KR102236542B1 - Template for supporting mask, template for supporting mask metal sheet, producing method of template for supporting mask and producing method of mask integrated frame - Google Patents

Abstract

The present invention relates to a mask support template, a mask metal film support template, a method of manufacturing a mask support template, and a method of manufacturing a frame-integrated mask. The mask support template according to the present invention is a template that supports an OLED pixel forming mask to correspond to a frame, and includes a template 50, a temporary bonding portion 55 formed on the template 50, and a temporary bonding portion 55 It is adhered on the template 50 and includes the mask 100 on which the mask pattern P is formed, and the mask 100 is adhered to the template 50 in a state where a tensile force F is applied in the lateral direction. It is characterized.

Description

Manufacturing method of mask support template, mask metal film support template, mask support template, and manufacturing method of frame-integrated mask }

The present invention relates to a mask support template, a mask metal film support template, a method of manufacturing a mask support template, and a method of manufacturing a frame-integrated mask. More specifically, a mask support template, a mask metal film support template, a method of manufacturing a mask support template, and a frame capable of stably supporting and moving without deformation of the mask, and clear alignment between each mask. It relates to a method of manufacturing an integral mask.

As a technology for forming pixels in the OLED manufacturing process, the FMM (Fine Metal Mask) method is mainly used in which an organic material is deposited at a desired location by attaching a thin metal mask to a substrate.

In the existing OLED manufacturing process, the mask is manufactured in the form of a stick or plate, and then the mask is welded and fixed to the OLED pixel deposition frame. One mask may include several cells corresponding to one display. In addition, in order to manufacture a large area OLED, several masks can be fixed to the OLED pixel deposition frame. In the process of fixing to the frame, each mask is stretched so that it is flat. It is a very difficult task to adjust the tensile force so that the entire part of the mask is flat. In particular, in order to align a mask pattern with a size of only a few to tens of μm while making all the cells flat, a high level of work is required to check the alignment status in real time while finely adjusting the tensile force applied to each side of the mask. do.

Nevertheless, in the process of fixing several masks to one frame, there is a problem in that the alignment between the masks and the mask cells is not good. In addition, in the process of welding and fixing the mask to the frame, the thickness of the mask film is too thin and large area, so the mask is struck or distorted by the load, and wrinkles and burrs occur in the welding part during the welding process. There were problems such as misalignment.

In the case of ultra-high-definition OLED, the current QHD quality is 500-600 PPI (pixel per inch), and the pixel size reaches about 30-50㎛, and 4K UHD, 8K UHD high-definition is higher than this, ~860 PPI, ~1600 PPI, etc. Will have a resolution of. In this way, in consideration of the pixel size of the ultra-high-definition OLED, the alignment error between cells should be reduced to about several µm, and the error beyond this leads to product failure, so the yield may be very low. Therefore, there is a need to develop a technique for preventing deformation, such as being struck or distorted, and for clarifying alignment, a technique for fixing the mask to the frame, and the like.

Therefore, the present invention has been devised to solve the problems of the prior art as described above, and it is possible to stably support and move the mask without deformation, and to prevent deformation such as the mask being struck or warped, and to clarify the alignment. It is an object of the present invention to provide a possible mask support template, a mask metal film support template, a method of manufacturing a mask support template, and a method of manufacturing a frame-integrated mask.

In addition, an object of the present invention is to provide a method for manufacturing a frame-integrated mask in which the manufacturing time is remarkably reduced and the yield is remarkably increased.

The above object of the present invention is to provide a template for supporting an OLED pixel forming mask to correspond to a frame, comprising: a template; A temporary adhesive portion formed on the template; And a mask bonded on the template through the temporary bonding portion and on which the mask pattern is formed, wherein the mask is bonded on the template in a state where a tensile force is applied in the lateral direction, and is achieved by a mask supporting template.

In addition, the above object of the present invention is a template for supporting an OLED pixel forming mask to correspond to a frame, comprising: a template; A temporary adhesive portion formed on the template; And a mask that is adhered to the template through a temporary bonding portion and formed with a mask pattern, and a through hole through which welding energy passes is formed in a portion of the template corresponding to the welding portion of the mask, and the mask is a state in which a tensile force is applied in the lateral direction This is achieved by means of a mask supporting template, glued onto the furnace template.

The mask may be made of a metal sheet manufactured by a rolling or electroforming process.

The thickness of the mask may be 5 μm to 20 μm.

The temporary bonding unit may be an adhesive or adhesive sheet that can be separated by applying heat, and an adhesive or adhesive sheet that can be separated by UV irradiation.

The temporary adhesive may be a liquid wax or a thermal release tape.

Templates include wafer, glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), borosilicate glass, zirconia, soda-lime glass. ) And low-iron glass.

The mask may include a mask cell on which a plurality of mask patterns are formed, and a dummy around the mask cell.

And, the above object of the present invention, a template; A temporary adhesive portion formed on the template; And a mask metal film adhered to the template through a temporary bonding portion and used to manufacture a mask for forming an OLED pixel, wherein the mask metal film is adhered on the template while a tensile force is applied in the lateral direction. Is achieved by

And, the above object of the present invention, a template; A temporary adhesive portion formed on the template; And a mask metal film that is adhered to the template through a temporary bonding portion and used to manufacture a mask for forming an OLED pixel, and a through hole through which welding energy passes is formed in a portion of the template corresponding to the welding portion of the mask, and the mask is This is achieved by the mask metal film supporting template, which is adhered on the template with a tensile force applied in the lateral direction.

(a) forming a patterned insulating portion on the mask metal film; (b) forming a mask pattern by etching a portion of the mask metal layer exposed between the insulating portions; And (c) by performing the step of removing the insulating portion may be manufactured as a mask for forming an OLED pixel mask metal film.

In addition, the above object of the present invention is a method of manufacturing a template corresponding to a frame by supporting a mask for forming an OLED pixel, comprising the steps of: (a) providing a mask metal film; (b) adhering a mask metal film on a template having a temporary adhesive portion formed on one side thereof while applying a tensile force in the lateral direction; And (c) forming a mask pattern on the mask metal film to manufacture a mask.

The mask metal layer may be formed by rolling or electroforming.

Between (b) and (c), the step of reducing the thickness of the mask metal film adhered to the template may be further included.

After the step of reducing the thickness of the mask metal layer, the thickness of the mask metal layer may be 5 μm to 20 μm.

Step (b) includes the steps of: (b1) fixing the template with a temporary adhesive portion formed on one surface thereof to the upper block; (b2) fixing at least one side of the mask metal film to the lower block in a tensioned state; And (b3) bonding the mask metal layer and the template by compressing the upper block and the lower block.

Step (b) may be performed in a vacuum atmosphere.

After step (b3), a portion of the mask metal film protruding out of the template may be cut.

Step (c) includes the steps of: (c1) forming a patterned insulating portion on the mask metal film; (c2) forming a mask pattern by etching a portion of the mask metal layer exposed between the insulating portions; And (c3) removing the insulating part.

In addition, the above object of the present invention is a method of manufacturing a frame-integrated mask in which a plurality of masks and a frame supporting the mask are integrally formed. Providing a; (b) providing a frame having a plurality of mask cell regions; (c) loading the template onto the frame to correspond the mask to the mask cell area of the frame; And (d) attaching the mask to the frame by irradiating a laser to the welding portion of the mask, wherein the mask is adhered on the template with a tensile force applied in the lateral direction, and is achieved by a method of manufacturing a frame-integrated mask.

(e) repeating steps (c) to (d) to attach the mask to all mask cell regions of the frame may be further included.

The step (a) includes the steps of: (a1) providing a mask metal film composed of a metal sheet manufactured by a rolling process; (a2) adhering a mask metal film on a template in which a temporary adhesive part is formed on one surface in a lateral direction with a tensile force applied thereto; And (a3) forming a mask by forming a mask pattern on the mask metal layer to manufacture a mask, thereby providing a mask supporting template in which a mask having a plurality of mask patterns formed thereon is adhered to the template.

Between (a2) and (a3), the step of reducing the thickness of the mask metal film adhered to the template may be further included.

The temporary bonding unit may be an adhesive or adhesive sheet that can be separated by applying heat, and an adhesive or adhesive sheet that can be separated by UV irradiation.

The step (a2) includes: (a2-1) fixing the template with a temporary adhesive portion formed on one surface thereof to the upper block; (a2-2) fixing at least one side of the mask metal film to the lower block in a tensioned state; And (a2-3) bonding the mask metal layer and the template by compressing the upper block and the lower block.

Step (a2) may be performed in a vacuum atmosphere.

After step (b3), a portion of the mask metal film protruding out of the template may be cut.

Step (a3) may include (a3-1) forming a patterned insulating portion on the mask metal film; (a3-2) forming a mask pattern by etching a portion of the mask metal layer exposed between the insulating portions; And (a3-3) removing the insulating part.

In step (d), the laser irradiated from the top of the template may pass through the laser through hole and be irradiated to the welding portion of the mask.

In step (c), the mask on the template may correspond to the mask cell area only by controlling the position of the template without applying tension to the mask.

After step (e), it may further include the step of separating the mask and the template by performing at least one of applying heat, chemical treatment, ultrasonic application, and UV application to the temporary adhesive.

When the template is separated from the mask, a tensile force applied to the mask can be applied to the frame.

The frame includes: a frame frame portion including a hollow area; And a mask cell sheet portion connected to the frame frame portion and including a plurality of mask cell regions, wherein the mask cell sheet portion comprises: a frame sheet portion; At least one first grid sheet portion extending in the first direction and having both ends connected to the frame sheet portion; And at least one second grid sheet portion extending in a second direction perpendicular to the first direction, crossing the first grid sheet portion, and having both ends connected to the edge sheet portion.

The mask and frame may be made of any one of invar, super invar, nickel, and nickel-cobalt.

According to the present invention configured as described above, there is an effect of stably supporting and moving the mask without deformation, preventing deformation such as the mask being struck or twisted, and clarifying alignment.

In addition, according to the present invention, there is an effect of remarkably reducing the manufacturing time and increasing the yield remarkably.

1 is a schematic diagram showing a conventional OLED pixel deposition mask.
2 is a schematic diagram showing a process of attaching a conventional mask to a frame.
3 is a schematic diagram showing that an alignment error occurs between cells in a process of tensioning a conventional mask.
4 is a front view and a side cross-sectional view showing a frame-integrated mask according to an embodiment of the present invention.
5 is a front view and a side cross-sectional view showing a frame according to an embodiment of the present invention.
6 is a schematic diagram showing a manufacturing process of a frame according to an embodiment of the present invention.
7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention.
8 is a schematic diagram showing a conventional mask for forming a high-resolution OLED.
9 is a schematic diagram showing a mask according to an embodiment of the present invention.
10 is a schematic diagram illustrating a process of manufacturing a mask metal film according to an embodiment of the present invention by a rolling method.
11 is a schematic diagram illustrating a process of manufacturing a mask metal film according to another embodiment of the present invention by electroforming.
12 is a schematic side cross-sectional view showing a process of attaching a frame according to a difference in coefficient of thermal expansion of a mask.
13 to 14 are schematic diagrams illustrating a process of adhering a mask metal layer to a template according to an exemplary embodiment of the present invention.
15 to 16 are schematic diagrams illustrating a process of manufacturing a mask supporting template by attaching a mask metal layer on a template according to an embodiment of the present invention and forming a mask.
17 is an enlarged cross-sectional schematic view showing a temporary bonding unit according to an embodiment of the present invention.
18 is a schematic diagram illustrating a process of loading a mask supporting template onto a frame according to an embodiment of the present invention.
19 is a schematic diagram illustrating a state in which a template according to an embodiment of the present invention is loaded onto a frame and a mask is associated with a cell area of the frame.
20 is a schematic diagram illustrating a process of separating a mask and a template after attaching a mask to a frame according to an embodiment of the present invention.
21 is a schematic diagram showing a state in which a mask is attached to a cell area of a frame according to an exemplary embodiment of the present invention.
22 is a schematic diagram showing an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The detailed description of the present invention described below refers to the accompanying drawings, which illustrate specific embodiments in which the present invention may be practiced. These embodiments are described in detail sufficient to enable a person skilled in the art to practice the present invention. It should be understood that the various embodiments of the present invention are different from each other, but need not be mutually exclusive. For example, specific shapes, structures, and characteristics described herein may be implemented in other embodiments without departing from the spirit and scope of the present invention in relation to one embodiment. In addition, it should be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the present invention. Accordingly, the detailed description to be described below is not intended to be taken in a limiting sense, and the scope of the present invention, if appropriately described, is limited only by the appended claims, along with all ranges equivalent to those claimed by the claims. In the drawings, similar reference numerals refer to the same or similar functions over various aspects, and the length, area, thickness, and the like may be exaggerated and expressed for convenience.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to enable those of ordinary skill in the art to easily implement the present invention.

1 is a schematic diagram showing a conventional OLED pixel deposition mask 10.

Referring to FIG. 1, a conventional mask 10 may be manufactured in a stick-type or plate-type. The mask 10 shown in (a) of FIG. 1 is a stick-type mask and can be used by welding and fixing both sides of the stick to the OLED pixel deposition frame. The mask 100 shown in (b) of FIG. 1 is a plate-type mask and may be used in a process of forming a pixel having a large area.

A plurality of display cells C are provided on the body of the mask 10 (or the mask layer 11). One cell C corresponds to one display such as a smartphone. In the cell C, a pixel pattern P is formed to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B appear. For example, the pixel pattern P is formed in the cell C to have a resolution of 70 X 140. That is, a number of pixel patterns P are clustered to form one cell C, and a plurality of cells C may be formed on the mask 10.
2 is a schematic diagram showing a process of attaching the conventional mask 10 to the frame 20. 3 is a schematic diagram illustrating that an alignment error occurs between cells in a process of stretching the conventional mask 10 (F1 to F2). A stick mask 10 including six cells C: C1 to C6 shown in FIG. 1A will be described as an example.
Referring to FIG. 2A, first, the stick mask 10 must be flattened. As the stick mask 10 is pulled by applying a tensile force F1 to F2 in the long axis direction of the stick mask 10, the stick mask 10 is unfolded. In that state, the stick mask 10 is loaded on the frame 20 in the form of a square frame. The cells C1 to C6 of the stick mask 10 are located in a blank area inside the frame of the frame 20. The frame 20 may have a size such that the cells C1 to C6 of one stick mask 10 are located in an empty area inside the frame, and the cells C1 to C6 of the plurality of stick masks 10 are It may be large enough to be located in an internal empty area.
Referring to FIG. 2(b), after aligning while finely adjusting the tensile forces (F1 to F2) applied to each side of the stick mask 10, a part of the side of the stick mask 10 is welded (W). Accordingly, the stick mask 10 and the frame 20 are interconnected. 2C shows a cross-sectional side view of a stick mask 10 and a frame connected to each other.
Referring to FIG. 3, although the tensile forces F1 to F2 applied to each side of the stick mask 10 are finely adjusted, there is a problem in that the mask cells C1 to C3 are not well aligned with each other. For example, the distances D1 to D1" and D2 to D2" between the patterns P of the cells C1 to C3 are different from each other, or the patterns P are skewed. Since the stick mask 10 has a large area including a plurality (for example, 6) of cells C1 to C6 and has a very thin thickness of several tens of µm, it is easily struck or distorted by a load. In addition, it is very difficult to check the alignment between the cells (C1 to C6) in real time through a microscope while adjusting the tensile force (F1 to F2) to flatten all of the cells (C1 to C6).
Therefore, a minute error in the tensile force (F1 to F2) may cause an error in the extent to which each of the cells (C1 to C3) of the stick mask 10 is stretched or unfolded, and accordingly, the distance D1 between the mask patterns (P) ~D1", D2~D2") causes a problem that becomes different. Of course, it is difficult to completely align the error so that it is 0, but in order to prevent the mask pattern (P) having a size of several to tens of µm from adversely affecting the pixel process of the ultra-high-definition OLED, the alignment error should not exceed 3 µm. It is desirable not to. This alignment error between adjacent cells is referred to as PPA (pixel position accuracy).
In addition, a plurality of stick masks 10 of about 6 to 20 are connected to one frame 20, respectively, between a plurality of stick masks 10, and a plurality of cells C of the stick mask 10 It is also a very difficult task to clarify the alignment state between ~C6), and the process time according to alignment is inevitably increased, which is a significant reason for reducing productivity.
On the other hand, after the stick mask 10 is connected and fixed to the frame 20, tensile forces F1 to F2 applied to the stick mask 10 may act in reverse to the frame 20. That is, after the stick mask 10, which has been stretched taut by the tensile forces F1 to F2, is connected to the frame 20, a tension may be applied to the frame 20. Usually, this tension is not large and may not have a large effect on the frame 20, but when the size of the frame 20 is reduced in size and the rigidity is lowered, this tension may finely deform the frame 20. As a result, there may be a problem of misalignment between the plurality of cells C to C6.
Accordingly, the present invention proposes a frame 200 and a frame-integrated mask that enables the mask 100 to form an integral structure with the frame 200. The mask 100 integrally formed with the frame 200 is prevented from being struck or twisted, and may be clearly aligned with the frame 200. Since no tensile force is applied to the mask 100 when the mask 100 is connected to the frame 200, the frame 200 may not be deformed after the mask 100 is connected to the frame 200. . In addition, the manufacturing time for integrally connecting the mask 100 to the frame 200 can be significantly reduced, and the yield can be remarkably increased.
4 is a front view [Fig. 4 (a)] and a side cross-sectional view [Fig. 4 (b)] showing a frame-integrated mask according to an embodiment of the present invention, and Fig. 5 is It is a front view [FIG. 5(a)] and a side cross-sectional view [FIG. 5(b)] showing the frame.
4 and 5, the frame-integrated mask may include a plurality of masks 100 and one frame 200. In other words, a plurality of masks 100 are attached to the frame 200, one by one. Hereinafter, for convenience of explanation, a rectangular mask 100 is used as an example, but the mask 100 may be in the form of a stick mask having protrusions clamped on both sides before being attached to the frame 200, and the frame 200 ), the protrusion can be removed after being attached to it.
A plurality of mask patterns P may be formed on each mask 100, and one cell C may be formed on one mask 100. One mask cell C may correspond to one display such as a smartphone.
Mask 100 may be a coefficient of thermal expansion of about 1.0 X 10 ^-6 / ℃ of invar (invar), about 1.0 X 10 ^-7 / ℃ Super Invar (super invar) material. Since the mask 100 made of this material has a very low coefficient of thermal expansion, it is less likely that the pattern shape of the mask is deformed by thermal energy, and thus can be used as a Fine Metal Mask (FMM) or a shadow mask in high-resolution OLED manufacturing. In addition, considering the recent development of technologies for performing the pixel deposition process in a range where the temperature change value is not large, the mask 100 is made of nickel (Ni) and nickel-cobalt (Ni-Co ), etc. The mask 100 may use a metal sheet produced by a rolling process or electroforming. It will be described later in detail with reference to FIGS. 9 and 10.
The frame 200 is formed to attach a plurality of masks 100. The frame 200 may include several corners formed in a first direction (eg, a horizontal direction) and a second direction (eg, a vertical direction) including an outermost edge. These various corners may partition a region on the frame 200 to which the mask 100 is to be attached.
The frame 200 may include a frame portion 210 having a substantially square shape or a square frame shape. The inside of the frame frame 210 may have a hollow shape. That is, the frame frame unit 210 may include a hollow region R. The frame 200 may be made of a metal material such as Invar, Super Invar, aluminum, titanium, etc., and in consideration of thermal deformation, it is composed of materials such as Invar, Super Invar, nickel, nickel-cobalt, etc., which have the same coefficient of thermal expansion as the mask. Preferably, these materials can be applied to both the frame part 210 and the mask cell sheet part 220 which are components of the frame 200.
In addition, the frame 200 may include a plurality of mask cell regions CR, and may include a mask cell sheet part 220 connected to the frame frame part 210. Like the mask 100, the mask cell sheet part 220 may be formed by rolling, or may be formed using another film forming process such as electroplating. In addition, the mask cell sheet part 220 may form a plurality of mask cell regions CR on a planar sheet through laser scribing, etching, or the like, and then connect to the frame frame part 210. Alternatively, the mask cell sheet part 220 may form a plurality of mask cell regions CR through laser scribing, etching, or the like after connecting the planar sheet to the frame frame part 210. In the present specification, it is assumed that a plurality of mask cell regions CR are first formed in the mask cell sheet part 220 and then connected to the frame frame part 210.
The mask cell sheet part 220 may include at least one of an edge sheet part 221 and first and second grid sheet parts 223 and 225. The frame sheet portion 221 and the first and second grid sheet portions 223 and 225 refer to respective portions partitioned from the same sheet, and they are integrally formed with each other.
The frame sheet part 221 may be substantially connected to the frame frame part 210. Accordingly, the frame sheet part 221 may have a substantially square shape and a square frame shape corresponding to the frame frame part 210.
In addition, the first grid sheet portion 223 may be formed to extend in a first direction (horizontal direction). The first grid sheet part 223 may be formed in a linear shape so that both ends may be connected to the edge sheet part 221. When the mask cell sheet portion 220 includes a plurality of first grid sheet portions 223, it is preferable that each of the first grid sheet portions 223 form equal intervals.
In addition, in addition to this, the second grid sheet portion 225 may be formed to extend in a second direction (vertical direction). The second grid sheet portion 225 may be formed in a linear shape so that both ends thereof may be connected to the edge sheet portion 221. The first grid sheet portion 223 and the second grid sheet portion 225 may vertically cross each other. When the mask cell sheet portion 220 includes a plurality of second grid sheet portions 225, it is preferable that each of the second grid sheet portions 225 form equal intervals.
Meanwhile, the interval between the first grid sheet portions 223 and the interval between the second grid sheet portions 225 may be the same or different depending on the size of the mask cell C.
The first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, but the shape of a cross-section perpendicular to the length direction may be a rectangle, a rectangular shape such as a trapezoid, a triangular shape, etc., Some of the sides and corners may be rounded. The cross-sectional shape can be adjusted in the process of laser scribing and etching.
The thickness of the frame frame part 210 may be thicker than the thickness of the mask cell sheet part 220. Since the frame frame portion 210 is responsible for the overall rigidity of the frame 200, it may be formed to a thickness of several millimeters to several centimeters.
In the case of the mask cell sheet part 220, the process of manufacturing a substantially thick sheet is difficult, and if it is too thick, the organic material source 600 (see FIG. 23) passes through the mask 100 in the OLED pixel deposition process. It can cause clogging problems. Conversely, if the thickness is too thin, it may be difficult to secure enough rigidity to support the mask 100. Accordingly, the mask cell sheet part 220 is thinner than the thickness of the frame frame part 210, but is preferably thicker than the mask 100. The thickness of the mask cell sheet part 220 may be about 0.1 mm to 1 mm. In addition, the first and second grid sheet portions 223 and 225 may have a width of about 1 to 5 mm.
A plurality of mask cell areas CR: CR11 to CR56 may be provided except for the area occupied by the edge sheet portion 221 and the first and second grid sheet portions 223 and 225 in the planar sheet. In another aspect, the mask cell area CR is an area occupied by the frame sheet part 221 and the first and second grid sheet parts 223 and 225 in the hollow area R of the frame frame part 210. Except for, it may mean an empty area.
As the cell C of the mask 100 corresponds to the mask cell region CR, it can be used as a passage through which the pixel of the OLED is deposited substantially through the mask pattern P. As described above, one mask cell C corresponds to one display such as a smartphone. Mask patterns P constituting one cell C may be formed on one mask 100. Alternatively, one mask 100 may include a plurality of cells C, and each cell C may correspond to each cell area CR of the frame 200, but clear alignment of the mask 100 is achieved. In order to do so, it is necessary to avoid the large-area mask 100, and a small-area mask 100 having one cell C is preferable. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell area CR of the frame 200. In this case, for clear alignment, it may be considered to correspond to the mask 100 having a small number of cells C of about 2-3.
The frame 200 includes a plurality of mask cell areas CR, and each mask 100 may be attached such that one mask cell C corresponds to the mask cell area CR. Each mask 100 may include a mask cell C having a plurality of mask patterns P formed thereon, and a dummy around the mask cell C (corresponding to a portion of the mask layer 110 excluding the cell C). have. The dummy may include only the mask layer 110 or may include the mask layer 110 in which a predetermined dummy pattern similar to the mask pattern P is formed. The mask cell C corresponds to the mask cell area CR of the frame 200, and a part or all of the dummy may be attached to the frame 200 (mask cell sheet part 220). Accordingly, the mask 100 and the frame 200 can form an integral structure.
Meanwhile, according to another embodiment, the frame is not manufactured by attaching the mask cell sheet part 220 to the frame frame part 210, but the frame frame part 210 is formed in the hollow region R part of the frame frame part 210. ) And a frame in which a grid frame (corresponding to the grid seat portions 223 and 225) is formed immediately may be used. This type of frame also includes at least one mask cell area CR, and a frame-integrated mask can be manufactured by matching the mask 100 to the mask cell area CR.
Hereinafter, a process of manufacturing a frame-integrated mask will be described.
First, the frame 200 described above in FIGS. 4 and 5 may be provided. 6 is a schematic diagram showing a manufacturing process of the frame 200 according to an embodiment of the present invention.
Referring to FIG. 6A, a frame frame 210 is provided. The frame frame part 210 may have a rectangular frame shape including a hollow region R.
Next, referring to FIG. 6B, a mask cell sheet part 220 is manufactured. The mask cell sheet part 220 is manufactured by manufacturing a flat sheet using rolling, electroplating, or other film forming processes, and then removing the mask cell area (CR) through laser scribing, etching, etc. can do. In this specification, an example in which a 6 X 5 mask cell region (CR: CR11 to CR56) is formed will be described. Five first grid sheet portions 223 and four second grid sheet portions 225 may be present.
Next, the mask cell sheet part 220 may correspond to the frame frame part 210. In the process of matching, all sides of the mask cell sheet part 220 are stretched (F1 to F4) to flatten the mask cell sheet part 220 and the frame sheet part 221 is attached to the frame frame part 210. You can respond. In one side, it is also possible to hold the mask cell sheet part 220 at several points (for example, 1 to 3 points in FIG. 6(b)) and stretch it. On the other hand, the mask cell sheet portion 220 may be stretched (F1, F2) along some side directions instead of all sides.
Next, if the mask cell sheet part 220 corresponds to the frame frame part 210, the frame sheet part 221 of the mask cell sheet part 220 may be attached by welding (W). It is preferable to weld (W) all sides so that the mask cell sheet part 220 can be firmly attached to the frame frame part 220. Welding (W) should be performed as close as possible to the edge of the frame frame part 210 to reduce the excitement space between the frame part 210 and the mask cell sheet part 220 as much as possible and increase the adhesion. The welding (W) portion may be generated in a line or spot shape, and the frame frame portion 210 and the mask cell sheet portion 220 are integrally made of the same material as the mask cell sheet portion 220. It can be a medium to connect with.
7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention. In the embodiment of FIG. 6, the mask cell sheet part 220 having the mask cell area CR is first manufactured and attached to the frame frame part 210. However, in the embodiment of FIG. 210), a mask cell area CR is formed.
First, as shown in (a) of FIG. 6, a frame part 210 including a hollow region R is provided.
Next, referring to FIG. 7A, a planar sheet (a flat mask cell sheet part 220 ′) may correspond to the frame frame part 210. The mask cell sheet part 220 ′ is in a planar state in which the mask cell region CR has not yet been formed. In the matching process, all sides of the mask cell sheet part 220 ′ are stretched (F1 to F4) to correspond to the frame frame part 210 with the mask cell sheet part 220 ′ flattened. On one side, it is possible to hold the mask cell sheet portion 220 ′ at several points (eg, 1 to 3 points in FIG. 7 (a)) and stretch it. On the other hand, the mask cell sheet portion 220 ′ may be stretched (F1, F2) along some side directions instead of all sides.
Next, if the mask cell sheet part 220 ′ corresponds to the frame frame part 210, the rim part of the mask cell sheet part 220 ′ may be attached by welding (W). It is preferable to weld (W) all sides so that the mask cell sheet part 220 ′ can be firmly attached to the frame frame part 220. Welding (W) should be performed as close as possible to the edge of the frame frame part 210 to reduce the excitement space between the frame part 210 and the mask cell sheet part 220 ′ and increase adhesion. The welding (W) portion may be created in a line or spot shape, and has the same material as the mask cell sheet portion 220 ′, and the frame frame portion 210 and the mask cell sheet portion 220 ′ It can be a medium that connects all together.
Next, referring to FIG. 7B, a mask cell region CR is formed on a planar sheet (a planar mask cell sheet portion 220'). The mask cell area CR may be formed by removing the sheet in the mask cell area CR through laser scribing, etching, or the like. In this specification, an example in which a 6 X 5 mask cell region (CR: CR11 to CR56) is formed will be described. When the mask cell area CR is formed, the edge frame portion 210 and the welded (W) portion become the edge sheet portion 221, and the five first grid sheet portions 223 and the four second grids A mask cell sheet portion 220 having a sheet portion 225 may be configured.
8 is a schematic diagram showing a conventional mask for forming a high-resolution OLED.
In order to implement a high-resolution OLED, the size of the pattern is decreasing, and the thickness of the mask metal film used for this is also required to be thin. As shown in (a) of FIG. 8, in order to implement the high-resolution OLED pixel 6, it is necessary to reduce the pixel gap and pixel size in the mask 10' (PD ->PD'). In addition, in order to prevent the OLED pixel 6 from being unevenly deposited due to the shadow effect, it is necessary to form the mask 10' in an oblique manner (14). However, in the process of forming a pattern 14 in a thick mask 10' having a thickness T1 of about 30 to 50 µm in an oblique manner, patterning 13 suitable for a fine pixel spacing PD' and a pixel size is performed. Because it is difficult to do, it causes the yield to deteriorate in the processing step. In other words, in order to form an inclined pattern 14 with a fine pixel gap PD', a thin mask 10' should be used.
In particular, for high resolution at the UHD level, fine patterning is possible only when a thin mask 10 ′ having a thickness T2 of about 20 μm or less is used as shown in FIG. 8B. In addition, for ultra-high resolution of UHD or higher, use of a thin mask 10' having a thickness T2 of about 10 μm may be considered.
9 is a schematic diagram showing a mask 100 according to an embodiment of the present invention.
The mask 100 may include a mask cell C in which a plurality of mask patterns P are formed and a dummy DM surrounding the mask cell C. It has been described above that the mask 100 may be manufactured from a metal sheet produced by a rolling process or electroplating, and one cell C may be formed in the mask 100. The dummy DM corresponds to a portion of the mask layer 110 (mask metal layer 110) excluding the cell C, and includes only the mask layer 110, or a predetermined dummy having a shape similar to the mask pattern P A patterned mask layer 110 may be included. In the dummy DM, part or all of the dummy DM may be attached to the frame 200 (mask cell sheet part 220) corresponding to the edge of the mask 100.
The width of the mask pattern P may be less than 40 μm, and the thickness of the mask 100 may be about 5 to 20 μm. Since the frame 200 includes a plurality of mask cell regions (CR: CR11 to CR56), the mask 100 having mask cells (C: C11 to C56) corresponding to each of the mask cell regions (CR: CR11 to CR56). ) May also be provided in plural.
Since one surface 101 of the mask 100 is a surface to be attached to and in contact with the frame 200, it is preferable to be flat. One surface 101 may be flattened and mirrored in a planarization process to be described later. The other surface 102 of the mask 100 may face one surface of the template 50 to be described later.
Hereinafter, a mask metal layer 110 ′ is manufactured, and the mask 100 is manufactured by supporting it on the template 50, and the template 50 on which the mask 100 is supported is loaded on the frame 200. A series of processes for manufacturing a frame-integrated mask by attaching the mask 100 to the frame 200 will be described.
10 is a schematic diagram illustrating a process of manufacturing a mask metal film according to an embodiment of the present invention by a rolling method. 11 is a schematic diagram illustrating a process of manufacturing a mask metal film according to another embodiment of the present invention by electroforming.
First, a mask metal layer 110 may be prepared. As an embodiment, the mask metal layer 110 may be prepared by a rolling method.
Referring to FIG. 10A, the metal sheet produced by the rolling process may be used as the mask metal film 110 ′. The metal sheet manufactured by the rolling process may have a thickness of tens to hundreds of μm in the manufacturing process. As described above in FIG. 8, fine patterning can be performed by using a thin mask metal layer 110 having a thickness of about 20 μm or less for a high resolution of UHD level, and a thickness of about 10 μm for ultra-high resolution of UHD or higher. A thin mask metal film 110 having a should be used. However, since the mask metal layer 110 ′ produced by the rolling process has a thickness of about 25 to 500 μm, it is necessary to have a thinner thickness.
Accordingly, a process of planarizing (PS) one surface of the mask metal layer 110 ′ may be further performed. Here, planarization (PS) refers to reducing the thickness by partially removing an upper portion of the mask metal layer 110 ′ while mirroring one surface (upper surface) of the mask metal layer 110 ′. Planarization (PS) may be performed by a CMP (Chemical Mechanical Polishing) method, and a known CMP method may be used without limitation. In addition, the thickness of the mask metal layer 110 ′ may be reduced by chemical wet etching or dry etching. In addition, a process capable of flattening the mask metal layer 110 ′ may be used without limitation.
In the process of performing the planarization (PS), for example, in the CMP process, the surface roughness R _a of the upper surface of the mask metal layer 110 ′ may be controlled. Preferably, mirroring may be performed in which the surface roughness is further reduced. Alternatively, as another example, after performing a chemical wet etching or dry etching process to perform planarization (PS), a polishing process such as a separate CMP process may be added thereafter to reduce the _{surface roughness R a.}
In this way, the thickness of the mask metal layer 110 ′ can be made thin to about 50 μm or less. Accordingly, it is preferable that the thickness of the mask metal layer 110 is about 2 μm to 50 μm, and more preferably, the thickness of the mask metal layer 110 may be about 5 μm to 20 μm. However, it is not necessarily limited thereto.
Referring to FIG. 10B, as in FIG. 10A, the mask metal layer 110 may be manufactured by reducing the thickness of the mask metal layer 110 ′ manufactured by the rolling process. However, the thickness of the mask metal layer 110 ′ may be reduced by performing a planarization (PS) process while being adhered to the template 50 to be described later through the temporary bonding portion 55.
As another embodiment, the mask metal layer 110 may be prepared by electroplating.
Referring to FIG. 11 (a), a conductive substrate 21 is prepared. In order to perform electroforming, the base material 21 of the mother plate may be made of a conductive material. The mother plate can be used as a cathode electrode in electroplating.
As a conductive material, in the case of metal, metal oxides may be generated on the surface, impurities may be introduced during the metal manufacturing process, in the case of a polycrystalline silicon substrate, inclusions or grain boundaries may exist, and conductive polymers In the case of the substrate, it is highly likely to contain impurities, and the strength. Acid resistance may be weak. An element that prevents uniform formation of an electric field on the surface of the mother plate (or cathode) such as metal oxide, impurities, inclusions, grain boundaries, etc. is referred to as “defect”. Due to defects, a uniform electric field may not be applied to the cathode body made of the above-described material, so that a part of the plating film 110 (or the mask metal film 110) may be formed unevenly.
In implementing ultra-high definition pixels of the UHD level or higher, non-uniformity of the plating layer and the plating layer pattern (mask pattern P) may adversely affect the formation of the pixel. For example, in the case of current QHD quality, the size of the pixel reaches about 30-50㎛ at 500~600 PPI (pixel per inch), and in the case of 4K UHD and 8K UHD high quality, ~860 PPI, ~1600 PPI, which is higher. It has the same resolution. Micro-displays directly applied to VR devices, or micro-displays inserted into VR devices, aim for ultra-high quality of about 2,000 PPI or higher, and the size of pixels reaches about 5 to 10 μm. The pattern width of the FMM and shadow mask applied to this can be formed in a size of several to several tens of µm, preferably smaller than 30 µm, so that even defects of several µm can occupy a large proportion of the pattern size of the mask. to be. In addition, in order to remove the defects in the cathode material of the above-described material, an additional process for removing metal oxide, impurities, etc. may be performed, and in this process, another defect such as etching of the cathode material may be caused. have.
Therefore, in the present invention, a single crystal base plate (or a cathode body) may be used. In particular, it is preferably made of single crystal silicon. In order to have conductivity, a ^{high-concentration doping of 10 19} /cm ³ or more may be performed on the mother plate made of single crystal silicon. Doping may be performed on the entire parent plate, or may be performed only on the surface portion of the parent plate.
Meanwhile, as a single crystal material, metals such as Ti, Cu, and Ag, semiconductors such as GaN, SiC, GaAs, GaP, AlN, InN, InP, Ge, and carbon-based materials such as graphite and graphene _{, CH 3 NH 3 PbCl 3,} CH 3 NH 3 PbBr 3, CH 3 NH 3 PbI 3, SrTiO 3 , etc. page containing the perovskite (perovskite) superconductor single crystalline ceramic, aircraft single crystal second heat-resistant alloy for components for such structures Etc. can be used. Metal and carbon-based materials are basically conductive materials. In the case of a semiconductor material, ^{high concentration doping of 10 19} /cm ³ or more may be performed to have conductivity. In the case of other materials, doping may be performed or oxygen vacancy may be formed to form conductivity. Doping may be performed on the entire parent plate, or may be performed only on the surface portion of the parent plate.
Since there are no defects in the case of a single crystal material, there is an advantage that a uniform plating film 110 can be generated due to the formation of a uniform electric field over the entire surface during electroplating. The frame-integrated masks 100 and 200 manufactured through a uniform plating film can further improve the quality level of OLED pixels. In addition, since there is no need to perform an additional process for removing and eliminating defects, there is an advantage in that process cost is reduced and productivity is improved.
Referring again to (a) of FIG. 11, next, the conductive substrate 21 is used as a mother plate [cathode body], and the anode body (not shown) is spaced apart on the conductive substrate 21. The plating film 110 (or the mask metal film 110) may be formed by electroplating. The plating film 110 may be formed on the exposed top and side surfaces of the conductive substrate 21 that faces the anode body and can act on an electric field. In addition to the side surfaces of the conductive substrate 21, the plating film 110 may be formed on a part of the lower surface of the conductive substrate 21.
Next, the edge portion of the plating film 110 is cut (D) with a laser, or a photoresist layer is formed on the plating film 110 and only the exposed portion of the plating film 110 is etched to be removed (D). I can. Accordingly, as shown in (b) of FIG. 11, the plating film 110 may be separated from the conductive substrate 21.
Meanwhile, before separating the plated film 110 from the conductive substrate 21, a heat treatment (H) may be performed. The present invention reduces the coefficient of thermal expansion of the mask 100 and at the same time prevents the deformation of the mask 100 and the mask pattern P due to heat. It is characterized in that the heat treatment (H) is performed before separating 110). The heat treatment may be performed at a temperature of 300°C to 800°C.
In general, compared to the Invar sheet produced by rolling, the Invar sheet produced by electroplating has a higher coefficient of thermal expansion. Thus, by performing a heat treatment on the Invar sheet, the coefficient of thermal expansion may be lowered, and during this heat treatment process, the Invar sheet may be peeled or deformed. This is a phenomenon that occurs because only the Invar thin plate is heat treated or the Invar thin plate temporarily adhered only to the upper surface of the conductive substrate 21 is heat treated. However, in the present invention, since the plating film 110 is formed not only on the upper surface of the conductive substrate 21 but also on the side and lower surfaces of the conductive substrate 21, peeling or deformation does not occur even when heat treatment (H) is performed. In other words, since the heat treatment is performed in a state in which the conductive substrate 21 and the plating film 110 are closely adhered, there is an advantage of preventing delamination and deformation due to heat treatment and stably performing heat treatment.
The thickness of the mask metal layer 110 generated by the electroplating process may be thinner than that of the rolling process. Accordingly, the planarization (PS) process for reducing the thickness may be omitted, but since the etching characteristics may be different depending on the composition of the surface layer of the plating mask metal layer 110 ′ and the crystal structure/microstructure, planarization (PS) is performed. Through the need to control the surface properties and thickness.
12 is a schematic side cross-sectional view showing a process of attaching a frame according to a difference in coefficient of thermal expansion of a mask. 12(a1) to (a3) show the process of attaching the Invar mask 100' generated by the electroplating process on the mask cell sheet part 220 (frame 200), and FIG. 12(b1) ) to (b3) show the process of attaching the Invar mask 100" generated by the rolling process on the mask cell sheet part 220 (frame 200). In Fig. 12, the mask using the difference in the coefficient of thermal expansion is used. The process of attaching while applying tension to the frame will be described.
The term "process area" may refer to a space in which constituent elements such as the mask 100 and the frame 200 are located, and an attaching process of the mask 100 is performed. The process area may be a space within a closed chamber or an open space. Further, the term "first temperature" may mean a temperature higher than or equal to the pixel deposition process temperature when the frame-integrated mask is used in the OLED pixel deposition process. In addition, the term "second temperature" may mean a temperature lower than the first temperature.
Referring to FIG. 12A1, the invar mask 100 ′ generated by the electroplating process is positioned on the mask cell sheet part 220. The Invar mask 100' produced by the electroplating process has a coefficient of thermal expansion ^{greater than about 3.0 X 10 -6} /°C. In addition, the mask cell sheet portion 220 composed of the Invar sheet produced by the rolling process has a coefficient of thermal expansion of about 1.0 X 10 ^-6 /°C.
Next, referring to FIG. 12A2, the temperature of the process region may be raised (ET) to the first temperature. Since the mask cell sheet part 220 has a smaller coefficient of thermal expansion than the invar mask 100', a displacement of L1 occurs after being elongated/expanded, whereas the invar mask 100' has an amount of L2 that is three times larger than L1. Displacement can occur (L1 <L2). In this state, the invar mask 100 ′ is welded to the mask cell sheet portion 220 to form a welding bead WB, thereby being integrally connected.
Next, referring to (a3) of FIG. 12, the temperature of the process region may be lowered (LT) to the second temperature. Since the mask cell sheet part 220 has a smaller coefficient of thermal expansion than the invar mask 100', after being contracted/compressed, displacement by L1 occurs and returns to its original size, whereas the Invar mask 100' is about three times larger than that of L1. A large displacement of L2 occurs and it can return to its original size. At this time, since the invar mask 100' is contracted/compressed with a greater displacement while attached to the mask cell sheet part 220 by welding, the tension TS is applied to the surrounding mask cell sheet part 220 by itself. It is done. The invar mask 100 ′ may be attached on the mask cell sheet part 220 in a more taut state by applying the tension TS by itself.
For comparison with the invar mask 100 ′ produced by the electroplating process, the case of the Invar mask 100 ″ produced by the rolling process will be described.
Referring to Fig. 12B1, the Invar mask 100" generated by the rolling process is placed on the mask cell sheet part 220. The Invar mask 100" generated by the rolling process has a coefficient of thermal expansion of about weak. It is about 1.0 X 10 ^-6 /℃. In addition, the mask cell sheet portion 220 composed of the Invar sheet produced by the rolling process has a thermal expansion coefficient of about 1.0 X 10 ^-6 /°C, similar to the Invar mask 100".
Next, referring to (b2) of FIG. 12, the temperature of the process region may be raised (ET) to the first temperature. After the mask cell sheet part 220 is elongated/expanded, a displacement as much as L1 occurs, and the invar mask 100" has the same coefficient of thermal expansion as that of the mask cell sheet part 220, so the displacement by L2 equal to L1 is the same. It may occur (L1 = L2) In this state, the invar mask 100" is welded to the mask cell sheet part 220 to form a welding bead WB, thereby being integrally connected.
Next, referring to (b3) of FIG. 12, the temperature of the process region may be lowered (LT) to the second temperature. Since the mask cell sheet part 220 and the invar mask 100" have the same coefficient of thermal expansion, the same displacements of L1 and L2 are generated after being contracted/compressed, so that the mask cell sheet part 220 can return to its original size. Since the and invar mask 100" is contracted/compressed with the same displacement, the invar mask 100" does not apply tension to the surrounding mask cell sheet portion 220. Therefore, the invar mask 100" generated by the rolling process is produced by the rolling process. In the case of 100"), there is a problem in that an alignment error of the mask pattern P may occur because tension is not applied to the mask cell sheet part 220 and thus sagging occurs due to a load. Accordingly, there is a need for a method of attaching the mask 100" to the mask cell sheet part 220 in a taut state.
In addition, a heating device/cooling device capable of heating or cooling is provided in order to raise (ET) the process region to a first temperature and lower (LT) to a second temperature so that the difference in the coefficient of thermal expansion as shown in FIG. 12 can be used. Should be. In order to further install these devices in an apparatus for manufacturing a frame-integrated mask, interference with other equipment must be considered, and cost increases as the apparatus is added. In addition, there is a problem in that, in the process of heating/cooling the process area, an adverse effect of giving thermal shock to other devices may occur.
Therefore, the present invention does not heat or cool the process area, and at the same time, in the process of attaching the mask 100 to the frame 200, the frame 200 is tightened without applying a direct tensile force to the mask 100. ) We propose a method that can be attached to it.
13 to 14 are schematic diagrams illustrating a process of adhering the mask metal layers 110 and 110 ′ to the template 50 according to an exemplary embodiment of the present invention.
The mask supporting template according to an embodiment of the present invention is characterized in that the mask 100 is adhered on the template 50 in a state in which a tensile force F is applied in the lateral direction. In addition, the mask metal film supporting template according to an embodiment of the present invention is characterized in that the mask metal films 110 and 110 ′ are adhered to the template 50 in a state in which a tensile force F is applied in the lateral direction. When the process of forming the mask pattern P is completed in the mask metal layer supporting template, the mask supporting template may be formed.
Referring to FIG. 13, an apparatus 40 for manufacturing a mask metal film supporting template may include a body 41, an upper block 42, a lower block 45, and a tensioning means 46.
The body 41 may provide a chamber space in which the mask metal layers 110 and 100 ′ and the template 50 are adhered. The main body 41 may be connected to a vacuum forming means (not shown) such as a pump, so that the chamber space becomes a vacuum (VAC) environment.
The upper block 42 may be disposed above the chamber space. The upper block 42 is connected to an elevating means (not shown) that can move up and down, and may come into contact with the lower block 45 when positioned at a lower limit. The template 50 may be fixed under the upper block 42.
The template 50 will be described in detail. The template 50 is a medium that can be moved while the mask 100 is attached and supported on one surface. It is preferable that one surface of the template 50 is flat to support and move the flat mask 100. The central portion 50a (refer to FIG. 15) may correspond to the mask cell C of the mask metal layer 110, and the edge portion 50b may correspond to the dummy DM of the mask metal layer 110. The size of the template 50 may be a flat plate shape having the same area or larger than that of the mask metal layer 110 so that the mask metal layer 110 can be entirely supported.
The template 50 is preferably made of a transparent material to facilitate observation of vision and the like in the process of aligning and bonding the mask 100 to the frame 200. In addition, in the case of a transparent material, the laser may penetrate. Transparent materials such as glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), borosilicate glass, zirconia, soda-lime glass , Low-iron glass, etc. can be used. For example, in consideration of the coefficient of thermal expansion with the mask 100, the template 50 may be made of a ^{BOROFLOAT ® 33 material having excellent heat resistance, chemical durability, mechanical strength, transparency, etc. among borosilicate glass.}
Meanwhile, in the template 50, one surface in contact with the mask metal layer 110 is a mirror surface so that an air gap does not occur between the interface with the mask metal layer 110 (or the mask 100). I can. In consideration of this, the surface roughness Ra of one surface of the template 50 may be 100 nm or less. In order to implement the template 50 having a surface roughness Ra of 100 nm or less, the template 50 may use a wafer. The wafer (wafer) has a surface roughness (Ra) of about 10 nm, there are many products on the market, and many surface treatment processes are known, so it can be used as the template 50. Since the surface roughness (Ra) of the template 50 is in nm scale, there is no or almost no air gap, and it is easy to generate the welding bead (WB) by laser welding, which affects the alignment error of the mask pattern (P). I may not give it.
The template 50 includes a laser through hole 51 in the template 50 so that the laser L irradiated from the upper portion of the template 50 can reach the welding portion WP of the mask 100 (a region to be welded). ) Can be formed. The laser through-hole 51 may be formed in the template 50 to correspond to the position and number of the welding portions WP. Since a plurality of welding portions WP are disposed along a predetermined interval in the edge or the dummy DM portion of the mask 100, a plurality of laser through holes 51 may be formed along a predetermined interval to correspond thereto. As an example, since a plurality of welding parts are disposed along a predetermined distance on both sides (left/right) dummy (DM) portions of the mask 100, the laser through hole 51 also has the template 50 on both sides (left/right). A plurality may be formed along a predetermined interval.
The laser through-hole 51 need not necessarily correspond to the position and number of the welding portions WP. For example, it is also possible to perform welding by irradiating the laser (L) to only a part of the laser through hole (51). In addition, some of the laser through-holes 51 that do not correspond to the welding part WP may be used instead of the alignment mark when aligning the mask 100 and the template 50. If the material of the template 50 is transparent to the laser (L) light, the laser through hole 51 may not be formed.
On the other hand, as long as it is applied from the top of the template 50 as well as the laser L to reach the weld WP of the mask 100, other forms of energy ("welding energy") Can also be used. In this case, the laser through hole 51 may be referred to as a through hole 51.
A temporary adhesive portion 55 may be formed on one surface of the template 50. Temporary bonding portion 55 is temporarily adhered to one surface of the template 50 until the mask 100 is adhered to the frame 200 (or the mask metal film 110). Can be supported.
The temporary adhesive part 55 may be an adhesive or adhesive sheet (thermal release type) that can be separated by applying heat, an adhesive or adhesive sheet (UV release type) that can be separated by UV irradiation.
For example, the temporary bonding part 55 may be formed of liquid wax. The liquid wax may be the same as the wax used in the polishing step of a semiconductor wafer, and the like, and the type is not particularly limited. The liquid wax is mainly a resin component for controlling adhesion, impact resistance, and the like with respect to holding power, and may include substances and solvents such as acrylic, vinyl acetate, nylon, and various polymers. As an example, the temporary adhesive part 55 may use SKYLIQUID ABR-4016 including acrylonitrile butadiene rubber (ABR) as a resin component and n-propyl alcohol as a solvent component. The liquid wax may be formed on the temporary bonding portion 55 using spin coating.
The temporary adhesive part 55, which is a liquid wax, has a lower viscosity at a temperature higher than 85°C to 100°C, and becomes more viscous at a temperature lower than 85°C and may be partially solidified, so that the mask metal film 110' and the template 50 ) Can be fixed and bonded.
17 is an enlarged cross-sectional schematic view showing a temporary bonding portion 55 according to an embodiment of the present invention. As another example, the temporary adhesive part 55 may use a thermal release tape. In the thermal release tape, a core film 56 such as a PET film is disposed in the center, and thermal release adhesives 57a and 57b are disposed on both sides of the core film 56, and an adhesive layer 57a , 57b) may be in a form in which the release film/release film 58a and 58b are disposed. Here, the adhesive layers 57a and 57b disposed on both sides of the core film 56 may have different temperatures at which they are separated from each other.
According to an embodiment, in the state where the release film/release films 58a and 58b are removed, the lower surface of the heat release tape (the second adhesive layer 57b) is adhered to the template 50, and the upper part of the heat release tape The surface (the first adhesive layer 57a) may be adhered to the mask metal layer 110 ′. Since the first adhesive layer 57a and the second adhesive layer 57b are separated from each other at different temperatures, when separating the template 50 from the mask 100 in FIG. 18 to be described later, the first adhesive layer 57a As the heat to be thermally peeled off is applied, the mask 100 may be separated from the template 50 and the temporary bonding portion 55.
Again, referring to FIG. 13, the lower block 45 may be disposed below the chamber space so as to face the upper block 42. The lower block 45 may be in a fixed state, but, like the upper block 42, may be connected to an elevating means (not shown) that can move up and down.
The mask metal layers 110 and 110 ′ may be fixed on the lower block 45. The mask metal film 110 ′ itself generated by the rolling process or the electroplating process may be used, or the mask metal film 110 having a reduced thickness may be used.
The tensioning means 46 on the lower block 45 may clamp the mask metal layers 110 and 110 ′ to apply a tensile force F in the lateral direction. The tensioning means 46 may clamp one or both sides of the mask metal layers 110 and 110 ′. According to the application of the tensile force (F) of the tensioning means 46, the mask metal layers 110 and 110 ′ may be fixed on the lower block 45 in a state that is longer than the original length.
Next, referring to FIG. 14A, the upper block 42 may descend. Alternatively, the upper block 42 and the lower block 45 may descend/elevate each other. Accordingly, the template 50 fixed to the lower portion of the upper block 42 and the mask metal films 110 and 110 ′ fixed to the upper block 45 may contact each other.
After the template 50 and the mask metal layers 110 and 110 ′ come into contact with each other by the temporary bonding portion 55, they may be bonded to each other. In this case, it is preferable to maintain a vacuum (VAC) atmosphere in the chamber space to prevent air bubbles from entering between the template 50 and the mask metal layers 110 and 110 ′.
In the case of liquid wax, the temporary bonding part 55 compresses the upper block 42 and the lower block 45 while maintaining the chamber space at a temperature of about 85°C to 100°C to form the template 50 and the mask metal film 110. , 110') can be performed. In addition, according to an embodiment, baking is performed on the template 50 for about 120° C. for 60 seconds to vaporize the solvent of the temporary bonding portion 55, and the upper block 42 and the lower block 45 are Bonding of the template 50 and the mask metal layers 110 and 110 ′ may be performed by pressing.
The template 50 and the mask metal films 110 and 110 ′ may be bonded to each other while the tensioning means 46 maintains applying a tensile force F to the side of the mask metal films 110 and 110 ′.
Since an extra area that can be clamped to the side surfaces of the mask metal layers 110 and 110 ′ is required, the mask metal layers 110 and 110 ′ may have a larger area than the template 50. After the mask metal layers 110 and 110 ′ are adhered to the template 50, portions of the mask metal layers 110 and 110 ′ protruding out of the template 50 may be cut.
Then, a mask metal film support template may be manufactured as shown in FIG. 14B. The template 50 and the mask metal film supporting template to which the mask metal films 110 and 110 ′ are adhered may be taken out from the body 41. Since the template 50 is adhered and fixed with the tensile force (F) applied to the mask metal films 110 and 110', even if the tensioning means 46 releases the clamping, the mask metal films 110 and 110' It may be adhesively fixed on the template 50 while maintaining the tensile force IT. This residual tensile force IT may be maintained until the mask metal layers 110 and 110 ′ are separated from the template 50.
15 to 16 are schematic diagrams illustrating a process of manufacturing a mask supporting template by attaching the mask metal layer 110 on the template 50 and forming the mask 100 according to an embodiment of the present invention.
Subsequent to FIG. 14, referring to FIG. 15A further, when the mask metal layer 110 ′ is adhered to the template 50, one surface of the mask metal layer 110 ′ may be planarized (PS). . As described above in FIG. 10, the mask metal layer 110 ′ manufactured by the rolling process may be reduced in thickness (110 ′ -> 110) through a planarization (PS) process.
Accordingly, as the thickness of the mask metal layer 110 ′ is reduced (110 ′ -> 110), as shown in FIG. 15B, the thickness of the mask metal layer 110 becomes about 5 μm to 20 μm. I can.
Next, referring to FIG. 16C, a patterned insulating portion 25 may be formed on the mask metal layer 110. The insulating part 25 may be formed of a photoresist material using a printing method or the like.
Subsequently, the mask metal layer 110 may be etched. A method such as dry etching or wet etching may be used without limitation, and as a result of the etching, a portion of the mask metal layer 110 exposed to the empty space 26 between the insulating portions 25 may be etched. The etched portion of the mask metal layer 110 constitutes the mask pattern P, and the mask 100 having a plurality of mask patterns P formed thereon may be manufactured.
Next, referring to (d) of FIG. 16, the manufacturing of the template 50 supporting the mask 100 may be completed by removing the insulating portion 25.
Since the frame 200 includes a plurality of mask cell regions (CR: CR11 to CR56), the mask 100 having mask cells (C: C11 to C56) corresponding to each of the mask cell regions (CR: CR11 to CR56). ) May also be provided in plural. In addition, a plurality of templates 50 supporting each of the plurality of masks 100 may be provided.
18 is a schematic diagram illustrating a process of loading a mask supporting template onto a frame according to an embodiment of the present invention.
Referring to FIG. 18, the template 50 may be transferred by the vacuum chuck 90. The vacuum chuck 90 may adsorb and transport a surface opposite to the surface of the template 50 to which the mask 100 is adhered. The vacuum chuck 90 may be connected to a moving means (not shown) that moves in the x, y, z, and θ axes. In addition, the vacuum chuck 90 may be connected to a flip means (not shown) capable of adsorbing and flipping the template 50. As shown in (b) of FIG. 18, after the vacuum chuck 90 adsorbs and flips the template 50, even in the process of transferring the template 50 onto the frame 200, the mask 100 There is no effect on the adhesion and alignment.
19 is a schematic diagram showing a state in which the template 50 according to an embodiment of the present invention is loaded onto the frame 200 and the mask 100 corresponds to the cell area CR of the frame 200. In FIG. 19, one mask 100 is exemplified in correspondence/attachment to the cell area CR. However, a plurality of masks 100 are simultaneously corresponded to all the cell areas CR so that the mask 100 is framed 200. You can also perform the process of attaching to ). In this case, a plurality of templates 50 supporting each of the plurality of masks 100 may be provided.
Next, referring to FIG. 19, the mask 100 may correspond to one mask cell area CR of the frame 200. By loading the template 50 onto the frame 200 (or the mask cell sheet part 220), the mask 100 may correspond to the mask cell area CR. While controlling the position of the template 50/vacuum chuck 90, it is possible to examine whether the mask 100 corresponds to the mask cell area CR through a microscope. Since the template 50 compresses the mask 100, the mask 100 and the frame 200 can be in close contact with each other.
Meanwhile, the lower support 70 may be further disposed under the frame 200. The lower support 70 may have a size such that it fits into the hollow region R of the frame rim 210 and may have a flat plate shape. In addition, a predetermined support groove (not shown) corresponding to the shape of the mask cell sheet part 220 may be formed on the upper surface of the lower support body 70. In this case, the edge sheet portion 221 and the first and second grid sheet portions 223 and 225 are fitted into the support grooves, so that the mask cell sheet portion 220 may be better fixed.
The lower support 70 may press the opposite surface of the mask cell area CR to which the mask 100 contacts. That is, the lower support 70 may support the mask cell sheet part 220 in an upward direction to prevent the mask cell sheet part 220 from sagging downward during the attaching process of the mask 100. At the same time, since the lower support 70 and the template 50 press the frame 200 (or the mask cell sheet part 220) of the mask 100 in opposite directions to each other, the mask 100 Can be maintained without being disturbed.
In this way, simply attaching the mask 100 on the template 50 and loading the template 50 on the frame 200 allows the mask 100 to correspond to the mask cell area CR of the frame 200. Since the process is completed, no tensile force may be applied to the mask 100 during this process.
Subsequently, the mask 100 may be attached to the frame 200 by irradiating the laser L to the mask 100 by laser welding. A welding bead WB is generated in the welding portion of the laser-welded mask, and the welding bead WB may be integrally connected with the mask 100 / frame 200 and having the same material.
20 is a schematic diagram showing a process of separating the mask 100 and the template 50 after attaching the mask 100 to the frame 200 according to an embodiment of the present invention.
Referring to FIG. 20, after attaching the mask 100 to the frame 200, the mask 100 and the template 50 may be debonded. Separation of the mask 100 and the template 50 can be performed through at least one of heat application (ET), chemical treatment (CM), ultrasonic application (US), and UV application (UV) to the temporary bonding part 55. have. Since the mask 100 remains attached to the frame 200, only the template 50 can be lifted. For example, when heat at a temperature higher than 85°C to 100°C is applied (ET), the viscosity of the temporary bonding portion 55 decreases, and the adhesive strength between the mask 100 and the template 50 is weakened, and thus the mask 100 ) And the template 50 may be separated. As another example, the mask 100 and the template 50 may be separated by dissolving or removing the temporary bonding portion 55 by immersing (CM) the temporary bonding portion 55 in a chemical substance such as IPA, acetone, and ethanol. have. As another example, when ultrasound is applied (US) or UV is applied (UV), the adhesion between the mask 100 and the template 50 is weakened, so that the mask 100 and the template 50 may be separated.
In more detail, since the temporary bonding portion 55 that mediates the adhesion between the mask 100 and the template 50 is a TBDB adhesive material (temporary bonding&debonding adhesive), various debonding methods can be used.
For example, a solvent debonding method according to a chemical treatment (CM) may be used. Debonding may be performed as the temporary bonding portion 55 is dissolved by the penetration of the solvent. At this time, since the pattern P is formed on the mask 100, the solvent may penetrate through the mask pattern P and the interface between the mask 100 and the template 50. Solvent debonding has an advantage of being relatively economical compared to other debonding methods because debonding is possible at room temperature and does not require a complex debonding facility designed separately.
As another example, a heat debonding method according to heat application (ET) may be used. When the temporary bonding portion 55 is decomposed using high temperature heat, and the adhesive force between the mask 100 and the template 50 is reduced, debonding may proceed in the vertical direction or the left and right directions.
As another example, a peelable adhesive debonding method based on heat application (ET), UV application (UV), or the like may be used. When the temporary adhesive part 55 is a thermal peeling tape, debonding can be performed using a peel adhesive debonding method, and this method does not require high-temperature heat treatment and expensive heat treatment equipment like the thermal debonding method. Has a relatively simple advantage.
As another example, a room temperature debonding method according to chemical treatment (CM), ultrasonic application (US), and UV application (UV) may be used. When a non-sticky treatment is performed on a part (central part) of the mask 100 or the template 50, only the edge part may be adhered by the temporary adhesive part 55. In addition, during the debonding, the solvent penetrates into the edge portion and the debonding is performed by dissolving the entrance examination bonding portion 55. This method has the advantage of not causing direct loss or defects due to adhesive material residues during debonding, except for the edge area of the mask 100 and the template 50 while bonding and debonding are in progress. There is this. In addition, unlike the thermal debonding method, since a high-temperature heat treatment process is not required during debonding, there is an advantage of relatively reducing the process cost.
Again, referring to FIG. 20 ((b) of FIG. 20), when the template 50 is separated from the mask 100, the mask 100 is attached to the frame 200 (mask cell sheet part 220). It can contract a predetermined amount in the state. As described above in (b) of FIG. 14, when the template 50 is separated while the mask metal layers 110 and 110 ′ have a tensile force (IT) in themselves, the mask metal layers 110 and 110 ′ are unique. It contracts in the process of returning to length. Accordingly, by applying the tension TS to the frame 200 (mask cell sheet part 220), the mask 100 may be attached in a taut state.
21 is a schematic diagram showing a state in which the mask 100 is attached to the frame 200 according to an embodiment of the present invention. In FIG. 21, all of the masks 100 are attached to the cell area CR of the frame 200. After attaching the masks 100 one by one, the template 50 may be separated, but after attaching all the masks 100, all the templates 50 may be separated.
In the present invention, by attaching the mask 100 on the template 50 and loading the template 50 on the frame 200, the mask 100 corresponds to the mask cell area CR of the frame 200. Since the process is completed, no tensile force may be applied to the mask 100 during this process. Thus, it is possible to prevent deformation of the frame 200 (or the mask cell sheet part 220) by acting as a tension on the frame 200 as opposed to the tensile force applied to the mask 100.
The conventional mask 10 of FIG. 1 has a long length because it includes 6 cells (C1 to C6), whereas the mask 100 of the present invention has a short length including one cell (C). The degree of distortion of the pixel position accuracy (PPA) can be reduced. For example, assuming that the length of the mask 10 including a plurality of cells (C1 to C6, ...) is 1 m and a PPA error of 10 μm occurs in the entire 1 m, the mask 100 of the present invention The above error range can be 1/n according to the reduction in the relative length (corresponding to the reduction in the number of cells C). For example, if the length of the mask 100 of the present invention is 100 mm, since it has a length reduced from 1 m to 1/10 of the conventional mask 10, a PPA error of 1 μm occurs in the entire 100 mm length. , There is an effect that the alignment error is significantly reduced.
On the other hand, if the mask 100 includes a plurality of cells C, and each cell C corresponds to each cell area CR of the frame 200 within a range in which the alignment error is minimized, The mask 100 may correspond to a plurality of mask cell regions CR of the frame 200. Alternatively, the mask 100 having a plurality of cells C may correspond to one mask cell area CR. Even in this case, in consideration of the process time and productivity according to the alignment, the mask 100 is preferably provided with as few cells (C) as possible.
In the case of the present invention, it is only necessary to match one cell (C) of the mask 100 and check the alignment state, so that a plurality of cells (C: C1 to C6) must be matched at the same time and all alignment conditions must be checked. Compared to the conventional method [see Fig. 2], the manufacturing time can be significantly reduced.
That is, in the method of manufacturing a frame-integrated mask of the present invention, each of the cells C11 to C16 included in the six masks 100 corresponds to each of the cell regions CR11 to CR16 and checks the alignment state. Through one process, the time can be much shorter than that of a conventional method in which the six cells C1 to C6 are simultaneously matched and the alignment state of the six cells C1 to C6 is checked at the same time.
In addition, in the method of manufacturing a frame-integrated mask of the present invention, the product yield in the process of 30 times of matching and aligning 30 masks 100 to 30 cell regions (CR: CR11 to CR56), respectively, is 6 cells (C1). The five masks 10 each including ~C6) (see Fig. 2 (a)) may appear much higher than the conventional product yield in the five processes of matching and aligning the frame 20. Since the conventional method of arranging six cells (C1 to C6) in a region corresponding to six cells (C) at a time is a much cumbersome and difficult operation, the product yield is low.
When the template 50 and the mask 100 are separated after each of the masks 100 are attached to the corresponding mask cell area CR, a tension TS that contracts the plurality of masks 100 in opposite directions to each other. ) Is applied, the force is canceled, so that deformation does not occur in the mask cell sheet portion 220. For example, the first grid sheet portion 223 between the mask 100 attached to the CR11 cell area and the mask 100 attached to the CR12 cell area is in the right direction of the mask 100 attached to the CR11 cell area. The applied tension TS and the tension TS acting in the left direction of the mask 100 attached to the CR12 cell area may be canceled out. Thus, the frame 200 (or the mask cell sheet part 220) due to the tension (TS) has the advantage that the deformation is minimized so that the alignment error of the mask 100 (or the mask pattern P) can be minimized. There is this.
22 is a schematic diagram showing an OLED pixel deposition apparatus 1000 using the frame-integrated masks 100 and 200 according to an embodiment of the present invention.
Referring to FIG. 22, the OLED pixel deposition apparatus 1000 includes a magnet plate 300 in which a magnet 310 is accommodated and a cooling water line 350 is disposed, and an organic material source 600 from a lower portion of the magnet plate 300. It includes a deposition source supply unit 500 to supply ).
A target substrate 900 such as glass on which the organic material source 600 is deposited may be interposed between the magnet plate 300 and the source deposition unit 500. The frame-integrated masks 100 and 200 (or FMM) for allowing the organic material source 600 to be deposited for each pixel may be disposed on the target substrate 900 to be in close contact or very close to each other. The magnet 310 generates a magnetic field and may be in close contact with the target substrate 900 by the magnetic field.
The deposition source supply unit 500 may reciprocate the left and right path to supply the organic material source 600, and the organic material sources 600 supplied from the deposition source supply unit 500 are pattern P formed on the frame-integrated masks 100 and 200. ) May be deposited on one side of the target substrate 900. The deposited organic material source 600 passing through the pattern P of the frame-integrated masks 100 and 200 may function as the pixel 700 of the OLED.
In order to prevent non-uniform deposition of the pixel 700 due to the shadow effect, the pattern of the frame-integrated masks 100 and 200 may be formed to be inclined (S) (or formed in a tapered shape (S)). . Since the organic material sources 600 passing through the pattern in a diagonal direction along the inclined surface may also contribute to the formation of the pixel 700, the pixel 700 may have a uniform thickness as a whole.

Since the mask 100 is attached and fixed to the frame 200 at a first temperature higher than the pixel deposition process temperature, even if it is raised to the process temperature for pixel deposition, the position of the mask pattern P is hardly affected. The PPA between 100 and the mask 100 adjacent thereto may be maintained not to exceed 3 μm.

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Although the present invention has been shown and described with reference to a preferred embodiment as described above, it is not limited to the above embodiment, and within the scope not departing from the spirit of the present invention, various It can be transformed and changed. Such modifications and variations should be viewed as falling within the scope of the present invention and the appended claims.

40: mask metal film support template manufacturing apparatus
41: main body
42: upper block
45; Lower block
46: tension means
50: template
51: laser through hole
55: temporary bonding part
70: lower support
100: mask
110: mask film, mask metal film
200: frame
210: frame frame portion
220: mask cell sheet portion
221: border sheet portion
223: first grid seat portion
225: second grid seat portion
1000: OLED pixel deposition device
C: cell, mask cell
CM: chemical treatment
CR: Mask cell area
DM: dummy, mask dummy
EP: heat application
L: laser
R: hollow area of the frame part
P: mask pattern
US: Ultrasonic approval
UV: UV applied
W: welding
WB: welding bead
WP: weld

Claims (34)

delete As a template that supports an OLED pixel forming mask and corresponds to the frame,
template;
A temporary adhesive portion formed on the template; And
A mask that is adhered to the template through a temporary bonding part and has a mask pattern formed thereon
Including,
A through hole through which welding energy passes is formed in the portion of the template corresponding to the welding portion of the mask,
A mask supporting template, wherein the mask is adhered on the template in a state in which a tensile force is applied in the lateral direction, and the mask is adhered on the template in a state extending from the original length. delete delete delete delete delete delete delete template;
A temporary adhesive portion formed on the template; And
A mask metal film that is adhered to the template through a temporary bonding part and used to manufacture a mask for forming an OLED pixel.
Including,
A through hole through which welding energy passes is formed in the portion of the template corresponding to the welding portion of the mask,
A mask metal film supporting template, wherein the mask is adhered on the template in a state where a tensile force is applied in the lateral direction, and the mask is adhered on the template in a state extending from the original length. delete As a manufacturing method of a template corresponding to a frame by supporting an OLED pixel forming mask,
(a) providing a mask metal film;
(b) adhering a mask metal film on a template having a temporary adhesive portion formed on one side thereof while applying a tensile force in the lateral direction; And
(c) manufacturing a mask by forming a mask pattern on the mask metal film
Including,
In step (b), the mask metal film is adhered to the template in a state where a tensile force is applied in the lateral direction, so that the mask metal film is adhered to the template in a state extending from the original length. delete delete delete The method of claim 12,
Step (b) is,
(b1) fixing the template on which the temporary adhesive portion is formed on one side to the upper block;
(b2) fixing at least one side of the mask metal film to the lower block in a tensioned state; And
(b3) bonding the mask metal film and the template by compressing the upper block and the lower block
Containing, the manufacturing method of the mask support template. delete delete delete A method of manufacturing a frame-integrated mask in which a plurality of masks and a frame supporting the mask are integrally formed,
(a) preparing a mask supporting template in which a mask having a plurality of mask patterns formed thereon is adhered to the template;
(b) loading a template onto a frame having a plurality of mask cell areas to correspond the mask to the mask cell area of the frame; And
(c) attaching the mask to the frame
Including,
A method of manufacturing a frame-integrated mask, wherein the mask is adhered on the template while the tensile force is applied in the lateral direction, so that the mask metal film is adhered to the template in a state extending from the original length. delete delete delete delete delete delete delete delete delete delete delete delete delete delete

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