CN108330461A - Carry base station - Google Patents
Carry base station Download PDFInfo
- Publication number
- CN108330461A CN108330461A CN201810077588.9A CN201810077588A CN108330461A CN 108330461 A CN108330461 A CN 108330461A CN 201810077588 A CN201810077588 A CN 201810077588A CN 108330461 A CN108330461 A CN 108330461A
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- CN
- China
- Prior art keywords
- base station
- glass substrate
- carrying base
- radiating subassembly
- station according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention provides a kind of carrying base station, for crossing bearing glass substrate in processing procedure splashing, which is characterized in that the carrying base station includes：Base station ontology, and the cooling device that is set on the base station ontology；The cooling device includes：Radiating subassembly accelerates cooling for the subregion to the glass substrate after surface formation metallic diaphragm；And mobile mechanism, the radiating subassembly is connected, for being moved to the radiating subassembly, is fitted with the glass baseplate surface with being moved to the radiating subassembly in due course；It has the beneficial effect that：Provided by the present invention for splashing the carrying base station for crossing bearing glass substrate in processing procedure compared with prior art, on bearing substrate surface, cooling device is set, after glass baseplate surface splashes and has crossed metal film, cooling device in time cools down to the easy warpage position of glass substrate, to reduce glass substrate wrapping degree.
Description
Technical field
The present invention relates to display production technical field, more particularly to a kind of cross in processing procedure to bearing glass substrate splashing
Carrying base station.
Background technology
Thin film transistor (TFT) directly affects the performance of Thin Film Transistor-LCD as Primary Component；In existing TFT-
In LCD (Thin Film Transistors-LCD display panel) manufacturing field, the preparation generally use magnetron sputtering plating of thin film transistor (TFT)
Means are completed.Lotus energy particle (such as argon ion) bombard the surface of solids, cause the surface of solids various particles (such as atom, molecule or
Micel beam) the phenomenon that being escaped from the surface of solids claims " to sputter ".During magnetron sputtering plating, argon gas electricity is typically applied
The neutral atom of positive ion bombardment solid (target) from generation, spillage deposits on substrate (substrate), to form film layer；More than
Sputtering process is completed in the film forming chamber room of sputtering equipment, and the substrate of film forming to be sputtered is placed in the indoor carrying base station table of film forming chamber
Face.
As LCD is toward the development of advanced lines, sputtered Cu film thickness gradually adopts thick copper wiring, the thickness of copper film in TFT substrate
Degree is likely to increase 800nm~1000nm.Farther out due to the thermal expansion character of copper and TFT glass substrates difference, the heat of copper is swollen
Swollen coefficient 1.62E-5, and the coefficient of thermal expansion 3.75E-6 of glass, thus thick copper film splash cross after the completion of, from 200 ° of coolings of high temperature
To after room temperature, TFT glass substrates are likely to occur significantly warpage, to influence the quality of film forming.
In conclusion existing splash crosses equipment when sputtering copper film to glass baseplate surface, since the heat of glass substrate is swollen
The coefficient of thermal expansion differences of swollen coefficient and metal, after causing glass baseplate surface to splash and crossed metal film, temperature is by sputtering environment temperature
200 ° be cooled to room temperature after, there is warpage in glass substrate, and then influences into film quality.
Invention content
The present invention provides a kind of for splashing the carrying base station for crossing bearing glass substrate in processing procedure, the setting of bearing substrate surface
There is cooling device, after glass baseplate surface splashes and crossed metal film, to cool down in time to the easy warpage position of glass substrate,
To reduce glass substrate wrapping degree.
To solve the above problems, technical solution provided by the invention is as follows：
The present invention provides a kind of carrying base station, for crossing bearing glass substrate in processing procedure splashing；
The carrying base station includes：Base station ontology, and the cooling device that is set on the base station ontology；The cooling
Device includes：
Radiating subassembly accelerates cooling for the subregion to the glass substrate after surface formation metallic diaphragm；And
Mobile mechanism connects the radiating subassembly, for being moved to the radiating subassembly, in due course by the heat dissipation
Component is moved to fit with the glass baseplate surface.
According to one preferred embodiment of the present invention, the radiating subassembly includes multiple support pins, and the support pin is uniform
It is distributed in the base station body surface.
According to one preferred embodiment of the present invention, the radiating subassembly includes four support pins, and four branch
The rectangular distribution of support needle.
According to one preferred embodiment of the present invention, the support pin includes U-tube ontology, and the U-tube ontology is connected with
Water circle device；
The water circle device includes water tank, cooler bin, and the supercharging device being set in the water tank；
The U-tube ontology includes discharge outlet and water inlet, and the water inlet connects the water tank, the discharge outlet connection
The cooler bin.
According to one preferred embodiment of the present invention, the U-tube ontology includes for close to described in the evaporator section of heat source, connection
The adiabatic section of evaporator section and the condensation segment of the connection adiabatic section other end.
According to one preferred embodiment of the present invention, the U-tube ontology includes shell, and the pipe in the shell
Core, the tube core internal circulation flow have coolant liquid.
According to one preferred embodiment of the present invention, the base station body surface is provided with identical with the support pin quantity
Through-hole, the support pin are telescopically arranged in the through-hole.
According to one preferred embodiment of the present invention, the through-hole for being set to the base station body surface is strip through-hole, the branch
Support needle is translatable and is telescopically arranged in the through-hole.
According to one preferred embodiment of the present invention, the mobile mechanism includes lifting platform, and fixation is provided on the lifting platform
Holder, the water circle device and the U-tube ontology are set on the fixing bracket.
According to one preferred embodiment of the present invention, the lifting platform bottom is provided with the turbine moved horizontally for realizing it
Structure.
Beneficial effects of the present invention are：Provided by the present invention for splashing the carrying base station for crossing bearing glass substrate in processing procedure
Compared with prior art, cooling device is set on bearing substrate surface, after glass baseplate surface splashes and has crossed metal film, cooling dress
It sets and cools down in time to the easy warpage position of glass substrate, to reduce glass substrate wrapping degree；It solves existing splash and crosses equipment
When sputtering copper film to glass baseplate surface, due to the coefficient of thermal expansion of glass substrate and the coefficient of thermal expansion differences of metal, cause
Glass baseplate surface splashes crossed metal film after, after temperature is cooled to room temperature by 200 ° of sputtering environment temperature, glass substrate occur
Warpage, so influence at film quality the technical issues of.
Description of the drawings
It, below will be to embodiment or the prior art in order to illustrate more clearly of embodiment or technical solution in the prior art
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only some invented
Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these
Figure obtains other attached drawings.
Fig. 1 is carrying abutment structure schematic diagram provided by the invention.
Fig. 2 is one overlooking structure diagram of carrying base station provided by the invention；
Fig. 3 is another overlooking structure diagram of carrying base station provided by the invention.
Specific implementation mode
The explanation of following embodiment is referred to the additional illustration, to illustrate the present invention can be used to implement particular implementation
Example.The direction term that the present invention is previously mentioned, such as [on], [under], [preceding], [rear], [left side], [right side], [interior], [outer], [side]
Deng being only the direction with reference to annexed drawings.Therefore, the direction term used be illustrate and understand the present invention, rather than to
The limitation present invention.The similar unit of structure is with being given the same reference numerals in the figure.
The present invention crosses equipment when sputtering copper film to glass baseplate surface for existing splash, since the heat of glass substrate is swollen
The coefficient of thermal expansion differences of swollen coefficient and metal, after causing glass baseplate surface to splash and crossed metal film, temperature is by sputtering environment temperature
200 ° be cooled to room temperature after, there is warpage in glass substrate, and then the technical issues of influence into film quality, and the present embodiment can solve
The certainly defect.
As shown in Figure 1, carrying base station provided by the invention, described to carry the film forming chamber for being provided with inner vacuum on base station
(not shown) is provided with target, temperature-adjusting device in the film forming chamber room and is set in the film forming chamber room
The conductive layer of wall, the conductive layer are electrically connected with target, radio-frequency power supply and DC power supply respectively, to form electric field, and then are manufactured
Lotus energy particle bombardment target, substrate surface is deposited to by the neutral atom that target splashes out；It waits splashing the glass base for crossing metallic diaphragm
Plate is placed in the carrying base station surface, and in the film forming chamber room, metallic diaphragm is crossed being splashed to the glass baseplate surface
When, the temperature-adjusting device can heat the indoor temperature of the film forming chamber and 200 ° of holding, splashes and crosses after completion, the temperature
It spends regulating device and stops heating, after the glass substrate is naturally cooling to room temperature, by the glass substrate material and at membrane material
Warping phenomenon will occur in four angular zones of the influence of the coefficient of thermal expansion differences of material, the glass substrate, in the glass base
Plate surface is formed for 800nm copper films, and the glass substrate is after 200 ° of operating ambient temperature are cooled to room temperature, the glass
The amount of warpage of four angular zone of substrate can reach 0.74mm.
The carrying base station includes cabinet 101, and the bearing panel 102 positioned at 101 surface of the cabinet, the carrying
Panel 102 is for placing the glass substrate 103；Also, it is provided with cooling device on the carrying base station, wherein described cold
But device includes radiating subassembly and mobile mechanism；The radiating subassembly be used for four angular zones of the glass substrate 103 into
Row accelerates cooling, and the region except four angular zones of the glass substrate 103 then uses Temperature fall；The radiating subassembly setting
In in the mobile mechanism, to realize the position movement to the radiating subassembly, the glass substrate 103 crosses stream splash
Cheng Shi, the glass substrate 103 are placed in 102 surface of the bearing panel, after the completion of the glass substrate 103 is in and splashes and cross
When the flow that cools down, 103 surface of the glass substrate forms metallic diaphragm 106, and the mobile mechanism moves the radiating subassembly
It fits to four angular zones with the glass substrate 103, to take away the heat of 103 4 angular zone of the glass substrate；For example,
The radiating subassembly and the mobile mechanism are set in the carrying base station cabinet 101, wait needing the radiating subassembly
When auxiliary temperature-reducing, the radiating subassembly is moved at the top of the radiating subassembly and the bearing panel 102 by the mobile mechanism
Concordantly so that the radiating subassembly fits with 103 surface of the glass substrate, to which the glass substrate 103 is dissipated with described
The accelerated cooling in the region of hot component touch.
The radiating subassembly includes the support pin there are four rectangular distribution, for corresponding to the glass base respectively
Four angular zones of plate 103.
For example, the support pin is water cooling tube, the water cooling tube includes U-tube ontology 104, the U-tube ontology 104
It is connected with water circle device 105, the water circle device 105 includes water tank, cooler bin, and the increasing being set in the water tank
Voltage device；It is stored with coolant liquid in the water tank；The U-tube ontology 104 includes discharge outlet and water inlet, and the water inlet connects
The water tank is connect, the discharge outlet connects the cooler bin；Wherein, the supercharging device is increasing the pressure in the water tank
By force so that the coolant liquid in the water tank can recycle in the U-tube ontology 104, and then take away the glass substrate 103
The heat on surface.
The U-tube ontology 104 includes for evaporator section, the connection evaporator section close to the glass substrate 103
The condensation segment of adiabatic section and the connection adiabatic section other end.
Specifically, the water cooling tube radiating principle：The U-tube ontology 104 is divided into evaporator section and condensation segment, root along longitudinal direction
It also can be in centre plus an adiabatic section according to needs.The cross section of U-tube ontology 104 is made of shell, tube core and steam cavity.Although taking out
Interior air simultaneously injects a certain amount of working medium, then by package closure.Tube core is porous capillary structure, is full of liquid work in duct
Matter.The saturated vapor of working medium is accommodated in steam cavity.When work, outside heat spontaneous evaporation section is incoming, makes the work in evaporator section tube core
Matter heat absorption evaporation becomes steam and flows to condensation segment, and is condensed in condensation segment die surfaces, releases gasification latent heat, outflow pipe
Outside.In the liquid working substance that condensation segment condenses, because the capillary pressure difference in tube core flows back to evaporator section again.So continue cycling through,
Heat is constantly passed into the other end from one end of U-tube ontology 104.U-tube ontology 104 transmits heat using evaporation-condensation process
Amount has very high thermal conductivity efficiency, and then is cooled down to four angular zones on 103 surface of the glass substrate.
Show that the support pin makes 103 4 jiaos of (100*100mm of the glass substrate through experiment2) regional temperature adds
Speed is cooled to 100 °, other regions use Temperature fall mode, when 103 temperature of the glass substrate drops to room temperature, the glass
The amount of warpage of glass substrate 103 drops to 0.508mm, further avoids the panel that 103 higher amount of warpage of the glass substrate is brought
Quality problem.
For another example, the support pin is the metal thimble prepared using highly heat-conductive material, and metal thimble bottom passes through
Pipeline connects liquid nitrogen container, and the metal thimble is contacted with 103 surface of the glass substrate, to take away the glass substrate 103
The heat on surface, the liquid nitrogen container raise liquid level to contact metal thimble bottom, to be the metal thimble in due course
Cooling.Preferably, the metal thimble is in chamfered edge taper, to increase the contact of the metal thimble and the glass substrate 103
Area, and then increase the film-cooled heat to the glass substrate 103.
Preferably, the mobile mechanism includes lifting platform, and fixing bracket 107 is provided on the lifting platform, and the water follows
Loop device 105 and the U-tube ontology 104 are set on the fixing bracket 107；The lifting platform includes pedestal 108, setting
In the lifting cylinder 109 on the pedestal 108, the fixing bracket 107 is set to 109 top of the lifting cylinder.
Preferably, the lifting platform bottom is provided with the pulley mechanism moved horizontally for realizing it, for example, the pulley
Mechanism is driven by servo motor.
Preferably, the lifting cylinder 109 is connected to timing means with the servo motor, and the timing means connects
It is connected to the control unit of sputtering equipment；The work of the lifting cylinder 109 and the servo motor is controlled by the timing means
Make, to move the position of the support pin if necessary.
As shown in Fig. 2, 201 surface of the bearing panel is provided with through-hole 202 identical with the support pin quantity, and
And the position of the through-hole 202 corresponds to four angular zones of the glass substrate；The glass substrate splash crossing flow
When, the support pin is accommodated in the cabinet of the carrying base station, and the support pin is less than 202 height of the through-hole, institute
Support pin is stated not contact with the glass baseplate surface；When needing the radiating subassembly auxiliary temperature-reducing, the support pin
The through-hole 202 is stretched out to contact with the glass baseplate surface.
As shown in figure 3, the through-hole on 301 surface of the bearing panel is set as strip through-hole 302, and two institutes being diagonally arranged
Strip through-hole 302 is stated to be oppositely arranged, the support pin can in the strip through-hole 302 shift position, described in adjusting
Position of the support pin in the strip through-hole 302 can radiate to the specified region of the glass substrate, or can be with
It radiates to four angular zones of various sizes of glass substrate.
Beneficial effects of the present invention are：Provided by the present invention for splashing the carrying base station for crossing bearing glass substrate in processing procedure
Compared with prior art, cooling device is set on bearing substrate surface, after glass baseplate surface splashes and has crossed metal film, cooling dress
It sets and cools down in time to the easy warpage position of glass substrate, to reduce glass substrate wrapping degree；It solves existing splash and crosses equipment
When sputtering copper film to glass baseplate surface, due to the coefficient of thermal expansion of glass substrate and the coefficient of thermal expansion differences of metal, cause
Glass baseplate surface splashes crossed metal film after, after temperature is cooled to room temperature by 200 ° of sputtering environment temperature, glass substrate occur
Warpage, so influence at film quality the technical issues of.
In conclusion although the present invention is disclosed above with preferred embodiment, above preferred embodiment is not to limit
The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, therefore protection scope of the present invention is subject to the range that claim defines.
Claims (10)
1. a kind of carrying base station, for crossing bearing glass substrate in processing procedure splashing, which is characterized in that the carrying base station includes：
Base station ontology, and the cooling device that is set on the base station ontology；The cooling device includes：
Radiating subassembly accelerates cooling for the subregion to the glass substrate after surface formation metallic diaphragm；And
Mobile mechanism connects the radiating subassembly, for being moved to the radiating subassembly, in due course by the radiating subassembly
It is moved to and fits with the glass baseplate surface.
2. carrying base station according to claim 1, which is characterized in that the radiating subassembly includes multiple support pins, institute
It states support pin and is evenly distributed on the base station body surface.
3. carrying base station according to claim 2, which is characterized in that the radiating subassembly includes four branch supports
Needle, and four rectangular distributions of support pin.
4. carrying base station according to claim 3, which is characterized in that the support pin includes U-tube ontology, the U
Type tube body is connected with water circle device；
The water circle device includes water tank, cooler bin, and the supercharging device being set in the water tank；
The U-tube ontology includes discharge outlet and water inlet, and the water inlet connects the water tank, described in the discharge outlet connection
Cooler bin.
5. carrying base station according to claim 4, which is characterized in that the U-tube ontology includes for close to heat source
The condensation segment of evaporator section, the adiabatic section of the connection evaporator section and the connection adiabatic section other end.
6. carrying base station according to claim 5, which is characterized in that the U-tube ontology includes shell, and is located at institute
The tube core in shell is stated, the tube core internal circulation flow has coolant liquid.
7. carrying base station according to claim 2, which is characterized in that the base station body surface is provided with and the support
The identical through-hole of thimble quantity, the support pin are telescopically arranged in the through-hole.
8. carrying base station according to claim 7, which is characterized in that the through-hole for being set to the base station body surface is item
Shape through-hole, the support pin is translatable and is telescopically arranged in the through-hole.
9. carrying base station according to claim 7, which is characterized in that the mobile mechanism includes lifting platform, the lifting
Fixing bracket is provided on platform, the water circle device and the U-tube ontology are set on the fixing bracket.
10. carrying base station according to claim 9, which is characterized in that the lifting platform bottom is provided with for realizing it
The pulley mechanism moved horizontally.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810077588.9A CN108330461B (en) | 2018-01-26 | 2018-01-26 | Bearing base platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810077588.9A CN108330461B (en) | 2018-01-26 | 2018-01-26 | Bearing base platform |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108330461A true CN108330461A (en) | 2018-07-27 |
| CN108330461B CN108330461B (en) | 2020-05-19 |
Family
ID=62925833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810077588.9A Active CN108330461B (en) | 2018-01-26 | 2018-01-26 | Bearing base platform |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108330461B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111188012A (en) * | 2018-11-14 | 2020-05-22 | 广东聚华印刷显示技术有限公司 | Evaporation device, preparation method of evaporation film, electroluminescent device and preparation method |
| CN113166941A (en) * | 2018-11-28 | 2021-07-23 | 朗姆研究公司 | Susceptor including vapor chamber for substrate processing system |
| CN114134478A (en) * | 2021-11-26 | 2022-03-04 | 上海大学 | Fast-cooling film coating sample stage device and application thereof |
| CN117051367A (en) * | 2023-08-18 | 2023-11-14 | 上海陛通半导体能源科技股份有限公司 | Magnetron sputtering equipment |
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| JP2008179850A (en) * | 2007-01-24 | 2008-08-07 | Toshiba Matsushita Display Technology Co Ltd | Method and apparatus for depositing amorphous ito film |
| CN201365388Y (en) * | 2008-12-30 | 2009-12-16 | 上海大郡自动化系统工程有限公司 | Electronic module cooler with base plate heat source |
| CN104846346A (en) * | 2015-05-20 | 2015-08-19 | 中国科学院宁波材料技术与工程研究所 | Control method and control device for temperature of substrate as well as film deposition equipment |
| CN106715751A (en) * | 2014-07-31 | 2017-05-24 | 株式会社爱发科 | Substrate processing apparatus and substrate processing method |
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Patent Citations (4)
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|---|---|---|---|---|
| JP2008179850A (en) * | 2007-01-24 | 2008-08-07 | Toshiba Matsushita Display Technology Co Ltd | Method and apparatus for depositing amorphous ito film |
| CN201365388Y (en) * | 2008-12-30 | 2009-12-16 | 上海大郡自动化系统工程有限公司 | Electronic module cooler with base plate heat source |
| CN106715751A (en) * | 2014-07-31 | 2017-05-24 | 株式会社爱发科 | Substrate processing apparatus and substrate processing method |
| CN104846346A (en) * | 2015-05-20 | 2015-08-19 | 中国科学院宁波材料技术与工程研究所 | Control method and control device for temperature of substrate as well as film deposition equipment |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111188012A (en) * | 2018-11-14 | 2020-05-22 | 广东聚华印刷显示技术有限公司 | Evaporation device, preparation method of evaporation film, electroluminescent device and preparation method |
| CN113166941A (en) * | 2018-11-28 | 2021-07-23 | 朗姆研究公司 | Susceptor including vapor chamber for substrate processing system |
| CN114134478A (en) * | 2021-11-26 | 2022-03-04 | 上海大学 | Fast-cooling film coating sample stage device and application thereof |
| CN117051367A (en) * | 2023-08-18 | 2023-11-14 | 上海陛通半导体能源科技股份有限公司 | Magnetron sputtering equipment |
| CN117051367B (en) * | 2023-08-18 | 2024-05-31 | 上海陛通半导体能源科技股份有限公司 | Magnetron sputtering equipment |
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| Publication number | Publication date |
|---|---|
| CN108330461B (en) | 2020-05-19 |
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