CN108070834B - Back plate and forming method thereof - Google Patents

Back plate and forming method thereof Download PDF

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Publication number
CN108070834B
CN108070834B CN201611028664.4A CN201611028664A CN108070834B CN 108070834 B CN108070834 B CN 108070834B CN 201611028664 A CN201611028664 A CN 201611028664A CN 108070834 B CN108070834 B CN 108070834B
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initial
plate
solder
welding surface
welding
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CN108070834A (en
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姚力军
潘杰
相原俊夫
王学泽
吴东青
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Ningbo Jiangfeng Electronic Material Co Ltd
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Ningbo Jiangfeng Electronic Material Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Arc Welding In General (AREA)

Abstract

The invention provides a back plate and a forming method thereof, wherein the method comprises the following steps: providing a bottom plate, a cover plate and initial welding materials, wherein the bottom plate comprises a first welding surface, a water tank is arranged in the bottom plate, the first welding surface is exposed out of the water tank, and the cover plate comprises a second welding surface; one or both of the bottom plate and the cover plate is made of stainless steel; attaching the base plate, the cover plate and the initial welding flux to enable the initial welding flux to be positioned between the first welding surface and the second welding surface and to be respectively contacted with the first welding surface and the second welding surface to form an initial back plate; and carrying out soldering treatment on the initial back plate to enable the initial solder to form solder. The stainless steel has higher hardness, and is not easy to bend after water is introduced into the water tank, so that a welding seam between the starting plate and the cover plate is not easy to crack, and the service life of the back plate can be prolonged.

Description

Back plate and forming method thereof
Technical Field
The invention relates to the field of target preparation, in particular to a back plate and a forming method thereof.
Background
The target material is a sputtering source for forming various functional films by a sputtering coating method. In brief, the target material is the target material bombarded by high-speed charged energy particles. In order to ensure that the target material has good electric conduction and heat conduction performance, the target material needs to be welded with a back plate (copper or aluminum and other materials) before sputtering to form a target material assembly. The target is arranged on the machine table through a back plate.
During the vacuum sputtering process, the environment of the target assembly is very harsh. The temperature is higher (such as 300-500℃)) The target material assembly is in a high-voltage electric field and a magnetic field with larger intensity, and the front surface is 10-9In a high vacuum environment of Pa, the target material is sputtered by various high-energy ions, and sputtered high-energy target atoms or molecules are deposited on the substrate to form a film. The temperature of the target assembly rises dramatically, requiring a backing plate to transfer and dissipate heat and thereby avoid target distortion, reduced life, and quality problems affecting the formed film. In the prior art, in order to increase the heat dissipation of the back plate, a cooling water channel is arranged in the back plate, and the cooling water in the cooling water channel can quickly dissipate the heat of the target assembly. The back plate is formed by welding a bottom plate with a cooling water channel and a cover plate.
However, because the backplate is in the use, the cooling water can produce pressure to backplate and apron to make apron or bottom plate take place to warp, lead to the welding seam fracture between apron and the bottom plate, thereby shorten the life of backplate, consequently, the life of the backplate that prior art formed is short.
Disclosure of Invention
The invention provides a backboard and a forming method thereof, which are used for prolonging the service life of the backboard.
In order to solve the above problems, the present invention provides a method for forming a back plate, comprising: providing a bottom plate, a cover plate and initial welding materials, wherein the bottom plate comprises a first welding surface, a water tank is arranged in the bottom plate, the first welding surface is exposed out of the water tank, and the cover plate comprises a second welding surface; one or both of the bottom plate and the cover plate is made of stainless steel; attaching the base plate, the cover plate and the initial welding flux to enable the initial welding flux to be positioned between the first welding surface and the second welding surface and to be respectively contacted with the first welding surface and the second welding surface to form an initial back plate; and carrying out soldering treatment on the initial back plate to enable the initial solder to form solder.
Optionally, the bottom plate is made of stainless steel, and the cover plate is made of copper; or the bottom plate is made of copper, and the cover plate is made of stainless steel; the initial solder is a silver-based solder or a copper-based solder.
Optionally, in the initial back plate, a projected pattern of the initial solder on the second soldering surface is not overlapped with a projected pattern of the bottom of the water tank on the second soldering surface.
Optionally, the attaching process includes: placing the initial solder on the first soldering surface, the solder exposing the water tank; placing the cover plate on the solder after placing the solder on the first welding surface; or, the second welding surface comprises a fitting area, and the fitting processing step comprises: placing the solder on the bonding area; and after the welding flux is placed on the bonding area, placing the bottom plate on the welding flux to bond the first welding surface and the welding flux.
Optionally, the initial solder comprises a solder face for contacting the first soldering face; before forming the initial back plate, the method further comprises the following steps: cutting the initial solder according to the shape of the first welding surface to make the solder surface rectangular or make the shape and size of the initial solder and the first welding surface the same; when the solder surface is rectangular, the width of the solder surface is smaller than the distance between the water tanks.
Optionally, the welding process includes: heating the initial back plate to melt the initial solder to form a molten solder; and after the heating treatment, cooling the initial back plate to solidify the molten solder to form the solder.
Optionally, the initial back plate is subjected to a heating treatment by a vacuum furnace, and the heating treatment includes: placing the initial backing plate in a vacuum furnace; and adjusting the temperature of the vacuum furnace, and heating the initial back plate.
Optionally, the vacuum furnace includes a furnace chamber, and the step of placing the initial back plate in the vacuum furnace includes: placing the initial back plate in the furnace chamber with the cover plate in contact with the bottom of the furnace chamber.
Optionally, in the process of performing heat treatment on the initial back plate, the vacuum degree in the vacuum furnace is greater than 1E-3 Pa.
Optionally, the step of heat treatment comprises: heating the initial back plate to a heating temperature to melt the initial solder; and after the temperature is raised to the heating temperature, preserving the heat of the initial back plate.
Optionally, the heating temperature is 700-800 ℃; the heat preservation time is 2-5 h.
Optionally, during the heating process of the initial back plate, pressure is applied to the initial back plate in a direction perpendicular to the surface of the cover plate.
Optionally, the step of heat treating and applying pressure comprises: after heating the initial back plate to a heating temperature, applying pressure to the initial back plate in a direction perpendicular to the surface of the cover plate.
Optionally, the step of applying pressure to the initial back plate includes: placing a compact on the initial back plate before heat treating the initial back plate.
Optionally, the pressure applied to the initial back plate is 600N to 2000N.
Optionally, in the process of performing welding treatment on the initial back plate, an acute included angle between the first welding surface of the bottom plate and the horizontal plane is less than 0.03 degrees; and an acute included angle between the second welding surface and the horizontal plane is less than 0.03 degree.
Optionally, the flatness of the first welding surface of the bottom plate is less than 0.05 mm; the flatness of the cover plate is less than 0.05 mm.
Optionally, before forming the initial back plate, the method further includes: cleaning the first welding surface of the bottom plate and the second welding surface of the cover plate; and after the cleaning treatment, drying the first welding surface at the bottom and the second welding surface of the cover plate.
Correspondingly, the invention also provides a back plate, comprising: a base plate including a first welding surface, the base plate having a water trough therein, the first welding surface exposing the water trough; a cover plate comprising a second weld face, one or both of the base plate and the cover plate being made of stainless steel; and the solder is positioned between the first welding surface of the bottom plate and the second welding surface of the cover plate.
Optionally, the bottom plate is made of stainless steel, and the cover plate is made of copper; or the bottom plate is made of copper, and the cover plate is made of stainless steel; the solder is silver-based solder or copper-based solder.
Compared with the prior art, the technical scheme of the invention has the following advantages:
in the method for forming the back plate provided by the technical scheme of the invention, one or both of the bottom plate and the cover plate is made of stainless steel. The stainless steel has higher hardness, and after water is introduced into the water tank, the pressure of the water on the stainless steel is not easy to bend the cover plate or the bottom plate, so that the welding line between the bottom plate and the cover plate is not easy to crack, and the service life of the back plate can be prolonged. In addition, the stainless steel is low in price, and the production cost of the back plate can be reduced.
Further, in the process of heating the initial back plate, an acute included angle between the first welding surface of the bottom plate and the horizontal plane is less than 0.03 degree. The included angle between the first welding surface and the horizontal plane and the included angle between the second welding surface and the horizontal plane are small, so that molten solder on the first welding surface can not easily flow into the water tank under the action of gravity, the water tank can not be easily blocked by the solder, and the performance of the formed back plate can be improved.
Further, in the initial back plate, a projection pattern of the initial solder on the second welding surface is not overlapped with a projection pattern of the bottom of the water tank on the second welding surface, and in the welding process, the molten solder is not easy to enter the water tank, so that the water tank is not easy to block, and the performance of the formed back plate can be improved.
Further, the initial back plate is heated by a vacuum furnace, and the vacuum furnace has a high vacuum degree, so that the oxygen partial pressure in the vacuum furnace can be low. The oxide on first face of weld and the second face of weld is easily decomposed under low oxygen partial pressure environment to can reduce oxide on first face of weld and the second face of weld improves the smooth finish of first face of weld and second face of weld, and then increases welding strength between first face of weld and the second face of weld. Therefore, the forming method can increase the service life of the formed back plate.
Further, the initial back plate is pressed along the direction vertical to the surface of the cover plate, so that the wettability of the molten solder on the first welding surface and the second welding surface can be increased, and the welding strength between the bottom plate and the cover plate is increased.
Furthermore, the initial back plate is pressed after being heated to the heating temperature, so that the time for pressing the initial back plate can be shortened on the premise of not reducing the wettability of the molten solder on the first welding surface and the second welding surface, and the initial back plate can be prevented from being bent.
In the back plate provided by the technical scheme of the invention, the bottom plate or the cover plate is made of stainless steel, or the bottom plate and the cover plate are made of stainless steel. The stainless steel has higher hardness, and after water is introduced into the water tank, the pressure of the water on the stainless steel is not easy to bend the cover plate or the bottom plate, so that the welding line between the bottom plate and the cover plate is not easy to crack, and the service life of the back plate can be prolonged. In addition, the stainless steel is low in price, and the production cost of the back plate can be reduced.
Drawings
Fig. 1 to 7 are schematic structural diagrams of steps of an embodiment of a method for forming a backplane according to the present invention.
Detailed Description
As mentioned in the background, the back plate has problems, such as a short lifespan of the back plate.
Now, in connection with a back plate, the reason for the short service life of the back plate is analyzed:
the back plate includes: a base plate including a first welding surface, the base plate having a water trough therein, the first welding surface exposing the water trough; a cover plate comprising a second weld face; and the solder is positioned between the first welding surface and the second welding surface.
Wherein, the material of the cover plate and the bottom plate is copper or aluminum. Since the copper material is expensive, the production cost is easily increased. The aluminum material has lower cost and wider application. However, the hardness of the aluminum is low, the cooling water is introduced into the water tank during the use process of the back plate, and the bottom plate and the cover plate are easily subjected to the pressure of the cooling water, so that the bottom plate or the cover plate is deformed, the welding line between the bottom plate and the cover plate is cracked, and the service life of the back plate is shortened.
In order to solve the technical problem, the invention provides a method for forming a back plate, which comprises the following steps: providing a bottom plate, a cover plate and initial welding materials, wherein the bottom plate comprises a first welding surface, a water tank is arranged in the bottom plate, the first welding surface is exposed out of the water tank, and the cover plate comprises a second welding surface; one or both of the bottom plate and the cover plate is made of stainless steel; attaching the base plate, the cover plate and the initial welding flux to enable the initial welding flux to be positioned between the first welding surface and the second welding surface and to be respectively contacted with the first welding surface and the second welding surface to form an initial back plate; and carrying out soldering treatment on the initial back plate to enable the initial solder to form solder.
Wherein one or both of the material of the bottom plate and the material of the cover plate is stainless steel. The stainless steel has higher hardness, and after water is introduced into the water tank, the pressure of the water on the stainless steel is not easy to bend the cover plate or the bottom plate, so that the welding line between the bottom plate and the cover plate is not easy to crack, and the service life of the back plate can be prolonged. In addition, the stainless steel is low in price, and the production cost of the back plate can be reduced.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
Fig. 1 to 7 are schematic structural diagrams of steps of an embodiment of a method for forming a backplane according to the present invention.
Referring to fig. 1, a base plate 110, a cover plate 120 and initial solder (as shown in fig. 2) are provided, the base plate 110 includes a first soldering surface 111, the base plate 110 has a water trough 112 therein, the first soldering surface 111 exposes the water trough 112, and the cover plate 120 includes a second soldering surface 121; the material of one or both of the base plate 110 and the cover plate 120 is stainless steel.
The water trough 112 is used to contain cooling water during use of the formed backing plate.
Note that, the material of one or both of the bottom plate 110 and the cover plate 120 is stainless steel. The stainless steel has high hardness, and after the cooling water is introduced into the water tank 112, the pressure of the cooling water on the stainless steel is not easy to bend the cover plate 120 or the base plate 110, so that the weld joint between the base plate 110 and the cover plate 120 is not easy to crack, and the service life of the formed back plate can be prolonged. In addition, the stainless steel is low in price, and the production cost of the formed back plate can be reduced.
In this embodiment, the base plate 110 further includes a first back surface opposite to the first soldering surface. The cover plate 120 further includes a second back surface opposite to the second welding surface 121.
In this embodiment, the material of the bottom plate 110 is copper, the material of the cover plate 120 is stainless steel, and the material of the initial solder is silver-based solder or copper-based solder. The copper backplane can increase the conductivity of the formed backplane. The bending resistance of copper is good, and the pressure of the cooling water in the water tank 112 on the bottom plate 110 is unlikely to cause bending deformation of the bottom plate 110 in the use process of the formed back plate.
In other embodiments, the material of the bottom plate can also be stainless steel.
In this embodiment, the water tank 112 holds cooling water during the use of the formed back plate, thereby cooling the formed back plate.
In this embodiment, the number of the water tanks 112 is plural. The water tanks 112 are strip-shaped, and the water tanks 112 are arranged in parallel.
In this embodiment, the forming method further includes: cleaning the first welding surface 111 of the base plate 110 and the second welding surface 121 of the cover plate 120; after the cleaning process, the first welding surface 111 of the base plate 110 and the second welding surface 121 of the cover plate 120 are dried.
The cleaning treatment is used for removing impurities such as oil stains and dust on the first welding surface 111 and the second welding surface 121 and increasing the smoothness of the first welding surface 111 and the second welding surface 121, so that the wettability of initial welding flux on the first welding surface 111 and the second welding surface 121 is increased, the welding strength between the cover plate 120 and the base plate 110 is increased, and the service life of the formed back plate is prolonged.
In the present embodiment, the first bonding surface 111 and the second bonding surface 121 are cleaned by ultrasonic treatment.
Specifically, the cleaning treatment includes: placing the base plate 110 and the cover plate 120 in a cleaning solution; after the base plate 110 and the cover plate 120 are put in a cleaning solution, the base plate 110 and the cover plate 120 are cleaned by an ultrasonic device.
In this embodiment, the cleaning solution is an alcohol solution. In other embodiments, the cleaning solution may also be water.
In this embodiment, the time for the cleaning treatment is 15 to 25 min.
The drying process is used to remove the residual cleaning solution and moisture on the surfaces of the base plate 110 and the cover plate 120, thereby reducing oxidation of the base plate 110 and the cover plate 120.
In this embodiment, the bottom plate 110 and the cover plate 120 are dried by a vacuum drying oven.
In this embodiment, the drying parameters include: the drying temperature is 25-35 ℃; the drying time is 0.8 h-1.2 h, and the vacuum degree in the drying box is more than 1E-2 Pa.
In this embodiment, the forming method further includes: the initial solder is trimmed according to the shape of the first soldering surface 111.
The initial solder 130 is trimmed so that the initial solder 130 is exposed from the bottom of the water tank 112 after the initial solder 130 is placed on the first bonding surface 111 of the base plate 110.
In this embodiment, the initial solder 130 includes a solder surface for contacting the second bonding surface 121.
Specifically, the initial solder 130 is cut to make the solder surface rectangular or to make the shape and size of the initial solder 130 the same as those of the first soldering surface 111; when the solder surface is rectangular, the width of the solder surface is less than the spacing between the water channels 112.
And subsequently, carrying out a bonding treatment on the base plate 110, the cover plate 120 and the initial solder 130, so that the initial solder 130 is positioned between the first welding surface 111 and the second welding surface 121, and the initial solder 130 is respectively contacted with the first welding surface 111 and the second welding surface 121 to form an initial back plate.
In the initial back plate, the projected pattern of the initial solder on the second soldering surface 121 does not overlap with the projected pattern of the bottom of the water tank 112 on the second soldering surface 121.
The projection pattern of the initial solder 130 on the second soldering surface 121 is not overlapped with the projection pattern of the bottom of the water tank 112 on the second soldering surface 121, so that the molten solder in the water tank 112 can be reduced in the subsequent soldering process, and the subsequently formed solder is not easy to block the water tank 112, thereby improving the performance of the formed back plate.
In this embodiment, the steps of forming the initial back plate are shown in fig. 2 to 4.
Referring to fig. 2 and 3, fig. 3 is a top view along the X direction of fig. 1, and an initial solder 130 is placed on the first soldering surface 111.
In this embodiment, after the initial solder 130 is cut, the initial solder is placed on the second soldering surface 111.
In this embodiment, the step of placing the initial solder 130 on the first soldering surface 111 includes: the initial solder 130 is placed on the second soldering surface 121 in the shape of the first soldering surface 111, so that the initial solder 130 is exposed out of the bottom of the water tank 112.
The initial solder 130 is placed on the second soldering surface 121 according to the shape of the first soldering surface 111, so that after the initial back plate is formed, the projection pattern of the initial solder 130 on the second soldering surface 121 is not overlapped with the projection pattern of the bottom of the water tank 112 on the second soldering surface 121, and therefore the subsequently formed solder is not easy to block the water tank 112, and the performance of the formed back plate can be improved.
The initial solder 130 is exposed out of the bottom of the water tank 112, so that after the initial back plate is formed, the projection pattern of the initial solder on the second welding surface 121 is not overlapped with the projection pattern of the bottom of the water tank 112 on the second welding surface 121, thereby reducing the molten solder in the water tank 112 in the subsequent welding process, further preventing the subsequently formed solder from blocking the water tank 112, and improving the performance of the formed back plate.
In this embodiment, the initial solder 130 is placed on the first soldering surface 111. In other embodiments, the second bonding surface includes a bonding region, and the solder may be further placed on the bonding region of the second bonding surface.
Referring to fig. 4, after the initial solder 130 is placed on the first soldering surface 111, the cover plate 120 is placed on the initial solder 130 to form an initial back plate.
In this embodiment, since the initial solder 130 is exposed from the water tank 112 during the process of placing the initial solder 130 on the first soldering surface 111, a projected pattern of the initial solder 130 on the second soldering surface 121 in the initial back plate does not overlap with a projected pattern of the bottom of the water tank 112 on the second soldering surface 121, so as to prevent the subsequently formed solder from blocking the water tank 112.
Before the subsequent heating treatment, the cover plate 120 is placed on the initial solder 130, and the positions of the base plate 110, the cover plate 120 and the initial solder 130 can be adjusted, so that the initial solder 130 can be prevented from being dislocated, the welding quality can be ensured, the subsequently formed solder is not easy to block the water tank 112, and the performance of the formed back plate can be improved.
In another embodiment, the second welding surface includes a bonding area, and the step of performing the bonding process includes: placing the solder on the bonding area; and after the welding flux is placed on the bonding area, placing the bottom plate on the welding flux to bond the first welding surface and the welding flux.
The initial back plate is then soldered to form the initial solder 130 into solder.
In this embodiment, the steps of the welding process are shown in fig. 5 and 6.
Referring to fig. 5, the initial back plate is heated to melt the initial solder 130, forming a molten solder 131.
Specifically, in this embodiment, the initial backing plate is subjected to a heating process by the vacuum furnace 140.
In this embodiment, the step of heat treatment includes: placing the initial backing plate in the vacuum oven 140; the temperature of the vacuum oven 140 is adjusted to heat the initial backing plate.
In this embodiment, the vacuum furnace 140 includes a furnace chamber 141. The step of placing the initial backing plate in a vacuum oven 140 comprises: the initial back plate is placed within the cavity 141 with the lid plate 120 in contact with the bottom of the cavity 141.
It should be noted that, when the cover plate 120 is in contact with the bottom of the cavity 141, the bottom plate 110 is located on the cover plate 120, so that the molten solder 131 flowing into the water tank 112 can be reduced, and the subsequently formed solder is prevented from blocking the water tank 112.
In this embodiment, the step of adjusting the temperature of the vacuum furnace 140 and heating the initial back plate includes: raising the initial back plate to a heating temperature to melt the initial solder 130 (shown in fig. 4); and after the temperature is raised to the heating temperature, preserving the heat of the initial back plate.
In the embodiment, the heating temperature is 700-800 ℃; the heat preservation time is 2-5 h.
In this embodiment, during the heating process of the initial back plate, the furnace chamber 141 is ensured to have a higher vacuum degree, so that the oxygen partial pressure in the furnace chamber 141 can be lower. The oxides on the first welding surface 111 and the second welding surface 121 are easily decomposed in a low oxygen partial pressure environment, so that the oxides on the first welding surface 111 and the second welding surface 121 can be reduced, the smoothness of the first welding surface 111 and the second welding surface 121 is improved, and the welding strength between the first welding surface 111 and the second welding surface 121 is increased, thereby being beneficial to the reduction of the oxides on the first welding surface 111 and the second welding surface 121. The forming method can prolong the service life of the formed back plate. Specifically, the vacuum degree in the furnace chamber 141 is greater than 1E-3 Pa.
In this embodiment, during the heating process, a pressure is applied to the initial back plate in a direction perpendicular to the surface of the cover plate 120.
Applying pressure to the initial back plate in a direction perpendicular to the surface of the cover plate 120 can increase the wettability of the molten solder 131 to the first and second soldering surfaces 111 and 121, thereby increasing the soldering strength between the base plate 110 and the cover plate 120.
In this embodiment, after the initial back plate is heated to the heating temperature, a pressure is applied to the initial back plate in a direction perpendicular to the surface of the cover plate 120.
By applying pressure to the initial back plate after heating to the heating temperature, the time for applying pressure to the initial back plate can be reduced without reducing the wettability of the molten solder 131 to the first soldering surface 111 and the second soldering surface 120, and the initial back plate can be prevented from being bent.
In other embodiments, a pressure may be applied to the initial backing plate by placing a pressing block on the initial backing plate before the initial backing plate is subjected to the heat treatment.
If the pressure applied to the initial back plate is too small, the wettability of the molten solder 131 on the first welding surface 111 and the second welding surface 121 is not increased; if too much pressure is applied to the initial backing plate, the molten solder 131 is easily squeezed into the water bath 112, and thus the water bath 112 is easily clogged. Specifically, in this embodiment, the pressure applied to the initial back plate is 600N to 2000N.
Referring to fig. 6, after the heating process is performed on the initial back plate, the soldering process further includes: the initial back plate is cooled to solidify the molten solder to form solder 132.
In this embodiment, the initial backing plate is furnace cooled. In other embodiments, the initial backing plate may also be allowed to cool naturally.
Referring to fig. 7, after the cooling process, the initial back sheet is machined to form a back sheet.
In this embodiment, the machining step includes: and carrying out mechanical polishing treatment on the first back surface and the second back surface to reduce the roughness of the first back surface and the second back surface.
In summary, in the method for forming the back plate according to the embodiment of the present invention, the material of one or both of the bottom plate and the cover plate is stainless steel. The stainless steel has higher hardness, and after water is introduced into the water tank, the pressure of the water on the stainless steel is not easy to bend the cover plate or the bottom plate, so that the welding line between the bottom plate and the cover plate is not easy to crack, and the service life of the back plate can be prolonged. In addition, the stainless steel is low in price, and the production cost of the back plate can be reduced.
Further, in the process of heating the initial back plate, an acute included angle between the first welding surface of the bottom plate and the horizontal plane is less than 0.03 degree. The included angle between the first welding surface and the horizontal plane and the included angle between the second welding surface and the horizontal plane are small, so that molten solder on the first welding surface can not easily flow into the water tank under the action of gravity, the water tank can not be easily blocked by the solder, and the performance of the formed back plate can be improved.
Further, in the initial back plate, a projection pattern of the initial solder on the second welding surface is not overlapped with a projection pattern of the bottom of the water tank on the second welding surface, and in the welding process, the molten solder is not easy to enter the water tank, so that the water tank is not easy to block, and the performance of the formed back plate can be improved.
Further, the initial back plate is heated by a vacuum furnace, and the vacuum furnace has a high vacuum degree, so that the oxygen partial pressure in the vacuum furnace can be low. The oxide on first face of weld and the second face of weld is easily decomposed under low oxygen partial pressure environment to can reduce oxide on first face of weld and the second face of weld improves the smooth finish of first face of weld and second face of weld, and then increases welding strength between first face of weld and the second face of weld. Therefore, the forming method can increase the service life of the formed back plate.
Further, the initial back plate is pressed along the direction vertical to the surface of the cover plate, so that the wettability of the molten solder on the first welding surface and the second welding surface can be increased, and the welding strength between the bottom plate and the cover plate is increased.
Furthermore, the initial back plate is pressed after being heated to the heating temperature, so that the time for pressing the initial back plate can be shortened on the premise of not reducing the wettability of the molten solder on the first welding surface and the second welding surface, and the initial back plate can be prevented from being bent.
With continued reference to FIG. 7, the present invention also provides an embodiment of a backing plate, the backing plate comprising:
a base plate 110, wherein the base plate 110 includes a first welding surface 111, the base plate 110 has a water tank 112 therein, and the first welding surface 111 exposes the water tank 112;
a cover plate 120, the cover plate 120 including a second welding surface 121, one or both of the base plate 110 and the cover plate 120 being made of stainless steel;
and the solder 132 is positioned between the first welding surface 111 of the bottom plate and the second welding surface 121 of the cover plate.
The water trough 112 is used to contain cooling water during use of the formed backing plate.
Note that, the material of one or both of the bottom plate 110 and the cover plate 120 is stainless steel. The stainless steel has high hardness, and after the cooling water is introduced into the water tank 112, the pressure of the cooling water on the stainless steel is not easy to bend the cover plate 120 or the base plate 110, so that the weld joint between the base plate 110 and the cover plate 120 is not easy to crack, and the service life of the formed back plate can be prolonged. In addition, the stainless steel is low in price, and the production cost of the formed back plate can be reduced.
In this embodiment, the material of the bottom plate 110 is copper, the material of the cover plate 120 is stainless steel, and the material of the solder is silver-based solder or copper-based solder. The copper backplane can increase the conductivity of the formed backplane. In other embodiments, the material of the bottom plate can also be stainless steel.
In this embodiment, the number of the water tanks 112 is plural. The water tanks 112 are strip-shaped, and the water tanks 112 are arranged in parallel.
In summary, in the back plate according to the embodiment of the present invention, one or both of the material of the bottom plate and the material of the cover plate is stainless steel. The stainless steel has higher hardness, and after water is introduced into the water tank, the pressure of the water on the stainless steel is not easy to bend the cover plate or the bottom plate, so that the welding line between the bottom plate and the cover plate is not easy to crack, and the service life of the back plate can be prolonged. In addition, the stainless steel is low in price, and the production cost of the back plate can be reduced.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (17)

1. A method of forming a backplane, comprising:
providing a bottom plate, a cover plate and initial welding materials, wherein the bottom plate comprises a first welding surface, a water tank is arranged in the bottom plate, the first welding surface is exposed out of the water tank, and the cover plate comprises a second welding surface; one or both of the bottom plate and the cover plate is made of stainless steel;
attaching the base plate, the cover plate and the initial welding flux to enable the initial welding flux to be positioned between the first welding surface and the second welding surface and to be respectively contacted with the first welding surface and the second welding surface to form an initial back plate;
carrying out welding treatment on the initial back plate to enable the initial welding flux to form welding flux; in the initial back plate, the projection pattern of the initial solder on the second welding surface is not overlapped with the projection pattern of the bottom of the water tank on the second welding surface; the step of the attaching process includes: placing the initial solder on the first soldering surface, the solder exposing the water tank; placing the cover plate on the solder after placing the solder on the first welding surface; or, the second welding surface comprises a fitting area, and the fitting processing step comprises: placing the solder on the bonding area; after the welding flux is placed on the bonding area, the bottom plate is placed on the welding flux, and the first welding surface is bonded with the welding flux; in the process of welding the initial back plate, an acute included angle between a first welding surface of the bottom plate and a horizontal plane is less than 0.03 degree; and an acute included angle between the second welding surface and the horizontal plane is less than 0.03 degree.
2. The method of claim 1, wherein the material of the base plate is stainless steel, and the material of the cover plate is copper; or the bottom plate is made of copper, and the cover plate is made of stainless steel; the initial solder is a silver-based solder or a copper-based solder.
3. The method of forming a back plate of claim 1, wherein the initial solder comprises a solder face for contacting the first solder face; before forming the initial back plate, the method further comprises the following steps: cutting the initial solder according to the shape of the first welding surface to make the solder surface rectangular or make the shape and size of the initial solder and the first welding surface the same;
when the solder surface is rectangular, the width of the solder surface is smaller than the distance between the water tanks.
4. The method of forming a back plate of claim 1, wherein the soldering process comprises: heating the initial back plate to melt the initial solder to form a molten solder; and after the heating treatment, cooling the initial back plate to solidify the molten solder to form the solder.
5. The method of forming a back sheet according to claim 4, wherein the preliminary back sheet is subjected to a heat treatment by a vacuum furnace, the heat treatment comprising: placing the initial backing plate in a vacuum furnace; and adjusting the temperature of the vacuum furnace, and heating the initial back plate.
6. The method of forming a back sheet of claim 5, wherein the vacuum oven includes a furnace chamber, and the step of placing the initial back sheet in the vacuum oven includes: placing the initial back plate in the furnace chamber with the cover plate in contact with the bottom of the furnace chamber.
7. The method of claim 5, wherein the degree of vacuum in the vacuum furnace is greater than 1E-3Pa during the heat treatment of the initial backing sheet.
8. The method of forming a back sheet according to claim 4, wherein the step of heat-treating comprises: heating the initial back plate to a heating temperature to melt the initial solder; and after the temperature is raised to the heating temperature, preserving the heat of the initial back plate.
9. The method of forming a back sheet according to claim 8, wherein the heating temperature is 700 ℃ to 800 ℃; the heat preservation time is 2-5 h.
10. The method of claim 8, wherein the initial back plate is heated while applying pressure in a direction perpendicular to the surface of the cover plate.
11. The method of forming a back sheet according to claim 10, wherein the steps of heat treating and applying pressure comprise: after heating the initial back plate to a heating temperature, applying pressure to the initial back plate in a direction perpendicular to the surface of the cover plate.
12. The method of forming a back sheet of claim 10, wherein the step of applying pressure to the initial back sheet comprises: placing a compact on the initial back plate before heat treating the initial back plate.
13. The method of claim 10, wherein the pressure applied to the initial backing plate is 600N to 2000N.
14. The method of claim 1, wherein the flatness of the first bonding side of the base plate is less than 0.05 mm; the flatness of the cover plate is less than 0.05 mm.
15. The method of forming a back sheet of claim 1, further comprising, prior to forming the initial back sheet: cleaning the first welding surface of the bottom plate and the second welding surface of the cover plate; and after the cleaning treatment, drying the first welding surface at the bottom and the second welding surface of the cover plate.
16. A backsheet obtained by the forming method according to any one of claims 1 to 15, comprising:
a base plate including a first welding surface, the base plate having a water trough therein, the first welding surface exposing the water trough;
a cover plate comprising a second weld face, one or both of the base plate and the cover plate being made of stainless steel;
and the solder is positioned between the first welding surface of the bottom plate and the second welding surface of the cover plate.
17. The backplate of claim 16, wherein the material of the backplate is stainless steel and the material of the cover plate is copper; or the bottom plate is made of copper, and the cover plate is made of stainless steel; the solder is silver-based solder or copper-based solder.
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