CN109267022A - A kind of target cooling device - Google Patents
A kind of target cooling device Download PDFInfo
- Publication number
- CN109267022A CN109267022A CN201811537494.1A CN201811537494A CN109267022A CN 109267022 A CN109267022 A CN 109267022A CN 201811537494 A CN201811537494 A CN 201811537494A CN 109267022 A CN109267022 A CN 109267022A
- Authority
- CN
- China
- Prior art keywords
- target
- backboard
- water
- cooling
- stand
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 40
- 238000007789 sealing Methods 0.000 claims abstract description 18
- 125000006850 spacer group Chemical group 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 12
- 238000003032 molecular docking Methods 0.000 abstract description 2
- 102000010637 Aquaporins Human genes 0.000 description 6
- 108010063290 Aquaporins Proteins 0.000 description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 240000002853 Nelumbo nucifera Species 0.000 description 1
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 1
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a kind of target cooling devices, including target stand, the target backboard being mounted on target stand, it is bundled in the positive target of target backboard, the water-cooling groove of a plurality of connection is offered at the back side of target backboard, water-cooling groove is sealed by water-cooling cover plate, the back side of target backboard be also provided be connected to water-cooling groove into, water outlet, on target stand with into, water outlet corresponding position have into, exhalant canal, into, exhalant canal with into, sealing spacer is built-in at water outlet docking, sealing ring is equipped in sealing spacer and target backboard junction, into, the other end of exhalant canal by connecting flange connection it is external into, outlet pipe.The present invention directly cools down target by backboard, good cooling results, can quickly reduce target temperature, every time when replacement target, directly backboard can be removed from target stand, not need disassembly disengaging water swivel, to reduce the damage to backboard, the efficiency of replacement is improved.
Description
Technical field
The present invention relates to technical field of vacuum plating, specially a kind of target cooling device.
Background technique
Sputter coating is exactly to make the particle deposition pounded in substrate using lotus energy particle bombardment target surface in a vacuum
On technology.In general, generating incident ion using low-pressure inert gas glow discharge.Cathode target is made of Coating Materials, base
Piece is passed through argon gas or other inert gases in vacuum chamber, the argon ion bombardment target surface ionized out, so that target atom as anode
It splashes out and is deposited on substrate, form film.
Target material assembly is target by meeting sputtering performance and can be in conjunction with target and the backboard with some strength is constituted,
Backboard can be assembled in target stand in the target material assembly and play a supporting role, and have effects that conduct heat.
A large amount of heat can be issued during vacuum splashing and plating, target needs uniform heat dissipation to guarantee not to be cracked,
In the prior art, it is utilized in target stand more and cooling duct is set, cool down backboard by way of indirect water-cooling, pass through backboard
Target is transmitted to absorb the heat that target generates in sputtering process, this kind of mode cooling effect is low, conducts heat not significant, cooling
Effect is undesirable, can usually cause to burn target or the cracked phenomenon of target material surface.
Summary of the invention
The present invention is directed to above-mentioned problems of the prior art, provides a kind of target cooling device, direct by backboard
Target is cooled down.
The technical solution adopted by the invention is as follows: a kind of target cooling device, including target stand, the target being mounted on target stand
Backboard is bundled in the positive target of target backboard, offers the water-cooling groove of a plurality of connection at the back side of target backboard, water-cooling groove is logical
Cross water-cooling cover plate sealing, inlet and outlet be connected to water-cooling groove are also provided at the back side of target backboard, on target stand and
Inlet and outlet corresponding position has an intake tunnel and exhalant canal, intake tunnel and exhalant canal with water inlet
With sealing spacer is built-in at water outlet docking, sealing spacer and target backboard junction be equipped with sealing ring, intake tunnel and
The other end of exhalant canal connects external inlet tube and outlet tube by connecting flange.
Further, the position that water-cooling groove opens up is corresponding with target location.
The present invention by there is the back side of the backboard of target to process a plurality of water-cooling groove in binding, by backboard directly to target into
Row cooling, good cooling results can quickly reduce target temperature, the cooling water in water-cooling groove by the intake-outlet at the backboard back side into
Out, disengaging aquaporin, external inlet tube and outlet tube and the connection being arranged on target stand are equipped with intake-outlet corresponding position on target stand
Flanged joint, cooling water are docked by passing in and out aquaporin with the intake-outlet on backboard, the disengaging on disengaging aquaporin and backboard
By sealing spacer and sealing ring sealing between the mouth of a river, it is not necessarily to connector, it, can be directly by backboard from target stand when replacing target every time
It removes, does not need disassembly disengaging water swivel to reduce the damage to backboard and improve the efficiency of replacement.
Detailed description of the invention
Fig. 1 is overall structure diagram of the invention.
Fig. 2 is back board structure schematic diagram of the invention.
Fig. 3 is backboard sectional view of the invention.
Fig. 4 is structural schematic diagram at the backboard intake-outlet of this practicability.
Specific embodiment
To facilitate the understanding of the present invention, the present invention is made below in conjunction with Figure of description and preferred embodiment more complete
Face meticulously describes, but the protection scope of the present invention is not limited to the following specific embodiments.
As shown in Fig. 1-Fig. 4, a kind of target cooling device of the invention, including target stand 1, the target being mounted on target stand 1
Backboard 2 is bundled in the positive target 3 of target backboard 2, offers the water-cooling groove 201 of a plurality of connection at the back side of target backboard 2,
The position that water-cooling groove 201 opens up is corresponding with target location, and water-cooling groove 201 is sealed by water-cooling cover plate 202, in target backboard 2
The back side be also provided with the water inlet 203 and water outlet 204 being connected to water-cooling groove, it is corresponding with inlet and outlet on target stand 1
Position has intake tunnel and exhalant canal 101, and intake tunnel and exhalant canal 101 are docked with inlet and outlet
Place is built-in with sealing spacer 102, is equipped with sealing ring in sealing spacer 102 and 2 junction of target backboard, intake tunnel and water outlet are logical
The other end in road 101 connects external inlet tube and outlet tube by connecting flange 103.
The present invention by there is the back side of the backboard of target to process a plurality of water-cooling groove in binding, by backboard directly to target into
Row cooling, can quickly reduce target temperature, and the cooling water in water-cooling groove is passed in and out by the intake-outlet at the backboard back side, on target stand
It is equipped with disengaging aquaporin with intake-outlet corresponding position, external inlet tube and outlet tube is connect with the connecting flange being arranged on target stand, cold
But water is docked by passing in and out aquaporin with the intake-outlet on backboard, is passed in and out and is passed through between the intake-outlet on aquaporin and backboard
Spacer and sealing ring sealing are sealed, connector is not necessarily to, when replacing target every time, directly backboard can be removed from target stand, do not needed
Disassembly disengaging water swivel improves the efficiency of replacement to reduce the damage to backboard.
With the help of the introduction present in aforementioned specification and relevant drawings, those skilled in the art in the invention will
It will recognize that many modifications and other embodiments of the invention.It will consequently be understood that the present invention is not limited to disclosed specific realities
Scheme is applied, modification and other embodiments are to be considered as included in scope of the appended claims.Although spy is used herein
Determine term, they are only used with generic and descriptive sense, rather than limitation.
Claims (2)
1. a kind of target cooling device including target stand, the target backboard being mounted on target stand, is bundled in the positive target of target backboard
Material, it is characterised in that: the water-cooling groove of a plurality of connection is offered at the back side of target backboard, water-cooling groove is sealed by water-cooling cover plate,
The inlet and outlet being connected to water-cooling groove are also provided at the back side of target backboard, on target stand with inlet and outlet pair
Answer position to have an intake tunnel and exhalant canal, intake tunnel and exhalant canal at being docked with inlet and outlet in
It is equipped with sealing spacer, is equipped with sealing ring, the other end of intake tunnel and exhalant canal in sealing spacer and target backboard junction
External inlet tube and outlet tube is connected by connecting flange.
2. a kind of target cooling device as described in claim 1, it is characterised in that: the position and target location that water-cooling groove opens up
It is corresponding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811537494.1A CN109267022A (en) | 2018-12-15 | 2018-12-15 | A kind of target cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811537494.1A CN109267022A (en) | 2018-12-15 | 2018-12-15 | A kind of target cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109267022A true CN109267022A (en) | 2019-01-25 |
Family
ID=65187508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811537494.1A Pending CN109267022A (en) | 2018-12-15 | 2018-12-15 | A kind of target cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109267022A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111719122A (en) * | 2019-03-21 | 2020-09-29 | 广东太微加速器有限公司 | Target |
| CN112144034A (en) * | 2019-06-27 | 2020-12-29 | 昆山世高新材料科技有限公司 | Cooling back plate |
| CN112323026A (en) * | 2020-10-29 | 2021-02-05 | 珠海和泽科技有限公司 | Target material back plate and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5433835A (en) * | 1993-11-24 | 1995-07-18 | Applied Materials, Inc. | Sputtering device and target with cover to hold cooling fluid |
| JPH09125245A (en) * | 1995-10-31 | 1997-05-13 | Sony Corp | Sputtering system |
| CN1957107A (en) * | 2004-12-28 | 2007-05-02 | F·T·S·股份有限公司 | Opposing target type sputter device |
| KR20090005445U (en) * | 2007-11-30 | 2009-06-03 | (주) 에이알티 | Cooling cathode |
| CN209338651U (en) * | 2018-12-15 | 2019-09-03 | 湖南玉丰真空科学技术有限公司 | A kind of target cooling device |
-
2018
- 2018-12-15 CN CN201811537494.1A patent/CN109267022A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5433835A (en) * | 1993-11-24 | 1995-07-18 | Applied Materials, Inc. | Sputtering device and target with cover to hold cooling fluid |
| US5433835B1 (en) * | 1993-11-24 | 1997-05-20 | Applied Materials Inc | Sputtering device and target with cover to hold cooling fluid |
| JPH09125245A (en) * | 1995-10-31 | 1997-05-13 | Sony Corp | Sputtering system |
| CN1957107A (en) * | 2004-12-28 | 2007-05-02 | F·T·S·股份有限公司 | Opposing target type sputter device |
| KR20090005445U (en) * | 2007-11-30 | 2009-06-03 | (주) 에이알티 | Cooling cathode |
| CN209338651U (en) * | 2018-12-15 | 2019-09-03 | 湖南玉丰真空科学技术有限公司 | A kind of target cooling device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111719122A (en) * | 2019-03-21 | 2020-09-29 | 广东太微加速器有限公司 | Target |
| CN112144034A (en) * | 2019-06-27 | 2020-12-29 | 昆山世高新材料科技有限公司 | Cooling back plate |
| CN112144034B (en) * | 2019-06-27 | 2022-12-30 | 昆山世高新材料科技有限公司 | Cooling back plate |
| CN112323026A (en) * | 2020-10-29 | 2021-02-05 | 珠海和泽科技有限公司 | Target material back plate and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190125 |
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| RJ01 | Rejection of invention patent application after publication |