JP5570359B2 - Rotary joint and sputtering apparatus - Google Patents

Description

  The present invention relates to a rotary joint and a sputtering apparatus including the same.

Conventionally, in a plasma processing apparatus such as a sputtering apparatus, a rotary joint has been used to flow a fluid from a stationary part side to a rotating part side.
For example, Patent Document 1 discloses a sputtering apparatus including a support having a cathode surface on which a plurality of targets can be mounted. In order to simultaneously cool the cathode of this sputtering apparatus, for example, a rotary joint as in Patent Document 2 has been used. In Patent Document 2, a cylindrical shaft body that switches a plurality of flow paths and a cylindrical housing are configured, and the fluid supplied from the cylindrical housing flows when the cylindrical shaft body rotates. A rotary joint that changes the orientation of the is disclosed.

JP 2003-147519 A JP 2006-177453 A

  However, as the demand for downsizing of the sputtering apparatus has increased, conventional rotary joints cannot cope with it. Therefore, as a result of intensive studies, the inventor intensively cooled the target in use with a large flow of cooling water while efficiently reducing the target while reducing the size of the rotary joint. For, we found a method of cooling with a relatively small amount of cooling water.

  Accordingly, the present invention has been made to solve the above-described problems, and provides a rotary joint that can be efficiently cooled while reducing the size of the apparatus, and a sputtering apparatus including the rotary joint. With the goal.

In order to solve the above-described problems, the rotary joint of the present invention has a housing having an insertion hole and an introduction port for introducing fluid from the outside, and is rotatable relative to the housing with respect to the rotation axis. A shaft body unit inserted through the insertion hole of the housing, and a first shaft body unit introduction formed in the shaft body unit along the rotational axis direction to communicate with the introduction port A path and a second shaft body unit introduction path, and a switching member provided in the middle of the first shaft body unit introduction path and the second shaft body unit introduction path, for switching the flow rate of the fluid. Has a first hole and a second hole smaller than the diameter of the first hole and smaller than the diameter of the first shaft body unit introduction path and the second shaft body unit introduction path, The first hole is formed with the first shaft body unit. In accordance with one of the entrance path or the second shaft body unit introduction path, switching is performed so that the upstream side and the downstream side communicate with each other, and the second hole of the switching member is switched to the first shaft body unit introduction path or the second axis. In accordance with the other of the shaft body unit introduction paths, the upstream side and the downstream side can be switched to communicate with each other.
The sputtering apparatus of the present invention includes a housing having an insertion hole and an introduction port for introducing a fluid from the outside, and the housing to be rotatable relative to the housing with respect to a rotation axis. A shaft body unit inserted through the insertion hole, a first shaft body unit introduction path formed in the shaft body unit along the rotational axis direction and communicated with the introduction port, and a second shaft body unit introduction And a switching member for switching the flow rate of the fluid, provided in the middle of the first shaft body unit introduction path and the second shaft body unit introduction path, the switching member including the first hole, The second hole is smaller than the diameter of the first hole and smaller than the diameter of the first shaft body unit introduction path and the second shaft body unit introduction path, and the first hole of the switching member is the first hole. Shaft unit introduction path or second shaft unit guide In accordance with one of the paths, the upstream side and the downstream side are switched to communicate with each other, and the second hole of the switching member is aligned with the other of the first shaft body unit introduction path or the second shaft body unit introduction path. A rotary joint that can be switched so as to communicate between the upstream side and the downstream side, a rotatable support for supporting a plurality of targets, and a support for sputtering the targets. A first cathode provided with a first pipe for flowing a fluid from the uniaxial body unit introduction path, and provided on the support to sputter a target, and flow a fluid from the second shaft body unit introduction path And a second cathode provided with a second pipe for the purpose.

  According to the present invention, by providing a switching member for switching fluid in the rotary joint, a rotary joint that can be efficiently cooled while reducing the size of the apparatus, and a sputtering apparatus including the rotary joint are provided. Can be provided.

It is a schematic plan view for demonstrating the whole structure of the sputtering device which concerns on this invention. It is the schematic plan view which looked at the three support bodies shown in FIG. 1 from the board | substrate side. It is a disassembled perspective view of the rotary joint structure and fluid quantity switching member which concern on the 1st Embodiment of this invention. It is a schematic sectional drawing of the rotary joint of FIG. It is a figure explaining the structure of the control system which concerns on embodiment of this invention. FIG. 5 is a schematic cross-sectional view of the rotary joint when the fluid amount switching member is rotated and the flow rate is varied from FIG. 4. It is a figure explaining the fluid amount switching member. FIG. 3 is a cross-sectional view illustrating the positional relationship between a cathode and a fluid amount switching member when a target 70a in the sputtering chamber of the sputtering film forming apparatus of FIG. It is sectional drawing explaining the positional relationship of a cathode and the switching member of a fluid amount, when the target 70a in the sputtering chamber of the sputtering film-forming apparatus of FIG. 1 discharges in the direction rotated 180 degrees. It is sectional drawing of the rotary joint which concerns on the 2nd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to the embodiments.

(First embodiment)
FIG. 1 is a schematic plan view for explaining the overall configuration of a sputtering apparatus according to the present invention.
The sputtering chamber 14 includes a tray 10 on which a substrate (glass substrate) 12 is mounted, and three supports having the same configuration on both sides of the tray 10. The shape of the substrate 12 is a rectangular parallel flat plate. The tray 10 is loaded and positioned through the gate valve 16 into the sputtering chamber 14 with the substrate 12 mounted from the direction of the arrow a. Each of the supports 50, 52, 54, 50 ', 52' and 54 'has a substantially hexagonal column shape, but every other side has a large side and a cathode is provided on each side. Yes. Each support body has a rotation drive mechanism that rotates (rotates) in the forward and reverse directions and can stop at an appropriate rotation position as indicated by an arrow c with the central axes C50, C52,. 101. The center axis of each support is parallel to the film formation surface and parallel to each center axis. As shown in FIG. 5, the rotation operation of the rotation drive mechanism 101 for rotating the support is controlled by the control unit 100.

  The rotation axes of the supports 50 and 52 are C50 and C52, and the cathodes provided on the three side surfaces of the support are 60a, 60b, 60c and 62a, 62b, 62c. Targets 70a, 70b, 70c, 72a, 72b, and 72c are mounted on the target mounting surfaces 50a, 50b, 50c, 52a, 52b, and 52c of the respective cathodes. The three targets for one support are different types of targets. Among the supports, the same type of target is mounted at the same order position. Therefore, the same type of target faces the substrate simultaneously. Further, as shown in FIG. 5, each cathode is provided with a power introduction mechanism 102 for introducing DC power, and to which cathode the power is introduced is controlled by the control unit.

  In the configuration example shown in FIG. 1, each support is rotated, and first targets of the same type are positioned so as to face each other to form a film. In the second film formation, the respective supports are rotated so that the second target is of a different type from the first target, but is positioned so that the second target of the same type faces the substrate. Do. In the third film formation, each support is further rotated and positioned so that the third target of the same type is opposite to the substrate, although the type is different from the first and second targets. Then, film formation is performed. In this manner, three different component films can be formed on one substrate 12 in the same sputtering chamber.

  In the configuration example shown in FIG. 1, at the time of film formation, the sputtering surface of the target is opposed to the film formation surface of the substrate. That is, in the case of the center side support body 52 arranged on the center side of the substrate, the target mounting surface of the support body is parallel to the film formation surface 12a. In the case of the peripheral support 50 disposed on the peripheral side of the substrate, the target mounting surface of the support is inclined at an angle α with respect to the film formation surface 12a. However, the present invention is not limited to this, and the sputtering target surfaces of all targets facing the substrate during film formation may be parallel to the substrate surface.

  In the configuration example shown in FIG. 1, each support is further provided with a shield (also referred to as an anti-adhesion jig) 80, 82, 84, 80 ′, 82 ′, 84 ′ covering the support. These shields are provided so as to substantially cover the entire length of the cathode and the target in the vertical direction along the center axis direction of each support. The shields 80, 82, 84, 80 ′, 82 ′, 84 ′ are provided so as to surround the periphery of the support and not to hinder the rotation of the support. Further, the shield is not exposed to the targets 70a and 72a facing the film formation surface of the substrate during film formation, so that the targets 80a and 72a are exposed from the shields 80 and 82. It is formed to be a siege.

  In the configuration example shown in FIG. 1, the shield has a substantially C-shaped cross section. Accordingly, the C-shaped shields 80, 82, 84, 80 ', 82', and 84 'are required for film formation in the vertically divided openings 80a, 82a, 84a, 80'a, 82'a, and 84'a. Target is positioned.

  Thus, by providing a shield, it is possible to prevent sputter atoms and undesired particles flying at the time of film formation from adhering to the surface of the target or cathode that has been retracted without being used at the time of film formation. I can do it.

  FIG. 2 is a schematic plan view of the three supports shown in FIG. 1 as viewed from the substrate side. A plurality of supports are arranged in the sputtering chamber 14 so that film formation can be performed on a substrate on a rectangular parallel flat plate. In addition, although mentioned later for details, piping for introducing cooling water through the rotary joint 200 is provided behind each target in order to cool the target of each support body.

Here, with reference to FIG. 1, the manufacturing method of an electronic device using the sputtering apparatus of this invention is demonstrated. Hereinafter, the support 50 will be described as an example, but the same applies to other supports.
Pre-sputtering is performed by rotating the target 60 a 180 ° from the substrate 12 side so as to face the C-shaped shield 80. The pre-sputtering means that the target surface (surface to be sputtered) oxidized by opening the sputtering chamber to the atmosphere is sputtered and removed before film formation of the substrate in order to stabilize discharge at the start of film formation.
In order to pre-sputter the target 60a at a position rotated 180 ° from the substrate 12 side, the contact of the DC power line is switched to the cathode of the target 60a. That is, power is not supplied to the cathodes of the targets 60b and 60c, and sputtering is not performed. At the same time, by switching the rotary joint 200 described later so that the temperature of the target 60a does not increase, a relatively large flow rate of cooling water is supplied to the target 60a side, and a relatively small flow rate is supplied to the targets 60b and 60c. Pre-sputtering is performed by supplying cooling water. A cathode that is not in use is also heated by heat from a heater in the sputtering apparatus or heat from plasma, so the cathode must be cooled by cooling water.
Next, the target 60a is rotated so as to face the substrate 12, and sputtering film formation is performed on the substrate. The contact of the DC power line is switched to the target 60a rotated to the substrate side, and the rotary joint 200 is switched to supply a relatively large flow rate of cooling water to the target 60a rotated to the substrate side. Then, sputtering film formation is performed on the substrate while flowing a relatively small amount of cooling water through the target 60c.

With reference to FIG.3 and FIG.4, the structure of the rotary joint 200 which is the characterizing part of this invention is demonstrated.
FIG. 3 is an exploded perspective view illustrating the internal configuration of the rotary joint 200 and the fluid amount switching member according to the present invention.
The rotary joint 200 includes a substantially cylindrical casing 204 having an insertion hole through which the shaft body 205 is inserted, and a shaft body unit 201 including a substantially columnar shaft body 205 and the like. The unit 201 and the casing 204 are configured to be relatively rotatable around the rotation shaft 217 of the shaft body unit 201. An inlet 215 for introducing a fluid from the outside and a lead-out port 216 for leading the fluid to the outside are formed on the side wall of the housing 204.
As shown in FIG. 3, the housing 204 has a cylindrical shape and is fixed to the sputtering chamber 14. On the other hand, since the shaft body unit 201 is connected to the support body 50, the shaft body unit 201 can rotate together with the support body 50. The shaft body unit 201 is configured so that the shaft body 50, the seal plate 207 a, the switching member 208, the seal plate 207 b, and the piping body 230 can be assembled together. Inside the shaft body 205, there are three introduction paths 213 a, 214 a, 215 a for communicating with the introduction port 215, and three outlet paths 213 b, 214 b, 215 b for communicating with the outlet port 216. It is formed along the direction. Specifically, one introduction path 213a is formed in the flow path formed in the shaft body 205, the hole formed in the seal plate 207a, the hole formed in the switching member 208, and the seal plate 207b. And a combination of a pipe formed in the pipe body 230. Similarly, the introduction paths and lead-out paths 213b, 214a, 214b, 215a, and 215b are also connected to the introduction paths and lead-out paths formed in the shaft body 205, the holes formed in the seal plate 207a, and the switching member 208. Each hole formed, each hole formed in the seal plate 207b, and each pipe formed in the pipe body 230 are combined to be configured. In this example, the introduction path and the derivation paths 213a, 213b, 214a, 214b, 215a, and 215b are all the same diameter, but the present invention is not limited to this, and the diameters may be different. Good.

The seal plate 207a and the seal plate 207b are made of fluororesin or elastomer. On the other hand, the switching member 207 is made of stainless steel.
A switching member 208 for switching the flow rate of the fluid moving in the direction of the rotation axis of the shaft is provided in the middle of the introduction path and the derivation paths 213a, 213b, 214a, 214b, 215a, and 215b. The switching member 208 includes a pair of first holes (large holes) 209a and 209b having substantially the same diameter as the introduction paths and lead-out paths 213a, 213b, 214a, 214b, 215a, and 215b, and the first holes (Large holes) A pair of second holes (small holes) 210a, 210b having a diameter smaller than those of 209a, 209b and smaller than the diameters of the introduction and outlet paths 213a, 213b, 214a, 214b, 215a, 215b, and A pair of third holes 211a and 211b (small holes) having the same size as the second holes are provided. The number of holes is not limited to this, and may be only a pair of first holes and a pair of second holes. The diameters of the first holes (large holes) 209a and 209b may be larger or slightly smaller than the diameters of the introduction path and the lead-out path.
In addition, the 1st shaft body unit introduction path and the 2nd shaft body unit introduction path of a claim are any two of the introduction paths 213a, 214a, and 215a. In addition, the third shaft body unit lead-out path and the fourth shaft body unit lead-out path in the claims are paired with two introduction paths that are the first shaft body unit introduction path and the second shaft body unit introduction path. This is the derivation path. That is, the switching member 208 has a first hole 209 and a second hole 210 smaller than the diameter of the first hole and smaller than the diameter of the first shaft body unit introduction path and the second shaft body unit introduction path. The first hole 209 of the switching member is switched to communicate with the upstream side and the downstream side according to one of the first shaft body unit introduction path or the second shaft body unit introduction path,
The second hole 210 of the switching member can be switched so as to communicate the upstream side and the downstream side in accordance with the other of the first shaft body unit introduction path or the second shaft body unit introduction path.

FIG. 4 is a schematic cross-sectional view of the rotary joint 200 according to the present invention.
A seal member 206 such as an oil seal or an O-ring is provided between the shaft body 205 and the housing 204. On the outside of the shaft body 205, a groove is formed as the first annular flow path 219a. The introduction port 215 formed in the housing 204 is formed at the same height as the first annular flow path 219 a for communicating with the introduction port 215. Three holes are provided in the inner side surface of the first annular channel 219a formed on the outer side of the shaft body 205, and these holes are the first points of the introduction paths 213a, 214a, and 215a, respectively. One through hole 221a, 222a, 223a is formed. L-shaped introduction paths 213a, 214a, 215a are formed from these first through holes 221a, 222a, 223a.

  A groove serving as a second annular channel 219b is formed outside the shaft body 205 and above the first annular channel 219a. The outlet port 216 formed in the housing 204 is formed at the same height as the second annular channel 219b for communicating with the outlet port 216. Three holes are provided in the inner side surface of the second annular flow path 219b formed on the outer side of the shaft body 205, and these holes are the end points of the lead-out paths 213b, 214b, and 215b, respectively. The two through holes 221b, 222b, and 223b are formed. L-shaped lead-out paths 213b, 214b, and 215b are formed from these second through holes 221b, 222b, and 223b.

Although not shown, the introduction path 213a and the lead-out path 213b are connected through a pipe provided in the cathode of the support 50. Similarly, the introduction paths 214a and 215a and the outlet paths 214b and 215b are connected through respective pipes.
As shown in FIG. 4, since the shaft body 205 is connected to the seal plates 207 a and 207 b and the pipe 230, the seal plates 207 a and 207 b and the pipe 230 are also rotated together with the support body 50. A stainless switching member 208 is provided between the seal plates 207a and 207b. The switching member 208 and the seal plate 207 for switching the flow rate are processed to have a surface roughness of 6.3a or less to prevent fluid leakage.
The switching member 208 is fixed to a rotation driver (servo motor) 220 via a rotation shaft 217. Therefore, the switching member 208 does not rotate even when the support 50 rotates, but is engaged with the three transmission members (gears) 218a, transmission members (gears) 218b, and transmission members (gears) 218c via the rotation shaft 217. Further, since the transmission member (gear) 218c is connected to the rotation driver (servo motor) 220, the switching member 208 rotates separately from the support 50 by driving the rotation driver 220. Can be made. Further, the rotation operation of the rotation driver 220 is controlled by the control unit 100.

Next, the flow of cooling water inside the rotary joint 200 will be described with reference to FIG.
The cooling water introduced from the inlet 215 provided on the side surface of the casing 204 of the rotary joint 200 branches from the first annular flow path 219a in the shaft body 205 to the first shaft body unit flow paths 213a, 214a, and 214a. After that, it passes through the inside of the support 50 and is supplied to the pipes 600a, 600b, and 600c formed in the cathodes 60a, 60b, and 60c.
A switching member 208 for switching the flow rate of the fluid is provided in the middle of the first shaft body unit flow passages 213a, 214a, and 215a, and the switching member 208 allows the first shaft body unit flow passages 213a, 214a, and 215a to be respectively connected. The flow rate of the supplied cooling water can be changed. The cooling water in the return direction after cooling the targets 70a, 70b, 70c from the first shaft body unit flow passages 213a, 214a, 215a passes through the second shaft body unit flow passages 213b, 214b, 215b, and the shaft body In the second annular flow path 219b in 205, they merge and are discharged from the outlet port 216.

  FIG. 5 shows a main configuration of a control system in the sputtering apparatus according to the embodiment of the present invention. The control unit 100 includes one or a plurality of microcomputers. Each unit in the unit, in particular, the rotation drive mechanism 101 of the support 54, the power introduction mechanism 102 to each cathode, and the rotation driver 202 of the switching member 208, The individual operation of the moving means 103 and the like of the substrate holder 10 and the entire operation (sequence) are controlled. In particular, the control unit 100 stores a program (software) for executing any control related to sputtering processing and substrate transport processing, rotary joint rotation processing, support rotation processing, and various additional functions. A program memory is provided, and a central processing control unit (CPU) of the microcomputer reads and executes a required program sequentially from the program memory. Various storage media such as a hard disk, an optical disk, and a flash memory can be used for program storage management.

  FIG. 6 is a diagram illustrating a state when the fluid amount switching member 208 is rotated to switch from the first hole (large hole) 209 to the second hole (small hole) 210. When the rotation driver 220 is driven to rotate the switching member 208, the flow rate of the fluid flowing through the introduction path 213a and the outlet path 213b can be switched, and as a result, the cooling water supplied to each cathode in the support 50 The flow rate can be varied.

FIG. 7 is a top view of the switching member 208. The switching member 208 is formed with a first hole (large hole) 209, a second hole (small hole) 210, and a third hole (small hole) 211 in order to change the diameter of the flow path. A rotation shaft 217 is provided at the center of the switching member 208.
In this example, the small hole 210 and the small hole 211 have the same size as the second hole, but the present invention is not limited to this, and the first hole 209, the second hole 210, and the third hole 211 are all different. You may make it a size.

The relationship between the rotation operation of the support and the rotation operation of the switching member will be described with reference to FIGS.
FIG. 8 is a cross-sectional view of the support 50 in a state where the cathode 60a can be formed by sputtering. Three cathodes 60 a, a cathode 60 b, and a cathode 60 c are arranged on each surface of the support 50. Pipes 600a, 600b, and 600c for flowing cooling water for cooling the target are provided inside the cathode 60a, the cathode 60b, and the cathode 60c, respectively. Further, as described above, the operations of the present invention such as the operation of the sputtering apparatus, the rotation of the support, and the rotation of the switching member 208 are all controlled by the control unit 100.
In order to cool the heat generated in the target during film formation, cooling water exceeding 100 liters per minute is supplied to the pipe 600a through the first hole (large hole) 209a. At this time, in order to cool the target that has not been subjected to the film formation process, the piping 600b of the cathode 60b and the piping 600c of the cathode 60c are respectively 10 liters per minute through the second holes (small holes) 210a and 211a. Cooling water is supplied.

  When the cathode 60c is formed by sputtering, the support 50 is rotated about 120 ° counterclockwise so that the cathode 60c faces the substrate 12. At this time, the rotation drive 220 is not driven, and the switching member 208 is fixed via the rotation shaft 217. Thus, even if the support 50 rotates, a large flow rate of cooling water exceeding 100 liters per minute is introduced into the pipe 600c of the cathode 60c to be sputtered through the first hole (large hole) 209a. Cooling water of 10 liters per minute is supplied to the cathode 60a and the cathode 60b through small holes 210a and 211a, respectively.

  When the cathode 60b is formed by sputtering, the support 50 is further rotated about 120 ° counterclockwise so that the cathode 60b faces the substrate 12. At this time, the rotation drive 220 is not driven, and the switching member 208 is fixed via the rotation shaft 217. Thus, even when the support 50 rotates, a large flow rate of cooling water exceeding 100 liters per minute is introduced into the pipe 600b of the cathode 60b to be sputtered through the first hole (large hole) 209a. Cooling water of 10 liters per minute is supplied to the cathode 60a and the cathode 60c through small holes 210a and 211a, respectively.

FIG. 9 is a schematic cross-sectional view of the support 50 during pre-sputtering. At this time, in order to perform pre-sputtering on the cathode 60a side, the support 50 is rotated, and the cathode 60a is positioned at a position rotated 180 ° from the substrate side. At this time, the rotation driver 220 is driven at the same time to rotate the switching member 208 via the rotation shaft 217. At this time, the first hole (large hole) 209 of the switching member 208 is also positioned at a position rotated by 180 ° from the substrate side. Thus, even when the cathode 60a rotates 180 °, the switching member 208 is rotated in the pipe 600a, and cooling water exceeding 100 liters per minute can be supplied via the first hole (large hole) 209a. Cooling water of 10 liters per minute is supplied to the piping 600b of the cathode 60b and the piping 600c of the cathode 60c through the second holes (small holes) 210a and 211a, respectively.
As described above, the first hole is aligned with the cathode pipe that is performing the sputtering process, the cathode is cooled with a large flow of cooling water, and the cathode pipe that is not performing the sputtering process. The cathode can be cooled with a relatively small amount of cooling water by combining the second holes. That is, a plurality of cathodes can be efficiently cooled while downsizing the inlet and outlet of the rotary joint, the first annular channel, and the second annular channel.
In addition, the control unit described above aligns the first hole with the first pipe of the first cathode that is performing the sputtering process, and the second pipe of the second cathode that is not performing the sputtering process. The rotary joint can be controlled to match the second hole.

(Second Embodiment)
FIG. 10 is a sectional view of a rotary joint according to the second embodiment of the present invention. Unlike the rotary joint according to the first embodiment shown in FIG. 4, the rotary joint in the present embodiment is provided with an introduction port 215 and a lead-out port 216 at the bottom of the housing 204.
Further, a groove as the first annular flow path 219a is formed at the bottom of the shaft body so as to communicate with the introduction port 215 of the housing. Three holes are provided on the upper side surface of the first annular flow path 219a, and these holes serve as first through holes 221a, 222a, and 223a that are starting points of the introduction paths 213a, 214a, and 215a, respectively. The three introduction paths 213a, 214a, and 215a are bent flow paths.
Similarly, a groove as a second annular channel 219b is formed at the bottom of the shaft body and inside the first annular channel 219a in the radial direction so as to communicate with the outlet 216 of the housing. Three holes are provided in the upper side surface of the second annular flow path 219b formed at the bottom of the shaft body 205, and these holes are the second through holes that are the end points of the lead-out paths 213b, 214b, and 215b, respectively. The holes 221b, 222b, and 223b are formed. The lead-out paths 213b, 214b, and 215b are bent flow paths.
Also, unlike the rotary joint according to the first embodiment shown in FIG. 4, the rotary shaft 217 connected to the switching member 208 is directly connected to the rotary driver 220 without the gears 218a, 218b, 218c. Has been. Compared with the rotary joint according to the first embodiment, the rotary joint in the present embodiment can reduce the thickness of the casing in the height direction.

As mentioned above, although embodiment of this invention was described, this invention is not limited to embodiment mentioned above.
For example, if the number of targets is two, the number of large and small holes of the fluid amount switching member is four, and if the number of targets is four, the number of large and small holes of the fluid amount switching member is eight. It is possible to apply to the number of channels.
Examples of the fluid of the present invention include gas, air, water, and oil. The present invention is applicable to rotary joints that require switching the flow rates of these fluids. For example, when driving an air cylinder via an air rotary joint, it is possible to change the operating speed of the air cylinder by switching the flow rate by using the rotary joint with the fluid amount switching member according to the present invention. It becomes.

  Moreover, in the above-mentioned embodiment, although the inlet and the outlet were provided in one rotary joint, it is not limited to this. For example, it can also be set as the apparatus which combined the rotary joint which has an inlet, and the rotary joint which has an outlet.

  In the above-described embodiment, of the shaft body unit and the housing, the housing is fixed to the sputtering apparatus. However, the present invention is not limited to this, and the shaft body unit may be fixed and the housing may be configured to be rotatable. . For example, when the substrate holder 10 that can be moved by the moving means 103 is provided around the support of the present invention and the substrate holder 10 can be disposed to face each cathode, or on each target of the support This is effective when the respective substrate holders 10 are arranged facing each other. The movement operation by the substrate holder moving means 103 is controlled by the control unit.

  The present invention is applicable not only to the exemplified sputtering apparatus but also to a plasma processing apparatus such as a dry etching apparatus, a plasma ashing apparatus, a CVD apparatus, and a vapor deposition apparatus. Examples of the electronic device according to the present invention include a liquid crystal display, a solar cell, a semiconductor, and a magnetic recording medium.

  The rotary joint of the present invention can be configured by combining any feature described in each embodiment.

10 Tray (substrate holder)
12 Substrate 14 Sputtering chamber 16 Gate valve 50 Supports 60a, 60b, 60c, 62a, 62b, 62c Cathode 70a, 70b, 70c Target 72, 74 Target 80, 82, 84 Shield 100 Control unit 200 Rotary joint
201 Shaft body unit 204 Housing 205 Shaft body 206 Seal member 207 Seal plate 208 Switching member 209 First hole 210 Second hole 211 Third hole 212 Bearings 213a, 214a, 215a Inlet paths 213b, 214b, 215b Outlet paths 215 Inlet 216 Outlet 217 Rotating shaft 218 Transmission member 219a First annular flow path 219b Second annular flow path 220 Rotation drivers 221a, 222a, 223a First through holes 221b, 222b, 223b Second through holes 230 Piping bodies 600a, 600b, 600c piping

Claims (5)

A housing having an insertion hole and an introduction port for introducing fluid from the outside;
A shaft unit inserted into the insertion hole of the housing to be rotatable relative to the housing with respect to the rotation axis;
A first shaft body unit introduction path and a second shaft body unit introduction path which are formed in the shaft body unit along the rotation axis direction and communicate with the introduction port;
Provided in the middle of the first shaft body unit introduction path and the second shaft body unit introduction path, and a switching member for switching the flow rate of the fluid,
The switching member has a first hole and a second hole smaller than the diameter of the first hole and smaller than the diameter of the first shaft body unit introduction path and the second shaft body unit introduction path,
The first hole of the switching member is switched to communicate with the upstream side and the downstream side according to one of the first shaft body unit introduction path or the second shaft body unit introduction path,
The second hole of the switching member can be switched to communicate with the upstream side and the downstream side in accordance with the other of the first shaft body unit introduction path or the second shaft body unit introduction path. Rotary joint. A first annular channel formed on the outside of the shaft body unit for communicating with the inlet of the housing;
The rotary joint according to claim 1, wherein the first shaft body unit introduction path and the second shaft body unit introduction path communicate with the first annular flow path. The housing has a lead-out port for leading the fluid to the outside,
A second annular channel formed on the outside of the shaft unit for communicating with the outlet of the housing;
A third shaft body lead-out path formed in the direction of the rotation axis in the shaft body unit, communicated with the first shaft body unit introduction path and the first pipe, and communicated with the second annular flow path;
A fourth shaft unit lead-out path that is formed in the direction of the rotation axis in the shaft body unit, communicates with the second shaft body unit introduction path and the second pipe, and communicates with the second annular channel; The switching member is provided in the middle of the first shaft body unit introduction path, the second shaft body unit introduction path, the third shaft body unit lead-out path, and the fourth shaft body unit lead-out path,
The switching member includes a pair of first holes and a pair of second holes smaller than the diameter of the first hole and smaller than the diameters of the first shaft body unit introduction path and the second shaft body unit introduction path. Have
The pair of first holes of the switching member is either the first shaft body unit introduction path and the third shaft body unit lead-out path, or the second shaft body unit introduction path and the fourth shaft body unit lead-out path. According to one, switching to communicate between the upstream side and the downstream side,
The pair of second holes of the switching member are either the first shaft body unit introduction path and the third shaft body unit lead-out path, or the second shaft body unit introduction path and the fourth shaft body unit lead-out path. The rotary joint according to claim 2, wherein the rotary joint can be switched so as to communicate with the upstream side and the downstream side in accordance with the other side. A housing having an insertion hole and an introduction port for introducing fluid from the outside;
A shaft unit inserted into the insertion hole of the housing to be rotatable relative to the housing with respect to the rotation axis;
A first shaft body unit introduction path and a second shaft body unit introduction path which are formed in the shaft body unit along the rotation axis direction and communicate with the introduction port;
Provided in the middle of the first shaft body unit introduction path and the second shaft body unit introduction path, and a switching member for switching the flow rate of the fluid,
The switching member has a first hole and a second hole smaller than the diameter of the first hole and smaller than the diameter of the first shaft body unit introduction path and the second shaft body unit introduction path,
The first hole of the switching member is switched to communicate with the upstream side and the downstream side according to one of the first shaft body unit introduction path or the second shaft body unit introduction path,
A rotary joint that can be switched so that the upstream side and the downstream side communicate with each other in accordance with the second hole of the switching member and the other of the first shaft body unit introduction path or the second shaft body unit introduction path,
A rotatable support for supporting a plurality of targets;
A first cathode provided on the support for sputtering a target, and having a first pipe for flowing a fluid from the first shaft unit introduction path;
A second cathode provided on the support for sputtering the target, and comprising a second pipe for flowing a fluid from the second shaft unit introduction path;
A sputtering apparatus comprising: The first hole is aligned with the first pipe of the first cathode that is performing the sputtering process, and the second hole is aligned with the second pipe of the second cathode that is not performing the sputtering process. The sputtering apparatus according to claim 4, further comprising: a control unit that controls the rotary joint so as to match.