TW201036058A - Solution for increasing wafer sheet resistance and/or photovoltaic cell power density level - Google Patents
Solution for increasing wafer sheet resistance and/or photovoltaic cell power density level Download PDFInfo
- Publication number
- TW201036058A TW201036058A TW099100956A TW99100956A TW201036058A TW 201036058 A TW201036058 A TW 201036058A TW 099100956 A TW099100956 A TW 099100956A TW 99100956 A TW99100956 A TW 99100956A TW 201036058 A TW201036058 A TW 201036058A
- Authority
- TW
- Taiwan
- Prior art keywords
- solution
- water
- wafer
- hydrogen peroxide
- weight
- Prior art date
Links
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims abstract description 48
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 239000007800 oxidant agent Substances 0.000 claims abstract description 33
- 230000002378 acidificating effect Effects 0.000 claims abstract description 30
- -1 fluoride ions Chemical class 0.000 claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 17
- 239000002738 chelating agent Substances 0.000 claims abstract description 12
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 12
- 239000010409 thin film Substances 0.000 claims abstract description 8
- 239000005388 borosilicate glass Substances 0.000 claims abstract description 6
- 150000005622 tetraalkylammonium hydroxides Chemical class 0.000 claims abstract 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 33
- 239000000203 mixture Substances 0.000 claims description 27
- 230000001590 oxidative effect Effects 0.000 claims description 22
- 150000002500 ions Chemical class 0.000 claims description 10
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 9
- 239000004094 surface-active agent Substances 0.000 claims description 8
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 5
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 5
- 239000000908 ammonium hydroxide Substances 0.000 claims description 5
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 4
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 229910052684 Cerium Inorganic materials 0.000 claims description 2
- 239000013078 crystal Substances 0.000 claims description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 150000002923 oximes Chemical class 0.000 claims 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims 1
- PLZVEHJLHYMBBY-UHFFFAOYSA-N Tetradecylamine Chemical compound CCCCCCCCCCCCCCN PLZVEHJLHYMBBY-UHFFFAOYSA-N 0.000 claims 1
- 239000013543 active substance Substances 0.000 claims 1
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 239000013522 chelant Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000001307 helium Substances 0.000 claims 1
- 229910052734 helium Inorganic materials 0.000 claims 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims 1
- 150000004714 phosphonium salts Chemical class 0.000 claims 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 claims 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 claims 1
- 230000004936 stimulating effect Effects 0.000 claims 1
- ZYSDERHSJJEJDS-UHFFFAOYSA-M tetrakis-decylazanium;hydroxide Chemical compound [OH-].CCCCCCCCCC[N+](CCCCCCCCCC)(CCCCCCCCCC)CCCCCCCCCC ZYSDERHSJJEJDS-UHFFFAOYSA-M 0.000 claims 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 abstract 2
- 229910021529 ammonia Inorganic materials 0.000 abstract 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 abstract 1
- 239000005360 phosphosilicate glass Substances 0.000 abstract 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 63
- 235000012431 wafers Nutrition 0.000 description 62
- 238000004519 manufacturing process Methods 0.000 description 9
- 125000000217 alkyl group Chemical group 0.000 description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 5
- 239000011574 phosphorus Substances 0.000 description 5
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 235000019441 ethanol Nutrition 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000002485 combustion reaction Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- DVUVKWLUHXXIHK-UHFFFAOYSA-N tetraazanium;tetrahydroxide Chemical compound [NH4+].[NH4+].[NH4+].[NH4+].[OH-].[OH-].[OH-].[OH-] DVUVKWLUHXXIHK-UHFFFAOYSA-N 0.000 description 3
- IDQBJILTOGBZCR-UHFFFAOYSA-N 1-butoxypropan-1-ol Chemical compound CCCCOC(O)CC IDQBJILTOGBZCR-UHFFFAOYSA-N 0.000 description 2
- URDCARMUOSMFFI-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(2-hydroxyethyl)amino]acetic acid Chemical compound OCCN(CC(O)=O)CCN(CC(O)=O)CC(O)=O URDCARMUOSMFFI-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical compound [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 239000006117 anti-reflective coating Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- QEMXHQIAXOOASZ-UHFFFAOYSA-N tetramethylammonium Chemical compound C[N+](C)(C)C QEMXHQIAXOOASZ-UHFFFAOYSA-N 0.000 description 2
- RBNPOMFGQQGHHO-UHFFFAOYSA-N -2,3-Dihydroxypropanoic acid Natural products OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 description 1
- XNCSCQSQSGDGES-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]propyl-(carboxymethyl)amino]acetic acid Chemical compound OC(=O)CN(CC(O)=O)C(C)CN(CC(O)=O)CC(O)=O XNCSCQSQSGDGES-UHFFFAOYSA-N 0.000 description 1
- ZIMXAFGAUMQPMG-UHFFFAOYSA-N 2-[4-[bis(carboxymethyl)amino]butyl-(carboxymethyl)amino]acetic acid Chemical compound OC(=O)CN(CC(O)=O)CCCCN(CC(O)=O)CC(O)=O ZIMXAFGAUMQPMG-UHFFFAOYSA-N 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- KWYJDIUEHHCHCZ-UHFFFAOYSA-N 3-[2-[bis(2-carboxyethyl)amino]ethyl-(2-carboxyethyl)amino]propanoic acid Chemical compound OC(=O)CCN(CCC(O)=O)CCN(CCC(O)=O)CCC(O)=O KWYJDIUEHHCHCZ-UHFFFAOYSA-N 0.000 description 1
- 239000005725 8-Hydroxyquinoline Substances 0.000 description 1
- XNSPQPOQXWCGKC-UHFFFAOYSA-N C(C)(=O)O.C(C)(=O)O.C(C)(=O)O.[N] Chemical compound C(C)(=O)O.C(C)(=O)O.C(C)(=O)O.[N] XNSPQPOQXWCGKC-UHFFFAOYSA-N 0.000 description 1
- AMQMBHHZEKYBFS-UHFFFAOYSA-N C(CCCCCCCCC)C(C#C)(CC(C)CCCCCCCCCC)O Chemical compound C(CCCCCCCCC)C(C#C)(CC(C)CCCCCCCCCC)O AMQMBHHZEKYBFS-UHFFFAOYSA-N 0.000 description 1
- 101100493820 Caenorhabditis elegans best-1 gene Proteins 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- 206010011224 Cough Diseases 0.000 description 1
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UWTATZPHSA-N D-glyceric acid Chemical compound OC[C@@H](O)C(O)=O RBNPOMFGQQGHHO-UWTATZPHSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- 150000000917 Erbium Chemical class 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 206010036790 Productive cough Diseases 0.000 description 1
- 229930182558 Sterol Natural products 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- WDJHALXBUFZDSR-UHFFFAOYSA-N acetoacetic acid Chemical compound CC(=O)CC(O)=O WDJHALXBUFZDSR-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001346 alkyl aryl ethers Chemical class 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- DVARTQFDIMZBAA-UHFFFAOYSA-O ammonium nitrate Chemical class [NH4+].[O-][N+]([O-])=O DVARTQFDIMZBAA-UHFFFAOYSA-O 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- JJDYDNFZWRFDFV-UHFFFAOYSA-N azane chloro hypochlorite Chemical compound O(Cl)Cl.N JJDYDNFZWRFDFV-UHFFFAOYSA-N 0.000 description 1
- BCKPSZOVMCRZEE-UHFFFAOYSA-N azanium hydrogen peroxide fluoride Chemical compound OO.[F-].[NH4+] BCKPSZOVMCRZEE-UHFFFAOYSA-N 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- SXDBWCPKPHAZSM-UHFFFAOYSA-M bromate Inorganic materials [O-]Br(=O)=O SXDBWCPKPHAZSM-UHFFFAOYSA-M 0.000 description 1
- SXDBWCPKPHAZSM-UHFFFAOYSA-N bromic acid Chemical compound OBr(=O)=O SXDBWCPKPHAZSM-UHFFFAOYSA-N 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- NWEKXBVHVALDOL-UHFFFAOYSA-N butylazanium;hydroxide Chemical compound [OH-].CCCC[NH3+] NWEKXBVHVALDOL-UHFFFAOYSA-N 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 239000008121 dextrose Substances 0.000 description 1
- DQUIAMCJEJUUJC-UHFFFAOYSA-N dibismuth;dioxido(oxo)silane Chemical compound [Bi+3].[Bi+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O.[O-][Si]([O-])=O DQUIAMCJEJUUJC-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- NFDRPXJGHKJRLJ-UHFFFAOYSA-N edtmp Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CCN(CP(O)(O)=O)CP(O)(O)=O NFDRPXJGHKJRLJ-UHFFFAOYSA-N 0.000 description 1
- AVPRDNCYNYWMNB-UHFFFAOYSA-N ethanamine;hydrate Chemical compound [OH-].CC[NH3+] AVPRDNCYNYWMNB-UHFFFAOYSA-N 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000000174 gluconic acid Substances 0.000 description 1
- 235000012208 gluconic acid Nutrition 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- ICIWUVCWSCSTAQ-UHFFFAOYSA-M iodate Chemical compound [O-]I(=O)=O ICIWUVCWSCSTAQ-UHFFFAOYSA-M 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- IWYDHOAUDWTVEP-UHFFFAOYSA-N mandelic acid Chemical compound OC(=O)C(O)C1=CC=CC=C1 IWYDHOAUDWTVEP-UHFFFAOYSA-N 0.000 description 1
- 229960002510 mandelic acid Drugs 0.000 description 1
- LFETXMWECUPHJA-UHFFFAOYSA-N methanamine;hydrate Chemical compound O.NC LFETXMWECUPHJA-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- UMIPWJGWASORKV-UHFFFAOYSA-N oct-1-yne Chemical group CCCCCCC#C UMIPWJGWASORKV-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 229960003540 oxyquinoline Drugs 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 229960003330 pentetic acid Drugs 0.000 description 1
- LLYCMZGLHLKPPU-UHFFFAOYSA-N perbromic acid Chemical class OBr(=O)(=O)=O LLYCMZGLHLKPPU-UHFFFAOYSA-N 0.000 description 1
- KHIWWQKSHDUIBK-UHFFFAOYSA-N periodic acid Chemical class OI(=O)(=O)=O KHIWWQKSHDUIBK-UHFFFAOYSA-N 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 238000012358 sourcing Methods 0.000 description 1
- 208000024794 sputum Diseases 0.000 description 1
- 210000003802 sputum Anatomy 0.000 description 1
- 150000003432 sterols Chemical class 0.000 description 1
- 235000003702 sterols Nutrition 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229910021653 sulphate ion Inorganic materials 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- UNWZKBKTIYBBRV-UHFFFAOYSA-N tetraazanium;tetrachloride Chemical compound [NH4+].[NH4+].[NH4+].[NH4+].[Cl-].[Cl-].[Cl-].[Cl-] UNWZKBKTIYBBRV-UHFFFAOYSA-N 0.000 description 1
- CBXCPBUEXACCNR-UHFFFAOYSA-N tetraethylammonium Chemical compound CC[N+](CC)(CC)CC CBXCPBUEXACCNR-UHFFFAOYSA-N 0.000 description 1
- 125000004014 thioethyl group Chemical group [H]SC([H])([H])C([H])([H])* 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- UCVGPWMKVFBRMN-UHFFFAOYSA-N tributyl(2-hydroxyethyl)azanium Chemical compound CCCC[N+](CCO)(CCCC)CCCC UCVGPWMKVFBRMN-UHFFFAOYSA-N 0.000 description 1
- OLNCQUXQEJCISO-UHFFFAOYSA-M trimethyl(propyl)azanium;hydroxide Chemical compound [OH-].CCC[N+](C)(C)C OLNCQUXQEJCISO-UHFFFAOYSA-M 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/39—Organic or inorganic per-compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/39—Organic or inorganic per-compounds
- C11D3/3947—Liquid compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Sustainable Development (AREA)
- Emergency Medicine (AREA)
- Health & Medical Sciences (AREA)
- Weting (AREA)
- Photovoltaic Devices (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
Description
201036058 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種酸性處理組合物及該酸性處理組合物 於處理於光伏打電池中使用之薄膜非晶形或單-或多_曰1曰形 矽晶圓基材,以提供經增加之晶圓薄片電阻及/或自該晶 圓製得之光伏打電池之功率密度之方法中之用途,咳晶圓 基材具有一 pn-或ηρ·接面及位於該晶圓基材之頂部表面上 之一部分磷矽酸鹽或硼矽酸鹽玻璃層中之至少—者。 【先前技術】 基於矽之太陽能電池、或光伏打電池需要數個處理步驟 以使能將入射光轉化為冑流。必匕等步驟中之一者涉及射極 之形成,其最常藉由將磷熱驅入至摻硼矽晶圓中來實現。 此方法會導致所謂死層之形成,其會導致所產生電荷之高 重組速率且不利於太陽能電池之效率及功率密度值。此 卜此方法會於该晶圓頂部形成一所謂的填石夕酸踐玻璃 ⑽⑽,該層含㈣1及氧,且需移除此ps(j5 H續电池製造。於熱驅入方法後,視處理條件,磷深度 分佈曲線顯示自該表面延伸至數十或數百奈米深處之高濃 度=2穩狀態。理想情況下,接近表面處的濃度較高(即 102G_21原子/cm3)以使能良好地接觸電極。 夕日日形光伏打t池製造商之一主要目標係要降低由其等 陽此包池所提供旎量之成本。此—般可以以下兩種方式 之實現,即降低總電池製造成本及/或改良太陽能電池 轉化效率。於實現後-目的之—嘗試中,現有製造方法在 145744.doc 201036058 磷擴散後應用後射極蝕刻,其係藉由將晶圓浸潰於HF中來 移除PSG層。先前實驗已顯示於hF_浸潰後之額外處理可 提高電池效率(高達0.3%絕對值)。目前,於此額外步驟中 • 使用 Mallinckr〇dt Baker,Inc.之一產品(即,產品 PV-160)。 . 然而’使用此產品一般需在該產品之熱浴(7〇°c或更高)中 處理晶圓基材。 極度希望可取得與目前使用之PV_i 60產品所得結果相 ❹比’可藉由改良之PSG層殘餘物餘刻以及較深之死層钮刻 而於相等或較短處理時間内且於降低溫度下於太陽能電池 中產生較高功率密度之組合物。 【發明内容】 於本發明之第一實施例中,提供一種處理於光伏打電池 中使用之薄膜非晶形或單-或多-晶形石夕晶圓基材,以增加 (a)晶圓薄片電阻及(b)自該晶圓製得之光伏打電池之功率 ίδ度中之至少一者之方法,該晶圓基材具有一 或np_接 〇 面及/或位於晶圓基材之一頂部表面上之部分填石夕酸鹽及/ 或侧石夕酸鹽玻璃層,該處理方法包含在足以增加(a)晶圓薄 片電阻及(b)自該晶圓製得之光伏打電池之功率密度中至少 •一者的時間内及溫度下使該晶圓基材與一酸性處理溶液接 •觸’該溶液包含: 一以下組份之緩衝氧化物蝕刻(BOE)溶液: 約〇. 1至約20重量%之至少一氫氧化四燒銨、 約0· 1至約5重量。/〇之乙酸、 約〇. 1至約5重量%之至少一非離子表面活性劑、 145744.doc 201036058 約0.1至約5重量%之至少一金屬螯合劑、 約0.1至約20重量%之無金屬銨離子源、 約0.01至約20重量%之無金屬氟化物離子源、 補足至100%之水, 其以0.01至10/0至100/1之氧化劑/水/B〇E溶液之體積比 與氧化劑及視情況之水混合。具有射極之晶圓包含口_及 n_源矽型兩者。 雖然該處理可增加晶圓薄片電阻或光伏打電池之功率密 度,然而其較佳可增加該兩者。此外,該處理亦可增加自 此晶圓製得之光伏打電池之效率。 於本發明之另一貫施例中,提供一種用於處理於光伏打 電池中使用之薄膜非晶形或單-或多-晶形矽晶圓基材,以 增加(a)晶圓薄片電阻及(b)自該晶圓製得之光伏打電池之 功率密度中至少一者之酸性處理溶液,該晶圓基材具有一 pn-或np-接面及/或位於該晶圓基材之一頂部表面上之部分 磷矽酸鹽及/或硼矽酸鹽玻璃層,其中該酸性處理溶液包 含以下組份之混合物: 一以下組份之緩衝氧化物蝕刻(BOE)溶液: 約〇·1至約20重量%之至少一氫氧化四烷銨、 約0.1至約5重量%之乙酸、 約〇. 1至約5重量%之至少一非離子表面活性劑、 約0.1至約5重量%之至少一金屬螯合劑、 約0.1至約2〇重量%之無金屬銨離子源、 約〇.〇1至約20重量。/。之無金屬氟化物離子源、 145744.doc 201036058 補足至100%之水, 其以0.01至10/0至100/1之氧化劑/水/B〇E溶液之體積比 與氧化劑及視情況之水混合。具有射極之晶圓包含P _及 • η-源矽型兩者。 • 於此兩實施例中,於ΒΟΕ溶液中之氯化四烷銨重量百分 里較佳係0.5至15%,更佳係1至1 〇%,甚佳係1.5至8%,且 最佳係2至4%,且尤其係3.1%。 0 乙酸之重量百分量較佳係〇·5至4% ’更佳係〇.8至3%,甚 佳係1至2%,最佳係1至1 ·5%,且尤其係丨至2〇/〇。 就非離子表面活性劑而言,其重量百分量較佳係〇2至 4%,更佳係0.3至2%,甚佳係〇.5至1%,最佳係〇7至 0-9% ’且尤其係〇.8%。 就螯合劑而言,其重量百分量較佳係〇2至4% ,更佳係 〇_3至3/。’甚佳係〇 4至1%,最佳係〇 5至〇篇,且尤其係 0.6%。 ® 就叙離子源而§,其重量百分量較佳係G.2至1G%,更佳 系3至5 /〇 ’甚佳係〇 5至2%,最佳係〇石至ι〇/〇,且尤其係 0.8%。 ' 就氣化物離子源而言,其重量百分量較佳係1至10%, 係0.5至5 /〇 ’甚佳係i 至3%,最佳係! 5至2 ,且 尤其係2.1 %。 雖然該處理可增加晶圓薄片電阻或自該晶圓製得之光伏打 之力率密度中任-者,但其較佳可增加該兩者。此 外,該處理亦可增加自該晶圓製得之光伏打電池之效率。 145744.doc 201036058 於本發明之—&处& 平乂佳實施例中,該處理係於約20至低於 7〇C之溫度下進行。 於本孓月之另—較佳實施例中,該Β〇Ε溶液具有約3至 小於7之pH ’較佳約3至約6之阳’且更佳約至約$之 pH。 名各日月之 7 _ . —較佳實施例中,該氧化劑包含過氧化 氫 般而Q,該氧化劑係呈任何適用比例之水與過氧化 氫之水冷液(〇.〇!%至5〇%,更佳,及甚至更佳 約30%之水溶液)’但_般而言其比例係約2至約^。 於本勒明之再—較佳實施例中,該BOE溶液包含作為氫 氧化四烧4*之氫氧化四甲基敍、作為至少—表面活性劑之 3.5- 二甲基己小炔_3_醇、及作為至少一金屬螯合劑之 EDTA ’且該氧化劑溶液包含過氧化氫及水: 於本發明之又再—較佳實施例中,該BOE溶液包含約 1 /〇氫氧化四曱基錢、約i 2%乙酸、約2. 、約〇篇 3.5- —甲基己小块_3_醇、約〇 8%氫氧化銨約〇 謝八、約91.5%水,其中百分數係重量百分數。 於本發明之另一較佳實施例中,該BOL·溶液係以約 1/6/0.2之BOE/水/過氧化氫比例與氧化劑溶液混合。於本 發明之另一較佳實施例中,該BOE溶液係以約1/6/0.8之 BOE/水/過氧化氫比例與氡化劑溶液混合。於本發明之另 車又仏貫靶例中’該B〇E溶液係以約1/以1之B〇E/水/過氧 化氫比例與氧化劑溶液混合。 於本發明之又再其他較佳實施例中,該等實施例包含上 145744.doc 201036058 述較佳實施例之一或多種組合。 此外’本發明可於約20°C至约40°c之處理溫度下使用, 該溫度係低於7 0 °C之現有工業標準。 【實施方式】 • 本發明提供一種處理於光伏打電池中使用之薄膜非晶形 或單-或多-晶形矽晶圓基材,以改良(a)晶圓薄片電阻及(]?) 自该晶圓製得之光伏打電池之功率密度中至少一者之方 0 法’ 5亥晶圓基材具有一 Pn-或np-接面及/或位於該晶圓基材 之 員。卩表面上之部分鱗碎酸鹽及/或蝴碎酸鹽玻璃層, 該方法包含於足以增加(a)薄片電阻及(b)光伏打電池之功 率密度中至少一者之時間内及溫度下使該晶圓基材與一酸 性處理溶液接觸,該酸性處理溶液包含: 一以下組份之緩衝氧化物姓刻(B〇E)溶液: 約0 _ 1至約2 0重量%之至少一氫氧化四院録、 約〇· 1至約5重量%之乙酸、 〇 約0.1至約5重量%之至少一非離子表面活性劑、 約〇· 1至約5重量%之至少一金屬螯合劑、 約0.1至約20重量%之無金屬銨離子源、 約0.01至約20重量❶之無金屬氟化物離子源、 補足至100%之水, 其以〇·(Η至聊至100/1之氧化劑/水/B〇E溶液體積比與 氧化劑及視情況之水混合。具有射極之晶圓包含p_h_ 源矽型兩者。 雖然該處理可增加晶圓薄片電阻或自該晶圓製得之光伏打 145744.doc 201036058 電池之功率密度,但其較佳可增加該兩者。此外,該處理 亦可增加自該晶圓製得之光伏打電池之效率。 同樣地,本發明提供一種用於處理於光伏打電池中使用 之薄膜非晶形或單·或多-晶形矽晶圓基材,以增加(a)晶圓 薄片電阻及(b)自該晶圓製得之光伏打電池之功率密度中至 )者之溶液,该晶圓基材具有一Pn-或np-接面及/或位於 该晶圓基材之一頂部表面上之部分磷矽酸鹽及/或硼矽酸 鹽玻璃層,其中該酸性處理溶液包含以下組份之混合物: 一以下組份之緩衝氧化物蝕刻(B〇E)溶液: 約〇· 1至約20重量。/。之至少一氫氧化四烷銨、 約0.1至約5重量%之乙酸、 約0.1至約5重量❶/。之至少一非離子表面活性劑、 約〇. 1至約5重量%之至少一金屬螯合劑、 約0 · 1至約2 〇重量%之無金屬録離子源、 約〇.〇1至約20重量%之無金屬氟化物離子源、 補足至100%之水, 其以0.01至10/0至100/1之氧化劑/水/B〇E溶液之比與氧 化劑及視情況之水混合。具有射極之晶圓包含p-及卜源 發型兩者。 雖然該處理可增加晶圓薄片電阻或自該晶圓製得之光伏打 電池之功率密度,但其較佳可增加該兩者。此外,該處理 亦可增加自該晶圓製得之光伏打電池之效率。 於本發明之方法中,使用酸性處理溶液之步驟係於利用 HF將磷矽酸鹽或硼矽酸鹽玻璃移除(非完全移除)後及緊接 145744.doe 201036058 Ο Ο 另一 HF浸潰及隨後的抗反射塗層(ARC)(如(例如)SiNxH)沈 積之前,於光伏打電池晶圓基材上實行。該方法包含使晶 圓基材暴露至酸性處理溶液,諸如藉由於足以增加(a)晶圓 薄片電阻及(b)自該晶圓製得之光伏打電池之功率密度中至 少一者之時間内及溫度下將晶圓基材浸泡於該溶液之熱浴 中。晶圓基材與酸性處理溶液之接觸一般將持續約〇〇 j至 約20分鐘’較佳約〇.5至約5分鐘’且更佳約!分鐘之時 長。溶液之溫度一般係約20°C至低於約70。(:,較佳係約 20 C至約60°C,更佳係約20°C至約40°C,甚佳係約4(Tc。
適宜用於本發明之酸性處理組合物中者,可提及氫氧化 四烷銨或式[(RhNiprq]之鹽,其中每一 R獨立地係經取 代或未經取代之烷基,較佳係1至22,且更佳1至6,最佳i 個石反原子之烷基;且χ=〇Η或適宜的鹽陰離子,如碳酸根 等;P&q相等且係丨至3的整數。此等中之最佳者係氫氧化< 四甲基銨及氫氧化三乙基料祕)。其他可用的 氫氧化第四1安之實例包括:氫氧化三甲基-3-經丙基銨、氣 二化三甲基_3_經丁基錄、氫氧化三甲基_4,丁基銨、氫 ,化三乙基-2-經乙基錢、氫氧化三丙基_2_經乙基銨、氫 乳化三丁基_2_羥乙基銨、氫氧化二,基乙基奸乙美 錄、氣氧化二甲基二(2·經乙基)録、氫氧化單甲基三(M η 氧化四乙基銨、氣氧化四丙基鍵、氣氧化四 ^基錄、職化單甲基三乙基鍵、氫氧化單甲基 銨、虱氧化單甲基三丁基銨 '氫 土 氧化單乙基:…早乙基三甲基錢、氫 干u丞—丁基銨、虱氧化 - Τ基―乙基銨、氫氧化二 145744.doc 201036058 f基二丁基銨等及其等混合物。 無金屬録離子源可為任何適料無金屬銨鹽,如(例如) 氫氧化錢、氟化銨、氯化銨、頌酸錢等,但較佳係氫氧化 銨。無金屬氟化物離子源可為任何適用的無金屬氣化物化 合物’如⑽如)氟化氫、敦化錄、a化第喊如說化四甲 基叙。無金屬氟化物離子源較佳係册。於另—較佳實施例 中’錢離子及氟化物離子兩者可由一化合物(即氟化錢)提 供。 本發明之酸性處理組合物可含有任何適用的非離子表面 活性劑。在可用於本發明處難合物之各種相非離子表 面活性劑中,可提及(例如)低發泡非離子表面活性劑如炔 醇表面活性劑、氟化表面活性劑如氟化烧基院氧化物如 Fh^ad® FC_171、氟化烷基醋如FC_43〇及fc_43i及氟化 聚氧伸乙基烷醇如Flu〇rad® FC_17〇c、乡元醇之脂族酸 酯、聚氧伸乙基單烷基醚 '聚氧伸乙基二醇、矽氧烷型表 面活性劑及烷二醇單烷基醚如丁氧基丙醇。於本發明之鹼 性處理溶液中用作非離子表面活性劑之較佳者係块醇表面 活性劑’尤其係3,5-二曱基己小块小醇咖咖^⑧-叫或 任何其他Surfynol®表面活性劑;氟化烷基聚氧伸乙基乙 醇,尤其係Fluorad® FC-HOC及烷二醇單烷基醚,尤其係 丁氧基丙醇。 可於本發明之酸性處理組合物中採用任何可增加調配物 使金屬保留於溶液中之能力的適用金屬螯合劑。用於此目 的之螯合劑之一般實例係以下有機酸及其等鹽:乙二胺四 145744.doc 12 201036058 乙酸(EDTA)、丁二胺四乙酸、環己烧_ 1,2-二胺四乙酸 (CyDTA)、二伸乙三胺五乙酸、乙二胺四丙酸、(羥乙基) 乙二胺三乙酸(HEDTA)、甲基亞胺二乙酸、伸丙二胺四乙 酸、氮基三乙酸(NTA)、檸檬酸、酒石酸、葡萄糖酸、葡 萄糖二酸、甘油酸、草酸、苯二甲酸、順丁烯二酸、苯乙 醇酸、丙二酸、乳酸、水楊酸、鄰苯二酚、8_羥基喹啉、 N,N,N’,N’-乙二胺四(亞甲基膦酸)等。 可採用任何適用的氧化劑,如(例如)氧化陰離子如(例 如)過氧化物、硝酸及其鹽及銨之硝酸鹽、過硫酸鹽、過 碘酸鹽、過溴酸鹽、過氣酸鹽、碘酸鹽、溴酸鹽、及氯酸 鹽。較佳者係過氧化物且尤其係過氧化氫。 可藉由於適合容器中混合所需組份形成組合物來製備本 表明之酸性處理組合物。較佳地,將該組合物之所需組份 以驗/酸/鹼/酸之次序添加至衮 王谷窃中,以使來自組份反應之 任何可能熱量最小化。 〇 、/然而,於太陽能電池製造中,產物不僅需敍刻氧化石夕, 亚且亦需钮刻石夕及鱗。為實現此目的,將BOE與作為氧化 劑之過氧化氫組合。此意味於钮刻·氧化之連續製程中, =刻掉氧切,而氧化劑在表面上形成新 2 ’氧_會氧㈣Μ在之璘’藉此將其溶解。經_ 的種類(包括但非限於金屬雜質)藉由添加螯合劍 保留於溶液中,而表面的可濕性(即,氧化 °刀 之效率潘由添加表面活性劑獲得 化表面 雙重緩衝系統,其有助於製程穩定性。心乙酸可確保 145744.doc -13- 201036058 藉由(但不限於)以下實例說明本發明。於該等實例中, 百分數係重量百分數。 於工業類型線上光伏打電池製造序列中處理一組尺寸約 15.6><15·6 cm2且具有約180至200 μηι厚度之25個相鄰多晶 形石夕晶圓。於射極沈積且藉由HF移除含填玻璃後,晶圓於 該晶圓基材之一頂部表面上具有部份磷;5夕酸鹽玻璃層,使 該等晶圓與(1 )40°C下之本發明酸性處理溶液接觸,(?)先 前技術PV-160溶液在該溶液所需之7(TC下接觸,或(3)不與 處理溶液接觸以作對照。本發明之酸性處理溶液包含具有 約3.1%氫氧化四甲基銨、約12%乙酸、約21% hf、約 〇篇3,5-二曱基己炔_3_醇、約〇 8%氯氧化銨約〇 6% 丑〇丁八、約91.5%水的8(^溶液。以約1/6/〇2之;6〇£/水/3〇% 過氧化氫溶液比將此B〇E溶液與過氧化氫氧化劑溶液混 合二亦使用以約UWOJiBOE/水/3〇%過氧化氫溶液比與 過氧化氫氧化劑溶液混合的先前技術pv_16〇溶液。然後使 =處理之晶圓於室溫下於i重量%之册溶液中經受濕式化 :?理1分鐘,接著進行一般習知的光伏打製造步驟,以
^传所*的光伏打電池。當處理不同組別時將電極燃燒設 疋值保持传定 B 。〜疋且政疋於先前技術組的最佳燃燒設定值 ^測定電池之功率密度(單位mW/cm2,定義為短路電流 U1路電壓之乘積,jscxv〇c)。結果顯示於下表1中。 145744.doc 201036058 表1 處理組合物 短路電流密度 (Jsc) mA/cm2 開路電壓 (Voc) V 功率密度 (JscxVoc) mAV/cm2 薄片電阻之 增加 (歐姆/平方) 本發明組合物 33.37 0.607 20.25 5 PY-160 33.33 0.608 20.27 3 無 32.96 0.604 19.91 0 實例2 於工業類型線上光伏打電池製造序列中處理一組尺寸約 15.6x15.6 cm2且具有約180至200 μιη厚度之25個相鄰的多 晶形矽晶圓。於射極沈積及藉由HF移除含磷玻璃後,晶圓 於該晶圓基材之一頂部表面上具有部份磷矽酸鹽玻璃層, 使該等晶圓與(1)40°C下之本發明酸性處理溶液接觸,(2) 先前技術PV-160溶液於該溶液所需之70°C下接觸。本發明 之處理溶液包含具有約3.1%氫氧化四甲基銨、約1.2%乙 酸、約 2.1% HF、約 0.8% 3,5-二曱基己-1-炔-3-醇、約 0.8% 氫氧化銨、約0.6°/。£〇丁八、約91.5%水的6〇£溶液。以約 1/6/0.8之BOE/水/3 0%過氧化氫之比例將此BOE溶液與過氧 化氳氧化劑溶液混合。亦使用以約1/6/0.2之BOE/水/30% 過氧化氫溶液比與過氧化氫氧化劑溶液混合的先前技術 PV-160溶液。然後,使經處理之晶圓於室溫下在1重量。/〇 之HF溶液中經受濕式化學處理1分鐘,接著進行一般習知 的光伏打製造步驟以製得所需的光伏打電池。當處理不同 組別時使電極燃燒設定值維持不變,且設定在先前技術組 之最佳燃燒設定值下。測定該等電池之功率密度(單位 mW/cm2,定義為短路電流密度與開路電壓之乘積, 145744.doc -15- 201036058
JscxVoc)。結果顯示於下表2中。 表2 處理組合物 短路電流密度 Λ (Jsc) mA/cm 開路電壓 (Voc) V 功率密度 (JscxVoc) mAV/cm2 薄片電阻之增加 (歐姆/平方) 發明組合物 33.50 0.600 20.10 8.5 PV-160 33.33 0.598 19.93 1.5 實例3 於工業類型線上光伏打電池製造序列中處理一組尺寸約 15.6x15.6 cm2且具有約180至200 μιη厚度之25個相鄰的多 晶形矽晶圓。於射極沈積及藉由HF移除含磷玻璃後,該等 晶圓於晶圓基材之一頂部表面上具有部份磷矽酸鹽玻璃 層,使該等晶圓與(1)25°C、30°C及40°C下之本發明酸性處 理溶液接觸,(2)先前技術PV-160溶液於該溶液所需之70°C 下接觸,或(3)不與溶液接觸以作對照。本發明之酸性處理 溶液包含具有約3.1 %氫氧化四甲基銨、約1.2%乙酸、約 2.1% HF、約0.8% 3,5-二曱基己-1-炔-3-醇、約0.8%氫氧化 銨、約0.6%£〇丁人、約91.5%水的3〇£溶液。以約1/6/1之 B0E/水/3 0%過氧化氫溶液比將此BOE溶液與過氧化氫氧化 劑溶液混合。亦使用以約1/6/0·2之B0E/水/過氧化氫溶液 比與過氧化氫氧化劑溶液混合的先前技術PV-160溶液。然 後,使經處理之晶圓於室溫下在1重量%之HF溶液中經受 濕式化學處理1分鐘,接著進行一般習知的光伏打製造步 驟以製得所需的光伏打電池。當處理不同組別時使電極燃 燒設定值維持不變,且設定於先前技術組之最佳燃燒設定 145744.doc -16· 201036058 值下。結果顯示於下表3中。 表3 處理組合物 效率(%) 開路電壓 (V〇c)V 短路電 流密度 (Jsc) mA/cm2 填充 因子 (%) 平均 功率密度 (JscxVoc) mAV/cm2 薄片電阻 之增加 (歐姆/平方) PV-160 14.74 0.60 7.93 74.81 4.80 1.10 無 14.75 0.60 7.89 75.55 4.75 0.70 25°C下之發明 組合物 1486 0.60 7.91 75.58 4.78 1.80 30 °C下之發明 組合物 14.71 0.60 7.91 74.85 4.78 2.20 40°C下之發明 組合物 14.74 0.61 7.94 74.56 4.81 4.50 如結果所顯示,本發明組合物使薄片電阻及/或電池功 率密度顯著地增加超過對照組。藉由改變混合比,尤其係 藉由增加過氧化氫之量,本發明組合物展現等於或優於 PV-160之功率密度。然而,本發明組合物能於20°C至40°C 之溫度範圍内達成,而PV-160組合物則需在70°C溫度下才 能達成。 〇 雖然本文已參考其具體實施例描述本發明,但應瞭解在 不脫離本文所揭示之本發明概念之精神及範圍下可進行改 變、修改及變化。因此,意欲涵蓋隨附專利申請範圍之精 神及範圍内之所有此等改變、修改及變化。 145744.doc 17
Claims (1)
- 201036058 七、申請專利範圍: 一種處理於光伏打電池中使用之薄膜非晶形或單_或多_ 晶形矽晶圓基材之方法,用以增加(a)薄片電阻及(b)該光 伏打電池之功率密度中至少一者,其中該晶圓基材具有 一 Pn-或np-接面及位於該晶圓基材之一頂部表面上之一 部份磷矽酸鹽或硼矽酸鹽玻璃層中至少一者,該方法包 含於足以增加(a)該晶圓薄片電阻及(b)自該晶圓製得之光 伏打包池之功率岔度中之至少一者之時間内及溫度下使 該晶圓基材與一酸性處理溶液接觸,該酸性處理溶液包 含: 具有以下組份之緩衝氧化物蝕刻(B〇E)溶液: 約〇.1至約20重量%之至少一氫氧化四烷基銨、 約〇. 1至約5重量%之乙酸、 約〇.1至約5重量%之至少—非離子表面活性劑、 約ο. 1至約5重量%之至少一金屬螯合劑、 〇 '、’勺0.1至約2〇重篁%之無金屬録離子源、 約0.01至約20重量%之無金屬銳化物離子源、 補足至100%之水, 其係以〇.〇1至謂至麵i之氧化劑溶液/水/B〇E溶液比 與氧化劑溶液及視情況之水混合。 2. h月求項1之方法’其中該處理係於約2〇。〇至約赋之 溫度下進行。 3.如明求項1或2之方法,其中該B〇E溶液具有約3至約6之 145744.doc 201036058 4.如請求項3 $古 . ^ 項·3之方法,其中該B〇E溶液具有約43 pH。 5·如上述請求項中任—項之方法,其中該氧化劑溶液包含 過氧化氫。 6.如上述請求項中任一項之方法,其中該b〇e溶液包含作 為虱氧化四燒基狀氫氧化四甲基銨、作為該至少一表 面活性劑之3,5-二甲基己领_3_醇、及作為該至少一金 螯口 %丨之EDTA ’且該氧化劑溶液包含過氧化氫及 水。 月长項6之方法,其中該B〇E溶液包含約3.1 %氫氧化 四曱基銨、約12%乙酸、約2 l% hf、約〇篇二甲 基己小炔-3-醇、約〇,8%氫氧化錢、約〇 6% Ε〇τΑ、約 9 1.5 % 水。 月求員7之方法,其中該B〇E溶液係以1/6/0.2至1.0範 圍1之BOE/水/3〇%過氧化氫比與氧化劑溶液混合。 月长項7之方法,其中該BOE溶液係以約i/6/0.2之 良/30 /。過氧化氫溶液比與氧化劑溶液混合。 月长項7之方法’其中該BOE溶液係以約1/6/0.8之 BO^/水/3G%過氧化氫溶液比與氧化劑溶液混合。 士 〇月求項7之方法’其令該BOE溶液係以約i/6/l之BOE/ 水/30%過氧化氫溶液比與氧化劑溶液混合。 12. 如明求項9之方法,其中該處理係於約at至約7〇。〇之 溫度下進行。 13. 如上述請求項中任—項之方法,其中該處理亦改良自該 145744.doc 201036058 日日圓製仔之光伏打電池之效率。 14. 一種用於處理於光伏打電池中使用之薄膜非晶形或單-或 夕_晶形矽晶圓基材之酸性處理溶液,用以增加(a)該晶 圓薄片電阻及(b)自該晶圓製得之光伏打電池之功率密度 中至夕―者’其中該晶圓基材具有一 pn-或np接面及一位 於忒晶圓基材之頂部表面上之部份磷矽酸鹽或硼矽酸鹽 Ο 玻璃層中之至少一者,該酸性處理溶液包含以下組份之 混合物: 一具有以下組份之緩衝氧化物蝕刻(B〇E)溶液: 約〇· 1至約20重量%之至少一氫氧化四烷基銨、 約0.1至約5重量%之乙酸、 約0.1至約5重量%之至少一非離子表面活性劑、 約〇· 1至約5重量%之至少一金屬螯合劑、 約〇. 1至約2〇重量%之無金屬銨離子源、 約0.01至約20重量❶/。之無金屬氟化物離子源、 Q 補足至1〇〇%之水, 其係以0.01至10/0至100Π之氧化劑溶液/水/B〇E溶液 比與氧化劑溶液及視情況之水混合。 ’ 15_如請求項14之酸性處理溶液,其中該B〇E溶液具有約3至 約6之pH。 16. 如請求項15之酸性處理溶液,其中該B〇E溶液具有約4.3 至約5之pH。 17. 如請求項14或15之酸性處理溶液,其中該氧化劑溶液包 含過氧化氫。 145744.doc 201036058 18. 如明求項14至17中任一項之酸性處理溶液,其中該B〇E 溶液包含作為該氫氧化四烧基敍之氫氧化四甲基敍、作 為該至少一表面活性劑之3,5_二甲基己-卜炔―%醇、及作 為該至少一金屬螯合劑之EDTA,且該氧化劑溶液包含 過氧化氳及水。 19. 如請求項18之酸性處理溶液,其中該b〇e溶液包含約 3.1 /〇氣氧化四曱基錢、約1 ·2〇/0乙酸、約2.1 % hf、約 〇·8% 3,5-二曱基己_1_炔_3_醇、約〇 8%氫氧化銨、約 0.6°/(^〇丁入、約91.5%水。 20. 如請求項19之酸性處理溶液,其中該B〇E溶液係以 1/6/0.2至1 .〇範圍内之boe/水/30%過氧化氫溶液比與該 氧化劑溶液混合。 ’ 21. 如請求項19之酸性處理溶液,其中該b〇e溶液係以約 1/6/0.2之BOE/水/3 0%過氧化氫溶液比與該氧化劑溶液混 合0 22. 如請求項19之酸性處理溶液,其中該B〇E溶液係以約 1/6/0.8之BOE/水/30%過氧化氫溶液比與該氧化劑溶液混 合0 23. 如請求項19之酸性處理溶液,其中該β〇Ε溶液係以約 W6/1之B0E/水/30%過氧化氫溶液比與該氧化劑溶液混 合0 145744.doc 201036058 四、指定代表圖: (一) 本案指定代表圖為:(無) (二) 本代表圖之元件符號簡單說明: 五、本案若有化學式時,請揭示最能顯示發明特徵的化學式: (無)145744.doc
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14447909P | 2009-01-14 | 2009-01-14 | |
US22568509P | 2009-07-15 | 2009-07-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201036058A true TW201036058A (en) | 2010-10-01 |
Family
ID=42272664
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW099100956A TW201036058A (en) | 2009-01-14 | 2010-01-14 | Solution for increasing wafer sheet resistance and/or photovoltaic cell power density level |
Country Status (14)
Country | Link |
---|---|
EP (1) | EP2387801A2 (zh) |
JP (1) | JP2012515444A (zh) |
KR (1) | KR20110105396A (zh) |
CN (1) | CN102282682B (zh) |
AU (1) | AU2010205945A1 (zh) |
BR (1) | BRPI1006176A2 (zh) |
CA (1) | CA2749836A1 (zh) |
IL (1) | IL213936A0 (zh) |
MX (1) | MX2011007413A (zh) |
RU (1) | RU2011134068A (zh) |
SG (1) | SG172973A1 (zh) |
TW (1) | TW201036058A (zh) |
WO (1) | WO2010081661A2 (zh) |
ZA (1) | ZA201105863B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011050136A1 (de) | 2010-09-03 | 2012-03-08 | Schott Solar Ag | Verfahren zum nasschemischen Ätzen einer Siliziumschicht |
EP2514799A1 (en) | 2011-04-21 | 2012-10-24 | Rohm and Haas Electronic Materials LLC | Improved polycrystalline texturing composition and method |
DE102011103538A1 (de) | 2011-06-07 | 2012-12-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Dotierung von Halbleitersubstraten sowie dotiertes Halbleitersubstrat und Verwendung |
CN113980580B (zh) * | 2021-12-24 | 2022-04-08 | 绍兴拓邦新能源股份有限公司 | 一种单晶硅片的碱刻蚀抛光方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2372904A1 (fr) * | 1976-11-19 | 1978-06-30 | Ibm | Composition de decapage du silicium polycristallin contenant de l'hydroxyde de tetramethylammonium et procede d'application |
TW263531B (zh) * | 1992-03-11 | 1995-11-21 | Mitsubishi Gas Chemical Co | |
KR20010066769A (ko) * | 1999-04-20 | 2001-07-11 | 가네꼬 히사시 | 세정액 |
JP2003152176A (ja) * | 2001-11-14 | 2003-05-23 | Matsushita Electric Ind Co Ltd | 半導体装置の洗浄方法及びその製造方法 |
BR0311830A (pt) * | 2002-06-07 | 2005-03-29 | Mallinckrodt Baker Inc | Composições removedoras de arco e de limpeza de microeletrÈnicos |
JP4319006B2 (ja) * | 2003-10-23 | 2009-08-26 | シャープ株式会社 | 太陽電池セルの製造方法 |
JP4553597B2 (ja) * | 2004-01-30 | 2010-09-29 | シャープ株式会社 | シリコン基板の製造方法および太陽電池セルの製造方法 |
US20070099806A1 (en) * | 2005-10-28 | 2007-05-03 | Stewart Michael P | Composition and method for selectively removing native oxide from silicon-containing surfaces |
TW200918664A (en) * | 2007-06-13 | 2009-05-01 | Advanced Tech Materials | Wafer reclamation compositions and methods |
-
2010
- 2010-01-11 CN CN201080004496.XA patent/CN102282682B/zh active Active
- 2010-01-11 RU RU2011134068/28A patent/RU2011134068A/ru not_active Application Discontinuation
- 2010-01-11 BR BRPI1006176A patent/BRPI1006176A2/pt not_active IP Right Cessation
- 2010-01-11 SG SG2011050853A patent/SG172973A1/en unknown
- 2010-01-11 AU AU2010205945A patent/AU2010205945A1/en not_active Abandoned
- 2010-01-11 KR KR1020117018830A patent/KR20110105396A/ko not_active Application Discontinuation
- 2010-01-11 JP JP2011545669A patent/JP2012515444A/ja not_active Withdrawn
- 2010-01-11 CA CA2749836A patent/CA2749836A1/en not_active Abandoned
- 2010-01-11 WO PCT/EP2010/000076 patent/WO2010081661A2/en active Application Filing
- 2010-01-11 EP EP10716465A patent/EP2387801A2/en not_active Withdrawn
- 2010-01-11 MX MX2011007413A patent/MX2011007413A/es not_active Application Discontinuation
- 2010-01-14 TW TW099100956A patent/TW201036058A/zh unknown
-
2011
- 2011-07-05 IL IL213936A patent/IL213936A0/en unknown
- 2011-08-11 ZA ZA2011/05863A patent/ZA201105863B/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN102282682A (zh) | 2011-12-14 |
ZA201105863B (en) | 2012-04-25 |
AU2010205945A1 (en) | 2011-09-01 |
WO2010081661A2 (en) | 2010-07-22 |
MX2011007413A (es) | 2011-07-21 |
JP2012515444A (ja) | 2012-07-05 |
BRPI1006176A2 (pt) | 2019-09-24 |
SG172973A1 (en) | 2011-08-29 |
CA2749836A1 (en) | 2010-07-22 |
CN102282682B (zh) | 2016-07-06 |
KR20110105396A (ko) | 2011-09-26 |
WO2010081661A3 (en) | 2010-10-07 |
EP2387801A2 (en) | 2011-11-23 |
IL213936A0 (en) | 2011-07-31 |
RU2011134068A (ru) | 2013-02-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3447791B1 (en) | Etching solution for selectively removing silicon-germanium alloy from a silicon-germanium/ silicon stack during manufacture of a semiconductor device | |
US8366954B2 (en) | Solution for increasing wafer sheet resistance and/or photovoltaic cell power density level | |
TWI693305B (zh) | 於製造一半導體裝置時用於從矽-鍺/矽堆疊同時移除矽及矽-鍺合金的蝕刻溶液 | |
US8883543B2 (en) | Method of producing wafer for solar cell, method of producing solar cell, and method of producing solar cell module | |
US20110275222A1 (en) | Silicon Texture Formulations With Diol Additives And Methods of Using The Formulations | |
TWI607115B (zh) | 用於矽晶圓之局部掺雜之掺雜介質 | |
TW201308627A (zh) | 太陽能電池和半導體應用中自矽表面移除金屬雜質 | |
JP2018508976A (ja) | 半導体のレーザードーピング | |
TW200951204A (en) | Non-selective oxide etch wet clean composition and method of use | |
TW201007968A (en) | Hybrid heterojunction solar cell fabrication using a doping layer mask | |
US20150040983A1 (en) | Acidic etching process for si wafers | |
TW201003961A (en) | Solar cell spin-on based process for simultaneous diffusion and passivation | |
TW201036058A (en) | Solution for increasing wafer sheet resistance and/or photovoltaic cell power density level | |
KR20170100628A (ko) | 반도체를 도핑하기 위한 방법 | |
TW201710410A (zh) | 可同時抑制在共擴散方法中之磷擴散的可網印硼摻雜膠 | |
CN102254814A (zh) | 一种氧化硅的选择性刻蚀溶液及其制备方法和应用 | |
TW201320357A (zh) | 太陽電池用晶圓、太陽電池用晶圓的製造方法、太陽電池單元的製造方法、以及太陽電池模組的製造方法 | |
WO2013153950A1 (ja) | 塗布拡散剤組成物、塗布拡散剤組成物の製造方法、太陽電池及び太陽電池の製造方法 | |
JP5575822B2 (ja) | テクスチャー形成用エッチング液 | |
JP2016506629A (ja) | シリコンウェハから不純物をゲッタリングするための酸化物媒体 | |
TW201710185A (zh) | 可抑制寄生擴散之用於矽晶圓局部摻雜之基於溶膠-凝膠的可印刷摻雜介質 | |
WO2024057722A1 (ja) | 不純物拡散組成物、それを用いた半導体素子の製造方法および太陽電池の製造方法 | |
JP6157895B2 (ja) | テクスチャー形成用組成物、シリコン基板の製造方法、及びテクスチャー形成用組成物調製キット | |
CN114373807A (zh) | 一种晶硅电池的钝化结构及其制备方法 | |
TWI544653B (zh) | A solar cell and a manufacturing method thereof, and a manufacturing apparatus for a solar cell |