CN213417000U - Target assembly with composite structure - Google Patents

Target assembly with composite structure Download PDF

Info

Publication number
CN213417000U
CN213417000U CN202021922333.7U CN202021922333U CN213417000U CN 213417000 U CN213417000 U CN 213417000U CN 202021922333 U CN202021922333 U CN 202021922333U CN 213417000 U CN213417000 U CN 213417000U
Authority
CN
China
Prior art keywords
target
groove
recess
thickness
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202021922333.7U
Other languages
Chinese (zh)
Inventor
罗婷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Xinyisheng Technology Co ltd
Original Assignee
Shenzhen Xinyisheng Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Xinyisheng Technology Co ltd filed Critical Shenzhen Xinyisheng Technology Co ltd
Priority to CN202021922333.7U priority Critical patent/CN213417000U/en
Application granted granted Critical
Publication of CN213417000U publication Critical patent/CN213417000U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Physical Vapour Deposition (AREA)

Abstract

The utility model belongs to the technical field of the target manufacturing technology and specifically relates to a composite construction's target subassembly, including target and backplate, the backplate is equipped with the recess, and in the target embedded into the recess along thickness direction, the bottom surface and the side of target all closely laminated with the recess, and the ratio of the central thickness of target and the maximum depth of recess is no less than 80%, and the target is compound with the backplate with the welding mode. The utility model discloses the composite construction that well recess closely surrounds the target has increased side area of contact and total area of contact between recess and the target, neither reduces the effective thickness of target and the whole thickness of target subassembly, has realized also that as much as possible target contacts and heat-conduction with the backplate that possesses high thermal conductivity, thereby reduce the whole thermal resistivity of target subassembly, promote the heat conductivility of target subassembly unit interval by a wide margin, the heat conductivility of the compound subassembly of target has been improved effectively, make the target cooling rate fast.

Description

Target assembly with composite structure
Technical Field
The utility model belongs to the technical field of the target manufacturing technology and specifically relates to a composite construction's target subassembly.
Background
Magnetron sputtering is widely applied to the field of material coating. In the sputtering process, the target assembly is used as a cathode and needs to have excellent conductivity; meanwhile, in order to transfer high-density heat generated by high-energy-state ions bombarding the surface of the target at high speed, the target assembly also needs to have excellent thermal conductivity. In order to meet the two performance requirements, the conventional target assembly is mainly composed of a target and a back plate, as shown in fig. 1. The target material is a target material bombarded by high-speed ion beams and belongs to the core part of the target material assembly; the back plate mainly plays a role in fixing the sputtering target and needs to have good electric conduction and heat conduction performance and supporting strength.
For high power magnetron sputtering or high power impulse magnetron sputtering, etc., it is generally desirable to use a higher power or average power. However, too high a power will generate a large amount of heat, which puts high demands on the heat conductivity of the target. If the target material is determined, the reduction of the target thickness is beneficial to the improvement of the target acting power, and the resistivity of the target can also be synchronously reduced. However, under the same conditions, the target material with too thin thickness has short service life, the replacement frequency is increased, and the economic efficiency requirement is not met; therefore, the thickness of the target cannot be reduced without limitation.
In other words, both the heat conduction speed and the heat conduction amount of the target assembly need to be increased to meet the heat conduction requirement of the target. Whereas an excessively thin target thickness clearly does not meet the economic requirements.
As shown in fig. 1, the conventional target assembly generally combines a conventional target 1 and a conventional backing plate 2, and the main contact surfaces of the conventional target 1 and the conventional backing plate 2 are the bottom surface of the conventional target 1 and the top surface of the conventional backing plate 2. The composite structure of the plane stacking type lamination is too simple, the contact area is limited, and the comprehensive requirements of strength, electric conduction and heat conduction under the high-power condition, service life and the like cannot be better met at the same time.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that the existing target material component can not better meet the comprehensive requirements of electric conduction, heat conduction, service life and the like under the conditions of strength and high power.
In order to solve the technical problem, the utility model provides a composite construction's target subassembly, including target and backplate, in the target embedded into the recess along thickness direction, the bottom surface and the side of target all closely laminated with the recess, and 80% is no less than to the ratio of the maximum depth of the central thickness of target and recess, and target and backplate are compound with the welding mode.
Preferably, the target comprises one of a rectangular target, a circular target, and a racetrack target.
Preferably, the cross section of the target material in the thickness direction is one of an inverted trapezoid, a semicircle, a U-shaped cross section and a V-shaped cross section.
Preferably, the target is provided with a cavity, the groove is provided with a protruding structure, the protruding structure and the cavity are in embedded fit with each other, and the side face of the protruding structure is tightly attached to the side wall of the cavity.
Preferably, the top surface of the target is a flat surface, and when the target is embedded in the groove, the top surface of the target is flush with the surface of the back plate.
Preferably, the ratio of the maximum depth of the groove to the total thickness of the back plate is 1:5 to 4: 5.
Preferably, the thickness of the target material is 5-30 mm.
Preferably, the target is made of metal or alloy or ceramic, and the backing plate is made of copper or aluminum.
Preferably, the area of the back plate outside the groove is provided with a plurality of fixing holes.
Implement the utility model discloses, following beneficial effect has:
in the target material component with the composite structure, the shape of the groove is matched with the shape of the part of the target material embedded into the groove, so that the groove is in close contact with the target material embedded part; meanwhile, the way that the groove surrounds the target increases the side contact area and the total contact area between the groove and the target. Compared with a conventional target assembly, the two characteristics are combined, the effective thickness of the target and the overall thickness of the target assembly are not reduced, contact and heat conduction between the target and a back plate with high heat conductivity are realized as much as possible, the overall thermal resistivity of the target assembly is reduced, the heat conductivity of the target assembly in unit time is greatly improved, the heat conductivity of the target composite assembly is effectively improved, and the target cooling speed is high.
Drawings
Fig. 1 is an axial cross-sectional view of a conventional target assembly in the thickness direction;
fig. 2 is a sectional view of the target and the backing plate in the thickness direction before welding the target assembly of the embodiment of the present invention;
FIG. 3 is a sectional view in thickness of the target and backing plate of FIG. 2 in combination;
FIG. 4 is a top view corresponding to FIG. 3;
fig. 5 is a cross-sectional view of the target material in the thickness direction of the embodiment of the present invention, which is an inverted trapezoid;
fig. 6 is a cross-sectional view of the target material in the embodiment of the present invention, the cross-section in the thickness direction being semicircular;
fig. 7 is a cross-sectional view of the target material in the thickness direction of the embodiment of the present invention, which is a U-shaped cross-section;
fig. 8 is a cross-sectional view of the target material in the thickness direction of the embodiment of the present invention, which is a V-shaped cross-section;
fig. 9 is another cross-sectional view of the target and the backing plate in the thickness direction before welding of the target assembly of the present invention;
FIGS. 10 to 16 are top views of a target with a cavity and a back plate assembled together;
fig. 17 is a schematic structural view of a target assembly with a fixing hole according to an embodiment of the present invention.
The reference numbers illustrate:
reference numerals Name (R) Reference numerals Name (R)
1 Conventional target material 210 Groove
2 Conventional backing sheet 2101 Bump structure
10 Target material 220 Fixing hole
20 Back plate
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The invention will be further described with reference to the accompanying drawings and specific embodiments so as to more clearly understand the technical idea claimed in the invention. It should be noted that the present invention is only used in the above, lower, left, right, front, back, inner, outer, etc. words that appear or are about to appear in the text, which is not intended to be specific limitations of the present invention.
In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
The first embodiment of the target assembly of the present invention with a composite structure is provided.
Fig. 2 is a sectional view of the target and the back plate in the thickness direction respectively before welding the target assembly of the embodiment of the present invention, the target assembly specifically includes a target 10 and a back plate 20, the back plate 20 is provided with a groove 210, the target 10 is embedded into the groove 210 in the thickness direction, the bottom surface and the side surface of the target 10 are both tightly attached to the groove 210, the ratio of the center thickness of the target 10 to the maximum depth of the groove 210 is not less than 80%, and the target 10 and the back plate 20 are combined in a welding manner to form a composite structural assembly as shown in fig. 3 and 4.
Specifically, the surface of the back plate 20 on which the groove 210 is disposed may be a surface having a larger area on the back plate. The manner of forming the groove 210 on the back plate 20 may be determined according to actual requirements and conditions, such as back plate material, back plate size, and the like, and may specifically be etching, cutting, casting/stamping, and the like. The processing mode is beneficial to improving the efficiency and the precision of groove forming.
Based on multiple factors such as material properties, processing difficulty, economic cost, etc., preferably, the target material 10 is made of metal or alloy or ceramic, and the backing plate 20 is made of copper or aluminum. Of course, the material used for the target 10 may also be a multilayer composite structure of the above-mentioned preferred materials. The material of the back plate is preferably a material with the thermal conductivity higher than that of the target material, such as copper, aluminum and the like, so that the heat of the target material is quickly transferred to the back plate, the comprehensive strength requirement of the target material is met by the smaller thickness of the back plate, the thickness of the target material assembly is less, and the better heat conducting performance is provided.
Understandably, the target 10 is embedded in the groove 210 in the thickness direction, and the ratio of the center thickness of the target 10 to the maximum depth of the groove 210 is not less than 80%, i.e., the end opposite to the sputtering surface of the target is mostly or completely embedded in the groove. Wherein, the target sputtering surface is the working surface of the target 10, namely the action surface of the target bombarded by the high-speed ion beam; it may be a planar surface or an irregular surface. Meanwhile, the bottom surface and the side surface of the target 10 are tightly attached to the groove 210, that is, the bottom surface and the side surface of the target 10 embedded in the groove 210 are respectively overlapped with the side wall and the bottom surface of the groove 210.
As shown in fig. 2, the target 10 has a center thickness H1 in the thickness direction, and the maximum depth of the groove is H2. Since the target material is generally a planar regular structure, the shape of the groove can also be regarded as a planar regular shape. Therefore, the depth of the target 10 inserted into the groove 210 can be regarded as equal to H2. In the present embodiment, H2 is defined to be greater than or equal to (H1 × 80%). Therefore, the side wall of the target with a higher proportion can be ensured to be contacted with the groove.
The machining of the groove 210 is based on the shape of the embedded portion of the target 10, i.e. the shape of the groove 210 is exactly congruent with the shape of the embedded portion of the target 10. The shape of the groove 210 specifically includes the depth of the groove, the area and spatial distribution of the side walls and bottom surface of the groove, and the like.
It should be noted that the target material described herein is preferably a solid structure or a hollow structure with regular shape and flat surface; more specifically, the target described herein includes one of a rectangular target, a circular target, and a racetrack target.
In this embodiment, the shape of the groove 210 formed on the surface of the back plate 20 is determined according to the shape of the actual structure of the target 10, so as to adapt to different target shapes, so that the target 10 and the back plate 20 are convenient and easy to assemble, easy to operate, and beneficial to improving the assembly efficiency.
As shown in FIG. 2, the thickness H1 of the target 10 is preferably 5-30 mm. The target material of the utility model mainly comprises a plane target material; correspondingly, the maximum thickness H1 of the target 10 is the thickness of the top and bottom surfaces of the target 10. The target materials with different thicknesses are provided, and the specific production requirements of the sputtering process can be well matched, so that the application range of the target materials is widened.
As shown in FIG. 2, as a more preferable scheme, the ratio of the maximum depth H2 of the groove to the total thickness H3 of the back plate is 1:5 to 4: 5. The thickness ratio range enables the target material 10 embedded in the groove 210 and the backing plate 20 to maintain a proper thickness ratio, thereby ensuring that the target material assembly has better electrical conductivity and thermal conductivity and the requirement of supporting strength in the sputtering process.
The target 10 is welded after being completely inserted into the groove 210 in the thickness direction, and the welding method includes, but is not limited to: high and low temperature brazing, hot melt welding, high temperature diffusion welding, high pressure diffusion welding, and diffusion welding after interference press-in.
The characteristics of the target etching process need to be described here.
For magnetron sputtering techniques, cathode magnetron arc techniques, a magnetic field arranged at the cathode is used to control the moving area, moving trajectory, etc. of the charged particles. Due to the arrangement of the magnetic field as is conventional in the art, the figures herein omit the associated means for depicting the arrangement of the magnetic field. The particular spatial distribution of the magnetic field acting on the sputtering surface of the target can affect the area of the target sputtering surface etched by the plasma. Generally, after etching a target material, the target material forms a continuous etching area or a continuous/discontinuous etching track; the etching areas or the etching tracks are in the distribution range of the magnetic field, and the cross section of the etching area of the target material in the thickness direction is concave. The sputtering rate of the target portion in the region outside the magnetic field is extremely low, and there is generally no concern about the magnetic field interfering with or affecting the sputtering process of the target portion in the region outside the magnetic field.
Therefore, the present embodiment is characterized in that: the shape of the groove is matched with that of the part of the target material embedded into the groove, so that the groove is tightly contacted with the target material embedded part; meanwhile, the way that the groove surrounds the target increases the side contact area and the total contact area between the groove and the target. The two characteristics are cooperated together, so that the effective thickness of the target and the overall thickness of the target assembly are not reduced, contact and heat conduction between the target and a back plate with high heat conductivity are realized as much as possible, the overall thermal resistivity of the target assembly is reduced, the heat conductivity of the target assembly in unit time is greatly improved, the heat conductivity of the target composite assembly is effectively improved, and the cooling speed of the target is high.
Next, a second embodiment of the composite-structured target assembly of the present invention will be given.
As shown in fig. 5 to 8, the cross section of the target 10 in the thickness direction is one of an inverted trapezoid, a semicircle, a U-shaped cross section, and a V-shaped cross section.
Based on the characteristics of the target etching process, when the target is prefabricated, the target with a specific shape is constructed, so that the cross section of the target in the thickness direction is in one of an inverted trapezoid shape, a semicircular shape, a U-shaped cross section and a V-shaped cross section, which are respectively shown in fig. 5 to 8; in fig. 5 to 8, dashed lines L1, L2, L3, and L4 are exemplary outlines of the target material with corresponding shapes after etching. Further, a groove 210 corresponding to a matching shape is opened in the backing plate 20 based on the sectional shape of the target 10 in the thickness direction.
Here, the inverted trapezoidal, semicircular, U-shaped, and V-shaped cross sections refer to the overall cross sectional shape of the target 10 in the thickness direction; in other words, if the cross-sectional shape of the target in the thickness direction is one of an inverted trapezoid, a semicircle, a U-shaped cross section and a V-shaped cross section as a whole, the target assembly formed by the target and the back plate having the groove matching with the target shape is within the protection scope of the present invention.
Compared with the regular-shape conventional target material, the specific embodiment has the advantages that: the specific shape structure of the target can better match the characteristics of a target consumption area in the sputtering process, so that the ineffective utilization of the target is reduced, the utilization rate of the target is improved, the material cost of a target component is reduced, and the economic benefit is improved.
Next, a third embodiment of the composite-structured target assembly of the present invention will be described.
Fig. 9 is another cross-sectional view of the target and the backing plate in the thickness direction before welding the target assembly according to the embodiment of the present invention, in which the target 10 has a cavity 110, the groove 210 has a protruding structure 2101, the protruding structure 2101 and the cavity 110 are in a mutual embedded fit, and the side surface of the protruding structure 2101 is tightly attached to the side wall of the cavity 110.
The cavity 110 may be opened in a penetrating or non-penetrating manner in the thickness direction of the target 10, as required. More preferably, the cavity 110 is formed as shown in fig. 10 to 16 (in fig. 10 to 16, the groove 210 is not shown to have the protruding structure 2101), and the specific shape thereof includes a rectangle, a circle, a racetrack, and the like.
The backing plate 20 is correspondingly machined to form grooves 210 with raised structures 2101, depending on the machined shape of the target 10, and the raised structures 2101 of the grooves 219 interfit with the cavities 110 of the target 10. For example, a central sub-region of the backplate 20 is retained, and the region outside the central sub-region is cut to form a groove 210 having a protrusion 2101 with a specific shape. As shown in fig. 9, the target and the groove of the backing plate form a bonding structure with a cross section similar to a Chinese character 'shan' shape in the thickness direction.
Understandably, the cavity 110 is completely mated with the raised structure 2101 and the corresponding surfaces are in close proximity to each other. Compared with a structure that only one side surface of the groove is tightly attached to one side wall of the target material, the structure that at least two side surfaces of the groove respectively surround the inner side wall and the outer side wall of the target material is formed in the embodiment, so that the side surface contact area and the total contact area between the groove and the target material are further increased, and the heat conducting performance of the target material composite assembly is further improved. Meanwhile, the structure increases the mutual nesting and matching area between the groove and the target, and is beneficial to improving the firmness of the target composite assembly.
Next, a fourth embodiment of the composite-structured target assembly of the present invention will be described.
As an improvement of the present invention, as shown in fig. 2 and 3, the top surface of the target 10 is a flat surface, and when the target 10 is embedded into the groove 210, the top surface of the target 10 is flush with the surface of the backing plate 20. on the premise of ensuring that the groove 210 is tightly attached to the non-sputtering surface of the target, the surface of the backing plate 20 is flush with the sputtering surface of the target 10. Therefore, the flatness of the plane of the target sputtering surface is ensured, the normal implementation of the magnetron sputtering process is facilitated, and the assembly matching degree of the target assembly on other devices is also improved.
Next, a fifth embodiment of the composite-structured target assembly of the present invention will be given.
As a more preferable modification, as shown in fig. 17, a plurality of fixing holes 220 (no groove is marked in fig. 17) are provided in the area of the back plate 20 other than the groove. The fixing holes 220 may be threaded through holes or other types of through holes, and the number of the through holes may be determined according to specific needs and the area of the back plate, and is not limited herein. The fixing holes 220 may be distributed in a rectangular array or a circular array in the region outside the groove. A fixing hole 220 is provided for locking and fixing the back plate 20 with other parts; the fixed locking mode is convenient and reliable, space operation can be conveniently carried out through the matching of the threads and the set small tool with the torque wrench, misoperation is eliminated, and a target assembly with a more complex and diversified structure can be formed.
The above is only the concrete embodiment of the present invention, and not therefore the limit of the patent scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the patent protection scope of the present invention.

Claims (9)

1. The target assembly with the composite structure is characterized by comprising a target and a back plate, wherein the target is embedded into a groove along the thickness direction, the bottom surface and the side surface of the target are tightly attached to the groove, the ratio of the central thickness of the target to the maximum depth of the groove is not less than 80%, and the target and the back plate are compounded in a welding mode.
2. A composite construction target assembly as claimed in claim 1, wherein said target comprises one of a rectangular target, a circular target, and a racetrack target.
3. A composite construction target assembly as claimed in claim 1, wherein the target has a cross-section in the thickness direction that is one of inverted trapezoidal, semicircular, U-shaped, and V-shaped.
4. A composite construction target assembly as claimed in claim 1, wherein the target has a cavity, the recess has a protrusion, the protrusion fits into the cavity, and the side of the protrusion fits tightly against the side wall of the cavity.
5. A composite structural target assembly according to claim 1, wherein the top surface of the target is a flat surface and is flush with the surface of the backing plate when the target is inserted into the recess.
6. A composite construction target assembly according to any one of claims 1 to 5, wherein the ratio of the maximum depth of the grooves to the total thickness of the backing plate is from 1:5 to 4: 5.
7. A composite structural target assembly according to any of claims 1 to 5, wherein the target thickness is 5 to 30 mm.
8. A composite construction target assembly as claimed in claim 1, wherein the target material is a metal or alloy or ceramic and the backing plate material is copper or aluminum.
9. A composite construction target assembly as claimed in claim 1, wherein the backing plate is provided with a plurality of securing holes in areas outside the grooves.
CN202021922333.7U 2020-09-04 2020-09-04 Target assembly with composite structure Active CN213417000U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021922333.7U CN213417000U (en) 2020-09-04 2020-09-04 Target assembly with composite structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021922333.7U CN213417000U (en) 2020-09-04 2020-09-04 Target assembly with composite structure

Publications (1)

Publication Number Publication Date
CN213417000U true CN213417000U (en) 2021-06-11

Family

ID=76260112

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021922333.7U Active CN213417000U (en) 2020-09-04 2020-09-04 Target assembly with composite structure

Country Status (1)

Country Link
CN (1) CN213417000U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114481052A (en) * 2022-01-11 2022-05-13 先导薄膜材料(广东)有限公司 Aluminum alloy target and preparation method thereof
CN114672776A (en) * 2022-03-16 2022-06-28 先导薄膜材料有限公司 Target binding method of hollow back plate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114481052A (en) * 2022-01-11 2022-05-13 先导薄膜材料(广东)有限公司 Aluminum alloy target and preparation method thereof
CN114481052B (en) * 2022-01-11 2023-11-17 先导薄膜材料(广东)有限公司 Aluminum alloy target and preparation method thereof
CN114672776A (en) * 2022-03-16 2022-06-28 先导薄膜材料有限公司 Target binding method of hollow back plate
CN114672776B (en) * 2022-03-16 2023-09-29 先导薄膜材料(安徽)有限公司 Target binding method for hollow backboard

Similar Documents

Publication Publication Date Title
CN213417000U (en) Target assembly with composite structure
EP1349698B1 (en) Friction fit target assembly for high power sputtering operation
CA1304830C (en) Cooling structure
US20040056070A1 (en) Method of manufacturing sputter targets with internal cooling channels
US20040113364A1 (en) Low temperature sputter target/backing plate joining technique and assemblies made thereby
JPH0213025B2 (en)
EP3618170B1 (en) Battery cooling component
GB2431370A (en) An apparatus for electromagnetically forming a workpiece
CN114658623A (en) Integrated magnetic screen anode structure for low-power Hall thruster
CN115360567A (en) Laser cooling heat sink with micro-channel structure
CN110684952A (en) Target material structure
CN213061006U (en) Welding structure of target and back plate
CN216614826U (en) Tool assembly for vacuum sputtering
CN114128063B (en) Method for producing a cooling element and cooling element produced in this way
CN113301777B (en) Vapor chamber, method for manufacturing vapor chamber, and electronic apparatus
CN113549889A (en) Target material assembly and using method
CN210215524U (en) Magnetron sputtering target assembly for mobile phone glass coating
CN103681174B (en) A kind of flat multi-level depressurization collector
CN115143816A (en) Heat exchanger
CN113494864A (en) Temperature-equalizing plate and manufacturing method thereof
CN218328905U (en) Novel water-cooling cavity of cooling structure
US20230396105A1 (en) Cooling structure for disc-type motor
CN218203025U (en) Target material assembly for high-power magnetron sputtering
CN217979979U (en) Heat exchange plate group for brazing plate type heat exchanger
US20050057157A1 (en) Traveling-wave tube having heat radiating structure with high thermal conductivity

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant