CN111172497B

CN111172497B - Mask plate, preparation method thereof and evaporation method

Info

Publication number: CN111172497B
Application number: CN202010099013.4A
Authority: CN
Inventors: 沈阔
Original assignee: BOE Technology Group Co Ltd
Current assignee: BOE Technology Group Co Ltd
Priority date: 2020-02-18
Filing date: 2020-02-18
Publication date: 2022-09-23
Anticipated expiration: 2040-02-18
Also published as: CN111172497A

Abstract

The invention provides a mask plate, a preparation method thereof and an evaporation method. The mask plate comprises a main body part and a supporting part, wherein the main body part is arranged on the supporting part, an area, used for evaporation, of the supporting part comprises a plurality of opening areas, at least part of the edge of at least part of the opening areas is provided with a magnetic force adjusting part, and the magnetic force adjusting part is configured to adjust the magnetic force adsorption strength of the supporting part at the corresponding position. This mask plate, through setting up magnetic force adjustment portion, can adjust the size of the magnetic force adsorption strength of supporting part in relevant position department, make the magnetic plate strengthen greatly with the adsorption magnetic force between the whole edge of opening area or the local edge on the supporting part in the coating by vaporization equipment, thereby avoid the edge of opening area on the supporting part to produce great flagging when the coating by vaporization, and then reduce or avoid the main part to appear fold flagging and local deformation under the supporting role of supporting part, improve the coating by vaporization yield.

Description

Mask plate, preparation method thereof and evaporation method

Technical Field

The invention belongs to the technical field of display, and particularly relates to a mask plate, a preparation method thereof and an evaporation method.

Background

An OLED (Organic Light Emitting Diode) display screen is considered as a display device with the most potential development because of its advantages of self-luminescence, high contrast, fast response time, low power consumption, etc., and has become the mainstream development direction in the display technology field.

Nowadays, the market prospect of the OLED screen is wide, and various manufacturers actively research and produce various OLED screens so as to meet the market demand. At present, the AMOLED display screen luminescent material is mainly evaporated on a display substrate by using a fine metal mask plate. The Mask plate used for evaporating the OLED screen consists of a precise Metal Mask (FMM) for defining RGB (red, green and blue) sub-pixels and a supporting Mask plate (F-Mask) for shielding a non-evaporation area and supporting the FMM. FMM and F-Mask for evaporation can droop due to self gravity, although a magnetic field exists in evaporation equipment during evaporation, the Mask can be adsorbed and attached to an evaporation substrate in a large area, for the edge of an F-Mask opening (generally corresponding to the edge of each daughter board on a mother board in a preparation process) or the edge of an F-Mask special-shaped opening (corresponding to the edge of each daughter board on the mother board in an irregular shape), which is popular at present, the local warping or sinking of the F-Mask is difficult to improve due to the fact that the special-shaped opening is under the condition of uniformly distributed magnetic field strength, and therefore the FMM can also generate local warping and wrinkling, and the risk of evaporation deviation and color mixing exists.

Disclosure of Invention

The invention provides a Mask plate, a preparation method thereof and an evaporation method, aiming at the problem of evaporation deviation and color mixing caused by local warping and wrinkling of an FMM (thin film transistor) due to the fact that the edge of an F-Mask opening or a special-shaped opening is uniformly distributed under the magnetic field intensity during evaporation. This mask plate enables among the evaporation equipment magnetic sheet and the supporting part on the whole edge of opening district or the local magnetic force of absorption between the edge strengthen greatly to avoid the edge of opening district to produce great flagging when the evaporation on the supporting part, and then reduce or avoid the main part to appear fold flagging and local deformation under the supporting role of supporting part, it is bad to reduce or avoid appearing evaporating coating layer colour mixture, improves the evaporation coating yield.

The invention provides a mask plate, which comprises a main body part and a supporting part, wherein the main body part is arranged on the supporting part, an area of the supporting part for evaporation comprises a plurality of opening areas, at least part of the edges of at least part of the opening areas are provided with magnetic force adjusting parts, and the magnetic force adjusting parts are configured to adjust the magnetic force adsorption strength of the supporting part at corresponding positions.

Optionally, the magnetic force adjusting portion is disposed on a side of the supporting portion away from the main body portion.

Optionally, the magnetic force adjusting portion is a magnetic conductive structure having a magnetic force adsorption strength greater than that of the supporting portion.

Optionally, the magnetic force adjusting part is a conductive structure, and the conductive structure can be supplied with currents of different magnitudes so as to enable the conductive structure to have magnetic force adsorption strengths of different magnitudes;

an insulating layer is further arranged between the conductive structure and the supporting portion.

Optionally, the material of the magnetic permeable structure comprises an iron-cobalt soft magnetic alloy or an iron-nickel-cobalt alloy.

Optionally, the conductive structure has a magnetic attraction strength proportional to the amount of current flowing through the conductive structure.

Optionally, each of the opening areas of the support part has the same regular rectangular edge,

the edge of each opening area of the supporting part is provided with the magnetic force adjusting part.

Optionally, each opening area of the support portion has at least one section of irregular edge with the same size and shape, and the irregular edge of each opening area is provided with the magnetic force adjusting portion with the same magnetic force adsorption strength.

Optionally, each of the opening regions of the support part has irregular rectangular edges of the same size and shape, edge lines of four corners of each of the opening regions are arc lines of the same curvature,

the four angular positions of each opening area are provided with the magnetic force adjusting parts with the same magnetic force adsorption strength.

Optionally, the region of the support part for evaporation includes at least two sub-regions, each of the sub-regions is butted, and at least one opening region is respectively disposed in each of the sub-regions;

the sizes of the opening areas in the sub-areas are similar in different shapes; or the size and shape of the opening area in each sub-area are different;

the irregular edges of the opening areas in the sub areas are respectively provided with the magnetic force adjusting parts, the magnetic force absorbing strength of the magnetic force adjusting parts at different positions in the same sub area is the same, and the magnetic force absorbing strength of the magnetic force adjusting parts in different sub areas is different.

Optionally, the region of the support part for evaporation includes two sub-regions, which are a central region and a peripheral region, respectively, the peripheral region surrounds the central region, and a plurality of opening regions are disposed in the central region and the peripheral region, respectively; the magnetic force adjusting part comprises a first adjusting part and a second adjusting part;

each opening area in the central area is provided with irregular rectangular edges with the same size and shape, and the edge lines of four corners of each opening area in the central area are arc lines with the same curvature; the first adjusting parts are arranged at four angular positions of each opening area in the central area;

the shape of each of said open areas in said peripheral region being the same as the shape of each of said open areas in said central region, the area of each of said open areas in said central region being 9/10 the area of each of said open areas in said peripheral region; the second adjusting parts are arranged at four angular positions of each opening area in the peripheral area;

the magnetic force adsorption strength of the first regulation part is 9/10 of the magnetic force adsorption strength of the second regulation part.

Optionally, the support part is plate-shaped, and the thickness of the support part ranges from 105 μm to 110 μm.

The invention also provides a preparation method of the mask plate, which comprises the steps of preparing the main body part and the supporting part respectively, fixing the main body part to the supporting part through the expanded mesh, and preparing the magnetic force adjusting part at least at part of the edge of the opening area of the supporting part.

Optionally, the magnetic force adjusting part is prepared after the main body part net is fixed to the support part.

Optionally, the preparing the magnetic force adjusting part includes forming a magnetic conductive structure by electroplating or forming a conductive structure by using a patterning process.

The invention also provides an evaporation method, which comprises the following steps:

firstly, a film layer is evaporated by using a mask plate without a magnetic force adjusting part;

and then according to the evaporation precision difference of different positions of the evaporation coating layer, preparing a magnetic force adjusting part in the area of the mask plate supporting part corresponding to the area with poor evaporation coating layer evaporation precision, and adjusting the magnetic force adsorption strength at the corresponding position of the mask plate supporting part.

The invention has the beneficial effects that: according to the mask plate provided by the invention, the magnetic force adjusting part is arranged at least part of the edge of at least part of the opening area, so that the magnetic force adsorption strength of the supporting part at the corresponding position can be adjusted, the adsorption magnetic force between the magnetic plate in the evaporation equipment and the whole edge or local edge of the opening area on the supporting part is greatly enhanced, the edge of the opening area on the supporting part is prevented from generating large sag during evaporation, the flatness of the edge of the opening area on the supporting part is ensured, the wrinkle sag and local deformation of the main body part under the supporting action of the supporting part are further reduced or avoided, the material to be plated can be more accurately evaporated to the corresponding position on the substrate to be plated, the poor color mixing of an evaporation film layer is reduced or avoided, and the evaporation yield is improved.

The evaporation method provided by the invention can ensure the integral flatness of the mask plate, thereby improving the evaporation effect.

Drawings

FIG. 1 is a schematic structural diagram of a conventional evaporation apparatus;

FIG. 2 is a schematic view of a conventional mask plate supporting a force applied to a shaped opening of the mask plate in a magnetic field of an evaporation apparatus;

fig. 3 is a schematic top view of a structure of a mask plate in embodiment 1 of the present invention;

fig. 4 is a schematic view of the edge of the opening area of the support portion of the mask plate under stress in the magnetic field of the evaporation apparatus in embodiment 1 of the present invention;

fig. 5 is a schematic top view of a structure of a mask in embodiment 2 of the present invention;

fig. 6 is a schematic top view of another mask according to embodiment 2 of the present invention;

fig. 7 is a schematic top view of a structure of another mask in embodiment 2 of the present invention;

fig. 8 is a schematic top view of a structure of a mask in embodiment 3 of the present invention;

fig. 9 is a schematic top view of a structure of a mask in embodiment 4 of the present invention.

Wherein the reference numerals are:

1. a main body portion; 2. a support portion; 21. an open area; 3. a magnetic force adjusting part; 101. a central region; 102. a peripheral region; 31. a first adjusting section; 32. a second regulating part; 301. a conductive pattern; 302. a signal lead; 303. an electrode; 4. a magnetic plate; 5. a mask plate; 51. supporting the mask plate; 510. a special-shaped opening; 6. evaporating a substrate; 7. a vapor deposition source; 8. a lifting mechanism.

Detailed Description

In order to make those skilled in the art better understand the technical solution of the present invention, a mask plate, a manufacturing method thereof, and an evaporation method thereof are described in further detail below with reference to the accompanying drawings and the detailed description.

As shown in fig. 1, is a schematic structural diagram of a conventional evaporation apparatus: the Mask plate is composed of a precise Metal Mask (FMM) for defining RGB (red, green and blue) sub-pixels and a supporting Mask plate (F-Mask) for shielding a non-evaporation area and supporting the FMM. Before evaporation, a gap exists between the mask plate 5 and the evaporation substrate 6 due to the self gravity and the stretching deformation of the mask plate; when the evaporation source 7 carries out evaporation, the magnetic plate lifting mechanism 8 descends to drive the magnetic plate 4 to be close to the metal mask plate 5, the mask plate 5 becomes flat and has no folds under the action of the magnetic field intensity, and the gap between the mask plate 5 and the evaporation substrate 6 can be reduced; generally, the magnetic force can adsorb a large area of the mask plate to be attached to the evaporation substrate 6. However, for F-Mask openings, especially F-Mask shaped openings, FIG. 2 is a diagram illustrating the force applied to the shaped opening 510 of the Mask 51 in the magnetic field: the special-shaped opening 510 of the supporting mask plate 51 is different from the deformation of the conventional area under the uniform magnetic field intensity, the edge of the special-shaped opening is easy to generate large sag, and the local flatness is difficult to guarantee due to the fact that the magnetic force cannot be adjusted, so that wrinkles or sag also exist on the metal mask plate, materials to be plated cannot be plated to the corresponding position through the evaporation source 7, and poor color mixing of the evaporation film layer is caused.

Example 1

Based on the above technical problem of the mask plate, the present embodiment provides a mask plate, as shown in fig. 3, including a main body portion 1 and a supporting portion 2, where the main body portion 1 is disposed on the supporting portion 2, an area of the supporting portion 2 for evaporation includes a plurality of opening areas 21, at least a part of edges of at least a part of the opening areas 21 is provided with a magnetic force adjusting portion 3, and the magnetic force adjusting portion 3 is configured to adjust a magnetic force adsorption strength of the supporting portion 2 at a corresponding position.

The main body 1 is a Fine Metal Mask (FMM) for defining RGB sub-pixels, and the support 2 is a support Mask (F-Mask) for blocking a non-deposition region and supporting the FMM. The region of the main body 1 for vapor deposition refers to a region of the main body 1 corresponding to the entire substrate to be plated, the region of the support 2 for vapor deposition refers to a region of the support 2 corresponding to the entire substrate to be plated, and the orthographic projections of the region of the main body 1 for vapor deposition and the region of the support 2 for vapor deposition on the substrate to be plated substantially coincide. A plurality of sub-boards to be plated are distributed on the whole substrate to be plated (namely, a mother board to be plated), the opening area 21 on the supporting part 2 refers to an area corresponding to the whole sub-board to be plated, the edge of the opening area 21 corresponds to the edge of the sub-board to be plated, and the opening area 21 is opened so that evaporation materials can be evaporated to each sub-pixel area on the sub-board to be plated after passing through the main body part 1 corresponding to the opening area 21.

As shown in fig. 4, by providing the magnetism-regulated part 3 at least at a part of the edge of at least a part of the opening area 21, if the magnetic force adjusting part 3 is arranged on the whole edge or partial edge of the opening area 21, the size of the magnetic force adsorption strength of the supporting part 2 at the corresponding position can be adjusted, so that the adsorption magnetic force between the magnetic plate 4 and the whole edge or partial edge of the opening area 21 on the supporting part 2 in the evaporation equipment is greatly enhanced, thereby avoiding the edge of the opening area 21 on the support part 2 from generating large sagging during the evaporation, ensuring the flatness of the edge of the opening area 21 on the support part 2, and then reduce or avoid main part 1 the support action of supporting part 2 down the appearance fold flagging and local deformation, make to wait to plate the material and can more accurately evaporate by vaporization the relevant position to waiting to plate on the base plate, reduce or avoid appearing evaporating the coating layer colour mixture bad, improve the evaporation coating yield.

In this embodiment, the magnetic force adjusting portion 3 is disposed on a side of the supporting portion 2 away from the main body portion 1. In the vapor deposition, the main body part 1 is positioned on one side of the supporting part 2, which is far away from the vapor deposition source, and the magnetic force adjusting part 3 is arranged on one side of the supporting part 2, which is close to the vapor deposition source, so that the main body part 1 can be prevented from being scratched by the contact of the magnetic force adjusting part 3 and the main body part 1, and the flatness of the main body part 1 is prevented from being influenced.

In this embodiment, the magnetic force adjusting portion 3 is a magnetic conductive structure having a magnetic force adsorption strength greater than that of the support portion 2. The magnetic structure is made of iron-cobalt soft magnetic alloy or iron-nickel-cobalt alloy. Typical alloy materials include 35Co-0.5Cr-Fe,49Co-2V-Fe,27Co-0.6Cr-Fe or Fe-Ni-Co alloys with Ni + Co content of about 46%, etc. Through adopting the magnetic conduction structure that magnetic adsorption strength is greater than supporting part 2, can strengthen the magnetic adsorption strength of the magnetic force regulating part 3 position department that sets up of supporting part 2, make the magnetic force that adsorbs between the magnetic sheet 4 in the magnetic force regulating part 3 position department that sets up of supporting part 2 and the evaporation equipment strengthen greatly to avoid the magnetic force regulating part 3 position department that sets up of supporting part 2 to produce great flagging when being in the evaporation coating, guaranteed the flatness when the magnetic force regulating part 3 position that sets up of supporting part 2 is in the evaporation coating. The magnetic conduction structure preferentially selects the metal composite material with smaller thermal expansion coefficient, thereby avoiding the whole mask plate from generating larger deformation when in evaporation coating and avoiding influencing the evaporation coating effect of the evaporation coating layer. The Fe-Co soft magnetic alloy and the Fe-Ni-Co alloy have smaller thermal expansion coefficients and can meet the requirement of the Fe-Co soft magnetic alloy and the Fe-Ni-Co alloy as magnetic conduction structure materials.

Preferably, in the present embodiment, as shown in fig. 3, each opening area 21 of the support part 2 has the same regular rectangular edge, and the magnetic force adjusting part 3 is provided at the edge of each opening area 21 of the support part 2.

Because the opening of the opening area 21 of the support part 2 is regular, the deformation abnormality caused by large area stress concentration can not occur when the main body part 1 is expanded, but the edge of each opening area 21 of the support part 2 is insufficient due to the magnetic adsorption strength during the evaporation, the sagging amount is different from other areas, and the flatness of the main body part 1 is influenced. The whole edge of each opening area 21 of the supporting part 2 is provided with a magnetic conduction structure with magnetic adsorption strength greater than that of the supporting part 2, the magnetic adsorption strength of the edge of each opening area 21 of the supporting part 2 can be enhanced, the adsorption magnetic force between the edge of each opening area 21 of the supporting part 2 and a magnetic plate in evaporation equipment is greatly enhanced, thereby avoiding the great sag of the edge of each opening area 21 of the supporting part 2 during evaporation, ensuring the flatness of the edge of each opening area 21 of the supporting part 2 during evaporation, further reducing or avoiding the drape sag and local deformation of the main body part 1 under the supporting effect of the supporting part 2, enabling the material to be plated to be more accurately evaporated to the corresponding position on the substrate to be plated, reducing or avoiding the poor color mixing of the evaporation film layer, and improving the evaporation yield.

In this embodiment, the supporting portion 2 is plate-shaped, and the thickness of the supporting portion 2 is 105-. The thickness of tradition supporting part 2 is 100 mu m, and in this embodiment, the thickness of supporting part 2 increases 5% -10% on current thickness basis, so can improve 1 net of main part to supporting part 2 on the time of the net tensile force of supporting part 2, the deformation that the large tracts of land stress concentration of mask plate leads to appears when avoiding opening the net is unusual to improve the net quality of mask plate, and then promote the coating by vaporization yield that adopts this mask plate to evaporate the coating film layer.

Based on the above structure of the mask plate, this embodiment further provides a preparation method of the mask plate, including preparing the main body portion and the support portion respectively, fixing the main body portion to the support portion by tensioning, and the preparation method further includes preparing the magnetic force adjusting portion at least at a part of the edge of the opening area of the support portion.

Preferably, the magnetic force adjusting part is prepared after the main body part tension net is fixed to the supporting part. Therefore, the stress distribution uniformity of the main body part and the supporting part when the magnetic force adjusting part is arranged to influence net stretching can be prevented, and the net stretching quality is ensured.

In this embodiment, the preparing the magnetic force adjusting portion includes electroplating to form the magnetic structure. Of course, the magnetic conductive structure can also be formed by other processes (such as a patterning process).

In this embodiment, the preparation of the main body portion and the support portion and the fixing of the main body portion stretch net to the support portion all adopt the conventional process, and are not described herein again.

Example 2

The embodiment provides a mask plate, and is different from embodiment 1 in that each opening area of a supporting part has at least one section of irregular edge with the same size and shape, and the irregular edge of each opening area is provided with a magnetic force adjusting part with the same magnetic force adsorption strength.

In the present embodiment, as shown in fig. 5, each opening area 21 of the support portion 2 has irregular rectangular edges having the same size and shape, the edge lines at the four corners of each opening area 21 are arc lines having the same curvature, and the magnetic force adjusting portions 3 having the same magnetic force adsorption strength are provided at the four corners of each opening area 21.

Since the magnetic force absorption strength is significantly insufficient at the four corners of each opening area 21 of the support part 2 compared with other areas of the support part 2, the drooping amount at the four corners of each opening area 21 is significantly different from that in other areas, which affects the flatness of the main body part. The magnetic structure with the magnetic adsorption strength higher than that of the support part 2 is arranged at four angular positions of each opening area 21 of the support part 2, the magnetic adsorption strength at four angular positions of each opening area 21 of the support part 2 can be enhanced, the adsorption magnetic force between the four angular positions of each opening area 21 of the support part 2 and a magnetic plate in evaporation equipment is greatly enhanced, so that the situation that the four angular positions of each opening area 21 of the support part 2 generate large sag when evaporation is carried out is avoided, the flatness of the four angular positions of each opening area 21 of the support part 2 when evaporation is carried out is ensured, the phenomenon that the main body part generates wrinkle sag and local deformation under the supporting action of the support part 2 is reduced or avoided, materials to be plated can be more accurately evaporated to corresponding positions on a substrate to be plated, poor color mixing of evaporation layers is reduced or avoided, and the evaporation yield is improved.

It should be noted that the mask plate in this embodiment may also be a mask plate in which each opening region 21 of the support portion 2 has a section of irregular edge with the same size and shape, for example, a mask plate for evaporating a bang screen, and a magnetic force adjusting portion 3 with the same magnetic force adsorption strength is disposed at the irregular bang edge of each opening region 21, as shown in fig. 6; alternatively, each opening area 21 of the support portion 2 has irregular edges with the same size and shape, such as a mask plate for evaporating a water droplet screen, and the entire irregular edge of each opening area 21 is provided with the magnetic force adjusting portion 3 with the same magnetic force adsorption strength, as shown in fig. 7.

Other structures and preparation methods of the mask plate in this embodiment are the same as those in embodiment 1, and are not described herein again.

Example 3

The embodiment provides a mask, which is different from embodiments 1-2, and as shown in fig. 8, an area for vapor deposition of a support portion 2 includes at least two sub-areas, each sub-area is butted, and at least one opening area 21 is respectively arranged in each sub-area; the size of the opening area 21 in each sub-area is similar in shape and shape; the irregular edges of the opening areas 21 in each sub-area are respectively provided with a magnetic force adjusting part, the magnetic force adsorption strength of the magnetic force adjusting parts at different positions in the same sub-area is the same, and the magnetic force adsorption strength of the magnetic force adjusting parts in different sub-areas is different.

Wherein, because the irregular edge of opening area 21 in each subregion on supporting part 2 is obviously not enough than the other regional magnetic force adsorption intensity of supporting part 2, the sagging amount can appear in the irregular edge of opening area 21 in each subregion and is obviously different with other regions, influences the flatness of main part. The magnetic force adjusting parts in different sub-areas respectively adopt magnetic conduction structures with different magnetic force adsorption strengths, so that the magnetic force adsorption strength at the irregular edges of the opening areas 21 in different sub-areas on the supporting part 2 can be adjusted, the magnetic force adsorption strength at the irregular edges of the opening areas 21 in different sub-areas on the supporting part 2 is enhanced to different degrees, the adsorption magnetic force between the irregular edges of the opening areas 21 in each sub-area on the supporting part 2 and a magnetic plate in evaporation equipment is greatly enhanced, the irregular edges of the opening areas 21 in each sub-area on the supporting part 2 are prevented from generating larger sag when in evaporation, the flatness of the irregular edges of the opening areas 21 in each sub-area on the supporting part 2 during evaporation is ensured, the main body part is further reduced or prevented from generating sag and local deformation under the supporting action of the supporting part 2, and the material to be plated can be more accurately evaporated to the corresponding position on the substrate to be plated, reduce or avoid the appearance of the poor colour mixture of coating by vaporization layer, improve the coating by vaporization yield.

In this embodiment, the area of the support part 2 for vapor deposition includes two sub-areas, which are a central area 101 and a peripheral area 102, respectively, the peripheral area 102 surrounds the central area 101, and a plurality of opening areas 21 are respectively disposed in the central area 101 and the peripheral area 102; the magnetic force adjusting part includes a first adjusting part 31 and a second adjusting part 32; each opening area 21 in the central area 101 has irregular rectangular edges with the same size and shape, and the edge lines of the four corners of each opening area 21 in the central area 101 are arc lines with the same curvature; first regulating parts 31 are provided at four angular positions of each opening area 21 in the central area 101; the shape of each open area 21 in the peripheral area 102 is the same as the shape of each open area 21 in the central area 101, and the area of each open area 21 in the central area 101 is 9/10 of the area of each open area 21 in the peripheral area 102; the four angular positions of each opening area 21 in the peripheral area 102 are provided with second regulating parts 32; the magnetic force adsorption strength of the first regulating portion 31 is 9/10 of the magnetic force adsorption strength of the second regulating portion 32.

Because the droop degree of the second adjusting part 32 on the supporting part 2 is more obvious than the droop degree of the first adjusting part 31 on the supporting part 2, the magnetic adsorption strength of the second adjusting part 32 is greater than that of the first adjusting part 31, so that the irregular edges of the opening areas 21 in the central area 101 and the peripheral area 102 on the supporting part 2 tend to be flat during evaporation, the overall flatness of the supporting part 2 during evaporation is ensured, the wrinkle droop and local deformation of the main body part under the supporting effect of the supporting part 2 are reduced or avoided, and the evaporation yield is improved.

The size and shape of the opening area in each sub-area of the support part may be different. That is, the size and shape difference of the opening area in each sub area on the support part is not limited to the case shown in fig. 8, and the opening area in each sub area may be a combination of a plurality of opening areas and set according to actual requirements. It is sufficient to adjust the flatness of the irregular edge of each opening region to be the same as that of the other conventional regions for vapor deposition by making the magnetic force adsorption strengths of the magnetic force adjusting portions provided in the different sub-regions different.

In addition, it should be noted that the size and shape differences of the various opening areas on the supporting part cannot be too large, so that the risk of damaging the mask plate due to too large local deformation and too large adjustment difference of the magnetic adsorption strength of different sub-areas when the supporting part is stretched is avoided.

Example 4

The embodiment provides a mask plate, which is different from embodiments 1 to 3 in that a magnetic force adjusting part is a conductive structure, and the conductive structure can be supplied with currents of different magnitudes so as to enable the conductive structure to have magnetic force adsorption strengths of different magnitudes; an insulating layer is also arranged between the conductive structure and the supporting part.

The supporting part is made of invar alloy material and can conduct electricity, so that the supporting part and the conducting structure need to be separated through an insulating layer.

The conductive structure can have different magnetic adsorption strengths when currents with different magnitudes are introduced, by arranging the conductive structure at least part of the edge of the opening area, for example, arranging the conductive structure at the whole edge or partial edge of the opening area, the magnetic adsorption strength of the supporting part at the corresponding position can be adjusted, so that the adsorption magnetic force between the magnetic plate in the evaporation equipment and the whole edge or partial edge of the opening area on the supporting part is greatly enhanced, thereby avoiding the edge of the opening area on the supporting part from generating larger sagging during the evaporation, ensuring the flatness of the edge of the opening area on the supporting part, and then reduce or avoid the main part to appear the fold flagging and local deformation under the supporting role of supporting part, make and treat that the material of plating can more accurately the coating by vaporization to the relevant position on treating the plating base plate, reduce or avoid appearing coating by vaporization layer colour mixture bad, improve the coating by vaporization yield.

In this embodiment, the magnetic force of the conductive structure is proportional to the current flowing through the conductive structure. That is, the larger the current passed through the conductive structure, the greater the magnetic adsorption strength. The conductive structure can be made into a conductive coil, the conductive coil can generate a magnetic field when being electrified, and the magnetic field interacts with the magnetic field of the magnetic plate in the evaporation equipment, so that the magnetic adsorption strength between the corresponding position of the supporting part and the magnetic plate is adjusted.

Other structural arrangements of the mask plate in this embodiment are the same as those in any of embodiments 1 to 3. As shown in fig. 9, the magnetic force adjusting portion is a conductive structure, the structure of the mask is set as the overall structure of the mask in the scheme of embodiment 3, and the conductive structure can input different currents to the irregular edges of the opening area 21 in different sub-areas on the supporting portion 2, so that the independent control of the magnetic force adsorption strength at the irregular edges of the opening area 21 in different sub-areas on the supporting portion 2 is realized, and the magnetic force adsorption strength compensation is performed to different sagging degrees at the irregular edges of the opening area 21 in different sub-areas on the supporting portion 2.

As shown in fig. 9, the conductive structure includes a conductive pattern 301, two signal leads 302 and two electrodes 303, where the two signal leads 302 are respectively connected to two ends of the conductive pattern 301, the other ends of the two signal leads 302 are respectively connected to the two electrodes 303, and the two electrodes 303 are respectively used for connecting the positive electrode and the negative electrode of an external power supply, so that the external power supply can provide current for the conductive pattern 301. In the case where the shape, size and material of the conductive pattern 301 in the central region 101 and the peripheral region 102 are all the same, the current applied to the first adjustment portion 31 is 9/10 of the current applied to the second adjustment portion 32. That is, the region for vapor deposition of the support 2 is controlled in a divisional manner, and the conductive patterns 301 in the central region 101 can be connected in series in the vicinity of each other and controlled in equal current; each of the conductive patterns 301 in the peripheral region 102 is individually controlled by inputting the same current respectively.

It should be noted that, when the sizes and shapes of the opening areas in the sub-areas on the support part are different, the conductive structures in the sub-areas can be respectively controlled by inputting currents with different sizes, and since the input currents are in direct proportion to the magnetic field generated by the conductive structures, the magnetic adsorption strength can be independently adjusted for each sub-area, so as to better improve different sagging amounts of the edges of the opening areas in the sub-areas.

Based on the above structure of the mask, this embodiment further provides a method for manufacturing the mask, which is different from the method for manufacturing the mask in embodiments 1 to 3 in that the step of manufacturing the magnetic force adjusting portion includes forming the conductive structure by using a composition process.

Other parts of the preparation method of the mask plate in this embodiment are the same as those in embodiment 1, and are not described herein again.

The beneficial effects of embodiments 1-4, the mask plate provided by embodiments 1-4, through set up the magnetic force adjustment part in at least some edges of at least some opening areas, can adjust the size of the magnetic force adsorption strength of supporting part in relevant position department, make the magnetic force of absorption between the whole edge or the local edge of opening area on magnetic plate and the supporting part in the evaporation equipment strengthen greatly, thereby avoid the edge of opening area on the supporting part to produce great flagging when the coating by vaporization, guaranteed the flatness of opening area edge on the supporting part, and then reduce or avoid the main part to appear fold flagging and local deformation under the supporting action of supporting part, make the material of waiting to plate can more accurately evaporate the coating by vaporization to the relevant position on the base plate of waiting to plate, reduce or avoid appearing evaporating the coating layer colour mixture bad, improve the coating by vaporization yield.

Example 5

The present embodiment also provides an evaporation method, including:

then according to the evaporation precision difference of different positions of the evaporation coating layer, a magnetic force adjusting part is prepared in the area of the mask plate supporting part, which corresponds to the area with poor evaporation coating precision of the evaporation coating layer, and the magnetic force adsorption strength of the corresponding position of the mask plate supporting part is adjusted.

The evaporation method can ensure the integral flatness of the mask plate, thereby improving the evaporation effect.

It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.

Claims

1. A mask plate comprises a main body part and a supporting part, wherein the main body part is arranged on the supporting part, and an area of the supporting part for evaporation comprises a plurality of opening areas;

the main body part is a precise metal mask plate for defining RGB sub-pixels; the supporting part is a supporting mask plate which is used for shielding a non-evaporation area and supporting the precise metal mask plate;

the opening area on the supporting part is an area corresponding to the whole sub-board to be plated;

the area of the supporting part for evaporation comprises at least two sub-areas, the sub-areas are connected in an abutting mode, and at least one opening area is arranged in each sub-area;

the irregular edges of the opening areas in the sub areas are respectively provided with the magnetic force adjusting parts, the magnetic force absorption strength of the magnetic force adjusting parts at different positions in the same sub area is the same, and the magnetic force absorption strength of the magnetic force adjusting parts in different sub areas is different;

the area for vapor deposition of the support part comprises two sub-areas which are a central area and a peripheral area respectively, the peripheral area surrounds the central area, and a plurality of opening areas are arranged in the central area and the peripheral area respectively; the magnetic force adjusting part comprises a first adjusting part and a second adjusting part;

2. A mask plate according to claim 1, wherein the magnetic force adjusting portion is disposed on a side of the supporting portion away from the main body portion.

3. A mask plate according to claim 2, wherein the magnetic force adjusting portion is a magnetic conductive structure having a magnetic force adsorption strength greater than that of the supporting portion.

4. A mask plate according to claim 2, wherein the magnetic force adjusting portion is a conductive structure, and the conductive structure can be supplied with currents of different magnitudes so as to have magnetic force adsorption strengths of different magnitudes;

5. A mask according to claim 3, wherein the material of the magnetic conductive structure comprises a soft magnetic iron-cobalt alloy or an iron-nickel-cobalt alloy.

6. A mask according to claim 4, wherein the conductive structure has a magnetic adsorption strength proportional to the current passing through it.

7. A mask plate according to claim 3 or 4, wherein each of the opening areas of the supporting portion has the same regular rectangular edge,

8. A mask plate according to claim 3 or 4, wherein each of the opening regions of the support portion has at least one section of irregular edge having the same size and shape, and the irregular edge of each of the opening regions is provided with the magnetic force adjusting portion having the same magnetic force adsorption strength.

9. A mask according to claim 8, wherein each of the opening areas of the supporting portion has irregular rectangular edges of the same size and shape, edge lines of four corners of each of the opening areas are arc lines of the same curvature,

10. A mask plate according to claim 1, wherein the support portion is plate-shaped, and the thickness of the support portion is 105-110 μm.

11. A method for producing a mask according to any one of claims 1 to 10, comprising separately producing a main body portion and a support portion, and fixing a tension net for the main body portion to the support portion, characterized in that the production method further comprises producing a magnetic force adjusting portion at least at a part of an edge of an opening area of the support portion.

12. A method for manufacturing a mask according to claim 11, wherein said magnetic force adjusting portion is manufactured after said main body portion tension net is fixed to said supporting portion.

13. A method for making a mask according to claim 12, wherein the step of making the magnetic force adjustment portion comprises forming a magnetic conductive structure by electroplating or forming a conductive structure by a patterning process.

14. An evaporation method adopting a mask plate as claimed in any one of claims 1 to 10, characterized by comprising: