CN113549889A - Target material assembly and using method - Google Patents
Target material assembly and using method Download PDFInfo
- Publication number
- CN113549889A CN113549889A CN202110878168.2A CN202110878168A CN113549889A CN 113549889 A CN113549889 A CN 113549889A CN 202110878168 A CN202110878168 A CN 202110878168A CN 113549889 A CN113549889 A CN 113549889A
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- Prior art keywords
- target
- target assembly
- lower plate
- assembly
- welding
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Links
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000013077 target material Substances 0.000 title claims description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 27
- 238000003466 welding Methods 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 229910052755 nonmetal Inorganic materials 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical group [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 abstract description 14
- 238000004544 sputter deposition Methods 0.000 abstract description 9
- 238000012360 testing method Methods 0.000 description 9
- 238000001755 magnetron sputter deposition Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 2
- -1 specifically Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention provides a target assembly and a use method thereof. According to the target assembly, the circulating water channel is arranged on the lower plate, so that the cooling is guaranteed during product sputtering, the self weight of the product is reduced, the threaded holes are positioning mounting holes during use, the structure is simple, the target assembly is convenient and practical, and the target assembly has high safety, stability and reliability.
Description
Technical Field
The invention belongs to the technical field of sputtering targets, relates to the design of targets, and particularly relates to a target assembly and a use method thereof.
Background
In the vacuum sputtering process, the target assembly is composed of a target meeting the sputtering performance and a back plate with certain strength. The back plate not only plays a supporting role when the target assembly is assembled to a sputtering base station, but also has the effect of conducting heat, and is used for heat dissipation of the target in the magnetron sputtering process. The method specifically comprises the following steps: in the magnetron sputtering process, the working environment of the target assembly is harsh. The temperature is high (such as 300-500 ℃), the target material assembly is in a high-voltage electric field and a magnetic field with high magnetic field intensity, the front surface of the target material assembly is bombarded by various high-energy ions in a high-vacuum environment, the target material is sputtered, and sputtered neutral target atoms or molecules are deposited on the substrate to form a film. During the magnetron sputtering process, the temperature of the target assembly is increased sharply, so that the heat of the target needs to be transferred and dissipated rapidly through a back plate in the target assembly, and the problems of target deformation, short service life of the target, influence on the coating quality of a substrate and the like caused by the heat are avoided. Therefore, in the practical operation process of magnetron sputtering of the target assembly, the back surface of the back plate adopts a high-pressure cooling water impact measure to dissipate heat of the target assembly.
CN204474752U discloses a magnetron sputtering device and a cathode target assembly thereof, the magnetron sputtering device includes a cathode target assembly, wherein the cathode target assembly includes a cathode target, a magnet and a cooling channel, the length extending direction of the cooling channel is consistent with the length extending direction of the cathode target, the width extending direction of the cooling channel is consistent with the width extending direction of the cathode target, the cooling channel includes at least two groups of water gap groups, each group of water gap group includes a water inlet and a water outlet, the water inlet and the water outlet located in the same water gap group are oppositely arranged along the width direction of the cooling channel, and the at least two groups of water gaps are arranged along the length direction of the cooling channel. So set up, cooling water flows along cooling channel's width direction, can guarantee the uniformity of the temperature of the cooling water in the cooling channel, and then can guarantee the uniformity of cathode plate cooling effect to can guarantee the uniformity of coating layer performance.
CN213235677U discloses a copper target assembly welding structure and a copper target assembly comprising the same, wherein the structure comprises a back plate and a copper target, a groove and a boss which are matched with each other are respectively arranged on the back plate and the copper target, end face threads are arranged on the surface of the groove, and the fit clearance between the boss and the groove is controlled, so that the welding area can be further increased, the welding combination rate is improved, the effect of high welding rate can be achieved for the copper target which is difficult to weld, and the qualification rate of the copper target is finally improved; the copper target material component welded by the welding structure is not easy to fall off in the sputtering process of the target material, cannot influence a chip and has high industrial application value.
CN104513952B discloses a method for manufacturing a target assembly and a target assembly, wherein the method for manufacturing a target assembly includes: providing a first target material assembly blank, wherein the first target material assembly blank comprises a back plate and a target material fixed on the back plate; performing first machining on the first target assembly blank to form a second target assembly blank, wherein the surface of a back plate of the second target assembly blank is smooth; oxidizing the surface of the back plate of the second target assembly blank to form an oxide film on the surface of the back plate; and carrying out first cleaning on the oxidized second target assembly blank to form a target assembly. The target assembly formed by the manufacturing method has higher quality of a film layer formed on a substrate, the cost of a magnetron sputtering process is lower, and a sputtering machine table for mounting the target assembly cannot be polluted.
However, the film layer formed on the substrate by the target assembly in the prior art is not high in quality, and the cost of the magnetron sputtering process is high, so that the target assembly provided by the prior art can ensure the target cooling effect, and the technical problem to be solved by the technical personnel in the field is solved.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a target assembly and a use method thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the invention provides a target assembly, which comprises an upper plate, a lower plate and a target, wherein the upper plate, the lower plate and the target are fixedly connected in sequence from bottom to top, and a circulating water channel is arranged on the upper plate and/or the lower plate.
According to the target assembly, the circulating water channel is arranged on the lower plate, so that the cooling is guaranteed during product sputtering, the self weight of the product is reduced, the threaded holes are positioning mounting holes during use, the structure is simple, the target assembly is convenient and practical, and the target assembly has high safety, stability and reliability.
It should be noted that the present invention is not particularly limited to the structural features such as the size and shape of the upper plate and the lower plate, and the upper plate and the lower plate serve as the cover plate and the back plate of the target assembly in the present invention, so it can be understood that other upper plates and lower plates capable of performing such functions can be used in the present invention, and those skilled in the art can adaptively adjust the size and shape of the upper plate and the lower plate according to the use scenario and the test condition.
As a preferable technical solution of the present invention, the lower plate is provided with a circulating water channel.
It should be noted that the present invention does not specifically require and specially limit the structural features such as the size and shape of the circulating water channel, and the circulating water channel in the present invention is used to inject water into the circulating water channel, so that the processing temperature can be effectively reduced during the processing of the target assembly.
As a preferred technical solution of the present invention, the upper plate, the lower plate and the target are connected by welding.
It should be noted that, the connection mode and connection material of the upper plate, the lower plate and the target material are not specifically required or limited, and the upper plate, the lower plate and the target material are fixedly connected in the present invention, so it can be understood that other connection modes and connection materials capable of achieving such functions can be used in the present invention, and those skilled in the art can adaptively adjust the connection mode and connection material according to the use scenario and test conditions.
Preferably, the welding material adopted for welding the upper plate and the lower plate is silver wax.
Preferably, the welding material used for welding the lower plate and the target is indium.
In a preferred embodiment of the present invention, the lower plate and the upper plate are made of metal.
Preferably, the metal is copper.
As a preferred technical solution of the present invention, the target material is a non-metal.
It should be noted that the present invention does not specifically require and specially limit the structural features such as the size and shape of the target, and the target functions as a necessary condition for forming the target assembly in the present invention, so it can be understood that other targets capable of achieving such functions can be used in the present invention, and those skilled in the art can adapt the size and shape of the target according to the use scenario and the test condition.
Preferably, the non-metal is silicon carbide.
As a preferable technical scheme of the invention, the two ends of the circulating water channel are respectively provided with a water inlet and a water outlet.
As a preferable technical scheme of the invention, the circulating water channel is uniformly coiled on the lower plate.
Preferably, the circulating water channel is coiled in a serpentine shape.
As a preferable technical scheme of the invention, at least two threaded holes are arranged between the water inlet and the water outlet.
It should be noted that the present invention does not specifically require and specially limit the structural features such as the size and shape of the threaded hole, and the threaded hole in the present invention is used as a positioning mounting hole for positioning when the target assembly is mounted, so it can be understood that other threaded holes capable of achieving such functions can be used in the present invention, and those skilled in the art can adaptively adjust the size and shape of the threaded hole according to the use scenario and test conditions.
Preferably, the number of the threaded holes is 2 to 6, for example, 2, 3, 4, 5, 6, but not limited to the recited values, and other values not recited in the range of values are also applicable.
As a preferred technical solution of the present invention, the edges of the lower plate, the upper plate and the target material are respectively and correspondingly provided with at least two welding holes.
Preferably, the number of the welding holes is 4 to 12, for example, 4, 5, 6, 7, 8, 9, 10, 11, 12, but not limited to the recited values, and other values not recited in the range of the values are also applicable.
In a second aspect, the present invention provides a method of using the target assembly of the first aspect, the method comprising: and the circulating water channel of the target material assembly is injected with water, so that the production temperature during product processing can be reduced.
Compared with the prior art, the invention has the beneficial effects that:
according to the target assembly, the circulating water channel is arranged on the lower plate, so that the cooling is guaranteed during product sputtering, the self weight of the product is reduced, the threaded holes are positioning mounting holes during use, the structure is simple, the target assembly is convenient and practical, and the target assembly has high safety, stability and reliability.
Drawings
Fig. 1 is a schematic structural view of a target assembly according to an embodiment of the present invention;
fig. 2 is a side view of a target assembly according to one embodiment of the present invention;
wherein, 1-upper plate; 2-lower plate; 3-a target material; 4-a threaded hole; 5-a water inlet; 6-water outlet; 7-welding holes; 8-circulating water channel.
Detailed Description
It is to be understood that in the description of the present invention, the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be taken as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
It should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "disposed," "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
It should be understood by those skilled in the art that the present invention necessarily includes necessary piping, conventional valves and general pump equipment for achieving the complete process, but the above contents do not belong to the main inventive points of the present invention, and those skilled in the art can select the layout of the additional equipment based on the process flow and the equipment structure, and the present invention is not particularly limited to this.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
In one embodiment, the present invention provides a target assembly, as shown in fig. 1 and 2, comprising an upper plate 1, a lower plate 2 and a target 3 fixedly connected in sequence from bottom to top, specifically, a circulating water channel 8 is provided on the upper plate 1 and/or the lower plate 2.
In the invention, the lower plate 2 is provided with the circulating water channel 8 to ensure the cooling of the product during sputtering and reduce the self weight of the product, and the threaded holes 4 are positioning mounting holes during use, so that the structure is simple, the device is convenient and practical, and the target 3 assembly has higher safety, stability and reliability.
It should be noted that the present invention does not specifically require and specially limit the structural features such as the size and shape of the upper plate 1 and the lower plate 2, and the upper plate 1 and the lower plate 2 serve as the cover plate and the back plate of the target assembly in the present invention, so it can be understood that other upper plates 1 and lower plates 2 capable of implementing such functions can be used in the present invention, and those skilled in the art can adaptively adjust the size and shape of the upper plate 1 and the lower plate 2 according to the use scenario and the test condition.
The lower plate 2 is provided with a circulating water channel 8. It should be noted that the present invention does not specifically require and specially limit the structural features such as the size and shape of the circulating water channel 8, and the circulating water channel 8 in the present invention is used to inject water into the circulating water channel 8, so that the processing temperature can be effectively reduced during the processing of the target assembly, and therefore, it can be understood that other circulating water channels 8 capable of achieving such functions can be used in the present invention, and those skilled in the art can adaptively adjust the size and shape of the circulating water channel 8 according to the use scenario and the test condition.
The upper plate 1, the lower plate 2 and the target 3 are connected by welding. It should be noted that, the connection mode and connection material of the upper plate 1, the lower plate 2 and the target 3 are not specifically required or limited, and the function of the present invention is to fixedly connect the upper plate 1, the lower plate 2 and the target 3, so it can be understood that other connection modes and connection materials capable of realizing such functions can be used in the present invention, and those skilled in the art can adaptively adjust the connection mode and connection material according to the use scenario and test conditions.
The welding material used for welding the upper plate 1 and the lower plate 2 is silver wax, and the welding material used for welding the lower plate 2 and the target 3 is indium. The lower plate 2 and the upper plate 1 are made of metal, specifically, copper.
The target 3 is made of nonmetal, and further, the nonmetal is silicon carbide.
It should be noted that the present invention does not specifically require and specially limit the structural features such as the size and shape of the target 3, and the target 3 functions as a necessary condition for forming a target assembly in the present invention, so it can be understood that other targets 3 capable of achieving such functions can be used in the present invention, and those skilled in the art can adaptively adjust the size and shape of the target 3 according to the use scenario and the test condition.
The two ends of the circulating water channel 8 are respectively provided with a water inlet 5 and a water outlet 6. The circulating water channel 8 is uniformly coiled on the lower plate 2, and specifically, the circulating water channel 8 is coiled in a serpentine shape.
At least two threaded holes 4 are arranged between the water inlet 5 and the water outlet 6. It should be noted that the present invention does not specifically require and specially limit the structural features such as the size and shape of the threaded hole 4, and the threaded hole 4 serves as a positioning and mounting hole for positioning when the target assembly is mounted, so it can be understood that other threaded holes 4 capable of achieving such functions can be used in the present invention, and those skilled in the art can adaptively adjust the size and shape of the threaded hole 4 according to the use scenario and the test conditions.
The number of the screw holes 4 is 2 to 6, and for example, 2, 3, 4, 5, and 6 are possible, but the number is not limited to the above-mentioned values, and other values not mentioned in the above-mentioned range are also applicable.
The edges of the lower plate 2, the upper plate 1 and the target 3 are correspondingly provided with at least two welding holes 7. Specifically, the number of the welding holes 7 is 4 to 12, and for example, 4, 5, 6, 7, 8, 9, 10, 11, and 12 are possible, but not limited to the enumerated values, and other values not enumerated within the range of the enumerated values are also applicable.
In another embodiment, the present invention provides a method of using the target assembly of one embodiment, the method comprising: the water is injected into the circulating water channel 8 of the target material assembly, so that the production temperature during product processing can be reduced.
The applicant declares that the above description is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and it should be understood by those skilled in the art that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are within the scope and disclosure of the present invention.
Claims (10)
1. The target assembly is characterized by comprising an upper plate, a lower plate and a target which are fixedly connected from bottom to top in sequence, wherein a circulating water channel is arranged on the upper plate and/or the lower plate.
2. The target assembly of claim 1, wherein the lower plate is provided with a circulation channel.
3. The target assembly of claim 1 or 2, wherein the upper plate, the lower plate and the target are connected by welding;
preferably, the welding material adopted for welding the upper plate and the lower plate is silver wax;
preferably, the welding material used for welding the lower plate and the target is indium.
4. The target assembly of any of claims 1-3, wherein the lower plate and the upper plate are both made of metal;
preferably, the metal is copper.
5. The target assembly of any of claims 1-4, wherein the target material is non-metallic;
preferably, the non-metal is silicon carbide.
6. The target assembly of any one of claims 1 to 5, wherein the two ends of the circulating water channel are a water inlet and a water outlet, respectively.
7. The target assembly of any one of claims 1 to 6, wherein the circulating water channel is uniformly coiled on the lower plate;
preferably, the circulating water channel is coiled in a serpentine shape.
8. The target assembly of any of claims 1-7, wherein at least two threaded holes are provided between the water inlet and the water outlet;
preferably, the number of the threaded holes is 2-6.
9. The target assembly of any one of claims 1 to 8, wherein at least two welding holes are correspondingly formed on the edges of the lower plate, the upper plate and the target;
preferably, the number of the welding holes is 4-12.
10. A method of using the target assembly of any of claims 1-9, the method comprising: and the circulating water channel of the target material assembly is injected with water, so that the production temperature during product processing can be reduced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110878168.2A CN113549889A (en) | 2021-07-30 | 2021-07-30 | Target material assembly and using method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110878168.2A CN113549889A (en) | 2021-07-30 | 2021-07-30 | Target material assembly and using method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113549889A true CN113549889A (en) | 2021-10-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110878168.2A Pending CN113549889A (en) | 2021-07-30 | 2021-07-30 | Target material assembly and using method |
Country Status (1)
| Country | Link |
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| CN (1) | CN113549889A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115302206A (en) * | 2022-08-26 | 2022-11-08 | 宁波江丰电子材料股份有限公司 | Thin-wall part with embedded water channel and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202063989U (en) * | 2011-04-25 | 2011-12-07 | 柏夫企业有限公司 | Backboard structure for target |
| CN104513952A (en) * | 2013-09-30 | 2015-04-15 | 宁波江丰电子材料股份有限公司 | Manufacturing method of target material assembly and the target material assembly |
| CN204474752U (en) * | 2015-03-17 | 2015-07-15 | 海南汉能薄膜太阳能有限公司 | A kind of magnetron sputtering equipment and cathode targets assembly thereof |
| CN211689221U (en) * | 2019-10-22 | 2020-10-16 | 有研亿金新材料有限公司 | Back plate with internal water channel groove and target material |
-
2021
- 2021-07-30 CN CN202110878168.2A patent/CN113549889A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202063989U (en) * | 2011-04-25 | 2011-12-07 | 柏夫企业有限公司 | Backboard structure for target |
| CN104513952A (en) * | 2013-09-30 | 2015-04-15 | 宁波江丰电子材料股份有限公司 | Manufacturing method of target material assembly and the target material assembly |
| CN204474752U (en) * | 2015-03-17 | 2015-07-15 | 海南汉能薄膜太阳能有限公司 | A kind of magnetron sputtering equipment and cathode targets assembly thereof |
| CN211689221U (en) * | 2019-10-22 | 2020-10-16 | 有研亿金新材料有限公司 | Back plate with internal water channel groove and target material |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115302206A (en) * | 2022-08-26 | 2022-11-08 | 宁波江丰电子材料股份有限公司 | Thin-wall part with embedded water channel and manufacturing method thereof |
| CN115302206B (en) * | 2022-08-26 | 2024-03-22 | 宁波江丰电子材料股份有限公司 | Manufacturing method of thin-wall part embedded with water channel and thin-wall part |
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