CN216404520U - Vacuum evaporation coating equipment - Google Patents
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- CN216404520U CN216404520U CN202122006653.9U CN202122006653U CN216404520U CN 216404520 U CN216404520 U CN 216404520U CN 202122006653 U CN202122006653 U CN 202122006653U CN 216404520 U CN216404520 U CN 216404520U
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Abstract
The utility model discloses vacuum evaporation coating equipment which comprises a vacuum cavity, wherein a central slewing mechanism is arranged at the top in the vacuum cavity, a workpiece tray for placing a substrate to be coated is connected to the lower end of the central slewing mechanism, evaporation devices for evaporating coating materials are arranged on two sides of the bottom in the vacuum cavity, an ion source device is arranged in the center of the bottom in the vacuum cavity, a heating device is arranged in the vacuum cavity, the evaporation devices comprise an electron generator and a pot-shaped water cooling mechanism, the pot-shaped water cooling mechanism is arranged around the periphery of the electron generator, a temperature sensor is arranged on the workpiece tray, a controller is arranged outside the vacuum cavity, and the controller is respectively connected with the temperature sensor and the pot-shaped water cooling mechanism. Has the advantages that: the redundant radiant heat of the electron generator can be taken out in time, and the warping of the substrate and the like are avoided; the cold water circulation of the tank-shaped water cooling mechanism can be controlled according to the real-time temperature, so that the waste of heat is avoided while the overhigh temperature is avoided; the device is particularly suitable for substrates with low-temperature coating requirements, such as micro-nano crystals with the thickness less than 1 mm.
Description
Technical Field
The utility model belongs to the technical field of coating, and particularly relates to vacuum evaporation coating equipment.
Background
Since the film was manufactured and used in the early 19 th century, the scientists of the first generation have conducted intensive research on the theory, preparation process, material and application field of the film, and have gradually formed a complete optical film system. At present, the thin film technology is widely applied in the high-tech industry fields such as electronic components, laser, aerospace and the like, and the thin film technology increasingly affects the performance of products, and becomes an important technology in the high-tech industry.
Vacuum evaporation coating is a thin film manufacturing method in which a coating material is heated in a vacuum environment, vaporized, and deposited on a substrate to obtain a thin film material.
The existing vacuum evaporation coating method is mainly applied to the fields of manufacturing precise optical films and the like, and the coated substrates mainly comprise substrates such as optical glass, plastic, resin, semiconductor materials and the like.
Because the number of the optical film layers is usually large, the temperature of the substrate is in an increasing state from the beginning of film coating to the end of film coating. According to different coating requirements and coating processes, the temperature of the substrate in the vacuum cavity is in the coating process, the high temperature from tens of degrees centigrade to hundreds of degrees centigrade is available, (1) most glass substrates can bear the coating temperature, but thin substrates, such as planar substrates with the thickness of less than 1mm (such as micro-nano crystal planar substrates with the thickness of less than 1 mm), if the coating layer number is more, the temperature rise of the coating temperature is higher, after the coating is finished, the substrate is seriously warped and deformed, and coated products are scrapped. (2) Plastic and resin substrates generally cannot withstand high temperatures (see table 1 below, which lists the glass transition temperatures of some plastic and resin substrates), and are coated at temperatures below 200 ℃.
TABLE 1 comparison table for partial performance of plastic and resin substrates
| Performance of | ARTON | PC | PMMA | Zeonex |
| Density/(g/cm)3) | 1.08 | 1.19 | 1.19 | 1.01 |
| Water absorption (%) | 0.4 | 0.4 | 2.0 | ＜0.01 |
| Refractive index | 1.51 | 1.58 | 1.49 | 1.53 |
| Transmittance (%) | 92 | 90 | 93 | 91 |
| Abbe number | 57 | 30 | 58 | 52 |
| Glass transition temperature Tg/℃ | 171 | 150 | 93 | 140 |
| Hardness of pencil | 2H | B | 3H | H |
Aiming at the coating of a substrate which cannot bear high temperature, the prior art mainly adopts a low-temperature coating mode, such as low-energy ion source auxiliary deposition; coating at a low deposition rate; and closing the cavity heating mechanism, namely not heating the normal-temperature coating film.
In order to meet the problems of deformation and warpage of a substrate caused by high temperature and the like because the substrate cannot bear high temperature when plastic, resin and a thinner substrate are coated, the prior art mainly adopts low-energy, normal-temperature (no heating) and low-deposition-rate coating. In this way, a series of problems are caused to the film, such as:
(1) low-energy film coating: the compactness of the film layers is insufficient, the hole gaps among the film layers are increased, and the weather resistance is poor.
(2) Coating at normal temperature: the plastic and resin substrates can not be completely released by not heating and baking, and the quality of the film layer is poor, such as insufficient adhesion of the film layer, failure of a hundred-grid test and the like.
(3) The low deposition rate of the film plating causes the film plating time to be lengthened due to the reduction of the film plating rate. And for the preparation of the film with more film series layers, before the film forming of the next cover of product is started after the film coating of one cover of product is finished, the production rhythm is prolonged again due to the cooling of the film coating equipment, so that the film forming efficiency is greatly reduced. The production beat is long and the production efficiency is low.
The above-mentioned coating process is mainly adopted for controlling or reducing overhigh temperature rise in the vacuum cavity. And high-energy high-temperature coating is adopted, although the quality of the coating is better than that of low-energy low-temperature coating, some very thin substrates, such as optical glass substrates (such as micro-nano crystal plane substrates) with the thickness of less than 1mm, plastic substrates and resin substrates, cannot bear the high-energy high-temperature coating, and otherwise, after the film forming is finished, the substrates are seriously deformed and warped, so that the products cannot be used or are scrapped.
For example, chinese patent application No. 201310429910.7 discloses a vacuum coater, which comprises a vacuum chamber, an electron gun and an auxiliary ion source are arranged at the lower part of the inner cavity of the vacuum chamber, a substrate holder facing the electron gun and the auxiliary ion source is arranged above the electron gun and the auxiliary ion source, and a substrate heater is arranged at the outer side of the substrate holder; the position where the top of the substrate frame is connected with the top of the inner cavity of the vacuum chamber is provided with a light control system and a crystal control system, and the electron gun, the auxiliary ion source, the light control system and the crystal control system are connected with monitoring equipment through signal lines. The patent stably and uniformly heats the substrate before film coating through a substrate heater so as to improve the compactness and uniformity of a film layer; the ion beam is used for bombarding the growing film layer to form a compact and uniform film layer structure, so that the stability and the quality of the film coating film layer are improved, and the purpose of improving the optical and mechanical properties of the film coating film layer is achieved. However, the patent does not consider the problem that the temperature rise in the cavity is uncontrollable or the excessive heat cannot be transferred out in time.
Therefore, a technical scheme for solving the problem that temperature rise in the cavity is uncontrollable or redundant heat cannot be transferred out in time along with the extension of the coating time in the prior art is urgently needed.
SUMMERY OF THE UTILITY MODEL
Aiming at the problems in the prior art, the utility model provides vacuum evaporation coating equipment to solve the problems that the temperature rise in a cavity is uncontrollable or redundant heat cannot be transferred out in time along with the extension of coating time, and the adopted technical scheme is as follows:
the utility model provides a vacuum evaporation coating equipment, includes the vacuum chamber, the top is equipped with central rotation mechanism in the vacuum chamber, and central rotation mechanism lower extreme is connected with and is used for placing the workpiece tray who treats the coating film base plate, and the bottom both sides all are equipped with the evaporation plant who is used for evaporating the coating film material in the vacuum chamber, and bottom central authorities are equipped with ion source device in the vacuum chamber, are equipped with heating device in the vacuum chamber, evaporation plant includes electron generator, jar form water cooling mechanism, and jar form water cooling mechanism encircles and locates the electron generator peripherally, and the workpiece tray is equipped with temperature sensor, and the vacuum chamber is equipped with the controller outward, and the controller is connected with temperature sensor, jar form water cooling mechanism respectively.
As preferred scheme, jar form water-cooling mechanism includes the jar body, and the internal portion cavity of jar, jar external wall encircle and are equipped with the cooling water coil pipe, cooling water coil pipe and the outer cooling water system intercommunication of vacuum cavity.
As the preferred scheme, a plurality of locating holes are arranged on the end face of the tank body, a plurality of locating columns are arranged at the bottom in the vacuum cavity, and the tank body is detachably arranged at the bottom in the vacuum cavity through the locating columns and the locating holes.
Preferably, a bottom guard plate is detachably arranged at the bottom in the vacuum cavity, the positioning column is arranged on the bottom guard plate, a plurality of bottom guard plate supporting columns are arranged on the bottom surface of the bottom guard plate, and the ion source device and the evaporation device protrude out of the bottom guard plate.
As the preferred scheme, the cooling water coil pipe passes through the bottom guard plate and is communicated with a cooling water system outside the vacuum cavity.
According to a preferable scheme, the evaporation device further comprises a first baffle mechanism, the first baffle mechanism comprises a first supporting rod and a first rotating plate, the first supporting rod is located beside the tank-shaped water cooling mechanism and is vertically installed on the bottom protection plate, and the first rotating plate is located on the upper side of the electron generator and is rotatably installed on the first supporting rod.
As the preferred scheme, the ion source device comprises an ion beam generator and a second baffle mechanism, wherein the second baffle mechanism comprises a second supporting rod and a second rotating plate, the second supporting rod is located beside the ion beam generator and is vertically installed on the bottom protecting plate, and the second rotating plate is located on the upper side of the ion beam generator and is rotatably installed on the second supporting rod.
Preferably, a pair of film thickness correction plates is arranged on the side wall of the vacuum cavity below the workpiece tray, and the film thickness correction plates are rotatably connected with the inner wall of the vacuum cavity.
As the preferred scheme, the side wall of the vacuum cavity is provided with a vacuum cavity door, the vacuum cavity door is provided with a window, and the side wall of the tank body is provided with a reserved observation window corresponding to the window.
Preferably, the electron generator is an electron gun.
The utility model has the beneficial effects that:
1. the pot-shaped water cooling mechanism can timely take the redundant radiation heat of the electron generator out of the cavity, so that the warping deformation of the coated substrate caused by overhigh temperature in the vacuum coated cavity is avoided, and the equipment is more suitable for the film formation of thin substrates, plastic cement, resin and other substrates which cannot bear high temperature.
2. The cold water circulation in the tank-shaped water cooling mechanism can be controlled in time according to the real-time temperature, so that not only is the over-high temperature in the cavity avoided, but also the heat waste is avoided.
3. When a high-temperature film is formed, the tank-shaped water cooling mechanism can be detached at any time to restore the original shape of the equipment, and the installation and the detachment are simple and convenient.
4. The positioning holes are reserved on the end face of the tank body, the positioning columns are preset on the cavity bottom protective plate, accurate positioning of the tank-shaped water cooling mechanism can be achieved as long as the positioning holes of the tank body fall into the preset positioning columns on the bottom protective plate, and the tank-shaped water cooling mechanism is simple and accurate in positioning.
5. The side wall of the vacuum cavity is provided with a vacuum cavity door, the vacuum cavity door is provided with a window, and the side wall of the tank body is provided with a reserved observation window corresponding to the window. The device is convenient for a user to observe the state of the electron generator during film coating, so as to realize the purpose of adjusting the evaporation parameters of the electron generator in real time.
6. Because of the addition of the pot-shaped water cooling mechanism, the redundant radiant heat generated by the electron generator can be immediately transmitted out of the cavity, so that the coating temperature in the vacuum cavity is reduced by 30 ℃ or more. Due to the reduction of the temperature, a coating mode with higher energy can be used, so that the coated film layer has better quality and better weather resistance.
7. Because the bottom protection plate can be detachably arranged at the bottom in the vacuum cavity, the bottom in the vacuum cavity is effectively protected, and the bottom protection plate is convenient to detach and correspondingly cleaned due to the detachable design.
8. The material for manufacturing the pot-shaped water cooling mechanism is easy to obtain and low in cost.
9. The equipment is particularly suitable for coating the substrate which can not bear high-temperature coating, such as micro-nano crystal substrates with the thickness less than 1mm, plastic, resin and other optical substrates.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view showing a structure of a vacuum evaporation coating apparatus;
FIG. 2 is a schematic structural view of a pot-shaped water cooling mechanism;
FIG. 3 shows the results of the test at EB2 shutdown and EB1 startup;
FIG. 4 shows the results of the test at EB2 startup and EB1 shutdown;
FIG. 5 shows the test results at EB2 startup and EB1 startup;
FIG. 6 is a graph of the effect of an ion source on temperature distribution;
FIG. 7 is a graph of the effect of a second heater on the temperature distribution;
FIG. 8 is a diagram showing the temperature change when the pot-shaped water cooling mechanism is used;
FIG. 9 is a diagram showing the temperature change when the pot cooling mechanism is not used;
FIG. 10 is a graph showing a temperature comparison with the use of a pot-shaped water cooling mechanism;
in the figure: 1. the device comprises a central rotating mechanism, 2 parts of a workpiece disc, 3 parts of a vacuum cavity, 4 parts of a film thickness correction plate, 5 parts of a rotating mechanism, 6 parts of a first baffle mechanism, 7 parts of an electron generator, 8 parts of a bottom protection plate support column, 9 parts of a bottom protection plate, 10 parts of an ion beam generator, 11 parts of a second baffle mechanism, 12 parts of a vacuum cavity door, 13 parts of a tank-shaped water cooling mechanism, 131 parts of a tank inner wall, 132 parts of a tank outer wall, 133 parts of a cooling water coil pipe, 134 parts of a reserved observation window, 135 parts of a positioning hole, 1331 parts of a water inlet pipe, 1332 parts of a water outlet pipe, inner parts of the workpiece disc, middle parts of the workpiece disc, outer parts of the workpiece disc, No Can mask, non-tank-shaped water cooling mechanism and Can mask.
Detailed Description
The following description of the embodiments of the present invention is provided by way of specific examples, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The utility model is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict.
Referring to fig. 1-2, this embodiment provides a vacuum evaporation coating apparatus, including a vacuum chamber 3, a central rotation mechanism 1 is arranged at the top in the vacuum chamber 3, a workpiece tray 2 for placing a substrate to be coated is connected to the lower end of the central rotation mechanism 1, the workpiece tray 2 rotates and stands still at high and low speeds when coating is realized by the central rotation mechanism 1, the workpiece tray 2 is of an umbrella frame structure, evaporation devices for evaporating coating materials are arranged on both sides of the bottom in the vacuum chamber 3, an ion source device is arranged in the center of the bottom in the vacuum chamber 3, a heating device is arranged in the vacuum chamber 3, the evaporation devices include an electric generator 7 and a can-shaped water cooling mechanism 13, the can-shaped water cooling mechanism 13 is arranged around the periphery of the electric generator 7, the workpiece tray 2 is provided with a temperature sensor, a controller is arranged outside the vacuum chamber 3, and the controller is respectively connected with the temperature sensor, The tank-shaped water cooling mechanism is connected, and the controller controls the cold water circulation of the tank-shaped water cooling mechanism 13 according to the temperature detected by the temperature sensor.
The heating device comprises a first heater arranged on the inner side wall of the vacuum cavity 3 and a second heater arranged at the joint of the outer wall of the workpiece disc 2 and the top of the vacuum cavity 3.
It should be noted that, the evaporation apparatus may be provided as one or more evaporation apparatuses, and when there are a plurality of evaporation apparatuses, several evaporation apparatuses may be selected to be provided with the tank-shaped water cooling mechanism 13, and the setting may be specifically performed according to actual requirements. For example, fig. 1 shows a case where two evaporation devices are provided, the two evaporation devices are provided on both sides of the bottom in the vacuum chamber 3, and the ion source device is provided in the center of the bottom in the vacuum chamber 3.
Namely, the pot-shaped water cooling mechanism 13 can instantly take the redundant radiation heat of the electron generator 7 out of the cavity, so that the warping and deformation of the coated substrate caused by the overhigh temperature in the vacuum coated cavity can be avoided, and the equipment is more suitable for the film formation of thin substrates and substrates which can not bear high temperature, such as plastic, resin and the like.
Moreover, the pot-shaped water cooling mechanism 13 is added, so that redundant radiant heat generated by the electron generator 7 can be immediately transmitted to the outside of the cavity, the coating temperature in the vacuum cavity 3 is reduced by 30 ℃ or more, and further, a coating mode with higher energy can be used due to the reduction of the temperature, so that the coating film has better quality and better weather resistance.
The equipment can also timely control the circulation of cold water in the tank-shaped water cooling mechanism 13 according to the real-time temperature, thereby not only avoiding the overhigh temperature in the cavity, but also avoiding the waste of heat.
Specifically, the method comprises the following steps:
referring to fig. 2, the tank-shaped water cooling mechanism 13 includes a hollow tank body, a cooling water coil 133 is disposed around an outer wall 132 of the tank body, and the cooling water coil 133 is communicated with a cooling water system outside the vacuum chamber 2. The cooling water coil 133 is provided with a water inlet pipe 1331 and a water outlet pipe 1332, and the cooling water coil 133 is communicated with a cooling water system outside the vacuum cavity 3 through the water inlet pipe 1331 and the water outlet pipe 1332. The cooling water system is arranged on the outer wall of the vacuum cavity 3, not only plays a role in cooling the vacuum cavity 3, but also is used for providing cooling water required by the tank-shaped water cooling mechanism 13 during working.
The end face of the tank body is provided with a plurality of positioning holes 135, the bottom of the vacuum chamber 3 is provided with a plurality of positioning columns (the positioning columns are not shown in the figure), and the tank body is detachably arranged at the bottom of the vacuum chamber 3 through the positioning columns and the positioning holes 135.
A bottom protection plate 9 is detachably arranged at the bottom in the vacuum cavity 3, a positioning column is arranged on the bottom protection plate 9, a plurality of bottom protection plate supporting columns 8 are arranged on the bottom surface of the bottom protection plate 9, and the ion source device and the evaporation device protrude out of the bottom protection plate 9.
Namely, the end face of the tank body is provided with the positioning hole 135, the positioning column is preset on the cavity bottom protection plate 9, the accurate positioning of the tank-shaped water cooling mechanism 13 can be realized as long as the positioning hole 135 of the tank body falls into the preset positioning column on the bottom protection plate 9, and the positioning of the tank-shaped water cooling mechanism 13 is simple and accurate.
On the other hand, when high-temperature film formation is required, the tank-shaped water cooling mechanism 13 can be detached at any time to restore the original shape of the equipment, and the installation and the detachment are simple and convenient.
And, the bottom sets up detachable end backplate 9 in vacuum chamber 3, has effectively protected the bottom in vacuum chamber 3, and detachable design, also be convenient for dismantle end backplate 9 and carry out corresponding clearance.
Further, the water inlet pipe 1331 and the water outlet pipe 1332 of the cooling water coil 133 can penetrate through the bottom protection plate 9 and are communicated with a cooling water system outside the vacuum cavity 3 through a position hole reserved on the wall of the vacuum cavity 3.
The evaporation device further comprises a first baffle mechanism 6, the first baffle mechanism 6 comprises a first supporting rod and a first rotating plate, the first supporting rod is located beside the tank-shaped water cooling mechanism 13 and is vertically installed on the bottom protection plate 9, and the first rotating plate is located on the upper side of the electron generator 7 and is rotatably installed on the first supporting rod.
When coating is carried out, the first rotating plate is opened, the electron generator 7 is opened for coating, and when coating of the layer is finished, the electron generator 7 is closed, so that the electron generator 7 is protected.
The ion source device comprises an ion beam generator 10 and a second baffle mechanism 11, wherein the second baffle mechanism 11 comprises a second supporting rod and a second rotating plate, the second supporting rod is located beside the ion beam generator 10 and is vertically installed on the bottom protecting plate 9, and the second rotating plate is located on the upper side of the ion beam generator 10 and is rotatably installed on the second supporting rod.
Also, the second rotating plate is opened when the ion beam generator 10 is needed, and closed when the ion beam generator 10 is not needed, to protect the ion beam generator 10.
A pair of film thickness correction plates 4 are arranged on the side wall of the vacuum cavity 3 below the workpiece disc 2, and the film thickness correction plates 4 are rotatably connected with the inner wall of the vacuum cavity 3.
Namely, a pair of film thickness correction plates 4 are provided between the work tray 2 and the evaporation apparatus, and the evaporation material directly above the evaporation source is blocked by the rotation of both the film thickness correction plates 4, so as to reduce the film thickness of the substrate to be coated. Specifically, the film thickness correction plate 4 can be rotatably connected by a rotating mechanism 5 installed on the inner wall of the vacuum chamber 3, and the rotating mechanism 5 can be a cylinder or the like.
The side wall of the vacuum cavity 3 is provided with a vacuum cavity door 12, the vacuum cavity door 12 is provided with a window, and the side wall of the tank body is provided with a reserved observation window 134 corresponding to the window. The device is convenient for the user to observe the state of the electronic generator 7 during film coating, so as to realize the purpose of adjusting the evaporation parameters of the electronic generator 7 in real time.
The tank body further comprises a tank body inner wall 131, the tank body inner wall 131 is made of any one of stainless steel, cast iron and alloy steel, and the tank body outer wall 132 and the cooling water coil 133 are made of copper materials.
That is, the inner wall 131 (close to the electron generator) of the tank body is made of any one of stainless steel, cast iron and alloy steel, and can be cleaned and maintained by spraying sand, and the maintenance is convenient. The outer wall 132 of the tank body is made of copper material, and can be replaced by other materials with good heat-conducting property. The cooling water coil 133 is made of a copper material. By virtue of the excellent heat-conducting property of copper and the cooling of cooling water, the redundant radiation heat generated by the electron generator 7 can be taken out of the vacuum cavity 3 to the maximum extent.
It should be noted that, the inner wall 131 and the outer wall 132 of the tank are made of two materials, and the inner wall 131 and the outer wall 132 may be welded into a whole or may be separated.
The heat source in the vacuum evaporation coating equipment during coating is analyzed through a specific test.
And step1, confirming the source of temperature rise in the vacuum cavity 3 during film coating.
In the vacuum coating cavity, the main reasons that can cause the temperature rise are: an evaporation source (which can be an electron gun) of the evaporation device, ion source bombardment of the ion source device and heating of the heating device.
The source and distribution of each heat source are tested separately.
Step 1-1: coating equipment, left side electron gun (EB1) for lowering SiO material with refractive index2Right electron gun (EB2) emits Ti3O5The high-refractive-index material collects the heat radiation temperature generated by an electron gun evaporation source (the temperature collector is arranged in an inner ring, a middle ring and an outer ring of a workpiece disc).
The following test conditions were met:
1. the first heater which closes the inner side wall of the vacuum cavity 3;
2. a second heater for closing the outer wall of the workpiece tray 2;
3.EB1 EMISSION＝140mA；
4.EB2 EMISSION＝420mA。
the following operations were performed:
EB2 was turned off and EB1 was turned on, the results of which are shown in FIG. 3;
EB2 was turned on and EB1 was turned off, the results of the test are shown in FIG. 4;
EB2 challenge and EB1 challenge, the results of which are shown in FIG. 5.
It can be seen that the temperature rise caused by the electron gun is uniformly increased and the temperature graduation is uniform.
Step 1-2: by changing the height and angle (position) of the ion source, different ion source GRIDs GRID are used, and finally the temperature distribution caused by the ion source is optimized, as shown in fig. 6.
The following test conditions were met:
1. the first heater which closes the inner side wall of the vacuum cavity 3;
2. a second heater for closing the outer wall of the workpiece tray 2;
3. only the ion source operates.
As a result: from the test results of fig. 6, it can be seen that the temperature rise caused by the ion source is uniformly increased and the temperature is uniformly graduated.
Step 1-3: by changing the power distribution of the second heaters of the respective segments, the heating temperature distribution in the workpiece tray 2 is finally made uniform, as shown with reference to fig. 7.
The following test conditions were met:
1. only the second heater of the outer wall of the workpiece tray 2 is operated;
2. closing the electron gun;
3. the ion source is turned off.
As a result: from the test results of fig. 7, it is known that the temperature rise caused by only the second heater is constant.
And step2, the thermal radiation analysis of a heat source during film coating can be reduced.
(1) Since the outer walls of the vacuum chamber 3 are already provided with cooling water systems and heating of the chamber top and side walls is required (heating of the workpiece disk 2), the heating of the heating device cannot be switched off and the heat radiation generated thereby is undesirably lost.
(2) When the ion source auxiliary deposition is not needed, the ion source can be selected not to be started, but when the ion source auxiliary deposition coating process is needed, the ion beam always needs to bombard the part of the workpiece disc 2 during coating, and the heat generated by the ion beam cannot be reduced.
(3) When an evaporation source (electron gun) deposits a coating film material on the surface of a substrate, the electron gun generates a large amount of radiant heat in the process, and in this part, the electron gun can try to transfer or reduce the radiant heat in time.
Step3. analysis of the technical scheme.
According to the technical scheme, the tank-shaped water cooling mechanism 13 which can be flexibly installed and detached is additionally arranged, so that the multi-waste heat radiation heat generated by the electron gun can be synchronously transferred in time when the electron gun evaporates the coating material. The description is made by the following tests:
(1) on the premise that the coating is performed by the same coating process, and when the pot-shaped water cooling mechanism 13 is not used, the temperature changes of the inner ring, the middle ring and the outer ring are as shown in fig. 8.
Abscissa time points illustrate:
0-Exhaust Start Time；
62-Process Begin Time；
199-Process End Time。
maximum temperature of inner, middle and outer rings:
Tmax_inner/℃：135.5；
Tmax_middle/℃：137.0；
Tmax_outer/℃：135.0；
Δ T/. degree.C. (maximum temperature difference): 2.0.
(2) when the pot-shaped water cooling mechanism 13 is used under the condition that the plating is performed in the same plating process, the temperature changes of the inner, middle and outer rings are as shown in fig. 9.
Abscissa time points illustrate:
0-Exhaust Start Time；
74-Process Begin Time；
208-Process End Time。
maximum temperature of inner, middle and outer rings:
Tmax_inner/℃：85.5；
Tmax_middle/℃：87.0；
Tmax_outer/℃：89.0；
ΔT/℃：3.5。
(3) and (3) comparison:
(1) and (2) comparing the mid-range temperatures (coating was performed using the same coating program with and without the Can water cooling mechanism 13), as shown in fig. 10 (No Can mask indicates No Can water cooling mechanism, and Can mask indicates the Can water cooling mechanism), in which:
ΔTmax(middle)＝137.0℃-87.0℃＝50℃。
from the comparison, the technical scheme adopts the pot-shaped water cooling mechanism 13 to carry out film coating, and the temperature can be reduced by about 50 ℃.
The above-mentioned embodiments are merely illustrative of the preferred embodiments of the present invention, and do not limit the scope of the present invention, and various modifications and improvements of the technical solutions of the present invention by those skilled in the art should fall within the protection scope of the present invention without departing from the design spirit of the present invention.
Claims (10)
1. The utility model provides a vacuum evaporation coating equipment, its characterized in that, includes the vacuum cavity, the top is equipped with central rotation mechanism in the vacuum cavity, and central rotation mechanism lower extreme is connected with the work piece dish that is used for placing the base plate that treats the coating film, and the bottom both sides all are equipped with the evaporation plant who is used for evaporating coating material in the vacuum cavity, and bottom central authorities are equipped with ion source device in the vacuum cavity, are equipped with heating device in the vacuum cavity, evaporation plant includes electron generator, jar form water cooling mechanism, and jar form water cooling mechanism encircles and locates the electron generator periphery, and the work piece dish is equipped with temperature sensor, is equipped with the controller outward of vacuum cavity, and the controller is connected with temperature sensor, jar form water cooling mechanism respectively.
2. The vacuum evaporation coating equipment according to claim 1, wherein the tank-shaped water cooling mechanism comprises a tank body, the tank body is hollow, a cooling water coil is arranged around the outer wall of the tank body, and the cooling water coil is communicated with a cooling water system outside the vacuum cavity.
3. The vacuum evaporation coating apparatus according to claim 2, wherein the end surface of the can is provided with a plurality of positioning holes, the bottom of the vacuum chamber is provided with a plurality of positioning posts, and the can is detachably mounted on the bottom of the vacuum chamber through the positioning posts and the positioning holes.
4. The vacuum evaporation coating apparatus according to claim 3, wherein a bottom protection plate is detachably disposed at the bottom of the vacuum chamber, the positioning column is disposed on the bottom protection plate, a plurality of bottom protection plate supporting columns are disposed on the bottom surface of the bottom protection plate, and the ion source device and the evaporation device protrude from the bottom protection plate.
5. The vacuum evaporation coating apparatus according to claim 4, wherein the cooling water coil is connected to a cooling water system outside the vacuum chamber through the bottom protection plate.
6. The vacuum evaporation coating apparatus according to claim 4, wherein the evaporation device further comprises a first baffle mechanism, the first baffle mechanism comprises a first supporting rod and a first rotating plate, the first supporting rod is located beside the pot-shaped water cooling mechanism and vertically mounted on the bottom protection plate, and the first rotating plate is located on the upper side of the electron generator and rotatably mounted on the first supporting rod.
7. The vacuum evaporation coating apparatus according to claim 4, wherein the ion source device comprises an ion beam generator, and a second baffle mechanism, the second baffle mechanism comprises a second supporting rod and a second rotating plate, the second supporting rod is located beside the ion beam generator and vertically mounted on the bottom baffle, and the second rotating plate is located on the upper side of the ion beam generator and rotatably mounted on the second supporting rod.
8. The vacuum evaporation coating apparatus according to claim 1, wherein a pair of film thickness correction plates are provided in the vacuum chamber at the side wall below the workpiece tray, the film thickness correction plates being rotatably connected to the inner wall of the vacuum chamber.
9. The vacuum evaporation coating apparatus according to claim 2, wherein the vacuum chamber has a vacuum chamber door on a side wall thereof, the vacuum chamber door has a window, and the tank has a reserved observation window corresponding to the window on a side wall thereof.
10. The vacuum evaporation coating apparatus according to claim 1, wherein the electron generator is an electron gun.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122006653.9U CN216404520U (en) | 2021-08-25 | 2021-08-25 | Vacuum evaporation coating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122006653.9U CN216404520U (en) | 2021-08-25 | 2021-08-25 | Vacuum evaporation coating equipment |
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