CN218910495U

CN218910495U - Target backboard

Info

Publication number: CN218910495U
Application number: CN202222479331.0U
Authority: CN
Inventors: 白杨杨
Original assignee: Beijing Guijincheng Technology Co ltd
Current assignee: Beijing Guijincheng Technology Co ltd
Priority date: 2022-09-19
Filing date: 2022-09-19
Publication date: 2023-04-25
Anticipated expiration: 2032-09-19

Abstract

The utility model relates to the technical field of sputter coating, in particular to a target backboard, which is simple in structure and good in heat dissipation, and comprises a target backboard, wherein a sputter target is arranged in the middle of the bottom of the target backboard, a cooling groove is formed in the target backboard, a plurality of heat conducting blocks are arranged in the cooling groove, a radiating fin is arranged at the top end of the target backboard, a plurality of fins are arranged on the radiating fin, a liquid inlet connector is arranged at one side of the top of the radiating fin, a liquid outlet connector is arranged at the other side of the top of the radiating fin, the target backboard and the heat conducting blocks are integrally formed, the target backboard and the heat conducting blocks are made of the same material, and the liquid inlet connector and the liquid outlet connector are both connected with a connecting pipe according to use requirements.

Description

Target backboard

Technical Field

The utility model relates to the technical field of sputter coating, in particular to a target backboard.

Background

As is well known, the target material is a special electronic material with high added value, and is mainly used in industries such as microelectronics, displays, memories, optical coating films and the like.

Sputtering coating is a process of bombarding the surface of a target material with ions generated by an ion source, so that target atoms are sputtered away from the target and are then deposited on the surface of a substrate. The sputtering coating has the following remarkable advantages: the film layer has strong binding force and good film thickness stability, the film thickness can not change, and the film thickness stability can be reduced to good film thickness controllability and repeatability.

At present, when sputtering coating is carried out on a target, ion beam current with high speed flow bombards the surface of the target, so that a large amount of heat is generated on the target, the temperature of the target is increased, and the coating quality is affected.

Through retrieving the target backplate structure of CN201821044039.3 disclosure and the target backplate of CN202022456979.7 disclosure, all cool down the target through the runner, the runner is crooked in the inside setting of target backplate, and not only the inside structure of target backplate is complicated, and the radiating effect is not good moreover.

Disclosure of Invention

(one) solving the technical problems

Aiming at the defects of the prior art, the utility model provides the target backboard, which has simple structure and good heat dissipation.

(II) technical scheme

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a target backplate, includes the target backplate, and the middle part of target backplate bottom is provided with the sputtering target, and the inside of target backplate is provided with the cooling tank, and the inside of cooling tank is provided with the several heat conduction piece, and the top of target backplate is provided with the fin, is provided with the several fin on the fin, and one side at fin top is provided with the feed liquor and connects, and the opposite side at fin top is provided with out the liquid and connects.

Further, the target backboard and the heat conducting block are integrally formed, and the target backboard and the heat conducting block are made of the same material.

Further, the cooling fin is detachable or non-detachable according to the use requirement.

Further, the liquid inlet connector and the liquid outlet connector are connected with the connecting pipe.

(III) beneficial effects

Compared with the prior art, the utility model provides the target backboard, which has the following beneficial effects:

this target backplate, through the setting of cooling tank, the cooling tank has replaced traditional runner's setting, has not only improved cooling area, and simple structure has good thermal diffusivity moreover, through the setting of heat conduction piece, the heat conduction piece has improved the area of contact of target backplate and cooling liquid, through the setting of fin and fin, has improved the radiating efficiency at target backplate back.

Drawings

FIG. 1 is a schematic diagram of an equivalent structure of the present utility model;

FIG. 2 is a schematic elevational view of the present utility model;

FIG. 3 is a schematic cross-sectional view of the present utility model;

FIG. 4 is a schematic diagram of an equivalent structure without a heat sink according to the present utility model.

In the figure: 1. a target backing plate; 2. sputtering a target material; 3. a cooling tank; 4. a heat conduction block; 5. a heat sink; 6. a fin; 7. a liquid inlet joint; 8. and a liquid outlet joint.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, the target backboard of the present utility model includes a target backboard 1, a sputtering target 2 is disposed in the middle of the bottom of the target backboard 1, a cooling groove 3 is disposed in the target backboard 1, the cooling groove 3 replaces the conventional runner, not only improves cooling area, but also has a simple structure, good heat dissipation, a plurality of heat conducting blocks 4 are disposed in the cooling groove 3, the target backboard 1 and the heat conducting blocks 4 are integrally formed, the target backboard 1 and the heat conducting blocks 4 are made of the same material, the heat conducting blocks 4 improve the contact area of the target backboard 1 and cooling liquid, a heat sink 5 is disposed at the top of the target backboard 1, the heat sink 5 is detachable or non-detachable according to the use requirement, a plurality of fins 6 are disposed on the heat sink 5, the heat sink 5 and the fins 6 improve the heat dissipation efficiency of the back of the target backboard 1, a liquid inlet joint 7 is disposed at one side of the top of the heat sink 5, cooling liquid is injected into the cooling groove 3 from the inside of the cooling groove 7, a liquid outlet joint 8 is disposed at the other side of the top of the heat sink 5, the liquid outlet joint 8 is disposed at the other side of the top of the heat sink 5, and the liquid outlet joint 8 is connected with the liquid outlet joint 8.

In summary, when the target backboard is in use, a large amount of cooling liquid is injected into the cooling tank 3 through the connecting pipe on the liquid inlet joint 7, the cooling liquid in the cooling tank 3 cools the target backboard 1, the cooling liquid absorbing heat is discharged from the liquid outlet joint 8, and the cooling fin 5 and the fin 6 dissipate heat of the target backboard 1.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The target backboard comprises a target backboard (1), and is characterized in that: the novel heat-conducting target is characterized in that a sputtering target (2) is arranged in the middle of the bottom of the target backboard (1), a cooling groove (3) is formed in the target backboard (1), a plurality of heat-conducting blocks (4) are arranged in the cooling groove (3), a radiating fin (5) is arranged at the top end of the target backboard (1), a plurality of fins (6) are arranged on the radiating fin (5), a liquid inlet connector (7) is arranged on one side of the top of the radiating fin (5), and a liquid outlet connector (8) is arranged on the other side of the top of the radiating fin (5).

2. The target backing plate of claim 1, wherein: the target backboard (1) and the heat conducting block (4) are integrally formed, and the target backboard (1) and the heat conducting block (4) are made of the same material.

3. The target backing plate of claim 1, wherein: the radiating fins (5) are detachable or non-detachable according to the use requirement.

4. The target backing plate of claim 1, wherein: the liquid inlet joint (7) and the liquid outlet joint (8) are connected with the connecting pipe.