CN201979187U - Fast induction soldering device for soldering target and back plate - Google Patents
Fast induction soldering device for soldering target and back plate Download PDFInfo
- Publication number
- CN201979187U CN201979187U CN201120025792XU CN201120025792U CN201979187U CN 201979187 U CN201979187 U CN 201979187U CN 201120025792X U CN201120025792X U CN 201120025792XU CN 201120025792 U CN201120025792 U CN 201120025792U CN 201979187 U CN201979187 U CN 201979187U
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- China
- Prior art keywords
- backboard
- target
- induction coil
- brazed
- quick
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 230000006698 induction Effects 0.000 title claims abstract description 70
- 238000005476 soldering Methods 0.000 title abstract description 8
- 238000001816 cooling Methods 0.000 claims abstract description 20
- 230000005672 electromagnetic field Effects 0.000 claims abstract description 7
- 238000005219 brazing Methods 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- 238000003466 welding Methods 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 10
- 229910000838 Al alloy Inorganic materials 0.000 claims description 8
- 239000012809 cooling fluid Substances 0.000 claims description 5
- 239000000155 melt Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 abstract description 14
- 229910000679 solder Inorganic materials 0.000 abstract description 14
- 230000000694 effects Effects 0.000 abstract description 5
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 239000013077 target material Substances 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000005477 sputtering target Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- General Induction Heating (AREA)
Abstract
A fast induction soldering device for soldering a target and a back plate comprises an induction coil, a cooling device and a high-frequency power source device; the induction coil is used for generating an alternating electromagnetic field and heating a target and a back plate, which are to be soldered, as well as solder between the target and the back plate, and is provided with two connectors; the cooling device is used for cooling the solder between the target and the back plate after the solder is melted and is positioned under the target and the back plate, which are to be soldered; and the high-frequency power source device is used for providing high-frequency current to the induction coil and is provided with two connectors which are electrically connected with the two connectors of the induction coil through lead wires respectively. According to the utility model, the high-frequency AC induction coil is adopted, and strong variation of the electromagnetic field is produced through the variation of high-frequency current, so that the target, the back plate and the solder between the target and the back plate generate large eddy current so as to be heated to reach the melting point of the solder. By adopting the technical scheme of the utility model, mass soldering can be performed, and meanwhile, the soldering effect is good, and power is saved.
Description
Technical field
The utility model relates to a kind of brazing device, relates in particular to a kind of quick induction brazing device that welds target and backboard.
Background technology
In large scale integrated circuit is made, generally on silicon chip, form the layer of metal film by physical vapour deposition (PVD) sputtering target material method.Target in sputter procedure usually and backboard weld formation sputtering target material assembly by scolder.Described backboard plays the effect of supporting and conducting heat in described target material assembly assembling and sputter procedure.
Method for welding is a target and backboard welding method commonly used, and its principle is that workpiece is placed on the heated plate, reach uniform temperature after, scolder is placed in the middle of target and the backboard, treat that scolder melts after, under certain pressure, keep a period of time, both are welded together.
Many materials can be used for making target, and more representational rafifinal and the aluminium alloy of being to use, described rafifinal are the aluminium of at least 99.99% (4N) purity, and preferred at least 99.9999% (5N) purity, and percentage is atomic percentage.And in for example using magnetically controlled sputter method sputter rafifinal and aluminium alloy target process, described target needs working strength is higher and thermal conductivity is high, electric conductivity is high copper or copper alloy as back veneer material, and described rafifinal and aluminum alloy materials and back veneer material welded together just can be processed into the required target material assembly of semiconductor integrated circuit.
Present domestic raffinal and aluminium alloy and copper or copper alloy soldering, thermal source adopts heating plate, for example, just announced a kind of such mode of heating in the Chinese patent literature of publication number CN1986133A, but, adopt the welding manner of this kind heating plate, the slow and power consumption of programming rate is difficult to realize producing in enormous quantities.
Therefore aspect industrial-scale production, need a kind of new replacement device of utilizing heating plate to provide thermal source to weld of exploitation, to reach the purpose of simple fast heating welding material.
The utility model content
The problem that the utility model solves provides a kind of new brazing device, to reach the purpose of Fast Heating welding material.
For addressing the above problem, the utility model provides a kind of quick induction brazing device that welds target and backboard, comprise: induction coil, be used to produce alternating electromagnetic field, described induction coil is in order to heat target to be brazed, scolder between backboard and target and the backboard, described induction coil is provided with two joints; Cooling device is used for after scolder melts the scolder between described target and the described backboard being cooled off, and described cooling device is positioned under described target to be brazed and the described backboard; High intensity light source is used for providing high frequency electric to described induction coil, and described high intensity light source is provided with two joints, and described two joints are electrically connected respectively by lead-in wire with described induction coil two joints.
Alternatively, also comprise pressue device, be used for exerting pressure that so that described target combines with described backboard is close, described pressue device is positioned on described target to be brazed and the described backboard to target to be brazed.
Alternatively, described pressue device is a pneumatic shuttle.
Alternatively, between described target and the pressue device cushion block is set, described cushion block is applied to pressure on target and the backboard in order to balanced pressue device.
Alternatively, described cooling device is the metal or metal alloy flat board, is provided with dress cooling fluid pipeline in the described metal or metal alloy flat board.
Alternatively, at least one circle of described induction coil.
Alternatively, described target and backboard are rafifinal and aluminium alloy target copper backboard, and described induction coil is the series connection of 5 to 50 circles.
Alternatively, described induction coil shape is consistent with described target to be brazed and backboard shape, and the in-plane size is not less than described target to be brazed and backboard size.
Alternatively, described target and backboard are circular, and described induction coil is an annular.
Alternatively, described cooling device, described target to be brazed and backboard and described induction coil, parallel in twos.
Compared with prior art, the utlity model has following advantage: by adopting the high-frequency ac induction coil, utilize high frequency electric to change and produce the strong-electromagnetic field variation, thereby make the scolder between target, backboard and target and the backboard be heated because of high-intensity magnetic field changes the huge eddy current of generation, reach the scolder fusing point, make described solder fusing, adopt the technical solution of the utility model, can weld the better and power saving of welding effect simultaneously in enormous quantities.
Description of drawings
Fig. 1 is the quick induction brazing principle of device of a utility model schematic diagram;
Fig. 2 is the utility model circular rafifinal target copper backboard brazing process apparatus structure schematic diagram to be brazed.
The specific embodiment
The utility model is by adopting the high-frequency ac induction coil, utilize high frequency electric to change and produce the strong-electromagnetic field variation, thereby make the scolder between target and the backboard be heated because of high-intensity magnetic field changes the huge eddy current of generation, reach the scolder fusing point, make described solder fusing, adopt technical scheme of the present invention, can weld in enormous quantities, especially for high-purity aluminum or aluminum alloy and copper or copper alloy backing plate, welding effect better and power saving simultaneously.
Below by accompanying drawing specific embodiment of the utility model is done more specifically explanation.
Fig. 1 provides the quick induction brazing principle of device of the utility model schematic diagram, specifically comprises:
High frequency electric coil 12 is used to produce alternating electromagnetic field, is placed with conductor 13 in the described high frequency electric coil 12, and described high frequency electric coil 12 has two lead-in wires 121 and 122;
Radio-frequency generator 11 is used for applying current signal to two lead-in wires 121 and 122 of high frequency electric coil 12.
Above-mentioned high-frequency induction heating is a kind of noncontact heating means, principle is as follows: when placing conductor 13 in the coil 12 that is being connected with high frequency electric, this conductor generates heat because of electromagnetic induction phenomenon, when target and backboard are described conductor, can generate heat reaches the scolder fusing point, thereby described solder fusing plays the welding effect.
Based on above-mentioned principle, the present utility model people has proposed a kind of novel welding target and the quick induction brazing device of backboard, comprising:
Induction coil is used to produce alternating electromagnetic field, and described induction coil is in order to heating target to be brazed, the scolder between backboard and target and the backboard, and described induction coil is provided with two joints;
Cooling device is used for after scolder melts the scolder between described target and the described backboard being cooled off, and described cooling device is positioned under described target to be brazed and the described backboard;
High intensity light source is used for providing high frequency electric to described induction coil, and described high intensity light source is provided with two joints, and described two joints are electrically connected respectively by lead-in wire with described induction coil two joints.
Further optimally, also comprise pressue device, be used for exerting pressure that so that described target combines with described backboard is close, described pressue device is positioned on described target to be brazed and the described backboard to target to be brazed.
Further optimally, described pressue device is a pneumatic shuttle.
Further optimally, between described target and the pressue device cushion block is set, described cushion block is applied to pressure on target and the backboard in order to balanced pressue device.
Further optimally, described cooling device is the metal or metal alloy flat board, is provided with dress cooling fluid pipeline in the described metal or metal alloy flat board.
Further optimally, at least one circle of described induction coil.
Further optimally, described target and backboard are rafifinal and aluminium alloy target copper backboard, and described induction coil is the series connection of 5 to 50 circles.
Further optimally, described induction coil shape is consistent with described target to be brazed and backboard shape, and the in-plane size is not less than described target to be brazed and backboard size.
Further optimally, described target and backboard are circular, and described induction coil is an annular.
Further optimally, described cooling device, described target to be brazed and backboard and described induction coil, parallel in twos.
With circular rafifinal target, circular copper backboard tin solder is example, and Fig. 2 concisely shows the structure of quick induction brazing device, comprising:
Cooling device is used for after scolder melts the tin solder 232 between described rafifinal target 231 and the described copper backboard 233 being cooled off, and described cooling device is positioned at described rafifinal target to be brazed 231 and described copper backboard 233 times;
High intensity light source, be specially radio-frequency generator 22, described radio-frequency generator 22 is used for providing high frequency electric to described induction coil, and described radio-frequency generator 22 is provided with two joint (not shown)s, and 211 liang of joints of described two joints and described induction coil are electrically connected respectively by lead-in wire.
Described quick induction brazing device can be provided with heating clamber shell 21, in order to induction coil is carried out electromagnetic shielding; Described induction coil 211 and cooling device are arranged in the described heating clamber, and described radio-frequency generator 22 is arranged on outside the heating clamber shell 21.
Further optimally, also comprise pressue device, described pressue device is used for exerting pressure to rafifinal target 231 to be brazed, so that rafifinal target 231 combines closely with described copper backboard 233.
Further optimally, described pressue device is a pneumatic shuttle 213, and pressure is no more than 1Mpa.
Further optimally, be provided with cushion block 214 between described target 231 and the pneumatic shuttle 213, described cushion block 214 is applied to pressure on the rafifinal target copper backboard in order to balanced pressue device.
Further optimally, described cooling device is a metal or metal alloy flat board 212, is provided with in the described metal or metal alloy flat board to be used to adorn the pipeline that cooling fluid is used, and further optimally, described cooling fluid is a recirculated water.
Further optimally, at least one circle of described induction coil.Further optimize, described induction coil is the series connection of 25 circles.
Further optimally, described induction coil is an annular, described target to be brazed of the monolateral distance of in-plane and backboard 10-20 millimeter.
Further optimally, described metal or metal alloy flat board 212, described target 231 to be brazed and backboard 233 and described induction coil 211, parallel in twos.
Further optimally, wrap up nonmagnetic metal housing (not shown) around the described lead-in wire 215 and 216.
Further optimally, between described two lead-in wires insulation exotic material and housing are set and separate (not shown).
The method of carrying out soldering for above-mentioned circular rafifinal target, circular copper backboard tin solder specifically comprises: during work, spread one deck tin solders 232 in the middle of circular rafifinal target 231 to be brazed and the circular copper backboard 233 below; Start radio-frequency generator 22, the ring-type heater coil 211 that the big current direction of high frequency is turned to, because the electric current that changes produces high-intensity magnetic field, flux connects whole rafifinal target and copper backboard, produces the direction strong vortex flow opposite with heating current at described rafifinal target with copper backboard metal inside.Because there are resistance in described rafifinal and copper metal, produce Joule heat thus, make assembly temperature to be brazed reach the 250-300 degree, described solder fusing is simultaneously at pneumatic shuttle, under the pressure of 0.5MPa, by cushion block 214 counterpressures, kept 30 seconds, together two kinds of metal solder.The nonmagnetic metal housing of parcel prevents the leakage field that leaks electricity in the induction coil galvanization around the described lead-in wire.In the service life of the insulation high-temperature material extension coil that is provided with between described two lead-in wires, prevent short circuit.
After brazing process finishes, start water circulation in the metal or metal alloy dull and stereotyped 212, cold water enters the cooling flat board of heat from water inlet 2121, circulate a week, the hot water of taking away heat flows out from delivery port 2122, and so circulation is cooled off rafifinal target and copper backboard.
The above only is preferred embodiment of the present utility model, is not the utility model is done any pro forma restriction.Any those of ordinary skill in the art, do not breaking away under the technical solutions of the utility model scope situation, all can utilize the technology contents of above-mentioned announcement that technical solutions of the utility model are made many possible changes and modification, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not break away from technical solutions of the utility model, all still belongs in the scope of technical solutions of the utility model protection any simple modification, equivalent variations and modification that above embodiment did according to technical spirit of the present utility model.
Claims (10)
1. a quick induction brazing device that welds target and backboard is characterized in that, comprising:
Induction coil is used to produce alternating electromagnetic field, and described induction coil is in order to heat the scolder between target to be brazed, backboard and target and the backboard, and described induction coil is provided with two joints;
Cooling device is used for after scolder melts the scolder between described target and the described backboard being cooled off, and described cooling device is positioned under described target to be brazed and the described backboard;
High intensity light source is used for providing high frequency electric to described induction coil, and described high intensity light source is provided with two joints, and described two joints are electrically connected respectively by lead-in wire with described induction coil two joints.
2. the quick induction brazing device of welding target according to claim 1 and backboard, it is characterized in that, also comprise pressue device, be used for exerting pressure to target to be brazed, so that described target combines with described backboard is close, described pressue device is positioned on described target to be brazed and the described backboard.
3. the quick induction brazing device of welding target according to claim 2 and backboard is characterized in that described pressue device is a pneumatic shuttle.
4. the quick induction brazing device of welding target according to claim 2 and backboard is characterized in that, between described target and the pressue device cushion block is set, and described cushion block is applied to pressure on target and the backboard in order to balanced pressue device.
5. the quick induction brazing device of welding target according to claim 1 and backboard is characterized in that described cooling device is the metal or metal alloy flat board, is provided with dress cooling fluid pipeline in the described metal or metal alloy flat board.
6. the quick induction brazing device of welding target according to claim 1 and backboard is characterized in that, at least one circle of described induction coil.
7. the quick induction brazing device of welding target according to claim 6 and backboard is characterized in that, described target and backboard are rafifinal and aluminium alloy target copper backboard, and described induction coil is the series connection of 5 to 50 circles.
8. the quick induction brazing device of welding target according to claim 1 and backboard is characterized in that described induction coil shape is consistent with described target to be brazed and backboard shape, and the in-plane size is not less than described target to be brazed and backboard size.
9. the quick induction brazing device of welding target according to claim 1 and backboard is characterized in that, described target and backboard are circular, and described induction coil is an annular.
10. the quick induction brazing device of welding target according to claim 1 and backboard is characterized in that, described cooling device, and described target to be brazed and backboard and described induction coil, parallel in twos.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120025792XU CN201979187U (en) | 2011-01-26 | 2011-01-26 | Fast induction soldering device for soldering target and back plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120025792XU CN201979187U (en) | 2011-01-26 | 2011-01-26 | Fast induction soldering device for soldering target and back plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201979187U true CN201979187U (en) | 2011-09-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120025792XU Expired - Lifetime CN201979187U (en) | 2011-01-26 | 2011-01-26 | Fast induction soldering device for soldering target and back plate |
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| Country | Link |
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| CN (1) | CN201979187U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012100476A1 (en) * | 2011-01-26 | 2012-08-02 | 宁波江丰电子材料有限公司 | Method for soldering target and back plate |
| CN103192152A (en) * | 2012-01-09 | 2013-07-10 | 日立金属株式会社 | Bonding apparatus |
-
2011
- 2011-01-26 CN CN201120025792XU patent/CN201979187U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012100476A1 (en) * | 2011-01-26 | 2012-08-02 | 宁波江丰电子材料有限公司 | Method for soldering target and back plate |
| CN103192152A (en) * | 2012-01-09 | 2013-07-10 | 日立金属株式会社 | Bonding apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 315400 Ningbo City, Yuyao Province Economic Development Zone, state science and Technology Industrial Park Road, No. 198, No. Patentee after: NINGBO JIANGFENG ELECTRONIC MATERIAL CO., LTD. Address before: 315400 Ningbo City, Yuyao Province Economic Development Zone, state science and Technology Industrial Park Road, No. 198, No. Patentee before: Ningbo Jiangfeng Electronic Materials Co., Ltd. |
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| CX01 | Expiry of patent term |
Granted publication date: 20110921 |
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| CX01 | Expiry of patent term |