TWI687534B - Backing plate and sputtering target and method for using the same - Google Patents

Backing plate and sputtering target and method for using the same Download PDF

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Publication number
TWI687534B
TWI687534B TW107131508A TW107131508A TWI687534B TW I687534 B TWI687534 B TW I687534B TW 107131508 A TW107131508 A TW 107131508A TW 107131508 A TW107131508 A TW 107131508A TW I687534 B TWI687534 B TW I687534B
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Taiwan
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plate
plate body
wall
sputtering
fixing
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TW107131508A
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Chinese (zh)
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TW202010859A (en
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楊清河
吳智穩
翁基祥
蘇夢鵬
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住華科技股份有限公司
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Priority to TW107131508A priority Critical patent/TWI687534B/en
Priority to CN201910184139.9A priority patent/CN110684951A/en
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Publication of TW202010859A publication Critical patent/TW202010859A/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A backing plate, and sputtering target and a method for using the same are provided. The backing plate includes a first plate, a second plate and fixing elements. The fixing elements are detachable and used to attach the first plate with the second plate.

Description

背板、使用其之濺射靶材及其使用方法 Backplane, sputtering target material using the same, and method of using the same

本發明是有關於一種背板、使用其之濺射靶材及其使用方法。 The invention relates to a backplane, a sputtering target using the same, and a method of using the same.

目前，濺鍍技術(sputtering)係為主要沉積鍍膜技術所使用的方式之一。濺鍍技術一般是在濺鍍腔室中形成電漿，電漿(plasma)會對金屬靶材進行離子轟擊(ion bombardment)，使靶材的金屬原子撞擊出，而形成氣體分子發射到達所要沉積的基材上，氣體分子經過附著、吸附、表面遷徙、成核等濺鍍作用之後，最終在基材上形成具有金屬原子的金屬薄膜。濺鍍技術係廣泛地應用在工業生產和科學研究領域。然而，一般濺射靶材使用焊接製程(bonding)，因此組裝費時、費用較高且使用彈性小。 Currently, sputtering is one of the main methods used to deposit coatings. Sputtering technology generally forms plasma in the sputtering chamber. The plasma bombards the metal target with ion bombardment, causing the metal atoms of the target to strike out, forming gas molecules that emit to the desired deposit. On the substrate, after the gas molecules undergo sputtering such as attachment, adsorption, surface migration, and nucleation, a metal thin film with metal atoms is finally formed on the substrate. Sputtering technology is widely used in industrial production and scientific research. However, the sputtering target generally uses a bonding process, so assembly is time-consuming, expensive, and has low flexibility.

本發明係有關於一種背板、使用其之濺射靶材及其使用方法。 The invention relates to a backplane, a sputtering target using the same, and a method of using the same.

根據本發明之一方面，提出一種背板，其包括第一板體、第二板體及固定件。固定件用以可拆地連接第一板體及第二板體。 According to one aspect of the present invention, a backplane is provided, which includes a first plate body, a second plate body and a fixing member. The fixing member is used for detachably connecting the first plate body and the second plate body.

根據本發明之一方面，提出一種濺射靶材，其包括如上所述之背板與濺射板，濺射板設置在背板上。 According to one aspect of the present invention, a sputtering target material is proposed, which includes the back plate and the sputtering plate as described above, and the sputtering plate is provided on the back plate.

根據本發明之另一方面，提出一種濺射靶材的使用方法，包括：提供如上所述之背板。藉由固定件連接第一板體及第二板體。配置濺射板在背板上。 According to another aspect of the present invention, a method for using a sputtering target is proposed, which includes: providing the back plate as described above. The first plate body and the second plate body are connected by a fixing member. Configure the sputtering plate on the backplane.

為了對本發明之上述及其他方面有更佳的瞭解，下文特舉實施例，並配合所附圖式詳細說明如下： In order to have a better understanding of the above and other aspects of the present invention, the following examples are specifically described in conjunction with the accompanying drawings as follows:

102、202、302:第一板體 102, 202, 302: the first plate

102A、202A、106A、206A:溝槽 102A, 202A, 106A, 206A: groove

102B:板基底 102B: Board base

102W1、106W1、302W1、306W1:外板壁 102W1, 106W1, 302W1, 306W1: outer panel wall

102W2、106W2、302W2、306W2:內板壁 102W2, 106W2, 302W2, 306W2: inner panel wall

103:管線通孔 103: pipeline through hole

104:流體管路 104: fluid line

106、206、306:第二板體 106, 206, 306: second plate

108、208、308:背板 108, 208, 308: backplane

108A:腔室固定孔 108A: chamber fixing hole

110、310:第一板體表面 110, 310: the first plate surface

112、312:第二板體表面 112, 312: second board surface

114、214:容置空間 114, 214: accommodating space

116:固定件 116: fastener

118:濺射板 118: Sputtered board

118S:濺射表面 118S: Sputtered surface

120、220、320:濺射靶材 120, 220, 320: sputtering target

102C、106C、302C、306C:固定孔 102C, 106C, 302C, 306C: fixing holes

H、H1、H2:高度 H, H1, H2: height

L、L1:長度 L, L1: length

W:寬度 W: width

第1A圖至第1E圖繪示根據第一實施例概念之濺射靶材的使用方法。 FIGS. 1A to 1E illustrate a method of using a sputtering target according to the concept of the first embodiment.

第2A圖至第2D圖繪示根據第二實施例概念之濺射靶材的使用方法。 2A to 2D illustrate a method of using a sputtering target according to the concept of the second embodiment.

第3圖繪示根據第三實施例概念之濺射靶材。 FIG. 3 shows a sputtering target according to the concept of the third embodiment.

以下係以一些實施例做說明。須注意的是，本揭露並非顯示出所有可能的實施例，未於本揭露提出的其他實施態樣也可能可以應用。再者，圖式上的尺寸比例並非按照實際產品等比例繪製。因此，說明書和圖示內容僅作敘述實施例之用，而非 作為限縮本揭露保護範圍之用。另外，實施例中之敘述，例如細部結構、製程步驟和材料應用等等，僅為舉例說明之用，並非對本揭露欲保護之範圍做限縮。實施例之步驟和結構各之細節可在不脫離本揭露之精神和範圍內根據實際應用製程之需要而加以變化與修飾。以下是以相同/類似的符號表示相同/類似的元件做說明。 The following is a description with some embodiments. It should be noted that this disclosure does not show all possible embodiments, and other implementations not proposed in this disclosure may also be applicable. Furthermore, the size ratios in the drawings are not drawn according to the actual products. Therefore, the description and illustrations are only for describing the embodiments, not for As a limitation of the disclosure of the scope of protection. In addition, the descriptions in the embodiments, such as the detailed structure, process steps and material application, etc., are for illustrative purposes only, and do not limit the scope of the disclosure to be protected. The details of the steps and structure of the embodiments can be changed and modified according to the needs of the actual application process without departing from the spirit and scope of the present disclosure. The following description uses the same/similar symbols to indicate the same/similar components.

第1A圖至第1E圖繪示根據第一實施例概念之濺射靶材的使用方法。 FIGS. 1A to 1E illustrate a method of using a sputtering target according to the concept of the first embodiment.

請參照第1A圖，提供第一板體102。第一板體102包括板基底102B、外板壁102W1及內板壁102W2。外板壁102W1是從板基底102B的四側邊緣凸出的封閉框形壁部分。內板壁102W2是從板基底102B凸出並連接從外板壁102W1之內表面的條狀壁部分。第一板體102具有由板基底102B、外板壁102W1及內板壁102W2定義出的溝槽102A。此實施例中，外板壁102W1及內板壁102W2上設有複數固定孔102C。板基底102B設有管線通孔103。管線通孔103分別連通溝槽102A與外界環境。 Please refer to FIG. 1A to provide the first board 102. The first plate body 102 includes a plate base 102B, an outer plate wall 102W1 and an inner plate wall 102W2. The outer panel wall 102W1 is a closed frame-shaped wall portion protruding from the four side edges of the panel base 102B. The inner panel wall 102W2 is a strip-shaped wall portion protruding from the panel base 102B and connected from the inner surface of the outer panel wall 102W1. The first plate body 102 has a groove 102A defined by a plate base 102B, an outer plate wall 102W1 and an inner plate wall 102W2. In this embodiment, the outer plate wall 102W1 and the inner plate wall 102W2 are provided with a plurality of fixing holes 102C. The board base 102B is provided with pipeline through holes 103. The pipeline through holes 103 respectively connect the groove 102A and the external environment.

請參照第1B圖，將流體管路104配置在第一板體102的溝槽102A中。流體管路104之相對兩端分別穿過二管線通孔103而延伸至外部，即板基底102B上的二管線通孔103可分別作為流體管路104的出液口、入液口。 Referring to FIG. 1B, the fluid line 104 is disposed in the groove 102A of the first plate body 102. The opposite ends of the fluid pipeline 104 respectively extend through the two pipeline through holes 103 to the outside, that is, the two pipeline through holes 103 on the board base 102B can serve as the liquid outlet and the liquid inlet of the fluid pipeline 104, respectively.

請參照第1C圖，提供第二板體106。第二板體106具有溝槽106A。將流體管路104夾設在第一板體102與第二板體 106之間，並使流體管路104配置在溝槽102A與溝槽106A中，從而形成背板108。 Please refer to FIG. 1C to provide the second plate 106. The second plate 106 has a groove 106A. The fluid line 104 is sandwiched between the first plate body 102 and the second plate body Between 106 and the fluid line 104 is arranged in the groove 102A and the groove 106A, thereby forming a back plate 108.

一實施例中，背板108之長度L約為2500-3500mm，例如3000mm；背板108之寬度W約為100-300mm，例如190mm。第一板體102之高度H1約佔背板108之高度H的75%~87.5%，例如80%。第二板體106之高度H2約佔背板108之高度H的12.5%~25%，例如20%。一實施例中，背板108之高度H約為16mm，第二板體106之高度H2則約為2mm-4mm，例如3.2mm、第一板體102之高度H1約為12-14mm，例如12.8mm。背板108具有相對的第一板體表面110及第二板體表面112，第一板體表面110及第二板體表面112分別位於背板108的相反側。 In one embodiment, the length L of the back plate 108 is about 2500-3500 mm, such as 3000 mm; the width W of the back plate 108 is about 100-300 mm, such as 190 mm. The height H1 of the first plate body 102 accounts for about 75% to 87.5% of the height H of the back plate 108, for example, 80%. The height H2 of the second plate 106 accounts for about 12.5% to 25% of the height H of the back plate 108, for example, 20%. In one embodiment, the height H of the back plate 108 is about 16mm, the height H2 of the second plate body 106 is about 2mm-4mm, for example 3.2mm, and the height H1 of the first plate body 102 is about 12-14mm, for example 12.8 mm. The back plate 108 has a first plate surface 110 and a second plate surface 112 opposite to each other. The first plate surface 110 and the second plate surface 112 are respectively located on opposite sides of the back plate 108.

第一板體102的溝槽102A與第二板體106的溝槽106A共同定義出背板108的容置空間114。此實施例中，輪廓是呈蛇行狀並列成2列。第一板體102的溝槽102A與第二板體106的溝槽106A構成的容置空間114的形狀輪廓與尺寸可配合流體管路104，具有U形輪廓，使得流體管路104能夠卡合在容置空間114中。 The groove 102A of the first plate body 102 and the groove 106A of the second plate body 106 together define the accommodation space 114 of the back plate 108. In this embodiment, the outline is arranged in two rows in a serpentine shape. The shape contour and size of the accommodating space 114 formed by the groove 102A of the first plate body 102 and the groove 106A of the second plate body 106 can match the fluid line 104 and have a U-shaped profile so that the fluid line 104 can be engaged In the accommodating space 114.

一實施例中，背板108之中還可選擇性的設置一磁性物質(未繪示)，磁性物質設置在容置空間114中，以控制之後配置濺射板118(繪示於第1D圖)的磁力線型。 In one embodiment, a magnetic substance (not shown) can be selectively disposed in the back plate 108, and the magnetic substance is arranged in the accommodating space 114 to control the placement of the sputtering plate 118 (shown in FIG. 1D) )'S magnetic line type.

請參照第1C~1D圖，可使用複數個固定件116可拆地固定第一板體102及第二板體106。第二板體106亦設有外板 壁106W1及內板壁106W2，分別與第一板體102的外板壁102W1及內板壁102W2相對應，第二板體106之外板壁106W1及內板壁106W2之上設有與第一板體102之複數固定孔102C相對應連通的複數固定孔106C，複數固定孔106C並分別貫穿第二板體106之外板壁106W1及內板壁106W2。複數個固定件116個別配置在第一板體102與第二板體106相對應的複數固定孔102C、106C中，在背板108不重疊容置空間114的部分進行鎖固，例如配置在第一板體102的外板壁102W1及內板壁102W2，及分別與其相對應重疊的第二板體106的外板壁106W1及內板壁106W2之間。此實施例中，複數個固定件116是分別從第二板體表面112穿過第二板體106的外板壁106W1及內板壁106W2而穿入第一板體102的外板壁102W1及內板壁102W2中，即該些固定件116中，有一些固定件116是從第二板體106的外板壁106W1對應穿入第一板體102的外板壁102W1中，另一些固定件116是從第二板體106的內板壁106W2對應穿入第一板體102的內板壁102W2中，且固定件116係各別從第二板體106的固定孔106C對應鎖入第一板體102的固定孔102C中。固定件116可包括螺絲、插栓、或黏著劑，例如金屬黏著劑、軟焊劑等，其中螺絲或插栓的材料可為不鏽鋼、鐵。 Please refer to FIGS. 1C to 1D, a plurality of fixing members 116 may be used to detachably fix the first plate body 102 and the second plate body 106. The second plate 106 is also provided with an outer plate The wall 106W1 and the inner plate wall 106W2 correspond to the outer plate wall 102W1 and the inner plate wall 102W2 of the first plate body 102 respectively, and the second plate body 106 is provided with a plurality of the first plate body 102 on the outer plate wall 106W1 and the inner plate wall 106W2 The fixing holes 102C correspond to a plurality of fixed holes 106C communicating with each other, and the plurality of fixing holes 106C respectively penetrate the outer plate wall 106W1 and the inner plate wall 106W2 of the second plate body 106. The plurality of fixing pieces 116 are individually arranged in the plurality of fixing holes 102C and 106C corresponding to the first plate body 102 and the second plate body 106, and locked at a portion of the back plate 108 that does not overlap the accommodating space 114, for example, at the first Between the outer plate wall 102W1 and the inner plate wall 102W2 of a plate body 102, and the outer plate wall 106W1 and the inner plate wall 106W2 of the second plate body 106 respectively corresponding to and overlapping with each other. In this embodiment, the plurality of fixing members 116 respectively pass through the outer plate wall 106W1 and the inner plate wall 106W2 of the second plate body 106 from the second plate body surface 112 to penetrate into the outer plate wall 102W1 and the inner plate wall 102W2 of the first plate body 102 In the fixing members 116, some fixing members 116 penetrate the outer plate wall 106W1 of the second plate body 106 into the outer plate wall 102W1 of the first plate body 102, and other fixing elements 116 are from the second plate The inner plate wall 106W2 of the body 106 corresponds to penetrate into the inner plate wall 102W2 of the first plate body 102, and the fixing pieces 116 respectively lock into the fixing holes 102C of the first plate body 102 from the fixing holes 106C of the second plate body 106 . The fixing member 116 may include screws, plugs, or adhesives, such as metal adhesives, soft solders, etc., wherein the material of the screws or plugs may be stainless steel or iron.

一實施例中，可利用鑽孔方式在第一板體102及第二板體106的複數固定孔102C、106C中分別形成具有對應螺絲的螺紋側面，且可使用螺絲起子將螺絲旋進螺絲孔，即利用螺旋 機制將固定件116從第二板體表面112對應鎖入第二板體106的固定孔106C及第一板體102的固定孔102C中，使固定件116分別連接第二板體106及第一板體102的螺紋側面，以可拆地固定第二板體106及第一板體102。透過上述之鎖固方法以形成之背板108，其複數個固定件116對第一板體102及第二板體106產生之扭力值約為25KgF-cm~35KgF-cm，例如29.4KgF-cm。複數個固定件116須避開流體管路104設置，如複數個固定件116分布在對應於第二板體106之外板壁106W1、內板壁106W2及第一板體102之外板壁102W1、內板壁102W2之間，以對應連接第二板體106及第一板體102，複數固定孔102C、106C設置之位置可供複數個固定件116定位在背板108之容置空間114外側的部分，因此複數個固定件116不重疊容置空間114，以避免影響背板108散熱，使流體管路104達到均勻的冷卻效果。 In one embodiment, a plurality of fixing holes 102C and 106C in the first plate body 102 and the second plate body 106 can be respectively formed with threaded side faces by using a drilling method, and a screwdriver can be used to screw the screws into the screw holes , That is, using the spiral The mechanism locks the fixing member 116 into the fixing hole 106C of the second board 106 and the fixing hole 102C of the first board 102 from the second board surface 112 correspondingly, so that the fixing member 116 is connected to the second board 106 and the first The threaded side surface of the plate body 102 can detachably fix the second plate body 106 and the first plate body 102. The back plate 108 formed by the above-mentioned locking method has a plurality of fixing members 116 that produce a torque value of about 25KgF-cm~35KgF-cm for the first plate body 102 and the second plate body 106, for example, 29.4KgF-cm . The plurality of fixing pieces 116 must be disposed away from the fluid line 104, for example, the plurality of fixing pieces 116 are distributed on the outer plate wall 106W1, the inner plate wall 106W2 corresponding to the second plate body 106 and the outer plate wall 102W1, the inner plate wall of the first plate body 102 Between 102W2, to connect the second plate 106 and the first plate 102 correspondingly, the plurality of fixing holes 102C, 106C are provided at positions where the plurality of fixing pieces 116 can be positioned outside the accommodating space 114 of the back plate 108, so The plurality of fixing members 116 do not overlap the accommodating space 114, so as not to affect the heat dissipation of the back plate 108, and to achieve uniform cooling effect of the fluid pipeline 104.

一實施例中，複數個固定件116之總數約介於3至150個，例如30個。一實施例中，複數個固定件116分布在第一板體102或第二板體106上的單位密度約為0.000526~0.026個/cm2，例如0.01個/cm2。一實施例中，複數個固定件116之總表面積約佔第一板體表面110或第二板體表面112的面積的1%~50%，例如30%。一實施例中，複數個固定件116之間距約介於2~10cm，例如5cm。第一板體102、第二板體106與流體管路104的組裝方法簡單、快速。相較於一般技術採用焊接製程(bonding)的組裝方式，根據本實施例使用鎖固方法可降低組裝時 間及製造成本，提升生產效率。 In one embodiment, the total number of the plurality of fixing members 116 is about 3 to 150, such as 30. In an embodiment, the unit density of the plurality of fixing members 116 distributed on the first plate body 102 or the second plate body 106 is about 0.000526~0.026 pieces/cm 2 , for example, 0.01 pieces/cm 2 . In one embodiment, the total surface area of the plurality of fixing members 116 accounts for about 1% to 50% of the area of the first plate surface 110 or the second plate surface 112, such as 30%. In one embodiment, the distance between the plurality of fixing members 116 is about 2-10 cm, such as 5 cm. The method of assembling the first plate body 102, the second plate body 106 and the fluid line 104 is simple and fast. Compared with the general technique of using a welding process (bonding) assembling method, using the locking method according to the present embodiment can reduce assembly time and manufacturing cost, and improve production efficiency.

請參照第1D圖，第1D圖是以類似第1C圖所示AB線的方位所繪示出的剖面圖。如第1D圖所示，配置濺射板118在背板108的第二板體表面112上，濺射板118之長度L1約為2150-3150mm，例如2650mm，此時第二板體表面112可視為背板108的上表面。一實施例中，複數個固定件116可配置於濺射板118之下。一實施例中，將濺射板118配置在背板108的第一板體表面110上，此時第一板體表面110可視為背板108的上表面。 Please refer to FIG. 1D. FIG. 1D is a cross-sectional view similar to the line AB shown in FIG. 1C. As shown in FIG. 1D, the sputtering plate 118 is arranged on the second plate surface 112 of the back plate 108. The length L1 of the sputtering plate 118 is about 2150-3150mm, for example, 2650mm. At this time, the second plate surface 112 is visible It is the upper surface of the back plate 108. In one embodiment, a plurality of fixing members 116 can be disposed under the sputtering plate 118. In one embodiment, the sputter plate 118 is disposed on the first plate body surface 110 of the back plate 108. At this time, the first plate body surface 110 can be regarded as the upper surface of the back plate 108.

一實施例中，可利用接合件(未繪示)將濺射板118固定在背板108的第二板體表面112上，從而組裝完成濺射靶材120。濺射板118與背板108之間的接合件(未繪示)可包括螺絲、插栓、或黏著劑，例如金屬黏著劑、軟焊劑等。濺射板118的濺射表面118S為濺射靶材120放置在濺鍍腔室中時面向欲被沉積薄膜之基材的表面。一實施例中，流體管路104中可導入液體，而可對濺射靶材120提供冷卻、散熱的效果。 In one embodiment, the sputter plate 118 can be fixed on the second plate surface 112 of the back plate 108 by using a bonding member (not shown), so that the sputtering target 120 is assembled. The joint (not shown) between the sputter plate 118 and the back plate 108 may include screws, plugs, or adhesives, such as metal adhesives, soft solders, and the like. The sputtering surface 118S of the sputtering plate 118 is the surface facing the substrate on which the thin film is to be deposited when the sputtering target 120 is placed in the sputtering chamber. In one embodiment, a liquid can be introduced into the fluid line 104, which can provide cooling and heat dissipation effects to the sputtering target 120.

請參照第1E圖，一實施例中，背板108之最外圍可更包括至少一腔室固定孔108A，以供後續固定於濺鍍腔室(未繪示)之用。 Please refer to FIG. 1E. In one embodiment, the outermost periphery of the back plate 108 may further include at least one chamber fixing hole 108A for subsequent fixing in the sputtering chamber (not shown).

實施例中，可對使用後或需重工之濺射靶材120進行拆解。拆解方法包括先將濺射板118從背板108上卸除。再拆卸背板108之固定件116，例如，可利用螺絲起子將固定件116(例如為螺絲)旋出固定孔102C、106C，使背板108的第一板體102 與第二板體106彼此分離，並將流體管路104從第一板體102及第二板體106中卸除而移出背板108之容置空間114，拆解方式簡單且快速，而可增進製造速度。 In the embodiment, the sputtering target 120 after use or reworking may be disassembled. The disassembly method includes first removing the sputtering plate 118 from the back plate 108. Then, remove the fixing member 116 of the back plate 108, for example, a screwdriver can be used to screw the fixing piece 116 (for example, a screw) out of the fixing holes 102C and 106C to make the first plate body 102 of the back plate 108 The second plate 106 is separated from each other, and the fluid line 104 is removed from the first plate 102 and the second plate 106 to move out of the accommodating space 114 of the back plate 108. The disassembling method is simple and fast. Improve manufacturing speed.

濺射板118的材質可視欲沉積在基材上的薄膜材質而定，例如為金屬或氧化物。背板108的第一板體102及第二板體106與濺射板118的材質可為相同或不同。一實施例中，背板108的第一板體102及第二板體106的材質為銅，濺射板118的材質是選用鋁。另一實施例中，背板108的第一板體102及第二板體106的材質皆為鋁、鈦或銅的金屬，濺射板118的材質為鋁、鈦或銅等金屬或氧化銦錫氧化物。 The material of the sputtering plate 118 may depend on the material of the thin film to be deposited on the substrate, such as metal or oxide. The materials of the first plate body 102 and the second plate body 106 of the back plate 108 and the sputtering plate 118 may be the same or different. In one embodiment, the material of the first plate 102 and the second plate 106 of the back plate 108 is copper, and the material of the sputtering plate 118 is aluminum. In another embodiment, the first plate 102 and the second plate 106 of the back plate 108 are made of aluminum, titanium, or copper, and the sputter plate 118 is made of aluminum, titanium, or copper, or indium oxide. Tin oxide.

第2A圖至第2D圖繪示根據第二實施例概念之濺射靶材的使用方法。 2A to 2D illustrate a method of using a sputtering target according to the concept of the second embodiment.

請參照第2A圖，提供第一板體202，其與第1A圖所示之第一板體102的差異說明如下。第一板體202包括板基底102B與外板壁102W1。第一板體102具有由板基底102B及外板壁102W1定義出的溝槽202A。板基底102B設有連通溝槽202A與外界環境的二管線通孔103。 Please refer to FIG. 2A to provide the first plate body 202. The difference from the first plate body 102 shown in FIG. 1A is described as follows. The first plate body 202 includes a plate base 102B and an outer plate wall 102W1. The first plate body 102 has a groove 202A defined by a plate base 102B and an outer plate wall 102W1. The board base 102B is provided with two pipeline through holes 103 that connect the groove 202A with the external environment.

請參照第2B圖，將流體管路104配置在第一板體202的溝槽202A中，並將流體管路104之相對二端分別穿過二管線通孔103而延伸至外部。 Referring to FIG. 2B, the fluid pipeline 104 is disposed in the groove 202A of the first plate 202, and the two opposite ends of the fluid pipeline 104 are respectively extended through the two pipeline through holes 103 to the outside.

請參照第2C圖，提供第二板體206。第二板體206具有溝槽206A。將流體管路104夾設在第一板體202與第二板體 206之間，並使流體管路104配置在溝槽202A與溝槽206A中，從而形成背板208。第一板體202的溝槽202A與第二板體206的溝槽206A共同定義出背板208的容置空間214。此實施例中，溝槽202A與溝槽206A構成的容置空間214具有長方體形狀。流體管路104可配置在容置空間214中，並使用固定件116將第一板體202及第二板體206可拆地固定在一起。固定件116可配置在背板208之位在容置空間214外側的部分，請參考第一實施例之鎖固方法以形成背板208，於此不再贅述。 Please refer to FIG. 2C to provide the second board 206. The second plate 206 has a groove 206A. The fluid line 104 is sandwiched between the first plate 202 and the second plate Between 206, the fluid line 104 is arranged in the groove 202A and the groove 206A, thereby forming a back plate 208. The groove 202A of the first plate body 202 and the groove 206A of the second plate body 206 jointly define the accommodating space 214 of the back plate 208. In this embodiment, the accommodating space 214 formed by the groove 202A and the groove 206A has a rectangular parallelepiped shape. The fluid line 104 can be disposed in the accommodating space 214, and the first plate 202 and the second plate 206 can be detachably fixed together using a fixing member 116. The fixing member 116 can be disposed at a portion of the back plate 208 outside the accommodating space 214. Please refer to the locking method of the first embodiment to form the back plate 208, which will not be repeated here.

請參照第2D圖，第2D圖是以類似第2C圖所示CD線的方位所繪示出的剖面圖。如第2D圖所示，可利用一接合件(未繪示)將濺射板118固定在背板208的第二板體206上，從而組裝完成濺射靶材220。接合件(未繪示)可包括螺絲、插栓、或黏著劑，例如金屬黏著劑、軟焊劑等。 Please refer to FIG. 2D, which is a cross-sectional view drawn in an orientation similar to the CD line shown in FIG. 2C. As shown in FIG. 2D, a splicing plate 118 can be fixed on the second plate body 206 of the back plate 208 using a bonding member (not shown), so that the sputtering target 220 is assembled. The joints (not shown) may include screws, plugs, or adhesives, such as metal adhesives, solder pastes, and the like.

實施例中，可對濺射靶材220進行拆解。拆解方法包括將濺射板118從背板208上卸除。亦同樣可如第一實施例之方式拆卸背板208之固定件116，使第一板體202與第二板體206彼此分離，並將流體管路104從第一板體202及第二板體206中卸除而移出背板208之容置空間214。 In an embodiment, the sputtering target 220 may be disassembled. The disassembly method includes removing the sputtering plate 118 from the back plate 208. Similarly, the fixing member 116 of the back plate 208 can be removed as in the first embodiment, so that the first plate body 202 and the second plate body 206 are separated from each other, and the fluid line 104 is separated from the first plate body 202 and the second plate The body 206 is removed and moved out of the accommodating space 214 of the back plate 208.

第3圖繪示根據第三實施例概念之濺射靶材320，其與第一實施例的差異在於，此實施例中，複數個固定件116是分別從相對於第二板體表面312的第一板體表面310穿過第一板體302的外板壁302W1及內板壁302W2而穿入第二板體306的 外板壁306W1及內板壁306W2中，即該些固定件116中，有一些固定件116是從第一板體302的外板壁302W1對應穿入第二板體306的外板壁306W1中，另一些固定件116是從第一板體302的內板壁302W2對應穿入第二板體306的內板壁306W2中，且複數個固定件116係從第一板體302的固定孔302C對應鎖入第二板體306的固定孔306C中。例如使用螺絲起子將螺絲旋進螺絲孔，即利用螺旋機制將固定件116從第一板體表面310對應鎖入第一板體302的固定孔302C及第二板體306的固定孔306C中，使固定件116分別連接第一板體302及第二板體306的螺紋側面，以可拆地固定第一板體302及第二板體306。此概念亦可延伸至第二實施例。 FIG. 3 illustrates the sputtering target 320 according to the concept of the third embodiment. The difference from the first embodiment is that in this embodiment, a plurality of fixing members 116 are respectively opposite to the surface 312 of the second plate The first plate surface 310 passes through the outer plate wall 302W1 and the inner plate wall 302W2 of the first plate body 302 and penetrates into the second plate body 306 In the outer panel wall 306W1 and the inner panel wall 306W2, that is, in the fixing members 116, some of the fixing members 116 are penetrated from the outer panel wall 302W1 of the first panel body 302 into the outer panel wall 306W1 of the second panel body 306, and others are fixed The piece 116 is inserted into the inner plate wall 306W2 of the second plate body 306 from the inner plate wall 302W2 of the first plate body 302, and a plurality of fixing pieces 116 are correspondingly locked into the second plate from the fixing holes 302C of the first plate body 302 In the fixing hole 306C of the body 306. For example, a screwdriver is used to screw the screw into the screw hole, that is, the screw 116 is used to lock the fixing member 116 from the first plate body surface 310 into the fixing hole 302C of the first plate body 302 and the fixing hole 306C of the second plate body 306, The fixing members 116 are respectively connected to the screw side surfaces of the first plate body 302 and the second plate body 306 to detachably fix the first plate body 302 and the second plate body 306. This concept can also be extended to the second embodiment.

根據本揭露概念的濺射靶材亦可視實際需求任意調變結構設計。例如，另一實施例中，第一板體與第二板體中，只有第一板體具有溝槽，且此溝槽具有可容納整個流體管路的尺寸與形狀。又另一實施例中，第一板體與第二板體中，只有第二板體具有溝槽，且此溝槽具有可容納整個流體管路的尺寸與形狀。再另一實施例中，由第一板體及第二板體定義出的容置空間可具有其它形狀，例如呈蛇行狀並列成3列、4列或更多列、或呈螺旋形狀、或具有立方體形狀、圓柱體形狀等，但不限於此，只要流體管路能配置在其中，且第一板體及第二板體可相鄰接彼此固定即可。 The sputtering target according to the concept of the present disclosure can also be arbitrarily adjusted in structural design according to actual needs. For example, in another embodiment, of the first plate body and the second plate body, only the first plate body has a groove, and the groove has a size and shape that can accommodate the entire fluid line. In yet another embodiment, of the first plate body and the second plate body, only the second plate body has a groove, and the groove has a size and shape that can accommodate the entire fluid pipeline. In still another embodiment, the accommodating space defined by the first plate body and the second plate body may have other shapes, for example, a serpentine shape arranged in 3 rows, 4 rows or more, or a spiral shape, or It has a cubic shape, a cylindrical shape, etc., but it is not limited thereto, as long as the fluid line can be disposed therein, and the first plate body and the second plate body can be fixed adjacent to each other.

綜上所述，雖然本發明已以實施例揭露如上，然其 並非用以限定本發明。本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾。因此，本發明之保護範圍當視後附之申請專利範圍所界定者為準。 In summary, although the invention has been disclosed as above with examples, its It is not intended to limit the invention. Those with ordinary knowledge in the technical field to which the present invention belongs can make various modifications and retouching without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be deemed as defined by the scope of the attached patent application.

102:第一板體 102: the first plate

102A、106A:溝槽 102A, 106A: groove

102C、106C:固定孔 102C, 106C: fixed hole

102W1、106W1:外板壁 102W1, 106W1: outer panel wall

102W2、106W2:內板壁 102W2, 106W2: inner wall

104:流體管路 104: fluid line

106:第二板體 106: second plate

108:背板 108: backplane

110:第一板體表面 110: surface of the first plate

112:第二板體表面 112: second board surface

114:容置空間 114: accommodating space

116:固定件 116: fastener

118:濺射板 118: Sputtered board

118S:濺射表面 118S: Sputtered surface

120:濺射靶材 120: Sputtering target

L1:長度 L1: Length

Claims (10)

一種背板，包括：一第一板體；一第二板體；及複數個固定件，用以可拆地連接該第一板體及該第二板體，其中該複數個固定件包括螺絲或插栓，且該複數個固定件是獨立於該第一板體與該第二板體。 A back plate includes: a first plate body; a second plate body; and a plurality of fixing pieces for detachably connecting the first plate body and the second plate body, wherein the plurality of fixing pieces includes screws Or a plug, and the plurality of fixing pieces are independent of the first plate body and the second plate body. 如申請專利範圍第1項所述之背板，其中該第一板體及該第二板體共同定義出一容置空間，一流體管路設置在該容置空間中，其中該第一板體及該第二板體滿足至少一項選自下列(1)~(6)之結構特徵：(1)該第一板體及該第二板體至少一者具有一溝槽，該容置空間由該溝槽定義；(2)該第一板體之高度佔所述之背板之高度的75%~87.5%；(3)該第二板體之高度佔所述之背板之高度的12.5%~25%；(4)該第一板體具有至少一管線通孔，該至少一管線通孔連通該容置空間；(5)該第一板體及該第二板體皆包括相對的一內板壁及一外板壁，該複數個固定件是配置在該第一板體的該外板壁及該內板壁，及分別與其相對應重疊的該第二板體的該外板壁及該內板壁之間；(6)該第一板體及該第二板體形成具有對應螺絲的螺紋側面，該複數個固定件分別連接該第一板體及該第二板體的該螺紋側面，藉以鎖固該第一板體及該第二板體。 The back plate as described in item 1 of the patent application scope, wherein the first plate body and the second plate body together define an accommodating space, and a fluid line is provided in the accommodating space, wherein the first plate The body and the second plate body satisfy at least one structural feature selected from the following (1) to (6): (1) At least one of the first plate body and the second plate body has a groove, the accommodating The space is defined by the groove; (2) the height of the first plate body accounts for 75%~87.5% of the height of the back plate; (3) the height of the second plate body accounts for the height of the back plate 12.5%~25%; (4) The first plate body has at least one pipeline through hole, the at least one pipeline through hole communicates with the accommodating space; (5) The first plate body and the second plate body include Opposed to an inner panel wall and an outer panel wall, the plurality of fixing members are disposed on the outer panel wall and the inner panel wall of the first panel body, and the outer panel wall and the second panel body respectively overlapping with them Between the inner plate walls; (6) the first plate body and the second plate body form threaded sides with corresponding screws, and the plurality of fixing members are respectively connected to the threaded sides of the first plate body and the second plate body, Thereby, the first plate body and the second plate body are locked. 如申請專利範圍第1項所述之背板，其中該複數個固定件滿足至少一項選自下列(1)~(6)之結構特徵：(1)該複數個固定件對該第一板體及該第二板體產生之扭力值為25KgF-cm~35KgF-cm；(2)該複數個固定件之總數介於3至150個；(3)該複數個固定件分布在該第一板體或該第二板體上的單位密度為0.000526~0.026個/cm2；(4)該複數個固定件之總表面積分別佔該背板的一第一板體表面或一第二板體表面的面積的1%~50%，該第一板體表面及該第二板體表面是彼此相對；(5)該複數個固定件之間距介於2~10cm；(6)該複數個固定件不重疊該第一板體及該第二板體共同定義之一容置空間。 The backplane as described in item 1 of the patent application scope, wherein the plurality of fixing members satisfy at least one structural feature selected from the following (1) to (6): (1) the plurality of fixing members The torque value generated by the body and the second plate is 25KgF-cm~35KgF-cm; (2) The total number of the plurality of fixing pieces is between 3 and 150; (3) The plurality of fixing pieces are distributed on the first The unit density of the board or the second board is 0.000526~0.026/cm 2 ; (4) The total surface area of the plurality of fixing members respectively occupies a surface of a first board or a second board of the backboard 1%~50% of the surface area, the surface of the first plate and the surface of the second plate are opposite to each other; (5) the distance between the plurality of fixing pieces is between 2~10cm; (6) the plurality of fixings The pieces do not overlap the first plate body and the second plate body to jointly define an accommodating space. 一種濺射靶材，包括：一如申請專利範圍第1項至第3項任一項所述之背板；及一濺射板，設置在該背板上。 A sputtering target material includes: a backplane as described in any one of claims 1 to 3; and a sputtering plate provided on the backplane. 如申請專利範圍4項所述之濺射靶材，其中該背板或該濺射板滿足至少一項選自下列(1)~(6)之結構特徵：(1)該濺射板的材質係金屬或氧化物；(2)該背板的材質係金屬；(3)該複數個固定件配置在該濺射板下方；(4)該背板之最外圍包括至少一腔室固定孔；(5)該濺射板係配置於該第一板體或該第二板體上； (6)該背板更包括一磁性物質設置在該第一板體及該第二板體共同定義之該容置空間中。 The sputtering target as described in item 4 of the patent application, wherein the backplane or the sputtering plate satisfies at least one structural feature selected from the following (1) to (6): (1) the material of the sputtering plate It is a metal or oxide; (2) The material of the back plate is metal; (3) The plurality of fixing members are arranged under the sputtering plate; (4) The outermost periphery of the back plate includes at least one chamber fixing hole; (5) The sputtering plate is arranged on the first plate body or the second plate body; (6) The back plate further includes a magnetic substance disposed in the accommodating space defined by the first plate body and the second plate body. 如申請專利範圍5項所述之濺射靶材，其中該第一板體及該第二板體的材質皆為鋁、鈦或銅的金屬；或該濺射板的材質為鋁、鈦、銅、或氧化銦錫氧化物。 The sputtering target material as described in item 5 of the patent scope, wherein the material of the first plate body and the second plate body are metals of aluminum, titanium or copper; or the material of the sputtering plate is aluminum, titanium, Copper, or indium tin oxide. 一種濺射靶材的使用方法，包括：提供一如申請專利範圍第1~3項之任一項所述之背板；藉由該複數個固定件連接該第一板體及該第二板體；及配置一濺射板在該背板上。 A method for using a sputtering target, comprising: providing a back plate as described in any one of the patent application items 1 to 3; connecting the first plate body and the second plate with the plurality of fixing members Body; and configure a sputtering plate on the back plate. 如申請專利範圍第7項所述之濺射靶材的使用方法，其中是提供如申請專利範圍第2項所述之背板，該複數個固定件連接該第一板體及該第二板體的使用方法包括：將該複數個固定件分別從該背板的一第一板體表面穿過該第一板體的該外板壁對應鎖入該第二板體的該外板壁中、從該第一板體表面穿過該第一板體的該內板壁對應鎖入該第二板體的該內板壁中；或將該複數個固定件分別從該背板的相對於該第一板體表面的一第二板體表面穿過該第二板體的該外板壁對應鎖入該第一板體的該外板壁中、從該第二板體表面穿過該第二板體的該內板壁對應鎖入該第一板體的該內板壁中，透過該複數個固定件分別連接該第一板體及該第二板體的螺紋側面，以鎖固該第一板體及該第二板體。 The method of using a sputtering target as described in item 7 of the patent application scope is to provide a backplane as described in item 2 of the patent application scope, the plurality of fixing members connecting the first plate body and the second plate The method of using the body includes: locking the plurality of fixing pieces from a surface of a first plate body of the back plate through the outer plate wall of the first plate body into the outer plate wall of the second plate body respectively, The surface of the first plate passes through the inner plate wall of the first plate body and locks into the inner plate wall of the second plate body; or the plurality of fixing members are respectively separated from the back plate relative to the first plate A second plate surface of the body surface passing through the outer plate wall of the second plate body correspondingly locks into the outer plate wall of the first plate body, the second plate body passes through the second plate body from the second plate body surface The inner panel wall is correspondingly locked into the inner panel wall of the first panel body, and the threaded sides of the first panel body and the second panel body are respectively connected through the plurality of fixing members to lock the first panel body and the first panel body Second board. 如申請專利範圍第7項所述之濺射靶材的使用方法，其中是提供如申請專利範圍第2項所述之背板，該使用方法更包括將該流體管路或一磁性物質設置在該容置空間中，或將該 濺射板配置於該背板的一第一板體表面或一第二板體表面上，該第一板體表面及該第二板體表面是彼此相對。 The use method of the sputtering target material as described in item 7 of the patent application scope, which is to provide the backing plate as described in item 2 of the patent application scope, the use method further includes providing the fluid line or a magnetic substance in In the accommodating space, or The sputtering plate is disposed on a surface of a first plate or a surface of a second plate of the back plate. The surface of the first plate and the surface of the second plate are opposite to each other. 如申請專利範圍第9項所述之濺射靶材的使用方法，更包括拆卸該背板之該複數個固定件，使該第一板體與該第二板體彼此分離，並將該流體管路移出該容置空間。 The method of using the sputtering target as described in item 9 of the patent application scope further includes disassembling the plurality of fixing members of the back plate, separating the first plate body and the second plate body from each other, and separating the fluid The pipeline moves out of the accommodating space.
TW107131508A 2018-09-07 2018-09-07 Backing plate and sputtering target and method for using the same TWI687534B (en)

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