TWI810497B - Producing method of template for supporting mask and producing method of mask integrated frame - Google Patents

Producing method of template for supporting mask and producing method of mask integrated frame Download PDF

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TWI810497B
TWI810497B TW109139194A TW109139194A TWI810497B TW I810497 B TWI810497 B TW I810497B TW 109139194 A TW109139194 A TW 109139194A TW 109139194 A TW109139194 A TW 109139194A TW I810497 B TWI810497 B TW I810497B
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mask
template
frame
manufacturing
metal film
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TW202119672A (en
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李炳一
金奉辰
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南韓商奧魯姆材料股份有限公司
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04Coating on selected surface areas, e.g. using masks
    • C23C16/042Coating on selected surface areas, e.g. using masks using masks
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2051Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2059Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
    • G03F7/2063Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam for the production of exposure masks or reticles
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

本發明涉及掩模支撐模板的製造方法和框架一體型掩模的製造方法。根據本發明的掩模支撐模板的製造方法,該模板用於支撐OLED像素形成用掩模並將掩模對應到框架上,該方法包括:(a)將模板插入模板支撐部上形成的槽的步驟;(b)在模板和模板支撐部的至少一面上黏貼掩模金屬膜的步驟;以及(c)在掩模金屬膜上形成掩模圖案,並切除掩模金屬膜邊緣以製造與模板相同尺寸的掩模的步驟。The present invention relates to a method of manufacturing a mask supporting template and a method of manufacturing a frame-integrated mask. According to the manufacturing method of the mask supporting template of the present invention, the template is used to support the mask for OLED pixel formation and correspond the mask to the frame, the method includes: (a) inserting the template into the groove formed on the template supporting part Steps; (b) a step of sticking a mask metal film on at least one side of the template and the template support; and (c) forming a mask pattern on the mask metal film, and cutting off the edge of the mask metal film to make the same as the template Dimensions of the mask steps.

Description

掩模支撐模板的製造方法及框架一體型掩模的製造方法Manufacturing method of mask supporting template and manufacturing method of frame-integrated mask

發明領域field of invention

本發明涉及掩模支撐模板的製造方法及框架一體型掩模的製造方法。更具體地,涉及一種使掩模不發生變形且能夠穩定地得到支撐移動並能夠準確地對準各掩模的掩模支撐模板的製造方法及框架一體型掩模的製造方法。The present invention relates to a method of manufacturing a mask supporting template and a method of manufacturing a frame-integrated mask. More specifically, it relates to a method of manufacturing a mask supporting template capable of stably supporting movement without deforming a mask, and of accurately aligning each mask, and a method of manufacturing a frame-integrated mask.

發明背景Background of the invention

作為OLED(有機發光二極體)製造工藝中形成像素的技術,主要使用精細金屬掩模(Fine Metal Mask,FMM)方法,該方法將薄膜形式的金屬掩模(Shadow Mask,陰影掩模)緊貼於基板並且在所需位置上沉積有機物。As a technique for forming pixels in the OLED (Organic Light Emitting Diode) manufacturing process, a fine metal mask (Fine Metal Mask, FMM) method is mainly used. Attach to the substrate and deposit organics on desired locations.

在現有的OLED製造工藝中,將掩模製造成條狀、板狀等後,將掩模焊接固定到OLED像素沉積框架並使用。一個掩模上可以具備與一個顯示器對應的多個單元。另外,為了製造大面積OLED,可將多個掩模固定於OLED像素沉積框架,在固定於框架的過程中,拉伸各個掩模,以使其變得平坦。調節拉伸力以使掩模的整體部分變得平坦是非常困難的作業。特別是,為了使各個單元全部變得平坦,同時對準尺寸僅為數μm至數十μm的掩模圖案,需要微調施加到掩模各側的拉伸力並且即時確認對準狀態的高難度作業要求。In the existing OLED manufacturing process, after the mask is manufactured into strips, plates, etc., the mask is welded and fixed to the OLED pixel deposition frame and used. A plurality of cells corresponding to one display may be provided on one mask. In addition, in order to manufacture large-area OLEDs, multiple masks can be fixed to the OLED pixel deposition frame, and each mask is stretched to become flat during the process of fixing to the frame. Adjusting the stretching force to flatten the entire portion of the mask is a very difficult task. In particular, in order to make all the cells flat while aligning a mask pattern with a size of several μm to tens of μm, it is necessary to fine-tune the tension applied to each side of the mask and check the alignment state in real time. Require.

儘管如此,在將多個掩模固定於一個框架過程中,仍然存在掩模之間以及掩模單元之間對準不好的問題。另外,在將掩模焊接固定於框架的過程中,掩模膜的厚度過薄且面積大,因此存在掩模因荷重而下垂或者扭曲的問題;由於焊接過程中在焊接部分產生的皺紋、毛邊(burr)等,導致掩模單元的對準不准的問題等。However, in the process of fixing multiple masks to a frame, there is still a problem of poor alignment between masks and between mask units. In addition, in the process of welding and fixing the mask to the frame, the thickness of the mask film is too thin and the area is large, so there is a problem that the mask sags or twists due to the load; (burr), etc., causing the problem of misalignment of the mask unit, etc.

在超高畫質的OLED中,現有的QHD畫質為500-600PPI(pixel per inch,每英吋像素),像素的尺寸達到約30-50μm,而4KUHD、8KUHD高畫質具有比之更高的~860PPI,~1600PPI等的解析度。如此,考慮到超高畫質的OLED的像素尺寸,需要將各單元之間的對準誤差縮減為數μm左右,超出這一誤差將導致產品的不良,所以收率可能極低。因此,需要開發能夠防止掩模的下垂或者扭曲等變形並且使對準精確的技術,以及將掩模固定於框架的技術等。In ultra-high-quality OLEDs, the existing QHD picture quality is 500-600PPI (pixel per inch, pixel per inch), and the pixel size reaches about 30-50μm, while 4KUHD and 8KUHD high-quality images have higher than that. Resolutions of ~860PPI, ~1600PPI, etc. In this way, considering the pixel size of ultra-high-quality OLEDs, it is necessary to reduce the alignment error between each unit to about a few μm. Exceeding this error will lead to defective products, so the yield may be extremely low. Therefore, it is necessary to develop a technology capable of preventing deformation such as sagging or twisting of the mask and accurately aligning the mask, and a technology of fixing the mask to the frame.

發明概要Summary of the invention

因此,本發明是為了解決如上所述的現有技術的各種問題而提出的,其目的在於,提供一種能夠將多個掩模支撐模板同時對應至框架並進行黏貼的掩模支撐模板的製造方法。Therefore, the present invention is made to solve various problems of the prior art as described above, and an object of the present invention is to provide a method of manufacturing a mask supporting template capable of simultaneously matching and affixing a plurality of mask supporting templates to a frame.

此外,本發明的目的在於,提供一種使掩模不發生變形且能夠穩定地得到支撐移動,而且能夠防止掩模的下垂或者扭曲等變形,並能夠準確地對準掩模的掩模支撐模板的製造方法及框架一體型掩模的製造方法。In addition, an object of the present invention is to provide a mask support template capable of stably supporting and moving the mask without deformation, preventing deformation such as sagging or twisting of the mask, and accurately aligning the mask. Manufacturing method and manufacturing method of frame-integrated mask.

此外,本發明的目的在於,提供一種能夠顯著地縮短製造時間且顯著地提升收率的框架一體型掩模的製造方法。 [技術方案]Another object of the present invention is to provide a method for manufacturing a frame-integrated mask that can remarkably shorten the manufacturing time and significantly improve the yield. [Technical solutions]

本發明的上述目的可通過如下掩模支撐模板的製造方法來實現,該模板用於支撐OLED像素形成用掩模並將掩模對應到框架上,該方法包括:(a)將模板插入模板支撐部上形成的槽的步驟;(b)在模板和模板支撐部的至少一面上黏貼掩模金屬膜的步驟;以及(c)在掩模金屬膜上形成掩模圖案,並切除掩模金屬膜邊緣以製造與模板相同尺寸的掩模的步驟。The above objects of the present invention can be achieved by a method for manufacturing a mask supporting template for supporting a mask for OLED pixel formation and corresponding the mask to the frame, the method comprising: (a) inserting the template into the template support (b) a step of sticking a mask metal film on at least one side of the template and the template support part; and (c) forming a mask pattern on the mask metal film and cutting off the mask metal film edge to make a mask of the same size as the stencil.

在步驟(a)和步驟(b)之間可包括提升工藝溫度的步驟,在步驟(b)與步驟(c)之間或步驟(c)之後,還可包括降低工藝溫度的步驟。A step of raising the process temperature may be included between step (a) and step (b), and a step of lowering the process temperature may also be included between step (b) and step (c) or after step (c).

如果提升工藝溫度並將掩模金屬膜黏貼在模板上,之後降低工藝溫度,則模板的收縮小於掩模的收縮,從而掩模被施以側面方向的拉伸力。If the process temperature is increased and the mask metal film is attached to the template, and then the process temperature is lowered, the shrinkage of the template is smaller than that of the mask, so that the mask is subjected to a lateral tensile force.

在步驟(c)之後,還可包括從模板支撐部分離模板和黏貼於模板的一面上的掩模的步驟。After the step (c), a step of detaching the template and the mask attached to one side of the template from the template support part may also be included.

模板和模板支撐部的熱膨脹係數可小於掩模的熱膨脹係數。A coefficient of thermal expansion of the template and the template support may be smaller than a coefficient of thermal expansion of the mask.

掩模的熱膨脹係數可至少大於1,模板的熱膨脹係數可小於1(大於0)。The thermal expansion coefficient of the mask can be at least greater than 1, and the thermal expansion coefficient of the template can be less than 1 (greater than 0).

在步驟(b)中,在對應於掩模金屬膜的模板和模板支撐部的一面上可形成臨時黏合部。In the step (b), a temporary adhesive part may be formed on one side of the template and the template support part corresponding to the mask metal film.

在步驟(a)中,在模板支撐部的槽上形成臨時黏合部,並且模板的另一面可通過中間夾設臨時黏合部來黏貼在模板支撐部上。In step (a), a temporary adhesive part is formed on the groove of the template support part, and the other side of the template can be pasted on the template support part by interposing the temporary adhesive part.

臨時黏合部可以為基於加熱可分離的黏合劑、基於UV照射可分離的黏合劑。The temporary bonding part may be a heat-releasable adhesive, a UV-irradiation-releasable adhesive.

在步驟(a)中,還可以進行位置調整,從而使模板和模板支撐部對準。In step (a), a position adjustment may also be performed so that the template and the template support are aligned.

在步驟(a)之後,為了使模板和模板支撐部的一面的高度一致可進行平坦化工藝。After the step (a), a planarization process may be performed in order to make the height of one side of the template and the template support part uniform.

模板支撐部可包括底板及連接於底板的一面邊緣且具有中空區域的框板,中空區域對應模板支撐部的槽。The template supporting part may include a base plate and a frame plate connected to one edge of the base plate and having a hollow area, and the hollow area corresponds to the groove of the template supporting part.

此外,本發明的所述目的可通過框架一體型掩模的製造方法實現,所述框架一體型掩模由至少一個掩模和用於支撐掩模的框架一體形成,該方法包括:(a)將模板插入模板支撐部上形成的槽的步驟;(b)在模板和模板支撐部的至少一面上黏貼掩模金屬膜的步驟;(c)在掩模金屬膜上形成掩模圖案,並切除掩模金屬膜邊緣以製造與模板相同尺寸的掩模的步驟;(d)在具有至少一個掩模單元區域的框架上裝載模板,使掩模與框架的掩模單元區域對應的步驟;以及(e)將掩模附著於框架的步驟。Furthermore, the object of the present invention can be achieved by a method of manufacturing a frame-integrated mask that is integrally formed with at least one mask and a frame for supporting the mask, the method comprising: (a) The step of inserting the template into the groove formed on the template support part; (b) the step of sticking a mask metal film on at least one side of the template and the template support part; (c) forming a mask pattern on the mask metal film, and cutting a step of masking the edge of the metal film to manufacture a mask of the same size as the template; (d) a step of loading the template on a frame having at least one mask unit area so that the mask corresponds to the mask unit area of the frame; and ( e) Step of attaching the mask to the frame.

此外,本發明的所述目的可通過框架一體型掩模的製造方法實現,所述框架一體型掩模由至少一個掩模和用於支撐掩模的框架一體形成,該方法包括:(a)在具有至少一個掩模單元區域的框架上裝載基於請求項1所述的製造方法製造的模板,並使掩模與框架的掩模單元區域對應的步驟;以及(b)將掩模附著於框架的步驟。 [有益效果]In addition, the object of the present invention can be achieved by a method of manufacturing a frame-integrated mask that is integrally formed with at least one mask and a frame for supporting the mask, the method comprising: (a) A step of loading a template manufactured based on the manufacturing method described in claim 1 on a frame having at least one mask unit area, and making the mask correspond to the mask unit area of the frame; and (b) attaching the mask to the frame A step of. [beneficial effect]

根據如上所述的本發明,具有能夠將多個掩模支撐模板同時對應到框架並進行黏貼的效果。According to the present invention as described above, there is an effect that a plurality of mask supporting templates can be attached to the frame simultaneously.

此外,根據本發明,使掩模不發生變形且能夠穩定地得到支撐移動,而且能夠防止掩模的下垂或者扭曲等變形,並能夠準確地對準掩模。Furthermore, according to the present invention, the mask can be stably supported and moved without being deformed, and deformation such as sagging or twisting of the mask can be prevented, and the mask can be accurately aligned.

此外,根據本發明,具有能夠顯著地縮短製造時間且顯著地提升收率的效果。Furthermore, according to the present invention, there is an effect that the production time can be significantly shortened and the yield can be significantly improved.

較佳實施例之詳細說明Detailed Description of the Preferred Embodiment

後述本發明的詳細說明將參照附圖,該附圖將能夠實施本發明的特定實施例作為示例示出。充分詳細地說明這些實施例,以使本領域技術人員能夠實施本發明。應當理解,本發明的多種實施例雖然彼此不同,但是不必相互排斥。例如,在此記載的特定形狀、結構及特性與一實施例有關,在不脫離本發明的精神及範圍的情況下,能夠實現為其他實施例。另外,應當理解,在不脫離本發明的精神及範圍的情況下,各公開的實施例中的個別構成要素的位置或配置可進行變更。因此,後述的詳細說明不應被視為具有限制意義,只要適當地說明,則本發明的範圍僅由所附的申請專利範圍及與其等同的所有範圍限定。圖中相似的附圖標記從多方面表示相同或相似的功能,為了方便起見,長度、面積、厚度及其形狀可以誇大表示。The detailed description of the invention which follows will refer to the accompanying drawings, which illustrate by way of example specific embodiments in which the invention can be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the invention, although different from each other, are not necessarily mutually exclusive. For example, specific shapes, structures, and characteristics described here relate to one embodiment, and can be implemented as other embodiments without departing from the spirit and scope of the present invention. In addition, it is to be understood that the location or arrangement of individual constituent elements within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. Therefore, the following detailed description should not be regarded as limiting, and the scope of the present invention is limited only by the appended patent claims and all equivalent scopes as long as it is properly stated. Similar reference numerals in the drawings indicate the same or similar functions in various aspects, and for convenience, the length, area, thickness and shape may be exaggerated.

下面,將參照附圖對本發明的優選實施例進行詳細說明,以便本領域技術人員能夠容易地實施本發明。Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention.

圖1是現有的將掩模10附著於框架20的過程的示意圖。FIG. 1 is a schematic diagram of a conventional process for attaching a mask 10 to a frame 20 .

現有的掩模10為棒式(Stick-Type)或者板式(Plate-Type),圖1的棒式掩模10可通過將棒的兩側焊接固定於OLED像素沉積框架來使用。掩模10的本體(Body)[或者掩模膜11]具有多個顯示單元C。一個單元C可對應一個智慧手機等的顯示器。單元C上形成有與顯示器的各像素對應的像素圖案P。Existing masks 10 are stick-type or plate-type, and the stick-type mask 10 in FIG. 1 can be used by welding and fixing both sides of the stick to the OLED pixel deposition frame. The body (Body) of the mask 10 [or the mask film 11 ] has a plurality of display units C. As shown in FIG. One unit C can correspond to one display of a smart phone or the like. A pixel pattern P corresponding to each pixel of the display is formed on the unit C.

參照圖1的(a),通過沿著棒狀掩模10的長軸方向施加拉伸力F1~F2,以展開的狀態將棒狀掩模10裝載至四邊形框體形狀的框架20上。棒狀掩模10的單元C1~C6將位於框架20的框體內部空白區域部分。Referring to FIG. 1( a ), by applying tensile forces F1 to F2 along the long axis direction of the rod mask 10 , the rod mask 10 is mounted on the frame 20 in the shape of a quadrangular frame in an unfolded state. The cells C1 to C6 of the rod mask 10 are located in the blank area inside the frame 20 .

參照圖1的(b),通過微調施加在棒狀掩模10各側的拉伸力F1~F2並進行對準之後,並通過對棒狀掩模10側面的一部分進行焊接W將棒狀掩模10與框架20相互連接。圖1的(c)圖示了相互連接的棒狀掩模10和框架的側截面。Referring to (b) of FIG. 1 , after fine-tuning the stretching forces F1 to F2 applied to each side of the rod mask 10 and aligning them, and by welding a part of the rod mask 10 sides W, the rod mask The mold 10 and the frame 20 are interconnected. (c) of FIG. 1 illustrates a side section of the stick mask 10 and the frame connected to each other.

儘管對施加在棒狀掩模10各側的拉伸力F1~F2進行微調,仍然出現掩模單元C1~C3相互間對準不好的問題。單元C1~C6的圖案間的距離互不相同或圖案P不齊就是這種例子。由於棒狀掩模10包括多個單元C1~C6且具有較大的面積,並且具有數十㎛級的十分薄的厚度,因此基於荷重容易發生下垂或者扭曲。而且,為了使各單元C1~C6全部處於平坦狀態,調整拉伸力F1~F2的同時通過顯微鏡觀察各單元C1~C6間的對準狀態是一件十分困難的工作。為了使尺寸為數㎛至數十㎛的掩模圖案P不對超高畫質OLED的像素工藝產生不良影響,對準誤差優選不超過3㎛。這種相鄰的單元之間的對準誤差稱為像素位置精度(pixel position accuracy,PPA)。Despite fine-tuning the stretching forces F1-F2 applied to each side of the rod-shaped mask 10, there still occurs a problem of poor alignment of the mask units C1-C3 with respect to each other. An example of this is that the distances between the patterns of the cells C1 to C6 are different from each other or the patterns P are uneven. Since the rod mask 10 includes a plurality of cells C1 to C6, has a large area, and has a very thin thickness on the order of several tens of ㎛, it tends to sag or twist due to a load. Moreover, in order to make all the cells C1 to C6 in a flat state, it is very difficult to observe the alignment state of the cells C1 to C6 through a microscope while adjusting the tensile forces F1 to F2. In order to prevent the mask pattern P with a size of several ㎛ to tens of ㎛ from adversely affecting the pixel process of the ultra-high-quality OLED, the alignment error is preferably not more than 3 ㎛. This alignment error between adjacent units is called pixel position accuracy (PPA).

另外,多個棒狀掩模10分別連接至一個框架20上,並且確認多個棒狀掩模10間和棒狀掩模10的多個單元C1~C6間對準狀態同樣是一件十分困難的工作,對準操作會導致工藝時間增加,成為降低生產效率的重大原因。In addition, a plurality of stick masks 10 are respectively connected to one frame 20, and it is also very difficult to confirm the alignment state between the plurality of stick masks 10 and among the units C1 to C6 of the stick masks 10. Alignment operations will lead to increased process time and become a major cause of reduced production efficiency.

另外,將棒狀掩模10連接固定於框架20之後,施加於棒狀掩模10的拉伸力F1~F2可作為張力(tension)反作用於框架20。這種張力可使框架20細微地變形,而且使多個單元C1~C6間的對準狀態發生扭曲。In addition, after the rod mask 10 is connected and fixed to the frame 20 , the tensile forces F1 - F2 applied to the rod mask 10 can react on the frame 20 as tension. Such tension may slightly deform the frame 20 and distort the alignment state among the plurality of units C1 to C6.

由此,本發明提出了一種能夠使掩模100與框架200構成一體型結構的框架200及框架一體型掩模。與框架200形成一體的掩模100可防止發生下垂和扭曲等變形,可準確地在框架200上對準。Therefore, the present invention proposes a frame 200 and a frame-integrated mask in which the mask 100 and the frame 200 can form an integrated structure. The mask 100 integrated with the frame 200 can prevent deformation such as sagging and twisting, and can be accurately aligned on the frame 200 .

圖2是根據本發明的一實施例的框架一體型掩模的主視圖[圖2的(a)]及側截面圖[圖2的(b)]。2 is a front view [FIG. 2(a)] and a side sectional view [FIG. 2(b)] of a frame-integrated mask according to an embodiment of the present invention.

在本說明書中,下面將對框架一體型掩模的配置進行簡單的說明,然而對框架一體型掩模的結構和製造過程的說明可理解為將韓國專利申請第2018-0016186號的內容整體記載到裡面。In this specification, the configuration of the frame-integrated mask will be briefly described below, but the description of the structure and manufacturing process of the frame-integrated mask can be understood as describing the entire contents of Korean Patent Application No. 2018-0016186 go inside.

參照圖2,框架一體型掩模可包括多個掩模100及一個框架200。換而言之,是將多個掩模100分別逐一附著於框架200的形態。以下為了便於說明,雖然以四邊形的掩模100為例進行說明,但是掩模100可以是在附著於框架200之前兩側具有用於夾住的突出部的棒狀掩模形態,並且附著於框架200上之後可去除突出部。Referring to FIG. 2 , the frame-integrated mask may include a plurality of masks 100 and a frame 200 . In other words, it is a form in which a plurality of masks 100 are attached to the frame 200 one by one. Hereinafter, for convenience of description, although the quadrilateral mask 100 is used as an example for description, the mask 100 may be in the form of a rod-shaped mask with protrusions for clamping on both sides before being attached to the frame 200, and attached to the frame. The protrusions can be removed after 200 up.

各掩模100上形成有多個掩模圖案P,一個掩模100上可形成有一個單元C。一個掩模單元C可對應一個智慧手機等的顯示器。A plurality of mask patterns P are formed on each mask 100 , and one cell C may be formed on one mask 100 . One mask unit C can correspond to one display of a smartphone or the like.

掩模100的材料也可以是因瓦合金(invar)、超因瓦合金(super invar)、鎳(Ni)、鎳-鈷(Ni-Co)等。掩模100可使用由軋製(rolling)工藝或者電鑄(electroforming)生成的金屬片材(sheet)。The material of the mask 100 may also be invar, super invar, nickel (Ni), nickel-cobalt (Ni—Co) or the like. The mask 100 may use a metal sheet produced by a rolling process or electroforming.

框架200形成為可附著多個掩模100。出於熱變形的考慮,框架200優選由與掩模相同的材料構成。框架200可包括大致為四邊形、四邊形框體狀的邊緣框架部210。邊緣框架部210的內部可為中空形態。The frame 200 is formed to attach a plurality of masks 100 . In consideration of thermal deformation, the frame 200 is preferably composed of the same material as the mask. The frame 200 may include an edge frame part 210 that is substantially quadrangular, quadrangular frame shape. The inside of the edge frame part 210 may be hollow.

另外,框架200具有多個掩模單元區域CR,可包括連接至邊緣框架部210的掩模單元片材部220。掩模單元片材部220可由邊緣片材部221和第一柵格片材部223及第二柵格片材部225構成。邊緣片材部221和第一柵格片材部223及第二柵格片材部225是指在相同的片材上劃分的各部分,它們相互形成一體。In addition, the frame 200 has a plurality of mask unit regions CR and may include a mask unit sheet part 220 connected to the edge frame part 210 . The mask unit sheet part 220 may be composed of an edge sheet part 221 and a first grid sheet part 223 and a second grid sheet part 225 . The edge sheet part 221, the 1st grid sheet part 223, and the 2nd grid sheet part 225 refer to each part divided on the same sheet, and these are formed integrally with each other.

邊緣框架部210的厚度大於掩模單元片材部220的厚度且由數mm至數cm的厚度形成。掩模單元片材部220的厚度可小於邊緣框架部210的厚度但是大於掩模100的厚度,約為0.1mm至1mm左右。第一柵格片材部223和第二柵格片材部225的寬度約為1~5mm左右。The edge frame part 210 has a thickness greater than that of the mask unit sheet part 220 and is formed with a thickness of several mm to several cm. The thickness of the mask unit sheet part 220 may be smaller than that of the edge frame part 210 but larger than that of the mask 100, about 0.1 mm to 1 mm. The width of the first grid sheet part 223 and the second grid sheet part 225 is about 1-5 mm.

在平面的片材中,除邊緣片材部221和第一柵格片材部223及第二柵格片材部225佔用的區域以外,可提供多個掩模單元區域CR(CR11~CR56)。In the planar sheet, in addition to the area occupied by the edge sheet portion 221 and the first grid sheet portion 223 and the second grid sheet portion 225, a plurality of mask unit regions CR (CR11˜CR56) can be provided. .

框架200具有多個掩模單元區域CR,各掩模100可以以每個掩模單元C與掩模單元區域CR對應的方式附著。掩模單元C與框架200的掩模單元區域CR對應,虛設部的一部分或者全部可附著於框架200[掩模單元片材部220]。由此,掩模100與框架200可形成一體型結構。The frame 200 has a plurality of mask cell regions CR, and each mask 100 may be attached in such a manner that each mask cell C corresponds to the mask cell region CR. The mask unit C corresponds to the mask unit region CR of the frame 200, and part or all of the dummy part may be attached to the frame 200 [the mask unit sheet part 220]. Thus, the mask 100 and the frame 200 can form an integrated structure.

圖3是根據本發明的一實施例的掩模100和根據比較例的掩模支撐模板50'的示意性俯視圖及側截面圖。FIG. 3 is a schematic top view and side sectional view of a mask 100 according to an embodiment of the present invention and a mask supporting template 50 ′ according to a comparative example.

參照圖3的(a)和圖3的(b),掩模100可包括形成有多個掩模圖案P的掩模單元C及位於掩模單元C周邊的虛設部DM。掩模100可由軋製工藝、電鑄等生成的金屬片材製成,掩模100上可形成有一個單元C。虛設部DM與除單元C以外的掩模膜110[掩模金屬膜110]部分對應,可以只包括掩模膜110,或者可以包括形成有類似於掩模圖案P形態的預定的虛設部圖案的掩模膜110。虛設部DM與掩模100的邊緣對應,且虛設部DM的一部或者全部可附著於框架200[掩模單元片材部220]。Referring to FIG. 3( a ) and FIG. 3( b ), the mask 100 may include a mask unit C formed with a plurality of mask patterns P and a dummy part DM located around the mask unit C. Referring to FIG. The mask 100 may be made of a metal sheet produced by a rolling process, electroforming, etc., and a unit C may be formed on the mask 100 . The dummy part DM corresponds to the part of the mask film 110 [mask metal film 110] other than the cell C, and may include only the mask film 110, or may include a dummy part pattern formed with a predetermined dummy part pattern similar to the mask pattern P. masking film 110 . The dummy part DM corresponds to the edge of the mask 100, and part or all of the dummy part DM may be attached to the frame 200 [mask unit sheet part 220].

掩模圖案P的寬可以以小於40㎛的尺寸形成,掩模100的厚度可以以約5~20㎛的尺寸形成。由於框架200具有多個掩模單元區域CR(CR11~CR56),因此也可具有多個掩模100,所述掩模100具有與各掩模單元區域CR(CR11~CR56)對應的掩模單元C(C11~C56)。The width of the mask pattern P may be formed in a size smaller than 40㎛, and the thickness of the mask 100 may be formed in a size of about 5˜20㎛. Since the frame 200 has a plurality of mask unit regions CR (CR11˜CR56), it may also have a plurality of masks 100 having mask units corresponding to each mask unit region CR (CR11˜CR56). C (C11~C56).

參照圖3的(b),掩模100能夠以附著在比較例的模板50'的一面上並被支撐的狀態移動。模板50'的中心部可對應掩模金屬膜110的掩模單元C,邊緣部可對應掩模金屬膜110的虛設部DM。為了整體上支撐掩模金屬膜110,模板50'為尺寸大於掩模金屬膜110面積的大型平板狀。Referring to (b) of FIG. 3 , the mask 100 can move in a state attached to and supported by one side of the template 50' of the comparative example. The center portion of the template 50 ′ may correspond to the mask unit C of the mask metal film 110 , and the edge portion may correspond to the dummy portion DM of the mask metal film 110 . In order to support the mask metal film 110 as a whole, the template 50 ′ is in the shape of a large flat plate whose size is larger than the area of the mask metal film 110 .

為了使從模板50'的上部照射的雷射L直達掩模100的焊接部WP(執行焊接功能),模板50'上可形成有雷射通過孔51'。雷射通過孔51'可以以對應焊接部WP的位置及數量的方式形成於模板50'上。In order to allow the laser L irradiated from the upper part of the template 50' to directly reach the welding part WP of the mask 100 (perform a welding function), a laser passing hole 51' may be formed on the template 50'. The laser passing holes 51' may be formed on the template 50' in a manner corresponding to the positions and numbers of the welding parts WP.

模板50'的一面可形成有臨時黏合部55'。在掩模100附著於框架200之前,臨時黏合部55'可使掩模100[或者掩模金屬膜110]臨時黏貼在模板50'的一面並支撐在模板50'上。One side of the template 50' may be formed with a temporary adhesive part 55'. Before the mask 100 is attached to the frame 200 , the temporary adhesive part 55 ′ allows the mask 100 [or the mask metal film 110 ] to be temporarily pasted on one side of the template 50 ′ and supported on the template 50 ′.

圖4是根據比較例的將掩模支撐模板50'裝載至框架200上的過程的示意圖。FIG. 4 is a schematic diagram of a process of loading a mask supporting template 50' onto a frame 200 according to a comparative example.

參照圖4,可通過真空吸盤90移送模板50'。利用真空吸盤90吸附黏貼有掩模100的模板50'的一面的相反面從而進行移送。Referring to FIG. 4 , the template 50 ′ can be transferred by a vacuum chuck 90 . The surface opposite to the surface on which the template 50 ′ of the mask 100 is adhered is sucked and transferred by the vacuum chuck 90 .

掩模100可對應於框架200的一個掩模單元區域CR。通過將模板50'裝載至框架200[或者掩模單元片材部220]上從而使掩模100對應至掩模單元區域CR。The mask 100 may correspond to one mask cell region CR of the frame 200 . The mask 100 is made to correspond to the mask unit region CR by loading the template 50 ′ onto the frame 200 [or the mask unit sheet part 220 ].

接下來,向掩模100照射雷射L,並基於雷射焊接將掩模100黏貼至框架200。雷射焊接的掩模的焊接部分上形成有焊珠WB,焊珠WB可具有與掩模100/框架200相同的材料且連成一體。Next, the mask 100 is irradiated with laser L, and the mask 100 is adhered to the frame 200 by laser welding. A welding bead WB is formed on the welding portion of the laser-welded mask, and the welding bead WB may have the same material as the mask 100/frame 200 and be integrated.

通過反復執行將一個掩模100對應至一個掩模單元區域CR並通過照射雷射L使掩模100黏貼至框架200的過程,從而可在所有掩模單元區域CR上分別黏貼掩模100。然而,掩模100通過焊接黏貼至框架200之後,所述掩模100可向所述掩模100周邊的掩模單元片材部220施加拉伸力。由此,掩模單元片材部220會發生細微的變形,從而黏貼下一個掩模100時會給對準帶來壞影響。By repeatedly performing a process of associating one mask 100 with one mask unit region CR and irradiating the laser L to attach the mask 100 to the frame 200 , the masks 100 can be respectively attached to all the mask unit regions CR. However, after the mask 100 is adhered to the frame 200 by welding, the mask 100 may apply a tensile force to the mask unit sheet portion 220 around the mask 100 . As a result, the mask unit sheet portion 220 is slightly deformed, which adversely affects alignment when the next mask 100 is pasted.

因此,相比於將掩模100一一對應/黏貼至掩模單元區域CR,需要將所有掩模100同時對應並黏貼至掩模單元區域CR。為了將掩模100同時對應至掩模單元區域CR,在框架200上應裝載多個支撐並黏貼有掩模100的模板50'。然而,如圖4所示,由於模板50'以大於掩模100的面積形成,導致相鄰的模板50'間形成相互重疊的區域OR,因此產生干擾問題。將多個模板50'並排地對應至框架200是十分困難的。第一柵格片材部223和第二柵格片材部225的寬度僅為1~5mm左右,因此掩模100與模板50'一側的長度差應小於所述寬度的1/2,即0.5~2.5mm左右。在滿足上述尺寸差的同時在模板50'上執行製造具有掩模圖案P的掩模100的工藝是十分困難的。Therefore, compared to one-to-one correspondence/pasting of the masks 100 to the mask unit region CR, all the masks 100 need to be simultaneously mapped and pasted to the mask unit region CR. In order to simultaneously correspond the mask 100 to the mask unit region CR, a plurality of templates 50 ′ supporting and pasting the mask 100 should be loaded on the frame 200 . However, as shown in FIG. 4 , since the template 50 ′ is formed with an area larger than that of the mask 100 , overlapping regions OR are formed between adjacent templates 50 ′, thereby causing an interference problem. It is very difficult to map multiple templates 50' to the frame 200 side by side. The width of the first grid sheet part 223 and the second grid sheet part 225 is only about 1-5mm, so the length difference between the mask 100 and the template 50' side should be less than 1/2 of the width, that is About 0.5~2.5mm. It is very difficult to perform the process of manufacturing the mask 100 having the mask pattern P on the template 50' while satisfying the above-mentioned difference in size.

因此,提出了一種形成與掩模100的面積相同的模板50的方案。然而,當在具有與掩模金屬膜110相同面積的模板50上直接執行在掩模金屬膜110上形成掩模圖案P的工藝時,掩模圖案P與模板50的對準將會發生錯位,還會發生模板50的雷射通過孔51與掩模100的虛設部DM[或者焊接部WP]對準不好的問題。而且,在掩模金屬膜110上形成掩模圖案P之後應切除角部並形成如圖3的(a)所示的掩模100,但是在具有與掩模100相同面積的模板50上切除角部是十分困難的。Therefore, a proposal is made to form the template 50 having the same area as the mask 100 . However, when the process of forming the mask pattern P on the mask metal film 110 is directly performed on the template 50 having the same area as the mask metal film 110, the alignment of the mask pattern P and the template 50 will be misaligned, and There is a problem that the alignment between the laser passing hole 51 of the template 50 and the dummy part DM [or welded part WP] of the mask 100 may be poor. Also, after the mask pattern P is formed on the mask metal film 110, the corners should be cut off and the mask 100 as shown in (a) of FIG. Department is very difficult.

為了解決該問題,可以考慮在預定的基板上製造掩模100之後,轉移(transfer)至具有與掩模100相同尺寸的模板50上的方式。然而,在轉移掩模100的過程中因掩模100中產生的缺陷,或者掩模100中產生褶皺、變形使掩模100與模板50的對準不好,或者掩模100與模板50之間夾有異物等會導致再次引發產品的不良率增加的問題。In order to solve this problem, it is conceivable to transfer the mask 100 to the template 50 having the same size as the mask 100 after manufacturing the mask 100 on a predetermined substrate. However, in the process of transferring the mask 100, due to defects generated in the mask 100, or wrinkles and deformations in the mask 100, the alignment between the mask 100 and the template 50 is not good, or the gap between the mask 100 and the template 50 is not good. Intervention of foreign matter or the like will cause a problem that the defect rate of the product will increase again.

因此,本發明的特徵是,在模板支撐部60中插設模板50的狀態下製造具有與模板50相同面積的掩模100。更具體地,本發明的特徵是,在模板支撐部60插設模板50,並在模板支撐部60和模板50上黏貼掩模金屬膜110之後,在掩模金屬膜110上形成掩模圖案P,再切除掩模金屬膜110的邊緣部分,從而製造具有與模板50的尺寸相同的掩模100。Therefore, the present invention is characterized in that the mask 100 having the same area as the template 50 is manufactured in a state where the template 50 is inserted into the template support portion 60 . More specifically, the feature of the present invention is that after inserting the template 50 into the template support part 60 and pasting the mask metal film 110 on the template support part 60 and the template 50, the mask pattern P is formed on the mask metal film 110. , and then cut off the edge portion of the mask metal film 110, thereby manufacturing the mask 100 having the same size as the template 50.

圖5至圖6是根據本發明一實施例的掩模支撐模板50的製造過程的示意圖。5 to 6 are schematic views of the manufacturing process of the mask support template 50 according to an embodiment of the present invention.

參照圖5的(a),可準備模板支撐部60。模板支撐部60上可形成有用於插設模板50的槽64。槽64的寬度和高度與模板50對應。為了能夠將模板50容納在槽64中,很顯然模板支撐部60的尺寸和高度應大於模板50。而且,為具有類似的熱行為,模板支撐部60可採用與模板50相同的材料或者具有相同熱膨脹係數的材料。Referring to (a) of FIG. 5 , the template support part 60 may be prepared. A slot 64 for inserting the template 50 may be formed on the template supporting part 60 . The slot 64 has a width and a height corresponding to the template 50 . In order to accommodate the template 50 in the groove 64 , it is obvious that the size and height of the template support 60 should be larger than the template 50 . Moreover, in order to have a similar thermal behavior, the template support part 60 may use the same material as the template 50 or a material with the same thermal expansion coefficient.

另外,槽64的至少一部分可形成有臨時黏合部65以使模板50插入後黏貼固定。臨時黏合部65可採用與後述的模板50的臨時黏合部55相同的材料,優選地,可採用基於UV照射可分離的黏貼片(UV release tape;URT)。URT作為臨時黏合部65使用時,通過只向特定區域照射UV來進行分離,從而具有可輕鬆地從模板支撐部60分離模板50的優點。In addition, at least a part of the slot 64 may be formed with a temporary adhesive portion 65 to allow the template 50 to be pasted and fixed after being inserted. The temporary adhesive part 65 can be made of the same material as the temporary adhesive part 55 of the template 50 described later, preferably, a detachable adhesive sheet (UV release tape; URT) based on UV irradiation can be used. When the URT is used as the temporary bonding part 65 , the template 50 can be easily separated from the template support part 60 by irradiating UV to a specific area for separation.

然後,參照圖5的(b),可準備模板50並將其插入模板支撐部60的槽64。模板50是使掩模100附著於所述模板50的一面上並在支撐的狀態下移動的媒介。模板50的一面優選為平坦狀以支撐並搬運平坦的掩模100。Then, referring to (b) of FIG. 5 , the template 50 may be prepared and inserted into the groove 64 of the template support part 60 . The template 50 is a medium that attaches the mask 100 to one surface of the template 50 and moves while being supported. One side of the template 50 is preferably flat to support and carry the flat mask 100 .

模板50上可形成有雷射通過孔51以使從模板50上部照射的雷射L能夠到達掩模100的焊接部WP。雷射通過孔51可形成於模板50上以對應焊接部WP的位置和數量。由於在掩模100的邊緣或者虛擬部DM部分上以預定的間隔佈置多個焊接部WP,因此與之對應地也可以以預定間隔形成多個雷射貫穿孔51。作為一示例,由於在掩模100的兩側(左側/右側)虛擬部DM部分上以預定間隔佈置多個焊接部WP,因此雷射貫穿孔51也可以在模板50的兩側(左側/右側)以預定間隔可形成多個。A laser passing hole 51 may be formed on the template 50 so that the laser L irradiated from the upper part of the template 50 can reach the welding part WP of the mask 100 . Laser passing holes 51 may be formed on the template 50 to correspond to the positions and numbers of the welding parts WP. Since a plurality of welding parts WP are arranged at predetermined intervals on the edge of the mask 100 or the dummy part DM, a plurality of laser penetration holes 51 may also be formed at predetermined intervals corresponding thereto. As an example, since a plurality of welding parts WP are arranged at predetermined intervals on both sides (left side/right side) of the dummy part DM of the mask 100, the laser penetration hole 51 may also be formed on both sides (left side/right side) of the template 50. ) may be formed in plural at predetermined intervals.

雷射通過孔51不必一定與焊接部的位置和數量對應。例如,也可以只對部分雷射通過孔51照射雷射L進行焊接。而且,不與焊接部對應的雷射通過孔51中一部分也可以在對準掩模100與模板50時作為對準標識而使用。只是,如果模板50的材料能夠透過雷射L,則也可以不形成雷射通過孔51。The laser passage holes 51 do not necessarily correspond to the position and number of welded portions. For example, only a part of the laser passage hole 51 may be irradiated with the laser L for welding. In addition, a part of the laser passage hole 51 that does not correspond to the welding portion may be used as an alignment mark when aligning the mask 100 and the template 50 . However, if the material of the template 50 can transmit the laser L, the laser passing hole 51 may not be formed.

在模板支撐部60的槽64中插設模板50的過程可通過調整位置進行對準。槽64和模板50可以嚴格地相同,但是當槽64大於模板50時需要進行對準過程。可使用顯微鏡、對準器等熟知的確認和調整位置的裝置來調整位置。The process of inserting the template 50 into the groove 64 of the template support part 60 can be aligned by adjusting the position. The groove 64 and the template 50 may be exactly the same, but an alignment process is required when the groove 64 is larger than the template 50 . The position can be adjusted using well-known devices for confirming and adjusting position such as microscopes and aligners.

另外,在模板支撐部60的槽64中插設模板50之後,當模板50和模板支撐部60的一面(上面)的高度不一致時,可執行預定的平坦化工藝。平坦化工藝可以指通過拋光等使模板50和模板支撐部60的高度一致的一系列工藝。由於模板50和模板支撐部60會發生加工公差,因此通過使高度變成一致,從而能夠輕鬆地執行後續工藝,如形成臨時黏合部55、黏貼掩模金屬膜110。In addition, after the template 50 is inserted into the groove 64 of the template support part 60 , when the heights of the template 50 and one side (upper side) of the template support part 60 are inconsistent, a predetermined planarization process may be performed. The planarization process may refer to a series of processes for making the template 50 and the template support part 60 uniform in height through polishing or the like. Due to processing tolerances of the template 50 and the template supporting portion 60 , by making the heights consistent, subsequent processes such as forming the temporary bonding portion 55 and pasting the mask metal film 110 can be easily performed.

然後,參照圖5的(c),在模板50和模板支撐部60的一面上可形成臨時黏合部55。臨時黏合部55優選形成於與掩模金屬膜110對應的模板50和模板支撐部60的部分上。掩模金屬膜110可具有大於模板50且小於模板支撐部60的面積,因此臨時黏合部55可形成在模板50一面(上面)的全部和模板支撐部60一面(上面)的局部。掩模100附著於框架200之前,臨時黏合部55可使掩模100臨時黏貼於模板50的一面並由模板50支撐。而且,在掩模金屬膜110上形成掩模圖案P並製成掩模100之前,臨時黏合部55可使掩模金屬膜110黏貼於模板50和模板支撐部60的一面並得到支撐。Then, referring to (c) of FIG. 5 , a temporary bonding part 55 may be formed on one side of the template 50 and the template support part 60 . The temporary adhesive part 55 is preferably formed on the part of the template 50 and the template support part 60 corresponding to the mask metal film 110 . The mask metal film 110 may have an area larger than the template 50 and smaller than the template support portion 60 , so the temporary adhesive portion 55 may be formed on all of one side (upper side) of the template 50 and part of one side (upper side) of the template support portion 60 . Before the mask 100 is attached to the frame 200 , the temporary adhesive part 55 can temporarily stick the mask 100 on one side of the template 50 and be supported by the template 50 . Moreover, before the mask pattern P is formed on the mask metal film 110 and the mask 100 is formed, the temporary adhesive part 55 can make the mask metal film 110 adhere to and support one side of the template 50 and the template support part 60 .

臨時黏合部55可使用基於加熱可分離的黏合劑、基於UV照射可分離的黏合劑。The temporary adhesive part 55 can use the adhesive which is separable by heating, and the adhesive which is separable by UV irradiation.

作為一示例,臨時黏合部55可使用液蠟(liquid wax)。液蠟可使用半導體晶片的研磨工序等中使用的蠟,其種類沒有特別限制。作為主要用於控制與維持力有關的黏合力、耐衝擊性等的樹脂成分,液蠟可包括如丙烯酸、醋酸乙烯酯、尼龍及各種聚合物的物質及溶劑。作為一示例,臨時黏合部55可使用包括作為樹脂成分的丁腈橡膠(ABR,Acrylonitrile butadiene rubber),作為溶劑成分的n-丙醇的SKYLIQUID ABR-4016。液蠟可通過旋轉塗布來形成臨時黏合部55。As an example, liquid wax may be used for the temporary adhesive part 55 . As the liquid wax, waxes used in the polishing process of semiconductor wafers and the like can be used, and the type is not particularly limited. As a resin component mainly used to control adhesive force related to maintaining force, impact resistance, etc., the liquid wax may include substances such as acrylic acid, vinyl acetate, nylon, and various polymers and solvents. As an example, SKYLIQUID ABR-4016 including Acrylonitrile butadiene rubber (ABR, ABR) as a resin component and n-propanol as a solvent component can be used as the temporary adhesive part 55 . Liquid wax can be spin-coated to form the temporary bonding portion 55 .

作為液蠟的臨時黏合部55在高於85℃~100℃的溫度下黏性下降,在低於85℃的溫度下黏性增加,其一部分如固體固化,從而可固定黏貼掩模金屬膜110和模板50[和模板支撐部60]。The temporary adhesive portion 55 as liquid wax decreases in viscosity at a temperature higher than 85°C to 100°C, and increases in viscosity at a temperature lower than 85°C, and a part of it solidifies as a solid, so that the mask metal film 110 can be fixedly pasted. And template 50 [and template support 60].

再次參照圖5的(c),可將執行一工藝的空間的工藝溫度上升至高於常溫的溫度T1,所述工藝用於形成臨時黏合部55並使掩模金屬膜110與模板50和模板支撐部60黏貼。工藝溫度T1可以是使上述的臨時黏合部55的黏性下降的溫度,約為85℃~100℃左右。Referring again to (c) of FIG. 5 , the process temperature of the space where a process for forming the temporary bonding portion 55 and making the mask metal film 110 and the template 50 and the template support can be raised to a temperature T1 higher than normal temperature may be raised. Part 60 is pasted. The process temperature T1 may be a temperature at which the viscosity of the above-mentioned temporary bonding part 55 is reduced, and is about 85° C. to 100° C. or so.

然後,參照圖5的(d),在模板50和模板支撐部60上可黏貼掩模金屬膜110。作為一示例,將液蠟加熱至85℃以上並將掩模金屬膜110接觸模板50和模板支撐部60之後,將掩模金屬膜110、模板50及模板支撐部60通過輥(roller)之間並進行黏貼。Then, referring to (d) of FIG. 5 , the mask metal film 110 may be pasted on the template 50 and the template supporting part 60 . As an example, after heating the liquid wax to above 85°C and contacting the mask metal film 110 with the template 50 and the template support part 60, the mask metal film 110, the template 50 and the template support part 60 are passed between rollers. and paste it.

根據一實施例,通過對模板50[和模板支撐部60]以約120℃烘烤(baking)60秒,使臨時黏合部55的溶劑氣化,然後可馬上進行掩模金屬膜110的層壓(lamination)工藝。層壓可通過以下方式執行:在一面形成有臨時黏合部55的模板50和模板支撐部60上裝載掩模金屬膜110,並使其通過約為100℃的上部輥(roll)與約為0℃的下部輥之間。或者,在一面形成有臨時黏合部55的模板50和模板支撐部60上裝載掩模金屬膜110,並在常溫或者高於常溫的溫度下進一步執行真空層壓。結果,掩模金屬膜110可放置在模板50和模板支撐部60上且中間夾設臨時黏合部55。According to an embodiment, by baking the template 50 [and the template supporting part 60 ] at about 120° C. for 60 seconds, the solvent of the temporary bonding part 55 is vaporized, and then the lamination of the mask metal film 110 can be performed immediately. (lamination) process. Lamination can be performed by loading the mask metal film 110 on the template 50 and the template support 60 with the temporary bonding part 55 formed on one side, and passing it through an upper roll at about 100° C. ℃ between the lower rolls. Alternatively, the mask metal film 110 is loaded on the template 50 and the template supporting part 60 having the temporary bonding part 55 formed on one side thereof, and vacuum lamination is further performed at normal temperature or higher. As a result, the mask metal film 110 can be placed on the template 50 and the template support part 60 with the temporary adhesive part 55 interposed therebetween.

另外,可進一步對掩模金屬膜110的一面進行平坦化。利用軋製工藝製造的掩模金屬膜110可通過平坦化工藝減少厚度。此外,為了控制表面特性、厚度,也可以對通過電鑄工藝製造的掩模金屬膜110進行平坦化工藝。由此,掩模金屬膜110的厚度漸漸變薄,掩模金屬膜110的厚度可約為5㎛至20㎛。毫無疑問,可以將厚度變薄的掩模金屬膜110裝載到模板50和模板支撐部60上。In addition, one side of the mask metal film 110 may be further planarized. The mask metal film 110 manufactured using a rolling process may be reduced in thickness through a planarization process. In addition, in order to control surface characteristics and thickness, a planarization process may also be performed on the mask metal film 110 manufactured by the electroforming process. Thus, the thickness of the mask metal film 110 gradually becomes thinner, and the thickness of the mask metal film 110 may be about 5㎛ to 20㎛. Needless to say, the mask metal film 110 having a reduced thickness can be loaded onto the template 50 and the template support 60 .

然後,參照圖6的(e),可以在掩模金屬膜110上形成圖案化的絕緣部25。絕緣部25可通過印刷法等由光刻膠材料形成。Then, referring to (e) of FIG. 6 , a patterned insulating part 25 may be formed on the mask metal film 110 . The insulating portion 25 can be formed of a photoresist material by a printing method or the like.

接下來,可對掩模金屬膜110進行蝕刻。可不受限制地使用乾式蝕刻、濕式蝕刻等方法。經蝕刻的結果,從絕緣部25之間的空白空間26露出的掩模金屬膜110部分被蝕刻。掩模金屬膜110中被蝕刻的部分可構成掩模圖案P,從而可製成形成有多個掩模圖案P的掩模100。Next, the mask metal film 110 may be etched. Methods of dry etching, wet etching, and the like can be used without limitation. As a result of the etching, the portion of the mask metal film 110 exposed from the empty space 26 between the insulating portions 25 is etched. The etched portion of the mask metal film 110 may constitute a mask pattern P, so that the mask 100 formed with a plurality of mask patterns P may be fabricated.

在蝕刻掩模圖案P的同時還可蝕刻(EC)掩模金屬膜110的邊緣。如果絕緣部25的空白部分形成為對應模板50的形態,並且蝕刻從空白空間露出的掩模金屬膜110部分,則可切除掩模金屬膜110的邊緣部分111使其具有與模板50相同的尺寸。接下來,可進一步執行去除絕緣部25的工藝。The edge of the mask metal film 110 may also be etched (EC) while the mask pattern P is etched. If the blank portion of the insulating portion 25 is formed in a form corresponding to the template 50, and the portion of the mask metal film 110 exposed from the blank space is etched, the edge portion 111 of the mask metal film 110 can be cut to have the same size as the template 50. . Next, a process of removing the insulating part 25 may be further performed.

然後,參照圖6的(f),可以從模板支撐部60分離(debonding)模板50和掩模100。分離可通過對臨時黏合部65進行加熱、化學處理、施加超聲波、施加UV(UV)中至少任意一個來執行。但,為了輕鬆地分離特定區域,優選使用向URT臨時黏合部65照射UV的方法。Then, referring to (f) of FIG. 6 , the template 50 and the mask 100 may be debonded from the template support part 60 . Separation may be performed by at least any one of heating, chemical treatment, application of ultrasonic waves, and application of UV (UV) to the temporary bonding portion 65 . However, in order to easily separate a specific region, it is preferable to use a method of irradiating UV to the URT temporary bonding portion 65 .

然後,參照圖6的(g),可將支撐掩模100的模板50的工藝溫度降低至常溫或者使臨時黏合部55的黏性變大以致部分如固體固化的溫度T2。由此,掩模100被施以側面方向的拉伸力IT,且能夠以繃緊的狀態黏貼於模板50上,從而可結束支撐掩模100的模板50的製造。在後續的圖9和圖10中將具體說明掩模100被施以側面方向的拉伸力IT的原理。Then, referring to (g) of FIG. 6 , the process temperature of the template 50 supporting the mask 100 may be lowered to normal temperature or a temperature T2 at which the temporary adhesive part 55 becomes viscous so as to be partially solidified. As a result, the mask 100 is applied with the tensile force IT in the lateral direction, and can be attached to the template 50 in a tense state, thereby completing the manufacture of the template 50 supporting the mask 100 . The principle that the mask 100 is applied with the tensile force IT in the lateral direction will be described in detail in the subsequent FIGS. 9 and 10 .

由於框架200具有多個掩模單元區域CR(CR11~CR56),因此也可具有多個掩模100,所述掩模100具有與各掩模單元區域CR(CR11~CR56)對應的掩模單元C(C11~C56)。而且,可具有用於分別支撐多個掩模100的多個模板50。Since the frame 200 has a plurality of mask unit regions CR (CR11˜CR56), it may also have a plurality of masks 100 having mask units corresponding to each mask unit region CR (CR11˜CR56). C (C11~C56). Also, there may be a plurality of templates 50 for respectively supporting a plurality of masks 100 .

圖7是根據本發明另一實施例的模板支撐部60'的示意圖。FIG. 7 is a schematic diagram of a template support portion 60' according to another embodiment of the present invention.

參照圖7,根據另一實施例的模板支撐部60'可包括另外的構件,如底板61'和框板62'。底板61'為平板狀,框板62'為具有中空區域66的方形環狀。底板61'上黏貼有框板62'且中間夾有預定的黏貼部67,框板62'的中空區域66可構成模板支撐部60'的槽。黏貼部67可相當於黏合劑或者臨時黏合部55。Referring to FIG. 7 , a form support part 60' according to another embodiment may include additional members such as a bottom plate 61' and a frame plate 62'. The bottom plate 61 ′ is in the shape of a flat plate, and the frame plate 62 ′ is in the shape of a square ring with a hollow area 66 . A frame plate 62 ′ is pasted on the bottom plate 61 ′ with a predetermined sticking portion 67 sandwiched therebetween. The hollow area 66 of the frame plate 62 ′ can form a groove of the template support portion 60 ′. The sticking part 67 may correspond to the adhesive or the temporary bonding part 55 .

尤其,框板62'和模板50可通過使用相同的圓盤而製成。如果使用相同的圓盤製造框板62'和模板50,則厚度和材料相同,就不會出現因高度不同產生的加工公差。因此,具有圖5的步驟(b)中可省略使模板50和模板支撐部60的高度一致的平坦化工藝的優點。而且,隨著從底板61'分離框板62',支撐掩模100的模板50突出地形成於底板61'上,從而具有能夠更輕鬆地從底板61'分離模板50的優點。In particular, the frame plate 62' and the formwork 50 can be made by using the same circular disc. If the same disc is used to manufacture the frame plate 62' and the template 50, the thickness and material are the same, and there will be no processing tolerance due to different heights. Therefore, there is an advantage that the planarization process for making the heights of the template 50 and the template support portion 60 uniform can be omitted in step (b) of FIG. 5 . Also, as the frame plate 62' is separated from the bottom plate 61', the template 50 supporting the mask 100 is protrudingly formed on the bottom plate 61', thereby having an advantage that the template 50 can be more easily separated from the bottom plate 61'.

圖8是根據本發明一實施例的將掩模支撐模板裝載至框架上的過程的示意圖。FIG. 8 is a schematic diagram of a process of loading a mask support template onto a frame according to an embodiment of the present invention.

參照圖8,可通過真空吸盤90移送模板50。可利用真空吸盤90吸附黏貼有掩模100的模板50的一面的相反面並移送。真空吸盤90可與向x、y、z、θ軸移動的移動手段(未圖示)連接。此外,真空吸盤90還可以與通過吸附模板50來進行翻轉(flip)的翻轉手段(未圖示)連接。如圖8的(b)所示,在真空吸盤90吸附模板50並翻轉後向框架200移送模板50的過程中,也不會影響掩模100的黏貼狀態及對準狀態。Referring to FIG. 8 , the template 50 may be transferred by a vacuum chuck 90 . The surface opposite to the surface of the template 50 on which the mask 100 is attached can be sucked and transported by the vacuum chuck 90 . The vacuum chuck 90 can be connected to a moving means (not shown) that moves along the x, y, z, and θ axes. In addition, the vacuum chuck 90 may also be connected to a flipping means (not shown) that flips (flips) by suctioning the template 50 . As shown in (b) of FIG. 8 , in the process of transferring the template 50 to the frame 200 after the vacuum chuck 90 absorbs the template 50 and flips it over, the sticking state and alignment state of the mask 100 will not be affected.

圖9是根據本發明一實施例的將模板裝載至框架並使掩模對應框架的單元區域的狀態的示意圖。FIG. 9 is a schematic diagram of a state in which a template is loaded into a frame and the mask corresponds to a unit area of the frame according to an embodiment of the present invention.

參照圖9,可以將掩模100對應於框架200的一個掩模單元區域CR。可通過將模板50裝載到框架200[或者掩模單元片材部220]上的方式將掩模100對應於掩模單元區域CR。可通過控制模板50/真空吸盤90的位置同時利用顯微鏡觀察掩模100是否與掩模單元區域CR對應。由於模板50擠壓掩模100,因此掩模100能夠與框架200緊貼。Referring to FIG. 9 , the mask 100 may correspond to one mask cell region CR of the frame 200 . The mask 100 may correspond to the mask unit region CR by loading the template 50 onto the frame 200 [or the mask unit sheet part 220 ]. Whether the mask 100 corresponds to the mask unit region CR can be observed by using a microscope while controlling the positions of the template 50/vacuum chuck 90 . Since the template 50 presses the mask 100 , the mask 100 can be in close contact with the frame 200 .

可依次或者同時將多個模板50裝載到框架200[或者掩模單元片材部220]上,從而使各掩模100與各掩模單元區域CR分別對應。由於模板50與掩模100具有相同的尺寸,因此對應於特定掩模單元區域CR11上的模板50和對應於與其相鄰的掩模單元區域CR12、CR21上的模板50之前不發生干擾/不重疊且具有預定的間隔。該預定的間隔可以是小於第一柵格片材部223和第二柵格片材部225的寬度的1/2。A plurality of templates 50 may be loaded onto the frame 200 [or the mask unit sheet part 220 ] sequentially or simultaneously so that each mask 100 corresponds to each mask unit region CR. Since the template 50 has the same size as the mask 100, no interference/non-overlap occurs before the template 50 corresponding to the specific mask cell region CR11 and the template 50 corresponding to the adjacent mask cell regions CR12, CR21 and have a predetermined interval. The predetermined interval may be less than 1/2 of the widths of the first grid sheet part 223 and the second grid sheet part 225 .

另外,還可將下部支撐體70佈置在框架200下部。下部支撐體70可擠壓與掩模100接觸的掩模單元區域CR的反面。同時,由於下部支撐體70和模板50沿著相互相反的方向擠壓掩模100的邊緣及框架200[或者掩模單元片材部220],因此可維持掩模100的對準狀態而不發生扭曲。In addition, the lower support body 70 may also be disposed at the lower portion of the frame 200 . The lower supporter 70 may press the reverse side of the mask cell region CR in contact with the mask 100 . Meanwhile, since the lower support 70 and the template 50 press the edge of the mask 100 and the frame 200 [or the mask unit sheet part 220 ] in mutually opposite directions, the alignment state of the mask 100 can be maintained without occurrence of distortion.

接下來,向掩模100照射雷射L,基於雷射焊接將掩模100附著在框架200上。進行雷射焊接的掩模的焊接部的局部上生成焊珠WB,焊珠WB可具有與掩模100/框架200相同的材料並連成一體。Next, the mask 100 is irradiated with laser L, and the mask 100 is attached to the frame 200 by laser welding. Weld beads WB are locally formed on the welded portion of the mask subjected to laser welding, and the weld beads WB may have the same material as the mask 100/frame 200 and be integrated.

下面,將進一步進行說明基於模板50和掩模100的熱膨脹係數的材料選擇及掩模100附著於框架200之後的熱行為。Next, the material selection based on the thermal expansion coefficients of the template 50 and the mask 100 and the thermal behavior after the mask 100 is attached to the frame 200 will be further described.

在現有技術中,當玻璃等材料的模板50'的熱膨脹係數大於因瓦合金等材料的掩模100[或者掩模金屬膜110]時,會發生如下的問題。在現有技術中,模板50'使用了玻璃(glass)、硼矽酸鹽玻璃(borosilicate glass)等材料。其中,作為硼矽酸鹽玻璃的BOROFLOAT® 33,熱膨脹係數約為3.3X10-6 /℃,與熱膨脹係數為1.5~3X10-6 /℃左右的因瓦合金(invar)掩模金屬膜110相比,熱膨脹係數差值較小,而且容易控制掩模金屬膜110,因此被廣泛使用。In the prior art, when the thermal expansion coefficient of the template 50 ′ made of material such as glass is greater than that of the mask 100 [or the mask metal film 110 ] made of material such as invar, the following problems may occur. In the prior art, materials such as glass and borosilicate glass are used for the template 50 ′. Among them, BOROFLOAT ® 33, which is a borosilicate glass, has a thermal expansion coefficient of about 3.3X10 -6 /℃, compared with the invar mask metal film 110, which has a thermal expansion coefficient of about 1.5~3X10 -6 /℃ , the thermal expansion coefficient difference is small, and it is easy to control the mask metal film 110, so it is widely used.

由於模板50'的熱膨脹係數大於掩模100的熱膨脹係數,因此提升溫度並將掩模100黏貼於模板50'之後,在重新降低溫度時,掩模100基於溫度變換收縮相對較小,相反,模板50'收縮程度相對較大。同時,模板50'與掩模100中間夾有臨時黏合部55且處於較好地黏貼固定的狀態,因此掩模100將被施以大於原有收縮程度的收縮力。欲進一步收縮的力是因為模板50'的收縮程度大於掩模100的收縮程度而產生的。由此,掩模100將以被施以側面方向[掩模100的內側]的壓縮力的狀態黏貼在模板50'上。Since the thermal expansion coefficient of the template 50' is greater than that of the mask 100, after raising the temperature and pasting the mask 100 on the template 50', when the temperature is lowered again, the shrinkage of the mask 100 is relatively small based on the temperature change. On the contrary, the template The degree of shrinkage at 50' is relatively large. At the same time, the template 50 ′ and the mask 100 are sandwiched by the temporary adhesive portion 55 and are in a well-adhesive and fixed state, so the mask 100 will be subjected to a contraction force greater than the original contraction degree. The force to further shrink is generated because the shrinkage of the template 50 ′ is greater than that of the mask 100 . Accordingly, the mask 100 is attached to the template 50 ′ in a state where a compressive force is applied in the side direction (inside of the mask 100 ).

如上所述,將掩模100處於被施以側面方向的壓縮力狀態下的模板50'裝載到框架200,使掩模100對應於掩模單元區域CR,並通過焊接將掩模100附著於框架200[參照圖4]。然後,從掩模100分離模板50'。然而,隨著從掩模100分離模板50'的同時施加在掩模100上的壓縮力被解除,從而會打亂掩模100的對準。換而言之,由於施加在掩模100上的壓縮力,掩模100不能以兩側被向外側方向拉緊的狀態附著於框架200,而以褶皺或者下垂的狀態附著於框架200。這將導致掩模100的對準誤差、單元C間的PPA誤差等,最終導致產品失敗。As described above, the mask 100 is loaded on the frame 200 with the mask 100 in the state where the compressive force is applied in the lateral direction, so that the mask 100 corresponds to the mask cell region CR, and the mask 100 is attached to the frame by welding. 200 [refer to FIG. 4]. Then, the template 50 ′ is separated from the mask 100 . However, the compressive force applied to the mask 100 is released as the template 50 ′ is separated from the mask 100 , thereby disturbing the alignment of the mask 100 . In other words, due to the compressive force applied to the mask 100 , the mask 100 cannot be attached to the frame 200 in a state where both sides are pulled in an outward direction, but is attached to the frame 200 in a wrinkled or sagging state. This will result in an alignment error of the mask 100, a PPA error between cells C, etc., eventually leading to product failure.

因此,本發明的特徵是,模板50的熱膨脹係數小於掩模100[或者掩模金屬膜110]的熱膨脹係數。而且,模板支撐部60的熱膨脹係數也可以小於掩模100的熱膨脹係數。如圖5的(c)或(d),將工藝溫度提升至高於常溫的溫度T1,並將掩模金屬膜110黏貼在模板50和模板支撐部60上。而且,在模板50上製造掩模100之後,可以將工藝溫度降至溫度T2,在溫度T2下臨時黏合部55的黏性變大以致一部分如固體固化。Therefore, the present invention is characterized in that the thermal expansion coefficient of the template 50 is smaller than that of the mask 100 [or the mask metal film 110 ]. Also, the thermal expansion coefficient of the template support part 60 may be smaller than the thermal expansion coefficient of the mask 100 . As shown in (c) or (d) of FIG. 5 , the process temperature is increased to a temperature T1 higher than normal temperature, and the mask metal film 110 is pasted on the template 50 and the template support portion 60 . Also, after manufacturing the mask 100 on the template 50, the process temperature may be lowered to a temperature T2 at which the temporary adhesive part 55 becomes so viscous that a part is solidified as a solid.

掩模金屬膜110[或者掩模100]的材料可以是熱膨脹係數至少大於1的因瓦合金、超因瓦合金、鎳、鎳-鈷等。相反,模板50[和模板支撐部60]的熱膨脹係數可以小於1(大於0)。優選地,可使用熱膨脹係數為0.55的石英(quartz)材料的模板50[和模板支撐部60],但不限於此。The material of the mask metal film 110 [or the mask 100 ] can be Invar alloy, super Invar alloy, nickel, nickel-cobalt, etc. with a coefficient of thermal expansion greater than 1 at least. Conversely, the coefficient of thermal expansion of the template 50 [and the template support 60 ] may be less than 1 (greater than 0). Preferably, the template 50 [and the template support part 60 ] of quartz material having a coefficient of thermal expansion of 0.55 may be used, but not limited thereto.

由於模板50的熱膨脹係數小於掩模100的熱膨脹係數,因此如圖6的(g)所示,當溫度T2下降時,模板50幾乎不發生收縮或者相比於掩模100收縮程度較小。雖然掩模100收縮程度相對較大,但是由於以中間夾有臨時黏合部55狀態較好地黏貼並固定於模板50上,因此不會發生收縮而是被施以欲收縮的內力IT。換而言之,掩模100可被施以側面方向的拉伸力IT並以繃緊的狀態黏貼在模板50上。Since the thermal expansion coefficient of the template 50 is smaller than that of the mask 100, as shown in (g) of FIG. Although the shrinkage of the mask 100 is relatively large, since the mask 100 is well pasted and fixed on the template 50 with the temporary adhesive part 55 in between, the shrinkage does not occur but the internal force IT intended to shrink is applied. In other words, the mask 100 can be attached to the template 50 in a tensioned state by applying a lateral tensile force IT.

這種狀態下,將模板50裝載到框架200上,以使掩模100對應,並通過焊接形成焊珠WB,從而可將掩模100附著於框架200。In this state, the template 50 is loaded on the frame 200 so that the mask 100 corresponds, and the bead WB is formed by welding so that the mask 100 can be attached to the frame 200 .

圖10是根據本發明的一實施例的將掩模附著於框架之後分離掩模與模板的過程的示意圖。10 is a schematic diagram of a process of separating the mask from the template after attaching the mask to the frame according to an embodiment of the present invention.

參照圖10,將掩模100附著於框架200之後,可分離(debonding)掩模100與模板50。掩模100與模板50的分離可通過對臨時黏合部55進行加熱ET、化學處理CM、施加超聲波US,施加紫外線UV中至少任意一個而執行。由於掩模100可維持附著在框架200上的狀態,因此可以只抬起模板50。作為一示例,如果施加高於85℃~100℃的溫度的熱ET,則臨時黏合部55的黏性降低,掩模100與模板50的黏貼力變弱,從而可分離掩模100與模板50。作為另一示例,可通過將臨時黏合部55浸漬於IPA、丙酮、乙醇等化學物質中使臨時黏合部55溶解、去除等的方式分離掩模100和模板50。作為另一示例,如果施加超聲波US或者施加紫外線UV,則掩模100與模板50的黏貼力變弱,從而可分離掩模100與模板50。Referring to FIG. 10 , after the mask 100 is attached to the frame 200 , the mask 100 and the template 50 may be debonded. The separation of the mask 100 from the template 50 may be performed by at least any one of heating ET, chemical treatment CM, application of ultrasonic waves US, and application of ultraviolet rays UV to the temporary bonding part 55 . Since the mask 100 can maintain a state of being attached to the frame 200, only the template 50 can be lifted. As an example, if heat ET at a temperature higher than 85° C. to 100° C. is applied, the viscosity of the temporary bonding portion 55 decreases, and the adhesive force between the mask 100 and the template 50 becomes weak, so that the mask 100 and the template 50 can be separated. . As another example, the mask 100 and the template 50 may be separated by immersing the temporary bonding part 55 in chemical substances such as IPA, acetone, ethanol, etc. to dissolve, remove, etc. the temporary bonding part 55 . As another example, if ultrasonic waves US or ultraviolet rays UV are applied, the adhesive force between the mask 100 and the template 50 becomes weak, so that the mask 100 and the template 50 can be separated.

模板50從掩模100分離的同時作用於掩模100的拉伸力IT被解除,從而可轉化為使掩模100兩側繃緊的張力TS。換而言之,掩模100處於以拉伸至大於掩模100的原有下降溫度T2下具有的長度並黏貼到模板5的狀態,通過該狀態原封不動地焊接並附著於框架200上,從而可維持拉緊的狀態[自身向周邊的掩模單元片材部220施加張力TS的狀態]。因此,掩模100以拉緊的狀態附著於框架200上,因此不會發生皺紋、變形等。據此,可具有減少掩模100的對準誤差、單元C間的PPA誤差的效果。The tensile force IT acting on the mask 100 is released when the template 50 is separated from the mask 100 , and thus can be converted into tension TS that tightens both sides of the mask 100 . In other words, the mask 100 is in a state of being stretched to a length greater than the original lowering temperature T2 of the mask 100 and pasted to the template 5, and is welded and attached to the frame 200 as it is in this state, thereby The tensioned state [the state in which the tension TS is applied to the surrounding mask unit sheet portion 220 by itself] can be maintained. Accordingly, the mask 100 is attached to the frame 200 in a tensioned state, so that wrinkles, deformation, etc. do not occur. Accordingly, there is an effect of reducing the alignment error of the mask 100 and the PPA error between the cells C.

圖11是根據本發明的一實施例的掩模100附著於框架200的狀態的示意圖。圖11顯示將所有掩模100附著於框架200的單元區域CR的狀態。可一一附著掩模100後再分離模板50,也可以附著所有掩模100後再分離所有模板50。FIG. 11 is a schematic diagram of a state where a mask 100 is attached to a frame 200 according to an embodiment of the present invention. FIG. 11 shows a state where all the masks 100 are attached to the cell region CR of the frame 200. Referring to FIG. The template 50 may be separated after attaching the masks 100 one by one, or all the templates 50 may be separated after attaching all the masks 100 .

現有的圖1的掩模10由於包括6個單元C1~C6從而具有較長的長度,相反,本發明的掩模100由於包括1個單元C從而具有較短的長度,因此像素位置精度(pixel position accuracy,PPA)發生扭曲的程度可能會減小。而且,本發明由於只需對應掩模100的一個單元C並確認對準狀態即可,因此相比於需要同時對應多個單元C(C1~C6)並確認所有的對準狀態的現有方法[參照圖1],能夠顯著地縮短製造時間。The existing mask 10 in FIG. 1 has a relatively long length because it includes 6 units C1 to C6. On the contrary, the mask 100 of the present invention has a short length because it includes 1 unit C. Therefore, the pixel position accuracy (pixel position accuracy, PPA) may be less distorted. Moreover, since the present invention only needs to correspond to one unit C of the mask 100 and confirm the alignment state, it is compared with the existing method that needs to correspond to multiple units C (C1-C6) and confirm all the alignment states at the same time[ Referring to Fig. 1], the manufacturing time can be significantly shortened.

如果每個掩模100均附著在對應的掩模單元區域CR上之後,分離模板50與掩模100,則由於多個掩模100施加向相反的方向收縮的張力TS,所述張力相互抵消,因此掩模單元片材部220上不會發生變形。例如,在CR11單元區域上附著的掩模100與CR12單元區域上附著的掩模100之間的第一柵格片材部223中,附著在CR11單元區域上的掩模100向右側方向作用的張力TS與附著在CR12單元區域上的掩模100向左側方向作用的張力TS可相互抵消。因此,通過最小化框架200[或者掩模單元片材部220]因張力TS發生的變形,從而具有可最小化掩模100[或者掩模圖案P]的對準誤差的優點。If the template 50 and the mask 100 are separated after each mask 100 is attached to the corresponding mask unit region CR, since the plurality of masks 100 apply tensions TS that shrink in opposite directions, the tensions cancel each other out, Therefore, deformation does not occur on the mask unit sheet portion 220 . For example, in the first grid sheet part 223 between the mask 100 attached to the CR11 cell area and the mask 100 attached to the CR12 cell area, the mask 100 attached to the CR11 cell area acts in the right direction. The tension TS and the tension TS acting in the left direction of the mask 100 attached to the CR12 cell area can cancel each other out. Therefore, by minimizing the deformation of the frame 200 [or the mask unit sheet portion 220 ] due to the tension TS, there is an advantage that an alignment error of the mask 100 [or the mask pattern P] can be minimized.

圖12是根據本發明一實施例的利用框架一體型掩模100、200的OLED像素沉積裝置1000的示意圖。12 is a schematic diagram of an OLED pixel deposition apparatus 1000 using frame-integrated masks 100, 200 according to an embodiment of the present invention.

參照圖12,OLED像素沉積裝置1000包括:磁板300,其容納有磁體310,並且佈置有冷卻水管350;沉積源供給部500,其從磁板300的下部供給有機物原料600。Referring to FIG. 12 , the OLED pixel deposition apparatus 1000 includes: a magnetic plate 300 containing a magnet 310 and arranged with a cooling water pipe 350 ;

磁板300與沉積源供給部500之間可以插入有用於沉積有機物源600的玻璃等目標基板900。目標基板900上可以以緊貼或非常接近的方式配置有使有機物源600按不同像素沉積的框架一體型掩模100、200(或者FMM)。磁體310可以產生磁場,並通過磁場緊貼到目標基板900上。A target substrate 900 such as glass for depositing the organic substance source 600 may be inserted between the magnetic plate 300 and the deposition source supply unit 500 . The frame-integrated masks 100 and 200 (or FMMs) for depositing the organic source 600 in different pixels may be placed on the target substrate 900 in close contact or very close to each other. The magnet 310 can generate a magnetic field, and be closely attached to the target substrate 900 through the magnetic field.

沉積源供給部500可以往返左右路徑並供給有機物源600,由沉積源供給部500供給的有機物源600可以通過形成於框架一體型掩模100、200的圖案P附著到目標基板900的一側。通過框架一體型掩模100、200的圖案P後沉積的有機物源600,可以用作OLED的像素700。The deposition source supply unit 500 can reciprocate the left and right paths and supply the organic source 600 , and the organic source 600 supplied by the deposition source supply unit 500 can be attached to one side of the target substrate 900 through the pattern P formed on the frame-integrated masks 100 and 200 . The organic source 600 deposited after passing through the pattern P of the frame-integrated masks 100 and 200 can be used as the pixel 700 of the OLED.

為了防止由於陰影效應(Shadow Effect)發生的像素700的不均勻沉積,框架一體型掩模100、200的圖案可以傾斜地形成S(或者以錐形S形成)。沿著傾斜表面,在對角線方向上通過圖案的有機物源600,也可以有助於像素700的形成,因此,能夠整體上厚度均勻地沉積像素700。In order to prevent uneven deposition of the pixels 700 due to shadow effects, the patterns of the frame-integrated masks 100 and 200 may be formed obliquely S (or formed in a tapered shape S). Along the inclined surface, the patterned organic source 600 passing in a diagonal direction may also contribute to the formation of the pixel 700, and thus, the pixel 700 can be deposited uniformly in thickness as a whole.

如上所述,本發明列舉了優選實施例進行圖示和說明,但是不限於上述實施例,在不脫離本發明的精神的範圍內,本領域技術人員能夠進行各種變形和變更。這種變形及變更均落在本發明和所附的申請專利範圍的範圍內。As described above, the present invention has been illustrated and described with preferred embodiments, but is not limited to the above embodiments, and various modifications and changes can be made by those skilled in the art without departing from the spirit of the present invention. Such modifications and changes all fall within the scope of the present invention and the scope of the appended patent applications.

50:模板 51:雷射通過孔 55,65:臨時黏合部 60,60':模板支撐部 100:掩模 110:掩模膜;掩模金屬膜 200:框架 210:邊緣框架部 220:掩模單元片材部 221:邊緣片材部 223:第一柵格片材部 225:第二柵格片材部 C:單元;掩模單元 CR:掩模單元區域 DM:虛設部;掩模虛設部 L:雷射 P:掩模圖案 WB:焊珠50:Template 51:Laser through the hole 55,65: Temporary bonding part 60,60': formwork support 100: mask 110: mask film; mask metal film 200: frame 210: Edge frame part 220: Mask unit sheet department 221: Edge sheet department 223:The first grid sheet part 225: Second grid sheet part C: unit; mask unit CR: mask cell area DM: dummy part; mask dummy part L: Laser P: mask pattern WB: welding bead

圖1是現有的將掩模附著於框架的過程的示意圖。 圖2是根據本發明一實施例的框架一體型掩模的主視圖及側截面圖。 圖3是根據本發明的一實施例的掩模和根據比較例的掩模支撐模板的示意性俯視圖及側截面圖。 圖4是將根據比較例的掩模支撐模板裝載至框架上的過程的示意圖。 圖5至圖6是根據本發明一實施例的掩模支撐模板的製造過程的示意圖。 圖7是根據本發明另一實施例的模板支撐部的示意圖。 圖8是根據本發明一實施例的將掩模支撐模板裝載至框架上的過程的示意圖。 圖9是根據本發明一實施例的將模板裝載至框架上並使掩模對應框架單元區域的狀態的示意圖。 圖10是根據本發明一實施例的將掩模附著到框架上之後並剝離掩模和模板的過程的示意圖。 圖11是根據本發明一實施例的將掩模裝載至框架的狀態的示意圖。 圖12是根據本發明一實施例的利用框架一體型掩模的OLED像素沉積裝置的示意圖。FIG. 1 is a schematic diagram of a conventional process for attaching a mask to a frame. 2 is a front view and a side sectional view of a frame-integrated mask according to an embodiment of the present invention. 3 is a schematic top view and side sectional view of a mask according to an embodiment of the present invention and a mask supporting template according to a comparative example. FIG. 4 is a schematic diagram of a process of loading a mask supporting template according to a comparative example onto a frame. 5 to 6 are schematic views of a manufacturing process of a mask supporting template according to an embodiment of the present invention. Fig. 7 is a schematic diagram of a template support part according to another embodiment of the present invention. FIG. 8 is a schematic diagram of a process of loading a mask support template onto a frame according to an embodiment of the present invention. FIG. 9 is a schematic diagram of a state in which a template is loaded onto a frame and the mask corresponds to a frame unit area according to an embodiment of the present invention. 10 is a schematic diagram of a process of peeling off the mask and stencil after attaching the mask to the frame according to an embodiment of the present invention. FIG. 11 is a schematic diagram of a state in which a mask is loaded to a frame according to an embodiment of the present invention. 12 is a schematic diagram of an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.

50:模板 50:Template

51:雷射通過孔 51:Laser through the hole

55,65:臨時黏合部 55,65: Temporary bonding part

60:模板支撐部 60: formwork support

64:槽 64: slot

110:掩模膜;掩模金屬膜 110: mask film; mask metal film

T1:溫度 T1: temperature

Claims (12)

一種支撐有掩模的模板的製造方法,該模板用於支撐OLED像素形成用掩模並將掩模對應到框架上,該方法包括:(a)將模板插入模板支撐部上形成的槽的步驟;(b)在模板和模板支撐部的至少一面上黏貼掩模金屬膜的步驟;以及(c)在掩模金屬膜上形成掩模圖案,並切除掩模金屬膜邊緣以製造與模板相同尺寸的掩模的步驟,在步驟(a)中,在模板支撐部的槽的至少一部分形成臨時黏合部,並將插入的模板黏貼並固定,在步驟(c)之後,使形成於模板支撐部的槽中的臨時黏合部的黏合力減弱,以使模板從模板支撐部分離,在步驟(c)之後,從模板支撐部分離模板的同時,亦從模板支撐部分離黏貼在模板的一面上的掩模。 A method of manufacturing a template supporting a mask for supporting a mask for OLED pixel formation and corresponding the mask to a frame, the method comprising: (a) a step of inserting the template into a groove formed on the template support portion (b) a step of sticking a mask metal film on at least one side of the template and the template support; and (c) forming a mask pattern on the mask metal film, and cutting off the edge of the mask metal film to manufacture the same size as the template The step of the mask, in the step (a), at least a part of the groove of the template support part forms a temporary adhesive part, and sticks and fixes the inserted template, and after the step (c), the formed on the template support part The adhesive force of the temporary bonding part in the groove is weakened so that the template is separated from the template support part. After step (c), when the template is separated from the template support part, the mask stuck on one side of the template is also separated from the template support part. mold. 如請求項1所述的支撐有掩模的模板的製造方法,其中,在步驟(a)和步驟(b)之間包括提升工藝溫度的步驟,在步驟(b)與步驟(c)之間或步驟(c)之後,還包括降低工藝溫度的步驟。 The method for manufacturing a template supporting a mask as claimed in claim 1, wherein, between step (a) and step (b), a step of raising the process temperature is included, and between step (b) and step (c) Or after step (c), it also includes the step of lowering the process temperature. 如請求項2所述的支撐有掩模的模板的製造方法,其中,如果提升工藝溫度並將掩模金屬膜黏貼在模板上,之後再降低工藝溫度,則模板的收縮小於掩模的收縮,從而掩模被施以側面方向的拉伸力。 The method of manufacturing a template supporting a mask as described in Claim 2, wherein if the process temperature is increased and the mask metal film is attached to the template, and then the process temperature is lowered, the shrinkage of the template is smaller than that of the mask , so that the mask is subjected to a tensile force in the side direction. 如請求項1所述的支撐有掩模的模板的製造方法,其中,模板和模板支撐部的熱膨脹係數小於掩模的熱膨脹係數。 The method of manufacturing a template supporting a mask as claimed in claim 1, wherein the thermal expansion coefficient of the template and the template support portion is smaller than that of the mask. 如請求項1所述的支撐有掩模的模板的製造方法,其中,在步驟(b)中,在對應於掩模金屬膜的模板和模板支撐部的一面上形成臨時黏合部。 The method of manufacturing a mask-supported stencil according to claim 1, wherein, in the step (b), a temporary bonding portion is formed on one side of the stencil and the stencil support portion corresponding to the mask metal film. 如請求項1所述的支撐有掩模的模板的製造方法,其中,在步 驟(a)中,在模板支撐部的槽上形成臨時黏合部,並且模板的另一面通過中間夾設臨時黏合部來黏貼在模板支撐部上。 The method for manufacturing a mask-supported template as claimed in claim 1, wherein, in step In step (a), a temporary adhesive part is formed on the groove of the template support part, and the other side of the template is pasted on the template support part by interposing the temporary adhesive part in the middle. 如請求項5或者6所述的支撐有掩模的模板的製造方法,其中,臨時黏合部為基於加熱可分離的黏合劑、基於UV照射可分離的黏合劑。 The method of manufacturing a mask-supported template according to claim 5 or 6, wherein the temporary adhesive part is an adhesive detachable by heating or an adhesive detachable by UV irradiation. 如請求項1所述的支撐有掩模的模板的製造方法,其中,在步驟(a)中,還進行位置調整,從而使模板和模板支撐部對準。 The method of manufacturing a mask-supporting template according to Claim 1, wherein in step (a), position adjustment is further performed so that the template and the template support are aligned. 如請求項1所述的支撐有掩模的模板的製造方法,其中,在步驟(a)之後,為了使模板和模板支撐部的一面的高度一致而進行平坦化工藝。 The method for manufacturing a mask-supported template as claimed in claim 1, wherein after step (a), a planarization process is performed to make the template and one side of the template support part have the same height. 如請求項1所述的支撐有掩模的模板的製造方法,其中,模板支撐部包括底板及連接於底板的一面邊緣且具有中空區域的框板,中空區域對應模板支撐部的槽。 The manufacturing method of a template supporting a mask according to Claim 1, wherein the template support part includes a base plate and a frame plate connected to one edge of the base plate and having a hollow area, and the hollow area corresponds to the groove of the template support part. 一種框架一體型掩模的製造方法,所述框架一體型掩模由至少一個掩模和用於支撐掩模的框架一體形成,該方法包括:(a)將模板插入模板支撐部上形成的槽的步驟;(b)在模板和模板支撐部的至少一面上黏貼掩模金屬膜的步驟;(c)在掩模金屬膜上形成掩模圖案,並切除掩模金屬膜邊緣以製造與模板相同尺寸的掩模的步驟;(d)在具有至少一個掩模單元區域的框架上裝載模板,使掩模與框架的掩模單元區域對應的步驟;以及(e)將掩模附著於框架的步驟,在步驟(a)中,在模板支撐部的槽的至少一部分形成臨時黏合部,並將插入的模板黏貼並固定,在步驟(c)之後,使形成於模板支撐部的槽中的臨時黏合部的黏合力減弱,以使模板從模板支撐部分離, 在步驟(c)之後,從模板支撐部分離模板的同時,亦從模板支撐部分離黏貼在模板的一面上的掩模。 A method of manufacturing a frame-integrated mask integrally formed of at least one mask and a frame for supporting the mask, the method comprising: (a) inserting a template into a groove formed on a template support portion (b) a step of sticking a mask metal film on at least one side of the template and the template support; (c) forming a mask pattern on the mask metal film, and cutting off the edge of the mask metal film to make the same as the template the step of the mask of the size; (d) the step of loading the template on the frame having at least one mask unit area so that the mask corresponds to the mask unit area of the frame; and (e) the step of attaching the mask to the frame , in step (a), at least a part of the groove of the template support part forms a temporary bonding part, and pastes and fixes the inserted template, and after step (c), makes the temporary bonding part formed in the groove of the template support part The adhesive force of the part is weakened so that the formwork is separated from the formwork support part, After step (c), when the template is separated from the template support part, the mask stuck on one side of the template is also separated from the template support part. 一種框架一體型掩模的製造方法,所述框架一體型掩模由至少一個掩模和用於支撐掩模的框架一體形成,該方法包括:(a)在具有至少一個掩模單元區域的框架上裝載基於請求項1所述的製造方法製造的支撐有掩模的模板,並使掩模與框架的掩模單元區域對應的步驟;以及(b)將掩模附著於框架的步驟。 A method for manufacturing a frame-integrated mask, wherein the frame-integrated mask is integrally formed by at least one mask and a frame for supporting the mask, the method comprising: (a) forming a frame with at least one mask unit area a step of loading the mask-supporting template manufactured based on the manufacturing method described in claim 1, and making the mask correspond to the mask unit area of the frame; and (b) a step of attaching the mask to the frame.
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