KR102342735B1 - Producing method of mask integrated frame and tray used for supporting mask - Google Patents

Abstract

The present invention relates to a method for manufacturing a frame-integrated mask and a tray used for supporting the mask. A method of manufacturing a frame-integrated mask according to the present invention is a method of manufacturing a frame-integrated mask in which at least one mask 100 and a frame 200 supporting the mask 100 are integrally formed, (a) at least one mask A step of providing the frame 200 having the cell region CR, (b) adhering the mask 100 on the tray 50 . (c) loading the tray 50 on the frame 200 so that the mask 100 corresponds to the mask cell region CR of the frame 200, and (d) a laser ( and attaching the mask 100 to the frame 200 by irradiating L), characterized in that the laser passage hole 51 is formed in the portion of the tray 50 corresponding to the welding part of the mask 100 do.

Description

A method for manufacturing a frame-integrated mask and a tray used for supporting the mask

The present invention relates to a method for manufacturing a frame-integrated mask and a tray used for supporting the mask. More specifically, when the mask is integrated with the frame, the adhesion between the mask and the frame can be improved, and the method for manufacturing a frame-integrated mask that can clearly align the respective masks and used for supporting the mask It's about the tray.

Recently, in the manufacture of thin plates, research on an electroforming method has been conducted. The electroplating method immerses the anode body and the cathode body in an electrolyte, and applies power to electrodeposit a thin metal plate on the surface of the cathode body, so it is possible to manufacture an ultra-thin plate and is a method that can be expected to be mass-produced.

On the other hand, as a technology for forming pixels in the OLED manufacturing process, the FMM (Fine Metal Mask) method is mainly used to deposit an organic material at a desired location by attaching a thin metal mask to the substrate.

In the existing OLED manufacturing process, a mask is manufactured in a stick shape or a plate shape, and then the mask is welded and fixed to the OLED pixel deposition frame. A plurality of cells corresponding to one display may be provided in one mask. In addition, for large-area OLED manufacturing, multiple masks can be fixed to the OLED pixel deposition frame, and in the process of fixing to the frame, each mask is stretched so that it is flat. Adjusting the tension so that the entire part of the mask is flat is a very difficult task. In particular, in order to align a mask pattern with a size of only a few to several tens of μm while flattening each cell, a high-level operation of checking the alignment state in real time while finely adjusting the tensile force applied to each side of the mask is required. do.

Nevertheless, in the process of fixing several masks to one frame, there is a problem in that the masks are not well aligned with each other and between the mask cells. In addition, in the process of welding and fixing the mask to the frame, since the thickness of the mask film is too thin and large, the mask is sagging or distorted by load, and wrinkles and burrs occurring in the welding part during welding There were problems such as misalignment of the alignment.

In the case of ultra-high-definition OLED, the current QHD image quality is 500-600 PPI (pixel per inch), with a pixel size of about 30-50 μm, and 4K UHD and 8K UHD high-definition are higher than this: ~860 PPI, ~1600 PPI, etc. has a resolution of As such, it is necessary to reduce the alignment error between cells by several μm in consideration of the pixel size of the ultra-high-definition OLED, and an error outside of this may lead to product failure, and thus the yield may be very low. Therefore, there is a need to develop a technology capable of preventing deformation such as sagging or twisting of the mask, and clarifying alignment, and a technology of fixing the mask to a frame.

Accordingly, the present invention has been devised to solve the problems of the prior art as described above, and an object of the present invention is to provide a method of manufacturing a frame-integrated mask in which a mask and a frame can form an integrated structure.

Another object of the present invention is to provide a method of manufacturing a frame-integrated mask capable of preventing deformation such as sagging or warping of the mask and clarifying alignment.

Another object of the present invention is to provide a method for manufacturing a frame-integrated mask that significantly reduces manufacturing time and significantly increases yield.

Another object of the present invention is to provide a tray used for supporting a mask for forming an OLED pixel that can prevent deformation of the mask and improve adhesion between the mask and the frame when the mask is attached to a frame.

The above object of the present invention is to provide a method of manufacturing a frame-integrated mask in which at least one mask and a frame supporting the mask are integrally formed, comprising the steps of: (a) providing a frame having at least one mask cell region; (b) adhering the mask onto the tray; (c) loading the tray on the frame so that the mask corresponds to the mask cell region of the frame; and (d) attaching the mask to the frame by irradiating a laser to the welding portion of the mask, wherein the laser passing hole is formed in a portion of the tray corresponding to the welding portion of the mask, achieved by the method of manufacturing the frame-integrated mask.

Step (a) comprises the steps of: (a1) providing an edge frame portion including a hollow region; (a2) connecting the flat mask cell sheet portion to the edge frame portion; and (a3) forming a plurality of mask cell regions in the mask cell sheet portion to manufacture a frame.

Step (a) comprises the steps of: (a1) providing an edge frame portion including a hollow region; and (a2) manufacturing a frame by connecting a mask cell sheet portion having a plurality of mask cell regions to an edge frame portion.

The tray has a flat plate shape and may include a material having a surface roughness (Ra) of 100 nm or less (greater than 0) of one surface in contact with the mask.

The tray may be a wafer.

The tray may include any one material of glass, silica, heat-resistant glass, quartz, and alumina (Al ₂ O _{3 ).}

Formation of an air gap at the interface between the tray and the mask can be prevented.

The laser irradiated from the upper part of the tray may pass through the laser passage hole and may be irradiated to the welding part of the mask.

A welding bead is formed in a portion of the welding portion irradiated with a laser, and the welding bead may mediate so that the mask and the frame are integrally connected.

The upper compression body formed so that a portion corresponding to the laser passing hole is penetrated may be disposed on the tray to apply a load to the tray.

A lower support may be disposed under the frame to compress the opposite surface of the mask cell region on which the tray is loaded.

Before or after the mask corresponds to the mask cell region, the temperature of the process region including the frame is raised to a first temperature, and after attaching the mask to the frame, the temperature of the process region including the frame is set to a second temperature can be lowered to

The first temperature may be equal to or higher than the OLED pixel deposition process temperature, and the second temperature may be at least lower than the first temperature.

The first temperature is any one of 25°C to 60°C, the second temperature is any one of 20°C to 30°C lower than the first temperature, and the OLED pixel deposition process temperature is any one of 25°C to 45°C It can be one temperature.

When the mask corresponds to the mask cell region, tension may not be applied to the mask.

When the temperature of the process region is lowered to the second temperature, the mask attached to the frame may be contracted and tension may be applied.

The mask cell sheet unit may include a plurality of mask cell regions in at least one of a first direction and a second direction perpendicular to the first direction.

The mask cell sheet unit includes: an edge sheet unit; and at least one first grid sheet portion extending in the first direction and having both ends connected to the edge sheet portion.

The mask cell sheet unit may further include at least one second grid sheet unit extending in a second direction perpendicular to the first direction, intersecting the first grid sheet unit, and having both ends connected to the edge sheet unit.

The mask and the frame may be made of any one of invar, super invar, nickel, and nickel-cobalt.

And, the above object of the present invention is achieved by a tray supporting a mask for forming an OLED pixel to correspond to a frame, in which a laser passage hole is formed in a portion of the tray corresponding to the welding part of the mask.

The tray has a flat plate shape and may include a material having a surface roughness (Ra) of 100 nm or less (greater than 0) of one surface in contact with the mask.

The tray may be a wafer.

The tray may include any one material of glass, silica, heat-resistant glass, quartz, and alumina (Al ₂ O _{3 ).}

According to the present invention configured as described above, there is an effect that the mask and the frame can form an integrated structure.

In addition, according to the present invention, there is an effect of preventing deformation such as sagging or twisting of the mask and clarifying alignment.

In addition, according to the present invention, there is an effect that can significantly reduce the manufacturing time and significantly increase the yield.

In addition, according to the present invention, when the mask is attached to the frame, there is an effect of preventing deformation of the mask and improving the adhesion between the mask and the frame.

1 is a schematic diagram showing a conventional mask for OLED pixel deposition.
2 is a schematic diagram illustrating a process of attaching a conventional mask to a frame.
3 is a schematic diagram illustrating that an alignment error between cells occurs in the process of tensioning a conventional mask.
4 is a front view and a side cross-sectional view showing a frame-integrated mask according to an embodiment of the present invention.
5 is a front view and a side cross-sectional view illustrating a frame according to an embodiment of the present invention.
6 is a schematic diagram illustrating a manufacturing process of a frame according to an embodiment of the present invention.
7 is a schematic diagram illustrating a manufacturing process of a frame according to another embodiment of the present invention.
8 is a schematic view showing a state in which a mask according to a comparative example is adhered to a tray.
9 is a schematic diagram illustrating a state in which a tray according to a comparative example is loaded onto a frame and a mask corresponds to a cell region of the frame.
10 is a schematic diagram illustrating a process of loading a tray on a frame and attaching a mask to a cell region of the frame and an interface state between the mask and the tray according to a comparative example.
11 is a schematic diagram illustrating a process of loading a tray on a frame and attaching a mask to a cell region of the frame and an interface state between the mask and the tray according to an embodiment of the present invention.
12 is a schematic diagram illustrating a tray according to an embodiment of the present invention.
13 is a schematic diagram illustrating a state in which a tray is loaded onto a frame and a mask corresponds to a cell region of the frame according to an embodiment of the present invention.
14 is a schematic diagram illustrating a process of sequentially attaching a mask to a cell region according to an embodiment of the present invention.
15 is a schematic diagram illustrating a process of lowering the temperature of a process region after attaching a mask to a cell region of a frame according to an embodiment of the present invention.
16 is a schematic diagram illustrating an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0010] Reference is made to the accompanying drawings, which show by way of illustration specific embodiments in which the present invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the present invention. It should be understood that the various embodiments of the present invention are different but need not be mutually exclusive. For example, certain shapes, structures, and characteristics described herein with respect to one embodiment may be implemented in other embodiments without departing from the spirit and scope of the invention. In addition, it should be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the present invention. Accordingly, the detailed description set forth below is not intended to be taken in a limiting sense, and the scope of the present invention, if properly described, is limited only by the appended claims, along with all scope equivalents as those claimed. In the drawings, like reference numerals refer to the same or similar functions in various aspects, and the length, area, thickness, and the like may be exaggerated for convenience.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art can easily practice the present invention.

1 is a schematic diagram showing a conventional mask 10 for OLED pixel deposition.

Referring to FIG. 1 , the conventional mask 10 may be manufactured in a stick-type or plate-type shape. The mask 10 shown in FIG. 1A is a stick-type mask, and can be used by welding and fixing both sides of the stick to the OLED pixel deposition frame. The mask 100 shown in FIG. 1B is a plate-type mask and may be used in a process of forming a large area pixel.

A plurality of display cells C are provided in the body of the mask 10 (or the mask film 11 ). One cell C corresponds to one display such as a smart phone. A pixel pattern P is formed in the cell C to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B appear. For example, a pixel pattern P is formed in the cell C to have a resolution of 70×140. That is, numerous pixel patterns P form a group to constitute one cell C, and a plurality of cells C may be formed on the mask 10 .

2 is a schematic diagram illustrating a process of attaching the conventional mask 10 to the frame 20 . 3 is a schematic diagram illustrating that an alignment error occurs between cells in the process of stretching (F1 to F2) the conventional mask 10 . The stick mask 10 including six cells (C: C1 to C6) shown in FIG. 1A will be described as an example.

Referring to FIG. 2A , first, the stick mask 10 should be flattened. The stick mask 10 is unfolded as it is pulled by applying tensile force F1 to F2 in the long axis direction of the stick mask 10 . In this state, the stick mask 10 is loaded on the frame 20 in the form of a square frame. The cells C1 to C6 of the stick mask 10 are located in the blank area inside the frame 20 of the frame 20 . The frame 20 may have a size such that the cells C1 to C6 of one stick mask 10 are located in an empty area inside the frame, and the cells C1 to C6 of the plurality of stick masks 10 are placed in the frame. It may be large enough to be located in the inner blank area.

Referring to FIG. 2 (b), after aligning while finely adjusting the tensile force (F1 to F2) applied to each side of the stick mask 10, a part of the side of the stick mask 10 is welded (W). Accordingly, the stick mask 10 and the frame 20 are interconnected. Figure 2 (c) shows a cross-section of the stick mask 10 and the frame interconnected.

Referring to FIG. 3 , in spite of finely adjusting the tensile forces F1 to F2 applied to each side of the stick mask 10 , there is a problem in that the mask cells C1 to C3 are not well aligned with each other. For example, the distances D1 to D1″ and D2 to D2″ between the patterns P of the cells C1 to C3 are different from each other, or the patterns P are skewed. Since the stick mask 10 has a large area including a plurality of (eg, six) cells C1 to C6 and has a very thin thickness of several tens of μm, it is easily sagged or twisted by a load. In addition, it is very difficult to check the alignment between the cells C1 to C6 in real time through a microscope while controlling the tensile force F1 to F2 to flatten all the cells C1 to C6.

Therefore, a minute error in the tensile force F1 to F2 may cause an error in the extent to which each cell C1 to C3 of the stick mask 10 is stretched or unfolded, and accordingly, the distance D1 between the mask patterns P ~D1", D2~D2") causes a problem that becomes different. Of course, it is difficult to align perfectly so that the error becomes 0, but in order to prevent the mask pattern P having a size of several to several tens of μm from adversely affecting the pixel process of the ultra-high-definition OLED, the alignment error should not exceed 3 μm. It is preferable not to This alignment error between adjacent cells is referred to as PPA (pixel position accuracy).

In addition, while connecting approximately 6 to 20 of a plurality of stick masks 10 to one frame 20 , respectively, between the plurality of stick masks 10 and a plurality of cells C of the stick mask 10 . It is also very difficult to clarify the alignment state between ~C6), and the processing time according to alignment is inevitably increased, which is a significant reason for reducing productivity.

Meanwhile, after the stick mask 10 is connected and fixed to the frame 20 , the tensile forces F1 to F2 applied to the stick mask 10 may reversely act on the frame 20 . That is, after the stick mask 10 stretched taut by the tensile forces F1 to F2 is connected to the frame 20 , a tension may be applied to the frame 20 . Usually, this tension is not large, so it may not have a significant effect on the frame 20 , but when the size of the frame 20 is reduced in size and rigidity is lowered, this tension may slightly deform the frame 20 . In this way, a problem in which an alignment state is misaligned among the plurality of cells C to C6 may occur.

Accordingly, the present invention proposes a frame 200 and a frame-integrated mask that allows the mask 100 to form an integrated structure with the frame 200 . The mask 100 integrally formed with the frame 200 is prevented from being deformed such as sagging or twisting, and can be clearly aligned with the frame 200 . Since no tensile force is applied to the mask 100 when the mask 100 is connected to the frame 200, a tension sufficient to deform the frame 200 after the mask 100 is connected to the frame 200 may not be applied. . And, it has the advantage of significantly reducing the manufacturing time for integrally connecting the mask 100 to the frame 200 and significantly increasing the yield.

4 is a front view [Fig. 4 (a)] and a side cross-sectional view [Fig. 4 (b)] showing a frame-integrated mask according to an embodiment of the present invention, and Fig. 5 is a frame-integrated mask according to an embodiment of the present invention. It is a front view [FIG. 5(a)] and a side cross-sectional view [FIG. 5(b)] which show a frame.

4 and 5 , the frame-integrated mask may include a plurality of masks 100 and one frame 200 . In other words, a plurality of masks 100 are attached to the frame 200 one by one. Hereinafter, for convenience of explanation, the mask 100 having a rectangular shape will be described as an example, but the masks 100 may be in the form of a stick mask having protrusions clamped on both sides before being attached to the frame 200 , and the frame 200 . ) after being attached to the protrusion can be removed.

A plurality of mask patterns P may be formed on each mask 100 , and one cell C may be formed on one mask 100 . One mask cell C may correspond to one display such as a smart phone. To form a thin film, the mask 100 may be formed by electroforming. Mask 100 may be a coefficient of thermal expansion of about 1.0 X 10 ^-6 / ℃ of invar (invar), about 1.0 X 10 ^-7 / ℃ Super Invar (super invar) material. Since the mask 100 made of this material has a very low coefficient of thermal expansion, there is little fear that the pattern shape of the mask is deformed by thermal energy, so it can be used as a fine metal mask (FMM) or a shadow mask in high-resolution OLED manufacturing. In addition, considering that technologies for performing a pixel deposition process in a range where the temperature change value is not large recently, the mask 100 may have a slightly larger coefficient of thermal expansion than nickel (Ni) and nickel-cobalt (Ni-Co). ) may be a material such as The thickness of the mask may be about 2 μm to about 50 μm.

The frame 200 is formed so that a plurality of masks 100 can be attached thereto. The frame 200 may include several corners formed in a first direction (eg, a horizontal direction) and a second direction (eg, a vertical direction) including an outermost edge. These various corners may define a region on the frame 200 to which the mask 100 is to be attached.

The frame 200 may include an edge frame portion 210 having a substantially rectangular shape or a rectangular frame shape. The inside of the edge frame part 210 may have a hollow shape. That is, the edge frame portion 210 may include the hollow region (R). The frame 200 may be made of a metal material such as Invar, Super Invar, aluminum, or titanium, and is made of Invar, Super Invar, Nickel, Nickel-Cobalt, etc., having the same coefficient of thermal expansion as the mask in consideration of thermal deformation. Preferably, these materials may be applied to both the edge frame part 210 and the mask cell sheet part 220 that are components of the frame 200 .

In addition, the frame 200 may include a plurality of mask cell regions CR, and may include a mask cell sheet unit 220 connected to the edge frame unit 210 . Like the mask 100 , the mask cell sheet unit 220 may be formed by electroplating, or may be formed using other film forming processes. In addition, the mask cell sheet unit 220 may be connected to the edge frame unit 210 after forming a plurality of mask cell regions CR on a flat sheet through laser scribing, etching, or the like. Alternatively, the mask cell sheet unit 220 may form a plurality of mask cell regions CR through laser scribing, etching, or the like after connecting a flat sheet to the edge frame unit 210 . In the present specification, it is mainly assumed that a plurality of mask cell regions CR are first formed on the mask cell sheet part 220 and then connected to the edge frame part 210 .

The mask cell sheet part 220 may include at least one of the edge sheet part 221 and the first and second grid sheet parts 223 and 225 . The edge sheet portion 221 and the first and second grid sheet portions 223 and 225 refer to partitioned portions of the same sheet, and they are integrally formed with each other.

The edge sheet part 221 may be substantially connected to the edge frame part 210 . Accordingly, the edge sheet part 221 may have a substantially rectangular shape or a rectangular frame shape corresponding to the edge frame part 210 .

Also, the first grid sheet part 223 may be formed to extend in the first direction (horizontal direction). The first grid sheet part 223 may be formed in a straight shape so that both ends thereof may be connected to the edge sheet part 221 . When the mask cell sheet unit 220 includes a plurality of first grid sheet units 223 , each of the first grid sheet units 223 may have equal intervals.

In addition, the second grid sheet part 225 may be formed to extend in the second direction (vertical direction). The second grid sheet part 225 may be formed in a straight shape so that both ends thereof may be connected to the edge sheet part 221 . The first grid sheet unit 223 and the second grid sheet unit 225 may vertically cross each other. When the mask cell sheet unit 220 includes a plurality of second grid sheet units 225 , each of the second grid sheet units 225 may have equal intervals.

Meanwhile, the distance between the first grid sheet parts 223 and the distance between the second grid sheet parts 225 may be the same or different depending on the size of the mask cell C. As shown in FIG.

Although the first grid sheet part 223 and the second grid sheet part 225 have a thin thickness in the form of a thin film, the shape of the cross-section perpendicular to the longitudinal direction may be a rectangle, a rectangular shape such as a parallelogram, a triangular shape, etc. , sides, and corners may be partially rounded. The cross-sectional shape can be adjusted in the process of laser scribing, etching, etc.

The thickness of the edge frame part 210 may be thicker than the thickness of the mask cell sheet part 220 . The edge frame part 210 may be formed to a thickness of several mm to several cm because it is responsible for the overall rigidity of the frame 200 .

In the case of the mask cell sheet unit 220 , the process of manufacturing a substantially thick sheet is difficult, and if it is too thick, the organic material source 600 (see FIG. 16 ) passes through the mask 100 in the OLED pixel deposition process. It may cause clogging problems. Conversely, if the thickness is too thin, it may be difficult to secure enough rigidity to support the mask 100 . Accordingly, the mask cell sheet portion 220 is thinner than the thickness of the edge frame portion 210 , but is preferably thicker than the mask 100 . The thickness of the mask cell sheet part 220 may be about 0.1 mm to about 1 mm. Also, the width of the first and second grid sheet parts 223 and 225 may be about 1 to 5 mm.

In the flat sheet, a plurality of mask cell regions CR: CR11 to CR56 may be provided except for regions occupied by the edge sheet part 221 and the first and second grid sheet parts 223 and 225 . From another point of view, the mask cell region CR is an area occupied by the edge sheet part 221 and the first and second grid sheet parts 223 and 225 in the hollow region R of the edge frame part 210 . may mean an empty area except for .

As the cell C of the mask 100 corresponds to the mask cell region CR, it can be used as a path through which the pixels of the OLED are deposited substantially through the mask pattern P. As described above, one mask cell C corresponds to one display such as a smart phone. Mask patterns P constituting one cell C may be formed on one mask 100 . Alternatively, one mask 100 may include a plurality of cells C, and each cell C may correspond to each cell region CR of the frame 200, but the mask 100 may be clearly aligned. For this, it is necessary to avoid the large-area mask 100 , and a small-area mask 100 including one cell C is preferable. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell region CR of the frame 200 . In this case, it may be considered to correspond to the mask 100 having a small number of cells C of about 2-3 for clear alignment.

The frame 200 includes a plurality of mask cell regions CR, and each mask 100 may be attached such that one mask cell C corresponds to the mask cell region CR. Each mask 100 may include a mask cell C on which a plurality of mask patterns P are formed, and a dummy (corresponding to a portion of the mask film 110 excluding the cell C) around the mask cell C. have. The dummy may include only the mask layer 110 or the mask layer 110 on which a predetermined dummy pattern similar to the mask pattern P is formed. The mask cell C corresponds to the mask cell region CR of the frame 200 , and a part or all of the dummy may be attached to the frame 200 (the mask cell sheet unit 220 ). Accordingly, the mask 100 and the frame 200 can form an integrated structure.

Meanwhile, according to another embodiment, the frame is not manufactured by attaching the mask cell sheet part 220 to the edge frame part 210 , but the edge frame part 210 in the hollow region R of the edge frame part 210 . ) and a grid frame (corresponding to grid sheet portions 223 and 225) integrally formed thereon may be used. This type of frame also includes at least one mask cell region CR, and by matching the mask 100 to the mask cell region CR, a frame-integrated mask can be manufactured.

Hereinafter, a process for manufacturing the frame-integrated mask will be described.

First, the frame 200 described above with reference to FIGS. 4 and 5 may be provided. 6 is a schematic diagram illustrating a manufacturing process of the frame 200 according to an embodiment of the present invention.

Referring to (a) of FIG. 6 , an edge frame part 210 is provided. The edge frame part 210 may have a rectangular frame shape including the hollow region R.

Next, referring to FIG. 6B , the mask cell sheet part 220 is manufactured. The mask cell sheet part 220 may be manufactured by manufacturing a flat sheet using electroplating or other film forming process, and then removing the mask cell region CR part through laser scribing, etching, etc. have. In the present specification, a case in which 6 X 5 mask cell regions CR: CR11 to CR56 are formed will be described as an example. Five first grid sheet parts 223 and four second grid sheet parts 225 may exist.

Next, the mask cell sheet part 220 may correspond to the edge frame part 210 . In the process of matching, all sides of the mask cell sheet part 220 are stretched (F1 to F4) to flatten the mask cell sheet part 220 and the edge sheet part 221 to the edge frame part 210 . can respond On one side, the mask cell sheet 220 may be held and tensioned at several points (eg, 1 to 3 points in FIG. 6(b) ). Meanwhile, the mask cell sheet unit 220 may be stretched (F1, F2) along some lateral directions instead of all sides.

Next, when the mask cell sheet part 220 corresponds to the edge frame part 210 , the edge sheet part 221 of the mask cell sheet part 220 may be attached by welding (W). It is preferable to weld (W) all sides so that the mask cell sheet part 220 can be firmly attached to the edge frame part 220 . Welding (W) should be performed as close to the edge of the edge frame part 210 as possible to reduce the floating space between the edge frame part 210 and the mask cell sheet part 220 as much as possible and increase adhesion. The weld (W) portion may be created in the form of a line or a spot, and has the same material as the mask cell sheet 220 and integrates the edge frame 210 and the mask cell sheet 220 together. It can be a medium that connects

7 is a schematic diagram illustrating a manufacturing process of a frame according to another embodiment of the present invention. In the embodiment of FIG. 6 , the mask cell sheet part 220 having the mask cell region CR is first manufactured and attached to the edge frame part 210 , but in the embodiment of FIG. 7 , a flat sheet is used as the edge frame part ( After attaching to 210 , a mask cell region CR portion is formed.

First, as shown in (a) of Figure 6, the frame portion 210 including the hollow region (R) is provided.

Next, referring to FIG. 7A , a flat sheet (planar mask cell sheet portion 220 ′) may correspond to the edge frame portion 210 . The mask cell sheet part 220 ′ is in a planar state in which the mask cell region CR is not yet formed. In the process of matching, all sides of the mask cell sheet unit 220' may be stretched (F1 to F4) to correspond to the edge frame unit 210 in a state in which the mask cell sheet unit 220' is flattened. On one side, the mask cell sheet part 220 ′ may be held and tensioned at several points (eg, 1 to 3 points in FIG. 7A ). Meanwhile, the mask cell sheet unit 220 ′ may be stretched (F1, F2) along some lateral directions instead of all sides.

Next, when the mask cell sheet portion 220 ′ corresponds to the edge frame portion 210 , the edge portion of the mask cell sheet portion 220 ′ may be attached by welding (W). It is preferable to weld (W) all sides so that the mask cell sheet part 220 ′ can be firmly attached to the edge frame part 220 . Welding (W) should be performed as close to the edge of the edge frame part 210 as possible so that the floating space between the edge frame part 210 and the mask cell sheet part 220 ′ can be reduced as much as possible and adhesion can be increased. The weld (W) portion may be created in the form of a line or a spot, and has the same material as the mask cell sheet portion 220 ′, and includes the edge frame portion 210 and the mask cell sheet portion 220 ′. It can be a medium that connects them together.

Next, referring to FIG. 7B , a mask cell region CR is formed on a flat sheet (planar mask cell sheet portion 220 ′). The mask cell region CR may be formed by removing the sheet of the mask cell region CR through laser scribing, etching, or the like. In the present specification, a case in which 6 X 5 mask cell regions CR: CR11 to CR56 are formed will be described as an example. When the mask cell region CR is formed, the edge frame portion 210 and the welded portion W become the edge sheet portion 221 , and five first grid sheet portions 223 and four second grids are formed. The mask cell sheet unit 220 including the sheet unit 225 may be configured.

8 is a plan view (Fig. 8(b)) and a side cross-sectional view of the shape of the mask 100 (Fig. 8(a)) and a state in which the mask 100 is adhered to the tray 50' according to the comparative example. [Fig. 8(c)] is shown. 9 is a plan view of a state in which a tray 50 ′ according to a comparative example is loaded onto the frame 200 and the mask 100 corresponds to the cell region CR of the frame 200 [FIG. 9 (a)] and a side cross-sectional view [FIG. 9(b)]. 10 shows a process of loading the tray 50 ′ according to a comparative example onto the frame 200 and attaching the mask 100 to the cell region CR of the frame 200 and the mask 100 and the tray 50 ′. ) shows a side cross-sectional view and a partially enlarged side cross-sectional view showing the interface state.

Referring to FIG. 8A , a mask 100 having a plurality of mask patterns P formed thereon may be provided. The mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy DM around the mask cell C. The dummy DM corresponds to a portion of the mask layer 110 excluding the cell C, and includes only the mask layer 110 or the mask layer 110 on which a predetermined dummy pattern similar to the mask pattern P is formed. may include A part or all of the dummy DM may be attached to the frame 200 (the mask cell sheet unit 220 ) corresponding to the edge of the mask 100 . The mask 100 made of Invar or Super Invar material can be manufactured by the electroplating method.

The mother plate used as a cathode in electroplating uses a conductive material. As a conductive material, in the case of a metal, metal oxides may be generated on the surface, impurities may be introduced during the metal manufacturing process, and in the case of a polycrystalline silicon substrate, inclusions or grain boundaries may exist, and a conductive polymer In the case of a base material, it is highly likely to contain impurities, and strength. Acid resistance, etc. may be weak. Elements that prevent the uniform formation of an electric field on the surface of the mother plate (or cathode body), such as metal oxides, impurities, inclusions, and grain boundaries, are referred to as “defects”. Due to the defect, a uniform electric field may not be applied to the cathode body made of the above material, so that a portion of the plating film (mask 100 ) may be non-uniformly formed.

In implementing ultra-high-definition pixels of UHD level or higher, the non-uniformity of the plating film and the plating film pattern [mask pattern P] may adversely affect the formation of the pixel. For example, in the case of the current QHD image quality, the pixel size reaches about 30-50㎛ with 500-600 PPI (pixel per inch), and in the case of 4K UHD and 8K UHD high-definition, ~860 PPI and ~1600 PPI and so on. A micro display applied directly to a VR device or a micro display used by inserting a VR device aims for an ultra-high resolution of about 2,000 PPI or higher, and the size of the pixel reaches about 5 to 10 μm. The pattern width of the FMM and shadow mask applied to this can be formed in a size of several to several tens of μm, preferably smaller than 30 μm, so that even defects with a size of several μm occupy a large proportion in the pattern size of the mask. to be. In addition, in order to remove defects in the anode body made of the above material, an additional process for removing metal oxides, impurities, etc. may be performed, and in this process, other defects such as etching of the cathode body material may be induced. have.

Therefore, in the present invention, a single crystal material mother plate (or negative electrode body) may be used. In particular, it is preferable that the material is single-crystal silicon. To have conductivity, a ^{high concentration doping of 10 19} /cm ³ or more may be performed on the mother plate made of single crystal silicon. Doping may be performed on the entire mother plate, or may be performed only on the surface portion of the mother plate.

On the other hand, as a single crystal material, metals such as Ti, Cu, Ag, semiconductors such as GaN, SiC, GaAs, GaP, AlN, InN, InP, Ge, and carbon-based materials such as graphite and graphene _{, CH 3 NH 3 PbCl 3,} CH 3 NH 3 PbBr 3, CH 3 NH 3 PbI 3, SrTiO 3 , etc. page containing the perovskite (perovskite) superconductor single crystalline ceramic, aircraft single crystal second heat-resistant alloy for components for such structures etc. may be used. Metals and carbon-based materials are basically conductive materials. In the case of a semiconductor material, high-concentration doping of 1019 or more may be performed to have conductivity. In the case of other materials, conductivity may be formed by doping or forming oxygen vacancies. Doping may be performed on the entire mother plate, or may be performed only on the surface portion of the mother plate.

In the case of a single crystal material, since there is no defect, there is an advantage that a uniform plating film (mask 100) can be generated due to the formation of a uniform electric field on the entire surface during electroplating. The frame-integrated masks 100 and 200 manufactured through a uniform plating film can further improve the quality level of OLED pixels. And, since there is no need to perform an additional process for removing and resolving defects, there are advantages in that process costs are reduced and productivity is improved.

In addition, if it is a silicon material or a single crystal material capable of forming an insulating film on the surface by oxidation or nitridation, the advantage of being able to form an insulating part only by oxidizing and nitriding the surface of the mother plate if necessary. have. The insulating portion may be formed using a photoresist. Electrodeposition of the plating film (mask 100) is prevented in the portion where the insulating portion is formed, and a pattern (mask pattern P) is formed on the plating film.

On the other hand, it should be noted that the material of the mother plate of the present invention is not necessarily limited to the above-described single crystal material as long as it is within the range of reducing defects in the cathode body.

The width of the mask pattern P may be formed to be smaller than 40 μm, and the thickness of the mask 100 may be formed to be about 2 to 50 μm. Since the frame 200 includes a plurality of mask cell regions CR: CR11 to CR56, the mask 100 having mask cells C: C11 to C56 corresponding to each of the mask cell regions CR: CR11 to CR56. ) may also be provided in plurality.

Next, referring to FIGS. 8B and 8C , the mask 100 may be adhered on a tray 50 ′. The mask 100 electrodeposited on the mother plate may be removed and adhered to the tray 50 ′. Electrostatic force, magnetic force, vacuum, etc. may be used so that the mask 100 is flatly spread and adhered on one surface of the tray 50 ′ without wrinkles or wrinkles. The tray 50 ′ may be made of a glass material through which the laser light L can pass.

Next, referring to FIGS. 9A and 9B , the mask 100 may correspond to one mask cell region CR of the frame 200 . The mask 100 is formed by turning over the tray 50 ′ to which the mask 100 is adhered, and loading the tray 50 ′ on the frame 200 (or the mask cell sheet unit 220 ). It can correspond to the region CR. When the tray 50 ′ is loaded onto the frame 200 (or the mask cell sheet unit 220 ), the mask 100 is loaded onto the tray 50 ′ and the frame 200 (or the mask cell sheet unit 220 ). )], and can be compressed by the tray 50'

Referring to FIG. 10 , the mask 100 may be attached to the frame 200 by laser welding by irradiating the laser L on the mask 100 . A welding bead WB is generated in the welding part of the laser-welded mask, and the welding bead WB may have the same material as that of the mask 100/frame 200 and may be integrally connected.

Meanwhile, in addition to pressing the mask 100 by the tray 50 ′, the mask 100 and the frame 200 (or the edge sheet portion 221 , and the first and second grid sheet portions 223 and 225 ) ], it is possible to add compression to the compression body (M) from the top of the tray (50') so that more closely abutting. In addition to the load by the weight of the compression body (M) may further include means for pressing the compression body (M). A through hole MH through which the laser L passes may be formed in the compression body M, and the laser L passes through the through hole MH and then passes through the transparent tray 50 ′ to the mask 100 . It can be irradiated to the welding part (the area to be welded) of

However, despite the load of the tray 50 ′ and the compression body M as described above, a fine air gap AG may exist on the interface between the tray 50 ′ and the mask 100 . Since the glass tray 50 ′ has a surface roughness Ra of about 20 to 30 μm, when looking at the surface of the tray 50 ′ on a micrometer scale, there is usually a fine curve. Accordingly, even when the mask 100 is compressed, there may be a portion where the tray 50 ′ and the mask 100 do not come into close contact with each other. [Alternatively, the edge sheet portion 221 and the first and second grid sheet portions 223 and 225] may not come into close contact with each other.

In a portion where the tray 50' and the mask 100 are in close contact without an air gap AG, the welding bead WB is well generated between the mask 100 and the frame 200 by the laser L1 irradiation, and , by integrally connecting the mask 100 and the frame 200, as a result, welding can be performed well. However, in a portion that does not come into close contact due to the presence of an air gap AG between the tray 50 ′ and the mask 100, a welding bead ( WB) is not well generated, and as a result, there is a problem that welding is not performed well.

Accordingly, the present invention is characterized in that it provides a tray 50 that can be in close contact with the mask 100 without an air gap (AG).

11 is a process for loading the tray 50 on the frame 200 and attaching the mask 100 to the cell region CR of the frame 200 and the mask 100 and the tray according to an embodiment of the present invention. It is a side cross-sectional view and a partially enlarged side cross-sectional view showing the interface state of (50). 12 is a plan view [Fig. 12 (a)] and a rear view [Fig. 12 (b)] showing the tray 50 according to an embodiment of the present invention. 13 is a schematic diagram illustrating a state in which the tray 50 is loaded onto the frame 200 and the mask 100 corresponds to the cell region CR of the frame 200 according to an embodiment of the present invention.

11 and 12 , the mask 100 may be adhered to the tray 50 . The mask 100 electrodeposited on the mother plate may be removed and adhered to the tray 50 . The tray 50 is preferably in the shape of a flat plate so that the mask 100 can be adhered flatly. The size of the tray 50 may be a flat plate shape larger than that of the mask 100 so that the mask 100 can be adhered flat as a whole.

Electrostatic force, magnetic force, vacuum, etc. may be used so that the mask 100 is spread flat without wrinkling or wrinkles on one surface of the tray 50 and adhered. The method of using electrostatic force is a method of inducing static electricity by rubbing an electrified body on one surface of the tray 50 . In addition, in the method using electrostatic force, a voltage is applied to the transparent electrode disposed on the upper or lower surface of the tray 50 , and when a voltage is also applied to the mask 100 , static electricity is induced and the mask 100 is spread flat. It is a method of being adhered to one surface of the tray 50 with a predetermined adhesive force while being removed. The method of using magnetic force is a method of holding and moving the mask 100 by magnetic force using a plurality of magnets on the opposite surface of the tray 50 on which the mask 100 is disposed. The method of using a vacuum is a method of holding and moving the mask 100 using a vacuum device from one end to the other end of the mask 100 disposed on the tray 50 and spreading it.

In particular, the tray 50 of the present invention is characterized in that one surface in contact with the mask 100 is a mirror surface so that an air gap AG does not occur between the interface with the mask 100 . Specifically, the surface roughness Ra of one surface of the tray 50 may be 100 nm or less. Since the general glass tray 50 ′ described above in FIG. 10 has a surface roughness Ra of about 20 to 30 μm, the presence of the air gap AG affects the alignment error of the mask pattern P having a μm scale. enough to give However, since the surface roughness Ra of the tray 50 of the present invention is in the nm scale, there is no or almost no air gap AG, and thus the alignment error of the mask pattern P is not affected.

In order to implement the tray 50 having a surface roughness Ra of 100 nm or less, the tray 50 may use a wafer. The wafer (wafer) has a surface roughness (Ra) of about 10 nm, and since there are many products on the market and many surface treatment processes are known, it is suitable for use as the tray 50 . In addition, if the surface roughness (Ra) can satisfy 100 nm or less by micro-mirror processing the surface, the tray 50 is glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O) ₃ ) can also be used. Hereinafter, it is assumed that the wafer is used as the tray 50 .

Referring to the enlarged portion of FIG. 11 , it can be seen that the interface between the tray 50 and the mask 100 having a surface roughness Ra of 100 nm or less is in close contact without an air gap AG. Laser welding may be performed by irradiating the laser L to the welding part of the mask 100 . The welding part of the mask 100 may refer to a target area in which the welding bead WB is to be formed by irradiating the laser L. The welding portion may correspond to at least a partial region of the rim or the dummy DM portion of the mask 100 .

On the other hand, the tray 50 made of a wafer material may be opaque to the laser (L) light. Accordingly, the tray 50 of the present invention has a laser passing hole 51 in the tray 50 so that the laser L irradiated from the upper portion of the tray 50 can reach the welding part of the mask 100 . characterized in that it is formed.

Referring to (a) and (b) of Figure 12, the laser through hole 51 may be formed in the tray 50 to correspond to the position and number of welds. Since a plurality of welding parts are disposed along a predetermined interval in the edge or dummy DM portion of the mask 100 , a plurality of laser passing holes 51 may be formed along a predetermined interval to correspond thereto. For example, since a plurality of welding parts are disposed along a predetermined interval on both sides (left/right) dummy DM portions of the mask 100 , the tray 50 is also located on both sides (left/right) of the laser passing hole 51 . A plurality may be formed along a predetermined interval.

The laser passing hole 51 does not necessarily correspond to the position and number of the welding part. For example, welding may be performed by irradiating the laser L to only a portion of the laser passing holes 51 . In addition, some of the laser passing holes 51 that do not correspond to the welding part may be used instead of the alignment mark when aligning the mask 100 and the tray 50 . If the material of the tray 50 is transparent to the laser (L) light, the laser passing hole 51 may not be formed.

The pressing body M is provided on the tray 50 so that the mask 100 and the frame 200 (or the edge sheet part 221 and the first and second grid sheet parts 223 and 225 ) more closely contact each other. More compression is possible. In addition to the load by the weight of the compression body (M) may further include means for pressing the compression body (M). A through hole MH through which the laser L passes may be formed in the compression body M, and the forming area of the through hole MH may overlap with the forming area of the laser through hole 51 of the tray 50 . can The laser L may pass through the through hole MH and then through the laser through hole 51 of the tray 50 to be irradiated to the welding portion (the region to be welded) of the mask 100 . Laser welding should be performed as close to the edge of the frame 200 as possible to reduce the floating space between the mask 100 and the frame 200 as much as possible and increase adhesion.

The tray 50 and the mask 100 can be in close contact without an air gap AG, and the tray 50 and the mask 100 are compressed by the load of the upper compression body M and the tray 50 itself 100 ), the mask 100 and the frame 200 (or, the edge sheet part 221 , and the first and second grid sheet parts 223 and 225 ) may more closely contact each other. Accordingly, the welding bead WB may be well generated between the mask 100 and the frame 200 by the laser L irradiation. The welding bead WB can be viewed as a part of the mask 100 molten, has the shape of a spot or a line, and is interposed to connect the mask 100 and the frame 200 integrally. Thus, as a result, welding can be performed well.

Next, referring to FIGS. 13A and 13B , the mask 100 may correspond to one mask cell region CR of the frame 200 . The mask 100 is placed in the mask cell region ( CR) can be matched. While controlling the position of the tray 50 , it is possible to check whether the mask 100 corresponds to the mask cell region CR through a microscope. When the tray 50 is loaded on the frame 200 (or the mask cell sheet part 220 ), the mask 100 is the tray 50 and the frame 200 (or the mask cell sheet part 220 ). It may be pressed by the tray 50 while being disposed therebetween.

Meanwhile, the lower support 70 may be further disposed under the frame 200 . The lower support 70 may have a size sufficient to fit into the hollow region R of the frame edge portion 210 and may have a flat plate shape. In addition, a predetermined support groove (not shown) corresponding to the shape of the mask cell sheet part 220 may be formed on the upper surface of the lower support body 70 . In this case, the edge sheet part 221 and the first and second grid sheet parts 223 and 225 are fitted into the support grooves, so that the mask cell sheet part 220 can be more well fixed.

The lower support 70 may press the opposite surface of the mask cell region CR to which the mask 100 contacts. That is, the lower support 70 may support the mask cell sheet 220 in an upward direction to prevent the mask cell sheet 220 from sagging in the downward direction in the process of attaching the mask 100 . At the same time, since the lower support 70 and the tray 50 press the edge and the frame 200 (or the mask cell sheet part 220) of the mask 100 in opposite directions, the mask 100 can be maintained without being disturbed.

According to the present invention, the mask 100 corresponds to the mask cell region CR of the frame 200 only by attaching the mask 100 on the tray 50 and loading the tray 50 on the frame 200 . Since the process is completed, it is characterized in that no tensile force is applied to the mask 100 in this process.

Since the mask cell sheet portion 220 of the frame 200 has a thin thickness, when it is attached to the mask cell sheet portion 220 while a tensile force is applied to the mask 100, the tensile force remaining in the mask 100 is applied to the mask. It acts on the cell sheet part 220 and the mask cell region CR and may deform them. Therefore, it is necessary to attach the mask 100 to the mask cell sheet 220 without applying a tensile force to the mask 100 . Thus, it is possible to prevent deformation of the frame 200 (or the mask cell sheet unit 220 ) by acting as tension on the frame 200 , opposite to the tensile force applied to the mask 100 .

However, one problem arises when a frame-integrated mask is manufactured by attaching it to the frame 200 (or the mask cell sheet 220) without applying a tensile force to the mask 100, and the frame-integrated mask is used in a pixel deposition process. can occur In the pixel deposition process performed at about 25 to 45° C., the mask 100 is thermally expanded by a predetermined length. Even with the mask 100 made of Invar material, the length may change by about 1 to 3 ppm according to a temperature increase of about 10° C. to form an atmosphere for the pixel deposition process. For example, when the total length of the mask 100 is 500 mm, the length may be increased by about 5 to 15 μm. Then, while the mask 100 is deformed, such as sagging by its own weight or being stretched and twisted in a fixed state in the frame 200, a problem in that the alignment error of the patterns P increases.

Therefore, according to the present invention, at a temperature higher than room temperature, without applying a tensile force to the mask 100 , it can correspond to and attach to the mask cell region CR of the frame 200 . In the present specification, it is expressed that the mask 100 is attached to the frame 200 after the temperature of the process region is raised (ET) to the first temperature.

The “process region” may mean a space in which components such as the mask 100 and the frame 200 are located, and an attachment process of the mask 100 is performed. The process region may be a space within a closed chamber or an open space. Also, when the frame-integrated mask is used for the OLED pixel deposition process, the “first temperature” may mean a temperature that is higher than or equal to the pixel deposition process temperature. Considering that the pixel deposition process temperature is about 25 to 45°C, the first temperature may be about 25 to 60°C. The temperature increase of the process region may be performed by installing a heating means in the chamber or a method of installing a heating means around the process region.

Again, referring to FIG. 13 , after the mask 100 corresponds to the mask cell region CR, the temperature of the process region including the frame 200 may be increased (ET) to the first temperature. Alternatively, after the temperature of the process region including the frame 200 is increased (ET) to the first temperature, the mask 100 may correspond to the mask cell region CR. Although the drawing shows that only one mask 100 corresponds to one mask cell region CR, the temperature of the process region is increased to the first temperature after matching the masks 100 for each mask cell region CR. (ET) can also be done.

Since the conventional mask 10 of FIG. 1 includes six cells (C1 to C6), it has a long length, whereas the mask 100 of the present invention has a short length including one cell (C). The degree of distortion of pixel position accuracy (PPA) may be reduced. For example, assuming that the length of the mask 10 including the plurality of cells C1 to C6, ... is 1 m, and a PPA error of 10 μm occurs in the entire 1 m, the mask 100 of the present invention can make the above error range 1/n according to the relative length reduction [corresponding to the reduction in the number of cells (C)]. For example, if the length of the mask 100 of the present invention is 100 mm, since it has a length reduced from 1 m to 1/10 of that of the conventional mask 10, a PPA error of 1 μm occurs over the entire length of 100 mm. , there is an effect that the alignment error is significantly reduced.

On the other hand, if the mask 100 includes a plurality of cells C, and each cell C corresponds to each cell region CR of the frame 200, within a range in which an alignment error is minimized, The mask 100 may correspond to a plurality of mask cell regions CR of the frame 200 . Alternatively, the mask 100 having a plurality of cells C may correspond to one mask cell region CR. Even in this case, in consideration of the processing time and productivity according to the alignment, it is preferable that the mask 100 includes as few cells C as possible.

In the case of the present invention, since it is only necessary to match one cell (C) of the mask 100 and check the alignment state, it is necessary to simultaneously correspond a plurality of cells (C: C1 to C6) and check the alignment state. Compared to the conventional method [see Fig. 2], the manufacturing time can be significantly reduced.

That is, the frame-integrated mask manufacturing method of the present invention corresponds to each cell C11 to C16 included in the six masks 100 to one cell region CR11 to CR16 and checks the alignment state. Through this process, the time can be significantly reduced compared to the conventional method of simultaneously matching the six cells C1 to C6 and checking the alignment status of the six cells C1 to C6 at the same time.

In addition, in the frame-integrated mask manufacturing method of the present invention, the product yield in the 30-step process of matching and aligning 30 masks 100 to 30 cell regions (CR: CR11 to CR56) is 6 cells (C1). ~C6) each containing 5 masks 10 (see Fig. 2 (a)) can be shown to be much higher than the conventional product yield in the process of 5 times of matching and aligning with the frame 20. Since the conventional method of aligning six cells C1 to C6 in an area corresponding to six cells C at a time is a much cumbersome and difficult task, the product yield appears low.

Meanwhile, after the mask 100 corresponds to the frame 200 , the mask 100 may be temporarily fixed to the frame 200 with a predetermined adhesive interposed therebetween. Thereafter, an attaching step of the mask 100 may be performed.

14 is a plan view [Fig. 14 (a)] and a side cross-sectional view [Fig. b)].

Referring to FIG. 14 , after the mask 100 is attached to the mask cell area CR11 correspondingly, the mask 100 may be attached to the mask cell area CR12 adjacent thereto. Although only two masks 100 are attached in FIG. 14 , the masks 100 may be attached to all the mask cell regions CR correspondingly.

A form in which one edge of two adjacent masks 100 is attached (forming a welding bead WB) appears on the upper surface of the first grid sheet part 223 (or the second grid sheet part 225 ). The width and thickness of the first grid sheet part 223 (or the second grid sheet part 225 ) may be formed to be about 1 to 5 mm, and in order to improve product productivity, the first grid sheet part 223 [ Alternatively, it is necessary to reduce the overlapping width of the second grid sheet portion 225] and the edge of the mask 100 as much as possible to about 0.1 to 2.5 mm.

Since welding LW is performed on the mask cell sheet 220 without applying a tensile force to the mask 100 , the mask cell sheet 220 (or the edge sheet 221 , the first and second grid sheets) No tension is applied to the portions 223 and 225].

After attaching one mask 100 to the frame 200 , the remaining masks 100 are sequentially matched to the remaining mask cells C, and the process of attaching to the frame 200 may be repeated. Since the mask 100 already attached to the frame 200 can suggest the reference position, the time required for sequentially matching the remaining masks 100 to the cell region CR and checking the alignment state is significantly reduced. There are advantages to being And, the pixel position accuracy (PPA) between the mask 100 attached to one mask cell area and the mask 100 attached to the neighboring mask cell area does not exceed 3 μm, so that the alignment is clear. There is an advantage in that it is possible to provide a mask for forming an OLED pixel.

15 is a schematic diagram illustrating a process of lowering (LT) the temperature of the process region after attaching the mask 100 to the cell region CR of the frame 200 according to an embodiment of the present invention.

Next, referring to FIG. 15 , the temperature of the process region may be lowered (LT) to a second temperature. The “second temperature” may mean a temperature lower than the first temperature. Considering that the first temperature is about 25° C. to 60° C., the second temperature may be about 20° C. to 30° C. on the assumption that it is lower than the first temperature, and preferably, the second temperature may be room temperature. The temperature drop of the process region may be performed by installing a cooling means in the chamber, installing a cooling means around the process region, or naturally cooling to room temperature.

When the temperature of the process region is lowered (LT) to the second temperature, the mask 100 may be thermally contracted by a predetermined length. The mask 100 may be isotropically heat-shrinkable along all lateral directions. However, since the mask 100 is fixedly connected to the frame 200 (or, the mask cell sheet unit 220 ) by welding, the heat shrinkage of the mask 100 is self-tensile on the surrounding mask cell sheet unit 220 . (TS) will be approved. The mask 100 may be attached on the frame 200 more taut by the application of the self-tensile TS of the mask 100 .

In addition, since the temperature of the process region is lowered (LT) to the second temperature after each mask 100 is attached on the corresponding mask cell region CR, all the masks 100 are thermally contracted at the same time to cause the frame The problem that 200 is deformed or that the alignment error of the patterns P increases can be prevented. More specifically, even if the tension TS is applied to the mask cell sheet part 220 , since the plurality of masks 100 apply the tension TS in opposite directions to each other, the force is canceled and the mask cell sheet part At 220, no deformation occurs. For example, the first grid sheet part 223 between the mask 100 attached to the CR11 cell area and the mask 100 attached to the CR12 cell area moves to the right of the mask 100 attached to the CR11 cell area. The applied tension TS and the tension TS acting in the left direction of the mask 100 attached to the CR12 cell region may be offset. Thus, the frame 200 (or the mask cell sheet part 220 ) due to the tension TS minimizes deformation so that the alignment error of the mask 100 (or the mask pattern P) can be minimized. There is this.

16 is a schematic diagram illustrating an OLED pixel deposition apparatus 1000 using the frame-integrated masks 100 and 200 according to an embodiment of the present invention.

Referring to FIG. 16 , in the OLED pixel deposition apparatus 1000 , the magnet 310 is accommodated, the magnet plate 300 on which the cooling water line 350 is disposed, and the organic material source 600 from the bottom of the magnet plate 300 . ) includes a deposition source supply unit 500 for supplying the .

A target substrate 900 such as glass on which the organic material source 600 is deposited may be interposed between the magnet plate 300 and the source deposition unit 500 . The frame-integrated masks 100 and 200 [or FMMs] that allow the organic material source 600 to be deposited for each pixel may be disposed in close contact with or very close to the target substrate 900 . The magnet 310 may generate a magnetic field and adhere to the target substrate 900 by the magnetic field.

The deposition source supply unit 500 may supply the organic material source 600 while reciprocating in a left and right path, and the organic material sources 600 supplied from the deposition source supply unit 500 may include patterns P formed on the frame-integrated masks 100 and 200 . ) and may be deposited on one side of the target substrate 900 . The deposited organic material source 600 passing through the pattern P of the frame-integrated masks 100 and 200 may act as the pixel 700 of the OLED.

In order to prevent non-uniform deposition of the pixel 700 due to the shadow effect, the pattern of the frame-integrated masks 100 and 200 may be inclined (S) (or formed in a tapered shape (S)). . Since the organic material sources 600 passing through the pattern in a diagonal direction along the inclined surface may also contribute to the formation of the pixel 700 , the pixel 700 may be deposited to have a uniform thickness as a whole.

Since the mask 100 is attached to and fixed to the frame 200 at a first temperature higher than the pixel deposition process temperature, even if the process temperature for pixel deposition is increased, the position of the mask pattern P has little effect, and the mask The PPA between 100 and the neighboring mask 100 may be maintained to not exceed 3 μm.

Although the present invention has been illustrated and described with reference to preferred embodiments as described above, it is not limited to the above-described embodiments and is not limited to the above-described embodiments, and various methods can be made by those of ordinary skill in the art to which the invention pertains without departing from the spirit of the present invention. Transformation and change are possible. Such modifications and variations are intended to fall within the scope of the present invention and the appended claims.

50: tray
51: laser passing hole
70: lower support
100: mask
110: mask film
200: frame
210: border frame portion
220: mask cell sheet portion
221: border sheet portion
223: first grid sheet portion
225: second grid sheet portion
1000: OLED pixel deposition device
C: cell, mask cell
CR: mask cell area
DM: dummy, mask dummy
ET: increase the temperature of the process region to the first temperature
L: laser
LT: lowering the temperature of the process zone to the second temperature
M: upper pressing body
R: Hollow area of the border frame part
P: mask pattern
TS: tension
W: Weld
WB: Weld Bead

Claims (24)

A method of manufacturing a frame-integrated mask in which at least one mask and a frame supporting the mask are integrally formed, the method comprising:
(a) preparing a frame having at least one mask cell region;
(b) adhering the mask onto the tray;
(c) loading the tray on the frame so that the mask corresponds to the mask cell region of the frame; and
(d) attaching the mask to the frame by irradiating a laser to the welding part of the mask
including,
A laser passage hole is formed in the part of the tray corresponding to the welding part of the mask,
In step (d), the laser irradiated from the top of the tray passes through the laser through hole and is irradiated to the welding part of the mask,
A method of manufacturing a frame-integrated mask, wherein the upper compression body formed so that a portion corresponding to the laser passage hole is penetrated is disposed on the tray to apply a load to the tray. delete delete According to claim 1,
The tray has a flat plate shape, and the surface roughness (Ra) of one surface in contact with the mask includes a material having a surface roughness Ra of 100 nm or less (greater than 0). 5. The method of claim 4,
The tray is a wafer (wafer), glass (glass), silica (silica), heat-resistant glass, quartz (quartz), alumina (Al ₂ O ₃ ) of any one material, a method of manufacturing a frame-integrated mask. delete 5. The method of claim 4,
A method of manufacturing a frame-integrated mask, wherein the formation of an air gap at an interface between the tray and the mask is prevented. delete delete delete According to claim 1,
A method of manufacturing a frame-integrated mask, wherein a lower support is disposed under the frame to press the opposite surface of the mask cell region in which the tray is loaded. The method of claim 1,
raising the temperature of the process region including the frame to a first temperature before or after the mask corresponds to the mask cell region;
A method of manufacturing a frame-integrated mask, wherein the temperature of a process region including the frame is lowered to a second temperature after the mask is adhered to the frame. delete delete The method of claim 1,
A method of manufacturing a frame-integrated mask, wherein no tension is applied to the mask when the mask corresponds to the mask cell region. delete delete delete delete delete delete delete delete delete

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