CN103074579A - Thin film deposition apparatus - Google Patents
Thin film deposition apparatus Download PDFInfo
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- CN103074579A CN103074579A CN2012102798252A CN201210279825A CN103074579A CN 103074579 A CN103074579 A CN 103074579A CN 2012102798252 A CN2012102798252 A CN 2012102798252A CN 201210279825 A CN201210279825 A CN 201210279825A CN 103074579 A CN103074579 A CN 103074579A
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- face glass
- temperature
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- film deposition
- heat part
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention discloses a thin film deposition apparatus. The thin film deposition apparatus comprises the following components: a deposition source which stores deposition material and discharges the deposition material on a glass panel; a temperature controller which is configured next to the glass panel and controls the temperature of the glass panel or the temperature of the area next to the glass panel; and a compartment which comprises the deposition source and the temperature controller. The temperature controller maintains the temperature of the glass panel and the temperature of the area next to the glass panel to an appropriate temperature, thereby guiding deposition of the deposition material onto the glass panel efficiently, and improving deposition efficiency and uniformity of the film formed on the glass panel.
Description
Technical field
The present invention relates in general to the film deposition equipment with improved sedimentation effect, relate more specifically to a kind of like this film deposition equipment, in this film deposition equipment, the temperature regulator of keeping the proper temperature of face glass or face glass near zone is arranged in the compartment (booth), thereby deposition material can deposit on the face glass efficiently, and has improved the uniformity coefficient of the film on the deposition surface that is formed on face glass.
Background technology
Usually, Organic Light Emitting Diode (OLED) is the selfluminous device that causes extensive concern as display unit of future generation.OLED has lot of advantages, such as, the picture quality higher than photograph (photograph) quality, wide visual angle, almost do not have dead visual angle, be reduced to 1/3 thickness, the reduce power consumption of LCD and approximately be 1/1000 the fast response time of LCD.Therefore, utilize OLED to produce high-quality video etc.
In having the OLED of above-mentioned feature, the hole transfers to hole transmission layer from anode, and electronics is from cathode transport to electron transfer layer.Hole and electronics recombine each other in the luminescent layer that is arranged between hole transmission layer and the electron transfer layer, thus electron-hole pair (exciton) produced.Be obtained from the light of the power generation specific wavelength of electron-hole pair.
Typically, the formation of organic thin film layer (such as hole transmission layer, luminescent layer, electron transfer layer etc.) is included in and makes the organic materials evaporation that comprises in the crucible (crucible) in the high vacuum compartment and the organic materials of evaporation is deposited on the face glass.For example, as shown in Figure 1, organic materials is fed in the deposition source 13, deposition source 13 comprises the crucible that wherein stores organic materials and is used for the heating unit of heating crucible (such as well heater etc.).After being placed on organic materials wherein, organic materials is heated.Then, the organic materials with evaporation deposits on the face glass 11 that is arranged in the high vacuum compartment.But, in this deposition method, be difficult to improve sedimentation effect, because this is a kind of random deposition method that moves freely of utilizing the organic materials of evaporation.In the trial that overcomes the problems referred to above, the method that adopts is, utilizes larger crucible to improve the velocity of evaporation of organic materials, perhaps utilizes to have the linearity of a plurality of nozzles or the deposition source on plane.But, owing to be difficult to keep the velocity of evaporation of organic materials constant, so be formed on the thickness that the thickness of the film on the centre of face glass may be different from the film on the peripheral part that is formed on face glass.Especially, in the situation of the large-size glass panel that recently uses, the homogeneity that is formed on the film on the deposition surface of face glass further reduces.The thickness of the organic material film that typically, deposits must be 200
To 2000
Scope in, and the homogeneity of thickness is necessary for 5% or less.
In order to solve the problems referred to above in the conventional art, in being entitled as Korean Patent public publication 10-2011-0024223 number (on March 9th, 2011) (patent documentation 1) of " Evaporator and vacuum deposition apparatus having the same(vaporizer and have the vacuum sediment equipment of this vaporizer) ", a kind of equipment has been proposed.Particularly, in the equipment of patent documentation 1, division board 360 is arranged on crucible cover 320 tops, and in division board 360 or be provided with in its surface refrigerating unit (such as cooling-water duct etc.), thereby isolation is transferred to the heat of face glass from deposition source, and then improve the homogeneity that is deposited on the film on the face glass, and reduce the loss (with reference to Fig. 9 and [0007], [0049] and [0050] section of patent documentation 1) of organic materials.
But, in the depositing device of patent documentation 1, the drop in temperature of the near zone of deposition source, thus reduced the velocity of evaporation of organic materials.In addition, must increase the ability (capacity) of well heater, so that sedimentation effect remains on high value.This makes its equilibrium so that be difficult to the temperature of control heater.And, even the vaporator rate of organic materials is suitably controlled, but also be not easy in division board or division board is installed refrigerating unit, also be not easy to control this refrigerating unit.
Another kind of equipment about deposition technique has been proposed in the Korean Patent public publication that is entitled as " Linear apparatus for manufacturing large-sized organic devices using downward-orientated heat-induced deposition(utilizes directed thermal conduction to deposit to make large size organic device linear device) " downwards 10-2007-0038640 number (on April 11st, 2007) (patent documentation 2).Particularly, the equipment of patent documentation 2 is constructed such that metal substrate 21 contacts with the refrigerating unit 54 that is connected to water cooler 55, thereby refrigerating unit 54 absorbs the heat energy from metal substrate 21, and then cool metal substrate 21(is with reference to the 2nd section of Fig. 8 of patent documentation 2 and page 5 thereof).
But in the depositing device of patent documentation 2, refrigerating unit directly contacts with the part of substrate, causes the temperature distributing disproportionation weighing apparatus of substrate.Therefore, the homogeneity that is formed on the film on the substrate is on duty mutually.
[prior art document]
[patent documentation]
1. Korean Patent public publication 10-2011-0024223 number (on March 9th, 2011)
2. Korean Patent public publication 10-2007-0038640 number (on April 11st, 2007)
Summary of the invention
Therefore, consider the problems referred to above that occur in the prior art and proposed the present invention, and the object of the present invention is to provide a kind of film deposition equipment, it is constructed such that face glass maintains proper temperature, thereby deposition material can be deposited on the face glass efficiently, has therefore improved sedimentation effect.
The inhomogeneity film deposition equipment of the film on the deposition surface that another object of the present invention is to provide a kind of improvement to be formed on face glass.
To achieve these goals, the invention provides a kind of film deposition equipment, comprising: at least one deposition source, the storage deposition material, described deposition source is discharged into deposition material on the face glass; At least one temperature regulator, it is arranged to the adjacent glass panel, with the temperature of the near zone of the control temperature of face glass or face glass; And at least one compartment, comprise described deposition source and described temperature regulator.
In one embodiment, the temperature regulator temperature control unit that can comprise the cool/heat part that the adjacent glass panel arranges and be used for the temperature of control cool/heat part.Deposition source can be arranged on the basal surface of compartment, and the cool/heat part can be arranged on the top surface below of compartment, and wherein face glass can be arranged between deposition source and the cool/heat part.
The area of cool/heat part can be corresponding to the area of the top surface of compartment or the area of face glass.The length of cool/heat part can be corresponding to length or the width of compartment or face glass.This film deposition equipment can comprise that quantity is arranged to the deposition source corresponding with the quantity of cool/heat part.
Temperature for the near zone that reduces face glass or face glass, can under the control of temperature control unit, cool off the cool/heat part, and the temperature for the near zone that improves face glass or face glass, can utilize the heat that produces in the atmosphere of compartment, perhaps can under the control of temperature control unit, heat the cool/heat part.
In another embodiment, the cool/heat part can be comprised of a plurality of cool/heat part subelements, and the temperature of each subelement is adjustable.
The temperature regulator of film deposition equipment can maintain 70 ° of C or lower with the temperature of the near zone of face glass or face glass.
In further embodiment, film deposition equipment can further comprise at least one temperature sensor that is arranged in the compartment, the temperature of the near zone of described temperature sensor senses face glass or face glass.
In an embodiment again, film deposition equipment can further comprise at least one nozzle unit that is connected to deposition source, and described nozzle unit has a plurality of nozzles so that deposition material by nozzle discharge to face glass.Nozzle unit can be adjusted the distance with respect to face glass.
In another embodiment, film deposition equipment can further comprise at least one nozzle unit that is connected to deposition source, described nozzle unit comprises a plurality of nozzles, so that deposition material by nozzle discharge to face glass, wherein, the length of cool/heat part can be corresponding to the length of nozzle unit.Nozzle unit can be adjusted the distance with respect to face glass.
In another embodiment, film deposition equipment can comprise a plurality of compartments that connect with the linear pattern decoration form sequentially one by one.Each compartment can comprise deposition source and cool/heat part, and each deposition source of each compartment can be stored different types of deposition material.
Description of drawings
From the detailed description below in conjunction with accompanying drawing, will be more readily understood above and other purpose of the present invention, feature and advantage, in the accompanying drawing:
Fig. 1 is the conceptual schematic view that traditional thin film deposition equipment is shown;
Fig. 2 is the conceptual schematic view that the membrane according to the invention depositing device is shown;
Fig. 3 is the sectional view of in-built example that the compartment of membrane according to the invention depositing device is shown;
Fig. 4 is the orthographic plan of example that the temperature regulator of membrane according to the invention depositing device is shown;
Fig. 5 is the orthographic plan of another example that the temperature regulator of membrane according to the invention depositing device is shown; And
Fig. 6 is the conceptual schematic view that illustrates according to linear pattern of the present invention (in-line) film deposition equipment.
Embodiment
Below, describe with reference to the accompanying drawings the film deposition equipment with improved sedimentation effect according to embodiment of the present invention in detail, but the present invention limits never or is subject to this.
As shown in Figure 2, film deposition equipment of the present invention is characterised in that technically, the temperature regulator that comprises cool/heat part 25 is arranged to adjacent glass panel 21, temperature with the near zone of the temperature that prevents face glass 21 or face glass 21 raises, thereby the sedimentation effect that prevents equipment reduces.In conventional art, as shown in Figure 1, the organic materials of evaporation is deposited on random position, so that be difficult to improve sedimentation effect.Different from conventional art, the present invention is constructed such that the proper temperature of the near zone of face glass 21 or face glass 21 is maintained, thereby deposition material can be deposited on the face glass 21 equably, has therefore improved sedimentation effect.In addition, the present invention has improved the deposition (yield) of deposition material, has reduced the loss of deposition material.The present invention has improved the uniformity coefficient of the film on the deposition surface that is formed on face glass 21, thereby this equipment also can be suitable for large-sized face glass.
Particularly, as shown in Figure 3, film deposition equipment according to the embodiment of the present invention comprises deposition source 23, cool/heat part 25, supply pipe 32, return tube 33, storage tank 35, temperature sensor 36, temperature control unit 37 and high vacuum compartment 30.23 pairs of deposition sources have been stored in deposition material 31 in the interior crucible and have heated and make it evaporation, so that deposition material is deposited on the face glass 21 by the mask 22 with predetermined pattern with the steam form.Cool/heat part 25 is arranged on face glass 21 tops, with the temperature of the near zone of control face glass 21 or face glass 21.Storage tank 35 storages are used for the water of cooling or heating and water are supplied to cool/heat part 25.Supply pipe 32 and return tube 33 are as the fluid channel, and cooling or heating water flow along this fluid channel.Control valve 34 is arranged on supply pipe 32 and the return tube 33, with the speed of control supply cooling or heating water.The temperature of the near zone of temperature sensor 36 sensing face glasss 21 or face glass 21.Temperature control unit 37 coolings or heating have been in the water in the storage tank 35, thus the temperature of control cool/heat part 25.
In this embodiment, the area of cool/heat part 25 is corresponding to the area of face glass 21.Replacedly, cool/heat part 25 can be constructed such that its area corresponding to the area of the top surface of compartment 30, thereby also can keep the proper temperature of the edge near zone of face glass.As another substitute mode, cool/heat part 25 can be constructed such that its length is corresponding to length or the width of face glass 21 or compartment 30, thereby can control the temperature of the near zone of the temperature that is being transmitted the face glass that device or allied equipment carry or this face glass, therefore make the installation and maintenance maximizing efficiency of temperature regulator.
Particularly, the membrane according to the invention depositing device also can be applicable to the large-size glass panel, for example, 4.5 generation (730mm * 920mm) or higher, preferably, 5.5 generations (1300mm * 1500mm) or higher, more preferably, 8 generations (2200mm * 2500mm) or higher.Provide these features, cool/heat part 25 is constructed such that its area or length are corresponding to area or the length of this face glass.Can suitably design in response to the size that is included in the face glass in the compartment 30 and quantity the size of compartment 30.Cool/heat part 25 can be designed so that it is corresponding to area or the length of the top surface of the compartment 30 with said structure.The shape of cool/heat part 25 is not limited to specific shape, as long as it can control the temperature of the near zone of face glass 21 or face glass 21.For example, the shape of cool/heat part 25 can be plate shape or tubular.
In addition, comprise that the nozzle unit of a plurality of nozzles 24 is connected to deposition source 23, so that by nozzle 24 discharging deposition material, thereby the efficient of using deposition material improved.Cool/heat part 25 can be designed so that its length corresponding to the length of nozzle unit, thereby can more effectively control the temperature of the near zone of the temperature of deposition surface of face glass 21 or face glass 21.Nozzle unit can be constructed such that to regulate the distance between nozzle unit and the face glass 21.In this case, by regulating the distance between nozzle unit and the face glass 21, can improve sedimentation effect and the uniformity coefficient of film.
The temperature of the temperature of temperature sensor 36 sensing face glasss 21 or the near zone of face glass 21.When the temperature of the near zone of face glass 21 or face glass 21 is positioned at outside the reference range of temperature, the temperature control unit 37 control cool/heat parts 25 of temperature regulator are so that the temperature of the near zone of face glass 21 or face glass 21 remains within the reference range of temperature.For organic materials is deposited on the face glass 21 efficiently, preferably, the temperature of the near zone of face glass 21 or face glass 21 is remained on 70 ° of C or lower.If the temperature of the near zone of face glass 21 or face glass 21 surpasses 70 ° of C, then the random motion of the organic materials of evaporation increases, so that be difficult to efficiently depositing organic material, and the uniformity coefficient of film reduces.A plurality of temperature sensors 36 can be arranged in the compartment 30, and measure respectively the temperature of middle part and the opposite end of face glass 21, thereby are complementary with the cool/heat part that can be divided into a plurality of sections.
As shown in Figure 4, can comprise storage tank 41, supply pipe 42, return tube 43, control valve 44, cool/heat part 45 and temperature control unit 46 according to temperature regulator of the present invention.In Fig. 4, although cool/heat part 45 has single segment structure (not being divided into a plurality of sections between this structure hollow), as shown in Figure 5, cool/heat part 55 is comprised of a plurality of cool/heat part subelements.Particularly, cool/heat part 55 can be divided into the middle portion 55a corresponding with the each several part of face glass and opposite end part 55b, part 55a and 55b is controlled, so that cool/heat water is fed among part 55a and the 55b independently.In this case, the middle portion 55a that is fed to cool/heat part 55 and the cooling of opposite end part 55b or the control of heating water are lower than the sedimentation effect of the middle portion of face glass so that can prevent the sedimentation effect of the opposite end of face glass, thereby film is formed uniformly on the whole zone of face glass.In the present invention, replace cooling or heating water, can or add warm air with cooling and come for cooling or heating purpose, with the temperature of the near zone of control face glass or face glass.And, by the heat that produces in the atmosphere that utilizes compartment, rather than utilize temperature regulator, can realize the rising of temperature of the near zone of face glass or face glass.
Be not limited to specific position according to the position of cool/heat part of the present invention in compartment, as long as it can control the temperature of the near zone of face glass or face glass effectively, thereby can improve sedimentation effect and the uniformity coefficient that is formed on the film on the face glass.Preferably, the cool/heat part of temperature regulator is arranged on such position: in this position, the cool/heat part in the face of face glass with the surface for the treatment of that deposition surface is relative, this position can change according to deposition method, for example, the method can be make progress orthotype, downward orthotype or vertical-type (vertical type).More preferably, the membrane according to the invention depositing device has upwards orthotype structure, and wherein, deposition source is arranged on the basal surface of compartment, the cool/heat part is arranged on the top surface below of compartment, and face glass is arranged between deposition source and the cool/heat part.
The membrane according to the invention depositing device can be constructed such that single compartment comprises: at least one deposition source, and it is stored deposition material and discharges deposition material to face glass; At least one temperature regulator, it is arranged to the adjacent glass panel and controls face glass or the temperature of the near zone of face glass; And at least one nozzle unit, it is connected to (one or more) deposition source, and each nozzle unit comprises a plurality of nozzles, so that by described nozzle discharge deposition material.The quantity that is included in deposition source, temperature regulator and nozzle unit in the single compartment is unrestricted.The area of consideration face glass, the projected area of nozzle, the quantity of nozzle etc. are determined the spacing that deposition source, temperature regulator or nozzle unit are spaced.In other words, the variation of the quantity and spacing of deposition source, temperature regulator or nozzle unit can suitably be set for production efficiency and conform to production cost, as long as can keep the proper temperature of the near zone of face glass or face glass, thereby deposition material can deposit on the face glass efficiently, thereby has improved sedimentation effect.Especially, if two or more cool/heat parts are set in single compartment, then the quantity of deposition source is corresponding to the quantity of cool/heat part, and deposition source can be stored different types of deposition material.
As shown in Figure 6, the membrane according to the invention depositing device can comprise two or more compartments 60.In this case, compartment 60 can be constructed by the linear pattern decoration form, so that they connect sequentially one by one.This linear pattern arrangement can be enhanced productivity and easily is suitable for producing the large-size glass panel.Especially, in linear pattern film deposition equipment according to the present invention, preferably, each compartment comprises deposition source and temperature regulator, and each deposition source of each compartment is stored different types of deposition material.Certainly, this film deposition equipment can use single compartment or be configured to utilize cluster (cluster) type, in the cluster type, the center compartment is arranged on predetermined position, and other compartments arrange with pentagon or hexagonal arrangement around the center compartment, so that face glass is processed successively by each compartment.
Preferably, utilize the membrane according to the invention depositing device to make OLED.Except utilizing the electroless copper deposition operation according to equipment of the present invention, make the general process of OLED with typically the process for the manufacture of OLED is identical.In the method for this manufacturing OLED, face glass in cleaning forms anode layer in the following manner: deposit tin indium oxide (ITO) and metallic membrane by carry out sputter at face glass, by photoetching technique to tin indium oxide and metal film pattern, and then it is carried out etching.Afterwards, depositing insulating layer to insulating layer pattern, and carries out etching to insulation layer by photoetching technique.Utilize afterwards shadow mask board (shadow mask) to form cathode separator.Then, the different types of organic materials that forms respectively hole transmission layer, luminescent layer and the electron transfer layer of OLED is fed in the corresponding crucible in the high vacuum compartment of membrane according to the invention depositing device for example.Afterwards, the well heater that is arranged in the deposition source sequentially heats and evaporating organic materials so that the evaporation after organic materials sequentially deposit on the respective surfaces of face glass, thereby form one by one above-mentioned organic material layer.During this process, temperature regulator prevents that the excessive temperature of the near zone of face glass or face glass from raising and keep suitable temperature.Therefore, organic materials can deposit on the face glass efficiently, thereby has improved sedimentation effect.After forming organic material layer, utilize the shadow mask board depositing metallic films, thereby form cathode layer.Afterwards, carry out sealing technology, thereby finish OLED.
As mentioned above, in the membrane according to the invention depositing device, at least one temperature regulator prevents that the excessive temperature of the near zone of face glass or face glass from raising and keep suitable temperature, so that deposition material can deposit on the face glass efficiently, thereby improved sedimentation effect.
In addition, the present invention has improved the deposition of deposition material, has reduced the loss of deposition material.Equipment of the present invention has also improved the uniformity coefficient of the film on the deposition surface that is formed on face glass, so that this equipment can easily be suitable for the large-size glass panel.
Although with disclosing of illustrative purpose preferred implementation of the present invention, but those skilled in the art will recognize that, in the situation that does not deviate from scope of the present invention disclosed in the accompanying claims and essence, various modifications, interpolation and replacement all are possible.
Claims (19)
1. film deposition equipment comprises:
At least one deposition source, the storage deposition material, described deposition source is discharged into described deposition material on the face glass;
At least one temperature regulator is arranged to contiguous described face glass, with the temperature of the near zone of the temperature of controlling described face glass or described face glass; And at least one compartment, each described compartment all comprises deposition source and described temperature regulator.
2. film deposition equipment according to claim 1, wherein, described temperature regulator comprises:
The cool/heat part is arranged to contiguous described face glass; And
Temperature control unit is controlled the temperature of described cool/heat part.
3. film deposition equipment according to claim 2, wherein, described deposition source is arranged on the basal surface of described compartment, and described cool/heat part is arranged on the top surface below of described compartment,
Wherein, described face glass is arranged between described deposition source and the described cool/heat part.
4. according to claim 2 or 3 described film deposition equipments, wherein, the area of described cool/heat part is corresponding to the area of the top surface of described compartment.
5. according to claim 2 or 3 described film deposition equipments, wherein, the length of described cool/heat part is corresponding to length or the width of described compartment.
6. according to claim 2 or 3 described film deposition equipments, wherein, the area of described cool/heat part is corresponding to the area of described face glass.
7. according to claim 2 or 3 described film deposition equipments, wherein, the length of described cool/heat part is corresponding to described length or the width of stating face glass.
8. according to claim 2 or 3 described film deposition equipments, wherein, described film deposition equipment comprises that quantity is arranged to the deposition source corresponding with the quantity of described cool/heat part.
9. according to claim 2 or 3 described film deposition equipments, wherein, temperature for the described near zone that reduces described face glass or described face glass, under the control of described temperature control unit, described cool/heat part is cooled off, and for the temperature of the described near zone that improves described face glass or described face glass, utilize the heat that produces in the atmosphere of described compartment.
10. according to claim 2 or 3 described film deposition equipments, wherein, temperature for the described near zone that reduces described face glass or described face glass, under the control of described temperature control unit, described cool/heat part is cooled off, and the temperature for the described near zone that improves described face glass or described face glass heats described cool/heat part under the control of described temperature control unit.
11. according to claim 2 or 3 described film deposition equipments, wherein, described cool/heat part is comprised of a plurality of cool/heat part subelements, and the temperature of each described cool/heat part subelement is adjustable.
12. each described film deposition equipment in 3 according to claim 1, wherein, described temperature regulator maintains 70 ℃ or lower with the temperature of the described near zone of described face glass or described face glass.
13. each described film deposition equipment in 3 according to claim 1 further comprises:
At least one temperature sensor is arranged in the described compartment, the temperature of the described near zone of the described face glass of described temperature sensor senses or described face glass.
14. each described film deposition equipment in 3 according to claim 1 further comprises:
At least one nozzle unit is connected to described deposition source, and described nozzle unit comprises a plurality of nozzles so that described deposition material by described nozzle discharge to described face glass.
15. film deposition equipment according to claim 14, wherein, described nozzle unit can be regulated with respect to the distance of described face glass.
16. according to claim 2 or 3 described film deposition equipments, further comprise:
At least one nozzle unit is connected to described deposition source, and described nozzle unit comprises a plurality of nozzles so that described deposition material by described nozzle discharge to described face glass,
Wherein, the length of described cool/heat part is corresponding to the length of described nozzle unit.
17. film deposition equipment according to claim 16, wherein, described nozzle unit can be regulated the distance with respect to described face glass.
18. each described film deposition equipment in 3 according to claim 1, wherein, described film deposition equipment comprises a plurality of compartments that connect with the linear pattern decoration form sequentially one by one.
19. film deposition equipment according to claim 18, wherein, each deposition source of each compartment is stored different types of deposition material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2011-0109617 | 2011-10-26 | ||
| KR1020110109617A KR20130045431A (en) | 2011-10-26 | 2011-10-26 | Thin film deposition apparatus with improved deposition rate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103074579A true CN103074579A (en) | 2013-05-01 |
Family
ID=48151271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102798252A Pending CN103074579A (en) | 2011-10-26 | 2012-08-07 | Thin film deposition apparatus |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20130045431A (en) |
| CN (1) | CN103074579A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105296928A (en) * | 2014-07-11 | 2016-02-03 | 圆益Ips股份有限公司 | Line source and thin film evaporation device comprising the same |
| CN105316626A (en) * | 2015-11-20 | 2016-02-10 | 苏州赛森电子科技有限公司 | Coating film raw material guiding device of evaporation table for semiconductor processing |
| CN108179383A (en) * | 2017-12-29 | 2018-06-19 | 武汉华星光电半导体显示技术有限公司 | cooling system and evaporator |
| US20190203342A1 (en) * | 2017-12-29 | 2019-07-04 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Cooling system and evaporation machine |
| CN110106475A (en) * | 2019-05-22 | 2019-08-09 | 深圳市华星光电技术有限公司 | The control method of evaporation coating device and its driving assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR102098789B1 (en) * | 2015-12-02 | 2020-04-08 | 세메스 주식회사 | Apparatus of manufacturing display cells and method of controlling temperature thereof |
| KR102180720B1 (en) * | 2018-05-04 | 2020-11-19 | 주식회사 야스 | Multipurpose Deposit System with Surface Evaporator |
| KR102216921B1 (en) * | 2020-06-08 | 2021-02-18 | 주식회사 야스 | Multipurpose Deposit System with Surface Evaporator |
| CN118166331B (en) * | 2024-05-14 | 2024-09-13 | 龙焱能源科技（杭州）有限公司 | Continuous deposition device and continuous deposition system |
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| US5766426A (en) * | 1995-02-14 | 1998-06-16 | Sputtered Films, Inc. | Apparatus for, and method of, depositing a film on a substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5766426A (en) * | 1995-02-14 | 1998-06-16 | Sputtered Films, Inc. | Apparatus for, and method of, depositing a film on a substrate |
| WO1997019303A1 (en) * | 1995-11-17 | 1997-05-29 | Cvc Products, Inc. | Temperature controlled chuck for vacuum processing |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105296928A (en) * | 2014-07-11 | 2016-02-03 | 圆益Ips股份有限公司 | Line source and thin film evaporation device comprising the same |
| CN105296928B (en) * | 2014-07-11 | 2018-03-27 | 圆益Ips股份有限公司 | Line source and the film vapor deposition device for possessing this line source |
| CN105316626A (en) * | 2015-11-20 | 2016-02-10 | 苏州赛森电子科技有限公司 | Coating film raw material guiding device of evaporation table for semiconductor processing |
| CN108179383A (en) * | 2017-12-29 | 2018-06-19 | 武汉华星光电半导体显示技术有限公司 | cooling system and evaporator |
| US20190203342A1 (en) * | 2017-12-29 | 2019-07-04 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Cooling system and evaporation machine |
| WO2019127675A1 (en) * | 2017-12-29 | 2019-07-04 | 武汉华星光电半导体显示技术有限公司 | Cooling system and evaporator |
| CN110106475A (en) * | 2019-05-22 | 2019-08-09 | 深圳市华星光电技术有限公司 | The control method of evaporation coating device and its driving assembly |
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|---|---|
| KR20130045431A (en) | 2013-05-06 |
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