CN110273124A - A kind of mask plate and preparation method thereof - Google Patents
A kind of mask plate and preparation method thereof Download PDFInfo
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- CN110273124A CN110273124A CN201910452518.1A CN201910452518A CN110273124A CN 110273124 A CN110273124 A CN 110273124A CN 201910452518 A CN201910452518 A CN 201910452518A CN 110273124 A CN110273124 A CN 110273124A
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- Prior art keywords
- exposure mask
- ontology
- mask
- electroforming
- sheet frame
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
Abstract
The invention discloses a kind of mask plate and preparation method thereof, mask plate includes exposure mask sheet frame and the exposure mask ontology that is fixed on exposure mask sheet frame；Mask pattern is provided on the exposure mask ontology, the mask pattern includes that the through-hole through the exposure mask ontology, the exposure mask ontology and exposure mask sheet frame are integrally formed by electrocasting method.The exposure mask ontology and exposure mask sheet frame of the application is obtained by electroforming integral forming process, is saved in traditional mask plate manufacturing process and is thrown the net and weld processing procedure, reduce the enormous investment for welding equipment of throwing the net, thereby reduces the cost of manufacture of mask plate；Bit errors caused by process of throwing the net are avoided simultaneously and are thrown the net the problems such as not tight, and bad caused by avoiding in welding processing procedure and waste enhances the mechanical strength of mask plate, improves the production yield and efficiency of mask plate；Improve the evaporating quality and yields of luminous organic material.
Description
Technical field
The present invention relates to the production field of mask plate, more particularly to a kind of mask plate and preparation method thereof.
Background technique
Organic electroluminescence device (Organic Light Emitting Diodes, OLED) with its self-luminous, it is low at
Sheet, high brightness, high contrast, response is fast, low-power consumption, visual angle is wide, appearance is frivolous, can Flexible Displays the advantages that, gradually replaced
Liquid crystal display (LCD) becomes current display mainstream, is widely used in smart phone, smartwatch, tablet computer, TV etc.
Field.The production process of OLED is that driving circuit and anode are successively made on substrate, and organic functions are then deposited on anode
Layer, organic luminous layer and cathode.The material of organic luminous layer is generally divided into macromolecular organic material and Small molecule organic materials, when
Preceding application is based on Small molecule organic materials.For Small molecule organic materials, the method for usually utilizing vacuum evaporation, on anode
Each organic function layer, organic luminous layer are formed, the cathode of device is finally re-formed.
In the process using vacuum deposition method production OLED device, need to use vapor deposition mold-mask plate conduct
The vapor deposition of medium progress OLED light emitting pixel pattern.Mask plate is divided into big opening metal mask plate (Open Mask) and high-precision
It spends metal mask plate (Fine Metal Mask, FMM), the former is mainly used for the vacuum evaporation film forming of functional layer and cathode, the latter
It is mainly used for the vacuum evaporation film forming of red (R), green (G), blue (B) each luminescent layer and each luminescent layer special function layer.
The material of mask plate is generally metal or metal alloy, is commonly invar alloy (Invar).It is mainly by making
It is made of the exposure mask ontology and exposure mask sheet frame of corresponding OLED luminous pattern.Because of demand of the people to display quality, it is desirable that aobvious
Show high-resolution, high-end display requires that resolution ratio accomplishes 500PPI or more, this requires that sub-pixel on a display screen must
It must accomplish very little, reach that 10um is even more small, require to require opening very to the mask plate being applied to especially FMM accordingly
Small, thickness very thin (within 25um) is just able to satisfy the production requirement of high-resolution OLED, and the production for greatly increasing FMM is difficult
Degree and yield.The effect of exposure mask sheet frame is the transport transmission for fixing exposure mask ontology and cooperation in OLED evaporated device, is needed
Want preferable flatness and intensity.With the advanced lines of production line, exposure mask sheet frame is increasing, and single exposure mask sheet frame weight is just
More than 50kg.
Currently, there are mainly two types of methods for the production of mask plate.First is that lithographic method, at ultra-thin (generally 20 ~ 50um)
It is then harsh by exposure development on invar alloy film, it obtains with the full page exposure mask ontology of display pixel corresponding pattern (usually
For small generation line) or exposure mask ontology item (FMM Stick), then exposure mask ontology or exposure mask ontology item are opened by screen-tensioning machine again
Net tenses the mask plate for being welded on and obtaining vacuum evaporation on exposure mask sheet frame.Second is that electrocasting method, passes through exposure on a structure base board
Photodevelopment scheme obtains required pattern corresponding with display pixel, is put into electroforming in electroforming tank and obtains corresponding full page exposure mask sheet
Body (being commonly used in small generation line) or exposure mask ontology item (FMM Stick) then pass through screen-tensioning machine for exposure mask ontology or exposure mask again
Ontology item throw the net tense be welded on exposure mask sheet frame obtain vacuum evaporation mask plate, pass through electrocasting method make exposure mask ontology
It can accomplish thinner, can reach the thickness of 5um.
The production of the mask plate of both the above method requires processing procedure/process by throwing the net and welding, and because of precision
It is required with tension intensity etc., the requirement of these welding equipments of throwing the net is very high, high equipment cost, and the efficiency for welding of throwing the net is very
It is low, it needs multiple devices to be just able to satisfy the requirement of production line, causes equipment investment very big.
In addition, requiring high-precision to align in the process for welding of throwing the net other than needing to spend biggish fund purchase of equipment
It is rationally controlled with to pulling force of throwing the net, slightly misoperation will result in bad, so that high price exposure mask ontology or stick are scrapped, or
Reduce the evaporating quality and yields of OLED luminescent layer.It also will cause throw the net and weld bad and scrap, to directly affect
The effect and quality being deposited to OLED.
And as organic luminescent device size and production line motherboard substrate size are increasing, traditional mask plate is thrown the net weldering
The technology difficulty connect will be bigger, and the welding equipment expense of throwing the net for needing to buy is higher, and the fraction defective for welding of throwing the net can be higher, from
And cause OLED vapor deposition bad higher with cost of manufacture.
Summary of the invention
To solve the above-mentioned problems, the present invention provides a kind of mask plate, including exposure mask sheet frame and it is fixed on exposure mask sheet frame
On exposure mask ontology；Mask pattern is provided on the exposure mask ontology, the mask pattern includes through the exposure mask ontology
Through-hole, the exposure mask ontology and exposure mask sheet frame are electroforming integrated formed structure.
Preferably, the thickness of the exposure mask sheet frame is greater than exposure mask ontology, and the lower surface of the exposure mask ontology is high in height
In the lower surface of exposure mask sheet frame；The upper surface of the exposure mask ontology is plane.
Preferably, there is joint face between the lower surface of the exposure mask ontology and the lower surface of exposure mask sheet frame.
Preferably, the exposure mask ontology includes multiple mask patterns, and support portion is provided between the mask pattern, described
Support zone is in the lower surface of exposure mask ontology.
Preferably, the thickness range of the exposure mask ontology is 0.005mm-0.1mm；The thickness range of the exposure mask sheet frame is
0.07mm-30mm。
The present invention also provides a kind of exposure mask board manufacturing methods, for making mask plate as described above, the production side
Method the following steps are included:
S1: electroforming template is provided；
S2: ablation material layer is formed on the upside of electroforming template；
S3: development is exposed to ablation material layer, forms the graphics field with opening；
S4: the electroforming template with ablation material layer being put into electroforming apparatus and carries out electroforming, forms electroformed layer in electroforming template,
Electroformed layer includes exposure mask ontology and exposure mask sheet frame；
S5: removal ablation material layer；
S6: it will be separated on electroformed layer and electroforming template, obtain mask plate.
Preferably, the upper surface of the electroforming template includes intermediate region, borderline region and join domain；In described
Between region correspond to exposure mask ontology lower surface, the borderline region correspond to exposure mask sheet frame lower surface, the join domain
Shape and the shape of joint face of mask plate match；The intermediate region of the electroforming template is higher than borderline region；In step
In S4, the electroformed layer is formed in the upper surface of the electroforming template.
Preferably, the electroforming apparatus includes electroforming tank, anode, cathode；The electroforming template is placed on conduct on cathode
A part of cathode is provided with the metal material for being used to form electroformed layer on anode；It is provided with masking between a cathode and an anode
Plate；
Multiple excessively electric holes are provided on shield, for passing through power line；Shield is in the region of corresponding exposure mask ontology, phase
The hole gross area in commensurate's area is smaller；Hole total face of the shield in the region of corresponding exposure mask sheet frame, same units area
Product is larger.
Preferably, the excessively electric hole of at least two groups is provided on shield, described two groups excessively electric holes include first group of excessively electric hole
With second group of excessively electric hole；The hole gross area of the described first group excessively electric hole in same units area is greater than described second group excessively electric hole
The hole gross area in same units area；The region of corresponding exposure mask ontology, first group of excessively electric hole is arranged in second group of excessively electric hole
The region of corresponding exposure mask sheet frame is set；First group of excessively electric hole is identical with the aperture in second group of excessively electric hole, first group of excessively electric hole
Distribution density is greater than the distribution density in second group of excessively electric hole.
Preferably, after step s 3 and before S4, one layer of parting-agent layer is formed in electroforming template.
Compared with prior art, the invention has the following beneficial effects:
The exposure mask ontology and exposure mask sheet frame of the application is obtained by electroforming integral forming process, and traditional mask plate system is saved
Throwing the net during work and processing procedure is welded, reduces the enormous investment for welding equipment of throwing the net, thereby reduce the production of mask plate
Cost；Bit errors caused by process of throwing the net are avoided simultaneously and are thrown the net the problems such as not tight, are avoided in welding processing procedure
Caused by it is bad and waste, enhance the mechanical strength of mask plate, improve the production yield and efficiency of mask plate；It has improved
The evaporating quality and yields of machine luminescent material.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of mask plate described in the embodiment of the present invention one；
Fig. 2 is the structural schematic diagram of another mask plate described in the embodiment of the present invention one；
Fig. 3 is a kind of structural schematic diagram of mask plate described in the embodiment of the present invention two；
Fig. 4 is the flow chart of the production method of mask plate described in the embodiment of the present invention three；
Fig. 5 is the corresponding structural schematic diagram of each step in mask plate manufacturing process described in the embodiment of the present invention three；
Fig. 6 is second of structural schematic diagram of electroforming template in the production method of mask plate described in the embodiment of the present invention three；
Fig. 7 is the third structural schematic diagram of electroforming template in the production method of mask plate described in the embodiment of the present invention three；
Fig. 8 is the schematic diagram of electroforming apparatus in the production method of mask plate described in the embodiment of the present invention three；
Fig. 9 is the schematic elevation view of one embodiment of shield in Fig. 6 electroforming apparatus；
Figure 10 is the schematic elevation view of second embodiment of shield in Fig. 6 electroforming apparatus；
Figure 11 is the 4th kind of structural schematic diagram of electroforming template in the production method of mask plate described in the embodiment of the present invention four；
Figure 12 is the schematic elevation view of shield in the production method of mask plate described in the embodiment of the present invention four；
Figure 13 is parting-agent layer and electroforming template, the structure of mask plate in mask plate manufacturing process described in the embodiment of the present invention five
Schematic diagram；
Figure 14 is the schematic diagram of vapor deposition process described in the embodiment of the present invention three.
Appended drawing reference:
1- electroforming template, 11- borderline region, 12- join domain, the intermediate region 13-, 131- groove,
2- ablation material layer, the graphics field 21-, 22- opening, 3- mask plate, 31- exposure mask sheet frame, 32- exposure mask ontology, 301- are covered
The lower surface of membrane body, 302- joint face, the lower surface of 303- exposure mask sheet frame, 304- mask plate upper surface, 321- occlusion part,
322- through-hole, 323- support portion, 4- electroforming apparatus, 41- electroforming tank, 5- anode, 6- cathode, 7- shield, first group of 71- it is excessively electric
The excessively electric hole hole, second group of 72-, 73- third group excessively electric hole, 8- parting-agent layer, 9- evaporation source, 10- glass substrate.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with attached drawing to the present invention make into
It is described in detail to one step, it is clear that described embodiments are only a part of the embodiments of the present invention, rather than whole implementation
Example.Based on the embodiments of the present invention, obtained by those of ordinary skill in the art without making creative efforts
All other embodiment, shall fall within the protection scope of the present invention.
With reference to the accompanying drawings and examples, the invention will be further described:
Embodiment one:
The present invention provides a kind of mask plates, apply in vacuum evaporation process, such as can apply in OLED display panel
In vacuum evaporation process.
As shown in Figure 1, mask plate includes exposure mask sheet frame 31 and the exposure mask ontology 32 that is fixed on exposure mask sheet frame 31；Wherein,
Exposure mask ontology 32 and exposure mask sheet frame 31 are obtained by electroforming integral forming process, and exposure mask ontology 32 and exposure mask sheet frame 31 are electricity
Cast integrated formed structure.It include mask pattern in exposure mask ontology 32, mask pattern includes occlusion part 321 and through-hole 322.Its
In, through-hole 322 runs through exposure mask ontology 32, for allowing organic material deposition to pass through in vapor deposition.
Because of demand of the people to display quality, it is desirable that display of high resolution is required accordingly in OLED vacuum evaporation
Exposure mask body thickness very thin (within 25um) is to meet the production requirement of high-resolution OLED.Because of the need of OLED vacuum evaporation
It wants, it is desirable that exposure mask ontology 32 gets over Bao Yuehao, too thick to be easy to produce shade (shadow) defect in vapor deposition, and too thin then intensity is too
It is weak to be easily damaged.Preferably, the thickness range of exposure mask ontology 32 is between 0.005mm-0.1mm.
The effect of exposure mask sheet frame 31 is mainly used for supporting fixed exposure mask ontology 32, so that mask plate has preferable intensity.
Exposure mask ontology 32 is relatively thin, and 31 thickness of exposure mask sheet frame is thick compared with exposure mask ontology 32 and is located at 1 borderline region 11 of electroforming template.Exposure mask
32 thinner thickness of ontology, lighter in weight is integrated with exposure mask sheet frame 31 by exposure mask ontology 32, can increase exposure mask ontology 32
Stability.
Theoretically the thicker 31 thickness of exposure mask sheet frame the better, and the work for supporting fixed exposure mask ontology 32 is not achieved in too thin intensity
With, but the limitation of electroforming process can not accomplish unconfined thickness.Preferably, the thickness range of exposure mask sheet frame 31 is 0.07mm-
Between 30mm.
In a preferred specific embodiment, the electroforming of exposure mask ontology 32 is with a thickness of 0.02mm, the thickness of exposure mask sheet frame 31
Degree is 20mm.
In the present embodiment, exposure mask ontology 32 is vacantly arranged on exposure mask sheet frame 31, as shown in Figure 1, under exposure mask ontology
Surface 301 is higher than the lower surface 303 of exposure mask sheet frame in height.The lower surface 303 of exposure mask sheet frame is used as in actual application
Placed side, for example, mask plate is placed on pedestal, the lower surface 303 of exposure mask sheet frame is contacted with the upper surface of pedestal, then exposure mask
Plate places into evaporated device together with pedestal.
In evaporation process, 32 upper surface of exposure mask ontology will fit together with glass substrate, therefore on exposure mask ontology 32
Surface is plane, and is required smooth.It should be understood that 31 upper surface of exposure mask sheet frame do not interfere with 32 upper surface of exposure mask ontology with
The fitting of glass substrate, for example, 31 upper surface of exposure mask sheet frame is not higher than 32 upper surface of exposure mask ontology.It is furthermore preferred that exposure mask ontology
32 upper surface is concordant with the upper surface of exposure mask sheet frame 31, and the upper surface of 32 upper surface of exposure mask ontology and exposure mask sheet frame 31 is same
On horizontal plane.
There is joint face 302, joint face between the lower surface 301 of the exposure mask ontology and the lower surface 303 of exposure mask sheet frame
302 for connecting the lower surface 301 of exposure mask ontology in different height with the lower surface 303 of exposure mask sheet frame.Even
Junction 302 can be vertically disposed face as shown in Figure 1, be also possible to the face being obliquely installed as shown in Figure 2 or may be used also
To be curved surface (not shown), it is to be understood that, it is not limited thereto.
Preferably, joint face 302 is the face being obliquely installed as shown in Figure 2, has certain angle with vertical direction, should
Angle is preferably, because of the integrally formed mask plate of electroforming, also to need to be divided with electroforming template 1 after shaping between 5 ~ 30 degree
From being provided with for the angle is conducive to separate mask plate from demoulding in electroforming template 1.
Exposure mask ontology 32 is identical as the material of the exposure mask sheet frame 31, can be metal or is metal alloy compositions.Gold
Belonging to material is, for example, stainless steel or pure nickel.Metal alloy compositions are, for example, invar alloy (Invar), and dilval, nickel cobalt are closed
Gold.
Compared with prior art, the invention has the following beneficial effects:
The exposure mask ontology 32 and exposure mask sheet frame 31 of the application mask plate are obtained by electroforming integral forming process, due to exposure mask
Ontology 32 and exposure mask sheet frame 31 are integrally formed, and are saved in traditional mask plate manufacturing process and are thrown the net and weld processing procedure, reduce
It throws the net the enormous investment of welding equipment, thereby reduces the cost of manufacture of mask plate；It avoids and is made in process of throwing the net simultaneously
At bit errors and throw the net the problems such as not tight, avoid welding processing procedure in caused by it is bad and waste, enhance mask plate
Mechanical strength improves the production yield and efficiency of mask plate；In later period vacuum evaporation luminous organic material, improve organic
The evaporating quality and yields of luminescent material.
Meanwhile can accomplish very thin by the exposure mask ontology 32 that electrocasting method makes, it can reach the thickness of 5um, this is conducive to
Make the OLED product of higher resolution.And other integral forming process, pass through machining or quarter such as in a block of material
Molding mode is lost, or by way of casting, be all difficult to realize satisfactory thin exposure mask ontology 32 simultaneously and make to cover
Membrane body has certain rigidity, in addition, exposure mask sheet frame 31 is also made to have excellent support.
Embodiment two:
This specific embodiment provides a kind of improved mask plate.
The present embodiment mask plate what is different from the first embodiment is that the present embodiment mask plate be suitable for vapor deposition process in it is big
Plate production.In OLED production process, more granule products can be arranged in one big plate, have non-display area between every OLED product
Domain (area dummy), this region is wider.As shown in figure 3, multiple mask patterns are provided on mask plate, multiple mask patterns
Quantity corresponds to the quantity of more OLED products.Between multiple mask patterns of exposure mask ontology 32, it is provided with support portion 323,
The position of the support portion 323 is arranged corresponding to non-display area (area dummy).And the support portion 323 is located under exposure mask ontology
Surface 301.
The support portion 323 can be used as the Auxiliary support of exposure mask ontology 32, and the exposure mask ontology 32 of such display area can be done
It is thinner, and the exposure mask ontology 32 the thin more is conducive to do high-resolution OLED product.
The support portion 323 can be electroforming hassock or support bar.Preferably, support portion 323 is support bar structure.
Embodiment three:
This specific embodiment provides the production method of mask plate described in embodiment one, production method the following steps are included:
It is illustrated in figure 4 the manufacturing process schematic diagram of mask plate,
Step S1: electroforming template 1 is provided.
As shown in Figure 5 a, the upper surface of electroforming template 1 includes intermediate region 13, borderline region 11, Yi Jiwei to electroforming template 1
Join domain 12 between intermediate region 13 and borderline region 11.
Intermediate region 13 corresponds to the lower surface 301 of exposure mask ontology, and borderline region 11 corresponds to the lower surface of exposure mask sheet frame
303.The shape of the joint face 302 of the shape and mask plate of join domain 12 matches.The intermediate region 13 of electroforming template 1 is higher than
Borderline region 11, the height being specifically higher by according to exposure mask sheet frame lower surface 303 to exposure mask ontology lower surface 301 distance and
It is fixed.
The upper surface of electroforming template 1 is the forming face of mask plate, and the underside shape of electroforming template 1 is unlimited.It is preferred that
, the lower surface of electroforming template 1 is generally plane, as shown in Figure 5 a.It the lower surface of electroforming template 1 can be with material reducing, so that electroforming
The uniform wall thickness of template 1.
Alternatively, material reducing is not made in the lower surface of electroforming template 1, the structure of electroforming template 1 is as shown in Figure 6.The system of electroforming template 1
Slab can be used, and carry out material reducing in the position for corresponding to mask plate borderline region 11.Alternatively, electroforming template 1 can be used two
Block plate is spliced, and does not have to abnormity processing electroforming template 1 in this way.The connecting method of two boards can be buckle, lock or welding
Etc. modes.
When the structure of mask plate is as shown in Figure 2, the structure of corresponding electroforming template 1 is as shown in fig. 7, join domain 12
Shape for inclined-plane, the joint face 302 of the shape and mask plate of join domain 12 matches.
The material of electroforming template 1 can be stainless steel plate, pure metal plate or other materials.
Step S2: ablation material layer 2 is formed on the upside of electroforming template 1, as shown in Figure 5 b.
Ablation material layer 2 can be realized by way of pasting dry film；Or ablation material layer 2 can also use photoetching peptization instead
Liquid forms film in electroforming template 1 using spraying, roller coating or spin coating mode.Photoresist solution is, for example, light sensitivity Asia Gree or gathers
The materials such as acid imide.Ablation material layer 2 is located at 1 intermediate region 13 of electroforming template.
Step S3: exposure development.
As shown in Figure 5 c, development is exposed to the ablation material layer 2, forms the graphics field 21 with opening 22.Figure
The pattern form in shape region 21 is corresponding with the pattern form of through-hole 322 of exposure mask ontology 32.
Step S4: electroforming process.
As fig 5d, the electroforming template 1 with ablation material layer 2 is put into electroforming apparatus 4 as shown in Figure 8, it is described
Electroforming apparatus includes electroforming tank 41, anode 5, cathode 6 and shield 7, carries out electroforming.It is not melted in 1 upper surface of electroforming template
The region of 2 graphics field 21 of material layer covering, forms electroformed layer, electroformed layer includes simultaneously exposure mask ontology 32 and exposure mask sheet frame 31.
In the position for corresponding to ablation 2 graphics field 21 of material layer, exposure mask ontology 32 forms through-hole 322.Through-hole 322 is for being deposited
In allow organic material deposition pass through.
The intermediate region 13 of 1 upper surface of electroforming template and the lower surface 301 of exposure mask ontology are corresponding.Table in electroforming template 1
The borderline region 11 in face and the lower surface 303 of exposure mask sheet frame are corresponding.The joint face 302 of mask plate and the connection of electroforming template 1
Region 12 is corresponding.
Cathode 6 and anode 5 are provided in electroforming tank 41, electroforming template 1 is placed on a part on cathode 6 as cathode 6,
The metal material for being used to form electroformed layer is provided on anode 5, it is preferable that for stainless steel or metal or metal alloy.
Since exposure mask ontology 32 is relatively thin, and exposure mask sheet frame 31 is thicker, in order to how electroforming film thickness, in cathode 6 and anode 5
Between be provided with shield 7.The position that shield 7 corresponds to electroforming template 1 is configured.
The embodiment that shield 7 designs:
Multiple excessively electric holes are provided on shield 7, for passing through power line.Relative to by electroforming at mask plate 3, masking
The hole gross area of the plate 7 in the region of corresponding exposure mask ontology 32, same units area is smaller；And shield 7 is in corresponding mask plate
The region of frame 31, the hole gross area in same units area are larger.In the different zones of the corresponding mask plate of shield 7, the total face in hole
Product (in same area) of different sizes, thus make by the density of electric fluxline it is different.The hole gross area is bigger, and power line (indicates
The illusory directing curve race of field distribution) density is bigger, and the electroformed layer thickness of corresponding region is just different.
For example, one embodiment as shield design, as shown in figure 9, shield 7 is in corresponding exposure mask ontology 32
Region corresponds to 1 intermediate region 13 of electroforming template, be provided with second group of excessively electric hole 72.And shield 7 is in corresponding exposure mask sheet frame
31 region corresponds to the borderline region 11 of electroforming template 1, be provided with first group of excessively electric hole 71.Wherein, first group of excessively electric hole
71 is identical with the aperture in second group of excessively electric hole 72, and still, in comparison, the distribution density in first group of excessively electric hole 71 is larger, the
The distribution density in two groups of excessively electric holes 72 is smaller.In this way, in same units area, the hole gross area in first group of excessively electric hole 71 compared with
Greatly.Therefore the electroformed layer wall thickness that exposure mask sheet frame 31 obtains is thicker.It should be understood that first group of excessively electric hole 71 and second group of excessively electric hole
72 are evenly distributed respectively, to guarantee the uniformity of electroformed layer wall thickness.
For example, second embodiment as shield design, as shown in Figure 10, first implementation with shield design
Unlike example, in second embodiment, the aperture in first group of excessively electric hole 71 is greater than the aperture in second group of excessively electric hole 72.In electroforming
In the process, since in same units area, the gross area in first group of excessively electric hole 71 is greater than the gross area in second group of excessively electric hole 72, because
This power line (the illusory directing curve race for indicating field distribution) will be more by first group of excessively electric hole 71.Make first group
The position of 1 borderline region 11 of electroforming template corresponding to electric hole 71 is crossed, the thickness of electroformed layer will be thicker than second group of mistake significantly
The position of 1 intermediate region 13 of electroforming template corresponding to electric hole 72.
By the way that size and number different excessively electric hole in aperture is arranged on shield, point for adjusting electroforming power line can be used to
Cloth, so that control is corresponding to required electroforming film thickness in electroforming template 1.The position in the excessively electric hole of each group is in electroforming template 1
Electroforming film needed for thickness distribution.
Design in addition to adjusting the hole on shield, can also be reached by way of other adjusting electroforming electric force lines distributions
Control the purpose of the electroforming different-thickness in same electroforming template 1.
During electroforming, the speed of electroforming is controlled by subregion, it is real under the requirement for reaching mask plate required thickness
32 upper surface of exposure mask ontology of existing electroforming is plane, can be guaranteed in evaporation process, 32 upper surface of exposure mask ontology is with glass base
Plate, which fits together, to be deposited, and can terminate to be electroplated after reaching certain thickness.Inventor has found exposure mask ontology in fact
Even if upper surface is also possible not on same surface with exposure mask sheet frame upper surface, having drop is also that can be used, as long as that is,
Guarantee the smooth of exposure mask body upper surface surface, it is ensured that there is no problem with the fitting of base plate glass.
It, can be in the upper table for 32 upper surface of exposure mask ontology and exposure mask sheet frame 31 for realizing electroforming as more preferred scheme
After face is in same level, then terminate electroforming.
Step S5: demoulding.
As depicted in fig. 5e, it carries out demoulding technique and removes ablation material layer 2.
Ablation material layer 2 can be removed by modes such as plasma etching, laser ablation, dipping by lye.
Step S5: separation.
It will be separated on electroformed layer and electroforming template 1, obtain exposure mask ontology 32 and the integrally formed mask plate of exposure mask sheet frame 31,
As shown in Figure 1.For example, mask plate can be made to separate from electroforming template 1 by demoulding method of expanding with heat and contract with cold, demoulding method is this field
Therefore technical staff is it is known that repeat no more.
It include mask pattern in exposure mask ontology 32.Mask pattern includes occlusion part 321 and through-hole 322, the through-hole 322
Through the exposure mask ontology 32, for allowing organic material deposition to pass through in vapor deposition.
Mask plate is in evaporation process, and as shown in figure 14, mask plate upper surface 304 will be fitted tightly over glass substrate 10
Together, therefore the level requirements of mask plate upper surface 304 are higher.It is used in actual evaporation process exposure mask sheet frame lower surface 303
Make placed side, for example, mask plate is placed on pedestal, exposure mask sheet frame lower surface 303 is contacted with the surface of pedestal, then mask plate
It is placed into evaporated device together with pedestal.The organic material of 9 heating sublimation of evaporation source penetrates the through-hole 322 on mask plate to glass
Pixel deposition pattern on glass substrate 10.
During the present embodiment electroforming, the speed of electroforming is controlled by subregion, is reaching mask plate required thickness
Under it is required that, the upper surface of 32 upper surface of exposure mask ontology and exposure mask sheet frame 31 of realizing electroforming makes mask plate in same level
Upper surface 304 is plane, terminates electroforming.
In general, mask plate upper surface 304 can be made to realize more flat plane as long as electroforming velocity slows down as long as back.For
More smooth mask plate upper surface is obtained, secondary operation can be carried out after electroforming and polishes etc..
Example IV: this specific embodiment provides the production method of mask plate described in embodiment two, and mask plate is applicable in
Big plate production in vapor deposition process.Multiple mask patterns are provided on mask plate, the quantity of multiple mask patterns corresponds to
The quantity of more OLED products.Between multiple mask patterns of exposure mask ontology 32, it is provided with support portion 323.
Unlike the production method of embodiment three, in the present embodiment:
The electroforming template 1 that step S1 is provided, as shown in figure 11, in 323 position of support portion for corresponding to exposure mask ontology 32, electroformed mould
The corresponding groove 131 in position is provided on plate 1.
The shield 7 provided in step S4 electroforming process, in 323 position of support portion for corresponding to exposure mask ontology 32, exposure mask
The thickness of ontology 32 increased.Therefore, the branch of exposure mask ontology 32 can be corresponded in shield 7 according to the method for embodiment three
323 position of support part increases the hole gross area in same units area, so that the distribution of electroforming power line herein is adjusted, to control
System electroforming film thickness needed for corresponding position in electroforming template 1.Specifically, the excessively electric hole 73 of settable third group, principle can join
Embodiment three is examined, details are not described herein.
Embodiment five:
This specific embodiment proposes improvement to embodiment three.
Unlike the production method of embodiment three, demoulding is improved in the present embodiment.For the ease of demoulding:
After step S3 exposure development, before step electroforming process S4, one layer of remover is formed in the upper surface of electroforming template 1
Layer 8.Parting-agent layer 8 and the structural schematic diagram of electroforming template 1, mask plate 3 are as shown in figure 13.
The material of parting-agent layer 8 is graphite powder, chromate, sulfide or terne metal etc..Parting-agent layer 8 with a thickness of
0.5~1.0 micron.
Compared with prior art, the invention has the following beneficial effects:
The exposure mask ontology 32 and exposure mask sheet frame 31 of the application mask plate 3 are obtained by electroforming integral forming process, due to covering
Membrane body 32 and exposure mask sheet frame 31 are integrally formed, and are saved in traditional mask plate manufacturing process and are thrown the net and weld processing procedure, reduce
The enormous investment of welding equipment of throwing the net, thereby reduces the cost of manufacture of mask plate；It avoids in process of throwing the net simultaneously
Caused by bit errors and throw the net the problems such as not tight, bad caused by avoiding in welding processing procedure and waste enhances mask plate
Mechanical strength, improve the production yield and efficiency of mask plate；In later period vacuum evaporation luminous organic material, improve
The evaporating quality and yields of machine luminescent material.
Meanwhile can accomplish very thin by the exposure mask ontology 32 that electrocasting method makes, it can reach the thickness of 5um, this is conducive to
Make the OLED product of higher resolution.And other integral forming process, pass through machining or erosion such as in a block of material
Molding mode is carved, or by way of casting, be all difficult to realize satisfactory thin exposure mask ontology 32 simultaneously and make to cover
Membrane body has certain rigidity, in addition, exposure mask sheet frame 31 is also made to have excellent support.
Finally, it should be noted that above embodiments be only to illustrate the technical solution of the embodiment of the present invention rather than to its into
Row limitation, although the embodiment of the present invention is described in detail referring to preferred embodiment, those skilled in the art
It should be understood that the technical solution of the embodiment of the present invention can be still modified or replaced equivalently, and these are modified or wait
The range of modified technical solution disengaging technical solution of the embodiment of the present invention cannot also be made with replacement.
Claims (10)
1. a kind of mask plate, including exposure mask sheet frame and the exposure mask ontology being fixed on exposure mask sheet frame；It is characterized in that, the exposure mask
Be provided with mask pattern on ontology, the mask pattern includes the through-hole through the exposure mask ontology, the exposure mask ontology with cover
Diaphragm plate frame is electroforming integrated formed structure.
2. mask plate according to claim 1, which is characterized in that the thickness of the exposure mask sheet frame is greater than exposure mask ontology, institute
The lower surface for stating exposure mask ontology is higher than the lower surface of exposure mask sheet frame in height；The upper surface of the exposure mask ontology is plane.
3. mask plate according to claim 2, which is characterized in that under the lower surface of the exposure mask ontology and exposure mask sheet frame
There is joint face between surface.
4. mask plate according to claim 1, which is characterized in that the exposure mask ontology includes multiple mask patterns, described
Support portion is provided between mask pattern, the support zone is in the lower surface of exposure mask ontology.
5. mask plate according to claim 2, which is characterized in that the thickness range of the exposure mask ontology is 0.005mm-
0.1mm；The thickness range of the exposure mask sheet frame is 0.07mm-30mm.
6. a kind of exposure mask board manufacturing method, which is characterized in that for making mask plate described in claim 1-5 any one,
The production method the following steps are included:
S1: electroforming template is provided；
S2: ablation material layer is formed on the upside of electroforming template；
S3: development is exposed to ablation material layer, forms the graphics field with opening；
S4: the electroforming template with ablation material layer being put into electroforming apparatus and carries out electroforming, forms electroformed layer in electroforming template,
Electroformed layer includes exposure mask ontology and exposure mask sheet frame；
S5: removal ablation material layer；
S6: electroformed layer is separated with electroforming template, obtains mask plate.
7. exposure mask board manufacturing method according to claim 6, which is characterized in that during the upper surface of the electroforming template includes
Between region, borderline region and join domain；The intermediate region corresponds to the lower surface of exposure mask ontology, the borderline region
Corresponding to the lower surface of exposure mask sheet frame, the shape of the joint face of the shape and mask plate of the join domain matches；The electricity
The intermediate region of mold plate is higher than borderline region；In step s 4, the electroformed layer is formed in the upper surface of the electroforming template.
8. exposure mask board manufacturing method according to claim 6, which is characterized in that the electroforming apparatus includes electroforming tank, sun
Pole, cathode；The electroforming template is placed on a part on cathode as cathode, is provided on anode and is used to form electroformed layer
Metal material；It is provided with shield between a cathode and an anode；
Multiple excessively electric holes are provided on shield, for passing through power line；Shield is in the region of corresponding exposure mask ontology, phase
The hole gross area in commensurate's area is smaller；Hole total face of the shield in the region of corresponding exposure mask sheet frame, same units area
Product is larger.
9. exposure mask board manufacturing method according to claim 8, which is characterized in that be provided at least two groups mistake on shield
Electric hole, described two groups excessively electric holes include first group of excessively electric hole and second group of excessively electric hole；Described first group excessively electric hole is in same units
The hole gross area in area is greater than the hole gross area of the described second group excessively electric hole in same units area；
The region of corresponding exposure mask ontology is arranged in second group of excessively electric hole, and the area of corresponding exposure mask sheet frame is arranged in first group of excessively electric hole
Domain；First group of excessively electric hole is identical with the aperture in second group of excessively electric hole, and the distribution density in first group of excessively electric hole is excessively electric greater than second group
The distribution density in hole.
10. exposure mask board manufacturing method according to claim 6, which is characterized in that after step s 3 and before S4, in electricity
One layer of parting-agent layer is formed in mold plate.
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| CN201910452518.1A CN110273124A (en) | 2019-05-28 | 2019-05-28 | A kind of mask plate and preparation method thereof |
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| CN112725729A (en) * | 2020-12-29 | 2021-04-30 | 天津市滨海新区微电子研究院 | Method for manufacturing color silicon-based OLED micro-display and mask plate |
| CN114032497A (en) * | 2021-07-30 | 2022-02-11 | 达运精密工业股份有限公司 | Metal mask manufacturing method and metal mask |
| CN114032497B (en) * | 2021-07-30 | 2023-05-05 | 达运精密工业股份有限公司 | Method for manufacturing metal mask and metal mask |
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Application publication date: 20190924 |