201033388 六、發明說明： 【發明所屬之技術領域】 用以固定該無材且 造方法。 本發明係關於具有濺鍍用之靶材、及 冷卻該靶材之冷卻板的靶材結構及其製 【先前技術】 /列如在半導體裝置之製造製程等t，係使用在基板上進 订成膜之㈣裝置。濺鍵裝置具有藉由離子化之氣體等之201033388 VI. Description of the invention: [Technical field to which the invention pertains] A method for fixing the material without the material. The present invention relates to a target structure having a target for sputtering and a cooling plate for cooling the target, and a method for preparing the same according to a manufacturing method of a semiconductor device, or the like, for ordering on a substrate. (4) device for film formation. The sputtering device has a gas by ionization or the like
衝擊而放出所期望之原子的賤鍍用乾材。該乾材τ，例如 如圖4所示，其背面側係接合於襯塾板b。藏鍵時，由於離 子之衝擊等會使㈣表面之溫度上升，因此需要冷卻乾材 丁。因此，於襯墊板B之内部通常形成有供冷卻水流過之冷 卻水流路A。 迄今為止，靶材T與襯墊板B例如為提高用以冷卻之熱 傳導性，而藉由所謂結合（b〇nding)將其接合。結合係藉由 於靶材T與襯墊板B之接合面介入有結合材c，貼合靶材τ 與概塾板B而進行。 先前技術文獻 專利文獻 專利文獻1 :日本專利公開公報2007_051308號 【發明内容】 發明所欲解決之問題 然而’上述結合須使用較高價之In、Sn等結合材，且需 要進行靶材或襯墊板之對位或接合面之改質處理、結合材 之塗布、加熱處理等多種步驟。因此，於結合上會耗費成 146010.doc 201033388 本與時間。另-方面，若不進行結合而單純以其他方法固 定’則會使靶材與襯墊板間之熱傳導性降低。 本發明係㈣上述問題點而完成者，其目的在於提供一 種可在維餘材與觀塾板等固定㈣之熱料性下，以更 低成本及短時間製造具絲材及固定板㈣材結構，及該 乾材結構之製造方法。 解決問題之技術手段 用以達成上述目的之本發明之乾材結構，係具有濺鍵月 之乾材'及用以固定_且冷卻該乾材之固定板者，』 於前述固定板中形成有供冷卻流體流過之流體流路，該夺 體流路係料於與濺㈣料㈣之消耗相對較多之部我 置，並且前述_板與前㈣材係藉由於無前对 &體流路之位置貫通前述固 心奴疋螺釘而固定，又，前过 靶材之一部份係露出於前述流體流路。 根據本發明，由於係藉由4 可餘…， 固定靶材與固定板，因此 / 错此，與藉由結合固定之情 形相比，可大幅降低製造成本。 „ $ ^ 又，亦可大幅縮短製造時 曰1。再者’由於乾材之_部々\在. .y P伤係露出於流體流路，因此可 確保靶材與固定板間之埶傳 # ^ ^ ^ * 導性。又，固定板之流體流路 ::置於賤鍍時婦消耗較多而變成高溫之部份。因此， 如本發明般之藉由於盔前诚攻 …、迚机體流路之位置以貫通前述固 疋板之螺釘來固定靶材盥 柯/、固疋板，可於靶材消耗較少之位 置’即靶材厚度得以維持 m ^ ^ 得p份以螺釘固定。因此，即使 因長時間之使用而消耗乾材 亦可維持靶材與固定板之固 146010.doc 201033388 定 亦可於别述固定板之固定前述靶 卻流體流過之揭益山_ 办成則述冷 十杯而 s，藉由以則述螺釘固定前述靶材與前述固 =开,Γ以前㈣材封閉前述槽而形成前述流體流路。 ::情形般例如，無需如於固定板形成貫通内部之流體流 以焊接等箅W如將預S分割形成之半個之111定板彼此予 知接專專，因此可容易地進行固定板之加工。另A dry material for ruthenium plating that emits a desired atom by impact. The dry material τ is joined to the backing plate b, for example, as shown in Fig. 4, on the back side. When the key is hidden, the temperature of the surface of (4) rises due to the impact of the ions, etc., so it is necessary to cool the dry material. Therefore, a cooling water flow path A through which the cooling water flows is usually formed inside the packing sheet B. Heretofore, the target T and the liner sheet B have been joined by, for example, so-called bonding, for the purpose of improving the thermal conductivity for cooling. The bonding is performed by interposing the bonding material c with the bonding surface of the target T and the backing plate B, and bonding the target τ and the insulating plate B. PRIOR ART DOCUMENT PATENT DOCUMENT Patent Document 1: Japanese Patent Laid-Open Publication No. 2007-051308 SUMMARY OF THE INVENTION Problems to be Solved by the Invention However, the above combination requires the use of a relatively high-priced bonding material such as In, Sn, etc., and requires a target or a liner plate. Various steps such as modification of the alignment or bonding surface, coating of the bonding material, and heat treatment. Therefore, it will cost 146010.doc 201033388 and time on the combination. On the other hand, if it is simply fixed by another method without bonding, the thermal conductivity between the target and the liner sheet is lowered. The present invention is based on (4) the above problems, and the object of the invention is to provide a wire material and a fixing plate (four) material which can be manufactured at a lower cost and in a shorter time under the hot material of the fixed material (4). Structure, and method of manufacturing the dry material structure. Means for Solving the Problem The dry material structure of the present invention for achieving the above object is a dry material of a splashing key and a fixing plate for fixing and cooling the dry material, which is formed in the fixing plate. a fluid flow path through which the cooling fluid flows, the body flow path is placed in a relatively large portion of the consumption of the splash (four) material (four), and the aforementioned _ plate and the front (four) material are due to no front pair & The position of the flow path is fixed by the aforementioned solid-hearted screw, and a part of the front passing target is exposed to the fluid flow path. According to the present invention, since the target and the fixing plate are fixed by 4, the error is made, and the manufacturing cost can be greatly reduced as compared with the case of being fixed by the combination. „ $ ^ Also, it can greatly shorten the manufacturing time 曰1. In addition, because the dry material is _ 々 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 露出 露出 露出 露出 露出 露出 露出 露出 露出 露出 露出 露出# ^ ^ ^ * Inductive. In addition, the fluid flow path of the fixed plate: is placed in the part of the enamel plating, which is consumed by the woman and becomes a high temperature. Therefore, as in the present invention, it is due to the attack before the helmet... The position of the body flow path is fixed by the screw that penetrates the solid plate to fix the target material, and the solid plate can be used at a position where the target consumption is small, that is, the thickness of the target is maintained at m ^ ^ to obtain a screw. Therefore, even if the dry material is consumed due to long-term use, the solidity of the target and the fixed plate can be maintained. 146010.doc 201033388 can also be fixed in the fixed plate to fix the target but the fluid flows through the Jieyi Mountain _ Then, ten cups are squirted, and the fluid flow path is formed by fixing the target and the solid-state opening by the screw, and the former (four) material is closed to form the fluid flow path. :: In the case, for example, it is not necessary to form a fixed plate. The fluid flow through the inside is welded, etc., such as the half of the 111 sheets formed by dividing the pre-S into each other. Then specifically designed, it can be processed easily fixing plate. Another
材則會露出固定板之流體流路，因此可進行例如由於 使用而印留於流體流路内之異物之檢查與除去。藉 此，可延長固定板之製品壽命。 又亦可於别述乾材之固定於前述固定板之面上，形成 嵌f於前述槽” _述槽之凸部。該㈣下，由於可以 2部之部份4絲材之厚度，因此即使於流體流路中流過 Γ7壓之冷*流體而提高冷卻效率，亦可確保⑭材之耐性。 另由於對槽嵌合凸部，因此可提高流體流路之氣密性。 再者，可容易地進行固定時靶材與固定板之定位。 根據另一觀點之本發明之靶材結構之製造方法，其中前 述乾材結構健有之㈣、及用·定該㈣且冷 部該靶材之固定板；前述製造方法係將供冷卻流體流過之 流體流路形成於前述固定板之與濺鍍時前述靶材之消耗相 對較多之部份對向的位置，並藉由於無前述流體流路之位 置貫通前述固定板之螺釘固定前述固定板與前述靶材，且 使前述靶材之一部份露出於前述流體流路。 發明之效果 1460l0.doc 201033388 根據本發明’可於維持靶材與固定板間之熱傳導性下， 以更低成本及短時間製造靶材結構。 【實施方式】 以下’茲參照圖式說明本發明之較佳之實施形態。 圖1係顯示本實施形態之靶材結構1之構成概要之縱剖面 的說明圖。另，本說明書及圖式中，關於實質上具有相同 機能構成之構成要素，係藉由賦與相同符號而省略重複說 明。 靶材結構1具有濺鍍用之板狀靶材10、及固定靶材1〇且 冷卻靶材10之作為板狀之固定板的襯墊板丨丨。靶材10之材 質’例如係使用Al、Cu、Mo、ITO、Si、AZO等，襯墊板 11之材質，例如係使用Cu或A卜Ti、不鏽鋼等。 靶材ίο之背面側係貼合於襯墊板u。襯墊板11之靶材ι〇 侧之面，形成有用以冷卻靶材丨〇之供冷卻流體流過之槽 20。槽20係以相對於例如設有靶材結構丨之濺鍍裝置之磁 鐵Μ之位置的方式，而配設成例如圖2所示之從平面所見 為大致U字型。槽20之加工例如係藉由機械加工進行。再 者，濺鍍裝置例如係藉由磁鐵^1產生磁場，藉由該磁場控 制例如離子，使離子衝擊於靶材1〇。 如圖1所不，靶材10之背面側，形成有嵌合於槽20而封 Ρ才 1槽20之凸部3〇。凸部3〇從平面戶斤見，係形成與槽2〇相同 之大致u字狀。凸部30係以低於槽2〇之深度而形成，且於 槽20喪合有凸部30時’凸部3〇會封閉槽2〇之開口部而形成 流體流路40。藉此’使靶材1〇之一部份露出於流體流路 146010.doc 201033388 4〇。流體流路40例如於兩端形成有作為冷卻流體例如冷卻 水之出入口’藉由於流體流路40流動以冷卻水，可將襯墊 板11調整至低溫’藉由該概塾板11可冷卻乾材1〇。再者， 乾材10之凸部30係藉由機械加工或擠壓成型而形成。 襯墊板11與靶材10係藉由複數之螺釘5〇而固定。螺釘5〇 例如係於不干擾流體流路4〇之位置，以從襯墊板丨丨之背面 側貫通襯墊板11之方式而設置。 另’襯墊板11與靶材1〇間之流體流路4〇之外側，係設有 環狀之密封部60。 製造靶材結構1時，係在於槽2〇嵌合凸部3〇之狀態下， 藉由螺釘50而固定襯墊板u與靶材1(^此時，螺釘5〇係設 於無流體流路40之位置。藉由該固定，使靶材1〇之一部份 露出於流體流路40。 根據以上實施形態，由於係藉由螺釘50固定靶材10與襯 墊板11，因此可簡化靶材結構1之製造步驟。藉此，與藉 由結合而固定之情形相比可大幅降低製造成本。且亦可大 幅=短製造時間。再者，由絲材1G之—部份係露出於流 體流路40 ’因此可確保乾材H)與襯墊板11間之熱傳導性。 又’由於係藉由於無流體流路4〇之位置貫通襯墊板η之螺 釘5〇而固定無材10與襯墊板11 ’因此如圖3所示，可於濺 又夺遠離磁鐵Μ且乾材1〇之消耗（減少）較少的位置，即乾 材1〇之厚度得以維持之部份以螺釘固定。因此，即使由於 時間使用而省耗乾材1〇，亦可維持乾材㈣概塾板η之 1460l0.doc 201033388 再者，由於不進行結合，因此無須將結合材附著於靶材 10，可將使用完之靶材1〇從襯墊板丨丨卸除而作為靶材原料 進行再利用。另’可防止因雜中離子衝擊於結合材而從 結合材放出之物質污染處理基板之情事。再者，由於製造 時不使用如結合時需使用之熱，因此不會因熱而於例如襯 墊板11產生翹曲，從而無需進行襯墊板丨丨之翹曲之修正， 此外亦可防止襯墊板11本身之劣化。 另，上述實施形態中，於襯墊板u之固定靶材1〇之面上 形成槽20，且以螺釘固定靶材1〇與襯墊板11，藉此以靶材 10封閉槽20而形成流體流路4〇。該情形下，無需如例如於 襯墊板11形成貫通内部之流體流路之情況般，將例如預先 为割而形成之半個之概墊板彼此予以焊接等等，因此可容 易地進行概塾板11之加工。另，若卸除靶材1〇則會使襯墊 板11之流體流路40露出，因此可進行例如由於長時間使用 而滯留於流體流路40内之異物之檢查與除去。藉此，可延 長襯墊板11之製品壽命。 又，上述實施形態中，於靶材10之固定於襯墊板丨丨之面 上’开> 成有嵌合於槽20而封閉槽20之凸部30。因此，可以 凸部30之部份確保靶材1〇之厚度，故即使於流體流路4〇流 動以尚壓之冷卻流體而提高冷卻效率，亦可確保乾材丨〇之 耐性。另，由於對於槽20嵌合以凸部3〇 ,因此可提高流體 流路40之氣密性。再者，可容易地進行固定時的靶材丨〇與 襯墊板11之定位。 以上參照附圖説明了本發明之較佳之實施形態，但本發 146010.doc 201033388 明不限於該例。所屬領域技術人員顯然可在申請專利範圍 所記載之思想之範疇内，思及各種變更例或修正例，亦可 了解該等變更例或修正例當然亦屬於本發明之技術範圍 内。 【圖式簡單說明】 圖1係顯示把材結構之構成之縱剖面之說明圖。 圖2係從平面觀察乾材結構時之說明圖。 圖3係顯示因濺鍍而消耗靶材之狀態的靶材結構之說 圖。 圖4係顯示利用結合之料結構之構成之縱剖面的說明 【主要元件符號說明】 1 靶材結構 10 靶材 11 襯墊板 20 槽 30 凸部 40 流體流路 50 螺釘 146010.docThe material exposes the fluid flow path of the fixed plate, so that inspection and removal of foreign matter deposited in the fluid flow path, for example, by use can be performed. As a result, the life of the product of the fixed plate can be extended. Further, in addition, the dry material may be fixed on the surface of the fixing plate to form a convex portion of the groove in the groove. (4), since the thickness of the portion of the four wires can be two, Even if the cooling fluid is passed through the fluid flow path to increase the cooling efficiency, the resistance of the material can be ensured. Further, since the convex portion is fitted to the groove, the airtightness of the fluid flow path can be improved. The fixing of the target material and the fixing plate is performed easily. According to another aspect, the method for manufacturing a target structure according to the present invention, wherein the dry material structure is healthy (4), and the (4) is used and the target is cold The fixing method is a method in which a fluid flow path through which a cooling fluid flows is formed at a position opposite to a portion of the fixing plate that is relatively consumed by the target during sputtering, and by the absence of the fluid The fixing plate and the target are fixed to the position of the flow path through the fixing plate, and a part of the target is exposed to the fluid flow path. Effect of the invention 1460l0.doc 201033388 According to the present invention, the target can be maintained Heat between the material and the fixed plate In the case of the conductivity, the target structure is manufactured at a lower cost and in a shorter time. [Embodiment] Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a view showing the configuration of the target structure 1 of the present embodiment. In the present specification and the drawings, constituent elements that have substantially the same functional configuration are denoted by the same reference numerals, and the description thereof will not be repeated. The target structure 1 has a plate shape for sputtering. The target 10 and the spacer plate which fixes the target 1 and cools the target 10 as a plate-shaped fixing plate. The material of the target 10 is, for example, Al, Cu, Mo, ITO, Si, AZO, or the like. The material of the backing plate 11 is, for example, Cu, A, Ti, stainless steel, etc. The back side of the target ίο is attached to the backing plate u. The surface of the target plate on the side of the target of the laying plate 11 is useful. Cooling the groove 20 through which the cooling fluid flows, the groove 20 is disposed, for example, as shown in FIG. 2 with respect to a position of a magnet Μ of a sputtering device provided with a target structure 丨, for example. It is seen as a substantially U-shape from the plane. The processing of the groove 20 is for example Further, the sputtering apparatus generates a magnetic field by, for example, a magnet, and the magnetic field controls, for example, ions to cause ions to impinge on the target 1 〇. As shown in Fig. 1, the back side of the target 10, The convex portion 3 is formed in the groove 20 and is sealed in the groove 20. The convex portion 3 is formed in a substantially U-shape similar to the groove 2 from the plane. The convex portion 30 is lower than the convex portion 30. The depth of the groove 2 is formed, and when the groove 20 is spliced with the convex portion 30, the convex portion 3 封闭 closes the opening portion of the groove 2 to form the fluid flow path 40. By this, one portion of the target 1 is formed. The portion is exposed to the fluid flow path 146010.doc 201033388 4 . The fluid flow path 40 is formed, for example, at both ends thereof as an inlet and outlet of a cooling fluid such as cooling water. By the fluid flow path 40 flowing to cool the water, the gasket plate 11 can be adjusted. To the low temperature', the dry plate 1 can be cooled by the profile plate 11. Further, the convex portion 30 of the dry material 10 is formed by machining or extrusion molding. The laying plate 11 and the target 10 are fixed by a plurality of screws 5〇. The screw 5 〇 is provided, for example, so as not to interfere with the fluid flow path 4 , so as to penetrate the liner sheet 11 from the back side of the liner sheet. Further, an annular sealing portion 60 is provided on the outer side of the fluid flow path 4A between the liner plate 11 and the target member 1. When the target structure 1 is manufactured, the spacer plate u and the target 1 are fixed by the screws 50 in the state in which the groove 2 is fitted to the convex portion 3 (wherein, the screw 5 is screwed to the fluid-free flow) The position of the road 40. By this fixing, a part of the target 1 is exposed to the fluid flow path 40. According to the above embodiment, since the target 10 and the laying plate 11 are fixed by the screws 50, the simplification is simplified. The manufacturing step of the target structure 1. Thereby, the manufacturing cost can be greatly reduced as compared with the case of being fixed by bonding, and the manufacturing time can be greatly reduced. Further, the part of the wire 1G is exposed. The fluid flow path 40' thus ensures thermal conductivity between the dry material H) and the backing plate 11. In addition, since the uncovered material 10 and the backing plate 11 are fixed by the screw 5 贯通 which penetrates the laying plate η by the position of the fluid-free flow path 4 ′′, as shown in FIG. 3 , it can be splashed away from the magnet and The position where the dry material is reduced (reduced) is small, that is, the portion where the thickness of the dry material is maintained is fixed by screws. Therefore, even if the dry material is consumed for a period of time, the dry material can be maintained. (4) The basic plate η is 1460l0.doc 201033388 Furthermore, since the bonding is not performed, it is not necessary to attach the bonding material to the target 10, and The used target 1 is removed from the liner sheet and reused as a target material. In addition, it is possible to prevent contamination of the substrate by the substance released from the bonding material by the impact of the impurities on the bonding material. Further, since the heat to be used when bonding is not used at the time of manufacture, warpage is not caused, for example, by the gasket 11 due to heat, so that it is not necessary to correct the warpage of the liner sheet, and it is also possible to prevent The liner board 11 itself is deteriorated. Further, in the above embodiment, the groove 20 is formed on the surface of the fixed target 1 衬垫 of the laying plate u, and the target 1 〇 and the laying plate 11 are fixed by screws, whereby the groove 20 is closed by the target 10 to form The fluid flow path is 4〇. In this case, it is not necessary to weld, for example, a half of the pads which are formed in advance by cutting, as in the case where the liner plate 11 is formed to flow through the inner fluid flow path, and the like, and thus it is easy to carry out the introduction. Processing of the board 11. Further, when the target 1 is removed, the fluid flow path 40 of the spacer 11 is exposed, so that inspection and removal of foreign matter remaining in the fluid flow path 40 due to long-term use can be performed, for example. Thereby, the life of the product of the liner sheet 11 can be extended. Further, in the above embodiment, the convex portion 30 of the groove 20 is closed by being fitted to the groove 20 on the surface of the target member 10 fixed to the liner sheet. Therefore, the thickness of the target member 1 can be ensured by the portion of the convex portion 30. Therefore, even if the fluid flow path 4 flows to increase the cooling efficiency by the cooling fluid which is still pressurized, the resistance of the dry material can be ensured. Further, since the convex portion 3 is fitted to the groove 20, the airtightness of the fluid flow path 40 can be improved. Further, the positioning of the target crucible and the liner sheet 11 at the time of fixing can be easily performed. The preferred embodiment of the present invention has been described above with reference to the drawings, but the present invention is not limited to this example. It is obvious to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an explanatory view showing a longitudinal section of a structure of a material. Fig. 2 is an explanatory view when the dry material structure is viewed from a plane. Fig. 3 is a view showing a structure of a target in a state in which a target is consumed by sputtering. Figure 4 is a view showing a longitudinal section of the structure using a combined material structure. [Main component symbol description] 1 Target structure 10 Target 11 Liner plate 20 groove 30 Projection 40 Fluid flow path 50 Screw 146010.doc