CN101960043A - Target structure and method for manufacturing target structure - Google Patents
Target structure and method for manufacturing target structure Download PDFInfo
- Publication number
- CN101960043A CN101960043A CN2010800012070A CN201080001207A CN101960043A CN 101960043 A CN101960043 A CN 101960043A CN 2010800012070 A CN2010800012070 A CN 2010800012070A CN 201080001207 A CN201080001207 A CN 201080001207A CN 101960043 A CN101960043 A CN 101960043A
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- China
- Prior art keywords
- target
- retaining plate
- fluid flowing
- flowing path
- constructions
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
A target structure is manufactured with lower cost in a short time, while maintaining heat conductivity between a target and a backing plate. The target structure has the target for sputtering, and the backing plate, which has the target fixed thereon and cools the target. The backing plate has a fluid channel (40) wherein a cooling fluid flows, the backing plate and the target are fixed by means of a screw penetrating the backing plate at a position where no fluid channel exists, and a part of the target is exposed to the fluid channel.
Description
Technical field
The present invention relates to have the target that splash uses and be fixed with this target and be used to cool off the target constructions and the manufacture method thereof of the cooling plate of this target.
Background technology
In the manufacturing processed of for example semiconductor device etc., use and on substrate, carry out film forming spraying and splashing facility.Spraying and splashing facility has by the collision of Ionized gas etc. emits the target that the splash of desired atom is used.This target T as shown in Figure 4, its rear side is bonded on the backboard B.When splash, owing to rise by the temperature on target surfaces such as ionic collision, therefore, must cooled target T.Thus, in the inside of backboard B, be formed with water coolant stream A for common flow of cooling water.
In the past, for example be used for the refrigerative heat conductivity for improving, target T and backboard B engage by so-called bonding.Bonding is that bonding material C is folded on the junction surface of target T and backboard B, is undertaken by target T and backboard B are fitted.
Patent documentation 1: open communique 2007-051308 number of Japanese Patent
But above-mentioned bonding uses the higher bonding materials such as In, Sn of price, a plurality of operations such as in addition, the upgrading that need carry out the aligned in position of target and backboard or junction surface is handled, the coating of bonding material, heat treated.Therefore, in bonding, cost cost and time.On the other hand, do not fix with additive method merely if do not carry out bonding, then the heat conductivity between target and the backboard reduces.
Summary of the invention
The present invention researches and develops in view of the above problems, and its objective is provides a kind of target constructions and manufacture method thereof with target and retaining plate, can keep the heat conductivity between the retaining plates such as target and backboard, and can make at short notice with lower cost.
To achieve these goals, target constructions of the present invention has: the target that splash is used; Be fixed with this target and be used for this target is carried out the refrigerative retaining plate, on described retaining plate, be formed with the but fluid flowing path of fluid flow of cooling, the relative many relative positions of part of the consumption of described target when this fluid flowing path is formed on splash, described retaining plate and described target are by in the screw retention that does not have on the position of described fluid flowing path to connect described retaining plate, and the part of described target is exposed to described fluid flowing path.
According to the present invention, because by screw retention target and retaining plate, so can simplify the manufacturing process of target constructions.Thus, and compare, can significantly reduce manufacturing cost by bonding fixed situation.In addition, manufacturing time also can significantly shorten.And, owing to the part of target is exposed to fluid flowing path, so can guarantee the heat conductivity between target and the retaining plate.The consumption of target was many and become on the pyritous part when in addition, the fluid flowing path of retaining plate was set at splash.Thus, as the present invention, by fixing target and retaining plate at the screw that does not have on the position of described fluid flowing path to connect described retaining plate, thus, and can be in the consumption of target few position, just the part of being kept at the thickness of target is carried out screw threads for fastening.Therefore, even be consumed, also can keep the fixing of target and retaining plate by long use target.
Can be on the surface that is fixed with described target of described retaining plate, be formed with the groove that flows for described cooling fluid, described target and described retaining plate are fixed by described screw, and described thus groove is sealed by described target and forms described fluid flowing path.Under this situation, for example do not need the situation that connects inner fluid flowing path as on retaining plate, being formed with,, therefore, can easily carry out the processing of retaining plate with cutting apart for example welding between half retaining plate of formation in advance etc.In addition, when pulling down target, the fluid flowing path of retaining plate exposes, so, for example, also can check and remove the foreign matter that is trapped in the fluid flowing path by using for a long time.Thus, can prolong the product life of retaining plate.
In addition, can on the surface on the described retaining plate of being fixed in of described target, be formed with the protuberance that is entrenched in the described groove and seals described groove.Under this situation, can guarantee the thickness of target in the part of protuberance, so, even thereby the highly compressed cooling fluid that flows in fluid flowing path improves cooling efficiency, also can guarantee the patience of target.In addition, owing to protuberance is embedded in the groove, so the resistance to air loss of fluid flowing path improves.And, can easily carry out the location of periodic admittedly target and retaining plate.
According to the manufacture method of the target constructions of the present invention of other viewpoints, this target constructions has: the target that splash is used; Be fixed with this target and be used for this target is carried out the refrigerative retaining plate, with cooling but the fluid flowing path of fluid flow be formed on the described retaining plate with splash the time described target the relative position of the relative many part of consumption on, by fixing described retaining plate and described target, and the part of described target is exposed to described fluid flowing path at the screw that does not have on the position of described fluid flowing path to connect described retaining plate.
The effect of invention
According to the present invention, can keep the heat conductivity between target and the retaining plate, and can make target constructions at short notice with lower cost.
Description of drawings
Fig. 1 is the explanatory view in longitudinal section of the structure of expression target constructions.
Fig. 2 is the explanatory view of overlooking when observing target constructions.
Fig. 3 is the explanatory view of the target constructions of the state that is consumed by splash of expression target.
Fig. 4 is the explanatory view in longitudinal section of the structure of the expression target constructions that used bonding.
Embodiment
Below, with reference to accompanying drawing preferred implementation of the present invention is described.Fig. 1 is the explanatory view of vertical section of general configuration of the target constructions 1 of expression present embodiment.In addition, in this specification sheets and accompanying drawing,, mark identical Reference numeral and omit repeat specification about having the integrant of essence identical functions structure.
Target constructions 1 has: the tabular target 10 that splash is used; Be fixed with the tabular backboard 11 of target 10 and cooled target 10 as retaining plate.For the material of target 10, use for example Al, Cu, Mo, ITO, Si, AZO etc., for the material of backboard 11, use for example Cu or Al, Ti, stainless steel etc.
The rear side of target 10 is fitted on the backboard 11.On the surface of target 10 sides of backboard 11, be formed with the groove 20 that flows for the cooling fluid that is used for cooled target 10.Groove 20 be with for example with the relative mode in position of the magnet M of the spraying and splashing facility that is provided with target constructions 1, be configured to overlook for example shown in Figure 2ly and observe roughly U font.The processing of groove 20 is for example undertaken by mechanical workout.In addition, spraying and splashing facility is for example to produce magnetic field by magnet M, and by this magnetic field control example such as ion, and make ion and target 10 collisions.
As shown in Figure 1, be formed with in the rear side of target 10 chimeric and be used for the protuberance 30 of enclosed slot 20 with groove 20.Protuberance 30 forms overlooks the roughly U word shape identical with groove 20.Protuberance 30 forms than the depth as shallow of groove 20, when protuberance 30 is entrenched in the groove 20, and the peristome of protuberance 30 enclosed slots 20 and form fluid flowing path 40.Thus, the part of target 10 is exposed to fluid flowing path 40.In the fluid flowing path 40, for example two ends are formed with the i.e. gangway of water coolant for example of cooling fluid, flow in fluid flowing path 40 by making water coolant, and backboard 11 is adjusted to low temperature, can pass through these backboard 11 cooled targets 10.In addition, the protuberance 30 of target 10 forms by mechanical workout or extrusion molding.
In addition, the outside of the fluid flowing path 40 between backboard 11 and target 10 is provided with cyclic sealing member 60.
When making target constructions 1, protuberance 30 is embedded under the state in the groove 20, backboard 11 and target 10 are fixing by screw 50.At this moment, screw 50 is set at the position that does not have fluid flowing path 40.Fix by this, the part of target 10 is exposed to fluid flowing path 40.
According to above embodiment, because by screw 50 fixed target 10 and backboard 11, so can simplify the manufacturing process of target constructions 1.Thus, and compare, can significantly reduce manufacturing cost by bonding fixed situation.In addition, manufacturing time also significantly shortens.And, owing to the part of target 10 is exposed to fluid flowing path 40, so can guarantee the heat conductivity between target 10 and the backboard 11.In addition, owing to fix target 10 and backboard 11 by the screw 50 that connects backboard 11 in the position that does not have fluid flowing path 40, so, as shown in Figure 3, can just on the part that the thickness of target 10 is kept, carry out screw threads for fastening in consumption (minimizing) the few position of distance magnet M during splash than far away and target 10.Therefore, by long use,, also can keep the fixing of target 10 and backboard 11 even target 10 is consumed.
And, owing to do not carry out bonding, so bonding material can not pulled down used target 10 as the target raw material from backboard 11 and utilize attached on the target 10.In addition, in the splash process, can prevent to pollute the situation of handling substrate because of the material that the ion impact bonding material is emitted from bonding material.And, during fabrication, owing to unlike bonding, use heat, thus can not need the warpage of backboard 11 is revised for example producing the warpage that causes because of heat on the backboard 11, and can prevent the deterioration of backboard 11 self.
In addition, in the above-described embodiment, be formed with groove 20 on the surface that is fixed with target 10 of backboard 11, target 10 and backboard 11 are fixed by screw threads for fastening, and therefore, groove 20 is sealed by target 10 and forms fluid flowing path 40.Under this situation, as for example on backboard 11, being formed with the situation that connects inner fluid flowing path, for example do not need therefore, can to carry out the processing of backboard 11 easily to welding between half backboard of cutting apart formation in advance etc.In addition, when pulling down target 10, the fluid flowing path 40 of backboard 11 exposes, so, for example by using for a long time, also can check and remove the foreign matter that is trapped in the fluid flowing path 40.Thus, can prolong the product life of backboard 11.
In addition, in the above-described embodiment,, be formed with the protuberance 30 of and enclosed slot 20 chimeric with groove 20 being fixed on the surface on the backboard 11 of target 10.Therefore, the part of protuberance 30 can be guaranteed the thickness of target 10, so, even thereby the highly compressed cooling fluid that flows in fluid flowing path 40 improves cooling efficiency, also can guarantee the patience of target 10.In addition, protuberance 30 is arranged, so the resistance to air loss of fluid flowing path 40 improves owing to chimeric in groove 20.And, can easily carry out the location of periodic admittedly target 10 and backboard 11.
More than, with reference to accompanying drawing preferred implementation of the present invention is illustrated, but the invention is not restricted to described example.To those skilled in the art, in the category of the thought of in the scope of claims, putting down in writing, can easily expect various modifications or revise example that they also belong to technical scope of the present invention certainly.
The explanation of Reference numeral
1 target constructions
10 targets
11 backboards
20 grooves
30 protuberances
40 fluid flowing paths
50 screws
Claims (4)
1. a target constructions has: the target that splash is used; Be fixed with this target and be used for this target is carried out the refrigerative retaining plate, it is characterized in that,
On described retaining plate, be formed with the but fluid flowing path of fluid flow of cooling, when this fluid flowing path is formed on splash on the relative position of the relative many part of the consumption of described target,
Described retaining plate and described target are fixed by the screw that connects described retaining plate in the position that does not have described fluid flowing path,
The part of described target is exposed to described fluid flowing path.
2. target constructions as claimed in claim 1 is characterized in that, on the surface that is fixed with described target of described retaining plate, is formed with the groove that flows for described cooling fluid,
Described target and described retaining plate are fixed by described screw, and thus, described groove is sealed by described target and forms described fluid flowing path.
3. target constructions as claimed in claim 2 is characterized in that, on the surface on the described retaining plate of being fixed on of described target, is formed with the protuberance that is entrenched in the described groove and seals described groove.
4. the manufacture method of a target constructions, this target constructions has: the target that splash is used; Be fixed with this target and be used for this target is carried out the refrigerative retaining plate, the manufacture method of target constructions is characterised in that,
With cooling but the fluid flowing path of fluid flow be formed on the described retaining plate with splash the time described target the relative position of the relative many part of consumption on, fix described retaining plate and described target by passing through the screw of putting logical described retaining plate, and the part of described target is exposed to described fluid flowing path in the position that does not have described fluid flowing path.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009011919A JP4382867B1 (en) | 2009-01-22 | 2009-01-22 | Target structure and method for manufacturing target structure |
| JP2009-011919 | 2009-01-22 | ||
| PCT/JP2010/050555 WO2010084857A1 (en) | 2009-01-22 | 2010-01-19 | Target structure and method for manufacturing target structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101960043A true CN101960043A (en) | 2011-01-26 |
Family
ID=41549762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010800012070A Pending CN101960043A (en) | 2009-01-22 | 2010-01-19 | Target structure and method for manufacturing target structure |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4382867B1 (en) |
| KR (1) | KR101059940B1 (en) |
| CN (1) | CN101960043A (en) |
| TW (1) | TW201033388A (en) |
| WO (1) | WO2010084857A1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104588807A (en) * | 2013-10-31 | 2015-05-06 | 宁波江丰电子材料股份有限公司 | Method for forming backboard and backboard |
| CN107851548A (en) * | 2015-07-24 | 2018-03-27 | 应用材料公司 | The cooling and utilization optimization for the metallic target that temperature-sensitive bonds |
| CN108018534A (en) * | 2017-12-12 | 2018-05-11 | 中国电子科技集团公司第四十八研究所 | A kind of magnetron sputtering plating clamping device for clamping target |
| CN110684951A (en) * | 2018-09-07 | 2020-01-14 | 住华科技股份有限公司 | Backing plate, sputtering target material using backing plate and using method of sputtering target material |
| CN110828021A (en) * | 2019-11-04 | 2020-02-21 | 中国原子能科学研究院 | Water cooling mechanism for medical isotope production target |
| CN112239852A (en) * | 2019-07-18 | 2021-01-19 | 东京毅力科创株式会社 | Target structure and film forming apparatus |
| CN112323026A (en) * | 2020-10-29 | 2021-02-05 | 珠海和泽科技有限公司 | Target material back plate and manufacturing method thereof |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY160316A (en) * | 2010-07-23 | 2017-02-28 | Jx Nippon Mining & Metals Corp | Magnetic material sputtering target provided with groove in rear face of target |
| JP5721815B2 (en) * | 2011-04-12 | 2015-05-20 | 株式会社アルバック | Target and target manufacturing method |
| KR101079621B1 (en) * | 2011-06-30 | 2011-11-03 | 박경일 | Glueless type connecting structure of target and backing plate |
| CN102501045B (en) * | 2011-10-20 | 2014-10-08 | 宁波江丰电子材料股份有限公司 | Method and device for processing nickel target component |
| KR20180068335A (en) * | 2015-11-12 | 2018-06-21 | 허니웰 인터내셔널 인코포레이티드 | Sputter target backing plate assembly with cooling structure |
| CN111455335B (en) * | 2020-04-24 | 2022-10-21 | 河北恒博新材料科技股份有限公司 | Binding method of planar target material |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE126931T1 (en) * | 1989-06-05 | 1995-09-15 | Balzers Hochvakuum | METHOD FOR COOLING TARGETS AND COOLING DEVICE FOR TARGETS. |
| JPH0625839A (en) * | 1992-01-10 | 1994-02-01 | Sony Corp | Sputtering device and cathode |
| JP3747447B2 (en) * | 1996-11-08 | 2006-02-22 | ソニー株式会社 | Sputtering equipment |
| JP2000026962A (en) * | 1998-07-09 | 2000-01-25 | Matsushita Electric Ind Co Ltd | Sputtering device |
-
2009
- 2009-01-22 JP JP2009011919A patent/JP4382867B1/en not_active Expired - Fee Related
-
2010
- 2010-01-19 CN CN2010800012070A patent/CN101960043A/en active Pending
- 2010-01-19 KR KR1020107019956A patent/KR101059940B1/en not_active IP Right Cessation
- 2010-01-19 WO PCT/JP2010/050555 patent/WO2010084857A1/en active Application Filing
- 2010-01-22 TW TW99101819A patent/TW201033388A/en not_active IP Right Cessation
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104588807A (en) * | 2013-10-31 | 2015-05-06 | 宁波江丰电子材料股份有限公司 | Method for forming backboard and backboard |
| CN107851548A (en) * | 2015-07-24 | 2018-03-27 | 应用材料公司 | The cooling and utilization optimization for the metallic target that temperature-sensitive bonds |
| CN108018534A (en) * | 2017-12-12 | 2018-05-11 | 中国电子科技集团公司第四十八研究所 | A kind of magnetron sputtering plating clamping device for clamping target |
| CN108018534B (en) * | 2017-12-12 | 2020-12-11 | 中国电子科技集团公司第四十八研究所 | Magnetron sputtering coating clamping device for clamping target material |
| CN110684951A (en) * | 2018-09-07 | 2020-01-14 | 住华科技股份有限公司 | Backing plate, sputtering target material using backing plate and using method of sputtering target material |
| CN112239852A (en) * | 2019-07-18 | 2021-01-19 | 东京毅力科创株式会社 | Target structure and film forming apparatus |
| CN112239852B (en) * | 2019-07-18 | 2023-11-14 | 东京毅力科创株式会社 | Target structure and film forming apparatus |
| CN110828021A (en) * | 2019-11-04 | 2020-02-21 | 中国原子能科学研究院 | Water cooling mechanism for medical isotope production target |
| CN112323026A (en) * | 2020-10-29 | 2021-02-05 | 珠海和泽科技有限公司 | Target material back plate and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010168621A (en) | 2010-08-05 |
| JP4382867B1 (en) | 2009-12-16 |
| KR101059940B1 (en) | 2011-08-29 |
| KR20100114923A (en) | 2010-10-26 |
| WO2010084857A1 (en) | 2010-07-29 |
| TWI359202B (en) | 2012-03-01 |
| TW201033388A (en) | 2010-09-16 |
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Application publication date: 20110126 |