TWI698543B - Target structure - Google Patents

Target structure Download PDF

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Publication number
TWI698543B
TWI698543B TW107141245A TW107141245A TWI698543B TW I698543 B TWI698543 B TW I698543B TW 107141245 A TW107141245 A TW 107141245A TW 107141245 A TW107141245 A TW 107141245A TW I698543 B TWI698543 B TW I698543B
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magnetic element
target
glue
magnetic
item
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TW107141245A
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Chinese (zh)
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TW202020202A (en
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楊清河
吳智穩
翁基祥
蘇夢鵬
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住華科技股份有限公司
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Priority to TW107141245A priority Critical patent/TWI698543B/en
Priority to CN201910189394.2A priority patent/CN110684952A/en
Publication of TW202020202A publication Critical patent/TW202020202A/en
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Publication of TWI698543B publication Critical patent/TWI698543B/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Magnetic Bearings And Hydrostatic Bearings (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A target structure includes a carrier, a magnetic component and a target. The carrier has a bearing surface. The magnetic element is disposed on the carrying surface. The target is disposed on the magnetic element and covers the entire magnetic element. A position of the magnetic element corresponds to a strong etched position.

Description

靶材結構 Target structure

本發明是有關於一種靶材結構，且特別是有關於一種具有磁性元件的靶材結構。 The present invention relates to a target structure, and particularly to a target structure with magnetic elements.

在離子濺鍍製程中，靶材會逐漸消耗。由於濺鍍機台產生的磁場在靶材不同位置的強度不同，因此造成靶材在不同位置的侵蝕量不一，進而造成靶材在不同位置的侵蝕深度，即某些位置的消耗深度特別深。通常情況是，當靶材的一位置過薄，即便其它大部分位置仍具有足夠厚度，就必須更換新的靶材，而造成靶材的浪費(因為其它大部分位置仍具有足夠厚度)。 During the ion sputtering process, the target material is gradually consumed. Because the intensity of the magnetic field generated by the sputtering machine is different at different positions of the target material, the erosion amount of the target material at different positions is different, which in turn causes the erosion depth of the target material at different positions, that is, the depth of consumption in some positions is very deep . Usually, when one position of the target material is too thin, even if most of the other positions still have sufficient thickness, a new target material must be replaced, resulting in waste of the target material (because most other positions still have sufficient thickness).

因此，如何提出一種新的靶材結構以改善前述問題是本技術領域業者努力的方向之一。 Therefore, how to propose a new target structure to improve the aforementioned problems is one of the directions of the industry in this technical field.

本發明係有關於一種靶材結構，可改善前述習知問題。 The present invention relates to a target structure that can improve the aforementioned conventional problems.

本發明一實施例提出一種靶材結構。靶材結構包括一載板、一第一磁性元件及一靶材。載板具有一承載面。第一磁 性元件配置在承載面。靶材配置在第一磁性元件且覆蓋整個第一磁性元件。其中，第一磁性元件的位置對應一第一強蝕位置。 An embodiment of the present invention provides a target structure. The target structure includes a carrier, a first magnetic element and a target. The carrier has a bearing surface. First magnet The sex element is arranged on the bearing surface. The target is arranged on the first magnetic element and covers the entire first magnetic element. Wherein, the position of the first magnetic element corresponds to a first strong erosion position.

為了對本發明之上述及其他方面有更佳的瞭解，下文特舉實施例，並配合所附圖式詳細說明如下： In order to have a better understanding of the above-mentioned and other aspects of the present invention, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows:

10:濺鍍機台 10: Sputtering machine

11a~11c:磁鐵 11a~11c: Magnet

100:靶材結構 100: target structure

110:載板 110: carrier board

110u:承載面 110u: bearing surface

120、120’:第一磁性元件 120, 120’: The first magnetic element

120s1、130s1:第一面 120s1, 130s1: first side

120s2、130s2:第二面 120s2, 130s2: second side

121、121’:第一調整部 121, 121’: The first adjustment part

121s:第一裁斷側面 121s: first cut side

122、122’:第二調整部 122, 122’: The second adjustment part

122s:第二裁斷側面 122s: second cut side

123:第一磁性部 123: The first magnetic part

130、130’:第二磁性元件 130, 130’: The second magnetic element

131、131’:第三調整部 131, 131’: Third Adjustment Department

131s:第三裁斷側面 131s: third cut side

132、132’:第四調整部 132, 132’: Fourth adjustment part

132s:第四裁斷側面 132s: Fourth cutting side

133:第二磁性部 133: The second magnetic part

140:靶材 140: target

140s1:第一側面 140s1: first side

140s2:第二側面 140s2: second side

150:第一黏膠 150: first glue

150s1、150s2:側面 150s1, 150s2: side

155:第二黏膠 155: second glue

160:第三黏膠 160: third glue

165:第四黏膠 165: fourth glue

170:第五黏膠 170: Fifth Viscose

175:第六黏膠 175: Sixth Glue

E1:磁場 E1: Magnetic field

P1:第一強蝕位置 P1: The first strong eclipse position

P2:第二強蝕位置 P2: The second strong eclipse position

第1A圖繪示本發明一實施例之靶材結構的示意圖。 FIG. 1A is a schematic diagram of a target structure according to an embodiment of the present invention.

第1B圖繪示第1A圖之靶材結構沿方向1B-1B’的剖視圖。 Figure 1B shows a cross-sectional view of the target structure of Figure 1A along the direction 1B-1B'.

第2A~2F圖繪示第1B圖之靶材結構的製造過程圖。 Figures 2A~2F show the manufacturing process diagram of the target structure in Figure 1B.

請參照第1A及1B圖，第1A圖繪示本發明一實施例之靶材結構100的示意圖，而第1B圖繪示第1A圖之靶材結構100沿方向1B-1B’的剖視圖。 Please refer to FIGS. 1A and 1B. FIG. 1A is a schematic diagram of a target structure 100 according to an embodiment of the present invention, and FIG. 1B is a cross-sectional view of the target structure 100 of FIG. 1A along the direction 1B-1B'.

如第1A圖所示，靶材結構100包括載板110、第一磁性元件120、第二磁性元件130、靶材140、第一黏膠150、第二黏膠155、第三黏膠160、第四黏膠165、第五黏膠170及第六黏膠175。 As shown in Figure 1A, the target structure 100 includes a carrier 110, a first magnetic element 120, a second magnetic element 130, a target 140, a first glue 150, a second glue 155, a third glue 160, The fourth glue 165, the fifth glue 170, and the sixth glue 175.

載板110具有一承載面110u。載板110的材質例如是鋁、鈦或銅的金屬或其它導熱優良的材料。第一磁性元件120及第二磁性元件130配置在承載面110u上。靶材140配置在第一磁性元件120及第二磁性元件130上且覆蓋第一磁性元件 120的至少一部分及第二磁性元件130的至少一部分。當靶材結構100配置在離子濺鍍機台10上時，在離子濺鍍製程中，濺鍍機台10的磁鐵11a~11c所產生磁場E1經過第一磁性元件120及第二磁性元件130。如第1B圖所示，濺鍍機台10的磁鐵11a、11b及11c分別是第一極性、第二極性及第一極性，其中第一極性與第二極性之一者例如是N極，而第一極性與第二極性之另一者例如是S極。 The carrier 110 has a carrying surface 110u. The material of the carrier 110 is, for example, metal such as aluminum, titanium, or copper, or other materials with good thermal conductivity. The first magnetic element 120 and the second magnetic element 130 are disposed on the carrying surface 110u. The target 140 is disposed on the first magnetic element 120 and the second magnetic element 130 and covers the first magnetic element At least a part of 120 and at least a part of the second magnetic element 130. When the target structure 100 is disposed on the ion sputtering machine 10, during the ion sputtering process, the magnetic field E1 generated by the magnets 11 a to 11 c of the sputtering machine 10 passes through the first magnetic element 120 and the second magnetic element 130. As shown in Fig. 1B, the magnets 11a, 11b, and 11c of the sputtering machine 10 have a first polarity, a second polarity, and a first polarity, respectively. One of the first polarity and the second polarity is, for example, an N-pole. The other of the first polarity and the second polarity is, for example, an S pole.

第一磁性元件120及第二磁性元件130可減弱磁場強度(如磁場強度降低至第1B圖的E1)，以減少靶材140中對應磁性元件120及130之位置的材料消耗率，進而延長靶材的使用時間。 The first magnetic element 120 and the second magnetic element 130 can weaken the magnetic field strength (for example, the magnetic field strength is reduced to E1 in Figure 1B), so as to reduce the material consumption rate in the target 140 corresponding to the magnetic elements 120 and 130, thereby extending the target The use time of the material.

此外，靶材140的材質例如是鋁、鈦或銅等金屬或氧化銦錫氧化物或其它用以濺鍍在工件上的材料。 In addition, the material of the target 140 is, for example, metals such as aluminum, titanium, or copper, or indium tin oxide or other materials used for sputtering on the workpiece.

詳言之，如第1A圖所示，第一強蝕位置P1及第二強蝕位置P2例如是靶材結構100未配置磁性元件時，在離子濺鍍製程中，靶材140中材料侵蝕量最多的部位(侵蝕深度最深處)。其中第一強蝕位置P1與第二強蝕位置P2例如是相對載板110的中心呈對稱。當第一磁性元件120的區域對應第一強蝕位置P1且第二磁性元件130的區域對應第二強蝕位置P2時，由於磁性元件能減弱磁場強度，因此能有效減少靶材140在第一強蝕位置P1及第二強蝕位置P2的消耗率(減少侵蝕深度)，進而讓靶材140在各位置的消耗率更為平均，以提升靶材140的使用壽命。根據實際測試結 果，習知靶材的使用壽命約30%~35%(以重量計算)，而本發明實施例之靶材結構100的靶材140的使用壽命可再提升5%~20%。 In detail, as shown in FIG. 1A, the first strong etching position P1 and the second strong etching position P2 are, for example, when the target structure 100 is not equipped with magnetic elements, the amount of material erosion in the target 140 during the ion sputtering process The most part (the deepest part of the erosion depth). The first strong erosion position P1 and the second strong erosion position P2 are symmetrical with respect to the center of the carrier 110, for example. When the area of the first magnetic element 120 corresponds to the first strong corrosion position P1 and the area of the second magnetic element 130 corresponds to the second strong corrosion position P2, since the magnetic element can weaken the magnetic field strength, it can effectively reduce the target 140 in the first strong corrosion position. The consumption rate of the strong etching position P1 and the second strong etching position P2 (to reduce the erosion depth), thereby making the consumption rate of the target 140 at each position more even, so as to increase the service life of the target 140. According to actual test results As a result, the service life of the conventional target material is about 30% to 35% (calculated by weight), and the service life of the target material 140 of the target structure 100 of the embodiment of the present invention can be increased by 5% to 20%.

如第1A圖所示，在一實施例中，第一強蝕位置P1與靶材中心C1的距離D1介於L/2~L/4之間，其中L為靶材140的長度。在一實施例中，第二強蝕位置P2與靶材中心C1的距離D2介於L/2~L/4之間。此外，在一實施例中，第一強蝕位置P1的位置不包含前述距離範圍於L/2處的端點，即第一強蝕位置P1不位於靶材140的邊緣位置，或與靶材140的邊緣位置間隔一距離。另，第二強蝕位置P2的位置不包含前述距離範圍於L/2處的端點，即第二強蝕位置P2不位於靶材140的邊緣位置，或與靶材140的邊緣位置間隔一距離。 As shown in FIG. 1A, in one embodiment, the distance D1 between the first etching position P1 and the target center C1 is between L/2 and L/4, where L is the length of the target 140. In one embodiment, the distance D2 between the second strong etching position P2 and the target center C1 is between L/2 and L/4. In addition, in one embodiment, the position of the first strong etching position P1 does not include the end point of the aforementioned distance range at L/2, that is, the first strong etching position P1 is not located at the edge position of the target 140, or is The edge positions of 140 are separated by a distance. In addition, the position of the second strong etching position P2 does not include the end point of the aforementioned distance range at L/2, that is, the second strong etching position P2 is not located at the edge position of the target 140, or is separated from the edge position of the target 140. distance.

此外，視磁場分布而定，第一強蝕位置P1不限於點分布，其也可以是線分布或面分布。第一磁性元件120的形狀及位置可對應第一強蝕位置P1的分布型態而定，本發明實施例不加以限定。相似地，第二強蝕位置P2也不限於點分布，其也可以是線分布或面分布。第二磁性元件130的形狀及位置可對應第二強蝕位置P2的分布型態而定，本發明實施例不加以限定。綜上，只要磁性元件能覆蓋(如沿Z軸向)整個強蝕位置即可，本發明實施例不限定磁性元件的形狀及/或位置。 In addition, depending on the distribution of the magnetic field, the first strong erosion position P1 is not limited to the point distribution, and it may also be a linear distribution or a surface distribution. The shape and position of the first magnetic element 120 can be determined according to the distribution pattern of the first strong erosion position P1, which is not limited in the embodiment of the present invention. Similarly, the second strong erosion position P2 is not limited to the point distribution, and it may also be a line distribution or a surface distribution. The shape and position of the second magnetic element 130 may correspond to the distribution pattern of the second strong erosion position P2, which is not limited in the embodiment of the present invention. In summary, as long as the magnetic element can cover (for example, along the Z-axis) the entire corrosion position, the embodiment of the present invention does not limit the shape and/or position of the magnetic element.

在一實施例中，本發明實施例可視磁場分布，包含多於二個的磁性元件。例如，對應第一強蝕位置P1處配置多個磁性元件及/或對應第二強蝕位置P2處配置多個磁性元件。 In one embodiment, the embodiment of the present invention can visualize the magnetic field distribution and include more than two magnetic elements. For example, a plurality of magnetic elements are arranged corresponding to the first strong erosion position P1 and/or a plurality of magnetic elements are arranged corresponding to the second strong erosion position P2.

就材料而言，第一磁性元件120及第二磁性元件130的材料可選自鐵(Fe)、鈷(Co)、鎳(Ni)、不銹鋼、坡莫合金(permalloy)及其任意組合，其中的不銹鋼例如SUS430。就尺寸而言，第一磁性元件120的厚度T1(厚度T1繪示於第1B圖)介於0.1毫米~0.5毫米之間。第二磁性元件130的厚度範圍同第一磁性元件120的厚度T1的範圍，於此不再贅述。具體而言，第一磁性元件120及/或第二磁性元件130例如是金屬箔(foil)，然亦可為厚度較厚的磁性板。在一實施例中，第一磁性元件120之第一磁性部123的寬度W1(如最大寬度)介於靶材140寬度W的20%~100%。第二磁性元件130之第二磁性部133的寬度具有類似前述第一磁性元件120的特徵，於此不再贅述。 In terms of materials, the materials of the first magnetic element 120 and the second magnetic element 130 can be selected from iron (Fe), cobalt (Co), nickel (Ni), stainless steel, permalloy, and any combination thereof. Of stainless steel such as SUS430. In terms of size, the thickness T1 of the first magnetic element 120 (thickness T1 is shown in FIG. 1B) is between 0.1 mm and 0.5 mm. The thickness range of the second magnetic element 130 is the same as the thickness T1 of the first magnetic element 120, and will not be repeated here. Specifically, the first magnetic element 120 and/or the second magnetic element 130 is, for example, a metal foil (foil), but may also be a thick magnetic plate. In one embodiment, the width W1 (such as the maximum width) of the first magnetic portion 123 of the first magnetic element 120 is between 20% and 100% of the width W of the target 140. The width of the second magnetic portion 133 of the second magnetic element 130 has similar features to the aforementioned first magnetic element 120, and will not be repeated here.

在本實施例中，如第1A及1B圖所示，第一磁性元件120包括第一調整部121、第二調整部122及第一磁性部123，其中第一調整部121及第二調整部122分別連接於第一磁性部123的相對二側。第一調整部121及第二調整部122分別具有一第一裁斷側面121s及第二裁斷側面122s，其分別與靶材140之相對之第一側面140s1及第二側面140s2對齊。如此，可避免第一調整部121及第二調整部122自靶材140外伸，進而避免因為誤觸調整部而導致第一磁性元件120偏移。此外，第一磁性部123的形狀例如是圓形的至少一部分，然亦可為橢圓形的至少一部分或多邊形，如三角形、矩形、正方形、梯形等。只要第一磁性部123能覆蓋(如沿Z軸向)整個第一強蝕位置P1即可，本發明實施例不限定第一磁性部123的形狀及/或位置。 In this embodiment, as shown in Figures 1A and 1B, the first magnetic element 120 includes a first adjustment portion 121, a second adjustment portion 122, and a first magnetic portion 123, wherein the first adjustment portion 121 and the second adjustment portion 122 are respectively connected to two opposite sides of the first magnetic portion 123. The first adjusting portion 121 and the second adjusting portion 122 respectively have a first cutting side surface 121s and a second cutting side surface 122s, which are respectively aligned with the first side surface 140s1 and the second side surface 140s2 opposite to the target 140. In this way, the first adjustment portion 121 and the second adjustment portion 122 can be prevented from extending from the target 140, and the first magnetic element 120 can be prevented from shifting due to accidentally touching the adjustment portion. In addition, the shape of the first magnetic portion 123 is, for example, at least a part of a circle, but can also be at least a part of an ellipse or a polygon, such as a triangle, a rectangle, a square, a trapezoid, and the like. As long as the first magnetic portion 123 can cover (for example, along the Z axis) the entire first strong erosion position P1, the embodiment of the present invention does not limit the shape and/or position of the first magnetic portion 123.

相似地，第二磁性元件130包括第三調整部131、第四調整部132及第二磁性部133，其中第三調整部131及第四調整部132分別連接於第一磁性部123的相對二側。第三調整部131及第四調整部132分別具有第三裁斷側面131s及第四裁斷側面132s，其分別與靶材140之相對之第一側面140s1及第二側面140s2對齊。如此，可避免第三調整部131及第四調整部132自靶材140外伸，進而避免因為誤觸調整部而導致第二磁性元件130偏移。此外，第二磁性部133的形狀例如是圓形的至少一部分，然亦可為橢圓形的至少一部分或多邊形，如三角形、矩形、正方形、梯形等。只要第二磁性部133能覆蓋(如沿Z軸向)整個第二強蝕位置P2即可，本發明實施例不限定第二磁性部133的形狀及/或位置。 Similarly, the second magnetic element 130 includes a third adjustment portion 131, a fourth adjustment portion 132, and a second magnetic portion 133, wherein the third adjustment portion 131 and the fourth adjustment portion 132 are respectively connected to two opposite sides of the first magnetic portion 123 side. The third adjusting portion 131 and the fourth adjusting portion 132 respectively have a third cutting side surface 131s and a fourth cutting side surface 132s, which are respectively aligned with the first side surface 140s1 and the second side surface 140s2 opposite to the target 140. In this way, the third adjustment portion 131 and the fourth adjustment portion 132 can be prevented from extending from the target 140, thereby preventing the second magnetic element 130 from shifting due to accidentally touching the adjustment portion. In addition, the shape of the second magnetic portion 133 is, for example, at least a part of a circle, but can also be at least a part of an ellipse or a polygon, such as a triangle, a rectangle, a square, a trapezoid, and the like. As long as the second magnetic portion 133 can cover (eg, along the Z axis) the entire second strong erosion position P2, the embodiment of the present invention does not limit the shape and/or position of the second magnetic portion 133.

如第1A及1B圖所示，第一黏膠150形成於承載面110u。第一磁性元件120及第二磁性元件130透過第一黏膠150配置在承載面110u。第二黏膠155及第三黏膠160分別形成於第一磁性元件120的相對二面。第五黏膠170及第六黏膠175分別形成於第二磁性元件130的相對二面。第四黏膠165覆蓋第一磁性元件120、第二磁性元件130及第一黏膠150。靶材140透過第四黏膠165配置在第一磁性元件120及第二磁性元件130。在一實施例中，第二黏膠155、第三黏膠160、第五黏膠170及第六黏膠175亦可選擇性地省略，而直接以第一黏膠150及第四黏膠165固定第一磁性元件120及第二磁性元件130。 As shown in FIGS. 1A and 1B, the first adhesive 150 is formed on the supporting surface 110u. The first magnetic element 120 and the second magnetic element 130 are disposed on the carrying surface 110 u through the first adhesive 150. The second glue 155 and the third glue 160 are respectively formed on two opposite sides of the first magnetic element 120. The fifth adhesive 170 and the sixth adhesive 175 are respectively formed on two opposite sides of the second magnetic element 130. The fourth glue 165 covers the first magnetic element 120, the second magnetic element 130 and the first glue 150. The target 140 is disposed on the first magnetic element 120 and the second magnetic element 130 through the fourth adhesive 165. In one embodiment, the second adhesive 155, the third adhesive 160, the fifth adhesive 170, and the sixth adhesive 175 can be optionally omitted, and the first adhesive 150 and the fourth adhesive 165 are directly used. The first magnetic element 120 and the second magnetic element 130 are fixed.

第一黏膠150、第二黏膠155、第三黏膠160、第四黏膠165、第五黏膠170及/或第六黏膠175例如是一金屬黏膠，其材料例如包含鍚、鋅、銦或其組合。 The first glue 150, the second glue 155, the third glue 160, the fourth glue 165, the fifth glue 170, and/or the sixth glue 175 are, for example, a metal glue, the material of which includes, for example, tin, Zinc, indium or a combination thereof.

請參照第2A~2F圖，其繪示第1B圖之靶材結構100的製造過程圖。 Please refer to FIGS. 2A to 2F, which illustrate the manufacturing process diagram of the target structure 100 in FIG. 1B.

如第2A圖所示，提供一載板110。 As shown in FIG. 2A, a carrier board 110 is provided.

如第2B圖所示，可採用例如是塗佈技術，形成第一黏膠150於載板110的承載面110u的至少一部分。 As shown in FIG. 2B, for example, a coating technique may be used to form at least a part of the first adhesive 150 on the bearing surface 110u of the carrier 110.

如第2C圖所示，可採用例如是塗佈技術，形成第二黏膠155及第三黏膠160分別於第一磁性元件120’的相對之第一面120s1的至少一部分與第二面120s2的至少一部分，以及形成第五黏膠170及第六黏膠175分別於第二磁性元件130’之相對的第一面130s1的至少一部分與第二面130s2的至少一部分。 As shown in Figure 2C, for example, a coating technique can be used to form the second adhesive 155 and the third adhesive 160 on at least a portion of the first surface 120s1 and the second surface 120s2 of the first magnetic element 120' opposite to each other. At least a part of, and at least a part of the first surface 130s1 and at least a part of the second surface 130s2 opposite to the second magnetic element 130 ′ are formed on the fifth adhesive 170 and the sixth adhesive 175, respectively.

如第2D圖所示，配置第一磁性元件120’及第二磁性元件130’於第一黏膠150上。如圖所示，第一磁性元件120’包括第一調整部121’、第二調整部122’及第一磁性部123，其中第一調整部121’及第二調整部122’分別連接於第一磁性部123的相對二側。第一調整部121’及第二調整部122’突出於第一黏膠150的相對二側面150s1及150s2，以利後續方便操作第一調整部121’及第二調整部122’而提整第一磁性元件120’與後續製程的靶材140之間的相對位置。 As shown in FIG. 2D, the first magnetic element 120' and the second magnetic element 130' are arranged on the first adhesive 150. As shown in the figure, the first magnetic element 120' includes a first adjustment portion 121', a second adjustment portion 122' and a first magnetic portion 123, wherein the first adjustment portion 121' and the second adjustment portion 122' are respectively connected to the Two opposite sides of a magnetic part 123. The first adjustment portion 121' and the second adjustment portion 122' protrude from the opposite sides 150s1 and 150s2 of the first adhesive 150 to facilitate subsequent operations of the first adjustment portion 121' and the second adjustment portion 122' to improve the The relative position between a magnetic element 120' and the target 140 in the subsequent process.

相似地。在第2D圖中，第二磁性元件130’包括第三調整部131’、第四調整部132’及第二磁性部133，其中第三調整部131’ 及第四調整部132’分別連接於第二磁性部133的相對二側。第三調整部131’及第四調整部132’突出於第一黏膠150的相對二側面150s1及150s2，以利後續方便操作第三調整部131’及第四調整部132’而提整第二磁性元件130’與後續製程的靶材140之間的相對位置。 Similarly. In Figure 2D, the second magnetic element 130' includes a third adjustment portion 131', a fourth adjustment portion 132', and a second magnetic portion 133, wherein the third adjustment portion 131' And the fourth adjusting portion 132' are respectively connected to two opposite sides of the second magnetic portion 133. The third adjustment portion 131' and the fourth adjustment portion 132' protrude from the opposite sides 150s1 and 150s2 of the first adhesive 150 to facilitate subsequent operations of the third adjustment portion 131' and the fourth adjustment portion 132' to improve the The relative position between the two magnetic elements 130 ′ and the target 140 in the subsequent process.

如第2E圖所示，可採用例如是塗佈技術，形成第四黏膠165覆蓋第一磁性元件120’、第二磁性元件130’及第一黏膠150。如圖所示，第一磁性元件120’的第一調整部121’及第二調整部122’分別突出第四黏膠165的相對二側，以方便後續操作第一調整部121’及第二調整部122’調整第一磁性元件120’與後續製程的靶材140之間的相對位置。相似地，第二磁性元件130’的第三調整部131’及第四調整部132’分別突出第四黏膠165的相對二側，以方便後續操作第三調整部131’及第四調整部132’調整第二磁性元件130’與後續製程的靶材140之間的相對位置。 As shown in FIG. 2E, for example, a coating technique can be used to form the fourth adhesive 165 to cover the first magnetic element 120', the second magnetic element 130', and the first adhesive 150. As shown in the figure, the first adjustment portion 121' and the second adjustment portion 122' of the first magnetic element 120' protrude from opposite sides of the fourth adhesive 165 to facilitate subsequent operations of the first adjustment portion 121' and the second adjustment portion 122'. The adjusting part 122' adjusts the relative position between the first magnetic element 120' and the target 140 of the subsequent process. Similarly, the third adjustment portion 131' and the fourth adjustment portion 132' of the second magnetic element 130' respectively protrude from opposite sides of the fourth glue 165 to facilitate subsequent operations of the third adjustment portion 131' and the fourth adjustment portion 132' adjusts the relative position between the second magnetic element 130' and the target 140 of the subsequent process.

在一實施例中，第2C圖之第二黏膠155、第三黏膠160、第五黏膠170及第六黏膠175亦可選擇性地省略，使後續步驟中第一黏膠150及第四黏膠165可直接固定第一磁性元件120及第二磁性元件130。 In one embodiment, the second adhesive 155, the third adhesive 160, the fifth adhesive 170, and the sixth adhesive 175 in Figure 2C can be optionally omitted, so that the first adhesive 150 and The fourth adhesive 165 can directly fix the first magnetic element 120 and the second magnetic element 130.

如第2F圖所示，配置靶材140於第四黏膠165上。由於第一磁性元件120’之第一調整部121’及第二調整部122’分別突出於靶材140之第一側面140s1及第二側面140s2，因此可方便操作第一調整部121’及第二調整部122’的位置而調整第一磁性元件120’與靶材140 之間的相對位置，使第一磁性元件120’之第一磁性部122的區域與第一強蝕位置P1沿Z軸向(第一磁性元件120’與靶材140的堆疊方向)重疊。 As shown in FIG. 2F, the target 140 is disposed on the fourth glue 165. Since the first adjustment portion 121' and the second adjustment portion 122' of the first magnetic element 120' respectively protrude from the first side surface 140s1 and the second side surface 140s2 of the target 140, it is convenient to operate the first adjustment portion 121' and the second side surface 140s2. Adjust the position of the second adjustment portion 122' to adjust the first magnetic element 120' and the target 140 The relative position therebetween is such that the area of the first magnetic portion 122 of the first magnetic element 120' and the first strong erosion position P1 overlap along the Z axis (the stacking direction of the first magnetic element 120' and the target 140).

相似地，在第2F圖中，第二磁性元件130’之第三調整部131’及第四調整部132’分別突出於靶材140之第一側面140s1及第二側面140s2，因此可透過操作第三調整部131’及第四調整部132’而調整第二磁性元件130’與靶材140之間的相對位置，使第二磁性元件130’之第二磁性部132的區域與第二強蝕位置P2沿Z軸向(第二磁性元件130’與靶材140的堆疊方向)重疊。 Similarly, in Figure 2F, the third adjustment portion 131' and the fourth adjustment portion 132' of the second magnetic element 130' respectively protrude from the first side surface 140s1 and the second side surface 140s2 of the target 140, so that it can be operated through The third adjustment portion 131' and the fourth adjustment portion 132' adjust the relative position between the second magnetic element 130' and the target 140, so that the area of the second magnetic portion 132 of the second magnetic element 130' is the same as the second strong The etching position P2 overlaps along the Z axis (the stacking direction of the second magnetic element 130' and the target 140).

在第一磁性元件120’的位置調整正確後，可裁斷第一調整部121’突出於靶材140之第一側面140s1的部分以及裁斷第二調整部122’突出於靶材140之第二側面140s2的部分。裁斷後的第一調整部121形成第一裁斷側面121s(繪示於第1A圖)，而裁斷後的第二調整部122形成第二裁斷側面122s(繪示於第1A圖)。第一裁斷側面121s及第二裁斷側面122s分別與靶材140之相對之第一側面140s1及第二側面140s2對齊，如第1A圖所示。如此，可避免第一調整部121及第二調整部122自靶材140外伸，進而避免因為誤觸調整部而導致第一磁性元件120偏移。 After the position of the first magnetic element 120' is adjusted correctly, the part of the first adjustment portion 121' protruding from the first side surface 140s1 of the target 140 and the second adjustment portion 122' can be cut out protruding from the second side surface of the target 140 140s2 part. The first adjusting portion 121 after cutting forms a first cutting side surface 121s (shown in Figure 1A), and the second adjusting portion 122 after cutting forms a second cutting side surface 122s (shown in Figure 1A). The first cutting side 121s and the second cutting side 122s are respectively aligned with the first side 140s1 and the second side 140s2 opposite to the target 140, as shown in FIG. 1A. In this way, the first adjustment portion 121 and the second adjustment portion 122 can be prevented from extending from the target 140, and the first magnetic element 120 can be prevented from shifting due to accidentally touching the adjustment portion.

相似地，在第二磁性元件130’的位置調整正確後，可裁斷第三調整部131’突出於靶材140之第一側面140s1的部分以及裁斷第四調整部132’突出於靶材140之第二側面140s2的部分。裁斷後的第三調整部131形成第三裁斷側面131s(繪示於第1A圖)，而裁斷後的第四調整部132形成第四裁斷側面132s(繪示於第1A圖)。第三裁斷側 面131s及第四裁斷側面132s分別與靶材140之相對之第一側面140s1及第二側面140s2對齊，如第1A圖所示。如此，可避免第三調整部131及第四調整部132自靶材140外伸，進而避免因為誤觸調整部而導致第二磁性元件130偏移。 Similarly, after the position of the second magnetic element 130' is adjusted correctly, the part of the third adjustment portion 131' protruding from the first side surface 140s1 of the target 140 and the fourth adjustment portion 132' protruding from the target 140 can be cut. Part of the second side 140s2. The cut third adjustment portion 131 forms a third cut side surface 131s (shown in Figure 1A), and the cut fourth adjustment portion 132 forms a fourth cut side surface 132s (shown in Figure 1A). Third judgment side The surface 131s and the fourth cutting side surface 132s are respectively aligned with the first side surface 140s1 and the second side surface 140s2 opposite to the target 140, as shown in FIG. 1A. In this way, the third adjustment portion 131 and the fourth adjustment portion 132 can be prevented from extending from the target 140, thereby preventing the second magnetic element 130 from shifting due to accidentally touching the adjustment portion.

然後，加熱裁斷後的第一磁性元件120、裁斷後的第二磁性元件130、第一黏膠150、第二黏膠155、第三黏膠160、第四黏膠165、第五黏膠170及第六黏膠175，以固化黏膠，增加第一磁性元件120及第二磁性元件130與靶材140之間的結合性。 Then, the first magnetic element 120 after cutting, the second magnetic element 130 after cutting, the first glue 150, the second glue 155, the third glue 160, the fourth glue 165, and the fifth glue 170 are heated. And the sixth adhesive 175 to cure the adhesive and increase the bond between the first magnetic element 120 and the second magnetic element 130 and the target 140.

在另一實施例中，可先固化黏膠，然後再剪裁第一磁性元件120’及第二磁性元件130’。 In another embodiment, the adhesive may be cured first, and then the first magnetic element 120' and the second magnetic element 130' can be cut.

綜上所述，雖然本發明已以實施例揭露如上，然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾。因此，本發明之保護範圍當視後附之申請專利範圍所界定者為準。 In summary, although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field of the present invention can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be subject to those defined by the attached patent scope.

100:靶材結構 100: target structure

110:載板 110: carrier board

110u:承載面 110u: bearing surface

120:第一磁性元件 120: The first magnetic element

121:第一調整部 121: First Adjustment Department

121s:第一裁斷側面 121s: first cut side

122:第二調整部 122: Second Adjustment Department

122s:第二裁斷側面 122s: second cut side

123:第一磁性部 123: The first magnetic part

130:第二磁性元件 130: second magnetic element

131:第三調整部 131: Third Adjustment Department

131s:第三裁斷側面 131s: third cut side

132:第四調整部 132: Fourth Adjustment Department

132s:第四裁斷側面 132s: Fourth cutting side

133:第二磁性部 133: The second magnetic part

140:靶材 140: target

140s1:第一側面 140s1: first side

140s2:第二側面 140s2: second side

P1:第一強蝕位置 P1: The first strong eclipse position

P2:第二強蝕位置 P2: The second strong eclipse position

Claims (10)

一種靶材結構，包括：一載板，具有一承載面；一第一磁性元件，配置在該承載面；一靶材，配置在該第一磁性元件且覆蓋整個該第一磁性元件；其中，該第一磁性元件的位置對應一第一強蝕位置；該第一磁性元件具有一裁斷側面，該裁斷側面與該靶材的一側面實質上對齊。 A target material structure includes: a carrier plate having a bearing surface; a first magnetic element arranged on the bearing surface; a target material arranged on the first magnetic element and covering the entire first magnetic element; wherein, The position of the first magnetic element corresponds to a first strong erosion position; the first magnetic element has a cutting side surface, and the cutting side surface is substantially aligned with a side surface of the target. 如申請專利範圍第1項所述之靶材結構，更包括：一第一黏膠，形成於該承載面；其中，該第一磁性元件透過該第一黏膠配置在該承載面。 The target structure described in item 1 of the scope of patent application further includes: a first glue formed on the carrying surface; wherein the first magnetic element is disposed on the carrying surface through the first glue. 如申請專利範圍第1項所述之靶材結構，更包括：一第二黏膠；以及一第三黏膠；其中，該第二黏膠及該第三黏膠分別形成於該第一磁性元件的相對二面。 The target structure described in item 1 of the scope of patent application further includes: a second glue; and a third glue; wherein, the second glue and the third glue are formed on the first magnetic Opposite sides of the component. 如申請專利範圍第2項所述之靶材結構，更包括：一第四黏膠，覆蓋該第一磁性元件及該第一黏膠；其中，該靶材透過該第四黏膠配置在該第一磁性元件。 The target structure described in item 2 of the scope of patent application further includes: a fourth glue covering the first magnetic element and the first glue; wherein the target is disposed on the fourth glue through the fourth glue The first magnetic element. 如申請專利範圍第2項所述之靶材結構，更包括：一第二磁性元件，配置在該承載面； 其中，該靶材配置在該第一磁性元件且覆蓋整個該第一磁性元件，而該第二磁性元件的位置對應一第二強蝕位置。 The target structure described in item 2 of the scope of patent application further includes: a second magnetic element disposed on the bearing surface; Wherein, the target is disposed on the first magnetic element and covers the entire first magnetic element, and the position of the second magnetic element corresponds to a second strong erosion position. 如申請專利範圍第5項所述之靶材結構，其中該第一強蝕位置與該第二強蝕位置相對該載板的中心呈對稱。 In the target structure described in item 5 of the scope of patent application, the first strong etching position and the second strong etching position are symmetrical with respect to the center of the carrier plate. 如申請專利範圍第1項所述之靶材結構，更包括：一第五黏膠；以及一第六黏膠；其中，該第五黏膠及該第六黏膠分別形成於該第二磁性元件的相對二面。 The target structure described in item 1 of the scope of patent application further includes: a fifth glue; and a sixth glue; wherein, the fifth glue and the sixth glue are formed on the second magnetic Opposite sides of the component. 如申請專利範圍第1項所述之靶材結構，其中該第一磁性元件包括一調整部及一磁性部，該調整部連接於該磁性部；該磁性部的位置對應該第一強蝕位置，該調整部具有一裁斷側面，該裁斷側面與該靶材的一側面實質上對齊。 The target structure as described in item 1 of the scope of patent application, wherein the first magnetic element includes an adjusting part and a magnetic part, the adjusting part is connected to the magnetic part; the position of the magnetic part corresponds to the first strong corrosion position The adjusting part has a cutting side surface, and the cutting side surface is substantially aligned with a side surface of the target material. 如申請專利範圍第1項所述之靶材結構，其中該第一磁性元件的厚度介於0.1毫米~0.5毫米之間，及/或該第一磁性元件的材料選自鐵(Fe)、鈷(Co)、鎳(Ni)、不銹鋼、坡莫合金(permalloy)及其任意組合，及/或該第一磁性元件寬度介於該靶材寬度的20%~100%。 The target structure as described in item 1 of the scope of patent application, wherein the thickness of the first magnetic element is between 0.1 mm and 0.5 mm, and/or the material of the first magnetic element is selected from iron (Fe) and cobalt (Co), nickel (Ni), stainless steel, permalloy and any combination thereof, and/or the width of the first magnetic element is between 20% and 100% of the width of the target. 如申請專利範圍第1項所述之靶材結構，其中該第一強蝕位置與該靶材之中心的距離介於L/2~L/4之間，其中L為該靶材的長度，及/或該第一強蝕位置不位於靶材的邊緣位置。 For the target structure described in item 1 of the scope of patent application, the distance between the first corrosion position and the center of the target is between L/2 and L/4, where L is the length of the target, And/or the first strong etching position is not located at the edge position of the target.
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