TW201033388A - Target structure and method for manufacturing target structure - Google Patents
Target structure and method for manufacturing target structure Download PDFInfo
- Publication number
- TW201033388A TW201033388A TW99101819A TW99101819A TW201033388A TW 201033388 A TW201033388 A TW 201033388A TW 99101819 A TW99101819 A TW 99101819A TW 99101819 A TW99101819 A TW 99101819A TW 201033388 A TW201033388 A TW 201033388A
- Authority
- TW
- Taiwan
- Prior art keywords
- target
- plate
- flow path
- fluid flow
- fixed
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 238000000034 method Methods 0.000 title description 7
- 239000012530 fluid Substances 0.000 claims abstract description 38
- 239000012809 cooling fluid Substances 0.000 claims abstract description 9
- 238000004544 sputter deposition Methods 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 53
- 238000001816 cooling Methods 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 239000000498 cooling water Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- 238000007689 inspection Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009011919A JP4382867B1 (ja) | 2009-01-22 | 2009-01-22 | ターゲット構造及びターゲット構造の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201033388A true TW201033388A (en) | 2010-09-16 |
| TWI359202B TWI359202B (https=) | 2012-03-01 |
Family
ID=41549762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW99101819A TW201033388A (en) | 2009-01-22 | 2010-01-22 | Target structure and method for manufacturing target structure |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4382867B1 (https=) |
| KR (1) | KR101059940B1 (https=) |
| CN (1) | CN101960043A (https=) |
| TW (1) | TW201033388A (https=) |
| WO (1) | WO2010084857A1 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI481736B (zh) * | 2011-04-12 | 2015-04-21 | Ulvac Inc | 靶材及靶材之製造方法 |
| TWI560296B (en) * | 2011-06-30 | 2016-12-01 | Samsung Display Co Ltd | A non-adhesive sputtering structure including a sputtering target and backing plate |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5596118B2 (ja) * | 2010-07-23 | 2014-09-24 | Ｊｘ日鉱日石金属株式会社 | ターゲットの裏面に溝を備えた磁性材スパッタリングターゲット |
| CN102501045B (zh) * | 2011-10-20 | 2014-10-08 | 宁波江丰电子材料股份有限公司 | 镍靶材组件的加工方法及加工装置 |
| CN104588807B (zh) * | 2013-10-31 | 2016-07-20 | 宁波江丰电子材料股份有限公司 | 背板的形成方法和背板 |
| WO2017016575A1 (en) * | 2015-07-24 | 2017-02-02 | Applied Materials, Inc. | Cooling and utilization optimization of heat sensitive bonded metal targets |
| EP3375007A4 (en) * | 2015-11-12 | 2019-07-31 | Honeywell International Inc. | CARRIER PLATE ASSEMBLY WITH COOLING STRUCTURE FOR SPUTTER TARGETS |
| CN108018534B (zh) * | 2017-12-12 | 2020-12-11 | 中国电子科技集团公司第四十八研究所 | 一种用于装夹靶材的磁控溅射镀膜装夹装置 |
| TWI687534B (zh) * | 2018-09-07 | 2020-03-11 | 住華科技股份有限公司 | 背板、使用其之濺射靶材及其使用方法 |
| JP7362327B2 (ja) * | 2019-07-18 | 2023-10-17 | 東京エレクトロン株式会社 | ターゲット構造体及び成膜装置 |
| CN110828021B (zh) * | 2019-11-04 | 2024-09-06 | 中国原子能科学研究院 | 一种用于医用同位素生产靶的水冷机构 |
| CN111455335B (zh) * | 2020-04-24 | 2022-10-21 | 河北恒博新材料科技股份有限公司 | 一种平面靶材的绑定方法 |
| CN112323026A (zh) * | 2020-10-29 | 2021-02-05 | 珠海和泽科技有限公司 | 靶材背板及其制作方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0401622B1 (de) * | 1989-06-05 | 1995-08-23 | Balzers Aktiengesellschaft | Verfahren zum Kühlen von Targets sowie Kühleinrichtung für Targets |
| JPH0625839A (ja) * | 1992-01-10 | 1994-02-01 | Sony Corp | スパッタ装置及びカソード |
| JP3747447B2 (ja) * | 1996-11-08 | 2006-02-22 | ソニー株式会社 | スパッタ装置 |
| JP2000026962A (ja) * | 1998-07-09 | 2000-01-25 | Matsushita Electric Ind Co Ltd | スパッタリング装置 |
-
2009
- 2009-01-22 JP JP2009011919A patent/JP4382867B1/ja not_active Expired - Fee Related
-
2010
- 2010-01-19 CN CN2010800012070A patent/CN101960043A/zh active Pending
- 2010-01-19 WO PCT/JP2010/050555 patent/WO2010084857A1/ja not_active Ceased
- 2010-01-19 KR KR1020107019956A patent/KR101059940B1/ko not_active Expired - Fee Related
- 2010-01-22 TW TW99101819A patent/TW201033388A/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI481736B (zh) * | 2011-04-12 | 2015-04-21 | Ulvac Inc | 靶材及靶材之製造方法 |
| TWI560296B (en) * | 2011-06-30 | 2016-12-01 | Samsung Display Co Ltd | A non-adhesive sputtering structure including a sputtering target and backing plate |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI359202B (https=) | 2012-03-01 |
| JP4382867B1 (ja) | 2009-12-16 |
| KR101059940B1 (ko) | 2011-08-29 |
| KR20100114923A (ko) | 2010-10-26 |
| WO2010084857A1 (ja) | 2010-07-29 |
| CN101960043A (zh) | 2011-01-26 |
| JP2010168621A (ja) | 2010-08-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |