CN111218701A - 一种sop封装的待镀电路模块局部阻镀保护方法 - Google Patents
一种sop封装的待镀电路模块局部阻镀保护方法 Download PDFInfo
- Publication number
- CN111218701A CN111218701A CN202010048400.5A CN202010048400A CN111218701A CN 111218701 A CN111218701 A CN 111218701A CN 202010048400 A CN202010048400 A CN 202010048400A CN 111218701 A CN111218701 A CN 111218701A
- Authority
- CN
- China
- Prior art keywords
- plating
- resistant
- glue
- circuit module
- bottom plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 137
- 238000000034 method Methods 0.000 title claims abstract description 38
- 239000003292 glue Substances 0.000 claims abstract description 84
- 239000002390 adhesive tape Substances 0.000 claims abstract description 37
- 238000005260 corrosion Methods 0.000 claims abstract description 33
- 230000007797 corrosion Effects 0.000 claims abstract description 33
- 238000000576 coating method Methods 0.000 claims abstract description 31
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000011248 coating agent Substances 0.000 claims abstract description 30
- 238000001465 metallisation Methods 0.000 claims abstract description 23
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 15
- 239000003960 organic solvent Substances 0.000 claims abstract description 9
- 238000001035 drying Methods 0.000 claims abstract description 7
- 238000009713 electroplating Methods 0.000 claims abstract description 7
- 239000000126 substance Substances 0.000 claims abstract description 6
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000012212 insulator Substances 0.000 claims abstract description 3
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 3
- 239000010703 silicon Substances 0.000 claims abstract description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 24
- 238000002791 soaking Methods 0.000 claims description 9
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 8
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 8
- 241001330002 Bambuseae Species 0.000 claims description 8
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 8
- 239000011425 bamboo Substances 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims description 4
- 238000006748 scratching Methods 0.000 claims description 3
- 230000002393 scratching effect Effects 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 2
- 230000002265 prevention Effects 0.000 claims 5
- 239000000463 material Substances 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 28
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 239000003973 paint Substances 0.000 description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 8
- 238000004382 potting Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000003513 alkali Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4889—Connection or disconnection of other leads to or from wire-like parts, e.g. wires
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
本发明提供一种SOP封装的待镀电路模块局部阻镀保护方法,包括:步骤1,在外引线表面涂抹耐腐蚀胶,烘烤固化;步骤2,沿外引线侧面包裹一层阻镀胶带,阻镀胶带的宽度与外引线梳状区域高度相同;步骤3,将夹块粘结固定于两外引线之间的底板上表面上,使夹块覆盖两外引线之间的底板表面;步骤4,在外引线暴露的侧面、夹块暴露的侧面和顶面以及底板暴露的上表面涂覆阻镀可剥胶,晾干;步骤5,采用化学镀镍及电镀镍金进行表面金属化;步骤6,剥离去除阻镀可剥胶,并去除夹块及阻镀胶带;步骤7,采用能溶解耐腐蚀胶的有机溶剂去除耐腐蚀胶。通过多材料、多工艺组合保证电路模块底板及两排外引线在表面金属化过程中不受侵蚀。
Description
技术领域
本发明涉及电子电镀,具体为一种SOP封装的待镀电路模块局部阻镀保护方法。
背景技术
SOP封装电路模块是将已封装器件、二维互连层和外引线进行垂直堆叠后,使用环氧树脂灌封料进行整体灌封,固化后通过精确切割灌封体侧面,形成互连点矩阵,再通过表面金属化和激光刻线形成侧面互连线条,完成已封装器件的三维组装和互连。而表面金属化是实现互连点连接的关键条件。
SOP封装电路模块结构示意图如图1所示,其中底板1为FR-4印制板表面丝印阻焊剂,外引线2从底板1两侧垂直于底板1引出,外引线2宽度一般为0.3mm以下,外引线2间距在0.5~0.7mm范围内,单排外引线2数量一般为20-40根,总幅宽在10~30mm范围,根据产品型号不同,外引线2引出位置、间距和数量均不相同。而底板1和外引线2是不需要进行表面金属化处理,在表面金属化过程中需进行阻镀保护,避免非镀区域被电镀上镍金层,导致产品短路。
SOP封装电路模块表面金属化前需将非镀区域进行保护,以达到局部表面金属化的目的,但由于电路模块非镀区域结构复杂,同时需要保护从模块底部垂直引出的两排外引线和底板表面,利用普通的保护方法,诸如制作专用阻镀工装夹具、涂覆阻镀胶、包裹阻镀胶带等工艺无法达到阻镀效果,容易造成镀液渗漏;而采用附着力较强的阻镀漆进行保护,会造成引线区域去除不净及化学试剂损伤底板阻焊剂等情况,影响最终产品可焊性及外观。采用传统的阻镀方法均无法适用于该电路的阻镀保护,主要存在以下问题:
1.阻镀可剥胶涂抹:阻镀可剥胶粘稠度较大,直接涂抹过程中会存在个别气泡、孔隙,镀液仍会渗漏对非镀区域造成腐蚀;而增加涂抹次数必然会使胶层变厚,粘接力显著增大,在后续去除过程中导致外引线扭曲变形等损伤。
2.阻镀工装夹具遮掩防护:由于电路模块尺寸小,站高较大,且需要利用外引线在表面金属化过程中实现阴极电导通(如图2),制作工装需要开槽深宽比大于40:1,还需在槽宽约0.4~0.5mm的槽内增加电连接点,且需要制作表面金属化过程中的夹持点,工装实现难度较大。而且产品种类多,封装尺寸不同,针对每种产品均需制作大量工装,不利于成本控制。
3.阻镀漆涂抹:SOP封装电路模块的表面金属化需先对环氧灌封料表面化学镀一层镍层,而在化学镀镍过程中会将阻镀漆表面镀上镍层,使用有机溶剂去除阻镀漆时由于表面镍层的阻隔,阻镀漆与有机溶剂无法发生化学反应,阻镀漆无法去除。另一方面由于表面金属化过程较长,镀液成分复杂,整个流程中镀液的pH范围为:0.2~11,必须使用耐酸碱腐蚀的阻镀漆,而这类阻镀漆必须使用较强的有机溶剂进行去除,长时间的有机溶剂浸泡会对灌封体的环氧胶及底板上的阻焊漆造成损伤,故单一使用阻镀漆无法进行该电路的阻镀保护。
基于此,本研究组之前对阻镀保护方法进行了改进,具体是先在外引线侧面缠绕阻镀胶带,然后在两个外引线之间放置夹块,最后再在非金属化区域涂抹阻镀可剥胶,但是这种方法在进行外引线侧面阻镀胶带缠绕时,若阻镀胶带保护区域过大,阻镀胶带缠绕上边沿与导电夹持孔之间间距过小,在涂覆阻镀可剥胶时,为保证导电夹持孔的通透性,外引线表面的阻镀胶带上沿阻镀可剥胶保护不全,在表面金属化过程中,镀液从阻镀胶带缝隙中渗入;且由于外引线外侧与电路模块边缘距离一般为1mm左右,在涂抹阻镀可剥胶过程中会存在胶液粘附至待镀面,在阻镀可剥胶固化后,采用修板刀铲除待镀表面多余胶层,由于阻镀可剥胶液固化后作为整体粘附于表面,在铲除过程中,会对粘附于底板表面的胶层产生拉力,接触面积小(阻镀胶带缠绕后使该区域阻镀可剥胶与底板相接的厚度仅为0.5mm左右)的部位存在与底板分离情况,导致阻镀保护不严密,镀液渗入,而缠绕外引线的阻镀胶带仅对单根外引线的两个外表面进行保护,单根引线相间的两个表面无任何保护措施,镀液一旦渗漏,引线表面将被电镀上多余镀层,造成外观不良甚至可焊性受到影响;或者酸性镀液渗入,对外引线产生腐蚀,后期产品对引线进行折弯成型时出现引线基材开裂情况。
发明内容
针对现有技术中存在的问题,本发明提供一种SOP封装的待镀电路模块局部阻镀保护方法,通过多材料、多工艺组合保证电路模块底板及两排外引线在表面金属化过程中不受侵蚀且阻镀材料去除方便。
本发明是通过以下技术方案来实现:
一种SOP封装的待镀电路模块局部阻镀保护方法,包括如下步骤:
步骤1,在外引线表面涂抹耐腐蚀胶,烘烤固化;
步骤2,沿外引线侧面包裹一层阻镀胶带,阻镀胶带的宽度与外引线梳状区域高度相同;
步骤3,将夹块粘结固定于两外引线之间的底板上表面上,使夹块覆盖两外引线之间的底板表面;
步骤4,在外引线暴露的侧面、夹块暴露的侧面和顶面以及底板暴露的上表面涂覆阻镀可剥胶,晾干;
步骤5,采用化学镀镍及电镀镍金进行表面金属化;
步骤6,剥离去除阻镀可剥胶,并去除夹块及阻镀胶带;
步骤7,采用能溶解耐腐蚀胶的有机溶剂去除耐腐蚀胶。
优选的,步骤1中,耐腐蚀胶为正性光刻胶。
优选的,步骤1具体为:用细勾线笔蘸取耐腐蚀胶,顺外引线方向由下往上涂抹。
优选的,步骤3具体为:将夹块用不转移胶带粘结固定于两外引线之间的底板上表面上,然后用不转移胶带沿夹块6上边沿并围绕外引线外侧缠绕一圈。
优选的,步骤4具体为:在外引线暴露的侧面、夹块暴露的侧面和顶面以及底板暴露的上表面逐面涂覆阻镀可剥胶,每面涂覆后放置30min,待所有面涂覆完成后,自然晾干不小于12h。
优选的,步骤6中,剥离去除阻镀可剥胶具体是:用刀片沿阻镀可剥胶与底板相接处伸入并缓慢划过,使底板上的阻镀可剥胶与底板分离,处理完一面更换另一面,直至将底板四周阻镀可剥胶均分离后,用刀片从夹块上割开阻镀可剥胶,然后用竹制镊子剥离去除阻镀可剥胶。
优选的,步骤7具体为:将电路模块置于丙酮中浸泡2-3min;然后另取丙酮溶液,将电路模块在丙酮溶液中涮洗10-15s,取出电路模块并立即浸泡于纯水中清洗,清洗后烘干。
与现有技术相比,本发明具有以下有益的技术效果:
本发明采用了耐腐蚀胶对外引线有效区域的外露面均进行保护,该耐腐蚀胶黏度较低,方便涂抹;其颜色与外引线表面的金镀层差异较大,涂抹后易于检查外引线表面涂抹完整性;固化时间短且温度较低,固化后和外引线表面结合良好;与表面金属化各槽液中的化学成分不发生反应,从而在金属化过程中使外引线与镀液完全隔离,避免了当阻镀胶和底板之间、阻镀胶带上边沿阻镀不严密时渗漏的镀液直接接触外引线表面,保证了两排外引线在表面金属化过程中不被侵蚀,防止外引线腐蚀导致的强度不够、折弯开裂。采用阻镀胶带和阻镀可剥胶相结合的方法,保证了耐腐蚀胶不被电镀上镍金,防止耐腐蚀胶表面被金属保护而去除不净,影响最终产品可焊性。
进一步的,采用专用工具,按流程去除阻镀可剥胶,防止电路模块表面镀层及引线损伤。
附图说明
图1为SOP封装电路模块结构示意图;
图2为一种SOP封装电路模块尺寸示意图;
图3为本发明一种SOP封装的待镀电路模块局部阻镀保护流程示意图;(a)(a)虚线区涂抹光刻胶,(b)阴影区胶带缠绕,(c)阴影区粘接夹块,(d)网格区涂抹阻镀胶,(e)实心区表面金属化,(f)雕刻刀分离交接面。
图中:1为底板,2为外引线,3为引腿,4为环氧灌封料,5为表面金属化镀层,6为夹块,7为阴极电导通点,8为导电夹持孔。
具体实施方式
下面结合具体的实施例对本发明做进一步的详细说明,所述是对本发明的解释而不是限定。
本发明通过采用耐腐蚀胶对外引线进行涂抹保护,该耐腐蚀胶黏度较低,可充分润湿接触外引线表面,固化后与涂覆表面结合力较强,可避免金属外引线在电镀过程中被酸性溶液侵蚀;然后粘接阻镀胶带及夹块,防止电镀挂具对金属外引线造成损伤,避免阻镀可剥胶直接涂抹于外引线梳状区域而去除困难;最后采用涂覆阻镀可剥胶的方式,将耐腐蚀胶与电镀液隔离开,保证金属化完成后去除阻镀的有效性。
表面金属化后利用雕刻刀片分离阻镀可剥胶层,去除阻镀可剥胶及阻镀胶带后,用去胶试剂去除耐腐蚀胶。
SOP封装的待镀电路模块局部阻镀保护流程依次为:外引线涂抹耐腐蚀胶,烘烤固化,阻镀胶带保护外引线,粘接固定夹块,涂抹阻镀可剥胶,自然晾干,表面金属化,分离阻镀可剥胶层,去除阻镀可剥胶层,去除夹块及阻镀胶带,试剂去除耐腐蚀胶,清洗烘干。如图3所示,具体介绍如下:
步骤1,外引线涂抹耐腐蚀胶:用细勾线笔蘸取少量耐腐蚀胶顺外引线2方向由下往上涂抹,保证外引线2外漏部分均被保护。
步骤2,烘箱烘烤固化:温度75-85℃,时间为55-65min。
步骤3,阻镀胶带保护外引线:用宽度与外引线2梳状区域高度相同的阻镀胶带沿外引线2侧面包裹一层,放入烘箱加热:温度75-85℃,时间8-12min,用竹制扁平镊子沿外引线2方向将阻镀胶带压实粘牢。
步骤4,粘接固定夹块:将夹块6用不转移胶带固定于两外引线2之间的底板1上,保证夹块6宽度尺寸与外引线2跨距相匹配,夹块6长度与外引线2长度相匹配。用不转移胶带沿夹块6上边沿将其与引线缠绕一圈。
步骤5,涂抹阻镀可剥胶:用粘度为80-90Pa.S的阻镀可剥胶对非金属化区域进行逐面保护,每面涂覆后放置30min,待所有面涂覆完成,检查顶面内侧、四角交接处,保证胶层涂覆完整。
步骤6,自然晾干:自然晾干不小于12h。
步骤7,表面金属化:表面金属化采用化学镀镍(这时会将整只待镀电路模块的所有外漏部位均化学镀上镍层),电镀加厚镍层,表面电镀金层保护。
步骤8,去除阻镀可剥胶:用雕刻刀沿阻镀可剥胶与底板1相接处轻轻伸入少许并缓慢划过,使底板1上的阻镀可剥胶层与底板1分离,处理完一面更换另一面,直至将底板四周阻镀可剥胶均分离后,用刀片从非功能面两外引线中间夹块6上割开阻镀可剥胶,用竹制镊子剥离阻镀可剥胶,并去除夹块及阻镀胶带。
步骤9,试剂去除耐腐蚀胶:取可快速溶解耐腐蚀胶的有机溶剂丙酮,液位以能完全浸泡整只电路模块为宜,用竹制镊子夹取电路模块置于溶剂中浸泡约2-3min;另取可完全浸泡整只电路模块的丙酮溶液,将电路模块在其中涮洗10-15s;取出模块并立即浸泡于纯水中。
步骤10,清洗烘干:流动纯水下冲洗电路模块表面及外引线,然后用高压气枪吹扫电路模块至表面无可见水渍,放入烘箱烘干:温度100-110℃,时间1h±5min。
实施例1:
步骤1,外引线涂抹耐腐蚀胶:用细勾线笔蘸取少量耐腐蚀胶顺外引线2方向由下往上涂抹,保证外引线2外漏部分均被保护。
步骤2,烘箱烘烤固化:温度80℃,时间为60min。
步骤3,阻镀胶带保护外引线:用宽度与外引线2梳状区域高度相同的阻镀胶带沿外引线2侧面包裹一层,放入烘箱加热:温度80℃,时间10min,用竹制扁平镊子沿外引线2方向将阻镀胶带压实粘牢。
步骤4,粘接固定夹块:将夹块6用不转移胶带固定于两外引线2之间的底板1上,保证夹块6宽度尺寸与外引线2跨距相匹配,夹块6长度与外引线2长度相匹配。用不转移胶带沿夹块6上边沿将其与引线缠绕一圈。
步骤5,涂抹阻镀可剥胶:用粘度为85Pa.S的阻镀可剥胶对非金属化区域进行逐面保护,每面涂覆后放置30min,待所有面涂覆完成,检查顶面内侧、四角交接处,保证胶层涂覆完整。
步骤6,自然晾干:自然晾干12h。
步骤7,表面金属化:表面金属化采用化学镀镍(这时会将整只待镀电路模块的所有外漏部位均化学镀上镍层),电镀加厚镍层,表面电镀金层保护。
步骤8,去除阻镀可剥胶:用雕刻刀沿阻镀可剥胶与底板1相接处向内按压可剥胶层,使底板1上的阻镀可剥胶层与底板1分离,处理完一面更换另一面,直至将底板四周阻镀可剥胶均分离后,用刀片从非功能面两外引线中间夹块6上割开阻镀可剥胶,用竹制镊子剥离阻镀可剥胶,并去除夹块及阻镀胶带。
步骤9,试剂去除耐腐蚀胶:取可快速溶解耐腐蚀胶的有机溶剂丙酮,液位以能完全浸泡整只电路模块为宜,用竹制镊子夹取电路模块置于溶剂中浸泡约2.5min;另取可完全浸泡整只电路模块的丙酮溶液,将电路模块在其中涮洗15s;取出模块并立即浸泡于纯水中。
步骤10,清洗烘干:流动纯水下冲洗电路模块表面及外引线,然后用高压气枪吹扫电路模块至表面无可见水渍,放入烘箱烘干:温度105℃,时间60min。
实施例2
与实施例1不同之处是:步骤2烘烤温度75℃,时间为55min;步骤3的烘箱加热温度75℃,时间为55min;步骤6自然晾干13h;步骤9溶剂浸泡2min。
实施例3
与实施例1不同之处是:步骤2烘烤温度85℃,时间为65min;步骤3的烘箱加热温度85℃,时间为65min;步骤6自然晾干14h;步骤9溶剂浸泡3min。
Claims (7)
1.一种SOP封装的待镀电路模块局部阻镀保护方法,其特征在于,包括如下步骤:
步骤1,在外引线表面涂抹耐腐蚀胶,烘烤固化;
步骤2,沿外引线侧面包裹一层阻镀胶带,阻镀胶带的宽度与外引线梳状区域高度相同;
步骤3,将夹块粘结固定于两外引线之间的底板上表面上,使夹块覆盖两外引线之间的底板表面;
步骤4,在外引线暴露的侧面、夹块暴露的侧面和顶面以及底板暴露的上表面涂覆阻镀可剥胶,晾干;
步骤5,采用化学镀镍及电镀镍金进行表面金属化;
步骤6,剥离去除阻镀可剥胶,并去除夹块及阻镀胶带;
步骤7,采用能溶解耐腐蚀胶的有机溶剂去除耐腐蚀胶。
2.根据权利要求1所述的SOP封装的待镀电路模块局部阻镀保护方法,其特征在于,步骤1中,耐腐蚀胶为正性光刻胶。
3.根据权利要求1所述的SOP封装的待镀电路模块局部阻镀保护方法,其特征在于,步骤1具体为:用细勾线笔蘸取耐腐蚀胶,顺外引线方向由下往上涂抹。
4.根据权利要求1所述的SOP封装的待镀电路模块局部阻镀保护方法,其特征在于,步骤3具体为:将夹块用不转移胶带粘结固定于两外引线之间的底板上表面上,然后用不转移胶带沿夹块6上边沿并围绕外引线外侧缠绕一圈。
5.根据权利要求1所述的SOP封装的待镀电路模块局部阻镀保护方法,其特征在于,步骤4具体为:在外引线暴露的侧面、夹块暴露的侧面和顶面以及底板暴露的上表面逐面涂覆阻镀可剥胶,每面涂覆后放置30min,待所有面涂覆完成后,自然晾干不小于12h。
6.根据权利要求1所述的SOP封装的待镀电路模块局部阻镀保护方法,其特征在于,步骤6中,剥离去除阻镀可剥胶具体是:用刀片沿阻镀可剥胶与底板相接处伸入并缓慢划过,使底板上的阻镀可剥胶与底板分离,处理完一面更换另一面,直至将底板四周阻镀可剥胶均分离后,用刀片从夹块上割开阻镀可剥胶,然后用竹制镊子剥离去除阻镀可剥胶。
7.根据权利要求1所述的SOP封装的待镀电路模块局部阻镀保护方法,其特征在于,步骤7具体为:将电路模块置于丙酮中浸泡2-3min;然后另取丙酮溶液,将电路模块在丙酮溶液中涮洗10-15s,取出电路模块并立即浸泡于纯水中清洗,清洗后烘干。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010048400.5A CN111218701A (zh) | 2020-01-16 | 2020-01-16 | 一种sop封装的待镀电路模块局部阻镀保护方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010048400.5A CN111218701A (zh) | 2020-01-16 | 2020-01-16 | 一种sop封装的待镀电路模块局部阻镀保护方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN111218701A true CN111218701A (zh) | 2020-06-02 |
Family
ID=70831194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010048400.5A Pending CN111218701A (zh) | 2020-01-16 | 2020-01-16 | 一种sop封装的待镀电路模块局部阻镀保护方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111218701A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116427002A (zh) * | 2023-04-20 | 2023-07-14 | 黄山广捷表面处理科技有限公司 | 一种针式散热基板的表面处理工艺及选择镀治具 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102010676A (zh) * | 2009-09-04 | 2011-04-13 | 东丽先端素材株式会社 | 电镀用粘着片 |
CN103531549A (zh) * | 2013-10-24 | 2014-01-22 | 桂林微网半导体有限责任公司 | 半导体芯片封装结构和封装方法 |
CN109755168A (zh) * | 2019-01-04 | 2019-05-14 | 西安微电子技术研究所 | 一种三维堆叠树脂灌封电路模块表面局部阻镀方法 |
-
2020
- 2020-01-16 CN CN202010048400.5A patent/CN111218701A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102010676A (zh) * | 2009-09-04 | 2011-04-13 | 东丽先端素材株式会社 | 电镀用粘着片 |
CN103531549A (zh) * | 2013-10-24 | 2014-01-22 | 桂林微网半导体有限责任公司 | 半导体芯片封装结构和封装方法 |
CN109755168A (zh) * | 2019-01-04 | 2019-05-14 | 西安微电子技术研究所 | 一种三维堆叠树脂灌封电路模块表面局部阻镀方法 |
Non-Patent Citations (1)
Title |
---|
平郑骅: "《高分子世界》", 31 May 2001, 复旦大学出版社 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116427002A (zh) * | 2023-04-20 | 2023-07-14 | 黄山广捷表面处理科技有限公司 | 一种针式散热基板的表面处理工艺及选择镀治具 |
CN116427002B (zh) * | 2023-04-20 | 2023-10-24 | 黄山广捷表面处理科技有限公司 | 一种针式散热基板的表面处理工艺及选择镀治具 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102891006B (zh) | 电子部件及电子部件的制造方法 | |
CN103796433B (zh) | 线路板混合表面工艺的制作方法 | |
WO2018107924A1 (zh) | 一种柔性线路板及其制备方法、太阳能光伏组件 | |
CN111218701A (zh) | 一种sop封装的待镀电路模块局部阻镀保护方法 | |
TWI577257B (zh) | 於基材絕緣表面形成導電線路的方法 | |
CN1191005C (zh) | 铜及铜合金的表面处理方法 | |
CN107148169A (zh) | 多层pcb板的制作工艺 | |
CN103339291A (zh) | 具有镀金层的不锈钢基板和对不锈钢基板的形成部分镀金图案的方法 | |
CN113782880A (zh) | 一种耐腐蚀的锂电池铝塑膜及其制备方法 | |
CN104582297A (zh) | 一种印制电路的选择性电镀加成制备工艺 | |
KR100947921B1 (ko) | 연성인쇄회로기판의 고연성 Au 표면처리 도금방법 | |
KR101383783B1 (ko) | 인쇄전자소자 커넥터 및 그의 제조 방법 | |
US6673656B2 (en) | Semiconductor chip package and manufacturing method thereof | |
CN109755168B (zh) | 一种三维堆叠树脂灌封电路模块表面局部阻镀方法 | |
US20150136170A1 (en) | Method for removing adhesive agent | |
CN101998771B (zh) | 具有金属镀层薄膜的制造方法 | |
CN203346504U (zh) | 电镀夹具 | |
WO2015144810A1 (de) | Haftfeste schicht auf keramik und/oder lötstopplack als schutzlack oder vergussmasse | |
FR2566612A1 (fr) | Procede de fabrication de plaquettes a circuits imprimes, et plaquette ainsi obtenue | |
JPS5921013A (ja) | 絶縁被覆方法 | |
CN217591185U (zh) | 一种洁面仪用smt贴片pcb板 | |
NO168376B (no) | Fremgangsmaate for midlertidig aa avstoette veggene i en groeft etter graving av denne | |
CN110933872B (zh) | 一种基于阶梯镀金插头式pcb电路板的分段制板方法 | |
CN109338363B (zh) | 绝缘层薄膜表面的导电化处理工艺 | |
KR101100139B1 (ko) | 스테인레스 스틸 박판을 이용한 플렉시블 인쇄회로기판의 제조 방법 및 그에 따른 플렉시블 인쇄회로기판 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200602 |