KR101986524B1 - Producing method of mask integrated frame - Google Patents

Abstract

The present invention relates to a method for manufacturing a frame-integrated mask, to remarkably reduce the manufacturing time. According to the present invention, a method for manufacturing a frame-integrated mask integrally forming at least one mask (100) and a frame (200) supporting the mask (100) comprises the following steps: (a) providing a frame (200) including at least one cell mask region (CR); (b) attaching the mask (100) on a tray (50); (c) loading the tray (50) on the frame (200) to correspond the mask (100) to the mask cell region (CR) of the frame (200); and (d) bonding the frame (200) to at least a part of an edge of the mask (100). In the step (b), the mask (100) is attached to the tray (50) while being flatly spread by using a spreading means (60: 61, 63, 65, 67).

Description

TECHNICAL FIELD [0001] The present invention relates to a method of manufacturing a frame-

The present invention relates to a method of manufacturing a frame-integrated mask. More specifically, the present invention relates to a method of manufacturing a frame-integrated mask capable of making a mask integral with a frame, and making alignment between the masks clear.

Recently, electroforming methods have been studied in the manufacture of thin plates. In the electroplating method, an anode body and a cathode body are immersed in an electrolytic solution, and a power source is applied to electrodeposit a metal thin plate on the surface of the cathode body, so that an ultra thin plate can be manufactured and mass production can be expected.

On the other hand, FMM (Fine Metal Mask) method for depositing an organic material at a desired position by bringing a thin film metal mask (Shadow Mask) into close contact with a substrate is mainly used as a technique of forming a pixel in an OLED manufacturing process.

In a conventional OLED manufacturing process, a mask is formed in a stick shape or a plate shape, and then a mask is welded and fixed to an OLED pixel deposition frame. One mask may include several cells corresponding to one display. In addition, several masks can be fixed to the OLED pixel deposition frame for the manufacture of a large area OLED. In the process of fixing to the frame, each mask is stretched so as to be flat. Adjusting the tensile force so that the entire portion of the mask is flat is a very difficult task. Particularly, in order to align a mask pattern having a size of several to several tens of micrometers while flattening each of the cells, it is necessary to perform a high level operation to check the alignment state in real time while finely adjusting the tensile force applied to each side of the mask do.

Nevertheless, there has been a problem in that, in fixing the plurality of masks to one frame, alignment between the masks and between the mask cells is not good. Further, in the process of welding and fixing the mask to the frame, there is a problem that the thickness of the mask film is too thin and the mask is warped due to the load.

In the case of ultra-high quality OLED, QHD image quality is 500 ~ 600 PPI (pixel per inch), pixel size is about 30 ~ 50㎛, 4K UHD and 8K UHD high image quality are higher ~ 860 PPI, ~ 1600 PPI Resolution. Considering the pixel size of the ultra-high-resolution OLED, the alignment error between each cell must be reduced to about several micrometers, and the deviation from the OLED can lead to a product failure, resulting in a very low yield. Therefore, it is necessary to develop techniques for preventing deformation such as masking and twisting, clarifying alignment, fixing the mask to the frame, and the like.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method of manufacturing a frame-integrated mask in which a mask and a frame can have an integrated structure.

It is another object of the present invention to provide a method of manufacturing a frame-integrated mask capable of preventing deformation such as warping or twisting of the mask and clarifying alignment.

Another object of the present invention is to provide a method for manufacturing a frame-integrated mask in which the production time is significantly reduced and the yield is remarkably increased.

The above object of the present invention can be also achieved by a method of manufacturing a frame-integrated mask in which at least one mask and a frame supporting the mask are integrally formed, the method comprising: (a) providing a frame having at least one mask cell region; (b) attaching a mask on the tray; (c) loading a tray on the frame to correspond to a mask cell region of the frame; And (d) adhering at least a part of the rim of the mask to the frame, wherein in the step (b), the mask is flatly spread on the tray using the spreading means, Lt; / RTI >

(a) comprises the steps of: (a1) providing a frame frame portion including a hollow region; And (a2) connecting the mask cell sheet portion having at least one mask cell region to the rim frame portion to manufacture a frame.

(a) comprises the steps of: (a1) providing a frame frame portion including a hollow region; (a2) plane mask cell sheet portion to a rim frame portion; And (a3) forming at least one mask cell region in the mask cell sheet portion to produce a frame.

(d) may be a step of bonding at least a part of the rim of the mask to the mask cell sheet portion to adhere the mask to the frame.

(B) loading the mask onto a tray; (b1) loading the mask onto a tray; (b2) rubbing the entire substrate against at least one of a tray and a mask to induce static electricity; And (b3) spreading the mask flat onto the tray.

(B1) loading the mask onto a tray; (b2) removing the mask from the tray; and (c) removing the mask from the tray. (b2) applying a voltage to the transparent electrode and the electrode to induce static electricity; And (b3) spreading the mask flat onto the tray.

The expanding means comprises a plurality of magnets, (b) comprising: (b1) loading the mask onto a tray; (b2) disposing a stationary magnet on at least one of the one side and the other side of the mask on the other side of the tray on which the mask is loaded, and fixing the mask by applying a magnetic force thereto; And (b3) a step of flatly spreading the mask while moving the expanding magnet from one side of the mask to the other side, and attaching the mask on the tray.

(B) loading (b1) a mask onto a tray; (b2) disposing a fixed vacuum in at least one of the one side and the other side of the mask, and fixing the mask by applying suction pressure; And (b3) a step of flatly spreading the mask and attaching it onto the tray while moving the spreading work from one side of the mask to the other side.

The tray may have a flat plate shape and may include a material through which laser light is transmitted.

The mask can be bonded to the frame by laser welding, which irradiates the laser at the top of the tray.

The temperature of the process region including the frame is raised to the first temperature before or after the mask corresponds to the mask cell region and the temperature of the process region including the frame is set to the second temperature . ≪ / RTI >

The first temperature may be equal to or higher than the OLED pixel deposition process temperature, and the second temperature may be at least lower than the first temperature.

The first temperature is any one of 25 ° C to 60 ° C and the second temperature is any one of 20 ° C to 30 ° C lower than the first temperature and the OLED pixel deposition process temperature is 25 ° C to 45 ° C It may be one temperature.

When the mask corresponds to the mask cell region, it is possible not to apply tension to the mask.

The mask cell sheet portion may include a plurality of mask cell regions along at least one of a first direction and a second direction perpendicular to the first direction.

The mask cell sheet portion includes a border sheet portion; And at least one first grid sheet portion extending in the first direction and having both ends connected to the border sheet portion.

The mask cell sheet portion may further include at least one second grid sheet portion extending in a second direction perpendicular to the first direction and intersecting the first grid sheet portion and having both ends connected to the border sheet portion.

Each mask cell area may correspond to each mask.

The mask includes one mask cell, and one mask cell can be located in one mask cell area.

The mask includes a plurality of mask cells, and the plurality of mask cells can be located in one mask cell area.

The mask and the frame may be made of any one of invar, super invar, nickel, and nickel-cobalt.

The pixel position accuracy (PPA) between a mask adhered to one mask cell region and a mask adhered to an adjacent mask cell region may not exceed 3 mu m.

According to the present invention configured as described above, there is an effect that the mask and the frame can have an integrated structure.

Further, according to the present invention, it is possible to prevent deformation such as warping or twisting of the mask and to make alignment clear.

Further, according to the present invention, the production time can be remarkably reduced and the yield can be remarkably increased.

1 is a schematic view showing a conventional OLED pixel deposition mask.
2 is a schematic view showing a process of bonding a conventional mask to a frame.
FIG. 3 is a schematic view showing an alignment error between cells in a process of stretching a conventional mask. FIG.
4 is a front view and a side sectional view showing a frame-integrated mask according to an embodiment of the present invention.
5 is a front view and a side sectional view showing a frame according to an embodiment of the present invention.
6 is a schematic view illustrating a process of manufacturing a frame according to an embodiment of the present invention.
7 is a schematic view showing a manufacturing process of a frame according to another embodiment of the present invention.
8 is a schematic view showing the shape of a mask according to an embodiment of the present invention and a state in which a mask is mounted on a tray.
9 is a schematic view showing a process of attaching a mask on a tray according to a comparative example (Fig. 9 (a)) and an embodiment of the present invention (Fig. 9 (b)
10-13 are schematic diagrams illustrating a method of attaching a mask on a tray using an unfolding means according to various embodiments of the present invention.
FIG. 14 is a schematic view showing a state in which a tray is loaded on a frame to correspond to a cell region of a frame according to an embodiment of the present invention. FIG.
15 is a schematic view showing a process of adhering a mask to a cell region of a frame according to an embodiment of the present invention.
16 is a schematic view showing a process of sequentially adhering a mask to a cell region according to an embodiment of the present invention.
17 is a schematic view illustrating a process of lowering a temperature of a process region after a mask is bonded to a cell region of a frame according to an embodiment of the present invention.
18 is a schematic view showing an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.

The following detailed description of the invention refers to the accompanying drawings, which illustrate, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are different, but need not be mutually exclusive. For example, certain features, structures, and characteristics described herein may be implemented in other embodiments without departing from the spirit and scope of the invention in connection with an embodiment. It is also to be understood that the position or arrangement of the individual components within each disclosed embodiment may be varied without departing from the spirit and scope of the invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is to be limited only by the appended claims, along with the full scope of equivalents to which such claims are entitled, if properly explained. In the drawings, like reference numerals refer to the same or similar functions throughout the several views, and length and area, thickness, and the like may be exaggerated for convenience.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art can easily carry out the present invention.

1 is a schematic view showing a conventional OLED pixel deposition mask 10;

Referring to FIG. 1, the conventional mask 10 may be made of a stick-type or a plate-type. The mask 10 shown in Fig. 1 (a) is a stick-shaped mask, and both sides of the stick can be welded and fixed to the OLED pixel deposition frame. The mask 100 shown in FIG. 1 (b) is a plate-type mask and can be used in a pixel forming process with a large area.

A plurality of display cells C are provided in the body (or mask film 11) of the mask 10. One cell C corresponds to one display such as a smart phone. In the cell C, a pixel pattern P is formed so as to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B are displayed. For example, a pixel pattern P is formed in the cell C so as to have a resolution of 70 X 140. That is, a large number of pixel patterns P constitute one cell C in a cluster, and a plurality of cells C can be formed in the mask 10. [

2 is a schematic view showing a process of bonding a conventional mask 10 to a frame 20. Fig. FIG. 3 is a schematic view showing that an alignment error occurs between cells in a process of stretching (F1 to F2) a conventional mask 10. A stick mask 10 having six cells C: C1 to C6 shown in FIG. 1 (a) will be described as an example.

Referring to FIG. 2 (a), first, the stick mask 10 should be flattened. Tensile forces F1 to F2 are applied in the longitudinal direction of the stick mask 10 and the stick mask 10 is stretched according to the pulling. In this state, the stick mask 10 is loaded on the frame 20 in a rectangular frame shape. The cells C 1 to C 6 of the stick mask 10 are located in the hollow space portion of the frame 20. The frame 20 may be of a size such that the cells C1 to C6 of one stick mask 10 are located in the hollow space of the frame and the cells C1 to C6 of the plurality of stick masks 10 Or may be of a size large enough to be located in the inner hollow area.

2 (b), after aligning while slightly adjusting the tensile force F1 to F2 applied to each side of the stick mask 10, a part of the side surface of the stick mask 10 is welded The stick mask 10 and the frame 20 are interconnected. 2 (c) shows a cross-sectional side view of the frame and the stick mask 10 connected to each other.

Referring to FIG. 3, although the tensile forces F1 to F2 applied to the respective sides of the stick mask 10 are finely adjusted, the alignment of the mask cells C1 to C3 does not work well. For example, the distances D1 to D1 ", D2 to D2 "between the patterns P of the cells C1 to C3 are different from each other, or the patterns P are skewed. The stick mask 10 is large in size including a plurality of (for example, six) cells C1 to C6, and has a very thin thickness on the order of several tens of micrometers, so that it is easily struck or warped by a load. In addition, it is a very difficult task to check the alignment state between the cells C1 to C6 in real time through a microscope while adjusting the tensile forces F1 to F2 to flatten each of the cells C1 to C6.

Therefore, the minute errors of the tensile forces F1 to F2 can cause an error in the extent to which the cells C1 to C3 of the stick mask 10 are elongated or extended, To D1 ", D2 to D2 ") are different from each other. Of course, it is difficult to arrange the mask pattern P so that the error is completely zero. However, in order to prevent the mask pattern P having a size of several to several tens of micrometers from adversely affecting the pixel process of the ultra high definition OLED, . The alignment error between adjacent cells is referred to as pixel position accuracy (PPA).

In addition to this, a plurality of stick masks 10 of about 6 to 20 are connected to one frame 20, respectively, and a plurality of stick masks 10 and a plurality of cells C It is also a very difficult task to clarify the alignment state between the substrates C6 to C6 and the process time due to the alignment is inevitably increased, which is a significant reason for reducing the productivity.

On the other hand, after the stick mask 10 is connected and fixed to the frame 20, the tensile forces F1 to F2 applied to the stick mask 10 can be applied to the frame 20 in reverse. That is, the stick mask 10, which has been stretched by the tensile forces F1 to F2, can be tensioned on the frame 20 after it is connected to the frame 20. Normally, this tension is not great and the frame 20 may not have a large influence. However, when the size of the frame 20 is reduced and the rigidity is lowered, such a tension can finely deform the frame 20. Thus, there may arise a problem that the alignment state is changed between a plurality of cells C to C6.

Accordingly, the present invention proposes a frame 200 and a frame-integrated mask that allow the mask 100 to have an integral structure with the frame 200. The mask 100 formed integrally with the frame 200 is prevented from being deformed such as striking or twisting and can be clearly aligned with the frame 200. [ Since the mask 100 does not apply any tensile force to the frame 200 when the mask 100 is connected to the frame 200, it may not apply enough tension to deform the frame 200 after the mask 100 is connected to the frame 200 . Further, the manufacturing time for integrally connecting the mask 100 to the frame 200 can be remarkably reduced, and the yield can be remarkably increased.

FIG. 4 is a front view (FIG. 4A) and a side sectional view (FIG. 4B) showing a frame-integrated mask according to an embodiment of the present invention, (A) and a side sectional view (Fig. 5 (b)) showing a frame.

Referring to FIGS. 4 and 5, the frame-integrated mask may include a plurality of masks 100 and one frame 200. In other words, a plurality of masks 100 are attached to the frame 200 one by one. Hereinafter, a square type mask 100 will be described as an example for convenience of explanation, but the masks 100 may be in the form of a stick mask having projections that are clamped on both sides before being bonded to the frame 200, The protrusions can be removed.

A plurality of mask patterns P are formed in each of the masks 100, and one cell C may be formed in one of the masks 100. One mask cell C may correspond to one display such as a smart phone. The mask 100 may be formed by electroforming so that it can be formed in a thin thickness. The mask 100 may be a super invar material having a thermal expansion coefficient of about 1.0 X 10 < ^-6 > / DEG C and an invar, about 1.0 X 10 < ^-7 > / DEG C. Since the mask 100 of this material has a very low thermal expansion coefficient, there is little possibility that the pattern shape of the mask is deformed by heat energy, and thus it can be used as FMM (Fine Metal Mask) and shadow mask in manufacturing high resolution OLED. In consideration of the development of techniques for performing the pixel deposition process in a range in which the temperature change value is not large recently, the mask 100 may be formed of nickel (Ni), nickel-cobalt ) Or the like. The thickness of the mask may be about 2 to 50 mu m.

The frame 200 is formed so as to adhere a plurality of masks 100 thereto. The frame 200 may include a plurality of edges formed in a first direction (e.g., a horizontal direction) and a second direction (e.g., a vertical direction) including an outermost border. These various edges may define a region on the frame 200 where the mask 100 is to be adhered.

The frame 200 may include a frame portion 210 having a substantially rectangular shape and a rectangular frame shape. The inside of the frame part 210 may be hollow. That is, the frame frame part 210 may include a hollow area R. [ The frame 200 may be made of a metal such as invar, super invar, aluminum, titanium, or the like, and may be made of a material such as Invar, Super Invar, Nickel, or Nickel-Cobalt having the same thermal expansion coefficient as that of the mask And these materials may be applied to both the frame part 210 and the mask cell part 220, which are components of the frame 200.

In addition, the frame 200 may include a mask cell sheet portion 220 having a plurality of mask cell regions CR and connected to the frame frame portion 210. The mask cell sheet portion 220 may be formed by electroplating as in the case of the mask 100, or may be formed using another film forming process. The mask cell sheet portion 220 may be connected to the frame portion 210 after forming a plurality of mask cell regions CR on a flat sheet by laser scribing, etching, or the like. Alternatively, the mask cell sheet portion 220 may be formed by connecting a flat sheet to the frame portion 210, and then forming a plurality of mask cell regions CR by laser scribing, etching, or the like. In this specification, it is assumed that a plurality of mask cell regions CR are first formed in the mask cell sheet portion 220 and then connected to the frame portion 210.

The mask cell sheet portion 220 may include at least one of a border sheet portion 221 and first and second grid sheet portions 223 and 225. The border sheet portion 221 and the first and second grid sheet portions 223 and 225 refer to respective portions partitioned by the same sheet, and they are integrally formed with each other.

The frame sheet portion 221 can be substantially connected to the frame frame portion 210. [ Accordingly, the frame sheet portion 221 may have a substantially rectangular shape corresponding to the frame portion 210 and a rectangular frame shape.

In addition, the first grid sheet portion 223 may be extended in the first direction (horizontal direction). The first grid sheet portion 223 may be formed in a straight line shape so that both ends of the first grid sheet portion 223 may be connected to the border sheet portion 221. When the mask cell sheet portion 220 includes a plurality of first grid sheet portions 223, it is preferable that the respective first grid sheet portions 223 are equally spaced.

In addition, in addition, the second grid sheet portion 225 can be extended in the second direction (longitudinal direction). The second grid sheet portion 225 may be formed in a straight line shape, and both ends thereof may be connected to the border sheet portion 221. The first grid sheet portion 223 and the second grid sheet portion 225 may be perpendicularly intersected with each other. When the mask cell sheet portion 220 includes a plurality of the second grid sheet portions 225, it is preferable that the respective second grid sheet portions 225 are equally spaced.

The space between the first grid sheet portions 223 and the space between the second grid sheet portions 225 may be the same or different depending on the size of the mask cell C. [

Although the first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, the shape of the cross section perpendicular to the longitudinal direction may be a rectangular shape such as a parallelogram or a quadrangle shape, , Sides, and corners may be rounded. The cross-sectional shape can be adjusted in the course of laser scribing, etching, and the like.

The thickness of the rim frame portion 210 may be thicker than the thickness of the mask cell sheet portion 220. The frame part 210 may be formed to have a thickness ranging from several millimeters to several centimeters because it is responsible for the overall rigidity of the frame 200.

In the case of the mask cell sheet portion 220, the process of manufacturing a substantially thick sheet is difficult, and if it is too thick, the path through which the organic material source 600 (see FIG. 18) Blocking can cause problems. On the contrary, if the thickness is too small, it may be difficult to secure the rigidity enough to support the mask 100. Accordingly, it is preferable that the mask cell sheet portion 220 is thinner than the frame frame portion 210, but thicker than the mask 100. The thickness of the mask cell sheet portion 220 may be about 0.1 mm to 1 mm. The widths of the first and second grid sheet portions 223 and 225 may be about 1 to 5 mm.

A plurality of mask cell regions CR11 to CR56 may be provided except for the region occupied by the border sheet portion 221 and the first and second grid sheet portions 223 and 225 in the planar sheet. The mask cell region CR refers to a region occupied by the border sheet portion 221, the first and second grid sheet portions 223 and 225 in the hollow region R of the frame portion 210, May mean an empty area, except for the < RTI ID = 0.0 >

The cell C of the mask 100 is associated with the mask cell region CR so that it can be used as a passage through which the pixels of the OLED are substantially deposited through the mask pattern P. [ As described above, one mask cell C corresponds to one display such as a smart phone. In one mask 100, mask patterns P constituting one cell C may be formed. Alternatively, although one mask 100 has a plurality of cells C and each cell C may correspond to a respective cell region CR of the frame 200, a clear alignment of the mask 100 It is necessary to avoid the large-area mask 100, and a small-area mask 100 having one cell C is preferable. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell region CR of the frame 200. [ In this case, it may be considered to correspond to the mask 100 having about a few number of the cells C for the clear alignment.

The frame 200 has a plurality of mask cell regions CR and each of the masks 100 can be bonded so that one mask cell C corresponds to the mask cell region CR. Each of the masks 100 may include a mask cell C having a plurality of mask patterns P and a dummy (corresponding to a portion of the mask film 110 excluding the cell C) around the mask cell C have. The dummy may include only the mask film 110 or may include a mask film 110 having a predetermined dummy pattern formed in a shape similar to the mask pattern P. [ The mask cell C corresponds to the mask cell region CR of the frame 200 and part or all of the dummy may be bonded to the frame 200 (mask cell sheet portion 220). As a result, the mask 100 and the frame 200 can have an integrated structure.

According to another embodiment of the present invention, the frame is not manufactured by adhering the mask cell sheet portion 220 to the rim frame portion 210, but the rim portion 210 (210) is formed in the hollow region R of the rim frame portion 210, (Corresponding to the grid sheet portions 223 and 225), which are integrated with the grid frame portions 223 and 225, may be used. This type of frame also includes at least one mask cell region CR, and the mask 100 can be made to correspond to the mask cell region CR so that a frame-integrated mask can be manufactured.

Hereinafter, a process for manufacturing a frame-integrated mask will be described.

First, the frame 200 described above with reference to FIGS. 4 and 5 can be provided. 6 is a schematic view showing a manufacturing process of the frame 200 according to an embodiment of the present invention.

Referring to FIG. 6 (a), a frame frame part 210 is provided. The frame part 210 may have a rectangular frame shape including the hollow area R.

Next, referring to FIG. 6 (b), a mask cell sheet portion 220 is manufactured. The mask cell sheet portion 220 can be manufactured by preparing a flat sheet using electroplating or other film forming process and then removing the mask cell region CR portion by laser scribing, have. In this specification, a mask cell region (CR: CR11 to CR56) of 6 X 5 is formed is described as an example. Five first grid sheet portions 223 and four second grid sheet portions 225 may exist.

Next, the mask cell sheet portion 220 may correspond to the frame portion 210 of the frame. All the sides of the mask cell sheet portion 220 are stretched to expose the mask cell sheet portion 220 in a flattened state and the frame sheet portion 221 to the frame frame portion 210 Can respond. The mask cell sheet portion 220 can be held and stretched by one point at several points (e.g., 1 to 3 points in FIG. 6 (b)). On the other hand, the mask cell sheet portion 220 may be stretched (F1, F2) along some lateral direction, not all sides.

Next, if the mask cell sheet portion 220 corresponds to the frame frame portion 210, the frame sheet portion 221 of the mask cell sheet portion 220 can be welded (W). It is preferable that all the sides are welded (W) so that the mask cell sheet portion 220 can be firmly adhered to the rim frame portion 220. The welding W should be performed as close as possible to the edge of the rim 210 so as to minimize the space between the rim 210 and the mask cell sheet 220 and improve the adhesion. The welded portion W may be formed in a line or a spot shape and may have the same material as the mask cell sheet portion 220 and may be integrally formed with the frame frame portion 210 and the mask cell sheet portion 220 As shown in FIG.

7 is a schematic view showing a manufacturing process of a frame according to another embodiment of the present invention. The embodiment of FIG. 6 first fabricated the mask cell sheet portion 220 with the mask cell region CR and adhered to the frame frame portion 210, but the embodiment of FIG. 7 differs from the embodiment of FIG. 210, a mask cell region CR portion is formed.

First, as shown in FIG. 6A, a frame frame part 210 including a hollow area R is provided.

Next, referring to FIG. 7A, a planar sheet (planar mask cell sheet portion 220 ') may correspond to the frame frame portion 210. FIG. The mask cell sheet portion 220 'is in a planar state in which the mask cell region CR is not yet formed. All the sides of the mask cell sheet portion 220 'may be stretched (F1 to F4) so that the mask cell sheet portion 220' may correspond to the frame frame portion 210 in a flat state. It is possible to hold the mask cell sheet portion 220 'at one point and hold the mask cell sheet portion 220' at several points (e.g., 1 to 3 points in FIG. 7A). On the other hand, the mask cell sheet portion 220 'may be stretched (F1, F2) along some lateral direction, not all sides.

Next, if the mask cell sheet portion 220 'corresponds to the rim frame portion 210, the edge portion of the mask cell sheet portion 220' can be welded (W) to be bonded. It is preferable to weld (W) all the sides so that the mask cell sheet portion 220 'can be firmly adhered to the frame portion 220. The weld W must be performed as close as possible to the edge of the rim 210 to maximally reduce the space between the rim 210 and the mask cell sheet 220 'and improve the adhesion. The welded portion W may be formed in the form of a line or a spot and may be formed of the same material as the mask cell sheet portion 220 ' As a whole.

Next, referring to FIG. 7B, a mask cell region CR is formed in a planar sheet (planar mask cell sheet portion 220 '). The mask cell region CR can be formed by removing the sheet of the mask cell region CR through laser scribing, etching, or the like. In this specification, a mask cell region (CR: CR11 to CR56) of 6 X 5 is formed is described as an example. When the mask cell region CR is formed, the portion welded to the rim frame portion 210 becomes the border sheet portion 221, and the five first grid sheet portions 223 and the four second grid portions 221, A mask cell sheet portion 220 having a sheet portion 225 may be constructed.

8 is a plan view of the mask 100 (FIG. 8 (a)) and the mask 100 (FIG. 8 (b)) attached on the tray 50 according to an embodiment of the present invention. And a side sectional view (Fig. 8 (c)). 9 is a schematic view showing a process of attaching a mask on a tray according to a comparative example (Fig. 9 (a)) and an embodiment of the present invention (Fig. 9 (b) Hereinafter, a series of processes of adhering the mask 100 to the manufactured frame 200 will be described according to an embodiment of the present invention.

Next, referring to FIG. 8A, it is possible to provide a mask 100 having a plurality of mask patterns P formed thereon. It has been described that a mask 100 of Invar or Super Invar can be manufactured by the electroplating method and one cell C can be formed in the mask 100. [

The mother plate used as a cathode in electroplating uses a conductive material. In the case of a metal, metal oxide may be generated on the surface, impurities may be introduced in the course of metal production, and in the case of a polycrystalline silicon substrate, an inclusion or a grain boundary may exist. In the case of the substrate, there is a high possibility that impurities are contained, and strength. Acid resistance may be weak. An element that hinders uniform formation of an electric field on the surface of a base (or cathode), such as metal oxide, impurities, inclusions, crystal grains, and the like, is referred to as "Defect ". Due to the defect, a uniform electric field is not applied to the negative electrode of the above-described material, so that a part of the plating film (mask 100) can be formed non-uniformly.

Unevenness of the plated film and the plated film pattern [mask pattern (P)] in the realization of UHD class or higher ultra high image quality may adversely affect pixel formation. Since the pattern width of the FMM and the shadow mask can be formed to a size of several to several tens of micrometers, preferably less than 30 micrometers, even a defect of a few micrometers in size occupies a large proportion in the pattern size of the mask.

Further, in order to remove defects in the cathode body made of the above-mentioned material, an additional process for removing metal oxide, impurities and the like may be performed. In this process, another defect such as etching of the cathode body material may be caused have.

Therefore, the present invention can use a base plate (or a negative electrode) made of a single crystal silicon material. High concentration doping of 10 ¹⁹ / cm ³ or more can be performed on a base plate made of a single crystal silicon material so as to have conductivity. The doping may be performed on the whole of the base plate, or may be performed only on the surface portion of the base plate.

Since there is no defect in the case of doped single crystal silicon, there is an advantage that a uniform plating film (mask 100) due to the formation of a uniform electric field on the entire surface at the time of electroplating can be produced. Frame-integrated masks 100 and 200 manufactured through a uniform plating film can further improve the image quality level of OLED pixels. Further, since there is no need to carry out an additional process for removing and eliminating defects, there is an advantage that the process cost is reduced and the productivity is improved.

Further, according to the use of a silicon base plate, there is an advantage that an insulating portion can be formed only by a process of oxidizing and nitriding the surface of the base plate, if necessary. The insulating portion may be formed using a photoresist. Electrodeposition of the plated film (the mask 100) is prevented in the portion where the insulating portion is formed, and a pattern (mask pattern P) is formed on the plated film.

The width of the mask pattern P may be less than 40 占 퐉, and the thickness of the mask 100 may be about 2 to 50 占 퐉. Since the frame 200 includes a plurality of mask cell regions CR11 to CR56, the mask 100 having the mask cells C: C11 to C56 corresponding to the respective mask cell regions CR11 to CR56 May also be provided.

Next, referring to FIG. 8 (b), the mask 100 may be attached on a tray 50. [ The mask 100 electrodeposited on the base plate can be removed and attached onto the tray 50. The tray 50 is preferably in the form of a flat plate so that the mask 100 can be attached flat. The size of the tray 50 may be a flat plate shape larger than the mask 100 so that the mask 100 can be attached as a whole flat.

The tray 50 may be a material through which the laser light L can be transmitted. The tray 50 includes a material through which laser light such as glass, silica, heat-resistant glass, quartz or alumina (Al ₂ O ₃ ) L), and the mask 100 can be bonded to the frame 200 by a laser welding (LW) method.

On the other hand, the mask 100 is not adhered well to one surface (upper surface) of the tray 50 by the loading process of placing it on the tray 50 as a very thin metal foil. In addition, it is more difficult to expect that the mask 100 is attached flat. 9A, when the mask 100 formed by electroplated plating is simply loaded on the tray 50, the mask 100a is not uniformly attached to the tray 50, but the wrinkles, And a void (v) may appear. This void v may cause a problem of misalignment of the mask pattern P of the mask 100a and the misalignment of the mask pattern P may lead to failure of the pixel deposition process.

Therefore, the present invention is characterized by using the spreading means 60, 70, 80, 90 so that the mask 100 can be adhered well onto the tray 50. As shown in FIG. 9 (b), when the spreading means 60, 70, 80, and 90 are used, the mask 100 is attached on one side of the tray 50 and is flat- There is an advantage that alignment of the pattern P is not shifted.

10 to 13 are schematic views showing a method of attaching the mask 100 on the tray 50 using the spreading means 60: 61, 63, 65, 67 according to various embodiments of the present invention.

A magnetic force, a vacuum, or the like so that the mask 100 can be attached on one side of the tray 50 and can be spread flat without wrinkles or wrinkles on the mask 100 during the attachment process. Can be used. Figs. 10 and 11 show an embodiment using electrostatic force as the unfolding means 61 and 63, Fig. 12 an embodiment using magnetic force by the unfolding means 65, and Fig. 13 an embodiment using vacuum by the unfolding means 67 do. The mask 100 may be attached to the tray 50 by using the unfolding means 60 and the mask 100 may be attached to the tray 50 by combining them.

10, according to one embodiment, the unfolding means 61 may comprise a large body 61, such as an ionizer. It is possible to induce the electrostatic charge SE by the large whole 61.

First, as shown in Fig. 10 (a), the mask 100 is loaded on the tray 50. The mask 100 may not be in a completely close contact with the tray 50 but may have some voids v.

Then, as shown in FIG. 10 (b), the entire large-size base 61 can be rubbed on the mask 100 and the tray 50. It is not absolutely necessary to rub the base 61 in contact with the mask 100 and the tray 50, and it may be rubbed in a state of being spaced apart by a predetermined distance. Then, static electricity SE can be induced in the mask 100 and the tray 50. [ Thus, as shown in FIG. 10C, an electrostatic charge SE can be induced to attach the mask 100 to one side of the tray 50 with a predetermined adhering force while spreading the mask 100 flat. As the mask 100 is attached and spreads flat, the voids v are eliminated, and the mask pattern P can maintain the alignment well.

11, the unfolding means 63 includes a transparent electrode 63a and a mask 100 disposed on one surface (upper surface) or the other surface (lower surface) of the tray 50, And an electrode portion 63b for applying a voltage to the electrode portion 63b. Since the mask 100 is a conductive material, when a voltage is applied to the mask 100 using the electrode portion 63b, the static electricity SE can be induced over the entire surface of the mask 100. [

First, as shown in Fig. 11 (a), the mask 100 is loaded on the tray 50. The mask 100 may not be in a completely close contact with the tray 50 but may have some voids v. On the tray 50, the transparent electrodes 63a may be arranged with a predetermined pattern. Although the transparent electrode 63a is shown on the upper surface of the tray 50 in the drawing, the transparent electrode 63a may be formed on the lower surface of the tray 50. [ Since the transparent electrode 63a is disposed on the tray 50 with a thickness of nm and 占 퐉 scale, the size of the void v of the mask 100 has almost no effect. The transparent electrode 63a may be made of any material such as indium tin oxide (ITO), aluminum doped zinc oxide (AZO), and fluorine doped tin oxide (FTO).

11 (b), the electrode portion 63b may be connected to the mask 100 and the transparent electrode 71, and a voltage may be applied. Then, the static electricity SE can be induced on one surface of the mask 100 and the tray 50 (the surface on which the transparent electrode 63a is disposed). Thus, as shown in FIG. 11 (c), an electrostatic charge SE can be induced and attached to one surface of the tray 50 with a predetermined adhering force as the mask 100 is spread flat. As the mask 100 is attached and spreads flat, the voids v are eliminated, and the mask pattern P can maintain the alignment well.

As shown in Figure 12, according to one embodiment, the unfolding means 65 may comprise a plurality of magnets 65a, 65b, 65c. Magnets can be used without restrictions such as electromagnets and permanent magnets. Since the mask 100 is a conductor, the nature of the mask 100 can be used.

First, as shown in Fig. 12 (a), the mask 100 is loaded on the tray 50. The mask 100 may not be in a completely close contact with the tray 50 but may have some voids v.

Next, as shown in FIG. 12B, the fixed magnets 65a and 65b can be disposed on at least one of the one side and the other side of the mask 100. FIG. The magnetic force of the stationary magnets 65a and 65b acts on the mask 100 through the tray 50 so that one side and the other side of the mask 100 can be brought into close contact with the tray 50. [ It is preferable that the stationary magnets 65a and 65b are disposed on the opposite side of the tray 50 surface on which the mask 100 is loaded because the mask 100 must be pulled toward the tray 50. [

Then, the expanding magnet 65c can be moved from one side of the mask 100 to the other side. A portion of the mask 100 corresponding to the position where the extended magnet 65c has moved can be brought into close contact with the tray 50. [ 12C, when the spread magnet 65c is moved from one side to the other side, the entire surface of the mask 100 can be flatly spread while being attached to the tray 50. [ As the mask 100 is attached and spreads flat, the voids v are eliminated, and the mask pattern P can maintain the alignment well.

As shown in Figure 13, according to one embodiment, the unfolding means 67 may comprise a plurality of refinements 67a, 67b, 67c, such as air knives, air pumps, and the like. The vacuum chambers 67a, 67b, and 67c generate suction pressure to pull the mask 100. [

First, as shown in Fig. 13A, the mask 100 is loaded on the tray 50. Fig. The mask 100 may not be in a completely close contact with the tray 50 but may have some voids v.

Then, fixed vacuum chambers 67a and 67b can be disposed on at least one of the one side and the other side of the mask 100 as shown in FIG. 13 (b). The fixed vacuum chambers 67a and 67b can be pulled toward the fixed vacuum chambers 67a and 67b by acting on the one side and the other side of the mask 100 by applying suction pressure. One side and the other side of the mask 100 can be pulled and tightly adhered to the tray 50. [ It is preferable that the fixed vacuum chambers 67a and 67b are disposed on the same plane as the plane of the tray 50 on which the mask 100 is loaded and are arranged on both ends of the mask 100 .

Subsequently, the spreading punch 67c can be moved from one side of the mask 100 to the other side. The portion of the mask 100 corresponding to the position where the spreading process 67c has moved can be brought into close contact with the tray 50 while being flattened and stretched. 13C, the entire surface of the mask 100 can be flatly spread while being attached to the tray 50 when the spreading unit 67c is moved from one side to the other side. As the mask 100 is attached and spreads flat, the voids v are eliminated, and the mask pattern P can maintain the alignment well.

14 is a plan view of the state in which the mask 100 is caused to correspond to the cell region CR of the frame 200 by loading the tray 50 on the frame 200 according to an embodiment of the present invention a) and a side sectional view (Fig. 14 (b)).

Next, referring to FIGS. 14A and 14B, the mask 100 may correspond to one mask cell region CR of the frame 200. FIG. By turning the tray 50 with the mask 100 on top and turning the tray 50 onto the frame 200 (or the mask cell sheet portion 220), the mask 100 is moved to the mask cell region CR). While controlling the position of the tray 50, it can be seen through the microscope whether the mask 100 corresponds to the mask cell region CR. When the tray 50 is loaded on the frame 200 (or the mask cell sheet portion 220), the mask 100 is held between the tray 50 and the frame 200 (or the mask cell sheet portion 220) And can be squeezed by the tray (50).

Meanwhile, the lower support 70 may be further disposed under the frame 200. The lower support 70 may have a size enough to fit into the hollow region R of the frame rim 210 and may have a flat plate shape. In addition, a predetermined support groove (not shown) corresponding to the shape of the mask cell sheet portion 220 may be formed on the upper surface of the lower support 70. In this case, the frame sheet portion 221 and the first and second grid sheet portions 223 and 225 are fitted into the support groove, so that the mask cell sheet portion 220 can be fixed more securely.

The lower support 70 can press the opposite surface of the mask cell region CR to which the mask 100 contacts. That is, the lower support 70 supports the mask cell sheet portion 220 in the upward direction, thereby preventing the mask cell sheet portion 220 from sagging in the downward direction during the adhesion of the mask 100. At the same time, since the edge of the mask 100 and the frame 200 (or the mask cell sheet portion 220) are pressed in the direction in which the lower support 70 and the tray 50 are opposed to each other, It is possible to maintain the alignment state of the light emitting device without being disturbed.

The present invention is characterized in that the mask 100 is mounted on the tray 50 and the mask 100 is mounted on the frame 200 to correspond to the mask cell area CR of the frame 200 The mask 100 is not subjected to any tensile force in this process.

The mask cell sheet portion 220 of the frame 200 has a small thickness so that when the mask 100 is adhered to the mask cell sheet portion 220 with a tensile force applied thereto, It may act on the cell sheet portion 220 and the mask cell region CR to deform them. Therefore, it is necessary to perform adhesion of the mask 100 to the mask cell sheet portion 220 without applying a tensile force to the mask 100. Thus, the tensile force applied to the mask 100 oppositely acts on the frame 200 as a tension to prevent the frame 200 (or the mask cell sheet portion 220) from deforming.

However, there is a problem when the frame-integrated mask is manufactured by adhering the mask 100 to the frame 200 (or the mask cell sheet portion 220) without applying a tensile force to the mask 100 and using the frame- Lt; / RTI > The mask 100 thermally expands by a predetermined length in the pixel deposition process performed at about 25 to 45 ° C. Even if the mask 100 is made of an invar mask, the length of the mask 100 may vary by about 1 to 3 ppm according to a temperature rise of about 10 DEG C to form an atmosphere for the pixel deposition process. For example, if the total length of the mask 100 is 500 mm, the length may be increased by about 5 to 15 占 퐉. Then, there arises a problem that the alignment errors of the patterns P are increased while the mask 100 is struck by its own weight or deformed such as stretching or twisting in a fixed state in the frame 200. [

Therefore, the present invention can adhere and adhere to the mask cell region CR of the frame 200 without applying a tensile force to the mask 100 at a temperature higher than room temperature. In this specification, it is expressed that the mask 100 corresponds to and adheres to the frame 200 after the temperature of the process area is raised to the first temperature (ET).

The term "process region" may refer to a space in which components such as the mask 100 and the frame 200 are located and the process of bonding the mask 100 is performed. The process region may be a space within a closed chamber or an open space. Also, the "first temperature" may mean a temperature higher than or equal to the pixel deposition process temperature when the frame-integrated mask is used in an OLED pixel deposition process. Considering that the pixel deposition process temperature is about 25 to 45 캜, the first temperature may be about 25 캜 to 60 캜. The temperature rise of the process region can be performed by providing a heating means in the chamber or by providing a heating means around the process region.

Referring again to FIG. 14, after the mask 100 corresponds to the mask cell region CR, the temperature of the process region including the frame 200 can be raised to the first temperature (ET). Alternatively, the mask 100 may correspond to the mask cell region CR after the temperature of the process region including the frame 200 is raised to the first temperature (ET). Although only one mask 100 is shown to correspond to one mask cell region CR in the figure, it is also possible to increase the temperature of the process region to the first temperature after mapping the masks 100 for each mask cell region CR (ET).

The conventional mask 10 of FIG. 1 has a long length since it includes six cells (C1 to C6), whereas the mask 100 of the present invention has a short length including one cell (C) The degree to which the pixel position accuracy (PPA) is distorted can be reduced. For example, assuming that the length of the mask 10 including a plurality of cells (C1 to C6, ...) is 1 m and a PPA error of 10 m is generated in all 1 m, Can be 1 / n of the upper error range according to the reduction of the relative length (corresponding to the reduction in the number of cells (C)). For example, if the length of the mask 100 of the present invention is 100 mm, the length of the conventional mask 10 is reduced from 1 m to 1/10, so that a PPA error of 1 탆 is generated in the entire length of 100 mm , The alignment error is remarkably reduced.

On the other hand, if the mask 100 has a plurality of cells C, and each cell C corresponds to each cell region CR of the frame 200, even if the alignment error is minimized, The mask 100 may correspond to a plurality of mask cell regions CR of the frame 200. Alternatively, the mask 100 having a plurality of cells C may correspond to one mask cell region CR. Also in this case, it is preferable that the mask 100 has as few cells C as possible in consideration of the process time and productivity in the alignment.

In the case of the present invention, since only one cell C of the mask 100 needs to be matched and the alignment state is checked, it is necessary to simultaneously match a plurality of cells (C: C1 to C6) The manufacturing time can be remarkably reduced as compared with the conventional method (see Fig. 2).

That is, the method for manufacturing a frame-integrated mask of the present invention is characterized in that each of the cells C11 to C16 included in six masks 100 is associated with one cell region CR11 to CR16, It is possible to shorten the time much more than the conventional method in which six cells (C1 to C6) are simultaneously associated and all the alignment states of the six cells (C1 to C6) need to be simultaneously checked.

The method of manufacturing a mask with a frame according to the present invention is characterized in that the product yield in thirty steps of aligning and aligning 30 masks (100) to 30 cell areas (CR11 to CR56) (See FIG. 2 (a)) including the first to sixth masks 10 to 16 (see FIG. The conventional method of aligning six cells (C1 to C6) in the area corresponding to six cells C at a time is a much more cumbersome and difficult task, resulting in a lower product yield.

On the other hand, after the mask 100 corresponds to the frame 200, the mask 100 may be temporarily fixed to the frame 200 through a predetermined adhesive. Thereafter, the step of adhering the mask 100 can proceed.

15 is a side sectional view (FIG. 15A) showing a process of adhering the mask 100 according to an embodiment of the present invention corresponding to the cell region CR of the frame 200 (Fig. 15 (b)). Fig. 15 (c) shows a comparative example of Fig. 15 (b).

15, a part or all of the rim of the mask 100 may be adhered to the frame 200. As shown in Fig. Adhesion may be performed by welding, and preferably by laser welding (LW). The laser welded (LW) portion may be integrally connected with the same material as the mask 100 / frame 200.

When the laser L is irradiated on the upper portion of the rim portion (or the dummy portion) of the mask 100 at the upper portion of the tray 50, the laser L penetrates the tray 50 to melt a portion of the mask 100 . Thus, the mask 100 can be laser welded (LW) to the frame 200. Laser welding (LW) should be performed as close as possible to the edge of the frame 200 to minimize the hysterical space between the mask 100 and the frame 200 and increase the adhesion. The laser welding (LW) portion may be created in the form of a line or a spot and may be a medium that has the same material as the mask 100 and connects the mask 100 and the frame 200 together have.

15 (c), when the laser welding LW 'is performed while the upper and lower portions of the mask 100' are not squeezed, the mask 100 ' It can be melted in one direction. Then, laser welding (LW ') is performed with a non-uniform thickness, and a weld bead 101' in the form of a wrinkled or corrugated shape is formed on the surface of the mask 100 ' So that the alignment state between them can be changed.

Accordingly, the present invention can prevent the weld bead 101 'from being formed during laser welding (LW) because the tray 50 and the lower support 70 squeeze the mask 100. The mask 100 is uniformly melted at the portion irradiated with the laser L at the time of laser welding (LW) because the tray 50 and the lower support 70 press the mask 100 in a flat shape, Laser welding (LW) can be performed in thickness. Accordingly, the alignment state between the mask pattern P and the cells C can be maintained during the adhesion process.

16A and 16B are a plan view (FIG. 16A) and a side sectional view (FIG. 16A and FIG. 16B) showing a process of sequentially adhering the mask 100 according to the embodiment of the present invention to the cell regions CR11 to CR56 b).

Referring to FIG. 16, after a mask 100 is correspondingly adhered to a mask cell region CR11, the mask 100 may be correspondingly adhered to a neighboring mask cell region CR12. Although FIG. 16 shows only two masks 100 bonded, it is possible to adhere masks 100 to all the mask cell regions CR in a corresponding manner.

A shape in which two edges of two neighboring masks 100 are bonded (LW) is shown on the upper surface of the first grid sheet portion 223 (or the second grid sheet portion 225). The width and thickness of the first grid sheet portion 223 (or the second grid sheet portion 225) may be about 1 to 5 mm. In order to improve the productivity of the product, the first grid sheet portion 223 Or the second grid sheet portion 225) and the edge of the mask 100 should be reduced to about 0.1 to 2.5 mm as much as possible.

(LW) is performed on the mask cell sheet portion 220 without applying a tensile force to the mask 100, the mask cell sheet portion 220 (or the border sheet portion 221, the first and second grid sheets 220, (223, 225) are not subjected to tension.

The process of bonding one mask 100 to the frame 200 and sequentially mapping the remaining masks 100 to the remaining mask cells C and bonding them to the frame 200 can be repeated. Since the mask 100 already bonded to the frame 200 can present the reference position, the time in the process of sequentially matching the remaining masks 100 to the cell region CR and confirming the alignment state is significantly reduced There is an advantage that can be. Then, the pixel position accuracy (PPA) between the mask 100 bonded to one mask cell region and the mask 100 bonded to the adjacent mask cell region does not exceed 3 mu m, There is an advantage that a mask for forming an OLED pixel can be provided.

17 is a schematic view showing a process of lowering the temperature of the process region LT after bonding the mask 100 to the cell region CR of the frame 200 according to an embodiment of the present invention.

Next, referring to FIG. 17, the temperature of the process region can be lowered (LT) to the second temperature. The "second temperature" may mean a temperature lower than the first temperature. Considering that the first temperature is about 25 ° C to 60 ° C, the second temperature may be about 20 ° C to 30 ° C, assuming that the second temperature is lower than the first temperature, and preferably the second temperature may be room temperature. The temperature lowering of the process region can be carried out by providing a cooling means in the chamber, installing a cooling means around the processing region, or naturally cooling to room temperature.

When the temperature of the process region is lowered to the second temperature (LT), the mask 100 can heat-shrink by a predetermined length. The mask 100 may be heat-shrunk isotropically along all lateral directions. However, since the mask 100 is fixedly connected to the frame 200 (or the mask cell sheet portion 220) by welding (LW), the heat shrinkage of the mask 100 can be suppressed to the peripheral mask cell sheet portion 220 The tension TS is applied by itself. By applying the self-tension TS of the mask 100, the mask 100 can be adhered on the frame 200 more tightly.

Further, since the temperature of the process region is lowered to the second temperature (LT) after all the masks 100 are adhered onto the corresponding mask cell region CR, all of the masks 100 simultaneously heat shrink, The problem that the pattern 200 is deformed or that the patterns P have a large alignment error can be prevented. More specifically, even if the tensile force TS is applied to the mask cell sheet portion 220, since the plurality of masks 100 apply the tensile force TS in mutually opposite directions, the force is canceled, So that deformation does not occur on the surface 220. For example, the first grid sheet portion 223 between the mask 100 attached to the CR11 cell region and the mask 100 attached to the CR12 cell region is located on the right side of the mask 100 attached to the CR11 cell region The tensile force TS acting in the left direction and the tensile force TS acting in the leftward direction of the mask 100 attached to the CR12 cell region can be canceled. Thus, the advantage that the deformation is minimized in the frame 200 (or the mask cell sheet portion 220) by the tension TS and the alignment error of the mask 100 (or the mask pattern P) can be minimized .

18 is a schematic view showing an OLED pixel deposition apparatus 1000 using a frame-integrated mask 100, 200 according to an embodiment of the present invention.

18, the OLED pixel deposition apparatus 1000 includes a magnet plate 300 in which a magnet 310 is accommodated and a cooling water line 350 is disposed, and an organic material source 600 (Not shown).

A target substrate 900 such as a glass on which the organic material source 600 is deposited may be interposed between the magnet plate 300 and the source evaporator 500. Integrated masks 100, 200 [or FMM] for depositing the organic source 600 on a pixel-by-pixel basis may be closely attached to the target substrate 900 or may be disposed in close proximity to each other. The magnet 310 generates a magnetic field and can be brought into close contact with the target substrate 900 by a magnetic field.

The deposition source supply part 500 can supply the organic material source 600 through the left and right paths and the organic material sources 600 supplied from the deposition source supply part 500 can supply the pattern P And may be deposited on one side of the target substrate 900. The deposited organic material source 600 that has passed through the pattern P of the frame-integrated mask 100, 200 can act as the pixel 700 of the OLED.

The patterns of the frame-integrated masks 100 and 200 may be formed to be inclined S (or formed into a tapered shape S) in order to prevent uneven deposition of the pixel 700 by a shadow effect . Organic materials 600 passing through the pattern in a diagonal direction along the sloped surface can also contribute to the formation of the pixel 700, so that the pixel 700 can be uniformly deposited in thickness as a whole.

Since the mask 100 is adhered and fixed to the frame 200 at a first temperature higher than the pixel deposition process temperature, even if the mask 100 is raised to the process temperature for the pixel deposition, there is almost no influence on the position of the mask pattern P, The PPA between the mask 100 and the mask 100 adjacent thereto may be kept not to exceed 3 mu m.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken in conjunction with the present invention. Variations and changes are possible. Such variations and modifications are to be considered as falling within the scope of the invention and the appended claims.

50: tray
60: Expanding means
61: Large All
63: transparent electrode, electrode part
65: Magnet
67: jeans study
70: Lower support
100: mask
110: mask film
200: frame
210:
220: mask cell sheet part
221:
223: first grid sheet portion
225: second grid sheet portion
1000: OLED pixel deposition apparatus
C: cell, mask cell
CR: mask cell area
ET: Raising the temperature of the process zone to the first temperature
L: Laser
LT: Lowering the temperature of the process region to the second temperature
LW: Laser welding
R: hollow region of the frame portion
P: mask pattern
TS: tension
W: Welding

Claims (22)

A method for manufacturing a frame-integrated mask in which at least one mask and a frame for supporting the mask are integrally formed,
(a) providing a frame having at least one mask cell region;
(b) attaching a mask on the tray;
(c) loading a tray on the frame to correspond to a mask cell region of the frame; And
(d) bonding at least a portion of the rim of the mask to the frame
Lt; / RTI >
(b), the mask is attached on the tray in a flatly spread state by using the unfolding means. The method according to claim 1,
(a)
(a1) providing a rim frame portion including a hollow region; And
(a2) connecting a mask cell sheet portion having at least one mask cell region to a frame portion to manufacture a frame
Wherein the frame-integrated mask comprises a plurality of mask patterns. The method according to claim 1,
(a)
(a1) providing a rim frame portion including a hollow region;
(a2) plane mask cell sheet portion to a rim frame portion; And
(a3) forming at least one mask cell region in the mask cell sheet portion to manufacture a frame
Wherein the frame-integrated mask comprises a plurality of mask patterns. The method according to claim 2 or 3,
(d) is a step of bonding at least a part of the rim of the mask to the mask cell sheet portion to adhere the mask to the frame. The method according to claim 1,
The unfolding means includes the entirety of the base,
(b)
(b1) loading a mask onto a tray;
(b2) rubbing the entire substrate against at least one of a tray and a mask to induce static electricity; And
(b3) flattening the mask and attaching it onto the tray
Wherein the frame-integrated mask comprises a plurality of mask patterns. The method according to claim 1,
The spreading means includes a transparent electrode disposed on one side or the other side of the tray and an electrode portion for applying a voltage to the mask,
(b)
(b1) loading a mask onto a tray;
(b2) applying a voltage to the transparent electrode and the electrode to induce static electricity; And
(b3) flattening the mask and attaching it onto the tray
Wherein the frame-integrated mask comprises a plurality of mask patterns. The method according to claim 1,
The spreading means comprises a plurality of magnets,
(b)
(b1) loading a mask onto a tray;
(b2) disposing a stationary magnet on at least one of the one side and the other side of the mask on the other side of the tray on which the mask is loaded, and fixing the mask by applying a magnetic force thereto; And
(b3) a step of flatly spreading the mask while moving the expanding magnet from one side of the mask to the other side,
Wherein the frame-integrated mask comprises a plurality of mask patterns. The method according to claim 1,
The expanding means comprises a plurality of reinforcements,
(b)
(b1) loading a mask onto a tray;
(b2) disposing a fixed vacuum in at least one of the one side and the other side of the mask, and fixing the mask by applying suction pressure; And
(b3) a step of flatly unfolding the mask while moving the unfolded work from one side of the mask to the other side,
Wherein the frame-integrated mask comprises a plurality of mask patterns. The method according to claim 1,
Wherein the tray has a flat plate shape and includes a material through which laser light is transmitted. The method according to claim 1,
A method for manufacturing a frame-integrated mask, wherein a mask is bonded to a frame by laser welding to irradiate a laser beam from an upper portion of the tray. The method according to claim 1,
Raising the temperature of the processing region including the frame to the first temperature before or after mapping the mask to the mask cell region,
And after the mask is adhered to the frame, the temperature of the process region containing the frame is lowered to the second temperature. 12. The method of claim 11,
The first temperature is equal to or higher than the OLED pixel deposition process temperature,
And the second temperature is at least a temperature lower than the first temperature. 13. The method of claim 12,
The first temperature is any one of 25 占 폚 to 60 占 폚,
The second temperature is any one of 20 占 폚 to 30 占 폚 lower than the first temperature,
Wherein the OLED pixel deposition process temperature is any one of 25 占 폚 to 45 占 폚. 12. The method of claim 11,
Wherein when the mask corresponds to the mask cell region, no tension is applied to the mask. The method according to claim 2 or 3,
Wherein the mask cell sheet portion includes a plurality of mask cell regions along at least one of a first direction and a second direction perpendicular to the first direction. The method according to claim 2 or 3,
In the mask cell sheet portion,
A border sheet portion; And
And at least one first grid sheet portion extending in the first direction and having both ends connected to the border sheet portion. 17. The method of claim 16,
Wherein the mask cell sheet portion further comprises at least one second grid sheet portion extending in a second direction perpendicular to the first direction and intersecting the first grid sheet portion and having both ends connected to the border sheet portion, ≪ / RTI > The method according to claim 1,
And each of the masks corresponds to each of the mask cell regions. The method according to claim 1,
Wherein the mask comprises one mask cell and one mask cell is located within one mask cell region. The method according to claim 1,
Wherein the mask includes a plurality of mask cells, and the plurality of mask cells are located within one mask cell area. The method according to claim 1,
Wherein the mask and the frame are made of any one of invar, super invar, nickel, and nickel-cobalt. The method according to claim 1,
Wherein a pixel position accuracy (PPA) between a mask adhered to one mask cell region and a mask adhered to a neighboring mask cell region does not exceed 3 占 퐉.

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