Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more fully describe the present invention to those skilled in the art. Thus, the shape of the elements in the figures has been exaggerated to emphasize a clearer description.
The facilities of this embodiment can be used to perform a photolithography process on a substrate such as a semiconductor wafer or a flat panel display panel. In particular, the apparatus of this embodiment can be used to perform a developing process with respect to a substrate connected to an exposure apparatus. However, the present embodiment is not limited thereto, and can be applied variously as long as it is a process of liquid-processing a substrate. In this embodiment, a wafer is used as a substrate.
Hereinafter, the substrate processing apparatus of the present invention will be described with reference to FIGS. 3 to 11. FIG.
3 is a plan view of the substrate processing equipment according to the embodiment of the present invention, FIG. 4 is a view of the equipment of FIG. 3 viewed from the direction AA, FIG. 5 is a view of the equipment of FIG. 3 viewed from the BB direction, Fig. 3 is a view of the facility of Fig. 3 viewed from the CC direction; Fig.
3 to 6, the substrate processing apparatus 1 includes a load port 100, an index module 200, a first buffer module 300, a coating and developing module 400, a second buffer module 500 An exposure pre- and post-processing module 600, and an interface module 700. The load port 100, the index module 200, the first buffer module 300, the application and development module 400, the second buffer module 500, the pre-exposure processing module 600, and the interface module 700, Are sequentially arranged in one direction in a single direction.
Hereinafter, the load port 100, the index module 200, the first buffer module 300, the coating and developing module 400, the second buffer module 500, the pre-exposure processing module 600, 700 are referred to as a first direction 12 and a direction perpendicular to the first direction 12 as viewed from above is referred to as a second direction 14 and a direction in which the first direction 12 and the second And a direction perpendicular to the direction 14 is referred to as a third direction 16.
The substrate W is moved in a state accommodated in the cassette 20. At this time, the cassette 20 has a structure that can be sealed from the outside. For example, as the cassette 20, a front open unified pod (FOUP) having a door at the front can be used.
Hereinafter, the load port 100, the index module 200, the first buffer module 300, the application and development module 400, the second buffer module 500, the pre-exposure processing module 600, 700 will be described in detail.
The load port 100 has a mounting table 120 on which the cassette 20 accommodating the substrates W is placed. A plurality of mounts 120 are provided, and the mounts 200 are arranged in a line along the second direction 14. [ In Fig. 2, four placement tables 120 are provided.
The index module 200 transfers the substrate W between the cassette 20 placed on the table 120 of the load port 100 and the first buffer module 300. The index module 200 has a frame 210, an index robot 220, and a guide rail 230. The frame 210 is provided generally in the shape of an inner rectangular parallelepiped and is disposed between the load port 100 and the first buffer module 300. The frame 210 of the index module 200 may be provided at a lower height than the frame 310 of the first buffer module 300 described later. The index robot 220 and the guide rail 230 are disposed within the frame 210. The index robot 220 is moved in the first direction 12, the second direction 14 and the third direction 16 so that the hand 221 that directly handles the substrate W can be moved and rotated in the first direction 12, the second direction 14, . The index robot 220 has a hand 221, an arm 222, a support 223, and a pedestal 224. The hand 221 is fixed to the arm 222. The arm 222 is provided with a stretchable structure and a rotatable structure. The support base 223 is disposed along the third direction 16 in the longitudinal direction. The arm 222 is coupled to the support 223 to be movable along the support 223. The support 223 is fixedly coupled to the pedestal 224. The guide rails 230 are provided so that their longitudinal direction is arranged along the second direction 14. The pedestal 224 is coupled to the guide rail 230 so as to be linearly movable along the guide rail 230. Further, although not shown, the frame 210 is further provided with a door opener for opening and closing the door of the cassette 20.
The first buffer module 300 has a frame 310, a first buffer 320, a second buffer 330, a cooling chamber 350, and a first buffer robot 360. The frame 310 is provided in the shape of an inner rectangular parallelepiped and is disposed between the index module 200 and the application and development module 400. The first buffer 320, the second buffer 330, the cooling chamber 350, and the first buffer robot 360 are located within the frame 310. The cooling chamber 350, the second buffer 330, and the first buffer 320 are sequentially disposed in the third direction 16 from below. The second buffer 330 and the cooling chamber 350 are located at a height corresponding to the coating module 401 of the coating and developing module 400 described later and the coating and developing module 400 at a height corresponding to the developing module 402. [ The first buffer robot 360 is spaced apart from the second buffer 330, the cooling chamber 350 and the first buffer 320 by a predetermined distance in the second direction 14.
The first buffer 320 and the second buffer 330 temporarily store a plurality of substrates W, respectively. The second buffer 330 has a housing 331 and a plurality of supports 332. The supports 332 are disposed within the housing 331 and are provided spaced apart from each other in the third direction 16. One substrate W is placed on each support 332. The housing 331 is constructed so that the index robot 220, the first buffer robot 360 and the developing robot 482 of the developing module 402 described later mount the substrate W on the support 332 in the housing 331 (Not shown) in the direction in which the index robot 220 is provided, in the direction in which the first buffer robot 360 is provided, and in the direction in which the developing robot 482 is provided, so that the developing robot 482 can carry it in or out. The first buffer 320 has a structure substantially similar to that of the second buffer 330. The housing 321 of the first buffer 320 has an opening in a direction in which the first buffer robot 360 is provided and in a direction in which the application unit robot 432 located in the application module 401 described later is provided. The number of supports 322 provided in the first buffer 320 and the number of supports 332 provided in the second buffer 330 may be the same or different. According to one example, the number of supports 332 provided in the second buffer 330 may be greater than the number of supports 322 provided in the first buffer 320.
The first buffer robot 360 transfers the substrate W between the first buffer 320 and the second buffer 330. The first buffer robot 360 has a hand 361, an arm 362, and a support base 363. The hand 361 is fixed to the arm 362. The arm 362 is provided in a stretchable configuration so that the hand 361 is movable along the second direction 14. The arm 362 is coupled to the support 363 so as to be linearly movable along the support 363 in the third direction 16. The support base 363 has a length extending from a position corresponding to the second buffer 330 to a position corresponding to the first buffer 320. The support member 363 may be provided longer in the upward or downward direction. The first buffer robot 360 may be provided so that the hand 361 is simply driven in two directions along the second direction 14 and the third direction 16.
The cooling chamber 350 cools the substrate W, respectively. The cooling chamber 350 has a housing 351 and a cooling plate 352. The cooling plate 352 has an upper surface on which the substrate W is placed and a cooling means 353 for cooling the substrate W. [ As the cooling means 353, various methods such as cooling with cooling water and cooling using a thermoelectric element can be used. In addition, the cooling chamber 350 may be provided with a lift pin assembly (not shown) for positioning the substrate W on the cooling plate 352. The housing 351 is provided with an index robot 220 so that the developing robot 482 provided in the index robot 220 and a developing module 402 to be described later can carry the substrate W into or out of the cooling plate 352 (Not shown) in the direction provided and the direction in which the developing robot 482 is provided. Further, the cooling chamber 350 may be provided with doors (not shown) for opening and closing the above-described opening.
The application and development module 400 performs a process of applying a photoresist on the substrate W before the exposure process and a process of developing the substrate W after the exposure process. The application and development module 400 has a generally rectangular parallelepiped shape. The coating and developing module 400 has a coating module 401 and a developing module 402. The application module 401 and the development module 402 are arranged so as to be partitioned into layers with respect to each other. According to one example, the application module 401 is located on top of the development module 402.
The application module 401 includes a step of applying a sensitizing liquid such as a photoresist to the substrate W and a baking step such as heating and cooling with respect to the substrate W before and after the resist coating step. The application module 401 has a resist application chamber 410, a bake chamber 420, and a transfer chamber 430. The resist application chamber 410, the bake chamber 420, and the transfer chamber 430 are sequentially disposed along the second direction 14. [ The resist application chamber 410 and the bake chamber 420 are positioned apart from each other in the second direction 14 with the transfer chamber 430 interposed therebetween. A plurality of resist coating chambers 410 are provided, and a plurality of resist coating chambers 410 are provided in the first direction 12 and the third direction 16, respectively. In the figure, six resist coating chambers 410 are provided. A plurality of bake chambers 420 are provided in the first direction 12 and the third direction 16, respectively. In the drawing, six bake chambers 420 are provided. Alternatively, however, the bake chamber 420 may be provided in a greater number.
The transfer chamber 430 is positioned in parallel with the first buffer 320 of the first buffer module 300 in the first direction 12. In the transfer chamber 430, a dispenser robot 432 and a guide rail 433 are positioned. The transfer chamber 430 has a generally rectangular shape. The applicator robot 432 is connected to the bake chambers 420, the resist application chambers 400, the first buffer 320 of the first buffer module 300, and the first buffer module 500 of the second buffer module 500 And transfers the substrate W between the cooling chambers 520. The guide rails 433 are arranged so that their longitudinal directions are parallel to the first direction 12. The guide rails 433 guide the applying robot 432 to move linearly in the first direction 12. The applicator robot 432 has a hand 434, an arm 435, a support 436, and a pedestal 437. The hand 434 is fixed to the arm 435. The arm 435 is provided in a stretchable configuration so that the hand 434 is movable in the horizontal direction. The support 436 is provided so that its longitudinal direction is disposed along the third direction 16. The arm 435 is coupled to the support 436 so as to be linearly movable in the third direction 16 along the support 436. The support 436 is fixedly coupled to the pedestal 437 and the pedestal 437 is coupled to the guide rail 433 so as to be movable along the guide rail 433.
The resist coating chambers 410 all have the same structure. However, the types of the photoresist used in each of the resist coating chambers 410 may be different from each other. As an example, a chemical amplification resist may be used as the photoresist. The resist coating chamber 410 applies a photoresist on the substrate W. [ The resist coating chamber 410 has a housing 411, a support plate 412, and a nozzle 413. The housing 411 has a cup shape with an open top. The support plate 412 is located in the housing 411 and supports the substrate W. [ The support plate 412 is rotatably provided. The nozzle 413 supplies the photoresist onto the substrate W placed on the support plate 412. The nozzle 413 has a circular tube shape and can supply photoresist to the center of the substrate W. [ Alternatively, the nozzle 413 may have a length corresponding to the diameter of the substrate W, and the discharge port of the nozzle 413 may be provided as a slit. In addition, the resist coating chamber 410 may further be provided with a nozzle 414 for supplying a cleaning liquid such as deionized water to clean the surface of the substrate W to which the photoresist is applied.
The bake chamber 420 heat-treats the wafer W. For example, the bake chambers 420 may be formed by a prebake process in which the wafer W is heated to a predetermined temperature to remove organic matter and moisture on the surface of the wafer W before the photoresist is applied, A soft bake process is performed after coating the wafer W on the wafer W, and a cooling process for cooling the wafer W after each heating process is performed. The bake chamber 420 has a cooling plate 421 or a heating plate 422. The cooling plate 421 is provided with a cooling means 423 such as a cooling water or a thermoelectric element. The heating plate 422 is also provided with a heating means 424, such as a hot wire or a thermoelectric element. The cooling plate 421 and the heating plate 422 may be provided in a single bake chamber 420, respectively. Optionally, some of the bake chambers 420 may include only the cooling plate 421, and the other portions may include only the heating plate 422.
The developing module 402 includes a developing process for supplying a developing solution to obtain a pattern on the substrate W to remove a part of the photoresist and a baking process such as heating and cooling performed on the substrate W before and after the developing process . The development module 402 has a development chamber 800, a bake chamber 470, and a transfer chamber 480. [ The development chamber 800, the bake chamber 470, and the transfer chamber 480 are sequentially disposed along the second direction 14. The development chamber 800 and the bake chamber 470 are positioned apart from each other in the second direction 14 with the transfer chamber 480 therebetween. A plurality of developing chambers 800 are provided and a plurality of developing chambers 800 are provided in the first direction 12 and the third direction 16, respectively. In the drawing, an example in which six developing chambers 800 are provided is shown. A plurality of bake chambers 470 are provided in the first direction 12 and the third direction 16, respectively. In the drawing, six bake chambers 470 are provided. Alternatively, however, the bake chamber 470 can be provided in greater numbers.
The transfer chamber 480 is positioned in parallel with the second buffer 330 of the first buffer module 300 in the first direction 12. In the transfer chamber 480, the developing robot 482 and the guide rail 483 are positioned. The delivery chamber 480 has a generally rectangular shape. The development robot 482 is connected to the bake chambers 470, the development chambers 800, the second buffer 330 and the cooling chamber 350 of the first buffer module 300 and the second buffer module 500, And the second cooling chamber 540 of the second cooling chamber 540. The guide rail 483 is arranged such that its longitudinal direction is parallel to the first direction 12. The guide rail 483 guides the developing robot 482 to linearly move in the first direction 12. The developing sub-robot 482 has a hand 484, an arm 485, a supporting stand 486, and a pedestal 487. The hand 484 is fixed to the arm 485. The arm 485 is provided in a stretchable configuration to allow the hand 484 to move in a horizontal direction. The support 486 is provided so that its longitudinal direction is disposed along the third direction 16. The arm 485 is coupled to the support 486 such that it is linearly movable along the support 486 in the third direction 16. The support table 486 is fixedly coupled to the pedestal 487. The pedestal 487 is coupled to the guide rail 483 so as to be movable along the guide rail 483.
The development chambers 800 all have the same structure. However, the types of developers used in the respective developing chambers 800 may be different from each other. The development chamber 800 is provided with an apparatus for developing a substrate. The development chamber 800 removes a region of the photoresist on the substrate W where light is irradiated. At this time, the area of the protective film irradiated with the light is also removed. Depending on the type of selectively used photoresist, only the areas of the photoresist and protective film that are not irradiated with light can be removed. In this embodiment, the development chamber 800 is provided with a substrate processing apparatus 800 for liquid-processing the substrate W. FIG. 7 is a cross-sectional view showing the substrate processing apparatus of FIG. 3, and FIG. 8 is a plan view showing the substrate processing apparatus of FIG. 7 and 8, the substrate processing apparatus 800 includes a processing vessel 820, a substrate supporting unit 810, a lift unit 840, a liquid supply unit 850, and a standby port 900 .
The processing vessel 820 provides a processing space in which a developing process is performed. The processing vessel 820 recovers the liquid used in the developing process. The processing vessel 820 includes a recovery cylinder 822 and a recovery line 830. The recovery cylinder 822 includes a vertical wall 824, a bottom wall 826, and an inclined wall 828. The vertical wall 824 is provided to have an annular ring shape surrounding the substrate support unit 810. The vertical wall 824 is provided to have a diameter that is spaced apart from the substrate support unit 810. The vertical wall 824 is positioned so that its central axis coincides with the substrate support unit 810. The bottom wall 826 extends from the lower end of the vertical wall 824. The bottom wall 826 is provided so as to face in the horizontal direction toward the central axis of the substrate supporting unit 810. The slanted wall 828 extends from the top of the vertical wall 824. The inclined wall 828 is provided so as to face upwardly inclined as it approaches the central axis of the substrate supporting unit 810. [ Alternatively, the inclined wall 828 may be provided to face in the horizontal direction.
The recovery line 830 discharges the liquid recovered to the processing space to the outside. The recovery line 830 is connected to the bottom wall 826. The discharged liquid may be provided to the external regeneration system through the recovery line 830. [
The substrate support unit 810 supports and rotates the substrate W in the process space. The substrate supporting unit 810 includes a substrate supporting member 811 and rotation driving members 814 and 815. The substrate supporting member 811 supports the substrate. The substrate support member 811 includes a support plate 812 and a pin member 813. The support plate 812 is provided to have a circular plate shape. On the upper surface of the support plate 812, pin members 812 for supporting the substrate W are coupled. A part of the pin member 812 supports the bottom surface of the substrate W and the other part 812 supports the side surface of the substrate W. [
The rotation drive members 814 and 815 rotate the substrate support member 811. The rotation drive members 814 and 815 include a rotation shaft 814 and a driver 815. The rotary shaft 814 is provided so as to have a tubular shape whose longitudinal direction faces up and down. The rotary shaft 814 is coupled to the bottom surface of the support plate 813. The driver 815 transmits the rotational force to the rotating shaft 814. The rotary shaft 814 is rotatable about the central axis by the rotational force provided from the driver 815. [ The support plate 812 is rotatable together with the rotation shaft 814. The rotating speed of the rotating shaft 814 is adjusted by a driving unit 815 so that the rotating speed of the substrate W can be adjusted. For example, the driver 815 may be a motor.
The lift unit 840 adjusts the relative height between the processing container 820 and the substrate supporting unit 810. The elevating unit 840 moves the processing vessel 820 in the vertical direction. The lifting unit 840 includes a bracket 842, a moving shaft 844, and a driver 846. The bracket 842 connects the processing vessel 820 and the moving shaft 844. The bracket 842 is fixed to the vertical wall 822 of the processing vessel 820. The moving shaft 844 is provided such that its longitudinal direction is directed up and down. The upper end of the moving shaft 844 is fixedly coupled to the bracket 842. The moving shaft 844 is moved up and down by the actuator 846 and the processing vessel 820 is movable up and down together with the moving shaft 844. [ For example, the actuator 846 may be a cylinder or a motor.
The liquid supply unit 850 supplies the prewetting liquid and the processing liquid onto the substrate W supported by the substrate holding unit 810. [ The liquid supply unit 850 includes a moving member 860 and a nozzle member 870. The moving member 860 linearly moves the nozzle member 870 in one direction. According to one example, the moving member 860 can linearly move the nozzle member 870 in the first direction 12. The moving member 860 moves the nozzle member 870 to the process position and the standby position. Where the process position is that the nozzle member 870 is opposed to the substrate W supported on the substrate support unit 810 and the standby position is a position out of the process position. According to one example, the standby position may be a position where the nozzle member stands by at the standby port. The movable member 860 includes a guide rail 862 and a support arm 864. The guide rails 862 are located on one side of the processing vessel. The guide rail 862 is provided so as to have a longitudinal direction parallel to the moving direction of the nozzle member 870. [ For example, the longitudinal direction of the guide rail 862 may be provided so as to face the first direction 12. Supporting arm 864 supports nozzle member 870. The support arm 864 is provided to have a bar shape. The support arms 864 are provided so as to have a longitudinal direction perpendicular to the guide rails 862 when viewed from above. for example. The longitudinal direction of the support arm 864 may be provided to face the second direction 14. A nozzle member 870 is coupled to one end of the support arm 864. The other end of the support arm 864 is provided on the guide rail 862. The support arm 864 and the nozzle member 870 are movable together along the longitudinal direction of the guide rail 862. [
The nozzle member 870 discharges various kinds of liquid. FIG. 9 is a perspective view showing the nozzle member of FIG. 7; FIG. 9, the nozzle member 870 includes a support body 872, a free nozzle 874, a stream nozzle 876, and a process nozzle 878. The support body 872 supports the free nozzle 874, the stream nozzle 876, and the treatment nozzle 878. The support body 872 is fixedly coupled to the bottom surface of one end of the support arm 864. A free nozzle 874, a stream nozzle 876, and a treatment nozzle 878 are fixedly coupled to the bottom surface of the support body 872, respectively.
The stream nozzle 876 discharges the processing liquid. The stream nozzle 876 has a circular stream outlet. The stream discharge port is provided so as to face in the vertical downward direction. For example, the treatment liquid may be a developer.
The treatment nozzle 878 discharges the treatment liquid in a liquid curtain manner. A treatment nozzle 878 is located at one side of the stream nozzle 876. The process nozzle 878 is positioned opposite the stream nozzle 876. The processing nozzle 878 and the stream nozzle 876 may be arranged along the second direction 14 when viewed from above. The discharge port of the treatment nozzle 878 is provided so as to face downwardly inclined direction. The discharge port of the treatment nozzle 878 may be provided as a slit discharge port having a slit shape. The slit discharge port has a longitudinal direction parallel to the guide rail 862. The slit discharge port may have a longitudinal direction toward the first direction (12). The slit discharge port is provided so as to have a length shorter than the radius of the substrate (W). According to one example, the slit discharge port may be provided so as to be directed downwardly inclined as it approaches the stream nozzle 876 at the processing nozzle 878. [ The treatment nozzle 878 may have a downwardly sloping slit discharge port so as to discharge the liquid at the same point as the stream nozzle 876. [ The slit discharge port of the treatment nozzle 878 may be positioned below the discharge port of the stream nozzle 876. [
The free nozzle 874 discharges the prewetting liquid in a streaming manner. A free nozzle 874 is positioned adjacent to the stream nozzle 876 and process nozzle 878. The free nozzle 874 and the stream nozzle 876 may be arranged along the first direction 12 when viewed from above. The free nozzle 874 has a circular stream outlet. The stream discharge port is provided so as to face in the vertical downward direction. The prewetting solution may be pure water (DIW).
The standby port 900 provides a space for the nozzles to wait. 10 is a cross-sectional view showing the standby port of FIG. 10, the standby port 900 includes a housing 910 discharge line 920, an airflow forming member 940, and a lower block 960. The housing 910 has a cylindrical shape with its top opened. An air space is formed inside the housing 910. The upper region of the atmosphere space is a nozzle accommodation space 912 in which the nozzle members 870 and 870 are waiting, and the lower region is provided in the liquid accommodation space 916 in which the liquid is received. For example, the housing 910 may be provided in a rectangular parallelepiped shape. On one side wall of the housing 910, an airflow supply port 922 is formed. The airflow supply port 922 is located at a height corresponding to the nozzle accommodating space 912. For example, the airflow supply port 922 may be provided in a slit shape. The liquid receiving space 916 is formed by the side surface and the bottom surface of the housing 910. The bottom surface of the housing 910 is provided with a downward inclination toward the center axis. A discharge port 918 is formed in the center of the bottom surface of the housing 910. The discharge port 918 is formed to be directed downward from the bottom surface. An outlet line 920 is connected to the outlet 918. The treatment liquid contained in the liquid accommodation space 916 may have a flow toward the center of the bottom surface. The processing liquid contained in the liquid accommodation space 916 is discharged to the outside through the discharge port 918 and the discharge line 920.
The airflow forming member 940 forms a shutoff airflow in the atmosphere space. The airflow forming member 940 forms a shutoff air flow in the nozzle accommodating space 912. The shutoff airflow prevents the process liquid discharged into the atmosphere space from being scattered to the outside through the open top of the housing 910. Also, the shutoff air flow prevents the treatment liquid discharged into the atmospheric space from scattering and contaminating the nozzle. The airflow forming member 940 includes an airflow supply line 942, a blocking block 960, and a pressure reducing member 944.
The airflow supply line 942 supplies airflow to the airflow supply port 922. The airflow supply line 942 is connected to the airflow supply port 922. The airflow is supplied to the atmosphere space through the airflow supply line 942 and the airflow supply port 922 sequentially. For example, the air flow may be air or an inert gas.
The blocking block 960 is located within the housing 910 at a height corresponding to the nozzle receiving space 912. A suction port 952 is formed on one side of the blocking block 960. The suction port 952 is depressurized by the pressure-reducing member 944. One side of the blocking block 960 in which the suction port 952 is formed is positioned to face one side wall of the housing 910 in which the airflow supply port 922 is formed. The blocking block 960 is fixedly coupled to the other side wall facing the one side wall of the housing 910. According to one example, the suction port 952 and the airflow inlet 922 can be positioned to face each other. Accordingly, a blocking air flow directed in the horizontal direction can be formed in the nozzle accommodating space 912. One side of the blocking block 960 may be provided on the side connecting the upper surface and the lower surface of the blocking block 960. One side of the blocking block 960 may be provided facing downwardly inclined. The upper surface of the blocking block 960 may be provided larger than the bottom surface. Therefore, the horizontal cross-sectional area of the blocking block 960 may become smaller as it goes down.
Further, when the processing nozzle 878 is positioned in the nozzle accommodating space 912, the slit discharge port may be positioned so as to face downwardly inclined as it approaches the blocking block 960. The angular difference between the flow direction of the shutoff airflow and the discharge direction of the treatment liquid can be reduced. Further, the treatment nozzle 878 can be positioned such that the slit discharge port is higher than the airflow supply port 922 and the suction port 952.
Also, the suction port 952 may be provided in a slit shape. The slit discharge port, the airflow supply port 922, and the suction port 952 may be provided so as to face in parallel longitudinal directions. Alternatively, the airflow inlet 922 or the suction port 952 may be provided so that a plurality of holes are arranged in one direction. Thus, a part of the nozzle accommodating space 912 is blocked by the blocking block 960, and the other part is blocked by the blocking airflow.
A vertical hole 956 is further formed in the blocking block 960. The vertical holes 956 are provided as openings penetrating the top and bottom of the blocking block 960. The vertical hole 956 is provided as an opening through which the liquid discharged from the stream nozzle and the free nozzle passes. The liquid discharged from the stream nozzle 876 and the free nozzle 874 can be received in the liquid accommodation space 916 through the vertical hole 956. [ The vertical hole 956 may communicate with the suction port 952.
The lower block 960 is located in the inner space of the housing 910. The lower block 960 forms a connection passage 914 connecting the nozzle accommodation space 912 and the liquid accommodation space 916. The lower block 960 is positioned below the nozzle accommodating space 912. [ The lower block 960 is positioned lower than the blocking block 960. The lower block 960 is vertically opposed to the nozzle member 870 located in the nozzle accommodating space 912. The lower block 960 is fixedly coupled to one side wall of the housing 910. One surface of the lower block 960 may be provided as a side surface connecting the upper surface and the lower surface. One side of the lower block 960 may be provided to face upward. The upper surface of the lower block 960 may be provided smaller than the lower surface. Therefore, the horizontal cross-sectional area of the lower block 960 may become larger as it goes down. Accordingly, the treatment liquid discharged from the treatment nozzle 878 may be supplied to the liquid accommodation space 916 through one surface of the upper block and one surface of the lower block 960.
The airflow supply port 922 and the suction port 952 are formed to face each other at a height corresponding to the nozzle accommodating space 912. [ However, the suction port 952 may be provided to face the other direction. 11, the suction port 952 may be formed on the bottom surface of the blocking block 960. The suction port 952 may be provided so as to face downward. At this time, the slit discharge port of the processing nozzle 878 located in the nozzle accommodating space 912 may be positioned lower than the bottom surface of the blocking block 960.
2 to 5, the bake chamber 470 of the developing module 402 heat-treats the substrate W. For example, the bake chamber 470 may include a post bake process for heating the substrate W before the development process is performed, a hard bake process for heating the substrate W after the development process is performed, A cooling step for cooling the substrate W, and the like. The bake chamber 470 has a cooling plate 471 or a heating plate 472. The cooling plate 471 is provided with a cooling means 473 such as a cooling water or a thermoelectric element. Or the heating plate 472 is provided with a heating means 474 such as a hot wire or a thermoelectric element. The cooling plate 471 and the heating plate 472 may be provided in one bake chamber 470, respectively. Optionally, some of the bake chambers 470 may have only a cooling plate 471, while the other may have only a heating plate 472. [
As described above, in the application and development module 400, the application module 401 and the development module 402 are provided to be separated from each other. In addition, the application module 401 and the development module 402 may have the same chamber arrangement as viewed from above.
The second buffer module 500 is provided as a path through which the substrate W is transferred between the coating and developing module 400 and the pre- and post-exposure processing module 600. The second buffer module 500 performs a predetermined process on the substrate W such as a cooling process or an edge exposure process. The second buffer module 500 includes a frame 510, a buffer 520, a first cooling chamber 530, a second cooling chamber 540, an edge exposure chamber 550, and a second buffer robot 560 I have. The frame 510 has a rectangular parallelepiped shape. The buffer 520, the first cooling chamber 530, the second cooling chamber 540, the edge exposure chamber 550, and the second buffer robot 560 are located within the frame 510. The buffer 520, the first cooling chamber 530, and the edge exposure chamber 550 are disposed at a height corresponding to the application module 401. The second cooling chamber 540 is disposed at a height corresponding to the development module 402. The buffer 520, the first cooling chamber 530, and the second cooling chamber 540 are sequentially arranged in a row along the third direction 16. The buffer 520 is disposed along the first direction 12 with the transfer chamber 430 of the application module 401. [ The edge exposure chamber 550 is spaced a certain distance in the second direction 14 from the buffer 520 or the first cooling chamber 530.
The second buffer robot 560 carries the substrate W between the buffer 520, the first cooling chamber 530, and the edge exposure chamber 550. A second buffer robot 560 is positioned between the edge exposure chamber 550 and the buffer 520. The second buffer robot 560 may be provided in a structure similar to that of the first buffer robot 360. The first cooling chamber 530 and the edge exposure chamber 550 perform a subsequent process on the substrates W that have been processed in the application module 401. The first cooling chamber 530 cools the substrate W processed in the application module 401. The first cooling chamber 530 has a structure similar to the cooling chamber 350 of the first buffer module 300. The edge exposure chamber 550 exposes its edge to the substrates W that have undergone the cooling process in the first cooling chamber 530. [ The buffer 520 temporarily stores the substrate W before the substrates W processed in the edge exposure chamber 550 are transported to a preprocessing module 601 described later. The second cooling chamber 540 cools the substrates W before the processed substrates W are transferred to the developing module 402 in the post-processing module 602 described later. The second buffer module 500 may further have a buffer added to the height corresponding to the development module 402. In this case, the substrates W processed in the post-processing module 602 may be temporarily stored in the added buffer and then conveyed to the developing module 402.
The pre- and post-exposure processing module 600 may process a process of applying a protective film for protecting the photoresist film applied to the substrate W during liquid immersion exposure, when the exposure apparatus 900 performs the liquid immersion exposure process. In addition, the pre- and post-exposure processing module 600 may perform a process of cleaning the substrate W after exposure. In addition, when the coating process is performed using the chemically amplified resist, the pre- and post-exposure processing module 600 can process the post-exposure bake process.
The pre-exposure post-processing module 600 has a pre-processing module 601 and a post-processing module 602. The pre-processing module 601 performs a process of processing the substrate W before the exposure process, and the post-process module 602 performs a process of processing the substrate W after the exposure process. The pre-processing module 601 and the post-processing module 602 are arranged so as to be partitioned into layers with respect to each other. According to one example, the preprocessing module 601 is located on top of the post-processing module 602. The preprocessing module 601 is provided at the same height as the application module 401. The post-processing module 602 is provided at the same height as the developing module 402. The pretreatment module 601 has a protective film application chamber 610, a bake chamber 620, and a transfer chamber 630. The protective film application chamber 610, the transfer chamber 630, and the bake chamber 620 are sequentially disposed along the second direction 14. The protective film application chamber 610 and the bake chamber 620 are positioned apart from each other in the second direction 14 with the transfer chamber 630 therebetween. A plurality of protective film application chambers 610 are provided and are arranged along the third direction 16 to form layers. Alternatively, a plurality of protective film application chambers 610 may be provided in the first direction 12 and the third direction 16, respectively. A plurality of bake chambers 620 are provided and are disposed along the third direction 16 to form layers. Alternatively, a plurality of bake chambers 620 may be provided in the first direction 12 and the third direction 16, respectively.
The transfer chamber 630 is positioned in parallel with the first cooling chamber 530 of the second buffer module 500 in the first direction 12. In the transfer chamber 630, a pre-processing robot 632 is located. The transfer chamber 630 has a generally square or rectangular shape. The preprocessing robot 632 is connected between the protective film application chambers 610, the bake chambers 620, the buffer 520 of the second buffer module 500 and the first buffer 720 of the interface module 700, The substrate W is transferred. The preprocessing robot 632 has a hand 633, an arm 634, and a support 635. The hand 633 is fixed to the arm 634. The arm 634 is provided with a retractable structure and a rotatable structure. The arm 634 is coupled to the support 635 so as to be linearly movable along the support 635 in the third direction 16.
The protective film applying chamber 610 applies a protective film for protecting the resist film on the substrate W during liquid immersion exposure. The protective film application chamber 610 has a housing 611, a support plate 612, and a nozzle 613. The housing 611 has a cup shape with its top opened. The support plate 612 is located in the housing 611 and supports the substrate W. [ The support plate 612 is rotatably provided. The nozzle 613 supplies a protective liquid for forming a protective film onto the substrate W placed on the supporting plate 612. The nozzle 613 has a circular tube shape and can supply the protective liquid to the center of the substrate W. [ Alternatively, the nozzle 613 may have a length corresponding to the diameter of the substrate W, and the discharge port of the nozzle 613 may be provided with a slit. In this case, the support plate 612 may be provided in a fixed state. The protective liquid includes a foamable material. The protective liquid may be a photoresist and a material having a low affinity for water. For example, the protective liquid may contain a fluorine-based solvent. The protective film application chamber 610 supplies the protective liquid to the central region of the substrate W while rotating the substrate W placed on the support plate 612.
The bake chamber 620 heat-treats the substrate W coated with the protective film. The bake chamber 620 has a cooling plate 621 or a heating plate 622. The cooling plate 621 is provided with a cooling means 623 such as a cooling water or a thermoelectric element. Or heating plate 622 is provided with a heating means 624, such as a hot wire or a thermoelectric element. The heating plate 622 and the cooling plate 621 may be provided in a single bake chamber 620, respectively. Optionally, some of the bake chambers 620 may have only the heating plate 622, while others may only have the cooling plate 621.
The post-processing module 602 has a cleaning chamber 660, a post-exposure bake chamber 670, and a delivery chamber 680. The cleaning chamber 660, the transfer chamber 680, and the post-exposure bake chamber 670 are sequentially disposed along the second direction 14. Accordingly, the cleaning chamber 660 and the post-exposure baking chamber 670 are positioned apart from each other in the second direction 14 with the transfer chamber 680 therebetween. A plurality of cleaning chambers 660 are provided and may be disposed along the third direction 16 to form layers. Alternatively, a plurality of cleaning chambers 660 may be provided in the first direction 12 and the third direction 16, respectively. A plurality of post-exposure bake chambers 670 are provided and may be disposed along the third direction 16 to form layers. Alternatively, a plurality of post-exposure bake chambers 670 may be provided in the first direction 12 and the third direction 16, respectively.
The transfer chamber 680 is positioned in parallel with the second cooling chamber 540 of the second buffer module 500 in the first direction 12 as viewed from above. The transfer chamber 680 has a generally square or rectangular shape. A post processing robot 682 is located in the transfer chamber 680. The post-processing robot 682 is connected to the cleaning chambers 660, post-exposure bake chambers 670, the second cooling chamber 540 of the second buffer module 500, and the second And transfers the substrate W between the buffers 730. The postprocessing robot 682 provided in the postprocessing module 602 may be provided with the same structure as the preprocessing robot 632 provided in the preprocessing module 601. [
The cleaning chamber 660 cleans the substrate W after the exposure process. The cleaning chamber 660 has a housing 661, a support plate 662, and a nozzle 663. The housing 661 has a cup shape with an open top. The support plate 662 is located in the housing 661 and supports the substrate W. [ The support plate 662 is rotatably provided. The nozzle 663 supplies the cleaning liquid onto the substrate W placed on the support plate 662. As the cleaning liquid, water such as deionized water may be used. The cleaning chamber 660 supplies the cleaning liquid to the central region of the substrate W while rotating the substrate W placed on the support plate 662. Optionally, while the substrate W is rotating, the nozzle 663 may move linearly or rotationally from the central region of the substrate W to the edge region.
The post-exposure bake chamber 670 heats the substrate W subjected to the exposure process using deep UV light. The post-exposure baking step heats the substrate W and amplifies the acid generated in the photoresist by exposure to complete the property change of the photoresist. The post-exposure bake chamber 670 has a heating plate 672. The heating plate 672 is provided with a heating means 674 such as a hot wire or a thermoelectric element. The post-exposure bake chamber 670 may further include a cooling plate 671 therein. The cooling plate 671 is provided with a cooling means 673 such as a cooling water or a thermoelectric element. Further, a bake chamber having only the cooling plate 671 may be further provided.
As described above, the pre-processing module 601 and the post-processing module 602 in the pre-exposure processing module 600 are provided to be completely separated from each other. The transfer chamber 630 of the preprocessing module 601 and the transfer chamber 680 of the postprocessing module 602 are provided in the same size and can be provided so as to completely overlap each other when viewed from above. Further, the protective film application chamber 610 and the cleaning chamber 660 may be provided to have the same size as each other and be provided so as to completely overlap with each other when viewed from above. Further, the bake chamber 620 and the post-exposure bake chamber 670 are provided in the same size, and can be provided so as to completely overlap each other when viewed from above.
The interface module 700 transfers the substrate W between the exposure pre- and post-processing module 600 and the exposure apparatus 900. The interface module 700 has a frame 710, a first buffer 720, a second buffer 730, and an interface robot 740. The first buffer 720, the second buffer 730, and the interface robot 740 are located within the frame 710. The first buffer 720 and the second buffer 730 are spaced apart from each other by a predetermined distance and are stacked on each other. The first buffer 720 is disposed higher than the second buffer 730. The first buffer 720 is positioned at a height corresponding to the preprocessing module 601 and the second buffer 730 is positioned at a height corresponding to the postprocessing module 602. The first buffer 720 is arranged in a line along the first direction 12 with the transfer chamber 630 of the preprocessing module 601 while the second buffer 730 is arranged in the postprocessing module 602, Are arranged in a line along the first direction 12 with the transfer chamber 630 of the transfer chamber 630. [
The interface robot 740 is spaced apart from the first buffer 720 and the second buffer 730 in the second direction 14. The interface robot 740 carries the substrate W between the first buffer 720, the second buffer 730 and the exposure apparatus 900. The interface robot 740 has a structure substantially similar to that of the second buffer robot 560.
The first buffer 720 temporarily stores the substrates W processed in the preprocessing module 601 before they are transferred to the exposure apparatus 900. The second buffer 730 temporarily stores the processed substrates W in the exposure apparatus 900 before they are transferred to the post-processing module 602. The first buffer 720 has a housing 721 and a plurality of supports 722. The supports 722 are disposed within the housing 721 and are provided spaced apart from each other in the third direction 16. One substrate W is placed on each support 722. The housing 721 is movable in the direction in which the interface robot 740 is provided and in the direction in which the interface robot 740 and the preprocessing robot 632 transfer the substrate W to and from the support table 722, 632 are provided with openings (not shown) in the direction in which they are provided. The second buffer 730 has a structure substantially similar to that of the first buffer 720. However, the housing 731 of the second buffer 730 has an opening (not shown) in the direction in which the interface robot 740 is provided and in a direction in which the postprocessing robot 682 is provided. Only the buffers and robots can be provided as described above without providing a chamber for performing a predetermined process on the substrate W in the interface module.
