TWM514103U - Processing solution supply piping loop - Google Patents

Description

Treatment liquid supply piping circuit

The present invention relates to a processing liquid supply piping circuit that supplies a processing liquid such as a developing liquid to a manufacturing process such as a semiconductor wafer or an FPD (planar display) substrate.

Generally, in the manufacture of a semiconductor element, for example, a photoresist liquid is applied onto a semiconductor wafer, an FPD substrate or the like (hereinafter referred to as a wafer or the like), and the mask pattern is subjected to exposure processing to form a circuit. Patterns to use light lithography. In the photolithography method, a photoresist is applied to a wafer or the like by a spin coating method, and a photoresist film formed by the film is exposed in accordance with a predetermined circuit pattern, and the exposure is performed. The pattern is subjected to development processing, whereby a circuit pattern is formed on the photoresist film.

In a photolithography project like this, a coating/development processing system is generally used, which is to connect an exposure device to a coating/display for coating/developing a photoresist. Like a device. In the coating/development processing system, a processing liquid such as a developing solution or a diluent is supplied to each processing unit disposed in the system, for example, a photoresist coating processing unit, a development processing unit, or the like. Necessary.

In the processing liquid supply piping circuit of the above-described type, in order to supply the processing liquid for performing the processing to the processing unit, the processing liquid supplied from the processing liquid supply source is temporarily stored, and at the same time, dissolved in the processing liquid. The gas is foamed and discharged, whereby degassing is performed (for example, refer to Patent Document 1). Further, in the treatment liquid supply piping circuit of this type, in order to obtain the supply pressure, the pump is pressurized by a bellows pump or a diaphragm pump, and is pressure-fed to the supply nozzle.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Laid-Open Patent Publication No. 2000-114154 (Patent Patent Application, FIG. 6)

[New summary]

In the conventional treatment liquid supply piping circuit, the treatment liquid in the storage container of the storage mechanism or the treatment liquid in the piping is insufficiently deaerated, so that it is foamed in the filter or when the treatment liquid is discharged onto the substrate. Foaming is a concern that the accuracy of the discharge amount is poor or the function of the filter is lowered. For example, if the foaming of the treatment liquid is carried out before the filtration of the filter, the filter medium may be caught by the filter and cause clogging. If the filter medium is passed through, the flow may be caused to flow to the supply nozzle, and the coating may be poor. because.

Further, in the conventional processing liquid supply piping circuit, the processing liquid temporarily stored in the storage means and discharged from the storage means is removed from the processing liquid by the filter while being supplied to the processing unit. However, since the filter passes once, there is also a possibility that the foreign matter modified in the treatment liquid after the time change is passed. When a foreign matter such as this is discharged, there is a concern that the processing of the pattern is adversely affected.

In view of the above, the present invention has been made in an effort to provide a processing liquid supply piping circuit in which a storage mechanism is used to increase the retention in the processing liquid supply piping circuit. The opportunity of the degassing treatment of the dissolved gas in the liquid increases the number of times of filtration of the filter, whereby the foreign matter in the trapping liquid is captured by the filter medium, and the cleanliness is improved.

In order to solve the above-described problems, the liquid processing supply circuit of the present invention is provided in a liquid processing apparatus which is provided in a surface for supplying a processing liquid from a liquid supply nozzle to a surface of a substrate, and is configured in the liquid supply nozzle and the aforementioned The treatment liquid supply piping circuit between the liquid supply units of the treatment liquid is characterized in that: an intermediate storage tank is provided, and the treatment liquid supplied from the liquid supply unit through the supply pipe is temporarily stored; and the exhaust pipe is connected to the middle Above the storage tank, the internal treatment liquid is decompressed to degas; the liquid supply pump draws the treatment liquid from the outlet side of the intermediate storage tank to make the discharge operation continuous; the on-off valve is disposed at Formed as the aforementioned liquid feeding a pipe between the secondary pipe of the liquid supply pump and the liquid supply nozzle on the discharge side of the pump, a switch that flows the processing liquid toward the liquid supply nozzle side, and a circulation pipe that branches from the primary side of the switching valve to communicate The processing liquid is circulated in the intermediate storage tank; and a circulation valve is used to switch the flow of the treatment liquid in the circulation piping (No. 1 of the patent application). In this case, the liquid feeding pump is preferably a magnet pump (the second item of the patent application).

With such a configuration, the treatment liquid supplied from the liquid supply unit is stored in the intermediate storage tank and degassed by a predetermined amount, but the treatment liquid can be returned from the liquid supply pump to the intermediate storage by using the circulation piping. The way of the tank increases the chance of degassing in the intermediate tank. Further, the liquid supply pump can be continuously used without being dusty by providing a magnet pump.

Further, in the novelty of the first application of the patent application or the second aspect of the patent application, the filter is provided in the arrangement between the intermediate storage tank and the liquid supply pump (Patent No. 3 of the patent application) . Alternatively, a filter may be provided in the piping on the secondary side of the liquid supply pump (the fourth item of the patent application).

According to this configuration, even if the liquid feeding pump is constantly driven, the processing liquid is circulated through the filter, so that the number of passages of the filter medium can be increased.

Further, in the novelty of the first to the fourth aspect of the patent application, the fourth aspect of the invention is characterized in that the control unit includes a flow meter for detecting a flow rate of the treatment liquid in front of the circulation pipe. A pressure gauge that detects pressure to maintain the measured value at a predetermined setting The control unit of the liquid feeding pump is controlled (the fifth item of the patent application).

With such a configuration, the liquid amount or the liquid supply pressure of the circulating treatment liquid can be freely adjusted so as to control the number of rotations of the liquid supply pump.

Further, a bypass valve is provided between the circulation valve and the intermediate storage tank, and the bypass valve is configured to switch a flow path of the treatment liquid to the intermediate storage tank without being connected via the intermediate storage tank. A bypass flow path of the piping on the outlet side of the intermediate storage tank (No. 6 of the patent application).

With such a configuration, since the circulating photoresist liquid does not enter the intermediate storage tank, erroneous detection of the upper limit liquid level sensor can be prevented when a new photoresist liquid is supplied to the intermediate storage tank, the upper limit liquid The surface sensor determines the timing of the supply stop.

According to the present invention, the dissolved gas having the possibility of being contained in the treatment liquid can be efficiently removed, and the discharge amount can be freely controlled. Further, a supply source of the same processing liquid of different processing units can be shared.

A, B‧‧‧ coating unit

71‧‧‧Liquid supply bottle

74‧‧‧Intermediate storage tank

76‧‧‧Intermediate tank exhaust valve

98‧‧‧Filter

111‧‧‧Upper level liquid level sensor

112‧‧‧Limited liquid level sensor

114‧‧‧ Magnet pump

116‧‧‧Recycling piping

117‧‧‧Circulation valve

118‧‧‧Distribution of the original valve

119‧‧‧ flowmeter

125‧‧‧ Bypass valve

126‧‧‧Bypass piping

130a, b‧‧‧Distribution valve

132a, b‧‧‧ liquid supply nozzle

Fig. 1 is a circuit diagram showing a treatment liquid supply pipe diagram of a coating unit according to an embodiment of the present invention.

Fig. 2 is a circuit diagram showing an embodiment of a circulation piping of the embodiment of the present invention.

[Fig. 3] shows an embodiment of a loop circuit of a part of the present invention Road map.

Fig. 4 is a configuration diagram for explaining a structure of a magnet pump used in the practice of the present invention.

Fig. 5 is a plan view of a liquid processing apparatus embodying the present invention.

Fig. 6 is a front elevational view of the liquid processing apparatus of the present invention.

Fig. 7 is a rear elevational view of the liquid processing apparatus of the present invention.

[To implement the form of the present invention]

Hereinafter, the novel embodiment will be described in detail based on the additional drawings. Fig. 1 is a schematic view showing an example of the new processing liquid supply piping circuit; Fig. 2 and Fig. 3 are schematic views showing another example of the novel processing liquid supply piping circuit; and Fig. 4 is for use. The configuration of the structure of the magnet pump for circulating the processing liquid of the present invention will be described.

As shown in FIG. 1, the processing liquid supply piping circuit supplies a processing liquid from a processing liquid supply source (liquid supply unit), for example, a liquid supply bottle 71 containing a photoresist. In the middle of the path, an intermediate storage tank 74 for temporarily storing the photoresist liquid from the liquid supply bottle 71 is disposed. In the middle of the pipe 72 connecting the liquid supply bottle 71 and the intermediate storage tank 74, an intermediate storage tank supply valve 73 is provided, and the intermediate storage tank supply valve 73 is a switch for allowing the flow of the photoresist liquid. In addition, the details and functions of the intermediate storage tank 74 will be described later.

The bottom side of the intermediate storage tank 74 is connected to the primary side (upstream side) of the filter 98 by a filter primary pipe 77, and the filter 98 The secondary side (downstream side) is connected to the primary side suction port 204 formed as the liquid suction side of the magnet pump 114 via the filter secondary pipe 113. The foreign matter in the photoresist is filtered by the filter 98, and a filter exhaust pipe 78 is provided to remove the gas accumulated in the filter 98, and the filter exhaust valve 79 is periodically opened to perform the discharge. gas.

As a path previously connected to the discharge port 205 (the discharge port 205 is formed on the discharge side of the magnet pump 114), the pump secondary side pipe 99 is connected to the flow meter 119 for measuring the flow rate, and the flow meter 119 is arranged in front of the flow meter 119. A distribution original valve 118 is provided to switch the flow of the earlier photoresist solution.

Between the pump secondary side pipe 99 and the distribution original valve 118, there is a branch pipe portion 115 for branching into the other, and the other is provided with a circulation pipe 116 for use as a The photoresist is returned to the flow path of the intermediate storage tank 74 to be circulated. A circulation valve 117 that switches the flow of the circulation is provided in the middle path of the circulation pipe 116.

Next, the path before the flow meter 119 will be described. First, although the dot chain shown by XY in FIG. 1 is described later with reference to FIG. 7, for example, the photoresist coating units 10 and 11 are used as an example, and the photoresist coating unit is different. Happening. The different photoresist coating units 10 and 111 are described as coating units A and B. The respective liquid supply nozzles 132a and 132b of the coating units A and B are shared by the supply source side to which the photoresist liquid is supplied, and are connected to each other on the secondary side of the flow meter 119.

Further, distribution paths 130a and 130b are provided in the intermediate paths of the nozzle supply tubes 131a and 131b between the liquid supply nozzles 132a and 132b and the flow meter 119, and the timing of the switches is controlled by the control unit 300.

The intermediate storage tank 74 shown in Fig. 1 is provided with, for example, a capacitance type liquid level sensor for discriminating the storage level of the photoresist liquid at the upper limit amount position and the lower limit amount position. The upper limit position is a position at which the intermediate storage tank supply valve 73 is closed and the supply is stopped when the upper limit liquid level sensor 111 detects the photoresist liquid supplied from the liquid supply bottle 71. The lower limit position refers to a position at which the intermediate reservoir supply valve 73 is opened and the photoresist liquid is supplied when the liquid level in the intermediate storage tank 74 is lowered to cause the lower limit liquid level sensor 112 to be closed.

A space is formed above the photoresist liquid level in the intermediate storage tank 74, and an intermediate storage tank exhaust pipe 75 and an intermediate storage tank exhaust valve 76 are provided in such a manner as to exhaust the gas in the space, so as to serve as The gas contained in the photoresist liquid, such as nitrogen, oxygen, or the like, is degassed by a negative pressure. The intermediate storage tank exhaust pipe 75 is connected to a suction exhaust source (not shown).

The above-mentioned circulation pipe 116 is at a position that does not affect the detection position of the upper limit liquid level sensor 111 and the lower limit liquid level sensor 112 of the intermediate storage tank 74, and the photoresist liquid is along the intermediate storage tank. The inner wall of the 74 is configured to flow down. Thereby, since the circulating photoresist liquid is repeatedly degassed in the intermediate storage tank 74, the dissolved gas in the photoresist liquid is not foamed in the piping or the discharged substrate. Further, in the middle of the circulation pipe 116, a circulation valve for performing a switch of the circulation pipe 116 is provided. 117.

Next, a configuration example of the magnet pump 114 will be described. Fig. 4 is a cross-sectional view showing the main part of a magnet pump 114 of an embodiment of the present invention. In the pump chamber 203 formed by the front case 201 and the rear case 202, a suction port 204 of a photoresist liquid is formed on the front surface thereof, and a discharge port 205 of a photoresist liquid is formed thereon. Inside the pump chamber 203, a rotating body 206 is housed. The rotating body 206 is rotatably supported by a support shaft 207 that protrudes from the center of the rear housing 202 toward the pump chamber 203. The rotating body 206 is composed of a cylindrical bearing 211 that is slidably contacted with the outer circumference of the support shaft 207, and a magnet ring 213 formed on the outer circumference of the bearing 211 at the outer peripheral portion. An annular driven magnet 212 is disposed; the impeller 214 is attached to the front surface of the magnet ring 213, and the photoresist is introduced into the pump chamber 203 from the suction port 204 by rotation to be discharged from the discharge port 205. The thrust bearing 215 is attached to the back surface of the impeller 214, and is in contact with the tip end of the support shaft 207 during idling, and a mouse ring 216 is attached to the front surface of the impeller 214. Further, a portion of the front surface of the impeller 214 opposite to the sealing ring 216 facing the front casing 201 is provided with a lining ring 217 which is slidably engaged when the impeller 214 moves forward.

On the other hand, at a position facing the driven magnet 212 of the magnet ring 213 via the rear casing 202, an annular drive that drives the rotating body 221 constituting the rotational driving means is magnetically coupled to the driven magnet 212. Magnet 222. The driving rotary body 221 is driven by the servo motor M via the drive shaft 223. In addition, the driving rotating body 221, the system and the pump The chamber 203 is isolated and housed in a space between the rear housing 202 and the driver housing portion 224. The bearing 211 is formed of a non-adhesive material such as PTFE.

According to the magnet pump 114, when the servo motor M rotationally drives the drive rotor 221 by the rotary shaft 223 to rotate the drive magnet 222, the driven magnet 212 magnetically coupled thereto also rotates. Thereby, the bearing 211 slides around the support shaft 207, the impeller 214 rotates, and the photoresist liquid is introduced into the pump chamber 203 from the suction port 204. Most of the introduced photoresist is transported to the pump secondary pipe 99 side via the discharge port 205.

With such a configuration, the photoresist liquid in the intermediate storage tank 74 passes through the filter 98, and the supply pressure is applied to the magnet pump 114, and flows to the circulation pipe 116 side in the branch pipe portion 115 of the pipe, and is again directed toward the intermediate storage. The photoresist of the tank 74 circulates.

Next, with regard to the distribution of the photoresist liquid, when the photoresist liquid is supplied toward the liquid supply nozzles 132a, 132b and the photoresist liquid is supplied onto the substrate, the dispensing original valve 118 is opened (the original valve 118 is disposed, Between the primary side of the flow meter 119 and the branch pipe portion 115 of the circulation pipe 116, after the photoresist liquid is sent to the flow meter 119, any of the distribution valves 130a, 130b corresponding to the coating units A and B that are dripped are processed. It will be turned on for liquid processing. Further, at this time, the circulation valve 117 is closed, and the photoresist liquid is not controlled to flow to the side of the circulation pipe 116.

The flow meter 119 monitors the flow to the nozzle supply pipes 131a, 131b side by the switch distribution valve 130a or (and) the distribution valve. The amount of liquid that fluctuates at the timing of 130b controls the number of rotations of the servo motor M of the magnet pump 114 so as to match the discharge flow rate at each time as the distribution rate of the photoresist film. Thereby, it is possible to suppress fluctuations in the amount of liquid caused by the discharge timing of the photoresist as in the case where the discharge operation is repeated or separately. Instead of liquid flow, a pressure sensor can be provided to monitor the hydraulic pressure, or both the liquid flow and the hydraulic pressure can be monitored for control.

Further, as shown in FIG. 2, the flow meter 119 is disposed further forward than the branch pipe portion 115, and the magnet pump 114 can be controlled in the same manner as described above even if it is provided at a position where the liquid flow rate during the cycle operation can be constantly monitored. . Further, the arrangement of the magnet pump 114 may be provided on the primary side of the filter 98.

Even in the circulation pipe 116, as shown in FIG. 3, a bypass valve 125 formed as a three-way valve is provided on the secondary side of the circulation valve 117, and the circulation valve 117 is provided in the intermediate storage tank 74 and the circulation piping 116. between. The bypass valve 125 is provided with a bypass branching portion 127 between the filter primary side pipe 77 (FIG. 1), and is connected by a bypass pipe 126. The filter primary side pipe 77 is different from the connection. The piping to the intermediate storage tank 74 is formed as a piping on the outer side of the intermediate storage tank 74. The bypass valve 125 can be switched so as not to circulate through the intermediate storage tank 74. The switching signal, for example, the lower limit liquid level sensor 112 of the intermediate storage tank 74 is detected, and is synchronized with the signal that the photoresist liquid is supplied from the liquid supply bottle 71 to the intermediate storage tank 74, and the bypass valve 125 is switched to be connected to the side. The side of the distribution pipe 126. Next, after the upper limit liquid level sensor 111 detects, the supply of the photoresist liquid is stopped, and at the same time, the bypass valve 125 is returned to the original cut. Change and connect to the side of the intermediate storage tank 74. Further, as another example, when the coating units A and B have not been subjected to the liquid processing in the standby state for a predetermined period of time, or the liquid supply nozzles 132a and 132b that are not used in the plurality of liquid supply nozzles 132a and 132b are in standby time When the predetermined time has elapsed, the control unit outputs a signal that is switched to the side of the bypass pipe 126. Further, synchronization is performed to reduce the number of rotations of the servo motor M of the magnet pump 114, thereby reducing the total amount of circulation of the photoresist. Thereby, the amount of filtration of the filter 98 is not largely wasted, and deterioration of the photoresist component can be suppressed.

Next, an example of applying the novel processing liquid supply system to a photoresist coating/development processing system will be briefly described. Figure 5 is a schematic plan view showing a photoresist coating/development processing system; Figure 6 is a schematic front view of a photoresist coating/development processing system; and Figure 7 is a photoresist coating/development A schematic rear view of the processing system.

The photoresist coating/development processing system 1 has a configuration in which the following is integrally connected as shown in FIG. 5: the cassette station 2 carries and transports the wafer to the cassette C for accommodating, for example, 25 wafers W. W; processing station 3, disposed adjacent to the cassette station 2, and configured in a plurality of stages to apply various processing units that are subjected to predetermined processing in a single-piece coating process; and the interface portion 4 is adjacent to The wafer W is received between the exposure devices (not shown) provided in the processing station 3.

The cassette station 2 is capable of placing a plurality of cassettes C in a row at a predetermined position on the cassette mounting table 5 in the horizontal X direction. Further, the cassette transporting station 2 is provided with a wafer transfer arm 7 that is movable in the X direction on the transport path 6. The wafer transfer arm 7 is configured to be housed in the cassette C The wafer W is freely movable in the wafer array direction (Z direction; vertical direction), and can selectively access the wafer W arranged in each of the cassettes C in the X direction.

Further, the wafer transfer arm 7 is configured to be rotatable in the θ direction around the Z axis, and is configured as a transfer device (TRS) that can belong to the third processing unit group G3 on the processing station 3 side as will be described later. 31 access.

The processing station 3 is provided with, for example, five processing unit groups G1 to G5 in which a plurality of processing units are arranged in multiple stages. On the front side of the processing station 3, the first processing unit group G1 and the second processing unit group G2 are sequentially arranged from the card station 2 side. Further, on the back side of the processing station 3, the third processing unit group G3, the fourth processing unit group G4, and the fifth processing unit group G5 are sequentially arranged from the card station 2 side. The first transport mechanism 110 is provided between the third processing unit group G3 and the fourth processing unit group G4. The first transport mechanism 110 is configured to selectively access the first processing unit group G1, the third processing unit group G3, and the fourth processing unit group G4 to transport the wafer W. The second transport mechanism 120 is provided between the fourth processing unit group G4 and the fifth processing unit group G5. The second transport mechanism 120 is configured to selectively access the second processing unit group G2, the fourth processing unit group G4, and the fifth processing unit group G5 to transport the wafer W.

As shown in FIG. 6, the first processing unit group G1 is sequentially stacked in five layers from the bottom: photoresist coating units (COT) 10, 11, and 12, and has a predetermined processing liquid supplied to the wafer W. a liquid processing unit for processing, for example, applying a photoresist solution to the wafer W The photoresist coating treatment; and the bottom coating unit (BARC) 13, 14 are coated with an ultraviolet curable resin liquid for preventing reflection of light during exposure to form an antireflection film. The second processing unit group G2 is sequentially superimposed into four layers from the lower side: development processing units (DEV) 21 to 24, and the developing process is applied to the wafer W.

Further, in the lowermost layers of the first processing unit group G1 and the second processing unit group G2, chemical chemical chambers (CHM) for supplying various developing liquids to the liquid processing units in the respective processing unit groups G1 and G2 are provided. ) 25, 26. The new chemical liquid supply system is included in the chemical chambers (CHM) 25 and 26. Further, in the third processing unit group G3, as shown in FIG. 7, the first processing unit group G3 is sequentially superimposed into nine layers from the bottom: a temperature adjustment unit (TCP) 30, and a transfer device (TRS) 31 for performing wafer W reception. And heat treatment unit (ULHP) 32~38, heat treatment of wafer W under high temperature management. In the fourth processing unit group G4, for example, 10 layers are sequentially superposed from below: a high-precision temperature adjustment unit (CPL) 40; a pre-baking unit (PAB) 41 to 44, and a wafer after the photoresist coating process is applied. W performs heat treatment; and post-baking units (POST) 45 to 49 heat-process the wafer W after the development process.

The fifth processing unit group G5 is sequentially superposed into 10 layers from the bottom: a plurality of heat treatment units such as high-precision temperature adjustment units (CPL) 50 to 53 for heat treatment of the wafer W; and a post-exposure baking unit (PEB) 54~59, heat-treating the exposed wafer W.

Further, in the positive direction side of the X direction of the first transport mechanism 110, as shown in FIG. 5, a plurality of processing units are arranged, for example, as shown in FIG. As shown, four layers are sequentially stacked from the bottom: adhesive units (AD) 80, 81 for hydrophobizing the wafer W, and heating units (HP) 82, 83 for heating the wafer W. Further, on the back side of the second transport mechanism 120, for example, a peripheral exposure unit (WEE) 84 is disposed, and the peripheral exposure unit (WEE) 84 selectively exposes only the edge portion of the wafer W.

Moreover, as shown in FIG. 6, the upper part of each block of the cassette station 2, the processing station 3, and the interface part 4 is equipped with the air conditioning unit 90 in the inside of each block. The air conditioning unit 90, the cassette station 2, the processing station 3, and the dielectric surface 4 can be adjusted to a predetermined temperature and humidity. Further, as shown in FIG. 7, for example, a gas supply unit 91 for supplying a predetermined gas to the third processing unit group G3 and the fourth processing unit group is provided in the upper portion of the processing station 3, respectively. A gas supply means such as an FFU (Fan Filter Unit) of each of the devices in the G4 and the fifth processing unit group G5. The gas supply unit 91 can blow the gas at a predetermined flow rate after removing impurities from the gas adjusted to a predetermined temperature and humidity.

As shown in FIG. 5, the interface 4 includes the first dielectric surface 100 and the second dielectric surface 101 in this order from the processing station 3 side. In the first dielectric surface portion 100, the wafer transfer arm 102 is disposed at a position corresponding to the fifth processing unit group G5. On both sides of the wafer transfer arm 102 in the X direction, for example, a buffer cassette 103 (back side in FIG. 5) and 104 (front side in FIG. 5) are provided. The wafer transfer arm 102 can access the heat treatment device and the buffer cassettes 103 and 104 in the fifth processing unit group G5. In the second dielectric surface 101, a wafer transfer arm 106 is provided, and the wafer transfer arm is provided. 106 moves on the transport path 105 provided in the X direction. The wafer transfer arm 106 is movable in the Z direction and rotatable in the θ direction, and can access the buffer cassette 104 and an exposure device (not shown) adjacent to the second dielectric surface 101. Therefore, the wafer W in the processing station 3 can be transported to the exposure device via the wafer transfer arm 102, the buffer cassette 104, and the wafer transfer arm 106, and the wafer W after the exposure process can pass through the crystal. The circular transfer arm 106, the buffer cassette 104, and the wafer transfer arm 102 are transported to the processing station 3.

Further, in the above-described embodiment, the case where the new processing liquid supply system is applied to the piping circuit of the photoresist liquid of the coating/development processing system of the semiconductor wafer has been described, but it can also be applied as a washing. A thinner or pure water supply line for the clean liquid or a supply line for the developing liquid for the development process. Further, even a substrate to be processed other than a semiconductor wafer such as FPD can be applied.

71‧‧‧Liquid supply bottle

72‧‧‧Pipe

73‧‧‧Intermediate tank supply valve

74‧‧‧Intermediate storage tank

75‧‧‧Intermediate storage tank exhaust pipe

76‧‧‧Intermediate tank exhaust valve

77‧‧‧Filter primary side piping

78‧‧‧Filter exhaust piping

79‧‧‧Filter exhaust valve

98‧‧‧Filter

99‧‧‧Pump secondary piping

111‧‧‧Upper level liquid level sensor

112‧‧‧Limited liquid level sensor

113‧‧‧Filter secondary piping

114‧‧‧ Magnet pump

115‧‧‧Different Department

116‧‧‧Recycling piping

117‧‧‧Circulation valve

118‧‧‧Distribution of the original valve

119‧‧‧ flowmeter

130a‧‧‧Distribution valve

130b‧‧‧Distribution valve

131a‧‧‧Nozzle supply tube

131b‧‧‧Nozzle supply tube

132a‧‧‧Liquid supply nozzle

132b‧‧‧Liquid supply nozzle

Claims (6)

A processing liquid supply piping circuit that is provided in a liquid processing apparatus that is supplied to a surface of a substrate for supplying a processing liquid from a liquid supply nozzle to a substrate, and is configured in the liquid supply nozzle and the liquid supply unit of the processing liquid The processing liquid supply piping circuit is characterized in that: an intermediate storage tank is provided to temporarily store the processing liquid supplied from the liquid supply unit through the supply piping; and an exhaust pipe is connected above the intermediate storage tank for The internal treatment liquid is depressurized and deaerated; the liquid supply pump draws the treatment liquid from the outlet side of the intermediate storage tank to continuously discharge the discharge operation; and the on-off valve is provided to be formed as the liquid supply pump a pipe between the secondary pipe of the liquid supply pump and the liquid supply nozzle on the discharge side, and a switch that flows the processing liquid toward the liquid supply nozzle side; the circulation pipe branches from the primary side of the switching valve to communicate with each other The intermediate storage tank circulates the treatment liquid, and a circulation valve that switches the flow of the treatment liquid in the circulation piping. The processing liquid supply piping circuit according to claim 1, wherein the liquid feeding pump is a magnet pump. The processing liquid supply piping circuit according to claim 1 or 2, wherein the piping between the intermediate storage tank and the liquid feeding pump is provided filter. A processing liquid supply piping circuit according to the first or second aspect of the invention, wherein the second side of the liquid feeding pump is provided with a filter. The treatment liquid supply piping circuit according to the first or second aspect of the invention, wherein the control unit includes a flow meter for detecting a flow rate of the treatment liquid or a pressure for detecting the treatment liquid in front of the circulation piping. The pressure gauge controls the driving portion of the liquid feeding pump in such a manner that the detected value is maintained at a predetermined setting. The processing liquid supply piping circuit according to claim 1 or 2, further comprising: a bypass valve provided between the circulation valve and the intermediate storage tank, wherein the bypass valve switches the processing liquid to the middle The flow path of the storage tank and the bypass flow path connected to the piping on the outlet side of the intermediate storage tank without passing through the intermediate storage tank.