CN110684952A - Target material structure - Google Patents
Target material structure Download PDFInfo
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- CN110684952A CN110684952A CN201910189394.2A CN201910189394A CN110684952A CN 110684952 A CN110684952 A CN 110684952A CN 201910189394 A CN201910189394 A CN 201910189394A CN 110684952 A CN110684952 A CN 110684952A
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- Prior art keywords
- magnetic element
- target
- adhesive
- magnetic
- target structure
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- 239000013077 target material Substances 0.000 title claims abstract description 17
- 230000003628 erosive effect Effects 0.000 claims abstract description 28
- 238000005530 etching Methods 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims description 87
- 230000001070 adhesive effect Effects 0.000 claims description 87
- 239000000463 material Substances 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 229910000889 permalloy Inorganic materials 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 238000005260 corrosion Methods 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims 1
- 238000000034 method Methods 0.000 description 12
- 238000004544 sputter deposition Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000002679 ablation Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Magnetic Bearings And Hydrostatic Bearings (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a target material structure, which comprises a support plate, a magnetic element and a target material. The carrier plate is provided with a bearing surface. The magnetic element is configured on the bearing surface. The target is arranged on the magnetic element and covers the whole magnetic element. The position of the magnetic element corresponds to a position of the hard etching. The magnetic element of the invention can weaken the magnetic field intensity, thereby effectively reducing the consumption rate (reducing the erosion depth) of the target material at the position of the strong erosion position, further ensuring that the consumption rate of the target material at each position is more average, and prolonging the service life of the target material.
Description
Technical Field
The present invention relates to a target structure, and more particularly, to a target structure having a magnetic element.
Background
In the ion sputtering process, the target is gradually consumed. Because the magnetic fields generated by the sputter stations have different strengths at different positions of the target, the erosion amounts of the target at different positions are different, and further the erosion depths of the target at different positions, i.e., the consumption depths of some positions are particularly deep. It is often the case that when one location of the target is too thin, even if most other locations still have sufficient thickness, the target must be replaced with a new one, resulting in wasted target (because most other locations still have sufficient thickness).
Therefore, the efforts of those skilled in the art to provide a new target structure to improve the above-mentioned problems have been directed.
Disclosure of Invention
The invention relates to a target material structure, which can solve the problem of target material waste caused by frequent replacement in the prior art.
An embodiment of the invention provides a target structure. The target structure comprises a carrier plate, a first magnetic element and a target. The carrier plate is provided with a bearing surface. The first magnetic element is configured on the bearing surface. The target is arranged on the first magnetic element and covers the whole first magnetic element. Wherein, the position of the first magnetic element corresponds to a first strong corrosion position.
In one embodiment, the target structure further comprises:
a first adhesive formed on the carrying surface;
the first magnetic element is configured on the bearing surface through the first adhesive.
In one embodiment, the target structure further comprises:
a second adhesive; and
a third adhesive;
the second adhesive and the third adhesive are respectively formed on two opposite surfaces of the first magnetic element.
In one embodiment, the target structure further comprises:
a fourth adhesive covering the first magnetic element and the first adhesive;
wherein the target is disposed on the first magnetic element through the fourth adhesive.
In one embodiment, the target structure further comprises:
a second magnetic element disposed on the carrying surface;
the target is arranged on the first magnetic element and covers the whole first magnetic element, and the position of the second magnetic element corresponds to a second strong etching position.
In an embodiment, the first and second etching locations are symmetrical with respect to a center of the carrier.
In one embodiment, the target structure further comprises:
a second magnetic element;
a fifth adhesive; and
a sixth adhesive;
the fifth adhesive and the sixth adhesive are respectively formed on two opposite surfaces of the second magnetic element.
In one embodiment, the first magnetic element has a cut side surface substantially aligned with a side surface of the target.
In one embodiment, the first magnetic element includes an adjusting portion and a magnetic portion, the adjusting portion is connected to the magnetic portion; the magnetic part is arranged corresponding to the first strong corrosion position, and the adjusting part is provided with a cutting side surface which is substantially aligned with one side surface of the target material.
In one embodiment, the thickness of the first magnetic element is between 0.1 mm and 0.5 mm, and/or the material of the first magnetic element is selected from iron (Fe), cobalt (Co), nickel (Ni), stainless steel, permalloy (permalloy), and any combination thereof, and/or the width of the first magnetic element is between 20% and 100% of the width of the target.
In one embodiment, the first erosion target is located at a distance of L/2-L/4 from the center of the target, where L is the length of the target, and/or the first erosion target is not located at the edge of the target.
The invention has the beneficial effects that:
the magnetic element of the invention can weaken the magnetic field intensity, thereby effectively reducing the consumption rate (reducing the erosion depth) of the target material at the position of the strong erosion position, further ensuring that the consumption rate of the target material at each position is more average, and prolonging the service life of the target material.
Drawings
Fig. 1A is a schematic diagram illustrating a target structure according to an embodiment of the invention.
FIG. 1B shows a cross-sectional view of the target structure of FIG. 1A along direction 1B-1B'.
FIGS. 2A-2F illustrate a process diagram for fabricating the target structure of FIG. 1B.
Wherein, the reference numbers:
10: sputtering machine platform
11a to 11 c: magnet
100: target material structure
110: support plate
110 u: bearing surface
120. 120': first magnetic element
120s1, 130s 1: first side
120s2, 130s 2: second surface
121. 121': first adjusting part
121 s: first cut side
122. 122': second adjusting part
122 s: second cutting side
123: a first magnetic part
130. 130': second magnetic element
131. 131': third adjusting part
131 s: third cutting side
132. 132': fourth adjustment part
132 s: fourth cutting side
133: second magnetic part
140: target material
140s 1: first side surface
140s 2: second side surface
150: the first adhesive
150s1, 150s 2: side surface
155: second adhesive
160: third adhesive
165: fourth adhesive
170: fifth adhesive
175: sixth adhesive
E1: magnetic field
P1: first strong etching position
P2: second position of strong etching
Detailed Description
Referring to fig. 1A and 1B, fig. 1A is a schematic diagram illustrating a target structure 100 according to an embodiment of the invention, and fig. 1B is a cross-sectional view of the target structure 100 of fig. 1A along a direction 1B-1B'.
As shown in fig. 1A, the target structure 100 includes a carrier plate 110, a first magnetic element 120, a second magnetic element 130, a target 140, a first adhesive 150, a second adhesive 155, a third adhesive 160, a fourth adhesive 165, a fifth adhesive 170, and a sixth adhesive 175.
The carrier 110 has a carrying surface 110 u. The material of the carrier 110 is, for example, metal such as aluminum, titanium or copper or other materials with good thermal conductivity. The first magnetic element 120 and the second magnetic element 130 are disposed on the supporting surface 110 u. The target 140 is disposed on the first magnetic element 120 and the second magnetic element 130 and covers at least a portion of the first magnetic element 120 and at least a portion of the second magnetic element 130. When the target structure 100 is disposed on the ion sputtering apparatus 10, the magnetic field E1 generated by the magnets 11 a-11 c of the ion sputtering apparatus 10 passes through the first magnetic element 120 and the second magnetic element 130 during the ion sputtering process. As shown in fig. 1B, the magnets 11a, 11B, and 11c of the sputter tool 10 have a first polarity, a second polarity, and a first polarity, respectively, wherein one of the first polarity and the second polarity is, for example, an N-pole, and the other of the first polarity and the second polarity is, for example, an S-pole.
The first magnetic element 120 and the second magnetic element 130 may reduce the magnetic field strength (e.g., reduce the magnetic field strength to E1 of fig. 1B) to reduce the material consumption rate of the target 140 corresponding to the positions of the magnetic elements 120 and 130, thereby prolonging the lifetime of the target.
In addition, the material of the target 140 is, for example, metal such as aluminum, titanium or copper, or indium tin oxide or other materials for sputtering on the workpiece.
In detail, as shown in fig. 1A, the first and second overetching positions P1 and P2 are, for example, the portions of the target 140 where the material erosion amount is the most (the deepest erosion depth) in the ion sputtering process when the magnetic element is not disposed in the target structure 100. The first etching position P1 and the second etching position P2 are, for example, symmetrical with respect to the center of the carrier 110. When the region of the first magnetic element 120 corresponds to the first erosion position P1 and the region of the second magnetic element 130 corresponds to the second erosion position P2, the magnetic field strength can be weakened by the magnetic elements, so that the consumption rates (erosion depths) of the target 140 at the first erosion position P1 and the second erosion position P2 can be effectively reduced, and the consumption rates of the target 140 at each position are more uniform, thereby prolonging the service life of the target 140. According to the actual test results, the service life of the target in the prior art is about 30% to 35% (by weight), while the service life of the target 140 of the target structure 100 of the embodiment of the invention can be further improved by 5% to 20%.
As shown in FIG. 1A, in one embodiment, the distance D1 between the first ablation position P1 and the target center C1 is between L/2 and L/4, where L is the length of the target 140. In one embodiment, the distance D2 between the second ablation position P2 and the target center C1 is between L/2 and L/4. In addition, in one embodiment, the position of the first erosion position P1 does not include the end point of the distance range at L/2, i.e., the first erosion position P1 is not located at the edge position of the target 140 or is spaced apart from the edge position of the target 140 by a distance. In addition, the position of the second erosion position P2 does not include the end point of the distance range at L/2, i.e., the second erosion position P2 is not located at the edge of the target 140 or is spaced apart from the edge of the target 140 by a distance.
Further, depending on the magnetic field distribution, the first erosion position P1 is not limited to a point distribution, and may be a line distribution or a surface distribution. The shape and position of the first magnetic element 120 may be determined according to the distribution pattern of the first overetch positions P1, but the embodiment of the invention is not limited thereto. Similarly, the second erosion position P2 is not limited to a dot distribution, but may be a line distribution or a plane distribution. The shape and position of the second magnetic element 130 may correspond to the distribution pattern of the second overetch positions P2, and the embodiment of the invention is not limited thereto. In summary, the shape and/or position of the magnetic element is not limited in the embodiments of the present invention as long as the magnetic element can cover (e.g., along the Z-axis) the entire over-etching position.
In one embodiment, embodiments of the present invention may include more than two magnetic elements depending on the magnetic field distribution. For example, a plurality of magnetic elements are disposed at positions corresponding to the first erosion position P1 and/or a plurality of magnetic elements are disposed at positions corresponding to the second erosion position P2.
As for the material, the material of the first magnetic element 120 and the second magnetic element 130 may be selected from iron (Fe), cobalt (Co), nickel (Ni), stainless steel, permalloy (permalloy), and any combination thereof, wherein the stainless steel is, for example, SUS 430. The thickness T1 (thickness T1 is shown in fig. 1B) of the first magnetic element 120 is between 0.1 mm and 0.5 mm in terms of size. The thickness range of the second magnetic element 130 is the same as the thickness T1 of the first magnetic element 120, and therefore, the description thereof is omitted. Specifically, the first magnetic element 120 and/or the second magnetic element 130 are, for example, metal foils (foils), but may also be magnetic plates with a relatively large thickness. In one embodiment, the width W1 (e.g., the maximum width) of the first magnetic part 123 of the first magnetic element 120 is 20% to 100% of the width W of the target 140. The width of the second magnetic portion 133 of the second magnetic element 130 is similar to that of the first magnetic element 120, and is not described herein again.
In the present embodiment, as shown in fig. 1A and 1B, the first magnetic element 120 includes a first adjusting portion 121, a second adjusting portion 122 and a first magnetic portion 123, wherein the first adjusting portion 121 and the second adjusting portion 122 are respectively connected to two opposite sides of the first magnetic portion 123. The first adjustment part 121 and the second adjustment part 122 have a first cut side surface 121s and a second cut side surface 122s, respectively, which are aligned with the first side surface 140s1 and the second side surface 140s2 of the target 140, respectively, which are opposite to each other. Thus, the first adjusting portion 121 and the second adjusting portion 122 are prevented from extending from the target 140, and the first magnetic element 120 is prevented from shifting due to mis-touching of the adjusting portions. In addition, the shape of the first magnetic part 123 is, for example, at least a part of a circle, but may also be at least a part of an ellipse or a polygon, such as a triangle, a rectangle, a square, a trapezoid, etc. Embodiments of the present invention are not limited to the shape and/or position of the first magnetic part 123 as long as the first magnetic part 123 can cover (e.g., along the Z-axis) the entire first eroded position P1.
Similarly, the second magnetic element 130 includes a third adjusting portion 131, a fourth adjusting portion 132 and a second magnetic portion 133, wherein the third adjusting portion 131 and the fourth adjusting portion 132 are respectively connected to two opposite sides of the first magnetic portion 123. The third adjustment part 131 and the fourth adjustment part 132 have a third cut side surface 131s and a fourth cut side surface 132s, respectively, which are aligned with the first side surface 140s1 and the second side surface 140s2 of the target 140, respectively, which face each other. Thus, the third adjusting portion 131 and the fourth adjusting portion 132 are prevented from extending from the target 140, and the second magnetic element 130 is prevented from shifting due to mis-touching of the adjusting portions. In addition, the shape of the second magnetic part 133 is, for example, at least a part of a circle, but may also be at least a part of an ellipse or a polygon, such as a triangle, a rectangle, a square, a trapezoid, etc. The shape and/or position of the second magnetic part 133 are not limited in the embodiments of the present invention as long as the second magnetic part 133 can cover (e.g., along the Z-axis) the entire second eroded position P2.
As shown in fig. 1A and 1B, the first adhesive 150 is formed on the supporting surface 110 u. The first magnetic element 120 and the second magnetic element 130 are disposed on the supporting surface 110u through the first adhesive 150. The second adhesive 155 and the third adhesive 160 are respectively formed on two opposite sides of the first magnetic element 120. The fifth adhesive 170 and the sixth adhesive 175 are respectively formed on two opposite sides of the second magnetic element 130. The fourth adhesive 165 covers the first magnetic element 120, the second magnetic element 130 and the first adhesive 150. The target 140 is disposed on the first magnetic element 120 and the second magnetic element 130 through the fourth adhesive 165. In an embodiment, the second adhesive 155, the third adhesive 160, the fifth adhesive 170, and the sixth adhesive 175 may be optionally omitted, and the first adhesive 150 and the fourth adhesive 165 are directly used to fix the first magnetic element 120 and the second magnetic element 130.
The first adhesive 150, the second adhesive 155, the third adhesive 160, the fourth adhesive 165, the fifth adhesive 170 and/or the sixth adhesive 175 are, for example, a metal adhesive, and the material thereof includes, for example, tin, zinc, indium or a combination thereof.
Referring to fig. 2A-2F, a process diagram of the target structure 100 of fig. 1B is shown.
As shown in fig. 2A, a carrier 110 is provided.
As shown in fig. 2B, a first adhesive 150 may be formed on at least a portion of the carrying surface 110u of the carrier 110 by, for example, a coating technique.
As shown in fig. 2C, the second adhesive 155 and the third adhesive 160 are formed on at least a portion of the first side 120s1 and at least a portion of the second side 120s2 of the first magnetic element 120 ', respectively, and the fifth adhesive 170 and the sixth adhesive 175 are formed on at least a portion of the first side 130s1 and at least a portion of the second side 130s2, respectively, of the second magnetic element 130', respectively, by a coating technique, for example.
As shown in fig. 2D, the first magnetic element 120 'and the second magnetic element 130' are disposed on the first adhesive 150. As shown in the figure, the first magnetic element 120 ' includes a first adjusting portion 121 ', a second adjusting portion 122 ', and a first magnetic portion 123, wherein the first adjusting portion 121 ' and the second adjusting portion 122 ' are respectively connected to two opposite sides of the first magnetic portion 123. The first adjustment portion 121 ' and the second adjustment portion 122 ' protrude from the opposite two sides 150s1 and 150s2 of the first adhesive 150, so that the first adjustment portion 121 ' and the second adjustment portion 122 ' can be conveniently operated to adjust the relative position between the first magnetic element 120 ' and the target 140 in the subsequent process.
Similarly. In fig. 2D, the second magnetic element 130 ' includes a third adjusting portion 131 ', a fourth adjusting portion 132 ', and a second magnetic portion 133, wherein the third adjusting portion 131 ' and the fourth adjusting portion 132 ' are respectively connected to two opposite sides of the second magnetic portion 133. The third adjusting portion 131 ' and the fourth adjusting portion 132 ' protrude from the opposite two sides 150s1 and 150s2 of the first adhesive 150, so that the third adjusting portion 131 ' and the fourth adjusting portion 132 ' can be conveniently operated to adjust the relative position between the second magnetic element 130 ' and the target 140 in the subsequent process.
As shown in fig. 2E, a fourth adhesive 165 may be formed to cover the first magnetic element 120 ', the second magnetic element 130' and the first adhesive 150, for example, by a coating technique. As shown in the figure, the first adjusting portion 121 'and the second adjusting portion 122' of the first magnetic element 120 'respectively protrude from opposite sides of the fourth adhesive 165, so as to facilitate the subsequent operation of the first adjusting portion 121' and the second adjusting portion 122 'to adjust the relative position between the first magnetic element 120' and the target 140 of the subsequent process. Similarly, the third adjusting portion 131 'and the fourth adjusting portion 132' of the second magnetic element 130 'respectively protrude from opposite sides of the fourth adhesive 165, so as to facilitate the subsequent operations of the third adjusting portion 131' and the fourth adjusting portion 132 'to adjust the relative position between the second magnetic element 130' and the target 140 of the subsequent process.
In an embodiment, the second adhesive 155, the third adhesive 160, the fifth adhesive 170, and the sixth adhesive 175 shown in fig. 2C may be optionally omitted, so that the first adhesive 150 and the fourth adhesive 165 can directly fix the first magnetic element 120 and the second magnetic element 130 in the subsequent steps.
As shown in fig. 2F, the target 140 is disposed on the fourth adhesive 165. Since the first adjusting portion 121 'and the second adjusting portion 122' of the first magnetic element 120 'respectively protrude from the first side surface 140s1 and the second side surface 140s2 of the target 140, the positions of the first adjusting portion 121' and the second adjusting portion 122 'can be conveniently operated to adjust the relative position between the first magnetic element 120' and the target 140, so that the region of the first magnetic portion 122 of the first magnetic element 120 'and the first erosion site P1 overlap in the Z-axis direction (the stacking direction of the first magnetic element 120' and the target 140).
Similarly, in fig. 2F, the third adjusting portion 131 'and the fourth adjusting portion 132' of the second magnetic element 130 'respectively protrude from the first side surface 140s1 and the second side surface 140s2 of the target 140, so that the relative position between the second magnetic element 130' and the target 140 can be adjusted by operating the third adjusting portion 131 'and the fourth adjusting portion 132', and the region of the second magnetic portion 132 of the second magnetic element 130 'overlaps the second erosion position P2 along the Z-axis direction (the stacking direction of the second magnetic element 130' and the target 140).
After the position of the first magnetic element 120 ' is adjusted correctly, the portion of the first adjustment part 121 ' protruding from the first side surface 140s1 of the target 140 and the portion of the second adjustment part 122 ' protruding from the second side surface 140s2 of the target 140 may be cut. The first adjusting part 121 after cutting forms a first cut side surface 121s (shown in fig. 1A), and the second adjusting part 122 after cutting forms a second cut side surface 122s (shown in fig. 1A). First severed side surface 121s and second severed side surface 122s are aligned with opposing first side surface 140s1 and second side surface 140s2 of target 140, respectively, as shown in fig. 1A. Thus, the first adjusting portion 121 and the second adjusting portion 122 are prevented from extending from the target 140, and the first magnetic element 120 is prevented from shifting due to mis-touching of the adjusting portions.
Similarly, after the position of the second magnetic element 130 ' is adjusted correctly, the portion of the third adjusting part 131 ' protruding from the first side surface 140s1 of the target 140 and the portion of the fourth adjusting part 132 ' protruding from the second side surface 140s2 of the target 140 may be cut. The third adjusting part 131 after cutting forms a third cut side surface 131s (shown in fig. 1A), and the fourth adjusting part 132 after cutting forms a fourth cut side surface 132s (shown in fig. 1A). Third severed side surface 131s and fourth severed side surface 132s are aligned with opposing first side surface 140s1 and second side surface 140s2 of target 140, respectively, as shown in fig. 1A. Thus, the third adjusting portion 131 and the fourth adjusting portion 132 are prevented from extending from the target 140, and the second magnetic element 130 is prevented from shifting due to mis-touching of the adjusting portions.
Then, the first magnetic element 120, the second magnetic element 130, the first adhesive 150, the second adhesive 155, the third adhesive 160, the fourth adhesive 165, the fifth adhesive 170, and the sixth adhesive 175 are heated to cure the adhesives, so as to increase the bonding between the first magnetic element 120, the second magnetic element 130, and the target 140.
In another embodiment, the adhesive can be cured first, and then the first magnetic element 120 'and the second magnetic element 130' can be cut.
The present invention is capable of other embodiments, and various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (11)
1. A target structure, comprising:
a carrier plate having a carrying surface;
a first magnetic element configured on the carrying surface;
a target material, which is configured on the first magnetic element and covers the whole first magnetic element;
wherein, the position of the first magnetic element corresponds to a first strong corrosion position.
2. The target structure of claim 1, further comprising:
a first adhesive formed on the carrying surface;
the first magnetic element is configured on the bearing surface through the first adhesive.
3. The target structure of claim 1, further comprising:
a second adhesive; and
a third adhesive;
the second adhesive and the third adhesive are respectively formed on two opposite surfaces of the first magnetic element.
4. The target structure of claim 2, further comprising:
a fourth adhesive covering the first magnetic element and the first adhesive;
wherein the target is disposed on the first magnetic element through the fourth adhesive.
5. The target structure of claim 2, further comprising:
a second magnetic element disposed on the carrying surface;
the target is arranged on the first magnetic element and covers the whole first magnetic element, and the position of the second magnetic element corresponds to a second strong etching position.
6. The target structure of claim 5, wherein the first and second erosion locations are symmetrical with respect to a center of the carrier.
7. The target structure of claim 1, further comprising:
a second magnetic element;
a fifth adhesive; and
a sixth adhesive;
the fifth adhesive and the sixth adhesive are respectively formed on two opposite surfaces of the second magnetic element.
8. The target structure of claim 1 wherein the first magnetic element has a truncated side that is substantially aligned with a side of the target.
9. The target structure of claim 1, wherein the first magnetic element comprises an adjusting portion and a magnetic portion, the adjusting portion being connected to the magnetic portion; the magnetic part is arranged corresponding to the first strong corrosion position, and the adjusting part is provided with a cutting side surface which is substantially aligned with one side surface of the target material.
10. The target structure of claim 1, wherein the thickness of the first magnetic element is between 0.1 mm and 0.5 mm, and/or the material of the first magnetic element is selected from the group consisting of iron, cobalt, nickel, stainless steel, permalloy, and any combination thereof, and/or the width of the first magnetic element is between 20% and 100% of the width of the target.
11. The target structure of claim 1, wherein the first erosion site is located at a distance of L/2 to L/4 from the center of the target, where L is the length of the target, and/or the first erosion site is not located at an edge of the target.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107141245 | 2018-11-20 | ||
| TW107141245A TWI698543B (en) | 2018-11-20 | 2018-11-20 | Target structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110684952A true CN110684952A (en) | 2020-01-14 |
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ID=69107575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910189394.2A Pending CN110684952A (en) | 2018-11-20 | 2019-03-13 | Target material structure |
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| Country | Link |
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| CN (1) | CN110684952A (en) |
| TW (1) | TWI698543B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112048706A (en) * | 2020-07-29 | 2020-12-08 | 优贝克科技股份有限公司 | Sputtering target and method for adjusting magnetic force line distribution around sputtering target |
| CN115404451A (en) * | 2021-05-28 | 2022-11-29 | 鑫天虹(厦门)科技有限公司 | Magnetic field adjusting device, thin film deposition equipment capable of generating uniform magnetic field and deposition method thereof |
| TWI794579B (en) * | 2020-01-20 | 2023-03-01 | 住華科技股份有限公司 | Sputtering target structure |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07188918A (en) * | 1993-12-27 | 1995-07-25 | Sumitomo Metal Mining Co Ltd | Magnetron sputtering device |
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| US8685214B1 (en) * | 2011-09-30 | 2014-04-01 | WD Media, LLC | Magnetic shunting pads for optimizing target erosion in sputtering processes |
| CN103290370A (en) * | 2012-02-24 | 2013-09-11 | 住华科技股份有限公司 | Composite target material and manufacturing method thereof |
| CN106133181A (en) * | 2014-02-20 | 2016-11-16 | 因特瓦克公司 | Sputtering system and method for high magnetic material |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI794579B (en) * | 2020-01-20 | 2023-03-01 | 住華科技股份有限公司 | Sputtering target structure |
| CN112048706A (en) * | 2020-07-29 | 2020-12-08 | 优贝克科技股份有限公司 | Sputtering target and method for adjusting magnetic force line distribution around sputtering target |
| CN115404451A (en) * | 2021-05-28 | 2022-11-29 | 鑫天虹(厦门)科技有限公司 | Magnetic field adjusting device, thin film deposition equipment capable of generating uniform magnetic field and deposition method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202020202A (en) | 2020-06-01 |
| TWI698543B (en) | 2020-07-11 |
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