US20070199682A1 - Dissipation Heat Pipe Structure and Manufacturing Method Thereof - Google Patents
Dissipation Heat Pipe Structure and Manufacturing Method Thereof Download PDFInfo
- Publication number
- US20070199682A1 US20070199682A1 US11/307,845 US30784506A US2007199682A1 US 20070199682 A1 US20070199682 A1 US 20070199682A1 US 30784506 A US30784506 A US 30784506A US 2007199682 A1 US2007199682 A1 US 2007199682A1
- Authority
- US
- United States
- Prior art keywords
- heat
- dissipation
- heat pipe
- pipe structure
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
Definitions
- the present invention relates to a dissipation heat pipe structure and corresponding manufacturing method and, more particularly, to the manufacturing method for manufacturing a heat conduction material combining a metal with a bracket structure of carbon element.
- the material applying in the heat dissipation structure usually includes copper or aluminum to be the tendency of current heat dissipation technology.
- aluminum applying in the heat dissipation material is restricted to cause a bottleneck because of high temperature conduction is produced by the efficiency upgrade of central processors.
- Copper applying in the heat dissipation technology is then provided.
- copper has a higher specific gravity that has disadvantage to shape and the application is restricted.
- both copper and aluminum are used for air cooling to implement heat dissipation, the air cooling incorporating the aforesaid copper and aluminum will be unable to satisfy the demand for heat dissipating when the heat release of chips achieves 50 W/cm 2 . Therefore, the high efficiency of heat dissipation materials needs to improve.
- a dissipation heat pipe is in widespread use for conducting heat.
- the dissipation heat pipe can be used in a small and narrow space by using a fluid within the dissipation heat pipe to absorb and release heat to generate a phase change for conducting heat.
- a greater heat transfer can be generated by the dissipation heat pipe at a slight temperature difference and there is a reputation of “heat superconductor” for the dissipation heat pipe. Therefore, a conventional heat dissipation module is developed and comprises at least one dissipation heat pipe, at least one heat dissipation slip, and a plurality of heat sink fins.
- FIG. 1 a schematic diagram illustrates a conventional heat dissipation module and a heat conduction process.
- the heat dissipation module as shown in FIG. 1 comprises a heat dissipation slip 11 , a dissipation heat pipe 12 and a plurality of heat sink fins 13 .
- the heat dissipation slip 11 includes a lower surface 111 and an upper surface 112 which is corresponded to the lower surface 111 .
- the heat conduction process is that the lower surface 111 of the heat dissipation slip 11 is contacted to a waste heat generated by a heat source first of all. The waste heat is then conducted to the upper surface 112 of the heat dissipation slip 11 .
- the dissipation heat pipe 12 comprises a heat source end 121 and a heat dissipation end 122 .
- the heat source end 121 is coupled to the upper surface 112 of the heat dissipation slip 11 .
- the waste heat is conducted to the heat dissipation end 122 of the dissipation heat pipe 12 from the heat source end 121 of the dissipation heat pipe 12 .
- a bottom 131 is formed by the plurality of heat sink fins 13 . Specifically the bottom 131 is composed of each edge of each fin.
- the heat dissipation end 122 of the dissipation heat pipe 12 is contacted to the bottom 131 to conduct the waste heat to the plurality of heat sink fins 13 .
- the waste heat is discharged through the convection and the radiating.
- diamonds are well known and have characteristics with the highest hardness, the fastest heat conduction, and the widest refraction range in current materials. Diamonds, therefore, are always one of more important materials in engineering due to the excellent characteristics.
- the thermal conductivity of diamonds at the normal atmospheric temperature is five times more than copper.
- the thermal expansion factor of diamonds at high temperature is very small that shows the excellent efficiency for heat dissipating. The feature may help people to differentiate the adulteration of diamonds.
- many technologies and manufacture procedures have been developed to make diamonds.
- the direct decomposition for hydrocarbons is the most familiar method like Microwave Plasma Enhance Chemical Vapor Deposition (MPCVD) and Hot Filament CVD (HFCVD).
- MPCVD Microwave Plasma Enhance Chemical Vapor Deposition
- HFCVD Hot Filament CVD
- the object of the present invention is to provide a heat conduction material which is applied for a dissipation heat pipe to improve the efficiency of heat dissipation for a chip.
- the waste heat caused by the high temperature, which is generated from the operation of the chip, can be reduced.
- the heat conduction material provided by the present invention is not only restricted for the heat dissipation of the chip, but is also applied for other heat conduction apparatuses.
- the heat conduction material provided by the present invention is applied for a dissipation heat pipe and the heat conduction material comprises combining a metal with a bracket structure of carbon element.
- the metal can be copper or aluminum or other metals with high thermal conductivity.
- the bracket structure of carbon element is diamonds and can also be used for coating on the metal surface or for encapsulating in materials.
- the bracket structure of carbon element can be further used in combining the metal with the materials.
- the heat conduction material can be made by chemical vapor deposition, physical vapor deposition, melting, electroplating or other manufacturing methods.
- FIG. 1 is schematic diagram illustrating a conventional heat dissipation module
- FIG. 2 is a schematic diagram illustrating a die for manufacturing a dissipation heat pipe which has an end without sealing according to an embodiment of the present invention
- FIG. 3 is a schematic diagram illustrating setting a wick structure into the dissipation heat pipe according to an embodiment of the present invention
- FIG. 4 is a schematic diagram illustrating setting a wick structure into the dissipation heat pipe according to another embodiment of the present invention.
- FIG. 5 is a perspective drawing illustrating the dissipation heat pipe according to an embodiment of the present invention.
- FIG. 6 is a schematic diagram illustrating microwave plasma enhanced chemical vapor deposition for manufacturing the dissipation heat pipe according to an embodiment of the present invention.
- FIG. 7 is a schematic diagram illustrating ion beam sputtering according to an embodiment of the present invention.
- FIG. 2 a schematic diagram illustrates a die for manufacturing a dissipation heat pipe according to an embodiment of the present invention.
- the die comprises a mold material supplier 21 , a mold material injector 22 and a mold 23 .
- a mold material is injected by the mold material injector 22 to a cavity 24 of the mold 23 for molding.
- the shape is a hollow closed pipe which has an end without sealing and a column within the hollow closed pipe.
- the mold material can be a metal material or a melt material which combines a metal with a bracket structure of carbon element.
- the metal is copper or aluminum or silver or other metals with high thermal conductivity or other material combinations.
- the melting point of the bracket structure of carbon element is higher than any metal of the mentioned above. Therefore, the bracket structure of carbon element can be mixed with those metals to form a mold material.
- a dissipation heat pipe 31 comprises the hollow closed pipe which has the end without sealing and the column within the hollow closed pipe according to FIG. 2 .
- Wick structures 315 are formed around an interior wall 313 of the hollow closed pipe and a surface 314 of the column as shown in FIG. 3 .
- the wick structures 315 which possess groove shapes are etched by microstructure manufacturing from the interior wall 313 and the surface 314 of the column.
- the wick structures 315 which are around the interior wall 313 and the surface 314 of the column can also be made by sintering via a metal mesh around the interior wall 313 and the surface 314 of the column.
- FIG. 5 a perspective drawing illustrates the dissipation heat pipe 31 which has the end with sealing after filling a type of fluid 14 according to FIG. 3 or FIG. 4 .
- the heat conduction process for the dissipation heat pipe 31 is that a heat source end 311 of the dissipation heat pipe 31 is connected to the upper surface 112 of the heat dissipation slip 11 as shown in FIG. 1 .
- the waste heat which is distributed on the upper surface 112 is conducted to the liquid fluid 14 within the hollow closed pipe from the heat source end 311 .
- the waste heat is then absorbed by the liquid fluid 14 to implement a phase change for vaporizing the liquid fluid 14 to be the gaseous fluid 14 .
- the waste heat carried by the gaseous fluid 14 is conducted onto the bottom 131 of the plurality of heat sink fins 13 as shown in FIG. 1 through the heat dissipation end 312 when the gaseous fluid 14 is diffused to a heat dissipation end 312 of the dissipation heat pipe 31 and is then contacted to the interior wall 313 of the heat dissipation end 312 .
- the gaseous fluid 14 is implemented via the phase change again and is then condensed to the liquid fluid 14 .
- the liquid fluid 14 further returns to the heat source end 311 through the forcing of the wick structures 315 around the interior wall 313 and the surface 314 of column.
- the aforesaid circulation process may help to discharge much heat.
- the heat is absorbed or released by the dissipation heat pipe 31 via the vaporization and the condensation of the type of liquid. Therefore, the dissipation heat pipe 31 possesses the outstanding heat conduction efficiency.
- the type of fluid 14 within the dissipation heat pipe 31 can be composed of water or liquids having heat conduction capacity.
- the heat conduction material having the bracket structure of carbon element can be formed on a metal surface by using CVD or PVD.
- FIG. 6 a schematic diagram illustrates microwave plasma enhanced chemical vapor deposition for manufacturing a heat dissipation structure according to an embodiment of the present invention.
- the reaction procedure is that a mixed gas for desired reaction is delivered to a gas reaction room 66 from a gas entrance 61 .
- a microwave is generated by a microwave generation system 62 to activate the mixed gas in order to provide reactive ions for reacting.
- a surface of a metal material 65 on a carrier 64 is absorbed to form diamond films.
- the metal material 65 is the dissipation heat pipe 31 as shown in FIG. 5 and can be copper or aluminum or other metals with high heat conductivity or other material combinations.
- Remaining gas is discharged via a waste gas exit 63 .
- FIG. 7 a schematic diagram illustrates ion beam sputtering for manufacturing a heat dissipation structure according to another embodiment of the present invention.
- the manufacturing procedure is that a target 72 is molded by diamond materials first of all.
- the placement angle of the target 72 and the shooting direction of ion beam of a first ion gun 71 are approximately forty five degrees.
- the diamond particles fired by the first ion gun 71 fly to the front of a second ion gun 73 .
- the diamond particles is then sputtered to the surface of a metal material 74 to form uniform diamond films by providing enough kinetic energy from the first ion gun 71 .
- the metal material 74 is the dissipation heat pipe 31 as shown in FIG. 5 and can be copper or aluminum or other metals with high heat conductivity or other material combinations.
- the remaining diamond particles are discharged by a waste gas exit 75 .
- a heat conduction material coating diamond particles can be acquired.
- the heat conduction material having a metal and a bracket structure of carbon element can be further made by electroplating, melting except CVD and PVD of the above embodiments.
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
This invention discloses a manufacturing method and the structure for a dissipation heat pipe. The dissipation heat pipe includes a hollow closed pipe, a column, a type of fluid and a wick structure. The dissipation heat pipe is often used in conducting the heat from the chip. The dissipation heat pipe can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can coat on the metal surface and also can be mixed into the metal.
Description
- The present invention relates to a dissipation heat pipe structure and corresponding manufacturing method and, more particularly, to the manufacturing method for manufacturing a heat conduction material combining a metal with a bracket structure of carbon element.
- In recent years, the pace of high technology industry development is extremely fast, the development of electronic components is toward small volumes and high densities. The efficiency requirements for the aforesaid components also increase that generates much waste heat. The efficiency of the electronic components will be decreased and destroyed if the waste heat is unable to eliminate appropriately. Therefore, various heat conduction materials are provided to improve the efficiency of heat dissipation.
- In the prior art, the material applying in the heat dissipation structure usually includes copper or aluminum to be the tendency of current heat dissipation technology. Traditionally, aluminum applying in the heat dissipation material is restricted to cause a bottleneck because of high temperature conduction is produced by the efficiency upgrade of central processors. Copper applying in the heat dissipation technology is then provided. However, copper has a higher specific gravity that has disadvantage to shape and the application is restricted. Although both copper and aluminum are used for air cooling to implement heat dissipation, the air cooling incorporating the aforesaid copper and aluminum will be unable to satisfy the demand for heat dissipating when the heat release of chips achieves 50 W/cm2. Therefore, the high efficiency of heat dissipation materials needs to improve.
- In addition, to satisfy the demand for the heat dissipation and the space restriction, a dissipation heat pipe is in widespread use for conducting heat. The dissipation heat pipe can be used in a small and narrow space by using a fluid within the dissipation heat pipe to absorb and release heat to generate a phase change for conducting heat. A greater heat transfer can be generated by the dissipation heat pipe at a slight temperature difference and there is a reputation of “heat superconductor” for the dissipation heat pipe. Therefore, a conventional heat dissipation module is developed and comprises at least one dissipation heat pipe, at least one heat dissipation slip, and a plurality of heat sink fins.
- Referring to
FIG. 1 , a schematic diagram illustrates a conventional heat dissipation module and a heat conduction process. The heat dissipation module as shown inFIG. 1 comprises aheat dissipation slip 11, adissipation heat pipe 12 and a plurality of heat sink fins 13. Theheat dissipation slip 11 includes alower surface 111 and anupper surface 112 which is corresponded to thelower surface 111. The heat conduction process is that thelower surface 111 of theheat dissipation slip 11 is contacted to a waste heat generated by a heat source first of all. The waste heat is then conducted to theupper surface 112 of theheat dissipation slip 11. Thedissipation heat pipe 12 comprises aheat source end 121 and aheat dissipation end 122. Theheat source end 121 is coupled to theupper surface 112 of theheat dissipation slip 11. The waste heat is conducted to theheat dissipation end 122 of thedissipation heat pipe 12 from theheat source end 121 of thedissipation heat pipe 12. Abottom 131 is formed by the plurality of heat sink fins 13. Specifically thebottom 131 is composed of each edge of each fin. Theheat dissipation end 122 of thedissipation heat pipe 12 is contacted to thebottom 131 to conduct the waste heat to the plurality of heat sink fins 13. Lastly, the waste heat is discharged through the convection and the radiating. - Besides, diamonds are well known and have characteristics with the highest hardness, the fastest heat conduction, and the widest refraction range in current materials. Diamonds, therefore, are always one of more important materials in engineering due to the excellent characteristics. The thermal conductivity of diamonds at the normal atmospheric temperature is five times more than copper. Moreover, the thermal expansion factor of diamonds at high temperature is very small that shows the excellent efficiency for heat dissipating. The feature may help people to differentiate the adulteration of diamonds. In the prior art, many technologies and manufacture procedures have been developed to make diamonds. The direct decomposition for hydrocarbons is the most familiar method like Microwave Plasma Enhance Chemical Vapor Deposition (MPCVD) and Hot Filament CVD (HFCVD). By the aforesaid methods, polycrystalline diamond films can be deposited. The characteristic of the polycrystalline diamond films is same as the single crystal diamonds.
- Briefly, to eliminate the waste heat generated by electronic components efficiently and to face the development tendency of electronic components with small volumes and high densities, the object of the present invention is to provide a heat conduction material which is applied for a dissipation heat pipe to improve the efficiency of heat dissipation for a chip. The waste heat caused by the high temperature, which is generated from the operation of the chip, can be reduced. In addition, the heat conduction material provided by the present invention is not only restricted for the heat dissipation of the chip, but is also applied for other heat conduction apparatuses.
- The heat conduction material provided by the present invention is applied for a dissipation heat pipe and the heat conduction material comprises combining a metal with a bracket structure of carbon element. The metal can be copper or aluminum or other metals with high thermal conductivity. The bracket structure of carbon element is diamonds and can also be used for coating on the metal surface or for encapsulating in materials. The bracket structure of carbon element can be further used in combining the metal with the materials. The heat conduction material can be made by chemical vapor deposition, physical vapor deposition, melting, electroplating or other manufacturing methods.
- Other features and advantages of the present invention and variations thereof will become apparent from the following description, drawings, and claims.
-
FIG. 1 is schematic diagram illustrating a conventional heat dissipation module; -
FIG. 2 is a schematic diagram illustrating a die for manufacturing a dissipation heat pipe which has an end without sealing according to an embodiment of the present invention; -
FIG. 3 is a schematic diagram illustrating setting a wick structure into the dissipation heat pipe according to an embodiment of the present invention; -
FIG. 4 is a schematic diagram illustrating setting a wick structure into the dissipation heat pipe according to another embodiment of the present invention; -
FIG. 5 is a perspective drawing illustrating the dissipation heat pipe according to an embodiment of the present invention; -
FIG. 6 is a schematic diagram illustrating microwave plasma enhanced chemical vapor deposition for manufacturing the dissipation heat pipe according to an embodiment of the present invention; and -
FIG. 7 is a schematic diagram illustrating ion beam sputtering according to an embodiment of the present invention. - Referring to
FIG. 2 , a schematic diagram illustrates a die for manufacturing a dissipation heat pipe according to an embodiment of the present invention. The die comprises amold material supplier 21, amold material injector 22 and amold 23. A mold material is injected by themold material injector 22 to acavity 24 of themold 23 for molding. The shape is a hollow closed pipe which has an end without sealing and a column within the hollow closed pipe. The mold material can be a metal material or a melt material which combines a metal with a bracket structure of carbon element. The metal is copper or aluminum or silver or other metals with high thermal conductivity or other material combinations. The melting point of the bracket structure of carbon element is higher than any metal of the mentioned above. Therefore, the bracket structure of carbon element can be mixed with those metals to form a mold material. - A
dissipation heat pipe 31 comprises the hollow closed pipe which has the end without sealing and the column within the hollow closed pipe according toFIG. 2 .Wick structures 315 are formed around aninterior wall 313 of the hollow closed pipe and asurface 314 of the column as shown inFIG. 3 . Thewick structures 315 which possess groove shapes are etched by microstructure manufacturing from theinterior wall 313 and thesurface 314 of the column. As shown inFIG. 4 , thewick structures 315 which are around theinterior wall 313 and thesurface 314 of the column can also be made by sintering via a metal mesh around theinterior wall 313 and thesurface 314 of the column. - Lastly, referring to
FIG. 5 , a perspective drawing illustrates thedissipation heat pipe 31 which has the end with sealing after filling a type offluid 14 according toFIG. 3 orFIG. 4 . The heat conduction process for thedissipation heat pipe 31 is that a heat source end 311 of thedissipation heat pipe 31 is connected to theupper surface 112 of theheat dissipation slip 11 as shown inFIG. 1 . The waste heat which is distributed on theupper surface 112 is conducted to theliquid fluid 14 within the hollow closed pipe from theheat source end 311. The waste heat is then absorbed by theliquid fluid 14 to implement a phase change for vaporizing theliquid fluid 14 to be thegaseous fluid 14. The waste heat carried by thegaseous fluid 14 is conducted onto thebottom 131 of the plurality of heat sink fins 13 as shown inFIG. 1 through theheat dissipation end 312 when thegaseous fluid 14 is diffused to aheat dissipation end 312 of thedissipation heat pipe 31 and is then contacted to theinterior wall 313 of theheat dissipation end 312. Thegaseous fluid 14 is implemented via the phase change again and is then condensed to theliquid fluid 14. Theliquid fluid 14 further returns to the heat source end 311 through the forcing of thewick structures 315 around theinterior wall 313 and thesurface 314 of column. The aforesaid circulation process may help to discharge much heat. The heat is absorbed or released by thedissipation heat pipe 31 via the vaporization and the condensation of the type of liquid. Therefore, thedissipation heat pipe 31 possesses the outstanding heat conduction efficiency. The type offluid 14 within thedissipation heat pipe 31 can be composed of water or liquids having heat conduction capacity. - In addition, the heat conduction material having the bracket structure of carbon element can be formed on a metal surface by using CVD or PVD. Referring to
FIG. 6 , a schematic diagram illustrates microwave plasma enhanced chemical vapor deposition for manufacturing a heat dissipation structure according to an embodiment of the present invention. In the embodiment, the reaction procedure is that a mixed gas for desired reaction is delivered to agas reaction room 66 from agas entrance 61. At the same time, a microwave is generated by amicrowave generation system 62 to activate the mixed gas in order to provide reactive ions for reacting. A surface of ametal material 65 on acarrier 64 is absorbed to form diamond films. Themetal material 65 is thedissipation heat pipe 31 as shown inFIG. 5 and can be copper or aluminum or other metals with high heat conductivity or other material combinations. Remaining gas is discharged via awaste gas exit 63. By the way mentioned above, a heat conduction material coating diamond particles can be acquired. - Referring to
FIG. 7 , a schematic diagram illustrates ion beam sputtering for manufacturing a heat dissipation structure according to another embodiment of the present invention. In the embodiment, the manufacturing procedure is that atarget 72 is molded by diamond materials first of all. The placement angle of thetarget 72 and the shooting direction of ion beam of afirst ion gun 71 are approximately forty five degrees. The diamond particles fired by thefirst ion gun 71 fly to the front of asecond ion gun 73. The diamond particles is then sputtered to the surface of ametal material 74 to form uniform diamond films by providing enough kinetic energy from thefirst ion gun 71. Themetal material 74 is thedissipation heat pipe 31 as shown inFIG. 5 and can be copper or aluminum or other metals with high heat conductivity or other material combinations. The remaining diamond particles are discharged by awaste gas exit 75. By the way mentioned above, a heat conduction material coating diamond particles can be acquired. - Moreover, the heat conduction material having a metal and a bracket structure of carbon element can be further made by electroplating, melting except CVD and PVD of the above embodiments.
- Although the features and advantages of the embodiments according to the preferred invention are disclosed, it is not limited to the embodiments described above, but encompasses any and all modifications and changes within the spirit and scope of the following claims.
Claims (24)
1. A dissipation heat pipe structure, applied in conducting and dissipating a heat source generated by a chip, comprising:
a hollow closed pipe having a heat source end for contacting said heat source and a heat dissipation end which being corresponded to said heat source end for contacting a heat dissipation device, a temperature of said heat dissipation device being lower than said heat source;
a column having a first end for contacting said heat source end of said hollow closed pipe and a second end for contacting said heat dissipation end of said hollow closed end;
a type of fluid, set at said heat source end within said hollow closed pipe, after said heat source being contacted to said heat source end to vaporize said type of fluid to be a vapor, said vapor being then contacted to said heat dissipation end to form said type of fluid; and
a wick structure, set at an interior wall of said hollow closed pipe and a surface of said column for conducting said type of fluid to said heat source end from said heat dissipation end.
2. The dissipation heat pipe structure of claim 1 , wherein said heat source generated by said chip is conducted by a heat dissipation slip to said heat source end.
3. The dissipation heat pipe structure of claim 1 , wherein said hollow closed pipe is any long column.
4. The dissipation heat pipe structure of claim 1 , wherein said hollow closed pipe is any flat column.
5. The dissipation heat pipe structure of claim 1 , wherein said column is any long column.
6. The dissipation heat pipe structure of claim 1 , wherein said column is any flat column.
7. The dissipation heat pipe structure of claim 1 , wherein said heat dissipation device is composed of a plurality of heat sink fins.
8. The dissipation heat pipe structure of claim 1 , wherein said column is combined a metal with a bracket structure of carbon element to form a heat conduction material.
9. The dissipation heat pipe structure of claim 8 , wherein said metal is copper.
10. The dissipation heat pipe structure of claim 8 , wherein said metal is aluminum.
11. The dissipation heat pipe structure of claim 8 , wherein said metal is silver.
12. The dissipation heat pipe structure of claim 8 , wherein said metal is a metal material with high thermal conductivity.
13. The dissipation heat pipe structure of claim 8 , wherein said bracket structure of carbon element is a diamond.
14. The dissipation heat pipe structure of claim 8 , wherein said heat conduction material can be formed by chemical vapor deposition (CVD).
15. The dissipation heat pipe structure of claim 8 , wherein said heat conduction material can be formed by physical vapor deposition (PVD).
16. The dissipation heat pipe structure of claim 8 , wherein said heat conduction material can be formed by melting.
17. The dissipation heat pipe structure of claim 8 , wherein said heat conduction material can be formed by electroplating.
18. A method for manufacturing a dissipation heat pipe structure, applied in conducting and dissipating a heat source generated by a chip, comprising:
employing a manufacturing to form a heat conduction material having a metal and a bracket structure of carbon element;
employing a die to form a hollow closed pipe and a column;
forming a wick structure in an interior wall of said hollow closed pipe and onto a surface of said column;
forming a type of fluid, set at an end within said hollow closed pipe; and
sealing said hollow closed pipe.
19. The method for manufacturing a dissipation heat pipe structure of claim 18 , further comprising providing copper to be said metal.
20. The method for manufacturing a dissipation heat pipe structure of claim 18 , further comprising providing aluminum to be said metal.
21. The method for manufacturing a dissipation heat pipe structure of claim 18 , further comprising providing silver to be said metal.
22. The method for manufacturing a dissipation heat pipe structure of claim 18 , further comprising providing a metal material having high thermal conductivity to be said metal.
23. The method for manufacturing a dissipation heat pipe structure of claim 18 , further comprising providing diamonds to be said bracket structure of carbon element.
24. The method for manufacturing a dissipation heat pipe structure of claim 18 , further comprising providing CVD to form said heat conduction material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/307,845 US20070199682A1 (en) | 2006-02-24 | 2006-02-24 | Dissipation Heat Pipe Structure and Manufacturing Method Thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/307,845 US20070199682A1 (en) | 2006-02-24 | 2006-02-24 | Dissipation Heat Pipe Structure and Manufacturing Method Thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
US20070199682A1 true US20070199682A1 (en) | 2007-08-30 |
Family
ID=38457699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/307,845 Abandoned US20070199682A1 (en) | 2006-02-24 | 2006-02-24 | Dissipation Heat Pipe Structure and Manufacturing Method Thereof |
Country Status (1)
Country | Link |
---|---|
US (1) | US20070199682A1 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101083249B1 (en) * | 2009-12-17 | 2011-11-17 | 티티엠주식회사 | Led lamp |
US20120211202A1 (en) * | 2011-02-18 | 2012-08-23 | Asia Vital Components Co., Ltd. | Low-profile heat transfer device |
DE102016103014A1 (en) * | 2016-02-22 | 2017-08-24 | Vision Electric Super Conductors Gmbh | Busbar and busbar system |
US20170343298A1 (en) * | 2016-05-27 | 2017-11-30 | Asia Vital Components Co., Ltd. | Heat dissipation component |
US20170347489A1 (en) * | 2016-05-27 | 2017-11-30 | Asia Vital Components Co., Ltd. | Heat dissipation element |
US20170343297A1 (en) * | 2016-05-27 | 2017-11-30 | Asia Vital Components Co., Ltd. | Heat dissipation device |
US10107557B2 (en) * | 2016-05-27 | 2018-10-23 | Asia Vital Components Co., Ltd. | Integrated heat dissipation device |
US11081937B2 (en) * | 2018-06-22 | 2021-08-03 | Chicony Power Technology Co., Ltd. | Integrated motor drive and integrated heat dissipation system |
Citations (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4734339A (en) * | 1984-06-27 | 1988-03-29 | Santrade Limited | Body with superhard coating |
US5045972A (en) * | 1990-08-27 | 1991-09-03 | The Standard Oil Company | High thermal conductivity metal matrix composite |
US5046553A (en) * | 1989-09-01 | 1991-09-10 | Deutsche Forschungsanstalt Fuer Luft- Und Raumfahrt E.V. | Heat pipe |
US5070936A (en) * | 1991-02-15 | 1991-12-10 | United States Of America As Represented By The Secretary Of The Air Force | High intensity heat exchanger system |
US5366688A (en) * | 1992-12-09 | 1994-11-22 | Iowa State University Research Foundation, Inc. | Heat sink and method of fabricating |
US5389400A (en) * | 1993-04-07 | 1995-02-14 | Applied Sciences, Inc. | Method for making a diamond/carbon/carbon composite useful as an integral dielectric heat sink |
US5552635A (en) * | 1994-01-11 | 1996-09-03 | Samsung Electronics Co., Ltd. | High thermal emissive semiconductor device package |
US5591034A (en) * | 1994-02-14 | 1997-01-07 | W. L. Gore & Associates, Inc. | Thermally conductive adhesive interface |
US5632158A (en) * | 1995-03-20 | 1997-05-27 | Calsonic Corporation | Electronic component cooling unit |
US5642779A (en) * | 1909-06-30 | 1997-07-01 | Sumitomo Electric Industries, Ltd. | Heat sink and a process for the production of the same |
US5925413A (en) * | 1996-03-25 | 1999-07-20 | Electrovac, Fabrikation Elektrotechnischer Spezialartikel Gesellschaft M.B.H. | Method of depositing a polycrystalline diamond layer on a nitride substrate |
US6055154A (en) * | 1998-07-17 | 2000-04-25 | Lucent Technologies Inc. | In-board chip cooling system |
US6255376B1 (en) * | 1997-07-28 | 2001-07-03 | Kyocera Corporation | Thermally conductive compound and semiconductor device using the same |
US20020023733A1 (en) * | 1999-12-13 | 2002-02-28 | Hall David R. | High-pressure high-temperature polycrystalline diamond heat spreader |
US20020130407A1 (en) * | 2001-01-19 | 2002-09-19 | Dahl Jeremy E. | Diamondoid-containing materials in microelectronics |
US6496373B1 (en) * | 1999-11-04 | 2002-12-17 | Amerasia International Technology, Inc. | Compressible thermally-conductive interface |
US6523259B1 (en) * | 1999-10-29 | 2003-02-25 | P1 Diamond, Inc. | Method of manufacturing a heat pipe |
US20030152773A1 (en) * | 2002-02-14 | 2003-08-14 | Chrysler Gregory M. | Diamond integrated heat spreader and method of manufacturing same |
US20030183372A1 (en) * | 2002-03-29 | 2003-10-02 | Cheng-Tien Lai | Heat pipe incorporating outer and inner pipes |
US20040105237A1 (en) * | 2001-01-22 | 2004-06-03 | Hoover David S. | CVD diamond enhanced microprocessor cooling system |
US20040175875A1 (en) * | 2002-10-11 | 2004-09-09 | Chien-Min Sung | Diamond composite heat spreader having thermal conductivity gradients and associated methods |
US20040183172A1 (en) * | 2002-10-22 | 2004-09-23 | Sumitomo Electric Industries, Ltd. | Package for housing semiconductor chip, and semiconductor device |
US20040253766A1 (en) * | 2002-10-11 | 2004-12-16 | Chien-Min Sung | Diamond composite heat spreader and associated methods |
US6844054B2 (en) * | 2001-04-30 | 2005-01-18 | Thermo Composite, Llc | Thermal management material, devices and methods therefor |
US20050086806A1 (en) * | 2003-10-22 | 2005-04-28 | Wert Kevin L. | Hybrid loop heat pipe |
US7051794B2 (en) * | 2003-07-21 | 2006-05-30 | Chin-Kuang Luo | Vapor-liquid separating type heat pipe device |
US7147367B2 (en) * | 2002-06-11 | 2006-12-12 | Saint-Gobain Performance Plastics Corporation | Thermal interface material with low melting alloy |
-
2006
- 2006-02-24 US US11/307,845 patent/US20070199682A1/en not_active Abandoned
Patent Citations (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5642779A (en) * | 1909-06-30 | 1997-07-01 | Sumitomo Electric Industries, Ltd. | Heat sink and a process for the production of the same |
US4734339A (en) * | 1984-06-27 | 1988-03-29 | Santrade Limited | Body with superhard coating |
US5046553A (en) * | 1989-09-01 | 1991-09-10 | Deutsche Forschungsanstalt Fuer Luft- Und Raumfahrt E.V. | Heat pipe |
US5045972A (en) * | 1990-08-27 | 1991-09-03 | The Standard Oil Company | High thermal conductivity metal matrix composite |
US5070936A (en) * | 1991-02-15 | 1991-12-10 | United States Of America As Represented By The Secretary Of The Air Force | High intensity heat exchanger system |
US5366688A (en) * | 1992-12-09 | 1994-11-22 | Iowa State University Research Foundation, Inc. | Heat sink and method of fabricating |
US5389400A (en) * | 1993-04-07 | 1995-02-14 | Applied Sciences, Inc. | Method for making a diamond/carbon/carbon composite useful as an integral dielectric heat sink |
US5552635A (en) * | 1994-01-11 | 1996-09-03 | Samsung Electronics Co., Ltd. | High thermal emissive semiconductor device package |
US5591034A (en) * | 1994-02-14 | 1997-01-07 | W. L. Gore & Associates, Inc. | Thermally conductive adhesive interface |
US5632158A (en) * | 1995-03-20 | 1997-05-27 | Calsonic Corporation | Electronic component cooling unit |
US5925413A (en) * | 1996-03-25 | 1999-07-20 | Electrovac, Fabrikation Elektrotechnischer Spezialartikel Gesellschaft M.B.H. | Method of depositing a polycrystalline diamond layer on a nitride substrate |
US6255376B1 (en) * | 1997-07-28 | 2001-07-03 | Kyocera Corporation | Thermally conductive compound and semiconductor device using the same |
US6055154A (en) * | 1998-07-17 | 2000-04-25 | Lucent Technologies Inc. | In-board chip cooling system |
US6523259B1 (en) * | 1999-10-29 | 2003-02-25 | P1 Diamond, Inc. | Method of manufacturing a heat pipe |
US6496373B1 (en) * | 1999-11-04 | 2002-12-17 | Amerasia International Technology, Inc. | Compressible thermally-conductive interface |
US20020023733A1 (en) * | 1999-12-13 | 2002-02-28 | Hall David R. | High-pressure high-temperature polycrystalline diamond heat spreader |
US20020130407A1 (en) * | 2001-01-19 | 2002-09-19 | Dahl Jeremy E. | Diamondoid-containing materials in microelectronics |
US20040105237A1 (en) * | 2001-01-22 | 2004-06-03 | Hoover David S. | CVD diamond enhanced microprocessor cooling system |
US6844054B2 (en) * | 2001-04-30 | 2005-01-18 | Thermo Composite, Llc | Thermal management material, devices and methods therefor |
US20030152773A1 (en) * | 2002-02-14 | 2003-08-14 | Chrysler Gregory M. | Diamond integrated heat spreader and method of manufacturing same |
US20030183372A1 (en) * | 2002-03-29 | 2003-10-02 | Cheng-Tien Lai | Heat pipe incorporating outer and inner pipes |
US7147367B2 (en) * | 2002-06-11 | 2006-12-12 | Saint-Gobain Performance Plastics Corporation | Thermal interface material with low melting alloy |
US20040253766A1 (en) * | 2002-10-11 | 2004-12-16 | Chien-Min Sung | Diamond composite heat spreader and associated methods |
US20040175875A1 (en) * | 2002-10-11 | 2004-09-09 | Chien-Min Sung | Diamond composite heat spreader having thermal conductivity gradients and associated methods |
US20040183172A1 (en) * | 2002-10-22 | 2004-09-23 | Sumitomo Electric Industries, Ltd. | Package for housing semiconductor chip, and semiconductor device |
US7051794B2 (en) * | 2003-07-21 | 2006-05-30 | Chin-Kuang Luo | Vapor-liquid separating type heat pipe device |
US20050086806A1 (en) * | 2003-10-22 | 2005-04-28 | Wert Kevin L. | Hybrid loop heat pipe |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101083249B1 (en) * | 2009-12-17 | 2011-11-17 | 티티엠주식회사 | Led lamp |
US20120211202A1 (en) * | 2011-02-18 | 2012-08-23 | Asia Vital Components Co., Ltd. | Low-profile heat transfer device |
US9074824B2 (en) * | 2011-02-18 | 2015-07-07 | Asia Vital Components Co., Ltd. | Low-profile heat transfer device |
DE102016103014A1 (en) * | 2016-02-22 | 2017-08-24 | Vision Electric Super Conductors Gmbh | Busbar and busbar system |
DE102016103014B4 (en) | 2016-02-22 | 2018-12-27 | Vision Electric Super Conductors Gmbh | Busbar and busbar system |
US20170343297A1 (en) * | 2016-05-27 | 2017-11-30 | Asia Vital Components Co., Ltd. | Heat dissipation device |
US20170347489A1 (en) * | 2016-05-27 | 2017-11-30 | Asia Vital Components Co., Ltd. | Heat dissipation element |
US10077945B2 (en) * | 2016-05-27 | 2018-09-18 | Asia Vital Components Co., Ltd. | Heat dissipation device |
US10107559B2 (en) * | 2016-05-27 | 2018-10-23 | Asia Vital Components Co., Ltd. | Heat dissipation component |
US10107557B2 (en) * | 2016-05-27 | 2018-10-23 | Asia Vital Components Co., Ltd. | Integrated heat dissipation device |
US20170343298A1 (en) * | 2016-05-27 | 2017-11-30 | Asia Vital Components Co., Ltd. | Heat dissipation component |
US10451355B2 (en) * | 2016-05-27 | 2019-10-22 | Asia Vital Components Co., Ltd. | Heat dissipation element |
US11081937B2 (en) * | 2018-06-22 | 2021-08-03 | Chicony Power Technology Co., Ltd. | Integrated motor drive and integrated heat dissipation system |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20070199682A1 (en) | Dissipation Heat Pipe Structure and Manufacturing Method Thereof | |
US6381135B1 (en) | Loop heat pipe for mobile computers | |
US11015879B2 (en) | Interface-free thermal management system for high power devices co-fabricated with electronic circuit | |
CN100495692C (en) | Capillary pump cooler with micro-groove wing structure and its manufacturing method | |
US7520315B2 (en) | Heat pipe with capillary wick | |
EP1927674A2 (en) | Evaporation source and vacuum evaporator using the same | |
US20070246194A1 (en) | Heat pipe with composite capillary wick structure | |
CN100547336C (en) | Penetrating support structure and manufacture method thereof | |
US20110083835A1 (en) | Heat-dissipating structure and method for fabricating the same | |
US20060256528A1 (en) | Air Blown Chip Dissipation Device and Manufacturing Method Thereof | |
CN1213071A (en) | Composite heat sink | |
Feng et al. | A novel ultra-large flat plate heat pipe manufactured by thermal spray | |
WO2012115214A1 (en) | Cooling device and method for producing same | |
TW200941195A (en) | Heat dissipation apparatus and heat pipe thereof | |
KR20030024916A (en) | Refrigeration device and a method for producing the same | |
CN110398167A (en) | A kind of trunk type support column soaking plate | |
Zuo et al. | Miniature high heat flux heat pipes for cooling of electronics | |
US20070199681A1 (en) | Dissipation Heat Pipe Structure and Manufacturing Method Thereof | |
US7427807B2 (en) | Chip heat dissipation structure and manufacturing method | |
US20070199677A1 (en) | Heat Sink Fin Structure and Manufacturing Method Thereof | |
CN103168210A (en) | Cooling device and method for producing same | |
CN101096748A (en) | Combined type copple | |
JP2006245569A (en) | Heat dissipation conduit structure for semiconductor chip and its production process | |
US20070201207A1 (en) | Chip Heat Dissipation System and Structure of Heat Exchange Device and Manufacturing Method Thereof | |
US20070199678A1 (en) | Surface Coating Film Structure on Heat Dissipation Metal and Manufacturing Method Thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: MITAC TECHNOLOGY CORP., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HWANG, MING-HANG;CHENG, YU-CHIANG;CHEN, CHAO-YI;AND OTHERS;REEL/FRAME:020344/0938;SIGNING DATES FROM 20060217 TO 20060507 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |