CN113930739B - Vacuum evaporation coating equipment - Google Patents
Vacuum evaporation coating equipment Download PDFInfo
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- CN113930739B CN113930739B CN202110978455.0A CN202110978455A CN113930739B CN 113930739 B CN113930739 B CN 113930739B CN 202110978455 A CN202110978455 A CN 202110978455A CN 113930739 B CN113930739 B CN 113930739B
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- 238000000576 coating method Methods 0.000 title claims abstract description 71
- 239000011248 coating agent Substances 0.000 title claims abstract description 66
- 238000007738 vacuum evaporation Methods 0.000 title claims abstract description 17
- 230000007246 mechanism Effects 0.000 claims abstract description 74
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 56
- 238000001816 cooling Methods 0.000 claims abstract description 47
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 238000001704 evaporation Methods 0.000 claims abstract description 32
- 230000008020 evaporation Effects 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 239000000498 cooling water Substances 0.000 claims description 29
- 238000010884 ion-beam technique Methods 0.000 claims description 16
- 238000012937 correction Methods 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 229910000851 Alloy steel Inorganic materials 0.000 claims description 5
- 229910001018 Cast iron Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 230000005855 radiation Effects 0.000 abstract description 7
- 239000002159 nanocrystal Substances 0.000 abstract description 4
- 239000002699 waste material Substances 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 49
- 238000012360 testing method Methods 0.000 description 14
- 239000004033 plastic Substances 0.000 description 10
- 229920003023 plastic Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000010410 layer Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000009826 distribution Methods 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 239000007888 film coating Substances 0.000 description 3
- 238000009501 film coating Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000012788 optical film Substances 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000005304 optical glass Substances 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/221—Ion beam deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
- C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/52—Means for observation of the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses vacuum evaporation coating equipment, which comprises a vacuum cavity, wherein the top in the vacuum cavity is provided with a central rotation mechanism, the lower end of the central rotation mechanism is connected with a workpiece disc for placing a substrate to be coated, the bottom in the vacuum cavity is provided with an ion source device and an evaporation device for evaporating coating materials, the vacuum cavity is internally provided with a heating device, the evaporation device comprises an electronic generator and a tank-shaped water cooling mechanism, the tank-shaped water cooling mechanism is arranged around the periphery of the electronic generator, the workpiece disc is provided with a temperature sensor, the vacuum cavity is provided with a controller, and the controller controls cold water circulation of the tank-shaped water cooling mechanism according to the temperature detected by the temperature sensor. The advantages are that: the redundant radiation heat of the electronic generator can be brought out in real time, so that the substrate warpage and the like caused by overhigh temperature are avoided; the cold water circulation can be controlled according to the real-time temperature, so that not only is the overhigh temperature in the cavity avoided, but also the heat waste is avoided; the device is particularly suitable for substrates requiring low-temperature coating, such as micro-nano crystals with the thickness of less than 1 mm.
Description
Technical Field
The invention belongs to the technical field of coating, and particularly relates to vacuum evaporation coating equipment.
Background
Since the beginning of the 19 th century when films were manufactured and used, the first generation of scientists have conducted intensive research into film theory, manufacturing process, materials and application fields, gradually forming a relatively complete optical film system. The film technology is widely applied in the fields of high-tech industries such as electronic components, laser, aerospace and the like, and the film technology increasingly influences the performance of products, so that the film technology becomes an important technology in the high-tech industries.
Vacuum evaporation coating is a thin film manufacturing method in which a coating material is heated in a vacuum environment to be vaporized and deposited on a substrate to obtain a thin film material.
The existing vacuum evaporation coating method is mainly applied to the fields of manufacturing precise optical films and the like, and the coated substrate mainly comprises substrates of optical glass, plastic, resin, semiconductor materials and the like.
Since the number of optical film layers is usually large, the substrate temperature is in an incremental state from the beginning of film coating to the end of film coating. According to different coating requirements and coating processes, the temperature of the substrate in the vacuum cavity is high from tens to hundreds of degrees centigrade in the coating process, (1) most glass substrates can bear the coating temperature, but thinner substrates, such as planar substrates with the thickness of less than 1mm (such as micro-nano crystal planar substrates with the thickness of less than 1 mm), if the number of coating layers is more, the temperature rise of the coating temperature is higher, and after the coating is finished, the substrate warp deformation is serious, so that a coated product is scrapped. (2) Plastic and resin substrates are generally not able to withstand high temperatures (the glass transition temperatures of some plastic and resin substrates are listed in table 1 below), and the temperature is controlled below 200 c during coating.
TABLE 1 comparison of partial Performance of Plastic and resin substrates
Performance of | ARTON | PC | PMMA | Zeonex |
Density/(g/cm 3) | 1.08 | 1.19 | 1.19 | 1.01 |
Water absorption (%) | 0.4 | 0.4 | 2.0 | <0.01 |
Refractive index | 1.51 | 1.58 | 1.49 | 1.53 |
Transmittance (%) | 92 | 90 | 93 | 91 |
Abbe number | 57 | 30 | 58 | 52 |
Glass transition temperature T g/. Degree.C | 171 | 150 | 93 | 140 |
Hardness of pencil | 2H | B | 3H | H |
Aiming at the substrate coating which cannot bear high temperature, the prior art mainly adopts a low-temperature coating mode, such as low-energy ion source auxiliary deposition; coating film at a low deposition rate; and closing the cavity heating mechanism, namely, not heating the normal-temperature coating film.
In order to cater to the problems of deformation and warping of the substrate caused by high temperature due to the fact that the substrate cannot bear high temperature when plastic, resin and thinner substrates are coated, the prior art mainly adopts low-energy, normal-temperature (non-heating) and low-deposition-rate coating. With this approach, a series of problems are caused to the film, such as:
(1) Low-energy coating: the compactness of the film layer is insufficient, the hole gap between the film layers is increased, and the weather resistance is poor.
(2) Coating at normal temperature: the water vapor in the plastic and resin base plate can not be completely discharged without heating and baking, and the quality of the film layer is poor, such as insufficient adhesive force of the film layer, and the hundred-cell test is not finished.
(3) Coating at a low deposition rate causes a prolonged coating time due to a reduced coating rate. And for the preparation of a film with a large number of layers of a film system, before the film formation of the next cover product is started after the film formation of one cover product is finished, the production takt is prolonged again due to the fact that the temperature of the film forming equipment is reduced, and the film forming efficiency is not reduced greatly. Long production beat and low production efficiency.
The above is mainly used for controlling or reducing the excessive temperature rise in the vacuum cavity, and a coating process is not adopted. And high-energy high-temperature coating is adopted, although the quality of the film layer is better than that of the low-energy low-temperature coating, some very thin substrates, such as optical glass substrates with the thickness of less than 1mm (such as micro-nano crystal plane substrates with the thickness of less than 1 mm), plastic substrates and resin substrates cannot bear the high-energy high-temperature coating, otherwise, after the film formation is finished, the deformation of the substrates is serious, and the products cannot be used or scrapped.
For example, chinese patent No. 201310429910.7 discloses a vacuum coating machine, which includes a vacuum chamber, an electron gun and an auxiliary ion source are disposed at the lower part of the inner cavity of the vacuum chamber, a substrate frame facing the electron gun and the auxiliary ion source is disposed above the electron gun and the auxiliary ion source, and a substrate heater is disposed at the outer side of the substrate frame; the top of the substrate frame is connected with the top of the vacuum chamber, a light control system and a crystal control system are arranged at the positions, which are connected with the monitoring equipment through signal wires, of the electron gun, the auxiliary ion source, the light control system and the crystal control system. The patent uses the substrate heater to heat the substrate stably and uniformly before coating so as to improve the compactness and uniformity of the film; the ion beam bombards the growing film to form compact and homogeneous film structure, and this can raise the stability and quality of the film and improve the optical and mechanical performance of the film. However, the patent does not consider the problem that the temperature rise in the cavity is not controllable or that excessive heat cannot be transferred out in time.
Therefore, in the prior art, along with the extension of the coating time, the temperature rise in the cavity is uncontrollable or the excessive heat cannot be timely transferred, and a technical scheme is needed.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides vacuum evaporation coating equipment to solve the problems that the temperature rise in a cavity is uncontrollable or excessive heat cannot be timely transferred along with the extension of coating time, and adopts the following technical scheme:
The utility model provides a vacuum evaporation coating equipment, includes the vacuum cavity, the top is equipped with central rotation mechanism in the vacuum cavity, and central rotation mechanism lower extreme is connected with the work piece dish that is used for placing the base plate of waiting to coat, and the bottom is equipped with ion source device and is used for evaporating the evaporation plant of coating film material in the vacuum cavity, is equipped with heating device in the vacuum cavity, evaporation plant includes electron generator, jar form water-cooling mechanism, and jar form water-cooling mechanism encircles and locates electron generator periphery, and the work piece dish is equipped with temperature sensor, is equipped with the controller outside the vacuum cavity, and the cold water circulation of temperature control jar form water-cooling mechanism that the controller detected according to temperature sensor.
As the preferable scheme, the tank-shaped water cooling mechanism comprises a tank body, the tank body is hollow, a cooling water coil is arranged on the outer wall of the tank body in a surrounding mode, and the cooling water coil is communicated with a cooling water system outside the vacuum cavity.
As the preferred scheme, jar body terminal surface is equipped with a plurality of locating holes, and vacuum cavity inner bottom is equipped with a plurality of reference columns, through reference column, locating hole with jar body detachable installation in vacuum cavity inner bottom.
As the preferable scheme, the bottom in the vacuum cavity is detachably provided with a bottom guard board, the positioning column is arranged on the bottom guard board, the bottom surface of the bottom guard board is provided with a plurality of bottom guard board supporting columns, and the ion source device and the evaporation device are protruded out of the bottom guard board.
Preferably, the cooling water pipe passes through the bottom guard plate and is communicated with a cooling water system outside the vacuum cavity.
As a preferred scheme, the evaporation device further comprises a first baffle mechanism, wherein the first baffle mechanism comprises a first supporting rod and a first rotating plate, the first supporting rod is positioned beside the tank-shaped water cooling mechanism and is vertically arranged on the bottom guard plate, and the first rotating plate is positioned on the upper side of the electronic generator and is rotatably arranged on the first supporting rod.
As a preferred scheme, the ion source device comprises an ion beam generator and a second baffle mechanism, wherein the second baffle mechanism comprises a second supporting rod and a second rotating plate, the second supporting rod is positioned beside the ion beam generator and is vertically arranged on the bottom guard plate, and the second rotating plate is positioned on the upper side of the ion beam generator and is rotatably arranged on the second supporting rod.
As a preferable scheme, a pair of film thickness correction plates are arranged at the side wall of the vacuum cavity below the workpiece disc, and the film thickness correction plates are rotationally connected with the inner wall of the vacuum cavity.
As a preferred scheme, the side wall of the vacuum cavity is provided with a vacuum cavity door, the vacuum cavity door is provided with a window, and the side wall of the tank body is provided with a reserved observation window corresponding to the window.
As the preferred scheme, the tank body further comprises a tank body inner wall, the tank body inner wall and the tank body outer wall are welded into a whole, the tank body inner wall is made of any one of stainless steel, cast iron and alloy steel materials, and the tank body outer wall and the cooling water coil pipe are made of copper materials.
The beneficial effects of the invention are as follows:
1. Through a tank-shaped water cooling mechanism, redundant radiant heat of the electronic generator is immediately brought out of the cavity, and the phenomenon that a coated substrate is warped and deformed due to overhigh temperature in a vacuum coating cavity is avoided, so that the device is more suitable for film forming of thin substrates, plastic substrates, resins and other substrates which cannot bear high temperature.
2. The cold water circulation in the tank-shaped water cooling mechanism can be controlled in time according to the real-time temperature, so that not only is the overhigh temperature in the cavity avoided, but also heat waste is avoided.
3. When high-temperature film forming is needed, the tank-shaped water cooling mechanism can be removed at any time to restore the original shape of the equipment, and the installation and the removal are simple and convenient.
4. The inner wall (one side close to the electronic generator) of the tank body is made of any one of stainless steel, cast iron and alloy steel materials, and can be sandblasted, cleaned and maintained conveniently.
5. The outer wall of the tank body is made of copper materials, the cooling water coil pipe is also made of copper materials, and the excessive radiation generated by the electronic generator can be discharged out of the vacuum cavity in a maximum limit by means of the excellent heat conducting property of copper and cooling water.
6. The positioning holes are reserved on the end face of the tank body, the positioning columns are preset on the cavity bottom guard plate, and the tank-shaped water cooling mechanism can be accurately positioned as long as the positioning holes of the tank body fall into the positioning columns preset on the bottom guard plate, so that the tank-shaped water cooling mechanism is simple and accurate to position.
7. The vacuum cavity door is installed to vacuum cavity lateral wall, and vacuum cavity door is equipped with the window, and jar body lateral wall is equipped with the reservation observation window corresponding with the window. The device is convenient for a user to observe the state of the electronic generator when coating so as to realize the purpose of adjusting the evaporation parameters of the electronic generator in real time.
8. Because the tank-shaped water cooling mechanism is added, the redundant radiant heat generated by the electronic generator can be immediately transmitted outside the cavity, and the coating temperature in the vacuum cavity is reduced by 30 ℃ or more. Due to the reduction of the temperature, a coating mode with higher energy can be used, so that a coating film layer has better quality and better weather resistance.
9. The bottom guard plate is detachably arranged at the inner bottom of the vacuum cavity, so that the inner bottom of the vacuum cavity is effectively protected, and the detachable design is convenient for detaching the bottom guard plate and cleaning correspondingly.
10. The material for manufacturing the pot-shaped water cooling mechanism is easy to obtain and low in cost.
11. The device is particularly suitable for coating substrates which cannot bear high-temperature coating, such as micro-nano crystal substrates with the thickness of less than 1mm, plastic substrates, resin substrates and other optical substrates.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a vacuum evaporation coating apparatus;
FIG. 2 is a schematic view of a tank-like water cooling mechanism;
FIG. 3 is a test result when EB2 is off and EB1 is on;
FIG. 4 is a test result when EB2 is started and EB1 is shut down;
FIG. 5 shows test results at the start of EB2 and EB 1;
FIG. 6 is a graph of the effect of ion source on temperature distribution;
FIG. 7 is a graph showing the influence of the second heater on the temperature distribution;
FIG. 8 is a graph showing the temperature change when a tank-shaped water cooling mechanism is used;
FIG. 9 is a graph showing the temperature change when the tank-shaped water cooling mechanism is not used;
FIG. 10 is a graph showing a comparison of temperatures when a tank-shaped water cooling mechanism is used or not;
In the figure: 1. the device comprises a center rotary mechanism, a workpiece disc, a vacuum cavity, a film thickness correction plate, a rotating mechanism, a first baffle mechanism, an electronic generator, a bottom baffle support column, a bottom baffle, an ion beam generator, a second baffle mechanism, a vacuum cavity door, a tank-shaped water cooling mechanism, a tank inner wall, a tank outer wall, a cooling water coil, a reserved observation window, a positioning hole, a 1331, a water inlet pipe, a 1332, a water outlet pipe, an inner ring of the workpiece disc, a middle, an outer ring of the workpiece disc, a No Can mask, a non-tank-shaped water cooling mechanism and a Can mask.
Detailed Description
The following specific examples are presented to illustrate the present invention, and those skilled in the art will readily appreciate the additional advantages and capabilities of the present invention as disclosed herein. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict.
Referring to fig. 1-2, this embodiment provides a vacuum evaporation coating apparatus, including vacuum cavity 3, the top is equipped with central rotary mechanism 1 in the vacuum cavity 3, the work piece dish 2 that is used for placing the base plate that waits to coat film is connected with at the central rotary mechanism 1 lower extreme, work piece dish 2 high-low speed rotation and static when realizing the coating film through central rotary mechanism 1, work piece dish 2 is umbrella stand structure, be equipped with ion source device and be used for evaporating the evaporation plant of coating film material in the vacuum cavity 3, be equipped with heating device in the vacuum cavity 3, evaporation plant includes electron generator 7, tank form water-cooling mechanism 13, and tank form water-cooling mechanism 13 encircles and locates electron generator 7 periphery, and work piece dish 2 is equipped with temperature sensor, and vacuum cavity 3 is equipped with the controller outward, and the controller is according to temperature sensor detects the cold water circulation of the temperature control tank form water-cooling mechanism 13 that obtains.
The heating device comprises a first heater arranged on the inner side wall of the vacuum cavity 3 and a second heater arranged at the joint of the outer wall of the workpiece disc 2 and the top of the vacuum cavity 3.
It should be noted that, the evaporation device may be provided in one or more, and when there are a plurality of evaporation devices, several of the evaporation devices may be selected to be provided with the tank-shaped water cooling mechanism 13, which may be specifically provided according to actual requirements. For example, fig. 1 shows a case where two evaporation devices are provided, the two evaporation devices being provided on both sides of the bottom inside the vacuum chamber 3, and the ion source device being provided in the center of the bottom inside the vacuum chamber 3.
Namely, by the tank-shaped water cooling mechanism 13, the redundant radiant heat of the electronic generator 7 is immediately taken out of the cavity, so that the film-coated substrate is prevented from being warped and deformed due to the overhigh temperature in the vacuum film-coated cavity, and the equipment is more suitable for film-forming of thin substrates, plastic, resin and other substrates which cannot bear high temperature.
And, owing to add the water-cooling mechanism 13 of pot shape, can make because of the unnecessary radiant heat that electron generator 7 produced is transmitted to outside the cavity body in real time for the coating film temperature in the vacuum cavity 3 drops by 30 ℃ or more, further owing to the reduction of temperature, can use the coating film mode of higher energy, and then realize that the coating film layer has better quality, makes its weatherability better.
The device can also control the cold water circulation in the tank-shaped water cooling mechanism 13 in time according to the real-time temperature, so that not only is the overhigh temperature in the cavity avoided, but also the heat waste is avoided.
Specifically:
referring to fig. 2, the tank-shaped water cooling mechanism 13 comprises a tank body, the tank body is hollow, a cooling water coil 133 is arranged around the outer wall 132 of the tank body, and the cooling water coil 133 is communicated with a cooling water system outside the vacuum cavity 2. The cooling water coil 133 is provided with a water inlet pipe 1331 and a water outlet pipe 1332, and the cooling water coil 133 is communicated with a cooling water system outside the vacuum cavity 3 through the water inlet pipe 1331 and the water outlet pipe 1332. The cooling water system is provided on the outer wall of the vacuum chamber 3, and is used for cooling the vacuum chamber 3 and supplying cooling water required for the operation of the tank-shaped water cooling mechanism 13.
The end face of the tank body is provided with a plurality of positioning holes 135, the bottom in the vacuum cavity 3 is provided with a plurality of positioning columns (the positioning columns are not shown in the figure), and the tank body is detachably arranged at the bottom in the vacuum cavity 3 through the positioning columns and the positioning holes 135.
The bottom in the vacuum cavity 3 can be dismantled and be equipped with end backplate 9, and the reference column is located on end backplate 9, and the bottom surface of end backplate 9 is equipped with a plurality of end backplate support columns 8, ion source device, evaporation plant all protrude in end backplate 9.
That is, the positioning hole 135 is arranged on the end face of the tank body, the positioning column is preset on the cavity bottom guard plate 9, and the tank-shaped water cooling mechanism 13 can be accurately positioned as long as the positioning hole 135 of the tank body falls onto the positioning column preset on the bottom guard plate 9, and the positioning of the tank-shaped water cooling mechanism 13 is simple and accurate.
In another aspect, when high-temperature film formation is required, the tank-shaped water cooling mechanism 13 can be removed at any time to restore the original equipment, and the installation and the removal are simple and convenient.
And set up detachable end backplate 9 in vacuum cavity 3 bottom, effectively protected vacuum cavity 3 interior bottom, and detachable design, the backplate 9 is and carry out corresponding clearance at the bottom of also convenient to detach.
Further, the water inlet pipe 1331 and the water outlet pipe 1332 of the cooling water coil 133 can pass through the bottom guard plate 9 and are communicated with a cooling water system outside the vacuum cavity 3 through position holes reserved on the wall of the vacuum cavity 3.
The evaporation device further comprises a first baffle mechanism 6, the first baffle mechanism 6 comprises a first supporting rod and a first rotating plate, the first supporting rod is located beside the tank-shaped water cooling mechanism 13 and is vertically arranged on the bottom guard plate 9, and the first rotating plate is located on the upper side of the electronic generator 7 and is rotatably arranged on the first supporting rod.
When coating, the first rotating plate is opened, the electronic generator 7 is opened for coating, and when the coating is finished, the electronic generator 7 is closed, and the first rotating plate is closed, so that the electronic generator 7 is protected.
The ion source device comprises an ion beam generator 10 and a second baffle mechanism 11, wherein the second baffle mechanism 11 comprises a second supporting rod and a second rotating plate, the second supporting rod is positioned beside the ion beam generator 10 and is vertically arranged on the bottom guard plate 9, and the second rotating plate is positioned on the upper side of the ion beam generator 10 and is rotatably arranged on the second supporting rod.
Also, when the ion beam generator 10 is required, the second turning plate is opened, and when the ion beam generator 10 is not required, the second turning plate is closed to protect the ion beam generator 10.
A pair of film thickness correction plates 4 are arranged on the side wall of the vacuum cavity 3 below the workpiece disc 2, and the film thickness correction plates 4 are rotatably connected with the inner wall of the vacuum cavity 3.
That is, a pair of film thickness correction plates 4 is provided between the work tray 2 and the evaporation apparatus, and the film thickness of the substrate to be coated is reduced by shielding the evaporation material directly above the evaporation source by rotation of the film thickness correction plates 4. Specifically, the film thickness correction plate 4 may be rotatably connected by a rotation mechanism 5 mounted on the inner wall of the vacuum chamber 3, and the rotation mechanism 5 may be an air cylinder or the like.
The side wall of the vacuum cavity 3 is provided with a vacuum cavity door 12, the vacuum cavity door 12 is provided with a window, and the side wall of the tank body is provided with a reserved observation window 134 corresponding to the window. The state of the electronic generator 7 during film plating is convenient for a device user to observe, so as to realize the purpose of adjusting the evaporation parameters of the electronic generator 7 in real time.
The tank body further comprises a tank body inner wall 131, the tank body inner wall 131 is made of any one of stainless steel, cast iron and alloy steel, and the tank body outer wall 132 and the cooling water coil 133 are made of copper materials.
That is, the inner wall 131 (side close to the electron generator) of the tank body is made of any one of stainless steel, cast iron and alloy steel, and can be sandblasted, cleaned and maintained conveniently. The outer wall 132 of the can body is made of copper material, and can be replaced by other materials with good heat conduction performance. The cooling water coil 133 is made of copper material. By means of the excellent heat conducting property of copper and cooling water, the excessive radiation generated by the electron generator 7 can be brought out of the vacuum cavity 3 in a maximum limit.
It should be noted that, since the inner wall 131 and the outer wall 132 of the can body are made of two materials, the inner wall 131 and the outer wall 132 may be welded integrally or may be separated.
The heat source in the vacuum evaporation coating equipment during coating was analyzed by a specific test.
Step1, confirming the source of temperature rise in the vacuum cavity 3 during film coating.
In the vacuum coating cavity, the main temperature rise can be caused: the evaporation source (which may be an electron gun) of the evaporation device, the ion source bombardment of the ion source device, and the heating device.
The sources and distribution of the heat sources were individually tested in the following manner.
Step1-1: the coating equipment, the left side electron gun (EB 1) discharges SiO 2 as a low refractive index material, the right side electron gun (EB 2) discharges Ti 3O5 as a high refractive index material, and the temperature of heat radiation generated by the evaporation source of the electron gun is collected (a temperature collector is arranged in an inner ring, a middle ring and an outer ring of a workpiece disc).
The following test conditions were satisfied:
1. Closing a first heater on the inner side wall of the vacuum cavity 3;
2. Closing a second heater on the outer wall of the workpiece disc 2;
3.EB1 EMISSION=140mA;
4.EB2 EMISSION=420mA。
The following operations are respectively carried out:
EB2 was turned off, EB1 was started, and the test results are shown in FIG. 3;
EB2 started, EB1 closed, test results are shown in FIG. 4;
EB2 start, EB1 start, test results are shown in FIG. 5.
It is known that the temperature rise caused by the electron gun is uniformly increased and the temperature graduation is uniform.
Step1-2: by changing the height and angle (position) of the ion source, different GRID GRIDs of the ion source are used, so that the temperature distribution caused by the ion source is finally in an optimal state, as shown in fig. 6.
The following test conditions were satisfied:
1. Closing a first heater on the inner side wall of the vacuum cavity 3;
2. Closing a second heater on the outer wall of the workpiece disc 2;
3. Only the ion source is operated.
Results: from the test results of fig. 6, it can be seen that the temperature rise caused by the ion source is uniformly increased and the temperature division is uniform.
Step1-3: by changing the power distribution of the second heaters of each segment, the heating temperature distribution in the workpiece tray 2 is finally made uniform, as shown with reference to fig. 7.
The following test conditions were satisfied:
1. only the second heater of the outer wall of the workpiece tray 2 is operated;
2. the electron gun is turned off;
3. the ion source is turned off.
Results: from the test results of fig. 7, it is known that the temperature rise caused by only the second heater is constant.
Step2, can reduce the thermal radiation analysis of the heat source during coating.
(1) Since the outer wall of the vacuum chamber 3 is already provided with a cooling water system and heating of the top and side walls of the chamber is required (heating of the workpiece tray 2), the heating by the heating means cannot be switched off and the heat radiation generated by it is not desired to be lost.
(2) The ion source part can select not to start the ion source when the ion source is not needed for auxiliary deposition, but the ion beam needs to bombard the workpiece disc 2 part all the time when the ion source is needed for auxiliary deposition coating process, and the heat generated by the ion beam can not be reduced.
(3) When the evaporation source (electron gun) deposits the coating material on the surface of the substrate, the electron gun generates a large amount of radiant heat in the process, and in this part, we can try to transfer or reduce the radiant heat in time.
Step3, analysis of the technical scheme.
According to the technical scheme, the tank-shaped water cooling mechanism 13 which can be flexibly installed and detached is additionally arranged, so that the aim of synchronously transferring the excessive heat radiation heat generated by the electron gun in time when the electron gun evaporates the coating material is fulfilled. The description is made by the following test:
(1) The temperature changes of the inner, middle and outer rings are shown in fig. 8 on the premise of coating by the same coating program without using the pot-shaped water cooling mechanism 13.
Abscissa time point description:
0-Exhaust Start Time;
62-Process Begin Time;
199-Process End Time。
maximum temperature of inner, middle and outer rings:
Tmax_inner/℃:135.5;
Tmax_middle/℃:137.0;
Tmax_outer/℃:135.0;
Δt/. Degree.C (maximum temperature difference): 2.0.
(2) When the pot-shaped water cooling mechanism 13 is used under the premise of coating by the same coating program, the temperature changes of the inner, middle and outer rings are shown in fig. 9.
Abscissa time point description:
0-Exhaust Start Time;
74-Process Begin Time;
208-Process End Time。
maximum temperature of inner, middle and outer rings:
Tmax_inner/℃:85.5;
Tmax_middle/℃:87.0;
Tmax_outer/℃:89.0;
ΔT/℃:3.5。
(3) Comparison:
(1) And (2) with a middle-turn temperature comparison (coating using the same coating program with and without the Can-shaped water cooling mechanism 13), as shown in fig. 10 (No Can mask indicates a Can-shaped water cooling mechanism, can mask indicates a Can-shaped water cooling mechanism), wherein:
ΔTmax(middle)=137.0℃-87.0℃=50℃。
As is clear from the comparison, the temperature of the coating film can be reduced by about 50 ℃ by using the tank-shaped water cooling mechanism 13 in the technical scheme.
The above examples are merely illustrative of the preferred embodiments of the present invention and are not intended to limit the scope of the present invention, and various modifications and improvements made by those skilled in the art to the technical solution of the present invention should fall within the protection scope of the present invention without departing from the design spirit of the present invention.
Claims (6)
1. The vacuum evaporation coating equipment is characterized by comprising a vacuum cavity, wherein the top in the vacuum cavity is provided with a central rotation mechanism, the lower end of the central rotation mechanism is connected with a workpiece disc for placing a substrate to be coated, the bottom in the vacuum cavity is provided with an ion source device and an evaporation device for evaporating coating materials, the vacuum cavity is internally provided with a heating device, the evaporation device comprises an electronic generator and a tank-shaped water cooling mechanism, the tank-shaped water cooling mechanism is arranged around the periphery of the electronic generator, the workpiece disc is provided with a temperature sensor, the vacuum cavity is provided with a controller, and the controller controls cold water circulation of the tank-shaped water cooling mechanism according to the temperature detected by the temperature sensor;
The tank-shaped water cooling mechanism comprises a tank body, the inside of the tank body is hollow, a cooling water coil is arranged on the outer wall of the tank body in a surrounding manner, and the cooling water coil is communicated with a cooling water system outside the vacuum cavity;
The end face of the tank body is provided with a plurality of positioning holes, the bottom in the vacuum cavity is provided with a plurality of positioning columns, and the tank body is detachably arranged at the bottom in the vacuum cavity through the positioning columns and the positioning holes;
The bottom in the vacuum cavity is detachably provided with a bottom guard plate, positioning columns are arranged on the bottom guard plate, the bottom surface of the bottom guard plate is provided with a plurality of bottom guard plate supporting columns, and the ion source device and the evaporation device are protruded out of the bottom guard plate;
the cooling water coil pipe passes through the bottom guard plate and is communicated with a cooling water system outside the vacuum cavity.
2. The vacuum evaporation coating apparatus according to claim 1, wherein the evaporation device further comprises a first baffle mechanism, the first baffle mechanism comprises a first supporting rod and a first rotating plate, the first supporting rod is located beside the tank-shaped water cooling mechanism and vertically installed on the bottom guard plate, and the first rotating plate is located on the upper side of the electronic generator and rotatably installed on the first supporting rod.
3. The vacuum evaporation coating apparatus according to claim 1, wherein the ion source device comprises an ion beam generator and a second baffle mechanism, the second baffle mechanism comprises a second support rod and a second rotating plate, the second support rod is located beside the ion beam generator and vertically installed on the bottom guard plate, and the second rotating plate is located on the upper side of the ion beam generator and rotatably installed on the second support rod.
4. The vacuum evaporation coating apparatus according to claim 1, wherein a pair of film thickness correction plates are provided at a side wall of the vacuum chamber below the workpiece tray, and the film thickness correction plates are rotatably connected to an inner wall of the vacuum chamber.
5. The vacuum evaporation coating apparatus according to claim 1, wherein the vacuum chamber side wall is provided with a vacuum chamber door, the vacuum chamber door is provided with a window, and the tank side wall is provided with a reserved viewing window corresponding to the window.
6. The vacuum evaporation coating equipment according to claim 1, wherein the tank body further comprises a tank body inner wall, the tank body inner wall and the tank body outer wall are welded into a whole, the tank body inner wall is made of any one of stainless steel, cast iron and alloy steel, and the tank body outer wall and the cooling water coil pipe are made of copper materials.
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CN207891417U (en) * | 2018-02-27 | 2018-09-21 | 河南航晨纳米材料有限公司 | A kind of software ionic reaction composite membrane machine |
CN213388868U (en) * | 2020-09-21 | 2021-06-08 | 厦门立扬光学科技有限公司 | Infrared optical film coating machine |
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