KR102616524B1 - Substrate processing apparatus, treatment solution supply apparatus and treatment solution supply method - Google Patents

Abstract

The present invention provides a substrate processing apparatus. The substrate processing apparatus includes processing devices that process a substrate using a processing liquid; It includes a processing liquid supply unit that supplies processing liquid to the nozzles of each of the processing devices using one pump unit; The processing liquid supply unit may sequentially supply processing liquid according to the order of substrates loaded into each of the processing devices.

Description

Substrate processing device, processing liquid supply device, and processing liquid supply method {SUBSTRATE PROCESSING APPARATUS, TREATMENT SOLUTION SUPPLY APPARATUS AND TREATMENT SOLUTION SUPPLY METHOD}

The present invention relates to a processing liquid supply device and a processing liquid supply method in an apparatus for treating a substrate with a processing liquid.

Among the semiconductor manufacturing processes, the photo-lithography process is a process that forms a desired pattern on a wafer. The photographic process is usually carried out in a spinner local facility where exposure equipment is connected and sequentially processes the coating process, exposure process, and development process. These spinner facilities sequentially or selectively perform the HMDS (Hexamethyl disilazane) process, application process, bake process, and development process.

Figure 8 is a diagram showing a treatment liquid supply device in a treatment device in which a general coating process is performed.

As shown in FIG. 8, in the existing application process, the pump 2 is installed independently for each liquid treatment device 1. As a result, when the process progresses, the state of the processing liquid in the processing liquid supply device is different for each liquid processing device 1.

Specifically, the state of the pump 2 or filter (not shown) of the processing liquid supply device causes the supply of the processing liquid to differ between the liquid processing devices 1 . In this way, if the state of the pump 2 or the filter of the processing liquid supply device is different between the liquid processing devices 1, the particles in the processing liquid supplied from the processing liquid supply device and discharged from the application nozzle of the liquid processing device to the substrate may be affected. There is a large difference between liquid processing devices in the amount or the amount of defects in a substrate that has been liquid treated using the processing liquid.

As a result, quality differences occur between substrates. In addition, when all treatment liquid supply devices operate simultaneously, abnormal negative pressure is generated in the chemical solution tank, creating an environment in which bubbles are likely to form in the chemical solution, and if the generated bubbles are supplied to the liquid treatment device, it may cause application defects.

The present invention is intended to provide a treatment liquid supply device and a treatment liquid supply method that can reduce treatment liquid stagnation time in a supply pipe.

The present invention is intended to provide a treatment liquid supply device and a treatment liquid supply method that can reduce the possibility of bubbles occurring in the supply pipe by reducing the range of pressure fluctuations in the supply pipe.

The present invention is intended to provide a treatment liquid supply device and a treatment liquid supply method that can reduce waste liquid generated from the supply device by using a common supply device.

The present invention is intended to provide a processing liquid supply device and a processing liquid supply method that can reduce the idle time of the chemical liquid supply device by matching the substrate supply sequence and the chemical liquid supply sequence.

The present invention is intended to provide a treatment liquid supply device and a treatment liquid supply method that can reduce the quantity of the supply pump.

The problem to be solved by the present invention is not limited to the problems mentioned above. Other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

According to one aspect of the present invention, processing devices for processing a substrate using a processing liquid; It includes a processing liquid supply unit that supplies processing liquid to the nozzles of each of the processing devices using one pump unit; The processing liquid supply unit may be provided as a substrate processing device that supplies processing liquid sequentially according to the order of substrates loaded into each of the processing devices.

In addition, the processing liquid supply unit may further include a pump control unit that controls the supply pressure of the pump to minimize pressure changes in the supply pipe according to the processing liquid movement length between the pump unit and the nozzles of each of the processing devices. .

Additionally, the processing devices may be stacked and arranged in multiple stages.

In addition, the processing liquid supply unit may further include a pump control unit that controls the supply pressure of the pump to minimize pressure changes in the supply pipe according to differences in stacking heights of the processing devices.

In addition, the processing devices are arranged in a multi-stage stack, and the processing liquid supply unit minimizes pressure changes in the supply pipe according to the processing liquid movement length between the pump unit and the nozzle of each of the processing devices and the difference in the stacking height of the processing devices. To do this, it may further include a pump control unit that controls the supply pressure of the pump.

In addition, the treatment liquid supply unit includes a bottle in which the treatment liquid is stored; and a trap tank that temporarily stores the treatment liquid supplied from the bottle, wherein the supply pipe includes a main pipe in which the bottle, the trap tank, and the pump unit are sequentially arranged. and branch pipes branched from the main pipe and connected to nozzles of each of the processing devices.

Additionally, the pump unit includes a first motor and a charging pump unit that receives and fills the processing liquid from the trap tank. a discharge pump unit including a second motor, receiving the treatment liquid charged in the charge pump unit and supplying it to the nozzle; a filter provided on a path along which the processing liquid moves from the charge pump unit to the discharge pump unit; And a pump control unit that controls the first motor and the second motor; The pump control unit controls the torque and speed of the second motor according to the processing liquid movement length between the nozzles of the pump unit and each of the processing devices and the difference in stacking height of the processing devices to provide different supply pressure to the discharge pump unit. can do.

Additionally, the pump control unit may control the supply pressure of the discharge pump unit to increase as the processing liquid movement length between the pump unit and the nozzle of each of the processing devices is longer and the stacking height of the processing devices is higher.

In addition, the order in which substrates are loaded into each of the processing devices is sequentially loaded for each tower on which the processing devices are stacked; The processing devices located at the top of the relevant tower are sequentially introduced downward, and when loading of the substrates within the tower is completed, the substrates can be sequentially inputted upwards starting from the processing devices located at the bottom of another tower adjacent to the tower.

According to one aspect of the present invention, a treatment liquid source; a main pipe connected to the treatment liquid supply source; a branch pipe branched from the main pipe and connected to a nozzle of each of the processing devices; A pump unit installed in the main pipe; and a control unit that controls the pump unit to sequentially supply the processing liquid according to the order of the substrates loaded into each of the processing devices.

In addition, the pump unit includes a first motor and a charging pump unit that receives and charges processing liquid from the processing liquid supply source. a discharge pump unit including a second motor, receiving the treatment liquid charged in the charge pump unit and supplying it to the nozzle; And it may include a pump control unit that controls the first motor and the second motor.

In addition, the pump control unit controls the torque and speed of the second motor according to the processing liquid movement length between the nozzles of the pump unit and each of the processing devices and the difference in stacking height of the processing devices to adjust the supply pressure of the discharge pump unit. It can be provided differently.

Additionally, the pump control unit may control the supply pressure of the discharge pump unit to increase as the processing liquid movement length between the pump unit and the nozzle of each of the processing devices is longer and the stacking height of the processing devices is higher.

Additionally, the pump unit may further include a filter provided on a path through which the treatment liquid moves from the charge pump unit to the discharge pump unit.

According to one aspect of the present invention, temporarily storing a treatment liquid contained in a bottle in a trap tank; Filling the pump chamber of the pump with the treatment liquid stored in the trap tank through the suction operation of the pump, and supplying the treatment liquid filled in the pump chamber to the nozzles of each of the treatment devices through the discharge operation of the pump. Includes a pumping step; The pumping step may provide a processing liquid supply method in which the processing liquid is sequentially supplied according to the order of the substrates loaded into each of the processing devices.

In addition, the pumping step includes charging the treatment liquid stored in the trap tank into the pump chamber of the charging pump unit; storing the treatment liquid charged in the charging pump unit in the pump chamber of the discharge pump unit; It may include supplying the treatment liquid to the nozzle through a discharge operation of the discharge pump unit.

Additionally, the pumping step may provide different supply pressures of the discharge pump unit depending on the movement length of the processing liquid between the pump and the nozzle of each of the processing devices.

Additionally, the pumping step may provide different supply pressures of the discharge pump unit according to differences in stacking heights of the processing devices.

Additionally, the pumping step may be controlled so that the supply pressure of the discharge pump unit increases as the processing liquid movement length between the pump unit and the nozzles of each of the processing devices increases and the stacking height of the processing devices increases.

Additionally, the supply pressure of the discharge pump unit may be provided through torque and speed control of the driving motor of the discharge pump unit.

In addition, the order in which substrates are loaded into each of the processing devices is sequentially loaded for each tower on which the processing devices are stacked; The processing devices located at the top of the relevant tower are sequentially introduced downward, and when loading of the substrates within the tower is completed, the substrates can be sequentially inputted upwards starting from the processing devices located at the bottom of another tower adjacent to the tower.

According to an embodiment of the present invention, the stagnation time of the treatment liquid in the supply pipe can be reduced, thereby reducing the bubble growth time in the pipe, and has the special effect of preventing deterioration of the treatment liquid by being less affected by the surrounding temperature.

According to an embodiment of the present invention, it has a special effect of reducing the possibility of bubbles occurring in the supply pipe by reducing the fluctuation range of pressure in the supply pipe.

According to an embodiment of the present invention, it has a special effect of reducing waste liquid generated from the supply device by using a common supply device.

According to an embodiment of the present invention, the idle time of the chemical solution supply device can be reduced by matching the substrate supply order and the chemical solution supply order.

According to an embodiment of the present invention, it has a special effect of reducing idle liquid in the pipe by integrating the piping system into one.

According to an embodiment of the present invention, the number of pumps can be reduced, which has the special effect of reducing maintenance and installation space.

The effects of the present invention are not limited to the effects described above. Effects not mentioned can be clearly understood by those skilled in the art from this specification and the attached drawings.

1 is a plan view of a substrate processing facility according to a first embodiment of the present invention.
Figure 2 is a cross-sectional view of the facility of Figure 1 viewed from the AA direction.
Figure 3 is a cross-sectional view of the equipment of Figure 1 viewed from the BB direction.
Figure 4 is a cross-sectional view of the facility of Figure 1 viewed from the CC direction.
FIG. 5 is a diagram for explaining a processing liquid supply device that supplies photoresist liquid to each of the resist application chambers.
FIG. 6 is a diagram for explaining the pump unit shown in FIG. 5.
FIG. 7 is a process diagram for explaining the process of supplying processing liquid to the liquid processing devices shown in FIG. 5.
Figure 8 is a diagram showing a treatment liquid supply device in a treatment device in which a general coating process is performed.

Below, with reference to the attached drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Additionally, when describing preferred embodiments of the present invention in detail, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. In addition, the same symbols are used throughout the drawings for parts that perform similar functions and actions.

'Including' a certain component does not mean excluding other components, but rather including other components, unless specifically stated to the contrary. Specifically, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are not intended to include one or more other features or It should be understood that this does not exclude in advance the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Terms such as first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, a first component may be named a second component, and similarly, the second component may also be named a first component without departing from the scope of the present invention.

Singular expressions include plural expressions unless the context clearly dictates otherwise. Additionally, the shapes and sizes of elements in the drawings may be exaggerated for clearer explanation.

The equipment of this embodiment can be used to perform a photolithography process on a substrate such as a semiconductor wafer or flat display panel. In particular, the equipment of this embodiment can be connected to an exposure apparatus and used to perform a coating process and a developing process on a substrate. Below, the case where a wafer is used as a substrate will be described as an example.

Hereinafter, the substrate processing equipment of the present invention will be described with reference to FIGS. 1 to 7.

FIG. 1 is a view of the substrate processing facility viewed from above, FIG. 2 is a view of the facility of FIG. 1 viewed from the A-A direction, FIG. 3 is a view of the facility of FIG. 1 viewed from the B-B direction, and FIG. 4 is a view of the facility of FIG. 1 This is a view viewed from the C-C direction.

1 to 4, the substrate processing equipment 1 includes a load port 100, an index module 200, a first buffer module 300, a coating and development module 400, and a second buffer module 500. ), a pre- and post-exposure processing module 600, and an interface module 700.

Load port 100, index module 200, first buffer module 300, coating and development module 400, second buffer module 500, pre- and post-exposure processing module 600, and interface module 700. Can be sequentially arranged in a row in one direction.

Hereinafter, the load port 100, the index module 200, the first buffer module 300, the coating and development module 400, the second buffer module 500, the pre- and post-exposure processing module 600, and the interface module ( The direction in which 700) is arranged is referred to as the first direction 12, and the direction perpendicular to the first direction 12 when viewed from the top is referred to as the second direction 14, and the first direction 12 and the second The direction perpendicular to the direction 14 is called the third direction 16.

The substrate W is moved while stored in the cassette 20. At this time, the cassette 20 has a structure that can be sealed from the outside. For example, a Front Open Unified Pod (FOUP) having a door at the front may be used as the cassette 20.

Hereinafter, the load port 100, the index module 200, the first buffer module 300, the coating and development module 400, the second buffer module 500, the pre- and post-exposure processing module 600, and the interface module ( 700) is explained in detail.

The load port 100 has a table 120 on which the cassette 20 containing the substrates W is placed. A plurality of platforms 120 are provided, and the platforms 200 are arranged in a row along the second direction 14. In Figure 1, four stands 120 are provided.

The index module 200 transfers the substrate W between the cassette 20 placed on the holder 120 of the load port 100 and the first buffer module 300. The index module 200 has a frame 210, an index robot 220, and a guide rail 230. The frame 210 is generally provided in the shape of a rectangular parallelepiped with an empty interior, and is disposed between the load port 100 and the first buffer module 300. The frame 210 of the index module 200 may be provided at a lower height than the frame 310 of the first buffer module 300, which will be described later. The index robot 220 and guide rail 230 are disposed within the frame 210. The index robot 220 is driven in four axes so that the hand 221, which directly handles the substrate W, can move and rotate in the first direction 12, the second direction 14, and the third direction 16. This has a possible structure. The index robot 220 has a hand 221, an arm 222, a support 223, and a stand 224. The hand 221 is fixedly installed on the arm 222. The arm 222 is provided in a stretchable structure and a rotatable structure. The support 223 is disposed along the third direction 16 in its longitudinal direction. The arm 222 is coupled to the support 223 so as to be movable along the support 223. The support 223 is fixedly coupled to the pedestal 224. The guide rail 230 is provided so that its longitudinal direction is arranged along the second direction 14. The stand 224 is coupled to the guide rail 230 so that it can move linearly along the guide rail 230. In addition, although not shown, the frame 210 is further provided with a door opener for opening and closing the door of the cassette 20.

The first buffer module 300 has a frame 310, a first buffer 320, a second buffer 330, a cooling chamber 350, and a first buffer robot 360. The frame 310 is provided in the shape of a rectangular parallelepiped with an empty interior, and is disposed between the index module 200 and the application and development module 400. The first buffer 320, second buffer 330, cooling chamber 350, and first buffer robot 360 are located within frame 310. The cooling chamber 350, the second buffer 330, and the first buffer 320 are sequentially arranged along the third direction 16 from below. The first buffer 320 is located at a height corresponding to the application module 401 of the application and development module 400, which will be described later, and the second buffer 330 and the cooling chamber 350 will be located at a height corresponding to the application module 401 of the application and development module 400, which will be described later. It is located at a height corresponding to the development module 402 of 400). The first buffer robot 360 is positioned at a certain distance from the second buffer 330, the cooling chamber 350, and the first buffer 320 in the second direction 14.

The first buffer 320 and the second buffer 330 each temporarily store a plurality of substrates W. The second buffer 330 has a housing 331 and a plurality of supports 332. The supports 332 are disposed within the housing 331 and are spaced apart from each other along the third direction 16. One substrate (W) is placed on each support 332. The housing 331 includes an index robot 220, a first buffer robot 360, and a developing robot 482 of the developing module 402, which will be described later, to place the substrate W on the support 332 within the housing 331. It has an opening (not shown) in the direction in which the index robot 220 is provided, the direction in which the first buffer robot 360 is provided, and the direction in which the developing robot 482 is provided for loading or unloading. The first buffer 320 has a generally similar structure to the second buffer 330. However, the housing 321 of the first buffer 320 has an opening in the direction in which the first buffer robot 360 is provided and in the direction in which the applicator robot 432 located in the applicator module 401, which will be described later, is provided. The number of supports 322 provided in the first buffer 320 and the number of supports 332 provided in the second buffer 330 may be the same or different. According to one example, the number of supports 332 provided in the second buffer 330 may be greater than the number of supports 322 provided in the first buffer 320.

The first buffer robot 360 transfers the substrate W between the first buffer 320 and the second buffer 330. The first buffer robot 360 has a hand 361, an arm 362, and a support base 363. The hand 361 is fixedly installed on the arm 362. The arm 362 is provided in a stretchable structure, allowing the hand 361 to move along the second direction 14. The arm 362 is coupled to the support 363 so as to be able to move linearly in the third direction 16 along the support 363. The support 363 has a length extending from a position corresponding to the second buffer 330 to a position corresponding to the first buffer 320 . The support 363 may be provided longer in the upward or downward direction. The first buffer robot 360 may be provided so that the hand 361 is simply driven in two axes along the second direction 14 and the third direction 16.

The cooling chambers 350 cool the substrates W, respectively. The cooling chamber 350 has a housing 351 and a cooling plate 352. The cooling plate 352 has an upper surface on which the substrate W is placed and a cooling means 353 for cooling the substrate W. As the cooling means 353, various methods may be used, such as cooling using coolant or cooling using thermoelectric elements. Additionally, the cooling chamber 350 may be provided with a lift pin assembly (not shown) that positions the substrate W on the cooling plate 352 . The housing 351 has the index robot 220 so that the index robot 220 and the developing robot 482 provided in the developing module 402, which will be described later, can load or unload the substrate W into or out of the cooling plate 352. The direction provided and the developing robot 482 have an opening (not shown) in the direction provided. Additionally, the cooling chamber 350 may be provided with doors (not shown) that open and close the above-described openings.

The coating and developing module 400 performs a process of applying photoresist on the substrate W before the exposure process and a process of developing the substrate W after the exposure process. The coating and developing module 400 has a generally rectangular parallelepiped shape. The application and development module 400 has an application module 401 and a development module 402. The application module 401 and the development module 402 are arranged to be divided into layers from each other. According to one example, the application module 401 is located on top of the development module 402.

The application module 401 includes a process of applying a photosensitive liquid such as photoresist to the substrate W and a heat treatment process such as heating and cooling to the substrate W before and after the resist application process. The application module 401 has a resist application chamber 410, a bake chamber 420, and a transfer chamber 430. The resist application chamber 410, the bake chamber 420, and the transfer chamber 430 are sequentially arranged along the second direction 14. Accordingly, the resist application chamber 410 and the bake chamber 420 are positioned to be spaced apart from each other in the second direction 14 with the transfer chamber 430 interposed therebetween. A plurality of resist application chambers 410 are provided, and a plurality of resist application chambers 410 are provided in each of the first direction 12 and the third direction 16. In the drawing, an example in which six resist application chambers 410 are provided is shown. A plurality of bake chambers 420 are provided in each of the first direction 12 and the third direction 16. In the drawing, an example in which six bake chambers 420 are provided is shown. However, unlike this, the bake chamber 420 may be provided in greater numbers.

The transfer chamber 430 is positioned parallel to the first buffer 320 of the first buffer module 300 in the first direction 12. An applicator robot 432 and a guide rail 433 are located within the transfer chamber 430. The transfer chamber 430 has a generally rectangular shape. The applicator robot 432 includes bake chambers 420, resist application chambers 410, the first buffer 320 of the first buffer module 300, and the first buffer of the second buffer module 500, which will be described later. The substrate W is transferred between cooling chambers 520. The guide rail 433 is arranged so that its longitudinal direction is parallel to the first direction 12. The guide rail 433 guides the applicator robot 432 to move linearly in the first direction 12. The applicator robot 432 has a hand 434, an arm 435, a support 436, and a stand 437. The hand 434 is fixedly installed on the arm 435. The arm 435 is provided in a stretchable structure so that the hand 434 can move in the horizontal direction. The support 436 is provided so that its longitudinal direction is arranged along the third direction 16. The arm 435 is coupled to the support 436 to enable linear movement in the third direction 16 along the support 436. The support 436 is fixedly coupled to the pedestal 437, and the pedestal 437 is coupled to the guide rail 433 so as to be movable along the guide rail 433.

The resist application chambers 410 all have the same structure. However, the type of photoresist used in each resist application chamber 410 may be different. As an example, a chemical amplification resist may be used as a photo resist. The resist application chamber 410 applies photoresist on the substrate W.

The resist application chamber 410 has a housing 411, a support plate 412, and a nozzle 413. The housing 411 has a cup shape with an open top. The support plate 412 is located within the housing 411 and supports the substrate W. The support plate 412 is provided to be rotatable. The nozzle 413 supplies photoresist onto the substrate W placed on the support plate 412. The nozzle 413 has a circular tube shape and can supply photoresist to the center of the substrate W. Optionally, the nozzle 413 may have a length corresponding to the diameter of the substrate W, and the discharge port of the nozzle 413 may be provided as a slit. Additionally, the resist application chamber 410 may be further provided with a nozzle 414 for supplying a cleaning liquid such as deionized water to clean the surface of the substrate W on which the photoresist is applied.

Referring again to FIGS. 1 to 4, the bake chamber 420 heat-treats the substrate W. For example, the bake chambers 420 perform a prebake process in which organic matter or moisture on the surface of the substrate W is removed by heating the substrate W to a predetermined temperature before applying the photoresist, or a photoresist is applied to the substrate (W). A soft bake process performed after coating on W is performed, and a cooling process for cooling the substrate W is performed after each heating process. The bake chamber 420 has a cooling plate 421 or a heating plate 422. The cooling plate 421 is provided with a cooling means 423 such as coolant or a thermoelectric element. Additionally, the heating plate 422 is provided with a heating means 424 such as a heating wire or thermoelectric element. The cooling plate 421 and the heating plate 422 may each be provided within one bake chamber 420. Optionally, some of the bake chambers 420 may have only a cooling plate 421 and others may have only a heating plate 422.

The development module 402 includes a development process of removing part of the photo resist by supplying a developer solution to obtain a pattern on the substrate W, and a heat treatment process such as heating and cooling performed on the substrate W before and after the development process. Includes. The development module 402 has a development chamber 460, a bake chamber 470, and a transfer chamber 480. The development chamber 460, the bake chamber 470, and the transfer chamber 480 are sequentially arranged along the second direction 14. Accordingly, the development chamber 460 and the bake chamber 470 are positioned to be spaced apart from each other in the second direction 14 with the transfer chamber 480 interposed therebetween. A plurality of development chambers 460 are provided, and a plurality of development chambers 460 are provided in each of the first direction 12 and the third direction 16. In the drawing, an example in which six development chambers 460 are provided is shown. A plurality of bake chambers 470 are provided in each of the first direction 12 and the third direction 16. In the drawing, an example in which six bake chambers 470 are provided is shown. However, unlike this, the bake chamber 470 may be provided in greater numbers.

The transfer chamber 480 is positioned parallel to the second buffer 330 of the first buffer module 300 in the first direction 12. A developing robot 482 and a guide rail 483 are located within the transfer chamber 480. The transfer chamber 480 has a generally rectangular shape. The developing robot 482 includes bake chambers 470, developing chambers 460, the second buffer 330 and cooling chamber 350 of the first buffer module 300, and the second buffer module 500. The substrate W is transferred between the second cooling chambers 540. The guide rail 483 is arranged so that its longitudinal direction is parallel to the first direction 12. The guide rail 483 guides the developing robot 482 to move linearly in the first direction 12. The developing robot 482 has a hand 484, an arm 485, a support 486, and a stand 487. The hand 484 is fixedly installed on the arm 485. The arm 485 is provided in a stretchable structure so that the hand 484 can move in the horizontal direction. The support 486 is provided so that its longitudinal direction is arranged along the third direction 16. The arm 485 is coupled to the support 486 to enable linear movement in the third direction 16 along the support 486. The support 486 is fixedly coupled to the pedestal 487. The stand 487 is coupled to the guide rail 483 so as to be movable along the guide rail 483.

The development chambers 460 all have the same structure. However, the type of developer used in each developing chamber 460 may be different. The developing chamber 460 removes the light-irradiated area of the photo resist on the substrate W. At this time, the light-irradiated area of the protective film is also removed. Depending on the type of photoresist selectively used, only the areas that are not exposed to light among the areas of the photoresist and the protective film may be removed.

The development chamber 460 has a housing 461, a support plate 462, and a nozzle 463. The housing 461 has a cup shape with an open top. The support plate 462 is located within the housing 461 and supports the substrate W. The support plate 462 is provided to be rotatable. The nozzle 463 supplies developer onto the substrate W placed on the support plate 462. The nozzle 463 has a circular tube shape and can supply the developing solution to the center of the substrate W. Optionally, the nozzle 463 may have a length corresponding to the diameter of the substrate W, and the discharge port of the nozzle 463 may be provided as a slit. Additionally, the developing chamber 460 may be further provided with a nozzle 464 that supplies a cleaning solution such as deionized water to clean the surface of the substrate W to which the developing solution has been supplied.

The bake chamber 470 of the development module 402 heat-treats the substrate W. For example, the bake chambers 470 include a post-bake process of heating the substrate W before the development process is performed, a hard bake process of heating the substrate W after the development process, and a heating process after each bake process. A cooling process to cool the wafer is performed. The bake chamber 470 has a cooling plate 471 or a heating plate 472. The cooling plate 471 is provided with cooling means 473 such as coolant or thermoelectric elements. Alternatively, the heating plate 472 is provided with a heating means 474 such as a heating wire or thermoelectric element. The cooling plate 471 and the heating plate 472 may each be provided within one bake chamber 470. Optionally, some of the bake chambers 470 may have only a cooling plate 471 and others may have only a heating plate 472.

As described above, in the application and development module 400, the application module 401 and the development module 402 are provided to be separated from each other. Additionally, when viewed from the top, the application module 401 and the development module 402 may have the same chamber arrangement.

The second buffer module 500 is provided as a passage through which the substrate W is transported between the coating and development module 400 and the pre- and post-exposure processing module 600. Additionally, the second buffer module 500 performs a predetermined process, such as a cooling process or an edge exposure process, on the substrate W. The second buffer module 500 includes a frame 510, a buffer 520, a first cooling chamber 530, a second cooling chamber 540, an edge exposure chamber 550, and a second buffer robot 560. have The frame 510 has the shape of a rectangular parallelepiped. Buffer 520, first cooling chamber 530, second cooling chamber 540, edge exposure chamber 550, and second buffer robot 560 are located within frame 510. The buffer 520, the first cooling chamber 530, and the edge exposure chamber 550 are disposed at a height corresponding to the application module 401. The second cooling chamber 540 is disposed at a height corresponding to the development module 402. The buffer 520, the first cooling chamber 530, and the second cooling chamber 540 are sequentially arranged in a line along the third direction 16. When viewed from the top, the buffer 520 is disposed along the first direction 12 and the transfer chamber 430 of the application module 401. The edge exposure chamber 550 is disposed to be spaced apart from the buffer 520 or the first cooling chamber 530 by a predetermined distance in the second direction 14 .

The second buffer robot 560 transports the substrate W between the buffer 520, the first cooling chamber 530, and the edge exposure chamber 550. The second buffer robot 560 is located between the edge exposure chamber 550 and the buffer 520. The second buffer robot 560 may be provided in a similar structure to the first buffer robot 360. The first cooling chamber 530 and the edge exposure chamber 550 perform subsequent processes on the wafers W on which the process was performed in the coating module 401. The first cooling chamber 530 cools the substrate W on which a process has been performed in the coating module 401. The first cooling chamber 530 has a similar structure to the cooling chamber 350 of the first buffer module 300. The edge exposure chamber 550 exposes the edges of the wafers W on which the cooling process was performed in the first cooling chamber 530 . The buffer 520 temporarily stores the substrates W on which a process has been performed in the edge exposure chamber 550 before they are transported to the preprocessing module 601, which will be described later. The second cooling chamber 540 cools the wafers W that have undergone processing in the post-processing module 602, which will be described later, before they are transported to the development module 402. The second buffer module 500 may further have a buffer added to the height corresponding to the development module 402. In this case, the wafers W that have undergone processing in the post-processing module 602 may be temporarily stored in an added buffer and then transported to the development module 402.

When the exposure apparatus 1000 performs a liquid immersion exposure process, the pre- and post-exposure processing module 600 may process a process of applying a protective film that protects the photoresist film applied to the substrate W during liquid immersion exposure. Additionally, the pre- and post-exposure processing module 600 may perform a process of cleaning the substrate W after exposure. Additionally, when the application process is performed using a chemically amplified resist, the pre- and post-exposure processing module 600 can process a post-exposure bake process.

The pre- and post-exposure processing module 600 includes a pre-processing module 601 and a post-processing module 602. The pre-processing module 601 performs a process of processing the substrate W before performing the exposure process, and the post-processing module 602 performs a process of processing the substrate W after the exposure process. The pre-processing module 601 and the post-processing module 602 are arranged to be divided into layers. According to one example, the pre-processing module 601 is located on top of the post-processing module 602. The pretreatment module 601 is provided at the same height as the application module 401. The post-processing module 602 is provided at the same height as the development module 402. The pretreatment module 601 has a protective film application chamber 610, a bake chamber 620, and a transfer chamber 630. The protective film application chamber 610, the transfer chamber 630, and the bake chamber 620 are sequentially arranged along the second direction 14. Accordingly, the protective film application chamber 610 and the bake chamber 620 are positioned to be spaced apart from each other in the second direction 14 with the transfer chamber 630 interposed therebetween. A plurality of protective film application chambers 610 are provided and arranged along the third direction 16 to form a layer on top of each other. Optionally, a plurality of protective film application chambers 610 may be provided in each of the first direction 12 and the third direction 16. A plurality of bake chambers 620 are provided and arranged along the third direction 16 to form a layer on top of each other. Optionally, a plurality of bake chambers 620 may be provided in each of the first direction 12 and the third direction 16.

The transfer chamber 630 is located parallel to the first cooling chamber 530 of the second buffer module 500 in the first direction 12. A preprocessing robot 632 is located within the transfer chamber 630. The transfer chamber 630 has a generally square or rectangular shape. The preprocessing robot 632 operates between the protective film application chambers 610, the bake chambers 620, the buffer 520 of the second buffer module 500, and the first buffer 720 of the interface module 700, which will be described later. Transfer the substrate (W). The pretreatment robot 632 has a hand 633, an arm 634, and a support base 635. The hand 633 is fixedly installed on the arm 634. The arm 634 is provided in a stretchable structure and a rotatable structure. The arm 634 is coupled to the support 635 so as to be able to move linearly in the third direction 16 along the support 635.

The protective film application chamber 610 applies a protective film that protects the resist film on the substrate W during liquid immersion exposure. The protective film application chamber 610 has a housing 611, a support plate 612, and a nozzle 613. The housing 611 has a cup shape with an open top. The support plate 612 is located within the housing 611 and supports the substrate W. The support plate 612 is provided to be rotatable. The nozzle 613 supplies protective liquid for forming a protective film onto the substrate W placed on the support plate 612. The nozzle 613 has a circular tube shape and can supply protective liquid to the center of the substrate W. Optionally, the nozzle 613 may have a length corresponding to the diameter of the substrate W, and the discharge port of the nozzle 613 may be provided as a slit. In this case, the support plate 612 may be provided in a fixed state. The protective liquid contains a foaming material. The protective liquid may be a photoresist or a material with low affinity for water. For example, the protective liquid may contain a fluorine-based solvent. The protective film application chamber 610 rotates the substrate W placed on the support plate 612 and supplies a protective liquid to the central area of the substrate W.

The bake chamber 620 heat-treats the substrate W on which the protective film is applied. The bake chamber 620 has a cooling plate 621 or a heating plate 622. The cooling plate 621 is provided with cooling means 623 such as coolant or thermoelectric elements. Alternatively, the heating plate 622 is provided with a heating means 624 such as a heating wire or thermoelectric element. The heating plate 622 and the cooling plate 621 may each be provided within one bake chamber 620. Optionally, some of the bake chambers 620 may have only a heating plate 622 and others may have only a cooling plate 621.

The post-processing module 602 has a cleaning chamber 660, a post-exposure bake chamber 670, and a transfer chamber 680. The cleaning chamber 660, the transfer chamber 680, and the post-exposure bake chamber 670 are sequentially arranged along the second direction 14. Accordingly, the cleaning chamber 660 and the post-exposure bake chamber 670 are positioned to be spaced apart from each other in the second direction 14 with the transfer chamber 680 interposed therebetween. A plurality of cleaning chambers 660 are provided, and may be arranged along the third direction 16 to form a layer on top of each other. Optionally, a plurality of cleaning chambers 660 may be provided in each of the first direction 12 and the third direction 16. A plurality of post-exposure bake chambers 670 are provided, and may be arranged along the third direction 16 to form a layer on top of each other. Optionally, a plurality of post-exposure bake chambers 670 may be provided in each of the first direction 12 and the third direction 16.

The transfer chamber 680 is positioned parallel to the second cooling chamber 540 of the second buffer module 500 in the first direction 12 when viewed from the top. The transfer chamber 680 has a generally square or rectangular shape. A post-processing robot 682 is located within the transfer chamber 680. The post-processing robot 682 includes cleaning chambers 660, post-exposure bake chambers 670, a second cooling chamber 540 of the second buffer module 500, and a second cooling chamber 540 of the interface module 700, which will be described later. The substrate W is transported between buffers 730. The post-processing robot 682 provided in the post-processing module 602 may be provided in the same structure as the pre-processing robot 632 provided in the pre-processing module 601.

The cleaning chamber 660 cleans the substrate W after the exposure process. Cleaning chamber 660 has a housing 661, a support plate 662, and a nozzle 663. The housing 661 has a cup shape with an open top. The support plate 662 is located within the housing 661 and supports the substrate W. The support plate 662 is provided to be rotatable. The nozzle 663 supplies cleaning liquid onto the substrate W placed on the support plate 662. Water such as deionized water may be used as a cleaning liquid. The cleaning chamber 660 supplies cleaning liquid to the central area of the substrate W while rotating the substrate W placed on the support plate 662. Optionally, while the substrate W is rotated, the nozzle 663 may move linearly or rotationally from the center area of the substrate W to the edge area.

After exposure, the bake chamber 670 heats the substrate W on which the exposure process was performed using far ultraviolet rays. The post-exposure bake process heats the substrate W to amplify the acid generated in the photoresist by exposure, thereby completely changing the properties of the photoresist. The post-exposure bake chamber 670 has a heating plate 672. The heating plate 672 is provided with heating means 674, such as a heating wire or thermoelectric element. After exposure, the bake chamber 670 may further include a cooling plate 671 therein. The cooling plate 671 is provided with cooling means 673 such as coolant or thermoelectric elements. Additionally, optionally, a bake chamber with only a cooling plate 671 may be further provided.

As described above, in the pre- and post-exposure processing module 600, the pre-processing module 601 and the post-processing module 602 are provided to be completely separated from each other. Additionally, the transfer chamber 630 of the pre-processing module 601 and the transfer chamber 680 of the post-processing module 602 may be provided in the same size, so that they completely overlap each other when viewed from the top. Additionally, the protective film application chamber 610 and the cleaning chamber 660 may be provided in the same size and completely overlap each other when viewed from the top. Additionally, the bake chamber 620 and the post-exposure bake chamber 670 may be provided in the same size and completely overlap each other when viewed from the top.

The interface module 700 transfers the substrate W between the pre- and post-exposure processing module 600 and the exposure apparatus 1000. The interface module 700 has a frame 710, a first buffer 720, a second buffer 730, and an interface robot 740. The first buffer 720, second buffer 730, and interface robot 740 are located within frame 710. The first buffer 720 and the second buffer 730 are spaced a certain distance apart from each other and are arranged to be stacked on each other. The first buffer 720 is placed higher than the second buffer 730. The first buffer 720 is located at a height corresponding to the pre-processing module 601, and the second buffer 730 is located at a height corresponding to the post-processing module 602. When viewed from the top, the first buffer 720 is arranged in line with the transfer chamber 630 of the pre-processing module 601 along the first direction 12, and the second buffer 730 is disposed in the post-processing module 602. It is positioned to be aligned with the transfer chamber 630 along the first direction 12.

The interface robot 740 is positioned to be spaced apart from the first buffer 720 and the second buffer 730 in the second direction 14. The interface robot 740 transports the substrate W between the first buffer 720, the second buffer 730, and the exposure apparatus 1000. The interface robot 740 has a structure generally similar to that of the second buffer robot 560.

The first buffer 720 temporarily stores the substrates W on which a process has been performed in the preprocessing module 601 before they are moved to the exposure apparatus 1000 . And the second buffer 730 temporarily stores the substrates W that have completed the process in the exposure apparatus 1000 before they are moved to the post-processing module 602. The first buffer 720 has a housing 721 and a plurality of supports 722. The supports 722 are disposed within the housing 721 and are spaced apart from each other along the third direction 16. One substrate (W) is placed on each support 722. The housing 721 is provided with an interface robot 740 and a preprocessing robot ( 632) has an opening (not shown) in the provided direction. The second buffer 730 has a generally similar structure to the first buffer 720. However, the housing 4531 of the second buffer 730 has an opening (not shown) in the direction in which the interface robot 740 is provided and in the direction in which the post-processing robot 682 is provided. The interface module may be provided with only buffers and a robot as described above without providing a chamber for performing a predetermined process on the wafer.

FIG. 5 is a diagram for explaining a processing liquid supply device that supplies photoresist liquid to each of the resist application chambers.

In this embodiment, the processing liquid supply device 900 is described as supplying photoresist liquid to each of the resist application chambers, but it is not limited to this and can be applied to any liquid processing device that processes the surface of a substrate using a processing liquid. . The resist application chamber may be provided as a liquid processing device 800 for applying photoresist on the substrate W described below. Each liquid processing device 800 may include a substrate support unit 810, a processing vessel 820, and a nozzle 830.

Referring to FIG. 5 , three liquid processing devices 800 may be arranged in a stack of three each in the first tower T1 and the second tower T2. As an example, the liquid processing devices arranged in a stack in the first tower (T1) are, from the top to bottom, liquid processing device No. 1 (800-1), liquid processing device No. 3 (800-3), and liquid processing device No. 5 (800). It can be defined as -5), and the liquid processing devices arranged in a stack in the second tower (T2) are liquid processing device No. 2 (800-2), liquid processing device No. 4 (800-4), and 6 from the top. It may be defined as a liquid processing device 800-6.

The treatment liquid supply device 900 may include a bottle 910, a trap tank 920, a pump unit 930, and a supply pipe 980.

The bottle 910 is filled with a treatment liquid, and the first inert gas supply line 912 and the first supply line (L1) are connected. An inert gas (helium gas or nitrogen gas) is supplied to the bottle 910 through a regulator through the first inert gas supply line 912 to create an inert gas atmosphere inside the sealed bottle 910, and the gas is supplied at a relative pressure. The internal processing liquid is moved to the trap tank 920 through the first supply line (L1).

The trap tank 920 stores the treatment liquid provided through the first supply line (L1), and water level detection sensors 922 are installed on one side to detect the water level of the treatment liquid and continuously fill the treatment liquid to the appropriate level. Make it possible. Meanwhile, the top of the trap tank 920 is connected to a second drain line 924, which removes air bubbles collected at the top of the trap tank 920 or changes the properties of the treatment liquid. In response, the treatment liquid is passively drained. The bubbles and the treatment liquid with changed properties discharged through the second drain line 924 may be provided to a waste liquid tank (not shown). A second supply line (L2) is connected to the bottom of the trap tank 920. The second supply line (L2) is connected to the pump unit 930.

The pump unit 930 supplies a fixed amount of the treatment liquid stored in the trap tank 920 to the nozzles 830 of each of the liquid treatment devices using fluid pressure generated by suction and discharge operations. The pump unit 930 may suction the processing liquid for one batch of substrates from the trap tank 920 and discharge the processing liquid to the corresponding nozzle 830 at different supply pressures during the application process.

A third supply line (L3) is connected to the pump unit 930. Branch pipes (L4) connected to the nozzles 830 of each of the liquid processing devices may be connected to the third supply line (L3). The main pipe may include a first supply line (L1), a second supply line (L2), and a third supply line (L3).

As an example, the processing liquid supply device 900 may sequentially supply processing liquid according to the order of substrates loaded into each of the liquid processing devices 800-1 to 800-6.

The processing liquid supply device 900 may include a pump control unit 990. The pump control unit 990 operates a pump unit ( 930) supply pressure can be controlled. Additionally, the pump control unit 990 may control the supply pressure of the pump unit 930 according to the difference in stacking height of the liquid processing devices.

FIG. 6 is a diagram for explaining the pump unit shown in FIG. 5.

Referring to FIG. 6, the pump unit 930 is designed to discharge a fixed amount of fluid onto the substrate. As an example, the pump unit 930 may be provided as a multi-stage pump structure including a charge pump unit 940, a discharge pump unit 950, and a filter 960. For example, the charge pump unit 940 and the discharge pump unit 950 may be diaphragm type pumps, but are not limited thereto. The filter 960 may be installed on the line through which the processing liquid moves from the charge pump unit 940 to the discharge pump unit 950.

The charging pump unit 940 may include a first motor 942 and a first pump chamber 944 that receives and fills the processing liquid from the trap tank 920.

The discharge pump unit 950 may include a second motor 952 and a second pump chamber 954 that receives and stores the treatment liquid charged in the charge pump unit 940. The treatment liquid stored in the second pump chamber 954 may be supplied to the nozzle 830 by the discharge operation of the second motor 952. While the discharge pump unit 950 supplies the treatment liquid to the nozzle 830, the charge pump unit 940 fills the first pump chamber 944 with the treatment liquid from the trap tank 920 through a suction operation.

The pump control unit 990 can control the first motor 942 and the second motor 952, respectively. As an example, the pump control unit 990 controls the torque and By controlling the speed, the supply pressure of the discharge pump unit 950 can be provided differently. Meanwhile, the supply pressure of the charging pump unit 940 may be controlled by the pump control unit 990 to be constant at all times.

According to this embodiment, the pump control unit 990 operates the discharge pump so that the supply pressure increases as the movement length of the processing liquid between the pump unit 930 and the nozzle 830 of each of the liquid processing devices is longer and the stacking height of the processing devices is higher. Unit 950 can be controlled.

FIG. 7 is a process diagram for explaining the process of supplying processing liquid to the liquid processing devices shown in FIG. 5.

Referring to FIGS. 5 to 7 , the order in which substrates are loaded into each liquid processing device may be sequentially loaded for each tower on which the liquid processing devices are stacked. As an example, the substrate loading order of the substrate transfer robot starts with the liquid processing unit No. 1 located at the top of the first tower, and sequentially moves to the liquid processing unit No. 3 (800-3) and the liquid processing unit No. 5 (800-5). can be put in. And when the substrate loading in the first tower (T1) is completed, liquid processing device No. 6 (800-6), liquid processing device No. 4 (800-4) and 2 located at the bottom of the adjacent second tower (T2) It may be sequentially introduced into the liquid processing device 800-2. Through the sequential input of these substrates, deviations occur in the start time of each process. Using this time difference, the treatment liquid is supplied sequentially.

Meanwhile, the supply of the treatment liquid is as follows. The valve of the branch line (L4) leading to the first liquid processing device (800-1) into which the substrate was first input is opened to supply the processing liquid to the nozzle 830 of the first liquid processing device (800-1). After supplying a fixed amount of treatment liquid, close the valve between liquid treatment device No. 1 *800-1) and the treatment liquid supply device and fill the treatment liquid in the pump unit 930. After completing the filling of the treatment liquid in the pump unit 930, the valve of the branch line L4 leading to the liquid treatment device No. 3 (800-3) is opened to supply the treatment liquid to the liquid treatment device No. 3 (800-3). After supplying a fixed amount of treatment liquid, the valve between the liquid treatment device 3 (800-3) and the treatment liquid supply device is closed and the treatment liquid in the pump unit 930 is recharged. After completing the filling of the treatment liquid in the pump unit 930, the valve of the branch line (L4) leading to the liquid treatment device No. 5 (800-5) is opened to supply the treatment liquid to the liquid treatment device No. 5 (800-5). After supplying a fixed amount of treatment liquid, the valve between the 5th liquid treatment device (800-5) and the treatment liquid supply device is closed and the treatment liquid in the pump unit 930 is charged. As above, all liquid treatment devices in the first tower are supplied sequentially from the top and then switched to the second tower (T2).

The supply of the treatment liquid from the second tower (T2) starts from the 6th liquid treatment unit (800-6), then the 4th liquid treatment unit (800-4), and the 2nd liquid treatment unit (800-2). , the explanation for this is omitted.

The processing liquid supply device 900 of the present invention supplies processing liquid according to the loading order of the substrate from the top to the bottom of the tower, from the bottom to the top, and then from the top to the bottom, as shown above.

It should be understood that the above embodiments are provided to aid understanding of the present invention, and do not limit the scope of the present invention, and that various modifications possible therefrom also fall within the scope of the present invention. The scope of technical protection of the present invention should be determined by the technical spirit of the patent claims, and the scope of technical protection of the present invention is not limited to the literal description of the claims themselves, but is substantially a scope of equal technical value. It should be understood that this extends to inventions of .

800: Liquid processing device 810: Substrate support unit
820: Processing container 830: Nozzle
900: Treatment liquid supply device 910: Bottle
920: Trap tank 930: Pump unit
940 ; Charge pump unit 950: Discharge pump unit
960: Filter 990: Pump control unit

Claims (20)

Processing devices that process a substrate using a processing liquid;
It includes a processing liquid supply unit that supplies processing liquid to the nozzles of each of the processing devices using one pump unit;
The treatment liquid supply unit
Supplying processing liquid sequentially according to the order of substrates loaded into each of the processing devices;
The treatment liquid supply unit
A bottle in which the treatment liquid is stored;
a trap tank for temporarily storing the treatment liquid supplied from the bottle;
A supply pipe including a main pipe in which the bottle, the trap tank, and the pump unit are sequentially arranged, and branch pipes branched from the main pipe and connected to nozzles of each of the processing devices,
The pump unit is
a charging pump unit including a first motor and receiving and charging the processing liquid from the trap tank;
a discharge pump unit including a second motor, receiving the treatment liquid charged in the charge pump unit and supplying it to the nozzle;
a filter provided on a path along which the processing liquid moves from the charge pump unit to the discharge pump unit; and
It includes a pump control unit that controls the first motor and the second motor;
The pump control unit
A substrate processing device that provides different supply pressures to the discharge pump unit by controlling the torque and speed of the second motor according to the processing liquid movement length between the nozzles of the pump unit and each of the processing devices and the difference in stacking height of the processing devices. . delete According to claim 1,
The processing devices are
A substrate processing device that is stacked in multiple stages. delete delete delete delete According to claim 1,
The pump control unit
A substrate processing device that controls the supply pressure of the discharge pump unit to increase as the processing liquid movement length between the pump unit and the nozzle of each of the processing devices is longer and the stacking height of the processing devices is higher. According to claim 1,
The order in which the substrate is loaded into each of the processing devices is
Substrates are sequentially loaded into each tower where the processing devices are stacked;
Substrate processing devices are sequentially inputted starting from the processing device located at the top of the relevant tower downwards, and when loading of substrates within the tower is completed, substrate processing devices are sequentially inputted starting from the processing device located at the bottom of another tower adjacent to the tower. Process liquid source;
a main pipe connected to the treatment liquid supply source;
a branch pipe branched from the main pipe and connected to a nozzle of each of the processing devices;
A pump unit installed in the main pipe; and
A control unit that controls the pump unit to sequentially supply processing liquid according to the order of substrates loaded into each of the processing devices;
The pump unit is
A charging pump unit including a first motor and receiving and charging processing liquid from the processing liquid supply source;
a discharge pump unit including a second motor, receiving the treatment liquid charged in the charge pump unit and supplying it to the nozzle; and
A processing liquid supply device including a pump control unit that controls the first motor and the second motor. delete According to claim 10,
The pump control unit
Processing liquid supply to provide different supply pressures to the discharge pump unit by controlling the torque and speed of the second motor according to the processing liquid movement length between the nozzles of the pump unit and each of the processing devices and the difference in stacking height of the processing devices. Device. According to claim 12,
The pump control unit
A processing liquid supply device that controls the supply pressure of the discharge pump unit to increase as the processing liquid movement length between the pump unit and the nozzle of each of the processing devices is longer and the stacking height of the processing devices is higher. According to claim 10,
The pump unit is
A processing liquid supply device further comprising a filter provided on a path through which the processing liquid moves from the charge pump unit to the discharge pump unit. In the treatment liquid supply method,
Temporarily storing the treatment liquid contained in the bottle in a trap tank;
The treatment liquid stored in the trap tank is filled into the first pump chamber of the pump through a suction operation of the pump, and the treatment liquid filled in the first pump chamber is stored in the second pump chamber of the pump. A pumping step of supplying the processing liquid filled in the second pump chamber to each nozzle of the processing devices through a discharge operation of;
The pumping step sequentially supplies processing liquid according to the order of substrates loaded into each of the processing devices,
The pumping step is
filling the first pump chamber with the treatment liquid stored in the trap tank;
storing the treatment liquid charged in the first pump chamber in the second pump chamber; and
A processing liquid supply method comprising supplying the processing liquid stored in the second pump chamber to the nozzle through a discharge operation of the pump. delete According to claim 15,
The pumping step is
A processing liquid supply method that provides different supply pressures to the second pump chamber depending on the processing liquid movement length between the pump and the nozzle of each of the processing devices and the difference in stacking height of the processing devices. According to claim 15,
The pumping step is
A processing liquid supply method in which the supply pressure of the second pump chamber is controlled to increase as the processing liquid movement length between the pump and the nozzle of each of the processing devices is longer and the stacking height of the processing devices is higher. The method of claim 17 or 18,
The supply pressure of the second pump room is
A treatment liquid supply method provided through torque and speed control of the driving motor of the second pump room. According to claim 15,
The order in which the substrate is loaded into each of the processing devices is
Substrates are sequentially loaded into each tower where the processing devices are stacked;
A method of supplying processing liquid in which the processing liquid is sequentially supplied downward starting from the processing device located at the top of the relevant tower, and when substrate loading in the tower is completed, the processing liquid is sequentially inputted upward starting from the processing device located at the bottom of another tower next to the tower.

Images