KR101988498B1 - Template for supporting mask and producing methoe thereof and producing method of mask integrated frame - Google Patents

Abstract

The present invention relates to a mask supporting template and a manufacturing method thereof, and method of manufacturing a frame-integrated mask. According to the present invention, the manufacturing method of a mask supporting template is a method for manufacturing a template (50) for supporting an OLED pixel forming mask (100) to correspond to a frame (200). The manufacturing method of a mask supporting template comprises the steps of: (a) providing a mask metal film (110); (b) adhering the mask metal film (110) on the template (50) having a temporary adhesive part (55) formed on one surface thereof; and (c) manufacturing the mask (100) by forming a mask pattern (P) on the mask metal film (110).

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a mask support template, a method of manufacturing the mask support template,

The present invention relates to a mask supporting template, a manufacturing method thereof, and a method of manufacturing a frame-integrated mask. More specifically, it is possible to stably support and move without deformation of the mask, and when the mask is integrally formed with the frame, the adhesion between the mask and the frame can be improved, and alignment between the masks can be clarified And a method for manufacturing a frame-integrated mask.

In the OLED manufacturing process, FMM (Fine Metal Mask) is a technique for forming pixels by depositing a thin film of a shadow mask on a substrate and depositing the organic material at a desired position.

In a conventional OLED manufacturing process, a mask is formed in a stick shape or a plate shape, and then a mask is welded and fixed to an OLED pixel deposition frame. One mask may include several cells corresponding to one display. In addition, several masks can be fixed to the OLED pixel deposition frame for the manufacture of a large area OLED. In the process of fixing to the frame, each mask is stretched so as to be flat. Adjusting the tensile force so that the entire portion of the mask is flat is a very difficult task. Particularly, in order to align a mask pattern having a size of several to several tens of micrometers while flattening each of the cells, it is necessary to perform a high level operation to check the alignment state in real time while finely adjusting the tensile force applied to each side of the mask do.

Nevertheless, there has been a problem in that, in fixing the plurality of masks to one frame, alignment between the masks and between the mask cells is not good. Further, in the process of welding and fixing the mask to the frame, since the thickness of the mask film is too thin and confronted, the mask is struck or warped by the load, wrinkles and burrs generated in the welding portion during the welding process, There is a problem that the alignment is staggered.

In the case of ultra-high quality OLED, QHD image quality is 500 ~ 600 PPI (pixel per inch), pixel size is about 30 ~ 50㎛, 4K UHD and 8K UHD high image quality are higher ~ 860 PPI, ~ 1600 PPI Resolution. Considering the pixel size of the ultra-high-resolution OLED, the alignment error between each cell must be reduced to about several micrometers, and the deviation from the OLED can lead to a product failure, resulting in a very low yield. Therefore, it is necessary to develop techniques for preventing deformation such as masking and twisting, clarifying alignment, fixing the mask to the frame, and the like.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a mask support template capable of stably supporting and moving a mask without deformation, and a manufacturing method thereof.

Another object of the present invention is to provide a mask support template capable of improving adhesion between a mask and a frame when the mask is adhered to the frame, and a manufacturing method thereof.

It is another object of the present invention to provide a mask support template which can be repeatedly used after bonding a mask to a frame, and a manufacturing method thereof.

It is another object of the present invention to provide a method of manufacturing a frame-integrated mask in which the mask and the frame can have an integrated structure.

It is another object of the present invention to provide a method of manufacturing a frame-integrated mask capable of preventing deformation such as warping or twisting of the mask and clarifying alignment.

Another object of the present invention is to provide a method for manufacturing a frame-integrated mask in which the production time is significantly reduced and the yield is remarkably increased.

The above object of the present invention is achieved by a method of manufacturing a template for supporting a mask for OLED pixel formation and corresponding to a frame, the method comprising the steps of: (a) providing a mask metal film; (b) adhering a mask metal film on a template on which a temporary adhering portion is formed; And (c) forming a mask pattern on the mask metal film to produce a mask.

The mask metal film can be produced by rolling or electroforming.

Between the step (b) and the step (c), the step of reducing the thickness of the mask metal film adhered to the template may be further included.

The thickness reduction of the mask metal film can be performed by any one of CMP (Chemical Mechanical Polishing), chemical wet etching, and dry etching.

After the step of reducing the thickness of the mask metal film, the thickness of the mask metal film may be 5 占 퐉 to 20 占 퐉.

(A1) forming a mask metal film on at least one side of the conductive single crystal substrate, wherein the mask metal film is formed by electroplating; And (a2) separating the mask metal film from the conductive single crystal substrate.

Between step (a1) and step (a2), a step of heat-treating the mask metal film may be further performed.

The temporary adhering portion may be an adhesive or an adhesive sheet which can be separated by applying heat, an adhesive or an adhesive sheet which can be separated by UV irradiation.

The temporary adhering portion may be a liquid wax or a thermal release tape.

The liquid wax can securely bond the template to the mask metal film at a temperature lower than 85 ° C.

In the step (b), after the liquid wax is heated to 85 DEG C or higher and the mask metal film is brought into contact with the template, the mask metal film and the template may be passed between the rollers to perform the adhesion.

(c) forming (c1) a patterned insulating portion on the mask metal film; (c2) etching a portion of the exposed mask metal film between the insulating portions to form a mask pattern; And (c3) removing the insulating portion.

The template may be a transparent material.

The template may comprise a material selected from the group consisting of glass, silica, heat resistant glass, quartz, alumina (Al ₂ O ₃ ), borosilicate glass, and zirconia.

The above object of the present invention can also be achieved by a template for supporting a mask for forming an OLED pixel and corresponding to a frame, comprising: a template; A temporary adhering portion formed on the template; And a mask bonded to the template via the temporary adhering portion and including a mask pattern formed thereon.

The thickness of the mask metal film may be 5 탆 to 20 탆.

The temporary adhering portion may be an adhesive or an adhesive sheet which can be separated by applying heat, an adhesive or an adhesive sheet which can be separated by UV irradiation.

The temporary adhering portion may be a liquid wax or a thermal release tape.

A laser passage hole may be formed in a portion of the template corresponding to the welded portion of the mask.

The template may be a transparent material.

The template may comprise a material selected from the group consisting of glass, silica, heat resistant glass, quartz, alumina (Al ₂ O ₃ ), borosilicate glass, and zirconia.

The mask may include a mask cell having a plurality of mask patterns formed therein, and a dummy around the mask cell.

The mask may be composed of a metal sheet manufactured by a rolling process or an electroforming process.

The above object of the present invention can also be achieved by a method of manufacturing a frame-integrated mask having at least one mask and a frame for supporting the mask, the method comprising the steps of: (a) providing a mask metal film; (b) adhering a mask metal film on a template on which a temporary adhering portion is formed; (c) forming a mask pattern on the mask metal film to manufacture a mask; (d) providing a frame having at least one mask cell region; (e) loading a template on the frame to correspond to a mask cell region of the frame; And (f) irradiating a laser to the welded portion of the mask to adhere the mask to the frame.

The mask metal film can be produced by rolling or electroforming.

(d) comprises the steps of: (d1) providing a frame frame portion including a hollow region; (d2) planar mask cell sheet portion to a rim frame portion; And (d3) forming a plurality of mask cell regions in the mask cell sheet portion to produce a frame.

(d) comprises the steps of: (d1) providing a frame frame portion including a hollow region; And (d2) connecting the mask cell sheet portion having the plurality of mask cell regions to the frame portion to manufacture the frame.

Between the step (b) and the step (c), the step of reducing the thickness of the mask metal film adhered to the template may be further included.

The thickness reduction of the mask metal film can be performed by any one of CMP (Chemical Mechanical Polishing), chemical wet etching, and dry etching.

After the step of reducing the thickness of the mask metal film, the thickness of the mask metal film may be 5 占 퐉 to 20 占 퐉.

(A1) forming a mask metal film on at least one side of the conductive single crystal substrate, wherein the mask metal film is formed by electroplating; And (a2) separating the mask metal film from the conductive single crystal substrate.

Between step (a1) and step (a2), a step of heat-treating the mask metal film may be further performed.

The temporary adhering portion may be an adhesive or an adhesive sheet which can be separated by applying heat, an adhesive or an adhesive sheet which can be separated by UV irradiation.

The temporary adhering portion may be a liquid wax or a thermal release tape.

The liquid wax can securely bond the template to the mask metal film at a temperature lower than 85 ° C.

In the step (b), after the liquid wax is heated to 85 DEG C or higher and the mask metal film is brought into contact with the template, the mask metal film and the template may be passed between the rollers to perform the adhesion.

(c) forming (c1) a patterned insulating portion on the mask metal film; (c2) etching a portion of the exposed mask metal film between the insulating portions to form a mask pattern; And (c3) removing the insulating portion.

The template may be a transparent material.

The template may comprise a material selected from the group consisting of glass, silica, heat resistant glass, quartz, alumina (Al ₂ O ₃ ), borosilicate glass, and zirconia.

The laser irradiated from the top of the template can be irradiated to the welded portion of the mask through the laser passing hole.

A weld bead is formed in a portion of the welded portion irradiated with the laser, and the weld bead can be mediated to integrally connect the mask and the frame.

After the step (f), the method may further include the step of separating the mask and the template by performing at least one of heat, chemical treatment, ultrasonic wave, and UV application to the temporary adhering portion.

The mask cell sheet portion includes a border sheet portion; And at least one first grid sheet portion extending in the first direction and having both ends connected to the border sheet portion.

The mask cell sheet portion may further include at least one second grid sheet portion extending in a second direction perpendicular to the first direction and intersecting the first grid sheet portion and having both ends connected to the border sheet portion.

The mask and the frame may be made of any one of invar, super invar, nickel, and nickel-cobalt.

According to the present invention configured as described above, there is an effect that the mask can be stably supported and moved without being deformed.

Further, according to the present invention, when the mask is attached to the frame, the adhesion between the mask and the frame can be improved.

Further, according to the present invention, there is an effect that the mask can be repeatedly used after being bonded to the frame.

Further, according to the present invention, there is an effect that the mask and the frame can form an integral structure.

Further, according to the present invention, it is possible to prevent deformation such as warping or twisting of the mask and to make alignment clear.

Further, according to the present invention, the production time can be remarkably reduced and the yield can be remarkably increased.

1 is a schematic view showing a conventional OLED pixel deposition mask.
2 is a schematic view showing a process of bonding a conventional mask to a frame.
FIG. 3 is a schematic view showing an alignment error between cells in a process of stretching a conventional mask. FIG.
4 is a front view and a side sectional view showing a frame-integrated mask according to an embodiment of the present invention.
5 is a front view and a side sectional view showing a frame according to an embodiment of the present invention.
6 is a schematic view illustrating a process of manufacturing a frame according to an embodiment of the present invention.
7 is a schematic view showing a manufacturing process of a frame according to another embodiment of the present invention.
8 is a schematic view showing a mask for forming a conventional high-resolution OLED.
9 is a schematic view showing a mask according to an embodiment of the present invention.
10 is a schematic view showing a process of manufacturing a mask metal film in a rolling manner according to an embodiment of the present invention.
11 is a schematic view showing a process of fabricating a mask metal film according to another embodiment of the present invention by an electroforming method.
12 to 13 are schematic views showing a process of bonding a mask metal film on a template according to an embodiment of the present invention and forming a mask to manufacture a mask support template.
14 is an enlarged cross-sectional schematic view showing a temporary adhering portion according to an embodiment of the present invention.
15 is a schematic view illustrating a process of loading a mask support template onto a frame according to an embodiment of the present invention.
16 is a schematic view showing a state in which a template is loaded on a frame to correspond to a cell region of a frame according to an embodiment of the present invention.
17 is a schematic view showing a process of separating a mask and a template after a mask is bonded to a frame according to an embodiment of the present invention.
18 is a schematic view showing a state in which a mask is adhered to a frame according to an embodiment of the present invention.
19 is a schematic view showing an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.

The following detailed description of the invention refers to the accompanying drawings, which illustrate, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are different, but need not be mutually exclusive. For example, certain features, structures, and characteristics described herein may be implemented in other embodiments without departing from the spirit and scope of the invention in connection with an embodiment. It is also to be understood that the position or arrangement of the individual components within each disclosed embodiment may be varied without departing from the spirit and scope of the invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is to be limited only by the appended claims, along with the full scope of equivalents to which such claims are entitled, if properly explained. In the drawings, like reference numerals refer to the same or similar functions throughout the several views, and length and area, thickness, and the like may be exaggerated for convenience.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art can easily carry out the present invention.

1 is a schematic view showing a conventional OLED pixel deposition mask 10;

Referring to FIG. 1, the conventional mask 10 may be made of a stick-type or a plate-type. The mask 10 shown in Fig. 1 (a) is a stick-shaped mask, and both sides of the stick can be welded and fixed to the OLED pixel deposition frame. The mask 100 shown in FIG. 1 (b) is a plate-type mask and can be used in a pixel forming process with a large area.

A plurality of display cells C are provided in the body (or mask film 11) of the mask 10. One cell C corresponds to one display such as a smart phone. In the cell C, a pixel pattern P is formed so as to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B are displayed. For example, a pixel pattern P is formed in the cell C so as to have a resolution of 70 X 140. That is, a large number of pixel patterns P constitute one cell C in a cluster, and a plurality of cells C can be formed in the mask 10. [

2 is a schematic view showing a process of bonding a conventional mask 10 to a frame 20. Fig. FIG. 3 is a schematic view showing that an alignment error occurs between cells in a process of stretching (F1 to F2) a conventional mask 10. A stick mask 10 having six cells C: C1 to C6 shown in FIG. 1 (a) will be described as an example.

Referring to FIG. 2 (a), first, the stick mask 10 should be flattened. Tensile forces F1 to F2 are applied in the longitudinal direction of the stick mask 10 and the stick mask 10 is stretched according to the pulling. In this state, the stick mask 10 is loaded on the frame 20 in a rectangular frame shape. The cells C 1 to C 6 of the stick mask 10 are located in the hollow space portion of the frame 20. The frame 20 may be of a size such that the cells C1 to C6 of one stick mask 10 are located in the hollow space of the frame and the cells C1 to C6 of the plurality of stick masks 10 Or may be of a size large enough to be located in the inner hollow area.

2 (b), after aligning while slightly adjusting the tensile force F1 to F2 applied to each side of the stick mask 10, a part of the side surface of the stick mask 10 is welded The stick mask 10 and the frame 20 are interconnected. 2 (c) shows a cross-sectional side view of the frame and the stick mask 10 connected to each other.

Referring to FIG. 3, although the tensile forces F1 to F2 applied to the respective sides of the stick mask 10 are finely adjusted, the alignment of the mask cells C1 to C3 does not work well. For example, the distances D1 to D1 ", D2 to D2 "between the patterns P of the cells C1 to C3 are different from each other, or the patterns P are skewed. The stick mask 10 is large in size including a plurality of (for example, six) cells C1 to C6, and has a very thin thickness on the order of several tens of micrometers, so that it is easily struck or warped by a load. In addition, it is a very difficult task to check the alignment state between the cells C1 to C6 in real time through a microscope while adjusting the tensile forces F1 to F2 to flatten each of the cells C1 to C6.

Therefore, the minute errors of the tensile forces F1 to F2 can cause an error in the extent to which the cells C1 to C3 of the stick mask 10 are elongated or extended, To D1 ", D2 to D2 ") are different from each other. Of course, it is difficult to arrange the mask pattern P so that the error is completely zero. However, in order to prevent the mask pattern P having a size of several to several tens of micrometers from adversely affecting the pixel process of the ultra high definition OLED, . The alignment error between adjacent cells is referred to as pixel position accuracy (PPA).

In addition to this, a plurality of stick masks 10 of about 6 to 20 are connected to one frame 20, respectively, and a plurality of stick masks 10 and a plurality of cells C It is also a very difficult task to clarify the alignment state between the substrates C6 to C6 and the process time due to the alignment is inevitably increased, which is a significant reason for reducing the productivity.

On the other hand, after the stick mask 10 is connected and fixed to the frame 20, the tensile forces F1 to F2 applied to the stick mask 10 can be applied to the frame 20 in reverse. That is, the stick mask 10, which has been stretched by the tensile forces F1 to F2, can be tensioned on the frame 20 after it is connected to the frame 20. Normally, this tension is not great and the frame 20 may not have a large influence. However, when the size of the frame 20 is reduced and the rigidity is lowered, such a tension can finely deform the frame 20. Thus, there may arise a problem that the alignment state is changed between a plurality of cells C to C6.

Accordingly, the present invention proposes a frame 200 and a frame-integrated mask that allow the mask 100 to have an integral structure with the frame 200. The mask 100 formed integrally with the frame 200 is prevented from being deformed such as striking or twisting and can be clearly aligned with the frame 200. [ Since the mask 100 does not apply any tensile force to the frame 200 when the mask 100 is connected to the frame 200, it may not apply enough tension to deform the frame 200 after the mask 100 is connected to the frame 200 . Further, the manufacturing time for integrally connecting the mask 100 to the frame 200 can be remarkably reduced, and the yield can be remarkably increased.

FIG. 4 is a front view (FIG. 4A) and a side sectional view (FIG. 4B) showing a frame-integrated mask according to an embodiment of the present invention, (A) and a side sectional view (Fig. 5 (b)) showing a frame.

Referring to FIGS. 4 and 5, the frame-integrated mask may include a plurality of masks 100 and one frame 200. In other words, a plurality of masks 100 are attached to the frame 200 one by one. Hereinafter, a square type mask 100 will be described as an example for convenience of explanation, but the masks 100 may be in the form of a stick mask having projections that are clamped on both sides before being bonded to the frame 200, The protrusions can be removed.

A plurality of mask patterns P are formed in each of the masks 100, and one cell C may be formed in one of the masks 100. One mask cell C may correspond to one display such as a smart phone.

The mask 100 may be a super invar material having a thermal expansion coefficient of about 1.0 X 10 < ^-6 > / DEG C and an invar, about 1.0 X 10 < ^-7 > / DEG C. Since the mask 100 of this material has a very low thermal expansion coefficient, there is little possibility that the pattern shape of the mask is deformed by heat energy, and thus it can be used as FMM (Fine Metal Mask) and shadow mask in manufacturing high resolution OLED. In consideration of the development of techniques for performing the pixel deposition process in a range in which the temperature change value is not large recently, the mask 100 may be formed of nickel (Ni), nickel-cobalt ) Or the like. The mask 100 may be a metal sheet produced by a rolling process or electroforming. This will be described later in detail with reference to FIG. 9 and FIG.

The frame 200 is formed so as to adhere a plurality of masks 100 thereto. The frame 200 may include a plurality of edges formed in a first direction (e.g., a horizontal direction) and a second direction (e.g., a vertical direction) including an outermost border. These various edges may define a region on the frame 200 where the mask 100 is to be adhered.

The frame 200 may include a frame portion 210 having a substantially rectangular shape and a rectangular frame shape. The inside of the frame part 210 may be hollow. That is, the frame frame part 210 may include a hollow area R. [ The frame 200 may be made of a metal such as invar, super invar, aluminum, titanium, or the like, and may be made of a material such as Invar, Super Invar, Nickel, or Nickel-Cobalt having the same thermal expansion coefficient as that of the mask And these materials may be applied to both the frame part 210 and the mask cell part 220, which are components of the frame 200.

In addition, the frame 200 may include a mask cell sheet portion 220 having a plurality of mask cell regions CR and connected to the frame frame portion 210. The mask cell sheet portion 220 may be formed by rolling in the same manner as the mask 100, or may be formed using another film forming process such as electroplating. The mask cell sheet portion 220 may be connected to the frame portion 210 after forming a plurality of mask cell regions CR on a flat sheet by laser scribing, etching, or the like. Alternatively, the mask cell sheet portion 220 may be formed by connecting a flat sheet to the frame portion 210, and then forming a plurality of mask cell regions CR by laser scribing, etching, or the like. In this specification, it is assumed that a plurality of mask cell regions CR are first formed in the mask cell sheet portion 220 and then connected to the frame portion 210.

The mask cell sheet portion 220 may include at least one of a border sheet portion 221 and first and second grid sheet portions 223 and 225. The border sheet portion 221 and the first and second grid sheet portions 223 and 225 refer to respective portions partitioned by the same sheet, and they are integrally formed with each other.

The frame sheet portion 221 can be substantially connected to the frame frame portion 210. [ Accordingly, the frame sheet portion 221 may have a substantially rectangular shape corresponding to the frame portion 210 and a rectangular frame shape.

In addition, the first grid sheet portion 223 may be extended in the first direction (horizontal direction). The first grid sheet portion 223 may be formed in a straight line shape so that both ends of the first grid sheet portion 223 may be connected to the border sheet portion 221. When the mask cell sheet portion 220 includes a plurality of first grid sheet portions 223, it is preferable that the respective first grid sheet portions 223 are equally spaced.

In addition, in addition, the second grid sheet portion 225 can be extended in the second direction (longitudinal direction). The second grid sheet portion 225 may be formed in a straight line shape, and both ends thereof may be connected to the border sheet portion 221. The first grid sheet portion 223 and the second grid sheet portion 225 may be perpendicularly intersected with each other. When the mask cell sheet portion 220 includes a plurality of the second grid sheet portions 225, it is preferable that the respective second grid sheet portions 225 are equally spaced.

The space between the first grid sheet portions 223 and the space between the second grid sheet portions 225 may be the same or different depending on the size of the mask cell C. [

Although the first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, the shape of the cross section perpendicular to the longitudinal direction may be a rectangular shape such as a parallelogram or a quadrangle shape, , Sides, and corners may be rounded. The cross-sectional shape can be adjusted in the course of laser scribing, etching, and the like.

The thickness of the rim frame portion 210 may be thicker than the thickness of the mask cell sheet portion 220. The frame part 210 may be formed to have a thickness ranging from several millimeters to several centimeters because it is responsible for the overall rigidity of the frame 200.

In the case of the mask cell sheet portion 220, it is difficult to manufacture a substantially thick sheet, and if it is too thick, a path through which the organic material source 600 (see FIG. 19) Blocking can cause problems. On the contrary, if the thickness is too small, it may be difficult to secure the rigidity enough to support the mask 100. Accordingly, it is preferable that the mask cell sheet portion 220 is thinner than the frame frame portion 210, but thicker than the mask 100. The thickness of the mask cell sheet portion 220 may be about 0.1 mm to 1 mm. The widths of the first and second grid sheet portions 223 and 225 may be about 1 to 5 mm.

A plurality of mask cell regions CR11 to CR56 may be provided except for the region occupied by the border sheet portion 221 and the first and second grid sheet portions 223 and 225 in the planar sheet. The mask cell region CR refers to a region occupied by the border sheet portion 221, the first and second grid sheet portions 223 and 225 in the hollow region R of the frame portion 210, May mean an empty area, except for the < RTI ID = 0.0 >

The cell C of the mask 100 is associated with the mask cell region CR so that it can be used as a passage through which the pixels of the OLED are substantially deposited through the mask pattern P. [ As described above, one mask cell C corresponds to one display such as a smart phone. In one mask 100, mask patterns P constituting one cell C may be formed. Alternatively, although one mask 100 has a plurality of cells C and each cell C may correspond to a respective cell region CR of the frame 200, a clear alignment of the mask 100 It is necessary to avoid the large-area mask 100, and a small-area mask 100 having one cell C is preferable. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell region CR of the frame 200. [ In this case, it may be considered to correspond to the mask 100 having about a few number of the cells C for the clear alignment.

The frame 200 has a plurality of mask cell regions CR and each of the masks 100 can be bonded so that one mask cell C corresponds to the mask cell region CR. Each of the masks 100 may include a mask cell C having a plurality of mask patterns P and a dummy (corresponding to a portion of the mask film 110 excluding the cell C) around the mask cell C have. The dummy may include only the mask film 110 or may include a mask film 110 having a predetermined dummy pattern formed in a shape similar to the mask pattern P. [ The mask cell C corresponds to the mask cell region CR of the frame 200 and part or all of the dummy may be bonded to the frame 200 (mask cell sheet portion 220). As a result, the mask 100 and the frame 200 can have an integrated structure.

According to another embodiment of the present invention, the frame is not manufactured by adhering the mask cell sheet portion 220 to the rim frame portion 210, but the rim portion 210 (210) is formed in the hollow region R of the rim frame portion 210, (Corresponding to the grid sheet portions 223 and 225), which are integrated with the grid frame portions 223 and 225, may be used. This type of frame also includes at least one mask cell region CR, and the mask 100 can be made to correspond to the mask cell region CR so that a frame-integrated mask can be manufactured.

Hereinafter, a process for manufacturing a frame-integrated mask will be described.

First, the frame 200 described above with reference to FIGS. 4 and 5 can be provided. 6 is a schematic view showing a manufacturing process of the frame 200 according to an embodiment of the present invention.

Referring to FIG. 6 (a), a frame frame part 210 is provided. The frame part 210 may have a rectangular frame shape including the hollow area R.

Next, referring to FIG. 6 (b), a mask cell sheet portion 220 is manufactured. The mask cell sheet portion 220 is manufactured by preparing a flat sheet using rolling, electroplating or other film forming process, and then removing the mask cell region CR portion by laser scribing, etching, can do. In this specification, a mask cell region (CR: CR11 to CR56) of 6 X 5 is formed is described as an example. Five first grid sheet portions 223 and four second grid sheet portions 225 may exist.

Next, the mask cell sheet portion 220 may correspond to the frame portion 210 of the frame. All the sides of the mask cell sheet portion 220 are stretched to expose the mask cell sheet portion 220 in a flattened state and the frame sheet portion 221 to the frame frame portion 210 Can respond. The mask cell sheet portion 220 can be held and stretched by one point at several points (e.g., 1 to 3 points in FIG. 6 (b)). On the other hand, the mask cell sheet portion 220 may be stretched (F1, F2) along some lateral direction, not all sides.

Next, if the mask cell sheet portion 220 corresponds to the frame frame portion 210, the frame sheet portion 221 of the mask cell sheet portion 220 can be welded (W). It is preferable that all the sides are welded (W) so that the mask cell sheet portion 220 can be firmly adhered to the rim frame portion 220. The welding W should be performed as close as possible to the edge of the rim 210 so as to minimize the space between the rim 210 and the mask cell sheet 220 and improve the adhesion. The welded portion W may be formed in a line or a spot shape and may have the same material as the mask cell sheet portion 220 and may be integrally formed with the frame frame portion 210 and the mask cell sheet portion 220 As shown in FIG.

7 is a schematic view showing a manufacturing process of a frame according to another embodiment of the present invention. The embodiment of FIG. 6 first fabricated the mask cell sheet portion 220 with the mask cell region CR and adhered to the frame frame portion 210, but the embodiment of FIG. 7 differs from the embodiment of FIG. 210, a mask cell region CR portion is formed.

First, as shown in FIG. 6A, a frame frame part 210 including a hollow area R is provided.

Next, referring to FIG. 7A, a planar sheet (planar mask cell sheet portion 220 ') may correspond to the frame frame portion 210. FIG. The mask cell sheet portion 220 'is in a planar state in which the mask cell region CR is not yet formed. All the sides of the mask cell sheet portion 220 'may be stretched (F1 to F4) so that the mask cell sheet portion 220' may correspond to the frame frame portion 210 in a flat state. It is possible to hold the mask cell sheet portion 220 'at one point and hold the mask cell sheet portion 220' at several points (e.g., 1 to 3 points in FIG. 7A). On the other hand, the mask cell sheet portion 220 'may be stretched (F1, F2) along some lateral direction, not all sides.

Next, if the mask cell sheet portion 220 'corresponds to the rim frame portion 210, the edge portion of the mask cell sheet portion 220' can be welded (W) to be bonded. It is preferable to weld (W) all the sides so that the mask cell sheet portion 220 'can be firmly adhered to the frame portion 220. The weld W must be performed as close as possible to the edge of the rim 210 to maximally reduce the space between the rim 210 and the mask cell sheet 220 'and improve the adhesion. The welded portion W may be formed in the form of a line or a spot and may be formed of the same material as the mask cell sheet portion 220 ' As a whole.

Next, referring to FIG. 7B, a mask cell region CR is formed in a planar sheet (planar mask cell sheet portion 220 '). The mask cell region CR can be formed by removing the sheet of the mask cell region CR through laser scribing, etching, or the like. In this specification, a mask cell region (CR: CR11 to CR56) of 6 X 5 is formed is described as an example. When the mask cell region CR is formed, the portion welded to the rim frame portion 210 becomes the border sheet portion 221, and the five first grid sheet portions 223 and the four second grid portions 221, A mask cell sheet portion 220 having a sheet portion 225 may be constructed.

8 is a schematic view showing a mask for forming a conventional high-resolution OLED.

In order to realize a high-resolution OLED, the size of the pattern is being reduced, and the thickness of the mask metal film used needs to be reduced. As shown in FIG. 8A, in order to implement a high-resolution OLED pixel 6, the pixel interval and the pixel size should be reduced in the mask 10 '(PD -> PD'). Further, it is necessary to form the pattern of the mask 10 'obliquely (14) in order to prevent the non-uniform deposition of the OLED pixels 6 by the shadow effect. However, in the process of forming the pattern sloping 14 on the thick mask 10 'with the thickness T1 of about 30 to 50 μm, the patterning 13 corresponding to the fine pixel pitch PD' It is difficult to perform the process, which causes the yield in the processing step to deteriorate. In other words, a thin mask 10 'should be used in order to form the pattern 14 sloping with a fine pixel interval PD'.

Particularly, in order to achieve high resolution at the UHD level, a thin mask 10 'having a thickness (T2) of about 20 μm or less should be used as shown in FIG. 8 (b) for fine patterning. In addition, for a super high resolution of UHD or higher, the use of a thin mask 10 'having a thickness (T2) of about 10 mu m can be considered.

9 is a schematic diagram showing a mask 100 according to an embodiment of the present invention.

The mask 100 may include a mask cell C having a plurality of mask patterns P and a dummy DM around the mask cell C. [ It has been described that the mask 100 can be manufactured from the metal sheet formed by the rolling process, electroplating or the like, and one cell C can be formed in the mask 100. The dummy DM corresponds to the portion of the mask film 110 (mask metal film 110) excluding the cell C and includes only the mask film 110 or a predetermined dummy shape similar to the mask pattern P And a mask film 110 having a pattern formed thereon. The dummy DM can be adhered to the frame 200 (mask cell sheet portion 220) with a part or the whole of the dummy DM corresponding to the rim of the mask 100. [

The width of the mask pattern P may be less than 40 占 퐉, and the thickness of the mask 100 may be about 5 to 20 占 퐉. Since the frame 200 includes a plurality of mask cell regions CR11 to CR56, the mask 100 having the mask cells C: C11 to C56 corresponding to the respective mask cell regions CR11 to CR56 May also be provided.

Since the one surface 101 of the mask 100 is a surface to be bonded to the frame 200, it is preferable that the surface is flat. The surface 101 may be planarized and mirror-finished by a planarization process to be described later. The other surface 102 of the mask 100 can face one surface of the template 50 to be described later.

Hereinafter, the mask metal film 110 'is manufactured, the mask metal 100 is supported on the template 50 to manufacture the mask 100, the template 50 on which the mask 100 is supported is loaded on the frame 200 A series of steps for manufacturing a frame-integrated mask by adhering the mask 100 to the frame 200 will be described.

10 is a schematic view showing a process of manufacturing a mask metal film in a rolling manner according to an embodiment of the present invention. 11 is a schematic view showing a process of fabricating a mask metal film according to another embodiment of the present invention by an electroforming method.

First, the mask metal film 110 can be prepared. As an embodiment, the mask metal film 110 can be prepared by a rolling method.

Referring to FIG. 10 (a), the metal sheet formed by the rolling process can be used as the mask metal film 110 '. The metal sheet produced by the rolling process may have a thickness of several tens to several hundreds of micrometers in the manufacturing process. 8, for the high resolution of the UHD level, a thin mask metal film 110 having a thickness of about 20 μm or less can be used for fine patterning, and for ultra high resolution over UHD, a thickness of about 10 μm Lt; RTI ID = 0.0 > 110 < / RTI > However, since the mask metal film 110 'formed by the rolling process has a thickness of about 25 to 500 μm, it is necessary to make the thickness thinner.

Therefore, a process of planarizing (PS) one surface of the mask metal film 110 'can be further performed. Here, the planarization (PS) means that one surface (upper surface) of the mask metal film 110 'is mirror-finished while a part of the upper portion of the mask metal film 110' is partially removed to reduce the thickness thinly. The planarization (PS) can be performed by a CMP (Chemical Mechanical Polishing) method, and a known CMP method can be used without limitation. In addition, the thickness of the mask metal film 110 'can be reduced by a chemical wet etching method or a dry etching method. In addition, a planarization process for thinning the thickness of the mask metal film 110 'can be used without limitation.

In the process of performing the planarization (PS), for example, in the CMP process, the surface roughness R _a of the upper surface of the mask metal film 110 'can be controlled. Preferably, a mirror surface with a further reduced surface roughness may proceed. Alternatively, another example, may be after performing a chemical wet etch or dry etch planarization process (PS) advances to, in addition to the polishing process, such as a separate CMP process after reducing the surface roughness (R _a).

In this way, the thickness of the mask metal film 110 'can be reduced to about 50 탆 or less. Accordingly, the thickness of the mask metal layer 110 is preferably about 2 to 50 mu m, and more preferably about 5 to 20 mu m. However, the present invention is not limited thereto.

Referring to FIG. 10B, similarly to FIG. 10A, the mask metal film 110 can be manufactured by reducing the thickness of the mask metal film 110 'produced by the rolling process. However, the thickness of the mask metal film 110 'may be reduced by performing a planarization (PS) process in a state in which the mask metal film 110' is adhered to the template 50 to be described later via the temporary adhering portion 55.

As another embodiment, the mask metal film 110 can be prepared by electroplating.

Referring to Fig. 11 (a), a conductive base material 21 is prepared. In order to perform electroforming, the substrate 21 of the base plate may be made of a conductive material. The base plate can be used as a cathode electrode in electroplating.

In the case of a metal, metal oxide may be generated on the surface, impurities may be introduced in the course of metal production, and in the case of a polycrystalline silicon substrate, an inclusion or a grain boundary may exist. In the case of the substrate, there is a high possibility that impurities are contained, and strength. Acid resistance may be weak. An element that hinders uniform formation of an electric field on the surface of a base (or cathode), such as metal oxide, impurities, inclusions, crystal grains, and the like, is referred to as "Defect ". Due to the defect, a uniform electric field is not applied to the negative electrode of the above-described material, so that a part of the plating film 110 (or the mask metal film 110) may be formed non-uniformly.

Unevenness of the plated film and the plated film pattern [mask pattern (P)] in the realization of UHD class or higher ultra high image quality may adversely affect pixel formation. For example, in the case of QHD image quality, the pixel size is about 30 ~ 50 ㎛ with 500 ~ 600 PPI (pixel per inch). In case of 4K UHD and 8K UHD high image quality, ~ 860 PPI, ~ 1600 PPI And so on. A microdisplay directly applied to a VR device or a microdisplay used in a VR device aims at an ultra-high picture quality of about 2,000 PPI or more and a pixel size of about 5 to 10 mu m. Since the pattern width of the FMM and the shadow mask applied thereto can be formed to a size of several to several tens of micrometers, preferably less than 30 micrometers, even a defect of a few micrometers in size may be a size to be. Further, in order to remove defects in the cathode body made of the above-mentioned material, an additional process for removing metal oxide, impurities and the like may be performed. In this process, another defect such as etching of the cathode body material may be caused have.

Therefore, the present invention can use a single-crystal base plate (or a negative electrode). Particularly, a single crystal silicon material is preferable. High concentration doping of 10 ¹⁹ / cm ³ or more can be performed on a base plate made of a single crystal silicon material so as to have conductivity. The doping may be performed on the whole of the base plate, or may be performed only on the surface portion of the base plate.

On the other hand, examples of the single crystal material include a metal such as Ti, Cu, Ag, a carbon-based material such as a semiconductor such as GaN, SiC, GaAs, GaP, AlN, InN, InP or Ge, graphite or graphene _{, CH 3 NH 3 PbCl 3,} CH 3 NH 3 PbBr 3, CH 3 NH 3 PbI 3, SrTiO 3 , etc. page containing the perovskite (perovskite) superconductor single crystalline ceramic, aircraft single crystal second heat-resistant alloy for components for such structures Etc. may be used. In the case of metal and carbon materials, it is basically a conductive material. In the case of a semiconductor material, high concentration doping of 10 ¹⁹ / cm ³ or more can be performed so as to have conductivity. In the case of other materials, doping may be performed or oxygen vacancy may be formed to form conductivity. The doping may be performed on the whole of the base plate, or may be performed only on the surface portion of the base plate.

Since there is no defect in the case of a single crystal material, there is an advantage that a uniform plating film 110 due to the formation of a uniform electric field on the entire surface at the time of electroplating can be produced. Frame-integrated masks 100 and 200 manufactured through a uniform plating film can further improve the image quality level of OLED pixels. Further, since there is no need to carry out an additional process for removing and eliminating defects, there is an advantage that the process cost is reduced and the productivity is improved.

Referring again to FIG. 10 (a), next, the conductive substrate 21 is used as a base plate (cathode body), and an anode body (not shown) The plating film 110 (or the mask metal film 110) can be formed by electroplating. The plated film 110 may be formed on the exposed upper surface and the side of the conductive base material 21 which is opposed to the anode body and to which an electric field can act. The plating film 110 may be formed on a part of the lower surface of the conductive base material 21 in addition to the side surface of the conductive base material 21. [

Next, the edge of the plated film 110 is cut with a laser (D), a photoresist layer is formed on the plated film 110, and only the portion of the exposed plated film 110 is etched (D) . As a result, the plating film 110 can be separated from the conductive base material 21 as shown in Fig. 10 (b).

On the other hand, before the plating film 110 is separated from the conductive base material 21, a heat treatment (H) may be performed. The present invention is a method for removing the plating film (or the plating film) from the conductive substrate 21 (or the mother board, the cathode body) in order to reduce the thermal expansion coefficient of the mask 100 and prevent deformation of the mask 100 and the mask pattern P by heat 110) before the heat treatment (H) is performed. The heat treatment may be performed at a temperature of 300 ° C to 800 ° C.

In general, the invar sheet produced by electroplating is higher in thermal expansion coefficient than the invar sheet produced by rolling. Thus, the thermal expansion coefficient can be lowered by performing the heat treatment on the thinned plate. In this heat treatment process, the thinned plate may be peeled and deformed. This is a phenomenon that is caused by heat treatment of the invar sheet only or heat treatment of the invar sheet temporarily bonded to only the upper surface of the conductive substrate 21. However, since the plating film 110 is formed not only on the upper surface of the conductive substrate 21 but also on the side surface and a part of the lower surface of the conductive substrate 21, peeling and deformation do not occur even if the heat treatment H is performed. In other words, since the heat treatment is performed in a state where the conductive base material 21 and the plated film 110 are closely adhered to each other, there is an advantage that the heat treatment can be stably prevented from peeling and deformation due to the heat treatment.

The thickness of the mask metal film 110 produced by the electroplating process may be thinner than the rolling process. Accordingly, the planarization (PS) step for reducing the thickness may be omitted. However, since the etching characteristics may vary depending on the composition of the surface layer of the plating mask metal film 110 'and the crystal structure / microstructure, It is necessary to control the surface characteristics and the thickness through the above-mentioned method.

12 to 13 are schematic views showing a process of attaching a mask metal film 110 on a template 50 according to an embodiment of the present invention and forming a mask 100 to manufacture a mask support template.

Referring to FIG. 12 (a), a template 50 may be provided. The template 50 is a medium on which the mask 100 can be attached and supported on one surface. It is preferable that one surface of the template 50 is flat so as to support and move the flat mask 100. The center portion 50a may correspond to the mask cell C of the mask metal film 110 and the rim portion 50b may correspond to the dummy DM of the mask metal film 110. [ The size of the template 50 may be a flat plate shape having a larger area than the mask metal film 110 so that the mask metal film 110 can be entirely supported.

The template 50 is preferably made of a transparent material so that vision and the like can be easily observed while the mask 100 is aligned and adhered to the frame 200. In the case of a transparent material, the laser may penetrate. Materials such as glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), borosilicate glass, and zirconia can be used as the transparent material. For example, the template 50 may be made of BOROFLOAT ^® 33 material having excellent heat resistance, chemical durability, mechanical strength, transparency and the like among the borosilicate glass. In addition, BOROFLOAT ^® 33 has a thermal expansion coefficient of about 3.3 and has a small thermal expansion coefficient difference from the invasive metal film 110, which facilitates the control of the mask metal film 110.

On the other hand, the template 50 is formed so that one surface in contact with the mask metal film 110 is a mirror surface (not shown) so that an air gap does not occur between the interface with the mask metal film 110 (or the mask 100) . In consideration of this, the surface roughness Ra of one surface of the template 50 may be 100 nm or less. In order to realize the template 50 having the surface roughness Ra of 100 nm or less, the template 50 can use a wafer. Since the wafer has a surface roughness (Ra) of about 10 nm, many products on the market and many surface treatment processes are known, the wafer 50 can be used as the template 50. Since the surface roughness Ra of the template 50 is in the nm scale, it is easy to generate the weld bead WB by the laser welding at a level with little or no air gap, which affects the alignment error of the mask pattern P I can not give.

The template 50 is provided with the laser passage hole 51 in the template 50 so that the laser L irradiated from the upper portion of the template 50 can reach the welded portion of the mask 100 . The laser passage hole 51 may be formed in the template 50 so as to correspond to the position and the number of the welded portions. Since a plurality of welding portions are arranged along a predetermined interval in the rim or the dummy DM portion of the mask 100, a plurality of the laser passing holes 51 may be formed along the predetermined interval corresponding to the laser passing holes 51. [ For example, since a plurality of welding portions are arranged at predetermined intervals on both sides (left / right side) of the mask 100 in the dummy DM, the laser passage holes 51 are formed in both sides (left / right) And may be formed in a plurality of predetermined intervals.

The laser passage hole 51 does not have to correspond to the position and the number of the welded portions. For example, it is also possible to perform the welding by irradiating the laser L only to a part of the laser passage holes 51. [ Some of the laser passage holes 51 not corresponding to the welded portion may be used in place of the alignment marks when the mask 100 and the template 50 are aligned. If the material of the template 50 is transparent to the laser light L, the laser passage hole 51 may not be formed.

A temporary adhering portion 55 may be formed on one side of the template 50. The temporary adhering portion 55 is temporarily adhered to one surface of the template 50 until the mask 100 (or the mask metal film 110) is temporarily adhered to the template 50 until the mask 100 is adhered to the frame 200 As shown in Fig.

As the temporary adhering portion 55, an adhesive or an adhesive sheet which can be separated as heat is applied, an adhesive or an adhesive sheet which can be separated by UV irradiation can be used.

For example, the temporary adhering portion 55 may use liquid wax. The liquid wax may be the same as the wax used in the polishing step of the semiconductor wafer or the like, and the type thereof is not particularly limited. Liquid waxes can contain materials and solvents such as acrylic, vinyl acetate, nylon, and various polymers as resin components for controlling adhesion force, impact resistance, etc., mainly on holding force. For example, SKYLIQUID ABR-4016, which contains acrylonitrile butadiene rubber (ABR) as a resin component and n-propyl alcohol as a solvent component, may be used as the temporary adhering portion 55. The liquid wax can be formed on the temporary adhering portion 55 using spin coating.

The temporary adhering portion 55 which is a liquid wax has a low viscosity at a temperature higher than 85 ° C to 100 ° C and a viscosity at a temperature lower than 85 ° C and can be solidified like a solid portion to form a mask metal film 110 ' ) Can be fixedly bonded.

Next, referring to FIG. 12 (b), the mask metal film 110 'may be adhered onto the template 50. After the liquid wax is heated to 85 DEG C or higher and the mask metal film 110 'is brought into contact with the template 50, the mask metal film 110' and the template 50 can be passed between the rollers to perform the adhesion .

According to one embodiment, baking may be performed on the template 50 at about 120 DEG C for 60 seconds to vaporize the solvent of the temporary adhering portion 55 and immediately proceed with the mask metal film lamination process . The lamination is performed by loading the mask metal film 110 'on the template 50 formed on one side of the temporary adhering portion 55 and passing it between an upper roll of about 100 캜 and a lower roll of about 0 캜 . As a result, the mask metal film 110 'can be contacted via the temporary adhering portion 55 on the template 50.

14 is an enlarged sectional schematic view showing a temporary adhering portion 55 according to an embodiment of the present invention. As another example, the temporary adhering portion 55 may use a thermal release tape. A core film 56 such as a PET film is disposed in the center of the heat peeling tape and thermal release adhesives 57a and 57b capable of releasing heat are disposed on both sides of the core film 56. Adhesive layers 57a And 57b may be disposed on the outer sides of the release films / release films 58a and 58b. Here, the adhesive layers 57a and 57b disposed on both sides of the core film 56 may have different temperatures at which they are peeled from each other.

The lower surface (second adhesive layer 57b) of the heat peeling tape is adhered to the template 50, and the upper surface of the heat peeling tape 58a (58b) The surface (first adhesive layer 57a) may be adhered to the mask metal film 110 '. The first adhesive layer 57a and the second adhesive layer 57b differ in the temperature at which they are peeled from each other. Therefore, when the template 50 is detached from the mask 100 in FIG. 17, The mask 100 can be separated from the template 50 and the temporary adhering portion 55 by applying the heat to be peeled off.

Next, referring to FIG. 12 (b), one side of the mask metal film 110 'may be planarized (PS). As described above with reference to FIG. 10, the mask metal film 110 'manufactured by the rolling process can reduce the thickness (110' -> 110) by a planarization (PS) process. Also, the mask metal film 110 manufactured by the electroplating process may be subjected to a planarizing (PS) process for controlling the surface characteristics and the thickness.

Accordingly, as shown in FIG. 12C, as the thickness of the mask metal film 110 'decreases (110' -> 110), the thickness of the mask metal film 110 becomes about 5 to 20 μm .

Next, referring to FIG. 13D, a patterned insulating portion 25 may be formed on the mask metal film 110. The insulating portion 25 may be formed of a photoresist material by a printing method or the like.

Etching of the mask metal film 110 can then be performed. Dry etching, wet etching, and the like can be used without limitation, and a portion of the mask metal film 110 exposed in the empty space 26 between the insulating portions 25 as a result of the etching can be etched. An etched portion of the mask metal film 110 constitutes a mask pattern P and a mask 100 in which a plurality of mask patterns P are formed can be manufactured.

Next, referring to FIG. 13E, the insulating portion 25 is removed, and the manufacture of the template 50 supporting the mask 100 can be completed.

Since the frame 200 includes a plurality of mask cell regions CR11 to CR56, the mask 100 having the mask cells C: C11 to C56 corresponding to the respective mask cell regions CR11 to CR56 May also be provided. Further, a plurality of templates 50 for supporting each of the plurality of masks 100 may be provided.

15 is a schematic view illustrating a process of loading a mask support template onto a frame according to an embodiment of the present invention.

Referring to FIG. 15, the template 50 may be transferred by a vacuum chuck 90. The opposite surface of the template 50 surface to which the mask 100 is adhered can be adsorbed and transferred to the vacuum chuck 90. The vacuum chuck 90 may be connected to a moving means (not shown) which is moved in the x, y, z, and θ axes. In addition, the vacuum chuck 90 can be connected to flip means (not shown) which can adsorb and flip the template 50. 15 (b), even in the process of transferring the template 50 onto the frame 200 after the vacuum chuck 90 sucks and flips the template 50, Adhesion and alignment are not affected.

16 is a schematic view showing a state in which a template is loaded on a frame to correspond to a cell region of a frame according to an embodiment of the present invention. 16 illustrates a case in which one mask 100 is attached to and bonded to the cell region CR but a plurality of masks 100 are simultaneously associated with all of the cell regions CR so that the mask 100 is sandwiched between the frames 200 ) May be performed. In this case, a plurality of templates 50 for supporting each of the plurality of masks 100 may be provided.

Next, referring to FIG. 16, the mask 100 may correspond to one mask cell region CR of the frame 200. FIG. The mask 100 can be made to correspond to the mask cell region CR by loading the template 50 onto the frame 200 (or the mask cell sheet portion 220). It is possible to check whether the mask 100 corresponds to the mask cell region CR through the microscope while controlling the position of the template 50 / vacuum chuck 90. [ Since the template 50 presses the mask 100, the mask 100 and the frame 200 can be brought into close contact with each other.

Meanwhile, the lower support 70 may be further disposed under the frame 200. The lower support 70 may have a size enough to fit into the hollow region R of the frame rim 210 and may have a flat plate shape. In addition, a predetermined support groove (not shown) corresponding to the shape of the mask cell sheet portion 220 may be formed on the upper surface of the lower support 70. In this case, the frame sheet portion 221 and the first and second grid sheet portions 223 and 225 are fitted into the support groove, so that the mask cell sheet portion 220 can be fixed more securely.

The lower support 70 can press the opposite surface of the mask cell region CR to which the mask 100 contacts. That is, the lower support 70 supports the mask cell sheet portion 220 in the upward direction, thereby preventing the mask cell sheet portion 220 from sagging in the downward direction during the adhesion of the mask 100. At the same time, since the edge of the mask 100 and the frame 200 (or the mask cell sheet portion 220) are pressed in the direction in which the lower support 70 and the template 50 are opposite to each other, It is possible to maintain the alignment state of the light emitting device without being disturbed.

As described above, by merely attaching the mask 100 on the template 50 and loading the template 50 onto the frame 200, the mask 100 can be mounted on the frame 200 corresponding to the mask cell region CR of the frame 200 The mask 100 may not be subjected to any tensile force in this process.

Then, the mask 100 can be adhered to the frame 200 by laser irradiation by irradiating the mask 100 with the laser L. Weld beads WB are generated in the welded portion of the laser welded mask and weld beads WB can be integrally connected with the same material as the mask 100 /

17 is a schematic view showing a process of separating the mask 100 and the template 50 after adhering the mask 100 to the frame 200 according to an embodiment of the present invention.

Referring to FIG. 17, after the mask 100 is bonded to the frame 200, the mask 100 and the template 50 may be debonded. Separation between the mask 100 and the template 50 can be performed through at least one of heat application (ET), chemical application (CM), ultrasonic application (US), and UV application (UV) have. Since the mask 100 remains attached to the frame 200, only the template 50 can be lifted. For example, applying heat (ET) at a temperature higher than 85 ° C to 100 ° C lowers the viscosity of the temporary adhering portion 55, weakens the adhesion between the mask 100 and the template 50, And the template 50 can be separated from each other. As another example, by immersing (CM) the temporary adhering portion 55 in a chemical substance such as IPA, acetone, or ethanol, the mask 100 and the template 50 can be separated by dissolving or removing the temporary adhering portion 55 have. As another example, applying ultrasound (US) or applying UV (UV) weakens the adhesion between the mask 100 and the template 50, so that the mask 100 and the template 50 can be separated.

In other words, since the temporary adhering portion 55 that mediates adhesion between the mask 100 and the template 50 is a temporary bonding & debonding adhesive, various debonding methods can be used.

As an example, a solvent debonding method according to a chemical treatment (CM) can be used. The temporary bonding portion 55 is melted by the penetration of the solvent, so that the solder bonding can be performed. At this time, since the pattern P is formed on the mask 100, the solvent can be penetrated through the interface between the mask pattern P and the mask 100 and the template 50. Solvent debonding is advantageous in that it is relatively economical compared to other debonding methods because it can be debonded at room temperature and does not require a complex designed debonding facility.

As another example, a heat debonding method according to heat application (ET) can be used. De-bonding may be performed in the vertical direction or in the left-right direction if the adhesive force between the mask 100 and the template 50 is reduced by inducing the dissolution of the temporary adhering portion 55 using heat at a high temperature.

As another example, a peelable adhesive debonding method according to heat application (ET), UV application (UV), or the like can be used. Bonding can be performed by the peeling adhesive debonding method in the case where the temporary bonding portion 55 is a heat peeling tape and that this method does not require high temperature heat treatment and expensive heat treatment equipment like the thermal debonding method, There is a relatively simple advantage.

As another example, a room temperature debonding method according to chemical treatment (CM), ultrasonic irradiation (US), UV application (UV), or the like can be used. When the mask 100 or a portion (center portion) of the template 50 is subjected to a non-sticky treatment, only the rim portion can be adhered by the temporary adhering portion 55. At the time of the debonding, the solvent penetrates the rim portion, and the bonding is performed by dissolving the adhering bonding portion 55. This method is advantageous in that, except for the edge region of the mask 100 and the template 50, during the bonding and debonding, there is no direct loss or defect caused by residue of adhesive material during debonding . Unlike the thermal debonding method, there is an advantage that the process cost can be relatively reduced since a high-temperature heat treatment process is not required in debonding.

18 is a schematic view showing a state in which the mask 100 is adhered to the frame 200 according to an embodiment of the present invention.

Referring to FIG. 18, one mask 100 may be adhered onto one cell region CR of the frame 200

The mask cell sheet portion 220 of the frame 200 has a small thickness so that when the mask 100 is adhered to the mask cell sheet portion 220 with a tensile force applied thereto, It may act on the cell sheet portion 220 and the mask cell region CR to deform them. Therefore, it is necessary to perform adhesion of the mask 100 to the mask cell sheet portion 220 without applying a tensile force to the mask 100. The present invention is characterized in that the mask 100 is attached to the template 50 and the mask 100 is mounted on the frame 200 to correspond to the mask cell region CR of the frame 200 The mask 100 may not be subjected to any tensile force in this process. Thus, the tensile force applied to the mask 100 oppositely acts on the frame 200 as a tension to prevent the frame 200 (or the mask cell sheet portion 220) from deforming.

The conventional mask 10 of FIG. 1 has a long length since it includes six cells (C1 to C6), whereas the mask 100 of the present invention has a short length including one cell (C) The degree to which the pixel position accuracy (PPA) is distorted can be reduced. For example, assuming that the length of the mask 10 including a plurality of cells (C1 to C6, ...) is 1 m and a PPA error of 10 m is generated in all 1 m, Can be 1 / n of the upper error range according to the reduction of the relative length (corresponding to the reduction in the number of cells (C)). For example, if the length of the mask 100 of the present invention is 100 mm, the length of the conventional mask 10 is reduced from 1 m to 1/10, so that a PPA error of 1 탆 is generated in the entire length of 100 mm , The alignment error is remarkably reduced.

On the other hand, if the mask 100 has a plurality of cells C, and each cell C corresponds to each cell region CR of the frame 200, even if the alignment error is minimized, The mask 100 may correspond to a plurality of mask cell regions CR of the frame 200. Alternatively, the mask 100 having a plurality of cells C may correspond to one mask cell region CR. Also in this case, it is preferable that the mask 100 has as few cells C as possible in consideration of the process time and productivity in the alignment.

In the case of the present invention, since only one cell C of the mask 100 needs to be matched and the alignment state is checked, it is necessary to simultaneously match a plurality of cells (C: C1 to C6) The manufacturing time can be remarkably reduced as compared with the conventional method (see Fig. 2).

That is, the method for manufacturing a frame-integrated mask of the present invention is characterized in that each of the cells C11 to C16 included in six masks 100 is associated with one cell region CR11 to CR16, It is possible to shorten the time much more than the conventional method in which six cells (C1 to C6) are simultaneously associated and all the alignment states of the six cells (C1 to C6) need to be simultaneously checked.

The method of manufacturing a mask with a frame according to the present invention is characterized in that the product yield in thirty steps of aligning and aligning 30 masks (100) to 30 cell areas (CR11 to CR56) (See FIG. 2 (a)) including the first to sixth masks 10 to 16 (see FIG. The conventional method of aligning six cells (C1 to C6) in the area corresponding to six cells C at a time is a much more cumbersome and difficult task, resulting in a lower product yield.

On the other hand, when the mask metal film 110 is adhered to the template 50 by the lamination process, a temperature of about 100 캜 can be applied to the mask metal film 110, as described above with reference to FIG. 12 (b) . Thereby, the mask metal film 110 can be adhered to the template 50 with some tensile tension applied thereto. Thereafter, when the mask 100 is adhered to the frame 200, and the template 50 is separated from the mask 100, the mask 100 may contract slightly.

When the templates 50 and the masks 100 are separated after each of the masks 100 are adhered onto the corresponding mask cell region CR, the plurality of masks 100 are tensed The force is canceled and the mask cell sheet portion 220 is not deformed. For example, the first grid sheet portion 223 between the mask 100 attached to the CR11 cell region and the mask 100 attached to the CR12 cell region is located on the right side of the mask 100 attached to the CR11 cell region The tension acting on the CR12 cell region and the tension acting on the left side of the mask 100 attached to the CR12 cell region can be canceled. Thus, there is an advantage that distortion is minimized in the frame 200 (or the mask cell sheet portion 220) by the tension and the misalignment of the mask 100 (or the mask pattern P) can be minimized.

19 is a schematic view showing an OLED pixel deposition apparatus 1000 using a frame-integrated mask 100, 200 according to an embodiment of the present invention.

19, the OLED pixel deposition apparatus 1000 includes a magnet plate 300 in which a magnet 310 is accommodated and a cooling water line 350 is disposed, and an organic material source 600 (Not shown).

A target substrate 900 such as a glass on which the organic material source 600 is deposited may be interposed between the magnet plate 300 and the source evaporator 500. Integrated masks 100, 200 [or FMM] for depositing the organic source 600 on a pixel-by-pixel basis may be closely attached to the target substrate 900 or may be disposed in close proximity to each other. The magnet 310 generates a magnetic field and can be brought into close contact with the target substrate 900 by a magnetic field.

The deposition source supply part 500 can supply the organic material source 600 through the left and right paths and the organic material sources 600 supplied from the deposition source supply part 500 can supply the pattern P And may be deposited on one side of the target substrate 900. The deposited organic material source 600 that has passed through the pattern P of the frame-integrated mask 100, 200 can act as the pixel 700 of the OLED.

The patterns of the frame-integrated masks 100 and 200 may be formed to be inclined S (or formed into a tapered shape S) in order to prevent uneven deposition of the pixel 700 by a shadow effect . Organic materials 600 passing through the pattern in a diagonal direction along the sloped surface can also contribute to the formation of the pixel 700, so that the pixel 700 can be uniformly deposited in thickness as a whole.

Since the mask 100 is adhered and fixed to the frame 200 at a first temperature higher than the pixel deposition process temperature, even if the mask 100 is raised to the process temperature for the pixel deposition, there is almost no influence on the position of the mask pattern P, The PPA between the mask 100 and the mask 100 adjacent thereto may be kept not to exceed 3 mu m.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken in conjunction with the present invention. Variations and changes are possible. Such variations and modifications are to be considered as falling within the scope of the invention and the appended claims.

50: template
51: laser passing hole
55: Temporary adhesive portion
70: Lower support
100: mask
110: mask film
200: frame
210:
220: mask cell sheet part
221:
223: first grid sheet portion
225: second grid sheet portion
1000: OLED pixel deposition apparatus
C: cell, mask cell
CM: Chemical treatment
CR: mask cell area
DM: Dummy, Mask Pile
ET: with heat
L: Laser
R: hollow region of the frame portion
P: mask pattern
US: with ultrasonic
UV: with UV
W: Welding
WB: Weld bead

Claims (44)

A method of manufacturing a template in which a mask for forming an OLED pixel is supported to correspond to a frame,
(a) providing a mask metal film;
(b) adhering a mask metal film on a template on which a temporary adhering portion is formed; And
(c) forming a mask pattern on the mask metal film to manufacture a mask
Lt; / RTI >
The mask includes a mask cell having a plurality of mask patterns formed therein, and a dummy around the mask cell,
And a laser passage hole is formed in a portion of the template corresponding to the welded portion that is at least part of the dummy region of the mask. The method according to claim 1,
Wherein the mask metal film is produced by rolling or electroforming. The method according to claim 1,
Between the step (b) and the step (c)
Further comprising reducing the thickness of the mask metal film adhered to the template. The method of claim 3,
Wherein the thickness reduction of the mask metal film is performed by any one of CMP (Chemical Mechanical Polishing), chemical wet etching, and dry etching. The method of claim 3,
Wherein after the step of reducing the thickness of the mask metal film, the thickness of the mask metal film is 5 占 퐉 to 20 占 퐉. 3. The method of claim 2,
When the mask metal film is formed by electroplating, the step (a)
(a1) forming a mask metal film on at least one side of the conductive single crystal substrate; And
(a2) separating the mask metal film from the conductive single crystal substrate
≪ / RTI > The method according to claim 6,
further comprising the step of heat-treating the mask metal film between the step (a1) and the step (a2). The method according to claim 1,
Wherein the temporary adhering portion is an adhesive or an adhesive sheet separable by applying heat, and an adhesive or an adhesive sheet separable by UV irradiation. 9. The method of claim 8,
Wherein the temporary adhering portion is a liquid wax or a thermal release tape. 10. The method of claim 9,
Wherein the liquid wax firmly adheres the template to the mask metal film at a temperature lower than < RTI ID = 0.0 > 85 C. < / RTI > 11. The method of claim 10,
in the step (b), the liquid wax is heated to 85 DEG C or higher and the mask metal film is brought into contact with the template, and then the mask metal film and the template are passed between the rollers to perform the adhesion. The method according to claim 1,
(c)
(c1) forming a patterned insulating portion on the mask metal film;
(c2) etching a portion of the exposed mask metal film between the insulating portions to form a mask pattern; And
(c3) removing the insulating portion
≪ / RTI > The method according to claim 1,
Wherein the template is a transparent material. 14. The method of claim 13,
The template may comprise a material selected from the group consisting of glass, silica, heat resistant glass, quartz, alumina (Al ₂ O ₃ ), borosilicate glass, zirconia, A method of manufacturing a template. As a template for supporting a mask for forming an OLED pixel and corresponding to a frame,
template;
A temporary adhering portion formed on the template; And
A mask which is adhered to the template via the temporary adhering portion and has the mask pattern formed thereon
Lt; / RTI >
The mask includes a mask cell having a plurality of mask patterns formed therein, and a dummy around the mask cell,
And a laser passage hole is formed in a portion of the template corresponding to the welded portion that is at least part of the dummy region of the mask. 16. The method of claim 15,
And the thickness of the mask metal film is 5 占 퐉 to 20 占 퐉. 16. The method of claim 15,
Wherein the temporary adhering portion is an adhesive or an adhesive sheet separable by applying heat, an adhesive or an adhesive sheet separable by UV irradiation, and a mask supporting template. 18. The method of claim 17,
Wherein the temporary adhering portion is a liquid wax or a thermal release tape. delete 16. The method of claim 15,
The template is a transparent material, a mask support template. 21. The method of claim 20,
The template may comprise a material selected from the group consisting of glass, silica, heat resistant glass, quartz, alumina (Al ₂ O ₃ ), borosilicate glass, zirconia, template. delete 16. The method of claim 15,
Wherein the mask comprises a metal sheet produced by a rolling process or an electroforming process. A method for manufacturing a frame-integrated mask in which at least one mask and a frame for supporting the mask are integrally formed,
(a) providing a mask metal film;
(b) adhering a mask metal film on a template on which a temporary adhering portion is formed;
(c) forming a mask pattern on the mask metal film to manufacture a mask;
(d) providing a frame having at least one mask cell region;
(e) loading a template on the frame to correspond to a mask cell region of the frame; And
(f) irradiating the laser welded portion of the mask to adhere the mask to the frame
Wherein the frame-integrated mask comprises a plurality of mask patterns. 25. The method of claim 24,
Wherein the mask metal film is produced by rolling or electroforming. 25. The method of claim 24,
(d)
(d1) providing a rim frame portion including a hollow region;
(d2) planar mask cell sheet portion to a rim frame portion; And
(d3) forming a plurality of mask cell regions in the mask cell sheet portion to manufacture a frame
Wherein the frame-integrated mask comprises a plurality of mask patterns. 25. The method of claim 24,
(d)
(d1) providing a rim frame portion including a hollow region; And
(d2) fabricating a frame by connecting a mask cell sheet portion having a plurality of mask cell regions to a frame portion of the frame
Wherein the frame-integrated mask comprises a plurality of mask patterns. 25. The method of claim 24,
Between the step (b) and the step (c)
Further comprising reducing the thickness of the mask metal film adhered to the template. 29. The method of claim 28,
Wherein the thickness of the mask metal film is reduced by any one of CMP (Chemical Mechanical Polishing), chemical wet etching, and dry etching. 29. The method of claim 28,
After the step of reducing the thickness of the mask metal film, the thickness of the mask metal film is 5 占 퐉 to 20 占 퐉. 26. The method of claim 25,
When the mask metal film is formed by electroplating, the step (a)
(a1) forming a mask metal film on at least one side of the conductive single crystal substrate; And
(a2) separating the mask metal film from the conductive single crystal substrate
Wherein the frame-integrated mask comprises a plurality of mask patterns. 25. The method of claim 24,
Wherein the temporary adhering portion is an adhesive or an adhesive sheet which can be separated as heat is applied, and an adhesive or an adhesive sheet which can be separated by UV irradiation. 25. The method of claim 24,
Wherein the temporary adhering portion is a liquid wax or a thermal release tape. 34. The method of claim 33,
Wherein the liquid wax fixes and bonds the mask metal film and the template at a temperature lower than < RTI ID = 0.0 > 85 C. < / RTI > 35. The method of claim 34,
in the step (b), the liquid wax is heated to 85 DEG C or higher, the mask metal film is brought into contact with the template, and then the mask metal film and the template are passed between the rollers to perform adhesion. 25. The method of claim 24,
(c)
(c1) forming a patterned insulating portion on the mask metal film;
(c2) etching a portion of the exposed mask metal film between the insulating portions to form a mask pattern; And
(c3) removing the insulating portion
Wherein the frame-integrated mask comprises a plurality of mask patterns. 25. The method of claim 24,
Wherein the template is a transparent material. 39. The method of claim 37,
The template may be a frame-integrated type, including a material selected from the group consisting of glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), borosilicate glass, and zirconia A method of manufacturing a mask. 25. The method of claim 24,
Wherein the laser irradiated from the upper portion of the template is irradiated to the welding portion of the mask through the laser passage hole. 25. The method of claim 24,
A welding bead is formed in a portion of a welded portion irradiated with a laser, and the weld bead mediates the mask and the frame to be integrally connected. 25. The method of claim 24,
(f), separating the mask and the template by performing at least one of heat application, chemical treatment, ultrasonic wave application, and UV application to the temporary adhering portion
Further comprising the steps of: 28. The method of claim 26 or 27,
In the mask cell sheet portion,
A border sheet portion; And
And at least one first grid sheet portion extending in the first direction and having both ends connected to the border sheet portion. 43. The method of claim 42,
Wherein the mask cell sheet portion further comprises at least one second grid sheet portion extending in a second direction perpendicular to the first direction and intersecting the first grid sheet portion and having both ends connected to the border sheet portion, ≪ / RTI > 25. The method of claim 24,
Wherein the mask and the frame are made of any one of invar, super invar, nickel, and nickel-cobalt.

Images