TW201825164A - Apparatus for supplying treatment liquid - Google Patents

Abstract

Provided is a processing liquid supplying apparatus which particles in the processing liquid can be appropriately removed by a filter without depending on a positional relationship of each part in the apparatus, piping, installation conditions, and the like. A resist liquid supplying apparatus (200), providing an application nozzle (142) with resist liquid, comprises: a buffer tank (202) for temporarily storing a processing liquid supplied from a resist liquid supply source (201) for storing the resist liquid; a filter (212) provided between the application nozzle (142) and the buffer tank (202) for removing foreign substances in the resist liquid; and a pump (211) for sending the resist liquid from which the foreign substance has been removed by the filter (212) to the application nozzle (142). The buffer tank (202) has a press-feeding function for press-feeding the resist liquid stored in the buffer tank (202).

Description

Treatment liquid supply device

[0001] The present invention relates to a processing liquid supply device that supplies a processing liquid such as a photoresist liquid to a subject through a processing liquid discharge unit.

[0002] In the photolithography process in the manufacturing process of semiconductor devices, in order to form a coating film such as an antireflection film or a photoresist film on a processing object such as a semiconductor wafer, or a photoresist after development exposure For the film, use a processing solution such as a photoresist solution or a developing solution. [0003] Foreign matter (fine particles) may be contained in the treatment liquid. In addition, even if the original processing liquid does not contain particles, the particles may be mixed in the supplied processing liquid when the particles are attached to a system path such as a pump, a valve, or a pipe of a device for supplying the processing liquid. Therefore, a filter is provided in a system path of a device for supplying a treatment liquid, and particulates are removed by the filter (Patent Document 1). In addition, in the treatment liquid supply device of Patent Document 1, in order to prevent the operation of the device from being stopped when the photoresist liquid supply source storing the treatment liquid is exchanged, a temporary is provided between the photoresist liquid supply source and the filter. Buffer tank for storage of treatment solution. [Prior Art Document] [Patent Document] [0004] [Patent Document 1] Japanese Patent Laid-Open No. 2013-211525

[Problems to be Solved by the Invention] 000 [0005] Although a filter can be used to collect / remove particles in the processing liquid like the treatment liquid supply device of Patent Document 1, the supplement efficiency of the particles in the filter depends on the filtration The hydraulic pressure changes when the device passes. However, the hydraulic pressure of the processing liquid when the filter passes may not be the expected hydraulic pressure due to the positional relationship between the buffer tank and the filter, or the piping between the two. Furthermore, even when the processing liquid supply device is installed on a high ground, for example, the hydraulic pressure of the processing liquid when the filter passes may not be able to obtain the expected hydraulic pressure. [0006] The present invention has been made in view of such a situation, and an object thereof is to provide a processing liquid that can appropriately remove particles in the processing liquid by a filter regardless of the positional relationship of each part in the device, piping, arrangement conditions, etc. Supply device. [Means to Solve the Problem] [0007] In order to achieve the above object, the present invention is a processing liquid supply device that supplies a processing liquid to a processing liquid discharge portion that discharges a processing liquid to a subject, and the processing liquid supply device It is characterized by comprising: a temporary storage device that temporarily stores a processing liquid supplied from a processing liquid supply source that stores the processing liquid; and a filter that removes foreign substances from the processing liquid from the temporary storage device; and The pump is configured to send the processing liquid from which the foreign matter is removed by the filter to the processing liquid discharge portion, and the temporary storage device has a pressure feeding function of pressure-feeding the processing liquid stored in the temporary storage device. [0008] It is preferable to include a pressure measuring device and a control device, which is disposed further downstream than the temporary storage device and measures the hydraulic pressure of the processing liquid; the control device is based on the measurement result of the pressure measuring device , At least control the pressure feed of the processing liquid from the temporary storage device. [0009] The pressure measuring device measures the hydraulic pressure on the secondary side of the filter, and the control device controls the hydraulic pressure on the pressure feed when the hydraulic pressure on the secondary side of the filter becomes constant. [0010] The pressure measuring device measures the hydraulic pressure on the secondary side of the filter, and the control device applies a specific pressure to the temporary storage device when the hydraulic pressure on the secondary side of the filter is within a specific range. It is also possible to pressure-feed the processing liquid. [0011] Even if the pressure measuring device measures the hydraulic pressure on the primary side of the filter, the control device may control the hydraulic pressure on the primary side of the filter to be constant, and may control the hydraulic pressure during the pressure feeding. [0012] a plurality of sets of the temporary storage device, the filter, and the pump, and the control device includes electric motor-driven air in a storage room for adjusting the storage solution of the temporary storage device, which is provided for the temporary storage device; The regulator is better. [0013] The temporary storage device may be configured by a tubular diaphragm pump. [0014] The plurality of temporary storage devices, the filter, and the pump are provided, and the temporary storage devices each include a storage device for storing a processing liquid in different individuals, and another pump for pressure-feeding the processing liquid in the storage device. A common electric air conditioner is provided, which adjusts the hydraulic pressure in the storage chamber of the additional pump to store the processing liquid and pressure-feeds the processing from the temporary storage device. The control of the hydraulic pressure at the time of liquid may be performed by the electric air conditioner described above. [0015] The above-mentioned additional pump may be constituted by a tubular diaphragm pump. [0016] The pump system is preferably configured such that when the processing liquid from which the foreign matter is removed by the filter is sent to the processing liquid discharge section, the pump is sent again through the filter. [0017] The processing liquid supply pipe having the temporary storage device, the filter, and the pump sequentially provided from the upstream side, the pump has a storage chamber for storing the processing liquid, and the processing liquid supply pipe is connected to the temporary storage A valve is provided between the device and the filter, and another valve is provided between the temporary storage device and the filter. The control device is configured to supply the processing liquid for removing foreign matter through the filter to the pump from the temporary storage device. At the time of Urano's storage room, in a state where the one valve is opened and the other valves are closed, the pressure from the secondary side of the filter measured by the pressure measuring device becomes a specific value, and control from the temporary After the pressure of the processing liquid of the storage device is closed, the above valve is closed and the other valves are opened, and the pressure on the secondary side of the filter measured by the pressure measuring device is controlled to become the above-mentioned specific value. After the pressure in the storage chamber, it is better to start the replenishment in a state where the one valve and the other valves are opened. [Effects of the Invention] [0018] When the processing liquid supply device of the present invention is used, the particles in the processing liquid can be appropriately removed by a filter regardless of the positional relationship of each part in the device, piping, and arrangement conditions.

[0020] (First Embodiment) The following, An embodiment of the present invention will be described. FIG. 1 is an explanatory diagram showing a schematic configuration of a substrate processing system 1 equipped with a photoresist liquid supply device as a processing liquid supply device according to a first embodiment of the present invention. 2 and 3 are a front view and a rear view, respectively, schematically showing the internal configuration of the substrate processing system 1. In addition, In this manual and drawings, For elements that have substantially the same functional composition, By assigning the same symbol, Duplicate description is omitted.  [0021] The substrate processing system 1 is as shown in FIG. 1, A cassette station 10 having an integral connection for loading and unloading a cassette C containing a plurality of wafers W, And a processing station 11 having a plurality of various processing devices for applying a specific process to the wafer W, An interface station 13 configured to receive and transmit wafers W between an exposure device 12 adjacent to the processing station 11.  [0022] A cassette mounting station 20 is provided in the cassette station 10. A plurality of cassette loading stations 20 are provided at the time of loading and unloading cassettes C into and out of the substrate processing system 1. The cassette mounting plate 21 on which the cassette C is mounted.  [0023] As shown in FIG. 1, the cassette station 10 is provided with a wafer transfer device 23 that can move freely on the transfer path 20 extending in the X direction. The wafer transfer device 23 also moves freely in the vertical direction and around the vertical axis (the θ direction). The wafer W can be transferred between the cassette C on each cassette mounting plate 21 and the receiving device in the third block G3 of the processing station 11 described later.  [0024] The processing station 11 is provided with a plurality of devices having various devices, for example, four blocks G1, G2 G3, G4. E.g, A first block G1 is provided on the front side of the processing station 11 (the negative direction side in the X direction in FIG. 1), A second block G2 is provided on the back side of the processing station 11 (the positive direction side in the X direction in FIG. 1). Furthermore, A third block G3 is provided on the cassette station 10 side of the processing station 11 (the negative direction side in the Y direction in FIG. 1), A fourth block G4 is provided on the interface station 13 side of the processing station 11 (the positive direction side in the Y direction in FIG. 1).  [0025] For example, in the first block G1, As shown in Figure 2, Multiple liquid processing devices are sequentially arranged from below, For example, a developing device 30 that performs a developing process on the wafer W, An anti-reflection film is formed below the photoresist film on the wafer W (hereinafter, (Called "lower reflection preventing film") lower reflection preventing film forming device 31, Photoresist coating device 32 for applying a photoresist liquid to wafer W to form a photoresist film, An antireflection film is formed on the photoresist film of the wafer W (hereinafter, It is referred to as an "upper reflection preventing film") and an upper reflection preventing film forming device 33.  [0026] For example, Development processing device 30, Lower reflection preventing film forming device 31, Photoresist coating device 32, Each of the upper anti-reflection film forming devices 33 is arranged in an array in the horizontal direction. In addition, The development processing devices 30, Lower reflection preventing film forming device 31, Photoresist coating device 32, The number or arrangement of the upper reflection preventing film forming devices 33 can be arbitrarily selected.  [0027] In these development processing devices 30, Lower reflection preventing film forming device 31, Photoresist coating device 32, In a liquid processing device such as the upper reflection preventing film forming device 33, For example, spin coating is performed by applying a specific processing liquid on the wafer W. In spin coating, The processing liquid is discharged from, for example, a coating nozzle onto the wafer W, At the same time, the wafer W is rotated, The processing liquid is diffused on the surface of the wafer W.  [0028] For example, In block 2 G2, As shown in Figure 3, A heat treatment device 40 for performing heat treatment such as heating or cooling of the wafer W is arranged in an up-down direction and a horizontal direction. Or an attachment device 41 for improving the fixity of the photoresist liquid and the wafer W, A peripheral exposure device 42 for exposing the outer periphery of the wafer W. Even for these heat treatment devices 40, The number or arrangement of the attachment device 41 and the peripheral exposure device 42, You can also choose arbitrarily.  [0029] For example, in the third block G3, A plurality of receiving devices 50 are sequentially provided from below, 51, 52, 53, 54, 55, 56. Furthermore, In block 4 G4, A plurality of receiving devices 60 are provided in order from below, 61, 62.  [0030] As shown in Figure 1, In the area included in the first block G1 to the fourth block G4, A wafer transfer area D is formed. In wafer transfer area D, The configuration plural has, for example, the Y direction, X direction, Wafer transfer device 70 with a transfer arm 70a that can move freely in the θ direction and the vertical direction. The wafer transfer device 70 moves in the wafer transfer area D, The wafer W can be transferred to the surrounding first block G1. Block 2 G2 Specific devices in the third block G3 and the fourth block G4.  [0031] Furthermore, The wafer transfer area D is provided with a shuttle transfer device 80 that linearly transfers the wafer W between the third block G3 and the fourth block G4.  [0032] The shuttle conveying device 80 moves linearly in the Y direction in FIG. 3, for example. The shuttle conveying device 80 moves in the Y direction while supporting the wafer W. The wafer W can be transferred between the receiving device 52 in the third block G3 and the receiving device 62 in the fourth block G4.  [0033] As shown in FIG. 1, A wafer transfer device 100 is provided beside the X-direction positive side of the third block G3. The wafer transfer apparatus 100 has, for example, a Y-direction, A transfer arm that can move freely in the θ and up and down directions. The wafer transfer device 100 moves up and down while supporting the wafer W. The wafer W can be transferred to each receiving device in the third block G3.  [0034] The interface station 13 is provided with a wafer transfer device 110 and a receiving device 111. The wafer transfer device 110 has, for example, a Y-direction, The transfer arm 110a can move freely in the θ direction and the vertical direction. The wafer transfer device 110 can support the wafer W on, for example, a transfer robot arm 110a. And each receiving device in the fourth block G4, The wafer W is transferred between the receiving and receiving device 111 and the exposure device 12.  [0035] Next, The configuration of the photoresist coating device 32 will be described. FIG. 4 is a longitudinal cross-sectional view showing a schematic configuration of the photoresist coating device 32, FIG. 5 is a schematic cross-sectional view showing the configuration of the photoresist coating device 32.  [0036] The photoresist coating device 32 is as shown in FIG. 4, There is a processing container 120 capable of closing the inside. On the side of the processing container 120, As shown in Figure 5, The wafer W is carried in and out 121, At the entrance 121, A switch gate 122 is provided.  [0037] In the center of the processing container 120, As shown in FIG. 4, a rotation jig 130 that holds the wafer W and rotates is provided. The rotating fixture 130 has a horizontal top, A suction port (not shown) for suctioning the wafer W is provided on the upper surface. With the attraction from that mouth, The wafer W can be suction-held on the rotating jig 130.  [0038] The rotary jig 130 includes a jig driving mechanism 131 including, for example, a motor, The clamp driving mechanism 131 can rotate at a specific speed. Furthermore, A lifting driving source such as a cylinder is provided in the jig driving mechanism 131, The rotary jig 130 can move up and down.  [0039] Around the rotating fixture 130, Set access, The cup body 132 of the liquid scattered or dropped from the wafer W is recovered. Under the cup body 132, Connected to a discharge pipe 133 for discharging the recovered liquid, And an exhaust pipe 134 for exhausting the atmosphere in the cup body 132.  [0040] As shown in FIG. 5, On the side of the cup body 132 in the negative X direction (lower direction in FIG. 5), A rail 140 extending along the Y direction (the left-right direction in FIG. 5) is formed. The track 140 is formed, for example, from the side of the negative Y direction (left direction in FIG. 5) side of the cup body 132 to the side of the positive Y direction (right direction in FIG. 5) side. A robot arm 141 is attached to the rail 140.  [0041] As shown in FIG. 4 and FIG. 5, the robotic arm 141 supports the coating nozzle 142 that discharges the photoresist solution. The robot arm 141 is provided with a nozzle driving unit 143 shown in FIG. 5. Freely move on the track 140. Based on this, The coating nozzle 142 may be provided from the standby portion 144 located outside the Y-direction positive direction side of the cup body 132, Move over the center of the wafer W in the cup 132, And it can move on the surface of the wafer W in the radial direction of the wafer W. Furthermore, The robot arm 141 is lifted and lowered freely by the nozzle driving part 143, The height of the coating nozzle 142 can be adjusted. As shown in FIG. 4, the coating nozzle 142 is connected to a photoresist liquid supply device 200 that supplies a photoresist liquid.  [0042] Next, As for the coating nozzle 142 for the processing liquid discharge portion in the photoresist coating device 32, The configuration of the photoresist liquid supply device 200 for supplying the photoresist liquid will be described. FIG. 6 is an explanatory diagram showing the outline of the configuration of the photoresist liquid supply device 200. FIG. 7 is a schematic external view illustrating a buffer tank. In addition, The photoresist liquid supply device 200 is installed in, for example, a chemical chamber (not shown). The chemical room is used to supply various processing liquids to the liquid processing apparatus.  [0043] The photoresist liquid supply device 200 of FIG. 6 is provided with a photoresist liquid supply source (an example of a "treatment liquid supply source" related to the present invention) 201 that stores the photoresist liquid inside, A buffer tank ("temporary storage device" 202 related to the present invention) 202 that temporarily stores the photoresist liquid transferred from the photoresist liquid supply source 201.  [0044] The photoresist liquid supply source 201 can be replaced, Above the photoresist liquid supply source 201, A first processing liquid supply pipe 251 for moving the photoresist liquid to the buffer tank 202 is provided. A supply valve 203 is provided in the first processing liquid supply pipe 251.  [0045] Furthermore, On the downstream side of the supply valve 203 in the first processing liquid supply pipe 251, An air supply tube 252 connected to a pressure source 204 for pressurizing the photoresist liquid in the buffer tank 202 and discharging the photoresist liquid in the buffer tank 202 is provided. The air supply pipe 252 is provided with a switching valve 205.  [0046] The buffer tank 202 temporarily stores the photoresist liquid transferred from the replaceable photoresist liquid supply source 201, At the same time, it has the function of pressure feeding for pressure-storing the stored treatment liquid. The buffer tank 202 is composed of, for example, a tubular diaphragm pump. As shown in Figure 7, Contains a flexible diaphragm 202a, With this diaphragm 202a, A storage chamber 202b for temporarily storing the photoresist is formed. The capacity in the storage chamber 202b can be adjusted by deforming the diaphragm 202a. therefore, Even when the photoresist liquid supply source 201 is replaced, It is also possible to minimize the contact between the photoresist liquid and the gas in the storage chamber 202b.  [0047] Above the buffer tank 202, A drain pipe 253 provided for discharging the photoresist liquid in the tank 202, The liquid discharge pipe 253 is provided with a discharge valve 206.  [0048] Moreover, In the buffer tank 202, An electric air conditioner 207 for deforming the diaphragm 202a is connected via an air supply and exhaust pipe 254. The electric air conditioner 207 is connected to an air supply pipe 255 connected to a pressure source 208, An exhaust pipe 256 connected to the decompression source 209 is connected. By adjusting the pressure caused by the pressurized source 208 and the pressure caused by the depressurized source 209, The diaphragm 202a may be deformed. In the supply and exhaust pipe 254, A pressure sensor 210 is provided to measure the pressure (air pressure) in the pipeline, which is the pressure used to deform the diaphragm 202a.  [0049] FIG. 8 is an explanatory diagram of the structure of the buffer tank 202, Figure 8 (A) is an external view, FIG. 8 (B) is a cross-sectional view showing a cross section only for an outer peripheral wall described later, Fig. 8 (C) is a sectional view taken along A-A.  管 A tubular diaphragm pump constituting the buffer tank 202 is shown in FIG. 8, for example. It has a diaphragm 202a and an outer peripheral wall 202c. In the buffer tank 202, With the space formed by the cylindrical outer peripheral wall 202c, A flexible diaphragm 202a is partitioned into a storage chamber 202b and an operating chamber 202d. By using the electric air conditioner 207 to control the pressure in the operating chamber 202d, The photoresist liquid can be transferred from the photoresist liquid supply source 201 to the storage chamber 202b, Alternatively, the resist liquid is pressure-fed from the storage chamber 202b with a desired hydraulic pressure.  [0050] Furthermore, Above the diaphragm 202a, An inlet port 202e is provided to connect the first treatment liquid supply pipe 251 and the discharge pipe 253. An outlet port 202f connected to a second processing liquid supply pipe 257 described later is provided at the lower end. Furthermore, Above the outer peripheral wall 202c, A port 202g for connecting the supply and exhaust pipe 254 is provided.  [0051] In addition, The separator 202a and the outer peripheral wall 202c are formed of, for example, a fluororesin. By using fluororesin, Because it is transparent, Therefore, the state of the photoresist liquid inside can be detected by a photo sensor, etc. Furthermore, The diaphragm 202a and the outer peripheral wall 202c are welded to each other to seal the outer peripheral wall 202c, An actuation chamber 202d may be formed.  [0052] Return to the description of FIG. 6.  Under the buffer tank 202, A second processing liquid supply pipe 257 for transferring the photoresist liquid to the pump 211 is provided. In other words, On the downstream side of the buffer tank 202 in the second processing liquid supply pipe 257, Set the pump 211.  [0053] Furthermore, Between the buffer tank 202 and the pump 211 of the second processing liquid supply pipe 257, A filter 212 is provided to remove particles in the photoresist. In filter 212, A liquid discharge pipe 258 is provided to discharge the air bubbles generated in the photoresist liquid. The discharge pipe 258 is provided with a discharge valve 213.  Also, On the upstream side of the filter 212 of the second processing liquid supply pipe 257, The supply valve 214 is provided, Between the filter 212 and the pump 211 of the second processing liquid supply pipe 257, A switching valve 215 is provided.  [0054] The pump 211 is, for example, a tubular diaphragm pump, A storage chamber (not shown) with a photoresist, At the same time, an electric air conditioner 216 for controlling the discharge amount of the photoresist liquid from the pump 211 and the like is connected via the air supply and exhaust pipe 259. An air supply pipe 260 connected to a pressure source 217 is connected to the electric air conditioner 216, An exhaust pipe 261 connected to the decompression source 218 is connected.  [0055] In pump 211, A third processing liquid supply pipe 262 for supplying a photoresist liquid from the pump 211 to the wafer to be processed through the coating nozzle 142 is provided. The third processing liquid supply pipe 262 is provided with a pressure sensor 219 that measures the hydraulic pressure of the photoresist liquid in the third processing liquid supply pipe 262.  [0056] Furthermore, On the downstream side of the pressure sensor 219 of the third processing liquid supply pipe 262, Provided with a switching valve 220, On the downstream side of the switching valve 220 and near the coating nozzle 142, A supply control valve 221 is provided.  [0057] Moreover, The photoresist liquid supply device 200 includes a return pipe 263 for returning the photoresist liquid in the pump 211 to the buffer tank 202. One end of the return pipe 263 is connected between the pressure sensor 219 and the switching valve 220 in the third processing liquid supply pipe 262. The other end is connected between the supply valve 214 and the filter 212 in the second processing liquid supply pipe 257. Furthermore, A return control valve 222 is provided in the return pipe 263.  [0058] Furthermore, The photoresist liquid supply device 200 includes a control unit (not shown). For each valve provided in the photoresist liquid supply device 200, Use a solenoid valve or air operated valve that can be controlled by the control unit, Each valve and the said control part are electrically connected. Furthermore, The control unit and the pressure sensor 210 or the pressure sensor 219, Electric air conditioner 207, 216 is electrically connected. With this constitution, A series of processes in the photoresist liquid supply device 200 can be automatically performed under the control of the control section. In addition, The "control device" of the present invention is, for example, the control unit and the electric air conditioner 207, 216 is constructed.  [0059] Then, According to Figure 9 ~ 12, The operation of the photoresist liquid supply device 200 will be described.  [0060] (Supplement toward buffer tank 202) As shown in FIG. 9, According to the control signal from the control department, The supply valve 203 provided in the first processing liquid supply pipe 251 by the intermediary is turned on, At the same time, with electric air conditioner 207 and decompression source 209, In the storage chamber 202b of the decompression buffer tank 202, Accordingly, the photoresist liquid is supplied from the photoresist liquid supply source 201 into the storage chamber 202b of the buffer tank 202. at this time, The pressure in the storage chamber 202b is the pressure in the actuation chamber 202d. According to the measurement result in the pressure sensor 210, Be controlled by feedback.  Also, In Figure 9 and later, Whiten the open valve, Blacken the closed valve, A thick line indicates a pipeline that circulates fluid such as photoresist, Therefore, the description of the switching states of other valves is omitted.  [0061] (Supplement toward pump 211) When a specific amount of photoresist liquid is supplied / replenished in the storage chamber 202b of the buffer tank 202, As shown in Figure 10, The supply valve 203 is closed, The supply valve 214 provided in the second processing liquid supply pipe 257 by the intermediary, The switching valve 215 is opened. Simultaneously, The connection destination of the buffer tank 202 is switched to the pressure source 208 by the electric air conditioner 207, And the storage chamber 202b of the pressure buffer tank 202, Accordingly, the photoresist liquid in the storage chamber 202b is pressure-fed from the buffer tank 202 to the second processing liquid supply pipe 257. After the pressurized photoresist passes through the filter 212, Transferred to pump 211. at this time, The pressure in the third processing liquid supply pipe 262 is measured by the pressure sensor 219, That is, the pressure on the secondary side of the filter 212 becomes equal to the pressure in the pump 211 connected to the supply pipe 262. and, Based on this measurement, The hydraulic pressure when the processing liquid is pressure-fed from the storage chamber 202b of the buffer tank 202, The secondary-side hydraulic pressure of the filter 212 measured by the pressure sensor 219 is feedback-controlled to become the expected hydraulic pressure.  [0062] (Spit) When a specific amount of photoresist liquid is supplied / replenished in the pump 211, As shown in Figure 11, Make the supply valve 214, The switching valve 215 is closed, The switching valve 220 provided in the third processing liquid supply pipe 262 through the intermediary, The supply control valve 221 is opened. Simultaneously, With the electric air conditioner 216, Switch the connection destination of the pump 211 to the pressure source 217, The photoresist liquid is pressure-fed from the pump 211 to the third processing liquid supply pipe 262. Based on this, Part of the photoresist that was transferred to pump 211 (for example, 1 in 5) is ejected to the wafer via the coating nozzle 142. at this time, The pressure in the pump 211 is based on the measurement result of the pressure in the third processing liquid supply pipe 262 by the pressure sensor 219, Be controlled by feedback.  006 [0063] (Back) When a specific amount of the photoresist liquid is discharged from the pump 211, As shown in Figure 12, Make the switching valve 220, The supply control valve 221 is closed, Make the return control valve 222, The supply valve 214 is opened. Simultaneously, In a manner that the pressure of the pump 211 is greater than the pressure in the storage chamber 202b of the buffer tank 202, According to the measurement results of the pressure sensor 210 and the pressure sensor 219, Controls the electric air conditioner 216. Based on this, Residual photoresist in pump 211 (e.g., 4/5) Return to the buffer tank 202 via the return pipe 263.  [0064] After that, Repeat the above action.  [0065] As mentioned above, The photoresist liquid supply device 200 series buffer tank 202 not only has a function of temporarily storing the processing liquid, It also has the function of pressure feeding the processing liquid.  Therefore, The photoresist liquid supply device 200 has the following effects. That is, When the buffer tank is a learner, Depending on the device setup conditions or the layout inside the device, When the pump 211 is replenished with photoresist from the buffer tank, The hydraulic pressure of the filter 212 cannot be expected. but, Since the photoresist liquid supply device 200 has a pressure feeding function in the buffer tank 202, So even if you set the conditions or the layout of the same device, In the photoresist liquid supply device 200, When the pump 211 is replenished with photoresist, The hydraulic pressure of the filter 212 can be made a desired hydraulic pressure.  [0066] In particular, According to the hydraulic pressure of the photoresist liquid in the third processing liquid supply pipe 262 measured by the pressure sensor 219, That is, the hydraulic pressure of the secondary side of the filter 212, In such a way that the secondary side hydraulic pressure becomes constant at a specific value, Feedback control hydraulic pressure (hereinafter, Hydraulic pressure). therefore, When the pump 211 is replenished with photoresist from the buffer tank 202, It is possible to make the hydraulic pressure of the filter 212 more surely the desired hydraulic pressure.  [0067] In addition, When the photoresist passes through the filter 212, The flow rate rises, The hydraulic pressure of the photoresist drops, at this time, When it drops to saturated vapor pressure, By the principle of holes, Bubbles are generated in the photoresist. but, In the photoresist liquid supply device 200, Control the hydraulic pressure on the secondary side of the filter 212, By making the static pressure level higher than the saturated vapor pressure, Can suppress the generation of bubbles.  [0068] Moreover, The buffer tank 202 is a deformed storage chamber 202b for storing the photoresist solution. therefore, It has the following effects.  In the photoresist liquid supply source 201, No photoresist, When the photoresist solution in the storage chamber of the buffer tank is reduced, If it is a normal buffer tank, The liquid level of the photoresist in the storage chamber drops, The inner peripheral surface of the storage room is in contact with the air and dried, the result, Defects may occur in the processed wafer.  On this, The photoresist liquid supply device 200 is as described above. Because the storage room 202b of the buffer tank 202 is deformed, Therefore, even if the amount of photoresist in the storage chamber 202b decreases, It is also possible to prevent the inner peripheral surface of the storage chamber 202b from contacting the air, Makes it not dry.  [0069] In addition, The photoresist in the buffer tank 202 can use a pressurized source 204, It is discharged through the second processing liquid supply pipe 257 and the third processing liquid supply pipe 262. Furthermore, The pressurized source 204 may be used when performing a liquid-passing treatment on the return pipe 263 or the filter 212. During the liquid-passing treatment of the filter 212, The photoresist liquid is discharged through the liquid discharge pipe 258.  [0070] Moreover, Although illustration is omitted, However, in order to pass the photoresist liquid to the buffer tank 202 and the first processing liquid supply pipe 251, It is also possible to provide a pressure source in the photoresist liquid supply source 201. During the fluid treatment, The photoresist is discharged through a liquid discharge tube 253.  [0071] (Other Examples of Pressure Feed Control) 中 In the above example, In a way that the hydraulic pressure on the secondary side of the filter 212 becomes constant at a specific value, Feedback control hydraulic pressure. but, Even if the hydraulic pressure on the secondary side of the filter 212 measured by the pressure sensor 219 is within a certain range, If the measurement results are not abnormal, the following will occur. To replace this. That is, Even with the buffer slot 202, More specifically, To the storage room 202b of the buffer tank 202, Use electric air conditioner 207 to apply a certain certain pressure, The processing liquid may be pressure-fed from the buffer tank 202.  [0072] (Another Example of Pressure Feed Control) FIG. 13 is a diagram illustrating another example of control when pressure is fed from the buffer tank 202.  光 The photoresist liquid supply device 200 of FIG. 13 is between the buffer tank 202 and the supply valve 214 of the second processing liquid supply pipe 257. A pressure sensor 223 is provided to measure the hydraulic pressure in the second processing liquid supply pipe 257.  Even if the hydraulic pressure on the primary side of the filter 212 measured by the pressure sensor 223 is at a certain value, it becomes a certain method, It is also possible to use the electric air conditioner 207 to feedback-control the hydraulic pressure.  [0073] (Second Embodiment Mode) FIG. 14 is an explanatory diagram showing a schematic configuration of a photoresist liquid supply device according to a second embodiment mode of the present invention. FIG. 15 is a diagram showing a schematic configuration of a photoresist liquid supply device related to a comparative form.  The structure is further downstream than the buffer tank of the photoresist liquid supply device related to this embodiment and the comparison mode, Because it is the same as the photoresist liquid supply device 200 of FIG. 6, Therefore, the illustration is omitted.  [0074] The photoresist liquid supply device 300 of FIG. 14 is different from the photoresist liquid supply device 200 of FIG. 6, Two buffer tanks 202 are provided with respect to the photoresist liquid supply source 201. and, The photoresist liquid supply device 300 is provided with electric air conditioners 207 to the buffer tanks 202, Different pressures may be applied to the storage chamber 202b of each buffer tank 202.  [0075] In addition, The photoresist liquid supply device 300 'of FIG. 15 is provided with a common electric air conditioner 207 with respect to the two buffer tanks 202. therefore, The pressure that can be applied to the storage chamber 202b of the buffer tank 202 is the same in both storage chambers 202b.  Therefore, The photoresist liquid supply device 300 'has the following problems. When the buffer tank 202 cannot be replenished from the photoresist liquid supply source 201, When the photoresist is pressed from one buffer tank 202, In such a manner that the storage room 202b of the buffer tank 202 of the one side is reduced, Diaphragm 202a deformed, Does not return to the original shape. therefore, If no greater pressure is applied to the storage chamber 202b of the buffer tank 202 of the one side, The photoresist cannot be pressure-fed at the expected pressure. but, When the pressure in the storage chamber 202b of the one buffer tank 202 is raised, Even if the pressure in the storage chamber 202b of the buffer tank 202 on the other side that has obtained the desired pressure is increased, The pressure at the time of pressure feeding from the storage chamber 202b of the other buffer tank 202 becomes larger than the expected pressure.  [0076] In such a photoresist liquid supply device 300 ', When the buffer tank 202 cannot be replenished from the photoresist liquid supply source 201, That is, there is a problem when the photoresist liquid supply source 201 is replaced.  [0077] In this regard, In the photoresist liquid supply device 300 of FIG. 14, Because each storage chamber 202b of the buffer tank 202 can be Apply different pressures, Therefore, when the photoresist liquid supply source 201 is replaced, Even if the storage chamber 202b transformed into the buffer tank 202 is reduced, The photoresist can also be pressure-fed from the buffer tank 202 by a desired pressure.  [0078] In addition, In the photoresist liquid supply device 300, The hydraulic pressure from the buffer tank 202, For example, the hydraulic pressure on the secondary side of the filter 212 measured by the pressure sensor 219 is made constant at a specific value, Be controlled by feedback. Furthermore, The same as the first embodiment, When the hydraulic pressure of the secondary side of the filter 212 measured by the pressure sensor 219 is within a specific range, Even if the electric storage unit 202b of the buffer tank 202 is used with the electric air conditioner 207, Exert a certain certain pressure, Accordingly, the processing liquid may be pressure-fed from the buffer tank 202. and, Even if a pressure sensor is provided to measure the hydraulic pressure in the second processing liquid supply pipe 257, In such a manner that the hydraulic pressure on the primary side of the filter 212 measured by the pressure sensor becomes constant at a specific value, Using electric air conditioner 207, The feedback control of the hydraulic pressure from the buffer tank 202 is also possible.  [0079] Furthermore, Even like the photoresist liquid supply device 300 'of FIG. 13, The buffer tank 202 has a common electric air conditioner 207, Even if the diaphragm 202a in the buffer tank 202 is deformed, When the reaction force is also small, The problem during replacement of the photoresist liquid supply source 201 does not occur.  [0080] In addition, In the photoresist liquid supply device 300 ', A switching valve 301 is provided in the air supply and exhaust pipe 254 connecting the buffer tank 202 and the electric air conditioner 207. Furthermore, The buffer tank 202 is provided with an exhaust pipe 351 connected to a decompression source 302. An exhaust valve 303 is provided in the exhaust pipe 351. and, In the photoresist liquid supply device 300 ', When replenishing the photoresist in the buffer tank 202, By turning the switching valve 301 into a closed state, The supply valve 203 is opened, And the exhaust valve 303 is opened, The storage chamber 202b of the decompression buffer tank 202. Based on this, A photoresist liquid is supplied from the photoresist liquid supply source 201 into the storage chamber 202b of the buffer tank 202.  [0081] (Third Embodiment) FIG. 16 is an explanatory diagram showing a schematic configuration of a photoresist liquid supply device according to a third embodiment of the present invention.  光 The photoresist liquid supply device 400 of FIG. 16 is the same as the photoresist liquid supply device 300 'of FIG. 15, A common electric air conditioner 207 is provided with respect to the two buffer tanks 202. but, The photoresist liquid supply device 400 of FIG. 16 is different from the photoresist liquid supply device 300 'of FIG. 15, Between the photoresist liquid supply source 201 and the buffer tank 202 of the first processing liquid supply tube 251, An additional buffer groove 401 is provided. The other buffer tank 401 is a normal tank having no pressure feeding function.  [0082] In this photoresist liquid supply device 400, Since the photoresist supply source 201 becomes empty, Pressure feed the photoresist liquid from one buffer tank 202, Even if the diaphragm 202a becomes the storage chamber 202b of the one buffer tank 202, The other buffer tank 401 is also supplemented with a photoresist solution from the buffer tank 202 of the above one. Therefore, the diaphragm 202a returns to its original shape. therefore, Even when the photoresist supply source 201 needs to be replaced, The photoresist liquid may be pressure-fed from the buffer tank 202 at a desired pressure.  Also, A switching valve 402 is provided between the other buffer tank 401 and the buffer tank 202 in the first processing liquid supply pipe 251.  [0083] (Fourth Embodiment) FIG. 17 is an explanatory diagram showing a schematic configuration of a photoresist liquid supply device according to a fourth embodiment of the present invention.  [0084] In the photoresist liquid supply device 500 of FIG. 17, Below the buffer tank 202, A second processing liquid supply pipe 551 is provided to transfer the photoresist liquid to the tubular diaphragm pump, that is, the pump 211. In other words, At one end of the second processing liquid supply pipe 551, Connection buffer slot 202, At the other end, One port of the pump 211 is connected (refer to symbol 202e in FIG. 8, 202f).  Between the buffer tank 202 and the pump 211 of the second processing liquid supply pipe 551, A filter 212 is set. Furthermore, In the second processing liquid supply pipe 551, Between the buffer tank 202 and the filter 212, The supply valve 214 is provided, Between the supply valve 214 and the filter 212, A switching valve 215 is provided. and, Between the filter 212 and the pump 211 of the second processing liquid supply pipe 551, A switching valve 501 is provided.  [0085] The photoresist liquid supply device 500 includes a third processing liquid supply tube 552 that supplies the photoresist liquid from the pump 211 to the wafer through the coating nozzle 142. One end of the third processing liquid supply pipe 552 is connected between the filter 212 and the switching valve 501 in the second processing liquid supply pipe 551. The other end is connected to a coating nozzle 142. In the third processing liquid supply pipe 552, The pressure sensors 219, and Liquid flow meter 502, Supply control valve 221, Coating nozzle 142.  [0086] Furthermore, The photoresist liquid supply device 500 includes a return pipe 553 used when the photoresist liquid in the pump 211 is returned to the buffer tank 202. One end of the return pipe 553 is connected between the supply valve 214 and the switching valve 215 in the second processing liquid supply pipe 551. The other end is connected to a port on the opposite side to the connection side of the second processing liquid supply pipe 551 of the pump 211 (refer to symbol 202e in FIG. 202f). Furthermore, The return pipe 553 is provided with a switching valve 503.  And, In the photoresist liquid supply device 500, A gas flow meter 504 is provided in the air supply and exhaust pipe 259 provided between the pump 211 and the electric air conditioner 216.  [0087] Next, According to Figure 18 ~ Figure 27, The operation of the photoresist liquid supply device 500 will be described.  [0088] (Supplement towards pump 211) First, As shown in Figure 18, While maintaining the switching valve 501 provided in the second processing liquid supply pipe 551 by the intermediary, When the switching valve 505 interposed in the return pipe 553 is closed, Make the supply valve 214, The switching valve 215 is opened, Then, the supply control valve 221 is opened. In this state, A photoresist is sent from the buffer tank 202. and, The pressure in the third processing liquid supply pipe 552 at this time is measured by the pressure sensor 219. The measured hydraulic pressure is slightly equal to the back pressure applied to the pump 211 when the photoresist liquid is supplied / replenished from the buffer tank 202.  [0089] Then, As shown in Figure 19, The switching valve 215 is closed, Stop sending out the photoresist solution from the buffer tank 202, The switching valve 501 is opened. and, With the electric air conditioner 216, Control the pressure of the operating chamber in the pump 211, So that the pressure measured by the pressure sensor 219 is the pressure on the switching valve 501 side of the pump 211, When sending out the photoresist liquid from the buffer tank 202, The pressure measured by the pressure sensor 219 becomes equal.  [0090] After that, As shown in Figure 20, The supply control valve 221 is closed, The switching valve 215 is opened, Replenishment of the photoresist liquid from the buffer tank 202 was started. at this time, When the pressure on the switching valve 501 side of the pump 211 is set to be sent out from the photoresist liquid from the buffer tank 202, The pressure measured at the pressure sensor 219, That is, the back pressure applied to the pump 211 is equal when the photoresist liquid from the buffer tank 202 is replenished. So at the beginning of the supplement, There will be no changes by back pressure, The photoresist liquid flows into the pump 211 momentarily.  [0091] (Other examples of supplements to pump 211) First, As shown in Figure 18, While maintaining the closed state of the switching valve 501 provided by the intermediary in the second processing liquid supply pipe 551 and the switching valve 503 provided by the intermediary in the return pipe 553, Make the supply valve 214, The switching valve 215 is opened, Then, the supply control valve 221 is opened. In this state, A photoresist is sent from the buffer tank 202. and, The pressure on the secondary side of the filter 212 is measured by a pressure sensor 219, in particular, The hydraulic pressure in the third processing liquid supply pipe 552. At the same time as the pressure measurement, with the electric air conditioner 207, Control the pressure of the operating chamber in the buffer tank 202, The feedback control makes the pressure measured at the pressure sensor 219 a target pressure (for example, 50 kPa).  [0092] Next, As shown in Figure 21, The supply valve 214 is closed, The switching valve 501 is opened. and, With the electric air conditioner 216, Control the pressure of the operating chamber in the pump 211, So that the pressure measured by the pressure sensor 219 is the pressure on the switching valve 501 side of the pump 211, Same as above and the target pressure becomes equal.  [0093] After that, As shown in Figure 20, The supply control valve 221 is closed, The supply valve 214 is opened, Replenishment of the photoresist liquid from the buffer tank 202 was started. In this situation, At the beginning of the supplement, Due to the pressure feed hydraulic pressure from the buffer tank 202 and the pressure on the switching valve 501 side of the pump 211, The pressure on the above goals becomes equal, So at the beginning of the supplement, The photoresist liquid does not flow into the pump 211 instantaneously.  [0094] (spit out) When the spit out of the photoresist, As shown in Figure 22, The switching valve 501 provided by the intermediary in the second processing liquid supply pipe 551 and the supply control valve 221 provided by the intermediary in the third processing liquid supply pipe 552 are opened. Simultaneously, With the electric air conditioner 216, Using the connection destination of the pump 211 as the pressure source 217, From the port on the switching valve 501 side of pump 211, The photoresist liquid is pressure-fed to the third processing liquid supply tube 552 via the second processing liquid supply tube 551. Based on this, Through filter 212, Photoresist liquid stored in pump 211, It is discharged to the wafer through the coating nozzle 142.  [0095] (Other examples of spitting out) As shown in FIG. 23, The switching valve 215 provided in the second processing liquid supply pipe 551 by the intermediary, A supply control valve 221 provided in the third processing liquid supply pipe 552, And the switching valve 503 interposed in the return pipe 553 is opened. Simultaneously, With the electric air conditioner 216, Using the connection destination of the pump 211 as the pressure source 217, From the port on the side of the return pipe 553 of the pump 211, The photoresist liquid is pressure-fed to the third processing liquid supply tube 552 via the return tube 553 and the second processing liquid supply tube 551. Based on this, Through filter 212, Photoresist liquid stored in pump 211, After passing the filter 212 again, Spit out to the wafer. By so constituting, It is possible to further reduce the possibility of defects occurring on the wafer.  [0096] (Switching of spitting) In the following, The method of causing the photoresist to pass through the filter 212 again as shown in FIG. 23 and spit it out to the wafer. Called the two-pass method, A method in which the photoresist is discharged to the wafer without passing through the filter 212 as shown in FIG. 22 is referred to as a single-pass method.  The two-pass method and the single-pass method can be selected depending on the purpose and the like. E.g, Double-pass is usually used, When flushing, Or when you need to spit out the photoresistor for a short time, use the single-pass method.  [0097] In addition, The replenishment speed of the pump 211 photoresist is the filtration rate of the filter 212 during replenishment. The discharge rate of the photoresist liquid in the two-pass mode is the filtration rate of the filter 212 during the discharge of the mode, Both filtration rates are preferably slow. The reason is that the particles in the treatment liquid can be more reliably collected by the filter 212. but, When the filtration rate of the latter is too slow, Because the treatment liquid is intermittently discharged into a droplet shape, Therefore, the speed is limited. therefore, Taking the filtration rate at the time of supplementation and the filtration rate at the time of spitting out, One of the filtration rates at the time of supplementation is preferably small. In addition, The filtration rate during supplementation is, for example, 0. 05ml / second, the filtration rate at the time of spitting out is, for example, 0. 5ml / s. [0098] (Drain) At the time of bleeding, for example, as shown in FIG. 24, the supply valve 214 provided by the intermediary in the second processing liquid supply pipe 551 and the return pipe 553 provided by the intermediary are maintained. When the switching valve 503 is closed, the switching valve 215 and the supply control valve 221 are opened, and the discharge valve 213 is opened. Then, the pressure in the third processing liquid supply pipe 552 at this time is measured by the pressure sensor 219. The measured hydraulic pressure is slightly equal to the back pressure applied to the pump 211 during discharge. [0099] Next, as shown in FIG. 25, the discharge valve 213 and the supply control valve 221 are closed, and the switching valve 503 is opened. Furthermore, the electric air regulator 216 controls the pressure of the operating chamber in the pump 211, so that the pressure measured by the pressure sensor 219 is the pressure on the switching valve 503 side of the pump 211 and the pressure in the state shown in FIG. 24. The pressures measured by the pressure sensor 219 become equal. [0100] After that, as shown in FIG. 26, the discharge valve 213 is opened, and the photoresist liquid in the pump 211 of the liquid discharge pipe 258 is started to be discharged. At this time, since the pressure on the switching valve 503 side of the pump 211 is set to be equal to the pressure measured by the pressure sensor 219 in the state of FIG. 24, that is, the back pressure applied to the pump 211 at the time of discharge, At the beginning of the bleed, there will be no situation where the photoresist liquid flows out into the pump 211 instantaneously by the change of the back pressure. [0101] (Other examples of venting) As a venting method, in addition to a venting method of a filter discharged through the filter 212 described above, there is a return venting method that returns to the buffer tank 202. In the backflow bleed method, before the bleed is performed, for example, first, as shown in FIG. 18, the switching valve 501 and the switching valve 503 are closed, and the supply valve 214, the switching valve 215, and the supply control valve 221 are On. In this state, the photoresist is sent out from the buffer tank 202. The pressure on the secondary side of the filter 212 is measured by the pressure sensor 219, specifically, the hydraulic pressure in the third processing liquid supply pipe 552. At the same time as the pressure measurement, the pressure of the operating chamber in the buffer tank 202 is controlled by the electric air conditioner 207, and feedback control is performed so that the pressure measured by the pressure sensor 219 becomes a specific pressure. Next, based on the pressure of the operating chamber of the buffer tank 202 when the pressure measured by the pressure sensor 219 becomes a specific pressure, the pressure at the start of the bleeding of the pump 211 is corrected. For example, if the pressure in the operating chamber is large when the specific pressure is reached, the pressure at the start of the release of the pump 211 is increased, and if it is small, the pressure is decreased. [0102] Next, as shown in FIG. 25, the supply valve 214 and the supply control valve 221 are closed, and the switching valve 503 is opened. In addition, the electric air conditioner 216 controls the pressure of the operating chamber in the pump 211 so that the pressure measured by the pressure sensor 219 is the pressure on the switching valve 503 side of the pump 211 and becomes a corrected pump. Pressure at the beginning of 211's release. [0103] After that, as shown in FIG. 27, the supply valve 214 is opened, the switching valve 215 is closed, and the photoresist liquid in the pump 211 is returned to the buffer tank 202, that is, it is drained back. Because the pressure in the storage chamber of the buffer tank 202 is changed by the amount of the photoresist in the storage chamber, when the pressure of the pump 211 at the beginning of the backflow bleed is set to be constant, the backflow bleed cannot be properly performed. However, in this example, the pressure of the pump 211 at the start of the backflow bleed is corrected based on the pressure of the operating chamber of the buffer tank 202 corresponding to the pressure of the storage chamber of the buffer tank 202, so the backflow discharge can be appropriately performed. vent. [0104] (Bleed amount) The bleed amount is determined by the difference between the replenishment amount of the pump 211 and the discharged amount of the photoresist solution. In the example shown in the figure, since the liquid flow meter 502 is provided, the actual output amount of the photoresist liquid can be calculated based on the measurement result in the liquid flow meter 502. Therefore, the discharge amount can be calculated accurately.无 In the case where no liquid flow meter 502 is provided, the gas flow meter 504 provided to the pump 211 measures the flow rate of the gas sent from the pump 211 and calculates using the measurement result. The gas flow meter 504 is a mass flow meter. By converting the integrated value of the measured mass into a volume, the discharge amount of the photoresist liquid can be calculated. Because the relationship between mass and volume depends on pressure and temperature, the conversion from mass to volume can be performed even if the temperature in the pump 211 is 20 ° C and the pressure in the pump 211 is 1 atmosphere. The pressure in the operating chamber of the pump 211 may be measured when the temperature in the pump 211 is 23 ° C. By properly determining the amount of bleed, the time of bleed can be set appropriately. [0105] (Execution sequence of bleed) Return bleed is performed in order to prevent the photoresist from staying, for example, periodically. Filter bleed is performed when the cleansing degree of the photoresist liquid in the pump 211 is low, for example, at startup, periodically, or when air bubbles are detected on the primary side of the filter 212. . (2) The above-mentioned bubble detector is preferably provided between a connection portion of the return pipe 553 of the second processing liquid supply pipe 551 and the supply valve 214, for example. This portion is in the actual photoresist liquid supply device 500 and is located above the filter 212 and the pump 211 in a vertical direction. Therefore, air bubbles generated on the primary side of the filter can be reliably detected, and more specifically, the filter 212 or the pump 211, and the system from the portion provided with the air bubble detector to the filter 212 or the pump 211 Bubbles generated by the path. [0106] (Abnormality detection) In the photoresist liquid supply device 500, since the diaphragm constituting the storage chamber of the pump 211 is extended with time, the pressure for deforming the diaphragm is controlled by the electric air conditioner 216 The pressure (EV pressure) of the operating chamber in the pump 211 must be increased in accordance with the extension of the diaphragm. Therefore, in the photoresist liquid supply device 500, the EV pressure is measured and compared with the pressure (hydraulic pressure) measured by the pressure sensor 219. When the extension of the diaphragm exceeds the allowable range or other abnormality occurs, and the difference between the EV pressure and the hydraulic pressure becomes a certain value or more, an error is notified by sound information or visual information. Furthermore, at the same time as the error notification, the pressurization of the operating chamber of the pump 211 by the pressurizing source 217 is stopped to bring the EV pressure to atmospheric pressure. At this time, the supply valve 214, the switching valve 215, and the switching valve 501 are preferably opened. Even if the buffer tank 202 is the same as the pump 211, the detection error may be based on the pressure of the operating chamber in the buffer tank. [0107] In the above-mentioned photoresist liquid supply device 500, although the liquid flow meter 502 is provided between the pump 211 in the third processing liquid supply pipe 522 and the supply control valve 221, The connection portion between the third processing liquid supply pipe 552 of the processing liquid supply pipe 551 and the filter 212 may be used. The liquid flow meter 502 may not be provided. [0108] In the photoresist liquid supply device 500, a pressure sensor 219 that measures the pressure on the secondary side of the filter 212 is provided at the most upstream portion of the third processing liquid supply pipe 552. However, the pressure sensor 219 may be provided between the connection portion of the third processing liquid supply pipe 552 in the second processing liquid supply pipe 551 and the switching valve 501. In this case, when the photoresist liquid is discharged from the pump 211 through the filter 212, the pressure sensor 219 is not passed, so that particles can be prevented from being mixed into the photoresist liquid. [0109] In the photoresist liquid supply device 500, in addition to the pressure sensor 219 that measures the pressure on the secondary side of the filter 212, a pressure sensor that measures the pressure on the primary side of the filter 212 is provided. can. The primary-side pressure sensor is provided between, for example, the switching valve 215 and the filter 212 in the second processing liquid supply pipe 551. The differential pressure between the primary pressure sensor and the secondary pressure sensor 219 provided in this part changes depending on the state of the clogging of the filter 212. Therefore, by providing the primary pressure sensor 219 in the above portion, the state of the filter 212 can be determined based on the differential pressure. When a primary pressure sensor is provided in the above portion, the pressure loss from the buffer tank 202 to the primary pressure sensor is lower than that from the buffer tank 202 to the secondary pressure sensor 219. The pressure loss is small. Therefore, if the measurement result of the pressure sensor on the primary side is fed back to the operating chamber of the buffer tank 202, the measurement result of the pressure sensor 219 on the secondary side can be used to buffer the measurement result. The magnitude of the pressure of the photoresist liquid in the groove 202 becomes an expected value. In addition, in the photoresist liquid supply device 500, even if a primary-side pressure sensor is provided between the buffer tank 202 and the supply valve 214 of the second processing liquid supply pipe 551, it can be switched as described above. The same effect is obtained when a portion between the valve 215 and the filter 212 is provided. [0110] The photoresist liquid supply device 500 may generate a degassed liquid through the buffer tank 202. When the filter 212 is activated or during regular maintenance, the deaerated liquid generated in the buffer tank 202 is passed through the filter 212 to remove fine air bubbles that cannot be removed by the ordinary photoresist that is not degassed. The degassed liquid passing through the filter 212 is preferably discharged through the drain pipe 258. [0111] In the above description, the photoresist liquid is used as an example to describe the processing liquid supplied by the processing liquid supply device related to the present invention, but it is also possible to supply a coating liquid such as SOG (Spin On Glass). (Example) [0112] FIG. 28 is a diagram showing the amount of particles observed in the photoresist films of Examples and Comparative Examples, and FIGS. 28 (A) to (D) show Comparative Example 1 and implementation in order. The amount of fine particles in Example 1, Comparative Example 2, and Example 2. In the figure, the horizontal axis represents the first wafer, and the vertical axis represents the amount of particles. The number of particles in the photoresist film of the fourth wafer in Comparative Example 2 is set to one. Time value. The presence / absence of particles was observed and confirmed by an electron microscope. In addition, the hatched part in the histogram in the figure indicates the number of particles that should be bubbles. [0113] In Example 1 and Example 2, the photoresist liquid supply device 500 related to the fourth embodiment is used, and the pressure is applied to the buffer tank 202 so that the pressure in the pressure sensor 219 becomes 50 kPa. Specifically, In other words, the pressure of the pressure sensor 219 is set to 50 kPa, while the pressure of the operating chamber of the buffer tank 202 is controlled, and the pump 211 is supplemented with a photoresist liquid from the buffer tank 202. Furthermore, in Example 1 and Example 2, a photoresist liquid was supplied from the pump 211 in a two-pass method to form a photoresist film. In Comparative Example 1 and Comparative Example 2, although the photoresist liquid supply device 500 related to the fourth embodiment is used, the pump 211 is supplemented with the photoresist liquid from the buffer tank 202, and light is supplied from the pump 211 in a two-pass manner. The liquid is blocked to form a photoresist film, but during replenishment, no pressure is applied through the buffer tank 202. In addition, in Example 1 and Comparative Example 1 and Example 2 and Comparative Example 2, the positional relationship between the buffer tank and the filter, the piping, the processing liquid supply device installation place, and the like are different. [0114] As shown in FIGS. 28 (A) and 28 (C), although it is slightly less in Comparative Example 1, in Comparative Example 1 and Comparative Example 2, there are many fine particles, and in addition, there are also Should be airborne particles. In this regard, in Examples 1 and 2, as shown in FIGS. 28 (B) and 28 (D), the number of particles is small, and in particular, the number of particles that should be bubbles is zero. [0115] As can be seen from the above examples and comparative examples, if the photoresist liquid supply device 500 is used, the filter 212 can be used even in an environment where a large number of particles exist without the pressure function of the buffer tank 202. Remove particles appropriately. That is, regardless of the environment, fine particles can be removed appropriately. Furthermore, with the photoresist liquid supply device 500, it is possible to prevent generation of particles that should be bubbles regardless of the environment. [Usage feasibility in production] [0116] The present invention is effective in the technique of applying a treatment liquid to an object.

[0117]

142‧‧‧coating nozzle

200, 300, 400, 500‧‧‧ photoresist liquid supply device

201‧‧‧Photoresist liquid supply source

202‧‧‧ buffer tank

202a‧‧‧ diaphragm

202b‧‧‧Storage room

207‧‧‧ Electric Air Conditioner

210‧‧‧Pressure sensor

211‧‧‧pump

212‧‧‧filter

216‧‧‧ Electric Air Conditioner

219‧‧‧Pressure sensor

223‧‧‧Pressure sensor

[0019] FIG. 1 is a plan view showing a schematic configuration of a substrate processing system related to this embodiment. FIG. 2 is a front view showing a schematic configuration of a substrate processing system according to this embodiment. FIG. 3 is a rear view showing a schematic configuration of a substrate processing system according to the embodiment. FIG. 4 is a longitudinal cross-sectional view showing a schematic configuration of a photoresist coating device. FIG. 5 is a cross-sectional view schematically showing the configuration of a photoresist coating device. FIG. 6 is an explanatory diagram showing the outline of the configuration of the photoresist coating apparatus according to the first embodiment. FIG. 7 is a schematic external view illustrating a buffer tank. FIG. 8 is an explanatory diagram of the structure of the buffer tank. FIG. 9 is an explanatory diagram showing a state in which a piping system for describing a configuration of a photoresist liquid supply device is supplemented to a buffer tank. FIG. 10 is an explanatory diagram showing a state in which a piping system for explaining a configuration of a photoresist liquid supply device is pumped to a pump. FIG. 11 is an explanatory diagram showing a piping system and a coating process for explaining the configuration of a photoresist liquid supply device. FIG. 12 is an explanatory diagram showing a process of returning the photoresist liquid to the buffer tank, which is a schematic piping system for explaining the configuration of the photoresist liquid supply device. FIG. 13 is a diagram illustrating another example of control when pressure is fed from a buffer tank. Fig. 14 is an explanatory diagram showing a schematic configuration of a photoresist liquid supply device according to a second embodiment of the present invention. FIG. 15 is a diagram showing a schematic configuration of a photoresist liquid supply device related to a comparative type. Fig. 16 is an explanatory diagram showing a schematic configuration of a photoresist liquid supply device according to a third embodiment of the present invention. Fig. 17 is an explanatory diagram showing a schematic configuration of a photoresist liquid supply device according to a fourth embodiment of the present invention. FIG. 18 is an explanatory diagram showing a schematic piping system for explaining the configuration of the photoresist liquid supply device, and performing a supplementary process or a drain process toward a pump. FIG. 19 is an explanatory diagram showing a piping system for explaining the outline of the configuration of the photoresist liquid supply device to the pump. FIG. 20 is an explanatory view showing a piping system for explaining the configuration of the photoresist liquid supply device, and a pump-supplying process. FIG. 21 is an explanatory diagram showing a piping system for explaining the outline of the configuration of the photoresist liquid supply device, and other supplementary processes for pumping. FIG. 22 is an explanatory diagram showing a state of a piping system for explaining a configuration of a photoresist liquid supply device and a state in which a coating process is performed. FIG. 23 is an explanatory diagram showing a state in which a piping system for describing the configuration of the photoresist liquid supply device is subjected to another coating process. FIG. 24 is an explanatory diagram showing a piping system and a draining process for explaining the configuration of the photoresist liquid supply device. FIG. 25 is an explanatory diagram showing a piping system and a draining process for explaining the configuration of the photoresist liquid supply device. FIG. 26 is an explanatory diagram showing a piping system and a draining process for explaining the configuration of the photoresist liquid supply device. FIG. 27 is an explanatory diagram showing a schematic piping system for explaining the configuration of the photoresist liquid supply device, and another drainage process. FIG. 28 is a graph showing the amount of fine particles observed in the photoresist films of Examples and Comparative Examples.

Claims (11)

A processing liquid supply device that supplies a processing liquid to a processing liquid discharge portion that discharges a processing liquid to a subject, and the processing liquid supply device is characterized by comprising: a temporary storage device for temporarily storing the storage liquid from the storage processing The processing liquid supplied by the processing liquid supply source of the liquid; a filter to remove the foreign matter in the processing liquid from the temporary storage device; and a pump to send the processing liquid to remove the foreign matter through the filter to the above The processing liquid discharge unit: The temporary storage device has a pressure feeding function of pressure-feeding the processing liquid stored in the temporary storage device. The processing liquid supply device according to claim 1, comprising: a pressure measuring device which is provided downstream of the temporary storage device and measures the hydraulic pressure of the processing liquid; and a control device which is based on the pressure measurement The measurement result of the device controls at least the pressure feed of the processing liquid from the temporary storage device. The processing liquid supply device according to claim 2, wherein the pressure measuring device measures the hydraulic pressure on the secondary side of the filter, and the control device controls the hydraulic pressure on the secondary side of the filter to be constant. Sending hydraulic pressure. The processing liquid supply device according to claim 2, wherein the pressure measuring device measures the hydraulic pressure on the secondary side of the filter, and the control device is in a case where the hydraulic pressure on the secondary side of the filter is within a specific range. , A specific pressure is applied to the temporary storage device, and the processing liquid is pressure-fed. The processing liquid supply device according to claim 2, wherein the pressure measuring device measures the hydraulic pressure on the primary side of the filter, and the control device controls the hydraulic pressure on the primary side of the filter to be constant. Sending hydraulic pressure. The processing liquid supply device according to any one of claims 2 to 5, which includes a plurality of the temporary storage device, the filter, and the pump, and the control device has adjustments for setting the temporary storage device, respectively. The hydraulic electric air conditioner in the storage chamber for the treatment liquid in the temporary storage device. The processing liquid supply device according to any one of claims 1 to 5, wherein the above-mentioned temporary storage device is a tubular diaphragm pump. The processing liquid supply device according to claim 1, which includes a plurality of the temporary storage device, the filter, and the pump, and the temporary storage device includes a storage device for storing the processing liquid in different units, and pressure-feeds the storage device. The other pump for the processing liquid in the storage device is provided with a common electric air conditioner, which adjusts the hydraulic pressure in the storage chamber for the processing liquid in the other pump for the other pump in the temporary storage device. The control of the hydraulic pressure when the processing liquid from the temporary storage device is pressurized is performed by the electric air conditioner. The processing liquid supply device according to claim 8, wherein: 另外 the other pump is a tubular diaphragm pump. The processing liquid supply device according to any one of claims 1 to 5, 8, and 9, wherein the pump is configured to send the processing liquid from which the foreign matter is removed by the filter to the processing liquid discharge unit, Send it out again in the filter. The processing liquid supply device according to claim 2, further comprising a processing liquid supply pipe in which the temporary storage device, the filter, and the pump are sequentially provided from the upstream side, and the pump has a storage chamber for storing the processing liquid. The treatment liquid supply pipe is provided with a valve between the temporary storage device and the filter, and has another valve between the temporary storage device and the filter. 系 The control device is supplemented from the temporary storage device by the filtering. When the processing liquid for removing foreign matter reaches the storage chamber of the pump, when the one valve is opened and the other valves are closed, the pressure on the secondary side of the filter measured by the pressure measuring device becomes With a specific value method, the pressure of the processing liquid from the temporary storage device is controlled, and after closing the one valve and the other valve, the second side of the filter measured by the pressure measuring device is used. The way that the pressure becomes the above specific value. After controlling the pressure in the storage chamber, In the state of the valve and the other valves, the above-mentioned replenishment is started.