TW201708582A - Backing plate, sputtering target, and method for manufacturing same - Google Patents

Abstract

The purpose of the present invention is to provide a method for manufacturing a backing plate whereby the thickness of a cover member can be made uniform, a backing plate in which the thickness of a cover member is uniform after manufacturing, and a sputtering target including such a backing plate. The present invention makes it possible to provide: a method for manufacturing a backing plate including joining a plate-shaped body having a groove on one side through which a fluid passes and a plate-shaped cover member disposed on the body so as to cover the groove of the body, wherein the method for manufacturing a backing plate includes fixing the body so that after the body and the cover member are joined and integrated, the difference between the maximum value and the minimum value of the height measured on a surface of the cover member is less than 0.5 mm, an interface between the body and the cover member being an upper surface, and the method for manufacturing a backing plate includes processing at least a portion of the interface by cutting; a backing plate in which the difference between the maximum value and the minimum value of the thickness of the cover member is 0.4 mm or less; and a sputtering target including such a backing plate.

Description

Backing plate, sputtering target, and manufacturing method thereof

The present invention relates to a backing plate, a sputtering target, and methods of making the same.

The backing plate is supported by a target that is sputtered to the sputter target, and the sputter target is fixed to the member used in the sputter device. Moreover, the backing plate also serves to dissipate heat generated during sputtering.

The back sheet for a sputtering apparatus used for forming an integrated circuit (IC) is, for example, a disk having a diameter of up to about 500 to 600 mm, and is generally made of a plate material such as a copper alloy or an aluminum alloy.

Further, the back sheet for a sputtering apparatus used for the manufacture of a liquid crystal display (LCD) is, for example, a plate shape (or a panel shape), and is generally made of a plate material such as copper or a copper alloy.

Moreover, the target used in the sputtering apparatus for LCD manufacturing is generally larger than that of the IC user, and the amount of heat generated during sputtering is also very large. The heat generated also affects the characteristics of the film formed by sputtering, so a large back sheet which can effectively cool the target is used. When it has a plate shape, it is possible that the dimension in the longitudinal direction is larger than 3 m.

For example, in the back sheets used for LCD manufacturing, for example, in general, for the purpose of improving heat dissipation performance and cooling performance, a flow path through which a fluid for a refrigerant is used is often formed. In such a flow path, for example, a groove for a flow path is formed in advance in a body constituting the back plate, and a cover member formed to cover the groove is engaged with, for example, a groove portion of the main body, and is joined by welding or the like. And formed.

[Previous Technical Literature] [Patent Document]

[Patent Document 1] Patent No. 4852897

[Patent Document 2] Patent No. 3818084

[Patent Document 3] JP-A-2012-126965

As a back sheet used for LCD manufacturing, it is usually large and has a long dimension, and a relatively hard metal such as copper or a copper alloy is used, so that there is a problem of bending or deformation in manufacturing.

Further, when the flow path for the refrigerant is formed in the back sheet, when the main body and the lid member are welded and joined, the heat causes problems such as deformation or deflection of the entire body including the lid member. In particular, in the case of electron beam welding, when the electron beam is irradiated to the joint portion, a large amount of heat is applied to the joint portion, so that the possibility of deformation or deflection is increased.

Further, in the case of electron beam welding, a ridge portion called a bead is usually formed in the joint portion, and a flat surface having less unevenness is formed by cutting and removing, and when the desired back sheet shape is processed, there is The thickness of the cover member may be uneven due to the above deformation or deflection.

Further, recently, in the joining of the main body and the lid member constituting the back sheet, friction stir welding (friction stir welding) by friction heat has been used. In this case, a protrusion called a burr is formed on the joint portion, and a flat surface is formed by cutting and removing the joint, and when the shape is a desired back sheet shape, the thickness of the cover member may be uneven as described above. .

Conventionally, after joining the main body and the cover member, the purpose of correcting the deformation occurring in the joined body is to perform the removal operation of the deformation by the correcting operation or machining of the press. However, it is customary to focus on being able to process into the desired final shape, or to correct it in such a manner that no deformation remains on the finished backing plate, and does not specifically review the uniformity of the thickness of the members constituting the backing plate. It is known that the back sheet has a problem of uniformity of the thickness of the cover member.

Further, when the joined body such as the back sheet is joined by electron beam welding or friction stir welding, the joined body is gently curved on the joint surface side. Therefore, when the backing plate of the desired size is processed by the cutting process after the main body and the cover member are joined, it is easy to cause the thickness of the cover member to be thinner or thicker in the range of several tens to several hundreds of mm.

As described above, when the thickness of the cover member is not uniform, the pressure of the fluid pressed into the flow path (for example, 0.2 to 0.7 MPa) is applied to the sputtering during sputtering. In the case of such a non-uniform cover member, the possibility of deformation in a thin portion of the cover member becomes high, and problems such as bending or breakage of the cover member may occur. In particular, in the case where the thickness of the constituent member is designed to be thinner, the risk of deformation accompanying the unevenness of the thickness of the cover becomes high. For example, in the back plate made of copper, when the thickness of the cover member is designed to be 5 mm or less, it is necessary to pay attention to the cover. The uniformity of the components.

Moreover, the unevenness of the thickness of such a cover member not only reduces the strength of the back sheet itself used for repeatedly bonding the target, but also causes unevenness in the thickness of the side of the opposite side to which the target is adhered. In general, when the surface on the opposite side is to be processed in such a manner that the joint surface of the cover member is parallel, if the thickness unevenness of the cover member due to deformation or deflection of the body remains, the surface of the opposite side is processed. Thickness unevenness also occurs. Such unevenness in thickness causes a local difference in cooling efficiency, and therefore, in a sputtering target in which a target is bonded by solder, local peeling may occur in the target.

Accordingly, an object of the present invention is to provide a method for producing a back sheet in which the thickness of the lid member can be made uniform, and to provide a back sheet having a uniform thickness of the lid member after the production and a sputtering target including the back sheet.

In view of the problems of the present invention, the inventors have found through intensive research that in the method of manufacturing a back sheet using a body having a groove for a flow path and a cover member thereof, the joint surface of the body and the cover member is used as the upper surface. When the difference between the maximum value and the minimum value of the height measured in the surface of the cover member is less than 0.5 mm, the body is fixed, and the machining is performed by cutting The joint surface can make the thickness of the cover member uniform, and the present invention has been completed.

The present invention provides the following method for producing a back sheet, a back sheet, a method for producing a sputtering target including the back sheet, and a sputtering target, but the present invention is not limited to the following.

〔1〕

A manufacturing method of a backboard includes joining a plate-shaped body and a plate-shaped cover member having a groove passing through a fluid on one side, the plate-shaped cover member covering the groove of the body The method is disposed on the body; and comprises: after the body is joined to the cover member, the joint surface between the body and the cover member is used as an upper surface, and the maximum height measured on the surface of the cover member is The body is fixed in such a manner that the difference of the minimum values is less than 0.5 mm, and at least a part of the joint surface is cut by machining.

〔2〕

In the manufacturing method described in the above [1], the main body is fixed by a mechanical method.

[3]

In the manufacturing method according to the above [1] or [2], the main body is fixed by a vise, a clamp or a vacuum chuck.

[4]

In the manufacturing method according to any one of the above [1] to [3], the processing is a milling process.

[5]

In the manufacturing method according to any one of the above [1] to [4], the main body and the lid member are joined by electron beam welding or friction stir welding.

[6]

A back plate comprising: a plate-shaped body having a groove passing through a fluid on one side; and a plate-shaped cover member disposed on the body to cover the groove of the body; the body is integrated with the cover member by bonding The difference between the maximum value and the minimum value of the thickness of the cover member is 0.4 mm or less.

[7]

The back sheet obtained by the production method described in the above [1].

〔8〕

In the back sheet according to the above [7], the difference between the maximum value and the minimum value of the thickness of the lid member is 0.4 mm or less.

〔9〕

A sputtering target characterized in that a target is bonded to the back sheet described in the above [6].

[10]

A method for producing a sputtering target, comprising the method of producing a sputtering target comprising a backing plate and a target, wherein the backing plate is manufactured by the manufacturing method according to any one of the above [1] to [5] .

According to the present invention, it is possible to provide the thickness of the cover member The method for manufacturing a uniform back sheet and the back sheet having a uniform thickness of the cover member after the manufacture, in particular, a back sheet having a difference between the maximum value and the minimum value of the thickness of the cover member of 0.4 mm or less and including the back sheet Sputter target.

1‧‧‧ Ontology

2‧‧‧ditch (or flow path)

3‧‧‧Cover components

4‧‧‧ joint

5‧‧‧Base section

6‧‧‧ hole

10‧‧‧ Backboard

20‧‧‧Back plate (with base)

Fig. 1 is a perspective view schematically showing an embodiment of a body (before joining).

Fig. 2 is a perspective view schematically showing an embodiment of a cover member (before joining).

Fig. 3 is a schematic cross-sectional view showing the X-X section of the body shown in Fig. 1.

Fig. 4 is a schematic view showing a schematic representation of a method of manufacturing a back sheet.

[Fig. 5A] A plan view schematically showing an embodiment of a backing plate as seen from the side of the base surface.

[Fig. 5B] A plan view schematically showing an embodiment (having a base portion) of the back plate as seen from the side of the base surface.

Fig. 6A is a side view showing a schematic representation of one embodiment of a backing plate.

Fig. 6B is a side view showing a schematic representation of one embodiment of the back sheet (having a base portion).

Fig. 7 is a plan view schematically showing an embodiment of a joined body as seen from the side of the joint surface.

Fig. 8 is a plan view schematically showing an embodiment of a joined body as seen from the side of the base surface.

Fig. 9 is a side view showing a schematic representation of an embodiment of a joined body.

Fig. 10 is a schematic cross-sectional view (a) of the A-A cross section of the joined body shown in Fig. 8, and a schematic sectional view (b) of the B-B cross section of the joined body shown in Fig. 8.

Fig. 11 is a cross-sectional view showing the C-C cross section of the joined body shown in Fig. 8.

Fig. 12 is a graph showing the result of Example 1 (thickness of the lid member).

Fig. 13 is a graph showing the result of Example 2 (thickness of the lid member).

Fig. 14 is a graph showing the result of Comparative Example 1 (thickness of the lid member).

Fig. 15 is a graph showing the result of Comparative Example 2 (thickness of the lid member).

Fig. 16 is a graph showing the result of Example 3 (thickness of the lid member).

The present invention is mainly directed to a method of manufacturing a back sheet having a body and a lid member, a thickness of the lid member, and a back sheet having a uniform thickness of the lid member after the production.

In the present invention, the "thickness of the lid member" of the back sheet is as described in detail below, and means that the difference between the maximum value and the minimum value of the thickness of the lid member measured in the back sheet after the production is 0.4 mm or less. It is 0.35mm~0mm, more preferably 0.2mm~0mm. When the difference in thickness is more than 0.4 mm, local deformation occurs in the lid member during pressurization, and deformation may remain in the lid member. Moreover, when the backboard is repeatedly used, the strength of the material is lowered. The amount of deformation may also become large, causing damage to the cover member. Further, when the error in the thickness of the main body portion is increased, the local heat transfer efficiency is changed, and localized peeling of the target may occur in the sputtering target in which the solder is bonded. When the target is peeled off, the distance between the target and the substrate changes at the peeling point, which may cause a problem such as adverse effects on the characteristics of the film formed by sputtering.

The method for manufacturing the back sheet of the present invention, for example, as shown in Figs. 1 to 4, and particularly to the schematic view of Fig. 4, includes joining the plate-like body 1 to the plate-like cover member 3 (hereinafter referred to as "engineering (a)", For example, referring to the engineering (a) shown in FIG. 4, the body 1 is provided on one side with a groove 2 through which the fluid can pass, and the cover member 3 is used to cover (or plug) the groove 2 of the body 1. Disposed on the main body 1 includes: after the main body 1 and the cover member 3 are joined together (for example, referring to the joint body 4 of the main body 1 and the cover member 3 shown in FIG. 4), the joint surface of the main body 1 and the cover member 3 is used as In the above, the body 1 (and, if necessary, the cover member 3) is fixed such that the difference between the maximum value and the minimum value of the height measured in the surface of the cover member 3 is less than 0.5 mm, and at least a part of the joint surface is cut (hereinafter) This is called "engineering (b)". For example, refer to the project (b) shown in Fig. 4.

In the present invention, the thickness of the lid member 3 after the cutting can be made uniform by the above-mentioned engineering (a) and engineering (b), and specifically, the difference between the maximum value and the minimum value of the thickness of the lid member can be obtained. Set to 0.4mm or less.

Further, in the present invention, if necessary, as a post-treatment project, for example, it may be on the opposite side of the joint surface of the main body 1 and the lid member 3 (hereinafter, it may be referred to as a "base" in which a target for a sputtering target can be disposed. surface") The base portion 5 is formed. The base portion 5 is a portion in which the target member can be disposed, and the method of forming the target portion is not particularly limited, and the base portion 5 can be processed by, for example, a milling machine for the base portion 5 other than the base surface. Partially cut to form. Further, the shape, size, height, and the like of the base portion 5 are not particularly limited. For example, the surface of the base portion 5 may be substantially parallel to the joined surface after processing, and preferably parallel.

For example, FIGS. 5 and 6 show schematic views of one embodiment of the back sheet of the present invention, but the back sheet of the present invention is not limited to the embodiment. 5A (plan view) and FIG. 6A (side view) schematically show an embodiment of a backing plate without the base portion 5, and FIG. 5B (plan view) and FIG. 6B (side view) schematically show the above-described formation. One of the back plates of the base portion 5 is embodied.

5 (a plan view seen from the side of the base surface) and FIG. 6 (side view), the back sheets 10, 20 basically include a plate-like body 1 having a groove 2 through which a fluid passes on one side (for example, see FIG. 1) And a plate-like cover member 3 (for example, see FIG. 2) which is disposed in the main body 1 so as to cover the groove 2 of the main body 1, and has a structure in which the main body 1 and the cover member 3 are joined to each other.

Further, as shown in FIG. 5B (top view) and FIG. 6B (side view), the base portion 5 on which the target can be placed can be formed on the base surface of the back plate 20.

In the cover member 3 of the joint surface, a hole 6 of any size can be formed at any position thereof to make fluid connection with the groove (or flow path) 2 formed in the body 1 possible. Further, the number of the holes 6 is not particularly limited.

Further, a plurality of holes that can be attached to the sputtering apparatus, preferably through holes (not shown), may be formed in the body of the back sheets 10 and 20.

In the present invention, the shape of the back sheet is not particularly limited, and for example, it is preferably a plate shape (or a panel shape) as shown in the plan view of Fig. 5 .

The size of the back sheet in the present invention is not particularly limited. For example, when the back sheet has a plate shape (or a panel shape), the length in the longitudinal direction is, for example, 400 mm to 4000 mm, preferably 500 mm to 3500 mm, more preferably 700 mm to 3200 mm. Further, the length in the longitudinal direction of the length in the longitudinal direction is, for example, 100 mm to 2000 mm, preferably 150 mm to 1500 mm, more preferably 200 mm to 1500 mm. Further, the length in the longitudinal direction and the length in the width direction may be the same or different.

In the present invention, the thickness of the back sheet (that is, the maximum distance between the base surface (the base surface of the base portion when the base portion is provided) and the joint surface) is, for example, 5 mm to 30 mm, preferably 7 mm. 25mm, more preferably 10mm~20mm. However, as long as a flow path can be formed inside, the thickness of the back plate is not particularly limited.

In the present invention, the shape of the flow path formed inside the backing plate is not particularly limited, and it is not particularly limited as long as the target disposed on the base surface of the backing plate can be cooled. For example, when the flow path has a rectangular cross section as in the illustrated embodiment, the dimension in the width direction is, for example, 10 mm to 100 mm. Further, the dimension in the height direction is, for example, 1 mm to 20 mm, preferably 3 mm to 15 mm, more preferably 4 mm to 10 mm. Further, in the present invention, in a state in which the lid member 3 is placed on the upper side of the groove 2 of the main body 1, the space formed by the groove 2 of the main body 1 and the lid member 3 is a flow path. It is preferable that the bottom surface of the groove 2 and the back surface of the cover member 3 (i.e., the surface opposite to the joint surface) are substantially parallel, and parallel is more preferable. According to the size of the backboard A plurality of flow paths are formed.

Hereinafter, the terminology and each member used in the present invention will be described in detail with reference to FIG. 4 while illustrating the manufacturing method of the present invention.

As shown in Fig. 4, in the manufacturing method of the present invention, in the "engineer (a)", the main body 1 made of the material 1' for the main body is joined to the cover member 3 made of the material 3' for the cover member. In order to integrate them, a joint body 4 having a flow path therein is formed. Thereafter, in the item (b), the difference between the maximum value and the minimum value of the height measured in the surface of the cover member 3 is defined by the joint surface of the body 1 and the lid member 3 of the joint body 4 as the upper surface (or the upper side). The body 1 and the cover member 3 are fixed in a manner of less than 0.5 mm, and at least a part of the joint surface of the joined body 4 is preferably completely cut. The joined body 4 after the processing has a flow path through which the fluid such as cooling water can pass through the joint body 1 and the lid member 3, so that the surface on the opposite side of the joint surface has a cooling function, and has a function as a Since the function of the base surface of the target is disposed, a backing plate for a sputtering target (for example, the bonded body 4 and the backing plate 10 surrounded by a broken line shown in FIG. 4) can be used. Further, if necessary, the manufacturing method of the present invention includes a "post-treatment process", and for example, a back plate having a base portion 5 on a base surface for arranging a target may be manufactured (for example, see FIGS. 4, 5B, and 6B). Back panel 20). Further, in Fig. 4, in order to explain the manufacturing method of the present invention more simply, each member is shown in a perspective view of the shape of the cross section.

<ontology>

As shown in Fig. 4, the body 1 can be formed by processing the material 1' for the body by cutting, grinding, or the like.

The material 1' for the main body may be formed of a conductive material, and a plate-like (or panel-like) material made of a metal or an alloy thereof is preferably used.

The metal may be, for example, copper, copper alloy, aluminum, aluminum alloy, titanium, titanium alloy, tungsten, tungsten alloy, molybdenum, molybdenum alloy, niobium, tantalum alloy, niobium, tantalum alloy, stainless steel, etc., in terms of processability, mechanical strength, durability. From the viewpoints of properties and heat dissipation properties, copper is preferably used. Among them, oxygen-free copper (purity: 99.96% or more and oxygen concentration of 10 ppm or less) is preferably used from the viewpoint of high thermal conductivity and high electrical conductivity.

The body 1, such as shown in the oblique view of Fig. 1, can be passed through a liquid refrigerant (e.g., water, ethanol, ethylene glycol, or the like) after being joined to a cover member (e.g., the cover member 3 shown in Fig. 2) described in detail below. In a manner such as a fluid such as a mixture of two or more kinds, a groove 2 in which a flow path can be formed on one surface thereof.

The groove 2, for example, as shown in the cross-sectional view of Fig. 3, can support (or mount) the shape of the cover member 3 described in detail below, for example, having the step portions 2a, 2b. Further, the shape or size of the groove 2 and the ratio or position of the body 1 are not particularly limited. It is preferable that the groove 2 has a shape or a size in which the surface of the lid member 3 which becomes the joint surface after joining is flush with the surface of the body 1 which becomes the joint surface after joining.

Here, as shown in FIG. 4, the body 1 having the groove 2 can be produced as follows, for example, a plate-shaped (or panel-like) material of an appropriate size. 1', first, the surface on the side of the pedestal surface is used as the upper surface, for example, mechanically fixed using a vise, a vacuum chuck, or the like, for example, by a milling tool using a rotary cutter such as a face milling cutter or a cutter, and then the surface is cut. The seat surface is fixed as follows, for example, by using a vise, a vacuum chuck, etc., and if necessary, for example, using a face milling cutter or a rotary tool such as a cutter to perform cutting by a milling machine, for example, using a face milling cutter or a cutter, A body 1 having a groove 2 can be produced. The formed body 1 has a substantially constant thickness, and the surface on the side of the base surface and the joint surface may be substantially parallel to the bottom surface of the groove 2, and preferably parallel. Further, the outer peripheral surface of the body 1 can be processed by cutting or grinding at any stage as necessary.

Further, the material 1' is not bent, deformed, twisted or the like, and when the horizontal plane can be secured, the surface can be directly used as the base surface, and the groove 2 can be formed on the opposite side as described above.

<cover member>

The cover member 3 is, for example, a perspective view of FIG. 2 and a schematic view of FIG. 4, and is disposed on the main body 1 so as to cover (or plug) the groove 2 of the main body 1, and has a plate shape having a thickness of usually 2 to 6 mm ( Or a panel-like component. From the viewpoint of being easily disposed on the body of the cover member, as shown in the cross-sectional view of FIG. 3, the width of the cover member is set to be larger than the width of the groove so that the cover member is placed on the step portions 2a and 2b of the body. Preferably, the thickness of the cover member is 5 mm or less, and particularly 3.5 mm or less, since the pressure of the flow path is easily deformed, the width of the cover member is set to be the width of the groove + 30 mm or less, preferably +20 mm or less. It is better to set it to a size of +15mm or less. Further, the thickness of the cover member may be appropriately determined, and the thickness of the cover member is 5 mm or less, preferably 3.5 mm or less, and more preferably 3 mm or less.

The material 3' for the lid member which can form the lid member 3 is preferably a material made of a conductive material, and a plate-like (or panel-like) material made of a metal or an alloy thereof is preferably used.

The metal may be, for example, copper, copper alloy, aluminum, aluminum alloy, titanium, titanium alloy, tungsten, tungsten alloy, molybdenum, molybdenum alloy, niobium, tantalum alloy, niobium, tantalum alloy, stainless steel, etc., in terms of processability, mechanical strength, durability. From the viewpoints of properties and heat dissipation properties, copper is preferably used. Among them, oxygen-free copper (purity: 99.96% or more and oxygen concentration of 10 ppm or less) is preferably used from the viewpoint of high thermal conductivity and high electrical conductivity. It is better to use high-strength 1/4H~H oxygen-free copper in oxygen-free copper.

The material 3' may be the same as or different from the material 1'. In the present invention, the cover member 3 and the main body 1 are joined and integrated, and the high strength viewpoint of the joint portion is maintained, and it is preferably a material formed of the same material or the same composition and purity.

The cover member 3, for example, using a restraining tool such as a vise, mechanically fixes a suitably sized material 3', such as a band saw (Sand Saw), a wire saw, a circular saw, a lathe, a milling machine, a band saw, a grinder A water jet or the like can be formed by cutting or cutting. The cover member is formed to have a substantially constant thickness, and the back surface of the watch is substantially parallel, preferably parallel. Further, the outer peripheral surface of the cover member 3 may be cut or polished at any stage as necessary.

Further, if necessary, a hole through which a fluid can pass can be formed at any position of the cover member 3 (for example, refer to the hole 6 shown in Figs. 5 and 6). Further, the number of the holes 6 is not particularly limited. In particular, when the cover member 3 is formed in the hole 6 before the engagement of the body 1 is formed, when the cover member 3 is fitted into the body 1, or the air enclosed by the body 1 and the cover member 3 can be discharged through the hole 6 when they are joined, It is preferable to suppress the occurrence of deviation in the joint portion.

<Engineering (a)>

The project (a) includes integrating the body 1 and the cover member 3 by joining them. For example, as shown in FIG. 4, the cover member 3 is placed on the main body 1 so as to cover the groove 2 of the main body 1, and it is preferable to arrange the surface of the main body 1 so as to be flush with the surface of the cover member 3. Their components.

The joining method of the main body 1 and the cover member 3 is not particularly limited, and may be, for example, Electron Beam Welding (EBW), Friction Stir Welding (FSW), TIG welding, laser beam welding, MIG. Welding, MAG welding, etc. Among them, electron beam welding or friction stir welding is preferred from the viewpoints of smaller welded beads, smaller weld deformation, and the like.

Further, in the present invention, the joined body 4 obtained by joining and integrating the main body 1 and the lid member 3 has a good airtightness at the joint portion. For example, even if air pressurized to 0.1 MPa to 0.8 MPa is injected into the flow path, the air does not leak, and the airtightness can be maintained.

Here, as shown in the schematic diagrams of FIGS. 7 to 9, the joined body 4 One embodiment is more specifically shown. Fig. 7 shows the joint surface of the joined body 4, Fig. 8 shows the base surface of the joined body 4, and Fig. 9 shows the side surface of the joined body 4. 10 to 11 show the cross section of the joined body 4. More specifically, Figures 10(a) and (b) show the A-A and B-B cross-sections of Figure 8, respectively, and Figure 11 shows the C-C cross-section of Figure 8. Further, in the present invention, the joined body 4 is not limited to the illustrated embodiment.

Further, the joined body 4 obtained by the above-described joining may be bent. In this case (in particular, when the length in the longitudinal direction is longer than 2000 mm), for example, the cover member 3 is not deformed by using a straightening machine or the like. In this case, it is preferable to correct the bonded body 4 before the level of the bending is fixed to a level on the horizontal surface, preferably before the thickness is less than 5 mm. Further, in the present invention, the "bending" of the joined body 4 means that the joined body 4 has the base surface as the lower side and is placed on an arbitrary horizontal plane, and the longitudinal direction or the width direction of the joined body 4 (vertical) The edge portion below the end portion of at least one of the widthwise directions in the longitudinal direction is located at a position separated by the horizontal plane, or the edge portion below all the end portions is in contact with the horizontal surface. Only the central portion of the lower portion of the joined body 4 is separated from the horizontal plane. In the present invention, the maximum distance between the separated edge portion or the central portion of the lower portion and the horizontal plane is indicated by the "bending". Further, the edge portion below the end portion may be separated in a wave shape with respect to the horizontal plane, and the maximum distance between the horizontal plane and the edge portion is also expressed by the magnitude of "bending". Further, since the "bending" generated at the lower central portion of the joined body 4 cannot be directly measured, the height of the joined body 4 measured on the surface of the cover member 3 is reduced by the thickness of the joined body 4. The maximum value of the difference is expressed as the "bending" size.

For example, the bending of at least one end portion of the longitudinal direction (hereinafter also referred to as "bending in the longitudinal direction") is preferably less than 5 mm, more preferably less than 1 mm.

Further, the bending of at least one end portion in the width direction (hereinafter also referred to as "bending in the width direction") is preferably less than 5 mm, more preferably less than 1 mm.

<Engineering (b)>

In the item (b), for example, on the horizontal plane, the joint surface of the body 1 and the lid member 3 of the joint body 4 is fixed as the upper surface (or the upper side) (for example, referring to the joint body 4 shown in Fig. 4). Next, when the joined body 4 is fixed to the horizontal plane, it is preferable that the surface on the side where the joined body 4 is provided (the surface on the side of the base surface) is placed as close as possible to the horizontal plane and then fixed. Next, the difference between the maximum value and the minimum value of the height measured in the surface of the cover member 3 (that is, the distance from the plane of the horizontal surface to the measurement point of the surface of the cover member 3) is less than 0.5 mm, preferably From 0.4 mm to 0 mm, more preferably from 0.3 mm to 0 mm, the cover member 3 and at least a part of the joint surface are preferably cut horizontally by cutting, if necessary.

Further, when the parallelism between the joint surface and the base surface can be ensured, the following method can be used for the method of fixing the joint body 4 in the item (b). On the horizontal plane, the joint surface of the body 1 and the cover member 3 of the joint body 4 is taken as the upper surface (or the upper side), so that the base surface is as It is fixed in a way that is grounded to the horizontal plane. When the joined body 4 is fixed to the horizontal plane, the maximum value of the interval between the horizontal plane and the bottom surface of the joined body 4 (the surface which becomes the base surface side) is less than 0.5 mm, preferably 0.4 mm. Preferably, it is preferably fixed in a manner of 0.3 mm to 0 mm, and then at least a part of the joint surface is preferably cut horizontally by cutting.

The method of fixing the joined body 4, particularly the body 1, is not particularly limited. For example, it is preferable to use a pliers, a jig, a vacuum chuck, or the like to fix the jig by mechanical means. When the jig is fixed by a jig or a jig, for example, a plurality of restriction jigs may be disposed in the longitudinal direction of the joint body 4, and the side portion of the clamp joint body may be fixed to the horizontal plane by pressing. The restriction jig is placed at least at the two end portions in the longitudinal direction of the joint body 4 and at the center portion, and it is preferable to additionally arrange five or more positions at the positions of 1/4 and 3/4 in the longitudinal direction. When the difference between the maximum value and the minimum value of the height measured in the surface of the cover member 3 is not less than 0.5 mm, after the joint body 4 is temporarily moved to the extent that the joint body 4 is not moved, the hammer or the plastic hammer is used for thousands of strokes. It is grounded on a horizontal plane so that the surface of the cover member 3 can be fixed in a horizontal state. Moreover, when fixing by a vacuum chuck, for example, before the joining of the main body and the lid member, the base surface side of the main body is cut to form a flat surface, so that the O-ring is centered so that the suction area is increased. The O-ring is disposed around the joined body so as to be located at a distance of 5 mm to 20 mm from the edge of the joined body, and vacuum suction is performed with the base surface side as an adsorption surface until -0.1 MPa. Vacuum (gauge pressure) The line is fixed so that the surface of the cover member 3 can be fixed in a horizontal state.

Further, the position at which the height is measured on the surface of the lid member 3 is not particularly limited. For example, it is preferable to measure above the groove 2, and it is preferable to measure it above the central portion of the groove 2. For example, as shown in FIG. 7, it is preferable to measure the height of the cover member 3 along the straight line L1 and/or L2.

The measurement method of the height is not particularly limited, and for example, it can be measured using an altimeter, a dial gauge, or the like.

As described above, the difference between the maximum value and the minimum value of the height measured in the surface of the cover member 3 is less than 0.5 mm, preferably 0.4 mm to 0 mm, more preferably 0.3 mm to 0 mm. Further, by cutting at least a part of the joint surface, preferably horizontally, it is preferable to perform horizontal processing by the noodle, so that the thickness of the processed lid member can be made uniform. The difference between the maximum value and the minimum value of the thickness of the cover member after processing can be 0.4 mm or less, preferably 0.35 mm to 0 mm, more preferably 0.3 mm to 0 mm.

Further, the processing of the joint surface is not particularly limited as long as the joint surface can be processed by cutting, and for example, it can be processed by milling, planar grinding, end mill processing, lathe machining, or the like.

Further, in the item (b), the side surface of the joined body 4 can be processed by cutting or grinding at any stage, and for example, precision machining can be performed up to the mirror surface.

In the present invention, the joined body 4 obtained after the process (b) (for example, the joined body 4 surrounded by the broken line of Fig. 4, or the joint shown in Figs. 7 to 11) The body 4) can be directly used as a backing plate (for example, the backing plate 10 shown in Figs. 4, 5A, and 6A).

Further, in the production method of the present invention, the following post-treatment work can be performed on the joined body 4 as necessary.

<post-processing engineering>

The post-processing project can be, for example, the following projects.

(1) Cutting of the base surface

(2) Precision machining of the joint surface

(3) Precision machining of the base surface

(4) Piercing processing

(5) Bending correction

The post-processing is preferably performed in the order of the above-mentioned items (1) to (5), but is not limited to the above order. Moreover, the above-mentioned projects (1) to (5) are arbitrary projects, and can be performed in any order. The following is a brief description of each project.

(1) Cutting of the base surface

The bonded body 4 is disposed with the base surface as the upper side, and is fixed by, for example, a vacuum chuck, and the base surface of the joined body 4 is further processed by, for example, milling, grinding, end mill processing, lathe machining, or the like. can.

This cutting process shapes the base surface to be substantially parallel to the joint surface of the joined body 4, and is preferably parallel.

(2) Precision machining of the joint surface

The joint body 4 is disposed with the joint surface as the upper side, and is fixed by, for example, a vacuum chuck, and the joint surface of the joint body 4 may be precisely processed by, for example, milling, grinding, end mill processing, or lathe machining.

This precision machining is performed by cutting or grinding the joint surface of the joined body 4 until the mirror surface is used depending on the application and if necessary.

(3) Precision machining of the base surface

The joined body 4 is disposed on the upper side of the base surface, and is fixed by, for example, a vacuum chuck, and the base surface of the bonded body 4 may be precisely processed by, for example, milling, grinding, or end mill processing.

Further, the base portion 5 may be formed on the base surface at any stage before the precision processing of the base surface as necessary (for example, the back plate 20 shown in FIGS. 5B and 6B). The method of forming the base portion 5 is not particularly limited, and for example, milling processing, grinding processing, end mill processing, lathe machining, and the like can be used.

The precision machining of the base surface can be performed separately on the base portion 5 and the surrounding portions thereof.

This precision machining can process the base surface of the joined body 4 (sometimes both the base portion 5 and the surrounding portions thereof) to the mirror surface.

(4) Piercing processing

If necessary, a through hole may be formed in a portion of the body 1 of the backing plate where the groove 2 or the base portion 5 is not formed. The body 1 can be fixed to the sputtering apparatus by such a bolt or the like in such a through hole. The method of forming the through holes is not particularly limited, and for example, it can be formed using a drill or the like. Further, the size, position, number, and the like of the through holes are not particularly limited.

(5) Bending correction

Between the processing of the back sheet, there is a possibility that the joint body 4 is bent. In this case, for example, it is preferable to correct the joint body 4 by using a straightening machine or the like so that the size of the bend is less than 2 mm, preferably 1 mm. ~0mm, more preferably 0.5mm~0mm.

Again, such correction of the bend can be made at any stage of the manufacture of the backsheet.

For the back sheet thus obtained, a sputtering target can be produced by bonding (or bonding or wire bonding) the target to the base surface of the back sheet using a solder material.

The target material is not particularly limited as long as it is a material composed of a metal or an alloy, an oxide, a nitride or the like, or a sintered body which can be used for film formation by a sputtering method, and the target material can be appropriately selected depending on the use or purpose. Such a target may be, for example, aluminum, copper, titanium, molybdenum, silver, tungsten or an alloy containing them as a main component, indium tin oxide (ITO), aluminum-doped zinc oxide (AZO), gallium-doped zinc oxide ( GZO), In-Ga-Zn composite oxide (IGZO), and the like.

In the production method of the present invention, the target material can be processed into a substantially plate shape, and the method of processing into a plate shape is not particularly limited. In the case of a metal-based target material, for example, a rectangular or cylindrical target material obtained by dissolution or casting is subjected to plastic working such as calendering, extrusion processing, or forging processing, and then subjected to cutting processing or milling processing. Machining such as milling machining can be manufactured by precision machining in such a manner as to achieve the desired size or surface state. On the other hand, in the case of a target material of a high melting point metal or oxide sintering system, the target material is filled in a mold which is in the form of a plate, and is pressed by sintering in a hot press or Hot Isostatic Pressing apparatus. After obtaining a green compact by a sintering method, cold isostatic pressing, or injection molding, a plate-shaped sintered body is obtained by a normal pressure sintering method or the like which is sintered under atmospheric pressure, and then a cutting process or a milling machine is performed. Machining and grinding processing such as machining and end mill processing can be manufactured by precision machining in a desired size or surface state.

The solder material used for bonding the target and the back sheet is not particularly limited, and is preferably a material of a metal or alloy having a low melting point (for example, 723 K or less), and may be, for example, made of indium (In), tin (Sn), or zinc. A material selected from the group consisting of (Zn), lead (Pb), silver (Ag), copper (Cu), bismuth (Bi), cadmium (Cd), and antimony (Sb), or a material thereof. More specifically, it may be In, In-Sn, Sn-Zn, Sn-Zn-In, In-Ag, Sn-Pb, Sn-Pb-Ag, Sn-Bi, Sn-Ag-Cu, Pb-Sn, Pb-Ag, Zn-Cd, Pb-Sn-Sb, Pb-Sn-Cd, Pb-Sn-In, Bi-Sn-Sb, and the like. Solder materials for sputtering targets are generally widely used in low melting point In or In alloys and Sn alloys.

Hereinafter, the present invention will be described in more detail by way of examples, but the invention is not limited to the examples below.

[Examples] [Example 1]

The back sheet 10 shown in Figs. 5A and 6A is produced by using the body of the shape shown in Figs. 1 and 2 and the cover member. Further, in the joining of the project (a), an electron beam welding machine manufactured by Steigerwald Strahltechnik GmbH was used, and the main body and the lid member were joined by electron beam welding.

The material of each member and the design target value set as the target are as follows.

Main body: oxygen-free copper plate (C1020-1/2H made by Mitsubishi Shindo Co., Ltd.)

Vickers hardness > 80

Tensile strength>265MPa

Conductivity >101% IACS (20 ° C)

Cover member: oxygen-free copper plate (C1020-1/2H made by Mitsubishi Shindo Co., Ltd.)

Vickers hardness >80

Tensile strength>265MPa

Conductivity >101% IACS (20 ° C)

Backplane design target value

The dimension of the long side of the backboard: 2500mm

The width of the back plate is 270mm

Back plate thickness: 16mm

Body thickness (groove): 8mm

Cover member thickness: 3mm

The dimension of the long side of the cover member: 2350mm

Dimensions in the width direction of the cover member: 175 mm (full length) (= 70 mm (the dimension in the width direction of the long straight portion) + 35 mm (the dimension in the width direction of the middle portion) + 70 mm (the dimension in the width direction of the long straight portion) )

Dimensions in the width direction of the flow path: 165 mm (full length) (=60 mm (the dimension in the width direction of the long straight portion) + 45 mm (the dimension in the width direction of the middle portion) + 60 mm (the dimension in the width direction of the long straight portion) )

Thickness (or height) of the flow path: 5mm

Since the joined body after joining is bent toward the joint surface side in the longitudinal direction and the width direction, the correction is performed by press forming so that the bending is less than 1 mm.

In the joint surface, the dial gauge is fixed to the door type machining center, and the cover member is moved by moving the dial gauge along the straight lines L1 and L2 located at the center of the long straight portion of the cover member shown in FIG. The height in the surface was measured.

The gate type is used after the joint is fixed by the vise so that the difference between the maximum value and the minimum value of the height measured in the joint surface is 0.4 mm. The machining center performs milling machining (engineering (b)).

Next, the bonded body after the milling machine was fixed by a vacuum chuck to have the base surface as the upper side, and the base surface was subjected to milling processing using a gate type machining center.

The back sheet manufactured in this manner was cut along L1 and L2 shown in FIG. 7, and the "thickness of the lid member" was measured using a vernier caliper. The results are shown in the graph of Figure 12 and Table 1 below.

As shown in Fig. 12 and Table 1, the difference between the maximum value and the minimum value of the "thickness of the cover member" is 0.31 mm (= 3.13 - 2.82) in L1 and 0.26 mm (= 3.14 mm - 2.88 mm) in L2. .

From the results, it was found that in the back sheet produced in Example 1, the thickness of the lid member was uniform.

Further, in the embodiment of the present invention, the uniform thickness of the cover member means that the difference between the maximum value and the minimum value of the thickness of the cover member is "0.4 mm or less".

[Example 2]

A backing plate was produced in the same manner as in Example 1 except that the difference between the maximum value and the minimum value of the height of the joint surface was 0.3 mm.

The back sheet produced in this manner was cut along L1 and L2 shown in FIG. 7, and the "thickness of the lid member" was measured. The results are shown in the graph of Figure 13 and Table 1 below.

As shown in Figure 13 and Table 1, the "thickness of the cover member" is the most The difference between the large value and the minimum value is 0.17 mm (= 3.04 - 2.87) in L1 and 0.13 mm (= 3.04 mm - 2.91 mm) in L2.

As a result of the above, it was found that in the back sheet produced in Example 2, the thickness of the lid member was uniform.

[Example 3]

The body and the lid member are joined by friction stir welding, and the back sheet is produced at the design target value shown below. The material of each member was the same as that of Example 1.

Backplane design target value

The dimension of the long side of the backboard: 2100mm

The width of the back plate is 270mm

Back plate thickness: 16mm

Body thickness (groove): 7.7mm

Cover member thickness: 3.3mm

The dimension of the long side of the cover member: 2000mm

Dimensions in the width direction of the cover member: 175 mm (full length) (= 70 mm (the dimension in the width direction of the long straight portion) + 35 mm (the dimension in the width direction of the middle portion) + 70 mm (the dimension in the width direction of the long straight portion) )

Dimensions in the width direction of the flow path: 165 mm (full length) (= 60 mm (dimension in the width direction of the long straight portion) + 45 mm (the size in the width direction of the middle portion) + 60 mm (the width direction of the long straight portion) Inch))

Thickness (or height) of the flow path: 5mm

A backing plate was produced in the same manner as in Example 1 except that the difference between the maximum value and the minimum value of the height measured in the joint surface was 0.3 mm.

The back sheet produced in this manner was cut along L1 and L2 shown in FIG. 7, and the "thickness of the lid member" was measured. The results are shown in the graph of Figure 16 and Table 1 below.

As shown in Fig. 16 and Table 1, the difference between the maximum value and the minimum value of the "thickness of the cover member" is 0.13 mm (=3.34-3.21) in L1 and 0.10 mm (=3.31 mm - 3.21 mm) in L2. .

As a result of the above, it was found that the thickness of the lid member was uniform in the back sheet produced in Example 3.

[Comparative Example 1]

A backing plate was produced in the same manner as in Example 1 except that the difference between the maximum value and the minimum value of the height measured in the joint surface was 1.0 mm.

The back sheet produced in this manner was cut along L1 and L2 shown in FIG. 7, and the "thickness of the lid member" was measured. The results are shown in the graph of Figure 14 and Table 1 below.

As shown in Fig. 14 and Table 1, the difference between the maximum value and the minimum value of the "thickness of the cover member" is 0.60 mm (=3.77 - 3.17) in L1 and 0.65 mm (= 3.79 - 3.14) in L2.

From such results, it was found that the thickness of the lid member was not uniform in the back sheet produced in Comparative Example 1.

[Comparative Example 2]

A backing plate was produced in the same manner as in Example 1 except that the difference between the maximum value and the minimum value of the height measured in the joint surface was 0.5 mm.

The back sheet produced in this manner was cut along L1 and L2 shown in FIG. 7, and the "thickness of the lid member" was measured. The results are shown in the graph of Figure 15 and Table 1 below.

As shown in Fig. 15 and Table 1, the difference between the maximum value and the minimum value of the "thickness of the cover member" is 0.41 mm (= 3.17 - 2.76) in L1 and 0.48 mm (= 3.16 mm - 2.68 mm) in L2. .

From the results, it was found that in the back sheet produced in Comparative Example 2, the thickness of the lid member was not uniform.

In Comparative Examples 1 and 2, the difference between the maximum value and the minimum value of the thickness of the cover member was more than 0.4 mm, and the thickness of the cover member was not uniform. This is caused by the difference between the maximum value and the minimum value of the height measured in the joint surface when the joined body is fixed in the process (b), which is 0.5 mm or more (in particular, the result of Comparative Example 2).

On the other hand, in the first to third embodiments of the present invention, since the difference between the maximum value and the minimum value of the thickness of the cover member is 0.4 mm or less, the thickness of the cover member is uniform. This is caused by the difference between the maximum value and the minimum value of the height measured in the joint surface when the joint body is fixed in the work (b), which is less than 0.5 mm.

As described above, according to the first to third embodiments and the comparative examples 1 and 2, after the project (a), in the project (b), the maximum height measured in the surface of the lid member among the joint faces of the joined body is as described above. The difference from the minimum value is set The bonded body is fixed to less than 0.5 mm, and at least a part of the joined surface is cut. Thus, in the back sheet after the manufacture, the difference between the maximum value and the minimum value of the thickness of the cover member is 0.4 mm or less, and the thickness of the cover member is Can be set to be uniform.

Further, in the item (b), at least a part of the joint surface is cut in a state in which the joint body is fixed, and such fixing has almost no influence on the bending or deformation of the back sheet after the manufacture.

[Example 4]

A backing plate was produced in the same manner as in Example 1, and a water pressure of 0.5 MPa was applied to the flow path in the backing plate through a hole provided in the lid member connected to the flow path, and a withstand voltage test was performed. After holding for 30 minutes under a pressurized state, it was confirmed whether or not the cover member was deformed under the state of removing the load, and as a result, no deformation was observed. Further, after the withstand voltage test, a He leakage device manufactured by ULVAC Co., Ltd. was used to conduct a He leak test of the flow path, and the leak rate was 5.0 × 10 ^-10 Pa. Below m ³ /s, no leakage occurred. By making the thickness of the lid member uniform, it is possible to obtain a back sheet which is resistant to strong deformation without causing plastic deformation of the lid member even under pressure.

A sputtering target was produced by wire bonding an aluminum target of 2250 mm × 200 mm × t15 mm using indium solder on the back sheet which was confirmed to have no deformation or leakage by the above-described withstand voltage test and the He leak test of the flow path. In the wire bonding operation, although the backing plate was heated to 240 ° C, no large bending was caused, and the bonding rate was detected by the ultrasonic flaw detector. As a result, it was confirmed that the bonding ratio was 99% or more, and the target material could be uniformly and uniformly wired. Sputter target.

In addition, the present application claims priority on the basis of Japanese Patent Application No. 2015-138918, filed on Jan. 10, 2015, the entire disclosure of which is hereby incorporated by reference.

[Industrial use possibility]

The back sheet of the present invention and the method of manufacturing the same can be used for a sputtering target, and in particular, can be used for a sputtering target used in the manufacture of a flat panel display such as a liquid crystal display (LCD).

Claims (10)

A manufacturing method of a backboard includes joining a plate-shaped body and a plate-shaped cover member having a groove passing through a fluid on one side, the plate-shaped cover member covering the groove of the body The method is disposed on the body; and comprises: after the body is joined to the cover member, the joint surface between the body and the cover member is used as an upper surface, and the maximum height measured on the surface of the cover member is The body is fixed in such a manner that the difference of the minimum values is less than 0.5 mm, and at least a part of the joint surface is cut by machining. The manufacturing method of claim 1, wherein the body is fixed by a mechanical means. The manufacturing method of claim 1 or 2, wherein the body is fixed by a vise, a jig or a vacuum chuck. The manufacturing method according to any one of claims 1 to 3, wherein the processing is performed by a milling machine. The manufacturing method according to any one of claims 1 to 4, wherein the body and the cover member are joined by electron beam welding or friction stir welding. A back plate comprising: a plate-shaped body having a groove passing through a fluid on one side; and a plate-shaped cover member disposed on the body to cover the groove of the body; the body is integrated with the cover member by bonding The difference between the maximum value and the minimum value of the thickness of the cover member is 0.4 mm or less. A back sheet obtained by the method of manufacturing as claimed in claim 1. The back sheet of claim 7, wherein a difference between a maximum value and a minimum value of the thickness of the cover member is 0.4 mm or less. A sputtering target incorporating a target on a backing plate as in claim 6 of the patent application. A method of manufacturing a sputtering target, comprising a method of bonding a target to a backing sheet, which is characterized in that the above-mentioned back sheet is manufactured by the manufacturing method according to any one of claims 1 to 5.