CN104588807B - The forming method of backboard and backboard - Google Patents
The forming method of backboard and backboard Download PDFInfo
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- CN104588807B CN104588807B CN201310534650.XA CN201310534650A CN104588807B CN 104588807 B CN104588807 B CN 104588807B CN 201310534650 A CN201310534650 A CN 201310534650A CN 104588807 B CN104588807 B CN 104588807B
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- cover plate
- cooling water
- backboard
- water channel
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
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- Organic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The forming method of a kind of backboard and backboard.The forming method of its dorsulum includes: providing base plate and cover plate, described base plate is plate top surface towards the surface of described cover plate side, and described plate top surface is plane, and described cover plate bottom surface is plane, and the bottom of described cover plate has cooling water channel groove-like structure；Described cooling water channel groove-like structure and described base plate composition cooling water channel；Utilize soldering processes to be welded with plate top surface cover plate bottom surface, form backboard.The method adopting the present invention can reduce the assembly difficulty coefficient of cover plate and solder, base plate, and the backboard solder bond rate of formation is high.It addition, be not easy so that cover plate deforms.
Description
Technical field
The present invention relates to semiconductor applications, particularly relate to forming method and the backboard of a kind of backboard.
Background technology
In vacuum splashing and plating technique, target material assembly is made up of the target meeting sputtering performance and the backboard with some strength.Described backboard is not only played a supporting role in described target material assembly, and has effect of conduction heat, therefore, for the heat radiation of target in vacuum splashing and plating technique.Particularly as follows:
In vacuum splashing and plating process, target material assembly working environment is comparatively harsh.Its temperature higher (such as 300 DEG C to 500 DEG C), target material assembly is in high voltage electric field and the bigger magnetic field of magnetic field intensity, and front is 10-9Under the high vacuum environment of Pa, it is subject to various high-energy ion bombardment, causes target to sputter, and the neutral target atom sputtered or molecule deposition form thin film on substrate.The temperature of target material assembly can sharply raise, so that by the heat of the backboard transmission in target material assembly the target that dissipates rapidly, and avoids thus producing that target material assembly deforms, target material assembly shortens service life, affect the problems such as substrate coating quality.In prior art, cooling water channel is set in backboard, cooling water in cooling water channel can absorb and the heat of dissipation target and backboard rapidly, and the backboard thus with cooling water channel is possible to prevent target material assembly deformation, improves the service life of target material assembly and improve coating quality.
In prior art, with reference to Fig. 1 and Fig. 2, the backboard 10 with cooling water channel is rectangle backboard, base plate 11, cover plate 12 and joint 13 are welded.Concrete structure includes:
Base plate 11 is rectangle.Base plate 11 has the target mounting groove 111 for installing target, and target mounting groove 111 is rectangular slot.Forming two joint mounting grooves 112 on base plate around target mounting groove 111, the water inlet (not shown) of cooling-water duct is exposed in the bottom of a joint mounting groove 112；The outlet (not shown) of cooling-water duct is exposed in the bottom of another joint mounting groove 112.Joint mounting groove 112 is used for erection joint 13.
Cover plate 12, for cuboid, cover plate 12 is placed in bottom the target mounting groove 111 of base plate 11, and target is installed on cover plate 12.Having the opening cooling water channel groove-like structure 121 ' towards base plate (opening direction is outside) bottom cover plate 12, this cooling water channel groove-like structure 121 ' forms cooling-water duct 121 with target mounting groove 111 bottom surface.
Two joints 13, a joint 13 has inlet opening, and joint 13 is arranged on (with reference to Fig. 1) in joint mounting groove 112, and inlet opening connects the water inlet of cooling water channel 121, inputs cooling water by this joint 13 to the cooling water channel 121 of backboard.Another joint 13 has apopore, and another joint 13 is arranged on another joint mounting groove 112, and apopore connects the outlet of cooling water channel 121, cools down water by another joint 13 from cooling water channel 121 output.
With reference to Fig. 3, the method forming above-mentioned backboard 10 is as follows:
First, it is provided that the base plate 11 of said structure, cover plate 12 and two joints 13.Then, the first solder (not shown) is laid in target mounting groove 111 bottom surface of base plate 11, is placed on the first solder by cover plate 12 to realize the assembling of base plate 11 and cover plate 12.Then, second solder (not shown) is positioned over the bottom of two joint mounting grooves 112, then two joints 13 are arranged in two joint mounting grooves 112, soldering processes are adopted to be welded with target mounting groove 111 bottom surface cover plate 12 bottom surface, welding bottom joint 13 with joint mounting groove 112, such backboard is the formation of.
In prior art, cover plate is big with the assembly difficulty coefficient of solder, base plate, and the backboard solder bond rate of formation is low.Additionally, solder can fill up in gap place between base plate target mounting groove sidewall and cover sidewall, the solder at this gap place can have a strong impact on the attractive in appearance of backboard, need to spend substantial amounts of manpower and time to be removed by the solder at this gap place, remove in the process of this gap place solder, it is easy to cover plate is deformed.
Summary of the invention
Present invention solves the technical problem that and be: in prior art, cover plate is big with the assembly difficulty coefficient of solder, base plate, and the backboard solder bond rate of formation is low.
Additionally, can there is solder in the gap place between base plate target mounting groove sidewall and cover sidewall, the solder at this gap place can have a strong impact on the attractive in appearance of backboard, need to spend substantial amounts of manpower and time to be removed by the solder at this gap place, remove in the process of this gap place solder, it is easy to cover plate is deformed.
For solving the problems referred to above, the present invention provides the forming method of a kind of backboard, including:
Thering is provided base plate and cover plate, described base plate is plate top surface towards the surface of described cover plate side, and described plate top surface is plane, and described cover plate bottom surface is plane, and the bottom of described cover plate has cooling water channel groove-like structure；
Described cooling water channel groove-like structure and described base plate composition cooling water channel；
Utilize soldering processes to be welded with plate top surface cover plate bottom surface, form backboard.
Optionally, described base plate is the space structure surrounded by described end face, bottom surface and the side between end face, bottom surface, and described end face is parallel with bottom surface, and described side is perpendicular to described end face.
Optionally, described backboard also includes joint, and described cover plate top has the joint mounting groove holding described joint, and described joint bottom surface is connected with described joint mounting groove underrun Welding；
Described joint mounting groove is even number, and the described joint of half quantity is respectively provided with inlet opening, and the described joint of second half quantity is respectively provided with apopore, and described inlet opening communicates with the water inlet of cooling water channel, and described apopore communicates with the outlet of cooling water channel；
Or, described joint mounting groove is one, and described joint has inlet opening and apopore simultaneously, and described inlet opening communicates with the water inlet of cooling water channel, and described apopore communicates with the outlet of cooling water channel.
Optionally, described soldering processes adopt solder be shaped as hollow out lamellar.
Optionally, the material of the solder that described soldering processes adopt is silver-base solder.
Optionally, the material of described base plate, described cover plate and described joint is copper alloy, and described soldering processes carry out in described vacuum brazing furnace, and the vacuum of described vacuum brazing furnace is less than or equal to 10-3Pa, the pressure of described vacuum brazing furnace is 50kg～100kg；
The temperature of vacuum brazing furnace is risen to the first heating-up temperature be more than or equal to 10 DEG C/min and the first programming rate less than or equal to 15 DEG C/min, described first heating-up temperature is be more than or equal to 500 DEG C and less than or equal to 600 DEG C, and is incubated be more than or equal to 30min and less than or equal to 50min under the first heating-up temperature;
Be incubated under described first heating-up temperature be more than or equal to 30min and less than or equal to 50min after, the temperature of vacuum brazing furnace is risen to the second heating-up temperature be more than or equal to 3 DEG C/min and the second programming rate less than or equal to 5 DEG C/min, described second heating-up temperature is be more than or equal to 880 DEG C and less than 900 DEG C, and is incubated be more than or equal to 50min and less than or equal to 60min under the second heating-up temperature.
Optionally, be incubated under the first heating-up temperature be more than or equal to 30min and less than or equal to the step of 50min after, with be more than or equal to 3 DEG C/min and the second programming rate less than or equal to 5 DEG C/min the temperature of vacuum brazing furnace risen to the second heating-up temperature step before, also comprise the following steps:
The temperature of vacuum brazing furnace is risen to the 3rd heating-up temperature be more than or equal to 5 DEG C/min and the 3rd programming rate less than or equal to 10 DEG C/min, described 3rd heating-up temperature is be more than or equal to 800 DEG C and less than 850 DEG C, and is incubated be more than or equal to 15min and less than or equal to 20min under the 3rd heating-up temperature.
The present invention also provides for a kind of backboard, including:
Base plate and cover plate,
Described base plate is plate top surface towards the surface of described cover plate side, and described plate top surface is plane, and described cover plate bottom surface is plane, and the bottom of described cover plate has cooling water channel groove-like structure, described cooling water channel groove-like structure and described base plate composition cooling water channel；
The bottom surface of described cover plate is connected by Welding with described plate top surface.
Optionally, described base plate is the space structure surrounded by described end face, bottom surface and the side between end face, bottom surface, and described end face is parallel with bottom surface and be plane, and described side is perpendicular to described end face.
Optionally, described backboard also includes joint, and described cover plate top has the joint mounting groove holding described joint, and described joint bottom surface is connected with described joint mounting groove underrun Welding；
Described joint mounting groove is even number, and the described joint of half quantity is respectively provided with inlet opening, and the described joint of second half quantity is respectively provided with apopore, and described inlet opening communicates with the water inlet of cooling water channel, and described apopore communicates with the outlet of cooling water channel；
Or, described joint mounting groove is one, and described joint has inlet opening and apopore simultaneously, and described inlet opening communicates with the water inlet of cooling water channel, and described apopore communicates with the outlet of cooling water channel.
Technical scheme has the advantage that
Bottom is had cover plate and the solder of cooling water channel groove-like structure, the end face of base plate carries out in the process assembled, described base plate is plane towards the surface of described cover plate side, bottom described cover plate be plane so, solder is placed on the assembling process of plate top surface, cover plate is positioned in the assembling process of solder, surrounding is little to the interference factor of described assembling, therefore, easily by cover plate and the solder being positioned over base plate, base plate aligns, so that cover plate and solder, assembly difficulty between base plate reduces, make cover plate and solder, assembly precision between base plate is greatly improved, can be filled up completely with by solder between sidewall bottom and the plate top surface of the cooling water channel groove-like structure of such cover plate, substantially increase the solder bond rate of backboard.And, weld in the cooling water channel formed with plate top surface in the cooling water channel groove-like structure of cover plate and do not have solder, do not result in cooling water channel blocking.Additionally, shape just because of the base plate in technical solution of the present invention, cover plate designs, make not have between sidewall of the bottom plate and cover sidewall gap, certainly without occurring to there is solder situation at this gap place, and then will not waste of manpower and time the solder at gap place be removed, cover plate is without deforming.
Accompanying drawing explanation
Fig. 1 is the planar structure schematic diagram of backboard of the prior art；
Fig. 2 is the stacked section structural representation after the backboard in Fig. 1 assembles along AA direction, the base plate in BB direction, cover plate；
Fig. 3 is Fig. 2 cross-section structure decomposing schematic representation；
Fig. 4 is the planar structure schematic diagram of the backboard in the specific embodiment of the invention；
Fig. 5 is the stacked section structural representation after the backboard in Fig. 4 assembles along CC direction, the base plate in DD direction, cover plate；
Fig. 6 is Fig. 5 cross-section structure decomposing schematic representation；
Fig. 7 is the structural representation processing cover plate in prior art；
Fig. 8 is the structural representation processing cover plate in the specific embodiment of the invention.
Detailed description of the invention
Through research, in prior art, cover plate is big with the assembly difficulty coefficient of solder, base plate, and the backboard solder bond rate of formation is low.Additionally, can there is solder in the gap place between base plate target mounting groove sidewall and cover sidewall, the solder at this gap place can have a strong impact on the attractive in appearance of backboard, need to spend substantial amounts of manpower and time to be removed by the solder at this gap place, remove in the process of this gap place solder, it is easy to make the reason that cover plate deforms to be:
In prior art, solder is laminated structure.Before solder is positioned over the bottom surface of target mounting groove 111, first solder is contacted with the one side with cooling water channel groove-like structure 121 ' of cover plate 12, specifically, solder contacts with the sidewall bottom of composition cooling water channel groove-like structure 121 ', the local removal that cannot will contact with the sidewall bottom of cooling water channel groove-like structure 121 ' in solder, solder after described removal is hollow out laminated structure, and the shape of the non-hollow part in this solder and the shape of cooling water channel groove-like structure 121 ' are one to one.The shape of the non-hollow part in solder why with the shape one_to_one corresponding of cooling water channel groove-like structure 121 ', reason is as follows: in subsequent technique, when cover plate 12 is positioned on the solder of hollow out laminated structure, need to place corresponding with cooling water channel groove-like structure 121 ' for the non-hollow part in solder, so, could be filled up by the non-hollow part of solder between cooling water channel groove-like structure 121 ' sidewall bottom and target mounting groove 111 bottom surface, the solder bond rate of the backboard being subsequently formed is 100%, and, it is prevented from the cooling-water duct being namely subsequently formed at the groove location place of cooling water channel groove-like structure 121 ' and there is solder, in follow-up welding procedure, if cooling water channel has solder, cooling water channel clogging can be there is after this brazing filler metal melts.
Cover plate 12 of the prior art is cuboid, and very thin.The floor space of target mounting groove 111 need to more than the area in the face, cooling water channel groove-like structure 121 ' place in cover plate 12.So, gap can be had between sidewall and the sidewall of cover plate 12 of target mounting groove 111, the purpose that arranges in this gap is: operator can be made to take the surrounding of cover plate 12 cover plate 12 is put into the bottom of target mounting groove 111, can make operator that the position of cover plate 12 is adjusted equally, make the cooling water channel groove-like structure 121 ' of cover plate 12 align with the non-engraved structure place of solder.But, the width in gap of the prior art can not be too big, otherwise can affect the length of the cooling water channel of the backboard being subsequently formed and the aesthetics of whole backboard, therefore, when being placed on solder by cover plate 12, substantially it is difficult to the cooling water channel groove-like structure 121 ' of cover plate 12 and the non-engraved structure place of solder are carried out accurate alignment, therefore, by big for the assembly difficulty coefficient bottom cover plate 12 and solder, assembling target mounting groove 111 in prior art.
In prior art, just because of the non-hollow part of the cooling water channel groove-like structure 121 ' of cover plate 12 and solder cannot accurate alignment, not being filled up completely with by solder between sidewall bottom and the bottom surface of target mounting groove 111 of the cooling water channel groove-like structure 121 ' of cover plate 12, the solder bond rate of the backboard being so subsequently formed is very low.It addition, the setting of the selection of solder in the soldering processes of prior art, technological parameter also contributes to the solder bond rate of backboard.Just because of the non-hollow part of the cooling water channel groove-like structure 121 ' of cover plate 12 and solder cannot accurate alignment, cooling water channel groove-like structure 121 ' is welded with target mounting groove 111 bottom surface in the cooling water channel formed and has solder, it may appear that solder melts blocking cooling water channel phenomenon in welding procedure.Just because of the non-hollow part of the cooling water channel groove-like structure 121 ' of cover plate 12 and solder cannot accurate alignment, after forming backboard, can there is solder in the gap place between base plate target mounting groove sidewall and cover sidewall, the solder at this gap place has a strong impact on the attractive in appearance of backboard, need to spend substantial amounts of manpower and time to be removed by the solder at this gap place, removing in the process of this gap place solder, owing to cover plate is very thin, cover plate is susceptible to deformation.
The present invention provides a kind of backboard.Below in conjunction with accompanying drawing, by specific embodiment, technical scheme is carried out clear, complete description.With reference to Fig. 4 and Fig. 5, backboard 20 includes:
Base plate 21 and cover plate 22, described base plate 21 is plate top surface towards the surface of described cover plate 22 side, described plate top surface plane, described cover plate 22 bottom surface is plane, the bottom of described cover plate 22 has cooling water channel groove-like structure 221 ', and described cooling water channel groove-like structure 221 ' forms cooling-water duct 221 with described base plate 21；
Described cover plate 22 bottom surface is connected by Welding with described base plate 21 end face.
With reference to Fig. 5, base plate 21 in the present embodiment is different from base plate 11 shape of the prior art, base plate 21 is the space structure surrounded by end face 211, bottom surface 212 and the side 213 between end face 211, bottom surface 212, end face 211 is parallel with bottom surface 212 and be plane, and side 213 is perpendicular to end face 211.It is specifically as follows cuboid.Certainly in other embodiments, square, cylinder or meet the base plate 21 of above-mentioned requirements and broadly fall into protection scope of the present invention.
In the present embodiment, the top of cover plate 22 has the mating shapes of the target mounting groove 223 for installing target, the shape of target mounting groove 223 and the target of subsequent installation.In the present embodiment, target mounting groove 223 is rectangular slot, the sidewall of target mounting groove 223 stretches out a segment distance at the opening part of target mounting groove, the portion boundary extended is parallel with the border of target mounting groove, the part extended is epitaxy part 224, epitaxy part 224 has certain thickness h1, is provided with installing hole 225 in epitaxy part 224, is arranged on sputtering machine table by the backboard being subsequently formed by installing hole 225.The bottom surface of cover plate 22 is plane, and the bottom of cover plate 22 also has the opening cooling water channel groove-like structure 221 ' towards bottom surface (outwards), and this cooling water channel groove-like structure 221 ' forms cooling water channel 221 with base plate 21.Cooling water channel 221 has water inlet and outlet.
With continued reference to reference Fig. 5, top at cover plate 22, the surrounding of target mounting groove 223 also has a joint mounting groove 222 holding joint 23, and the number of joint mounting groove 222, distribution are relevant with the shape of cooling water channel 221, and joint mounting groove 222 communicates with water inlet and the outlet of cooling water channel 221.In the present embodiment, joint mounting groove is four, is respectively distributed to the corner of target mounting groove 223.Exposing the water inlet of cooling water channel bottom two of which joint mounting groove 222, the outlet of cooling water channel is exposed in the bottom of two other joint mounting groove 222.Certainly, in other embodiments, joint mounting groove is the even number of more than two or four, and the water inlet of cooling water channel is exposed in the bottom of the described joint mounting groove of half quantity, and additionally the outlet of cooling water channel is exposed in the bottom of the joint mounting groove of half quantity.Certainly, in other embodiments, joint mounting groove can be one, exposes water inlet and the outlet of cooling water channel simultaneously.
Backboard 20 in this enforcement also includes joint 23, corresponding with the number of joint mounting groove 222.Two joints 23 have inlet opening, and when the two joint 23 is arranged on the joint mounting groove 222 of correspondence, inlet opening connects the water inlet of cooling water channel 221, input cooling water by this joint 13 to the cooling water channel 221 of backboard.Another two joint 23 has apopore, and when another two joint 23 is arranged on the joint mounting groove 212 of correspondence, apopore connects the outlet of cooling water channel 221, cools down water by another joint 23 from cooling water channel 221 output.In other embodiments, if joint mounting groove is one, the joint corresponding with this joint mounting groove has inlet opening and apopore simultaneously.
In vacuum splashing and plating process, cooling water flows into cooling water channel 221 by the water inlet of the inlet opening in joint 23, cooling water channel 221, cooling water in cooling water channel 221 flow to outside target material assembly by the apopore of the outlet of cooling water channel 221, joint 23 after absorbing the heat on target material assembly, meanwhile, the heat in target material assembly is also carried over to target material assembly.In the present embodiment, why joint mounting groove is four, is respectively distributed to the corner of target mounting groove 223, is so that the water yield in cooling water channel increases, thus improving the cooling effect of the backboard being subsequently formed.
In the present embodiment, cover plate 22 bottom surface is connected by Welding with described base plate 21 end face, and joint 23 bottom surface is connected with described joint mounting groove 222 underrun Welding.
In the present embodiment, the material of base plate 21, cover plate 22 and joint 23 is copper alloy, and wherein the content of copper is 99.0%～99.9%, why select the copper alloy of above-mentioned content, it is because: if the content of copper is more than 99.9%, the backboard quality meeting deliquescing being subsequently formed, does not meet the support strength requirement of backboard；If the content of copper is too little, the conductivity of the backboard being subsequently formed does not meet the requirement of sputtering.
The method of concrete formation backboard 20 is as follows:
First, perform step S1, place the first solder at described base plate 21 end face.
First solder is solid solder, is rectangle hollow out flake, and non-hollow part is corresponding with the shape of cooling water channel, and laminar first solder is easier to infiltration to Cu alloy material, is conducive to the raising of solder bond rate.
Then, perform step S2, cover plate 22 is placed on the first solder, and the position between cover plate 22 with the first solder, base plate 21 is carried out adjustment of aliging.
Then, performing step S3, place the second solder bottom joint mounting groove 222, the second solder exposes water inlet and the outlet of described cooling water channel 221.
The material of the second solder and the first solder is identical, for circular hollow out flake.
In the present embodiment, the material of base plate 21, cover plate 22 and joint 23 is copper alloy, and wherein the content of copper is 99.0%～99.9%, then silver-base solder selected by the first solder and the second solder.The advantage selecting silver-base solder in the present embodiment is as follows:
(1) when silver-base solder at high temperature realizes the welding of Cu alloy material, silver can well spread infiltration to Cu alloy material, and relative to other solders, the bond strength of the copper alloy backing plate formed after silver-base solder welding is significantly high.
(2) silver-base solder realizes welding in the molten state, and the silver-base solder mobility of molten state is very poor, and in the process of welding, the silver-base solder of molten state may not flow in cooling water channel 221.
(3) silver-base solder is compared with other solders (such as, kupper solder), even if being also less likely to occur oxidation in the molten state.
(4) silver-base solder is stanniferous few, having certain hardness, therefore may be readily formed as flake, the bottom that laminar silver-base solder is directly placed at the end face of base plate 21 and joint mounting groove 222 is easy to operate, be conducive to being smoothed out of follow-up welding, and the backboard weld strength being subsequently formed is high.
Then, performing step S4, inserted by joint 23 and be placed with bottom the described joint mounting groove 222 of the second solder, the bottom surface of joint 23 contacts with the second solder, forms backboard blank.
Described welding procedure carries out in vacuum brazing furnace, and the vacuum of vacuum brazing furnace is less than or equal to 10-3Pa, the pressure of vacuum brazing furnace is 50kg～100kg.
In the present embodiment, in order to prevent backboard blank from aoxidizing in welding process, being set smaller than the vacuum of vacuum brazing furnace being equal to 100Pa, wherein, vacuum is the absolute pressure in given space, different with the concept of the vacuum that routine is understood.Certainly, the vacuum of vacuum brazing furnace is the smaller the better, and backboard blank occurs the probability aoxidized also more little.
The pressure arranging vacuum brazing furnace is 50kg～100kg, it is possible to increase the weld strength of cover plate and base plate, cover plate and joint.If the pressure that vacuum brazing stove applies is excessive, the backboard being subsequently formed is susceptible to deformation, for instance, it is easy to cooling water channel 221 is deformed, situations such as leaking occurs.Certainly, if the pressure of vacuum brazing furnace is less than 50kg, then the weld strength of the backboard being subsequently formed is undesirable.
Described backboard blank is placed in vacuum brazing furnace rear, the temperature of vacuum brazing furnace is risen to the first heating-up temperature be more than or equal to 10 DEG C/min and the first programming rate less than or equal to 15 DEG C/min, described first heating-up temperature is be more than or equal to 500 DEG C and less than or equal to 600 DEG C, and is incubated be more than or equal to 30min and less than or equal to 50min under the first heating-up temperature.
In the present embodiment, described backboard blank is placed in vacuum brazing furnace rear, with the first programming rate to the first heating-up temperature, then be incubated under the first heating-up temperature be more than or equal to 30min and less than or equal to 50min's in order that heating backboard blank, so that backboard blank bulk temperature is consistent, prepare for follow-up soldering, it is prevented that deform in follow-up welding process.Particularly as follows:
First programming rate is if greater than 15 DEG C/min, then the first programming rate is too fast, and backboard too high being not easy of blank hull-skin temperature diffuses to inside, and the internal and external temperature causing backboard blank is uneven, and the backboard blank of non-uniform temperature can deform.Such as, base plate, cover plate or joint can deform.The backboard blank deformed can have a strong impact on the bond strength of follow-up welding.First programming rate is if less than 10 DEG C/min, then the first programming rate is too slow, and the heating-up time is oversize, and time cost and expense are too high.
It is incubated be more than or equal to 30min and less than or equal to 50min under the first heating-up temperature.If be incubated under the first heating-up temperature less than 30min, after then backboard blank reaches the first heating-up temperature, the diffusion that temperature retention time is too short and heat can not be made to carry out abundance, so that the internal and external temperature of backboard blank is inconsistent, and then can cause that backboard blank solder bond intensity in follow-up welding process is not high.If be incubated under the first heating-up temperature more than 50min, then insulation cost is too high.
In the present embodiment, backboard blank be incubated under the first heating-up temperature be more than or equal to 30min and less than or equal to 50min after, the temperature of vacuum brazing furnace is risen to the second heating-up temperature be more than or equal to 3 DEG C/min and the second programming rate less than or equal to 5 DEG C/min, described second heating-up temperature is be more than or equal to 880 DEG C and less than 900 DEG C, and is incubated be more than or equal to 50min and less than or equal to 60min under the second heating-up temperature.
In the present embodiment, the second heating-up temperature is risen to the second programming rate, then be incubated under the second heating-up temperature be more than or equal to 50min and less than or equal to 60min's in order that adopt the first solder cover plate 22 bottom surface is welded with base plate 21 end face, adopt the second solder to be welded with joint mounting groove 222 bottom surface described joint 23 bottom surface, form backboard.
Particularly as follows: the second heating-up temperature is most important to the soldering processes of the present embodiment.Second heating-up temperature is be more than or equal to 880 DEG C and less than 900 DEG C, is because in this temperature range, and the first solder and the second solder can be in molten condition, is capable of between solder with copper alloy strong the welding of binding ability on the one hand；On the other hand, very poor at the first solder and second solder fluidity of molten condition, welding process does not flow in cooling water channel 221, it is prevented that blocking cooling water channel 221.Therefore, the second heating-up temperature is if it exceeds 900 DEG C, and the first solder and the second solder can melt, and easily flow to cooling water channel 221 in welding process, so that cooling water channel blocking；If the second heating-up temperature is lower than 880 DEG C, then the first solder and the second solder cannot realize welding.
In the present embodiment, owing to the second heating-up temperature is most important to the soldering processes of the present embodiment.Therefore, be warming up to the second heating-up temperature to better control second so that it is less than the second heating-up temperature, then the second programming rate is overall less than the first programming rate.If the second programming rate is too fast, more than 5 DEG C/min, then too high being not easy of backboard blank hull-skin temperature diffuses to inside, and the internal and external temperature causing backboard blank is uneven, and the backboard blank of non-uniform temperature can deform.The backboard blank deformed can have a strong impact on the bond strength of follow-up welding.Second programming rate is if less than 3 DEG C/min, then the second programming rate is too slow, and the heating-up time is oversize, and time cost and expense are too high.
Under the second heating-up temperature, temperature retention time is more long more be conducive to the infiltration between solder with copper alloy, phase counterdiffusion, and therefore, solder is more big with the solder bond intensity of copper alloy.In the present embodiment, it is incubated be more than or equal to 50min and less than or equal to 60min under the second heating-up temperature.If be incubated under the second heating-up temperature less than 50min, the infiltration between solder and copper alloy is insufficient, it is insufficient to spread, so that the solder bond intensity between solder and copper alloy is little.If be incubated under the second heating-up temperature more than 60min, then process costs is higher.
In the present embodiment, described backboard blank be incubated under the first heating-up temperature be more than or equal to 30min and less than or equal to the step of 50min after, with be more than or equal to 3 DEG C/min and the second programming rate less than or equal to 5 DEG C/min the temperature of vacuum brazing furnace risen to the second heating-up temperature step before, also comprise the following steps:
The temperature of vacuum brazing furnace is risen to the 3rd heating-up temperature be more than or equal to 5 DEG C/min and the 3rd programming rate less than or equal to 10 DEG C/min, described 3rd heating-up temperature is be more than or equal to 800 DEG C and less than 850 DEG C, and is incubated be more than or equal to 15min and less than or equal to 20min under the 3rd heating-up temperature.
In the present embodiment, with the 3rd programming rate to the 3rd heating-up temperature, then it is incubated be more than or equal to 15min and the purpose less than or equal to 20min under the 3rd heating-up temperature: be conducive to the first solder of solid-state and the second solder to change to molten state, the solder making subsequent melt state can better infiltrate with copper alloy, to improve weld strength.
3rd programming rate is if greater than 10 DEG C/min, then the 3rd programming rate is too fast, and backboard too high being not easy of blank hull-skin temperature diffuses to inside, and the internal and external temperature causing backboard blank is uneven, and the backboard blank of non-uniform temperature can deform.The backboard blank deformed can have a strong impact on the bond strength of follow-up welding.3rd programming rate is if less than 5 DEG C/min, then the 3rd programming rate is too slow, and the heating-up time is oversize, and time cost and expense are too high.
It is incubated be more than or equal to 15min and less than or equal to 20min under the 3rd heating-up temperature, so that backboard blank internal and external temperature is consistent, is more beneficial for the first solder and the second solder and changes to molten state.
After soldering completes, form backboard 20, need also exist for the backboard 20 to being formed after welding and cool down.Described cooling can be air cooling or furnace cooling.When cooling is for air cooling, the rate of cooling of air cooling is slower.If adopting water-cooled or other Cooling Mode, base plate after welding, cover plate and joint are because of generation volume contraction of catching a cold rapidly, it is easy to cause base plate, cover plate and Joint's falling off.When described cooling is furnace cooling, the speed of furnace cooling is also slower than air cooling, and ratio is made directly the effective of air cooling, and, furnace cooling can effectively utilize the waste heat of soldering oven.
In the present embodiment, the selection of the material of solder and the setting of welding condition substantially increase the solder bond rate of follow-up backboard.
The material of the described base plate of the present invention, described cover plate and described joint is not limited to copper alloy, it is also possible to for other materials.
It should be understood that (1) cover plate 22 bottom surface is connected by Welding with described base plate 21 end face, the first solder shape and structure is corresponding with the shape of cooling water channel, for hollow out laminated structure.Need before welding procedure the position between cover plate 22 with the first solder, base plate 21 is carried out adjustment of aliging, including: the edge of cover plate 22, the edge of the first solder and the edge of base plate 21 are mutually aligned.Non-hollow out position Accurate align in the sidewall of the cooling water channel groove-like structure 221 ' in cover plate 22 and the first solder.Only guaranteed above-mentioned position all Accurate aligns, can make to be filled up completely with by the first solder between the sidewall bottom of the cooling water channel groove-like structure 221 ' of cover plate 22 and base plate 21 end face, so can be greatly improved the solder bond rate of backboard.And, weld with base plate 21 end face in the cooling water channel groove-like structure 221 ' of cover plate 22 and the cooling water channel formed does not have solder, and then do not result in cooling water channel blocking.
Base plate 21, why cover plate 22 is said structure, reason is as follows: do not have sidewall around plate top surface 211, cover plate 22 with cooling water channel groove-like structure 221 ' can not by the restriction of described sidewall, can be placed on base plate 21 end face 211 easily, in subsequent technique, cover plate 22 and the first solder, the difficulty of the position adjustment between base plate 21 can be substantially reduced, so that cover plate and the first solder, assembly difficulty between base plate reduces, make cover plate 22 and the first solder, the degree of accuracy that position between base plate 21 is adjusted is greatly improved, make to be filled up completely with by the first solder between the sidewall bottom of the cooling water channel groove-like structure 221 ' of cover plate 22 and base plate 21 end face, substantially increase the solder bond rate of backboard.And, weld in the cooling water channel formed with base plate 21 end face in the cooling water channel groove-like structure 221 ' of cover plate 22 and do not have solder, do not result in cooling water channel blocking.It addition, the shape just because of the base plate in the present invention, cover plate designs so that do not have gap between target mounting groove sidewall and cover sidewall, certainly there is the situation of the first solder at this gap place without generation, cover plate is without deforming.
(2) in the present embodiment, it is processed to form in the process of base plate 21, cover plate 22, is also less likely to occur metaboly, for cover plate 22, it is not easy to the effect of deformation becomes apparent from, further increase the solder bond rate of the backboard being subsequently formed.Specific as follows: with reference to Fig. 7, when cover plate 12 of the prior art is processed cooling water channel groove-like structure, the shape of cover plate 12 determines the both sides that can only adopt the first fixture securing cover plate 22 and it is carried out the processing of cooling water channel groove-like structure, cover plate 12 is made cover plate 12 be easy to be moved in the course of processing by the mode that the first fixture 14 is fixing, and cover plate 12 is too thin, after processing cooling water channel groove-like structure, cover plate 12 can deform.In the present embodiment, with reference to Fig. 8, the top of cover plate 22 has target mounting groove, target mounting groove can be buckled on the second fixture 24, and adopt the epitaxy part 224 of the 3rd fixture 25 securing cover plate 22, so, second and the 3rd the area of fixture securing cover plate 22 more, the course of processing is less likely to occur mobile, and, the thickness of cover plate 22 is much larger than the thickness of cover plate 12 of the prior art, after forming cooling water channel groove-like structure 221 ' bottom processing cover plate 22, the probability that cover plate 22 deforms is only small, and difficulty of processing is substantially reduced.In the present embodiment, a base plate 21 simply cuboid, relative to base plate 11 of the prior art, simple in construction, therefore the difficulty of the base plate 21 in processing the present embodiment is greatly reduced.
(3) when cover plate 22 and the first solder, base plate 21 assemble, first place the first solder at the end face of base plate 21, then, the cover plate with cooling water channel groove-like structure 221 ' is positioned on the first solder, and makes cover plate, the first solder carry out, with base plate, adjustment of aliging.To why cover plate 22, base plate 21 are such assemble sequence and rigging position, reason is as follows: the first solder needs in the lower section of cooling water channel groove-like structure 221 ', if the first solder is formed in the top of cooling water channel groove-like structure 221 ', so in welding process, easily flow into after first brazing filler metal melts in the cooling water channel being subsequently formed, block cooling water channel.
Although the present invention discloses as above with preferred embodiment, but the present invention is not limited to this.Any those skilled in the art, without departing from the spirit and scope of the present invention, all can make various changes or modifications, and therefore protection scope of the present invention should be as the criterion with claim limited range.
Claims (9)
1. the forming method of a backboard, it is characterised in that including:
Thering is provided base plate and cover plate, described base plate is plate top surface towards the surface of described cover plate side, and described plate top surface is plane, and described cover plate bottom surface is plane, and the bottom of described cover plate has cooling water channel groove-like structure；
Described cooling water channel groove-like structure and described base plate composition cooling water channel；
Utilize soldering processes to be welded with plate top surface cover plate bottom surface, form backboard；
The material of described base plate and described cover plate is copper alloy, and described soldering processes carry out in vacuum brazing furnace, and the vacuum of described vacuum brazing furnace is less than or equal to 10-3Pa, the pressure of described vacuum brazing furnace is 50kg～100kg；
The temperature of vacuum brazing furnace is risen to the first heating-up temperature be more than or equal to 10 DEG C/min and the first programming rate less than or equal to 15 DEG C/min, described first heating-up temperature is be more than or equal to 500 DEG C and less than or equal to 600 DEG C, and is incubated be more than or equal to 30min and less than or equal to 50min under the first heating-up temperature；
Be incubated under described first heating-up temperature be more than or equal to 30min and less than or equal to 50min after, the temperature of vacuum brazing furnace is risen to the second heating-up temperature be more than or equal to 3 DEG C/min and the second programming rate less than or equal to 5 DEG C/min, described second heating-up temperature is be more than or equal to 880 DEG C and less than 900 DEG C, and is incubated be more than or equal to 50min and less than or equal to 60min under the second heating-up temperature.
2. the forming method of backboard as claimed in claim 1, it is characterised in that described base plate is the space structure surrounded by described end face, bottom surface and the side between end face, bottom surface, and described end face is parallel with bottom surface, and described side is perpendicular to described end face.
3. the forming method of backboard as claimed in claim 1, it is characterized in that, described backboard also includes joint, and the material of described joint is copper alloy, described cover plate top has the joint mounting groove holding described joint, and described joint bottom surface is connected with described joint mounting groove underrun Welding；
Described joint mounting groove is even number, and the described joint of half quantity is respectively provided with inlet opening, and the described joint of second half quantity is respectively provided with apopore, and described inlet opening communicates with the water inlet of cooling water channel, and described apopore communicates with the outlet of cooling water channel；
Or, described joint mounting groove is one, and described joint has inlet opening and apopore simultaneously, and described inlet opening communicates with the water inlet of cooling water channel, and described apopore communicates with the outlet of cooling water channel.
4. the forming method of backboard as claimed in claim 1, it is characterised in that the solder that described soldering processes adopt be shaped as hollow out lamellar.
5. the forming method of backboard as claimed in claim 1, it is characterised in that the material of the solder that described soldering processes adopt is silver-base solder.
6. the forming method of backboard as claimed in claim 1, it is characterized in that, be incubated under the first heating-up temperature be more than or equal to 30min and less than or equal to the step of 50min after, with be more than or equal to 3 DEG C/min and the second programming rate less than or equal to 5 DEG C/min the temperature of vacuum brazing furnace risen to the second heating-up temperature step before, also comprise the following steps:
The temperature of vacuum brazing furnace is risen to the 3rd heating-up temperature be more than or equal to 5 DEG C/min and the 3rd programming rate less than or equal to 10 DEG C/min, described 3rd heating-up temperature is be more than or equal to 800 DEG C and less than 850 DEG C, and is incubated be more than or equal to 15min and less than or equal to 20min under the 3rd heating-up temperature.
7. a backboard, it is characterised in that including:
Base plate and cover plate, described base plate is plate top surface towards the surface of described cover plate side, and described plate top surface is plane, and described cover plate bottom surface is plane, the bottom of described cover plate has cooling water channel groove-like structure, described cooling water channel groove-like structure and described base plate composition cooling water channel；
The bottom surface of described cover plate is connected by Welding with described plate top surface.
8. backboard as claimed in claim 7, it is characterised in that described base plate is the space structure surrounded by described end face, bottom surface and the side between end face, bottom surface, described end face is parallel with bottom surface and be plane, and described side is perpendicular to described end face.
9. backboard as claimed in claim 7, it is characterised in that described backboard also includes joint, and described cover plate top has the joint mounting groove holding described joint, and described joint bottom surface is connected with described joint mounting groove underrun Welding；
Described joint mounting groove is even number, and the described joint of half quantity is respectively provided with inlet opening, and the described joint of second half quantity is respectively provided with apopore, and described inlet opening communicates with the water inlet of cooling water channel, and described apopore communicates with the outlet of cooling water channel；
Or, described joint mounting groove is one, and described joint has inlet opening and apopore simultaneously, and described inlet opening communicates with the water inlet of cooling water channel, and described apopore communicates with the outlet of cooling water channel.
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| CN108070834B (en) * | 2016-11-18 | 2020-02-04 | 宁波江丰电子材料股份有限公司 | Back plate and forming method thereof |
| CN108232367A (en) * | 2016-12-15 | 2018-06-29 | 河南科隆汽车散热器有限公司 | A kind of new energy car battery group heat converter structure |
| CN112144034B (en) * | 2019-06-27 | 2022-12-30 | 昆山世高新材料科技有限公司 | Cooling back plate |
| CN111975161A (en) * | 2020-08-19 | 2020-11-24 | 扬州船用电子仪器研究所(中国船舶重工集团公司第七二三研究所) | Welding parting and preprocessing method for plate type pulsating heat pipe |
| CN112355427A (en) * | 2020-11-02 | 2021-02-12 | 河南东微电子材料有限公司 | Method for welding magnesium oxide target and back plate |
| CN112475796B (en) * | 2020-11-11 | 2022-04-15 | 宁波江丰电子材料股份有限公司 | Welding method of target assembly |
| CN112372165B (en) * | 2020-11-30 | 2022-06-17 | 宁波江丰电子材料股份有限公司 | Welding method of target cooling back plate |
| CN113927115A (en) * | 2021-11-09 | 2022-01-14 | 宁波江丰电子材料股份有限公司 | Welding method of back plate |
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| JP4408493B2 (en) * | 1999-09-10 | 2010-02-03 | パナソニック株式会社 | Film deposition method and apparatus |
| JP2001150126A (en) * | 1999-11-26 | 2001-06-05 | Mitsuo Kawai | Brazing method and plate type heat exchanger brazed by the method |
| JP4382867B1 (en) * | 2009-01-22 | 2009-12-16 | 順 上野 | Target structure and method for manufacturing target structure |
| CN102059519A (en) * | 2010-12-03 | 2011-05-18 | 宁波江丰电子材料有限公司 | Method for preparing back plate and back plate structure |
| CN201999986U (en) * | 2011-01-21 | 2011-10-05 | 许舒华 | Back panel structure with cooling flow passages |
| CN202063989U (en) * | 2011-04-25 | 2011-12-07 | 柏夫企业有限公司 | Backboard structure for target |
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