CN102133669A - Welding method for target and back plate - Google Patents
Welding method for target and back plate Download PDFInfo
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- CN102133669A CN102133669A CN2011100292010A CN201110029201A CN102133669A CN 102133669 A CN102133669 A CN 102133669A CN 2011100292010 A CN2011100292010 A CN 2011100292010A CN 201110029201 A CN201110029201 A CN 201110029201A CN 102133669 A CN102133669 A CN 102133669A
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- target
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- 238000003466 welding Methods 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000010438 heat treatment Methods 0.000 claims abstract description 46
- 238000001816 cooling Methods 0.000 claims abstract description 15
- 239000013077 target material Substances 0.000 claims description 31
- 229910000679 solder Inorganic materials 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 229910000838 Al alloy Inorganic materials 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000004411 aluminium Substances 0.000 claims description 7
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- 239000012809 cooling fluid Substances 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 230000006698 induction Effects 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 230000004907 flux Effects 0.000 abstract description 5
- 238000010923 batch production Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 9
- 238000005476 soldering Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 244000137852 Petrea volubilis Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- -1 aluminium Chemical class 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004781 supercooling Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/002—Soldering by means of induction heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
- H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention relates to a welding method for a target and a back plate, comprising the steps of: providing the target and the back plate; adding welding flux on welding surfaces of the target and the back plate, and matching the target and the back plate; putting the target and the back plate after being matched into a coil; applying current to the coil, carrying induction heating on the target and the back plate after being matched, and then welding the heated target and the heated back plate into a target component; and cooling the target component. In the welding method, fast heating can be carried out on the target and the back plate as well as the welding flux so as to finish the braze welding of the target and the back plate to form the target component, so that the production efficiency can be improved, and the large-batch production of the target component can be realized.
Description
Technical field
The present invention relates to field of semiconductor manufacture, the welding method of particularly a kind of target and backboard.
Background technology
In semi-conductor industry, target material assembly is to constitute by the target that meets sputtering performance with backboard that described target combined, had certain intensity.Backboard can be assembled in the sputter board at described target material assembly and play a supporting role, and has the effect of conduction heat.The normal aluminium target that uses carries out physical vaporous deposition (PVD) plated film to form the barrier layer in the large scale integrated circuit manufacturing, the aluminium target uses magnetron sputtering in sputter procedure, usually the high copper product of the higher and heat conduction of working strength, electric conductivity is as back veneer material, but aluminium target and back veneer material must be welded together and just can be processed into the employed target material assembly of semi-conductor industry, it both can be installed on the sputter board reliably, can under magnetic field, electric field action, effectively control again simultaneously and carry out sputter.
Method for welding is high-purity aluminum or aluminum alloy and copper or copper alloy welding method commonly used, its principle is the filling metal (being called solder or scolder) that utilizes fusing point lower than mother metal, after heat fused, utilize the wetting mother metal of liquid solder, fill the play movement and with mother metal counterdiffusion mutually, realize the welding method that connects.Fig. 1 to Fig. 3 is the soldering schematic diagram of target and backboard in the prior art.
Consult Fig. 1, be provided for constituting the workpiece of target material assembly, described workpiece comprises target 102 and backboard 101, described workpiece is placed on the heating plate 104 (target 102 and backboard 101 can be positioned over respectively and carries out preheating on the heating plate 104, also can with target 102 be positioned over after backboard 101 cooperates carry out preheating on the heating plate 104), after reaching uniform temperature, on the solder side of target 102 and backboard 101, add scolder 103.
Consult Fig. 2, treat 103 fusings of described scolder after, target 102 is cooperated with backboard 101, and under certain pressure, maintenance a period of time, target 102 and backboard 101 is welded together to form target material assembly.
Consult Fig. 3, the target material assembly of finishing welding after supercooling has been shown among Fig. 3, it comprises target 102 and backboard 101, and the scolder 103 ' after the thick lines among the figure are represented to melt welds target 102 and backboard 101.
But, adopt heating plate to come workpiece and scolder are heated the mode of carrying out soldering in the prior art usually, owing to make the programming rate of workpiece and scolder slower, be difficult to realize the production in enormous quantities of target material assembly as the heating plate of thermal source.
About the correlation technique of soldering, but application reference number is 200610146033.2 Chinese patent application, this patent disclosure a kind of method for welding that is applicable to the welding of large tracts of land dissimilar metal.
Summary of the invention
The problem to be solved in the present invention is that the soldering speed of target and backboard is slower in the prior art, thereby is difficult to realize large batch of production.
For addressing the above problem, the invention provides the welding method of a kind of target and backboard, comprising:
Target and backboard are provided;
Solder side at described target and backboard adds scolder, and described target is cooperated with described backboard;
Described target and backboard after cooperating are positioned in the coil;
Apply electric current to described coil, target after the described cooperation and backboard are carried out eddy-current heating, be welded into target material assembly;
Cool off described target material assembly.
Optionally, the welding method of described target and backboard also comprises: before adding scolder, the solder side of target and backboard is polished and cleaned.
Optionally, the time of described eddy-current heating is 5～20 minutes.
Optionally, the size of the electric current that applies to described coil is 100～2000A, and frequency is 100～250KHz.
Optionally, described target also comprises with the welding method of backboard: after the target after described cooperation the and backboard are carried out eddy-current heating, cool off described target material assembly before, described target and backboard are pressed.
Optionally, the described time that presses is 5～15 minutes, and described pressure is 0～1MPa to the pressure of the solder side generation of described target and backboard.
Optionally, the described target material assembly of described cooling is specially: feed cooling fluid described target material assembly is cooled off.
Optionally, the material of described target is an aluminum or aluminum alloy.
Optionally, the material of described backboard is copper, copper alloy, aluminium or aluminium alloy.
Optionally, the material of described scolder is a tin.
Compared with prior art, the present invention has the following advantages:
Mode by eddy-current heating is to target, backboard and scolder Fast Heating, and melting solder is finished the soldering of target and backboard, forms target material assembly, thereby can enhance productivity greatly, realizes the production in enormous quantities to described target material assembly.
Description of drawings
Fig. 1 to Fig. 3 is the soldering schematic diagram of target and backboard in the prior art;
Fig. 4 is the schematic flow sheet of the welding method of target provided by the invention and backboard;
Fig. 5 to Fig. 7 is the embodiment schematic diagram of the welding method of target provided by the invention and backboard.
The specific embodiment
For above-mentioned purpose of the present invention, feature and advantage can more be become apparent, the specific embodiment of the present invention is described in detail below in conjunction with accompanying drawing.
Set forth detail in the following description so that fully understand the present invention.But the present invention can be different from alternate manner described here and implements with multiple, and those skilled in the art can do similar popularization under the situation of intension of the present invention.Therefore the present invention is not subjected to the restriction of the following public specific embodiment.
As described in the background art, used in the prior artly workpiece (target and backboard) and scolder are heated the mode of finishing soldering with heating plate, since with heating plate as thermal source, the programming rate of workpiece and scolder is slower, thereby production efficiency is lower, is difficult to realize the production in enormous quantities of target material assembly.
For addressing the above problem, the invention provides the welding method of a kind of target and backboard.Fig. 4 is the schematic flow sheet of the welding method of target provided by the invention and backboard.Consult Fig. 4, the welding method of described target and backboard comprises:
Step S101 provides target and backboard;
Step S102 adds scolder at the solder side of described target and backboard, and described target is cooperated with described backboard;
Step S103 is positioned over described target and backboard after cooperating in the coil;
Step S104 applies electric current to described coil, and target after the described cooperation and backboard are carried out eddy-current heating, is welded into target material assembly;
Step S105 cools off described target material assembly.
With embodiment the welding method of above-mentioned target and backboard is elaborated below.Fig. 5 to Fig. 7 is the embodiment schematic diagram of the welding method of target provided by the invention and backboard.
In conjunction with Fig. 4 and Fig. 5, execution in step S101 provides target 202 and backboard 201.Particularly, the target 202 that provides, its shape is according to the actual requirement of applied environment, sputtering equipment, can be in circle, rectangle, annular, taper shape or other analogous shapes (comprising regular shape and irregularly shaped) any, its material can be metals such as aluminium, aluminium alloy, copper, copper alloy.In the present embodiment, the shape of described target 202 is preferably circle (Fig. 5 is a profile), and its material is preferably aluminum or aluminum alloy.And the shape of backboard 201 is determined by sputtering equipment, and material can be selected according to concrete needs, generally can adopt materials such as copper, copper alloy, aluminium or aluminium alloy, is preferably copper or copper alloy in the present embodiment.
Still consult Fig. 4 and Fig. 5, execution in step S102 adds scolder 203 at the solder side of described target 202 and backboard 201, and described target 202 is cooperated with described backboard 201.During concrete enforcement, can be earlier at the solder side interpolation scolder 203 of described backboard 201, described scolder 203 covers the surface of the solder side of described backboard 201, more described target 202 is cooperated with described backboard 201, and the solder side of described target 202 covers described scolder 203.In other embodiments, also can add scolder 203 or while at the solder side of described target 202 and add scolder 203 at the solder side of described target 202 and the solder side of backboard 201.In the present embodiment, the material of described scolder 203 is a tin.Need to prove, backboard 201 shown in Fig. 5 has the groove with the form fit of described target 202, can in described groove, add scolder 203, and then described target 202 cooperated with described backboard 201, can guarantee to be unlikely to overflow after scolder 203 fusings in the subsequent step solder side of described target 202 and backboard 201 so on the one hand, on the other hand, described target 202 and a kind of like this fit structure of described backboard 201 also can guarantee the quality of welding.In other embodiments, described backboard 201 also can not have described groove, and is the plane.
In addition, before execution in step S102, can also comprise the steps: before adding scolder 203, the solder side of target 202 and backboard 201 is polished and cleaned.Particularly, can polish to the solder side of described target 202 and backboard 201 with sand paper comprehensively, to remove its surperficial oxide layer, reduce the surface roughness of the solder side of described target 202 and backboard 201, make in the follow-up step and can obtain better welding effect.Then, with organic solvent the solder side after the polishing is cleaned, described organic solvent can be any in isobutanol (IBA), isopropyl alcohol (IPA) or the mixed propyl alcohol (IPB), is preferably IPA in the present embodiment.
In conjunction with Fig. 4 and Fig. 6, execution in step S103 is positioned over described target 202 and backboard 201 after cooperating in the coil 21.Particularly, provide an induction heating apparatus, described induction heating apparatus has the dress of receipts and is heated the heating clamber 22 that article are used, and described coil 21 is arranged among the described heating clamber 22, is used for vibration and produces the high frequency wave beam, and its number of turn is generally 5～50 circles.In addition, also be provided with in the described heating clamber 22 and be used for the cooling device 24 that after eddy-current heating finishes, cools off.Described induction heating apparatus also comprises high intensity light source, is specially a radio-frequency generator 23 in the present embodiment, and described radio-frequency generator 23 is connected with described coil 21, is used for providing high frequency electric to described coil 21.Induction heating apparatus adopts the above-mentioned form of the composition, does not need to implement numerous and diverse operation, and can heat to finish weld job surface and the internal implementation that is heated article in shorter time.
The principle of eddy-current heating is: the big current direction of high frequency is turned to the coil (normally making of copper tube) of ring-type or other shape, the strong flux of polarization instantaneous variation in coil thus, heating objects such as metal are placed in coil, flux will connect whole heating object, and the direction opposite with heating current in the inside of heating object just can produce corresponding very big vortex flow.Owing to exist resistance in the heating object,, the temperature of object self risen rapidly so can produce a lot of Joule heats.
During concrete enforcement, the coil 21 that the described target 202 after cooperating and backboard 201 are put into described induction heating apparatus, and place on the described cooling device 24.
Consult Fig. 4 and Fig. 6, Fig. 7, execution in step S104 applies electric current to described coil, and target after the described cooperation 202 and backboard 201 are carried out eddy-current heating, is welded into target material assembly.Particularly, start described radio-frequency generator 23, produce the big electric current (alternating current of high frequency, the frequency range of general high frequency is that 100KHz～500KHz) flow direction is turned to the coil 21 of ring-type, because the electric current that changes produces high-intensity magnetic field, flux connects whole target 202, backboard 201 and scolder 203, produces the direction strong vortex flow opposite with heating current in metal inside such as described target 202, backboard 201 and scolders 203.Because there is resistance in described target 202 with backboard 201, produce Joule heat thus, make described target 202 to be brazed, backboard 201 and scolder 203 temperature reach 250～300 degree, because the fusing point of described scolder 203 is much lower with respect to target 202, backboard 201, wetting described target 202 of scolder 203 ' after the fusing (representing with thick lines among Fig. 7) and backboard 201, fill both play movements, described target 202 is welded together to form target material assembly with backboard 201.In the present embodiment, during eddy-current heating, described radio-frequency generator is 100～2000A to the size of current of the alternating current that described coil 21 applies, and its frequency is 100～250KHz, and the time of described eddy-current heating is 5～20 minutes.Hence one can see that, adopts the mode of eddy-current heating among the present invention, can finish the welding of target and backboard fast, thereby can enhance productivity greatly, realizes the production in enormous quantities to described target material assembly.
In step S104, can also comprise: after the target after the described cooperation 202 and backboard 201 are carried out eddy-current heating, cool off described target material assembly before, described target 202 and backboard 201 are pressed.Preferably, the described time that presses is 5～15 minutes, and described pressure is 0～1Mpa (greater than 0 and smaller or equal to 1Mpa) to the pressure of the solder side generation of described target 202 and backboard 201.During concrete enforcement, can be by pressue device (representing pressure with arrow among Fig. 6) be set in described induction heating apparatus, it for example is a pneumatic shuttle, and can press to described target 202 and backboard 201 equilibriums by a cushion block, the solder side of described target 202 and backboard 201 is produced greater than 0 and smaller or equal to the pressure of 1Mpa, and keep to obtain better welding effect like this about 10 minutes.
In conjunction with Fig. 4 and Fig. 7, execution in step S105 cools off described target material assembly.Preferably, the described target material assembly of described cooling specifically adopts the feeding cooling fluid that described target material assembly is cooled off.In the present embodiment, described cooling device 24 is the metal or metal alloy flat board, is provided with the pipeline that the dress cooling fluid is used in the described metal or metal alloy flat board, and described cooling fluid is recirculated cooling water in the present embodiment.(not shown coil shown in Figure 6 21 and radio-frequency generator 23 among Fig. 7) as shown in Figure 7, described cooling device 24 comprises the water inlet 24a and the delivery port 24b of recirculated cooling water.During concrete enforcement, among the step S104 to described target 202 and backboard 201 back (still being in the state that keep-ups pressure) that presses, can start the cooling water circulation in the described cooling device 24, that is: cold water feeds from water inlet 24a, enter the cooling device 24 of heat, after the week of circulating, the hot water of taking away heat flows out from delivery port 24b, so circulation is cooled off target 202 and backboard 201.In other embodiments, also can take other types of cooling, for example place air cooling, cool off with winding-up cold wind etc.After finishing cooling, promptly realize the whole welding process of described target 202 and backboard 201.
In the foregoing description, described induction heating apparatus is except having coil, radio-frequency generator, also be integrated with pressue device, cooling device, in other embodiments, induction heating apparatus also can only comprise coil and radio-frequency generator, after finishing eddy-current heating, target and backboard after will cooperating place specific pressue device to press again, and place specific cooling device to cool off then.Therefore, the welding method of target provided by the invention and backboard is not limited to implement with the induction heating apparatus described in the present embodiment.
To sum up, the target that the embodiment of the invention provides and the welding method of backboard have following beneficial effect at least:
Mode by eddy-current heating is to target, backboard and scolder Fast Heating, and melting solder is finished the soldering of target and backboard, forms target material assembly, thereby can enhance productivity greatly, realizes the production in enormous quantities to described target material assembly.
Though the present invention with preferred embodiment openly as above; but it is not to be used for limiting the present invention; any those skilled in the art without departing from the spirit and scope of the present invention; can utilize the method and the technology contents of above-mentioned announcement that technical solution of the present invention is made possible change and modification; therefore; every content that does not break away from technical solution of the present invention; to any simple modification, equivalent variations and modification that above embodiment did, all belong to the protection domain of technical solution of the present invention according to technical spirit of the present invention.
Claims (10)
1. the welding method of target and backboard is characterized in that, comprising:
Target and backboard are provided;
Solder side at described target and backboard adds scolder, and described target is cooperated with described backboard;
Described target and backboard after cooperating are positioned in the coil;
Apply electric current to described coil, target after the described cooperation and backboard are carried out eddy-current heating, be welded into target material assembly;
Cool off described target material assembly.
2. the welding method of target according to claim 1 and backboard is characterized in that, also comprises: before adding scolder, the solder side of target and backboard is polished and cleaned.
3. the welding method of target according to claim 1 and backboard is characterized in that, the time of described eddy-current heating is 5～20 minutes.
4. the welding method of target according to claim 1 and backboard is characterized in that, the size of the electric current that applies to described coil is 100～2000A, and frequency is 100～250KHz.
5. the welding method of target according to claim 1 and backboard is characterized in that, also comprises: after the target after the described cooperation and backboard are carried out eddy-current heating, cool off described target material assembly before, described target and backboard are pressed.
6. the welding method of target according to claim 5 and backboard is characterized in that, the described time that presses is 5～15 minutes, and described pressure is 0～1MPa to the pressure of the solder side generation of described target and backboard.
7. the welding method of target according to claim 1 and backboard is characterized in that, the described target material assembly of described cooling is specially: feed cooling fluid described target material assembly is cooled off.
8. the welding method of target according to claim 1 and backboard is characterized in that, the material of described target is an aluminum or aluminum alloy.
9. the welding method of target according to claim 1 and backboard is characterized in that, the material of described backboard is copper, copper alloy, aluminium or aluminium alloy.
10. the welding method of target according to claim 1 and backboard is characterized in that, the material of described scolder is a tin.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100292010A CN102133669A (en) | 2011-01-26 | 2011-01-26 | Welding method for target and back plate |
| PCT/CN2011/074754 WO2012100476A1 (en) | 2011-01-26 | 2011-05-27 | Method for soldering target and back plate |
| KR1020137020388A KR20130110215A (en) | 2011-01-26 | 2011-05-27 | Method for soldering target and back plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100292010A CN102133669A (en) | 2011-01-26 | 2011-01-26 | Welding method for target and back plate |
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| Publication Number | Publication Date |
|---|---|
| CN102133669A true CN102133669A (en) | 2011-07-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011100292010A Pending CN102133669A (en) | 2011-01-26 | 2011-01-26 | Welding method for target and back plate |
Country Status (3)
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|---|---|
| KR (1) | KR20130110215A (en) |
| CN (1) | CN102133669A (en) |
| WO (1) | WO2012100476A1 (en) |
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| CN103692041A (en) * | 2012-09-28 | 2014-04-02 | 宁波江丰电子材料有限公司 | Brazing method for silicon target component |
| CN104588810A (en) * | 2013-10-30 | 2015-05-06 | 宁波江丰电子材料股份有限公司 | Welding method of aluminum target assembly |
| CN106541220A (en) * | 2015-09-23 | 2017-03-29 | 住华科技股份有限公司 | Solder, sputtering target and method for manufacturing sputtering target |
| CN106891070A (en) * | 2017-02-23 | 2017-06-27 | 深圳市科达利实业股份有限公司 | A kind of copper-aluminum composite board, pole connecting board structure and battery |
| CN108070834A (en) * | 2016-11-18 | 2018-05-25 | 宁波江丰电子材料股份有限公司 | Backboard and forming method thereof |
| CN108350566A (en) * | 2016-07-13 | 2018-07-31 | 住友化学株式会社 | The manufacturing method and sputtering target of sputtering target |
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| CN109382559A (en) * | 2017-08-09 | 2019-02-26 | 宁波江丰电子材料股份有限公司 | Backboard manufacturing method and backboard |
| CN109590560A (en) * | 2018-12-13 | 2019-04-09 | 有研亿金新材料有限公司 | A kind of large area Ferromagnetic target welding method and device |
| CN110270732A (en) * | 2018-03-16 | 2019-09-24 | 合肥江丰电子材料有限公司 | Target welder, lifting jig and target material welding method |
| CN110484876A (en) * | 2019-08-21 | 2019-11-22 | 东莞市欧莱溅射靶材有限公司 | A kind of flattening method of flat target |
| CN110666281A (en) * | 2019-11-01 | 2020-01-10 | 宁波江丰电子材料股份有限公司 | Brazing welding method for aluminum target and copper-containing back plate |
| CN111515484A (en) * | 2020-05-11 | 2020-08-11 | 宁波江丰电子材料股份有限公司 | Welding method of high-purity aluminum target |
| CN113210785A (en) * | 2021-06-02 | 2021-08-06 | 宁波江丰电子材料股份有限公司 | Brazing method of aluminum-scandium alloy target |
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| CN104588810A (en) * | 2013-10-30 | 2015-05-06 | 宁波江丰电子材料股份有限公司 | Welding method of aluminum target assembly |
| CN106541220A (en) * | 2015-09-23 | 2017-03-29 | 住华科技股份有限公司 | Solder, sputtering target and method for manufacturing sputtering target |
| CN108350566A (en) * | 2016-07-13 | 2018-07-31 | 住友化学株式会社 | The manufacturing method and sputtering target of sputtering target |
| CN108350566B (en) * | 2016-07-13 | 2019-08-23 | 住友化学株式会社 | The manufacturing method and sputtering target of sputtering target |
| CN108070834B (en) * | 2016-11-18 | 2020-02-04 | 宁波江丰电子材料股份有限公司 | Back plate and forming method thereof |
| CN108070834A (en) * | 2016-11-18 | 2018-05-25 | 宁波江丰电子材料股份有限公司 | Backboard and forming method thereof |
| CN106891070A (en) * | 2017-02-23 | 2017-06-27 | 深圳市科达利实业股份有限公司 | A kind of copper-aluminum composite board, pole connecting board structure and battery |
| CN106891070B (en) * | 2017-02-23 | 2023-11-07 | 深圳市科达利实业股份有限公司 | Copper-aluminum composite board, pole connecting plate structure and battery |
| CN109382559A (en) * | 2017-08-09 | 2019-02-26 | 宁波江丰电子材料股份有限公司 | Backboard manufacturing method and backboard |
| CN109382559B (en) * | 2017-08-09 | 2021-02-23 | 宁波江丰电子材料股份有限公司 | Backboard manufacturing method and backboard |
| CN110270732A (en) * | 2018-03-16 | 2019-09-24 | 合肥江丰电子材料有限公司 | Target welder, lifting jig and target material welding method |
| CN109262255A (en) * | 2018-09-19 | 2019-01-25 | 芜湖市星东塑胶模具制品有限公司 | A kind of air-suction silencer of compressor assembly device |
| CN109590560B (en) * | 2018-12-13 | 2020-11-27 | 有研亿金新材料有限公司 | Large-area ferromagnetic target welding method and device |
| CN109590560A (en) * | 2018-12-13 | 2019-04-09 | 有研亿金新材料有限公司 | A kind of large area Ferromagnetic target welding method and device |
| CN110484876A (en) * | 2019-08-21 | 2019-11-22 | 东莞市欧莱溅射靶材有限公司 | A kind of flattening method of flat target |
| CN110666281A (en) * | 2019-11-01 | 2020-01-10 | 宁波江丰电子材料股份有限公司 | Brazing welding method for aluminum target and copper-containing back plate |
| CN110666281B (en) * | 2019-11-01 | 2021-07-23 | 宁波江丰电子材料股份有限公司 | Brazing welding method for aluminum target and copper-containing back plate |
| CN111515484A (en) * | 2020-05-11 | 2020-08-11 | 宁波江丰电子材料股份有限公司 | Welding method of high-purity aluminum target |
| CN111515484B (en) * | 2020-05-11 | 2022-04-15 | 宁波江丰电子材料股份有限公司 | Welding method of high-purity aluminum target |
| CN113210785A (en) * | 2021-06-02 | 2021-08-06 | 宁波江丰电子材料股份有限公司 | Brazing method of aluminum-scandium alloy target |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130110215A (en) | 2013-10-08 |
| WO2012100476A1 (en) | 2012-08-02 |
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Address after: 315400 Ningbo City, Yuyao Province Economic Development Zone, state science and Technology Industrial Park Road, No. 198, No. Applicant after: NINGBO JIANGFENG ELECTRONIC MATERIAL CO., LTD. Address before: 315400 Ningbo City, Yuyao Province Economic Development Zone, state science and Technology Industrial Park Road, No. 198, No. Applicant before: Ningbo Jiangfeng Electronic Materials Co., Ltd. |
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