TWI441934B - And rotating the adapter - Google Patents

Description

Rotary adapter and sputtering device

The present invention relates to a rotary joint and a sputtering apparatus having the same.

Conventionally, in a plasma processing apparatus such as a sputtering apparatus, a rotary joint is used in order to flow a fluid from a fixed portion side to a rotating portion side. For example, Japanese Laid-Open Patent Publication No. 2003-147519 discloses a sputtering apparatus including a support having a cathode surface on which a plurality of targets can be mounted. Since the cathode of the sputtering apparatus is cooled at the same time, a rotary joint as in the case of Japanese Laid-Open Patent Publication No. 2006-177453 is used. Japanese Laid-Open Patent Publication No. 2006-177453 discloses a cylindrical body that switches a complex flow path and a cylindrical frame, and a cylindrical system is supplied as a cylindrical system. The direction of the flow path changes when the shaft of the shape is rotated.

However, as the size of the sputtering apparatus is required to be reduced, the conventional rotary joint cannot be used. Here, the inventors have carefully studied the results, and in order to reduce the size of the rotary jointer, the target material is efficiently cooled, and the cooling water in a large flow rate is concentrated to cool the target in use. The target is cooled by a relatively small amount of cooling water.

The present invention has been made in order to solve the above-described problems, and an object of the invention is to provide a rotary joint that can efficiently cool a device while reducing the size of the device, and a sputtering device including a rotary joint.

In order to solve the above problems, a rotary joint according to one aspect of the present invention includes a frame body having an insertion hole and an introduction port for introducing a fluid from the outside; and a shaft unit The insertion hole inserted into the frame body is rotatable relative to the rotating shaft, and the first shaft body unit introduction path and the second shaft body unit introduction path are in the shaft body unit. Formed along the rotation axis direction for communicating with the introduction port; and a switching member disposed between the first shaft unit introduction path and the second shaft unit introduction path for switching the fluid The switching member includes: a first hole, and a second hole smaller than a diameter of the first hole and smaller than a diameter of the first shaft unit introduction path and the second shaft unit introduction path; The first hole of the switching member is aligned with one of the first shaft unit introduction path or the second shaft unit introduction path, and is switched to communicate with the upstream side and the downstream side, and the second switching member is In alignment with said first shaft unit or the second shaft introducing path introducing path of the other unit, the communication is switched to the upstream side and the downstream side.

A sputtering apparatus according to another aspect of the present invention is characterized by comprising: a housing having an insertion hole and having an introduction port for introducing a fluid from the outside; and a shaft unit inserted into the housing The insertion hole of the frame body is rotatable relative to the rotating body with respect to the rotating shaft; the first shaft unit introducing path and the second shaft unit introducing path, wherein the rotation is along the rotation in the shaft unit An axial direction is formed to communicate with the introduction port; and a switching member is disposed between the first shaft unit introduction path and the second shaft unit introduction path for switching the flow rate of the fluid; The switching member includes a first hole, and a second hole smaller than a diameter of the first hole and smaller than a diameter of the first shaft unit introduction path and the second shaft unit introduction path, and includes a rotary joint. The first hole of the switching member may be aligned with one of the first shaft unit introduction path or the second shaft unit introduction path, and switched to communicate with the upstream side and the downstream side, and the switching member may be 2 holes are aligned with the other of the first shaft unit introduction path or the second shaft unit introduction path, and are switched to communicate with the upstream side and the downstream side; a rotatable support body for supporting a plurality of targets; a first cathode provided in the support body to perform sputtering treatment on the target, and includes a first pipe through which a fluid from the first shaft unit introduction path is passed; and a second cathode In order to perform sputtering treatment on the target, the support is provided on the support, and a second pipe through which the fluid from the second shaft unit introduction path flows is provided.

According to the present invention, it is possible to provide a rotary adapter that can efficiently cool the device while providing a switching member for switching fluid in the rotary joint, and a sputtering device having the rotary adapter. .

Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the embodiment.

(First embodiment)

Fig. 1 is a schematic plan view for explaining the overall configuration of a sputtering apparatus according to the present invention.

Each of the sputtering chambers 14 includes three substrate holders 10 for mounting a substrate (glass substrate) 12, and support bodies 50, 52, 54, 50', 52' having the same configuration as the both sides of the substrate holder 10. 54'. The shape of the substrate 12 is a rectangular parallel plate. The substrate holder 10 is placed in the sputtering chamber 14 via the gate valve 16 in the direction in which the substrate 12 is mounted, and is positioned. The supports 50, 52, 54, 50', 52' and 54' are each formed in the shape of a hexagonal column. The cross section of the hexagonal column is constructed by alternately forming a short side and a long side of the side. A cathode is provided on the side of the hexagonal column having the side of the long side of the side. The support bodies 50, 52, 54, 50', 52', 54' are provided with a rotation drive mechanism 101 (Fig. 5), and each of the rotation drive mechanisms 101 has a central axis C50, C52, C54, C50', C52' As the axis of rotation, C54' rotates (rotates) in the forward and reverse directions as indicated by the arrow c, and can be stopped at the appropriate rotation position (Fig. 5). The central axes C50, C52, C54, C50', C52', C54' of the respective supports are parallel with respect to the film formation surface, and the respective central axes are parallel to the other central axes. Further, as shown in FIG. 5, the rotation drive mechanism 101 for rotating the support body controls the rotation operation by the control unit 100.

The rotation axes of the respective supports 50 and 52 are C50 and C52, and the cathodes provided on the three side faces of the support are the cathodes 60a, 60b, 60c and 62a, 62b, 62c. The targets 70a, 70b, 70c, 72a, 72b, and 72c are mounted on the target mounting surfaces 50a, 50b, 50c, 52a, 52b, and 52c of the respective cathodes. Different types of targets can be mounted on each of the three target mounting surfaces of one support in accordance with the order of sputtering. At this time, in the support bodies, the same type of target is mounted on the target mounting surface corresponding to the same order. For example, "a", "b", and "c" attached to the back of the reference number indicating the target mounting surface indicate the target mounting surface 50a of the support 50 and the target of the support 52 when the order of sputtering is performed. The first target material is mounted on the material mounting surface 52a. In addition, the target mounting surfaces 50b and 52b are mounted with the same type of second target material, which is different from the first target material. Then, the target mounting surfaces 50c and 52c are mounted with the same type of third target material, which is different from the first and second targets. In the order in which the sputtering is performed, the target of the same type faces the substrate at the same time by rotating the support. Further, as shown in FIG. 5, each of the cathodes is provided with a power introduction mechanism 102 for introducing DC power, and which cathode is to be controlled by the control unit 100.

In the configuration example shown in Fig. 1, the support members 50, 52, 54, 50', 52', and 54' are rotated, and the substrates are aligned to the first target of the same type and positioned. membrane. In the second film formation, each of the supports is rotated and positioned differently from the first target, but the second target of the same type is opposed to the substrate and formed into a film. In the third film formation, each support is rotated and positioned differently from the first and second targets, but the third target of the same type is opposed to the substrate and formed. In this way, in the same sputtering chamber 14, three different compositions of film can be formed on one substrate 12.

In the configuration example shown in Fig. 1, at the time of film formation, the target material is subjected to sputtering to face the film formation surface 12a of the substrate 12. The target mounting surface of the support 52 (center side support) disposed on the center side of the substrate 12 is formed on the film formation surface 12a. In addition, the target mounting surface of the support 50 (peripheral side support) disposed on the peripheral side of the substrate is inclined at an angle α with respect to the film formation surface 12a. However, the gist of the present invention is not limited to this example, and it is also possible to arrange the support bodies so that the film formation faces 12a are arranged in parallel so that all the targets opposed to the substrate are sputtered at the time of film formation.

In the configuration example shown in Fig. 1, shields (also referred to as anti-adhesion jigs) 80, 82, 84, 80', 82', and 84' covering the support are provided in each of the support members. The shields are arranged to substantially cover the entire length of the cathode or the target in the vertical direction along the central axis direction of each support. Then, the shields 80, 82, 84, 80', 82', 84' are arranged to surround the periphery of the support without causing hindrance to the rotation of the support. Further, the shield is formed at the time of film formation from the shields 80, 82 which are formed toward the film-forming surface of the substrate 12, that is, the target is sputtered at the time of film formation. Become non-encircled.

In the configuration example shown in Fig. 1, the cross section of the shield has a substantially C-shaped shape. Therefore, the target required for film formation is positioned at the longitudinally cut openings 80a, 82a, 84a, 80'a of the C-shaped shields 80, 82, 84, 80', 82', 84', 82'a, 84'a.

In this way, by providing the shields 80, 82, 84, 80', 82', and 84', it is possible to prevent the sputtered atoms or undesired particles that are flying during film formation from being attached to the film. The surface of the target or cathode.

Fig. 2 is a schematic plan view of the three support bodies shown in Fig. 1 as seen from the side of the substrate 12. A plurality of supports 50 (cathode 60a, target 70a), 52 (cathode 62a, target 72a), 54 (cathode 64a, target 74a) are disposed in the sputtering chamber 14, and are parallel plate-shaped to the rectangular mold. The substrate 12 can be formed into a film. Further, as will be described later, in order to cool the targets of the respective supports, a pipe for introducing the cooling water through the rotary joint 200 is provided behind each of the targets.

Here, a method of manufacturing an electronic device using the sputtering apparatus of the present invention will be described with reference to FIG. Further, in the following, the support body 50 will be described by way of example, but the other support bodies are also the same.

The target 70a is rotated 180° from the substrate 12 side to face the C-shaped shield 80, and pre-sputtering is performed. The pre-sputtering means that the surface of the target to be oxidized is sputtered and removed (sputtered surface) by contacting the open sputtering chamber 14 with the atmosphere before the substrate is formed, in order to stabilize the discharge at the start of film formation. Since the target 70a located at a position rotated by 180° from the substrate 12 side is pre-sputtered, the contact of the DC power supply line is switched to the cathode 60a of the target 70a. That is, electric power is not supplied to the cathodes of the targets 70b and 70c, and sputtering is not performed. At the same time, the rotary adapter 200, which will be described later, is switched so that the temperature of the target 70a does not rise, and a relatively large amount of cooling water is supplied to the target 70a side, and a relatively small flow rate is supplied to the target 70b and the target 70c. The water is cooled and sputtered. Since the cathode that is not used is also heated by the heat from the heater in the sputtering apparatus or the heat from the plasma, the cathode must be cooled by the cooling water.

Next, the target 70a is rotated to face the substrate 12, and the substrate 12 is sputter-deposited. The contact of the DC power line is switched to the target 70a rotated to the substrate 12 side, and the rotary joint 200 is switched, and the relatively large flow rate of the cooling water is supplied to the target 70a rotated to the substrate 12 side. The cooling water of the flow rate flows to the target 70b and the target 70c, and is sprayed to form a film facing the substrate 12.

The configuration of the rotary joint 200 of the characteristic portion of the present invention will be described with reference to Figs. 3 and 4.

Fig. 3 is an exploded perspective view showing the configuration of the inside of the rotary joint 200 and the switching member for switching the amount of the cooling water in accordance with the present invention.

The rotary joint 200 is composed of a substantially cylindrical frame 204 formed with an insertion hole of the insertion shaft body 205, and a shaft unit 201 composed of a substantially cylindrical shaft body 205 or the like, and the shaft unit 201 The frame 204 and the frame 204 are configured to be rotatable relative to the circumference of the rotation axis 217 of the shaft unit 201. On the side wall of the frame 204, an introduction port 215 for introducing a fluid from the outside, and an outlet port 216 for guiding the fluid introduced from the introduction port 215 to the outside are formed.

As shown in FIG. 3, the frame 204 is formed in a cylindrical shape and is fixed to the sputtering chamber 14. Further, since the shaft unit 201 is coupled to the support body 50, the shaft unit 201 can also rotate simultaneously with the support body 50. The shaft unit 201 is configured such that the support body 50, the sealing plate 207a, the switching member 208, the sealing plate 207b, and the pipe body 230 are stacked. Inside the shaft body 205, three lead-in paths 213a, 214a, and 215a for communicating with the inlet 215 and three lead-out paths 213b, 214b, and 215b for communicating with the outlet 216 are formed along the direction of the rotating shaft 217. Specifically, one introduction path 213a combines a flow path formed in the shaft body 205, and a hole formed in the sealing plate 207a, and a hole formed in the switching member 208, and a hole formed in the sealing plate 207b. And the piping formed in the piping body 230 is comprised. Similarly, the introduction path and the lead-out paths 213b, 214a, 214b, 215a, and 215b are also formed in the respective holes of the sealing plate 207a by the respective introduction paths and the lead-out paths formed in the shaft body 205, and are formed in the switching. The respective holes of the member 208 are combined with the respective holes formed in the sealing plate 207b and the respective pipes formed by the pipe body 230. Further, in the present embodiment, the introduction path and the extraction paths 213a, 213b, 214a, 214b, 215a, and 215b are all set to have the same diameter, but are not limited thereto, and the sizes of the respective diameters may be different.

The sealing plate 207a and the sealing plate 207b are made of, for example, a fluororesin or an elastomer. Further, the switching member 208 is made of, for example, stainless steel. In the middle of the introduction path and the lead-out paths 213a, 213b, 214a, 214b, 215a, and 215b, a switching member 208 for switching the flow rate of the fluid in the direction of the rotation axis of the shaft body is provided. The switching member 208 is provided with a pair of first holes (large holes) 209a and 209b having a diameter substantially the same as that of the introduction path and the lead-out paths 213a, 213b, 214a, 214b, 215a, and 215b, and a diameter smaller than the first one. Holes (large holes) 209a, 209b, and a pair of second holes (small holes) 210a, 210b having a diameter smaller than the diameter of the introduction path and the lead-out paths 213a, 213b, 214a, 214b, 215a, 215b, and One of the two holes of the same size is the third hole (small hole) 211a, 211b. Further, the number of the holes is not limited to this, and it is not necessary to provide only the first hole and the pair of second holes in the third hole. Further, the diameters of the first holes (large holes) 209a and 209b may be larger than the diameters of the introduction path and the lead-out path, and may be smaller or smaller. In the following description, the first holes (large holes) 209a and 209b are also referred to as "first holes 209", and the second holes (small holes) 210a are also shown. The 210b is displayed as the "second hole 210", and the third holes (small holes) 211a and 211b are also displayed as the "third hole 211". Further, the third hole which does not distinguish the size of the hole from the second hole is collectively referred to as a "second hole" in the following description.

Further, the rotary joint according to the present embodiment is formed in the shaft unit 201 along the rotation axis direction, and has a first shaft unit introduction path and a second shaft unit introduction for communicating with the introduction port 215. path. Here, the first shaft unit introduction path and the second shaft unit introduction path are guided by any two of the paths 213a, 214a, and 215a. Further, the rotary joint according to the present embodiment is formed in the shaft unit 201 in the direction of the rotation axis, communicates with the first shaft unit introduction passage and the pipe, and communicates with the second annular flow path 219b. The third axis unit derives the path. Further, the rotary joint according to the present embodiment is formed in the shaft unit 201 in the direction of the rotation axis, communicates with the second shaft unit introduction path through the pipe, and has communication with the second annular flow path 219b. The fourth axis unit is derived from the path. Here, the third axis unit derivation path and the fourth axis unit derivation path refer to two derivation paths that are paired with the two introduction paths that are the first axis unit introduction path and the second axis unit introduction path. In other words, the switching member 208 has the first hole 209 and the second hole 210 which is smaller than the diameter of the first hole and smaller than the diameter of the first shaft unit introduction path and the second shaft unit introduction path, and is capable of switching the member. The first hole 209 is aligned with one of the first shaft unit introduction path or the second shaft unit single-input path, switched to the upstream side and the downstream side, and the second hole 210 of the switching member is aligned with the first axis The other of the body unit introduction path or the second axis unit introduction path is switched to communicate with the upstream side and the downstream side.

Fig. 4 is a schematic cross-sectional view showing a rotary joint 200 according to the present invention.

A sealing member 206 made of an oil seal or an O-ring or the like is disposed between the shaft body 205 and the frame body 204. On the outer side of the shaft body 205, a groove which is the first annular flow path 219a is formed. The introduction port 215 formed in the casing 204 is formed to have the same height as the first annular flow path 219a so as to communicate with the first annular flow path 219a. On the inner side surface of the first annular flow path 219a formed on the outer side of the shaft body 205, three holes are provided, and the holes are the first through holes which are the starting points of the introduction paths 213a, 214a, and 215a. In the fourth drawing, the first through hole 221a which is the starting point of the introduction path 213a is shown, but the first through hole which is the starting point of the introduction paths 214a and 215a is also formed in the same manner as the first through hole 221a. L-shaped introduction paths 213a, 214a, and 215a are formed from the first through holes 221a.

On the outer side of the shaft body 205, a groove serving as the second annular flow path 219b is formed above the first annular flow path 219a. The outlet 216 formed in the frame 204 is formed to have the same height as the second annular flow path 219b so as to communicate with the second annular flow path 219b. On the inner side surface of the second annular flow path 219b formed on the outer side of the shaft body 205, three holes are provided, each of which serves as a second through hole of the starting point of the above-described lead-out paths 213b, 214b, and 215b. In the fourth drawing, the second through hole 221b which is the starting point of the introduction path 213b is shown, but the second through hole which is the starting point of the introduction paths 214b and 215b is also formed in the same manner as the second through hole 221b. L-shaped lead-out paths 213b, 214b, and 215b are formed from the second through holes 221b.

Further, although not shown, the introduction path 213a and the lead-out path 213b are connected by a pipe provided in the cathode of the support body 50. Similarly, the introduction paths 214a and 215a and the lead-out paths 214b and 215b are connected by respective pipes.

As shown in Fig. 4, since the shaft body 205 and the seal plates 207a and 207b and the pipe body 230 are coupled, the seal plates 207a and 207b and the pipe body 230 are also the same, and rotate simultaneously with the support body 50. A switching member 208 made of stainless steel is provided between the sealing plates 207a and 207b. The switching member 208 for switching the flow rate and the sealing plates 207a and 207b are formed to have a surface roughness of 6.3a or less to prevent leakage of the fluid.

The switching member 208 is fixed to the rotary actuator (servo motor) 220 via the rotating shaft 217. Therefore, even if the support member 50 rotates and the switching member 208 does not rotate, it is engaged with the gear 218a, the gear 218b, and the gear 218c of the three communication members via the rotating shaft 217. Since the gear 218c is coupled to the rotation shaft of the rotary actuator (servo motor) 220, the switching member 208 can be rotated differently from the support body 50 by driving the rotary actuator 220. Furthermore, the rotation operation of the rotary actuator 220 is controlled by the control unit 100 (Fig. 5).

Next, the flow of the cooling water inside the rotary joint 200 will be described with reference to Fig. 4 . The introduction port 215 provided on the side surface of the frame 204 on which the rotary joint 200 is mounted is introduced into the cooling water, and is branched from the first annular flow path 219a in the shaft body 205 to the first shaft unit flow path 213a. 214a and 215a are then supplied to the pipes 600a, 600b, and 600c in the cathodes 60a, 60b, and 60c through the inside of the support 50 (Fig. 8 and Fig. 9). In the middle of the first shaft unit flow paths 213a, 214a, and 215a, a switching member 208 for switching the flow rate of the fluid is provided, and the switching member 208 can be changed to be supplied to the first shaft unit flow paths 213a, 214a. , the flow rate of cooling water of 215a. The cooling water in the return direction after the targets 70a, 70b, and 70c are cooled from the first shaft unit flow paths 213a, 214a, and 215a passes through the second shaft unit flow paths 213b, 214b, and 215b, and is in the shaft body 205. The second annular flow path 219b merges and is discharged through the outlet 216.

Fig. 5 is a view showing the main configuration of a control system in the sputtering apparatus according to the embodiment of the present invention. The control unit 100 includes one or a plurality of microcomputers, and various parts in the control unit, in particular, the rotary drive mechanism 101 of the support, the electric power introduction mechanism 102 introduced to each cathode, and the rotary drive 220 of the switching member 208, or the substrate holder 10 Each action of the moving means 103 and the like and the entire action (sequence). In particular, the control unit 100 has a program (software) for storing all the control relating to the sputtering process and the substrate transfer process, the rotation process of the rotary joint, the rotation control of the support body, or all the control of various additional functions. The program memory and the central computing control unit (CPU) of the microcomputer are executed by sequentially reading the necessary programs from the program memory. Furthermore, the program management can use various memory media such as a hard disk, a compact disk, and a flash memory.

Fig. 6 is a view for explaining a state in which the switching member 208 is rotated and switched from the first hole (large hole) 209 to the second hole (small hole) 210. When the rotary actuator 220 is driven to rotate the switching member 208, the flow rate of the fluid flowing to the introduction path 213a and the lead-out path 213b can be switched, and as a result, the flow rate of the cooling water supplied to each of the cathodes in the support body 50 can be adjusted.

Figure 7 is a top view of the switching member 208. Since the switching member 208 adjusts the diameter of the rectification path, the holes 210 and 211 which are the first holes (large holes) 209 and which are the second holes are formed. A rotating shaft 217 is provided at a central portion of the switching member 208. Further, in the present embodiment, the small hole 210 and the small hole 211 which are the second holes are the same size, but the size is not limited thereto, and even if the size of the hole 211 and the size of the hole 210 are different, All of the first hole 209, the second hole 210, and the third hole 211 may be different sizes.

The relationship between the rotation operation of the support body and the rotation operation of the switching member will be described with reference to Figs. 8 and 9.

Fig. 8 is a cross-sectional view showing the support body 50 in a state in which the cathode 60a is sputter-deposited. The three cathodes 60a, the cathodes 60b, and the cathodes 60c are disposed on the respective faces of the support 50. Pipes 600a, 600b, and 600c through which cooling water for cooling the target is flowed are provided inside each of the cathode 60a, the cathode 60b, and the cathode 60c. Further, as described above, the operation of the present invention, the operation of the sputtering apparatus, the rotation operation of the support body, and the rotation operation of the switching member 208 are all controlled by the control unit 100.

At the time of film formation, in order to cool the heat generated in the target, the cooling water exceeding 100 liters per minute is supplied to the pipe 600a through the first hole (large hole) 209a. At this time, since the target material for the film formation process is not cooled, the pipe 600b of the cathode 60b and the pipe 600c of the cathode 60c are supplied with 10 liters of cooling water per minute through the second holes (small holes) 210a and 211a. .

When the cathode 60c is sputter-deposited, the support 50 is rotated approximately 120° in the counterclockwise direction so that the cathode 60c faces the substrate 12. At this time, the rotary actuator 220 is not driven, and the switching member 208 is fixed via the rotating shaft 217. In this manner, even if the support body 50 rotates, the pipe 600c of the sputtered cathode 60c is introduced into the cooling water having a large flow rate exceeding 100 liters per minute through the first hole (large hole) 209a. In the cathode 60a and the cathode 60b, 10 liters of cooling water per minute is supplied through the small holes 210a and 211a.

When the cathode 60b is sputter-deposited, the support 50 is rotated approximately 120° in the counterclockwise direction so that the cathode 60b faces the substrate 12. At this time, the rotary actuator 220 is not driven, and the switching member 208 is fixed via the rotating shaft 217. In this manner, even if the support body 50 rotates, the piping 600b of the cathode 60b to be sputtered is introduced into the cooling water having a large flow rate exceeding 100 liters per minute through the first hole (large hole) 209a. In the cathode 60a and the cathode 60c, 10 liters of cooling water per minute is supplied through the small holes 210a and 211a.

Fig. 9 is a schematic cross-sectional view of the support 50 at the time of sputtering. At this time, since the cathode 60a side is sputtered, the support 50 is rotated, and the cathode 60a is positioned at a position rotated by 180° from the substrate side. At this time, the rotary driver 220 is simultaneously driven to rotate the switching member 208 via the rotary shaft 217. At this time, the first hole (large hole) 209 of the switching member 208 is also positioned to rotate 180 degrees from the substrate. As a result, when the cathode 60a is rotated by 180°, the switching member 208 is rotated, and the cooling water exceeding 100 liters per minute can be supplied to the pipe 600a via the first hole (large hole) 209a. In the piping 600b of the cathode 60b and the piping 600c of the cathode 60c, 10 liters of cooling water per minute is supplied through the second holes (small holes) 210a and 211a.

As described above, the cathode of the sputtering treatment can be aligned with the first hole, the cathode can be cooled with a large flow of cooling water, and the cathode tube that is not subjected to the sputtering treatment is aligned with the second hole. Less cooling water cools the cathode. That is, the plurality of cathodes can be efficiently cooled while minimizing the introduction port or the outlet port of the rotary joint, the first annular flow path, and the second annular flow path.

Further, the control unit 110 can control the rotary joint so that the first pipe of the first cathode subjected to the sputtering process is aligned with the first hole, and the second pipe of the second cathode not subjected to the sputtering process is controlled. , align the 2nd hole.

(Second embodiment)

Figure 10 is a cross-sectional view showing a rotary joint according to a second embodiment of the present invention. The rotary joint in the present embodiment is different from the rotary joint according to the first embodiment shown in Fig. 4, and the inlet 215 and the outlet 216 are provided at the bottom of the casing 204.

Further, a groove serving as the first annular flow path 219a is formed at the bottom of the shaft body 205 so that the introduction port 215 of the frame body 204 communicates. On the upper side surface of the first annular flow path 219a, three holes are provided, and the holes are first through holes which are the starting points of the introduction paths 213a, 214a, and 215a. In the tenth diagram, only the first through hole 221a which is the starting point of the introduction path 213a is shown, but the first through hole which is the starting point of the introduction paths 214a and 215a is also formed in the same manner as the first through hole 221a. The three lead-in paths 213a, 214a, and 215a become curved flow paths.

Similarly, in the manner of communicating with the outlet 216 of the frame 204, the second ring is formed at the bottom of the shaft body 205 and on the inner side of the radial direction of the first annular flow path 219a around the rotation axis 217. The groove of the flow path 219b. On the upper side surface of the second annular flow path 219b formed at the bottom of the shaft body 205, three holes are provided, each of which serves as a second through hole at the end of the above-described lead-out paths 213b, 214b, and 215b. In the tenth diagram, only the second through hole 221b which is the starting point of the introduction path 213b is shown, but the second through hole which is the starting point of the introduction paths 214b and 215b is also formed in the same manner as the second through hole 221b. The lead-out paths 213b, 214b, and 215b become curved flow paths.

Further, unlike the rotary joint according to the first embodiment shown in FIG. 4, the rotary shaft 217 coupled to the switching member 208 is directly connected to the rotary actuator 220 without the gears 218a, 218b, and 218c. In the rotary joint according to the first embodiment, the thickness of the frame in the height direction can be made thinner than the rotary joint according to the first embodiment.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments.

For example, when there are two targets, the size of the fluid amount switching member is four, and if the number of the targets is four, the size of the fluid switching member is set to eight, the present invention The number of arbitrary flow paths is applicable.

Further, examples of the fluid of the present invention include gas, air, water, oil, and the like. The invention is applicable to rotary adapters that must switch the flow of these fluids. For example, when the cylinder is driven by the air rotary adapter, the flow rate can be switched and the operating speed of the cylinder can be adjusted by using the rotary joint of the fluid amount switching member of the present invention.

Further, in the above embodiment, the introduction port and the outlet are provided in one rotary joint, but the invention is not limited thereto. For example, it may be a device that combines a rotary joint having an introduction port and a rotary joint having an outlet.

In the above-described embodiment, the frame body is fixed to the sputtering apparatus in the shaft unit and the casing. However, the present invention is not limited thereto, and the rotatable frame may be formed even if the shaft unit is fixed. For example, a substrate holder 10 movable by the moving means 103 is provided around the support of the present invention, and the substrate holder 10 can be disposed opposite to each cathode or opposite to the cathode of the support. It is effective when the respective substrate holders 10 are disposed. Further, the movement operation of the moving means 103 by the substrate holder 10 is controlled by the control unit 110.

The present invention can be applied not only to a sputtering apparatus but also to a plasma processing apparatus such as a dry etching apparatus, a plasma ashing apparatus, a CVD apparatus, and a vapor deposition apparatus. The electronic device according to the present invention may, for example, be a liquid crystal display, a solar cell, a semiconductor, a magnetic recording medium or the like.

The rotary joint of the present invention can also be constructed by combining the features described in the respective embodiments.

10. . . Substrate holder

12. . . Substrate

12a. . . Film formation surface

14. . . Sputtering room

16. . . gate

50, 50', 52, 52', 54, 54'. . . Support

50a, 50b, 50c, 52a, 52b, 52c. . . Target mounting surface

60a, 60b, 60c, 62a, 62b, 62c. . . cathode

C50, C52, C54, C50', C52, C54'. . . The central axis

70a, 70b, 70c, 72a, 72b, 72c. . . Target

80, 82, 84, 80', 82', 84'. . . shield

80a, 82a, 84a, 80'a, 82'a, 84'a. . . Opening

60a. . . cathode

62a. . . cathode

64a. . . cathode

70a. . . Target

72a. . . Target

74a. . . Target

200. . . Rotary adapter

201. . . Axle unit

204. . . framework

205. . . Axle body

207a. . . sealing plate

207b. . . sealing plate

208. . . Switching member

209a, 209b. . . First hole

210a, 210b. . . 2nd hole

211a, 211b. . . Third hole

213a, 214a, 215a. . . Import path

213b, 214b, 215b. . . Export path

215. . . Guide

216. . . Outlet

217. . . Rotary axis

218a, 218b, 218c. . . gear

219a. . . First annular flow path

219b. . . Second annular flow path

221a. . . First through hole

221b. . . Second through hole

220. . . Rotary drive

230. . . Piping body

600a, 600b, 600c. . . Piping

Fig. 1 is a schematic plan view for explaining the overall configuration of a sputtering apparatus according to the present invention.

Fig. 2 is a schematic plan view of the three support bodies shown in Fig. 1 as seen from the substrate side.

Fig. 3 is an exploded perspective view showing the configuration of the rotary joint and the fluid amount switching member according to the first embodiment of the present invention.

Fig. 4 is a schematic cross-sectional view showing the rotary joint of Fig. 3.

Fig. 5 is a view for explaining the configuration of a control system according to an embodiment of the present invention.

Fig. 6 is a schematic cross-sectional view showing the rotary joint when the fluid amount switching member is rotated in Fig. 4 and the flow rate can be changed.

Fig. 7 is a plan view showing the planar shape of the switching member of the fluid amount.

Fig. 8 is a cross-sectional view showing the positional relationship between the cathode and the fluid amount switching member when the target 70a of the sputtering chamber of the sputtering apparatus of Fig. 1 is formed.

Fig. 9 is a cross-sectional view showing the positional relationship between the cathode and the fluid amount switching member when the target 70a of the sputtering chamber of the sputtering apparatus of Fig. 1 is discharged in the direction rotated by 180° from the substrate side.

Figure 10 is a cross-sectional view showing a rotary joint according to a second embodiment of the present invention.

14. . . Sputtering room

200. . . Rotary adapter

201. . . Axle unit

204. . . framework

205. . . Axle body

207a. . . sealing plate

207b. . . sealing plate

208. . . Switching member

209a, 209b. . . First hole

210a, 210b. . . 2nd hole

211a, 211b. . . Third hole

213a, 214a, 215a. . . Import path

213b, 214b, 215b. . . Export path

215. . . Guide

216. . . Outlet

217. . . Rotary axis

220. . . Rotary drive

230. . . Piping body

Claims (5)

A rotary joint characterized by comprising: a frame body having an insertion hole and having an introduction port for introducing a fluid from the outside; and a shaft unit inserted into the insertion hole of the frame body; The frame can be relatively rotated with respect to the rotating shaft; the first shaft unit introduction path and the second shaft unit introduction path are formed in the shaft unit along the rotation axis direction for The introduction port is connected; and the switching member is disposed between the first shaft unit introduction path and the second shaft unit introduction path to switch the flow rate of the fluid; the switching member has a first hole, And the second hole having a smaller diameter than the first hole and smaller than the diameter of the first shaft unit introduction path and the second shaft unit introduction path, the first hole of the switching member may be aligned with the first hole One side of the shaft unit introduction path or the second shaft unit introduction path is switched to communicate with the upstream side and the downstream side, and the second hole of the switching member is aligned with the first shaft unit introduction path or the second Introducing path of the other unit, the communication is switched to the upstream side and the downstream side. The rotary joint according to claim 1, comprising a first annular flow path for forming an outer side of the shaft unit and communicating with the introduction port of the frame, the first shaft unit The introduction path and the second shaft unit introduction path are in communication with the first annular flow path. The rotary joint according to the second aspect of the invention, wherein the frame body has an outlet for guiding the fluid introduced from the introduction port to the outside, and the rotary adapter further includes a second annular flow path. The system is formed on the outer side of the shaft unit to communicate with the introduction port of the frame; and the third shaft unit is led out in the shaft unit in the direction of the rotation axis. a shaft unit introduction path communicating with the first pipe and communicating with the second annular flow path; and a fourth shaft unit deriving path formed in the shaft unit in the direction of the rotation axis The second shaft unit introduction path communicates with the second pipe and communicates with the second annular flow path, and the switching member is between the first shaft unit introduction path and the second shaft unit introduction path And being disposed between the third shaft unit lead-out path and the fourth shaft unit lead-out path, the switching member having: a pair of first holes, and The pair of second holes having a small diameter of the first hole and smaller than the diameter of the first shaft unit introduction path and the second shaft unit introduction path, the switching member can be switched to align the pair of first holes The first shaft unit introduction path and the third shaft unit lead-out path or one of the second shaft unit introduction path and the fourth shaft unit lead-out path, and the upstream side and the downstream side are connected to each other. And aligning one of the switching members with respect to the second hole with the first shaft unit introduction path and the third shaft unit lead-out path, or the second shaft unit introduction path and the fourth shaft unit lead-out path The other side is connected to the upstream side and the downstream side. A sputtering apparatus characterized by comprising: a frame body having an insertion hole and having an introduction port for introducing a fluid from the outside; and a shaft unit inserted into the insertion hole of the frame body; The frame can be relatively rotated with respect to the rotating shaft; the first shaft unit introduction path and the second shaft unit introduction path are formed in the shaft unit along the rotation axis direction for The introduction port is connected; and the switching member is disposed between the first shaft unit introduction path and the second shaft unit introduction path for switching the flow rate of the fluid; the switching member has a first hole, and a second hole that is smaller than a diameter of the first hole and smaller than a diameter of the first shaft unit introduction path and the second shaft unit introduction path, and includes a rotary joint that can be the first of the switching members 1 hole is aligned with one of the first shaft unit introduction path or the second shaft unit introduction path, and is switched to communicate with the upstream side and the downstream side, and the second hole of the switching member is aligned with the first shaft body The other side of the element introduction path or the second axis unit introduction path is switched to communicate with the upstream side and the downstream side; the rotatable support body is for supporting a plurality of targets; the first cathode is for the above The target is sputter-treated, and is provided on the support, and includes a first pipe through which a fluid from the first shaft unit introduction path is passed, and a second cathode for sputtering the target Further, the support body is provided with a second pipe through which a fluid flowing from the second shaft unit introduction path is provided. The sputtering apparatus according to claim 4, wherein the first pipe to which the first cathode having the sputtering treatment is applied is aligned with the first hole, and further includes a control portion, and the pair is not subjected to sputtering The second pipe of the second cathode is processed to control the rotary joint so as to be aligned with the second hole.