CN209890728U - Cooling assembly of magnetron sputtering reaction chamber and magnetron sputtering equipment thereof - Google Patents
Cooling assembly of magnetron sputtering reaction chamber and magnetron sputtering equipment thereof Download PDFInfo
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- CN209890728U CN209890728U CN201920110253.2U CN201920110253U CN209890728U CN 209890728 U CN209890728 U CN 209890728U CN 201920110253 U CN201920110253 U CN 201920110253U CN 209890728 U CN209890728 U CN 209890728U
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Abstract
The embodiment of the utility model discloses cooling module of magnetron sputtering reaction cavity and magnetron sputtering equipment thereof, subassembly wherein includes: an adapter; the adapter is configured to shield the bottom and sidewalls of the liner for securing the liner within the reaction chamber; the lateral wall of adapter and the lateral wall of inside lining have predetermined clearance between, and the bottom of adapter and inside lining contacts, and the adapter is provided with the cooling water course for cool down to the lateral wall of inside lining, bottom. The cooling component and the magnetron sputtering equipment thereof can increase the thermal contact area and increase the heat transfer efficiency between the adapter and the side wall of the lining; the temperature of the reaction area of the process is stabilized by cooling the side wall and the bottom surface of the lining, and the influence of the temperature rise of the reaction area on the substrate and the film is avoided; the steps and difficulty of processing the water channel are reduced, and the cleaning difficulty is reduced; need not the sealed of sealing washer to the water route, can reduce the risk of leaking.
Description
Technical Field
The utility model relates to a semiconductor manufacturing technology field especially relates to a cooling module of magnetron sputtering reaction cavity and magnetron sputtering equipment thereof.
Background
Physical Vapor Deposition (PVD) is widely used in the semiconductor field, and a Sputtering Deposition technique is adopted, in which inert gas such as argon is introduced between a substrate and a target, the inert gas is ionized by high voltage to generate plasma, the generated plasma bombards the target by enhancing the ability of binding electrons through a magnetic field, and atoms or ions of the target material are deposited on the substrate to form a thin film. The existing magnetron sputtering apparatus is shown in fig. 1, the apparatus has a reaction chamber 1, a target 2 is arranged in the reaction chamber 1, an insulating material 3 is arranged above the target 2 for insulating the target, and water cooling can be added between the material and the target 2 for cooling the target. In the sputtering process, a power supply applies bias to the target 2 to enable the target to be negative pressure relative to a grounded cavity, inert gas is introduced in a vacuum environment to discharge so as to ionize the inert gas to form plasma, and the negative bias can attract the positively charged plasma to the target 2.
When the energy of the plasma is high enough and bombards the target 2 under the action of the magnetic field formed by the rotating magnetron 4, metal atoms or metal ions will be allowed to escape from the target surface and be deposited on the wafer 6 by diffusion, and the reference numeral 5 is the base for bearing the substrate 6, but even if there is the binding action of the magnetron 4 to the metal atoms, a large amount of metal atoms and metal ions will be deposited on the inner wall of the reaction chamber 1, and contaminate the substrate and the reaction chamber 1 after detachment, and in view of the difficulty of cleaning the reaction chamber, a lining (Shield)9, a Cover plate (Cover ring)8, a deposition ring (Dep-ring)7 are provided to Shield the metal atoms and metal ions contaminating the reaction chamber, and the metal films of the lining (Shield)9, the Cover plate (Cover ring)8, and the deposition ring (Dep-ring)7 will not detach by increasing the surface roughness, and regular cleaning is required, Sand blasting and melt jetting, wherein an adapter10 is used for fixing a lining (Shield)9, a Cover plate (Cover ring)8 and a deposition ring (Dep-ring)7 on a reaction chamber 1, and in the magnetron sputtering process, metal ions and atoms are escaped to carry huge heat, so that the temperature of the inner wall of the reaction chamber 1 is increased, particularly the temperature of the lining (Shield)9, the Cover plate (Cover ring)8 and the deposition ring (Dep-ring)7 is increased beyond the temperature range of the process reaction, the process is not facilitated, and a series of problems such as film stress failure to reach the standard and whisker defects occur. At present, the lining 9 and the like are cooled in various ways, but the problems of limited cooling capacity, slow heat conduction rate, low efficiency, high cost, high processing difficulty and the like exist, and the quality of the film is influenced.
SUMMERY OF THE UTILITY MODEL
In view of this, the embodiment of the present invention provides a cooling assembly of a magnetron sputtering reaction chamber and a magnetron sputtering apparatus thereof.
According to an aspect of the embodiments of the present invention, there is provided a cooling assembly of a magnetron sputtering reaction chamber, including: an adapter; the adapter is configured to shield the bottom and sidewalls of the liner for securing the liner within the reaction chamber; the lateral wall of adapter with preset clearance has between the lateral wall of inside lining, the bottom of adapter with the bottom of inside lining contacts, the adapter is provided with the cooling water course for it is right the lateral wall of inside lining, bottom cool down.
Optionally, the cooling water channel is disposed inside a sidewall of the adapter and inside a bottom of the adapter.
Optionally, the adapter is a cylindrical structure with two open ends; the inner side of the side wall of the adapter is in clearance fit with the outer wall of the lining; the bottom of adapter is provided with the supporting part, the bottom of inside lining with the supporting part contacts.
Optionally, the cooling flume comprises: a first water channel, a second water channel; the first water channel is arranged inside the side wall of the adapter, the second water channel is arranged inside the supporting portion, and the first water channel is communicated with the second water channel.
Optionally, the first waterway comprises: a water outlet channel and a water return channel; the water outlet of the water outlet channel and the water return port of the water return channel are both arranged on the outer side of the side wall of the adapter.
Optionally, the water outlet channel and the water return channel are inclined channels inclined towards the top of the adapter, and the water outlet channel and the water return channel are respectively communicated with the second channel.
Optionally, the cooling flume comprises: a third water channel; the third water channel is arranged inside the side wall of the adapter and is used for communicating the water outlet channel with the second water channel and communicating the water return channel with the second water channel.
Optionally, the second waterway is an annular waterway disposed inside the support portion; joints are arranged at the water outlet of the water outlet channel and the water return port of the water return channel.
Optionally, the first water channel further comprises a portion surrounding a side wall of the adapter, and the portion surrounding the side wall of the adapter is respectively communicated with the water outlet channel and the water return channel.
According to another aspect of the embodiments of the present invention, there is provided a magnetron sputtering apparatus, including: the cooling assembly of the magnetron sputtering reaction chamber is described above.
The cooling component of the magnetron sputtering reaction chamber and the magnetron sputtering device thereof can increase the thermal contact area by arranging the adapter to shield the bottom and the side wall of the lining and ensure that the bottom surface of the lining is attached to the adapter; a preset gap is arranged between the side wall of the adapter and the side wall of the lining, so that the heat transfer efficiency of the adapter and the side wall of the lining is improved; the temperature of the reaction area of the process is stabilized by cooling the side wall and the bottom surface of the lining, the heat conduction of the lining around the substrate is effectively increased, the temperature rise phenomenon of the substrate caused by magnetron sputtering is reduced, the influence of the temperature rise of the reaction area on the substrate and a film is avoided, impurities released by the lining due to high temperature are effectively avoided, and the product quality is improved; the cooling water channel is arranged in the adapter, so that the processing steps and difficulty are reduced, the cleaning difficulty is reduced, and the disassembly and assembly difficulty caused by the addition of a water channel process assembly is reduced; simple structure, cooling efficiency is high, need not the sealed of sealing washer to the water route, has reduced the risk of leaking.
Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
In order to illustrate the embodiments of the present invention or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise:
FIG. 1 is a schematic diagram of a magnetron sputtering apparatus of the prior art;
fig. 2 is a schematic view of a cooling assembly of a magnetron sputtering reaction chamber according to the present invention;
figure 3 is a schematic view of an adapter of a cooling assembly of a magnetron sputtering reaction chamber according to the present invention;
FIG. 4 is a schematic view of a cooling water channel of a cooling assembly of a magnetron sputtering reaction chamber according to the present invention;
fig. 5 is a schematic view of another cooling water channel of a cooling assembly of a magnetron sputtering reaction chamber according to the present invention.
Detailed Description
The present invention now will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. The technical solution of the present invention is described in many aspects with reference to the drawings and the embodiments.
Hereinafter, for convenience of description, the terms "left", "right", "up" and "down" will be used in accordance with the left, right, up and down directions of the drawings themselves. The terms "first", "second", and the like, hereinafter, are used for descriptive purposes only and have no other special meanings.
As shown in fig. 2 to 5, the present invention provides a cooling assembly of a magnetron sputtering reaction chamber, which includes an adapter 20. The adapter 20 is configured to cover the bottom and the side wall of the liner 19, and is capable of receiving the liner 19 therein for fixing the liner 19 in the reaction chamber, and the adapter 20 is fixedly connected with the liner 19, wherein the fixed connection includes a threaded connection and the like, for example, the liner 19 is fixed on the adapter 20 by using a screw. The adapter 20 and the liner 19 are both made of metal.
The adapter 20 may have a variety of configurations and the cooling water passages may be arranged in a variety of ways. A cooling water passage is provided between the side wall of the adapter 20 and the bottom of the adapter 20, and a predetermined gap is provided between the side wall of the adapter 20 and the side wall of the liner 19. To ensure the accuracy of the liner 19, considering the problems of thermal expansion at high temperatures and deformation of the liner 19, a small gap 204 may be provided between the liner 19 and the upper surface of the adapter 20, for example, the gap may be 0.05-0.2mm, thereby allowing for adjustment of expansion or contraction deformation after temperature changes. The bottom of the adapter 20 is in contact with the bottom of the liner 19. The adapter 20 may cool the sidewall, bottom of the liner 19. The cooling water passage may be provided in various manners, for example, the cooling water passage may be provided inside the side wall of the adapter 20 and inside the bottom of the adapter 20.
In one embodiment, the adapter 20 is a cylindrical structure with two open ends, and the inside of the side wall 212 of the adapter 20 is in clearance fit with the outer wall of the liner 19, the clearance being as small as possible while ensuring that the liner 19 can be smoothly installed into the adapter 20. The bottom of the adapter 20 is provided with a support 205, and the bottom of the liner 19 is in contact with the support 205. The supporting portion 205 is circular, so that the thickness of the supporting portion is not too large for heat transfer, and the inner diameter of the supporting portion 205 is not smaller than the inner diameter of the lining 19 for facilitating the lifting of the substrate. After the liner 19 is inserted into the adapter 20, the liner is supported in the vertical direction by the support portions 205, and the sidewall 212 of the adapter 20 and the outer wall of the liner 19 are positioned to ensure coaxial arrangement.
The support portion 205 of the adapter 20 is added to support the liner 19, and the bottom surface of the liner 19 is tightly fitted to the support portion 205 by the gravity. The water passage is added to the support portion 205, and the temperature of the bottom surface of the liner 19 is lowered by heat transfer through thermal contact. The side wall 212 of the adapter 20 is a clearance fit with the side wall of the liner 19, and the clearance satisfies the installation condition. The side wall 212 of the adapter 20 is provided with a cooling water channel, so that the heat conduction efficiency of the adapter 20 and the side wall of the liner 19 is increased, and the cooling of the side wall of the liner 19 is realized. The temperature of the reaction area of the process is stabilized by cooling the side wall and the bottom surface of the lining 19.
In one embodiment, the structure of the adapter 20 is divided into two parts, i.e., the inner part of the reaction chamber and the outer part of the reaction chamber, and the structure of the adapter 20 positioned at the outer part of the reaction chamber may be a square chamfer structure. The cooling water passage 202 includes: first and second channels 207, 207', 208. A first flume 207, 207' is provided inside the side wall 212 of the adapter for incoming and returning water.
The second water channel 208 may be disposed inside the supporting portion 205 (not shown), or may be disposed at a position near the supporting portion 205 at the bottom of the side wall 212 of the adapter, as shown in fig. 2 and 3, and the bottom of the lining 19 is cooled by heat conduction of the supporting portion 205, and the first water channel 207, 207' is communicated with the second water channel 208. The first water channel 207,207 'may be an outlet water channel 207 and a return water channel 207', respectively, and the outlet of the outlet water channel and the return water port of the return water channel are both disposed outside the sidewall 212 of the adapter 20. The joint 213 is arranged at the water outlet of the water outlet channel and the water return port of the water return channel, and the joint 213 can be connected and sealed by adopting a connection mode such as welding and the like and arranging a sealing ring.
The cooling channel 202 may also include a third channel 209, the third channel 209 being disposed within the side wall 212 of the adapter, the third channel 209 being configured to communicate the outlet channel 207 with the second channel 208 and to communicate the return channel 207' with the second channel 208. The second water channel 208 may be an annular water channel disposed inside the support portion 205.
A third channel 209 may be provided in the annular second channel 208 for connecting the first channels 207,207 'or the third channel 209 may not be provided, and is directly connected to the second channel 208 via the first channels 207, 207'. The outlet water channel 207 and the return water channel 207 'may be inclined channels inclined toward the top of the adapter, i.e., the outlet water channel 207 and the return water channel 207' are inclined upward from left to right with respect to the horizontal form shown in fig. 3, thereby increasing the cooling effect of the channels on the upper side of the enclosed area. The water outlet channel and the water return channel are respectively communicated with the second channel 208.
The second water channel 208 may be formed by various methods, for example, a groove-shaped annular water channel may be formed on the supporting portion 205, and the groove-shaped annular water channel may be sealed by welding with the welding block 214 to form the annular second water channel 208. The welding mode is stable and reliable, and the condition of water leakage can not occur.
The first water channel 207,207 'may also include a portion (not shown) surrounding the side wall of the adapter 20, the portion surrounding the side wall of the adapter 20 being in communication with the outlet water channel 207 and the return water channel 207', respectively. By adding a portion of the sidewall surrounding the adapter 20, the cooling effect is increased. The arrangement of the cooling water channel 202 in the adapter 20 is not limited to the above-mentioned embodiments, and may be configured differently according to the needs of the cooling portion, and will not be described herein.
In one embodiment, the present invention provides a magnetron sputtering apparatus including a cooling assembly of a magnetron sputtering reaction chamber as in any of the above embodiments. A seal ring 210 is provided between the lower mounting surface of the adapter 20 and the mounting surface of the reaction chamber 11, and between the upper mounting surface of the adapter 20 and the mounting surface of the insulating block 211. A cover plate 18 is provided on the inner liner 19. Two sealing rings 210 are used to seal the upper surface of the adapter 20 to the insulating block 211 and the lower surface of the adapter 20 to the reaction chamber 11, respectively, thereby sealing the process kit.
In the cooling assembly of the magnetron sputtering reaction chamber and the magnetron sputtering device thereof in the above embodiments, the adapter is arranged to shield the bottom and the side wall of the liner, and preferably, a support part is added at the bottom of the adapter which does not need to be cleaned for supporting the liner, so that the bottom surface of the liner is attached to the adapter, and the thermal contact area can be increased; a preset gap is arranged between the side wall of the adapter and the side wall of the lining, so that the heat transfer efficiency of the adapter and the side wall of the lining is improved; the temperature of the reaction area of the process is stabilized by cooling the side wall and the bottom surface of the lining, the heat conduction of the lining around the substrate is effectively increased, the temperature rise phenomenon of the substrate caused by magnetron sputtering is reduced, the influence of the temperature rise of the reaction area on the substrate and a film is avoided, impurities released by the lining due to high temperature are effectively avoided, and the product quality is improved; the cooling water channel is arranged in the adapter, so that the processing steps and difficulty are reduced, the cleaning difficulty is reduced, the process problem caused by unsatisfactory cleaning, sand blasting and meltdown effects due to the fact that a water channel is protected is avoided, and the assembly and disassembly difficulty caused by the addition of water channel process components is also reduced; simple structure, cooling efficiency is high, need not the sealed of sealing washer to the water route, has reduced the risk of leaking.
Any technical solution disclosed in the present invention is, unless otherwise stated, disclosed a numerical range if it is disclosed, and the disclosed numerical range is a preferred numerical range, and any person skilled in the art should understand that: the preferred ranges are merely those values which are obvious or representative of the technical effect which can be achieved. Because numerical value is more, can't be exhaustive, so the utility model discloses just disclose some numerical values with the illustration the technical scheme of the utility model to, the numerical value that the aforesaid was enumerated should not constitute right the utility model discloses create the restriction of protection scope.
Also, above-mentioned the utility model discloses if disclose or related to mutually fixed connection's spare part or structure, then, except that other the note, fixed connection can understand: a detachable fixed connection (for example using bolts or screws) is also understood as: non-detachable fixed connections (e.g. riveting, welding), but of course, fixed connections to each other may also be replaced by one-piece structures (e.g. manufactured integrally using a casting process) (unless it is obviously impossible to use an integral forming process).
In addition, the terms used in any aspect of the present disclosure as described above to indicate positional relationships or shapes include similar, analogous, or approximate states or shapes unless otherwise stated. The utility model provides an arbitrary part both can be assembled by a plurality of solitary component parts and form, also can be the solitary part that the integrated into one piece technology was made.
The above embodiments are only used to illustrate the technical solution of the present invention and not to limit it; although the present invention has been described in detail with reference to preferred embodiments, it should be understood by those skilled in the art that: the invention can be modified or equivalent substituted for some technical features; without departing from the spirit of the present invention, it should be understood that the scope of the claims is intended to cover all such modifications and variations.
The description of the present invention has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to practitioners skilled in this art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Claims (10)
1. A cooling assembly for a magnetron sputtering reaction chamber, comprising:
an adapter; the adapter is configured to shield the bottom and sidewalls of the liner for securing the liner within the reaction chamber; the lateral wall of adapter with preset clearance has between the lateral wall of inside lining, the bottom of adapter with the bottom of inside lining contacts, the adapter is provided with the cooling water course for it is right the lateral wall of inside lining, bottom cool down.
2. The cooling assembly of claim 1,
the cooling water channel is arranged inside the side wall of the adapter and inside the bottom of the adapter.
3. The cooling assembly of claim 2,
the adapter is a cylindrical structure with two open ends; the inner side of the side wall of the adapter is in clearance fit with the outer wall of the lining; the bottom of adapter is provided with the supporting part, the bottom of inside lining with the supporting part contacts.
4. The cooling assembly of claim 3,
the cooling water channel includes: a first water channel, a second water channel; the first water channel is arranged inside the side wall of the adapter, the second water channel is arranged inside the supporting portion, and the first water channel is communicated with the second water channel.
5. The cooling assembly of claim 4,
the first waterway comprises: a water outlet channel and a water return channel; the water outlet of the water outlet channel and the water return port of the water return channel are both arranged on the outer side of the side wall of the adapter.
6. The cooling assembly of claim 5,
the water outlet channel and the water return channel are inclined channels inclined towards the top of the adapter, and the water outlet channel and the water return channel are respectively communicated with the second channel.
7. The cooling assembly of claim 5,
the cooling water channel includes: a third water channel; the third water channel is arranged inside the side wall of the adapter and is used for communicating the water outlet channel with the second water channel and communicating the water return channel with the second water channel.
8. The cooling assembly of claim 5,
the second water channel is an annular water channel arranged in the supporting part; joints are arranged at the water outlet of the water outlet channel and the water return port of the water return channel.
9. The cooling assembly of claim 5,
the first water channel further comprises a part surrounding the side wall of the adapter, and the part surrounding the side wall of the adapter is communicated with the water outlet channel and the water return channel respectively.
10. A magnetron sputtering apparatus, comprising:
the cooling assembly of the magnetron sputtering reaction chamber of any of claims 1 to 9.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920110253.2U CN209890728U (en) | 2019-01-23 | 2019-01-23 | Cooling assembly of magnetron sputtering reaction chamber and magnetron sputtering equipment thereof |
| TW109101255A TWI765213B (en) | 2019-01-23 | 2020-01-14 | Lined cooling components, reaction chambers and semiconductor processing equipment |
| KR1020217023726A KR102641209B1 (en) | 2019-01-23 | 2020-01-15 | Lining cooling assemblies, reaction chambers and semiconductor processing devices |
| JP2021542550A JP2022518518A (en) | 2019-01-23 | 2020-01-15 | Shielded cooling assembly, reaction chamber, and semiconductor processing equipment |
| PCT/CN2020/072184 WO2020151542A1 (en) | 2019-01-23 | 2020-01-15 | Liner cooling assembly, reaction chamber, and semiconductor processing apparatus |
| US17/384,240 US20210351016A1 (en) | 2019-01-23 | 2021-07-23 | Shield cooling assembly, reaction chamber and semiconductor processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920110253.2U CN209890728U (en) | 2019-01-23 | 2019-01-23 | Cooling assembly of magnetron sputtering reaction chamber and magnetron sputtering equipment thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209890728U true CN209890728U (en) | 2020-01-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920110253.2U Active CN209890728U (en) | 2019-01-23 | 2019-01-23 | Cooling assembly of magnetron sputtering reaction chamber and magnetron sputtering equipment thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209890728U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109735814A (en) * | 2019-01-23 | 2019-05-10 | 北京北方华创微电子装备有限公司 | The cooling component and its magnetron sputtering apparatus of magnetron sputtering reaction chamber |
| WO2020151542A1 (en) * | 2019-01-23 | 2020-07-30 | 北京北方华创微电子装备有限公司 | Liner cooling assembly, reaction chamber, and semiconductor processing apparatus |
-
2019
- 2019-01-23 CN CN201920110253.2U patent/CN209890728U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109735814A (en) * | 2019-01-23 | 2019-05-10 | 北京北方华创微电子装备有限公司 | The cooling component and its magnetron sputtering apparatus of magnetron sputtering reaction chamber |
| WO2020151542A1 (en) * | 2019-01-23 | 2020-07-30 | 北京北方华创微电子装备有限公司 | Liner cooling assembly, reaction chamber, and semiconductor processing apparatus |
| CN109735814B (en) * | 2019-01-23 | 2023-12-22 | 北京北方华创微电子装备有限公司 | Cooling assembly of magnetron sputtering reaction chamber and magnetron sputtering equipment thereof |
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