KR20200020652A - Mask integrated frame and producing method thereof - Google Patents

Abstract

The present invention relates to a frame-integrated mask and a manufacturing method thereof. According to the present invention, the frame-integrated mask is a frame-integrated mask in which a plurality of masks and a frame supporting the mask are integrally formed. The frame includes: an edge frame portion including a hollow region; and a mask cell sheet portion having a plurality of mask cell regions and connected to the edge frame portion. Each mask is connected to an upper part of the mask cell sheet portion. The mask includes: a mask cell in which a plurality of mask patterns are formed; and a dummy around the mask cell. A plurality of welding portions are formed at intervals on at least part of the dummy. At least part of the dummy where the welding portion is formed is thicker than the thickness of the mask cell.

Description

Frame integrated mask and manufacturing method {MASK INTEGRATED FRAME AND PRODUCING METHOD THEREOF}

The present invention relates to a frame integrated mask and a method of manufacturing the same. More specifically, a frame-integrated mask and its manufacture capable of stably supporting and moving without deformation of the mask, stably attaching the mask to the frame, and making alignment between the masks clear It is about a method.

Recently, studies on electroforming methods have been underway in thin plate manufacturing. The electroplating method is to immerse the positive electrode and the negative electrode in the electrolyte, and to apply the power to electrodeposit the metal thin plate on the surface of the negative electrode, it is possible to manufacture the ultra-thin plate, it is a method that can be expected to mass production.

Meanwhile, as a technology of forming pixels in an OLED manufacturing process, a fine metal mask (FMM) method of depositing an organic material at a desired position by closely attaching a thin metal mask to a substrate is mainly used.

In the conventional OLED manufacturing process, the mask is manufactured in the form of a stick, a plate, and the like, and then the mask is welded and fixed to the OLED pixel deposition frame. Each mask may include a plurality of cells corresponding to one display. In addition, in order to manufacture a large area OLED, several masks may be fixed to the OLED pixel deposition frame. In the process of fixing to the frame, each mask is tensioned to be flat. Adjusting the tension to make the entire part of the mask flat is a very difficult task. In particular, in order to align the mask pattern having a size of only a few to several tens of micrometers while flattening each cell, a high-level operation of checking the alignment in real time while finely adjusting the tension applied to each side of the mask is required. do.

Nevertheless, in the process of fixing several masks in one frame, there is a problem in that the alignment between the mask cells and the mask cells is not good. In addition, since the thickness of the mask film is too thin and large in the process of welding the mask to the frame, the mask may be squeezed or distorted due to the load, wrinkles, burrs, etc. generated in the welded part in the welding process. There was a problem of misalignment.

In the case of ultra-high-definition OLED, QHD image quality is 500 ~ 600 pixel per inch (PPI), and the pixel size is about 30 ~ 50㎛, and 4K UHD, 8K UHD high definition is higher than 860 PPI, ~ 1600 PPI, etc. It has a resolution of. As such, in consideration of the pixel size of the ultra-high-definition OLED, the alignment error between the cells must be reduced to several μm, and the error beyond this can lead to product failure, resulting in a very low yield. Therefore, there is a need for development of a technique for preventing deformation, such as knocking or twisting of a mask and making alignment clear, a technique for fixing a mask to a frame, and the like.

Accordingly, an object of the present invention is to provide a frame-integrated mask and a method of manufacturing the same, which are devised to solve the above-mentioned problems of the prior art, which can form an integral structure of a mask and a frame.

It is also an object of the present invention to provide a frame-integrated mask and a method of manufacturing the same, which can prevent deformation such as knocking or twisting of the mask and to clarify the alignment.

In addition, an object of the present invention is to provide a frame-integrated mask and a method of manufacturing the same, which significantly reduce the production time and significantly increase the yield.

The above object of the present invention is a frame-integrated mask in which a plurality of masks and a frame for supporting the mask are integrally formed, the frame comprising: an edge frame portion including a hollow region; A mask cell sheet portion having a plurality of mask cell regions and connected to an edge frame portion, each mask is connected to an upper portion of the mask cell sheet portion, and the mask is a mask cell having a plurality of mask patterns formed thereon, and a mask cell periphery; And a plurality of welds formed at intervals on at least a portion of the pile, wherein at least a portion of the pile on which the welds are formed is thicker than the thickness of the mask cell.

The mask cell sheet portion includes an edge sheet portion; At least one first grid sheet portion extending in a first direction and connected at both ends to the edge sheet portion; And at least one second grid sheet portion extending in a second direction perpendicular to the first direction and intersecting with the first grid sheet portion, and both ends connected to the edge sheet portion.

Each mask may correspond to each mask cell region.

The mask and frame may be made of any one of invar, super invar, nickel, and nickel-cobalt.

One surface of the mask connected to the mask cell sheet part may be flat, and at least a portion of the dummy may be bent or formed on the other surface opposite to the surface of the mask.

In addition, the above object of the present invention, a method of manufacturing a frame-integrated mask formed integrally with at least one mask and a frame for supporting the mask, (a) preparing a frame having at least one mask cell area; (b) loading the mask-attached template onto the frame to correspond to the mask cell area of the frame; And (c) attaching the mask to the frame, the mask including a mask cell having a plurality of mask patterns formed thereon, and a dummy around the mask cell, wherein the plurality of welds are formed at least a portion of the dummy at intervals; At least a part of the dummy in which the weld is formed is achieved by a method of manufacturing a frame-integrated mask, which is thicker than the thickness of the mask cell.

According to the present invention configured as described above, there is an effect that can be stably attached to the mask and the frame.

In addition, according to the present invention, there is an effect capable of stably supporting and moving the mask without deformation.

In addition, according to the present invention, when attaching the mask to the frame, there is an effect that can improve the adhesion between the mask and the frame.

In addition, according to the present invention, there is an effect that can be used repeatedly after the mask is attached to the frame.

In addition, according to the present invention, there is an effect that the mask and the frame can form an integrated structure.

In addition, according to the present invention, there is an effect that can prevent the deformation, such as knocking or twisting the mask and to clarify the alignment.

In addition, according to the present invention, there is an effect that can significantly reduce the production time, significantly increasing the yield.

1 is a schematic view showing a conventional mask for OLED pixel deposition.
2 is a schematic diagram illustrating a process of attaching a conventional mask to a frame.
3 is a schematic view showing that alignment errors between cells occur in the process of tensioning a conventional mask.
4 is a front and side cross-sectional view showing a frame-integrated mask according to an embodiment of the present invention.
5 is a front and side cross-sectional view showing a frame according to an embodiment of the present invention.
6 is a schematic diagram illustrating a manufacturing process of a frame according to an embodiment of the present invention.
7 is a schematic diagram illustrating a manufacturing process of a frame according to another embodiment of the present invention.
8 is a schematic diagram illustrating a process of manufacturing a mask metal film according to an embodiment of the present invention.
9 is a schematic diagram illustrating a mask for forming a conventional high resolution OLED.
10 is a schematic diagram illustrating a mask according to an embodiment of the present invention.
11 to 12 are schematic views illustrating a process of manufacturing a mask support template by adhering a mask metal film on a template and forming a mask according to an embodiment of the present invention.
13 is a schematic diagram illustrating a process of loading a mask support template on a frame according to an embodiment of the present invention.
14 is a schematic diagram illustrating a state in which a template is loaded onto a frame and the mask corresponds to a cell region of the frame according to an embodiment of the present invention.
15 is a schematic diagram illustrating a process of separating a mask and a template after attaching a mask to a frame according to an embodiment of the present invention.
16 is a schematic diagram illustrating a state in which a mask is attached to a frame according to an embodiment of the present invention.
17 is a schematic diagram illustrating an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION The following detailed description of the invention refers to the accompanying drawings that show, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It is to be understood that the various embodiments of the invention are different but need not be mutually exclusive. For example, certain shapes, structures, and characteristics described herein may be embodied in other embodiments without departing from the spirit and scope of the invention with respect to one embodiment. In addition, it is to be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims, along with the full scope of equivalents to which such claims are entitled. In the drawings, like reference numerals refer to the same or similar functions throughout the several aspects, and length, area, thickness, and the like may be exaggerated for convenience.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention.

1 is a schematic diagram showing a conventional mask for OLED pixel deposition 10.

Referring to FIG. 1, the mask 10 may be manufactured in a stick type or a plate type. The mask 10 shown in FIG. 1A is a stick type mask, and both sides of the stick may be welded and fixed to the OLED pixel deposition frame. The mask 100 illustrated in FIG. 1B is a plate-type mask and may be used in a large area pixel forming process.

A plurality of display cells C are provided in the body (or mask film 11) of the mask 10. One cell C corresponds to one display such as a smartphone. In the cell C, a pixel pattern P is formed to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B appear. For example, the pixel pattern P is formed in the cell C to have a resolution of 70 × 140. That is, a large number of pixel patterns P may be clustered to form one cell C, and a plurality of cells C may be formed in the mask 10.

2 is a schematic diagram illustrating a process of attaching a conventional mask 10 to a frame 20. 3 is a schematic view showing that alignment errors between cells occur in the process of tensioning the mask 10 (F1 to F2). A stick mask 10 having six cells C: C1 to C6 shown in FIG. 1A will be described as an example.

Referring to FIG. 2A, first, the stick mask 10 should be flattened. The stick mask 10 is unfolded as the tensile force F1 to F2 is applied in the major axis direction of the stick mask 10 and pulled. In this state, the stick mask 10 is loaded onto the frame 20 having a rectangular frame shape. The cells C1 to C6 of the stick mask 10 are positioned in the empty area of the frame 20 of the frame 20. The frame 20 may be large enough so that the cells C1 to C6 of one stick mask 10 are located in an empty area inside the frame, and the cells C1 to C6 of the plurality of stick masks 10 are framed. It may also be large enough to fit inside the empty area.

Referring to (b) of FIG. 2, after aligning while finely adjusting the tensile forces F1 to F2 applied to each side of the stick mask 10, a part of the side surface of the stick mask 10 is welded (W). Accordingly, the stick mask 10 and the frame 20 are interconnected. 2 (c) shows the side surface of the stick mask 10 and the frame connected to each other.

Referring to FIG. 3, in spite of finely adjusting the tensile forces F1 to F2 applied to each side of the stick mask 10, problems of misalignment of the mask cells C1 to C3 appear. For example, the distances D1 to D1 ″ and D2 to D2 ″ may be different from each other or the patterns P may be skewed between the patterns P of the cells C1 to C3. The stick mask 10 is a large area including a plurality of (eg, six) cells C1 to C6 and has a very thin thickness on the order of tens of micrometers, and thus is easily struck or warped by a load. In addition, it is very difficult to check the alignment between the cells C1 to C6 in real time through a microscope while adjusting the tensile forces F1 to F2 to flatten each of the cells C1 to C6.

Therefore, the minute error of the tensile force (F1 ~ F2) may cause an error in the extent that the cells (C1 ~ C3) of the stick mask 10 is extended or unfolded, and thus the distance (D1) between the mask pattern (P) ~ D1 ", D2-D2") cause a problem that becomes different. Of course, it is difficult to perfectly align the error to 0, but in order that the mask pattern P having a size of several to several tens of micrometers does not adversely affect the pixel process of the ultra-high definition OLED, the alignment error does not exceed 3 micrometers. It is preferable not to. This alignment error between adjacent cells is referred to as pixel position accuracy (PPA).

In addition, between the plurality of stick masks 10 and the plurality of cells C of the stick masks 10 while connecting the plurality of stick masks 10 of about 6 to 20 to each of the frames 20, respectively. It is also very difficult to clarify the alignment between ~ C6), and the process time due to alignment is inevitably increased, which is a significant reason for reducing productivity.

On the other hand, after fixing the stick mask 10 to the frame 20, the tensile force (F1 ~ F2) applied to the stick mask 10 may act inversely to the frame 20. That is, the stick mask 10, which is stretched by the tension forces F1 to F2, may be tensioned to the frame 20 after being connected to the frame 20. In general, the tension may not be large and may not have a large influence on the frame 20. However, when the size of the frame 20 is miniaturized and the rigidity is low, the tension may slightly change the frame 20. Thus, a problem may arise in that the alignment state is changed between the plurality of cells C to C6.

Accordingly, the present invention proposes a frame 200 and a frame integrated mask that allow the mask 100 to form an integrated structure with the frame 200. The mask 100 integrally formed in the frame 200 may be prevented from being deformed or warped, and may be clearly aligned with the frame 200. Since no tensile force is applied to the mask 100 when the mask 100 is connected to the frame 200, the tension may not be applied to the frame 200 after the mask 100 is connected to the frame 200. . In addition, the manufacturing time for integrally connecting the mask 100 to the frame 200 may be significantly reduced, and the yield may be significantly increased.

4 is a front view (FIG. 4 (a)) and a side cross-sectional view (FIG. 4 (b)) showing a frame-integrated mask according to an embodiment of the present invention, Figure 5 is according to an embodiment of the present invention It is a front view (FIG. 5 (a)) and a side sectional view (FIG. 5 (b)) which show a frame.

4 and 5, the frame integrated mask may include a plurality of masks 100 and one frame 200. In other words, the plurality of masks 100 are attached to the frame 200 one by one. Hereinafter, for convenience of description, the rectangular mask 100 will be described as an example, but the masks 100 may be in the form of a stick mask having protrusions clamped at both sides before being attached to the frame 200, and the frame 200. The protrusions can be removed after attachment.

A plurality of mask patterns P may be formed in each mask 100, and one cell C may be formed in one mask 100. One mask cell C may correspond to one display such as a smartphone. In order to form a thin thickness, the mask 100 may be formed by electroforming. The mask 100 may be an invar having a thermal expansion coefficient of about 1.0 × 10 ⁻⁶ / ° C. and a super invar material having about 1.0 × 10 ⁻⁷ / ° C. Since the mask 100 of this material has a very low coefficient of thermal expansion, there is little possibility that the pattern shape of the mask is deformed by thermal energy, and thus, the mask 100 may be used as a fine metal mask (FMM) or a shadow mask in high-resolution OLED manufacturing. In addition, in consideration of the recent development of techniques for performing the pixel deposition process in a range where the temperature change is not large, the mask 100 has a slightly larger thermal expansion coefficient than that of nickel (Ni) and nickel-cobalt (Ni-Co). It may be a material such as). The mask may have a thickness of about 2 μm to 50 μm.

The frame 200 is formed to attach the plurality of masks 100. The frame 200 may include various edges formed in a first direction (eg, a horizontal direction) and a second direction (eg, a vertical direction) including an outermost edge. These various corners may define the area on which the mask 100 is to be attached on the frame 200.

The frame 200 may include an edge frame portion 210 having a substantially rectangular shape and a rectangular frame shape. The inside of the frame frame 210 may be hollow. That is, the frame frame 210 may include a hollow region (R). The frame 200 may be made of a metal material such as Invar, Super Invar, Aluminum, Titanium, etc., and may be made of Inbar, Super Invar, Nickel, or Nickel-Cobalt having the same thermal expansion coefficient as a mask in consideration of thermal deformation. Preferably, the materials may be applied to both the edge frame portion 210 and the mask cell sheet portion 220 which are components of the frame 200.

In addition, the frame 200 may include a plurality of mask cell regions CR and may include a mask cell sheet portion 220 connected to the edge frame portion 210. Like the mask 100, the mask cell sheet part 220 may be formed by electroplating or may be formed using another film forming process. In addition, the mask cell sheet part 220 may be connected to the edge frame part 210 after forming a plurality of mask cell areas CR through laser scribing, etching, etc. on a flat sheet. Alternatively, the mask cell sheet unit 220 may form a plurality of mask cell regions CR through laser scribing, etching, etc. after connecting the planar sheet to the edge frame unit 210. In the present specification, a plurality of mask cell regions CR are first formed in the mask cell sheet part 220, and then the main parts of the mask cell sheet part 220 are connected to the edge frame part 210.

The mask cell sheet unit 220 may include at least one of the edge sheet unit 221 and the first and second grid sheet units 223 and 225. The edge sheet portion 221 and the first and second grid sheet portions 223 and 225 refer to respective portions partitioned from the same sheet, which are integrally formed with each other.

The edge sheet portion 221 may be substantially connected to the edge frame portion 210. Accordingly, the edge sheet part 221 may have a substantially rectangular shape and a rectangular frame shape corresponding to the edge frame part 210.

In addition, the first grid sheet part 223 may extend in a first direction (horizontal direction). The first grid sheet part 223 may be formed in a straight line shape and both ends thereof may be connected to the edge sheet part 221. When the mask cell sheet portion 220 includes a plurality of first grid sheet portions 223, each of the first grid sheet portions 223 may be equally spaced apart.

In addition, in addition, the second grid sheet part 225 may be formed to extend in a second direction (vertical direction). The second grid sheet part 225 may be formed in a straight line shape and both ends thereof may be connected to the edge sheet part 221. The first grid sheet part 223 and the second grid sheet part 225 may vertically cross each other. When the mask cell sheet portion 220 includes a plurality of second grid sheet portions 225, each of the second grid sheet portions 225 may be equally spaced apart.

Meanwhile, the spacing between the first grid sheet portions 223 and the spacing between the second grid sheet portions 225 may be the same or different according to the size of the mask cell C. FIG.

The first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, but the shape of the cross section perpendicular to the longitudinal direction may be rectangular, square shape such as trapezoid, triangular shape, or the like. The edges and corners may be partially rounded. The cross-sectional shape is adjustable in the process of laser scribing, etching and the like.

The thickness of the edge frame portion 210 may be thicker than the thickness of the mask cell sheet portion 220. The edge frame part 210 may be formed to a thickness of several mm to several cm because it is responsible for the overall rigidity of the frame 200.

In the case of the mask cell sheet part 220, a process of manufacturing a substantially thick sheet is difficult, and if the thickness is too thick, a path through which the organic source 600 (see FIG. 17) passes through the mask 100 in the OLED pixel deposition process. This can cause problems. On the contrary, if the thickness is too thin, it may be difficult to secure rigidity enough to support the mask 100. Accordingly, the mask cell sheet portion 220 is thinner than the thickness of the edge frame portion 210, but preferably thicker than the mask 100. The mask cell sheet part 220 may have a thickness of about 0.1 mm to about 1 mm. In addition, the widths of the first and second grid sheet parts 223 and 225 may be formed to about 1 to 5 mm.

A plurality of mask cell areas CR: CR11 to CR56 may be provided except for an area occupied by the edge sheet part 221 and the first and second grid sheet parts 223 and 225 in the planar sheet. In another aspect, the mask cell region CR is a region occupied by the edge sheet portion 221 and the first and second grid sheet portions 223 and 225 in the hollow region R of the edge frame portion 210. Except for, it may mean an empty area.

As the cell C of the mask 100 corresponds to the mask cell region CR, the mask C may be used as a passage through which the pixels of the OLED are deposited through the mask pattern P. FIG. As described above, one mask cell C corresponds to one display such as a smartphone. Mask patterns P that form one cell C may be formed in one mask 100. Alternatively, one mask 100 may include a plurality of cells C and each cell C may correspond to each cell region CR of the frame 200. It is necessary to avoid the large area mask 100, and the small area mask 100 provided with one cell C is preferable. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell region CR of the frame 200. In this case, for the sake of clear alignment, it may be considered to correspond to the mask 100 having a few cells C of about 2-3.

The frame 200 may include a plurality of mask cell regions CR, and each mask 100 may be attached such that one mask cell C corresponds to the mask cell region CR. Each mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy (corresponding to a portion of the mask film 110 except for the cell C) around the mask cell C. have. The dummy may include only the mask film 110 or the mask film 110 having a predetermined dummy pattern having a similar shape to the mask pattern P. FIG. The mask cell C corresponds to the mask cell region CR of the frame 200, and part or all of the dummy may be attached to the frame 200 (mask cell sheet portion 220). Accordingly, the mask 100 and the frame 200 may form an integrated structure.

On the other hand, according to another embodiment, the frame is not manufactured by attaching the mask cell sheet portion 220 to the border frame portion 210, the border frame portion 210 in the hollow region (R) portion of the border frame portion 210 ), A frame in which a grid frame (corresponding to the grid sheet portions 223 and 225) which is integral with the frame) is formed immediately. The frame of this type also includes at least one mask cell region CR, and the mask integrated region may be manufactured by corresponding the mask 100 to the mask cell region CR.

Hereinafter, the process of manufacturing a frame integrated mask is demonstrated.

First, the frame 200 described above with reference to FIGS. 4 and 5 may be provided. 6 is a schematic diagram illustrating a manufacturing process of the frame 200 according to an embodiment of the present invention.

Referring to FIG. 6A, an edge frame unit 210 is provided. The edge frame portion 210 may have a rectangular frame shape including the hollow area R.

Next, referring to FIG. 6B, a mask cell sheet part 220 is manufactured. The mask cell sheet unit 220 may be manufactured by fabricating a flat sheet using pre-plating or other film forming process, and then removing the mask cell region CR through laser scribing or etching. have. In the present specification, a description is given taking an example of forming a 6 × 5 mask cell region (CR: CR11 to CR56). There may be five first grid sheet portions 223 and four second grid sheet portions 225.

Next, the mask cell sheet part 220 may correspond to the edge frame part 210. In the corresponding process, all the sides of the mask cell sheet part 220 are stretched (F1 to F4), and the edge sheet part 221 is connected to the edge frame part 210 while the mask cell sheet part 220 is flattened. It can respond. On one side, the mask cell sheet part 220 may be grasped and tensioned at various points (for example, 1 to 3 points in FIG. 6B). On the other hand, the mask cell sheet portion 220 may be stretched (F1, F2) not in all sides but in some lateral direction.

Next, when the mask cell sheet portion 220 corresponds to the edge frame portion 210, the edge portion sheet 221 of the mask cell sheet portion 220 may be welded (W) and attached. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 can be firmly attached to the edge frame portion 220. Welding (W) should be performed as close as possible to the edge of the edge frame portion 210 as much as possible to reduce the excited space between the edge frame portion 210 and the mask cell sheet portion 220 as much as possible to increase the adhesion. The welding (W) portion may be generated in a line or spot form, and may have the same material as the mask cell sheet portion 220 and integrate the edge frame portion 210 and the mask cell sheet portion 220. It can be a medium to connect to.

7 is a schematic diagram illustrating a manufacturing process of a frame according to another embodiment of the present invention. In the embodiment of FIG. 6, the mask cell sheet unit 220 having the mask cell region CR is first manufactured and attached to the edge frame unit 210. However, the embodiment of FIG. After attaching to 210, the mask cell region CR is formed.

First, as shown in FIG. 6A, the edge frame part 210 including the hollow area R is provided.

Next, referring to FIG. 7A, the edge frame portion 210 may correspond to a planar sheet (the plane mask cell sheet portion 220 ′). The mask cell sheet portion 220 ′ is in a planar state in which the mask cell region CR is not yet formed. In the corresponding process, all sides of the mask cell sheet part 220 'may be stretched (F1 to F4) to correspond to the edge frame part 210 in a state where the mask cell sheet part 220' is flattened. On one side, the mask cell sheet portion 220 'may be grasped and tensioned at several points (for example, 1 to 3 points in FIG. 7A). On the other hand, the mask cell sheet portion 220 'may be stretched (F1, F2) not in all sides but in some lateral direction.

Next, when the mask cell sheet portion 220 'corresponds to the edge frame portion 210, the edge portion of the mask cell sheet portion 220' may be welded (W) and attached. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 ′ can be firmly attached to the edge frame portion 220. Welding (W) should be performed as close as possible to the edge of the edge frame portion 210 as much as possible to reduce the excited space between the edge frame portion 210 and the mask cell sheet portion 220 'as much as possible to increase the adhesion. The welded W portion may be formed in a line or spot shape, and may have the same material as that of the mask cell sheet portion 220 ′ and have an edge frame portion 210 and a mask cell sheet portion 220 ′. It can be a medium to connect the integrally.

Next, referring to FIG. 7B, a mask cell region CR is formed in a planar sheet (planar mask cell sheet portion 220 ′). The mask cell region CR may be formed by removing the sheet of the mask cell region CR through laser scribing or etching. In the present specification, a description is given taking an example of forming a 6 × 5 mask cell region (CR: CR11 to CR56). When the mask cell region CR is formed, a portion welded to the edge frame portion 210 becomes the edge sheet portion 221, and five first grid sheet portions 223 and four second grids are formed. The mask cell sheet part 220 having the sheet part 225 may be configured.

8 is a schematic diagram illustrating a process of manufacturing a mask metal film 110 according to an embodiment of the present invention. In FIG. 8, the manufacturing of the mask metal film 110 by electroplating will be described as an example. However, the mask metal film 110 of the present invention is not limited thereto, and one produced by rolling may be used.

Referring to FIG. 8A, the conductive substrate 21 is prepared. In order to perform electroforming, the substrate 21 of the mother plate may be a conductive material. The mother plate can be used as a cathode electrode in electroplating.

As the conductive material, in the case of metal, metal oxides may be generated on the surface, impurities may be introduced during the metal manufacturing process, and in the case of the polycrystalline silicon substrate, inclusions or grain boundaries may exist, and the conductive polymer may be present. In the case of a base material, it is highly likely to contain an impurity, and strength. Acid resistance may be weak. Elements that interfere with the uniform formation of an electric field on the surface of the substrate (or negative electrode body), such as metal oxides, impurities, inclusions, grain boundaries, etc., are referred to as "defects." Due to a defect, a uniform electric field may not be applied to the cathode body of the material described above, and thus a part of the mask metal film 110 may be unevenly formed.

Non-uniformity of the mask metal film and the mask metal film pattern (mask pattern P) may adversely affect the formation of the pixel in implementing a UHD-class or higher definition pixel. For example, QHD image quality is 500 ~ 600 pixel per inch (PPI), and the size of pixels is about 30 ~ 50㎛. For 4K UHD and 8K UHD high definition, it is higher than 860 PPI and ~ 1600 PPI. Have the same resolution. The micro display applied directly to the VR device, or the micro display used in the VR device, aims at an ultra high resolution of about 2,000 PPI or more, and the size of the pixel reaches about 5 to 10 μm. The pattern width of the FMM and shadow mask applied to this may be formed in a size of several to several tens of micrometers, preferably smaller than 30 micrometers, so that even a defect having a size of several micrometers occupies a large proportion in the pattern size of the mask. to be. In addition, an additional process for removing metal oxides, impurities, and the like may be performed to remove the defects in the cathode material of the material described above, and another defect such as etching of the anode material may be caused in this process. have.

Therefore, in the present invention, a mother plate (or a negative electrode body) of a single crystal material can be used. In particular, it is preferable that it is a single crystal silicon material. In order to have conductivity, a high concentration doping of 10 ¹⁹ / cm ³ or more may be performed on the single crystal silicon base plate. Doping may be performed on the entirety of the mother plate, or only on the surface portion of the mother plate.

On the other hand, the single crystal material is a metal such as Ti, Cu, Ag, carbon-based materials such as semiconductors such as GaN, SiC, GaAs, GaP, AlN, InN, InP, Ge, graphite, graphene _{, CH 3 NH 3 PbCl 3,} CH 3 NH 3 PbBr 3, CH 3 NH 3 PbI 3, SrTiO 3 , etc. page containing the perovskite (perovskite) superconductor single crystalline ceramic, aircraft single crystal second heat-resistant alloy for components for such structures And the like can be used. Metal and carbon-based materials are basically conductive materials. In the case of a semiconductor material, high concentration doping of 1019 or more may be performed to have conductivity. In the case of other materials, conductivity may be formed by performing doping or forming oxygen vacancies. Doping may be performed on the entirety of the mother plate, or only on the surface portion of the mother plate.

In the case of a single crystal material, since there is no defect, there is an advantage that a uniform mask metal film 110 may be generated due to the formation of a uniform electric field on the entire surface during electroplating. The frame integrated masks 100 and 200 manufactured through the uniform mask metal film may further improve the image quality level of the OLED pixel. In addition, since an additional process of removing and eliminating defects does not have to be performed, there is an advantage in that process costs are reduced and productivity is improved.

The following description assumes the use of a single crystal silicon wafer as the conductive base 21.

Referring back to FIG. 8A, next, the conductive substrate 21 is used as a mother plate (cathode body), and the anode body (not shown) is spaced apart on the conductive substrate 21. The mask metal film 110 ′ may be formed by electroplating. The mask metal film 110 ′ may be formed on the exposed top and side surfaces of the conductive substrate 21 facing the anode and capable of acting on an electric field. In addition to the side of the conductive substrate 21, a mask metal film 110 ′ may be formed even on a portion of the lower surface of the conductive substrate 21.

Next, the edge of the mask metal film 110 'is cut (D) with a laser, or a photoresist layer is formed on the mask metal film 110' and only the exposed portion of the mask metal film 110 'is etched. Can be removed (D). Accordingly, as shown in FIG. 8B, the mask metal film 110 ′ can be separated from the conductive base 21.

Meanwhile, before the mask metal film 110 ′ is separated from the conductive substrate 21, a heat treatment H may be performed. In order to reduce the thermal expansion coefficient of the mask 100 and to prevent deformation due to the heat of the mask 100 and the mask pattern P, the mask metal film is formed from the conductive base material 21 (or the mother plate and the cathode body). It is characterized in that the heat treatment (H) is performed before the separation (110 '). Heat treatment may be carried out at a temperature of 300 ℃ to 800 ℃.

In general, the Invar thin plate produced by electroplating has a higher coefficient of thermal expansion as compared to the Invar thin plate produced by rolling. Thus, the thermal expansion coefficient can be lowered by performing a heat treatment on the Invar thin plate. In this heat treatment, peeling, deformation, or the like may occur on the Invar thin plate. This is a phenomenon due to heat treatment of only the Inba thin plate, or heat treatment of the Inba thin plate temporarily attached only to the upper surface of the conductive substrate 21. However, in the present invention, since the mask metal film 110 ′ is formed not only on the upper surface of the conductive substrate 21 but also on part of the side surface and the lower surface, no peeling or deformation occurs even when the heat treatment (H) is performed. In other words, since the heat treatment is performed in a state in which the conductive base 21 and the mask metal film 110 'are closely attached, there is an advantage in that the heat treatment is prevented from being peeled off and deformed due to the heat treatment, and the heat treatment can be stably performed.

On the other hand, in addition to the Invar thin plate (or mask metal film 110 ') produced by electroplating, the Invar thin plate produced by rolling has a low coefficient of thermal expansion, and thus, a separate heat treatment (H) may not be performed.

9 is a schematic diagram illustrating a mask for forming a conventional high resolution OLED.

In order to realize a high-resolution OLED, the size of the pattern is decreasing, and the thickness of the mask metal film used for this needs to be thinned. As shown in FIG. 9A, in order to implement the OLED pixel 6 having a high resolution, the pixel spacing and the pixel size should be reduced in the mask 10 '(PD-> PD'). In addition, in order to prevent the OLED pixel 6 due to the shadow effect from being deposited unevenly, it is necessary to form 14 the pattern of the mask 10 'to be inclined. However, in the process of forming the inclined pattern 14 on the thick mask 10 'with a thickness T1 of about 30-50 μm, the patterning 13 suitable for the minute pixel spacing PD' and pixel size is formed. Since it is difficult to do this, it becomes a cause of a bad yield in a machining process. In other words, in order to form the pattern 14 to be inclined with a fine pixel interval PD ', a thin mask 10' must be used.

In particular, for the high resolution of the UHD level, as shown in FIG. 9 (b), fine patterning may be performed only by using a thin mask 10 'having a thickness T2 of about 20 μm or less. In addition, the use of a thin mask 10 ′ having a thickness T2 of about 10 μm may be considered for ultra high resolution of UHD or higher. However, even when the laser L is irradiated to perform the laser welding on the thin mask 10 ', the welding bead WB is not generated smoothly, leading to failure of the welding, and thus the mask 10' is moved to the frame 200. There was a problem that can not be attached to. In other words, the welding beads WB are not produced until a sufficient amount of the mask 10 'is melted by the laser L. Due to the thickness of the thin mask 10', the contact with the frame 200 is sufficient. Weld beads WB are not produced.

Accordingly, the present invention proposes a method in which a portion of the welded portion of the mask 100 to which the laser L is irradiated is formed to be thicker and stably attached to the frame 200.

10 is a schematic diagram illustrating a mask 100 according to an embodiment of the present invention.

The mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy DM around the mask cell C. FIG. The dummy DM corresponds to a portion of the mask film 110 (mask metal film 110) except for the cell C, includes only the mask film 110, or a predetermined dummy in a form similar to the mask pattern P. FIG. The patterned mask layer 110 may be included. In the dummy DM, a part or all of the dummy DM may be attached to the frame 200 (mask cell sheet part 220) corresponding to the edge of the mask 100.

The width of the mask pattern P may be smaller than 40 μm, and the thickness of the mask 100 may be about 2 to 50 μm. Since the frame 200 includes a plurality of mask cell regions CR11 to CR56, the mask 100 having mask cells C11 to C56 corresponding to the respective mask cell regions CR11 to CR56. ) Can also be provided in plurality.

The mask 100 is characterized in that at least a portion of the dummy DM is formed thicker than the mask cell (C). The welding portion (region to be welded) of the mask 100 may be disposed in the dummy DM, and when the laser L is irradiated as the dummy DM is formed thicker than the mask cell C, the weld bead (WB) can contribute to the stable generation.

Since one surface 101 of the mask 100 is a surface to be attached in contact with the frame 200, it is preferable to be flat. In addition, a bending or a step may be formed between the other surface 102a of the mask cell C portion and the other surface 102b of the dummy DM portion to have a different thickness.

11 to 12 are schematic diagrams illustrating a process of manufacturing a mask support template by adhering a mask metal film 110 on a template 50 and forming a mask 100 according to an embodiment of the present invention.

Referring to FIG. 11A, a template 50 may be provided. The template 50 is a medium capable of moving in a state in which the mask 100 is attached and supported on one surface. It is preferable that the template 50 has a shape in which the thickness of the edge portion 50b is thinner than that of the central portion 50a. The central portion 50a may correspond to the mask cell C of the mask metal film 110, and the edge portion 50b may correspond to the dummy DM of the mask metal film 110. The template 50 may have a flat plate shape having a curved surface or a step formed on an upper surface of the template 50 so that the mask metal film 110 may be entirely supported.

The template 50 is preferably made of a transparent material so as to easily observe vision and the like in the process of aligning and bonding the mask 100 to the frame 200. In addition, the laser may penetrate the transparent material. As a transparent material, materials such as glass, silica, heat resistant glass, quartz, alumina (Al ₂ O ₃ ), borosilicate glass, and the like may be used. For example, the template 50 may use a BOROFLOAT ^® 33 material having excellent heat resistance, chemical durability, mechanical strength, transparency, and the like in borosilicate glass. In addition, BOROFLOAT ^® 33 has a thermal expansion coefficient of about 3.3, which is advantageous in controlling the mask metal film 110 because the difference between the Invar mask metal film 110 and the thermal expansion coefficient is small.

On the other hand, the template 50 may be one surface that is in contact with the mask metal film 110 so that no air gap occurs between the interface with the mask metal film 110 (or the mask 100). have. In consideration of this, the surface roughness Ra of one surface of the template 50 may be 100 nm or less. In order to implement the template 50 whose surface roughness Ra is 100 nm or less, the template 50 may use a wafer. Since a wafer has a surface roughness Ra of about 10 nm, many products on the market, and many surface treatment processes are known, the wafer can be used as the template 50. Since the surface roughness Ra of the template 50 is nm scale, there is no or almost no air gap, and thus it is easy to generate welding beads WB by laser welding, thereby affecting the alignment error of the mask pattern P. Can not give.

The template 50 has a laser passing hole 51 in the template 50 so that the laser L irradiated from the upper portion of the template 50 can reach the welding part (region to be welded) of the mask 100. Can be formed. The laser through hole 51 may be formed in the template 50 so as to correspond to the position and the number of welds. Since a plurality of welding parts are disposed along a predetermined interval at the edge or dummy DM portion of the mask 100, a plurality of laser passing holes 51 may also be formed along the predetermined interval to correspond thereto. As an example, since a plurality of welds are disposed on both sides (left / right) of the mask 100 at a portion of the dummy DM along a predetermined interval, the laser penetrating holes 51 also have the template 50 on both sides (left / right). A plurality may be formed along a predetermined interval.

The laser through hole 51 does not necessarily correspond to the position and the number of welds. For example, welding may be performed by irradiating the laser L only to a part of the laser passing holes 51. In addition, some of the laser passing holes 51 that do not correspond to the welding part may be used in place of the alignment mark when the mask 100 and the template 50 are aligned. If the material of the template 50 is transparent to the laser light, the laser through hole 51 may not be formed.

The temporary adhesive part 55 may be formed on one surface of the template 50. In the temporary adhesive part 55, the mask 100 (or the mask metal film 110 ′) is temporarily bonded to one surface of the template 50 until the mask 100 is attached to the frame 200. It can be supported on the image.

The temporary adhesive part 55 may use liquid wax. The liquid wax can use the same thing as the wax used in the polishing step of a semiconductor wafer, etc., The type is not specifically limited. Liquid waxes may mainly include solvents and materials such as acrylic, vinyl acetate, nylon and various polymers as resin components for controlling adhesion, impact resistance, and the like regarding holding force. For example, the temporary adhesive part 55 may use acrylonitrile butadiene rubber (ABR) as a resin component and SKYLIQUID ABR-4016 including n-propyl alcohol as a solvent component. Liquid wax may be formed on the temporary bond 55 using spin coating.

The temporary adhesive portion 55, which is a liquid wax, has a low viscosity at temperatures higher than 85 ° C to 100 ° C, and may become viscous at a temperature lower than 85 ° C and partially harden as a solid, thereby forming the mask metal film 110 'and the template 50. ) Can be fixed and bonded.

Next, referring to FIG. 11B, the mask metal film 110 ′ may be adhered to the template 50. After the liquid wax is heated to 85 ° C. or higher and the mask metal film 110 ′ is brought into contact with the template 50, the mask metal film 110 ′ and the template 50 may be passed between the rollers to perform adhesion. .

According to an embodiment, the template 50 may be baked at about 120 ° C. for 60 seconds to vaporize the solvent of the temporary adhesive part 55, and immediately proceed to a mask metal film lamination process. . Lamination may be performed by loading the mask metal film 110 on the template 50 having the temporary adhesive part 55 formed on one surface thereof, and passing it between an upper roll of about 100 ° C. and a lower roll of about 0 ° C. have.

When the mask metal film 110 ′ contacts the template 50, the mask metal film 110 ′ may correspond to the shape of the upper portion of the template 50, that is, the bending or the step of the central portion 50a and the edge portion 50b. ) May also be curved or stepped.

Next, referring to FIG. 11C, one surface of the mask metal film 110 may be planarized. Specifically, the opposite surface 101 that faces the surface 102 of the mask metal film 110 adhered to the template 50 may be planarized. Planarization can be performed by a chemical mechanical polishing (CMP) method, and known CMP methods can be used without limitation. In addition, a planarization process can be used. Accordingly, the mask 100 may be formed at least a portion of the dummy DM thicker than the mask cell (C).

Next, referring to FIG. 12D, a patterned insulating portion 25 may be formed on the mask metal film 110. The insulating portion 25 may be formed of a photoresist material using a printing method or the like.

Subsequently, the mask metal layer 110 may be etched. Methods such as dry etching and wet etching may be used without limitation, and a portion of the mask metal film 110 exposed to the empty space 26 between the insulating portions 25 may be etched as a result of the etching. An etched portion of the mask metal layer 110 may form a mask pattern P, and a mask 100 having a plurality of mask patterns P may be manufactured.

Next, referring to FIG. 12E, the manufacturing of the template 50 supporting the mask 100 may be completed by removing the insulating portion 25.

13 is a schematic diagram illustrating a process of loading a mask support template onto a frame according to an embodiment of the present invention.

Referring to FIG. 13, the template 50 may be conveyed by the vacuum chuck 90. The vacuum chuck 90 may absorb and transfer the opposite surface of the template 50 to which the mask 100 is adhered. The vacuum chuck 90 may be connected to a moving means (not shown) which is moved along the x, y, z and θ axes. In addition, the vacuum chuck 90 may be connected to flip means (not shown) capable of attracting and flipping the template 50. As shown in FIG. 13B, the vacuum chuck 90 absorbs and flips the template 50, and then transfers the template 50 onto the frame 200. There is no effect on the adhesion state and the alignment state.

14 is a schematic diagram illustrating a state in which a template is loaded onto a frame and the mask corresponds to a cell area of the frame according to an embodiment of the present invention. In FIG. 14, one mask 100 is corresponded to / attached to the cell region CR. However, the mask 100 may be frame 200 by simultaneously matching the plurality of masks 100 to all the cell regions CR. ) May be attached. In this case, a plurality of templates 50 supporting each of the plurality of masks 100 may be provided.

Next, referring to FIG. 14, the mask 100 may correspond to one mask cell region CR of the frame 200. By loading the template 50 onto the frame 200 (or the mask cell sheet unit 220), the mask 100 may correspond to the mask cell region CR. While controlling the position of the template 50 / vacuum chuck 90, a microscope may be used to determine whether the mask 100 corresponds to the mask cell region CR. Since the template 50 compresses the mask 100, the mask 100 and the frame 200 may closely contact each other.

Meanwhile, the lower supporter 70 may be further disposed below the frame 200. The lower supporter 70 may have a size enough to fit into the hollow region R of the frame rim 210 and may have a flat plate shape. In addition, a predetermined support groove (not shown) corresponding to the shape of the mask cell sheet part 220 may be formed on the upper surface of the lower supporter 70. In this case, the edge sheet part 221 and the first and second grid sheet parts 223 and 225 are fitted into the support groove, so that the mask cell sheet part 220 may be more securely fixed.

The lower supporter 70 may compress the opposite surface of the mask cell region CR that the mask 100 contacts. That is, the lower supporter 70 may support the mask cell sheet part 220 in the upper direction to prevent the mask cell sheet part 220 from sagging in the lower direction during the attachment process of the mask 100. At the same time, since the lower support 70 and the template 50 are pressed against each other in a direction opposite to each other, the edge and the frame 200 (or the mask cell sheet part 220) of the mask 100 are compressed, so that the mask 100 is pressed. The alignment state of the can be maintained without being disturbed.

As such, the mask 100 may be attached to the mask cell region CR of the frame 200 by simply attaching the mask 100 to the template 50 and loading the template 50 onto the frame 200. Since the process is completed, no tensile force may be applied to the mask 100 in this process.

Subsequently, the laser 100 may be irradiated to the mask 100 to attach the mask 100 to the frame 200 by laser welding. A weld bead WB is generated in the welded portion of the laser welded mask, and the weld bead WB may be integrally connected with the same material as that of the mask 100 / frame 200. At this time, since the weld portion (or part of the dummy DM) of the mask 100 to which the laser L is irradiated is formed thicker than the mask cell C, a sufficient amount of the weld portion is melted to form the weld bead WB. And welding can be performed stably.

15 is a schematic diagram illustrating a process of separating the mask 100 and the template 50 after attaching the mask 100 to the frame 200 according to an embodiment of the present invention.

Referring to FIG. 15, after attaching the mask 100 to the frame 200, the mask 100 and the template 50 may be debonded. Separation of the mask 100 and the template 50 may be performed through at least one of heat application (ET), chemical treatment (CM), and ultrasonic application (US) to the temporary adhesive part 55. Since the mask 100 remains attached to the frame 200, only the template 50 may be lifted. For example, when heat (ET) at a temperature higher than 85 ° C to 100 ° C is applied (ET), the viscosity of the temporary adhesive part 55 is lowered, and the adhesive force between the mask 100 and the template 50 is weakened, so that the mask 100 ) And the template 50 may be separated. As another example, the mask 100 and the template 50 may be separated by dissolving and removing the temporary adhesive part 55 by dipping (CM) the temporary adhesive part 55 in chemical substances such as IPA, acetone, and ethanol. have. As another example, when the ultrasonic wave (US) is applied, the adhesive force between the mask 100 and the template 50 is weakened, so that the mask 100 and the template 50 may be separated.

16 is a schematic diagram illustrating a state in which the mask 100 is attached to the frame 200 according to an embodiment of the present invention.

Referring to FIG. 16, one mask 100 may be attached on one cell region CR of the frame 200.

Since the mask cell sheet part 220 of the frame 200 has a thin thickness, when the mask cell sheet part 220 is attached to the mask cell sheet part 220 while a tensile force is applied to the mask 100, the tensile force remaining in the mask 100 is masked. The cell sheet 220 and the mask cell region CR may act on the cell sheet 220 and may be modified. Therefore, the mask 100 should be attached to the mask cell sheet 220 without applying a tensile force to the mask 100. The present invention corresponds to the mask cell region CR of the frame 200 by simply attaching the mask 100 to the template 50 and loading the template 50 onto the frame 200. Since the process is completed, no tensile force may be applied to the mask 100 in this process. Thus, it is possible to prevent the tensile force applied to the mask 100 from acting as a tension on the frame 200 to deform the frame 200 (or the mask cell sheet part 220).

Since the mask 10 of FIG. 1 includes six cells C1 to C6, the mask 10 has a long length, whereas the mask 100 of the present invention has a short length including one cell C. The degree of distortion of the pixel position accuracy (PPA) can be reduced. For example, assuming that the length of the mask 10 including the plurality of cells C1 to C6, ... is 1 m, and a PPA error of 10 µm occurs in the entire 1 m, the mask 100 of the present invention May reduce the above error range by 1 / n according to the reduction of the relative length (corresponding to the reduction of the number of cells C). For example, if the length of the mask 100 of the present invention is 100mm, it has a length reduced to 1/10 at 1m of the conventional mask 10, the PPA error of 1㎛ occurs in the entire 100mm length As a result, the alignment error is significantly reduced.

On the other hand, if the mask 100 is provided with a plurality of cells (C), each cell (C) corresponding to each cell region (CR) of the frame 200 within the range that the alignment error is minimized, The mask 100 may correspond to the plurality of mask cell regions CR of the frame 200. Alternatively, the mask 100 having the plurality of cells C may correspond to one mask cell region CR. Also in this case, in consideration of the process time and productivity according to the alignment, the mask 100 preferably has as few cells C as possible.

In the case of the present invention, since only one cell C of the mask 100 needs to be corresponded and the alignment state is confirmed, the plurality of cells C: C1 to C6 must be simultaneously associated and the alignment state must be confirmed. In comparison with the conventional method (see Fig. 2), the production time can be significantly reduced.

That is, in the method of manufacturing a frame-integrated mask of the present invention, each cell C11 to C16 included in the six masks 100 corresponds to one cell region CR11 to CR16, respectively, and checks the alignment state. Through the process, the time can be much shorter than the conventional method of simultaneously matching six cells C1 to C6 and confirming the alignment of all six cells C1 to C6 at the same time.

In addition, in the method of manufacturing a frame-integrated mask of the present invention, the product yield in 30 processes of matching and aligning 30 masks 100 with 30 cell areas CR: CR11 to CR56 respectively is 6 cells (C1). 5 masks 10 (see FIG. 2A), each comprising ˜C6), may appear much higher than the conventional product yield in 5 steps of matching and aligning the frame 20. Since the conventional method of aligning six cells C1 to C6 in a region corresponding to six cells C at a time is a much more cumbersome and difficult task, product yield is low.

Meanwhile, as described above in step (b) of FIG. 11, when the mask metal film 110 is adhered to the template 50 by the lamination process, a temperature of about 100 ° C. may be applied to the mask metal film 110. have. As a result, the mask metal layer 110 may be adhered to the template 50 in a state in which some tensile tension is applied. Thereafter, when the mask 100 is attached to the frame 200 and the template 50 is separated from the mask 100, the mask 100 may contract a predetermined amount.

If the template 50 and the mask 100 are separated after each of the masks 100 are all attached on the corresponding mask cell region CR, a plurality of masks 100 are applied with a tension that contracts in opposite directions. Therefore, the force is canceled so that deformation does not occur in the mask cell sheet portion 220. For example, the first grid sheet portion 223 between the mask 100 attached to the CR11 cell region and the mask 100 attached to the CR12 cell region may move in the right direction of the mask 100 attached to the CR11 cell region. The tension acting and the tension acting in the left direction of the mask 100 attached to the CR12 cell region may be offset. Therefore, the deformation of the frame 200 (or the mask cell sheet part 220) due to the tension is minimized, so that the alignment error of the mask 100 (or the mask pattern P) can be minimized.

17 is a schematic diagram illustrating an OLED pixel deposition apparatus 1000 using frame-integrated masks 100 and 200 according to an embodiment of the present invention.

Referring to FIG. 17, the OLED pixel deposition apparatus 1000 includes a magnet plate 300 in which a magnet 310 is accommodated and a coolant line 350 is disposed, and an organic material source 600 from a lower portion of the magnet plate 300. And a deposition source supply unit (500) for supplying ().

A target substrate 900 such as glass on which the organic source 600 is deposited may be interposed between the magnet plate 300 and the source deposition unit 500. The frame integrated masks 100 and 200 (or FMMs) for allowing the organic source 600 to be deposited pixel by pixel may be disposed on the target substrate 900 to be in close contact with or very close to each other. The magnet 310 may generate a magnetic field and may be in close contact with the target substrate 900 by the magnetic field.

The deposition source supply unit 500 may supply the organic source 600 while reciprocating the left and right paths, and the organic source 600 supplied from the deposition source supply unit 500 may have patterns P formed in the frame integrated masks 100 and 200. ) May be deposited on one side of the target substrate 900. The deposited organic source 600 passing through the pattern P of the frame-integrated masks 100 and 200 may serve as the pixel 700 of the OLED.

In order to prevent non-uniform deposition of the pixel 700 by the shadow effect, the pattern of the frame-integrated masks 100 and 200 may be formed to be inclined S (or formed into a tapered shape S). . Since the organic sources 600 passing through the pattern in the diagonal direction along the inclined surface may also contribute to the formation of the pixel 700, the pixel 700 may be uniformly deposited in overall thickness.

Since the mask 100 is attached and fixed to the frame 200 at a first temperature higher than the pixel deposition process temperature, even if the mask 100 is raised to the process temperature for pixel deposition, the position of the mask pattern P is hardly affected. The PPA between the 100 and the neighboring mask 100 may be maintained not to exceed 3 μm.

Although the present invention has been illustrated and described with reference to the preferred embodiments as described above, it is not limited to the above embodiments and variously modified by those skilled in the art without departing from the spirit of the present invention. Modifications and variations are possible. Such modifications and variations are intended to be within the scope of the invention and the appended claims.

50: template
50a, 50b: center of template, border
51: laser through hole
55: temporary adhesive
70: lower support
100: mask
101, 102: one side of the mask, the other side
110: mask film
200: frame
210: border frame portion
220: mask cell sheet portion
221: border sheet portion
223: first grid sheet portion
225: second grid sheet portion
1000: OLED pixel deposition device
C: cell, mask cell
CM: chemical treatment
CR: mask cell area
DM: Dummy, Mask Dummy
ET: heat
L: laser
R: Hollow area of the border frame portion
P: mask pattern
US: Ultrasound
W: welding
WB: welding bead

Claims (6)

A frame integrated mask in which a plurality of masks and a frame supporting the mask are integrally formed,
The frame is
An edge frame portion including a hollow region;
A mask cell sheet portion having a plurality of mask cell regions and connected to an edge frame portion
Including,
Each mask is connected to the top of the mask cell sheet portion,
The mask includes a mask cell in which a plurality of mask patterns are formed, and a dummy around the mask cell, and a plurality of welds are formed at least a portion of the dummy at intervals.
At least a portion of the dummy in which the weld is formed is thicker than the thickness of the mask cell. The method of claim 1,
The mask cell sheet part,
Border sheet portion;
At least one first grid sheet portion extending in a first direction and connected at both ends to the edge sheet portion; And
And at least one second grid sheet portion extending in a second direction perpendicular to the first direction and intersecting with the first grid sheet portion and both ends connected to the edge sheet portion. The method of claim 1,
A frame-integrated mask, each mask corresponding to a respective mask cell region. The method of claim 1,
The mask and frame are frame-integrated masks of any one of invar, super invar, nickel, nickel-cobalt. The method of claim 1,
One surface of the mask connected to the mask cell sheet portion is flat,
At least a portion of the dummy is bent or stepped on the other surface opposite to one side of the mask, frame-integrated mask. A method of manufacturing a frame-integrated mask in which at least one mask and a frame supporting the mask are integrally formed,
(a) preparing a frame having at least one mask cell area;
(b) loading the mask-attached template onto the frame to correspond to the mask cell area of the frame; And
(c) attaching the mask to the frame
Including,
The mask includes a mask cell in which a plurality of mask patterns are formed, and a dummy around the mask cell, and a plurality of welds are formed at least a portion of the dummy at intervals.
At least a portion of the dummy in which the weld is formed is thicker than the thickness of the mask cell,
Method for producing a frame-integrated mask.

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