KR102152687B1 - Producing device of mask integrated frame - Google Patents

Abstract

The present invention relates to an apparatus for manufacturing a frame-integrated mask. The apparatus 10 for manufacturing a frame-integrated mask according to the present invention includes a grip unit for gripping the stage unit 20 on which the frame 200 is seated and supported, and the template 50 on which the mask 100 is adhered and supported ( 30), the grip moving part 40 moving the grip part 30 in at least one of the X, Y, Z, and θ axes, a laser is irradiated to the welding part of the mask 100, and the mask 100 is aligned A head unit 60 for sensing a state, and a head moving unit 70 for moving the head unit 60 in at least one of X, Y, and Z axes, and the grip unit 30 includes a template 50 ) It is characterized in that gripping by adsorbing at least a portion of the upper surface.

Description

Frame-integrated mask manufacturing device {PRODUCING DEVICE OF MASK INTEGRATED FRAME}

The present invention relates to an apparatus for manufacturing a frame-integrated mask. In more detail, it is possible to stably support and move without deformation of the mask, make the mask integral with the frame, and make the alignment between the masks clear. About.

As a technology for forming pixels in the OLED manufacturing process, the Fine Metal Mask (FMM) method is mainly used in which an organic material is deposited at a desired location by attaching a thin metal mask to a substrate.

In the existing OLED manufacturing process, the mask is manufactured in the form of a stick or plate, and then the mask is welded and fixed to the OLED pixel deposition frame. One mask may include several cells corresponding to one display. In addition, in order to manufacture a large area OLED, several masks can be fixed to the OLED pixel deposition frame. In the process of fixing to the frame, each mask is stretched so that it is flat. It is a very difficult task to adjust the tension so that the entire part of the mask is flat. In particular, in order to align a mask pattern with a size of only a few to tens of μm while making all the cells flat, a high level of work is required to check the alignment in real time while finely adjusting the tension applied to each side of the mask. do.

Nevertheless, in the process of fixing several masks to one frame, there is a problem in that the alignment between the masks and the mask cells is not good. In addition, in the process of welding and fixing the mask to the frame, the thickness of the mask film is too thin and large area, so the mask is struck or distorted by the load, and wrinkles and burrs occur in the welding part during the welding process. There were problems such as misalignment.

In the case of ultra-high-definition OLED, the current QHD quality is 500-600 PPI (pixel per inch), and the pixel size reaches about 30-50㎛, and 4K UHD, 8K UHD high-definition is higher than this, ~860 PPI, ~1600 PPI, etc. Will have a resolution of. In this way, in consideration of the pixel size of the ultra-high-definition OLED, the alignment error between cells should be reduced to about several µm, and the error beyond this leads to product failure, so the yield may be very low. Therefore, there is a need to develop a technique for preventing deformation such as a mask being struck or distorted, a technique for clarifying alignment, a technique for fixing a mask to a frame, and the like.

Accordingly, the present invention has been devised to solve the problems of the prior art as described above, and an object thereof is to provide an apparatus for manufacturing a frame-integrated mask in which a mask and a frame can be integrated.

In addition, an object of the present invention is to provide an apparatus for manufacturing a frame-integrated mask that can prevent deformation, such as being struck or warped, and clear alignment.

Further, it is an object of the present invention to provide an apparatus for manufacturing a frame-integrated mask in which manufacturing time is remarkably reduced and the yield is remarkably increased.

In addition, it is an object of the present invention to provide an apparatus for manufacturing a frame-integrated mask capable of stably supporting and moving a mask without deformation.

An object of the present invention is an apparatus for manufacturing a frame-integrated mask, comprising: a stage portion on which a frame is seated and supported; A grip portion for gripping the template on which the mask is adhered and supported; A grip moving part for moving the grip part in at least one of X, Y, Z, and θ axes; A head unit that irradiates a laser to the welding portion of the mask and senses an alignment state of the mask; And a head moving part that moves the head part in at least one of the X, Y, and Z axes, and the grip part grips by adsorbing at least a part of the upper surface of the template, and the stage part generates suction pressure in the lower part of the frame. This is achieved by an apparatus for manufacturing a frame-integrated mask, further comprising a lower support unit.

The stage unit may include a frame alignment unit that aligns the positions of the frames.

The stage unit may include a heating unit that applies heat to the frame.

The head unit may include a laser unit that irradiates a laser to the mask and welds it to the frame, or laser trims the mask by irradiating the laser.

A pair of laser units are arranged to be spaced apart from each other, and each laser unit may irradiate a laser with a welding portion of one side and the other side of the mask, respectively.

The frame includes: a frame frame portion including a hollow area; A plurality of mask cell regions may be provided, and may include a mask cell sheet part connected to the frame frame part.

The frame may include a plurality of mask cell regions along at least one of a first direction and a second direction perpendicular to the first direction.

A plurality of adsorption holes may be formed in portions spaced apart by a predetermined distance from the edge of the mask cell sheet portion in which the mask cell region exists.

At least one vacuum flow path of the lower support unit is formed, and the vacuum flow path may transmit the suction pressure generated by the external suction pressure generating means to the suction hole.

According to the present invention configured as described above, there is an effect that the mask and the frame can form an integral structure.

In addition, according to the present invention, there is an effect of preventing deformation, such as being struck or distorted, of the mask, and enabling clear alignment.

Further, according to the present invention, there is an effect of remarkably reducing the manufacturing time and increasing the yield remarkably.

In addition, according to the present invention, there is an effect that the mask can be stably supported and moved without deformation.

1 and 2 are schematic diagrams showing a process of attaching a conventional mask to a frame.
3 is a schematic diagram showing that an alignment error between cells occurs in a process of tensioning a conventional mask.
4 is a front view and a side cross-sectional view showing a frame-integrated mask according to an embodiment of the present invention.
5 is a front view and a side cross-sectional view showing a frame according to an embodiment of the present invention.
6 is a schematic diagram showing a manufacturing process of a frame according to an embodiment of the present invention.
7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention.
8 and 9 are a schematic plan view and a schematic front view showing an apparatus for manufacturing a frame-integrated mask according to an embodiment of the present invention.
10 is a partially enlarged schematic diagram of an apparatus for manufacturing a frame-integrated mask according to an embodiment of the present invention.
11 to 12 are schematic diagrams illustrating a process of manufacturing a mask supporting template by attaching a mask metal film on a template according to an embodiment of the present invention and forming a mask.
13 is an enlarged cross-sectional schematic view showing a temporary bonding unit according to an embodiment of the present invention.
14 is a schematic diagram illustrating a process of loading a mask supporting template onto a frame according to an embodiment of the present invention.
15 is a schematic diagram illustrating a state in which a template is loaded onto a frame and a mask is associated with a cell area of the frame according to an embodiment of the present invention.
16 is a schematic diagram illustrating a process of attaching a mask to a frame according to an embodiment of the present invention.
17 is a schematic diagram showing a state in which an adsorption force is applied to a mask through an adsorption hole according to an embodiment of the present invention.
18 is a schematic diagram illustrating a process of separating a mask and a template after attaching a mask to a frame according to an embodiment of the present invention.
19 is a schematic diagram showing a state in which a mask according to an exemplary embodiment is adhered to a frame.
20 is a schematic diagram showing an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION The detailed description of the present invention to be described later refers to the accompanying drawings, which illustrate specific embodiments in which the present invention may be practiced. These embodiments are described in detail sufficient to enable a person skilled in the art to practice the present invention. It is to be understood that the various embodiments of the present invention are different from each other, but need not be mutually exclusive. For example, specific shapes, structures, and characteristics described herein may be implemented in other embodiments without departing from the spirit and scope of the present invention in relation to one embodiment. In addition, it is to be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the present invention. Accordingly, the detailed description to be described below is not intended to be taken in a limiting sense, and the scope of the present invention, if properly described, is limited only by the appended claims, along with all scopes equivalent to those claimed by the claims. In the drawings, similar reference numerals refer to the same or similar functions over several aspects, and the length, area, thickness, and the like may be exaggerated and expressed for convenience.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to enable those of ordinary skill in the art to easily implement the present invention.

1 and 2 are schematic diagrams showing a process of bonding a conventional mask 1 to a frame 2. 3 is a schematic diagram showing that an alignment error occurs between cells C1 to C3 in the process of stretching the conventional mask 1 (F1 to F2).

Referring to FIG. 1, a conventional mask 1 may be manufactured in a stick-type or plate-type. The mask 1 shown in FIG. 1 is a stick-type mask and can be used by welding and fixing both sides of the stick to the OLED pixel deposition frame 2.

A plurality of display cells C are provided on the body of the mask 1 (or the mask film 1a). One cell C corresponds to one display such as a smartphone. A pixel pattern P is formed in the cell C to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B appear. For example, a pixel pattern P is formed in the cell C to have a resolution of 70 X 140. That is, a number of pixel patterns P are clustered to form one cell C, and a plurality of cells C may be formed on the mask 1. Hereinafter, a stick mask 1 including six cells C: C1 to C6 will be described as an example.

Referring to FIGS. 1A, 2A and 2B, first, the stick mask 1 must be flattened. A pair of clampers 3 facing each other with the frame 2 interposed therebetween clamps both sides of the mask 1 and applies a tensile force (F1 to F2) in the long axis direction of the mask 1 to prevent pulling. Accordingly, the mask 1 is unfolded. Then, the clamper 3 moves to a position corresponding to the frame 2 along the y-axis moving rail 4 occupying the outside of the frame 2. The cells C1 to C6 of the mask 1 are located in an empty area inside the frame of the frame 2. The frame 2 may have a size such that cells C1 to C6 of one stick mask 1 are located in an empty area inside the frame, and the cells C1 to C6 of a plurality of stick masks 1 are It may be large enough to be located in an internal empty area.

Next, referring to (c) of FIG. 2, a pair of clampers 3 descend along the Z-axis moving rail 5 to pull the mask 1 on the frame 2 in the form of a square frame. Load the mask (1). The cells C1 to C6 of the mask 1 are located in an empty area inside the frame of the frame 2. The frame 2 may have a size such that cells C1 to C6 of one mask 1 are located in an empty area inside the frame, and cells C1 to C6 of a plurality of masks 1 are empty inside the frame. It may be large enough to be located in the area.

Next, referring to Figures 1(b) and 2(d), after aligning while finely adjusting the tensile force (F1 to F2) applied to each side of the mask 1, the side of the mask 1 A part of the mask 1 and the frame 2 are interconnected by welding (W) with a laser (L) or the like. Then, the clamper 3 releases the clamping of the mask 1. 1C shows a cross-sectional side view of a mask 1 and a frame 2 connected to each other.

Referring to FIG. 3, although the tensile forces F1 to F2 applied to each side of the stick mask 1 are finely adjusted, there is a problem that the mask cells C1 to C3 are not well aligned with each other. For example, the distances D1 to D1" and D2 to D2" between the patterns P of the cells C1 to C3 are different from each other, or the patterns P are skewed. Since the stick mask 1 has a large area including a plurality (for example, 6) of cells C1 to C6 and has a very thin thickness of several tens of µm, it is easily struck or distorted by a load. In addition, it is a very difficult task to check the alignment between each cell (C1 to C6) in real time through a microscope while adjusting the tensile force (F1 to F2) to flatten all of the cells (C1 to C6).

Therefore, a minute error in the tensile force (F1 to F2) may cause an error in the extent to which each cell (C1 to C3) of the stick mask (1) is stretched or unfolded, and accordingly, the distance (D1) between the mask patterns (P) ~D1", D2 ~ D2") causes a problem that becomes different. Of course, it is difficult to completely align the error to be 0, but in order to prevent the mask pattern (P) having a size of several to tens of µm from adversely affecting the pixel process of an ultra-high-definition OLED, the alignment error should not exceed 3 µm. It is desirable not to. This alignment error between adjacent cells is referred to as PPA (pixel position accuracy).

In addition, a plurality of stick masks (1) of about 6 to 20 are connected to one frame (2), respectively, between a plurality of stick masks (1), and a plurality of cells (C) of the stick mask (1). It is also a very difficult task to clarify the alignment state between ~C6), and the process time according to the alignment is inevitably increased, which is a significant reason for reducing productivity.

On the other hand, after the stick mask 1 is connected and fixed to the frame 2, the tensile forces F1 to F2 applied to the stick mask 1 may act in reverse to the frame 2. That is, after the stick mask 1, which was stretched by the tensile forces F1 to F2, is connected to the frame 2, a tension may be applied to the frame 2. Usually, this tension is not so large that it may not have a large effect on the frame 2, but when the size of the frame 2 is reduced in size and the rigidity is lowered, this tension may finely deform the frame 2. As a result, there may be a problem of misalignment between the plurality of cells C to C6.

Accordingly, the present invention proposes a frame-integrated mask that enables the mask 100 to form an integrated structure with the frame 200 and an apparatus for manufacturing the same. The mask 100 integrally formed in the frame 200 is prevented from being struck or warped, and may be clearly aligned with the frame 200. Since no tensile force is applied to the mask 100 when the mask 100 is connected to the frame 200, the frame 200 may not be deformed after the mask 100 is connected to the frame 200. . In addition, the manufacturing time for integrally connecting the mask 100 to the frame 200 can be significantly reduced, and the yield can be remarkably increased.

Figure 4 is a front view [Fig. 4 (a)] and a side cross-sectional view [Fig. 4 (b)] showing a frame-integrated mask according to an embodiment of the present invention, Figure 5 is according to an embodiment of the present invention It is a front view [FIG. 5(a)] and a side cross-sectional view [FIG. 5(b)] showing the frame.

4 and 5, the frame-integrated mask may include a plurality of masks 100 and one frame 200. In other words, a plurality of masks 100 are adhered to the frame 200, one by one. Hereinafter, for convenience of explanation, a rectangular mask 100 is used as an example, but the mask 100 may be in the form of a stick mask having protrusions clamped on both sides before being adhered to the frame 200, and the frame 200 ) After being adhered to, the protrusion can be removed.

A plurality of mask patterns P may be formed on each mask 100, and one cell C may be formed on one mask 100. One mask cell C may correspond to one display such as a smartphone.

Mask 100 may be a coefficient of thermal expansion of about 1.0 X 10 ^-6 / ℃ of invar (invar), about 1.0 X 10 ^-7 / ℃ Super Invar (super invar) material. Since the mask 100 made of this material has a very low coefficient of thermal expansion, it is less likely that the pattern shape of the mask is deformed by thermal energy, and thus can be used as a Fine Metal Mask (FMM) or a shadow mask in high-resolution OLED manufacturing. In addition, considering the recent development of technologies for performing the pixel deposition process in a range where the temperature change value is not large, the mask 100 is made of nickel (Ni) and nickel-cobalt (Ni-Co) having a slightly larger coefficient of thermal expansion than this. ), etc. The mask 100 may be formed of a metal sheet produced by a rolling process or electroforming.

The frame 200 is formed to adhere a plurality of masks 100. The frame 200 may include several corners formed in a first direction (eg, horizontal direction) and a second direction (eg, vertical direction) including an outermost edge. These various corners may partition a region on the frame 200 to which the mask 100 will be adhered.

The frame 200 may include a frame portion 210 having a substantially square shape or a square frame shape. The inside of the frame frame 210 may have a hollow shape. That is, the frame frame unit 210 may include a hollow region R. The frame 200 may be made of metal materials such as Invar, Super Invar, aluminum, titanium, etc., and in consideration of thermal deformation, it is composed of materials such as Invar, Super Invar, nickel, nickel-cobalt, etc., which have the same coefficient of thermal expansion as the mask. Preferably, these materials may be applied to both the frame part 210 and the mask cell sheet part 220 which are components of the frame 200.

In addition, the frame 200 may include a plurality of mask cell regions CR, and may include a mask cell sheet part 220 connected to the frame frame part 210. Like the mask 100, the mask cell sheet part 220 may be formed by rolling, or may be formed using another film forming process such as electroplating. In addition, the mask cell sheet part 220 may form a plurality of mask cell regions CR on a planar sheet through laser scribing, etching, or the like, and then connect to the frame frame part 210. Alternatively, the mask cell sheet part 220 may form a plurality of mask cell regions CR through laser scribing, etching, or the like after connecting the planar sheet to the frame frame part 210. In the present specification, it is assumed that a plurality of mask cell regions CR are first formed in the mask cell sheet part 220 and then connected to the frame frame part 210.

The mask cell sheet part 220 may be configured to include at least one of an edge sheet part 221 and first and second grid sheet parts 223 and 225. The frame sheet portion 221 and the first and second grid sheet portions 223 and 225 refer to respective portions partitioned in the same sheet, and they are integrally formed with each other.

The frame sheet part 221 may be substantially connected to the frame frame part 210. Accordingly, the frame sheet part 221 may have a substantially square shape and a square frame shape corresponding to the frame frame part 210.

In addition, the first grid sheet portion 223 may be formed to extend in a first direction (horizontal direction). The first grid sheet portion 223 may be formed in a linear shape so that both ends may be connected to the edge sheet portion 221. When the mask cell sheet portion 220 includes a plurality of first grid sheet portions 223, it is preferable that each of the first grid sheet portions 223 form equal intervals.

Further, in addition to this, the second grid sheet portion 225 may be formed to extend in a second direction (vertical direction). The second grid sheet portion 225 may be formed in a linear shape so that both ends may be connected to the edge sheet portion 221. The first grid sheet portion 223 and the second grid sheet portion 225 may vertically cross each other. When the mask cell sheet portion 220 includes a plurality of second grid sheet portions 225, each of the second grid sheet portions 225 is preferably formed at an equal interval.

Meanwhile, the spacing between the first grid sheet parts 223 and the spacing between the second grid sheet parts 225 may be the same or different according to the size of the mask cell C.

The first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, but the shape of a cross section perpendicular to the length direction may be a rectangle, a square shape such as a parallelogram, a triangle shape, etc. , Sides, and corners may be partially rounded. The cross-sectional shape can be adjusted in the process of laser scribing and etching.

The thickness of the frame frame part 210 may be thicker than the thickness of the mask cell sheet part 220. Since the frame frame portion 210 is responsible for the overall rigidity of the frame 200, it may be formed to a thickness of several mm to several cm.

In the case of the mask cell sheet part 220, it is difficult to manufacture a substantially thick sheet, and if it is too thick, the organic material source 600 (see FIG. 20) passes through the mask 100 in the OLED pixel deposition process. It can cause clogging problems. Conversely, if the thickness is too thin, it may be difficult to secure enough rigidity to support the mask 100. Accordingly, the mask cell sheet portion 220 is thinner than the thickness of the frame frame portion 210, but is preferably thicker than the mask 100. The thickness of the mask cell sheet part 220 may be about 0.1 mm to 1 mm. In addition, the first and second grid sheet portions 223 and 225 may have a width of about 1 to 5 mm.

A plurality of mask cell areas CR (CR11 to CR56) may be provided except for the area occupied by the edge sheet portion 221 and the first and second grid sheet portions 223 and 225 in a flat sheet. In another aspect, the mask cell area CR is an area occupied by the frame sheet part 221 and the first and second grid sheet parts 223 and 225 in the hollow area R of the frame frame part 210. Except for, it may mean an empty area.

As the cell C of the mask 100 corresponds to the mask cell region CR, it can be used as a passage through which the pixel of the OLED is deposited substantially through the mask pattern P. As described above, one mask cell C corresponds to one display such as a smartphone. Mask patterns P constituting one cell C may be formed on one mask 100. Alternatively, one mask 100 may include a plurality of cells C, and each cell C may correspond to each cell area CR of the frame 200, but clear alignment of the mask 100 is achieved. In order to do so, it is necessary to avoid the large-area mask 100, and a small-area mask 100 having one cell C is preferable. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell area CR of the frame 200. In this case, for clear alignment, it may be considered to correspond to the mask 100 having a small number of cells C of about 2-3.

The frame 200 includes a plurality of mask cell regions CR, and each of the masks 100 may be adhered so that one mask cell C corresponds to the mask cell region CR. Each mask 100 may include a mask cell C having a plurality of mask patterns P formed thereon, and a dummy around the mask cell C (corresponding to a portion of the mask layer 110 excluding the cell C). have. The dummy may include only the mask layer 110 or may include the mask layer 110 in which a predetermined dummy pattern similar to the mask pattern P is formed. The mask cell C corresponds to the mask cell area CR of the frame 200, and part or all of the dummy may be adhered to the frame 200 (mask cell sheet part 220 ). Accordingly, the mask 100 and the frame 200 can form an integral structure.

On the other hand, according to another embodiment, the frame is not manufactured by bonding the mask cell sheet part 220 to the frame frame part 210, but the frame frame part 210 is formed in the hollow region R part of the frame frame part 210. ) And an integral grid frame (corresponding to the grid seat portions 223 and 225) may be directly formed. This type of frame also includes at least one mask cell area CR, and a frame-integrated mask can be manufactured by matching the mask 100 to the mask cell area CR.

Hereinafter, a process of manufacturing a frame-integrated mask will be described.

First, the frame 200 described above in FIGS. 4 and 5 may be provided. 6 is a schematic diagram showing a manufacturing process of the frame 200 according to an embodiment of the present invention.

Referring to FIG. 6A, a frame frame part 210 is provided. The frame frame part 210 may have a rectangular frame shape including a hollow region R.

Next, referring to FIG. 6B, a mask cell sheet part 220 is manufactured. The mask cell sheet part 220 is manufactured by manufacturing a flat sheet using rolling, electroplating, or other film forming processes, and then removing the mask cell area CR through laser scribing or etching. can do. In this specification, an example in which a 6 X 5 mask cell region (CR: CR11 to CR56) is formed will be described. Five first grid sheet portions 223 and four second grid sheet portions 225 may be present.

Next, the mask cell sheet part 220 may correspond to the frame frame part 210. In the process of correspondence, all sides of the mask cell sheet part 220 are stretched (F1 to F4) to flatten the mask cell sheet part 220 and the frame sheet part 221 is attached to the frame frame part 210. Can respond. In one side, it is possible to hold the mask cell sheet portion 220 at several points (for example, 1 to 3 points in FIG. 6 (b)) and stretch it. On the other hand, the mask cell sheet portion 220 may be stretched (F1, F2) along some side directions instead of all sides.

Next, if the mask cell sheet part 220 corresponds to the frame frame part 210, the frame sheet part 221 of the mask cell sheet part 220 may be welded (W) to be bonded. It is preferable to weld (W) all sides so that the mask cell sheet part 220 can be firmly adhered to the frame frame part 220. Welding (W) should be performed as close as possible to the edge of the frame frame part 210 to reduce the excitement space between the frame part 210 and the mask cell sheet part 220 and increase adhesion. The welding (W) part may be created in a line or spot shape, and the frame frame part 210 and the mask cell sheet part 220 are integrally made of the same material as the mask cell sheet part 220. It can be a medium to connect with.

7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention. In the embodiment of FIG. 6, the mask cell sheet part 220 having the mask cell area CR is first manufactured and adhered to the frame frame part 210. However, in the embodiment of FIG. After bonding to 210), a mask cell area CR is formed.

First, as shown in (a) of FIG. 6, a frame part 210 including a hollow region R is provided.

Next, referring to FIG. 7A, a flat sheet (a flat mask cell sheet 220 ′) may correspond to the frame frame 210. The mask cell sheet part 220 ′ is in a planar state in which the mask cell area CR has not yet been formed. In the matching process, all sides of the mask cell sheet part 220 ′ are stretched (F1 to F4) to correspond to the frame frame part 210 with the mask cell sheet part 220 ′ flattened. One side can also hold the mask cell sheet portion 220 ′ at several points (eg, 1 to 3 points in FIG. 7 (a)) and tension. On the other hand, the mask cell sheet portion 220 ′ may be stretched (F1, F2) along some side directions instead of all sides.

Next, if the mask cell sheet part 220 ′ corresponds to the frame frame part 210, the rim part of the mask cell sheet part 220 ′ may be welded (W) to be bonded. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 ′ can be firmly adhered to the frame frame portion 220. Welding (W) should be performed as close as possible to the edge of the frame frame part 210 to reduce the excitement space between the frame part 210 and the mask cell sheet part 220 ′ and increase adhesion. The welding (W) portion may be generated in a line or spot shape, and has the same material as the mask cell sheet portion 220 ′, and the frame frame portion 210 and the mask cell sheet portion 220 ′ It can be a medium that connects all together.

Next, referring to FIG. 7B, a mask cell region CR is formed on a planar sheet (a planar mask cell sheet portion 220'). The mask cell area CR may be formed by removing the sheet in the mask cell area CR through laser scribing or etching. In this specification, an example in which a 6 X 5 mask cell region (CR: CR11 to CR56) is formed will be described. When the mask cell area CR is formed, the edge frame portion 210 and the welded (W) portion become the edge sheet portion 221, and the five first grid sheet portions 223 and the four second grids A mask cell sheet portion 220 having a sheet portion 225 may be configured.

8 and 9 are a schematic plan view and a schematic front view showing an apparatus 10 for manufacturing a frame-integrated mask according to an embodiment of the present invention. 10 is a partially enlarged schematic diagram of an apparatus 10 for manufacturing a frame-integrated mask according to an embodiment of the present invention. In FIGS. 8 to 10, the frame 200 will be described as an example having a 2 X 5 mask cell area CR (CR11 to CR52).

8 to 10, the frame-integrated mask manufacturing apparatus 10 includes a table 15, a stage part 20, a grip part 30, a grip moving part 40, a head part 60, and a head movement. It includes a part 70, a vibration isolation table 80, and the like.

First, a table 15 called a gantry is firmly installed against the ground and is installed on a structure capable of preventing external vibration or shock. The upper surface of the table 15 is made to be accurately horizontal in order to perform a more reliable process.

A stage portion 20 on which the frame 200 is seated and supported is installed on the table 15. The stage unit 20 may include a loading unit 21, a frame alignment unit 23, and a frame support unit 25. In addition, a heating unit (not shown) and a backlight unit (not shown) may be further included.

The loading part 21 may correspond to the body of the stage part 20 and may have a wide plate shape so as to provide an area in which the frame 200 is loaded. A stage moving unit 27 may be further included on the table 15, and the stage moving unit 27 may include at least one of the X, Y, Z, and θ axes of the stage unit 20 (or the loading unit 21). You can move in either direction. The θ-axis direction may mean an angle of rotation on the XY plane, YZ plane, or XZ plane. 8 and 9 show that the stage moving part 27 is in the form of a rail so that the loading part 21 can be moved in the Y-axis direction. However, the present invention is not limited thereto, and known moving/rotating means such as a rail type, a belt type, a chain type, a motor, and a gear may be used so as to move/rotate in various directions.

The frame alignment unit 23 may be disposed at each side or corner of the frame support 25 or the frame 200 to align the position of the frame 200.

The frame support unit 25 may have a rectangular frame shape similar to that of the frame 200 so that the frame 200 can be seated and supported, and may be disposed on the loading unit 21 or the frame alignment unit 23. The frame support unit 25 may prevent the frame frame part 210 and the mask cell sheet part 220 from being deformed by tension during a process in which the mask 100 is adhered to the frame 200. The frame support unit 25 may be disposed under the frame 200 to be in close contact with the frame 200. Grooves may be formed on the upper surface of the frame support unit 25 so that the frame frame portion 210 and the grid frame portion 220 fit snugly, and the frame 200 may be fitted to the grooves. Thus, even in a state in which the mask 100 is adhered to the frame 200 to apply tension, deformation of the frame 200 can be prevented. The frame support unit 25 may be integrated with the lower support unit 90 to be described later in FIG. 17.

Thereafter, when the mask 100 is further adhered to the neighboring cell C, a force opposite to each other is applied to the frame 200 in which the mutually neighboring masks 100 are disposed, so that the frame 200 ) Can be canceled out. Before the tension is canceled, that is, when only one mask 100 is adhered, the frame support unit 25 seats and accommodates the frame 200, thereby preventing the deformation of the frame 200 during the mask 100 bonding process. Can be prevented

The heating unit (not shown) may control a process temperature in a process of bonding the mask 100 to the frame 200 or may apply heat to the frame.

As the backlight unit (not shown) emits light in the vertical upper (Z-axis) direction, the camera unit 65 of the head unit 60 may help to check the alignment shape of the mask pattern P. The emission of light in the vertical upward direction may be a transmission type, in which light is emitted directly, or as a reflection type, in which light irradiated in a vertical downward direction is reflected and light is emitted upward.

The grip unit 30 may include a grip unit 31, a grip moving unit 35, and a connection unit 37. The grip part 30 may grip the template 50 to which the mask 100 is adhered and supported. At this time, gripping may be performed by adsorbing at least a portion of the upper surface of the template 50. Alternatively, gripping may include holding and performing a part of the template 50 within a range that does not affect the mask 100.

The grip unit 31 may grip the upper surface of the template 50 by adsorbing it. The grip unit 31 may be formed in a horizontal shape on the XY plane, and a plurality of adsorption units 32 may be formed on the lower surface.

The adsorption unit 32 may be separately connected to the lower portion of the grip unit 31 or may be a part formed in the grip unit 31 in the form of an adsorption hole. As suction pressure is applied to the upper surface of the template 50 through the suction unit 32, the template 50 may be adsorbed to the lower surface of the grip unit 31. Although there is no limitation on the arrangement form of the adsorption unit 32, it is preferable not to overlap in the region on the Z axis with the welding portion (region where laser welding is to be performed) of the mask 100 so as not to block the entry path of the laser.

The grip moving unit 35 may move the grip unit 31 in at least one of X, Y, Z, and θ axes. In the present invention, since the grip moving unit 40 replaces the movement of the grip unit 31 in the X-axis and Y-axis directions, the grip moving unit 35 will be described on the assumption that it moves in the Z and θ-axis directions. . The grip moving unit 35 may use a known moving/rotating means capable of moving/rotating in various directions without limitation. Meanwhile, an auxiliary unit 33 for mediating the connection between the grip unit 31 and the grip moving unit 35 may be further included.

The connection unit 37 may mediate the connection of the grip moving unit 35 onto the grip moving part 40 (or the grip support unit 43 ).

The grip moving part 40 may move the grip part 30 in at least one of X, Y, Z, and θ axes. Here, the movement is performed by moving the grip part 30 to at least one of X, Y, Z, and θ axes while the grip part 30 is fixed to the grip moving part 40 so that the grip part 30 moves together. In addition to the concept, the grip moving part 40 may be understood to include a concept of moving only the grip part 30 in a non-moving state. In the present invention, the grip moving unit 40 performs movement in the X and Y axis directions of the grip unit 30, and the grip moving unit 35 or the grip support unit 45 is the Z, θ axis of the grip unit 30 It is assumed that the movement in the direction is performed.

The grip moving part 40 may include a base unit 41, a grip support unit 43, and a grip rail unit 45.

The base unit 41 has a wide plate shape, and may provide a space in which the grip support unit 43 is disposed at the upper portion. In addition, both side portions are connected to the grip rail unit 45 to move along the formation direction of the grip rail unit 45.

The grip support unit 43 may be disposed on the base unit 41 to support the grip part 30. The grip support unit 43 may move along the formation direction of the base rail unit 44 formed on the base unit 41.

The grip rail unit 45 is formed on both sides of the stage part 20 along the formation direction of the stage part 20 (or the loading part 21), and the base unit 41 on the grip rail unit 45 You can move this.

According to an embodiment, the stage part 20 is formed to be elongated along the X-axis direction, and a pair of grip rail units 45 may be formed along the X-axis direction at the long edge of the stage part 20. have. Further, the base unit 41 is extended in the Y-axis direction, and both ends are connected to the pair of grip rail units 45, respectively, so that the base unit 41 can move in the X-axis direction. Further, the base rail unit 44 is formed on the base unit 41 along the Y-axis direction, and the grip support unit 43 is connected to the base rail unit 44 to move in the Y-axis direction.

The frame 200 may be disposed on the left part of the stage part 20, and the grip part 30 and the grip moving part 40 may be disposed on the right part. The base unit 41 and the stage unit 20 are spaced apart from each other on the Z axis. Thus, even if the base unit 41 moves to the area where the frame 200 on the left side is disposed along the X-axis direction by the grip rail unit 45, the frame 200 and the base unit 41 do not interfere with each other. May not. Accordingly, the tray 50 gripped by the grip portion 30 supported on the base unit 41 may correspond to the specific cell area CR on the frame 200.

The head portion 60 is disposed above the stage portion 20 and the grip portion 30. A laser unit 61 (61a, 61b), a camera unit 65, a gap sensor, a failure analysis unit 67, and the like may be installed in the head unit 60.

The laser unit 61 may generate a laser L for welding the mask 100 and the frame 200. Alternatively, the laser unit 61 may generate a cutting laser for laser trimming by irradiating the mask 100. The pair of laser units 61 (61a, 61b) may be disposed to be spaced apart from each other, and may be installed to adjust the positions of the X and Y axes. The spaced apart distance may correspond to the distance between the left welding portion and the right welding portion of the mask 100. When irradiating the laser (L) to adhere the mask 100 to the frame 200, it is not necessary to irradiate the laser (L) on the left and right welding portions of the mask 100, respectively, by irradiating the laser (L) at once. It becomes possible to perform welding. Accordingly, since both sides of the mask 100 are adhered to the frame 200 at the same time, the process time is shorter than the process of bonding one side at a time, and the mask 100 can be stably adhered to the frame 200 without deformation. There is this.

The camera unit 65 may photograph and sense the alignment of the mask 100 and the mask pattern P. The gap sensor unit may measure the displacement of the Z-axis of the mask 100, or may sense a distance between the head 60 and the mask 100, the frame 200, and the like. The defect analysis unit may inspect the defective state of the mask 100.

The head moving units 70 (71, 75) may move the head unit 60 in at least one of the X, Y, and Z axes. In the present invention, the head moving unit 70 will be described on the assumption that the head unit 60 is moved only in the X axis. The upper part of the head part 60 is connected to the first head moving part 71 to receive movement power, and the second head moving part 75 spaced apart from the lower part of the first head moving part 71 has a head part ( The main components of 60) are connected, and movement in the X-axis direction can be guided according to the X-axis guide 76.

The vibration isolation table 70 may be installed to prevent vibration of the table 15. When the mask 100 is adhered to the frame 200, the alignment error PPA of the mask pattern P is affected even in an environment in which very small vibration occurs. Accordingly, the vibration isolator 70 can prevent vibration by preferably installing a passive isolator under the table 15.

11 to 12 are schematic diagrams illustrating a process of manufacturing a mask supporting template by attaching the mask metal layer 110 on the template 50 and forming the mask 100 according to an embodiment of the present invention.

Referring to FIG. 11A, a template 50 may be provided. The template 50 is a medium that can be moved while the mask 100 is attached and supported on one surface. It is preferable that one surface of the template 50 is flat so that it can be moved by supporting the flat mask 100. The central portion 50a may correspond to the mask cell C of the mask metal layer 110, and the edge portion 50b may correspond to a dummy of the mask metal layer 110. The size of the template 50 may be a flat plate shape having a larger area than that of the mask metal layer 110 so that the mask metal layer 110 can be entirely supported.

The template 50 is preferably made of a transparent material so that it is easy to observe vision or the like in the process of aligning and bonding the mask 100 to the frame 200. In addition, in the case of a transparent material, the laser may penetrate. As a transparent material, materials such as glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), borosilicate glass, and zirconia may be used. For example, the template 50 may be made of a BOROFLOAT ^® 33 material having excellent heat resistance, chemical durability, mechanical strength, transparency, etc. among borosilicate glass. In addition, BOROFLOAT ^® 33 has a coefficient of thermal expansion of about 3.3, which is advantageous in controlling the mask metal layer 110 because the difference between the thermal expansion coefficient and the invar mask metal layer 110 is small.

Meanwhile, in the template 50, one surface in contact with the mask metal layer 110 is a mirror surface so that an air gap does not occur between the interface with the mask metal layer 110 (or the mask 100). I can. In consideration of this, the surface roughness Ra of one surface of the template 50 may be 100 nm or less. In order to implement the template 50 having a surface roughness Ra of 100 nm or less, the template 50 may use a wafer. The wafer (wafer) has a surface roughness (Ra) of about 10 nm, there are many commercially available products, and many surface treatment processes are known, so it can be used as the template 50. Since the surface roughness (Ra) of the template 50 is in nm scale, there is no or almost no air gap, and it is easy to generate the weld bead (WB) by laser welding, which affects the alignment error of the mask pattern (P). I can not give it.

The template 50 has a laser through hole 51 in the template 50 so that the laser L irradiated from the top of the template 50 can reach the welding portion (area to be welded) of the mask 100. Can be formed. The laser through-hole 51 may be formed in the template 50 to correspond to the position and number of welding portions. Since a plurality of welding portions are disposed along a predetermined interval in the edge or the dummy DM portion of the mask 100, a plurality of laser through holes 51 may be formed along a predetermined interval to correspond thereto. As an example, since a plurality of welding parts are disposed along a predetermined distance on both sides (left/right) dummy (DM) of the mask 100, the laser through hole 51 is also on both sides (left/right) of the template 50. A plurality may be formed along a predetermined interval.

The laser through-hole 51 need not necessarily correspond to the position and number of welding parts. For example, it is also possible to perform welding by irradiating the laser (L) to only a part of the laser through hole (51). In addition, some of the laser through-holes 51 that do not correspond to the welding part may be used instead of the alignment mark when aligning the mask 100 and the template 50. If the material of the template 50 is transparent to the laser (L) light, the laser through hole 51 may not be formed.

A temporary adhesive portion 55 may be formed on one surface of the template 50. Temporary bonding portion 55 is temporarily adhered to one surface of the template 50 until the mask 100 (or the mask metal film 110) is adhered to the frame 200 Can be supported by

The temporary bonding part 55 may use an adhesive or adhesive sheet that can be separated by applying heat, and an adhesive or adhesive sheet that can be separated by UV irradiation.

As an example, the temporary bonding portion 55 may be formed of liquid wax. The liquid wax may be the same as the wax used in the polishing step of a semiconductor wafer, and the like, and the type is not particularly limited. The liquid wax is mainly a resin component for controlling adhesion, impact resistance, and the like with respect to holding power, and may include materials and solvents such as acrylic, vinyl acetate, nylon, and various polymers. As an example, the temporary adhesive part 55 may use SKYLIQUID ABR-4016 including acrylonitrile butadiene rubber (ABR) as a resin component and n-propyl alcohol as a solvent component. The liquid wax may be formed on the temporary bonding portion 55 using spin coating.

The temporary adhesive part 55, which is a liquid wax, has a lower viscosity at a temperature higher than 85°C to 100°C, and becomes more viscous at a temperature lower than 85°C, and may be partially hardened like a solid. ) Can be fixed and bonded.

Before or after preparation of the template 50, the mask metal layer 110 may be prepared.

As an embodiment, the mask metal layer 110 may be prepared by a rolling method. The metal sheet manufactured by the rolling process may have a thickness of several tens to several hundred μm in the manufacturing process. For UHD-level high resolution, a thin mask metal layer 110 having a thickness of about 20 μm or less must be used to perform fine patterning. For ultra-high resolution above UHD, a thin mask metal layer 110 having a thickness of about 10 μm. ) Should be used. However, since the mask metal layer 110 ′ produced by the rolling process has a thickness of about 25 to 500 μm, it is necessary to have a thinner thickness.

Accordingly, a process of flattening (PS) one surface of the mask metal layer 110 ′ (see FIG. 11B) may be further performed. Here, planarization (PS) refers to reducing the thickness of one surface (upper surface) of the mask metal layer 110 ′ to a thinner surface by removing a part of the upper surface of the mask metal layer 110 ′. Planarization (PS) may be performed by a CMP (Chemical Mechanical Polishing) method, and a known CMP method may be used without limitation. In addition, the thickness of the mask metal layer 110 ′ may be reduced by a chemical wet etching method or a dry etching method. In addition, a process capable of flattening the mask metal layer 110 ′ may be used without limitation.

In the process of performing the planarization (PS), for example, in the CMP process, the surface roughness R _a of the upper surface of the mask metal layer 110 ′ may be controlled. Preferably, mirroring can be performed in which the surface roughness is further reduced. Alternatively, as another example, after performing a chemical wet etching or dry etching process to perform planarization (PS), a polishing process such as a separate CMP process may be added thereafter to reduce the surface roughness (R _a ).

In this way, the thickness of the mask metal layer 110 ′ can be made thin to about 50 μm or less. Accordingly, it is preferable that the thickness of the mask metal layer 110 is about 2 μm to 50 μm, and more preferably, the thickness may be about 5 μm to 20 μm. However, it is not necessarily limited thereto.

As another embodiment, the mask metal layer 110 may be prepared by electroplating.

In order to perform electroforming, the base material of the mother plate may be a conductive material. The mother plate can be used as a cathode electrode in electroplating.

As a conductive material, in the case of metal, metal oxides may be generated on the surface, impurities may be introduced during the metal manufacturing process, in the case of a polycrystalline silicon substrate, inclusions or grain boundaries may exist, and conductive polymers In the case of the base material, the possibility of containing impurities is high and strength. Acid resistance may be weak. An element that prevents uniform formation of an electric field on the surface of the mother plate (or cathode) such as metal oxide, impurities, inclusions, grain boundaries, etc. is referred to as “defect”. Due to defects, a uniform electric field may not be applied to the cathode body made of the above-described material, so that a part of the plating film 110 (or mask metal film 110) may be formed unevenly.

In implementing ultra-high definition pixels of the UHD level or higher, non-uniformity of the plating film and the plating film pattern [mask pattern P] may adversely affect the formation of pixels. For example, in the case of current QHD quality, the size of the pixel reaches about 30-50㎛ with 500~600 PPI (pixel per inch), and in the case of 4K UHD and 8K UHD high quality, ~860 PPI and ~1600 PPI are higher. It has the same resolution. Micro-displays directly applied to VR devices, or micro-displays inserted into VR devices, aim for ultra-high quality of about 2,000 PPI or higher, and the size of pixels reaches about 5 to 10 μm. The pattern width of the FMM and shadow mask applied to this can be formed in a size of several to several tens of µm, preferably smaller than 30 µm, so that even a defect of several µm can occupy a large proportion of the pattern size of the mask. to be. In addition, in order to remove defects in the cathode material of the above-described material, an additional process for removing metal oxides and impurities may be performed, and in this process, another defect such as etching of the cathode material may be caused. have.

Accordingly, in the present invention, a single crystal base plate (or a cathode body) may be used. In particular, it is preferably made of single crystal silicon. In order to have conductivity, a high concentration doping of 10 ¹⁹ /cm ³ or more may be performed on the mother plate made of single crystal silicon. Doping may be performed on the entire parent plate, or may be performed only on the surface portion of the parent plate.

Meanwhile, as a single crystal material, metals such as Ti, Cu, and Ag, semiconductors such as GaN, SiC, GaAs, GaP, AlN, InN, InP, Ge, and carbon-based materials such as graphite and graphene _{, CH 3 NH 3 PbCl 3,} CH 3 NH 3 PbBr 3, CH 3 NH 3 PbI 3, SrTiO 3 , etc. page containing the perovskite (perovskite) superconductor single crystalline ceramic, aircraft single crystal second heat-resistant alloy for components for such structures Etc. can be used. Metal and carbon-based materials are basically conductive materials. In the case of a semiconductor material, high concentration doping of 10 ¹⁹ /cm ³ or more may be performed to have conductivity. In the case of other materials, doping may be performed or oxygen vacancy may be formed to form conductivity. Doping may be performed on the entire parent plate, or may be performed only on the surface portion of the parent plate.

Since there are no defects in the case of a single crystal material, there is an advantage in that a uniform plating film 110 can be generated due to the formation of a uniform electric field over the entire surface during electroplating. The frame-integrated masks 100 and 200 manufactured through a uniform plating film can further improve the quality level of OLED pixels. In addition, since there is no need to perform an additional process for removing and eliminating defects, there is an advantage in that process cost is reduced and productivity is improved.

A conductive substrate is used as a mother plate [cathode body], and an anode body (not shown) is spaced apart to form a plated film 110 (or mask metal film 110) by electroplating on the conductive substrate. Can be formed.

Next, the plating film 110 may be separated from the conductive substrate.

Meanwhile, before separating the plating film 110 from the conductive substrate, heat treatment may be performed. Heat treatment before separating the plated film 110 from the conductive substrate (or mother plate, cathode body) in order to reduce the coefficient of thermal expansion of the mask 100 and prevent deformation of the mask 100 and the mask pattern P by heat. You can do it. The heat treatment may be performed at a temperature of 300°C to 800°C.

In general, compared to the Invar sheet produced by rolling, the Invar sheet produced by electroplating has a higher coefficient of thermal expansion. Thus, by performing heat treatment on the Invar sheet, the coefficient of thermal expansion may be lowered, and during this heat treatment process, the Invar sheet may be deformed. Therefore, if the plating film 110 is formed on not only the upper surface of the conductive substrate, but also the side and lower surfaces of the conductive substrate in a state of being adhered to the conductive substrate, no peeling or deformation occurs even after heat treatment, and the heat treatment can be stably performed. have.

The thickness of the mask metal layer 110 generated by the electroplating process may be thinner than that of the rolling process. Accordingly, the planarization (PS) process for reducing the thickness may be omitted, but since the etching characteristics may be different depending on the composition of the surface layer of the plating mask metal layer 110 ′ and the crystal structure/fine structure, planarization (PS) is performed. Through the need to control the surface properties and thickness.

Next, referring to FIG. 11B, a mask metal layer 110 ′ may be adhered on the template 50. After heating the liquid wax to 85° C. or higher and contacting the mask metal film 110 ′ with the template 50, bonding may be performed by passing the mask metal film 110 ′ and the template 50 between rollers. .

According to an embodiment, baking is performed on the template 50 at about 120° C. for 60 seconds to vaporize the solvent of the temporary bonding portion 55, and immediately, a mask metal film lamination process may be performed. . Lamination is performed by loading the mask metal film 110 ′ on the template 50 on which the temporary bonding part 55 is formed, and passing it between the upper roll of about 100°C and the lower roll of about 0°C. I can. As a result, the mask metal layer 110 ′ may be in contact with the template 50 through the temporary bonding portion 55.

13 is an enlarged cross-sectional schematic view showing a temporary bonding portion 55 according to an embodiment of the present invention. As another example, the temporary adhesive part 55 may use a thermal release tape. In the thermal release tape, a core film 56 such as a PET film is disposed in the center, and thermal release adhesives 57a and 57b are disposed on both sides of the core film 56, and an adhesive layer 57a , 57b) may have a form in which the release film/release film 58a, 58b is disposed. Here, the adhesive layers 57a and 57b disposed on both sides of the core film 56 may have different temperatures at which they are separated from each other.

According to an embodiment, in the state where the release film/release film 58a, 58b is removed, the lower surface of the thermal release tape (the second adhesive layer 57b) is adhered to the template 50, and the upper part of the thermal release tape The surface (the first adhesive layer 57a) may be adhered to the mask metal layer 110 ′. Since the first adhesive layer 57a and the second adhesive layer 57b are separated from each other at different temperatures, when separating the template 50 from the mask 100 in FIG. 18 to be described later, the first adhesive layer 57a By applying the heat to be thermally separated, the mask 100 may be separated from the template 50 and the temporary bonding portion 55.

Subsequently, referring to FIG. 11B further, one surface of the mask metal layer 110 ′ may be planarized (PS). As described above, the thickness of the mask metal film 110 ′ manufactured by the rolling process may be reduced (110 ′ -> 110) through a planarization (PS) process. In addition, the mask metal layer 110 manufactured by the electroplating process may also be subjected to a planarization (PS) process to control surface characteristics and thickness.

Accordingly, as shown in (c) of FIG. 11, as the thickness of the mask metal layer 110 ′ is reduced (110 ′ -> 110), the thickness of the mask metal layer 110 becomes about 5 μm to 20 μm. I can.

Next, referring to FIG. 12D, a patterned insulating portion 25 may be formed on the mask metal layer 110. The insulating part 25 may be formed of a photoresist material using a printing method or the like.

Subsequently, the mask metal layer 110 may be etched. A method such as dry etching or wet etching may be used without limitation, and as a result of the etching, a portion of the mask metal layer 110 exposed to the empty space 26 between the insulating portions 25 may be etched. The etched portion of the mask metal layer 110 constitutes the mask pattern P, and the mask 100 having a plurality of mask patterns P formed thereon may be manufactured.

Next, referring to (e) of FIG. 12, manufacturing of the template 50 supporting the mask 100 may be completed by removing the insulating portion 25.

The mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy DM surrounding the mask cell C. The dummy DM corresponds to a portion of the mask layer 110 (mask metal layer 110) excluding the cell C, and includes only the mask layer 110, or a predetermined dummy having a shape similar to the mask pattern P A patterned mask layer 110 may be included. In the dummy DM, part or all of the dummy DM may be adhered to the frame 200 (mask cell sheet part 220) corresponding to the edge of the mask 100.

The width of the mask pattern P may be less than 40 μm, and the thickness of the mask 100 may be about 5 to 20 μm. Since the frame 200 includes a plurality of mask cell regions CR, a plurality of masks 100 having a mask cell C corresponding to each mask cell region CR may also be provided. In addition, a plurality of templates 50 for supporting each of the plurality of masks 100 may be provided.

14 is a schematic diagram illustrating a process of loading the mask supporting template 50 on the frame 200 according to an embodiment of the present invention.

Referring to FIG. 14, the template 50 may be transported by the grip part 30. The suction unit 32 of the grip part 30 may adsorb and transport the opposite surface of the template 50 to which the mask 100 is adhered. Since the grip part 30 adsorbs and transfers the template 50, and the mask 100 is adhered and supported to the template 50 via the temporary bonding part 55, the template 50 is transferred onto the frame 200. In the process of doing so, there is no effect on the adhesion state and the alignment state of the mask 100.

15 is a schematic diagram showing a state in which the template 50 according to an embodiment of the present invention is loaded onto the frame 200 and the mask 100 corresponds to the cell regions CR (CR11 to CR52) of the frame 200 to be. Hereinafter, the frame 200 will be described as an example having a 2×5 mask cell area CR (CR11 to CR52).

Next, referring to FIG. 15, the mask 100 may correspond to one mask cell area CR of the frame 200. By loading the template 50 onto the frame 200 (or the mask cell sheet part 220), the mask 100 may correspond to the mask cell area CR. While controlling the position of the grip part 30, it is possible to check whether the mask 100 corresponds to the mask cell area CR through the camera unit 65 of the head part 60. Since the template 50 compresses the mask 100, the mask 100 and the frame 200 can be in close contact with each other.

Meanwhile, a lower support unit 90 (see FIG. 17) may be further disposed under the frame 200. The lower support unit 90 may be configured integrally with the frame support unit 26. The lower support unit 90 may have a size such that it fits within the hollow area of the frame rim part 210 and may have a flat plate shape. Further, a predetermined support groove (not shown) corresponding to the shape of the mask cell sheet part 220 may be formed on the upper surface of the lower support unit 90. In this case, the edge sheet portion 221 and the first and second grid sheet portions 223 and 225 are fitted into the support grooves, so that the mask cell sheet portion 220 may be better fixed.

The lower support unit 90 may press the opposite surface of the mask cell area CR to which the mask 100 contacts. That is, the lower support unit 90 may support the mask cell sheet part 220 in an upward direction to prevent the mask cell sheet part 220 from sagging downward during the bonding process of the mask 100. At the same time, since the lower support unit 90 and the template 50 are pressed against the edge and frame 200 (or mask cell sheet part 220) of the mask 100 in opposite directions, the mask 100 ) Can be maintained without being disturbed.

In this way, just by attaching the mask 100 on the template 50 and loading the template 50 on the frame 200, the mask 100 corresponds to the mask cell area CR of the frame 200. Since the process is completed, no tensile force may be applied to the mask 100 during this process.

16 is a schematic diagram showing a process of bonding the mask 100 to the frame 200 according to an embodiment of the present invention.

Next, the mask 100 may be attached to the frame 200 by laser welding by irradiating the laser L to the mask 100. A welding bead WB is generated in the welding portion of the laser-welded mask, and the welding bead WB may be integrally connected with the mask 100 / frame 200 and having the same material. A pair of laser units 61a and 61b spaced apart from each other may perform welding by simultaneously irradiating the laser L to the left and right welds of the mask 100.

17 is a schematic diagram showing a state in which an adsorption force is applied to the mask 100 through the adsorption hole 229 according to an embodiment of the present invention.

Meanwhile, according to another embodiment, a plurality of adsorption holes 229 may be formed near the corners of the frame 200 in which the mask cell area CR exists. Specifically, a plurality of adsorption holes 229 may be formed at a portion spaced apart from the edge of the mask cell sheet part 220 by a predetermined distance, and more specifically, the inner edge of the edge sheet part 221 and a predetermined distance apart. It may be formed on a portion and a portion spaced apart from the corners of the first and second grid sheet portions 223 and 225 by a predetermined distance.

The shape, size, etc. of the plurality of adsorption holes 229 are not limited in the range of the purpose in which the vacuum suction pressure can be applied. However, it is preferable that the positions of the plurality of adsorption holes 229 do not overlap with the welding portion (a region to be welded) of the mask 100. When the welding part and the adsorption hole 229 overlap, the mask 100 and the frame 200 (or the mask cell sheet part 220) are not in close contact, so that the welding bead (WB) by laser welding cannot be properly generated. I can. Preferably, the plurality of adsorption holes 229 are formed in a portion adjacent to the welding portion so that the welding portion portion of the mask 100 may be further brought into close contact with the frame 200 (or the mask cell sheet portion 220).

As shown in FIG. 17, when the template 50 is loaded on the frame 200 (or the mask cell sheet part 220), a part of the lower surface of the mask 100 is formed in the frame 200 (or the mask cell sheet part ( 220)] It comes into contact with the upper part. The upper part of the adsorption hole 229 formed in the frame 200 (or the mask cell sheet part 220) corresponds to the lower surface of the mask 100, and the adsorption force (suction pressure) corresponding to the lower part of the adsorption hole 229 The application means may apply the adsorption force VS (or adsorption pressure VS) to the mask 100 through the adsorption hole 229 to pull the portion of the mask 100 corresponding to the adsorption hole 229. Accordingly, the mask 100 is more closely attached to the frame 200, and when laser welding is performed, a welding bead WB may be generated more stably.

An adsorption unit 95 may be formed on the lower support unit 90. The adsorption unit 95 is preferably disposed to correspond to the position of the adsorption hole 229 formed in the frame 200 (or mask cell sheet unit 220). In other words, the adsorption unit 95 may be disposed on the lower support unit 90 at a position capable of intensively applying the adsorption force VS (or adsorption pressure VS) to the adsorption hole 229. The adsorption unit 95 may use a known vacuum suction device, and may be connected to an external suction pressure generating means. For example, a vacuum flow path 96 is formed inside the lower support unit 90 so that the other end may be connected to an external suction pressure generating means (not shown) such as a pump, and one end may be connected to the suction unit 95. A plurality of holes, slits, etc. are formed on the upper surface of the adsorption unit 95 connected to the vacuum flow path 96, and thus may be used as a path through which suction pressure is applied. The external suction pressure generating means is connected to the various vacuum flow paths 96 of the lower support unit 90, so that suction pressure for each vacuum flow path 96 can be individually controlled, and suction pressure for all vacuum flow paths 96 Can also be controlled at the same time.

As the adsorption force VS (or adsorption pressure VS) is provided by the adsorption unit 95 of the lower support unit 90, and this adsorption force VS is applied to the mask 100 through the adsorption hole 229, , The mask 100 may be pulled toward the adsorption unit 95 (lower side). Then, the interface between the mask 100 and the frame 200 (or the mast cell sheet part 220) may be brought into close contact with each other.

Since the adsorption unit 95 strongly pulls the mask 100, a fine air gap does not exist between the interface between the mask 100 and the frame 200. As a result, since the mask 100 and the frame 200 (in the enlarged drawing of FIG. 13, the first grid sheet portion 223) are in close contact, the mask 100 and the frame 200 are irradiated with the laser L anywhere in the welding area. A weld bead (WB) can be well produced in between. The welding bead WB integrally connects the mask 100 and the frame 200, and as a result, there is an advantage that welding can be performed stably and well.

18 is a schematic diagram showing a process of separating the mask 100 and the template 50 after attaching the mask 100 to the frame 200 according to an embodiment of the present invention.

Referring to FIG. 18, after attaching the mask 100 to the frame 200, the mask 100 and the template 50 may be separated (debonded). Separation of the mask 100 and the template 50 can be performed through at least one of heat application (ET), chemical treatment (CM), ultrasonic application (US), and UV application (UV) to the temporary bonding part 55. have. Since the mask 100 remains attached to the frame 200, only the template 50 can be lifted. For example, when heat at a temperature higher than 85°C to 100°C is applied (ET), the viscosity of the temporary bonding portion 55 decreases, and the adhesion between the mask 100 and the template 50 is weakened, and thus the mask 100 ) And the template 50 may be separated. As another example, the mask 100 and the template 50 may be separated by dissolving or removing the temporary bonding portion 55 by immersing (CM) the temporary bonding portion 55 in a chemical substance such as IPA, acetone, and ethanol. have. As another example, when ultrasound is applied (US) or UV is applied (UV), the adhesion between the mask 100 and the template 50 is weakened, so that the mask 100 and the template 50 may be separated.

In more detail, since the temporary bonding portion 55 that mediates the adhesion between the mask 100 and the template 50 is a TBDB adhesive material (temporary bonding&debonding adhesive), various debonding methods can be used.

As an example, a solvent debonding method according to a chemical treatment (CM) may be used. Debonding may be performed as the temporary bonding portion 55 is dissolved by the penetration of the solvent. At this time, since the pattern P is formed on the mask 100, the solvent may penetrate through the mask pattern P and the interface between the mask 100 and the template 50. Solvent debonding has an advantage of being relatively economical compared to other debonding methods because debonding is possible at room temperature and does not require a complex debonding facility designed separately.

As another example, a heat debonding method according to heat application (ET) may be used. When the temporary bonding portion 55 is decomposed using high temperature heat, and the adhesive force between the mask 100 and the template 50 is reduced, debonding may proceed in the vertical direction or the left and right directions.

As another example, a peelable adhesive debonding method based on heat application (ET), UV application (UV), or the like may be used. When the temporary bonding part 55 is a thermal peeling tape, debonding can be performed using a peeling adhesive debonding method, and this method does not require high-temperature heat treatment and expensive heat treatment equipment like the thermal debonding method. It has a relatively simple advantage.

As another example, a room temperature debonding method according to chemical treatment (CM), ultrasonic application (US), and UV application (UV) may be used. When a non-sticky treatment is performed on a part (center) of the mask 100 or the template 50, only the edge portion may be adhered by the temporary bonding portion 55. In addition, during the debonding, the solvent penetrates into the edge portion and the debonding is performed by dissolving the entrance examination bonding portion 55. This method has the advantage of not causing direct loss or defects due to adhesive material residues during debonding, except for the edge area of the mask 100 and the template 50 during bonding and debonding. There is this. In addition, unlike the thermal debonding method, since a high-temperature heat treatment process is not required during debonding, there is an advantage of relatively reducing the process cost.

19 is a schematic diagram showing a state in which the mask 100 is adhered to the frame 200 according to an embodiment of the present invention.

Referring to FIG. 19, one mask 100 may be adhered to one cell area CR of the frame 200.

Since the mask cell sheet portion 220 of the frame 200 has a thin thickness, when the mask cell sheet portion 220 is adhered to the mask cell sheet portion 220 while a tensile force is applied to the mask 100, the tensile force remaining in the mask 100 is masked. It acts on the cell sheet part 220 and the mask cell area CR, and thus, they may be deformed. Therefore, it is necessary to adhere the mask 100 to the mask cell sheet part 220 without applying a tensile force to the mask 100. In the present invention, by attaching the mask 100 on the template 50 and loading the template 50 on the frame 200, the mask 100 corresponds to the mask cell area CR of the frame 200 Since the process is completed, no tensile force may be applied to the mask 100 during this process. Thus, it is possible to prevent deformation of the frame 200 (or the mask cell sheet part 220) by acting as a tension on the frame 200 as opposed to the tensile force applied to the mask 100.

The conventional mask 10 of FIG. 1 has a long length because it includes 6 cells (C1 to C6), whereas the mask 100 of the present invention has a short length including one cell (C). The degree of distortion of the pixel position accuracy (PPA) can be reduced. For example, assuming that the length of the mask 10 including a plurality of cells (C1 to C6, ...) is 1 m and a PPA error of 10 μm occurs in the entire 1 m, the mask 100 of the present invention The above error range can be 1/n according to the reduction in the relative length (corresponding to the reduction in the number of cells C). For example, if the length of the mask 100 of the present invention is 100 mm, since it has a length reduced from 1 m to 1/10 of the conventional mask 10, a PPA error of 1 μm occurs in the entire 100 mm length. , There is an effect that the alignment error is significantly reduced.

On the other hand, if the mask 100 includes a plurality of cells C, and each cell C corresponds to each cell area CR of the frame 200 within a range in which the alignment error is minimized, The mask 100 may correspond to a plurality of mask cell regions CR of the frame 200. Alternatively, the mask 100 having a plurality of cells C may correspond to one mask cell area CR. Even in this case, in consideration of the process time and productivity according to the alignment, the mask 100 is preferably provided with as few cells (C) as possible.

In the case of the present invention, it is only necessary to match one cell (C) of the mask 100 and check the alignment state, so that a plurality of cells (C: C1 to C6) must be matched at the same time and check all alignment states. Compared to the conventional method [see Fig. 1], the manufacturing time can be significantly reduced.

That is, in the method of manufacturing a frame-integrated mask of the present invention, each of the cells C11 to C16 included in the six masks 100 correspond to each of the cell regions CR11 to CR16 and check the alignment state. Through a single process, the time can be much shorter than that of a conventional method in which the six cells C1 to C6 are simultaneously matched and the alignment state of the six cells C1 to C6 is checked at the same time.

In addition, in the method of manufacturing a frame-integrated mask of the present invention, the product yield in the process of 30 times of matching and aligning 30 masks 100 to 30 cell regions (CR: CR11 to CR56), respectively, is 6 cells (C1 The five masks 10 each including ~C6) (see Fig. 1 (a)) may appear much higher than the conventional product yield in the five processes of matching and aligning the frame 20. Since the conventional method of arranging six cells (C1 to C6) in a region corresponding to six cells (C) at a time is much cumbersome and difficult operation, the product yield is low.

Meanwhile, as described above in step (b) of FIG. 11, when the mask metal layer 110 is adhered to the template 50 through a lamination process, a temperature of about 100° C. may be applied to the mask metal layer 110. . Accordingly, the mask metal layer 110 may be adhered to the template 50 in a state where some tensile tension is applied. Thereafter, when the mask 100 is adhered to the frame 200 and the template 50 is separated from the mask 100, the mask 100 may contract a predetermined amount.

When the template 50 and the mask 100 are separated after each of the masks 100 are adhered to the corresponding mask cell area CR, a tension that contracts the plurality of masks 100 in opposite directions is applied. Therefore, the force is canceled, so that deformation does not occur in the mask cell sheet portion 220. For example, the first grid sheet portion 223 between the mask 100 attached to the CR11 cell area and the mask 100 attached to the CR12 cell area is in the right direction of the mask 100 attached to the CR11 cell area. The applied tension and the tension acting in the left direction of the mask 100 attached to the CR12 cell area may be canceled out. Thus, deformation of the frame 200 (or mask cell sheet part 220) due to tension is minimized, so that an alignment error of the mask 100 (or mask pattern P) can be minimized.

20 is a schematic diagram illustrating an OLED pixel deposition apparatus 1000 using the frame-integrated masks 100 and 200 according to an embodiment of the present invention.

Referring to FIG. 20, the OLED pixel deposition apparatus 1000 includes a magnet plate 300 in which a magnet 310 is accommodated and a cooling water line 350 is disposed, and an organic material source 600 from a lower portion of the magnet plate 300. ) And a deposition source supply unit 500 to supply.

A target substrate 900 such as glass on which the organic material source 600 is deposited may be interposed between the magnet plate 300 and the source deposition unit 500. The frame-integrated masks 100 and 200 (or FMM) that allow the organic material source 600 to be deposited for each pixel may be disposed on the target substrate 900 in close contact or very close to each other. The magnet 310 generates a magnetic field and may be in close contact with the target substrate 900 by the magnetic field.

The deposition source supply unit 500 may reciprocate the left and right path to supply the organic material source 600, and the organic material sources 600 supplied from the deposition source supply unit 500 are pattern P formed on the frame-integrated masks 100 and 200. ) May be deposited on one side of the target substrate 900. The deposited organic material source 600 passing through the pattern P of the frame-integrated masks 100 and 200 may function as the pixel 700 of the OLED.

In order to prevent non-uniform deposition of the pixel 700 due to a shadow effect, the pattern of the frame-integrated masks 100 and 200 may be formed to be inclined (S) (or formed in a tapered shape (S)). . Since the organic material sources 600 passing through the pattern in a diagonal direction along the inclined surface may also contribute to the formation of the pixel 700, the overall thickness of the pixel 700 may be uniformly deposited.

Since the mask 100 is adhered and fixed to the frame 200 at a first temperature higher than the pixel deposition process temperature, even if it is raised to the process temperature for pixel deposition, the position of the mask pattern P is hardly affected. The PPA between 100 and the mask 100 adjacent thereto may be maintained not to exceed 3 μm.

Although the present invention has been shown and described with reference to a preferred embodiment as described above, it is not limited to the above embodiment, and within the scope not departing from the spirit of the present invention, various It can be transformed and changed. Such modifications and variations should be viewed as falling within the scope of the present invention and the appended claims.

10: frame-integrated mask manufacturing apparatus
20: stage part
30: grip
40: grip moving part
50: template
51: laser through hole
55: temporary bonding part
60: head
70: head moving part
90: lower support unit
100: mask
110: mask film
200: frame
210: frame frame portion
220: mask cell sheet portion
221: border sheet portion
223: first grid seat portion
225: second grid seat portion
1000: OLED pixel deposition device
C: cell, mask cell
CR: Mask cell area
DM: dummy, mask dummy
L: laser
P: mask pattern
WB: welding bead

Claims (9)

As an apparatus for manufacturing a frame-integrated mask,
A stage portion on which the frame is seated and supported;
A grip portion for gripping the template on which the mask is adhered and supported;
A grip moving part for moving the grip part in at least one of X, Y, Z, and θ axes;
A head unit that irradiates a laser to the welding portion of the mask and senses an alignment state of the mask; And
Head moving part that moves the head in at least one of the X, Y, and Z axes
Including,
The frame includes: a frame frame portion including a hollow area; And a mask cell sheet portion having a plurality of mask cell regions and connected to the frame frame portion,
A plurality of adsorption holes are formed in the mask cell sheet portion,
The grip portion grips by adsorbing at least a portion of the upper surface of the template,
The stage unit further includes a lower support unit supporting a lower portion of the mask cell sheet unit while applying suction pressure to the suction hole of the mask cell sheet unit to attract a portion of the lower surface of the mask in contact with the mask cell sheet unit. Manufacturing device. The method of claim 1,
The stage unit includes a frame alignment unit that aligns the positions of the frames. The method of claim 1,
The stage unit includes a heating unit that applies heat to the frame, and a frame-integrated mask manufacturing apparatus. The method of claim 1,
The head part,
An apparatus for manufacturing a frame-integrated mask, comprising a laser unit for irradiating a mask with a laser to weld it to a frame or for laser trimming by irradiating a laser to the mask. The method of claim 4,
A pair of laser units are arranged to be spaced apart from each other,
Each laser unit irradiates a laser to a welding portion on one side and the other side of the mask, respectively, a frame-integrated mask manufacturing apparatus. delete The method of claim 1,
A frame-integrated mask manufacturing apparatus, wherein the frame includes a plurality of mask cell regions along at least one of a first direction and a second direction perpendicular to the first direction. The method of claim 1,
An apparatus for manufacturing a frame-integrated mask, wherein a plurality of adsorption holes are formed in portions spaced apart by a predetermined distance from a corner of a mask cell sheet portion in which the mask cell region exists. The method of claim 1,
An apparatus for manufacturing a frame-integrated mask, wherein at least one vacuum flow path of the lower support unit is formed, and the vacuum flow path transmits the absorption pressure generated by an external absorption pressure generating means to the absorption hole.

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