CN202063989U - Backboard structure for target - Google Patents
Backboard structure for target Download PDFInfo
- Publication number
- CN202063989U CN202063989U CN2011201239929U CN201120123992U CN202063989U CN 202063989 U CN202063989 U CN 202063989U CN 2011201239929 U CN2011201239929 U CN 2011201239929U CN 201120123992 U CN201120123992 U CN 201120123992U CN 202063989 U CN202063989 U CN 202063989U
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- Prior art keywords
- upper cover
- cover plate
- substrate
- cooling water
- water channel
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Abstract
The utility model relates to a backboard structure for a target, which comprises an upper cover board and a base board, wherein the base board is provided with at least one welding bead, at least one cooling water channel, at least one water inlet end and at least one water outlet end; at least one positioning hole is formed on the upper cover board and corresponds to the welding bead on the base board; the upper cover board and the base board are combined and fixed along the welding bead. The disadvantages of complex manufacturing process and high equipment cost for manufacturing a backboard of the target are overcome, and the purposes of low distortion of the backboard of the target and high seal of an internal cooling water channel are achieved.
Description
Technical field
The utility model relates to a kind of target rear panel structure, refers in particular to a kind of target with upper cover plate and substrate, and utilizes arc welding and laser welding processing procedure bonded to found.
Background technology
In production such as Thin Film Transistor-LCD (TFT-LCD) and semiconductor crystal wafer, vacuum coating film equipment such as electricity slurry formula chemical vapour deposition (Plasma enhance chemical vapor deposition, PECVD) equipment and physical vapor deposition (Physical vapor deposition, PVD) equipment etc., all need adopt the target backboard with fixing and carrying target, and utilize target backboard cooling target, and the high torrid zone that target is produced in film-plating process is walked to dispel the heat.
The target backboard that tradition has cooling water channel mainly is to adopt the oxygen free copper material to be processed to form the substrate with cooling water channel, then with the upper cover plate covered substrate of oxygen free copper material, then again the seam of substrate and upper cover plate is carried out seal welding, and the geomery of target backboard is done last processing.Advantage by oxygen free copper material energy rapid absorption heat, tradition target backboard can be produced target rapidly in film-plating process heat of high temperature is taken away, yet because the density of oxygen free copper material is big and intensity is not good, therefore cause the target backboard need possess enough thickness to gain in strength, and then make that the weight of traditional target backboard is also heavier relatively, and cause problems such as material cost increase and welding difficulty.
Therefore, present target backboard has gradually adopted pure titanium equal strength preferable and have the material of high thermal conductivity, to replace the oxygen free copper material that tradition is used.The intensity of pure titanium material is preferable, thus can make the thickness of target backboard less relatively, and its density is about the oxygen free copper material half, and the weight that therefore can alleviate the target backboard reaches more than 50%.For PECVD equipment, the target backboard that gradually adopts pure titanium material to make helps better space planning, because of its can adopt vertical and electromagnetic control assembly in the vacuum cavity outside, and then have the processing procedure optimization effect.
Yet, adopt the target backboard of pure titanium material abroad mainly with its substrate of electrons leaves welding and upper cover plate at present, it need weld under the state of vacuum, therefore its equipment cost and technical need are higher, and then make the manufacturing cost of target backboard also improve relatively, and because the control of beam energy is determining the result of welding, if controlling too conference, its energy punctures welded article, and if its energy is controlled the depth of penetration that young pathbreaker too influences welding, and then make substrate separate because of the hydraulic pressure effect causes metal fatigue easily with upper cover plate, so its technical difficulty degree is higher.In addition, the TFT-LCD production is applied to colored filter (Color filter at present, CF) section is made tin indium oxide (Indium tin oxides, ITO) nesa coating and making black matrix" (Black matric, BM) chromium (Chromium in, Cr) the target backboard of the film-plating process of film is just towards large-area trend development.For in response to this trend development, except the target backboard being disassembled into many small areas make, otherwise just need to use relatively large electrons leaves welding equipment to weld, therefore the method for known making target backboard is comparatively complicated and need higher equipment cost.
Summary of the invention
Technical problem to be solved in the utility model is: at above-mentioned the deficiencies in the prior art, a kind of target rear panel structure is provided, can improve shortcomings such as known target backboard processing procedure complexity and equipment cost costliness, and reach the purpose of low deformation rate of target backboard and inner cooling water channel high sealing simultaneously.
In order to solve the problems of the technologies described above, the technical scheme that the utility model adopted is: a kind of target rear panel structure, comprise upper cover plate and substrate, be characterized in: described substrate has been made at least one welding bead and at least one cooling water channel, at least one feed-water end and at least one water side; This upper cover plate forms hole, certain at least position, and this at least one pilot hole corresponds at least one welding bead on the substrate; This upper cover plate engages fixing with this substrate along this welding bead.
Described cooling water channel is sealed between this upper cover plate and substrate, and this water coolant enters this cooling water channel and leaves this cooling water channel via this water side via this feed-water end.
The another kind of technical scheme that the utility model adopts is: a kind of target rear panel structure, comprise an at least one upper cover plate and a substrate, be characterized in: have at least one accommodation space on the described substrate with ccontaining this upper cover plate, and the periphery of this accommodation space is stepped and near this upper cover plate; This upper cover plate forms hole, certain at least position, and this pilot hole corresponds at least one welding bead on this substrate, and this upper cover plate is fixed and the location by this pilot hole and engaging of welding bead with this substrate.
Comprise at least one first cooling water channel and at least one second cooling water channel on the described substrate in addition, this second cooling water channel connects this first cooling water channel and adjacent with this first cooling water channel, and the water coolant in this first cooling water channel can not leak to this second cooling water channel via the joint face between this upper cover plate and this substrate.
Welding bead in the such scheme is straight line, circular arc or curve.Above-mentioned upper cover plate and this substrate can be made by titanium, iron, stainless steel, nickelalloy, aluminium alloy, magnesium alloy, copper alloy or titanium alloy.
The utility model has the advantages that: this target rear panel structure processing procedure is simple, can reduce equipment cost, and can reach the purpose of low distortion of target backboard and inner cooling water channel high sealing.
Description of drawings:
Fig. 1 is the exploded view of the target backboard of the utility model first embodiment.
Fig. 2 is the making schema of the target backboard of the utility model first embodiment.
Fig. 3 is the schematic top plan view of the target backboard of the utility model first embodiment.
Fig. 4 is the diagrammatic cross-section of the target backboard of the utility model second embodiment.
Fig. 5 is the making schema of the target backboard of the utility model second embodiment.
Label declaration:
Step S10 forms hole, certain at least position in upper cover plate
Step S20 carries out consent welding processing procedure
Step S30 carries out one first laser composite welding processing procedure
10 target backboards, 12 upper cover plates
14 substrates, 16 pilot holes
18 welding beads, 20 cooling water channels
22 feed-water ends, 24 water sides
30 peripheries, 32 spot welding positions
34 line of cut step S50 carry out a spot welding processing procedure
Step S60 carries out one first laser composite welding processing procedure, 40 target backboards
42 upper cover plates, 44 substrates
46 accommodation spaces, 48 peripheries
50 spot welding positions, 52 welding beads
54 first cooling water channels, 56 second cooling water channels
58 joint faces, 60 pilot holes
Embodiment:
For making the purpose of this utility model, structural attitude and function thereof there are further understanding, cooperate related embodiment and graphic being described in detail as follows now:
Please be simultaneously with reference to Fig. 1 and Fig. 2, it is respectively the making method schema of the target backboard of the exploded view of target backboard of the utility model first embodiment and the utility model first embodiment.Target backboard 10 shown in the utility model first embodiment is applied to equipment such as PECVD and PVD, has function fixing, that carry and cool off target, it comprises upper cover plate 12 and substrate 14, wherein upper cover plate 12 is that materials such as titanium, iron, stainless steel, nickelalloy, aluminium alloy, magnesium alloy, copper alloy or titanium alloy are made with substrate 14, and the outward appearance of target backboard 10 can be rectangle, circle or Any shape such as square.The target rear panel structure of the utility model first embodiment is to use welding with in conjunction with upper cover plate 12 and substrate 14.Wherein, this substrate 14 has been made at least one welding bead 18 and at least one cooling water channel 20, at least one feed-water end 22 and at least one water side 24, then form certain at least position hole 16(step S10 on this upper cover plate 12), this pilot hole 16 can utilize methods such as boring or punching, pilot hole 16 is formed on the upper cover plate 12 of corresponding at least one welding bead 18.Then, carry out consent welding processing procedure (step S20), it utilizes an arc welding with welding pilot hole 16 and welding bead 18, fixing by this and location upper cover plate 12 and substrate 14.Then, carry out one first laser composite welding processing procedure (step S30), it utilizes arc welding and laser welding simultaneously, and (Laser beam welding is LBM) with along welding bead 18 welding upper cover plates 12 and substrates 14.
Above-mentioned arc welding is to utilize an electrode to produce a pyritous electric arc, and this Arc Temperature can reach more than 3000 ℃, and with electrode and deposits yields fusion to be welded, reaches the purpose of joint.Wherein, arc welding can be rare gas element tungsten bar arc welding (Inert-gas tungsten arc welding, GTAW), rare gas element metal arc welding (Inert-gas metal arc welding, GMAW) or the arc welding of electricity slurry (Plasma arc welding, PAW).In addition, electrode can be expendable electrode or non-expendable electrode, if non-expendable electrode, then above-mentioned arc welding need utilize a metallic stuffing to carry out welding.
Laser welding is to utilize a laser oscillator to produce the laser beam of a single wavelength, and guided laser Shu Jing is just like the optical module of lens, and laser beam is concentrated and focused on the thing to be welded, makes thing to be welded reach its fusing point (but being no more than its boiling point) to carry out welding.Wherein, laser welding can be types such as welding of CO2 laser or the welding of Nd-YAG laser.Be different from electrons leaves welding, laser welding can be welded in air, its have low into heat, deflection is few, speed reaches characteristics such as high depth of penetration soon.
Laser composite welding processing procedure (Laser hybrid welding) carries out welding simultaneously in conjunction with arc welding and laser welding to act on same molten bath.Therefore, laser composite welding processing procedure possesses the high depth of penetration and the high-level efficiency of laser welding, and the arc characteristic of cooperation arc welding is with agitation molten pool, and then reduce the air holes of welding bead 18 and improve welding quality, and because the heat of going into of laser composite welding processing procedure is about tradition and only uses 1/5 to 1/10 of arc welding, so the deflection of welded article can reduce about 1/3 to 1/5 relatively.In addition, more can arrange in pairs or groups, near the zone that is higher than 300 ℃ the welding bead 18 is all covered the high purity rare gas element, take place and protection welding bead 18 with the phenomenon that reduces high temperature oxidation as the design of protection of inert gas atmosphere such as argon gas, nitrogen or helium.
Please be simultaneously with reference to Fig. 3, it is the target backboard schematic top plan view of the utility model first embodiment.System's announcement, consent welding processing procedure utilizes arc welding with welding pilot hole 16 and welding bead 18, fixes and positions upper cover plate 12 and substrate 14 by this, utilizes anchor clamps fixed cover plate 12 shortcoming that the obstruction welding operation carries out with substrate 14 to save known need.Then, the first laser composite welding processing procedure utilizes arc welding and laser welding with along welding bead 18 welding upper cover plates 12 and substrates 14 simultaneously, make cooling water channel 20 sealed and a water coolant can not leaked via the joint face (not shown) of 14 of upper cover plate 12 and substrates, and water coolant enter cooling water channel 20 and leave cooling water channel 20 via water side 24 via feed-water end 22.Wherein the path of welding bead 18 can be selected from the group that straight line, circular arc and curve are formed.
The utility model first embodiment comprises in addition and carries out one second laser composite welding processing procedure, it utilizes arc welding and laser welding with the periphery 30 frit seal upper cover plates 12 and substrates 14 along upper cover plate 12 simultaneously, and then makes that the water coolant in the cooling water channel 28 can be via the joint face leakage of 14 of upper cover plate 12 and substrates.In addition, before the second laser composite welding processing procedure, the utility model first embodiment can comprise a spot welding processing procedure in addition, and it utilizes the periphery 30 and substrate 14 of arc welding at least one spot welding position 32 welding upper cover plates 12, with fixing and location upper cover plate 12 and substrate 14.
It should be noted that, be the length of cooperation target backboard 10 and the requirement of dimensions, the upper cover plate 12 or the substrate 14 of the utility model first embodiment target backboard 10 also can be according to different designs, as resolving into plural piece according to line of cut 34, and utilize as above-mentioned spot welding processing procedure and laser is compound or the laser welding processing procedure to engage.
Please be simultaneously with reference to Fig. 4 and Fig. 5, it is respectively the making method schema of the target backboard of the diagrammatic cross-section of target backboard of the utility model second embodiment and the utility model second embodiment.Shown in the present embodiment, this target backboard 40 comprises several upper cover plates 42 and a substrate 44.Has at least one accommodation space 46 on the substrate 44 with ccontaining upper cover plate 42, and the periphery 48 of accommodation space 46 is stepped and near upper cover plate 42, wherein upper cover plate 42 is that materials such as titanium, iron, stainless steel, nickelalloy, aluminium alloy, magnesium alloy, copper alloy or titanium alloy are made with substrate 44, and the outward appearance of target backboard 40 can be rectangle, circle or Any shape such as square.The making method of the target backboard of the utility model second embodiment is to use welding with in conjunction with upper cover plate 42 and substrate 44.At first, carry out a spot welding processing procedure (step S50), it utilizes the periphery 48 and upper cover plate 42 of an arc welding at least one spot welding position 50 welding accommodation spaces 46, to fix and position upper cover plate 42 and substrate 44.Then, carry out one first laser composite welding processing procedure (step S60), it utilizes arc welding and a laser welding with along periphery 48 frit seal upper cover plates 42 and substrates 44 simultaneously.
The utility model second embodiment comprises in addition and carries out one second laser composite welding processing procedure, its be utilize simultaneously arc welding and laser welding with at least one welding bead 52 on substrate 44 with welding upper cover plate 42 and substrate 44, wherein the path of welding bead 52 is selected from the group that straight line, circular arc and curve are formed.It should be noted that, comprise at least one first cooling water channel 54 and at least one second cooling water channel 56 on the substrate 44, second cooling water channel 56 connects first cooling water channel 54 and adjacent with first cooling water channel 54, second laser composite welding processing procedure system is along welding bead 52 welding upper cover plates 42 and substrates 44, so that the water coolant in first cooling water channel 54 can not leak to second cooling water channel 56 via the joint face 58 of 44 of upper cover plate 42 and substrates.
In addition, the utility model second embodiment can comprise hole 60, the certain at least position of formation in addition in upper cover plate 42 before the second laser composite welding processing procedure, and it is the welding bead 52 on the corresponding substrate 44 and pilot hole 60 is formed at upper cover plate 42.Then, carry out consent welding processing procedure, it is to utilize arc welding with welding pilot hole 60 and welding bead 52, fixing by this and location upper cover plate 42 and substrate 44.
Compared to known technology, target rear panel structure of the present utility model is in conjunction with arc welding and laser welding processing procedure, it can improve known target backboard making method needs to weld under the state of vacuum because of using the electrons leaves welding processing procedure, therefore need that the target backboard of large-size is disassembled into many small areas and make or use relatively large electrons leaves welding equipment, cause process complexity to increase and problem such as equipment cost costliness to weld.In addition, known target backboard making method is if omnidistance only the employing has the arc welding processing procedure that height is gone into heat, to cause target backboard after the welding to produce the problem of high deflection, target rear panel structure of the present utility model removes can improve the problems referred to above, and has the advantage of high depth of penetration, high-level efficiency, high welding quality and inner cooling water channel high sealing.
Claims (8)
1. a target rear panel structure comprises upper cover plate and substrate, it is characterized in that: described substrate has been made at least one welding bead and at least one cooling water channel, at least one feed-water end and at least one water side; This upper cover plate forms hole, certain at least position, and this at least one pilot hole corresponds at least one welding bead on the substrate; This upper cover plate engages fixing with this substrate along this welding bead.
2. target rear panel structure as claimed in claim 1 is characterized in that: described cooling water channel is sealed between this upper cover plate and substrate, and this water coolant enters this cooling water channel and leaves this cooling water channel via this water side via this feed-water end.
3. target rear panel structure as claimed in claim 1 is characterized in that: described welding bead is straight line, circular arc or curve.
4. target rear panel structure as claimed in claim 1 is characterized in that: described upper cover plate and this substrate are made by titanium, iron, stainless steel, nickelalloy, aluminium alloy, magnesium alloy, copper alloy or titanium alloy.
5. a target rear panel structure comprises an at least one upper cover plate and a substrate, it is characterized in that: have at least one accommodation space on the described substrate with ccontaining this upper cover plate, and the periphery of this accommodation space is stepped and near this upper cover plate; This upper cover plate forms hole, certain at least position, and this pilot hole corresponds at least one welding bead on this substrate, and this upper cover plate is fixed and the location by this pilot hole and engaging of welding bead with this substrate.
6. target rear panel structure as claimed in claim 5, it is characterized in that: comprise at least one first cooling water channel and at least one second cooling water channel on the described substrate in addition, this second cooling water channel connects this first cooling water channel and adjacent with this first cooling water channel, and the water coolant in this first cooling water channel can not leak to this second cooling water channel via the joint face between this upper cover plate and this substrate.
7. target rear panel structure as claimed in claim 5 is characterized in that: described welding bead is straight line, circular arc or curve.
8. target rear panel structure as claimed in claim 5 is characterized in that: described upper cover plate and this substrate are made by titanium, iron, stainless steel, nickelalloy, aluminium alloy, magnesium alloy, copper alloy or titanium alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201239929U CN202063989U (en) | 2011-04-25 | 2011-04-25 | Backboard structure for target |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201239929U CN202063989U (en) | 2011-04-25 | 2011-04-25 | Backboard structure for target |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202063989U true CN202063989U (en) | 2011-12-07 |
Family
ID=45057858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201239929U Expired - Fee Related CN202063989U (en) | 2011-04-25 | 2011-04-25 | Backboard structure for target |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202063989U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104416253A (en) * | 2013-09-02 | 2015-03-18 | 宁波江丰电子材料股份有限公司 | Backboard forming method and backboard |
| CN104583453A (en) * | 2012-09-05 | 2015-04-29 | 应用材料公司 | Target cooling for physical vapor deposition (PVD) processing systems |
| CN104588807A (en) * | 2013-10-31 | 2015-05-06 | 宁波江丰电子材料股份有限公司 | Method for forming backboard and backboard |
| CN104668897A (en) * | 2013-12-03 | 2015-06-03 | 宁波江丰电子材料股份有限公司 | Method for forming back plate |
| CN104741776A (en) * | 2013-12-31 | 2015-07-01 | 宁波江丰电子材料股份有限公司 | Welding method of target component |
| CN113549889A (en) * | 2021-07-30 | 2021-10-26 | 宁波江丰电子材料股份有限公司 | Target material assembly and using method |
| CN114346800A (en) * | 2022-01-10 | 2022-04-15 | 合肥微睿光电科技有限公司 | Surface grinding method, workpiece, deposition apparatus and grinding station |
-
2011
- 2011-04-25 CN CN2011201239929U patent/CN202063989U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104583453A (en) * | 2012-09-05 | 2015-04-29 | 应用材料公司 | Target cooling for physical vapor deposition (PVD) processing systems |
| CN104416253A (en) * | 2013-09-02 | 2015-03-18 | 宁波江丰电子材料股份有限公司 | Backboard forming method and backboard |
| CN104588807A (en) * | 2013-10-31 | 2015-05-06 | 宁波江丰电子材料股份有限公司 | Method for forming backboard and backboard |
| CN104668897A (en) * | 2013-12-03 | 2015-06-03 | 宁波江丰电子材料股份有限公司 | Method for forming back plate |
| CN104741776A (en) * | 2013-12-31 | 2015-07-01 | 宁波江丰电子材料股份有限公司 | Welding method of target component |
| CN104741776B (en) * | 2013-12-31 | 2016-07-06 | 宁波江丰电子材料股份有限公司 | The welding method of target material assembly |
| CN113549889A (en) * | 2021-07-30 | 2021-10-26 | 宁波江丰电子材料股份有限公司 | Target material assembly and using method |
| CN114346800A (en) * | 2022-01-10 | 2022-04-15 | 合肥微睿光电科技有限公司 | Surface grinding method, workpiece, deposition apparatus and grinding station |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111207 Termination date: 20200425 |
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| CF01 | Termination of patent right due to non-payment of annual fee |