CN111261802A

CN111261802A - Mask supporting template, mask metal film supporting template, mask supporting template manufacturing method, and frame integrated mask manufacturing method

Info

Publication number: CN111261802A
Application number: CN201911213854.7A
Authority: CN
Inventors: 李炳一
Original assignee: Tgo Tech Corp
Current assignee: Tgo Tech Corp
Priority date: 2018-12-03
Filing date: 2019-12-02
Publication date: 2020-06-09
Anticipated expiration: 2039-12-02
Also published as: TW202023092A; KR20200067049A; KR102236542B1; TWI731482B; CN111261802B

Abstract

The present invention relates to a mask supporting template, a mask metal film supporting template, a method for manufacturing the mask supporting template, and a method for manufacturing a frame-integrated mask. The mask supporting template according to the present invention is a template for supporting a mask for forming OLED pixels and for attaching the mask to a frame, and includes: a template (50); a temporary bonding section (55) formed on the template (50); and a mask (100) bonded to the template (50) with a temporary bonding section (55) interposed therebetween, and having a mask pattern (P) formed thereon, wherein the mask (100) is bonded to the template (50) in a state in which a tensile force is applied in a lateral direction.

Description

Mask supporting template, mask metal film supporting template, mask supporting template manufacturing method, and frame integrated mask manufacturing method

Technical Field

The present invention relates to a mask supporting template, a mask metal film supporting template, a method for manufacturing the mask supporting template, and a method for manufacturing a frame-integrated mask. More particularly, the present invention relates to a mask supporting template, a mask metal film supporting template, a method for manufacturing the mask supporting template, and a method for manufacturing a frame-integrated mask, in which a mask is stably supported and moved without deformation, and each mask can be accurately aligned (aligned).

Background

As a technique for forming pixels in an OLED (organic light emitting diode) manufacturing process, an FMM (fine metal Mask) method is mainly used, which attaches a metal Mask (Shadow Mask) in the form of a thin film to a substrate and deposits an organic substance at a desired position.

In the existing OLED manufacturing process, after a mask is manufactured in a bar shape, a plate shape, or the like, the mask is solder-fixed to an OLED pixel deposition frame and used. One mask may have a plurality of cells corresponding to one display. In addition, in order to manufacture a large-area OLED, a plurality of masks may be fixed to an OLED pixel deposition frame, and each mask is stretched to be flat in the process of being fixed to the frame. Adjusting the tensile force to flatten the entire portion of the mask is a very difficult task. In particular, in order to align a mask pattern having a size of only several μm to several tens μm while flattening all the cells, it is necessary to finely adjust the tensile force applied to each side of the mask and to confirm the height requirement of the alignment state in real time.

However, in the process of fixing a plurality of masks to one frame, there is a problem that alignment between the masks and between the mask units is not good. In addition, in the process of welding and fixing the mask to the frame, the mask film has a problem that the mask is sagged or distorted due to a load because the thickness of the mask film is too thin and the area of the mask film is large; a problem of misalignment of the mask unit due to wrinkles, burrs (burr), etc. generated at the welded portion during the welding process, etc.

In the ultra-high definition OLED, the conventional QHD image quality is 500-600PPI (pixel per inch), the pixel size reaches about 30-50 μm, and the 4KUHD and 8KUHD high definition have higher resolution of 860PPI, 1600PPI and the like. Thus, in consideration of the pixel size of the ultra-high-definition OLED, the alignment error between the units needs to be reduced to about several μm, and exceeding this error causes product defects, so the yield may be extremely low. Therefore, it is necessary to develop a technique capable of preventing the sagging or distortion or the like of the mask and making the alignment accurate, a technique of fixing the mask to the frame, and the like.

Disclosure of Invention

Technical problem

Accordingly, the present invention has been made to solve the above-mentioned problems occurring in the prior art, and an object of the present invention is to provide a mask supporting template, a mask metal film supporting template, a method for manufacturing the mask supporting template, and a method for manufacturing a frame-integrated mask, which can stably support and move a mask without deformation, and can prevent the mask from deformation such as sagging or twisting, and can be accurately aligned.

Another object of the present invention is to provide a method for manufacturing a frame-integrated mask, which can significantly reduce the manufacturing time and significantly improve the yield.

Technical scheme

The stated object of the present invention is achieved by a mask supporting stencil for supporting a mask for OLED pixel formation and corresponding the mask to a frame, the mask supporting stencil including a stencil; a temporary bonding portion formed on the template; and a mask bonded to the template with the temporary bonding portion interposed therebetween and having a mask pattern formed thereon, the mask being bonded to the template in a state in which a tensile force is applied in a lateral direction.

Further, the stated object of the present invention is achieved by a mask supporting stencil for supporting a mask for OLED pixel formation and corresponding the mask to a frame, the mask supporting stencil including a stencil; a temporary bonding portion formed on the template; and a mask which is bonded to the template with a temporary bonding portion interposed therebetween and has a mask pattern formed thereon, wherein a through hole for allowing welding energy to pass therethrough is formed in a portion of the template corresponding to a welding portion of the mask, and the mask is bonded to the template in a state in which a tensile force is applied in a side direction.

The temporary bonding portion may be a heat-releasable adhesive or bonding sheet, a UV-releasable adhesive or bonding sheet upon irradiation.

The template material may include wafer, glass, silica gel, pyrex, quartz, alumina (Al)₂O₃) Any one of borosilicate glass (borosilicate glass), zirconia (zirconia), soda-lime glass (soda-lime glass), and low-iron glass (low-iron glass).

Further, the object of the present invention is achieved by a mask metal film supporting template including a template; a temporary bonding portion formed on the template; and a mask metal film which is bonded to the stencil with a temporary bonding portion interposed therebetween and used for manufacturing the mask for forming the OLED pixel, and which is bonded to the stencil with a tensile force applied in a lateral direction.

Further, the object of the present invention is achieved by a mask metal film supporting template including a template; a temporary bonding portion formed on the template; and a mask metal film which is bonded to the mask plate with a temporary bonding portion interposed therebetween and used for manufacturing a mask for forming an OLED pixel, wherein a through hole for passing welding energy is formed in a portion of the mask plate corresponding to a welding portion of the mask, and the mask is bonded to the mask plate in a state where a tensile force is applied in a lateral direction.

The mask metal film may be made into a mask for OLED pixel formation by performing the following steps: (a) a step of forming a patterned insulating portion on the mask metal film; (b) a step of forming a mask pattern by etching the mask metal film portion exposed between the insulating portions; and (c) removing the insulating portion.

Further, the object of the present invention is achieved by a method of manufacturing a mask supporting template for supporting a mask for OLED pixel formation and corresponding the mask to a frame, the method including: (a) bonding the mask metal film to a template having a temporary bonding portion formed on one surface thereof in a state where a tensile force is applied in a side surface direction; and (b) a step of manufacturing a mask by forming a mask pattern on the mask metal film.

Between step (a) and step (b), a step of reducing the thickness of the mask metal film bonded to the template may be further included.

Step (a) may comprise: (a1) fixing a template having a temporary bonding portion formed on one surface thereof to the upper block; (a2) a step of fixing at least one side of the mask metal film to the lower block in a stretched state; and (a3) a step of bonding the mask metal film and the stencil by pressing the upper block and the lower block.

Step (a) may be performed under a vacuum atmosphere.

After the step (a3), the portions of the mask metal film that protrude to the outside of the stencil may be cut.

Step (b) may comprise: (b1) a step of forming a patterned insulating portion on the mask metal film; (b2) a step of forming a mask pattern by etching the mask metal film portion exposed between the insulating portions; and (b3) removing the insulating portion.

Further, the object of the present invention is achieved by a method of manufacturing a frame-integrated mask integrally formed of a plurality of masks and a frame for supporting the masks, the method including: a step of (a) preparing a mask supporting template to which a mask having a plurality of mask patterns formed thereon is bonded on a template; (b) a step of loading the template onto a frame having a plurality of mask unit regions and corresponding the mask to the mask unit regions of the frame; and (c) attaching a mask to the frame, the mask being bonded to the stencil with a tensile force applied in the lateral direction.

The method can also comprise the following steps: (d) attaching a mask to all mask cell regions of the frame by repeatedly performing the steps (b) to (c).

Step (a) may comprise: (a1) a step of providing a mask metal mold composed of a metal sheet (sheet) manufactured by a rolling process; (a2) bonding the mask metal film to a template having a temporary bonding portion formed on one surface thereof in a state where a tensile force is applied in a side direction; and (a3) a step of manufacturing a mask by forming a mask pattern on the mask metal film, thereby providing a mask supporting template to which the mask is bonded, the mask having a plurality of mask patterns formed thereon.

In the step (c), the laser irradiated on the upper portion of the mask may be irradiated onto the welding portion of the mask through the laser penetration hole.

A step of separating the mask from the template by at least any one of heating, chemical treatment, ultrasonic wave application, and UV application to the temporary bonding portion after the step (c) may be further included.

If the stencil is separated from the mask, a tensile force applied to the mask will be applied to the frame.

The frame may include: an edge frame portion including a hollow region; and a mask unit sheet portion connected to the edge frame portion and having a plurality of mask unit regions, the mask unit sheet portion including: an edge sheet portion; at least one first grid sheet part extending in a first direction and having both ends connected to the edge sheet part; and a second grid sheet part extending in a second direction perpendicular to the first direction, intersecting the first grid sheet part, and having both ends connected to the edge sheet part.

Effects of the invention

According to the present invention having the above-described configuration, the mask can be stably supported and moved without being deformed, and the mask can be prevented from being deformed such as sagging or twisting, and can be accurately aligned.

In addition, the present invention has the effect of remarkably shortening the manufacturing time and remarkably improving the yield.

Drawings

FIG. 1 is a schematic diagram of a prior art mask for OLED pixel deposition.

Fig. 2 is a schematic view of a conventional process of attaching a mask to a frame.

Fig. 3 is a schematic diagram of alignment errors between cells occurring in a conventional process of stretching a mask.

Fig. 4 is a front view and a side sectional view of a frame-integrated mask according to an embodiment of the present invention.

Fig. 5 is a front view and a side sectional view of a frame according to an embodiment of the present invention.

Fig. 6 is a schematic view of a manufacturing process of a frame according to an embodiment of the present invention.

Fig. 7 is a schematic view of a manufacturing process of a frame according to another embodiment of the present invention.

Fig. 8 is a schematic view of a mask used to form a conventional high-resolution OLED.

Fig. 9 is a schematic diagram of a mask according to an embodiment of the present invention.

Fig. 10 is a schematic view of a process of manufacturing a mask metal film by rolling according to an embodiment of the present invention.

Fig. 11 is a schematic view of a process of manufacturing a mask metal film by electroforming according to another embodiment of the present invention.

Fig. 12 is a schematic side sectional view of an attaching process of a frame based on a difference in thermal expansion coefficient of a mask.

Fig. 13 to 14 are schematic views illustrating a process of bonding a mask metal film to a stencil according to an embodiment of the present invention.

Fig. 15 to 16 are schematic views of a process of manufacturing a mask supporting template by forming a mask by bonding a mask metal film on the template according to an embodiment of the present invention.

Fig. 17 is an enlarged cross-sectional view of a temporary bonding portion according to an embodiment of the present invention.

Fig. 18 is a schematic view of a process of loading a mask support template onto a frame according to an embodiment of the present invention.

Fig. 19 is a schematic view of a state in which a template is loaded on a frame and a mask is corresponded to a unit area of the frame according to an embodiment of the present invention.

Fig. 20 is a schematic diagram of a process of separating a mask from a template after attaching the mask to a frame according to an embodiment of the present invention.

Fig. 21 is a schematic view of a state in which a mask is attached to a cell region of a frame according to an embodiment of the present invention.

Fig. 22 is a schematic view of an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.

Reference numerals:

manufacturing apparatus 41 of mask metal film supporting template: body

42: upper block 45: lower block

46: stretching means 50: stencil (template)

51: laser through hole 55: temporary bonding part

70: lower support 100: mask and method for manufacturing the same

110 mask film, mask metal film 200: frame structure

210: the edge frame portion 220: mask unit sheet part

221: edge sheet portion 223: first grid sheet part

225: second grid sheet portion 1000: OLED pixel deposition device

C: cell, mask cell CM: chemical treatment

CR: mask cell region DM: dummy part and mask dummy part

EP: heating L: laser

R: hollow region P of edge frame portion: mask pattern

US: applying ultrasonic waves UV: application of ultraviolet light

W: and WB welding: welding bead

WP: weld part

Detailed Description

The following detailed description of the invention refers to the accompanying drawings, which illustrate specific embodiments by way of example, in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It is to be understood that the various embodiments of the invention, although different from one another, are not necessarily mutually exclusive. For example, particular shapes, structures and characteristics described herein may be associated with one embodiment and may be implemented in other embodiments without departing from the spirit and scope of the present invention. It is to be understood that the location or arrangement of individual elements within each disclosed embodiment may be modified without departing from the spirit and scope of the invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims, along with the full scope of equivalents to which such claims are entitled, as appropriately interpreted. Like reference numerals in the drawings denote the same or similar functions in many respects, and the length, area, thickness, and shape thereof may be exaggerated for convenience.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily practice the invention.

Fig. 1 is a schematic diagram of a prior art OLED pixel deposition mask 10.

Referring to fig. 1, a conventional mask 10 may be manufactured in a stripe Type (Stick-Type) or a Plate Type (Plate-Type). The mask 10 shown in fig. 1 (a) is used as a stripe mask, and both sides of a stripe may be solder-fixed to an OLED pixel deposition frame. The mask 100 shown in fig. 1 (b) is used as a plate mask in a large-area pixel formation process.

The mask 10 includes a plurality of display cells C in its main Body (Body, or mask film 11). One cell C corresponds to one display (display) of a smartphone or the like. The cell C has a pixel pattern P formed therein so as to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, B are displayed. As an example, a pixel pattern P is formed in the cell C so as to have 70 × 140 resolution. That is, a large number of pixel patterns P are grouped to constitute one cell C, and a plurality of cells C may be formed on the mask 10.

Fig. 2 is a schematic view of a conventional process of attaching the mask 10 to the frame 20. Fig. 3 is a schematic diagram of alignment errors between cells occurring during a conventional process of stretching the F1-F2 mask 10. Next, a description will be given of a bar mask 10 having 6 cells C (C1 to C6) shown in fig. 1 a as an example.

Referring to fig. 2 (a), first, the stripe mask 10 should be spread flat. Stretching forces F1 to F2 are applied along the longitudinal direction of the strip mask 10, and the strip mask 10 is stretched. In this state, the strip masks 10 are loaded on the frame 20 having a square frame shape. The cells C1-C6 of the strip mask 10 will be located in the blank area portions inside the frame 20. The size of the frame 20 may be sufficient to allow the cells C1-C6 of one bar mask 10 to be located in a blank area inside the frame, or may be sufficient to allow the cells C1-C6 of a plurality of bar masks 10 to be located in a blank area inside the frame.

Referring to fig. 2 (b), the tensile forces F1 to F2 applied to the respective sides of the strip mask 10 are finely adjusted while being aligned, and then the strip mask 10 and the frame 20 are coupled to each other as parts of the side surfaces of the W strip mask 10 are welded. Fig. 2 (c) shows a side cross-section of the bar mask 10 and the frame connected to each other.

Referring to fig. 3, although the tensile forces F1 to F2 applied to the sides of the strip mask 10 are finely adjusted, a problem of poor alignment of the mask units C1 to C3 with respect to each other is shown. For example, the distances D1 to D1 ″ and D2 to D2 ″ between the patterns P of the cells C1 to C3 are different from each other, or the patterns P are skewed. The stripe mask 10 has a large area including a plurality of (for example, 6) cells C1 to C6 and a very thin thickness of several tens of μm, and therefore is liable to sag or twist due to a load. It is very difficult to adjust the tensile forces F1 to F2 so that all of the cells C1 to C6 are flattened and to confirm the alignment state of the cells C1 to C6 in real time by a microscope.

Therefore, a slight error in the tensile forces F1 to F2 may cause an error in the degree of stretching or spreading of the cells C1 to C3 of the strip mask 10, thereby causing differences in the distances D1 to D1 ″ and D2 to D2 ″ between the mask patterns P. Although it is very difficult to perfectly align to make the error 0, it is preferable that the alignment error is not more than 3 μm in order to avoid bad influence of the mask pattern P having a size of several μm to several tens μm on the pixel process of the ultra high definition OLED. The alignment error between such adjacent cells is referred to as Pixel Position Accuracy (PPA).

In addition, it is very difficult to precisely align the plurality of bar masks 10 and the plurality of cells C-C6 of the bar masks 10 while respectively connecting about 6 to 20 bar masks 10 to one frame 20, and it is only possible to increase the process time by alignment, which is an important reason for lowering productivity.

On the other hand, after the bar masks 10 are fixedly attached to the frame 20, the tensile forces F1 to F2 applied to the bar masks 10 act in opposite directions on the frame 20. That is, after the bar masks 10 stretched by the tensile forces F1 to F2 are connected to the frame 20, tension (tension) can be applied to the frame 20. Normally, the tension is not so large as to exert a large influence on the frame 20, but in the case where the frame 20 is downsized and becomes low in strength, the frame 20 may be slightly deformed by such tension. Thus, a problem may occur in that the alignment state between the plurality of cells C to C6 is broken.

In view of this, the present invention provides a frame 200 and a frame-integrated mask, which can form the mask 100 and the frame 200 into an integrated structure. The mask 100 integrated with the frame 200 can prevent deformation such as sagging or twisting, and be accurately aligned with the frame 200. When the mask 100 is attached to the frame 200, no tensile force is applied to the mask 100, and thus no tensile force causing deformation is applied to the mask 200 after the mask 100 is attached to the frame 200. Also, the manufacturing time for integrally connecting the mask 100 to the frame 200 can be significantly shortened, and the yield can be significantly improved.

Fig. 4 is a front view (fig. 4 (a)) and a side sectional view (fig. 4 (b)) of a frame-integrated mask according to an embodiment of the present invention, and fig. 5 is a front view (fig. 5 (a)) and a side sectional view (fig. 5 (b)) of a frame according to an embodiment of the present invention.

Referring to fig. 4 and 5, the frame integrated mask may include a plurality of masks 100 and one frame 200. In other words, the plurality of masks 100 are attached to the frame 200. Hereinafter, for convenience of explanation, the mask 100 having a square shape will be described as an example, but the mask 100 may have a bar mask shape having protrusions for clamping on both sides before being attached to the frame 200, and the protrusions may be removed after being attached to the frame 200.

A plurality of mask patterns P are formed on each mask 100, and one cell C may be formed on one mask 100. One mask unit C may correspond to one display of a smart phone or the like

The mask 100 may have a coefficient of thermal expansion of about 1.0X10^-6Invar (invar) at/° C, coefficient of expansion of about 1.0X10^-7Super invar (super invar) material at/° c. Since the Mask 100 made of this material has a very low thermal expansion coefficient, there is little concern that the pattern of the Mask may be deformed by thermal energy, and thus, the Mask can be used as an fmm (fine Metal Mask) or a Shadow Mask (Shadow Mask) in the manufacture of a high-resolution OLED. In addition to this, in consideration of recently developed techniques for performing the pixel deposition process in a range where the temperature variation value is not large, the mask 100 may also be a material such as nickel (Ni), nickel-cobalt (Ni-Co), or the like, having a thermal expansion coefficient slightly larger than that. The mask 100 may use a sheet metal (sheet) generated by a rolling process or electroforming. Details will be described later by fig. 9 and 10.

The frame 200 is formed in a form of attaching a plurality of masks 100. The frame 200, including the outermost peripheral edge, may include a plurality of corners formed along a first direction (e.g., a lateral direction), a second direction (e.g., a vertical direction). Such a plurality of corners may divide an area for attaching the mask 100 on the frame 200.

The frame 200 may include an edge frame portion 210 that is generally square, box-shaped. The inside of the edge frame part 210 may be a hollow shape. That is, the edge frame portion 210 may include a hollow region R. The frame 200 may be formed of a metal material such as invar, super invar, aluminum, titanium, etc., and is preferably formed of a material such as invar, super invar, nickel-cobalt, etc., which has the same thermal expansion coefficient as the mask, in consideration of thermal deformation, and these materials are all applicable to the edge frame portion 210 and the mask unit sheet portion 220, which are all constituent elements of the frame 200.

In addition, the frame 200 is provided with a plurality of mask unit regions CR, and may include a mask unit piece part 220 connected to the edge frame part 210. The mask unit sheet part 220 may be formed by rolling as in the mask 100, or may be formed by using another film forming process such as electroforming. The mask unit sheet portion 220 may be connected to the edge frame portion 210 by forming a plurality of mask unit regions CR on a planar sheet (sheet) by laser scribing, etching, or the like. Alternatively, the mask unit sheet portion 220 may be formed by laser scribing, etching, or the like after a planar sheet is connected to the edge frame portion 210. In this specification, a case where the mask unit sheet portion 220 is first formed with a plurality of mask unit regions CR and then connected to the edge frame portion 210 will be mainly described.

The mask unit sheet portion 220 may include an edge sheet portion 221 and at least one of a first grid sheet portion 223 and a second grid sheet portion 225. The edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225 are portions divided on the same sheet, and are integrated with each other.

The edge sheet portion 221 may be substantially connected to the edge frame portion 210. Therefore, the edge sheet portion 221 may have a substantially rectangular, square box shape corresponding to the edge frame portion 210.

In addition, the first grid sheet part 223 may be formed to extend along the first direction (lateral direction). The first grid sheet portion 223 is formed in a straight line shape, and both ends thereof may be connected to the edge sheet portion 221. When the mask unit sheet portion 220 includes a plurality of first grid sheet portions 223, each of the first grid sheet portions 223 preferably has the same pitch.

In addition, further, the second grid sheet part 225 may be formed to extend in the second direction (vertical direction). The second grid sheet portion 225 is formed in a straight line shape, and both ends thereof may be connected to the edge sheet portion 221. The first and second

grid sheet portions

223, 225 may cross each other perpendicularly. When the mask unit sheet portion 220 includes a plurality of second grid sheet portions 225, each of the second grid sheet portions 225 preferably has the same pitch.

On the other hand, the pitch between the first grid sheet portions 223 and the pitch between the second grid sheet portions 225 may be the same or different depending on the size of the mask unit C.

The first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, but the shape of a cross section perpendicular to the longitudinal direction may be, for example, a rectangle, a quadrangle such as a trapezoid, a triangle, or the like, and the sides and corners may be partially rounded. The cross-sectional shape may be adjusted during laser scribing, etching, etc.

The thickness of the edge frame portion 210 may be greater than the thickness of the mask die sheet portion 220. Since the edge frame portion 210 takes charge of the overall rigidity of the frame 200, it may be formed in a thickness of several mm to several tens cm.

In the mask unit sheet part 220, a process of manufacturing a thick sheet is difficult in practice, and if it is too thick, there is a possibility that the organic matter source 600 (refer to fig. 22) may be clogged through the mask 100 in the OLED pixel deposition process

In the planar sheet, a plurality of mask unit regions CR (CR11 to CR56) may be provided in addition to the regions occupied by the edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225. From another perspective, the mask unit region CR may refer to a blank region except for regions occupied by the edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225 in the hollow region R of the edge frame portion 210.

As the cells C of the mask 100 correspond to the mask cell regions CR, they may be actually used as channels for depositing pixels of the OLED through the mask pattern P. As described above, one mask unit C corresponds to one display of a smartphone or the like. A mask pattern P for constituting one cell C may be formed in one mask 100. Alternatively, one mask 100 may have a plurality of cells C and each cell C may correspond to each cell region CR of the frame 200, but in order to precisely align the mask 100, it is necessary to avoid a large-area mask 100, and a small-area mask 100 having one cell C is preferable. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell region CR of the mask 200. At this time, in order to precisely align, it may be considered that the mask 100 having 2-3 cells C corresponds to one cell region CR of the mask 200.

The mask 200 includes a plurality of mask cell regions CR, and each mask 100 may be attached so that each mask cell C corresponds to each mask cell region CR. Each mask 100 may include a mask cell C in which a plurality of mask patterns P are formed, and a dummy portion (corresponding to a portion of the mask film 110 other than the cell C) around the mask cell C. The dummy portion may include only the mask film 110, or may include the mask film 110 on which a predetermined dummy pattern having a similar form to the mask pattern P is formed. The mask unit C corresponds to the mask unit region CR of the frame 200, and a part or the whole of the dummy portion may be attached to the frame 200 (the mask unit sheet portion 220). Thus, the mask 100 and the frame 200 may form an integrated structure.

On the other hand, according to another embodiment, the frame is not manufactured in such a manner that the mask unit sheet portions 220 are attached to the edge frame portion 210, but a frame in which a grid frame (corresponding to the grid sheet portions 223, 225) integrated with the edge frame portion 210 is directly formed at the hollow region R portion of the edge frame portion 210 may be used. The frame of this form also includes at least one mask unit region CR, and the mask 100 may be made to correspond to the mask unit region CR to manufacture a frame-integrated mask.

Hereinafter, a process of manufacturing the frame-integrated mask will be described.

First, the frame 200 described in fig. 4 and 5 may be provided. Fig. 6 is a schematic view of a manufacturing process of the frame 200 according to an embodiment of the present invention.

Referring to fig. 6 (a), an edge frame portion 210 is provided. The edge frame portion 210 may be a box shape including a hollow region R.

Next, referring to fig. 6 (b), the mask unit sheet portion 220 is manufactured. The mask unit sheet portion 220 can be manufactured by manufacturing a planar sheet by rolling, electroforming, or another film forming process, and then removing the mask unit region CR by laser scribing, etching, or the like. In this specification, the formation of 6 × 5 mask cell regions CR (CR11 to CR56) will be described as an example. There may be 5 first

grid sheet portions

223 and 4 second grid sheet portions 225.

Then, the mask die section 220 may correspond to the edge frame section 210. In the corresponding process, the edge sheet portion 221 may be made to correspond to the edge frame portion 210 in a state where all side portions of the mask unit sheet portions 220 of F1 to F4 are stretched to make the mask unit sheet portions 220 spread flat. The mask die sheet portion 220 can be stretched by sandwiching it at a plurality of points (1 to 3 points as an example of fig. 6 (b)) on one side. On the other hand, the F1 and F2 mask die section 220 may be stretched in a part of the side direction instead of all the sides.

Then, when the mask unit sheet portions 220 are made to correspond to the edge frame portions 210, the edge sheet portions 221 of the mask unit sheet portions 220 may be attached by welding W. Preferably, all side portions of W are welded so that the mask die section 220 is firmly attached to the edge frame section 210, but is not limited thereto. The welding W should be performed close to the corner side of the frame portion 210 as much as possible to minimize the tilting space between the edge frame portion 210 and the mask unit sheet portion 220 and improve the adhesion. The welding W portion may be generated in a line (line) or spot (spot) shape, have the same material as the mask unit sheet portion 220, and may become a medium for integrally connecting the edge frame portion 210 and the mask unit sheet portion 220.

Fig. 7 is a schematic view of a manufacturing process of a frame according to another embodiment of the present invention. The embodiment of fig. 6 first manufactures the mask unit sheet portions 220 having the mask unit regions CR and then attaches to the edge frame portions 210, while the embodiment of fig. 7 attaches a planar sheet to the edge frame portions 210 and then forms the mask unit region CR portions.

First, the edge frame portion 210 including the hollow region R is provided as in fig. 6 (a).

Then, referring to fig. 7 (a), a planar sheet (a planar mask unit sheet portion 220') may be made to correspond to the edge frame portion 210. The mask unit sheet portion 220' is in a planar state in which the mask unit region CR is not yet formed. In the corresponding process, the mask unit sheet portion 220 'may be made to correspond to the edge frame portion 210 in a state where all side portions of the mask unit sheet portions 220' are stretched in a flat state from F1 to F4. The unit sheet portion 220' can be sandwiched and stretched at a plurality of points (1 to 3 points as an example of fig. 7 (a)) on one side. On the other hand, the F1, F2 mask unit sheet portions 220' may be stretched in the direction of some of the side portions, not all of the side portions.

Then, when the mask unit sheet portion 220 'is made to correspond to the edge frame portion 210, the edge portion of the mask unit sheet portion 220' may be attached by welding W. Preferably, all side portions of W are welded so that the mask unit sheet portion 220' is firmly attached to the edge frame portion 220, but is not limited thereto. The welding W should be performed close to the corner side of the edge frame portion 210 to the maximum extent so as to minimize the turn-up space between the edge frame portion 210 and the mask unit sheet portion 220' and improve the adhesion. The welding W portion may be generated in a line (line) or spot (spot) shape, have the same material as the mask unit sheet portion 220 ', and may become a medium for integrally connecting the edge frame portion 210 and the mask unit sheet portion 220'.

Referring to fig. 7 (b), a mask unit region CR is formed in a planar sheet (a planar mask unit sheet portion 220'). The sheet of the mask unit region CR portion is removed by laser scribing, etching, or the like, thereby forming the mask unit region CR. In this specification, the formation of 6 × 5 mask cell regions CR (CR11 to CR56) will be described as an example. When the mask unit region CR is formed, the mask unit sheet portion 220 may be configured in which a portion to which W is welded to the edge frame portion 210 becomes an

edge sheet portion

221, and 5 first

grid sheet portions

223 and 4 second grid sheet portions 225 are provided.

In order to realize a high-resolution OLED, the size of the pattern is gradually reduced, and the thickness of the mask metal film used therefor is also required to be thin. As shown in fig. 8 (a), if it is desired to realize the OLED pixel 6 of high resolution, it is necessary to reduce the pixel interval and the pixel size and the like (PD- > PD ') in the mask 10'. Furthermore, in order to prevent the OLED pixels 6 from being deposited unevenly due to the shadow effect, it is necessary to form 14 the pattern of the mask 10' obliquely. However, in the process of forming 14 the pattern obliquely in the thick mask 10 'having the thickness T1 of about 30 to 50 μm, since it is difficult to form the pattern 13 matching thereto in the fine pixel interval PD' and the pixel size, it becomes a factor of causing a reduction in yield in the process. In other words, in order to have a fine pixel pitch PD 'and form the pattern 14 obliquely, it is necessary to use a mask 10' having a small thickness.

In particular, in order to realize a high resolution of UHD level, as shown in (b) of fig. 8, fine patterning can be performed only by using a thin mask 10' having a thickness T2 of 20 μm or less. In addition, to achieve ultra high resolution above UHD, it is contemplated to use a thin mask 10' having a thickness T2 of 10 μm.

Fig. 9 is a schematic diagram of a mask 100 according to an embodiment of the present invention.

The mask 100 may include a mask cell C formed with a plurality of mask patterns P and a dummy portion DM around the mask cell C. As described above, the mask 100 may be manufactured using a metal sheet produced by a rolling process, electroforming, or the like, with one cell C formed in the mask 100. The dummy portion DM corresponds to a portion of the mask film 110[ mask metal film 110] other than the cell C, and may include only the mask film 110, or include the mask film 110 formed with a predetermined dummy portion pattern similar to the shape of the mask pattern P. The dummy portion DM corresponds to an edge of the mask 100 and a part or the whole of the dummy portion DM may be attached to the frame 200[ the mask die section 220 ].

The width of the mask pattern P may be less than 40 μm, and the thickness of the mask 100 may be about 5-20 μm. Since the frame 200 has a plurality of mask cell regions CR (CR11 to CR56), it is also possible to have a plurality of masks 100, the masks 100 having mask cells C (C11 to C56) corresponding to each mask cell region CR (CR11 to CR 56).

The one surface 101 of the mask 100 is preferably a flat surface since it is a surface that contacts and adheres to the frame 200. One side 101 may be planarized and mirrored using a planarization process described later. The other side 102 of the mask 100 may face a side of the template 50 described later.

A series of processes for manufacturing the mask 100 by manufacturing the mask metal film 110' and supporting it on the template 50, and manufacturing the frame-integrated mask by loading the template 50 supporting the mask 100 on the frame 200 and attaching the mask 100 to the frame 200 will be described below.

Fig. 10 is a schematic view of a process of manufacturing a mask metal film by rolling according to an embodiment of the present invention. Fig. 11 is a schematic view of a process of manufacturing a mask metal film by electroforming according to another embodiment of the present invention.

First, the mask metal film 110 may be prepared. As an example, the mask metal film 110 may be prepared by rolling.

Referring to fig. 10 (a), the metal sheet generated by the rolling process may be used as the mask metal film 110'. The metal sheet manufactured by the rolling process may have a thickness of several tens to several hundreds of μm based on the manufacturing process. As shown in fig. 8, fine patterning can be performed only by using a thin mask metal film 110 having a thickness of 20 μm or less in order to obtain high resolution of UHD level, and it is necessary to use a thin mask metal film 110 having a thickness of 10 μm in order to obtain ultra high resolution of UHD or more. However, the mask metal film 110' generated by the rolling process has a thickness of about 25 to 500 μm, and thus it is necessary to reduce the thickness.

Accordingly, a process of planarizing one side of the PS mask metal film 110' may be further performed. Here, the flattening PS is to mirror one surface (upper surface) of the mask metal film 110 'and partially remove the upper portion of the mask metal film 110' to reduce the thickness. The planarization PS may be performed using a CMP (chemical Mechanical polishing) method, and a known CMP method may be used without limitation. In addition, the thickness of the mask metal film 110' may be thinned using a chemical wet etching (chemical wet etching) or dry etching (dry etching) method. In addition to this, a process of planarization that thins the thickness of the mask metal film 110' may be used without limitation.

In the process of performing the planarization PS, the surface roughness Ra of the upper surface of the mask metal film 110' can be controlled in the CMP process, as an example. Preferably, a mirror surface for further reducing the surface roughness may be performed. Alternatively, as another example, the planarization PS may be performed by a chemical wet etching or dry etching process, and then an additional polishing process such as a CMP process may be performed to reduce the surface roughness Ra.

Thus, the mask metal film 110' can be made thin to a thickness of about 50 μm or less. Therefore, the thickness of the mask metal film 110 is preferably about 2 μm to 50 μm, and more preferably about 5 μm to 20 μm. But is not necessarily limited thereto.

Referring to fig. 10 (b), as in fig. 10 (a), the mask metal film 110 may be manufactured by reducing the thickness of the mask metal film 110' manufactured by the rolling process. Only, the mask metal film 110' is bonded on the template 50 described later in a state of sandwiching the temporary bonding portion 55, and the planarization PS process is performed in this state, so that the thickness can be reduced.

As another example, the mask metal film 110 may be prepared by electroforming.

Referring to fig. 11 (a), a conductive base material 21 is prepared. In order to be able to perform electroforming (electroforming), the substrate 21 of the master may be a conductive material. The master plate can be used as a cathode (cathode) electrode in electroforming.

As the conductive material, metal oxide may be formed on the surface of metal, impurities may be doped during the production of metal, inclusions or Grain boundaries (Grain Boundary) may be present in the polycrystalline silicon base material, and the conductive polymer base material may have a high possibility of containing impurities, and is relatively weak in strength, acid resistance, and the like. Elements such as metal oxides, impurities, inclusions, grain boundaries, etc., which prevent the electromagnetic field from being uniformly formed on the surface of the mother substrate (or cathode) are called "defects" (defects). Since a uniform electromagnetic field cannot be introduced to the cathode of the above-mentioned material due to the Defect (Defect), the plated film 110[ or the mask metal film 110] can be locally formed unevenly.

In the process of realizing a pixel of ultra high definition of UHD level or higher, unevenness of the plating film and the plating film pattern [ mask pattern P ] adversely affects formation of the pixel. For example, the current QHD image quality is 500-600PPI (pixel) and the pixel size reaches about 30-50 μm, while the 4KUHD and 8KUHD high definition have higher resolution of 860PPI and 1600 PPI. The micro-display directly applied to the VR machine or the micro-display inserted into the VR machine is targeted at ultra-high picture quality of about 2000PPI or above, and the pixel size reaches about 5-10 μm. Since the pattern width of the FMM or shadow mask used herein may be several μm to several tens μm, and preferably less than 30 μm, even a defect of several μm has a large weight in the pattern size of the mask. In addition, in order to remove the defects in the cathode of the above materials, an additional process for removing metal oxide, impurities, etc. may be performed, in which other defects such as the cathode material being etched, etc. are also induced.

Thus, the present invention may use a master (or cathode) of single crystal material. In particular, a single crystal silicon material is preferable. To be conductive, a mother substrate of single crystal silicon material may be doped to a high concentration above 1019/cm 3. The doping may be performed on all of the motherboard or only on a portion of the surface of the motherboard.

Further, as the single crystal material, metals such as Ti, Cu, and Ag, semiconductors such as GaN, SiC, GaAs, GaP, AlN, InN, InP, and Ge, carbon-based materials such as graphite (graphite) and graphene (graphene), including CH, can be used₃NH₃PbCl₃、CH₃NH₃PbBr₃、CH₃NH₃PbI₃、SrTiO₃And single crystal ceramics for superconductors such as perovskite (perovskite) structures, and single crystal superalloys for aircraft parts. The metal or carbon-based material is basically a conductive material. For semiconductor materials, 10 can be done to have conductivity¹⁹/cm³So as to have a high concentration of doping. For other materials, conductivity can be formed by doping or forming oxygen vacancies (oxygen vacancies) or the like. The doping may be performed on all of the motherboard or only on a portion of the surface of the motherboard.

Since the single crystal material has no defect, there is an advantage that the plating film 110 can be formed uniformly by forming the electromagnetic field uniformly over the entire surface at the time of electroforming. The frame-integrated

mask

100, 200 manufactured by uniform plating can further improve the image quality level of the OLED pixel. In addition, because an additional process for removing and removing the defects is not required, the method has the advantages of reducing the process cost and improving the production efficiency.

Referring back to fig. 11 (a), the plating film 110[ or the mask metal film 110] can be formed on the conductive substrate 21 by electroforming by using the conductive substrate 21 as a master (Cathode Body) and disposing an anode (not shown) at a distance. The plated film 110 may be formed on the exposed upper and side surfaces of the conductive substrate 21 facing the anode and on which the electromagnetic field can act. The plating film 110 may be formed on a part of the lower surface of the conductive substrate 21 in addition to the side surface of the conductive substrate 21.

Then, an edge portion of the plating film 110 is cut off by a laser D, or a portion of the plating film 110 exposed after forming a photoresist layer only on the upper portion of the plating film 110 is etched and removed D. Thereby, as shown in fig. 11 (b), the plating film 110 can be separated from the conductive base material 21.

Further, before the plated film 110 is separated from the conductive base material 21, heat treatment H may be performed. The present invention is characterized in that the heat treatment H is performed before the plated film 110 is separated from the conductive base material 21[ or the master or the cathode ] in order to reduce the thermal expansion coefficient of the mask 100 and to prevent the mask 100 and the mask pattern P from being deformed by heat. The heat treatment may be performed at a temperature of 300 ℃ to 800 ℃.

The coefficient of thermal expansion of invar alloy sheets typically produced by electroforming is higher than that of invar alloy sheets produced by calendering. Therefore, the thermal expansion coefficient can be reduced by heat-treating the invar alloy sheet, but the invar alloy sheet may be peeled, deformed, and the like during the heat treatment. This is caused by heat-treating only the invar alloy thin plate or only the invar alloy thin plate temporarily bonded to the upper surface of the conductive base material 21. However, in the present invention, since the plating film 110 is formed not only on the upper surface but also on part of the side surface and the lower surface of the conductive base material 21, peeling, deformation, and the like do not occur even if the heat treatment H is performed. In other words, since the conductive base material 21 and the plating film 110 are heat-treated in a state of being closely adhered to each other, there is an advantage that peeling, deformation, and the like due to the heat treatment can be prevented and the heat treatment can be stably performed.

The thickness of the mask metal film 110 generated by the electroforming process may be thinner than that of the rolling process. Thus, although the planarization PS process for reducing the thickness may be omitted, it is necessary to control the surface characteristics and thickness by the planarization PS because the mask metal film 110' may have different etching characteristics based on the composition of the surface layer, the crystalline structure/the fine structure.

Fig. 12 is a schematic side sectional view of an attaching process of a frame based on a difference in thermal expansion coefficient of a mask. Fig. 12 (a1) to (a3) illustrate a process of attaching the invar alloy mask 100' generated by the electroforming process on the mask cell sheet part 220[ frame 200], and fig. 12 (b1) to (b3) illustrate a process of attaching the invar alloy mask 100 ″ generated by the rolling process on the mask cell sheet part 220[ frame 200 ]. The process of attaching the mask to the frame with tension applied to the frame by the difference in the coefficients of thermal expansion is illustrated in fig. 12.

The "process area" may refer to a space for placing the constituent elements of the mask 100, the frame 200, etc., and for performing an attaching process of the mask 100, etc. The process region may be a space within the sealed chamber or an open space. In addition, the "first temperature" may refer to a temperature equal to or higher than a temperature of a pixel deposition process when the frame-integrated mask is used in the OLED pixel deposition process. Further, "second temperature" may refer to a temperature lower than the first temperature.

Referring to fig. 12 (a1), the invar mask 100' produced by the electroforming process is placed on the mask unit sheet portion 220. The invar mask 100' produced by the electroforming process has a coefficient of thermal expansion greater than about 3.0X10^-6V. C. Further, the mask unit sheet portion 220 made of invar alloy sheet produced by the rolling process has a coefficient of thermal expansion of about 1.0X10^-6Around/° c.

Then, referring to (a2) of fig. 12, the temperature of the process area may be raised to the first temperature ET. Since the mask unit sheet part 220 has a smaller thermal expansion coefficient than the invar mask 100', a displacement of about L1 occurs after extension/expansion, whereas the invar mask 100' may undergo a displacement of about 3 times L2 as large as L1 (L1< L2). In this state, the invar mask 100' is welded to the mask unit sheet portion 220 and the solder ball WB is formed, so that the connection can be integrally made.

Then, referring to (a3) of fig. 12, the temperature of the process area may be lowered to the second temperature LT. The mask unit sheet part 220 is displaced around L1 and returns to its original size after shrinkage/compression because the thermal expansion coefficient is smaller than that of the invar alloy mask 100', whereas the invar alloy mask 100' may be displaced around L2, which is about 3 times that of L1, and may return to its original size. At this time, the invar alloy mask 100' is shrunk/compressed by a large displacement in a state of being attached to the mask die portion 220 by welding, and thus a tension TS is applied to the surrounding mask die portion 220. The invar mask 100' itself may be attached to the mask die portion 220 in a more taut state based on the applied tension TS.

The case of the invar mask 100 "produced by the rolling process will be described for comparison with the invar mask 100' produced by the electroforming process.

Referring to fig. 12 (b1), the invar alloy mask 100 ″ produced by the rolling process is placed on the mask unit sheet part 220. The invar alloy mask 100 "produced by the rolling process has a coefficient of thermal expansion of about 1.0X10^-6V. C. Further, the mask unit sheet part 220 made of invar alloy sheet produced by the rolling process has a thermal expansion coefficient of about 1.0X10, similar to that of the invar alloy mask 100 ″^-6/℃。

Then, referring to (b2) of fig. 12, the temperature of the process area may be raised to the first temperature ET. The mask unit sheet part 220 undergoes displacement of about L1 after extension/expansion, and since the invar mask 100 ″ has the same thermal expansion coefficient as the mask unit sheet part 220, the same displacement of L2 as that of L1 may occur (L1 — L2). In this state, the invar mask 100 ″ is welded to the mask die portion 220 to form the solder balls WB, thereby being integrally connected.

Then, referring to (b3) of fig. 12, the temperature of the process area may be lowered to the second temperature LT. The mask unit piece portion 220 has the same thermal expansion coefficient as the invar mask 100 ″, and thus can be displaced by the same dimensions L1 and L2 after contraction/compression, respectively, and return to the original dimensions. Since the mask die portion 220 contracts/compresses with the same displacement as the invar alloy mask 100", the invar alloy mask 100" does not apply tension to the surrounding mask die portions 220. Therefore, in the invar mask 100 ″ produced by the rolling process, since no tension is applied to the mask unit sheet portion 220, there is a problem that a tension error of the mask pattern P occurs due to a sagging of a load. Therefore, a scheme of attaching the mask 100 ″ to the mask die portion 220 in a tight state is required.

In addition, as shown in fig. 12, in order to utilize the difference in the thermal expansion coefficient, it is necessary to provide a heating device/cooling device that can heat or cool the process region to the first temperature ET and to the second temperature LT. In order to add these devices to a manufacturing apparatus of a frame-integrated mask, it is necessary to consider interference with other devices, and a problem arises in that cost increases due to the addition of devices. In addition, there is a problem in that an adverse effect of thermal shock to other devices may occur in the process of heating/cooling the process area.

Based on this, the present invention provides a scheme that does not heat or cool the process area, does not directly apply a tensile force to the mask 100 during the process of attaching the mask 100 to the frame 200, and can attach the mask 100 to the frame 200 in a tight manner.

Fig. 13 to 14 are schematic views of a process of bonding the mask metal films 110 and 100' to the stencil 50 according to an embodiment of the present invention.

The mask supporting template according to an embodiment of the present invention is characterized in that the mask 100 is bonded to the template 50 in a state where a lateral tensile force F is applied. Further, the mask metal film supporting template according to an embodiment of the present invention is characterized in that the mask metal films 110 and 100' are bonded to the template 50 in a state where a tensile force F in the lateral direction is applied. If the mask pattern P forming process is ended on the mask metal film supporting template, the mask supporting template may be formed.

Referring to fig. 13, an apparatus 40 for manufacturing a mask metal film supporting template may include a body 41, an upper block 42, a lower block 45, and a stretching means 46.

The body 41 may provide a cavity space for bonding the mask metal films 110, 100' and the stencil 50. The body 41 is connected to a vacuum forming means (not shown) such as an air pump, so that the chamber space can be made into a Vacuum (VAC) environment.

The upper block 42 may be disposed at an upper portion of the cavity space. The upper block 42 is connected to a vertically movable lifting means (not shown) and contacts the lower block 45 when it is at the lower limit. The template 50 may be fixed to the lower portion of the upper block 42.

The template (template)50 is explained in detail below. The stencil 50 is a medium having one surface to which the mask 100 is attached and moves the mask 100 in a state of supporting the mask 100. One side of the stencil 50 is preferably a flat side to support and carry the flat mask 100. The center portion 50a [ refer to fig. 15] may correspond to the mask cell C of the mask metal film 110, and the edge portion 50b may correspond to the dummy portion DM of the mask metal film 110. In order to be able to support the mask metal film 110 as a whole, the area of the stencil 50 is equal to or larger than the area of the mask metal film 110, and may be a flat shape.

The stencil 50 is preferably a transparent material to facilitate visual observation or the like during alignment and attachment of the mask 100 to the frame 200. In addition, when a transparent material is used, the laser light can also be passed through. As the transparent material, glass (glass), silica gel (silica), heat resistant glass, quartz (quartz), alumina (Al) can be used₂O₃) Borosilicate glass (borosilicate glass), zirconia (zirconia), soda-lime glass (soda-lime glass), low-iron glass (low-iron glass), and the like. For example, the template 50 may be formed of borosilicate glass having excellent heat resistance and chemical resistance in consideration of a thermal expansion coefficient with the mask 100Mechanical strength, transparency, etc

33 of a material.

In addition, in order to prevent an air gap (air gap) from being generated between the boundary with the mask metal film 110[ or the mask 100], a surface of the stencil 50 contacting the mask metal film 110 may be a mirror surface. In view of this, the surface roughness Ra of one side of the template 50 may be 100nm or less. In order to realize the template 50 having the surface roughness Ra of 100nm or less, a wafer (wafer) may be used as the template 50. The wafer (wafer) has a surface roughness Ra of about 10nm, is commercially available in many products, and has a widely known surface treatment process, and thus can be used as the template 50. Since the surface roughness Ra of the template 50 is in the order of nm, it can be of a level having no air gap or almost no air gap, so that the solder ball WB is easily generated by laser welding, and alignment errors of the mask pattern P are not affected.

The mask 50 may have a laser through hole 51 formed therein so that the laser light L irradiated from the upper portion of the mask 50 can reach a welding portion WP (a region where welding is performed) of the mask 100. The laser through-holes 51 can be formed in the die plate 50 so as to correspond to the positions and the number of the welding portions WP. Since the plurality of welding portions WP are arranged at predetermined intervals on the edge of the mask 100 or the dummy portion DM, a plurality of laser penetration holes 51 may be formed at predetermined intervals correspondingly. As an example, since a plurality of welding portions WP are arranged at predetermined intervals on both side (left/right side) dummy portions DM of the mask 100, a plurality of laser penetration holes 51 may be formed at predetermined intervals on both sides (left/right side) of the mask 50.

The positions and the number of the laser penetration holes 51 do not necessarily correspond to the positions and the number of the welded portions WP. For example, the laser L may be irradiated to only a part of the laser through-hole 51 to perform welding. In addition, the laser through-hole 51 that does not correspond to the welding portion WP may be used instead of the alignment mark when aligning the mask 100 and the mask 50. If the material of the template 50 is permeable to the laser light L, the laser through-hole 51 may not be formed.

In addition, not only the laser light L but also energy of other forms (referred to as "welding energy") may be used as long as it is in a range where the welding portion WP applied from the upper portion of the mask 50 and reaching the mask 100 is welded. In this case, the laser penetration hole 51 may be referred to as a penetration hole 51.

A temporary bonding portion 55 may be formed on one surface of the template 50. The temporary bonding portion 55 allows the mask 100[ or the mask metal film 110] to be temporarily attached to one surface of the stencil 50 and supported on the stencil 50 before the mask 100 is attached to the frame 200.

The temporary bonding portion 55 may use an adhesive or a bonding sheet (thermal release type) that is separable by heat, an adhesive or a bonding sheet (UV release type) that is separable by irradiation of UV.

For example, liquid wax (liquid wax) may be used for the temporary bonding portion 55. The liquid wax may be the same wax as that used in the polishing step of the semiconductor wafer or the like, and the type thereof is not particularly limited. As the resin component mainly used for controlling the adhesive force, impact resistance, and the like associated with the holding power, the liquid wax may include substances and solvents such as acrylic acid, vinyl acetate, nylon, and various polymers. For example, the temporary bonding portion 55 may be formed of SKYLIQUIDABR-4016 containing Acrylonitrile Butadiene Rubber (ABR) as a resin component and n-propanol as a solvent component. The temporary bonding portion 55 is formed with liquid wax by spin coating.

The temporary bonding portion 55, which is liquid wax, has a decreased viscosity at a temperature higher than 85 ℃ to 100 ℃ and an increased viscosity at a temperature lower than 85 ℃, and a portion thereof may be solidified as a solid, so that the mask metal film 110' may be fixedly bonded to the mask 50.

Fig. 17 is an enlarged cross-sectional view of the temporary bonding portion 55 according to an embodiment of the present invention. As another example, a thermal release tape (thermal release tape) may be used as the temporary adhesive portion 55. A core film (core film)56 such as a PET film is disposed in the middle of the thermal peeling tape, thermal peeling adhesive layers (thermal peeling adhesive)57a, 57b are disposed on both sides of the core film 56, and the outer contour of the

adhesive layers

57a, 57b may be in a form in which peeling films/

release films

58a, 58b are disposed. Wherein the mutual peeling temperatures of the

adhesive layers

57a, 57b disposed on both sides of the core film 56 may be different from each other.

According to an embodiment, in a state where the release films/

release films

58a, 58b are removed, the lower surface [ second adhesive layer 57b ] of the thermal release tape is adhered on the stencil 50, and the upper surface [ first adhesive layer 57a ] of the thermal release tape may be adhered on the mask metal film 110'. Since the first adhesive layer 57a and the second adhesive layer 57b have mutually different peeling temperatures, when the template 50 is separated from the mask 100 in fig. 20 described later, the mask 100 can be separated from the template 50 and the temporary adhesive portion 55 by applying heat for peeling the first adhesive layer 57 a.

Referring again to fig. 13, a lower block 45 is disposed at a lower portion of the cavity space facing the upper block 42. The lower block 45 may be fixed, but may be connected to a vertically movable lifting means (not shown) as in the case of the upper block 42.

The upper portion of the lower block 45 may be fixed with mask metal films 110, 110'. The mask metal film 110' formed by the rolling process or the electroforming process may be used as it is, or the mask metal film 110 having a reduced thickness may be used.

The stretching means 46 on the lower block 45 can apply a stretching force F in the lateral direction by clamping the mask metal films 110, 110'. The stretching means 46 may clamp one or both sides of the mask metal films 110, 110'. The mask metal films 110, 110' can be fixed to the lower block 45 in a state of being longer than their original lengths based on the tensile force F applied by the tensile means 46.

Then, referring to fig. 14 (a), the upper block 42 may be lowered. Alternatively, the upper block 42 and the lower block 45 may be lowered/raised with respect to each other. This makes it possible to bring the mask 50 fixed to the lower portion of the upper block 42 into contact with the mask metal films 110 and 110' fixed to the upper portion of the lower block 45.

The stencil 50 and the mask metal films 110 and 110' may be adhered to each other after being brought into contact with each other through the temporary adhesion portions 55. At this time, in order to prevent air bubbles from flowing between the mask 50 and the mask metal films 110 and 110', the chamber space is preferably maintained in a Vacuum (VAC) atmosphere.

When the temporary bonding portion 55 is made of liquid wax, the template 50 and the mask metal films 110 and 110' can be bonded by pressing the upper block 42 and the lower block 45 while the cavity space is maintained at a temperature of about 85 to 100 ℃. Further, according to an embodiment, baking (baking) is performed at about 120 ℃ for about 60 seconds on the template 50, the solvent of the temporary bonding portion 55 is vaporized, the upper block 42 and the lower block 45 are pressed, and the template 50 and the mask metal films 110, 110' may be bonded.

The template 50 and the mask metal films 110, 110 'can be bonded while maintaining the state where the stretching means 46 applies the lateral stretching force F to the mask metal films 110, 100'.

Since the side surfaces of the mask metal films 110, 110 'require a remaining area for clamping, the area of the mask metal films 110, 110' is larger than that of the stencil 50. After the mask metal films 110 and 110 'are bonded to the stencil 50, portions of the mask metal films 110 and 110' protruding to the outside of the stencil 50 are cut.

Thereby, as shown in fig. 14 (b), a mask metal film supporting template can be manufactured. The mask metal film supporting template to which the template 50 and the mask metal films 110, 110' are bonded can be taken out of the body 41. Since the mask 50 is fixed to the mask metal films 110 and 110 'in a bonded state with the tensile force F applied thereto, the mask metal films 110 and 110' can be fixed to the mask 50 in a bonded state with the tensile force IT thereof maintained even when the clamped state of the tensile means 46 is released. This remaining tensile force IT can be maintained until the mask metal films 110, 110' are separated from the stencil 50.

Fig. 15 to 16 are schematic views of a process of manufacturing a mask supporting template by forming a mask 100 by bonding a mask metal film 110 on a template 50 according to an embodiment of the present invention.

Referring next to fig. 14 with further reference to (a) of fig. 15, when the mask metal film 110 'is adhered on the stencil 50, one side of the mask metal film 110' may be planarized by PS. As illustrated in fig. 10, the mask metal film 110 'manufactured by the rolling process may be reduced in thickness (110' - >110) by the planarization PS process.

Therefore, as shown in (b) of fig. 15, as the thickness of the mask metal film 110 'is reduced (110' - >110), the thickness of the mask metal film 110 may be about 5 μm to 20 μm.

Then, referring to fig. 16 (c), a patterned insulating portion 25 may be formed on the mask metal film 110. The insulating portion 25 may be formed of a photoresist by a printing method or the like.

Next, the mask metal film 110 may be etched. A dry etching method, a wet etching method, or the like may be used without limitation, and as a result of the etching, portions of the mask metal film 110 exposed by the empty spaces 26 between the insulating parts 25 may be etched. The etched portion of the mask metal film 110 constitutes a mask pattern P, so that the mask 100 formed with a plurality of mask patterns P can be manufactured.

Then, referring to fig. 16 (d), the manufacture of the template 50 supporting the mask 100 may be finished by removing the insulating part 25.

Since the frame 200 has a plurality of mask cell regions CR (CR11 to CR56), it is also possible to have a plurality of masks 100, the masks 100 having mask cells C (C11 to C56) corresponding to each mask cell region CR (CR11 to CR 56). Further, there may be a plurality of templates 50 for respectively supporting each of the plurality of masks 100.

Fig. 18 is a schematic view of a process of loading a mask support template on a frame according to an embodiment of the present invention.

Referring to fig. 18, the template 50 may be transferred based on the vacuum chuck 90. The surface of the stencil 50 to which the mask 100 is attached is transferred while being sucked by the vacuum chuck 90. The vacuum chuck 90 may be connected to a moving means (not shown) for moving to x, y, z, and θ axes. The vacuum chuck 90 may be connected to a flip means (not shown) for flipping (flip) by sucking the stencil 50. As shown in fig. 18 (b), the bonding state and the alignment state of the mask 100 are not affected in the process of transferring the template 50 onto the frame 200 after the template 50 is sucked by the vacuum chuck 90 and turned upside down.

Fig. 19 is a schematic view illustrating a state in which the template 50 is loaded on the frame 200 and the mask 100 corresponds to the cell region CR of the frame 200 according to an embodiment of the present invention. Fig. 19 illustrates a manner in which one mask 100 is attached to the cell region CR, and a process may be performed in which a plurality of masks 100 are attached to the frame 200 while corresponding to all the cell regions CR. In this case, there may be a plurality of templates 50 for respectively supporting each of the plurality of masks 100.

Then, referring to fig. 19, the mask 100 may be corresponded to one mask unit region CR of the frame 200. The mask 100 may be corresponded to the mask unit region CR by loading the template 50 on the frame 200 or the mask unit sheet part 220. Whether the mask 100 corresponds to the mask unit region CR or not can be observed through a microscope while controlling the position of the template 50/vacuum chuck 90. Since the template 50 presses the mask 100, the mask 100 can be closely attached to the frame 200.

In addition, the lower support 70 may be further disposed at a lower portion of the frame 200. The lower support 70 has a size that can enter the hollow region R of the frame edge portion 210 and may be flat plate-shaped. In addition, a predetermined supporting groove (not shown) corresponding to the shape of the mask unit piece portion 220 may be formed on the upper surface of the lower supporter 70. In this case, since the edge sheet part 221 and the first and second

grid sheet parts

223 and 225 are inserted into the supporting grooves, the mask unit sheet part 220 is more firmly fixed.

The lower support 70 may press the opposite side of the mask unit region CR to which the mask 100 contacts. That is, the lower supporter 70 may prevent the mask unit sheet portion 220 from sagging in the lower direction during the attachment of the mask 100 by supporting the mask unit sheet portion 220 in the upper direction. Meanwhile, since the lower supporter 70 and the stencil 50 press the edge of the mask 100 and the frame 200 (or the mask unit sheet portions 220) in opposite directions to each other, the alignment state of the mask 100 can be maintained without being disturbed.

In this manner, the process of corresponding the mask 100 to the mask unit region CR of the frame 200, in which no tensile force is applied to the mask 100, can be finished only by attaching the mask 100 to the stencil 50 and loading the stencil 50 onto the frame 200.

Next, the mask 100 is attached to the frame 200 by irradiating the mask 100 with the laser light L based on the laser welding. A bead WB is generated on a welding portion WP portion of the mask by laser welding, and the bead WB may have the same material as the mask 100/frame 200 and be integrally connected thereto.

Referring to fig. 20, after the mask 100 is attached to the frame 200, the mask 100 may be separated (bonding) from the template 50. The separation of the mask 100 from the template 50 may be performed by at least any one of heating ET, chemical treatment CM, application of ultrasonic waves US, and application of UVUV to the temporary bonding portion 55. Since the mask 100 is maintained in the state of being attached to the frame 200, only the mask 50 can be lifted. For example, if heat ET at a temperature higher than 85 to 100 ℃ is applied, the adhesiveness of the temporary adhesive portion 55 is reduced, the adhesive force between the mask 100 and the template 50 is reduced, and the mask 100 and the template 50 can be separated. As another example, the mask 100 and the template 50 may be separated by immersing the temporary bonding portion 55 in a chemical substance such as IPA, acetone, or ethanol so as to dissolve or remove the temporary bonding portion 55. As another example, the mask 100 and the template 50 may be separated by weakening the adhesion between the mask 100 and the template 50 by applying the ultrasonic wave US or the ultraviolet light UV.

Further, the temporary bonding part 55, which is an intermediary of the bonding mask 100 and the template 50, is a TBDB bonding material (bonding) so that various separation (bonding) methods can be used.

As an example, a Solvent partitioning (Solvent partitioning) method based on chemically treated CM may be used. The temporary bonding portion 55 may be dissolved and separated based on penetration of a solvent (solvent). At this time, the mask 100 has the pattern P formed thereon, so that the solvent may permeate through the mask pattern P and the boundary between the mask 100 and the template 50. The solvent separation can be performed at normal temperature (roomtemperature), and has an advantage of being relatively inexpensive compared to other separation methods since an additional complicated separation apparatus is not required.

As another example, a Heat separation (Heat Debonding) method based on heating ET may be used. By inducing the decomposition of the temporary bonding portion 55 by the heat of high temperature, if the bonding force between the mask 100 and the template 50 is weakened, the separation can be performed in the vertical direction or the horizontal direction.

As another example, a release adhesive releasing (peelabeadhesive releasing) method based on heating ET, applying UVUV, or the like may be used. When the temporary bonding portion 55 is a thermal release tape, the separation can be performed by a release adhesive separation method which does not require high-temperature heat treatment such as a thermal separation method and does not require an additional expensive heat treatment apparatus, and has an advantage that the performing process is relatively simple.

As another example, a Room Temperature separation (Room Temperature separation) method based on chemical treatment CM, application of ultrasonic waves US, application of ultraviolet rays UV, or the like may be used. If the non-stick process is performed on a part (central portion) of the mask 100 or the template 50, only the edge portion is adhered by using the temporary adhesion portion 55. Further, the solvent penetrates to the edge portion at the time of separation to dissolve the temporary bonding portion 55, thereby achieving separation. This method has advantages that direct loss of the remaining portions other than the edge regions of the mask 100 and the template 50 during the bonding and separation process or defects due to residues of the bonding material (residue) do not occur at the time of separation. In addition, unlike the thermal separation method, since a high-temperature thermal treatment process is not required in the separation, there is an advantage that the process cost can be relatively reduced.

Referring again to fig. 20 (b), if the template 50 is separated from the mask 100, the state of the mask 100 attached to the frame 200 (mask unit sheet part (220)) can be reduced by a predetermined amount. As shown in fig. 14 (b), if the mask 50 is separated while the mask metal films 110 and 110 'maintain their own tensile force IT, the mask metal films 110 and 110' shrink while returning to their original dimensions. Thus, the mask 100 can be attached in a taut state by applying a tension TS to the frame 200[ the mask unit sheet portion (220) ].

Fig. 21 is a schematic view of a state in which the mask 100 is attached to the frame 200 according to an embodiment of the present invention. A state in which all the masks 100 are attached to the cell regions CR of the frame 200 is illustrated in fig. 21. The templates 50 may be separated after the masks 100 are attached one by one, or all the templates 50 may be separated after all the masks 100 are attached.

The present invention can terminate the process of corresponding the mask 100 to the mask cell region CR of the frame 200 without applying any tensile force to the mask 100 by simply attaching the mask 100 to the stencil 50 and loading the stencil 50 onto the frame 200. Accordingly, it is possible to prevent the frame 200[ or the mask unit piece portion 220] from being deformed by the tensile force applied to the mask 100 acting on the frame 200 in turn in the form of tension (tension).

The conventional mask 10 of FIG. 1 includes 6 cells C1-C6 and thus has a longer length, whereas the mask 100 of the present invention includes one cell C and thus has a shorter length, and thus the degree of PPA (pixel position access) twist is reduced. Assuming that the length of the mask 10 including the plurality of cells C1 to C6 … is 1m and a PPA error of 10 μm occurs in the total length of 1m, the mask 100 of the present invention can change the above error range to 1/n as the relative length decreases (corresponding to the decrease in the number of cells C). For example, the mask 100 of the present invention has a length reduced from 1m of the conventional mask 10 to 1/10 when the length is 100mm, so that a PPA error of 1 μm occurs in a total length of 100mm, and an alignment error is significantly reduced.

On the other hand, the mask 100 includes a plurality of cells C, and if the alignment error is minimized even if the cells C are associated with the cell regions CR of the frame 200, the mask 100 may be associated with the mask cell regions CR of the frame 200. Alternatively, the mask 100 having a plurality of cells C may correspond to one mask cell region CR. In this case, the mask 100 is preferably provided with as few cells C as possible in consideration of alignment-based process time and productivity.

In the present invention, since it is only necessary to match one cell C of the mask 100 and confirm the alignment state, the manufacturing time can be significantly reduced compared to the conventional method in which a plurality of cells C (C1 to C6) are simultaneously matched and all the alignment states need to be confirmed.

That is, the method of manufacturing the frame-integrated mask of the present invention can significantly reduce time by corresponding the cells C11 to C16 included in the 6 masks 100 to one cell regions CR11 to CR16, respectively, and by confirming 6 processes of the respective alignment states, as compared with the conventional method of matching the 6 cells C1 to C6 at the same time and confirming the alignment states of the 6 cells C1 to C6 at the same time.

In the method for manufacturing a frame-integrated mask of the present invention, the yield of products in 30 processes in which 30 masks 100 are aligned in correspondence with 30 cell regions CR (CR11 to CR56), respectively, can be significantly higher than the yield of existing products in 5 processes in which 5 masks 10 (see fig. 2 (a)) each including 6 cells C1 to C6 are aligned in correspondence with a frame 20. The existing method of aligning 6 cells C1-C6 in an area corresponding to 6 cells C at a time is a significantly cumbersome and difficult work, and the product yield is low.

If the template 50 is separated from the masks 100 after each mask 100 is attached to the corresponding mask cell region CR, since the plurality of masks 100 apply tensions TS contracting in opposite directions, which are offset from each other, no deformation occurs in the mask cell sheet portions 220. For example, in the first grid sheet portion 223 between the mask 100 attached to the CR11 cell region and the mask 100 attached to the CR12 cell region, the tension TS acting in the rightward direction of the mask 100 attached to the CR11 cell region and the tension TS acting in the leftward direction of the mask 100 attached to the CR12 cell region may cancel each other. Accordingly, there is an advantage in that an alignment error of the mask 100 or the mask pattern P can be minimized by minimizing deformation of the frame 200 or the mask die portion 220 due to the tension TS.

Fig. 22 is a schematic diagram of an OLED pixel deposition apparatus 1000 using a frame-integrated

mask

100, 200 according to an embodiment of the present invention.

Referring to fig. 22, the OLED pixel deposition apparatus 1000 includes: a magnetic plate 300 which accommodates the magnet 310 and in which the cooling water pipe 350 is arranged; and a deposition source supplier 500 for supplying the organic material 600 from a lower portion of the magnetic plate 300.

A target substrate 900 such as glass for depositing the organic source 600 may be inserted between the magnetic plate 300 and the deposition source deposition part 500. The frame-integrated masks 100 and 200 (or FMM) for depositing the organic material source 600 in different pixels may be disposed on the target substrate 900 in close contact or close proximity. The magnet 310 may generate a magnetic field and be attached to the target substrate 900 by the magnetic field.

The deposition source supply part 500 may supply the organic material source 600 while reciprocating the left and right paths, and the organic material source 600 supplied from the deposition source supply part 500 may be attached to one side of the target substrate 900 by the pattern P formed on the frame-integrated

masks

100 and 200. The organic source 600 deposited after passing through the pattern P of the frame-integrated

mask

100, 200 can be used as the pixel 700 of the OLED.

In order to prevent the uneven deposition of the pixels 700 occurring due to the Shadow Effect, the pattern of the frame-integrated

mask

100, 200 may be formed S obliquely (or formed in a tapered shape S). The organic source 600 passing through the pattern in the diagonal direction along the inclined surface may also contribute to the formation of the pixel 700, and thus, the pixel 700 can be deposited with uniform thickness as a whole.

The mask 100 is attached to the frame 200 at a first temperature higher than the temperature of the pixel deposition process, and thus has little influence on the position of the mask pattern P even when raised to the temperature for the pixel deposition process, and the PPA between the mask 100 and the mask 100 adjacent thereto can be maintained to be not more than 3 μm.

As described above, the present invention has been illustrated and described with reference to the preferred embodiments, but is not limited to the above-described embodiments, and those skilled in the art can make various modifications and alterations without departing from the spirit of the present invention. Such variations and modifications are intended to be within the scope of the present invention and the appended claims.

Claims

1. A mask supporting stencil for supporting a mask for OLED pixel formation and corresponding the mask to a frame, wherein the mask supporting stencil comprises:

a template;

a temporary bonding portion formed on the template; and

a mask bonded to the template with a temporary bonding portion interposed therebetween and having a mask pattern formed thereon,

the mask is bonded to the stencil with a tensile force applied in the lateral direction.

2. A mask supporting stencil for supporting a mask for OLED pixel formation and corresponding the mask to a frame, wherein the mask supporting stencil comprises:

a template;

a temporary bonding portion formed on the template; and

a through hole for passing welding energy is formed in a portion of the mask corresponding to the welding portion of the mask,

3. The mask supporting template according to claim 1 or 2, wherein the temporary bonding portion is an adhesive or a bonding sheet detachable based on heating, an adhesive or a bonding sheet detachable based on irradiation of UV.

4. The mask support template of claim 1, wherein the template material comprises any one of a wafer, glass, silica gel, pyrex, quartz, alumina, borosilicate glass, zirconia, soda lime glass, low iron glass.

5. A mask metal film supporting stencil, comprising:

a template;

a temporary bonding portion formed on the template; and

a mask metal film bonded to the stencil with a temporary bonding portion interposed therebetween and used for manufacturing a mask for forming OLED pixels,

the mask metal film is bonded to the stencil with a tensile force applied in the lateral direction.

6. A mask metal film supporting stencil, comprising:

a template;

a temporary bonding portion formed on the template; and

7. The masking metal film-supporting stencil of claim 5 or 6, wherein the masking metal film is made into a mask for OLED pixel formation by performing the steps of,

(a) a step of forming a patterned insulating portion on the mask metal film;

(b) a step of forming a mask pattern by etching the mask metal film portion exposed between the insulating portions; and

(c) and removing the insulating part.

8. A method of manufacturing a mask supporting stencil for supporting a mask for OLED pixel formation and corresponding the mask to a frame, wherein the method comprises:

(a) bonding the mask metal film to a template having a temporary bonding portion formed on one surface thereof in a state where a tensile force is applied in a side direction; and

(b) a step of manufacturing a mask by forming a mask pattern on the mask metal film.

9. The method of manufacturing a mask supporting template according to claim 8, further comprising, between the step (a) and the step (b), a step of reducing a thickness of the mask metal film bonded to the template.

10. The method of manufacturing a mask support template of claim 8, wherein step (a) comprises:

(a1) fixing a template having a temporary bonding portion formed on one surface thereof to the upper block;

(a2) a step of fixing at least one side of the mask metal film on the lower block in a stretched state; and

(a3) a step of bonding the mask metal film and the stencil by pressing the upper block and the lower block.

11. The method of manufacturing a mask supporting template according to claim 10, wherein step (a) is performed under a vacuum atmosphere.

12. The method of manufacturing a mask supporting stencil of claim 10, wherein after the step (a3), the portion of the mask metal film that protrudes toward the outside of the stencil is cut.

13. The method of manufacturing a mask support module according to claim 8, wherein the step (b) comprises:

(b1) a step of forming a patterned insulating portion on the mask metal film;

(b2) a step of forming a mask pattern by etching the mask metal film portion exposed between the insulating portions; and

(b3) and removing the insulating part.

14. A method of manufacturing a frame-integrated mask integrally formed of a plurality of masks and a frame for supporting the masks, wherein the method comprises:

(a) a step of preparing a mask supporting template to which a mask is bonded, the mask having a plurality of mask patterns formed thereon;

(b) a step of loading the template onto a frame having a plurality of mask unit regions and corresponding the mask to the mask unit regions of the frame; and

(c) a step of attaching the mask to the frame,

15. The apparatus for manufacturing a frame-integrated mask according to claim 14, further comprising: (d) attaching a mask to all mask cell regions of the frame by repeatedly performing the steps (b) to (c).

16. The method of manufacturing a frame-integrated type mask according to claim 14, wherein the step (a) comprises:

(a1) providing a mask metal mold;

(a2) bonding the mask metal film to a template having a temporary bonding portion formed on one surface thereof in a state where a tensile force is applied in a side direction; and

(a3) a step of manufacturing a mask by forming a mask pattern on the mask metal film, thereby providing a mask supporting template to which the mask is bonded, the mask having a plurality of mask patterns formed thereon.

17. The method of manufacturing a frame-integrated mask according to claim 14, wherein the laser irradiated on the upper portion of the mask is irradiated to the welding portion of the mask through the laser penetration hole in the step (c).

18. The method of manufacturing a frame integrated mask according to claim 14, further comprising a step of separating the mask from the template by performing at least one of heating, chemical treatment, ultrasonic wave application, and UV application to the temporary bonding portion after the step (c).

19. The method of manufacturing a frame integrated type mask according to claim 18, wherein if the template is separated from the mask, a tensile force applied to the mask is applied to the frame.

20. The method of manufacturing a frame-integrated mask of claim 14, wherein the frame comprises:

an edge frame portion including a hollow region; and

a mask unit sheet portion connected to the edge frame portion and having a plurality of mask unit regions,

the mask unit sheet part includes:

an edge sheet section;

at least one first grid sheet part extending in a first direction and having both ends connected to the edge sheet part; and

and a second grid sheet part extending in a second direction perpendicular to the first direction, intersecting the first grid sheet part, and having both ends connected to the edge sheet part.