KR102013434B1 - Producing method of template for supporting mask and producing method of mask integrated frame - Google Patents

Abstract

The present invention relates to a method for producing a mask support template and a method for producing a frame integrated mask. According to the present invention, the method for producing a mask support template to support an OLED pixel forming mask and correspond the OLED pixel forming mask to a frame comprises the steps of: (a) preparing a mask (100) on which a plurality of mask patterns (P) are formed; (b) preparing a template (50) having a temporary adhesive unit (55) formed on one surface thereof; and (c) attaching the mask (100) on the template (50).

Description

Manufacturing Method of Mask Support Template and Manufacturing Method of Integrated Frame Mask {PRODUCING METHOD OF TEMPLATE FOR SUPPORTING MASK AND PRODUCING METHOD OF MASK INTEGRATED FRAME}

The present invention relates to a method of manufacturing a mask support template and a method of manufacturing a frame integrated mask. More specifically, the present invention relates to a method for manufacturing a mask support template and a method for manufacturing a frame-integrated mask that can be stably supported and moved without deformation of the mask and that can align between each mask clearly.

As a technique for forming pixels in an OLED manufacturing process, a fine metal mask (FMM) method is used in which a thin metal mask is adhered to a substrate to deposit an organic material at a desired position.

In the conventional OLED manufacturing process, the mask is manufactured in a stick form, a plate form, and the like, and then the mask is welded and fixed to the OLED pixel deposition frame. Each mask may include a plurality of cells corresponding to one display. In addition, in order to manufacture a large area OLED, several masks may be fixed to the OLED pixel deposition frame. In the process of fixing to the frame, each mask is tensioned to be flat. Adjusting the tension to make the entire part of the mask flat is a very difficult task. In particular, in order to align the mask pattern having a size of only a few to several tens of micrometers while flattening each cell, a high-level operation of checking the alignment in real time while finely adjusting the tension applied to each side of the mask is required. do.

Nevertheless, in the process of fixing several masks in one frame, there is a problem in that the alignment between the mask cells and the mask cells is not good. In addition, since the thickness of the mask film is too thin and the large area in the process of welding and fixing the mask to the frame, the mask is squeezed or distorted due to the load, wrinkles, burrs, etc. generated in the welded part in the welding process. There was a problem of misalignment.

In the case of ultra-high-definition OLED, QHD image quality is 500 ~ 600 pixel per inch (PPI), and the pixel size is about 30 ~ 50㎛, and 4K UHD, 8K UHD high definition is higher than 860 PPI, ~ 1600 PPI, etc. It has a resolution of. As such, considering the pixel size of the ultra-high-definition OLED, the alignment error between each cell should be reduced to several μm, and the error beyond this may lead to product failure, resulting in very low yield. Therefore, there is a need for development of a technique for preventing deformation, such as knocking or twisting of a mask and making alignment clear, a technique for fixing a mask to a frame, and the like.

Accordingly, the present invention has been made to solve the above-mentioned problems of the prior art, it is possible to stably support and move the mask without deformation, to prevent deformation such as the mask is knocked or twisted and to clarify the alignment It is an object of the present invention to provide a method for manufacturing a mask support template and a method for manufacturing a frame-integrated mask.

Moreover, an object of this invention is to provide the manufacturing method of the frame-integrated mask which markedly reduced manufacturing time and raised the yield significantly.

The above object of the present invention is a template for supporting an OLED pixel forming mask and corresponding to a frame, comprising: a template; A temporary adhesive portion formed on the template; And a mask bonded onto the template via the temporary adhesive portion, the mask pattern having a mask pattern formed thereon, the mask being composed of a metal sheet manufactured by a rolling process, and the template having a coefficient of thermal expansion greater than that of the mask. Achieved by a support template.

In addition, the above object of the present invention, a method of manufacturing a template to support a mask for forming an OLED pixel to correspond to a frame, comprising the steps of: (a) preparing a mask having a plurality of mask patterns; (b) preparing a template having a temporary adhesive portion formed on one surface thereof; And (c) attaching the mask on the template.

The mask is composed of a sheet of metal manufactured by a rolling process, and the template may have a larger coefficient of thermal expansion than the mask.

The template may include a material having a coefficient of thermal expansion of 2.0 × 10 ⁻⁶ / ° C. to 20.0 × 10 ⁻⁶ / ° C.

In step (c), the mask may be adhered onto the template with tension applied in the lateral direction.

The mask may consist of a sheet of metal produced by a rolling or electroforming process.

The thickness of the mask may be 5 μm to 20 μm.

The temporary adhesive part may be an adhesive or adhesive sheet that can be separated by applying heat, and an adhesive or adhesive sheet that can be separated by UV irradiation.

The temporary adhesive may be liquid wax or thermal release tape.

Templates include wafers, glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), borosilicate glass, zirconia, soda-lime glass ), And may include any one material of low-iron glass.

A through hole through which welding energy passes may be formed in a portion of the template corresponding to the welding portion of the mask.

Step (c) comprises the steps of: (c1) fixing the template having the temporary adhesive portion formed on one surface to the upper block; (c2) fixing at least one side of the mask to the lower block in a tensioned state; And (c3) compressing the upper block and the lower block to adhere the mask and the template.

Step (c) may be performed in a vacuum atmosphere.

After the step (c3), the portion of the mask metal film protruding out of the template may be cut.

In addition, the above object of the present invention, a method of manufacturing a frame-integrated mask formed integrally with a plurality of masks and a frame for supporting the mask, comprising: (a) preparing a mask having a plurality of mask patterns; (b) preparing a template having a temporary adhesive portion formed on one surface thereof; And (c) attaching the mask on the template to produce a mask support template; (d) providing a frame having at least one mask cell area; (e) loading the template onto the frame to correspond to the mask cell area of the frame; And (f) irradiating a weld to the weld of the mask to adhere the mask to the frame.

The mask is composed of a sheet of metal manufactured by a rolling process, and the template may have a larger coefficient of thermal expansion than the mask.

The template may include a material having a coefficient of thermal expansion of 2.0 × 10 ⁻⁶ / ° C. to 20.0 × 10 ⁻⁶ / ° C.

Between (d) and (e), (d-2) raising the temperature of the process region including the frame to the first temperature; and between (e) and (f) (g) lowering the temperature of the process region including the frame to the second temperature.

The method may further include attaching the mask to all the mask cell regions of the frame by repeating steps (f-2) (e) to (f) between steps (f) and (g).

The temporary adhesive part may be an adhesive or adhesive sheet that can be separated by applying heat, and an adhesive or adhesive sheet that can be separated by UV irradiation.

The temporary adhesive may be liquid wax or thermal release tape.

In step (f), the welding energy irradiated from the upper portion of the template may pass through the through hole to be irradiated to the weld of the mask.

The first temperature may be equal to or higher than the OLED pixel deposition process temperature, and the second temperature may be at least lower than the first temperature.

The first temperature is any one of 25 ° C to 60 ° C, the second temperature is any one of 20 ° C to 30 ° C that is lower than the first temperature, and the OLED pixel deposition process temperature is any of 25 ° C to 45 ° C. It may be one temperature.

In step (d-2), the mask may extend beyond the inherent thermal expansion length.

The mask may stretch equal or less than the thermal expansion length of the template.

In step (e), the mask on the template may correspond to the mask cell region only by controlling the position of the template without applying tension to the mask.

When the temperature of the process region is lowered to the second temperature in step (g), the mask adhered to the frame may be contracted to apply a tension.

Between (f) and (g), the method may further include separating the mask and the template by performing at least one of heat application, chemical treatment, ultrasonic application, and UV application to the temporary bonding unit.

In step (c), the mask may be adhered onto the template with tension applied in the lateral direction.

The mask may consist of a sheet of metal produced by a rolling or electroforming process.

After step (e), the method may further include separating the mask and the template by performing at least one of heat application, chemical treatment, ultrasonic application, and UV application to the temporary bonding unit.

Once the template is separated from the mask, a tensile force applied to the mask can be applied to the frame.

The frame includes a border frame portion including a hollow area; And a mask cell sheet portion connected to the edge frame portion and having a plurality of mask cell regions, wherein the mask cell sheet portion comprises: an edge sheet portion; At least one first grid sheet portion extending in a first direction and connected at both ends to the edge sheet portion; And at least one second grid sheet portion extending in a second direction perpendicular to the first direction and intersecting with the first grid sheet portion, and both ends connected to the edge sheet portion.

The mask and frame may be made of any one of invar, super invar, nickel, and nickel-cobalt.

According to the present invention configured as described above, it is possible to stably support and move the mask without deformation, it is possible to prevent the deformation, such as knocked or twisted mask and to clarify the alignment.

In addition, according to the present invention, there is an effect that can significantly reduce the production time, and significantly increase the yield.

1 is a schematic view showing a conventional mask for OLED pixel deposition.
2 is a schematic diagram illustrating a process of adhering a conventional mask to a frame.
3 is a schematic diagram showing that alignment errors between cells occur in the process of tensioning a conventional mask.
4 is a front and side cross-sectional view showing a frame-integrated mask according to an embodiment of the present invention.
5 is a front and side cross-sectional view showing a frame according to an embodiment of the present invention.
6 is a schematic diagram illustrating a manufacturing process of a frame according to an embodiment of the present invention.
7 is a schematic diagram illustrating a manufacturing process of a frame according to another embodiment of the present invention.
8 is a schematic diagram illustrating a mask for forming a conventional high resolution OLED.
9 is a schematic diagram illustrating a mask according to an embodiment of the present invention.
10 is a schematic diagram illustrating a process of manufacturing a mask metal film by a rolling method according to an embodiment of the present invention.
FIG. 11 is a schematic diagram illustrating a process of fabricating a mask metal film according to another embodiment of the present invention by electroforming. FIG.
12 is a schematic diagram illustrating a process of manufacturing a mask support template by laminating a mask on a template according to an embodiment of the present invention.
Figure 13 is an enlarged cross-sectional schematic diagram showing a temporary adhesive portion according to an embodiment of the present invention.
14 is a schematic diagram illustrating a process of loading a mask support template onto a frame according to an embodiment of the present invention.
15 is a schematic diagram illustrating a state in which a mask is mapped to a cell area of a frame by loading a template according to an embodiment of the present invention.
16 is a schematic diagram illustrating a process of separating a mask and a template after attaching a mask to a frame according to an embodiment of the present invention.
17 is a schematic diagram illustrating a state in which a mask is adhered to a frame according to an embodiment of the present invention.
18 is a schematic diagram showing an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.
19 is a schematic diagram illustrating a state in which a template is loaded onto a frame after the temperature of the process region is raised according to the second embodiment of the present invention to correspond to a mask cell region of the frame.
20 is a schematic side cross-sectional view showing the bonding process of the frame according to the difference in the coefficient of thermal expansion of the mask.
21 is a schematic side cross-sectional view showing a series of processes for adhering a mask to a frame according to a second embodiment of the present invention.
22 is a schematic diagram illustrating a process of separating a mask and a template after attaching a mask to a frame according to a second embodiment of the present invention.
FIG. 23 is a schematic diagram showing a state in which a mask according to a second embodiment of the present invention corresponds to a cell region of a neighboring frame. FIG.
24 is a schematic diagram illustrating a process of separating a mask and a template after attaching a mask to a cell region of a neighboring frame according to a second embodiment of the present invention.
25 is a schematic diagram showing a state in which a mask according to a second embodiment of the present invention is adhered to a frame.
FIG. 26 is a schematic diagram illustrating a process of lowering a temperature of a process region after attaching a mask to a cell region of a frame according to a second embodiment of the present invention.
27 to 28 are schematic views illustrating a process of adhering a mask to a template according to a third embodiment of the present invention.
29 is a schematic diagram illustrating a state in which a template is loaded onto a frame and the mask corresponds to a cell area of the frame according to the third embodiment of the present invention.
30 is a schematic diagram illustrating a process of separating a mask and a template after attaching a mask to a frame according to a third embodiment of the present invention.
31 is a schematic diagram showing a state in which a mask according to a third embodiment of the present invention is adhered to a cell region of a frame.

DETAILED DESCRIPTION The following detailed description of the invention refers to the accompanying drawings that show, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are different but need not be mutually exclusive. For example, certain shapes, structures, and characteristics described herein may be embodied in other embodiments without departing from the spirit and scope of the invention with respect to one embodiment. In addition, it is to be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention, if properly described, is defined only by the appended claims, along with the full range of equivalents to which such claims are entitled. In the drawings, like reference numerals refer to the same or similar functions throughout the several aspects, and length, area, thickness, and the like may be exaggerated for convenience.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention.

1 is a schematic diagram showing a conventional mask for depositing OLED pixels 10.

Referring to FIG. 1, the conventional mask 10 may be manufactured in a stick type or a plate type. The mask 10 shown in FIG. 1A is a stick type mask, and both sides of the stick may be welded and fixed to the OLED pixel deposition frame. The mask 100 illustrated in FIG. 1B is a plate-type mask and may be used in a large area pixel forming process.

A plurality of display cells C are provided in the body (or mask film 11) of the mask 10. One cell C corresponds to one display such as a smartphone. In the cell C, a pixel pattern P is formed to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B appear. For example, the pixel pattern P is formed in the cell C to have a resolution of 70 × 140. That is, a large number of pixel patterns P may be clustered to form one cell C, and a plurality of cells C may be formed in the mask 10.

2 is a schematic diagram illustrating a process of adhering the mask 10 to the frame 20. 3 is a schematic view showing that alignment errors between cells occur in the process of tensioning the mask 10 (F1 to F2). A stick mask 10 having six cells C: C1 to C6 shown in FIG. 1A will be described as an example.

Referring to FIG. 2A, first, the stick mask 10 should be flattened. The stick mask 10 is unfolded by applying tensile forces F1 to F2 in the major axis direction of the stick mask 10. In this state, the stick mask 10 is loaded onto the frame 20 having a rectangular frame shape. The cells C1 to C6 of the stick mask 10 are positioned in the empty area of the frame 20 of the frame 20. The frame 20 may be large enough so that the cells C1 to C6 of one stick mask 10 are located in an empty area inside the frame, and the cells C1 to C6 of the plurality of stick masks 10 are framed. It may also be large enough to fit inside the empty area.

Referring to (b) of FIG. 2, after aligning while finely adjusting the tensile forces F1 to F2 applied to each side of the stick mask 10, a part of the side surface of the stick mask 10 is welded (W). Accordingly, the stick mask 10 and the frame 20 are interconnected. 2 (c) shows the side surface of the stick mask 10 and the frame connected to each other.

Referring to FIG. 3, in spite of finely adjusting the tensile force F1 to F2 applied to each side of the stick mask 10, there is a problem in that the alignment of the mask cells C1 to C3 is not good. For example, the distances D1 to D1 ″ and D2 to D2 ″ may be different from each other or the patterns P may be skewed between the patterns P of the cells C1 to C3. The stick mask 10 is a large area including a plurality of (eg, six) cells C1 to C6, and has a very thin thickness of several tens of micrometers, so that it is easily struck or warped by a load. In addition, it is very difficult to check the alignment between the cells C1 to C6 in real time through a microscope while adjusting the tensile forces F1 to F2 to flatten the cells C1 to C6.

Therefore, the minute error of the tensile force (F1 ~ F2) may cause an error in the extent that each cell (C1 ~ C3) of the stick mask 10 is extended or unfolded, and thus the distance (D1) between the mask pattern (P) ~ D1 ", D2-D2") cause a problem that becomes different. Of course, it is difficult to align perfectly so that the error is 0, but in order that the mask pattern P having a size of several to several tens of micrometers does not adversely affect the pixel process of the ultra-high definition OLED, the alignment error does not exceed 3 micrometers. It is preferable not to. This alignment error between adjacent cells is referred to as pixel position accuracy (PPA).

In addition, between the plurality of stick masks 10 and the plurality of cells C of the stick masks 10 while connecting the plurality of stick masks 10 of about 6 to 20 to each of the frames 20, respectively. It is also very difficult to clarify the alignment between ~ C6), and the process time due to alignment is inevitably increased, which is a significant reason for reducing productivity.

On the other hand, after fixing the stick mask 10 to the frame 20, the tensile force (F1 ~ F2) applied to the stick mask 10 can act inversely to the frame 20. That is, after the stick mask 10 is stretched by the tension force (F1 ~ F2) is connected to the frame 20 may be applied to the tension (tension) to the frame 20. In general, the tension may not be large, and thus may not have a large influence on the frame 20. However, when the size of the frame 20 is reduced in size and the rigidity is reduced, the tension may slightly change the frame 20. Thus, a problem may arise in that the alignment state is changed between the plurality of cells C to C6.

Thus, the present invention proposes a frame 200 and a frame integrated mask that allow the mask 100 to form an integrated structure with the frame 200. The mask 100 integrally formed in the frame 200 may be prevented from being deformed or warped, and may be clearly aligned with the frame 200. Since the mask 100 does not apply any tensile force to the mask 100 when the mask 100 is connected to the frame 200, the tension may not be applied to the frame 200 after the mask 100 is connected to the frame 200. . In addition, the manufacturing time for integrally connecting the mask 100 to the frame 200 may be significantly reduced, and the yield may be significantly increased.

4 is a front view (FIG. 4 (a)) and a side cross-sectional view (FIG. 4 (b)) showing a frame-integrated mask according to an embodiment of the present invention, Figure 5 is according to an embodiment of the present invention It is a front view (FIG. 5 (a)) and a side cross-sectional view (FIG. 5 (b)) which show a frame.

4 and 5, the frame integrated mask may include a plurality of masks 100 and one frame 200. In other words, the plurality of masks 100 are bonded to the frame 200 one by one. Hereinafter, for convenience of description, the rectangular mask 100 will be described as an example, but the masks 100 may be in the form of a stick mask having protrusions clamped at both sides before being bonded to the frame 200, and the frame 200. The protrusions can be removed after they have been adhered to.

A plurality of mask patterns P may be formed in each mask 100, and one cell C may be formed in one mask 100. One mask cell C may correspond to one display such as a smartphone.

The mask 100 may be an invar having a thermal expansion coefficient of about 1.0 × 10 ⁻⁶ / ° C. and a super invar material having about 1.0 × 10 ⁻⁷ / ° C. Since the mask 100 of this material has a very low coefficient of thermal expansion, there is little possibility that the pattern shape of the mask is deformed by thermal energy, and thus, the mask 100 may be used as a fine metal mask (FMM) or a shadow mask in high-resolution OLED manufacturing. In addition, in consideration of the recent development of techniques for performing the pixel deposition process in a range where the temperature change is not large, the mask 100 has a slightly larger thermal expansion coefficient than that of nickel (Ni) and nickel-cobalt (Ni-Co). It may be a material such as). The mask 100 may use a metal sheet produced by rolling, electroforming, or the like, but in consideration of the coefficient of thermal expansion, it is preferable to use a metal sheet produced by the rolling process.

The frame 200 is formed to bond the plurality of masks 100. The frame 200 may include various edges formed in a first direction (eg, a horizontal direction) and a second direction (eg, a vertical direction) including an outermost edge. These various corners may define the area to which the mask 100 is to be bonded on the frame 200.

The frame 200 may include an edge frame portion 210 having a substantially rectangular shape and a rectangular frame shape. The inside of the frame frame 210 may be hollow. That is, the frame frame 210 may include a hollow region (R). The frame 200 may be made of a metal material such as Invar, Super Invar, Aluminum, Titanium, etc., and may be made of Inbar, Super Invar, Nickel, or Nickel-Cobalt having the same thermal expansion coefficient as a mask in consideration of thermal deformation. Preferably, the materials may be applied to both the edge frame portion 210 and the mask cell sheet portion 220 which are components of the frame 200.

In addition, the frame 200 may include a plurality of mask cell regions CR and may include a mask cell sheet portion 220 connected to the edge frame portion 210. The mask cell sheet part 220 may be formed by rolling similarly to the mask 100, or may be formed using another film forming process such as electroplating. However, in consideration of the coefficient of thermal expansion, the mask cell sheet part 220 may be formed using a rolling process. desirable. In addition, the mask cell sheet part 220 may be connected to the edge frame part 210 after forming a plurality of mask cell areas CR through laser scribing or etching on a flat sheet. Alternatively, the mask cell sheet unit 220 may form a plurality of mask cell regions CR through laser scribing, etching, etc. after connecting the planar sheet to the edge frame unit 210. In the present specification, first, a plurality of mask cell regions CR are formed in the mask cell sheet part 220, and then the connection to the edge frame part 210 is mainly assumed.

The mask cell sheet part 220 may include at least one of the edge sheet part 221 and the first and second grid sheet parts 223 and 225. The edge sheet portion 221 and the first and second grid sheet portions 223 and 225 refer to respective portions partitioned from the same sheet, which are integrally formed with each other.

The edge sheet portion 221 may be substantially connected to the edge frame portion 210. Accordingly, the edge sheet part 221 may have a substantially rectangular shape and a rectangular frame shape corresponding to the edge frame part 210.

In addition, the first grid sheet part 223 may extend in a first direction (horizontal direction). The first grid sheet part 223 may be formed in a straight line shape and both ends thereof may be connected to the edge sheet part 221. When the mask cell sheet portion 220 includes the plurality of first grid sheet portions 223, each of the first grid sheet portions 223 may be equally spaced apart.

In addition, in addition, the second grid sheet part 225 may be formed to extend in a second direction (vertical direction). The second grid sheet part 225 may be formed in a straight line shape and both ends thereof may be connected to the edge sheet part 221. The first grid sheet portion 223 and the second grid sheet portion 225 may vertically cross each other. When the mask cell sheet portion 220 includes a plurality of second grid sheet portions 225, each of the second grid sheet portions 225 preferably has an equal interval.

Meanwhile, the spacing between the first grid sheet portions 223 and the spacing between the second grid sheet portions 225 may be the same or different according to the size of the mask cell C. FIG.

The first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, but the shape of the cross section perpendicular to the longitudinal direction may be a rectangle, a square shape such as a parallelogram, a triangular shape, or the like. The edges, edges, and corners may be partially rounded. The cross-sectional shape is adjustable in the process of laser scribing, etching and the like.

The thickness of the edge frame portion 210 may be thicker than the thickness of the mask cell sheet portion 220. The edge frame part 210 may be formed to a thickness of several mm to several cm because it is responsible for the overall rigidity of the frame 200.

In the case of the mask cell sheet part 220, a process of manufacturing a substantially thick sheet is difficult, and if it is too thick, a path through which the organic material source 600 (see FIG. 18) passes through the mask 100 in the OLED pixel deposition process. This can cause problems. On the contrary, if the thickness is too thin, it may be difficult to secure rigidity enough to support the mask 100. Accordingly, the mask cell sheet part 220 is thinner than the thickness of the edge frame part 210, but preferably thicker than the mask 100. The mask cell sheet part 220 may have a thickness of about 0.1 mm to about 1 mm. In addition, the widths of the first and second grid sheet parts 223 and 225 may be formed to about 1 to 5 mm.

A plurality of mask cell areas CR: CR11 to CR56 may be provided except for an area occupied by the edge sheet part 221 and the first and second grid sheet parts 223 and 225 in the planar sheet. In another aspect, the mask cell region CR is an area occupied by the edge sheet portion 221 and the first and second grid sheet portions 223 and 225 in the hollow region R of the edge frame portion 210. Except for, it may mean an empty area.

As the cell C of the mask 100 corresponds to the mask cell region CR, the mask C may be used as a passage through which the pixels of the OLED are deposited through the mask pattern P. FIG. As described above, one mask cell C corresponds to one display such as a smartphone. Mask patterns P constituting one cell C may be formed in one mask 100. Alternatively, one mask 100 may include a plurality of cells C, and each cell C may correspond to each cell region CR of the frame 200. It is necessary to avoid the large area mask 100, and the small area mask 100 provided with one cell C is preferable. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell region CR of the frame 200. In this case, for clear alignment, it may be considered to correspond to the mask 100 having a small number of cells C of about 2-3.

The frame 200 may include a plurality of mask cell regions CR, and each mask 100 may be bonded such that one mask cell C corresponds to the mask cell region CR. Each mask 100 may include a mask cell C in which a plurality of mask patterns P are formed and a dummy (corresponding to a portion of the mask film 110 except for the cell C) around the mask cell C. have. The dummy may include only the mask layer 110 or the mask layer 110 in which a predetermined dummy pattern having a similar shape to the mask pattern P is formed. The mask cell C may correspond to the mask cell region CR of the frame 200, and part or all of the dummy may be attached to the frame 200 (mask cell sheet portion 220). Accordingly, the mask 100 and the frame 200 may form an integrated structure.

On the other hand, according to another embodiment, the frame is not manufactured by bonding the mask cell sheet portion 220 to the edge frame portion 210, the edge frame portion 210 in the hollow region (R) portion of the edge frame portion 210 ), A frame in which a grid frame (corresponding to the grid sheet portions 223 and 225) which is integral with one another can be used immediately. The frame of this type also includes at least one mask cell region CR, and the mask integrated region may be manufactured by corresponding the mask 100 to the mask cell region CR.

Hereinafter, a process of manufacturing the frame integrated mask will be described.

First, the frame 200 described above with reference to FIGS. 4 and 5 may be provided. 6 is a schematic diagram illustrating a manufacturing process of the frame 200 according to an embodiment of the present invention.

Referring to FIG. 6A, an edge frame unit 210 is provided. The edge frame portion 210 may have a rectangular frame shape including the hollow area R.

Next, referring to FIG. 6B, a mask cell sheet part 220 is manufactured. The mask cell sheet part 220 is manufactured by manufacturing a flat sheet using a rolling, pre-plating or other film forming process, and then removing the mask cell region CR through laser scribing or etching. can do. In the present specification, a description will be given of an example in which a mask cell region CR: CR11 to CR56 of 6 × 5 is formed. There may be five first grid sheet portions 223 and four second grid sheet portions 225.

Next, the mask cell sheet part 220 may correspond to the edge frame part 210. In the corresponding process, all sides of the mask cell sheet part 220 are stretched (F1 to F4) to flatten the mask cell sheet part 220 to the edge sheet part 221 to the border frame part 210. It can respond. On one side, the mask cell sheet portion 220 may be grasped and tensioned at several points (for example, 1 to 3 points in FIG. 6B). On the other hand, the mask cell sheet portion 220 may be stretched (F1, F2) not in all sides but in some lateral directions.

Next, when the mask cell sheet part 220 corresponds to the edge frame part 210, the edge cell part 221 of the mask cell sheet part 220 may be welded (W) and bonded. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 can be firmly adhered to the edge frame portion 220. Welding (W) should be performed as close as possible to the edge of the edge frame portion 210 as much as possible to reduce the excited space between the edge frame portion 210 and the mask cell sheet portion 220 as much as possible to increase the adhesion. The weld (W) portion may be generated in a line or spot form, and may have the same material as the mask cell sheet portion 220 and integrate the edge frame portion 210 and the mask cell sheet portion 220. It can be a medium to connect to.

7 is a schematic diagram illustrating a manufacturing process of a frame according to another embodiment of the present invention. In the embodiment of FIG. 6, the mask cell sheet part 220 having the mask cell area CR is first manufactured and adhered to the edge frame part 210. However, the embodiment of FIG. After adhesion to 210, a mask cell region CR is formed.

First, as shown in FIG. 6A, the edge frame part 210 including the hollow area R is provided.

Next, referring to FIG. 7A, a flat sheet (a flat mask cell sheet portion 220 ′) may correspond to the edge frame portion 210. The mask cell sheet portion 220 ′ is in a planar state in which the mask cell region CR is not yet formed. In the corresponding process, all sides of the mask cell sheet part 220 'may be stretched (F1 to F4) to correspond to the edge frame part 210 in a state where the mask cell sheet part 220' is flattened. On one side, the mask cell sheet portion 220 'may be grasped and tensioned at various points (for example, 1 to 3 points in FIG. 7A). On the other hand, the mask cell sheet portion 220 'may be stretched (F1, F2) not in all sides but in some lateral direction.

Next, when the mask cell sheet portion 220 ′ corresponds to the edge frame portion 210, the edge portion of the mask cell sheet portion 220 ′ may be welded (W) and bonded. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 ′ can be firmly adhered to the edge frame portion 220. Welding (W) should be performed as close as possible to the edge of the edge frame portion 210 as much as possible to reduce the excited space between the edge frame portion 210 and the mask cell sheet portion 220 'as much as possible to increase the adhesion. The weld (W) portion may be generated in a line or spot shape, and may have the same material as the mask cell sheet portion 220 ′ and have an edge frame portion 210 and a mask cell sheet portion 220 ′. It can be a medium to connect the integrally.

Next, referring to FIG. 7B, a mask cell region CR is formed in a planar sheet (planar mask cell sheet portion 220 ′). The mask cell region CR may be formed by removing the sheet of the mask cell region CR through laser scribing or etching. In the present specification, a description will be given of an example in which a mask cell region CR: CR11 to CR56 of 6 × 5 is formed. When the mask cell region CR is formed, the portion welded to the edge frame portion 210 becomes the edge sheet portion 221, and five first grid sheet portions 223 and four second grids are formed. The mask cell sheet part 220 having the sheet part 225 may be configured.

8 is a schematic diagram illustrating a mask for forming a conventional high resolution OLED.

In order to implement a high-resolution OLED, the size of the pattern is decreasing, and the thickness of the mask metal film used for this needs to be thinned. As illustrated in (a) of FIG. 8, in order to implement the OLED pixel 6 having a high resolution, the pixel spacing, the pixel size, and the like must be reduced in the mask 10 '(PD-> PD'). Further, in order to prevent the OLED pixel 6 from being unevenly deposited due to the shadow effect, it is necessary to form the pattern 14 of the mask 10 'to be inclined. However, in the process of forming the inclined pattern 14 on the thick mask 10 'with a thickness T1 of about 30 to 50 µm, patterning 13 suitable for the minute pixel interval PD' and pixel size is formed. Since it is difficult to do this, it becomes a cause of a bad yield in a machining process. In other words, in order to form the pattern 14 to be inclined with a fine pixel interval PD ', a thin mask 10' must be used.

In particular, for high resolution of the UHD level, as shown in (b) of FIG. 8, fine patterning may be performed only by using a thin mask 10 ′ having a thickness T2 of about 20 μm or less. In addition, the use of a thin mask 10 ′ having a thickness T2 of about 10 μm may be considered for ultra high resolution of UHD or higher.

9 is a schematic diagram illustrating a mask 100 according to an embodiment of the present invention.

The mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy DM around the mask cell C. FIG. As described above, the mask 100 may be manufactured from a metal sheet generated by a rolling process, electroplating, or the like, and one cell C may be formed in the mask 100. The dummy DM corresponds to a portion of the mask film 110 (mask metal film 110) except for the cell C, includes only the mask film 110, or a predetermined dummy in a form similar to the mask pattern P. FIG. The patterned mask layer 110 may be included. The dummy DM may be attached to the frame 200 (mask cell sheet part 220) in part or in whole of the dummy DM in correspondence to the edge of the mask 100.

The width of the mask pattern P may be smaller than 40 μm, and the thickness of the mask 100 may be about 5 to 20 μm. Since the frame 200 includes a plurality of mask cell regions CR: CR11 to CR56, the mask 100 having mask cells C11 to C56 corresponding to the mask cell regions CR11 to CR56, respectively. ) Can also be provided in plurality.

One surface 101 of the mask 100 is preferably flat because it is a surface to be bonded to the frame 200 to be bonded. One surface 101 may be mirrored while being flattened by a planarization process to be described later. The other surface 102 of the mask 100 may face one surface of the template 50 to be described later.

Hereinafter, the mask metal film 110 ′ is manufactured, the mask 50 is supported by the template 50, and the template 50 on which the mask 100 is supported is loaded on the frame 200. A series of processes for manufacturing the frame-integrated mask as the mask 100 is adhered to the frame 200 will be described.

10 is a schematic diagram illustrating a process of manufacturing a mask metal film by a rolling method according to an embodiment of the present invention. FIG. 11 is a schematic diagram illustrating a process of fabricating a mask metal film according to another embodiment of the present invention by electroforming. FIG.

First, the mask metal film 110 may be prepared. In an embodiment, the mask metal film 110 may be prepared by a rolling method.

Referring to FIG. 10A, the metal sheet generated by the rolling process may be used as the mask metal film 110 ′. The metal sheet manufactured by the rolling process may have a thickness of several tens to several hundred micrometers in the manufacturing process. As described above with reference to FIG. 8, fine patterning may be performed by using a thin mask metal film 110 having a thickness of about 20 μm or less for UHD level high resolution, and about 10 μm thick for ultra high resolution of UHD or more. A thin mask metal film 110 having a must be used. However, since the mask metal film 110 ′ produced by the rolling process has a thickness of about 25 to 500 μm, the thickness of the mask metal film 110 ′ needs to be thinner.

Therefore, a process of planarizing (PS) one surface of the mask metal film 110 ′ may be further performed. Here, the planarization PS means that the thickness of the mask metal film 110 ′ is reduced by thinning one surface (upper surface) of the mask metal film 110 ′ and simultaneously removing a portion of the mask metal film 110 ′. Planarization (PS) may be performed by a chemical mechanical polishing (CMP) method, and known CMP methods may be used without limitation. In addition, the thickness of the mask metal layer 110 ′ may be reduced by chemical wet etching or dry etching. In addition, a process capable of flattening to thin the thickness of the mask metal film 110 ′ may be used without limitation.

In the process of performing a flattening (PS), in the CMP process, For example, a mask, a metal film (110 '), the surface roughness of the top surface (R _a) can be controlled. Preferably, mirroring may proceed with further reduction in surface roughness. Alternatively, another example, may be after performing a chemical wet etch or dry etch planarization process (PS) advances to, in addition to the polishing process, such as a separate CMP process after reducing the surface roughness (R _a).

As such, the thickness of the mask metal film 110 ′ may be made thinner than about 50 μm. Accordingly, the thickness of the mask metal film 110 may be about 2 μm to about 50 μm, and more preferably about 5 μm to about 20 μm. However, it is not necessarily limited thereto.

Referring to FIG. 10B, similarly to FIG. 10A, the mask metal film 110 may be manufactured by reducing the thickness of the mask metal film 110 ′ manufactured by the rolling process. However, the thickness of the mask metal film 110 ′ may be reduced by performing a planarization (PS) process in a state where the mask metal film 110 ′ is bonded to the template 50 to be described later via the temporary adhesive part 55.

In another embodiment, the mask metal film 110 may be prepared by electroplating.

Referring to FIG. 11A, a conductive substrate 21 is prepared. In order to perform electroforming, the substrate 21 of the mother plate may be a conductive material. The mother plate can be used as a cathode electrode in electroplating.

As the conductive material, in the case of metal, metal oxides may be generated on the surface, impurities may be introduced during the metal manufacturing process, and in the case of the polycrystalline silicon substrate, inclusions or grain boundaries may exist, and the conductive polymer may be present. In the case of a base material, it is highly likely to contain an impurity, and strength. Acid resistance may be weak. Elements that interfere with the uniform formation of an electric field on the surface of the substrate (or negative electrode body), such as metal oxides, impurities, inclusions, grain boundaries, etc., are referred to as "defects." Due to the defect, a uniform electric field may not be applied to the cathode body of the above-described material, so that a part of the plating film 110 (or the mask metal film 110) may be unevenly formed.

Non-uniformity of the plating film and the plating film pattern (mask pattern P) may adversely affect the formation of the pixel in implementing a UHD-class or higher definition pixel. For example, QHD image quality is 500 ~ 600 pixel per inch (PPI), and the pixel size is about 30 ~ 50㎛, and 4K UHD, 8K UHD high definition is ~ 860 PPI, ~ 1600 PPI Have the same resolution. The micro display applied directly to the VR device, or the micro display used in the VR device, aims at an ultra-high quality of about 2,000 PPI or more, and the size of the pixel reaches about 5 to 10 μm. Since the pattern width of the FMM and shadow mask applied to this can be formed in a size of several to several tens of micrometers, preferably smaller than 30 micrometers, even a defect of several micrometers is large enough to occupy a large proportion of the pattern size of the mask. to be. In addition, an additional process for removing metal oxides, impurities, and the like may be performed to remove the defects in the cathode material of the material described above, and another defect such as etching of the anode material may be caused in this process. have.

Accordingly, the present invention can use a mother plate (or a negative electrode body) of a single crystal material. In particular, it is preferable that it is a single crystal silicon material. In order to have conductivity, a high concentration doping of 10 ¹⁹ / cm ³ or more may be performed on the single crystal silicon base plate. Doping may be performed on the entirety of the mother plate, or only on the surface portion of the mother plate.

On the other hand, as the single crystal material, metals such as Ti, Cu, Ag, carbon-based materials such as semiconductors such as GaN, SiC, GaAs, GaP, AlN, InN, InP, Ge, graphite, and graphene _{, CH 3 NH 3 PbCl 3,} CH 3 NH 3 PbBr 3, CH 3 NH 3 PbI 3, SrTiO 3 , etc. page containing the perovskite (perovskite) superconductor single crystalline ceramic, aircraft single crystal second heat-resistant alloy for components for such structures And the like can be used. Metal and carbon-based materials are basically conductive materials. In the case of a semiconductor material, a high concentration doping of 10 ¹⁹ / cm ³ or more may be performed to have conductivity. In the case of other materials, the conductivity may be formed by performing doping or forming oxygen vacancies. Doping may be performed on the entirety of the mother plate, or only on the surface portion of the mother plate.

Since there is no defect in the case of a single crystal material, there is an advantage in that a uniform plating film 110 may be generated due to the formation of a uniform electric field on all surfaces during electroplating. The frame-integrated masks 100 and 200 manufactured through the uniform plating layer may further improve the image quality level of the OLED pixel. In addition, since an additional process of eliminating and eliminating defects does not have to be performed, process costs are reduced and productivity is improved.

Referring back to FIG. 11A, next, the conductive substrate 21 is used as a mother plate (cathode body), and the anode body (not shown) is spaced apart on the conductive substrate 21. The plating film 110 (or the mask metal film 110) can be formed in the electroplating. The plating film 110 may be formed on the exposed top and side surfaces of the conductive substrate 21 facing the anode and capable of acting on an electric field. In addition to the side surface of the conductive substrate 21, the plating film 110 may be formed even on a part of the lower surface of the conductive substrate 21.

Next, the edge of the plating film 110 may be cut (D) with a laser, or a photoresist layer may be formed on the plating film 110, and only a portion of the exposed plating film 110 may be etched and removed (D). Can be. Accordingly, as shown in FIG. 11B, the plating film 110 can be separated from the conductive substrate 21.

On the other hand, before the plating film 110 is separated from the conductive substrate 21, heat treatment (H) may be performed. In order to reduce the thermal expansion coefficient of the mask 100 and to prevent deformation due to the heat of the mask 100 and the mask pattern P, the plating film (or the base plate, the cathode body) is formed from the plated film ( Before the separation 110, characterized in that the heat treatment (H) is performed. Heat treatment may be carried out at a temperature of 300 ℃ to 800 ℃.

In general, the Invar thin plate produced by electroplating has a higher coefficient of thermal expansion as compared to the Invar thin plate produced by rolling. Thus, the thermal expansion coefficient can be lowered by performing heat treatment on the Invar thin plate. In this heat treatment, peeling, deformation, etc. may occur on the Invar thin plate. This is a phenomenon that occurs because only the Invar thin plate is heat-treated, or the Invar thin plate temporarily bonded only to the upper surface of the conductive substrate 21. However, in the present invention, since the plating film 110 is formed not only on the upper surface of the conductive substrate 21 but also on part of the side surface and the lower surface, no peeling or deformation occurs even when the heat treatment (H) is performed. In other words, since the heat treatment is performed in a state in which the conductive base material 21 and the plating film 110 are closely adhered to each other, there is an advantage in that delamination, deformation, etc. due to heat treatment can be prevented and heat treatment can be stably performed.

The thickness of the mask metal film 110 generated by the electroplating process may be thinner than the rolling process. Accordingly, although the planarization (PS) process of reducing the thickness may be omitted, the etching characteristics may vary depending on the composition of the surface layer of the plating mask metal film 110 ′ and the crystal structure / fine structure. It is necessary to control the surface characteristics and thickness through.

12 is a schematic diagram illustrating a process of manufacturing a mask support template by laminating a mask 100 on a template 50 according to an embodiment of the present invention.

First, a mask 100 in which a plurality of mask patterns P is formed may be prepared. The mask 100 described above with reference to FIG. 9 may be prepared, and the mask pattern P may be formed using a known patterning method using etching, laser etching, or the like using a lithography process.

Next, referring to FIG. 12A, a template 50 may be provided. The template 50 is a medium capable of moving the mask 100 in a supported state attached to one surface. One surface of the template 50 is preferably flat so as to support and move the flat mask 100. The central portion 50a may correspond to the mask cell C of the mask 100, and the edge portion 50b may correspond to the dummy DM of the mask metal film 110. The size of the template 50 may be the same or larger than that of the mask 100 so that the mask 100 may be flatly attached overall.

The template 50 is preferably made of a transparent material so that the vision is easily observed in the process of aligning and bonding the mask 100 to the frame 200. In addition, the laser may penetrate the transparent material. Transparent materials as glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), borosilicate glass, zirconia, soda-lime glass , Materials such as low-iron glass may be used. For example, in consideration of the coefficient of thermal expansion with the mask 100, the template 50 may use a BOROFLOAT ^® 33 material having excellent heat resistance, chemical durability, mechanical strength, transparency, etc. of borosilicate glass.

On the other hand, the template 50 is one surface which is in contact with the mask metal film 110 so as not to generate an air gap between the interface with the mask metal film 110 (or the mask 100). Can be. In consideration of this, the surface roughness Ra of one surface of the template 50 may be 100 nm or less. In order to implement the template 50 whose surface roughness Ra is 100 nm or less, the template 50 may use a wafer. Since a wafer has a surface roughness Ra of about 10 nm, many products on the market, and many surface treatment processes are known, the wafer can be used as the template 50. Since the surface roughness Ra of the template 50 is nm scale, there is no or almost no air gap, and thus it is easy to generate the welding beads WB by laser welding, thereby affecting the alignment error of the mask pattern P. Can not give.

Template 50 according to an embodiment of the present invention may have a larger coefficient of thermal expansion than the mask 100 / mask metal film 110. As an example, assuming that the mask 100 / mask metal film 110 uses an Invar sheet manufactured by a rolling process, the thermal expansion coefficient of the mask is about 1.0 × 10 ⁻⁶ / ° C. Therefore, the template 50 may use a material having a larger coefficient of thermal expansion than this, and a material having a coefficient of thermal expansion of about 2.0 × 10 ⁻⁶ / ° C. to 20.0 × 10 ⁻⁶ / ° C. may be used. If the thermal expansion coefficient of the template 50 is too large, the deviation with respect to the heat of the mask 100 and the template 50 becomes too large and may not be easy to control. Taking this into consideration, wafers (about 3.0 × 10 ⁻⁶ / ° C.), soda-lime glass (about 9 × 10 ⁻⁶ / ° C.), low-rion glass (about) 8 X 10 ^-6 / ° C), BOROFLOAT ^® 33 (about 3.3 X 10 ^-6 / ° C), alumina (about 4 X 10 ^-6 to 11 X 10 ^-6 / ° C), zirconia (borosilicate glass) It is preferable to use a template 50 including about 10 × 10 ⁻⁶ / ° C.) and the like. The behavior of the template 50 and the mask 100 according to the thermal expansion coefficient will be described later with reference to FIGS. 20 to 22.

The template 50 has a laser passing hole 51 in the template 50 so that the laser L irradiated from the upper portion of the template 50 can reach the welding part (WP, the area to be welded) of the mask 100. ) May be formed. The laser through hole 51 may be formed in the template 50 so as to correspond to the position and the number of welds WP. Since a plurality of welding portions WP are disposed along a predetermined interval at edges or dummy DM portions of the mask 100, a plurality of laser passing holes 51 may also be formed along a predetermined interval to correspond thereto. As an example, since a plurality of welds are disposed at both sides (left / right) of the mask 100 at a portion of the dummy DM along a predetermined interval, the laser penetrating hole 51 also has the template 50 at both sides (left / right). A plurality may be formed along a predetermined interval.

The laser through hole 51 does not necessarily correspond to the position and the number of the welds WP. For example, welding may be performed by irradiating the laser L only to a part of the laser passing holes 51. In addition, some of the laser through holes 51 which do not correspond to the welding portion WP may be used in place of the alignment mark when the mask 100 and the template 50 are aligned. If the material of the template 50 is transparent to the laser light, the laser through hole 51 may not be formed.

Meanwhile, other types of energy (“welding energy”) may be provided as long as the laser L is applied to the upper portion of the template 50 to reach the welding portion WP of the mask 100 and the welding is performed. Can also be used. In this case, the laser through hole 51 may be referred to as a through hole 51.

The temporary adhesive part 55 may be formed on one surface of the template 50. In the temporary adhesive part 55, the mask 100 (or the mask metal film 110) is temporarily adhered to one surface of the template 50 until the mask 100 is adhered to the frame 200. To be supported.

The temporary adhesive part 55 may use an adhesive or adhesive sheet (thermal release type) that can be separated by applying heat, and an adhesive or adhesive sheet (UV release type) that can be separated by UV irradiation.

For example, the temporary adhesive part 55 may use liquid wax. The liquid wax can use the same thing as the wax used in the polishing step of a semiconductor wafer, etc., The type is not specifically limited. Liquid waxes may mainly include solvents and materials such as acrylic, vinyl acetate, nylon and various polymers as resin components for controlling adhesion, impact resistance, and the like regarding holding force. For example, the temporary adhesive part 55 may use acrylonitrile butadiene rubber (ABR) as a resin component and SKYLIQUID ABR-4016 including n-propyl alcohol as a solvent component. Liquid wax may be formed on the temporary bond 55 using spin coating.

The temporary adhesive portion 55, which is a liquid wax, has a low viscosity at temperatures higher than 85 ° C to 100 ° C, and may become viscous at a temperature lower than 85 ° C and partially harden as a solid, thereby fixing the mask 100 and the template 50. It can be bonded.

According to the present invention, after the mask 100 and the template 50 on which the mask pattern P is formed are manufactured, the mask support template is manufactured by laminating the mask 100 and the template 50.

Referring to FIG. 12B, the mask 100 may be attached onto the template 50. After the liquid wax is heated to 85 ° C. or higher and the mask 100 is brought into contact with the template 50, the mask 100 and the template 50 may be passed between the rollers to perform adhesion.

According to an embodiment, the template 50 may be baked at about 120 ° C. for 60 seconds to vaporize the solvent of the temporary adhesive part 55, and immediately proceed to a mask metal film lamination process. . Lamination may be performed by loading the mask 100 on the template 50 having the temporary adhesive part 55 formed on one surface thereof, and passing it between an upper roll of about 100 ° C. and a lower roll of about 0 ° C. As a result, the mask 100 may be contacted on the template 50 via the temporary adhesive portion 55.

Figure 13 is an enlarged cross-sectional schematic diagram showing a temporary bonding portion 55 according to an embodiment of the present invention. As another example, the temporary adhesive part 55 may use a thermal release tape. In the heat-peelable tape, a core film 56 such as a PET film is disposed in the center, and thermal release adhesives 57a and 57b are arranged on both surfaces of the core film 56, and the adhesive layer 57a is provided. , 57b) may be in a form in which release films / release films 58a and 58b are disposed. Here, the pressure-sensitive adhesive layers 57a and 57b disposed on both surfaces of the core film 56 may have different temperatures.

According to one embodiment, with the release film / release film 58a, 58b removed, the bottom surface (second adhesive layer 57b) of the heat release tape is adhered to the template 50 and the top of the heat release tape The surface [first adhesive layer 57a] may be adhered to the mask metal film 110 '. Since the temperature at which the first adhesive layer 57a and the second adhesive layer 57b are separated from each other is different, when the template 50 is separated from the mask 100 in FIG. 22 to be described later, the first adhesive layer 57a is used. The mask 100 may be separated from the template 50 and the temporary adhesive part 55 by applying the heat-peeled heat.

As described above, in the mask support template according to the embodiment of the present invention, after manufacturing the mask 100 and the template 50 on which the mask pattern P is formed, the mask 100 and the template 50 may be temporarily bonded to each other ( Since the manufacturing can be completed by laminating via 55), the manufacturing process has a simple advantage.

Since the frame 200 includes a plurality of mask cell regions CR: CR11 to CR56, the mask 100 having mask cells C11 to C56 corresponding to the mask cell regions CR11 to CR56, respectively. ) Can also be provided in plurality. In addition, a plurality of templates 50 supporting each of the plurality of masks 100 may be provided.

14 is a schematic diagram illustrating a process of loading a mask support template onto a frame according to an embodiment of the present invention.

Referring to FIG. 14, the template 50 may be conveyed by the vacuum chuck 90. The vacuum chuck 90 may absorb and transfer the opposite surface of the template 50 to which the mask 100 is adhered. The vacuum chuck 90 may be connected to a moving means (not shown) which is moved along the x, y, z and θ axes. In addition, the vacuum chuck 90 may be connected to flip means (not shown) capable of attracting and flipping the template 50. As shown in FIG. 14B, the vacuum chuck 90 sucks and flips the template 50, and then transfers the template 50 onto the frame 200. There is no effect on the adhesion state and the alignment state.

15 is a schematic diagram illustrating a state in which a mask is mapped to a cell area of a frame by loading a template according to an embodiment of the present invention. In FIG. 15, one mask 100 is corresponded / adhered to the cell region CR. However, the mask 100 may be frame 200 by simultaneously matching the plurality of masks 100 to all the cell regions CR. ) May be adhered to.

Next, referring to FIG. 15, the mask 100 may correspond to one mask cell region CR of the frame 200. By loading the template 50 onto the frame 200 (or the mask cell sheet unit 220), the mask 100 may correspond to the mask cell region CR. While controlling the position of the template 50 / vacuum chuck 90, it is possible to see if the mask 100 corresponds to the mask cell region CR through the microscope. Since the template 50 compresses the mask 100, the mask 100 and the frame 200 may closely contact each other.

Meanwhile, the lower supporter 70 may be further disposed below the frame 200. The lower supporter 70 may have a size enough to fit into the hollow region R of the frame rim 210 and may have a flat plate shape. In addition, a predetermined support groove (not shown) corresponding to the shape of the mask cell sheet part 220 may be formed on the upper surface of the lower supporter 70. In this case, the edge sheet part 221 and the first and second grid sheet parts 223 and 225 are fitted into the support groove, so that the mask cell sheet part 220 may be more securely fixed.

The lower supporter 70 may compress the opposite surface of the mask cell region CR that the mask 100 contacts. That is, the lower supporter 70 may support the mask cell sheet part 220 in the upper direction to prevent the mask cell sheet part 220 from sagging in the lower direction during the bonding process of the mask 100. At the same time, since the lower support 70 and the template 50 are pressed against each other in a direction opposite to each other, the edge and the frame 200 (or the mask cell sheet part 220) of the mask 100 are compressed. The alignment state of the can be maintained without being disturbed.

As such, the mask 100 may be attached to the template 50, and the mask 100 may correspond to the mask cell region CR of the frame 200 by simply loading the template 50 onto the frame 200. Since the process is completed, no tensile force may be applied to the mask 100 in this process.

Subsequently, the mask 100 may be irradiated with the laser L to bond the mask 100 to the frame 200 by laser welding. A weld bead WB is generated in the welded portion of the laser welded mask, and the weld bead WB may be integrally connected with the same material as that of the mask 100 / frame 200.

16 is a schematic diagram illustrating a process of separating the mask 100 and the template 50 after attaching the mask 100 to the frame 200 according to an embodiment of the present invention.

Referring to FIG. 16, after the mask 100 is adhered to the frame 200, the mask 100 and the template 50 may be debonded. Separation of the mask 100 and the template 50 may be performed through at least one of heat application (EP), chemical treatment (CM), ultrasonic application (US), and UV application (UV) to the temporary adhesive part 55. have. Since the mask 100 remains attached to the frame 200, only the template 50 may be lifted. For example, when heat of temperature higher than 85 ° C. to 100 ° C. is applied (EP), the viscosity of the temporary adhesive part 55 is lowered, and the adhesive force of the mask 100 and the template 50 is weakened, thereby the mask 100 ) And the template 50 may be separated. As another example, the mask 100 and the template 50 may be separated by dissolving and removing the temporary adhesive part 55 by dipping (CM) the temporary adhesive part 55 in chemical substances such as IPA, acetone, and ethanol. have. As another example, when the ultrasonic wave (US) or the UV (UV) is applied, the adhesive force between the mask 100 and the template 50 is weakened, so that the mask 100 and the template 50 may be separated.

In more detail, since the temporary bonding part 55 which mediates the adhesion between the mask 100 and the template 50 is a TBDB adhesive material (temporary bonding & debonding adhesive), various debonding methods can be used.

For example, a solvent debonding method according to chemical treatment (CM) may be used. As the temporary adhesive part 55 is dissolved by penetration of a solvent, debonding may be performed. In this case, since the pattern P is formed in the mask 100, the solvent may penetrate through the mask pattern P and the interface between the mask 100 and the template 50. Solvent debonding has the advantage of being relatively economical as compared to other debonding methods because it can be debonded at room temperature and does not require a separate, devised complex debonding facility.

As another example, a heat debonding method according to heat application (EP) may be used. Debonding may be performed in the vertical direction or the left and right directions when the high temperature heat is induced to disassemble the temporary adhesive part 55 and the adhesive force between the mask 100 and the template 50 is reduced.

As another example, a peelable adhesive debonding method according to heat application (EP), UV application (UV), or the like may be used. When the temporary adhesive part 55 is a heat-peelable tape, debonding may be performed by a peeling adhesive debonding method, which does not require high temperature heat treatment and expensive heat treatment equipment as a thermal debonding method. Has a relatively simple advantage.

As another example, a room temperature debonding method according to chemical treatment (CM), ultrasonic application (US), UV application (UV), or the like may be used. If a non-sticky treatment is applied to a portion (center) of the mask 100 or the template 50, only the edge portion may be adhered by the temporary adhesive portion 55. In addition, during the debonding, the solvent penetrates into the edge portion, and the debonding is performed by dissolution of the entrance-adhesion part 55. This method is advantageous in that the remaining portions of the mask 100 and the template 50 except for the edges of the mask 100 and the template 50 are not directly lost during bonding and debonding, or defects caused by adhesive residue during debonding do not occur. There is this. In addition, unlike the thermal debonding method, since the high temperature heat treatment process is not required during debonding, there is an advantage in that the process cost can be relatively reduced.

17 is a schematic diagram illustrating a state in which the mask 100 is adhered to the frame 200 according to an embodiment of the present invention.

Referring to FIG. 17, one mask 100 may be adhered onto one cell region CR of the frame 200.

Since the mask cell sheet portion 220 of the frame 200 has a thin thickness, when the mask cell sheet portion 220 is bonded to the mask cell sheet portion 220 while the tensile force is applied to the mask 100, the tensile force remaining in the mask 100 is masked. The cell sheet 220 and the mask cell region CR may act on the cell sheet 220 and may be modified. Therefore, adhesion of the mask 100 to the mask cell sheet part 220 should be performed without applying a tensile force to the mask 100. The present invention corresponds to the mask cell region CR of the frame 200 by simply attaching the mask 100 to the template 50 and loading the template 50 onto the frame 200. Since the process is completed, no tensile force may be applied to the mask 100 in this process. Thus, it is possible to prevent the tensile force applied to the mask 100 from acting as a tension on the frame 200 to deform the frame 200 (or the mask cell sheet part 220).

Since the mask 10 of FIG. 1 includes six cells C1 to C6, the mask 10 has a long length, whereas the mask 100 of the present invention has a short length including one cell C. The degree of misalignment of the pixel position accuracy (PPA) can be reduced. For example, assuming that the length of the mask 10 including the plurality of cells C1 to C6, ... is 1 m, and a PPA error of 10 µm occurs in the entire 1 m, the mask 100 of the present invention According to the reduction of the relative length (corresponding to the reduction of the number of cells (C)) may be 1 / n of the above error range. For example, if the length of the mask 100 of the present invention is 100mm, it has a length reduced by 1/10 at 1m of the conventional mask 10, the PPA error of 1㎛ occurs in the entire 100mm length As a result, the alignment error is significantly reduced.

On the other hand, if the mask 100 is provided with a plurality of cells (C), each cell (C) corresponding to each cell region (CR) of the frame 200 is within a range that the alignment error is minimized, The mask 100 may correspond to the plurality of mask cell regions CR of the frame 200. Alternatively, the mask 100 having the plurality of cells C may correspond to one mask cell region CR. Also in this case, in consideration of the process time and productivity according to the alignment, it is preferable that the mask 100 has as few cells as possible.

In the case of the present invention, since only one cell C of the mask 100 needs to be corresponded and the alignment state checked, the plurality of cells C: C1 to C6 must be simultaneously associated and the alignment state must be confirmed. Compared with the conventional method (see FIG. 2), the manufacturing time can be significantly reduced.

That is, in the method of manufacturing a frame-integrated mask of the present invention, each cell C11 to C16 included in the six masks 100 corresponds to one cell region CR11 to CR16, respectively, and checks the alignment state. Through the process, the time can be much shorter than the conventional method of simultaneously matching six cells C1 to C6 and simultaneously confirming the alignment of the six cells C1 to C6.

In addition, in the method of manufacturing a frame-integrated mask of the present invention, the product yield in 30 steps of matching and aligning 30 masks 100 with 30 cell areas CR: CR11 to CR56, respectively, results in six cells (C1). 5 masks 10 (see FIG. 2 (a)) each comprising ˜C6) may appear much higher than the conventional product yield in five steps of matching and aligning the frame 20. Since the conventional method of aligning six cells C1 to C6 in a region corresponding to six cells C at a time is much more cumbersome and difficult, the product yield is low.

Meanwhile, as described above with reference to FIG. 12, when the mask 100 is attached to the template 50 by the lamination process, a temperature of about 100 ° C. may be applied to the mask 100. As a result, the mask 100 may be adhered to the template 50 in a state where some tensile tension is applied. Thereafter, when the mask 100 is adhered to the frame 200 and the template 50 is separated from the mask 100, the mask 100 may contract a predetermined amount.

After each of the masks 100 is bonded onto the corresponding mask cell region CR, the template 50 and the masks 100 are separated, and a plurality of masks 100 are applied in tension in opposite directions. Therefore, the force is canceled so that deformation does not occur in the mask cell sheet portion 220. For example, the first grid sheet portion 223 between the mask 100 attached to the CR11 cell region and the mask 100 attached to the CR12 cell region may move in the right direction of the mask 100 attached to the CR11 cell region. The tension acting and the tension acting in the left direction of the mask 100 attached to the CR12 cell region may be offset. Therefore, the deformation of the frame 200 (or the mask cell sheet part 220) due to tension is minimized, so that the alignment error of the mask 100 (or the mask pattern P) can be minimized.

18 is a schematic diagram illustrating an OLED pixel deposition apparatus 1000 using frame-integrated masks 100 and 200 according to an embodiment of the present invention.

Referring to FIG. 18, the OLED pixel deposition apparatus 1000 includes a magnet plate 300 in which a magnet 310 is accommodated and a coolant line 350 is disposed, and an organic material source 600 from a lower portion of the magnet plate 300. And a deposition source supply unit (500) for supplying ().

A target substrate 900 such as glass on which the organic source 600 is deposited may be interposed between the magnet plate 300 and the source deposition unit 500. In the target substrate 900, the frame-integrated masks 100 and 200 (or FMMs) for allowing the organic material 600 to be deposited pixel by pixel may be closely attached or very close to each other. The magnet 310 may generate a magnetic field and may be in close contact with the target substrate 900 by the magnetic field.

The deposition source supply unit 500 may supply the organic source 600 while reciprocating the left and right paths, and the organic source 600 supplied from the deposition source supply unit 500 may have patterns P formed in the frame integrated masks 100 and 200. ) May be deposited on one side of the target substrate 900. The deposited organic source 600 passing through the pattern P of the frame-integrated masks 100 and 200 can act as the pixel 700 of the OLED.

In order to prevent non-uniform deposition of the pixel 700 by the shadow effect, the pattern of the frame-integrated masks 100 and 200 may be formed to be inclined S (or formed into a tapered shape S). . Since the organic sources 600 passing through the pattern in a diagonal direction along the inclined surface may also contribute to the formation of the pixel 700, the pixel 700 may be uniformly deposited as a whole.

Since the mask 100 is adhesively fixed to the frame 200 at a first temperature higher than the pixel deposition process temperature, even if the mask 100 is raised to the process temperature for pixel deposition, the position of the mask pattern P is hardly affected. The PPA between the 100 and the neighboring mask 100 may be maintained not to exceed 3 μm.

19 is a schematic diagram illustrating a state in which a template is loaded onto a frame after the temperature of the process region is raised according to the second embodiment of the present invention to correspond to a mask cell region of the frame. In FIG. 19, one mask 100 is corresponded / adhered to the cell region CR. However, the plurality of masks 100 may be simultaneously associated with all the cell regions CR. ) May be adhered to. In this case, a plurality of templates 50 supporting each of the plurality of masks 100 may be provided.

Next, referring to FIG. 19, after the temperature of the process region is raised (ET), the mask 100 may correspond to one mask cell region CR of the frame 200. The present invention is characterized in that no tension is applied to the mask 100 in a process corresponding to the mask cell region CR of the frame 200.

Since the mask cell sheet portion 220 of the frame 200 has a thin thickness, when the mask cell sheet portion 220 is bonded to the mask cell sheet portion 220 while the tensile force is applied to the mask 100, the tensile force remaining in the mask 100 is masked. The cell sheet 220 and the mask cell region CR may act on the cell sheet 220 and may be modified. Therefore, adhesion of the mask 100 to the mask cell sheet part 220 should be performed without applying a tensile force to the mask 100. Thus, it is possible to prevent the tensile force applied to the mask 100 from acting as a tension on the frame 200 to deform the frame 200 (or the mask cell sheet part 220).

However, there is one problem when the frame integrated mask is manufactured by attaching the mask 100 to the frame 200 (or the mask cell sheet 220) without applying a tensile force, and using the frame integrated mask in a pixel deposition process. May occur. In the pixel deposition process performed at about 25-45 ° C., the mask 100 thermally expands by a predetermined length. Even in the mask 100 made of Invar, the length may be changed by about 1 to 3 ppm according to a temperature rise of about 10 ° C. for forming the pixel deposition process atmosphere. For example, when the total length of the mask 100 is 500 mm, the length may be increased by about 5 to 15 μm. Then, a problem arises in that the alignment error of the patterns P is increased while causing the deformation of the mask 100 by its own weight or by being stretched and twisted in a fixed state in the frame 200.

Accordingly, the present invention according to the second embodiment is characterized in that it corresponds to the mask cell region CR of the frame 200 and adheres to the mask 100 without applying a tensile force at a temperature not higher than room temperature. . In the present specification, after raising the temperature of the process region to the first temperature (ET), the mask 100 is expressed to correspond to and adhere to the frame 200.

The “process area” may refer to a space in which components such as the mask 100 and the frame 200 are located and an adhesion process of the mask 100 is performed. The process region may be a space in a closed chamber or may be an open space. In addition, “first temperature” may mean a temperature higher than or equal to the pixel deposition process temperature when the frame-integrated mask is used in the OLED pixel deposition process. Considering that the pixel deposition process temperature is about 25 to 45 ° C, the first temperature may be about 25 ° C to 60 ° C. The temperature rise of the process region may be performed by providing a heating means in the chamber, or installing a heating means around the process region. In addition, "second temperature" may mean a temperature lower than the first temperature. Considering that the first temperature is about 25 ° C. to 60 ° C., the second temperature may be about 20 ° C. to 30 ° C. provided that it is lower than the first temperature, and preferably, the second temperature may be room temperature. The temperature drop in the process region may be performed by providing a cooling means in the chamber, installing a cooling means around the process region, naturally cooling to room temperature, or the like.

Referring again to FIG. 19, after the temperature ET of the process region including the frame 200 is raised to the first temperature, the mask 100 may correspond to the mask cell region CR. Alternatively, after the mask 100 corresponds to the mask cell region CR, the temperature of the process region including the frame 200 may be increased to the first temperature (ET).

By loading the template 50 onto the frame 200 (or the mask cell sheet unit 220), the mask 100 may correspond to the mask cell region CR.

Subsequently, the mask 100 may be irradiated with the laser L to bond the mask 100 to the frame 200 by laser welding. The correspondence and adhesion process may be performed in the same manner as in FIG. 15.

On the other hand, in the process of raising the temperature of the process region to the first temperature (ET) as described above and adhering to the frame 200 without applying a tensile force directly to the mask 100, the mask 100 and the frame 200 [ Alternatively, there is a point to consider depending on the difference in the coefficient of thermal expansion according to the material of the mask cell sheet portion 220].

20 is a schematic side cross-sectional view showing the bonding process of the frame according to the difference in the coefficient of thermal expansion of the mask. 20A to 20A illustrate a process of bonding the Invar mask 100 'generated by the electroplating process onto the mask cell sheet 220 (frame 200), and FIG. 20B1. ) to (b3) show a process of adhering the Invar mask 100 ″ produced by the rolling process onto the mask cell sheet portion 220 (frame 200).

Referring to FIG. 20A, an inva mask 100 ′ generated by the electroplating process is positioned on the mask cell sheet 220. The Invar mask 100 ′ produced by the electroplating process has a thermal expansion coefficient greater than about 3.0 × 10 ⁻⁶ / ° C. The mask cell sheet portion 220 formed of the invar sheet produced by the rolling process has a thermal expansion coefficient of about 1.0 × 10 ⁻⁶ / ° C.

Next, referring to FIG. 20A, the temperature of the process region may be increased (ET) to the first temperature. Since the coefficient of thermal expansion of the mask cell sheet 220 is smaller than that of the inva mask 100 ', a displacement of L1 occurs after the expansion / expansion, whereas the inva mask 100' has an L2 of three times larger than L1. Displacement may occur (L1 <L2). In this state, the inva mask 100 ′ may be welded to the mask cell sheet 220 to form a weld bead WB, thereby being integrally connected.

Next, referring to FIG. 20A, the temperature of the process region may be lowered to the second temperature LT. Since the coefficient of thermal expansion of the mask cell sheet 220 is smaller than that of the inva mask 100 ', the displacement of the L1 occurs after the contraction / compression and returns to its original size, whereas the inva mask 100' is about three times larger than the size of L1. Displacement by a large L2 occurs and can be returned to its original size. At this time, since the invar mask 100 ′ is contracted / compressed with a larger displacement in a state in which the invar mask 100 ′ is bonded to the mask cell sheet part 220 by welding, a tension TS is applied to the surrounding mask cell sheet part 220 by itself. Done. By applying a tension (TS) of the invar mask 100 ′, the invar mask 100 ′ may be adhered to the mask cell sheet 220 in a more taut state.

The case of the inva mask 100 "generated by the rolling process for comparison with the inva mask 100 'generated by the electroplating process will be described.

20 (b1), the invar mask 100 ″ produced by the rolling process is placed on the mask cell sheet portion 220. The inva mask 100 ″ produced by the rolling process has a thermal expansion coefficient of about 1.0 X 10 ^-6 / ℃ degree. The mask cell sheet portion 220 formed of the invar sheet produced by the rolling process has a thermal expansion coefficient of about 1.0 × 10 ⁻⁶ / ° C., similarly to the invar mask 100 ″.

Next, referring to FIG. 20B2, the temperature of the process region may be raised (ET) to the first temperature. Since the mask cell sheet portion 220 is stretched / expanded as much as L1, the inverse mask 100 " (L1 = L2) In this state, the Invar mask 100 "may be welded to the mask cell sheet 220 to form a weld bead WB, thereby being integrally connected.

Next, referring to FIG. 20B3, the temperature of the process region may be lowered to the second temperature LT. Since the mask cell sheet 220 and the inva mask 100 ″ have the same thermal expansion coefficient, the same displacement as L1 and L2 may occur after shrinking / compression, thereby returning to the original size. Mask cell sheet 220 Since the invar mask 100 "is contracted / compressed at the same displacement, the invar mask 100" does not apply tension to the surrounding mask cell sheet portion 220. Thus, the invar mask (generated by the rolling process) 100 "), the tension is not applied to the mask cell sheet portion 220, which may cause deflection due to the load, and thus an alignment error of the mask pattern P may occur. It is necessary to have a way to adhere to.

21 is a schematic side cross-sectional view showing a series of processes for adhering the mask 100 to the frame 200 according to the second embodiment of the present invention. FIG. 21 is a mask cell sheet portion 220 (frame 200) composed of an Invar sheet produced by a rolling process of an Invar mask 100 generated by a rolling process as shown in FIGS. 20B1 to 20B3. The process of adhering to. For reference, FIGS. 21A and 21B correspond to FIG. 19 (FIG. 23), FIG. 21C corresponds to FIG. 22, and FIG. 21D corresponds to FIG. 25. It can be understood to correspond to.

Referring to FIG. 21A, the template 50 on which the Invar mask 100 generated by the rolling process is adhesively supported is positioned on the mask cell sheet 220. The invar mask 100 and the template 50 are bonded to each other via the temporary adhesive part 55. The template 50 may have a larger coefficient of thermal expansion than the invar mask 100 generated by the rolling process. For example, the thermal expansion coefficient of the template 50 made of borosilicate glass (BOROFLOAT ^® 33) is about 3.0 X 10 ^-6 / ℃. The mask cell sheet portion 220 formed of the invar sheet produced by the rolling process has a thermal expansion coefficient of about 1.0 × 10 ⁻⁶ / ° C., similarly to the invar mask 100.

Next, referring to FIG. 21B, the temperature of the process region may be increased (ET) to the first temperature. The mask cell sheet unit 220 may be displaced by L1 after being stretched / expanded. The mask 100 must also be expanded / expanded by an inherent thermal expansion length to generate the same displacement as L1, but can be stretched / expanded much larger than this because it is bonded to the template 50. In other words, the template 50 having a coefficient of thermal expansion larger than that of the mask 100 generates a displacement of L2 larger than L1 (L1 <L2), and the mask 100 adhered to the template 50 is the template 50. The stretching / expansion force by this L2 can be applied like the tensile force. Thus, the mask 100 can be stretched at least larger than L1 and to the same or lesser extent than L2. In this state, the inva mask 100 may be welded to the mask cell sheet 220 to form a weld bead WB, thereby being integrally connected.

Next, referring to FIG. 21C, the template 50 may be debonded from the mask 100 while the temperature of the process region is maintained at the first temperature (ET). Separation of the mask 100 and the template 50 may be performed through at least one of heat application (EP), chemical treatment (CM), ultrasonic application (US), and UV application (UV) to the temporary adhesive part 55. have.

When the mask 100 is separated from the template 50, the mask 100 having a displacement by L2 larger than L1 may be further contracted / compressed to a degree corresponding to L1 since the tensile force applied by the template 50 is released. . In the meantime, the tension TS is applied to the surrounding mask cell sheet part 220 by itself.

Next, referring to FIG. 21D, the temperature of the process region may be lowered to the second temperature LT. In a state of applying its own tension TS, the mask 100 and the mask cell sheet unit 220 may each be thermally contracted to return to their original size.

22 is a schematic diagram illustrating a process of separating the mask 100 and the template 50 after attaching the mask 100 to the frame 200 according to an embodiment of the present invention.

Referring to FIG. 22, after the mask 100 is adhered to the frame 200, the mask 100 and the template 50 may be debonded. Separation of the mask 100 and the template 50 may be performed through at least one of heat application (EP), chemical treatment (CM), ultrasonic application (US), and UV application (UV) to the temporary adhesive part 55. have. Separation may be performed in the same manner as in FIG. 16.

FIG. 23 is a schematic diagram illustrating a state in which the mask 100 according to the second embodiment of the present invention corresponds to the cell region CR of the neighboring frame 200.

Referring to FIG. 23, the mask 100 may correspond to the mask cell region CR12 adjacent to the mask cell region CR11 to which the mask 100 is adhered. The temperature of the process region may be maintained in a state where the temperature is increased (ET) to the first temperature in FIG. 19.

The mask 100 may correspond to the mask cell region CR12 by loading the template 50 onto the frame 200 (or the mask cell sheet unit 220). The method of controlling the template 50 to correspond to the mask cell region CR12 by controlling the position of the template 50 is the same as the process of FIG. 19. On the other hand, the mask 100 may first correspond to a mask cell region CR other than the mask cell region CR12 adjacent to the mask cell region CR11.

Subsequently, the mask 100 may be irradiated with the laser L to bond the mask 100 to the frame 200 by laser welding.

24 is a schematic diagram illustrating a process of separating the mask 100 and the template 50 after attaching the mask 100 according to the second embodiment of the present invention to the cell region CR of the neighboring frame 200. .

Referring to FIG. 24, after the mask 100 is adhered to the frame 200, the mask 100 and the template 50 may be debonded. Separation of the mask 100 and the template 50 may be performed through at least one of heat application (EP), chemical treatment (CM), ultrasonic application (US), and UV application (UV) to the temporary adhesive part 55. have. Since the mask 100 remains attached to the frame 200, only the template 50 may be lifted. This is the same as described above in FIG.

25 is a schematic diagram illustrating a state in which a mask is adhered to a frame according to an embodiment of the present invention.

Next, referring to FIG. 25, the process of attaching and bonding the mask 100 to the remaining mask cell regions CR may be performed. All masks 100 may be adhered to the mask cell region CR of the frame 200.

Meanwhile, after the mask 100 is corresponded to and adhered to all the mask cell regions CR, the templates 50 adhered to the respective masks 100 may be separated at the same time.

FIG. 26 is a schematic diagram illustrating a process of lowering the temperature of the process region LT after attaching the mask 100 to the cell region CR of the frame 200 according to an exemplary embodiment.

Next, referring to FIG. 26, the temperature of the process region is lowered to the second temperature LT.

When the temperature of the process region is lowered to the second temperature LT, the mask 100 may heat shrink by a predetermined length. The mask 100 may be thermally contracted isotropically along all lateral directions. However, since the mask 100 is fixedly connected to the frame 200 (or the mask cell sheet part 220) by welding (W), the thermal contraction of the mask 100 may be performed on the peripheral mask cell sheet part 220. The tension TS is applied by itself. By applying a tension (TS) of the mask 100, the mask 100 may be more tightly bonded onto the frame 200.

As described above with reference to FIG. 21, due to the difference in thermal expansion coefficient between the mask 100 and the template 50, the tension TS may be applied even before the temperature of the process region is lowered to the second temperature (LT), and the temperature After lowering (LT) it may be further applied to the tension (TS) by thermal contraction.

In addition, since each of the masks 100 is bonded onto the corresponding mask cell region CR, the temperature of the process region is lowered to the second temperature (LT), so that all of the masks 100 cause thermal contraction at the same time. The problem that the 200 is deformed or the patterns P are large in alignment error can be prevented. In more detail, even when the tension TS is applied to the mask cell sheet part 220, since the plurality of masks 100 apply the tension TS in opposite directions, the force is canceled to the mask cell sheet part. Deformation does not occur at 220. For example, the first grid sheet portion 223 between the mask 100 attached to the CR11 cell region and the mask 100 attached to the CR12 cell region may move in the right direction of the mask 100 attached to the CR11 cell region. The tension TS acting and the tension TS acting in the left direction of the mask 100 attached to the CR12 cell region may be canceled. Therefore, the deformation is minimized in the frame 200 (or the mask cell sheet part 220) due to the tension TS, thereby minimizing the alignment error of the mask 100 (or the mask pattern P). There is this.

On the other hand, as described above with reference to Figs. 20 (b1) to (b3), in the method of controlling the temperature of the process region to the first and second temperatures, the mask cell is tensioned with the invar mask 100 " There is a problem in that it is difficult to adhere on the sheet portion 220. In addition, the method described above with reference to Fig. 21 uses an inva mask 100 " produced by a rolling process using a difference between the thermal expansion coefficients of the mask 100 and the template 50. ) Can be adhered on the mask cell sheet portion 220 in a taut state, but in order to raise the process region to the first temperature (ET) and to the second temperature (LT), heating that can be heated or cooled The hassle of having to have a device / cooling device arises. Further installation of these devices in the apparatus for manufacturing the frame-integrated mask requires consideration of interference with other equipment, and the problem of cost increase as devices are added. In addition, there is a problem that may adversely affect the thermal shock to other devices in the process of heating / cooling the process area.

Accordingly, the present invention according to the third embodiment of the present invention does not heat or cool the process region while simultaneously applying the mask 100 to the frame 200 without applying a tensile force directly to the mask 100. Proposes a method that can be firmly bonded to the frame 200.

27 to 28 are schematic views illustrating a process of bonding the mask 100 to the template 50 according to the third embodiment of the present invention.

The mask support template according to the third embodiment of the present invention is characterized in that the mask 100 is bonded onto the template 50 in a state in which a tensile force F is applied in the lateral direction.

Referring to FIG. 27, the apparatus 40 for manufacturing the mask metal film support template may include a main body 41, an upper block 42, a lower block 45, and a tensioning means 46.

The body 41 may provide a chamber space to which the mask 100 and the template 50 are bonded. The main body 41 may be connected to a vacuum forming means (not shown) such as a pump so that the chamber space may be a vacuum (VAC) environment.

The upper block 42 may be disposed above the chamber space. The upper block 42 may be connected to a lifting means (not shown) that may move up and down, and may be in contact with the lower block 45 when positioned at the lower limit. The template 50 may be fixed to the lower portion of the upper block 42.

The lower block 45 may be disposed under the chamber space so as to face the upper block 42. The lower block 45 may be in a fixed state, but may be connected to a lifting means (not shown) that can move up and down like the upper block 42. The mask 100 may be fixed to the upper portion of the lower block 45.

The tensioning means 46 on the lower block 45 may apply the tensile force F in the lateral direction by clamping the mask 100. The tension means 46 may clamp one or both sides of the mask 100. Upon application of the tension force F of the tension means 46, the mask 100 can be fixed on the lower block 45 in a state longer than the original length. In this case, the mask cell C portion and the dummy DM portion where the mask pattern P of the mask 100 is formed may be fixed to be aligned with the template 50.

Next, referring to FIG. 28A, the upper block 42 may descend. Alternatively, the upper block 42 and the lower block 45 may descend / raise each other. Accordingly, the template 50 fixed to the lower portion of the upper block 42 and the mask 100 fixed to the upper portion of the lower block 45 may contact each other.

The template 50 and the mask 100 may be bonded to each other by the temporary adhesive part 55. In this case, in order to prevent bubbles from entering between the template 50 and the mask 100, the chamber space is preferably maintained in a vacuum (VAC) atmosphere.

In the case of the liquid wax, the temporary adhesive part 55 compresses the upper block 42 and the lower block 45 while keeping the chamber space at a temperature of about 85 ° C. to about 100 ° C. to form the template 50 and the mask 100. Adhesion can be performed. In addition, according to an embodiment, the template 50 is baked at about 120 ° C. for 60 seconds to vaporize the solvent of the temporary adhesive part 55, and the upper block 42 and the lower block 45 may be removed. Compression may be performed to bond the template 50 and the mask 100.

The template 50 and the mask 100 may be bonded while the tensioning means 46 maintains applying tension force F to the side of the mask 100.

Since a free area that can be clamped on the side of the mask 100 is required, the mask 100 may have a larger area than the template 50. After the mask 100 is adhered to the template 50, a portion (dummy DM portion) of the mask 100 protruding out of the template 50 may be cut.

Then, the mask support template can be manufactured as shown in FIG. 28 (b). The mask support template to which the template 50 and the mask 100 are bonded can be taken out from the main body 41. Since the template 50 is adhesively fixed while the tensile force F is applied to the mask 100, even if the tension means 46 releases the clamping, the mask 100 retains the tensile force IT in itself. It may be adhesively fixed on the template 50. This residual tensile force IT may be maintained until the mask 100 is separated from the template 50.

19 is a schematic diagram illustrating a state in which the template 100 is loaded on the frame 200 and the mask 100 corresponds to the cell region CR of the frame 200 according to the third embodiment of the present invention. In FIG. 19, one mask 100 is corresponded / adhered to the cell region CR. However, the plurality of masks 100 may be simultaneously associated with all the cell regions CR. ) May be adhered to. In this case, a plurality of templates 50 supporting each of the plurality of masks 100 may be provided.

Next, referring to FIG. 19, the mask 100 may correspond to one mask cell region CR of the frame 200.

Subsequently, the mask 100 may be irradiated with the laser L to bond the mask 100 to the frame 200 by laser welding. The correspondence and adhesion process may be performed in the same manner as in FIG. 15.

30 is a schematic diagram illustrating a process of separating the mask 100 and the template 50 after attaching the mask 100 according to the third embodiment of the present invention to the frame 200.

Referring to FIG. 30, after the mask 100 is adhered to the frame 200, the mask 100 and the template 50 may be debonded. Separation of the mask 100 and the template 50 may be performed through at least one of heat application (ET), chemical treatment (CM), ultrasonic application (US), and UV application (UV) to the temporary adhesive part 55. have. Since the mask 100 remains attached to the frame 200, only the template 50 may be lifted. Separation may be performed in the same manner as in FIG. 16.

When the template 50 is separated from the mask 100, the mask 100 may shrink in a predetermined amount in a state in which the mask 100 is adhered to the frame 200 (mask cell sheet portion 220). As described above with reference to FIG. 28B, when the template 50 is separated while the tensile force IT is retained in the mask 100 itself, the mask 100 contracts while returning to a unique length. Accordingly, by applying a tension TS to the frame 200 (mask cell sheet portion 220), the mask 100 may be adhered in a taut state.

31 is a schematic diagram showing a state in which the mask 100 according to the third embodiment of the present invention is adhered to the frame 200. In FIG. 31, all masks 100 are attached to the cell region CR of the frame 200. The template 50 may be separated after adhering the masks 100 one by one, but all the templates 50 may be separated after adhering all the masks 100.

When each of the masks 100 is adhered to the corresponding mask cell region CR and then the template 50 and the masks 100 are separated, the plurality of masks 100 are contracted in opposite directions to each other. ), The force is canceled so that deformation does not occur in the mask cell sheet portion 220. For example, the first grid sheet portion 223 between the mask 100 attached to the CR11 cell region and the mask 100 attached to the CR12 cell region may move in the right direction of the mask 100 attached to the CR11 cell region. The tension TS acting and the tension TS acting in the left direction of the mask 100 attached to the CR12 cell region may be canceled. Therefore, the deformation is minimized in the frame 200 (or the mask cell sheet part 220) due to the tension TS, thereby minimizing the alignment error of the mask 100 (or the mask pattern P). There is this.

Although the present invention has been shown and described with reference to preferred embodiments as described above, it is not limited to the above embodiments and various modifications made by those skilled in the art without departing from the spirit of the present invention. Modifications and variations are possible. Such modifications and variations are intended to fall within the scope of the invention and the appended claims.

40: apparatus for manufacturing mask metal film support template
41: main body
42: upper block
45; Lower block
46: tensioning means
50: template
51: laser through hole
55: temporary adhesive
70: lower support
100: mask
100 ': Mask generated by electroplating process
100 ": mask created by rolling process
110: mask film, mask metal film
200: frame
210: border frame portion
220: mask cell sheet portion
221: border sheet portion
223: first grid sheet portion
225: second grid sheet portion
1000: OLED pixel deposition device
C: cell, mask cell
CM: chemical treatment
CR: mask cell area
DM: Dummy, Mask Dummy
ET: raise the temperature of the process region to the first temperature
EP: Heat Is
L: laser
LT: lower the temperature in the process area to the second temperature
R: Hollow area of the border frame portion
P: mask pattern
US: Ultrasound
UV: UV is applied
W: welding
WB: welding bead
WP: weld

Claims (34)

A method of manufacturing a template that supports an OLED pixel forming mask and corresponds to a frame,
(a) preparing a mask on which a plurality of mask patterns are formed;
(b) preparing a template having a temporary adhesive portion formed on one surface thereof; And
(c) attaching the mask on the template
Including,
The manufacturing method of the mask support template in which the through hole through which welding energy passes is formed in the part of the template corresponding to the welding part of a mask. The method of claim 1,
The mask comprises a sheet of metal produced by a rolling process, the template having a higher coefficient of thermal expansion than the mask. The method of claim 2,
The template comprises a material having a coefficient of thermal expansion of 2.0 × 10 ⁻⁶ / ° C. to 20.0 × 10 ⁻⁶ / ° C. The method of claim 1,
and in step (c), the mask is adhered on the template with tension applied in the lateral direction. The method of claim 4, wherein
The mask comprises a sheet of metal produced by a rolling or electroforming process. The method of claim 1,
The thickness of the mask is 5 mu m to 20 mu m. The method of claim 1,
The temporary adhesive portion is a method of manufacturing a mask support template, which is an adhesive or adhesive sheet that can be separated by applying heat, an adhesive or adhesive sheet that can be separated by UV irradiation. The method of claim 7, wherein
The temporary adhesive is a liquid wax or thermal release tape. The method of claim 1,
Templates include wafers, glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), borosilicate glass, zirconia, soda-lime glass ), A method of manufacturing a mask support template comprising a material of any one of low-iron glass. delete The method of claim 4, wherein
(c) step,
(c1) fixing the template having the temporary adhesive portion formed on one surface thereof to the upper block;
(c2) fixing at least one side of the mask to the lower block in a tensioned state; And
(c3) bonding the mask and the template by pressing the upper block and the lower block;
Comprising a mask support template. The method of claim 4, wherein
(c) step is carried out in a vacuum atmosphere. The method of claim 11,
after step (c3), the portion of the mask metal film protruding out of the template is cut. A method of manufacturing a frame-integrated mask in which a plurality of masks and a frame supporting the mask are integrally formed,
(a) preparing a mask on which a plurality of mask patterns are formed;
(b) preparing a template having a temporary adhesive portion formed on one surface thereof; And
(c) attaching a mask on the template to produce a mask support template;
(d) providing a frame having at least one mask cell area;
(e) loading the template onto the frame to correspond to the mask cell area of the frame; And
(f) irradiating a laser to the weld of the mask to bond the mask to the frame
Including,
In step (f), the welding energy irradiated from the upper part of the template passes through the through hole and is irradiated to the welding part of the mask. The method of claim 14,
The mask is composed of a sheet of metal produced by a rolling process, the template is a method of manufacturing a frame-integrated mask, the coefficient of thermal expansion than the mask. The method of claim 15,
The template comprises a material having a coefficient of thermal expansion of 2.0 X 10 ^-6 / ° C to 20.0 X 10 ^-6 / ° C. The method of claim 15,
between steps (d) and (e),
(d-2) raising the temperature of the process region containing the frame to the first temperature;
More,
between steps (e) and (f),
(g) lowering the temperature of the process region containing the frame to a second temperature;
Further comprising a frame-integrated mask manufacturing method. The method of claim 17,
between steps (f) and (g),
(f-2) repeating steps (e) to (f) to attach the mask to all the mask cell regions of the frame;
Further comprising a frame-integrated mask manufacturing method. The method of claim 14,
The temporary bonding portion is an adhesive or adhesive sheet that can be separated by applying heat, and an adhesive or adhesive sheet that can be separated by UV irradiation. The method of claim 19,
The temporary adhesive portion is a liquid wax or thermal release tape. delete The method of claim 17,
The first temperature is the same or higher than the OLED pixel deposition process temperature,
And wherein the second temperature is a temperature at least lower than the first temperature. The method of claim 22,
The first temperature is any one of 25 ℃ to 60 ℃,
The second temperature is any one of 20 ° C to 30 ° C lower than the first temperature,
OLED pixel deposition process temperature is any one of 25 ℃ to 45 ℃ manufacturing method of the frame-integrated mask. The method of claim 17,
The method of manufacturing a frame-integrated mask, in (d-2), wherein the mask extends larger than the inherent thermal expansion length. The method of claim 24,
And wherein the mask extends less than or equal to the thermal expansion length of the template. The method of claim 14,
In step (e), the mask on the template corresponds to the mask cell region only by position control of the template without applying tension to the mask. The method of claim 17,
When the temperature of the process region is lowered to the second temperature in step (g), the mask adhered to the frame is contracted so that a tension is applied. The method of claim 17,
separating the mask from the template by performing at least one of heat application, chemical treatment, ultrasonic application, and UV application to the temporary bonding portion between (f) and (g).
Further comprising a frame-integrated mask manufacturing method. The method of claim 14,
and in step (c), the mask is bonded onto the template with tension applied in the lateral direction. The method of claim 29,
The mask comprises a sheet of metal produced by a rolling or electroforming process. The method of claim 29,
After the step (e), the mask and the template are separated by performing at least one of heat application, chemical treatment, ultrasonic application, and UV application to the temporary bonding portion.
Further comprising a frame-integrated mask manufacturing method. The method of claim 31, wherein
When the template is separated from the mask, a tensile force applied to the mask is applied to the frame. The method of claim 14,
The frame is
An edge frame portion including a hollow region; And
Mask cell sheet portion connected to the edge frame portion and having a plurality of mask cell regions
Including,
The mask cell sheet part,
Border sheet portion;
At least one first grid sheet portion extending in a first direction and connected at both ends to the edge sheet portion; And
At least one second grid sheet portion extending in a second direction perpendicular to the first direction and intersecting the first grid sheet portion, and both ends connected to the edge sheet portion;
Including, a frame-integrated mask manufacturing method. The method of claim 14,
The mask and frame are made of any one of invar, super invar, nickel, nickel-cobalt, the manufacturing method of the frame-integrated mask.

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