CN107849688A

CN107849688A - Backboard, sputtering target and their manufacture method

Info

Publication number: CN107849688A
Application number: CN201680040289.7A
Authority: CN
Inventors: 西冈宏司; 佐藤尚也
Original assignee: Sumitomo Chemical Co Ltd
Current assignee: Sumitomo Chemical Co Ltd
Priority date: 2015-07-10
Filing date: 2016-06-29
Publication date: 2018-03-27
Anticipated expiration: 2036-06-29
Also published as: JP6151870B2; CN107849688B; JP2017193779A; KR20180042214A; TW201708582A; JP2018095971A; TWI669405B; JP6286088B2; KR102116923B1; WO2017010293A1; JPWO2017010293A1

Abstract

It is an object of the invention to provide the thickness that can make The lid component become uniform backboard manufacture method and manufacture after The lid component backboard in uniform thickness and include the sputtering target of such backboard.Pass through the present invention, it is possible to provide：The manufacture method of backboard, the manufacture method include by the plate-like body in one side with the groove enabled flow through, with by the groove for covering the main body in a manner of the The lid component of tabular that is configured in the main body engage the step of, also, the manufacture method comprises the steps：The main body and the The lid component are engaged and progress it is integrated after, make the composition surface of the main body and the The lid component turn into above, the main body is fixed in a manner of the difference of the maxima and minima of the height of the surface measurements in the The lid component is less than 0.5mm, at least a portion on the composition surface is processed using cutting；The difference of the maxima and minima of the thickness of backboard, wherein The lid component is below 0.4mm；And sputtering target, it includes such backboard.

Description

Backboard, sputtering target and their manufacture method

Technical field

The present invention relates to backboard (backing plate), sputtering target and their manufacture method.

Background technology

Backboard be the target of sputtering target in order to support to use in sputtering and sputtering target is fixed on sputter equipment and The component used.In addition, backboard is also acted as in the effect of heat produced caused by sputtering.

The backboard of the sputter equipment used in the formation of integrated circuit (IC) is for example up to 500 with diameter~ 600mm or so discoidal shape, generally by the board making of copper alloy, aluminium alloy etc..

In addition, the backboard of the sputter equipment used in the manufacture of liquid crystal display (LCD) is for example with tabular (or flat board (panel) shape) shape, generally by the board making of copper or copper alloy etc..

In addition, make in sputter equipment of the target used in sputter equipment for manufacturing LCD generally than being used to manufacture IC Target is bigger, and heat caused by sputtering is also very big.Due to caused heat can to by sputtering and the film that is formed Characteristic impacts, thus has used the large-scale backboard that efficiently can be cooled down target.When the shape with tabular, there is also The size of its length direction exceedes 3m situation.

For example, as described in patent document 1~3, for the backboard used in LCD manufactures etc., generally, it is Raising exothermicity and cooling performance, are usually internally formed the runner for passing through the fluid of refrigerant at it.This The runner of sample can for example be formed in the following manner：Runner groove is pre-formed in the main body for forming backboard, will be somebody's turn to do with covering The The lid component that the mode of groove makes, such as engaged pass through welding in the state of being sticked in the groove portion of main body the methods of.

Prior art literature

Patent document

Patent document 1：No. 4852897 publications of Japanese Patent No.

Patent document 2：No. 3818084 publications of Japanese Patent No.

Patent document 3：Japanese Unexamined Patent Publication 2012-126965 publications

The content of the invention

Invent problem to be solved

The backboard that uses in being manufactured as LCD, it is usually large-scale and there is elongated size, in addition, having used copper and copper The harder metal such as alloy, therefore, the problem of warpage, deformation in its manufacture be present.

In addition, when forming refrigerant runner in backboard, if main body engaged with The lid component by welding, also in the presence of because Its heat and the problems such as cause the whole main body including The lid component deform, bend.Especially, welded using electron beam In the case of meeting (Electron Beam Welding), to during the irradiating electron beam of junction surface, junction surface has been assigned big calorimetric Amount, the possibility therefore, deform, bent increase.

In addition, in the case of electron beam welding, the ridge of commonly known as weld seam (bead) can be formed at its junction surface Portion, if it is desired to removed so as to form concavo-convex few flat surfaces and be processed into desired backboard shape, then by being cut Due to above-mentioned deformation, bending and cause the thickness of The lid component to become uneven sometimes.

In addition, recently, in the engagement of main body and The lid component of backboard is formed, rubbing using frictional heat is also used sometimes Wipe stirring engagement (Friction Stir Welding).In this case, it can be formed at junction surface and be referred to as crator (burr) Projection, if it is desired to by cut remove so as to form flat surface and be processed into desired backboard shape, then with it is upper State similarly, the thickness of The lid component becomes uneven sometimes.

In the past, after main body is engaged with The lid component, in order to correct the caused deformation in conjugant, implement utilization and add The operation that the rectification work of press progress, the removing for utilizing machining to carry out deform.However, it was conceived in the past that can be processed into Desired net shape or the mode of residual deformation is not modified on the backboard of completion, carried on the back for how to keep forming The uniformity of the thickness of each component of plate, is not studied especially, uniformity of the conventional backboard in the thickness of The lid component Problem be present in aspect.

In addition, in the case where forming conjugant as backboard, if being engaged into using electron beam welding or friction-stir Row engagement, then conjugant produces the warpage of low-angle in engagement surface side sometimes.Therefore, after main body is engaged with The lid component, if The desired backboard that desired size is processed into by machining, then easily make lid structure in the range of tens of~hundreds of mm Part produces the position thinner than target thickness or the position thicker than target thickness.

If the thickness of The lid component becomes uneven as described above, the pressure for the fluid being pressed into sputtering in runner When (such as 0.2~0.7MPa) is applied to such uneven The lid component, what is deformed in the thin part of The lid component can Energy property uprises, and the problems such as The lid component bends or be damaged occurs, this is known.Especially, set for the thickness of member of formation For the backboard for counting relatively thin, the risk for occurring to deform caused by the inhomogeneities of lid thickness is high, such as in the back of the body made of copper In plate, it is necessary to pay attention to the uniformity of The lid component in the case that the thickness of The lid component is designed into below 5mm.

In addition, the inhomogeneities of the thickness of such The lid component can not only reduce the backboard for being bonded target repeatedly and using certainly The intensity of body, but also the inhomogeneities of the thickness of the side of the fitting target as its opposite side can be produced.The reason is that Generally the face of opposite side is processed in a manner of parallel with the composition surface of The lid component, therefore, if because of the deformation of main body, bending Caused by The lid component thickness inhomogeneities remaining, then when being processed in the face to its opposite side, can also produce thickness Inhomogeneities.Cause cooling effectiveness due to the inhomogeneities of such thickness in local difference, therefore, by solder and It is connected with the sputtering target of target, also there is a possibility that target is partly peeled off.

Therefore, problem of the invention be to provide manufacture method that the thickness that can make The lid component becomes uniform backboard, with And the The lid component after manufacture backboard in uniform thickness and include the sputtering target of such backboard.

Means for solving the problems

In view of the above problems, present inventor has made intensive studies, and as a result finds, is used having used with runner In the manufacture method of the main body of groove and the backboard of its The lid component, by make the composition surface of main body and The lid component turn into above, with In the state that mode of the difference less than 0.5mm of the maxima and minima for the height that the surface of The lid component measures fixes main body Under, the composition surface is processed using cutting, becomes uniform thus, it is possible to the thickness for making The lid component, so as to complete this hair It is bright.

The present invention provides the manufacture method of following backboard and the manufacture of backboard and the following sputtering target comprising backboard Method and sputtering target, but the invention is not restricted to following scheme.

[1]

The manufacture method of backboard, the manufacture method include will one side have enable flow through groove plate-like body, With by the groove for covering the main body in a manner of the The lid component of tabular that is configured in the main body engage the step of, also, the system The method of making comprises the steps：The main body and the The lid component are engaged and progress it is integrated after, make the main body and the The lid component Composition surface turn into above, with the difference of the maxima and minima of the height of the surface measurements of the The lid component less than 0.5mm Mode fixes the main body, and at least a portion on the composition surface is processed using cutting.

[2]

Manufacture method described in above-mentioned [1], wherein, aforementioned body is fixed in a manner of mechanics.

[3]

Manufacture method described in above-mentioned [1] or [2], wherein, utilize vice (vice), clamp (clamp) or vacuum chuck (vacuum chuck) fixes aforementioned body.

[4]

Manufacture method any one of above-mentioned [1]~[3], wherein, it is foregoing to be processed as milling cutter (fraise) processing.

[5]

Manufacture method any one of above-mentioned [1]~[4], wherein, engaged using electron beam welding or friction-stir And aforementioned body is engaged with foregoing The lid component.

[6]

Backboard, it, which is included in one side, has the plate-like body of the groove enabled flow through and to cover the side of the groove of the main body Formula is configured in the The lid component of the tabular in the main body, wherein, the main body is integrated with the The lid component by engagement, the lid The difference of the maxima and minima of the thickness of component is below 0.4mm.

[7]

Backboard, it is as obtained from the manufacture method described in above-mentioned [1].

[8]

Backboard described in above-mentioned [7], wherein, the difference of the maxima and minima of the thickness of foregoing The lid component for 0.4mm with Under.

[9]

Sputtering target, it is characterised in that be connected with target on the backboard described in above-mentioned [6].

[10]

The manufacture method of sputtering target, the manufacture method include the step of being connected backboard with target, it is characterised in that profit Foregoing backboard is manufactured with the manufacture method any one of above-mentioned [1]~[5].

The effect of invention

Pass through the present invention, it is possible to provide after the thickness of The lid component can be made to become manufacture method and the manufacture of uniform backboard The difference of the maxima and minima of the thickness of the backboard in uniform thickness of The lid component, especially The lid component is below the 0.4mm back of the body Plate and the sputtering target for including such backboard.

Brief description of the drawings

[Fig. 1] is the stereogram for an embodiment for schematically showing main body (before engagement).

[Fig. 2] is the stereogram for an embodiment for schematically showing The lid component (before engagement).

[Fig. 3] is the sectional view for schematically showing the section at the X-X of the main body shown in Fig. 1.

[Fig. 4] is the skeleton diagram for the manufacture method for schematically showing backboard.

[Fig. 5 A] is the plan from pedestal surface side for an embodiment for schematically showing backboard.

[Fig. 5 B] is the putting down from pedestal surface side for an embodiment (having base portion) for schematically showing backboard Face figure.

[Fig. 6 A] is the side view for an embodiment for schematically showing backboard.

[Fig. 6 B] is the side view for an embodiment (having base portion) for schematically showing backboard.

[Fig. 7] is the plan from engagement surface side for an embodiment for schematically showing conjugant.

[Fig. 8] is the plan from pedestal surface side for an embodiment for schematically showing conjugant.

[Fig. 9] is the side view for an embodiment for schematically showing conjugant.

[Figure 10] is the sectional view (a) in the section at the A-A places for schematically showing conjugant shown in Fig. 8 and schematic The sectional view (b) in the section at the B-B of the conjugant shown in earth's surface diagram 8.

[Figure 11] is the sectional view for representing the section at the C-C of the conjugant shown in Fig. 8.

[Figure 12] is the figure for the result (thickness of The lid component) for representing embodiment 1.

[Figure 13] is the figure for the result (thickness of The lid component) for representing embodiment 2.

[Figure 14] is the figure for the result (thickness of The lid component) for representing comparative example 1.

[Figure 15] is the figure for the result (thickness of The lid component) for representing comparative example 2.

[Figure 16] is the figure for the result (thickness of The lid component) for representing embodiment 3.

Embodiment

The present invention relates to mainly have main body and The lid component and can be formed uniformly the backboard of the thickness of the The lid component The backboard in uniform thickness of The lid component after manufacture method, and manufacture.

In the present invention, " thickness of The lid component is uniform " of so-called backboard, as referring to as described in more detail below, making The difference of the maxima and minima of the thickness of the The lid component measured in backboard after making is below 0.4mm, preferably 0.35mm~ 0mm, more preferably 0.2mm~0mm.When the difference of the thickness is more than 0.4mm, The lid component is partly surrendered in pressurization, The possible remaining of The lid component has deformation.Further, since Reusability backboard and cause raw material intensity decline when, also exist deformation The situation of increase is measured, thus The lid component may also be damaged.In addition, the deviation that the thickness of main part also be present becomes big, because This, heat transfer efficiency changes locally, in the sputtering target by solder connection, it is also possible to being partially stripped for target occurs.If Target is peeled off, then following problems may occur：At the position, the distance between target and substrate change, to passing through sputtering And the characteristic of the film formed has undesirable effect, etc..

For example, as schematically shown in Fig. 1~4 (especially Fig. 4), the manufacture method bag of backboard of the invention Include by one side have can make fluid inside it by groove 2 plate-like body 1, with to cover the groove 2 of (or covering) main body 1 Mode be configured (hereinafter referred to as " process (a) " the step of the The lid component 3 of tabular on the body 1 engages.For example, with reference to figure Process (a) shown in 4), and comprise the steps：Main body 1 and The lid component 3 are engaged and it is integrated after (for example, with reference to figure The conjugant 4 of main body 1 and The lid component 3 shown in 4), make the composition surface of main body 1 and The lid component 3 turn into above, with The lid component 3 Mode of the difference less than 0.5mm of maxima and minima of height of surface measurements main body 1 fixed (and as needed will The lid component 3 is fixed), at least a portion on composition surface is processed (hereinafter referred to as " process (b) " by cutting.For example, Process (b) shown in Figure 4).

In the present invention, by above-mentioned process (a) and process (b), the The lid component 3 after being processed using cutting can be made Thickness becomes uniform, specifically, can make the difference of the maxima and minima of the thickness of The lid component turn into below 0.4mm.

In addition, in the present invention, as needed, as postprocessing working procedures, for example, can be on the composition surface of main body 1 and The lid component 3 The face (following, " seat surface " of the target of otherwise referred to as configurable sputtering target) of opposite side form base portion 5.Base portion 5 be the part of configurable target, its forming method is not particularly limited, base portion 5 for example can be (excellent by using machining Milling cutter is selected to process) part in addition to base portion 5 of seat surface is cut and formed.In addition, shape to base portion 5, Size, height etc. are not particularly limited, as long as example, the composition surface after the surface of base portion 5 and processing is almost parallel (preferably flat OK).

For example, in Fig. 5,6, it is schematically shown an embodiment of backboard of the invention, but the backboard of the present invention is not It is limited to such embodiment.It should be noted that Fig. 5 A (plan), Fig. 6 A (side view) are schematically shown without upper One embodiment of the backboard for the base portion 5 stated, Fig. 5 B (plan), Fig. 6 B (side view) are schematically shown formed with upper One embodiment of the backboard for the base portion 5 stated.

In Fig. 5 (plan from pedestal surface side) and Fig. 6 (side view), backboard 10,20 has following structure：Substantially It is upper to there is the plate-like body 1 (for example, see Fig. 1) of the groove 2 enabled flow through and included in one side to cover the groove 2 of main body 1 Mode is configured in the The lid component 3 (for example, see Fig. 2) of the tabular in main body 1, and main body 1 is with The lid component 3 by engagement and by one Body.

In addition, as shown in Fig. 5 B (top view), Fig. 6 B (side view), can be formed on the seat surface of backboard 20 configurable The base portion 5 of target.

In the The lid component 3 on composition surface, the hole 6 of arbitrary dimension can be formed in its any part, makes it can be with being formed in master Groove (or runner) 2 on body 1, which is realized, to be in fluid communication.It should be noted that the number of device to hole 6 is not particularly limited.

In addition, it can be formed in the main body of backboard 10,20 for realizing to multiple holes of the installation on sputter equipment, preferably Through hole (not shown).

In the present invention, the shape of backboard is not particularly limited, for example, it is preferable to such plate described in Fig. 5 plan Shape (or tabular).

In the present invention, the size of backboard is not particularly limited.For example, backboard has the shape of tabular (or tabular) When, the length of length direction is, for example, 400mm~4000mm, and preferably 500mm~3500mm, more preferably 700mm~ 3200mm.In addition, be, for example, 100mm~2000mm by the length of the vertically crosscutting width of the length of the length direction, Preferably 150mm~1500mm, more preferably 200mm~1500mm.It should be noted that the length of length direction and width side To length can be the same or different.

In the present invention, the thickness of backboard (that is, seat surface (being the seat surface of base portion in the case that there is base portion) with Ultimate range between composition surface) it is, for example, 5mm~30mm, preferably 7mm~25mm, more preferably 10mm~20mm.But The thickness of backboard is not particularly limited, as long as runner can be internally formed at it.

In the present invention, the shape of the runner being internally formed in backboard is not particularly limited, as long as will can be configured in Target cooling on the seat surface of backboard, is not particularly limited.For example, embodiment as shown is such, runner has In the case of square-section, the size of its width is, for example, 10mm~100mm.In addition, the size of short transverse is, for example, 1mm~20mm, preferably 3mm~15mm, more preferably 4mm~10mm.In addition, in the present invention, configured by The lid component 3 in master The upside of the groove 2 of body 1 and in the state of being engaged, will be referred to as runner by the space that the groove 2 of main body 1 and The lid component 3 are formed.Groove 2 bottom surface and the back side (that is, the face of the opposite side on composition surface) of The lid component 3 are preferably almost parallel, more preferably parallel.According to the back of the body The size of plate, a plurality of runner can be formed.

Hereinafter, reference picture 4, illustrate the manufacture method of the present invention, also, the term for being used in the present invention and each Component explains respectively.

As shown in figure 4, for the manufacture method of the present invention, in " process (a) ", by the system of material 1 ' by main body The main body 1 be used as, engage with the The lid component 3 of the making of material 3 ' by The lid component, and their integrations are thus formed in it Portion has the conjugant 4 of runner.Then, in " process (b) ", the composition surface of the main body 1 and The lid component 3 of conjugant 4 is made turn into (or upside) above, will in a manner of the difference of the maxima and minima of the height of the surface measurements in The lid component 3 is less than 0.5mm Main body 1 is fixed and (together fixed with The lid component 3 as needed), using cutting at least a portion on the composition surface of conjugant 4, excellent Entire surface is selected to be processed.For the conjugant 4 after the processing obtained in the manner described above, by by main body 1 and lid structure Part 3 engages, and can make the runner that cooling water or other fluid passes through so as to have inside it, therefore, the mask of the opposite side on composition surface There is refrigerating function, and function can be played as the seat surface of configurable target, so can make as the backboard of sputtering target With (for example, see the conjugant 4 and backboard 10 with dotted line shown in Fig. 4).In addition, as needed, manufacturer of the invention Method may include " postprocessing working procedures ", for example, the backboard (example on the seat surface for configuring target with base portion 5 can be manufactured Backboard 20 as shown in referring to Fig. 4, Fig. 5 B, Fig. 6 B).It should be noted that in Fig. 4, in order to more easily illustrate the present invention's Manufacture method, each component is illustrated with the solid for showing its cross sectional shape.

＜ main bodys ＞

As shown in figure 4, main body 1 can be processed and shape by using the methods of cutting, grinding to the material 1 ' of main body Into.

As the material 1 ' of main body, as long as being made up of the material of electric conductivity, preferably use by metal or its alloy Deng the material of the tabular (or tabular) of making.

As metal, can enumerate for example copper, copper alloy, aluminium, aluminium alloy, titanium, titanium alloy, tungsten, tungsten alloy, molybdenum, molybdenum alloy, Tantalum, tantalum alloy, niobium, niobium alloy, stainless steel etc., consider from viewpoints such as processability, mechanical strength, durability, exothermicities, preferably make With copper, wherein, especially from the viewpoint of high-termal conductivity and high conductivity, preferably using oxygen-free copper (purity be 99.96% with On, oxygen concentration is below 10ppm).

Such as shown in Fig. 1 stereogram, main body 1 has in its one side and can form the groove 2 of runner so that by main body 1 It can make liquid refrigerant (for example, water, second after being engaged with the The lid component (such as The lid component 3 shown in Fig. 2) being described in detail below The fluids such as alcohol, ethylene glycol or mixed liquor two or more in them) etc. pass through.

Such as shown in fig. 3 in cross section, groove 2 can have the The lid component 3 that can support that (or mounting) is described in detail below Shape, such as end difference 2a, 2b.

It should be noted that to the shape of groove 2, size and shared ratio in main body 1, position etc. without special Limitation.Groove 2 preferably has main body 1 of the surface of the The lid component 3 as composition surface with turning into composition surface upon engagement upon engagement Surface be in such shape, size in same level.

Herein, as shown in figure 4, the main body 1 with groove 2 can for example make in the following manner：For the plate of appropriate size The material 1 ' of shape (or tabular), first, as above, such as vice, vacuum card are used using as the face of this side of seat surface Disk etc. and fixed in a manner of mechanics, by using the throw such as face milling cutters (facemill), bite (cutter) Milling cutter is processed to carry out facing cut, next, making the seat surface turn into following, using such as vice, vacuum chuck and with mechanics Mode is fixed, and as needed, is processed to carry out facing cut, so by using the milling cutter of the throw such as face milling cutters, bite Afterwards, by using the machining such as face milling cutters, bite, the main body 1 with groove 2 is made.The thickness of the main body 1 of formation Constant, it is seat surface, almost parallel (preferably parallel) as the bottom surface in the face and groove 2 of this side on composition surface.In addition, root According to needs, the outer peripheral face of main body 1 can be processed using cutting or grinding in the arbitrary stage.

It should be noted that in the case where material 1 ' is not present warpage, deformation, distortion etc., is able to ensure horizontal plane, can By the face directly as seat surface, groove 2 can be also formed as described above on the face of its opposite side.

＜ The lid components ＞

Such as shown in the stereogram and Fig. 4 skeleton diagram such as Fig. 2, The lid component 3 can be to cover (or covering) main body 1 The mode of groove 2 is configured in the component of in main body 1, generally 2~6mm of thickness tabular (or tabular).Set from by The lid component From the aspect of the easiness of main body, in order that The lid component is placed in end difference 2a, 2b of the main body shown in Fig. 3 sectional view, It is preferred that the width of The lid component is more than the width of groove, when the thickness of The lid component is designed as into below 5mm, especially below 3.5mm, hold Yi Yin deforms to the pressurization of runner, it is therefore preferable that making the width of The lid component for below the width+30mm of groove, preferably groove Below width+20mm, more preferably below the width+15mm of groove size.In addition, the thickness of The lid component suitably determines, In the case that the thickness of The lid component is below 5mm, preferably below 3.5mm, more preferably below 3mm, the effect of the present invention is easily played Fruit.

As the material 3 ' for the The lid component that can form The lid component 3, be made up of the material of electric conductivity, preferably use by The material of the tabular (or tabular) of the making such as metal or its alloy.

As metal, can enumerate for example copper, copper alloy, aluminium, aluminium alloy, titanium, titanium alloy, tungsten, tungsten alloy, molybdenum, molybdenum alloy, Tantalum, tantalum alloy, niobium, niobium alloy, stainless steel etc., consider from viewpoints such as processability, mechanical strength, durability, exothermicities, preferably make With copper, wherein, especially from the viewpoint of high-termal conductivity and high conductivity, preferably using oxygen-free copper (purity be 99.96% with On, oxygen concentration is below 10ppm).In oxygen-free copper, the high matter of further preferred use intensity not (Japanese：Quality Do) it is 1/4H~H Oxygen-free copper.

Material 3 ' can be the same or different with material 1 ', in the present invention, from by engaging The lid component 3 and main body 1 Integration, remained engaged with high level portion intensity it is such from the viewpoint of, material 3 ' and material 1 ' be preferably identical material or The material being made up of same composition, purity.

The lid component 3 can be formed in the following manner：Using the limitation utensil such as vice by appropriate chi in a manner of mechanics Very little material 3 ' is fixed, uses such as band sawing machine (band saw), fret saw, circular saw, lathe, milling machine, band saw, grinding machine (grinder), water jet (water jet) etc. is cut or cut.The thickness constant of the The lid component of formation, the surface back of the body Face is almost parallel (preferably parallel).In addition, as needed, using cutting or it can be ground in the arbitrary stage to The lid component 3 Outer peripheral face be processed.

In addition, the hole that can enable flow through can be formed in the arbitrary portion of The lid component 3 as needed in the arbitrary stage (for example, see the hole 6 shown in Fig. 5,6).It should be noted that the number of device to hole 6 is not particularly limited.If especially with master Hole 6, then when The lid component 3 is embedded in into main body 1 or when they are being engaged, quilt are formed in The lid component 3 in advance before the engagement of body 1 The air that main body 1 and The lid component 3 are surrounded can be escaped by hole 6, can suppress to produce the changing of the relative positions at junction surface, thus preferably.

＜ processes (a) ＞

Process (a) includes engaging main body 1 and The lid component 3 so that by their integrated steps.

For example, as shown in figure 4, The lid component 3 is configured at main body 1 in a manner of the groove 2 that The lid component 3 covers main body 1, preferably These components are configured in a manner of the surface of main body 1 and the surface of The lid component 3 are in same level.

The joint method of main body 1 and The lid component 3 is not particularly limited, such as electron beam welding (Electron can be enumerated Beam Welding (EBW)), friction-stir engagement (Friction Stir Welding (FSW)), TIG weld, laser beam weldering Connect, MIG welding, MAG welding etc..Wherein, the viewpoints such as weld seam from welding is small, the deformation of welding is small consider that preferably electron beam welds Connect, friction-stir engagement.

It should be noted that in the present invention, it is integrated obtained to carry out by the way that main body 1 is engaged with The lid component 3 Conjugant 4 has excellent air-tightness at its junction surface.For example, 0.1MPa~0.8MPa has been forced into it even if being injected into runner Air, the air will not also reveal, and can maintain its air-tightness.

Herein, as schematically shown in Fig. 7~9, it show in further detail an implementation of conjugant 4 Mode.Fig. 7 represents the composition surface of conjugant 4, and Fig. 8 represents the seat surface of conjugant 4, and Fig. 9 represents the side of conjugant 4.In addition, Figure 10~11 represent the section of conjugant 4.More specifically, Figure 10 (a) and (b) represent cutting at Fig. 8 A-A and B-B respectively Face, Figure 11 represent the section at Fig. 8 C-C.It should be noted that in the present invention, conjugant 4 is not limited to the embodiment party of diagram Formula.

In addition, can also produce warpage in the conjugant 4 as obtained from above-mentioned engagement sometimes, such case is (especially Be length direction length more than 2000mm it is elongated situations such as) under, preferably using such as arbor press, pay attention to do not make lid structure Part 3 is corrected in the case of deforming to conjugant 4, until reach can be with contact to the side on horizontal plane for the size of warpage Level that formula is fixed, preferably smaller than 5mm.It should be noted that in the present invention, " warpage " of so-called conjugant 4, under referring to State situation：When conjugant 4 is rested on arbitrary horizontal plane in a manner of its seat surface turns into downside, conjugant 4 The edge part of the lower section of at least one end of length direction or width (by the vertically crosscutting width of length direction) Positioned at the horizontal plane every spaced position situation；Face of the edge part of the lower section of all ends with level connects, Only the central part of the lower section of conjugant 4 in horizontal plane every spaced position situation；Etc., in the present invention, will The ultimate range between spaced edge part or the central portion and horizontal plane of lower section is expressed as the size of " warpage ". In addition, there is also the edge part of the lower section of above-mentioned end relative to above-mentioned horizontal plane with wavy every spaced situation, this In the case of kind, the ultimate range between the horizontal plane and edge part is expressed as to the size of " warpage ".Further, since connecing " warpage " can not be determined directly caused by the bottom center portion of zoarium 4, therefore, by from the engagement of the surface measurements in The lid component 3 The height of body 4 subtracts the size that poor maximum obtained from the thickness of conjugant 4 is expressed as " warpage ".

For example, the warpage (following, otherwise referred to as " warpage of length direction ") of at least one end of length direction is excellent Choosing is less than 5mm, more preferably less than 1mm.

In addition, the warpage (following, otherwise referred to as " warpage of width ") of at least one end of width is excellent Choosing is less than 5mm, more preferably less than 1mm.

＜ processes (b) ＞

In process (b), for example, turning into the side of (or upside) above with the composition surface of the main body 1 of conjugant 4 and The lid component 3 Conjugant is fixed on horizontal plane (for example, with reference to the conjugant 4 shown in Fig. 4) by formula.Moreover, it is fixed on by conjugant 4 When on the horizontal plane, preferably so that the face (face for turning into this side of seat surface) of this side being configured of conjugant 4 to the greatest extent may be used The mode of energy ground close to the horizontal plane carries out matching somebody with somebody to postpone being fixed.Moreover, with the height of the surface measurements of The lid component 3 (that is, from the horizontal plane to the surface of The lid component 3 measuring point distance) maxima and minima difference be less than 0.5mm, Preferably 0.4mm~0mm, more preferably 0.3mm~0mm mode are fixed, as needed, using cutting by composition surface At least a portion (the preferably entire surface on composition surface) and The lid component 3 be together processed into level.

In addition, in the case where can guarantee that composition surface and the mutual collimation of seat surface, as the conjugant in process (b) 4 fixing means, following methods can be used.So that the composition surface of the main body 1 of conjugant 4 and The lid component 3 turns into above (on or Side), the mode that its seat surface connects with horizontal plane as much as possible is fixed on conjugant 4 on above-mentioned horizontal plane. When conjugant 4 is fixed on the horizontal plane, this of seat surface (is preferably turned into the bottom surface of the horizontal plane and conjugant 4 The face of side) between the maximum at interval be less than 0.5mm (be preferably 0.4mm~0mm, more preferably 0.3mm~0mm) mode It is fixed, then, as described above, at least a portion (preferably entire surface) on composition surface is processed into water using cutting It is flat.

Be not particularly limited for the fixing means of conjugant 4, especially main body 1, preferably using such as vice, clamp, Vacuum chuck etc. limits utensil, is fixed in a manner of mechanics.When being fixed using the limitation utensil such as vice, clamp, for example, Multiple limitation utensils can be configured on the length direction of conjugant 4, being carried out in a manner of the sidepiece of conjugant to be sandwiched Pressing is so that conjugant 4 be fixed on the horizontal level.Limit utensil at least conjugant 4 length direction both ends and in This is equably configured at 3 in centre portion, preferably further increase 1/4,3/4 position of length direction 5 at more than equably Configuration.In the case where the difference of the maxima and minima of the height of the surface measurements of The lid component 3 is more than 0.5mm, with engagement The inactive degree of body 4 is fixed temporarily with vice, then, is tapped with mallet, plastic hammer etc. and makes its contact to water On average face, thus, the surface of The lid component 3 can be fixed with the state of level.In addition, in the feelings being fixed with vacuum chuck Under condition, for example, before the engagement of main body and The lid component, machining is carried out to the pedestal surface side of main body, makes flat face, O-ring configuration is being engaged to be centrally located within the edge part 30mm away from conjugant, preferably in a manner of 5mm~20mm position So that adsorption area becomes big around body, using pedestal surface side as adsorption plane, vacuumize until vacuum (gauge pressure) It is -0.1MPa so as to be fixed, thus, can be fixed the surface of The lid component 3 with the state of level.

In addition, it is not particularly limited in the position of the surface measurements of The lid component 3 its height, for example, it is preferable in the top of groove 2 It is measured, is further preferably measured above the middle body of groove 2.For example, it is preferable to as shown in Figure 7 along Straight line L1 and/or L2 determines the height of The lid component 3.

The assay method of height is not particularly limited, for example, altimeter (height gage), amesdial can be used (dial gauge) etc. is measured.

As described above, with the difference of the maxima and minima of the height of the surface measurements of The lid component 3 be less than 0.5mm, Preferably 0.4mm~0mm, more preferably 0.3mm~0mm mode fix conjugant 4, then, will engagement using cutting At least a portion (preferably entire surface) in face is processed into level, and level is processed into preferably by facing cut, thus, after can making processing The thickness of The lid component become uniform.It is preferred that the difference that can make the maxima and minima of the thickness of the The lid component after processing is Below 0.4mm, it is preferably 0.35mm~0mm, more preferably 0.3mm~0mm.

It should be noted that for the processing on composition surface, as long as can be handled using cutting composition surface, It is not particularly limited, using such as milling cutter processing, flat surface grinding processing, slotting cutter (end mill) processing, lathe process It is processed.

In addition, in process (b), the side of conjugant 4 can be processed using cutting or grinding in the arbitrary stage, example It can such as implement to finish, until turning into minute surface.

In the present invention, the conjugant 4 that will can be obtained after process (b) is (for example, Fig. 4 conjugant with dotted line 4th, the conjugant 4 shown in Fig. 7~11) it is directly used as backboard (for example, backboard 10 shown in Fig. 4, Fig. 5 A, Fig. 6 A).

In addition, in the manufacture method of the present invention, as needed, following postprocessing working procedures can be implemented to conjugant 4.

＜ postprocessing working procedures ＞

As postprocessing working procedures, for example, following process etc. can be enumerated.

(1) processing carried out using cutting of seat surface

(2) finishing on composition surface

(3) finishing of seat surface

(4) perforate is processed

(5) warpage is corrected

Postprocessing working procedures are preferably carried out with the order of above-mentioned process (1)~(5), but are not limited to above-mentioned order.In addition, Above-mentioned process (1)~(5) are optional process, can be carried out in any order.Hereinafter, each operation is carried out briefly It is bright.

(1) processing carried out using cutting of seat surface

Conjugant 4 can be configured in a manner of its seat surface turns into upside, utilize the progress such as vacuum chuck It is fixed, processed, lathe process using such as milling cutter processing, grinding, slotting cutter, further to the seat surface of conjugant 4 It is processed.

The processing carried out using cutting is almost parallel (excellent with the composition surface of conjugant 4 in order to which seat surface is trimmed to Select parallel).

(2) finishing on composition surface

Conjugant 4 can be configured in a manner of its composition surface turns into upside, utilize the progress such as vacuum chuck It is fixed, finishing is carried out to the composition surface of conjugant 4 using such as milling cutter processing, grinding, slotting cutter processing, lathe process Work.

The finishing is for the purposes according to conjugant 4, as needed the composition surface of conjugant 4 is cut or ground Grind and be finish-machined to minute surface.

(3) finishing of seat surface

Conjugant 4 can be configured in a manner of its seat surface turns into upside, utilize the progress such as vacuum chuck It is fixed, using being processed such as milling cutter processing, grinding, slotting cutter, the seat surface of conjugant 4 is finished.

In addition, any stage before being finished to seat surface, can form base on seat surface as needed Portions 5 (for example, backboard 20 shown in Fig. 5 B, Fig. 6 B).The forming method of base portion 5 is not particularly limited, such as can be used Milling cutter processing, grinding, slotting cutter processing, lathe process etc..

Above-mentioned base portion 5 can be directed to and peripheral part in addition to it each carries out the finishing of seat surface respectively.

The finishing can be by the seat surface of conjugant 4 (according to circumstances, around for above-mentioned base portion 5 and in addition to it Partly this two side) it is processed into minute surface.

(4) perforate is processed

As needed, through hole can be formed in the part for not forming groove 2 and base portion 5 of the main body 1 of backboard.By making spiral shell Bolt etc. passes through such through hole, so as to which main body 1 is fixed on into sputter equipment.The forming method of through hole is not limited especially System, such as drilling machine (drill) etc. can be used to be formed.In addition, the size of through hole, position, number etc. are not particularly limited.

(5) warpage is corrected

During the postprocessing working procedures of above-mentioned backboard, warpage can be also produced in conjugant 4 sometimes, in this case, As needed, preferably conjugant 4 is corrected using such as arbor press, until the size of warpage is less than 2mm, is preferably 1mm~0mm, more preferably 0.5mm~0mm.

In addition, such warpage correction can be carried out in any stage that backboard manufactures.

For the backboard obtained in the manner described above, using solder material, target is connected (or engagement or bond (bonding)) in the seat surface of backboard, thus, sputtering target can be made.

As target, as long as metal, alloy, oxidation that generally can be as the use in the film forming based on sputtering method The material that the ceramics such as thing, nitride or sintered body are formed, is not particularly limited, target is suitably selected according to purposes, purpose Material.As such target, such as aluminium, copper, titanium, molybdenum, silver, tungsten can be enumerated or mixed using their alloy, tin as principal component Miscellaneous indium oxide (ITO), aluminium-doped zinc oxide (AZO), Ga-doped zinc oxide (GZO), In-Ga-Zn system complex oxides (IGZO) Deng.

In the manufacture method of the present invention, target can be processed into generally plate like, the method for being processed into tabular does not limit especially System.In the case of the target material of metal system, such as it can manufacture in the following manner：It will be grown as obtained from dissolving, cast The plastic workings such as cube, cylindric target material are processed for calendering, extrusion is processed, forging processing, then, implementation cut-out adds The machinings such as work, milling cutter processing, slotting cutter processing, thus, are finished, with as desired size, surface state. On the other hand, refractory metal, the sintering system of oxide target material in the case of, can manufacture in the following manner：Will Target material is filled into the mould as tabular, and (hot press, hot isotropism pressue device are wherein utilized by pressure sintering method Be sintered), the pressurization of cold isotropism, injection moulding etc. and after obtaining powder compact, it is normal using what is be sintered under atmospheric pressure Press sintering process etc. and obtain the sintered body of tabular, then, by implementing the machineries such as cutting off processing, milling cutter processing, slotting cutter processing Processing, grinding, so as to be finished in a manner of as desired size, surface state.

The solder material used in engagement as target and backboard, is not particularly limited, preferably comprising low melting point (such as Below 723K) metal or alloy material, can enumerate for example comprising selected from by indium (In), tin (Sn), zinc (Zn), lead (Pb), Material of metal or its alloy in the group that silver-colored (Ag), copper (Cu), bismuth (Bi), cadmium (Cd) and antimony (Sb) form etc..It is more specific and Speech, can enumerate In, In-Sn, Sn-Zn, Sn-Zn-In, In-Ag, Sn-Pb, Sn-Pb-Ag, Sn-Bi, Sn-Ag-Cu, Pb-Sn, Pb-Ag, Zn-Cd, Pb-Sn-Sb, Pb-Sn-Cd, Pb-Sn-In, Bi-Sn-Sb etc..As the solder material of sputtering target, generally, In, In alloy, the Sn alloys of low melting point can be widely used.

Hereinafter, enumerate embodiment and the present invention is further described, but the present invention is not limited by the following examples.

Embodiment

[embodiment 1]

Using the main body and The lid component of the shape shown in Fig. 1,2, the backboard 10 shown in Fig. 5 A, 6A is made.Need what is illustrated It is for the engagement in process (a), using the electron beam welding machine of Steigerwald company systems, to utilize electron beam welding Main body is engaged with The lid component.

The material of each component and as described below as the design object value of target.

Main body：No-oxygen copper plate (copper company system milled sheet C1020-1/2H stretches in Mitsubishi)

Vickers hardness ＞ 80

Tensile strength ＞ 265MPa

Conductance ＞ 101%IACS (20 DEG C)

The lid component：No-oxygen copper plate (copper company system milled sheet C1020-1/2H stretches in Mitsubishi)

Vickers hardness ＞ 80

Tensile strength ＞ 265MPa

Conductance ＞ 101%IACS (20 DEG C)

The design object value of backboard

The size of the length direction of backboard：2500mm

The size of the width of backboard：270mm

The thickness of backboard：16mm

The thickness (groove portion) of main body：8mm

The thickness of The lid component：3mm

The size of the length direction of The lid component：2350mm

The size of the width of The lid component：175mm (total length) (=70mm (chis of the width of elongated straight line portion It is very little)+35mm (size of the width of center section)+70mm (size of the width of elongated straight line portion))

The size of the width of runner：165mm (total length) (=60mm (size of the width of elongated straight line portion) + 45mm (size of the width of center section)+60mm (size of the width of elongated straight line portion))

The thickness (or height) of runner：5mm

For the conjugant after engagement, therefore, lead to engagement surface side warpage on length direction, width Implementation extrusion forming is crossed so as to implement correction with so that warpage becomes less than 1mm.

On its composition surface, amesdial is fixed on gate-type machining center (machining center), along positioned at Fig. 7 institutes The central straight line L1 and L2 of the elongated straight line portion for the The lid component shown, mobile amesdial, thus, in the surface measurements of The lid component Highly.

In a manner of the difference of the maxima and minima of the height measured on composition surface turns into 0.4mm, fixed and connect with vice Zoarium, then, milling cutter processing (process (b)) is carried out using gate-type machining center.

Next, using vacuum chuck, the conjugant after milling cutter is processed is entered in a manner of its seat surface turns into upside Row is fixed, and implements milling cutter processing to its seat surface using gate-type machining center.

The backboard manufactured in the manner described above is cut off along the L1 shown in Fig. 7 and L2, " lid structure is determined using slide measure The thickness of part ".Show the result in Figure 12 figure and following table 1.

As shown in Figure 12 and table 1, the difference of the maxima and minima of " thickness of The lid component " on L1 for 0.31mm (= 3.13-2.82), the difference of the maxima and minima of " thickness of The lid component " on L2 is 0.26mm (=3.14mm-2.88mm).

From such result, for the backboard manufactured in embodiment 1, the thickness of The lid component is uniform.

It should be noted that in embodiments of the invention, the thickness of The lid component uniformly refers to：The maximum of the thickness of The lid component The difference of value and minimum value is " below 0.4mm ".

[embodiment 2]

In a manner of the difference of the maxima and minima of the height measured on composition surface turns into 0.3mm, fixed and connect with vice Zoarium, in addition, operate similarly to Example 1, make backboard.

The backboard manufactured in the manner described above is cut off along the L1 shown in Fig. 7 and L2, determined " thickness of The lid component ".Will As a result Figure 13 figure and following table 1 are shown in.

As shown in Figure 13 and table 1, the difference of the maxima and minima of " thickness of The lid component " on L1 for 0.17mm (= 3.04-2.87), the difference of the maxima and minima of " thickness of The lid component " on L2 is 0.13mm (=3.04mm-2.91mm).

From such result, for the backboard manufactured in embodiment 2, the thickness of The lid component is uniform.

[embodiment 3]

Engaged by friction-stir and engage main body with The lid component, backboard is made with design object value as follows. As the material of each component, material similarly to Example 1 has been used.

The design object value of backboard

The size of the length direction of backboard：2100mm

The size of the width of backboard：270mm

The thickness of backboard：16mm

The thickness (groove portion) of main body：7.7mm

The thickness of The lid component：3.3mm

The size of the length direction of The lid component：2000mm

The thickness (or height) of runner：5mm

The backboard manufactured in the manner described above is cut off along the L1 shown in Fig. 7 and L2, determined " thickness of The lid component ".Will As a result Figure 16 figure and following table 1 are shown in.

As shown in Figure 16 and table 1, the difference of the maxima and minima of " thickness of The lid component " on L1 for 0.13mm (= 3.34-3.21), the difference of the maxima and minima of " thickness of The lid component " on L2 is 0.10mm (=3.31mm-3.21mm).

From such result, for the backboard manufactured in embodiment 3, the thickness of The lid component is uniform.

[comparative example 1]

In a manner of the difference of the maxima and minima of the height measured on composition surface turns into 1.0mm, fixed and connect with vice Zoarium, in addition, operate similarly to Example 1, make backboard.

The backboard manufactured in the manner described above is cut off along the L1 shown in Fig. 7 and L2, determined " thickness of The lid component ".Will As a result Figure 14 figure and following table 1 are shown in.

As shown in Figure 14 and table 1, the difference of the maxima and minima of " thickness of The lid component " on L1 for 0.60mm (= 3.77-3.17), the difference of the maxima and minima of " thickness of The lid component " on L2 is 0.65mm (=3.79-3.14).

From such result, for the backboard manufactured in comparative example 1, The lid component it is in uneven thickness.

[comparative example 2]

In a manner of the difference of the maxima and minima of the height measured on composition surface turns into 0.5mm, fixed and connect with vice Zoarium, in addition, operate similarly to Example 1, make backboard.

The backboard manufactured in the manner described above is cut off along the L1 shown in Fig. 7 and L2, determined " thickness of The lid component ".Will As a result Figure 15 figure and following table 1 are shown in.

As shown in Figure 15 and table 1, the difference of the maxima and minima of " thickness of The lid component " on L1 for 0.41mm (= 3.17-2.76), the difference of the maxima and minima of " thickness of The lid component " on L2 is 0.48mm (=3.16mm-2.68mm).

From such result, for the backboard manufactured in comparative example 2, The lid component it is in uneven thickness.

[table 1]

Understand in comparative example 1,2, the difference of the maxima and minima of the thickness of The lid component more than 0.4mm, The lid component It is in uneven thickness.This be due to make when conjugant is fixed in process (b) maximum of height that is measured on composition surface with most The difference of small value be more than 0.5mm caused by (referring particularly to the result of comparative example 2).

On the other hand, it is known that in embodiments of the invention 1~3, the difference of the maxima and minima of the thickness of The lid component It is below 0.4mm, the thickness of The lid component is uniform.This is due to make to survey on composition surface when conjugant is fixed in process (b) The difference of the maxima and minima of the height obtained is less than caused by 0.5mm.

As described above, according to embodiment 1~3 and comparative example 1~2, after process (a), in process (b) so that Mode of the difference of the maxima and minima of the height of the surface measurements of The lid component in the composition surface of conjugant less than 0.5mm is consolidated Determine conjugant, and at least a portion on composition surface is processed using cutting, thus, in backboard after fabrication, The lid component The difference of maxima and minima of thickness turn into below 0.4mm, the thickness of The lid component can be made become uniform.

In addition, in process (b), at least a portion on composition surface is entered in the state of conjugant is fixed using cutting Row processing, by such fixation, it is barely perceivable the influence of warpage, deformation to the backboard after manufacture.

[embodiment 4]

Operate similarly to Example 1, make backboard, by the hole being arranged in The lid component with flow passage to backboard Interior runner applies 0.5MPa hydraulic pressure, carries out pressure test.Kept for 30 minutes under pressurised conditions, then, in load removal In the state of confirm The lid component whether deform, as a result, not it was observed that the position to deform.In addition, after pressure test, Using ULVAC He leakage devices, the He leak tests of runner are carried out, leak rate is 5.0 × 10^-10Pa·m³/ below s, Not it was observed that leakage.By making the thickness of The lid component become uniform, so that can be unlikely to deform (even if being pressurizeed, lid structure Part will not be also plastically deformed) backboard.

Confirm to be not present on the backboard of deformation, leakage in the He leak tests by foregoing pressure test and runner, 2250mm × 200mm × t15mm aluminium target is bonded using indium solder, makes sputtering target.Although backboard is added in bond operation Heat but does not produce big warpage to 240 DEG C, and rate of engagement inspection has been carried out using ultrasonic flaw detecting device, as a result, rate of engagement is More than 99%, it is able to that the sputtering target that the whole face of target is equably bonded is made.

It should be noted that Japanese Patent Application 2015- of the application to be filed an application on July 10th, 2015 in Japan Based on No. 138918, advocate its priority, be incorporated to by referring to by entire contents in this specification.

Industrial applicability

The backboard and its manufacture method of the present invention (can especially show in sputtering target in flat boards such as liquid crystal displays (LCD) Show the sputtering target used in the manufacture of device) in be used.

Description of reference numerals

1 main body

2 grooves (or runner)

3 The lid components

4 conjugants

5 base portions

6 holes

10 backboards

20 backboards (have base portion)

Claims

1. the manufacture method of backboard, the manufacture method include will one side have the groove enabled flow through plate-like body, with The step of The lid component of tabular to be configured in a manner of covering the groove of the main body in the main body engages, also, it is described Manufacture method comprises the steps：By the main body with after the The lid component engages and progress is integrated, make the main body with The composition surface of the The lid component turns into above, with the difference of the maxima and minima of the height of the surface measurements of the The lid component Mode less than 0.5mm fixes the main body, and at least a portion on the composition surface is processed using cutting.

2. manufacture method as claimed in claim 1, wherein, the main body is fixed in a manner of mechanics.

3. manufacture method as claimed in claim 1 or 2, wherein, the main body is consolidated using vice, clamp or vacuum chuck It is fixed.

4. such as manufacture method according to any one of claims 1 to 3, wherein, it is described to be processed as milling cutter processing.

5. such as manufacture method according to any one of claims 1 to 4, wherein, utilize electron beam welding or friction-stir to engage And the main body is engaged with the The lid component.

6. backboard, it, which is included in one side, has the plate-like body of the groove enabled flow through and to cover the side of the groove of the main body Formula is configured in the The lid component of the tabular in the main body, wherein, the main body is with the The lid component by engagement and by one Change, the difference of the maxima and minima of the thickness of the The lid component is below 0.4mm.

7. backboard, it is as obtained from the manufacture method described in claim 1.

8. backboard as claimed in claim 7, wherein, the difference of the maxima and minima of the thickness of the The lid component is 0.4mm Below.

9. sputtering target, it is characterised in that be connected with target on the backboard described in claim 6.

10. the manufacture method of sputtering target, the manufacture method includes the step of being connected target with backboard, it is characterised in that profit The backboard is manufactured with manufacture method according to any one of claims 1 to 5.