CN110385527A - The manufacturing device of the one-piece type mask of frame - Google Patents

The manufacturing device of the one-piece type mask of frame Download PDF

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Publication number
CN110385527A
CN110385527A CN201910317998.0A CN201910317998A CN110385527A CN 110385527 A CN110385527 A CN 110385527A CN 201910317998 A CN201910317998 A CN 201910317998A CN 110385527 A CN110385527 A CN 110385527A
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CN
China
Prior art keywords
mask
unit
frame
piece type
template
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Granted
Application number
CN201910317998.0A
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CN110385527B (en
Inventor
李炳一
张泽龙
李裕进
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TGO TECHNOLOGY CORP
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TGO TECHNOLOGY CORP
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding
    • B23K26/21Bonding by welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The present invention relates to a kind of manufacturing devices of the one-piece type mask of frame.The manufacturing device (10) of the one-piece type mask of frame of the present invention includes: platform portion (20), for installing simultaneously braced frame (200);Clamping part (30) clamps template (50), bonds on the template (50) and is supported by the mask (100);It clamps moving portion (40), moves clamping part (30) along at least one direction in X, Y, Z, θ axis;Head (60) irradiates laser to the weld part of mask (100), and senses the alignment of mask (100);And head moving portion (70), along at least one direction moving-head (60) in X, Y, Z axis, wherein, upper face of the clamping part (30) to adsorb template (50) it is at least part of in a manner of clamped.

Description

The manufacturing device of the one-piece type mask of frame
Technical field
The present invention relates to a kind of manufacturing devices of the one-piece type mask of frame.In further detail, relating to not have in mask It in the case of having shifting ground, is steadily supported and moves, mask and frame can be formed as one, and can make each The manufacturing device of the one-piece type mask of frame of (align) is accurately aligned between mask.
Background technique
As the technology for forming pixel in OLED (Organic Light Emitting Diode) manufacturing process, FMM (Fine is mainly used Metal Mask, fine metal mask) method, this method is by the metal mask (Shadow Mask, shadow mask) of form of film It is tightly attached to substrate and deposits organic matter on required position.
In existing OLED manufacturing process, into strips, after plate etc., OLED is welded and fixed in mask by fabrication mask Pixel deposition frame simultaneously uses.Can have multiple units corresponding with a display on one mask.In addition, in order to manufacture Multiple masks can be fixed on OLED pixel deposition frame and stretch each cover during being fixed on frame by large-area OLEDs Mould, so that it becomes flat.Drawing force is adjusted so that it is very difficult operation that the integral part of mask, which becomes flat,.Especially It is to become flat to make each unit all, while being directed at the mask pattern that size is only several μm to tens of μm, need to finely tune It is applied to the drawing force of each side of mask and the height job requirements of real-time confirmation alignment.
Nevertheless, multiple masks are fixed in a framing process, however it remains between mask and mask list Bad problem is directed between member.In addition, during mask is fixedly welded on frame, the thickness of mask film is excessively thin and face Product is big, therefore there are problems that mask is sagging because of loading or distorts, because fold, burr occur for welding portion in welding process (burr) the problem of of making the alignment of mask unit interlock etc. such as.
In the OLED of ultra high-definition, existing QHD (Quarter High Definition, a quarter high definition) image quality For 500-600PPI (pixel per inch, per inch pixel), the size of pixel reaches about 30-50 μm, and 4K UHD (Ultra High Definition, ultra high-definition), 8K UHD high definition have than higher~860PPI ,~1600PPI's etc. Resolution ratio.In this way, the Pixel Dimensions of the OLED in view of ultra high-definition, need the alignment error between each unit being reduced to several μm Degree will lead to the bad of product beyond this error, so yield may be extremely low.Therefore, it is necessary to develop that mask can be prevented Sagging or distortion etc. deform and make to be directed at accurate technology, and mask is fixed on to the technology etc. of frame.
Summary of the invention
Technical problem
Therefore, the present invention is proposed to solve above-mentioned the problems of the prior art, it is intended that providing one kind The manufacturing device of the one-piece type mask of frame, is capable of forming the integral structure of mask and frame.
In addition, can be prevented under mask the object of the present invention is to provide a kind of manufacturing device of the one-piece type mask of frame Vertical or distortion etc. deforms and keeps alignment accurate.
In addition, the object of the present invention is to provide a kind of manufacturing device of the one-piece type mask of frame, when significant shortening manufactures Between, and it is obviously improved yield.
In addition, can not have in mask the object of the present invention is to provide a kind of manufacturing device of the one-piece type mask of frame In the case where deformation, steadily it is supported and moves.
Technical solution
Above-mentioned purpose of the invention is reached by a kind of manufacturing device of the one-piece type mask of frame, which includes: platform portion, For installing simultaneously braced frame;Clamping part clamps (Gripping) template, bonds and is supported by described in the template Mask;Moving portion is clamped, moves the clamping part along at least one direction in X, Y, Z, θ axis;Head, Xiang Suoshu mask Weld part irradiates laser, and senses the alignment of the mask;And head moving portion, along at least one of X, Y, Z axis The mobile head in direction, wherein upper face of the clamping part to adsorb the template it is at least part of in a manner of into Row clamping.
Described portion may include the frame alignment unit for being directed at the position of the frame.
Described portion may include the heating unit for heating the frame.
The clamping part may include: clamping unit, for clamping the template;Mobile unit is clamped, along X, Y, Z, θ The mobile clamping unit at least one direction in axis;And connection unit, the clamping mobile unit is connected to described Clamp moving portion.
The clamping unit could be formed with multiple absorbing units separated from each other, and multiple absorbing units are used for institute It states template and applies suction pressure.
Multiple absorbing units can be configured to not be overlapped with region of the weld part of the mask on Z axis.
The clamping moving portion includes: base unit;Clamp standoff unit, configuration is on the base unit to support State clamping part;And gripper rail unit, for moving the base unit, wherein the base unit can be along Z axis It is moved in the region that direction is separated with described portion, so that the clamping part enters the top in described portion.
The head may include laser cell, and the laser cell irradiates laser to the mask, by the mask It is welded with the frame, or laser is irradiated to the mask, to carry out laser reconditioning (trimming).
A pair of laser cell is separated from each other configuration, each laser cell side to the mask and separately respectively The weld part of side irradiates laser.
The frame may include: edge frame portion comprising hollow region;Mask unit sheet material portion, has multiple cover Form unit region, and it is connected to the edge frame portion.
The frame can along a first direction and perpendicular at least one direction in the second direction of first direction, Have multiple mask unit regions.
What multiple adsorption holes were formed in the mask unit sheet material portion with the mask unit region separates regulation with corner The part of distance.
Described portion may further include lower support unit, and the lower support unit produces the lower part of the frame Raw suction pressure.
The lower support unit is formed at least one vacuum flow path, and the vacuum flow path can will be from external suction pressure The suction pressure that generation device generates is transmitted to the adsorption hole.
Mask pattern is formed on the mask, the mask can be bonded in the template by temporary adhesion portion.
Invention effect
According to the present invention as constructed as above, mask and frame are capable of forming integral structure.
In addition, in accordance with the invention it is possible to prevent mask sagging or the deformation of distortion etc., and keep alignment accurate.
In addition, and being obviously improved yield in accordance with the invention it is possible to significantly shorten manufacturing time.
In addition, in accordance with the invention it is possible to being steadily supported and moving in the case where mask does not deform.
Detailed description of the invention
Fig. 1 and Fig. 2 is the skeleton diagram for the process being adhered to existing mask on frame.
Fig. 3 is that the skeleton diagram of alignment error occurs between unit during existing mask stretches.
Fig. 4 is the main view and sectional view for the one-piece type mask of frame that one embodiment of the invention is related to.
Fig. 5 is the main view and sectional view for the frame that one embodiment of the invention is related to.
Fig. 6 is the skeleton diagram of the manufacturing process for the frame that one embodiment of the invention is related to.
Fig. 7 is the skeleton diagram of the manufacturing process for the frame that another embodiment of the present invention is related to.
Fig. 8 and Fig. 9 is the schematic top view of the manufacturing device for the one-piece type mask of frame that one embodiment of the invention is related to Figure and main view skeleton diagram.
Figure 10 is the partial enlargement skeleton diagram of the manufacturing device for the one-piece type mask of frame that one embodiment of the invention is related to.
Figure 11 to 12 is the bonding mask metal film in template that one embodiment of the invention is related to, and forms mask, from And manufacture the skeleton diagram of the process of the template of mask support.
Figure 13 is the amplification section skeleton diagram in the temporary adhesion portion that one embodiment of the invention is related to.
Figure 14 is the general of the process that the template for the mask support for being related to one embodiment of the invention is loaded on frame Sketch map.
Figure 15 is that the template for being related to one embodiment of the invention is loaded on frame, so that the cellular zone of mask and frame The skeleton diagram of the corresponding state in domain.
Figure 16 is the skeleton diagram for the process that the mask for being related to one embodiment of the invention is adhered on frame.
Figure 17 is the skeleton diagram for the state that the adsorption hole that an embodiment through the invention is related to applies adsorption capacity to mask.
Figure 18 is to separate the process of mask and template after the mask for being related to one embodiment of the invention is adhered on frame Skeleton diagram.
Figure 19 is the skeleton diagram for the state that the mask for being related to one embodiment of the invention is bonded in frame.
Figure 20 is the general of the OLED pixel precipitation equipment for the one-piece type mask of frame being related to using one embodiment of the invention Sketch map.
Appended drawing reference:
10: the manufacturing device of the one-piece type mask of frame
20: platform portion
30: clamping part
40: clamping moving portion
50: template (template)
51: laser through hole
55: temporary adhesion portion
60: head
70: head moving portion
90: lower support unit
100: mask
110: mask film
200: frame
210: edge frame portion
220: mask unit sheet material portion
221: edge sheet material portion
223: the first grid sheet material portions
225: the second grid sheet material portions
1000:OLED pixel precipitation equipment
C: unit, mask unit
CR: mask unit region
DM: dummy section, mask dummy section
L: laser
P: mask pattern
WB: weld seam
Specific embodiment
It is aftermentioned for detailed description of the invention with reference to the accompanying drawings, which will implement particular implementation of the invention Example is shown as example.These embodiments are sufficiently explained in detail, so that those skilled in the art can implement the present invention.It should Understand, various embodiments of the invention are although different from each other, but are not necessarily mutually exclusive.For example, the specific shape recorded herein, Structure and characteristic are related with an embodiment, without departing from the spirit and scope of the present invention, can be implemented as other realities Apply example.In addition, it will be appreciated that position or the configuration of individual constituent elements in each disclosed embodiment, are not departing from this hair In the case where bright spirit and scope, it is able to carry out change.Therefore, aftermentioned detailed description is not construed as having limitation meaning Justice, as long as suitably illustrating, the scope of the present invention is only limited by appended claims and its equivalent all ranges.Figure In similar appended drawing reference indicate the same or similar function from many aspects, for convenience's sake, length, area, thickness and its Shape can exaggerate expression.
Hereinafter, with reference to the accompanying drawings to a preferred embodiment of the present invention will be described in detail, so as to those skilled in the art's energy It is enough easily to implement the present invention.
Fig. 1 and Fig. 2 is the skeleton diagram that existing mask 1 is adhered to the process on frame 2.Fig. 3 is covered existing During mould 1 stretches F1~F2, the skeleton diagram of the alignment error between generating unit C1~C3.
Referring to Fig.1, existing mask 1 can be manufactured with a formula (Stick-Type) or board-like (Plate-Type).Fig. 1 Shown in mask 1 be used as a formula mask, the two sides of item can be fixedly welded on to OLED pixel deposition and frame 2 and used.
In the main body (Body or mask film 1a) of mask 1, have multiple display unit C.One unit C and intelligence One display of mobile phone etc. is corresponding.Pattern of pixels P is formed in unit C, so as to corresponding with each pixel of display.Amplification When unit C, multiple pattern of pixels Ps corresponding with R, G, B are shown.As an example, pattern of pixels P is formed in unit C, so as to With 70 × 140 resolution ratio.That is, a large amount of pattern of pixels p-shaped is at set, to constitute a unit C, and multiple unit C can To be formed in mask 1.It is illustrated below for the formula mask 1 for having 6 unit C (C1~C6).
(b) of (a) referring to Fig.1, (a) of Fig. 2 and Fig. 2, firstly, a formula mask 1 flatly should be unfolded.In centre Across frame 2 and opposed pairs clamper 3 clamps the two sides of (clamping) mask 1, and with along the long axis side of mask 1 It is stretched to drawing force F1~F2 is applied, mask 1 is flatly unfolded.Also, it is moved along the y-axis for occupying 2 outside of frame Track 4, clamper 3 are moved to position corresponding with frame 2.The size of frame 2 can be the unit C1 for being enough to make a formula mask 1 ~C6 is located at frame inner spare area domain, and size is also possible to be enough to make the unit C1~C6 of multiple formula masks 1 to be located in frame Portion's white space.
Secondly, declining in a pair of of clamper 3 along Z axis moving track 5, the shape that mask 1 is stretched referring to (c) of Fig. 2 Under state, mask is loaded on the frame 2 of block form.Unit C1~C6 of mask 1 will be located at the frame inner spare area of frame 2 Domain part.The size of frame 2, which can be, is enough to make the unit C1~C6 an of mask 1 to be located at frame inner spare area domain, size It is also possible to be enough to make unit C1~C6 of multiple masks 1 to be located at frame inner spare area domain.
Secondly, (d) of (b) referring to Fig.1 and Fig. 2, the drawing force F1~F2 for finely tuning each side for being applied to mask 1 goes forward side by side After row alignment, with a part with the welding such as laser L 1 side of W mask, mask 1 and frame 2 are connected to each other.Also, it clamps Device 3 releases the clamping to mask 1.(c) of Fig. 1 is the lateral section for showing the mask 1 and frame 2 that are connected to each other.
Mask list is shown although fine tuning is applied to drawing force F1~F2 of each side of a formula mask 1 referring to Fig. 3 First C1~C3 is directed at bad problem each other.For example, the distance between pattern P of unit C1~C3 D1~D1 ", D2~ D2 " is different from each other or pattern P is crooked.It include multiple (as an example, being 6) unit C1~C6 since formula mask 1 has Large area, and with tens of μm of very thin thickness, so being easy or distortion sagging because of loading.In addition, adjusting Drawing force F1~F2 so that each unit C1~C6 all becomes flat, while passing through microscope real-time confirmation each unit C1 Alignment between~C6 is very difficult operation.
Therefore, the slight error of drawing force F1~F2 may cause the stretching or exhibition of 1 each unit C1~C3 of a formula mask The error of degree is opened, causes the distance between mask pattern P D1~D1 ", D2~D2 " different as a result,.Although be ideally aligned with It is very difficult for making error 0, but in order to avoid the mask pattern P having a size of several μm to tens of μm is to ultra high-definition OLED's Pixel technique causes bad influence, and preferred alignment error is not more than 3 μm.Alignment error between so adjacent unit is known as picture Plain positioning accuracy (pixel position accuracy, PPA).
In addition, general 6-20 formula masks 1 are connected to a frame 2, at the same make multiple formula masks 1 it Between, and alignment between multiple unit C-C6 of formula mask 1 is accurately very difficult operation, and can only be increased Process time based on alignment, this, which becomes, reduces productive important reason.
On the other hand, after a formula mask 1 being affixed to frame 2, it is applied to drawing force F1~F2 energy of a formula mask 1 It is enough oppositely to act on frame 2.That is, after the formula mask 1 for tightening stretching due to drawing force F1~F2 is connected to frame 2, energy It is enough that tension (tension) is acted on into frame 2.In general, the tension is little, big influence will not be generated to frame 2, but in frame In the case that the size of frame 2 realizes miniaturization and intensity is lower, this tension may make 2 subtle flow of frame.In this way, may send out The problem of raw alignment destroyed between multiple unit C~C6.
In consideration of it, the present invention proposes that mask 100 and frame 200 can be made to form the frame 200 and frame of integral structure The one-piece type mask of frame.The deformations such as sagging or distortion can be prevented by forming integrated mask 100 with frame 200, and accurately In alignment with frame 200.When mask 100 is connected to frame 200, any drawing force, therefore mask 100 are not applied to mask 100 After being connected to frame 200, deformed tension can not be applied to mask 200.Further, it is possible to shorten mask significantly 100 are integrally connected to the manufacturing time of frame 200, and are obviously improved yield.
Fig. 4 is the main view ((a) of Fig. 4) and side section view for the one-piece type mask of frame that one embodiment of the invention is related to Scheme ((b) of Fig. 4), Fig. 5 is the main view ((a) of Fig. 5) and sectional view (figure for the frame that one embodiment of the invention is related to 5 b).
Referring to Fig. 4 and Fig. 5, the one-piece type mask of frame may include multiple masks 100 and a frame 200.Change sentence It talks about, multiple masks 100 is bonded in the form of frame 200 respectively.Hereinafter, for ease of description, with the mask of square shape It is illustrated for 100, but mask 100 is before being bonded in frame 200, can be two sides and have protruding portion for clamping Formula mask shape, after being bonded in frame 200, protruding portion can be removed.
Each mask 100 is formed with multiple mask pattern P, and a mask 100 could be formed with a unit C.One is covered Form unit C can be corresponding with a display of smart phone etc..
It is about 1.0 × 10 that mask 100, which can be thermal expansion coefficient,-6/ DEG C invar alloy (invar) or about 1.0 × 10-7/ DEG C super invar alloy (super invar) material.Since the thermal expansion coefficient of the mask 100 of this material is very low, A possibility that pattern form deformation of mask, is small due to thermal energy, in manufacturing high-resolution OLED, may be used as FMM, shade Mask (Shadow Mask).In addition, it is contemplated that pixel depositing operation is implemented in exploitation in the little range of temperature change value recently Technology, mask 100 is also possible to the materials such as the bigger nickel (Ni) of thermal expansion coefficient ratio, nickel-cobalt (Ni-Co).Mask 100 can With the metal sheet (sheet) for using rolling (rolling) technique or electroforming (electroforming) to generate.
Frame 200 can be formed in a manner of bonding multiple masks 100.Including outermost peripheral edge, frame 200 can be with The multiple corners formed including (for example, lateral) along a first direction, second direction (for example, vertical).This multiple corners can To divide the region of mask 100 to be bonded on frame 200.
Frame 200 may include probably in square shape, the edge frame portion 210 of block form.Edge frame portion 210 Inside can be hollow shape.That is, edge frame portion 210 may include hollow region R.Frame 200 can be by invar alloy, super The metal materials such as grade invar alloy, aluminium, titanium are formed, it is contemplated that thermal deformation, preferably by there is same coefficient of thermal expansion with mask The materials such as invar alloy, super invar alloy, nickel, nickel-cobalt are formed, these materials can be applied to all as frame 200 Edge frame portion 210, the mask unit sheet material portion 220 of constituent element.
It in addition, frame 200 has multiple mask unit region CR, and may include being connected to edge frame portion 210 Mask unit sheet material portion 220.Mask unit sheet material portion 220 can be formed by rolling identically as mask 100, or by such as Electroforming is formed using other film-forming process.In addition, mask unit sheet material portion 220 can be by laser scribing, etching etc. flat After forming multiple mask unit region CR on planar sheet material (sheet), it is connected to edge frame portion 210.Alternatively, mask unit piece After planar sheet material can be connected to edge frame portion 210 by material portion 220, multiple cover is formed by laser scribing, etching etc. Form unit region CR.Mainly to first after mask unit sheet material portion 220 forms multiple mask unit region CR in this specification, The case where being connected to edge frame portion 210 is illustrated.
Mask unit sheet material portion 220 may include edge sheet material portion 221 and the first grid sheet material portion 223, the second grid At least one of sheet material portion 225.Edge sheet material portion 221 and the first grid sheet material portion 223, the second grid sheet material portion 225 are Refer to the various pieces divided on same sheet material, they are formed as one each other.
Edge sheet material portion 221 can be essentially connected to edge frame portion 210.Therefore, edge sheet material portion 221 can have Substantially square shape corresponding with edge frame portion 210, block form.
In addition, the first grid sheet material portion 223 (transverse direction) can extend to form along a first direction.First grid sheet material portion 223 are formed with rectilinear configuration, and both ends may be coupled to edge sheet material portion 221.When mask unit sheet material portion 220 includes multiple the When one grid sheet material portion 223, the preferred spacing having the same in each first grid sheet material portion 223.
In addition, further, the second grid sheet material portion 225 can be extended to form along second direction (vertical), second gate Lattice sheet material portion 225 is formed with rectilinear configuration, and both ends may be coupled to edge sheet material portion 221.First grid sheet material portion 223 and Two grid sheet material portions 225 can perpendicularly cross each other.When mask unit sheet material portion 220 includes multiple second grid sheet material portions 225 When, the preferred spacing having the same in each second grid sheet material portion 225.
On the other hand, the spacing between the first grid sheet material portion 223 and the spacing between the second grid sheet material portion 225, can It is identical or different with the size according to mask unit C.
Although the first grid sheet material portion 223 and the second grid sheet material portion 225 have the thin thickness of film morphology, It can be the quadrangle form, triangular shaped etc. of rectangle, parallelogram perpendicular to the shape in the section of length direction, Side, a part of of angle can form circle.Cross sectional shape can be adjusted during laser scribing, etching etc..
The thickness in edge frame portion 210 can be greater than the thickness in mask unit sheet material portion 220.Due to edge frame portion 210 It is responsible for the integral rigidity of frame 200, can be formed with the thickness of several mm to tens of cm.
For mask unit sheet material portion 220, the difficulty in process of sheet material is actually manufactured, it is blocked up, it is likely that Organic material resource 600 (referring to Figure 20) blocking passes through the path of mask 100 in OLED pixel depositing operation.On the contrary, excessively thin, then having can It can be difficult to ensure the rigidity for being enough to support mask 100.Mask unit sheet material portion 220 is preferably thicker than edge frame portion 210 as a result, Spend it is thin, but it is thicker than mask 100.The thickness in mask unit sheet material portion 220 may be about 0.1mm to 1mm.Also, the first grid Lattice sheet material portion 223, the second grid sheet material portion 225 width may be about 1~5mm.
In planar sheet material, in addition to edge sheet material portion 221, the first grid sheet material portion 223, the second grid sheet material portion 225 Other than the region occupied, multiple mask unit region CR (CR11~CR56) can be provided.For another angle, mask list First region CR can refer in the hollow region R in edge frame portion 210, in addition to edge sheet material portion 221, the first grid sheet material portion 223, the white space other than the region that the second grid sheet material portion 225 occupies.
As the unit C of mask 100 is corresponding with the mask unit region CR, can actually function as through mask pattern P Deposit the channel of the pixel of OLED.As previously mentioned, a mask unit C is corresponding with a display of smart phone etc..One It could be formed with the mask pattern P for constituting a unit C in mask 100.Alternatively, a mask 100 has multiple unit C And each unit C can be corresponding with each unit region CR of frame 200, but in order to be accurately aligned with mask 100, need to keep away Exempt from large area mask 100, is preferably provided with the small area mask 100 of a unit C.Alternatively, being also possible to have multiple unit C's One mask 100 is corresponding with a unit area CR of mask 200.At this point, in order to be accurately aligned with, it may be considered that have 2-3 The mask 100 of a unit C is corresponding with a unit area CR of mask 200.
Mask 200 has multiple mask unit region CR, can by each mask 100 with each mask unit C with it is each CR corresponding mode in mask unit region bonds.Each mask 100 may include the mask for being formed with multiple mask pattern P The dummy section (being equivalent to 110 part of mask film other than unit C) on unit C and the periphery mask unit C.Dummy section can be with Mask film 110 is only included, or may include the mask film for being formed with the defined dummy pattern of form similar with mask pattern P 110.Mask unit C is corresponding with the mask unit region CR of frame 200, and some or all of dummy section can be bonded in frame Frame 200 (mask unit sheet material portion 220).Mask 100 and frame 200 can form integral structure as a result,.
On the other hand, according to another embodiment, frame is not so that mask unit sheet material portion 220 is bonded in edge frame portion 210 mode manufactures, but the hollow region R-portion that can be used in edge frame portion 210 is directly formed and edge frame portion The frame of 210 grid frames (being equivalent to grid sheet material portion 223,225) being integrally formed.The frame of this form also includes at least One mask unit region CR, can make mask 100 corresponding with mask unit region CR, to manufacture the one-piece type mask of frame.
Hereinafter, being illustrated to the manufacturing process of the one-piece type mask of frame.
It is possible, firstly, to provide frame 200 described in Fig. 4 and Fig. 5.Fig. 6 is the frame that one embodiment of the invention is related to The skeleton diagram of the manufacturing process of frame 200.
Referring to (a) of Fig. 6, edge frame portion 210 is provided.Edge frame portion 210 can be the box including hollow region R Shape.
Secondly, manufacturing mask unit sheet material portion 220 referring to (b) of Fig. 6.Mask unit sheet material portion 220 uses rolling, electricity Casting or other film-forming process after manufacturing planar sheet material, by laser scribing, etching etc., remove mask unit region The part CR, so as to manufacture.In this specification, carried out for forming 6 × 5 mask unit region CR (CR11~CR56) Explanation.There may be 5 the first grid sheet material portions 223 and 4 the second grid sheet material portions 225.
It is then possible to which mask unit sheet material portion 220 is corresponding with edge frame portion 210.During corresponding, Ke Yi All sides in F1~F4 mask unit sheet material portion 220 are stretched so that in the state of the flat stretching, extension in mask unit sheet material portion 220, are made Edge sheet material portion 221 is corresponding with edge frame portion 210.A side also can using multiple points (as the example of (b) of Fig. 6,1~3 Point) it clamps mask unit sheet material portion 220 and is stretched.On the other hand, it may not be all sides, but along a part Side direction stretches F1, F2 mask unit sheet material portion 220.
Then, by mask unit sheet material portion 220 when alloing mask unit sheet material portion 220 corresponding with 210 pairs of edge frame portion Edge sheet material portion 221 bonded in a manner of W by welding.Preferably, all sides W are welded, so that mask unit sheet material portion 220 is secured Ground is bonded in edge frame portion 210.Welding W should be carried out close to the corner side of frame section 210 to the maximum extent, it could maximum limit Degree ground reduces the tilting space between edge frame portion 210 and mask unit sheet material portion 220, and promotes adhesiveness.Weld the part W It can be generated with line (line) or point (spot) shape, there is material identical with mask unit sheet material portion 220, and can be at For the medium that edge frame portion 210 and mask unit sheet material portion 220 link into an integrated entity.
Fig. 7 is the skeleton diagram of the manufacturing process for the frame that another embodiment of the present invention is related to.The embodiment of Fig. 6 is made first After making the mask unit sheet material portion 220 for having mask unit region CR, it is bonded in edge frame portion 210, and the embodiment of Fig. 7 will After planar sheet material is bonded in edge frame portion 210, the mask unit region part CR is formed.
Firstly, (a) with Fig. 6 provides the edge frame portion 210 including hollow region R in the same manner.
Then, referring to (a) of Fig. 7, planar sheet material (planar 220 ' of mask unit sheet material portion) and side can be made Edge frame section 210 is corresponding.220 ' of mask unit sheet material portion is the flat state that mask unit region CR has not yet been formed.Corresponding In the process, all sides of 220 ' of F1~F4 mask unit sheet material portion can stretched so that 220 ' of mask unit sheet material portion are flat Under extended state, keep it corresponding with edge frame portion 210.A side also can using multiple points (as the example of (a) of Fig. 7,1~3 A point) clamping unit sheet material portion 220 ' and stretched.On the other hand, it may not be all sides, but along a part Side direction stretches 220 ' of F1, F2 mask unit sheet material portion.
Then, by mask unit sheet material portion when alloing 220 ' of mask unit sheet material portion corresponding with 210 pairs of edge frame portion The marginal portion of 220 ' is bonded in a manner of W by welding.Preferably, all sides W are welded, so as to 220 ' of mask unit sheet material portion It is bonded in edge frame portion 220 securely.Welding W should be carried out close to the corner side in edge frame portion 210 to the maximum extent, The tilting space between 220 ' of edge frame portion 210 and mask unit sheet material portion can be reduced to the maximum extent, and promotes adhesiveness. Welding the part W can be generated with line (line) or point (spot) shape, have identical material with 220 ' of mask unit sheet material portion, And the medium that edge frame portion 210 and 220 ' of mask unit sheet material portion link into an integrated entity can be become.
Then, it referring to (b) of Fig. 7, is formed and is covered on planar sheet material (planar 220 ' of mask unit sheet material portion) Form unit region CR.By laser scribing, etching etc., the sheet material of the mask unit region part CR is removed, is covered so as to be formed Form unit region CR.In this specification, it is illustrated for forming 6 × 5 mask unit region CR (CR11~CR56).When When forming mask unit region CR, mask unit sheet material portion 220 may be constructed, wherein the portion of W is welded with edge frame portion 210 It is divided into edge sheet material portion 221, and has 5 the first grid sheet material portions 223 and 4 the second grid sheet material portions 225.
Fig. 8 and Fig. 9 is that the vertical view of the manufacturing device 10 for the one-piece type mask of frame that one embodiment of the invention is related to is general Sketch map and main view skeleton diagram.Figure 10 is the office of the manufacturing device 10 for the one-piece type mask of frame that one embodiment of the invention is related to Portion's enlarged outline map.It illustrates for frame 200 with 2 × 5 mask unit region CR (CR11~CR52) in Fig. 8 to 10 Explanation.
Referring to Fig. 8 to 10, the one-piece type mask set 10 of frame includes workbench 15, platform portion 20, clamping part 30, clamping movement Portion 40, head 60, head moving portion 70, vibration isolator 80 etc..
Firstly, the workbench 15 of referred to as rack (gantry) is arranged on works, which is securely disposed at ground Face, so as to prevent external vibration or impact.In order to carry out relatively reliable technique, the upper face of workbench 15 is needed Accurate leveling.
The platform portion 20 for installing simultaneously braced frame 200 is provided on workbench 15.Platform portion 20 may include loading part 21, Frame alignment unit 23 and frame holding unit 25.Furthermore it is also possible to further comprise heating unit (not shown), backlight list First (not shown).
Loading part 21 can be corresponding with the main body in platform portion 20, can have wide plate form, so as to provide load frame 200 region.It may further include platform moving portion 27 on workbench 15, platform moving portion 27 can be along in X, Y, Z, θ axis At least one direction mobile station portion 20 (alternatively, loading part 21).θ axis direction can refer in X/Y plane, YZ plane, XZ plane The angle of rotation.Platform moving portion 27 is shown in track form, so as to move loading part along Y direction in Fig. 8 and Fig. 9 21.But it is not limited to this, shifting well known to track form, conveyer belt form, hinge form, motor, gear etc. can be used Dynamic/slewing, so as to move/rotate along different directions.
Frame alignment unit 23 can be only fitted to each side of frame support 25 or frame 200, each corner, with alignment The position of frame 200.
Frame holding unit 25 can have box form similar with frame 200, so as to install simultaneously braced frame 200, and can be only fitted in loading part 21 or frame alignment portion 23.Frame holding unit 25 can be bonded in mask 100 Prevent edge frame portion 210 and mask unit sheet material portion 220 from deforming in the process of frame 200 because of tension.Frame support Unit 25 can be configured to cling to frame 200 from the lower part of frame 200.25 upper surface of frame holding unit could be formed with Close fit is inserted into multiple slots in edge frame portion 210 and grid frame portion 220, and installation frame can be inserted in slot 200.Therefore, though because mask is bonded in frame 200 apply tension in the state of, can also prevent the deformation of frame 200. Frame holding unit 25 be also possible to in Figure 17 will aftermentioned lower support unit 90 form integrated structure.
Thereafter, in bonding mask 100 again on adjacent unit C, adjacent multiple masks 100 are for configuring in-between Frame 200 apply opposite power, as a result, being applied to the tension of frame 200 can be cancelled.Offset this tension with Before, that is, when only bonding a mask 100, as frame holding unit 25 is installed and stores frame 200, it can prevent in mask The deformation of frame 200 in 100 bonding process.
Mask 100 is adhered in the process on frame 200, heating unit controllable technological temperature (not shown), or Heating frame.
As back light unit (not shown) shines towards vertical upper (Z axis) direction, the camera on head 60 can contribute to The alignment form of the confirmation of unit 65 mask pattern P.It shines towards vertical upper direction, directly luminous infiltration type can be used, And the light set is sent out towards vertical lower direction after reflection, the reflection-type etc. to shine towards upper direction.
Clamping part 30 includes clamping unit 31, clamping mobile unit 35, connection unit 37.Clamping part 30 can be to template 50 It is clamped, bonded in the template 50 and is supported by mask 100.At this point, clamping can pass through the top table of absorption template 50 At least part in face and carry out.Alternatively, clamping may include the fixed form 50 in the range of not influencing on mask 100 A part and carry out.
Clamping unit 31 can be clamped in a manner of adsorbing the upper face of template 50.Clamping unit 31 is in X/Y plane Be formed as horizontal shape, its underpart surface is formed with multiple absorbing units 32.
Absorbing unit 32 can be separately connected to the lower part of clamping unit 31, or can be in clamping unit 31 with Adsorb the part that pore morphology is formed.With applying suction pressure to the upper face of template 50 by absorbing unit 32, template 50 can be with It is adsorbed in the lower surface of clamping unit 31.Although to the configuration of absorbing unit 32, there is no limit it is preferred that and mask 100 region of weld part (region for carrying out laser welding) on Z axis is not overlapped, to prevent from stopping the access path of laser.
Clamping mobile unit 35 can move clamping unit 31 along at least one direction in X, Y, Z, θ axis.In the present invention, Due to replacing movement of the clamping unit 31 in X-axis and Y direction by clamping moving portion 40, thus, it is supposed that clamping is mobile single Member is moved along the direction of Z, θ axis, and is explained.Mobile unit 35 can not use can edge with limiting for clamping Well known movement/slewing of different directions movement/rotation.On the other hand, it may further include for connecting clamping The auxiliary unit 33 of unit 31 and clamping mobile unit 35.
Clamping mobile unit 35 can be connected to clamping moving portion 40 (or clamp standoff unit 43) by connection unit 37 On.
Clamping moving portion 40 can move clamping part 30 along at least one direction in X, Y, Z, θ axis.Wherein, it should be appreciated that It is mobile in addition to clamping part 30 is fixed on clamping moving portion 40 in the state of, clamping moving portion 40 along in X, Y, Z, θ axis extremely A few direction is mobile, so as to can also be included in clamping moving portion 40 other than the concept that clamping part 30 moves together and not move In the state of, the concept of mobile clamping part 30.In the present invention, it is assumed that X of the clamping moving portion 40 along clamping part 30, Y-axis side To being moved, and clamps mobile unit 35 or clamp standoff unit 43 and moved along Z, θ axis direction of clamping part 30 It is dynamic, and be explained.
Clamping moving portion 40 may include base unit 41, clamp standoff unit 43, gripper rail unit 45.
Base unit 41 is wide plate form, and top can provide the space for configuring clamp standoff unit 43.Also, its Both sides are connected on gripper rail unit 45, so as to move along the formation direction of gripper rail unit 45.
Clamp standoff unit 43 configures on base unit 41, so as to support clamping part 30.Clamp standoff unit 43 It can be moved along the formation direction for the base track unit 44 being formed on base unit 41.
Gripper rail unit 45 can be formed in the two of platform portion 20 along the formation direction of platform portion 20 (alternatively, loading part 21) Side, and base unit 41 can move on gripper rail unit 45.
According to an embodiment, platform portion 20 is formed approximately along X-direction, can be along X-axis in the long side part in platform portion 20 Direction is formed with a pair of of gripper rail unit 45.Also, base unit 41 is extended to form along Y direction, and both ends connect respectively It connects in a pair of of gripper rail unit 45, so as to be moved along X-direction.Also, along Y direction on base unit 41 It is formed with base track unit 44, clamp standoff unit 43 is connected on base track unit 44, so as to along Y direction It is mobile.
It can be configured with frame 200 in the left part in platform portion 20, and be configured with clamping part 30 in right part And clamping moving portion 40.Base unit 41 and platform portion 20 are separated from each other on Z axis.Therefore, even if base unit 41 passes through folder Hold the region configured with frame 200 that track element 45 is moved to left side along X-direction, frame 200 and base unit 41 It can not interfere each other.Thus, it is possible to make the pallet 50 clamped by the clamping part 30 being supported on base unit 41 and frame 200 On specific unit region CR it is corresponding.
Head 60 configures in platform portion 20, the top of clamping part 30.Head 60 is provided with laser cell 61 (61a, 61b), phase Machine unit 65, gap sensor (gap sensor), bad analytical unit 67 etc..
The laser L for solder mask and frame 200 can be generated in laser cell 61.Alternatively, laser cell 61 can also be with It generates and mask 100 is irradiated to carry out the cutting laser of laser reconditioning.A pair of of laser cell 61 (61a, 61b) is opposite each other, and And it can be set into and can adjust X, the position in Y-axis.The distance separated can be welded with the left side weld part of mask 100 and right side The distance of socket part is corresponding.When irradiating laser L to be adhered to mask on frame 200, do not need respectively to mask 100 Left/right weld part irradiates laser L, can be welded by disposably irradiating laser L.The two sides of mask 100 as a result, It is adhered on frame 200 simultaneously, therefore compared to the technique of each bonding side, the process time can be shortened, and by mask 100 are steadily adhered on frame 200 in indeformable situation.
Camera unit 65 can shoot and sense the alignment of mask 100, mask pattern P.Gap sensor unit can To measure the distance between Z axis displacement or head 60 and mask 100, frame 200 etc..Bad analytical unit, which can detecte, to be covered The defective mode of mould 100.
Head moving portion 70 (71,75) can be along at least one direction moving-head 60 in X, Y, Z, θ axis.The present invention In, it is assumed that head moving portion 70 is explained only along X-axis moving-head 60.First moving portion 71 is connected with head 60 top, thus receive mobile power, in second moving portion 75 that the lower part with first moving portion 71 is spaced apart, It is connected with the primary structure on head 60, X-axis guiding piece 76 can be directed along and moved in the X-axis direction.
Vibration isolator 80 workbench 15 can vibrate and be arranged in order to prevent.When mask 100 is adhered on frame 200, i.e., Make in the environment of very small vibration occurs, also can the alignment error PPA to mask pattern P impact.It is therefore preferable that Ground, the lower part of workbench 15 is arranged in passive type damper (passive isolator) by vibration isolator 80, so as to prevent Vibration.
Figure 11 to 12 is the bonding mask metal film 110 in template 50 that one embodiment of the invention is related to, and is formed and covered Mould 100, to manufacture the skeleton diagram of the process of the template of mask support.
1 (a) referring to Fig.1 can provide template (template) 50.Template 50, which can be, adheres to and props up in mask 100 It supports and carries out mobile medium in the state of a surface.Preferably, a surface of template 50 is flat, so as to support and move Flat mask 100.Central part 50a can be corresponding with the mask unit C of mask metal film 110, and edge part 50b and mask gold The dummy section for belonging to film 110 is corresponding.Template 50 can be the massive plate shape that area is greater than mask metal film 110, so as to prop up It is whole to support mask metal film 110.
Preferably, template 50 is transparent material, so as to by 100 alignment framework 200 of mask and during bonded, Easily field of view (vision) etc..In addition, transparent material can be with transmission laser.As transparent material, glass can be used Glass (glass), silica (silica), heat resistant glass, quartz (quartz), alchlor (Al2O3), borosilicate glass The materials such as (borosilicate glass), zirconium oxide (zirconia).As an example, borosilicate glass can be used in template 50 With outstanding heat resistance, chemical durability, mechanical strength, the transparency etc. in glass33 materials.Separately Outside,33 thermal expansion coefficient is about 3.3, the thermal expansion coefficient with invar alloy mask metal film 110 Difference is small, therefore is easy to control mask metal film 110.
On the other hand, the surface of template 50 contacted with mask metal film 110 can be mirror surface, so as to golden with mask Belong to and gap (air gap) does not occur between the interface of film 110 (or mask 100).In consideration of it, the surface on a surface of template 50 Rough overshoot Ra can be 100nm or less.In order to realize that surface rough overshoot Ra is 100nm template 50 below, template 50 can make With chip (wafer).The surface rough overshoot Ra of chip is about 10nm, and product is numerous in the market, and surface treatment procedure is wide To know, therefore it may be used as template 50.The surface rough overshoot Ra of template 50 is nm grades, therefore does not have gap, or almost do not have Have, is easy to generate weld seam WB by laser welding, therefore the alignment error of mask pattern P can not be impacted.
Template 50 could be formed with laser through hole 51, so that the laser L irradiated from 50 top of template reaches mask 100 Weld part (to-be-welded region).Laser through hole 51 can be formed in mould in a manner of corresponding with the position of weld part and quantity Plate 50.Multiple weld parts are at the edge or dummy section DM of mask 100 to provide spacing configuration, therefore multiple laser through holes 51 It can also be formed in a manner of corresponding with regulation spacing.As an example, virtual in the two sides (left/right) of mask 100 Portion DM, to provide that spacing configures multiple weld parts 100, therefore between the two sides of template 50 (left/right) can also be to provide Away from the multiple laser through holes 51 of formation.
Laser through hole 51 is not necessarily corresponding with the position of weld part and quantity.For example, it is also possible to only to a part Laser through hole 51 irradiates laser L, to be welded.In addition, also can be used and weld when mask 100 is aligned with template 50 A part in the not corresponding laser through hole 51 of socket part, to substitute alignment mark.If the material of template 50 is saturating to laser L It is bright, then it can not also form laser through hole 51.
Temporary adhesion portion 55 can be formed on a surface of template 50.Before mask 100 is bonded in frame 200, face When bonding part 55 (or the mask metal film 110) temporary adhesion of mask 100 can be made in a surface of template 50, to be supported on In template 50.
Temporary adhesion portion 55 can be used can by adhesive or adhesive sheet that heating separates, can be (purple by UV Outside line) it irradiates and isolated adhesive or adhesive sheet.
As an example, liquid wax (liquid wax) can be used in temporary adhesion portion 55.Liquid wax can be used and in crystalline substance Wax used in polishing step of piece etc. is identical, is not specially limited to its type.Liquid wax may include acrylic acid tree The substances such as rouge, vinyl acetate, nylon and multiple polymers and solvent, as being mainly used for, control is relevant to retentivity The resin component of bonding force, impact resistance etc..As an example, temporary adhesion portion 55 can be used nitrile rubber (ABR, Acrylonitrile butadiene rubber) it is used as resin component, and use the SKYLIQUID comprising normal propyl alcohol ABR-4016 is as solvent composition.Liquid wax can be formed in temporary adhesion portion 55 by spin-coating method.
Temporary adhesion portion 55 as liquid wax is reduced in the at a temperature of viscosity higher than 85 DEG C~100 DEG C, is being lower than 85 DEG C At a temperature of viscosity increase, and can as solid local solidification, so as to by mask metal film 110' and template 50 It fixes and is bonded together.
Before or after preparing template 50, mask metal film 110 can be prepared.
As an embodiment, mask metal film 110 can be prepared with rolling mode.The sheet metal manufactured by rolling process Material can have tens of to hundreds of μm of thickness in manufacturing process.For the high-resolution of UHD level, it should use with a thickness of 20 μm of relatively thin mask metal films 110 below, just it can be carried out fine patterning, for the ultrahigh resolution of UHD or more, it should Use the relatively thin mask metal film 110 with a thickness of 10 μm.But the mask metal made of rolling (rolling) process Film 110' with a thickness of about 25~500 μm, it is therefore desirable to become thinner its thickness.
Therefore, it can make a surface planarisation PS's (1 (b) referring to Fig.1) of mask metal film 110' with further progress Process.Wherein, planarization PS refers to that removal is covered while a surface (upper surface) of mask metal film 110' is carried out mirror-polishing The a part on the top of mould metal film 110', thus reducing thickness.Planarization PS can pass through CMP (Chemical Mechanical Polishing, chemically mechanical polishing) method carries out, and can use well known CMP method without restriction. Furthermore it is possible to by chemical wet etch (chemical wet etching) or dry-etching (dry etching) method, Reduce the thickness of mask metal film 110'.Further, it is also possible to without restriction using the thickness that can make mask metal film 110' Thinning planarization process.
During implementing to planarize PS, during CMP as an example, the top mask metal film 110' can be controlled The surface roughness R on surfacea.Preferably, the mirror-polishing of surface rough overshoot can be further decreased.Alternatively, as another Example can increase the polishing such as others CMP process after carrying out chemical wet etch or dry etch process to implement to planarize PS Process, to reduce surface roughness Ra
In this way, the thickness of mask metal film 110' can be contracted to about 50 μm or less.It is therefore preferred that by mask gold The thickness for belonging to film 110 is formed as about 2 μm to 50 μm, it is further preferred that thickness can be formed as to about 5 μm to 20 μm.But and It is nonessential to be defined in this.
As another embodiment, mask metal film 110 can be prepared by electroforming mode.
The substrate of motherboard can be conductive material, so as to implement electroforming.Motherboard can be used as cathode in electroforming Body.
As conductive material, metal can generate metal oxide on the surface, can flow in metal manufacturing process Entering has impurity, and polycrystalline silicon substrate may exist field trash or crystal boundary (Grain Boundary), and electroconductive polymer substrate contains There is a possibility that impurity height, and intensity, acid resistance etc. may be fragile.By such as metal oxide, impurity, field trash, crystal boundary Deng obstruction motherboard (or cathode) surface be formed uniformly electric field factor be known as " defect " (Defect).Due to defect (Defect), uniform electric field can not be applied to the cathode of the material, it is possible to cause to unevenly form a part of plated film 110 (or mask metal films 110).
Realize UHD rank more than ultra high-definition pixel in, plated film and plating film figure (mask pattern P) it is uneven, It is possible that generating deleterious effect to pixel is formed.For example, current QHD image quality be 500-600PPI (pixel per inch, often Inch pixel), pixel size is about 30-50 μm, 4K UHD, 8K UHD high image quality have than higher~860PPI ,~ The resolution ratio of 1600PPI etc..It directly applies to the miniscope of VR equipment or is inserted into the miniature display used after VR equipment For device using the high-resolution of about 2000PPI or more rank as target, pixel size is about 5~10 μm.FMM, shade applied to this The pattern width of mask can be formed as several μm to tens of μm sizes, preferably smaller than 30 μm of size, therefore several μm of sizes lack Falling into is also the size that very big specific gravity degree is occupied in the pattern dimension of mask.In addition, in order to remove the cathode of the material Defect can carry out the additional process for removing metal oxide, impurity etc., should be possible to cause cathode material again in the process The other defect being etched etc..
Therefore, the motherboard (or cathode) of single crystal silicon material can be used in the present invention.In particular it is preferred that monocrystalline silicon material Material.10 can be carried out to the motherboard of single crystal silicon material19/cm3Above high-concentration dopant, so as to conductive.Doping can be with Entire motherboard is carried out, can also only the local surfaces to motherboard be carried out.
On the other hand, monocrystal material can be used the metals such as Ti, Cu, Ag, GaN, SiC, GaAs, GaP, AlN, InN, InP, The Carbon materials such as the semiconductors such as Ge, graphite (graphite), graphene (graphene) include CH3NH3PbCl3、 CH3NH3PbBr3、CH3NH3PbI3、SrTiO3Deng perovskite (perovskite) structure etc. superconduction single-crystal ceramic, aircraft Components Single crystal superalloy etc..Metal, Carbon materials are usually conductive material.Semiconductor material can carry out 1019/ cm3Above high-concentration dopant, so as to conductive.Other materials can be doped or be formed Lacking oxygen (oxygen Vacancy) etc., to form electric conductivity.Doping can integrally be carried out in motherboard, can also only be carried out in the local surfaces of motherboard.
Monocrystal material is not due to having a defect, when electroforming, generates uniform due to forming uniform electric field in overall surface Plated film 110.The one-piece type mask 100,200 of the frame manufactured by uniform plated film can further improve the image quality of OLED pixel It is horizontal.Also, due to the additional process without being removed, eliminating defect, it can reduce the cost of technology, and promote productivity.
Conductive substrate is used as motherboard (cathode (Cathode Body)), separates configuration anode bodies (not shown), and And plated film 110 (or mask metal film 110) can be formed by electroforming on conductive substrate.
It is then possible to separate plated film 110 from conductive substrate.
On the other hand, plated film 110 can be heat-treated before conductive substrate separation.In order to reduce mask 100 Thermal expansion coefficient, while preventing the thermal deformation of mask 100 and mask pattern P, separating plated film 110 from conductive substrate (alternatively, motherboard, cathode) in the past, is heat-treated.Heat treatment can be carried out with 300 DEG C to 800 DEG C of temperature.
Generally, compared with the invar alloy thin plate made of rolling, the heat of invar alloy thin plate made of electroforming The coefficient of expansion is high.Therefore, invar alloy thin plate is heat-treated, so as to reduce thermal expansion coefficient, but the heat treatment In the process it is possible that peeling-off, deformation of invar alloy thin plate etc..This is because in the case where being bonded in conductive substrate state, in addition to Other than the upper face of conductive substrate, also by plated film 110 formed to side and to a part of lower surface, even if then into Row heat treatment, also not peeling-off, deformation etc., can be steadily heat-treated.
Compared with rolling process, the thickness of the mask metal film 110 generated by electroforming process can be thinner.Therefore, also It can be omitted the planarization PS process of reducing thickness, but according to the composition of the superficial layer of electroplating mask metal film 110', crystallization Structure/microstructure and etching characteristic are possible to different, it is therefore desirable to control surface characteristic, thickness by planarization PS.
Then, 1 (b) referring to Fig.1, can in template 50 bonding metal film 110'.By liquid wax be heated to 85 DEG C with On, after so that mask metal film 110' is contacted with template 50, pass through mask metal film 110' and template 50 between roller, so as to To be bonded.
According to an embodiment, the drying (baking) of about 120 DEG C, 60 seconds is carried out in template 50, so that temporary adhesion portion 55 Solvent be vaporized, and can directly be masked metal film stacking (lamination) process.Stacking can be in a table Face is formed with loading mask metal film 110' in the template 50 in temporary adhesion portion 55, makes it through about 100 DEG C of upper roll (roll) it is carried out between about 0 DEG C of lower rollers.As a result, mask metal film 110' can be contacted by temporary adhesion portion 55 In template 50.
Figure 13 is the enlarged section skeleton diagram in the temporary adhesion portion 55 that one embodiment of the invention is related to.As another example, Hot stripping tape (thermal release tape) can be used in temporary adhesion portion 55.Hot stripping tape can be matches in centre It is equipped with the cores such as PET film film 56, (hot soarfing is from adhesive, thermal in the adhesive layer of two surface configuration heat-peelables of core film 56 Release adhesive) 57a, 57b, in exterior arrangement stripping film/release film 58a, 58b shape of adhesive layer 57a, 57b. Wherein, adhesive layer 57a, the 57b of configuration on 56 liang of surfaces of core film can have exfoliation temperature different from each other.
According to an embodiment, in the state of removing stripping film/release film 58a, 58b, the lower surface of hot stripping tape (the second adhesive layer 57b) can be bonded in template 50, and the upper face (the first adhesive layer 57a) of hot stripping tape is bonded in and covers Mould metal film 110'.First adhesive layer 57a and the second adhesive layer 57b has exfoliation temperature different from each other, therefore when aftermentioned Figure 18 in when separating template 50 from mask 100, by apply make the first adhesive layer 57a hot soarfing from heat, mask 100 can be from Template 50 and temporary adhesion portion 55 separate.
Then, with further reference to (b) of Figure 11, a surface of mask metal film 110' can be made to carry out planarization PS.Such as Upper described, it is thick that the mask metal film 110' made of rolling process can reduce (110'- > 110) by planarization PS process Degree.Also, by mask metal film 110 made of electroforming process may be control surface characteristic, thickness carry out it is flat Change PS process.
As a result, as shown in (c) of Figure 11, as the thickness of mask metal film 110' reduces (110'- > 110), mask metal The thickness of film 110 can be formed as about 5 μm to 20 μm.
Then, 2 (d) referring to Fig.1, can form the insulation division 25 being patterned on mask metal film 110.Insulation division 25 can be formed by Other substrate materials using print process etc..
Then, the etching of metal film 110 can be masked.Dry-etching, wet etching can be used without restriction The methods of, etching result can be eclipsed from the part of the mask metal film 110 of the exposure of hollow space 26 between insulation division 25 It carves.The part that is etched of mask metal film 110 may be constructed mask pattern P, and manufacture the mask for being formed with multiple mask pattern P 100。
Then, 2 (e) referring to Fig.1, can remove insulation division 25, to complete the template 50 for being used to support mask 100 Manufacture.
Mask 100 may include be formed with multiple mask pattern P the periphery mask unit C and mask unit C it is virtual Portion DM.Dummy section DM is corresponding with mask film 110 (the mask metal film 110) part other than unit C, can only include mask Film 110, or the mask film 110 including being formed with shape defined dummy section pattern similar with mask pattern P.Dummy section DM Corresponding to the edge of mask 100, some or all of dummy section DM can be bonded in (the mask unit sheet material portion of frame 200 220)。
The width of mask pattern P can be for less than 40 μm, the thickness of mask 100 can be about 5~20 μm.Frame 200 has There are multiple mask unit region CR, therefore it is corresponding to have the mask unit C that multiple masks 100 and the multiple mask have In each mask unit region CR.Furthermore it is possible to have the multiple template 50 for being used to support each mask 100.
Figure 14 is that the template 50 for the mask support for being related to one embodiment of the invention is loaded into the process on frame 200 Skeleton diagram.
Referring to Fig.1 4, template 50 can be clamped the transfer of portion 30.Adsorbable be bonded with of absorbing unit 32 of clamping part 30 is covered The opposed surface on 50 surface of template of mould 100 is simultaneously transferred.Clamping part 30 adsorbs and transfers template 50, and mask 100 is by facing When bonding part 55 bond and be supported in template 50, therefore, though on frame 200 transfer template 50 during, will not shadow Ring the tacky state and alignment of mask 100.
Figure 15 is that the template 50 for being related to one embodiment of the invention is loaded on frame 200, so that mask 100 and frame The skeleton diagram of the 200 corresponding state of unit area CR (CR11~CR52).Hereinafter, having 2 × 5 mask list to frame 200 First region CR (CR11~CR52) is illustrated.
Then, referring to Fig.1 5, mask 100 can be made corresponding with a mask unit region CR of frame 200.By by mould Plate 50 is loaded into frame 200 (alternatively, mask unit sheet material portion 220), can make CR pairs of mask 100 and mask unit region It answers.Control clamping part 30 position while, can be observed by the camera unit 65 on head 60 mask 100 whether with mask Unit area is corresponding.Since template 50 squeezes mask 100, mask 100 and frame 200 can be close to.
On the other hand, lower support unit 90 (referring to Fig.1 7) can also further be configured in 200 lower part of frame.Lower part branch Support unit 90, which can be, forms integrated structure with frame holding unit 26.Lower support unit 90, which can have, is able to enter frame The size of degree in the hollow region of frame edge part 210, and can be writing board shape.In addition, lower support unit 90 Upper face can also be formed with defined support slot (not shown) corresponding with the shape in mask unit sheet material portion 220.At this point, Edge sheet material portion 221 and the first grid sheet material portion 223, the second grid sheet material portion 225 can be plugged into support slot, can be more preferable Ground permanent mask unit sheet portion 220.
Lower support unit 90 can squeeze the opposed surface of the mask unit region CR contacted by mask 100.That is, lower part Support unit 90 supports mask unit sheet material portion 220 to upper direction, so as to prevent mask unit sheet material portion 220 in mask Direction is sagging to the lower part in 100 adhesion process.At the same time, lower support unit 90 and template 50 are squeezed towards opposite direction Therefore the edge and frame 200 (alternatively, mask unit sheet material portion 220) of mask 100 can keep the alignment shape of mask 100 State avoids its at random.
In this way, only in template 50 adhere to mask 100 after, template 50 is loaded on frame 200, so that it may completion make Therefore the process corresponding with the mask unit region CR of frame of mask 100 can not apply mask 100 in this process and appoint What drawing force.
Figure 16 is the skeleton diagram for the process that the mask for being related to one embodiment of the invention is adhered on frame.
Then, laser L is irradiated to mask 100, mask 100 can be adhered on frame 200 by laser welding.Swashed The weld part part of the mask of photocoagulation, generate weld seam WB, weld seam WB with can with 100/ frame 200 of mask have same material simultaneously And it is attached thereto integral.A pair of laser cell 61a, 61b separated from each other can be simultaneously on the left side weld part of mask 100 and the right sides Side weld part irradiates laser L, to be welded.
Figure 17 is the adsorption hole 229 that an embodiment through the invention is related to, and applies the state of adsorption capacity to mask 100 Skeleton diagram.
On the other hand, according to another embodiment, multiple adsorption holes 229 may be formed at the frame with mask unit region CR 200 adjacent corner.Specifically, what multiple adsorption holes 229 can be formed in mask unit sheet material portion 220 separates rule with its corner The part of set a distance more specifically can be formed in the portion that predetermined distance is separated with the inside angle part in edge sheet material portion 221 Divide and separate with the corner in the first grid sheet material portion 223, the second grid sheet material portion 225 part of predetermined distance.
Form, size of multiple adsorption holes 229 etc. can apply vacuum suction pressure mesh in the range of it is unrestricted.But It is, it is preferable that the position of the multiple adsorption holes 229 not position Chong Die with the weld part of mask 100 (welding target area).Work as weldering When socket part is Chong Die with adsorption hole 229, since mask 100 and frame 200 (or mask unit sheet material portion 220) can not be in close contact And it is likely to result in forming the weld seam WB based on laser welding with can not be successfully.Preferably, multiple adsorption holes 229 can be formed in The part adjacent with weld part, so that frame 200 is more tightly attached to (alternatively, mask unit sheet material in the weld part part of mask 100 Portion 220).
As shown in figure 17, when template 50 being loaded into frame 200 (or mask unit sheet material portion 220), mask 100 Lower surface a part and frame 200 (alternatively, mask unit sheet material portion 220) upper contact.Frame 200 is formed in (alternatively, covering Form unit sheet material portion 220) adsorption hole 229 top it is corresponding with the lower surface of mask 100, it is corresponding with 229 lower part of adsorption hole Adsorption capacity (suction pressure) application devices, can by adsorption hole 229 to mask 100 apply adsorption capacity VS (or suction pressure VS), thus 100 part of mask corresponding with adsorption hole 229 can be adsorbed.Therefore, mask 100 is more tightly attached to frame 200, when progress laser When welding, weld seam WB can be more stably generated.
The top of lower support unit 90 could be formed with adsorption section 95.Preferably, adsorption section 95 is configured to and is formed It is corresponding in the position of the adsorption hole 229 of frame 200 (alternatively, mask unit sheet material portion 200).In other words, adsorption section 95 can Configuration can concentrate the position for applying adsorption capacity VS (alternatively, suction pressure VS) on lower support unit 90 to adsorption hole 229.Absorption The well known device that can suck vacuum can be used in portion 95, and can connect with external suction pressure generating device.As one Example, vacuum flow path 96 are formed in the inside of lower support unit 90, and the external suction pressure generating device of the other end and pump etc. (is not schemed Show) connection, one end can be connect with adsorption section 95.The upper face for the adsorption section 95 connecting with vacuum flow path 96 is formed with multiple Hole, crack etc. may be used as the channel for applying suction pressure.External suction pressure generating device can connect in lower support unit 90 Each vacuum flow path 96, to be carried out individual control to the suction pressure of each vacuum flow path 96, and can be to whole vacuum-flows The suction pressure on road 96 is carried out while being controlled.
Adsorption capacity VS (alternatively, suction pressure VS) is provided from the adsorption section of lower support unit 90 95, as adsorption capacity VS is logical It crosses adsorption hole 229 and is applied to mask 100, mask 100 can be adsorbed to 95 side of adsorption section (lower side).At this point, mask 100 with The interface of frame 200 (alternatively, mask unit sheet material portion 220) can be in close contact.
Since mask 100 is consumingly adsorbed in adsorption section 95, it is not present between mask 100 and the interface of frame 200 Small gap.As a result, mask 100 and frame 200 (in the enlarged drawing of Figure 17, the first grid sheet material portion 223) are close to, therefore not Pipe irradiates laser L in any part of weld part, and weld seam WB can be also generated well between mask 100 and frame 200. Weld seam WB links into an integrated entity mask 100 and frame 200, may finally steadily be welded.
Figure 18 is to separate 100 He of mask after the mask 100 for being related to one embodiment of the invention is adhered on frame 200 The skeleton diagram of the process of template 50.
Referring to Fig.1 8, after mask 100 is adhered on frame 200, (debonding) mask 100 and template can be separated 50.The separation of mask 100 and template 50 can be by carrying out heating ET to temporary adhesion portion 55, chemical treatment CM, applying ultrasonic wave US, apply at least one of UV to realize.Since mask 100 keeps the state for being bonded in frame 200, can only lift Template 50.As an example, to when being higher than 85 DEG C~100 DEG C of temperature, the viscosity in temporary adhesion portion 55 reduces heating ET, and reduces The bonding force of mask 100 and template 50, so as to separate mask 100 and template 50.As another example, in IPA, acetone, second CM temporary adhesion portion 55 is impregnated in the chemical substances such as alcohol, is covered so as to be separated in a manner of dissolving, removing temporary adhesion portion 55 Mould 100 and template 50.As another example, when applying ultrasonic wave US or applying UV, the bonding force of mask 100 and template 50 becomes It is weak, so as to separate mask 100 and template 50.
More specifically, the temporary adhesion portion 55 for bonding mask 100 and template 50 is TBDB jointing material (temporary bonding&debonding adhesive, temporary adhesion and unsticking adhesive), therefore can be used various Viscidity-removing method.
As an example, solvent debinding (Solvent Debonding) method based on chemical treatment CM can be used.With Temporary adhesion portion 55 is dissolved because of the infiltration of solvent (solvent), and unsticking may be implemented.At this point, since mask 100 is formed with figure Case P, solvent can be permeated by mask pattern P and mask 100 and the interface of template 50.Solvent debinding can be in room temperature Unsticking under (room temperature), and do not need the complicated unsticking equipment of other designs, thus with other viscidity-removing methods It compares, relatively economical.
As another example, hot unsticking (Heat Debonding) method based on heating ET can be used.Using the heat of high temperature, The decomposition for guiding temporary adhesion portion 55, when the bonding force between mask 100 and template 50 is reduced, can along up and down direction or Left and right directions is separated.
As another example, the releasable adhesive unsticking (eelable based on heating ET, application UV etc. can be used Adhesive Debonding) method.It, can be by removing adhesive viscidity-removing method when temporary adhesion portion 55 is hot stripping tape Carry out unsticking, this method needed unlike hot viscidity-removing method high temperature heat treatment and valuableness heat treatment equipment, and into Row process is relatively easy.
As another example, the room temperature unsticking based on chemical treatment CM, application ultrasonic wave US, application UV etc. can be used (Room Temperature Debonding) method.When a part (central part) progress to mask 100 or template 50 is non- When bonding (non-sticky) processing, marginal portion can be only bonded in by temporary adhesion portion 55.Also, in unsticking, solvent Marginal portion is penetrated into, to realize unsticking by dissolution temporary adhesion portion 55.The advantages of this method is, is being bonded With during unsticking, in the remainder other than the fringe region of mask 100, template 50, do not occur direct losses or Defect etc. will not occur because of jointing material residue (residue) when unsticking.In addition, different from hot unsticking method, when unsticking not The heat treatment process of high temperature is needed, therefore can relatively save the cost of technology.
Figure 19 is the skeleton diagram that the mask 100 for being related to one embodiment of the invention is bonded in the state of frame 200.
Referring to Fig.1 9, a mask 100 can be bonded on a unit area CR.
Since the mask unit sheet material portion 220 of frame 200 has thin thickness, in the shape for applying drawing force to mask 100 Under state, when being bonded in mask unit sheet material portion 220, in mask 100 remaining tensile force effect in mask unit sheet material portion 220 with And mask unit region CR, it is also possible to deform them.Therefore, it should in the state of not applying drawing force to mask 100, Mask 100 is bonded in mask unit sheet material portion 220.Mask 100 is attached in template 50 by the present invention, need to only be filled template 50 It is loaded on frame 200, can complete to make the process corresponding with the mask unit region CR of frame 200 of mask 100, therefore, at this During one, any drawing force can not be applied to mask 100.Thus, it is possible to prevent the stretching masterpiece because being applied to mask 100 Frame 200 (or mask unit sheet material portion 220) is caused to deform in frame 200 for tension (tension) acting in opposition.
The mask 10 of existing Fig. 1 includes 6 unit C1~C6, therefore has longer length, and mask of the invention 100 include a unit C, therefore has shorter length, therefore the degree of PPA distortion can become smaller.Assuming that including multiple lists First C1~C6 ... the length of mask 10 be 1m, and 10 μm of PPA error occurs in the total length of 1m, then it is of the invention Mask 100 can reduce with relative length and (be equivalent to the reduction of unit C quantity) and above-mentioned error range is become 1/n.For example, 100 length of mask of the invention is 100mm, then with the length for being reduced to 1/10 from the 1m of existing mask 10, therefore The PPA error that 1 μm occurs in the total length of 100mm, significantly reduces alignment error.
On the other hand, if mask 100 has multiple unit C, and even if make each of each unit C and frame 200 Unit area CR is corresponding to be also in the range of alignment error minimum, then mask 100 can also be with multiple masks of frame 200 Unit area CR is corresponding.Alternatively, the mask 100 with multiple unit C can also be corresponding with a mask unit region CR.At this Kind in the case of, it is also considered that based on alignment process time and productivity, mask 100 be preferably provided with unit C as a small amount of as possible.
In the present invention, due to need to only make a unit C of mask 100 corresponding and confirm alignment, with Make multiple unit C (C1~C6) corresponding simultaneously and needs to confirm that the existing method (referring to Fig.1) of whole alignments is compared, it can Significantly to shorten manufacturing time.
That is, the manufacturing method of the one-piece type mask of frame of the invention is compared with the conventional method, it can be obviously shortened the time, it should Existing method need by each unit C11~C16 for making to be contained in 6 masks 100 respectively with each unit region CR11~ CR16 is corresponding and confirms 6 processes of each alignment, while keeping 6 unit C1~C6 corresponding, and at the same time all confirmations 6 The alignment of a unit C1~C6.
In addition, in the manufacturing method of the one-piece type mask of frame of the invention, make 30 masks 100 respectively with 30 units Region CR (CR11~CR56) it is corresponding and be aligned 30 times during product yield, can be apparently higher than makes to respectively include 6 5 masks 10 ((a) referring to Fig.1) of a unit C1~C6 it is corresponding with frame and be aligned 5 times during existing product Yield.Since the existing method to the 6 unit C1~C6 of regional alignment for corresponding to 6 unit C every time is obvious cumbersome and tired Difficult operation, product yield are low.
On the other hand, such as the step of Figure 11 as described in (b), mask metal film 110 is adhered to template when passing through lamination process When 50, about 100 DEG C of temperature can be applied to mask metal film 110.Thus, it is possible to applying one to mask metal film 110 Divide in the state of drawing force, bonds it to template 50.Later, when mask 100 is adhered on frame 200, and template with cover When mould 100 separates, mask 100 can shrink specified amount.
After each mask 100 is all bonded in corresponding mask unit region CR, when template 50 and mask 100 separate, Multiple masks 100 apply the tension of contraction in the opposite direction, therefore offset the strength, do not send out in mask unit sheet material portion 220 Change shape.For example, between the mask 100 for being attached to the unit area CR11 and the mask 100 for being attached to the unit area CR12 Tension TS and court in first grid sheet material portion 223, towards the right direction effect for the mask 100 for being attached to the unit area CR11 The tension acted on to the left direction for the mask 100 for being attached to the unit area CR12 can cancel out each other.It drops to the maximum extent as a result, The deformation of the low frame 200 (or mask unit sheet material portion 220) based on tension TS, so as to reduce mask to the maximum extent The alignment error of 100 (or mask pattern P).
Figure 20 is the OLED pixel deposition dress using the one-piece type mask 100,200 of frame that one embodiment of the invention is related to Set 1000 skeleton diagram.
Referring to Figure 20, OLED pixel precipitation equipment 1000 includes: magnetic sheet 300, accommodates magnet 310, and be placed with cold But water pipe 350;Sedimentary origin supply unit 500 supplies organic material resource 600 from the lower part of magnetic sheet 300.
The targets such as the glass for depositing organic material resource 600 are inserted between magnetic sheet 300 and sedimentary origin deposition portion 500 Substrate 900.In target base plate 900 can in a manner of being close to or be very close configured with make organic material resource 600 by different pixels The one-piece type mask 100,200 (or FMM) of the frame of deposition.Magnet 310 can produce magnetic field, and by magnetic field, cling to mesh Mark substrate 900.
Sedimentary origin supply unit 500 can travel to and fro between left and right path and supply organic material resource 600, by sedimentary origin supply unit 500 Organic material resource 600 of supply can be deposited on target base plate after the pattern P by being formed in the one-piece type mask 100,200 of frame 900 side.The organic material resource 600 deposited after pattern P by the one-piece type mask 100,200 of frame, may be used as OLED's Pixel 700.
In order to prevent due to the nonuniform deposition of shadow effect (Shadow Effect) pixel 700 occurred, frame one The pattern of type mask 100,200 can be formed obliquely S (or being formed with taper S).Along inclined surface, in diagonal Upper organic material resource 600 by pattern, also can contribute to the formation of pixel 700, therefore, thickness can equably sink on the whole Product pixel 700.
It illustrates and illustrates as described above, the present invention lists preferred embodiment, but be not limited to the above embodiments, In In the range for not departing from spirit of the invention, those skilled in the art are able to carry out various modifications and change.This deformation and change More all fall within the present invention and appended claims in the range of.

Claims (15)

1. a kind of manufacturing device of the one-piece type mask of frame characterized by comprising
Platform portion, for installing simultaneously braced frame;
Clamping part clamps template, bonds in the template and is supported by the mask;
Moving portion is clamped, moves the clamping part along at least one direction in X, Y, Z, θ axis;
The weld part on head, Xiang Suoshu mask irradiates laser, and senses the alignment of the mask;And
Head moving portion, moves the head along at least one direction in X, Y, Z axis,
Wherein, upper face of the clamping part to adsorb the template it is at least part of in a manner of clamped.
2. the manufacturing device of the one-piece type mask of frame according to claim 1, which is characterized in that
Described portion includes the frame alignment unit for being directed at the position of the frame.
3. the manufacturing device of the one-piece type mask of frame according to claim 1, which is characterized in that
Described portion includes the heating unit for heating the frame.
4. the manufacturing device of the one-piece type mask of frame according to claim 1, which is characterized in that
The clamping part includes:
Clamping unit, for clamping the template;
Mobile unit is clamped, moves the clamping unit along at least one direction in X, Y, Z, θ axis;And
The clamping mobile unit is connected to the clamping moving portion by connection unit.
5. the manufacturing device of the one-piece type mask of frame according to claim 4, which is characterized in that
The clamping unit is formed with multiple absorbing units separated from each other, and multiple absorbing units are for applying the template Add suction pressure.
6. the manufacturing device of the one-piece type mask of frame according to claim 5, which is characterized in that
Multiple absorbing units are configured to not be overlapped with region of the weld part of the mask on Z axis.
7. the manufacturing device of the one-piece type mask of frame according to claim 1, which is characterized in that
The clamping moving portion includes:
Base unit;
Clamp standoff unit, configuration is on the base unit to support the clamping part;And
Gripper rail unit, for moving the base unit,
Wherein, the base unit moves in the region separated along Z-direction with described portion so that the clamping part into Enter the top to described portion.
8. the manufacturing device of the one-piece type mask of frame according to claim 1, which is characterized in that
The head includes laser cell, and the laser cell irradiates laser to the mask, by the mask and the frame Frame is welded, or irradiates laser to the mask, to carry out laser reconditioning.
9. the manufacturing device of the one-piece type mask of frame according to claim 8, which is characterized in that
A pair of laser cell is separated from each other configuration,
The weld part of the side to the mask and the other side irradiates laser to each laser cell respectively.
10. the manufacturing device of the one-piece type mask of frame according to claim 1, which is characterized in that
The frame includes:
Edge frame portion comprising hollow region;
Mask unit sheet material portion has multiple mask unit regions, and is connected to the edge frame portion.
11. the manufacturing device of the one-piece type mask of frame according to claim 10, which is characterized in that
The frame has multiple along a first direction and perpendicular at least one direction in the second direction of first direction The mask unit region.
12. the manufacturing device of the one-piece type mask of frame according to claim 10, which is characterized in that
What multiple adsorption holes were formed in the mask unit sheet material portion with the mask unit region separates predetermined distance with corner Part on.
13. the manufacturing device of the one-piece type mask of frame according to claim 12, which is characterized in that
Described portion further comprises lower support unit, and the lower support unit generates suction pressure to the lower part of the frame.
14. the manufacturing device of the one-piece type mask of frame according to claim 13, which is characterized in that
The lower support unit is formed at least one vacuum flow path, and the vacuum flow path will generate unit from external suction pressure The suction pressure of generation is transmitted to the adsorption hole.
15. the manufacturing device of the one-piece type mask of frame according to claim 1, which is characterized in that
Mask pattern is formed on the mask, the mask is bonded in the template by temporary adhesion portion.
CN201910317998.0A 2018-04-20 2019-04-19 Apparatus for manufacturing frame-integrated mask Active CN110385527B (en)

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210026168A (en) * 2019-08-29 2021-03-10 주식회사 오럼머티리얼 Template for supporting mask, producing method of template for supporting mask and producing method of mask integrated frame
CN113529081A (en) * 2020-04-09 2021-10-22 悟勞茂材料公司 Mask supporting template, method for manufacturing mask, and method for manufacturing frame-integrated mask

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008115411A (en) * 2006-11-01 2008-05-22 Seiko Epson Corp Method for manufacturing vapor deposition mask, vapor deposition mask, and vapor deposition method using the mask
JP2009052072A (en) * 2007-08-24 2009-03-12 Dainippon Printing Co Ltd Vapor deposition mask, vapor deposition mask device, method for manufacturing vapor deposition mask, method for manufacturing vapor deposition mask device and method for manufacturing sheet-shaped member for vapor deposition mask
CN101538698A (en) * 2007-11-20 2009-09-23 三星Smd株式会社 Method and apparatus for fabricating vertical deposition mask
CN102881652A (en) * 2011-08-25 2013-01-16 株式会社汉松 Segmentation mask framework components manufactured by AMOLED panel manufacturing
CN104097027A (en) * 2013-04-10 2014-10-15 昆山思拓机器有限公司 Manufacturing method of OLED (Organic Light Emitting Diode) metal mask plate
CN107425135A (en) * 2017-05-05 2017-12-01 京东方科技集团股份有限公司 Mask plate fixes bottom plate and mask board fixer

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100534580B1 (en) * 2003-03-27 2005-12-07 삼성에스디아이 주식회사 Deposition mask for display device and Method for fabricating the same
KR100742385B1 (en) * 2006-01-23 2007-07-24 삼성에스디아이 주식회사 Align apparatus of mask and align method of the same
JP2015127441A (en) * 2013-12-27 2015-07-09 大日本印刷株式会社 Manufacturing method of vapor deposition mask device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008115411A (en) * 2006-11-01 2008-05-22 Seiko Epson Corp Method for manufacturing vapor deposition mask, vapor deposition mask, and vapor deposition method using the mask
JP2009052072A (en) * 2007-08-24 2009-03-12 Dainippon Printing Co Ltd Vapor deposition mask, vapor deposition mask device, method for manufacturing vapor deposition mask, method for manufacturing vapor deposition mask device and method for manufacturing sheet-shaped member for vapor deposition mask
CN101538698A (en) * 2007-11-20 2009-09-23 三星Smd株式会社 Method and apparatus for fabricating vertical deposition mask
CN102881652A (en) * 2011-08-25 2013-01-16 株式会社汉松 Segmentation mask framework components manufactured by AMOLED panel manufacturing
CN104097027A (en) * 2013-04-10 2014-10-15 昆山思拓机器有限公司 Manufacturing method of OLED (Organic Light Emitting Diode) metal mask plate
CN107425135A (en) * 2017-05-05 2017-12-01 京东方科技集团股份有限公司 Mask plate fixes bottom plate and mask board fixer

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KR20190122598A (en) 2019-10-30
CN110385527B (en) 2021-10-29
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KR20190122599A (en) 2019-10-30
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