KR102202531B1 - Mask integrated frame and producing method thereof - Google Patents

Abstract

The present invention relates to a frame-integrated mask and a method of manufacturing the same. The frame-integrated mask according to the present invention is a frame-integrated mask in which a plurality of masks and a frame supporting the mask are integrally formed, the frame comprising: a frame frame portion including a hollow area; It has a plurality of mask cell regions and includes a mask cell sheet part connected to an edge frame part, each mask is connected to an upper part of the mask cell sheet part, and the mask is a mask cell on which a plurality of mask patterns are formed, and around the mask cell The dummy includes a dummy, and a plurality of welding portions are formed at intervals on at least a portion of the dummy, and at least a portion of the dummy in which the welding portions are formed is thicker than a thickness of the mask cell.

Description

Frame-integrated mask and its manufacturing method {MASK INTEGRATED FRAME AND PRODUCING METHOD THEREOF}

The present invention relates to a frame-integrated mask and a method of manufacturing the same. More specifically, a frame-integrated mask capable of stably supporting and moving without deformation of the mask, stably attaching the mask to the frame, and clear alignment between each mask, and its manufacture It's about how.

In recent years, research on an electroforming method in manufacturing a thin plate is in progress. The electroplating method is a method of immersing an anode body and a cathode body in an electrolyte solution, and applying power to deposit a metal thin plate on the surface of the cathode body, so that an ultra-thin plate can be manufactured and mass production can be expected.

Meanwhile, as a technology for forming pixels in the OLED manufacturing process, a Fine Metal Mask (FMM) method is mainly used in which an organic material is deposited at a desired location by attaching a thin metal mask to a substrate.

In the existing OLED manufacturing process, the mask is manufactured in the form of a stick or plate, and then the mask is welded and fixed to the OLED pixel deposition frame. One mask may include several cells corresponding to one display. In addition, in order to manufacture a large area OLED, several masks can be fixed to the OLED pixel deposition frame. In the process of fixing to the frame, each mask is stretched so that it is flat. It is a very difficult task to adjust the tension so that the entire part of the mask is flat. In particular, in order to align a mask pattern with a size of only a few to tens of μm while making all the cells flat, a high level of work is required to check the alignment in real time while finely adjusting the tension applied to each side of the mask. do.

Nevertheless, in the process of fixing several masks to one frame, there is a problem in that the alignment between the masks and the mask cells is not good. Also, in the process of welding and fixing the mask to the frame, the thickness of the mask film is too thin and large area, so the mask is struck or distorted by the load, There were problems such as misalignment.

In the case of ultra-high-definition OLED, the current QHD quality is 500-600 PPI (pixel per inch), and the pixel size reaches about 30-50㎛, and 4K UHD, 8K UHD high-definition is higher than this, ~860 PPI, ~1600 PPI, etc. Will have a resolution of. In this way, in consideration of the pixel size of the ultra-high-definition OLED, the alignment error between cells should be reduced to about several µm, and the error beyond this leads to product failure, so the yield may be very low. Therefore, there is a need to develop a technique for preventing deformation such as a mask being struck or distorted, a technique for clarifying alignment, a technique for fixing a mask to a frame, and the like.

Accordingly, an object of the present invention is to provide a frame-integrated mask and a method of manufacturing the same, which has been devised to solve the problems of the prior art as described above, in which a mask and a frame are integrated.

In addition, an object of the present invention is to provide a frame-integrated mask and a method of manufacturing the same, which can prevent deformation such as being struck or distorted and clear alignment.

In addition, an object of the present invention is to provide a frame-integrated mask and a method for manufacturing the same, which significantly reduces the manufacturing time and significantly increases the yield.

The object of the present invention is a frame-integrated mask in which a plurality of masks and a frame supporting the mask are integrally formed, the frame comprising: a frame frame portion including a hollow area; It has a plurality of mask cell regions and includes a mask cell sheet part connected to an edge frame part, each mask is connected to an upper part of the mask cell sheet part, and the mask is a mask cell on which a plurality of mask patterns are formed, and around the mask cell A dummy of, and at least a portion of the dummy is formed with a plurality of welds at intervals, and at least a portion of the dummy in which the welds are formed is achieved by a frame-integrated mask that is thicker than the thickness of the mask cell.

The mask cell sheet portion, the frame sheet portion; At least one first grid sheet portion extending in a first direction and having both ends connected to the frame sheet portion; And at least one second grid sheet portion extending in a second direction perpendicular to the first direction, crossing the first grid sheet portion, and having both ends connected to the edge sheet portion.

Each mask may correspond to each mask cell area.

The mask and frame may be made of any one of invar, super invar, nickel, and nickel-cobalt.

One surface of the mask connected to the mask cell sheet may be flat, and at least a portion of the dummy may be curved or have a step difference on the other surface facing the one surface of the mask.

In addition, the above object of the present invention is a method of manufacturing a frame-integrated mask in which at least one mask and a frame supporting the mask are integrally formed, the method comprising: (a) preparing a frame having at least one mask cell region; (b) loading the template to which the mask is adhered onto the frame to correspond the mask to the mask cell area of the frame; And (c) attaching the mask to the frame, wherein the mask includes a mask cell on which a plurality of mask patterns are formed, and a dummy around the mask cell, and a plurality of welding portions are formed at intervals on at least part of the dummy , At least a part of the dummy in which the weld is formed is achieved by a method of manufacturing a frame-integrated mask, which is thicker than the thickness of the mask cell.

According to the present invention configured as described above, there is an effect of stably attaching the mask and the frame.

In addition, according to the present invention, there is an effect that the mask can be stably supported and moved without deformation.

Further, according to the present invention, when attaching the mask to the frame, there is an effect of improving the adhesion between the mask and the frame.

Further, according to the present invention, there is an effect that the mask can be repeatedly used after attaching it to the frame.

In addition, according to the present invention, there is an effect that the mask and the frame can form an integral structure.

In addition, according to the present invention, there is an effect of preventing deformation, such as being struck or distorted, of the mask, and enabling clear alignment.

Further, according to the present invention, there is an effect of remarkably reducing the manufacturing time and increasing the yield remarkably.

1 is a schematic diagram showing a conventional OLED pixel deposition mask.
2 is a schematic diagram showing a process of attaching a conventional mask to a frame.
3 is a schematic diagram showing that an alignment error between cells occurs in a process of tensioning a conventional mask.
4 is a front view and a side cross-sectional view showing a frame-integrated mask according to an embodiment of the present invention.
5 is a front view and a side cross-sectional view showing a frame according to an embodiment of the present invention.
6 is a schematic diagram showing a manufacturing process of a frame according to an embodiment of the present invention.
7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention.
8 is a schematic diagram illustrating a process of manufacturing a mask metal layer according to an embodiment of the present invention.
9 is a schematic diagram showing a conventional mask for forming a high-resolution OLED.
10 is a schematic diagram showing a mask according to an embodiment of the present invention.
11 to 12 are schematic diagrams illustrating a process of manufacturing a mask support template by attaching a mask metal layer on a template according to an embodiment of the present invention and forming a mask.
13 is a schematic diagram illustrating a process of loading a mask supporting template onto a frame according to an embodiment of the present invention.
14 is a schematic diagram illustrating a state in which a template according to an embodiment of the present invention is loaded onto a frame and a mask is associated with a cell area of the frame.
15 is a schematic diagram illustrating a process of separating a mask and a template after attaching a mask to a frame according to an embodiment of the present invention.
16 is a schematic diagram showing a state in which a mask according to an embodiment of the present invention is attached to a frame.
17 is a schematic diagram showing an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION The detailed description of the present invention to be described later refers to the accompanying drawings, which illustrate specific embodiments in which the present invention may be practiced. These embodiments are described in detail sufficient to enable a person skilled in the art to practice the present invention. It is to be understood that the various embodiments of the present invention are different from each other, but need not be mutually exclusive. For example, specific shapes, structures, and characteristics described herein may be implemented in other embodiments without departing from the spirit and scope of the present invention in relation to one embodiment. In addition, it is to be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the present invention. Accordingly, the detailed description to be described below is not intended to be taken in a limiting sense, and the scope of the present invention, if properly described, is limited only by the appended claims, along with all scopes equivalent to those claimed by the claims. In the drawings, similar reference numerals refer to the same or similar functions over several aspects, and the length, area, thickness, and the like may be exaggerated and expressed for convenience.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to enable those of ordinary skill in the art to easily implement the present invention.

1 is a schematic diagram showing a conventional OLED pixel deposition mask 10.

Referring to FIG. 1, a conventional mask 10 may be manufactured in a stick-type or plate-type. The mask 10 shown in (a) of FIG. 1 is a stick-type mask, and both sides of the stick can be welded and fixed to an OLED pixel deposition frame. The mask 100 shown in (b) of FIG. 1 is a plate-type mask and may be used in a process of forming a pixel having a large area.

A plurality of display cells C are provided on the body of the mask 10 (or the mask layer 11). One cell C corresponds to one display such as a smartphone. A pixel pattern P is formed in the cell C to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B appear. For example, a pixel pattern P is formed in the cell C to have a resolution of 70 X 140. That is, a number of pixel patterns P are clustered to form one cell C, and a plurality of cells C may be formed on the mask 10.

2 is a schematic diagram showing a process of attaching the conventional mask 10 to the frame 20. 3 is a schematic diagram showing that an alignment error occurs between cells in a process of stretching the conventional mask 10 (F1 to F2). A stick mask 10 including six cells C: C1 to C6 shown in FIG. 1A will be described as an example.

Referring to FIG. 2A, first, the stick mask 10 must be flattened. The stick mask 10 is unfolded as it is pulled by applying a tensile force F1 to F2 in the long axis direction of the stick mask 10. In that state, the stick mask 10 is loaded on the frame 20 in the form of a square frame. Cells C1 to C6 of the stick mask 10 are located in a blank area inside the frame of the frame 20. The frame 20 may have a size such that cells C1 to C6 of one stick mask 10 are located in an empty area inside the frame, and cells C1 to C6 of a plurality of stick masks 10 are It may be large enough to be located in an internal empty area.

Referring to FIG. 2(b), after aligning while finely adjusting the tensile forces (F1 to F2) applied to each side of the stick mask 10, a part of the side of the stick mask 10 is welded (W). Accordingly, the stick mask 10 and the frame 20 are interconnected. 2C shows a cross-sectional side view of the frame and the stick mask 10 connected to each other.

Referring to FIG. 3, although the tensile forces F1 to F2 applied to each side of the stick mask 10 are finely adjusted, there is a problem in that the mask cells C1 to C3 are not well aligned with each other. For example, the distances D1 to D1" and D2 to D2" between the patterns P of the cells C1 to C3 are different from each other, or the patterns P are skewed. Since the stick mask 10 has a large area including a plurality (for example, 6) of cells C1 to C6 and has a very thin thickness of several tens of µm, it is easily struck or distorted by a load. In addition, it is a very difficult task to check the alignment between each cell (C1 to C6) in real time through a microscope while adjusting the tensile force (F1 to F2) to flatten all of the cells (C1 to C6).

Therefore, a minute error in the tensile force (F1 to F2) may cause an error in the extent to which each of the cells (C1 to C3) of the stick mask 10 is stretched or unfolded, and accordingly, the distance D1 between the mask patterns (P) ~D1", D2 ~ D2") causes a problem that becomes different. Of course, it is difficult to completely align the error to be 0, but in order to prevent the mask pattern (P) having a size of several to tens of µm from adversely affecting the pixel process of an ultra-high-definition OLED, the alignment error should not exceed 3 µm. It is desirable not to. This alignment error between adjacent cells is referred to as PPA (pixel position accuracy).

In addition, a plurality of stick masks 10 of about 6 to 20 are connected to one frame 20, respectively, between a plurality of stick masks 10, and a plurality of cells C of the stick mask 10 It is also a very difficult task to clarify the alignment state between ~C6), and the process time according to the alignment is inevitably increased, which is a significant reason for reducing productivity.

On the other hand, after the stick mask 10 is connected and fixed to the frame 20, the tensile forces F1 to F2 applied to the stick mask 10 may act in reverse to the frame 20. That is, after the stick mask 10, which was stretched by the tensile force F1 to F2, is connected to the frame 20, a tension may be applied to the frame 20. Usually, this tension is not large and may not have a large effect on the frame 20, but when the size of the frame 20 is reduced in size and the rigidity is lowered, this tension may finely deform the frame 20. As a result, there may be a problem of misalignment between the plurality of cells C to C6.

Accordingly, the present invention proposes a frame 200 and a frame-integrated mask that enables the mask 100 to form an integral structure with the frame 200. The mask 100 integrally formed in the frame 200 is prevented from being struck or warped, and may be clearly aligned with the frame 200. Since no tensile force is applied to the mask 100 when the mask 100 is connected to the frame 200, the frame 200 may not be deformed after the mask 100 is connected to the frame 200. . In addition, the manufacturing time for integrally connecting the mask 100 to the frame 200 can be significantly reduced, and the yield can be remarkably increased.

Figure 4 is a front view [Fig. 4 (a)] and a side cross-sectional view [Fig. 4 (b)] showing a frame-integrated mask according to an embodiment of the present invention, Figure 5 is according to an embodiment of the present invention It is a front view [FIG. 5(a)] and a side cross-sectional view [FIG. 5(b)] showing the frame.

4 and 5, the frame-integrated mask may include a plurality of masks 100 and one frame 200. In other words, a plurality of masks 100 are attached to the frame 200, one by one. Hereinafter, for convenience of explanation, a square-shaped mask 100 will be described as an example, but the mask 100 may be in the form of a stick mask having protrusions clamped on both sides before being attached to the frame 200, and the frame 200 ), the protrusion can be removed after being attached.

A plurality of mask patterns P may be formed on each mask 100, and one cell C may be formed on one mask 100. One mask cell C may correspond to one display such as a smartphone. In order to form a thin thickness, the mask 100 may be formed by electroforming. Mask 100 may be a coefficient of thermal expansion of about 1.0 X 10 ^-6 / ℃ of invar (invar), about 1.0 X 10 ^-7 / ℃ Super Invar (super invar) material. Since the mask 100 made of this material has a very low coefficient of thermal expansion, it is less likely that the pattern shape of the mask may be deformed by thermal energy, so it can be used as a Fine Metal Mask (FMM) or a shadow mask in high-resolution OLED manufacturing. In addition, considering the recent development of technologies for performing a pixel deposition process in a range where the temperature change value is not large, the mask 100 is made of nickel (Ni) and nickel-cobalt (Ni-Co) having a slightly larger coefficient of thermal expansion than this. ), etc. The mask may have a thickness of about 2 μm to 50 μm.

The frame 200 is formed to attach a plurality of masks 100. The frame 200 may include several corners formed in a first direction (eg, horizontal direction) and a second direction (eg, vertical direction) including an outermost edge. These various corners may partition a region on the frame 200 to which the mask 100 is to be attached.

The frame 200 may include a frame portion 210 having a substantially square shape or a square frame shape. The inside of the frame frame 210 may have a hollow shape. That is, the frame frame unit 210 may include a hollow region R. The frame 200 may be made of metal materials such as Invar, Super Invar, aluminum, titanium, etc., and in consideration of thermal deformation, it is composed of materials such as Invar, Super Invar, nickel, nickel-cobalt, etc., which have the same coefficient of thermal expansion as the mask. Preferably, these materials may be applied to both the frame part 210 and the mask cell sheet part 220 which are components of the frame 200.

In addition, the frame 200 may include a plurality of mask cell regions CR, and may include a mask cell sheet part 220 connected to the frame frame part 210. Like the mask 100, the mask cell sheet part 220 may be formed by electroplating, or may be formed using another film forming process. In addition, the mask cell sheet part 220 may form a plurality of mask cell regions CR on a planar sheet through laser scribing, etching, or the like, and then connect to the frame frame part 210. Alternatively, the mask cell sheet part 220 may form a plurality of mask cell regions CR through laser scribing, etching, or the like after connecting the planar sheet to the frame frame part 210. In the present specification, it is assumed that a plurality of mask cell regions CR are first formed in the mask cell sheet part 220 and then connected to the frame frame part 210.

The mask cell sheet part 220 may be configured to include at least one of an edge sheet part 221 and first and second grid sheet parts 223 and 225. The frame sheet portion 221 and the first and second grid sheet portions 223 and 225 refer to respective portions partitioned in the same sheet, and they are integrally formed with each other.

The frame sheet part 221 may be substantially connected to the frame frame part 210. Accordingly, the frame sheet part 221 may have a substantially square shape and a square frame shape corresponding to the frame frame part 210.

In addition, the first grid sheet portion 223 may be formed to extend in a first direction (horizontal direction). The first grid sheet portion 223 may be formed in a linear shape so that both ends may be connected to the edge sheet portion 221. When the mask cell sheet portion 220 includes a plurality of first grid sheet portions 223, it is preferable that each of the first grid sheet portions 223 form equal intervals.

Further, in addition to this, the second grid sheet portion 225 may be formed to extend in a second direction (vertical direction). The second grid sheet portion 225 may be formed in a linear shape so that both ends may be connected to the edge sheet portion 221. The first grid sheet portion 223 and the second grid sheet portion 225 may vertically cross each other. When the mask cell sheet portion 220 includes a plurality of second grid sheet portions 225, each of the second grid sheet portions 225 is preferably formed at an equal interval.

Meanwhile, the spacing between the first grid sheet parts 223 and the spacing between the second grid sheet parts 225 may be the same or different according to the size of the mask cell C.

The first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, but the shape of a cross-section perpendicular to the length direction may be a rectangle, a square shape such as a trapezoid, a triangle shape, etc., Some of the sides and corners may be rounded. The cross-sectional shape can be adjusted in the process of laser scribing and etching.

The thickness of the frame frame part 210 may be thicker than the thickness of the mask cell sheet part 220. Since the frame frame portion 210 is responsible for the overall rigidity of the frame 200, it may be formed to a thickness of several mm to several cm.

In the case of the mask cell sheet part 220, the process of manufacturing a substantially thick sheet is difficult, and if it is too thick, the organic material source 600 (see FIG. 17) passes through the mask 100 in the OLED pixel deposition process. It can cause clogging problems. Conversely, if the thickness is too thin, it may be difficult to secure enough rigidity to support the mask 100. Accordingly, the mask cell sheet portion 220 is thinner than the thickness of the frame frame portion 210, but is preferably thicker than the mask 100. The thickness of the mask cell sheet part 220 may be about 0.1 mm to 1 mm. In addition, the first and second grid sheet portions 223 and 225 may have a width of about 1 to 5 mm.

A plurality of mask cell areas CR (CR11 to CR56) may be provided except for the area occupied by the edge sheet portion 221 and the first and second grid sheet portions 223 and 225 in a flat sheet. In another aspect, the mask cell area CR is an area occupied by the frame sheet part 221 and the first and second grid sheet parts 223 and 225 in the hollow area R of the frame frame part 210. Except for, it may mean an empty area.

As the cell C of the mask 100 corresponds to the mask cell region CR, it can be used as a passage through which the pixel of the OLED is deposited substantially through the mask pattern P. As described above, one mask cell C corresponds to one display such as a smartphone. Mask patterns P constituting one cell C may be formed on one mask 100. Alternatively, one mask 100 may include a plurality of cells C, and each cell C may correspond to each cell area CR of the frame 200, but clear alignment of the mask 100 is achieved. In order to do so, it is necessary to avoid the large-area mask 100, and a small-area mask 100 having one cell C is preferable. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell area CR of the frame 200. In this case, for clear alignment, it may be considered to correspond to the mask 100 having a small number of cells C of about 2-3.

The frame 200 includes a plurality of mask cell areas CR, and each mask 100 may be attached such that one mask cell C corresponds to the mask cell area CR. Each mask 100 may include a mask cell C having a plurality of mask patterns P formed thereon, and a dummy around the mask cell C (corresponding to a portion of the mask layer 110 excluding the cell C). have. The dummy may include only the mask layer 110 or may include the mask layer 110 in which a predetermined dummy pattern similar to the mask pattern P is formed. The mask cell C corresponds to the mask cell area CR of the frame 200, and a part or all of the dummy may be attached to the frame 200 (mask cell sheet part 220). Accordingly, the mask 100 and the frame 200 can form an integral structure.

Meanwhile, according to another embodiment, the frame is not manufactured by attaching the mask cell sheet part 220 to the frame frame part 210, but the frame frame part 210 is formed in the hollow region R part of the frame frame part 210. ) And an integral grid frame (corresponding to the grid seat portions 223 and 225) may be directly formed. This type of frame also includes at least one mask cell area CR, and a frame-integrated mask can be manufactured by matching the mask 100 to the mask cell area CR.

Hereinafter, a process of manufacturing a frame-integrated mask will be described.

First, the frame 200 described above in FIGS. 4 and 5 may be provided. 6 is a schematic diagram showing a manufacturing process of the frame 200 according to an embodiment of the present invention.

Referring to FIG. 6A, a frame frame part 210 is provided. The frame frame part 210 may have a rectangular frame shape including a hollow region R.

Next, referring to FIG. 6B, a mask cell sheet part 220 is manufactured. The mask cell sheet part 220 can be manufactured by manufacturing a flat sheet using electroplating or other film forming processes, and then removing a portion of the mask cell area (CR) through laser scribing or etching. have. In this specification, an example in which a 6 X 5 mask cell region (CR: CR11 to CR56) is formed will be described. Five first grid sheet portions 223 and four second grid sheet portions 225 may be present.

Next, the mask cell sheet part 220 may correspond to the frame frame part 210. In the process of correspondence, all sides of the mask cell sheet part 220 are stretched (F1 to F4) to flatten the mask cell sheet part 220 and the frame sheet part 221 is attached to the frame frame part 210. Can respond. In one side, it is possible to hold the mask cell sheet portion 220 at several points (for example, 1 to 3 points in FIG. 6 (b)) and stretch it. On the other hand, the mask cell sheet portion 220 may be stretched (F1, F2) along some side directions instead of all sides.

Next, when the mask cell sheet part 220 corresponds to the frame frame part 210, the frame sheet part 221 of the mask cell sheet part 220 may be attached by welding (W). It is preferable to weld (W) all sides so that the mask cell sheet part 220 can be firmly attached to the frame part 220. Welding (W) should be performed as close as possible to the edge of the frame frame part 210 to reduce the excitement space between the frame part 210 and the mask cell sheet part 220 and increase adhesion. The welding (W) part may be created in a line or spot shape, and the frame frame part 210 and the mask cell sheet part 220 are integrally made of the same material as the mask cell sheet part 220. It can be a medium to connect with.

7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention. In the embodiment of FIG. 6, the mask cell sheet part 220 having the mask cell area CR is first manufactured and attached to the frame frame part 210. However, in the embodiment of FIG. 210), a mask cell region CR is formed.

First, as shown in (a) of FIG. 6, a frame part 210 including a hollow region R is provided.

Next, referring to FIG. 7A, a flat sheet (a flat mask cell sheet 220 ′) may correspond to the frame frame 210. The mask cell sheet part 220 ′ is in a planar state in which the mask cell area CR has not yet been formed. In the matching process, all sides of the mask cell sheet part 220 ′ are stretched (F1 to F4) to correspond to the frame frame part 210 with the mask cell sheet part 220 ′ flattened. One side can also hold the mask cell sheet portion 220 ′ at several points (eg, 1 to 3 points in FIG. 7 (a)) and tension. On the other hand, the mask cell sheet portion 220 ′ may be stretched (F1, F2) along some side directions instead of all sides.

Next, when the mask cell sheet part 220 ′ corresponds to the frame frame part 210, the rim part of the mask cell sheet part 220 ′ may be attached by welding (W). It is preferable to weld (W) all sides so that the mask cell sheet part 220 ′ can be firmly attached to the frame frame part 220. Welding (W) should be performed as close as possible to the edge of the frame frame part 210 to reduce the excitement space between the frame part 210 and the mask cell sheet part 220 ′ and increase adhesion. The welding (W) portion may be generated in a line or spot shape, and has the same material as the mask cell sheet portion 220 ′, and the frame frame portion 210 and the mask cell sheet portion 220 ′ It can be a medium that connects all together.

Next, referring to FIG. 7B, a mask cell region CR is formed on a planar sheet (a planar mask cell sheet portion 220'). The mask cell area CR may be formed by removing the sheet in the mask cell area CR through laser scribing or etching. In this specification, an example in which a 6 X 5 mask cell region (CR: CR11 to CR56) is formed will be described. When the mask cell area CR is formed, the edge frame portion 210 and the welded (W) portion become the edge sheet portion 221, and the five first grid sheet portions 223 and the four second grids A mask cell sheet portion 220 having a sheet portion 225 may be configured.

8 is a schematic diagram showing a manufacturing process of the mask metal layer 110 according to an embodiment of the present invention. In FIG. 8, manufacturing the mask metal layer 110 by electroplating is described as an example, but the mask metal layer 110 of the present invention is not limited thereto, and a rolled material may be used.

Referring to (a) of FIG. 8, a conductive substrate 21 is prepared. In order to perform electroforming, the base material 21 of the base plate may be a conductive material. The mother plate can be used as a cathode electrode in electroplating.

As a conductive material, in the case of metal, metal oxides may be generated on the surface, impurities may be introduced during the metal manufacturing process, in the case of a polycrystalline silicon substrate, inclusions or grain boundaries may exist, and conductive polymers In the case of the base material, the possibility of containing impurities is high and strength. Acid resistance may be weak. An element that prevents uniform formation of an electric field on the surface of the mother plate (or cathode) such as metal oxide, impurities, inclusions, grain boundaries, etc. is referred to as “defect”. Due to defects, a uniform electric field may not be applied to the cathode body made of the above-described material, so that a part of the mask metal layer 110 may be formed unevenly.

In implementing ultra-high definition pixels of the UHD level or higher, non-uniformity of the mask metal layer and the mask metal layer pattern [mask pattern P] may adversely affect the formation of pixels. For example, in the case of current QHD quality, the size of the pixel reaches about 30-50㎛ at 500~600 PPI (pixel per inch), and in the case of 4K UHD and 8K UHD high quality, ~860 PPI and ~1600 PPI are higher. It has the same resolution. Micro-displays directly applied to VR devices, or micro-displays inserted into VR devices, aim for ultra-high quality of about 2,000 PPI or higher, and the size of the pixels reaches about 5 to 10 μm. The pattern width of the FMM and shadow mask applied to this can be formed in a size of several to several tens of µm, preferably smaller than 30 µm, so that even defects of several µm can occupy a large proportion of the pattern size of the mask to be. In addition, in order to remove defects in the cathode material of the above-described material, an additional process for removing metal oxides and impurities may be performed, and in this process, another defect such as etching of the cathode material may be caused. have.

Accordingly, in the present invention, a single crystal base plate (or a cathode body) may be used. In particular, it is preferably made of single crystal silicon. In order to have conductivity, a high concentration doping of 10 ¹⁹ /cm ³ or more may be performed on the mother plate made of single crystal silicon. Doping may be performed on the entire parent plate, or may be performed only on the surface portion of the parent plate.

Meanwhile, as a single crystal material, metals such as Ti, Cu, and Ag, semiconductors such as GaN, SiC, GaAs, GaP, AlN, InN, InP, Ge, and carbon-based materials such as graphite and graphene _{, CH 3 NH 3 PbCl 3,} CH 3 NH 3 PbBr 3, CH 3 NH 3 PbI 3, SrTiO 3 , etc. page containing the perovskite (perovskite) superconductor single crystalline ceramic, aircraft single crystal second heat-resistant alloy for components for such structures Etc. can be used. Metal and carbon-based materials are basically conductive materials. In the case of a semiconductor material, doping with a high concentration of 1019 or higher may be performed to have conductivity. In the case of other materials, doping may be performed or oxygen vacancy may be formed to form conductivity. Doping may be performed on the entire parent plate, or may be performed only on the surface portion of the parent plate.

In the case of a single crystal material, since there are no defects, there is an advantage in that a uniform mask metal film 110 can be generated due to the formation of a uniform electric field over the entire surface during electroplating. The frame-integrated masks 100 and 200 manufactured through a uniform mask metal film can further improve the quality level of OLED pixels. In addition, since there is no need to perform an additional process for removing and eliminating defects, there is an advantage in that process cost is reduced and productivity is improved.

Hereinafter, it is assumed that a single crystal silicon wafer is used as the conductive substrate 21.

Referring again to (a) of FIG. 8, next, the conductive substrate 21 is used as a mother plate [cathode body], and the anode body (not shown) is spaced apart on the conductive substrate 21 The mask metal layer 110 ′ may be formed by electroplating. The mask metal layer 110 ′ may be formed on the exposed top and side surfaces of the conductive substrate 21 facing the anode body and on which the electric field may act. In addition to the side surfaces of the conductive substrate 21, the mask metal layer 110 ′ may be formed on a portion of the lower surface of the conductive substrate 21.

Next, the edge portion of the mask metal layer 110 ′ is cut (D) with a laser, or a photoresist layer is formed on the mask metal layer 110 ′, and only the exposed portion of the mask metal layer 110 ′ is etched. It can be removed (D). Accordingly, as shown in (b) of FIG. 8, the mask metal layer 110 ′ may be separated from the conductive substrate 21.

Meanwhile, before separating the mask metal layer 110 ′ from the conductive substrate 21, a heat treatment (H) may be performed. The present invention is to reduce the thermal expansion coefficient of the mask 100 and at the same time to prevent the deformation of the mask 100 and the mask pattern P by heat, the mask metal film from the conductive substrate 21 (or the mother plate, the cathode body) It is characterized in that the heat treatment (H) is performed before separating (110'). The heat treatment may be performed at a temperature of 300°C to 800°C.

In general, compared to the Invar sheet produced by rolling, the Invar sheet produced by electroplating has a higher coefficient of thermal expansion. Thus, by performing a heat treatment on the Invar sheet, the coefficient of thermal expansion may be lowered, and during this heat treatment process, the Invar sheet may be peeled or deformed. This is a phenomenon that occurs because only the Invar thin plate is heat treated or the Invar thin plate temporarily attached only to the upper surface of the conductive substrate 21 is heat treated. However, in the present invention, since the mask metal layer 110 ′ is formed not only on the upper surface of the conductive substrate 21 but also on the side and lower surfaces of the conductive substrate 21, peeling or deformation does not occur even when heat treatment (H) is performed. In other words, since the heat treatment is performed while the conductive substrate 21 and the mask metal film 110 ′ are closely attached, there is an advantage of preventing delamination and deformation due to heat treatment and stably performing heat treatment.

On the other hand, in the case of the Invar thin plate produced by electroplating (or the mask metal film 110 ′), the Invar thin plate produced by rolling has a low coefficient of thermal expansion, and thus a separate heat treatment (H) may not be performed.

9 is a schematic diagram showing a conventional mask for forming a high-resolution OLED.

In order to implement a high-resolution OLED, the size of the pattern is decreasing, and the thickness of the mask metal film used for this is also required to be thin. As shown in (a) of FIG. 9, in order to implement the high-resolution OLED pixel 6, it is necessary to reduce the pixel spacing and pixel size in the mask 10' (PD -> PD'). In addition, in order to prevent the OLED pixel 6 from being unevenly deposited due to the shadow effect, it is necessary to form the mask 10' in an oblique manner (14). However, in the process of forming (14) a pattern on a thick mask (10') having a thickness (T1) of about 30 to 50 µm in an inclined manner, patterning 13 suitable for a fine pixel gap PD' and a pixel size is performed. Because it is difficult to do, it causes the yield to deteriorate in the processing process. In other words, in order to form an inclined pattern 14 with a fine pixel gap PD', a thin mask 10' should be used.

In particular, for high resolution at the UHD level, fine patterning is possible only when a thin mask 10' having a thickness T2 of about 20 μm or less is used as shown in FIG. 9B. In addition, for ultra-high resolution of UHD or higher, use of a thin mask 10' having a thickness T2 of about 10 μm may be considered. However, even if the laser (L) is irradiated to perform laser welding on the thin mask (10'), the welding bead (WB) is not smoothly generated, leading to a failure of welding, and the mask (10') is framed 200 There was a problem that it could not be attached to. In other words, the welding bead WB is generated only when a sufficient amount of the mask 10 ′ is melted by the laser L. Due to the thickness of the thin mask 10 ′, a sufficient amount of contact with the frame 200 is sufficient. The welding bead (WB) is not generated.

Accordingly, the present invention proposes a method capable of stably attaching to the frame 200 by forming a thicker portion of the welding portion of the mask 100 to which the laser L is irradiated.

10 is a schematic diagram showing a mask 100 according to an embodiment of the present invention.

The mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy DM surrounding the mask cell C. The dummy DM corresponds to a portion of the mask layer 110 (mask metal layer 110) excluding the cell C, and includes only the mask layer 110, or a predetermined dummy having a shape similar to the mask pattern P A patterned mask layer 110 may be included. In the dummy DM, part or all of the dummy DM may be attached to the frame 200 (mask cell sheet part 220) corresponding to the edge of the mask 100.

The width of the mask pattern P may be less than 40 μm, and the thickness of the mask 100 may be about 2 to 50 μm. Since the frame 200 includes a plurality of mask cell regions CR: CR11 to CR56, the mask 100 having mask cells C: C11 to C56 corresponding to respective mask cell regions CR: CR11 to CR56 ) May also be provided.

The mask 100 is characterized in that at least a portion of the dummy DM is formed thicker than the mask cell C. The welding portion (area to be welded) of the mask 100 may be disposed on the dummy DM, and when the laser L is irradiated as the dummy DM is formed thicker than the mask cell C, the welding bead It can contribute to stably generating (WB).

Since one surface 101 of the mask 100 is a surface to be attached by contacting the frame 200, it is preferable that it is flat. Further, between the other surface 102a of the mask cell C portion and the other surface 102b of the dummy DM portion, a bend or step may be formed to have a different thickness.

11 to 12 are schematic diagrams illustrating a process of manufacturing a mask supporting template by attaching the mask metal layer 110 on the template 50 and forming the mask 100 according to an embodiment of the present invention.

Referring to FIG. 11A, a template 50 may be provided. The template 50 is a medium that can be moved while the mask 100 is attached and supported on one surface. It is preferable that the template 50 has a thinner shape of the edge portion 50b than the central portion 50a. The central portion 50a may correspond to the mask cell C of the mask metal layer 110, and the edge portion 50b may correspond to the dummy DM of the mask metal layer 110. The size of the template 50 may have a larger area than the mask metal layer 110 so that the mask metal layer 110 may be entirely supported, and may have a flat plate shape with bends or steps formed on an upper surface thereof.

The template 50 is preferably made of a transparent material so that it is easy to observe vision or the like in the process of aligning and bonding the mask 100 to the frame 200. In addition, in the case of a transparent material, the laser may penetrate. As a transparent material, materials such as glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), and borosilicate glass may be used. For example, the template 50 may be made of a BOROFLOAT ^® 33 material having excellent heat resistance, chemical durability, mechanical strength, transparency, etc. among borosilicate glass. In addition, BOROFLOAT ^® 33 has a coefficient of thermal expansion of about 3.3, which has a small difference in coefficient of thermal expansion from the Invar mask metal layer 110, so that it is easy to control the mask metal layer 110.

Meanwhile, in the template 50, one surface in contact with the mask metal layer 110 may be a mirror surface so that an air gap does not occur between the interface with the mask metal layer 110 (or the mask 100). have. In consideration of this, the surface roughness Ra of one surface of the template 50 may be 100 nm or less. In order to implement the template 50 having a surface roughness Ra of 100 nm or less, the template 50 may use a wafer. The wafer (wafer) has a surface roughness (Ra) of about 10 nm, there are many commercially available products, and many surface treatment processes are known, so it can be used as the template 50. Since the surface roughness (Ra) of the template 50 is in nm scale, there is no or almost no air gap, and it is easy to generate the weld bead (WB) by laser welding, which affects the alignment error of the mask pattern (P). I can not give it.

The template 50 has a laser through hole 51 in the template 50 so that the laser L irradiated from the top of the template 50 can reach the welding portion (area to be welded) of the mask 100. Can be formed. The laser through-hole 51 may be formed in the template 50 to correspond to the position and number of welding portions. Since a plurality of welding portions are disposed along a predetermined interval in the edge or the dummy DM portion of the mask 100, a plurality of laser through holes 51 may be formed along a predetermined interval to correspond thereto. As an example, since a plurality of welding parts are disposed along a predetermined distance on both sides (left/right) dummy (DM) parts of the mask 100, the laser through hole 51 is also provided on both sides (left/right). A plurality may be formed along a predetermined interval.

The laser through-hole 51 need not necessarily correspond to the position and number of welding parts. For example, it is also possible to perform welding by irradiating the laser (L) to only a part of the laser through hole (51). In addition, some of the laser through-holes 51 that do not correspond to the welding part may be used instead of the alignment mark when aligning the mask 100 and the template 50. If the material of the template 50 is transparent to the laser (L) light, the laser through hole 51 may not be formed.

A temporary adhesive portion 55 may be formed on one surface of the template 50. In the temporary bonding part 55, the mask 100 (or the mask metal film 110 ′) is temporarily adhered to one surface of the template 50 until the mask 100 is attached to the frame 200 so that the template 50 It can be supported on the top.

The temporary bonding portion 55 may be formed of liquid wax. The liquid wax may be the same as the wax used in the polishing step of a semiconductor wafer, and the like, and the type is not particularly limited. The liquid wax is mainly a resin component for controlling adhesion, impact resistance, and the like with respect to holding power, and may include materials and solvents such as acrylic, vinyl acetate, nylon, and various polymers. As an example, the temporary adhesive part 55 may use SKYLIQUID ABR-4016 including acrylonitrile butadiene rubber (ABR) as a resin component and n-propyl alcohol as a solvent component. The liquid wax may be formed on the temporary bonding portion 55 using spin coating.

The temporary adhesive part 55, which is a liquid wax, has a lower viscosity at a temperature higher than 85°C to 100°C, and becomes more viscous at a temperature lower than 85°C, and may be partially hardened like a solid. ) Can be fixed and bonded.

Next, referring to FIG. 11B, a mask metal layer 110 ′ may be adhered on the template 50. After heating the liquid wax to 85° C. or higher and contacting the mask metal film 110 ′ with the template 50, adhesion may be performed by passing the mask metal film 110 ′ and the template 50 between rollers. .

According to an embodiment, baking is performed on the template 50 at about 120° C. for 60 seconds to vaporize the solvent of the temporary bonding portion 55, and immediately, a mask metal film lamination process may be performed. . Lamination can be performed by loading the mask metal film 110 on the template 50 on which the temporary bonding part 55 is formed, and passing it between an upper roll of about 100°C and a lower roll of about 0°C. have.

When the mask metal layer 110 ′ comes into contact with the template 50, the mask metal layer 110 ′ corresponds to the shape of the upper portion of the template 50, that is, a curvature or a step difference between the central portion 50a and the edge portion 50b. ) May also have a bend or step.

Next, referring to FIG. 11C, one surface of the mask metal layer 110 may be planarized. Specifically, the opposite surface 101 facing the surface 102 of the mask metal layer 110 adhered to the template 50 may be flattened. The planarization may be performed by a CMP (Chemical Mechanical Polishing) method, and a known CMP method may be used without limitation. In addition to this, a process capable of flattening can be used. Accordingly, in the mask 100, at least a portion of the dummy DM may be formed to be thicker than the mask cell C.

Next, referring to FIG. 12D, a patterned insulating portion 25 may be formed on the mask metal layer 110. The insulating part 25 may be formed of a photoresist material using a printing method or the like.

Subsequently, the mask metal layer 110 may be etched. A method such as dry etching or wet etching may be used without limitation, and as a result of the etching, a portion of the mask metal layer 110 exposed to the empty space 26 between the insulating portions 25 may be etched. The etched portion of the mask metal layer 110 constitutes the mask pattern P, and the mask 100 having a plurality of mask patterns P formed thereon may be manufactured.

Next, referring to (e) of FIG. 12, manufacturing of the template 50 supporting the mask 100 may be completed by removing the insulating portion 25.

13 is a schematic diagram illustrating a process of loading a mask supporting template onto a frame according to an embodiment of the present invention.

Referring to FIG. 13, the template 50 may be transferred by the vacuum chuck 90. The vacuum chuck 90 may adsorb and transport the surface opposite to the surface of the template 50 to which the mask 100 is adhered. The vacuum chuck 90 may be connected to a moving means (not shown) that moves in the x, y, z, and θ axes. In addition, the vacuum chuck 90 may be connected to a flip means (not shown) capable of adsorbing and flipping the template 50. As shown in (b) of FIG. 13, after the vacuum chuck 90 adsorbs and flips the template 50, even in the process of transferring the template 50 onto the frame 200, the mask 100 There is no effect on the adhesion and alignment.

14 is a schematic diagram illustrating a state in which a template according to an embodiment of the present invention is loaded onto a frame and a mask is associated with a cell area of the frame. In FIG. 14, one mask 100 is exemplified to correspond to/attach to the cell area CR. However, a plurality of masks 100 are simultaneously corresponded to all the cell areas CR so that the mask 100 is frame 200 ) Can also be performed. In this case, a plurality of templates 50 for supporting each of the plurality of masks 100 may be provided.

Next, referring to FIG. 14, the mask 100 may correspond to one mask cell area CR of the frame 200. By loading the template 50 onto the frame 200 (or the mask cell sheet part 220), the mask 100 may correspond to the mask cell area CR. While controlling the position of the template 50/vacuum chuck 90, it is possible to examine whether the mask 100 corresponds to the mask cell area CR through a microscope. Since the template 50 compresses the mask 100, the mask 100 and the frame 200 can be in close contact with each other.

Meanwhile, the lower support 70 may be further disposed under the frame 200. The lower support 70 may have a size such that it fits into the hollow region R of the frame rim 210 and may have a flat plate shape. Further, a predetermined support groove (not shown) corresponding to the shape of the mask cell sheet portion 220 may be formed on the upper surface of the lower support body 70. In this case, the edge sheet portion 221 and the first and second grid sheet portions 223 and 225 are fitted into the support grooves, so that the mask cell sheet portion 220 may be better fixed.

The lower support 70 may press the opposite surface of the mask cell area CR to which the mask 100 contacts. That is, the lower support 70 may support the mask cell sheet part 220 in an upward direction to prevent the mask cell sheet part 220 from sagging downward during the attaching process of the mask 100. At the same time, the lower support 70 and the template 50 are pressed against the edge and frame 200 (or mask cell sheet part 220) of the mask 100 in opposite directions, so that the mask 100 Can be maintained without being disturbed.

In this way, just by attaching the mask 100 on the template 50 and loading the template 50 on the frame 200, the mask 100 corresponds to the mask cell area CR of the frame 200. Since the process is completed, no tensile force may be applied to the mask 100 during this process.

Subsequently, the mask 100 may be attached to the frame 200 by irradiating the laser L to the mask 100 by laser welding. A welding bead WB is generated in the welding portion of the laser-welded mask, and the welding bead WB may be integrally connected with the mask 100 / frame 200 and having the same material. At this time, since the welding part (or part of the dummy DM) of the mask 100 to which the laser (L) is irradiated is formed thicker than the mask cell (C), a sufficient amount of the welding part is melted to form a welding bead (WB). And welding can be performed stably.

15 is a schematic diagram illustrating a process of separating the mask 100 and the template 50 after attaching the mask 100 to the frame 200 according to an embodiment of the present invention.

Referring to FIG. 15, after attaching the mask 100 to the frame 200, the mask 100 and the template 50 may be separated (debonded). Separation of the mask 100 and the template 50 may be performed through at least one of heat application (ET), chemical treatment (CM), and ultrasonic application (US) to the temporary bonding part 55. Since the mask 100 remains attached to the frame 200, only the template 50 can be lifted. For example, when heat at a temperature higher than 85°C to 100°C is applied (ET), the viscosity of the temporary bonding portion 55 decreases, and the adhesion between the mask 100 and the template 50 is weakened, and thus the mask 100 ) And the template 50 may be separated. As another example, the mask 100 and the template 50 may be separated by dissolving or removing the temporary bonding portion 55 by immersing (CM) the temporary bonding portion 55 in a chemical substance such as IPA, acetone, and ethanol. have. As another example, when ultrasonic waves are applied (US), adhesion between the mask 100 and the template 50 is weakened, so that the mask 100 and the template 50 may be separated.

16 is a schematic diagram showing a state in which the mask 100 is attached to the frame 200 according to an embodiment of the present invention.

Referring to FIG. 16, one mask 100 may be attached on one cell area CR of the frame 200.

Since the mask cell sheet portion 220 of the frame 200 has a thin thickness, when a tensile force is applied to the mask 100 and attached to the mask cell sheet portion 220, the tensile force remaining in the mask 100 is masked. It acts on the cell sheet part 220 and the mask cell area CR, and thus, they may be deformed. Therefore, it is necessary to attach the mask 100 to the mask cell sheet part 220 without applying a tensile force to the mask 100. In the present invention, by attaching the mask 100 on the template 50 and loading the template 50 on the frame 200, the mask 100 corresponds to the mask cell area CR of the frame 200 Since the process is completed, no tensile force may be applied to the mask 100 during this process. Thus, it is possible to prevent deformation of the frame 200 (or the mask cell sheet part 220) by acting as a tension on the frame 200 as opposed to the tensile force applied to the mask 100.

The conventional mask 10 of FIG. 1 has a long length because it includes 6 cells (C1 to C6), whereas the mask 100 of the present invention has a short length including one cell (C). The degree of distortion of the pixel position accuracy (PPA) can be reduced. For example, assuming that the length of the mask 10 including a plurality of cells (C1 to C6, ...) is 1 m and a PPA error of 10 μm occurs in the entire 1 m, the mask 100 of the present invention The above error range can be 1/n according to the reduction in the relative length (corresponding to the reduction in the number of cells C). For example, if the length of the mask 100 of the present invention is 100 mm, since it has a length reduced from 1 m to 1/10 of the conventional mask 10, a PPA error of 1 μm occurs in the entire 100 mm length. , There is an effect that the alignment error is significantly reduced.

On the other hand, if the mask 100 includes a plurality of cells C, and each cell C corresponds to each cell area CR of the frame 200 within a range in which the alignment error is minimized, The mask 100 may correspond to a plurality of mask cell regions CR of the frame 200. Alternatively, the mask 100 having a plurality of cells C may correspond to one mask cell area CR. Even in this case, in consideration of the process time and productivity according to the alignment, the mask 100 is preferably provided with as few cells (C) as possible.

In the case of the present invention, it is only necessary to match one cell (C) of the mask 100 and check the alignment state, so that a plurality of cells (C: C1 to C6) must be matched at the same time and check all alignment states. Compared to the conventional method [see Fig. 2], the manufacturing time can be significantly reduced.

That is, in the method of manufacturing a frame-integrated mask of the present invention, each of the cells C11 to C16 included in the six masks 100 correspond to each of the cell regions CR11 to CR16 and check the alignment state. Through a single process, the time can be much shorter than that of a conventional method in which the six cells C1 to C6 are simultaneously matched and the alignment state of the six cells C1 to C6 is checked at the same time.

In addition, in the method of manufacturing a frame-integrated mask of the present invention, the product yield in the process of 30 times of matching and aligning 30 masks 100 to 30 cell regions (CR: CR11 to CR56), respectively, is 6 cells (C1 The five masks 10 each including ~C6) (see Fig. 2 (a)) may appear much higher than the conventional product yield in the five processes of matching and aligning the frame 20. Since the conventional method of arranging six cells (C1 to C6) in a region corresponding to six cells (C) at a time is much cumbersome and difficult operation, the product yield is low.

On the other hand, as described above in step (b) of FIG. 11, when the mask metal layer 110 is adhered to the template 50 by the re-mination process, a temperature of about 100° C. may be applied to the mask metal layer 110. have. Accordingly, the mask metal layer 110 may be adhered to the template 50 in a state where some tensile tension is applied. After that, when the mask 100 is attached to the frame 200 and the template 50 is separated from the mask 100, the mask 100 may contract a predetermined amount.

When the template 50 and the mask 100 are separated after each of the masks 100 are attached to the corresponding mask cell area CR, a tension that contracts the plurality of masks 100 in opposite directions is applied. Therefore, the force is canceled, so that deformation does not occur in the mask cell sheet portion 220. For example, the first grid sheet portion 223 between the mask 100 attached to the CR11 cell area and the mask 100 attached to the CR12 cell area is in the right direction of the mask 100 attached to the CR11 cell area. The applied tension and the tension acting in the left direction of the mask 100 attached to the CR12 cell area may be canceled out. Thus, deformation of the frame 200 (or mask cell sheet part 220) due to tension is minimized, so that an alignment error of the mask 100 (or mask pattern P) can be minimized.

17 is a schematic diagram illustrating an OLED pixel deposition apparatus 1000 using the frame-integrated masks 100 and 200 according to an embodiment of the present invention.

Referring to FIG. 17, the OLED pixel deposition apparatus 1000 includes a magnet plate 300 in which a magnet 310 is accommodated and a cooling water line 350 is disposed, and an organic material source 600 from a lower portion of the magnet plate 300. ) And a deposition source supply unit 500 to supply.

A target substrate 900 such as glass on which the organic material source 600 is deposited may be interposed between the magnet plate 300 and the source deposition unit 500. The frame-integrated masks 100 and 200 (or FMM) that allow the organic material source 600 to be deposited for each pixel may be disposed on the target substrate 900 in close contact or very close to each other. The magnet 310 generates a magnetic field and may be in close contact with the target substrate 900 by the magnetic field.

The deposition source supply unit 500 may reciprocate the left and right path to supply the organic material source 600, and the organic material sources 600 supplied from the deposition source supply unit 500 are pattern P formed on the frame-integrated masks 100 and 200. ) May be deposited on one side of the target substrate 900. The deposited organic material source 600 passing through the pattern P of the frame-integrated masks 100 and 200 may function as the pixel 700 of the OLED.

In order to prevent non-uniform deposition of the pixel 700 due to a shadow effect, the pattern of the frame-integrated masks 100 and 200 may be formed to be inclined (S) (or formed in a tapered shape (S)). . Since the organic material sources 600 passing through the pattern in a diagonal direction along the inclined surface may also contribute to the formation of the pixel 700, the overall thickness of the pixel 700 may be uniformly deposited.

Since the mask 100 is attached and fixed to the frame 200 at a first temperature higher than the pixel deposition process temperature, even if it is raised to the process temperature for pixel deposition, the position of the mask pattern P is hardly affected. The PPA between 100 and the mask 100 adjacent thereto may be maintained not to exceed 3 μm.

Although the present invention has been shown and described with reference to a preferred embodiment as described above, it is not limited to the above embodiment, and within the scope not departing from the spirit of the present invention, various It can be transformed and changed. Such modifications and variations should be viewed as falling within the scope of the present invention and the appended claims.

50: template
50a, 50b: the center of the template, the border
51: laser through hole
55: temporary bonding part
70: lower support
100: mask
101, 102: one side and the other side of the mask
110: mask film
200: frame
210: frame frame portion
220: mask cell sheet portion
221: border sheet portion
223: first grid seat portion
225: second grid seat portion
1000: OLED pixel deposition device
C: cell, mask cell
CM: chemical treatment
CR: Mask cell area
DM: dummy, mask dummy
ET: heat application
L: laser
R: hollow area of the frame part
P: mask pattern
US: Ultrasonic approval
W: welding
WB: welding bead

Claims (6)

A frame-integrated mask in which a plurality of masks and a frame supporting the mask are integrally formed,
The frame is,
A frame part including a hollow area;
A mask cell sheet portion having a plurality of mask cell areas and connected to the frame frame portion
Including,
Each mask is connected to the upper portion of the mask cell sheet,
The mask includes a mask cell on which a plurality of mask patterns are formed, and a dummy around the mask cell, and a plurality of welding portions are formed at intervals on at least a portion of the dummy,
At least a part of the dummy corresponding to the region of the welded portion is formed to be thicker than the thickness of the mask cell by forming a step difference from the mask cell in order to melt a sufficient amount of the weld,
A welding bead is formed in the welding part so that the mask and the frame are integrally connected,
The mask, frame and welding bead are invar material, frame-integrated mask. The method of claim 1,
The mask cell sheet part,
Border sheet portion;
At least one first grid sheet portion extending in a first direction and having both ends connected to the frame sheet portion; And
A frame-integrated mask comprising at least one second grid sheet portion extending in a second direction perpendicular to the first direction, crossing the first grid sheet portion, and having both ends connected to the frame sheet portion. The method of claim 1,
A frame-integrated mask in which each mask corresponds to each mask cell area. delete The method of claim 1,
One side of the mask connected to the mask cell sheet is flat,
A frame-integrated mask, wherein at least a portion of the dummy is curved or stepped on the other surface facing one surface of the mask. A method of manufacturing a frame-integrated mask in which at least one mask and a frame supporting the mask are integrally formed,
(a) preparing a frame having at least one mask cell area;
(b) loading the template to which the mask is adhered onto the frame to correspond the mask to the mask cell area of the frame; And
(c) attaching the mask to the frame
Including,
The mask includes a mask cell on which a plurality of mask patterns are formed, and a dummy around the mask cell, and a plurality of welding portions are formed at intervals on at least a portion of the dummy,
At least a portion of the dummy in which the weld is formed forms a step difference between the mask cell and the first stage, and is thicker than the thickness of the mask cell,
A welding bead is formed in the welding part so that the mask and the frame are integrally connected,
The mask, frame and welding bead are made of invar,
A method of manufacturing a frame-integrated mask.

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