KR20190122598A - Producing device of mask integrated frame - Google Patents

Abstract

The present invention relates to a manufacturing device of a frame integrated mask. According to the present invention, the manufacturing device (10) of the frame integrated mask comprises a stage part (20) on which the frame (200) is mounted and supported; a grip part (30) for gripping a template (50) to which a mask (100) is adhesively supported; a grip moving part (40) for moving the grip part (30) in at least one direction among X, Y, Z, and θ axes; a head part (60) which emits a laser to a welding part of a mask (100) and senses an alignment state of the mask (100); and a head moving part (70) for moving the head part (60) in at least one direction among the X, Y, and Z axes, wherein the grip part (30) absorbs and grips at least a part of an upper surface of the template (50). Therefore, the present invention is capable of forming the integrated structure of the mask and the frame.

Description

Equipment for manufacturing frame integrated mask {PRODUCING DEVICE OF MASK INTEGRATED FRAME}

The present invention relates to an apparatus for manufacturing a frame-integrated mask. More specifically, in the apparatus for manufacturing a frame-integrated mask that can be stably supported and moved without deformation of the mask, the mask can be integrated with the frame, and the alignment between the masks can be made clear. It is about.

As a technique for forming pixels in an OLED manufacturing process, a fine metal mask (FMM) method is used in which a thin metal mask is adhered to a substrate to deposit an organic material at a desired position.

In the conventional OLED manufacturing process, the mask is manufactured in a stick form, a plate form, and the like, and then the mask is welded and fixed to the OLED pixel deposition frame. Each mask may include a plurality of cells corresponding to one display. In addition, in order to manufacture a large area OLED, several masks may be fixed to the OLED pixel deposition frame. In the process of fixing to the frame, each mask is tensioned to be flat. Adjusting the tension to make the entire part of the mask flat is a very difficult task. In particular, in order to align the mask pattern having a size of only a few to several tens of micrometers while flattening each cell, a high-level operation of checking the alignment in real time while finely adjusting the tension applied to each side of the mask is required. do.

Nevertheless, in the process of fixing several masks in one frame, there is a problem in that the alignment between the mask cells and the mask cells is not good. In addition, since the thickness of the mask film is too thin and the large area in the process of welding and fixing the mask to the frame, the mask is squeezed or distorted due to the load, wrinkles, burrs, etc. generated in the welded part in the welding process. There was a problem of misalignment.

In the case of ultra-high-definition OLED, the current QHD image quality is 500 ~ 600 pixel per inch (PPI), and the pixel size is about 30 ~ 50㎛. It has a resolution of. As such, considering the pixel size of the ultra-high-definition OLED, the alignment error between each cell should be reduced to several μm, and the error beyond this may lead to product failure, resulting in very low yield. Therefore, there is a need for development of a technique for preventing deformation, such as knocking or twisting of a mask and making alignment clear, a technique for fixing a mask to a frame, and the like.

Accordingly, an object of the present invention is to provide an apparatus for manufacturing a frame-integrated mask, which is conceived to solve the above-mentioned problems of the prior art and which can form an integral structure of a mask and a frame.

It is also an object of the present invention to provide an apparatus for manufacturing a frame-integrated mask, which can prevent deformation such as knocking or twisting of the mask and clarity of alignment.

Moreover, an object of this invention is to provide the manufacturing apparatus of the frame integrated mask which markedly reduced manufacturing time and raised the yield significantly.

In addition, an object of the present invention is to provide an apparatus for manufacturing a frame-integrated mask that can stably support and move the mask without deformation.

An object of the present invention is to provide a frame-integrated mask manufacturing apparatus, comprising: a stage portion on which a frame is seated and supported; A grip portion for gripping a template on which the mask is adhesively supported; A grip moving part which moves the grip part in at least one of X, Y, Z and θ axes; A head unit for irradiating a laser to a welding portion of the mask and sensing an alignment state of the mask; And a head moving part moving the head part in at least one of X, Y, and Z axes, wherein the grip part is formed with a plurality of adsorption units that apply pressure to the template at intervals. It is achieved by an apparatus for manufacturing a frame-integrated mask, which absorbs and grips at least a portion of the upper surface.

The stage unit may include a heating unit for applying heat to the frame.

The grip portion includes a grip unit for gripping a template; A grip moving unit which moves the grip unit in at least one of X, Y, Z and θ axes; And a connecting unit connecting the grip moving unit to the grip moving unit.

A plurality of adsorption units are arranged in the grip unit, and the plurality of adsorption units may be arranged so as not to overlap in the region on the Z axis with the welded portion of the mask.

The grip moving unit includes a base unit; A grip support unit disposed on the base unit to support the grip portion; And a grip rail unit for moving the base unit, wherein the base unit can move in an area spaced in the Z-axis direction with the stage part so that the grip part enters the upper part of the stage part.

A base rail unit is formed on the base unit along the Y axis direction, and the grip support unit is connected to the base rail unit to move along the Y axis direction.

The head unit may include a laser unit which irradiates a mask with a laser to weld the frame to the mask, or irradiates the mask with a laser to trim the laser.

The pair of laser units are arranged to be spaced apart from each other, and each laser unit may irradiate a laser to one side of the mask and the other side of the welding unit.

According to the present invention configured as described above, there is an effect that the mask and the frame can form an integrated structure.

In addition, according to the present invention, there is an effect that can prevent the deformation, such as knocking or twisting the mask and to clarify the alignment.

In addition, according to the present invention, there is an effect that can significantly reduce the production time, and significantly increase the yield.

In addition, according to the present invention, there is an effect capable of stably supporting and moving the mask without deformation.

1 and 2 are schematic diagrams illustrating a process of adhering a conventional mask to a frame.
3 is a schematic diagram showing that alignment errors between cells occur in the process of tensioning a conventional mask.
4 is a front and side cross-sectional view showing a frame-integrated mask according to an embodiment of the present invention.
5 is a front and side cross-sectional view showing a frame according to an embodiment of the present invention.
6 is a schematic diagram illustrating a manufacturing process of a frame according to an embodiment of the present invention.
7 is a schematic diagram illustrating a manufacturing process of a frame according to another embodiment of the present invention.
8 and 9 are plan and schematic views showing an apparatus for manufacturing a frame-integrated mask according to an embodiment of the present invention.
10 is a partially enlarged schematic view of the apparatus for manufacturing a frame-integrated mask according to an embodiment of the present invention.
11 to 12 are schematic views illustrating a process of manufacturing a mask support template by adhering a mask metal film on a template and forming a mask according to an embodiment of the present invention.
Figure 13 is an enlarged cross-sectional schematic diagram showing a temporary adhesive portion according to an embodiment of the present invention.
14 is a schematic diagram illustrating a process of loading a mask support template onto a frame according to an embodiment of the present invention.
15 is a schematic diagram illustrating a state in which a mask is mapped to a cell area of a frame by loading a template according to an embodiment of the present invention.
16 is a schematic diagram illustrating a process of adhering a mask to a frame according to an embodiment of the present invention.
17 is a schematic diagram illustrating a state in which an adsorption force is applied to a mask through an adsorption hole according to an embodiment of the present invention.
18 is a schematic diagram illustrating a process of separating a mask and a template after attaching a mask to a frame according to an embodiment of the present invention.
19 is a schematic view showing a state in which a mask is adhered to a frame according to an embodiment of the present invention.
20 is a schematic diagram showing an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.

DETAILED DESCRIPTION The following detailed description of the invention refers to the accompanying drawings that show, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It is to be understood that the various embodiments of the invention are different but need not be mutually exclusive. For example, certain shapes, structures, and characteristics described herein may be embodied in other embodiments without departing from the spirit and scope of the invention with respect to one embodiment. In addition, it is to be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention, if properly described, is defined only by the appended claims, along with the full range of equivalents to which such claims are entitled. In the drawings, like reference numerals refer to the same or similar functions throughout the several aspects, and length, area, thickness, and the like may be exaggerated for convenience.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention.

1 and 2 are schematic diagrams showing a process of adhering a conventional mask 1 to a frame 2. 3 is a schematic diagram illustrating that an alignment error between cells C1 to C3 occurs in the process of tensioning the masks 1 to F1.

Referring to FIG. 1, the conventional mask 1 may be manufactured in a stick type or a plate type. The mask 1 shown in FIG. 1 is a stick type mask, and both sides of the stick can be used by welding and fixing the OLED pixel deposition frame 2.

A plurality of display cells C are provided in the body (or mask film 1a) of the mask 1. One cell C corresponds to one display such as a smartphone. In the cell C, a pixel pattern P is formed to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B appear. For example, the pixel pattern P is formed in the cell C to have a resolution of 70 × 140. That is, a large number of pixel patterns P may be clustered to form one cell C, and a plurality of cells C may be formed in the mask 1. Hereinafter, the stick mask 1 provided with six cells C: C1 to C6 will be described as an example.

Referring to FIGS. 1A, 2A, and 2B, first, the stick mask 1 should be flattened. A pair of clampers 3 facing each other with the frame 2 interposed therebetween clamps both sides of the mask 1, and pulls by applying tensile forces F1 to F2 in the long axis direction of the mask 1. Accordingly, the mask 1 is unfolded. Then, the clamper 3 moves to the position corresponding to the frame 2 along the y-axis moving rail 4 that occupies the outside of the frame 2. The cells C1 to C6 of the mask 1 are positioned in the empty area of the frame 2 of the frame 2. The frame 2 may have a size such that the cells C1 to C6 of one stick mask 1 are positioned in an empty area inside the frame, and the cells C1 to C6 of the plurality of stick masks 1 are framed. It may also be large enough to fit inside the empty area.

Next, referring to FIG. 2C, a pair of clampers 3 are lowered along the Z-axis moving rail 5 to tension the mask 1 on the frame 2 in a rectangular frame shape. Load the mask (1). The cells C1 to C6 of the mask 1 are positioned in the empty area of the frame 2 of the frame 2. The frame 2 may be large enough so that the cells C1 to C6 of one mask 1 are located in an empty area inside the frame, and the cells C1 to C6 of the plurality of masks 1 are empty inside the frame. It may be large enough to be located in an area.

Next, referring to FIGS. 1B and 2D, after aligning while finely adjusting the tensile force F1 to F2 applied to each side of the mask 1, the side surface of the mask 1 is adjusted. The mask 1 and the frame 2 are connected to each other by welding a portion of the portion W with the laser L or the like. Then, the clamper 3 releases the clamping of the mask 1. FIG. 1C shows side cross-sections of the mask 1 and the frame 2 interconnected.

Referring to FIG. 3, in spite of finely adjusting the tensile forces F1 to F2 applied to each side of the stick mask 1, problems of misalignment of the mask cells C1 to C3 appear. For example, the distances D1 to D1 ", D2 to D2" are different from each other, or the patterns P are distorted between the patterns P of the cells C1 to C3. The stick mask 1 is a large area including a plurality of (eg, six) cells C1 to C6, and has a very thin thickness of several tens of micrometers, so that it is easily struck or warped by a load. In addition, it is very difficult to check the alignment between the cells C1 to C6 in real time through a microscope while adjusting the tensile forces F1 to F2 to flatten the cells C1 to C6.

Therefore, the minute error of the tensile force (F1 ~ F2) may cause an error in the extent that the cells (C1 ~ C3) of the stick mask 1 is extended or unfolded, and thus the distance (D1) between the mask patterns (P) ~ D1 ", D2-D2") cause a problem that becomes different. Of course, it is difficult to align perfectly so that the error is 0, but in order that the mask pattern P having a size of several to several tens of micrometers does not adversely affect the pixel process of the ultra-high definition OLED, the alignment error does not exceed 3 micrometers. It is preferable not to. This alignment error between adjacent cells is referred to as pixel position accuracy (PPA).

In addition, between the plurality of stick masks 1 and the plurality of cells C of the stick masks 1 while connecting the plurality of stick masks 1 of about 6 to 20 to each of the frames 2, respectively. It is also very difficult to clarify the alignment between ~ C6), and the process time due to alignment is inevitably increased, which is a significant reason for reducing productivity.

On the other hand, after the stick mask 1 is fixedly connected to the frame 2, the tensile forces F1 to F2 applied to the stick mask 1 may act inversely to the frame 2. That is, after the stick mask 1 is stretched by the tension forces F1 to F2, the tension is applied to the frame 2 after the stick mask 1 is connected to the frame 2. Usually, this tension is not large and may not have a great influence on the frame 2, but when the size of the frame 2 is miniaturized and the rigidity is low, such a tension may finely deform the frame 2. Thus, a problem may arise in that the alignment state is changed between the plurality of cells C to C6.

Accordingly, the present invention proposes a frame-integrated mask and an apparatus for manufacturing the same, which enables the mask 100 to form an integrated structure with the frame 200. The mask 100 integrally formed in the frame 200 may be prevented from being deformed or warped, and may be clearly aligned with the frame 200. Since the mask 100 does not apply any tensile force to the mask 100 when the mask 100 is connected to the frame 200, the tension may not be applied to the frame 200 after the mask 100 is connected to the frame 200. . In addition, the manufacturing time for integrally connecting the mask 100 to the frame 200 may be significantly reduced, and the yield may be significantly increased.

4 is a front view (FIG. 4 (a)) and a side cross-sectional view (FIG. 4 (b)) showing a frame-integrated mask according to an embodiment of the present invention, Figure 5 is according to an embodiment of the present invention It is a front view (FIG. 5 (a)) and a side cross-sectional view (FIG. 5 (b)) which show a frame.

4 and 5, the frame integrated mask may include a plurality of masks 100 and one frame 200. In other words, the plurality of masks 100 are bonded to the frame 200 one by one. Hereinafter, for convenience of description, the rectangular mask 100 will be described as an example, but the masks 100 may be in the form of a stick mask having protrusions clamped at both sides before being bonded to the frame 200, and the frame 200. The protrusions can be removed after they have been adhered to.

A plurality of mask patterns P may be formed in each mask 100, and one cell C may be formed in one mask 100. One mask cell C may correspond to one display such as a smartphone.

The mask 100 may be an invar having a thermal expansion coefficient of about 1.0 × 10 ⁻⁶ / ° C. and a super invar material having about 1.0 × 10 ⁻⁷ / ° C. Since the mask 100 of this material has a very low coefficient of thermal expansion, there is little possibility that the pattern shape of the mask is deformed by thermal energy, and thus, the mask 100 may be used as a fine metal mask (FMM) or a shadow mask in high-resolution OLED manufacturing. In addition, in consideration of the recent development of techniques for performing the pixel deposition process in a range where the temperature change is not large, the mask 100 has a slightly larger thermal expansion coefficient than that of nickel (Ni) and nickel-cobalt (Ni-Co). It may be a material such as). The mask 100 may use a metal sheet generated by a rolling process or electroforming.

The frame 200 is formed to bond the plurality of masks 100. The frame 200 may include various edges formed in a first direction (eg, a horizontal direction) and a second direction (eg, a vertical direction) including an outermost edge. These various corners may define the area to which the mask 100 is to be bonded on the frame 200.

The frame 200 may include an edge frame portion 210 having a substantially rectangular shape and a rectangular frame shape. The inside of the frame frame 210 may be hollow. That is, the frame frame 210 may include a hollow region (R). The frame 200 may be made of a metal material such as Invar, Super Invar, Aluminum, Titanium, etc., and may be made of Inbar, Super Invar, Nickel, or Nickel-Cobalt having the same thermal expansion coefficient as a mask in consideration of thermal deformation. Preferably, the materials may be applied to both the edge frame portion 210 and the mask cell sheet portion 220 which are components of the frame 200.

In addition, the frame 200 may include a plurality of mask cell regions CR and may include a mask cell sheet portion 220 connected to the edge frame portion 210. Like the mask 100, the mask cell sheet part 220 may be formed by rolling, or may be formed using another film forming process such as electroplating. In addition, the mask cell sheet part 220 may be connected to the edge frame part 210 after forming a plurality of mask cell areas CR through laser scribing or etching on a flat sheet. Alternatively, the mask cell sheet unit 220 may form a plurality of mask cell regions CR through laser scribing, etching, etc. after connecting the planar sheet to the edge frame unit 210. In the present specification, first, a plurality of mask cell regions CR are formed in the mask cell sheet part 220, and then the connection to the edge frame part 210 is mainly assumed.

The mask cell sheet part 220 may include at least one of the edge sheet part 221 and the first and second grid sheet parts 223 and 225. The edge sheet portion 221 and the first and second grid sheet portions 223 and 225 refer to respective portions partitioned from the same sheet, which are integrally formed with each other.

The edge sheet portion 221 may be substantially connected to the edge frame portion 210. Accordingly, the edge sheet part 221 may have a substantially rectangular shape and a rectangular frame shape corresponding to the edge frame part 210.

In addition, the first grid sheet part 223 may extend in a first direction (horizontal direction). The first grid sheet part 223 may be formed in a straight line shape and both ends thereof may be connected to the edge sheet part 221. When the mask cell sheet portion 220 includes the plurality of first grid sheet portions 223, each of the first grid sheet portions 223 may be equally spaced apart.

In addition, in addition, the second grid sheet part 225 may be formed to extend in a second direction (vertical direction). The second grid sheet part 225 may be formed in a straight line shape and both ends thereof may be connected to the edge sheet part 221. The first grid sheet portion 223 and the second grid sheet portion 225 may vertically cross each other. When the mask cell sheet portion 220 includes a plurality of second grid sheet portions 225, each of the second grid sheet portions 225 preferably has an equal interval.

Meanwhile, the spacing between the first grid sheet portions 223 and the spacing between the second grid sheet portions 225 may be the same or different according to the size of the mask cell C. FIG.

The first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, but the shape of the cross section perpendicular to the longitudinal direction may be a rectangle, a square shape such as a parallelogram, a triangular shape, or the like. The edges, edges, and corners may be partially rounded. The cross-sectional shape is adjustable in the process of laser scribing, etching and the like.

The thickness of the edge frame portion 210 may be thicker than the thickness of the mask cell sheet portion 220. The edge frame part 210 may be formed to a thickness of several mm to several cm because it is responsible for the overall rigidity of the frame 200.

In the case of the mask cell sheet portion 220, a process of manufacturing a substantially thick sheet is difficult, and if it is too thick, a path through which the organic material source 600 (see FIG. 20) passes through the mask 100 in the OLED pixel deposition process. This can cause problems. On the contrary, if the thickness is too thin, it may be difficult to secure rigidity enough to support the mask 100. Accordingly, the mask cell sheet part 220 is thinner than the thickness of the edge frame part 210, but preferably thicker than the mask 100. The mask cell sheet part 220 may have a thickness of about 0.1 mm to about 1 mm. In addition, the widths of the first and second grid sheet parts 223 and 225 may be formed to about 1 to 5 mm.

A plurality of mask cell areas CR: CR11 to CR56 may be provided except for an area occupied by the edge sheet part 221 and the first and second grid sheet parts 223 and 225 in the planar sheet. In another aspect, the mask cell region CR is an area occupied by the edge sheet portion 221 and the first and second grid sheet portions 223 and 225 in the hollow region R of the edge frame portion 210. Except for, it may mean an empty area.

As the cell C of the mask 100 corresponds to the mask cell region CR, the mask C may be used as a passage through which the pixels of the OLED are deposited through the mask pattern P. FIG. As described above, one mask cell C corresponds to one display such as a smartphone. Mask patterns P constituting one cell C may be formed in one mask 100. Alternatively, one mask 100 may include a plurality of cells C, and each cell C may correspond to each cell region CR of the frame 200. It is necessary to avoid the large area mask 100, and the small area mask 100 provided with one cell C is preferable. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell region CR of the frame 200. In this case, for clear alignment, it may be considered to correspond to the mask 100 having a small number of cells C of about 2-3.

The frame 200 may include a plurality of mask cell regions CR, and each mask 100 may be bonded such that one mask cell C corresponds to the mask cell region CR. Each mask 100 may include a mask cell C in which a plurality of mask patterns P are formed and a dummy (corresponding to a portion of the mask film 110 except for the cell C) around the mask cell C. have. The dummy may include only the mask layer 110 or the mask layer 110 in which a predetermined dummy pattern having a similar shape to the mask pattern P is formed. The mask cell C may correspond to the mask cell region CR of the frame 200, and part or all of the dummy may be attached to the frame 200 (mask cell sheet portion 220). Accordingly, the mask 100 and the frame 200 may form an integrated structure.

On the other hand, according to another embodiment, the frame is not manufactured by bonding the mask cell sheet portion 220 to the edge frame portion 210, the edge frame portion 210 in the hollow region (R) portion of the edge frame portion 210 ), A frame in which a grid frame (corresponding to the grid sheet portions 223 and 225) which is integral with one another can be used immediately. The frame of this type also includes at least one mask cell region CR, and the mask integrated region may be manufactured by corresponding the mask 100 to the mask cell region CR.

Hereinafter, a process of manufacturing the frame integrated mask will be described.

First, the frame 200 described above with reference to FIGS. 4 and 5 may be provided. 6 is a schematic diagram illustrating a manufacturing process of the frame 200 according to an embodiment of the present invention.

Referring to FIG. 6A, an edge frame unit 210 is provided. The edge frame portion 210 may have a rectangular frame shape including the hollow area R.

Next, referring to FIG. 6B, a mask cell sheet part 220 is manufactured. The mask cell sheet part 220 is manufactured by manufacturing a flat sheet using a rolling, pre-plating or other film forming process, and then removing the mask cell region CR through laser scribing or etching. can do. In the present specification, a description will be given of an example in which a mask cell region CR: CR11 to CR56 of 6 × 5 is formed. There may be five first grid sheet portions 223 and four second grid sheet portions 225.

Next, the mask cell sheet part 220 may correspond to the edge frame part 210. In the corresponding process, all sides of the mask cell sheet part 220 are stretched (F1 to F4) to flatten the mask cell sheet part 220 to the edge sheet part 221 to the border frame part 210. It can respond. On one side, the mask cell sheet portion 220 may be grasped and tensioned at several points (for example, 1 to 3 points in FIG. 6B). On the other hand, the mask cell sheet portion 220 may be stretched (F1, F2) not in all sides but in some lateral directions.

Next, when the mask cell sheet part 220 corresponds to the edge frame part 210, the edge cell part 221 of the mask cell sheet part 220 may be welded (W) and bonded. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 can be firmly adhered to the edge frame portion 220. Welding (W) should be performed as close as possible to the edge of the edge frame portion 210 as much as possible to reduce the excited space between the edge frame portion 210 and the mask cell sheet portion 220 as much as possible to increase the adhesion. The weld (W) portion may be generated in a line or spot form, and may have the same material as the mask cell sheet portion 220 and integrate the edge frame portion 210 and the mask cell sheet portion 220. It can be a medium to connect to.

7 is a schematic diagram illustrating a manufacturing process of a frame according to another embodiment of the present invention. In the embodiment of FIG. 6, the mask cell sheet part 220 having the mask cell area CR is first manufactured and adhered to the edge frame part 210. However, the embodiment of FIG. After adhesion to 210, a mask cell region CR is formed.

First, as shown in FIG. 6A, the edge frame part 210 including the hollow area R is provided.

Next, referring to FIG. 7A, a flat sheet (a flat mask cell sheet portion 220 ′) may correspond to the edge frame portion 210. The mask cell sheet portion 220 ′ is in a planar state in which the mask cell region CR is not yet formed. In the corresponding process, all sides of the mask cell sheet part 220 'may be stretched (F1 to F4) to correspond to the edge frame part 210 in a state where the mask cell sheet part 220' is flattened. On one side, the mask cell sheet portion 220 'may be grasped and tensioned at various points (for example, 1 to 3 points in FIG. 7A). On the other hand, the mask cell sheet portion 220 'may be stretched (F1, F2) not in all sides but in some lateral direction.

Next, when the mask cell sheet portion 220 ′ corresponds to the edge frame portion 210, the edge portion of the mask cell sheet portion 220 ′ may be welded (W) and bonded. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 ′ can be firmly adhered to the edge frame portion 220. Welding (W) should be performed as close as possible to the edge of the edge frame portion 210 as much as possible to reduce the excited space between the edge frame portion 210 and the mask cell sheet portion 220 'as much as possible to increase the adhesion. The weld (W) portion may be generated in a line or spot shape, and may have the same material as the mask cell sheet portion 220 ′ and have an edge frame portion 210 and a mask cell sheet portion 220 ′. It can be a medium to connect the integrally.

Next, referring to FIG. 7B, a mask cell region CR is formed in a planar sheet (planar mask cell sheet portion 220 ′). The mask cell region CR may be formed by removing the sheet of the mask cell region CR through laser scribing or etching. In the present specification, a description will be given of an example in which a mask cell region CR: CR11 to CR56 of 6 × 5 is formed. When the mask cell region CR is formed, the portion welded to the edge frame portion 210 becomes the edge sheet portion 221, and five first grid sheet portions 223 and four second grids are formed. The mask cell sheet part 220 having the sheet part 225 may be configured.

8 and 9 are plan and schematic views showing the apparatus 10 for manufacturing a frame-integrated mask according to an embodiment of the present invention. 10 is a partially enlarged schematic view of the apparatus 10 for manufacturing a frame-integrated mask according to an embodiment of the present invention. 8 to 10, the frame 200 has a mask cell area CR (CR11 to CR52) of 2 × 5 as an example.

8 to 10, the apparatus 10 for manufacturing a frame-integrated mask includes a table 15, a stage portion 20, a grip portion 30, a grip movement portion 40, a head portion 60, and head movement. The part 70, the damping stand 80, etc. are included.

First, a table 15 called a gantry is installed on a structure that is firmly installed on the ground and can prevent external vibration or impact. The upper surface of the table 15 is precisely horizontal to allow for a more reliable process.

On the table 15, a stage portion 20 on which the frame 200 is mounted is supported. The stage unit 20 may include a loading unit 21, a frame alignment unit 23, and a frame support unit 25. In addition, a heating unit (not shown) and a backlight unit (not shown) may be further included.

The loading unit 21 may correspond to the body of the stage unit 20, and may have a wide plate shape to provide an area in which the frame 200 is loaded. The stage 15 may further include a stage moving unit 27 on the table 15, and the stage moving unit 27 may include the stage unit 20 (or the loading unit 21) in at least one of X, Y, Z, and θ axes. It can move in either direction. The θ-axis direction may mean an angle rotating on the XY plane, YZ plane, XZ plane. 8 and 9 illustrate that the stage moving unit 27 is in the form of a rail so that the loading unit 21 can be moved in the Y-axis direction. However, the present invention is not limited thereto, and a known moving / rotating means such as a rail form, a belt form, a chain form, a motor, a gear, and the like may be used to move / rotate in various directions.

The frame alignment unit 23 may be disposed at each side and each corner of the frame support 25 or the frame 200 to align the position of the frame 200.

The frame support unit 25 may have a rectangular rim shape similar to that of the frame 200 so that the frame 200 may be seated and supported, and may be disposed on the loading unit 21 or the frame alignment unit 23. The frame support unit 25 may prevent the edge frame portion 210 and the mask cell sheet portion 220 from being deformed by tension during the process of adhering the mask 100 to the frame 200. The frame support unit 25 may be disposed to be in close contact with the frame 200 at the bottom of the frame 200. Grooves may be formed on the upper surface of the frame support unit 25 so that the edge frame portion 210 and the grid frame portion 220 fit snugly, and the frame 200 may be fitted into the grooves. Thus, deformation of the frame 200 may be prevented even when the mask 100 is bonded to the frame 200 to apply tension. The frame support unit 25 may be integral with the lower support unit 90 which will be described later in FIG. 17.

Subsequently, when the mask 100 is further adhered to the neighboring cell C, since the masks 100 are applied to each other, the opposite forces are applied to the frame 200 disposed between the neighboring masks 100. The tension applied to) may be offset. Before the tension is canceled, i.e., when only one mask 100 is bonded, the frame support unit 25 receives the frame 200 and receives deformation of the frame 200 during the mask 100 bonding process. It can prevent

The heating unit (not shown) may control the process temperature or apply heat to the frame in the process of bonding the mask 100 to the frame 200.

The backlight unit (not shown) may help the camera unit 65 of the head unit 60 to check the alignment pattern of the mask pattern P by emitting light in a vertical upper (Z-axis) direction. The light emitted in the vertical upper direction may be a form of emitting light directly as a transmissive type, and a form in which light irradiated in the vertical lower direction is reflected and emits light in the upper direction as a reflective type.

The grip unit 30 may include a grip unit 31, a grip moving unit 35, and a connection unit 37. The grip part 30 may grip the template 50 on which the mask 100 is adhesively supported. In this case, the gripping may be performed by absorbing at least a portion of the upper surface of the template 50. Alternatively, the gripping may include holding a portion of the template 50 within a range that does not affect the mask 100.

The grip unit 31 may absorb and grip the upper surface of the template 50. The grip unit 31 may be formed in a horizontal shape on the XY plane, and a plurality of suction units 32 may be formed on the lower surface.

The suction unit 32 may be separately connected to the lower portion of the grip unit 31 or may be a portion formed in the shape of the suction hole in the grip unit 31. The template 50 may be adsorbed to the lower surface of the grip unit 31 by applying a pressure to the upper surface of the template 50 through the adsorption unit 32. Although there is no limitation in the arrangement form of the adsorption unit 32, in order not to block the entrance path of a laser, it is preferable that it does not overlap with the welding part (region to which laser welding is performed) of the mask 100 in the area | region on a Z axis.

The grip movement unit 35 may move the grip unit 31 in at least one of X, Y, Z, and θ axes. In the present invention, since the grip moving unit 40 replaces the grip unit 31 in the X and Y axis directions, the grip moving unit 35 moves in the directions of the Z and θ axes. . The grip movement unit 35 can use any known movement / rotation means that can move / rotate in various directions without limitation. On the other hand, it may further include an auxiliary unit 33 for mediating the connection of the grip unit 31 and the grip moving unit 35.

The connection unit 37 may mediate the grip movement unit 35 onto the grip movement portion 40 (or the grip support unit 43).

The grip moving part 40 may move the grip part 30 in at least one of X, Y, Z, and θ axes. In this case, the grip portion 30 is fixed to the grip movement portion 40 in which the grip movement portion 40 moves to at least one of the X, Y, Z, and θ axes so that the grip portion 30 moves together. In addition to the concept, the grip moving unit 40 may be understood to include a concept of moving only the grip unit 30 in a non-moving state. In the present invention, the grip moving part 40 moves in the X and Y axis directions of the grip part 30, and the grip moving unit 35 or the grip support unit 45 moves in the Z, θ axis of the grip part 30. It is assumed that the movement in the direction is performed.

The grip moving part 40 may include a base unit 41, a grip support unit 43, and a grip rail unit 45.

The base unit 41 has a wide plate shape, and may provide a space in which the grip support unit 43 is disposed. In addition, both side portions may be connected to the grip rail unit 45 to move along the forming direction of the grip rail unit 45.

The grip support unit 43 may be disposed on the base unit 41 to support the grip part 30. The grip support unit 43 can move along the formation direction of the base rail unit 44 formed on the base unit 41.

The grip rail unit 45 is formed on both sides of the stage part 20 along the formation direction of the stage part 20 (or the loading part 21), and the base unit 41 on the grip rail unit 45. This can move.

According to one embodiment, the stage portion 20 is formed long along the X-axis direction, a pair of grip rail unit 45 may be formed along the X-axis direction on the long edge portion of the stage portion 20 have. The base unit 41 extends in the Y-axis direction, and both ends thereof are connected to the pair of grip rail units 45 to move in the X-axis direction. The base rail unit 44 is formed on the base unit 41 along the Y-axis direction, and the grip support unit 43 is connected to the base rail unit 44 to move in the Y-axis direction.

The frame 200 may be disposed on the left portion of the stage 20, and the grip portion 30 and the grip moving portion 40 may be disposed on the right portion. The base unit 41 and the stage unit 20 are spaced apart from each other on the Z axis. Thus, even if the base unit 41 moves to the area where the frame 200 on the left side is disposed along the X axis direction by the grip rail unit 45, the frame 200 and the base unit 41 do not interfere with each other. You may not. Accordingly, the tray 50 gripped by the grip part 30 supported on the base unit 41 may correspond to the specific cell region CR on the frame 200.

The head part 60 is disposed above the stage part 20 and the grip part 30. The head unit 60 may be provided with a laser unit 61 (61a, 61b), a camera unit 65, a gap sensor, a failure analysis unit 67 and the like.

The laser unit 61 may generate a laser L for welding the mask 100 and the frame 200. Alternatively, the laser unit 61 may generate a cutting laser for laser trimming by irradiating the mask 100. The pair of laser units 61 (61a, 61b) are arranged to be spaced apart from each other, and can be installed to adjust the positions of the X and Y axes. The spaced distance may correspond to the distance between the left and right welds of the mask 100. When irradiating the laser L to adhere the mask 100 to the frame 200, the laser (L) irradiation at a time without the need to irradiate the laser (L) to the left and right welds of the mask 100, respectively Welding can be performed. Accordingly, since both sides of the mask 100 are bonded to the frame 200 at the same time, the process time is shorter than the process of bonding one by one, and the mask 100 can be stably bonded to the frame 200 without deformation. There is this.

The camera unit 65 may photograph and sense an alignment state of the mask 100 and the mask pattern P. FIG. The gap sensor unit may measure the Z-axis displacement of the mask 100 or sense a distance between the head part 60, the mask 100, the frame 200, and the like. The failure analysis unit may inspect a failure state of the mask 100.

The head moving parts 70: 71 and 75 may move the head part 60 in at least one of X, Y, and Z axes. In the present invention, the head moving unit 70 will be described assuming that the head unit 60 moves only on the X axis. An upper portion of the head portion 60 is connected to the first head moving portion 71 to receive movement power, and a head portion is provided to the second head moving portion 75 spaced apart from the lower portion of the first head moving portion 71. The main components of 60 may be connected and guided in the X-axis direction according to the X-axis guide 76.

The vibration damping table 70 can be installed to prevent vibration of the table 15. When the mask 100 is attached to the frame 200, the mask 100 may affect the alignment error PPA of the mask pattern P even in an environment in which very small vibration occurs. Accordingly, the vibration damping table 70 may be provided with a passive isolator below the table 15 to prevent vibration.

11 to 12 are schematic diagrams illustrating a process of manufacturing a mask support template by adhering a mask metal film 110 on a template 50 and forming a mask 100 according to an embodiment of the present invention.

Referring to FIG. 11A, a template 50 may be provided. The template 50 is a medium capable of moving the mask 100 in a supported state attached to one surface. One surface of the template 50 is preferably flat so as to support and move the flat mask 100. The central portion 50a may correspond to the mask cell C of the mask metal film 110, and the edge portion 50b may correspond to a dummy of the mask metal film 110. The template 50 may have a flat plate shape having a larger area than the mask metal film 110 so that the mask metal film 110 may be entirely supported.

The template 50 is preferably made of a transparent material so that the vision is easily observed in the process of aligning and bonding the mask 100 to the frame 200. In addition, the laser may penetrate the transparent material. As a transparent material, materials such as glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), borosilicate glass, and zirconia may be used. For example, the template 50 may use a BOROFLOAT ^® 33 material having excellent heat resistance, chemical durability, mechanical strength, transparency, and the like in borosilicate glass. In addition, BOROFLOAT ^® 33 has a thermal expansion coefficient of about 3.3, which is advantageous in controlling the mask metal film 110 because the difference between the Invar mask metal film 110 and the thermal expansion coefficient is small.

On the other hand, the template 50 is one surface which is in contact with the mask metal film 110 so as not to generate an air gap between the interface with the mask metal film 110 (or the mask 100). Can be. In consideration of this, the surface roughness Ra of one surface of the template 50 may be 100 nm or less. In order to implement the template 50 whose surface roughness Ra is 100 nm or less, the template 50 may use a wafer. Since a wafer has a surface roughness Ra of about 10 nm, many products on the market, and many surface treatment processes are known, the wafer can be used as the template 50. Since the surface roughness Ra of the template 50 is nm scale, there is no or almost no air gap, and thus it is easy to generate the welding beads WB by laser welding, thereby affecting the alignment error of the mask pattern P. Can not give.

The template 50 has a laser passing hole 51 in the template 50 so that the laser L irradiated from the upper portion of the template 50 can reach the welding part (region to be welded) of the mask 100. Can be formed. The laser through hole 51 may be formed in the template 50 so as to correspond to the position and the number of welds. Since a plurality of welding parts are disposed along a predetermined interval at edges or dummy DM portions of the mask 100, a plurality of laser passing holes 51 may also be formed along the predetermined interval to correspond thereto. For example, since a plurality of welding parts are disposed at both sides (left / right) dummy DM portions of the mask 100 at predetermined intervals, the laser passing holes 51 are also disposed at both sides (left / right sides) of the template 50. A plurality may be formed along a predetermined interval.

The laser through hole 51 does not necessarily correspond to the position and the number of welds. For example, welding may be performed by irradiating the laser L only to a part of the laser passing holes 51. In addition, some of the laser through holes 51 which do not correspond to the welding part may be used instead of the alignment mark when the mask 100 and the template 50 are aligned. If the material of the template 50 is transparent to the laser light, the laser through hole 51 may not be formed.

The temporary adhesive part 55 may be formed on one surface of the template 50. In the temporary adhesive part 55, the mask 100 (or the mask metal film 110) is temporarily adhered to one surface of the template 50 until the mask 100 is adhered to the frame 200. To be supported.

The temporary adhesive part 55 may use an adhesive or an adhesive sheet that can be separated by applying heat, an adhesive or an adhesive sheet that can be separated by UV irradiation.

For example, the temporary adhesive part 55 may use liquid wax. The liquid wax can use the same thing as the wax used in the polishing step of a semiconductor wafer, etc., The type is not specifically limited. Liquid waxes may mainly include solvents and materials such as acrylic, vinyl acetate, nylon and various polymers as resin components for controlling adhesion, impact resistance, and the like regarding holding force. For example, the temporary adhesive part 55 may use acrylonitrile butadiene rubber (ABR) as a resin component and SKYLIQUID ABR-4016 including n-propyl alcohol as a solvent component. Liquid wax may be formed on the temporary bond 55 using spin coating.

The temporary adhesive portion 55, which is a liquid wax, has a low viscosity at temperatures higher than 85 ° C to 100 ° C, and may become viscous at a temperature lower than 85 ° C and partially harden as a solid, thereby forming the mask metal film 110 'and the template 50. ) Can be fixed and bonded.

Before or after the preparation of the template 50, the mask metal film 110 may be prepared.

In an embodiment, the mask metal film 110 may be prepared by a rolling method. The metal sheet manufactured by the rolling process may have a thickness of several tens to several hundred micrometers in the manufacturing process. For high resolution of UHD level, a thin mask metal film 110 having a thickness of about 20 μm or less may be used for fine patterning, and a thin mask metal film 110 having a thickness of about 10 μm for ultra high resolution of UHD or higher may be used. ) Should be used. However, since the mask metal film 110 ′ produced by the rolling process has a thickness of about 25 to 500 μm, the thickness of the mask metal film 110 ′ needs to be thinner.

Therefore, a process of planarizing the surface of the mask metal film 110 ′ (PS) (see FIG. 11B) may be further performed. Here, the planarization PS means that the thickness of the mask metal film 110 ′ is reduced by thinning one surface (upper surface) of the mask metal film 110 ′ and simultaneously removing a portion of the mask metal film 110 ′. Planarization (PS) may be performed by a chemical mechanical polishing (CMP) method, and known CMP methods may be used without limitation. In addition, the thickness of the mask metal layer 110 ′ may be reduced by chemical wet etching or dry etching. In addition, a process capable of flattening to thin the thickness of the mask metal film 110 ′ may be used without limitation.

In the process of performing a flattening (PS), in the CMP process, For example, a mask, a metal film (110 '), the surface roughness of the top surface (R _a) can be controlled. Preferably, mirroring may proceed with further reduction in surface roughness. Alternatively, another example, may be after performing a chemical wet etch or dry etch planarization process (PS) advances to, in addition to the polishing process, such as a separate CMP process after reducing the surface roughness (R _a).

As such, the thickness of the mask metal film 110 ′ may be made thinner than about 50 μm. Accordingly, the thickness of the mask metal film 110 may be about 2 μm to about 50 μm, and more preferably about 5 μm to about 20 μm. However, it is not necessarily limited thereto.

In another embodiment, the mask metal film 110 may be prepared by electroplating.

The substrate of the mother plate may be a conductive material so as to perform electroforming. The mother plate can be used as a cathode electrode in electroplating.

As the conductive material, in the case of metal, metal oxides may be generated on the surface, impurities may be introduced during the metal manufacturing process, and in the case of the polycrystalline silicon substrate, inclusions or grain boundaries may exist and the conductive polymer may be present. In the case of a base material, it is highly likely to contain an impurity, and strength. Acid resistance may be weak. Elements that interfere with the uniform formation of an electric field on the surface of the substrate (or negative electrode body), such as metal oxides, impurities, inclusions, grain boundaries, etc., are referred to as "defects." Due to the defect, a uniform electric field may not be applied to the cathode body of the above-described material, so that a part of the plating film 110 (or the mask metal film 110) may be unevenly formed.

Non-uniformity of the plating film and the plating film pattern (mask pattern P) may adversely affect the formation of the pixel in implementing a UHD-class or higher definition pixel. For example, QHD image quality is 500 ~ 600 pixel per inch (PPI), and the pixel size is about 30 ~ 50㎛, and 4K UHD, 8K UHD high definition is ~ 860 PPI, ~ 1600 PPI Have the same resolution. The micro display applied directly to the VR device, or the micro display used in the VR device, aims at an ultra-high quality of about 2,000 PPI or more, and the size of the pixel reaches about 5 to 10 μm. Since the pattern width of the FMM and shadow mask applied to this can be formed in a size of several to several tens of micrometers, preferably smaller than 30 micrometers, even a defect of several micrometers is large enough to occupy a large proportion of the pattern size of the mask. to be. In addition, an additional process for removing metal oxides, impurities, and the like may be performed to remove the defects in the cathode material of the material described above, and another defect such as etching of the anode material may be caused in this process. have.

Accordingly, the present invention can use a mother plate (or a negative electrode body) of a single crystal material. In particular, it is preferable that it is a single crystal silicon material. In order to have conductivity, a high concentration doping of 10 ¹⁹ / cm ³ or more may be performed on the single crystal silicon base plate. Doping may be performed on the entirety of the mother plate, or only on the surface portion of the mother plate.

On the other hand, as the single crystal material, metals such as Ti, Cu, Ag, carbon-based materials such as semiconductors such as GaN, SiC, GaAs, GaP, AlN, InN, InP, Ge, graphite, and graphene _{, CH 3 NH 3 PbCl 3,} CH 3 NH 3 PbBr 3, CH 3 NH 3 PbI 3, SrTiO 3 , etc. page containing the perovskite (perovskite) superconductor single crystalline ceramic, aircraft single crystal second heat-resistant alloy for components for such structures And the like can be used. Metal and carbon-based materials are basically conductive materials. In the case of a semiconductor material, a high concentration doping of 10 ¹⁹ / cm ³ or more may be performed to have conductivity. In the case of other materials, the conductivity may be formed by performing doping or forming oxygen vacancies. Doping may be performed on the entirety of the mother plate, or only on the surface portion of the mother plate.

Since there is no defect in the case of a single crystal material, there is an advantage in that a uniform plating film 110 may be generated due to the formation of a uniform electric field on all surfaces during electroplating. The frame-integrated masks 100 and 200 manufactured through the uniform plating layer may further improve the image quality level of the OLED pixel. In addition, since an additional process of eliminating and eliminating defects does not have to be performed, process costs are reduced and productivity is improved.

A conductive substrate is used as a mother plate (cathode body), and a cathode body (not shown) is disposed to be spaced apart to form a plating film 110 (or mask metal film 110) by electroplating on the conductive substrate. Can be formed.

Next, the plating film 110 may be separated from the conductive substrate.

Meanwhile, before the plating film 110 is separated from the conductive substrate, heat treatment may be performed. In order to lower the coefficient of thermal expansion of the mask 100 and to prevent deformation due to the heat of the mask 100 and the mask pattern P, the heat treatment is performed before the plating film 110 is separated from the conductive substrate (or the mother plate and the cathode body). Can be performed. Heat treatment may be carried out at a temperature of 300 ℃ to 800 ℃.

In general, the Invar thin plate produced by electroplating has a higher coefficient of thermal expansion as compared to the Invar thin plate produced by rolling. Thus, the thermal expansion coefficient can be lowered by performing heat treatment on the Invar thin plate, and deformation may occur in the Invar thin plate during the heat treatment process. Therefore, when the plating film 110 is formed not only on the upper surface of the conductive substrate but also on a part of the side surface and the lower surface in the state of being adhered to the conductive substrate, even if the heat treatment is performed, peeling and deformation do not occur and the heat treatment can be stably performed. have.

The thickness of the mask metal film 110 generated by the electroplating process may be thinner than the rolling process. Accordingly, although the planarization (PS) process of reducing the thickness may be omitted, the etching characteristics may vary depending on the composition of the surface layer of the plating mask metal film 110 ′ and the crystal structure / fine structure. It is necessary to control the surface characteristics and thickness through.

Next, referring to FIG. 11B, the mask metal film 110 ′ may be adhered to the template 50. After the liquid wax is heated to 85 ° C. or higher and the mask metal film 110 ′ is brought into contact with the template 50, adhesion may be performed by passing the mask metal film 110 ′ and the template 50 between the rollers. .

According to an embodiment, the template 50 may be baked at about 120 ° C. for 60 seconds to vaporize the solvent of the temporary adhesive part 55, and immediately proceed to a mask metal film lamination process. . Lamination is performed by loading the mask metal film 110 ′ on the template 50 having the temporary adhesive part 55 formed on one surface thereof, and passing it between an upper roll of about 100 ° C. and a lower roll of about 0 ° C. Can be. As a result, the mask metal film 110 ′ may be contacted on the template 50 via the temporary adhesive part 55.

Figure 13 is an enlarged cross-sectional schematic diagram showing a temporary bonding portion 55 according to an embodiment of the present invention. As another example, the temporary adhesive part 55 may use a thermal release tape. In the heat-peelable tape, a core film 56 such as a PET film is disposed in the center, and thermal release adhesives 57a and 57b are arranged on both surfaces of the core film 56, and the adhesive layer 57a is disposed. , 57b) may be in a form in which release films / release films 58a and 58b are disposed. Here, the pressure-sensitive adhesive layers 57a and 57b disposed on both surfaces of the core film 56 may have different temperatures.

According to one embodiment, with the release film / release film 58a, 58b removed, the bottom surface (second adhesive layer 57b) of the heat release tape is adhered to the template 50 and the top of the heat release tape The surface [first adhesive layer 57a] may be adhered to the mask metal film 110 '. Since the temperature at which the first adhesive layer 57a and the second adhesive layer 57b are separated from each other is different, when the template 50 is separated from the mask 100 in FIG. 18 to be described later, the first adhesive layer 57a is used. The mask 100 may be separated from the template 50 and the temporary adhesive part 55 by applying the heat-peeled heat.

Subsequently, referring to FIG. 11B, one surface of the mask metal film 110 ′ may be planarized (PS). As described above, the mask metal film 110 ′ manufactured by the rolling process may reduce the thickness 110 ′-> 110 by a planarization (PS) process. In addition, the mask metal film 110 manufactured by the electroplating process may be performed with a planarization (PS) process to control surface characteristics and thickness.

Accordingly, as shown in FIG. 11C, as the thickness of the mask metal film 110 ′ is reduced (110 ′-> 110), the mask metal film 110 may have a thickness of about 5 μm to 20 μm. Can be.

Next, referring to FIG. 12D, a patterned insulating portion 25 may be formed on the mask metal film 110. The insulating portion 25 may be formed of a photoresist material using a printing method or the like.

Subsequently, etching of the mask metal layer 110 may be performed. Methods such as dry etching and wet etching may be used without limitation, and a portion of the mask metal film 110 exposed to the empty space 26 between the insulating portions 25 may be etched as a result of the etching. An etched portion of the mask metal film 110 forms a mask pattern P, and a mask 100 having a plurality of mask patterns P may be manufactured.

Next, referring to FIG. 12E, the manufacturing of the template 50 supporting the mask 100 may be completed by removing the insulating portion 25.

The mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy DM around the mask cell C. FIG. The dummy DM corresponds to a portion of the mask film 110 (mask metal film 110) except for the cell C, includes only the mask film 110, or a predetermined dummy in a form similar to the mask pattern P. FIG. The patterned mask layer 110 may be included. The dummy DM may be attached to the frame 200 (mask cell sheet part 220) in part or in whole of the dummy DM in correspondence to the edge of the mask 100.

The width of the mask pattern P may be smaller than 40 μm, and the thickness of the mask 100 may be about 5 to 20 μm. Since the frame 200 includes a plurality of mask cell regions CR, a plurality of masks 100 having mask cells C corresponding to the mask cell regions CR may also be provided. In addition, a plurality of templates 50 supporting each of the plurality of masks 100 may be provided.

14 is a schematic diagram illustrating a process of loading the mask support template 50 onto the frame 200 according to an embodiment of the present invention.

Referring to FIG. 14, the template 50 may be transferred by the grip part 30. The suction unit 32 of the grip unit 30 may absorb and transfer the opposite surface of the template 50 to which the mask 100 is attached. Since the grip part 30 adsorbs and transfers the template 50, and the mask 100 is adhesively supported to the template 50 via the temporary adhesive part 55, the template 50 is transferred onto the frame 200. Even in the process, the adhesion state and alignment state of the mask 100 are not affected.

15 is a schematic diagram illustrating a state in which a template 50 is loaded on a frame 200 according to an embodiment of the present invention so that the mask 100 corresponds to the cell regions CR11 to CR52 of the frame 200. to be. In the following description, the frame 200 has a mask cell area CR (CR 11 to CR 52) of 2 × 5 as an example.

Next, referring to FIG. 15, the mask 100 may correspond to one mask cell region CR of the frame 200. By loading the template 50 onto the frame 200 (or the mask cell sheet unit 220), the mask 100 may correspond to the mask cell region CR. While controlling the position of the grip unit 30, the camera unit 65 of the head unit 60 may determine whether the mask 100 corresponds to the mask cell region CR. Since the template 50 compresses the mask 100, the mask 100 and the frame 200 may closely contact each other.

Meanwhile, the lower support unit 90 (see FIG. 17) may be further disposed below the frame 200. The lower support unit 90 may be integral to the frame support unit 26. The lower support unit 90 may have a size enough to fit within the hollow area of the frame rim 210 and may have a flat plate shape. In addition, a predetermined support groove (not shown) corresponding to the shape of the mask cell sheet part 220 may be formed on the upper surface of the lower support unit 90. In this case, the edge sheet part 221 and the first and second grid sheet parts 223 and 225 are fitted into the support groove, so that the mask cell sheet part 220 may be more securely fixed.

The lower support unit 90 may compress the opposite surface of the mask cell region CR that the mask 100 contacts. That is, the lower support unit 90 may support the mask cell sheet part 220 in the upward direction to prevent the mask cell sheet part 220 from sagging in the downward direction during the adhesion of the mask 100. At the same time, since the lower support unit 90 and the template 50 are pressed against each other in a direction opposite to each other, the edge of the mask 100 and the frame 200 (or the mask cell sheet part 220) are pressed. ) Can be maintained without being disturbed.

As such, the mask 100 may be attached to the template 50, and the mask 100 may correspond to the mask cell region CR of the frame 200 by simply loading the template 50 onto the frame 200. Since the process is completed, no tensile force may be applied to the mask 100 in this process.

16 is a schematic diagram illustrating a process of bonding the mask 100 to the frame 200 according to an embodiment of the present invention.

Next, the mask 100 may be irradiated with the laser L to bond the mask 100 to the frame 200 by laser welding. A weld bead WB is generated in the welded portion of the laser welded mask, and the weld bead WB may be integrally connected with the same material as that of the mask 100 / frame 200. A pair of laser units 61a and 61b spaced apart from each other may perform welding by simultaneously irradiating the laser L with the left and right welds of the mask 100.

17 is a schematic view showing a state in which an adsorption force is applied to the mask 100 through the adsorption holes 229 according to an embodiment of the present invention.

Meanwhile, according to another exemplary embodiment, the plurality of suction holes 229 may be formed near the edge of the frame 200 in which the mask cell region CR is present. Specifically, a plurality of suction holes 229 may be formed at a portion spaced apart from the edge of the mask cell sheet 220 by a predetermined distance, and more specifically, spaced apart from the inner edge of the edge sheet 221 by a predetermined distance. The portion may be formed at a portion spaced apart from a corner of the first and second grid sheet portions 223 and 225 by a predetermined distance.

The shape, size, and the like of the plurality of adsorption holes 229 are not limited in the range of the purpose for acting the vacuum suction pressure. However, it is preferable that the position of the some adsorption hole 229 does not overlap with the welding part (welding object area | region) of the mask 100. When the welded portion and the suction hole 229 overlap each other, the mask 100 and the frame 200 (or the mask cell sheet portion 220) do not come into close contact with each other, so that the weld bead WB due to laser welding cannot be generated properly. Can be. Preferably, the plurality of adsorption holes 229 may be formed in a portion adjacent to the welded portion to further closely contact the welded portion of the mask 100 to the frame 200 (or the mask cell sheet portion 220).

As shown in FIG. 17, when the template 50 is loaded onto the frame 200 (or the mask cell sheet unit 220), a portion of the lower surface of the mask 100 may be frame 200 (or the mask cell sheet unit). 220)] is in contact with the top. The upper part of the suction hole 229 formed in the frame 200 (or the mask cell sheet part 220) corresponds to the lower surface of the mask 100 and the suction force (absorption pressure) corresponding to the lower part of the suction hole 229. The applying means may apply the adsorption force VS (or the adsorption pressure VS) to the mask 100 through the adsorption hole 229 to attract a portion of the mask 100 corresponding to the adsorption hole 229. Accordingly, the mask 100 may be in close contact with the frame 200, and the welding bead WB may be more stably generated when the laser welding is performed.

An adsorption part 95 may be formed on an upper portion of the lower support unit 90. The adsorption part 95 is preferably disposed to correspond to the position of the adsorption holes 229 formed in the frame 200 (or the mask cell sheet part 220). In other words, the suction unit 95 may be disposed on the lower support unit 90 at a position where the suction force VS (or the suction pressure VS) may be concentrated on the suction hole 229. The adsorption part 95 may use a device capable of vacuum suction, and may be connected to an external pressure generating means. For example, a vacuum flow path 96 is formed inside the lower support unit 90 so that the other end is connected to an external pressure generating means (not shown) such as a pump, and one end may be connected to the adsorption unit 95. The upper surface of the suction unit 95 connected to the vacuum passage 96 is formed with a plurality of holes, slits, etc., may be used as a passage through which the suction pressure is applied. The external pressure generating means is connected to several vacuum flow paths 96 of the lower support unit 90 to individually control the pressure suction for each vacuum flow path 96, and the pressure absorption for all vacuum flow paths 96. You can also control at the same time.

As the suction force 95 (or the suction pressure VS) is provided at the suction part 95 of the lower support unit 90, the suction force VS is applied to the mask 100 through the suction hole 229. The mask 100 can be pulled toward the suction part 95 side (lower side). In this case, an interface between the mask 100 and the frame 200 (or the mast cell sheet part 220) may be in close contact with each other.

Since the suction part 95 pulls the mask 100 strongly, there is no minute air gap between the interface of the mask 100 and the frame 200. As a result, since the mask 100 and the frame 200 (in the enlarged view of FIG. 13, the first grid sheet portion 223) come into close contact with each other, the mask 100 and the frame 200 are irradiated even if the laser L is irradiated anywhere in the welded portion. Weld beads WB can be produced well between. The welding bead WB integrally connects the mask 100 and the frame 200, and as a result, welding may be stably performed well.

18 is a schematic diagram illustrating a process of separating the mask 100 and the template 50 after attaching the mask 100 to the frame 200 according to an embodiment of the present invention.

Referring to FIG. 18, after the mask 100 is adhered to the frame 200, the mask 100 and the template 50 may be debonded. Separation of the mask 100 and the template 50 may be performed through at least one of heat application (ET), chemical treatment (CM), ultrasonic application (US), and UV application (UV) to the temporary adhesive part 55. have. Since the mask 100 remains attached to the frame 200, only the template 50 may be lifted. For example, when heat (ET) at a temperature higher than 85 ° C. to 100 ° C. is applied, the viscosity of the temporary adhesive part 55 is lowered, and the adhesive force between the mask 100 and the template 50 is weakened, and thus the mask 100 ) And the template 50 may be separated. As another example, the mask 100 and the template 50 may be separated by dissolving and removing the temporary adhesive part 55 by dipping (CM) the temporary adhesive part 55 in chemical substances such as IPA, acetone, and ethanol. have. As another example, when the ultrasonic wave (US) or the UV (UV) is applied, the adhesive force between the mask 100 and the template 50 is weakened, so that the mask 100 and the template 50 may be separated.

In more detail, since the temporary bonding part 55 which mediates the adhesion between the mask 100 and the template 50 is a TBDB adhesive material (temporary bonding & debonding adhesive), various debonding methods can be used.

For example, a solvent debonding method according to chemical treatment (CM) may be used. As the temporary adhesive part 55 is dissolved by penetration of a solvent, debonding may be performed. In this case, since the pattern P is formed in the mask 100, the solvent may penetrate through the mask pattern P and the interface between the mask 100 and the template 50. Solvent debonding has the advantage of being relatively economical as compared to other debonding methods because it can be debonded at room temperature and does not require a separate, devised complex debonding facility.

As another example, a heat debonding method according to heat application ET may be used. Debonding may be performed in the vertical direction or the left and right directions when the high temperature heat is induced to disassemble the temporary adhesive part 55 and the adhesive force between the mask 100 and the template 50 is reduced.

As another example, a peelable adhesive debonding method according to heat application (ET), UV application (UV), or the like may be used. When the temporary adhesive part 55 is a heat-peelable tape, debonding may be performed by a peeling adhesive debonding method. This method does not require high temperature heat treatment and expensive heat treatment equipment as the thermal debonding method and the progress process. Has a relatively simple advantage.

As another example, a room temperature debonding method according to chemical treatment (CM), ultrasonic application (US), UV application (UV), or the like may be used. If a non-sticky treatment is applied to a portion (center) of the mask 100 or the template 50, only the edge portion may be adhered by the temporary adhesive portion 55. In addition, during the debonding, the solvent penetrates into the edge portion, and the debonding is performed by dissolution of the entrance-adhesion part 55. This method is advantageous in that the remaining portions of the mask 100 and the template 50 except for the edges of the mask 100 and the template 50 are not directly lost during bonding and debonding, or defects caused by adhesive residue during debonding do not occur. There is this. In addition, unlike the thermal debonding method, since the high temperature heat treatment process is not required during debonding, there is an advantage in that the process cost can be relatively reduced.

19 is a schematic diagram illustrating a state in which the mask 100 is adhered to the frame 200 according to an embodiment of the present invention.

Referring to FIG. 19, one mask 100 may be bonded onto one cell region CR of the frame 200.

Since the mask cell sheet portion 220 of the frame 200 has a thin thickness, when the mask cell sheet portion 220 is bonded to the mask cell sheet portion 220 while the tensile force is applied to the mask 100, the tensile force remaining in the mask 100 is masked. The cell sheet 220 and the mask cell region CR may act on the cell sheet 220 and may be modified. Therefore, adhesion of the mask 100 to the mask cell sheet part 220 should be performed without applying a tensile force to the mask 100. The present invention corresponds to the mask cell region CR of the frame 200 by simply attaching the mask 100 to the template 50 and loading the template 50 onto the frame 200. Since the process is completed, no tensile force may be applied to the mask 100 in this process. Thus, it is possible to prevent the tensile force applied to the mask 100 from acting as a tension on the frame 200 to deform the frame 200 (or the mask cell sheet part 220).

Since the mask 10 of FIG. 1 includes six cells C1 to C6, the mask 10 has a long length, whereas the mask 100 of the present invention has a short length including one cell C. The degree of misalignment of the pixel position accuracy (PPA) can be reduced. For example, assuming that the length of the mask 10 including the plurality of cells C1 to C6, ... is 1 m, and a PPA error of 10 µm occurs in the entire 1 m, the mask 100 of the present invention According to the reduction of the relative length (corresponding to the reduction in the number of cells (C)) can be 1 / n above the error range. For example, if the length of the mask 100 of the present invention is 100mm, it has a length reduced by 1/10 at 1m of the conventional mask 10, the PPA error of 1㎛ occurs in the entire 100mm length As a result, the alignment error is significantly reduced.

On the other hand, if the mask 100 is provided with a plurality of cells (C), each cell (C) corresponding to each cell region (CR) of the frame 200 is within a range that the alignment error is minimized, The mask 100 may correspond to the plurality of mask cell regions CR of the frame 200. Alternatively, the mask 100 having the plurality of cells C may correspond to one mask cell region CR. Also in this case, in consideration of the process time and productivity according to the alignment, it is preferable that the mask 100 has as few cells as possible.

In the case of the present invention, since only one cell C of the mask 100 needs to be corresponded and the alignment state checked, the plurality of cells C: C1 to C6 must be simultaneously associated and the alignment state must be confirmed. In comparison with the conventional method (see Fig. 1), the production time can be significantly reduced.

That is, in the method of manufacturing a frame-integrated mask of the present invention, each cell C11 to C16 included in the six masks 100 corresponds to one cell region CR11 to CR16, respectively, and checks the alignment state. Through the process, the time can be much shorter than the conventional method of simultaneously matching six cells C1 to C6 and simultaneously confirming the alignment of the six cells C1 to C6.

In addition, in the method of manufacturing a frame-integrated mask of the present invention, the product yield in 30 steps of matching and aligning 30 masks 100 with 30 cell areas CR: CR11 to CR56, respectively, results in six cells (C1). 5 masks 10 (see FIG. 1 (a)) each comprising ˜C6) may appear much higher than the conventional product yield in 5 steps of matching and aligning the frame 20. Since the conventional method of aligning six cells C1 to C6 in a region corresponding to six cells C at a time is much more cumbersome and difficult, the product yield is low.

Meanwhile, as described above in step (b) of FIG. 11, when the mask metal film 110 is attached to the template 50 by the lamination process, a temperature of about 100 ° C. may be applied to the mask metal film 110. . As a result, the mask metal layer 110 may be adhered to the template 50 in a state in which some tensile tension is applied. Thereafter, when the mask 100 is adhered to the frame 200 and the template 50 is separated from the mask 100, the mask 100 may contract a predetermined amount.

After each of the masks 100 is bonded onto the corresponding mask cell region CR, the template 50 and the masks 100 are separated, and a plurality of masks 100 are applied in tension in opposite directions. Therefore, the force is canceled so that deformation does not occur in the mask cell sheet portion 220. For example, the first grid sheet portion 223 between the mask 100 attached to the CR11 cell region and the mask 100 attached to the CR12 cell region may move in the right direction of the mask 100 attached to the CR11 cell region. The tension acting and the tension acting in the left direction of the mask 100 attached to the CR12 cell region may be offset. Therefore, the deformation of the frame 200 (or the mask cell sheet part 220) due to tension is minimized, so that the alignment error of the mask 100 (or the mask pattern P) can be minimized.

20 is a schematic diagram illustrating an OLED pixel deposition apparatus 1000 using frame integrated masks 100 and 200 according to an embodiment of the present invention.

Referring to FIG. 20, the OLED pixel deposition apparatus 1000 includes a magnet plate 300 in which a magnet 310 is accommodated and a coolant line 350 is disposed, and an organic material source 600 from a lower portion of the magnet plate 300. And a deposition source supply unit (500) for supplying ().

A target substrate 900 such as glass on which the organic source 600 is deposited may be interposed between the magnet plate 300 and the source deposition unit 500. In the target substrate 900, the frame-integrated masks 100 and 200 (or FMMs) for allowing the organic material 600 to be deposited pixel by pixel may be closely attached or very close to each other. The magnet 310 may generate a magnetic field and may be in close contact with the target substrate 900 by the magnetic field.

The deposition source supply unit 500 may supply the organic source 600 while reciprocating the left and right paths, and the organic source 600 supplied from the deposition source supply unit 500 may have patterns P formed in the frame integrated masks 100 and 200. ) May be deposited on one side of the target substrate 900. The deposited organic source 600 passing through the pattern P of the frame-integrated masks 100 and 200 can act as the pixel 700 of the OLED.

In order to prevent uneven deposition of the pixel 700 by the shadow effect, the pattern of the frame-integrated masks 100 and 200 may be formed to be inclined S (or formed into a tapered shape S). . Since the organic sources 600 passing through the pattern in a diagonal direction along the inclined surface may also contribute to the formation of the pixel 700, the pixel 700 may be uniformly deposited as a whole.

Since the mask 100 is adhesively fixed to the frame 200 at a first temperature higher than the pixel deposition process temperature, even if the mask 100 is raised to the process temperature for pixel deposition, the position of the mask pattern P is hardly affected. The PPA between the 100 and the neighboring mask 100 may be maintained not to exceed 3 μm.

Although the present invention has been shown and described with reference to preferred embodiments as described above, it is not limited to the above embodiments and various modifications made by those skilled in the art without departing from the spirit of the present invention. Modifications and variations are possible. Such modifications and variations are intended to fall within the scope of the invention and the appended claims.

10: apparatus for manufacturing frame-integrated mask
20: stage part
30: grip
40: grip moving part
50: template
51: laser through hole
55: temporary adhesive
60: head
70: head moving part
90: lower support unit
100: mask
110: mask film
200: frame
210: border frame portion
220: mask cell sheet portion
221: border sheet portion
223: first grid sheet portion
225: second grid sheet portion
1000: OLED pixel deposition device
C: cell, mask cell
CR: mask cell area
DM: Dummy, Mask Dummy
L: laser
P: mask pattern
WB: welding bead

Claims (8)

As an apparatus for manufacturing a frame-integrated mask,
A stage unit on which the frame is seated and supported;
A grip portion for gripping a template on which the mask is adhesively supported;
A grip moving part which moves the grip part in at least one of X, Y, Z and θ axes;
A head unit for irradiating a laser to a welding portion of the mask and sensing an alignment state of the mask; And
Head moving part for moving the head part in at least one of X, Y and Z axes
Including,
In the grip portion, a plurality of adsorption units for applying pressure to the template are formed at a mutual interval.
And the plurality of adsorption units adsorb and grip at least a portion of the upper surface of the template. The method of claim 1,
The stage unit includes a heating unit for applying heat to the frame, wherein the frame-integrated mask manufacturing apparatus. The method of claim 1,
The grip part,
A grip unit for gripping a template;
A grip moving unit which moves the grip unit in at least one of X, Y, Z and θ axes; And
A connecting unit connecting the grip moving unit to the grip moving unit;
Apparatus for producing a frame-integrated mask comprising a. The method of claim 3,
A plurality of suction units are arranged in the grip unit,
The apparatus for manufacturing a frame-integrated mask, wherein the plurality of adsorption units are disposed so as not to overlap in the welded portion of the mask in the region on the Z axis. The method of claim 1,
The grip moving part,
A base unit;
A grip support unit disposed on the base unit to support the grip portion; And
A grip rail unit for moving the base unit,
And the base unit moves in a region spaced apart in the Z-axis direction from the stage portion so that the grip portion enters the upper portion of the stage portion. The method of claim 5,
An apparatus for manufacturing a frame-integrated mask, wherein a base rail unit is formed on the base unit along the Y axis direction, and the grip support unit is connected to the base rail unit to move along the Y axis direction. The method of claim 1,
Head part,
An apparatus for manufacturing a frame-integrated mask, comprising a laser unit that irradiates a mask with a laser to weld the frame to the mask, or irradiates the mask with a laser to perform laser trimming. The method of claim 7, wherein
The pair of laser units are arranged to be spaced apart from each other,
Each laser unit irradiates a laser to the welding part of one side and the other side of a mask, The manufacturing apparatus of the frame integrated mask.

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