CN112323026A - Target material back plate and manufacturing method thereof - Google Patents
Target material back plate and manufacturing method thereof Download PDFInfo
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- CN112323026A CN112323026A CN202011182839.3A CN202011182839A CN112323026A CN 112323026 A CN112323026 A CN 112323026A CN 202011182839 A CN202011182839 A CN 202011182839A CN 112323026 A CN112323026 A CN 112323026A
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- target
- flow channel
- back plate
- main body
- plate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a target material back plate, which comprises: the back plate main body is provided with a target material on the front surface and a flow channel on the back surface, the flow channel is provided with a liquid inlet and a liquid outlet, and the flow channel can be used for cooling liquid to flow; the cover plate is arranged on the back surface of the back plate main body and covers the flow channel; and the sealing ring is arranged between the cover plate and the flow channel and used for sealing the flow channel. During the use, can set up the target in the front of backplate main part, make the coolant liquid can flow in from the runner inlet that is located the backplate main part back, flow from the liquid outlet, the coolant liquid can take away the heat that is located the positive target of backplate main part to reduce the temperature of target in sputter coating process, and then can promote the coating quality. In addition, the sealing ring arranged between the cover plate and the flow channel can seal the flow channel. The invention also discloses a manufacturing method of the target backboard, which can enable the size of the finally obtained target backboard to be more accurate and can effectively reduce the deformation of the target backboard after long-term use.
Description
Technical Field
The invention relates to the field of sputtering coating, in particular to a target backboard and a manufacturing method thereof.
Background
The target material is a special electronic material with high added value, and is mainly used in the industries of microelectronics, displays, memories, optical coating and the like.
Sputtering is a process of bombarding the surface of a target material with ions generated by an ion source, so that target atoms are sputtered away from the target and then deposited on the surface of a substrate. Sputter coating has the following significant advantages: the film has strong binding force and good stability of the film thickness, the thickness of the film cannot be changed, and the stability of the film thickness can be summarized into good controllability and repeatability of the film thickness.
At present, when sputtering coating is carried out on a target, high-speed ion beam flow bombards the surface of the target, so that the target generates a large amount of heat, the temperature of the target is increased, and the coating quality is influenced.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides the target backboard and the manufacturing method thereof, which can reduce the temperature of the target in the sputtering coating process and improve the coating quality.
According to an embodiment of the first aspect of the invention, a target backing plate comprises: the back plate main body is provided with a target material on the front surface and a flow channel on the back surface, the flow channel is provided with a liquid inlet and a liquid outlet, and the flow channel can be used for cooling liquid to flow; the cover plate is arranged on the back surface of the back plate main body and covers the flow channel; and the sealing ring is arranged between the cover plate and the flow channel and used for sealing the flow channel.
The method has the following beneficial effects: during the use, can set up the target in the front of backplate main part, make the coolant liquid can flow in from the runner inlet that is located the backplate main part back, flow from the liquid outlet, the coolant liquid can take away the heat that is located the positive target of backplate main part to reduce the temperature of target in sputter coating process, and then can promote the coating quality. In addition, the sealing ring arranged between the cover plate and the flow channel can seal the flow channel.
According to some embodiments of the invention, the flow channel is U-shaped, and the liquid inlet and the liquid outlet are located at the same end of the backplate main body.
According to a second aspect of the present invention, a method for manufacturing a target backing plate includes the following steps: step 1, preparing a back plate main body with a corresponding size, and processing a flow channel on the back surface of the back plate main body; step 2, processing a cover plate to enable the cover plate to cover the flow channel; step 3, arranging a sealing ring between the cover plate and the flow channel, and welding the back plate main body and the cover plate to combine the back plate main body and the cover plate into a target back plate semi-finished product; step 4, leveling the combined target back plate semi-finished product; and 5, performing a leak detection test on the flow channel to obtain the target material back plate.
The method has the following beneficial effects: firstly, a back plate main body and a cover plate are machined, then the back plate main body and the cover plate are welded into a whole to form a target back plate semi-finished product, then the target back plate semi-finished product is leveled, and finally a leak detection experiment is carried out. The processing method of the target material back plate is simple and convenient, and the production efficiency is high. By leveling the semi-finished product of the target back plate, the size of the finally obtained target back plate can be more accurate, and the deformation of the target back plate after long-term use can be effectively reduced.
According to some embodiments of the invention, in the step 1, margins are left on the thicknesses of the front surface and the back surface of the backboard main body; in step 2, the thickness of the cover plate is left with a margin.
According to some embodiments of the invention, in the step 1, a margin of 2mm to 3mm is reserved on both the front surface and the back surface of the back plate main body, and in the step 2, a margin of 2mm to 3mm is reserved on the thickness of the cover plate.
According to some embodiments of the invention, the step 4 specifically comprises the following steps: step 4.1, leveling the combined target back plate semi-finished product; 4.2, performing rough machining on the semi-finished target back plate by using a numerical control machine tool, and reducing partial allowance of thicknesses of the front surface and the back surface of the semi-finished target back plate; 4.3, eliminating the internal residual stress of the semi-finished target back plate; and 4.4, performing finish machining on the semi-finished target back plate by using a numerical control machine tool, and reducing all allowance of thicknesses of the front surface and the back surface of the semi-finished target back plate.
According to some embodiments of the invention, in step 4.3, the internal residual stress of the target backing plate semi-finished product is eliminated by aging.
According to some embodiments of the invention, in the step 3, the back plate main body and the cover plate are welded to each other by means of friction welding.
According to some embodiments of the invention, in the step 4, the combined target backing plate semi-finished product is leveled by using a press.
According to some embodiments of the invention, in step 5, a leak test is performed on the flow channel by a helium leak detector.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural diagram of an embodiment of the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
FIG. 3 is a schematic structural diagram of a back plate body according to an embodiment of the invention;
FIG. 4 is a cross-sectional view taken along line B-B of FIG. 3;
fig. 5 is a schematic view of a cover plate structure in an embodiment of the invention.
Reference numerals: the back plate comprises a back plate body 100, a flow channel 110, a liquid inlet 111, a liquid outlet 112, a cover plate 200, a liquid inlet avoiding groove 210, a liquid outlet avoiding groove 220 and a concave part 230.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, the target material in the present invention is not the structure of the present invention, and the target material is introduced for the purpose of explaining the structure and or function.
In the description of the present invention, unless otherwise explicitly defined, terms such as arrangement, connection and the like should be broadly construed, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the detailed contents of the technical solutions.
Referring to fig. 1 to 5, the present invention discloses a target backing plate, which includes a backing plate main body 100, a cover plate 200 and a sealing ring.
The back plate main body 100 has a target on the front surface, a flow channel 110 on the back surface, the flow channel 110 having a liquid inlet 111 and a liquid outlet 112, the flow channel 110 allowing a cooling liquid to flow, a cover plate 200 disposed on the back surface of the back plate main body 100 and covering the flow channel 110, and a sealing ring disposed between the cover plate 200 and the flow channel 110 for sealing the flow channel 110.
It can be understood that, when in use, the target material can be disposed on the front surface of the backplate main body 100, so that the cooling liquid can flow in from the liquid inlet 111 of the flow channel 110 on the back surface of the backplate main body 100 and flow out from the liquid outlet 112, and the cooling liquid can take away the heat of the target material on the front surface of the backplate main body 100, thereby reducing the temperature of the target material in the sputtering coating process and further improving the coating quality. In addition, the sealing ring disposed between the cover plate 200 and the flow channel 110 can seal the flow channel 110.
Referring to fig. 3 and 5, in some embodiments of the present invention, the flow channel 110 is U-shaped, and the liquid inlet 111 and the liquid outlet 112 are located at the same end of the back plate body 100. The U-shaped flow channel 110 can increase the cooling area of the target material, thereby improving the cooling effect; the liquid inlet 111 and the liquid outlet 112 are located at the same end of the backplate main body 100, so that the cooling liquid can be conveniently circulated, wherein the liquid inlet 111 and the liquid outlet 112 are both connected with an external cooling system, and the cooling liquid flowing out of the liquid outlet 112 can enter the external cooling system for recycling.
In addition, referring to fig. 2, the cover plate 200 is U-shaped and fits to the flow channel 110, the cover plate 200 is provided with a liquid inlet avoiding groove 210 and a liquid outlet avoiding groove 220 in the regions corresponding to the liquid inlet 111 and the liquid outlet 112, respectively, and the widths of the liquid inlet avoiding groove 210 and the liquid outlet avoiding groove 220 are both smaller than the width of the flow channel 110. The liquid inlet 111 and the liquid outlet 112 may be directly connected to the external cooling system on the back plate main body 100, or may be connected to the external cooling system through a liquid inlet avoiding groove 210 and a liquid outlet avoiding groove 220 formed in the cover plate 200, wherein the liquid inlet avoiding groove 210 and the liquid outlet avoiding groove 220 are respectively disposed corresponding to the liquid inlet 111 and the liquid outlet 112. Specifically, the external cooling system is a cooling system that collects and cools the coolant having heat, and allows the cooled coolant to flow into the flow channel 110 again.
Specifically, when the cooling liquid flows into the flow channel 110 from the outside through the liquid inlet avoiding groove 210, the flow velocity of the cooling liquid is increased due to the fact that the cross section of the cooling liquid is changed from small to large, and the cooling of the cooling liquid on the target can be accelerated; when the cooling liquid flows out from the groove 220 through the liquid outlet in the inner diameter of the flow channel 110, the flowing cross section is changed from large to small, the flowing speed of the cooling liquid is reduced due to obstruction, the flow speed of the cooling liquid flowing into the external cooling system can be reduced, and the external cooling system is protected.
Specifically, the width of the liquid inlet 111 and the width of the liquid outlet 112 are gradually decreased from the inside of the backplate main body 100 to the outside of the backplate main body 100 along the length direction of the backplate main body 100. It can be understood that when the cooling liquid flows into the flow channel 110 from the outside, the flow velocity of the cooling liquid will be increased due to the larger and smaller cross sections, which can accelerate the cooling of the target material by the cooling liquid; when the cooling liquid flows out from the flow channel 110 to the outside, the flow of the cooling liquid is blocked and the speed is reduced due to the small cross section, so that the flow speed of the cooling liquid flowing into the external cooling system can be reduced, and the external cooling system is protected.
Referring to fig. 2, the main body 100 and the cover plate 200 are provided with recesses 230 at positions corresponding to the inlet-avoiding groove 210 and the outlet-avoiding groove 220, and the size of the recess 230 is larger than that of the inlet-avoiding groove 210 and that of the outlet-avoiding groove 220. When the pipelines of the external cooling system are connected, the concave portion 230 can align the pipelines with the positions of the inlet avoiding groove 210 and the outlet avoiding groove 220, which is convenient for installation.
The invention also discloses a manufacturing method of the target material back plate, which comprises the following steps:
step 1, preparing a back plate main body 100 with a corresponding size, and processing a flow channel 110 on the back surface of the back plate main body 100;
step 2, processing the cover plate 200 to enable the cover plate 200 to cover the flow channel 110;
step 3, arranging a sealing ring between the cover plate 200 and the flow channel 110, and welding the back plate main body 100 and the cover plate 200 to combine the back plate main body 100 and the cover plate 200 into a target back plate semi-finished product;
step 4, leveling the combined target back plate semi-finished product;
and 5, performing a leakage detection test on the flow channel 110 to obtain the target material back plate.
It can be understood that the back plate main body 100 and the cover plate 200 are firstly processed, then the back plate main body 100 and the cover plate 200 are welded into a whole to form a target back plate semi-finished product, then the target back plate semi-finished product is leveled, and finally a leak detection experiment is carried out. The processing method of the target material back plate is simple and convenient, and the production efficiency is high. By leveling the semi-finished product of the target back plate, the size of the finally obtained target back plate can be more accurate, and the deformation of the target back plate after long-term use can be effectively reduced.
In some embodiments of the present invention, in step S3, the backplate main body 100 and the cover plate 200 are welded to each other by means of friction welding. The friction welding is a method for welding the workpieces under pressure by utilizing heat generated by friction of the contact surfaces of the workpieces, has good welding quality and high dimensional precision of the weldment, and can meet the requirement of high-precision welding between the back plate main body 100 and the cover plate 200.
In some embodiments of the invention, in step S4, the combined target backing plate is leveled using a press. The press may be a pneumatic press, a screw press or a crank press.
In some embodiments of the present invention, in step S5, a leak test is performed on the flow channel 110 by a helium leak detector. Helium has a low molecular weight and low viscosity, and therefore has low noise and is easily diffused through the leak hole, and helium is an inert gas and does not corrode the flow channel 110 in the target backing plate.
The present invention also provides an embodiment comprising the steps of:
step 1, preparing a back plate main body 100 with a corresponding size, processing a flow channel 110 on the back surface of the back plate main body 100, and reserving margins on the thicknesses of the front surface and the back surface of the back plate main body 100;
step 2, processing the cover plate 200 to enable the cover plate 200 to cover the flow channel 110, and reserving allowance for the thickness of the cover plate 200;
step 3, arranging a sealing ring between the cover plate 200 and the flow channel 110, and welding the back plate main body 100 and the cover plate 200 to combine the back plate main body 100 and the cover plate 200 into a target back plate semi-finished product;
step 4.1, leveling the combined target back plate semi-finished product;
4.2, performing rough machining on the semi-finished target back plate by using a numerical control machine tool, and reducing partial allowance of thicknesses of the front surface and the back surface of the semi-finished target back plate;
4.3, eliminating the internal residual stress of the semi-finished product of the target back plate;
4.4, performing finish machining on the semi-finished target back plate by using a numerical control machine tool to reduce all allowance of thicknesses of the front surface and the back surface of the semi-finished target back plate;
and 5, performing a leakage detection test on the flow channel 110 to obtain the target material back plate.
Specifically, the front and back surfaces of the back plate main body 100 are reserved with 2mm to 3mm of allowance, and the thickness of the cover plate 200 is reserved with 2mm to 3mm of allowance. The size of the finally obtained target material back plate can be more accurate by reserving allowance and removing the allowance twice. Allowance is reserved on the front side and the back side of the back plate main body 100, so that the front side and the back side of the back plate main body 100 can be processed in sequence to obtain more accurate size. The reserved allowance needs to be controlled between 2mm and 3mm, and if the reserved allowance is too large, the time for removing the allowance is increased, so that the processing efficiency is influenced; if the reserved margin is too small, the purpose of increasing the size accuracy by removing the margin for many times cannot be achieved.
In step S4.3, the internal residual stress of the target backing plate is removed by aging. The aging treatment may be natural aging treatment performed at room temperature or artificial aging treatment performed at a certain temperature. The aging treatment can effectively eliminate the internal stress of the target material back plate, stabilize the structure and the size and improve the mechanical property.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (10)
1. The target backplate, its characterized in that includes:
the back plate comprises a back plate main body (100), wherein the front surface of the back plate main body is provided with a target, the back surface of the back plate main body is provided with a flow channel (110), the flow channel (110) is provided with a liquid inlet (111) and a liquid outlet (112), and cooling liquid can flow in the flow channel (110);
the cover plate (200) is arranged on the back surface of the back plate main body (100) and covers the flow channel (110);
and the sealing ring is arranged between the cover plate (200) and the flow channel (110) and is used for sealing the flow channel (110).
2. The target backing plate of claim 1, wherein the flow channel (110) is U-shaped, and the liquid inlet (111) and the liquid outlet (112) are located at the same end of the backing plate body (100).
3. The method of manufacturing a target backing plate according to claim 1 or 2, comprising the steps of:
step 1, preparing a back plate main body (100) with a corresponding size, and processing a flow channel (110) on the back surface of the back plate main body (100);
step 2, processing a cover plate (200) to enable the cover plate (200) to cover the flow channel (110);
step 3, arranging a sealing ring between the cover plate (200) and the flow channel (110), and welding the back plate main body (100) and the cover plate (200) to combine the back plate main body (100) and the cover plate (200) into a target back plate semi-finished product;
step 4, leveling the combined target back plate semi-finished product;
and 5, performing a leak detection test on the flow channel (110) to obtain the target material back plate.
4. The method for manufacturing the target backing plate according to claim 3, wherein in the step 1, margins are left on the thicknesses of the front surface and the back surface of the backing plate main body (100); in the step 2, a margin is left in the thickness of the cover plate (200).
5. The method of claim 4, wherein in step 1, a 2mm to 3mm margin is reserved on both the front and back sides of the backing plate body (100), and in step 2, a 2mm to 3mm margin is reserved on the thickness of the cover plate (200).
6. The method according to claim 4, wherein the step 4 specifically comprises the following steps:
step 4.1, leveling the combined target back plate semi-finished product;
4.2, performing rough machining on the semi-finished target back plate by using a numerical control machine tool, and reducing partial allowance of thicknesses of the front surface and the back surface of the semi-finished target back plate;
4.3, eliminating the internal residual stress of the semi-finished target back plate;
and 4.4, performing finish machining on the semi-finished target back plate by using a numerical control machine tool, and reducing all allowance of thicknesses of the front surface and the back surface of the semi-finished target back plate.
7. The method according to claim 6, wherein in step 4.3, the internal residual stress of the target backing plate semi-finished product is eliminated by aging treatment.
8. The method of manufacturing a target backing plate according to claim 3, wherein in step 3, the backing plate body (100) and the cover plate (200) are welded to each other by means of friction welding.
9. The method according to claim 3, wherein in the step 4, the combined target backing plate semi-finished product is leveled by using a press.
10. The method of manufacturing a target backing plate according to claim 3, wherein in the step 5, a leak test is performed on the flow channel (110) by a helium leak detector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011182839.3A CN112323026A (en) | 2020-10-29 | 2020-10-29 | Target material back plate and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011182839.3A CN112323026A (en) | 2020-10-29 | 2020-10-29 | Target material back plate and manufacturing method thereof |
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| CN112323026A true CN112323026A (en) | 2021-02-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011182839.3A Pending CN112323026A (en) | 2020-10-29 | 2020-10-29 | Target material back plate and manufacturing method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006150454A (en) * | 2000-12-22 | 2006-06-15 | Hitachi Cable Ltd | Cooling plate, manufacturing method thereof, sputtering target and manufacturing method thereof |
| CN101960043A (en) * | 2009-01-22 | 2011-01-26 | 上野顺 | Target structure and method for manufacturing target structure |
| CN107849688A (en) * | 2015-07-10 | 2018-03-27 | 住友化学株式会社 | Backboard, sputtering target and their manufacture method |
| CN109267022A (en) * | 2018-12-15 | 2019-01-25 | 湖南玉丰真空科学技术有限公司 | A kind of target cooling device |
-
2020
- 2020-10-29 CN CN202011182839.3A patent/CN112323026A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006150454A (en) * | 2000-12-22 | 2006-06-15 | Hitachi Cable Ltd | Cooling plate, manufacturing method thereof, sputtering target and manufacturing method thereof |
| CN101960043A (en) * | 2009-01-22 | 2011-01-26 | 上野顺 | Target structure and method for manufacturing target structure |
| CN107849688A (en) * | 2015-07-10 | 2018-03-27 | 住友化学株式会社 | Backboard, sputtering target and their manufacture method |
| CN109267022A (en) * | 2018-12-15 | 2019-01-25 | 湖南玉丰真空科学技术有限公司 | A kind of target cooling device |
Non-Patent Citations (1)
| Title |
|---|
| 兰士刚主编: "《上海市水利建设工程质量监测》", 同济大学出版社, pages: 213 * |
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