CN1946269A - Soldering apparatus - Google Patents
Soldering apparatus Download PDFInfo
- Publication number
- CN1946269A CN1946269A CN 200610159583 CN200610159583A CN1946269A CN 1946269 A CN1946269 A CN 1946269A CN 200610159583 CN200610159583 CN 200610159583 CN 200610159583 A CN200610159583 A CN 200610159583A CN 1946269 A CN1946269 A CN 1946269A
- Authority
- CN
- China
- Prior art keywords
- soft solder
- soft
- solder
- straight tube
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
An R-ALIP type electromagnetic pump having an inner core, a linear pipe, and a combination of an outer core (301 a) and coils (301 b) provided around the linear pipe (302) is disposed outside a solder vessel (101) containing a molten solder (100). The solder vessel (101) has a bottom wall (101 a) made of an iron having at least 100 times as high a magnetic permeability as that of the molten solder (100) and having a magnetic permeability not less than that of the inner core (303) and a wall thickness not less than that of the inner core (303) so that a magnetic field from the R-ALIP type electromagnetic pump (300) cannot leak into the solder. Therefore, a stray current derived from an alternating magnetic field can be prevented from spreading in the molten solder.
Description
Technical field
The present invention relates to be used on printed circuit board, to carry out the soft soldering apparatus that the solder of electronic component is installed.
Background technology
Produce thrust as making electromagnetic force directly act on the medium that should supply with and with it as the expulsion force of pump and the electromagnetic pump of inhalation power (LEP:linear electromagneticpump), be divided into induction type (induction type) and conduction type (conduction type) substantially.In general, use the example of the induction type electromagnetic pump that need not the corresponding medium energising of supplying with comparatively common.
In this induction type electromagnetic pump, flatlinear induction pump) and annular linear response type (ALIP type: annular linearinduction pump) roughly be divided into planar linear induction type (FLIP type:, and (the HIP type: helical inductionpump), they have intrinsic separately structure respectively to also have the spiral induction type.
As the technology of the soft soldering apparatus that uses ALIP type electromagnetic pump, the technology of No. the 6726082nd, United States Patent (USP) is arranged.This technology has such feature, that is, can make ALIP type electromagnetic pump from starting in flow of molten solder/turning round, and does not have energy loss, and then can eliminate infringement to electronic component or the like.
Especially at following parts, need to consider carrying out not bringing infringement or stress when solder is installed, described parts, good on the means this point of utilizing flow of molten solder as the leakage field decay that makes electromagnetic pump, and can move by small electric power or low-voltage because of leakage field.
As the example of ALIP type electromagnetic pump, Japanese publication JP-A-H05-260719 is arranged.
Use the soft soldering apparatus of induction type electromagnetic pump that following feature is arranged: the jet flow state that can stably keep flow of molten solder, and, the reproducibility and the stability of the parameter of supply flow of molten solder are extremely good, install no matter can both carry out the solder of equal conditions when, obtain stable solder quality.
Yet, in the technology of above-mentioned United States Patent (USP), because ALIP type electromagnetic pump is arranged in the soft solder, so when the maintenance of carrying out this electromagnetic pump or changing, existence must be put forward the problem of electromagnetic pump under the state of soft solder fusion.
Thereby as Japanese publication JP-A-2005-205479 was disclosed, consideration was arranged on this ALIP type electromagnetic pump in the cell wall outside of soft solder groove.Thus, flow of molten solder is drawn into the stream in the cell wall outside that is arranged in the soft solder groove, afterwards, the flow of molten solder of discharging is supplied in the soft solder groove, by such structure, easily the ALIP type electromagnetic pump that is positioned at the soft solder groove outside is safeguarded or changed.
In the technology of above-mentioned United States Patent (USP), utilized flow of molten solder in order to make leakage field decay, that is, make flow of molten solder play the effect of short-circuited conducting sleeve (short circuit band), so, exist electric current that the situation of leakage takes place in the fusion slicken solder.Progress rapidly along with as the semi-conductive microfabricationization of electronic component also needs further to reduce this leakage current.
In addition, in the technology of Japanese publication JP-A-2005-205479, the mechanism that the leakage field that is created in around the electromagnetic pump is blocked or collects is not set, exist printed circuit board with and the electronic component that carried be exposed to problem in this leakage field.Be known that this leakage field is created in the place, end of the outlet or the suction inlet of formation electromagnetic pump more.
Summary of the invention
The present invention makes in order to address the above problem, purpose is to provide following proposal, that is,, and can carry out the installation of electronic component with higher reliability by the soft soldering apparatus of realizing having improved maintainability as described above and further having reduced leakage field or stray electrical current.
First execution mode of the present invention provides a kind of soft soldering apparatus of printed circuit board, and this device comprises:
The soft solder groove is taken in flow of molten solder, possesses the diapire that is provided with the hole;
Nozzle is mounted in the soft solder groove and an end has first opening and the other end has the nozzle of second opening, and this first opening is arranged in the liquid level top of the flow of molten solder that is accommodated in the soft solder groove;
And electromagnetic pump;
This electromagnetic pump is the combination of straight tube, inner core body, coil and outside core body,
Described straight tube, the openend that has the end of sealing and be positioned at its opposition side and link with described hole, the flow of molten solder of soft solder groove can flow in this straight tube,
Described inner core body is the inner core body of tubular that forms the soft solder return path in inside, is configured in this straight tube, between forms the soft solder stream of ring-type, and, have the upper opening that links with second opening of this nozzle and with the opposed lower openings of the closed end of this straight tube
Described coil and described outside core body dispose in the mode of surrounding this straight tube, can be encouraged with electric means,
When this coil is energized, in the soft solder stream, form moving field, its result, flow of molten solder flows downwards along this soft solder stream, flow upward along return path then,, above first opening, form the soft solder ripple from the first opening jet flow of this nozzle;
This diapire be that the iron more than 100 times of flow of molten solder constitutes by permeability, and its permeability is more than the permeability of this inside core body, and its thickness is more than the thickness of this inside core body.
Second execution mode of the present invention provides a kind of soft soldering apparatus of printed circuit board, and this device comprises:
The soft solder groove is taken in flow of molten solder, possesses the diapire that is provided with the hole;
Nozzle is mounted in the soft solder groove and an end has first opening and the other end has the nozzle of second opening, and this first opening is arranged in the liquid level top of the flow of molten solder that is accommodated in the soft solder groove;
And electromagnetic pump;
This electromagnetic pump is the combination of straight tube, inner core body, coil and outside core body,
Described straight tube, the openend that has the end of sealing and be positioned at its opposition side and link with described hole, the flow of molten solder of soft solder groove can flow in this straight tube,
Described inner core body is the inner core body of tubular that forms the soft solder return path in inside, is configured in this straight tube, between forms the soft solder stream of ring-type, and, have the upper opening that links with second opening of this nozzle and with the opposed lower openings of the closed end of this straight tube
Described coil and described outside core body dispose in the mode of surrounding this straight tube, can be encouraged with electric means,
When this coil is energized, in the soft solder stream, form moving field, its result, flow of molten solder flows downwards along this soft solder stream, flow upward along return path then,, above first opening, form the soft solder ripple from the first opening jet flow of this nozzle;
This soft soldering apparatus also has heater and controlling organization, and described heater heats the soft solder in the above-mentioned soft solder groove, and described controlling organization control is supplied with the electric power of the coil of above-mentioned heater and above-mentioned electromagnetic pump;
Described controlling organization, soft solder in making described soft solder groove from the state that solidifies when the state-transition of fusion, the electric power of the described heater fed of subtend and control to the electric power that the coil of described electromagnetic pump is supplied with, before making that the fusion of the soft solder in straight tube begins, the fusion of the soft solder in the described soft solder groove begins, and, when the fusion of the soft solder in straight tube is finished, perhaps before it was finished, the fusion of the soft solder in the described soft solder groove was finished.
The 3rd execution mode of the present invention provides a kind of starting method of soft soldering apparatus of printed circuit board.Described soft soldering apparatus comprises:
The soft solder groove is taken in flow of molten solder, possesses the diapire that is provided with the hole;
Nozzle is mounted in the soft solder groove and an end has first opening and the other end has the nozzle of second opening, and this first opening is arranged in the liquid level top of the flow of molten solder that is accommodated in the soft solder groove;
And electromagnetic pump;
This electromagnetic pump is the combination of straight tube, inner core body, coil and outside core body,
Described straight tube, the openend that has the end of sealing and be positioned at its opposition side and link with described hole, the flow of molten solder of soft solder groove can flow in this straight tube,
Described inner core body is the inner core body of tubular that forms the soft solder return path in inside, is configured in this straight tube, between forms the soft solder stream of ring-type, and, have the upper opening that links with second opening of this nozzle and with the opposed lower openings of the closed end of this straight tube
Described coil and described outside core body dispose in the mode of surrounding this straight tube, can be encouraged with electric means,
When this coil is energized, in the soft solder stream, form moving field, its result, flow of molten solder flows downwards along this soft solder stream, flow upward along return path then,, above first opening, form the soft solder ripple from the first opening jet flow of this nozzle;
This soft soldering apparatus also has heater and controlling organization, and described heater heats the soft solder in the above-mentioned soft solder groove, and described controlling organization control is supplied with the electric power of the coil of above-mentioned heater and above-mentioned electromagnetic pump;
In the method, described controlling organization, soft solder in making described soft solder groove from the state that solidifies when the state-transition of fusion, the electric power of the described heater fed of subtend and control to the electric power that the coil of described electromagnetic pump is supplied with, when making that the fusion of the soft solder in straight tube is finished, perhaps before it was finished, the fusion of the soft solder in the described soft solder groove was finished.
The 4th execution mode of the present invention provides a kind of soft soldering apparatus of printed circuit board, and this device comprises:
A plurality of soft solder grooves are taken in flow of molten solder respectively and are possessed the diapire that is provided with the hole;
A plurality of nozzles, be the quantity a plurality of nozzles corresponding with the quantity of soft solder groove, each nozzle is installed in the corresponding soft solder groove, at one end has first opening and has second opening at the other end, and this first opening is arranged in the top of the flow of molten solder liquid level that is accommodated in corresponding soft solder groove;
A plurality of straight tubes, be the quantity a plurality of straight tubes corresponding with the quantity of soft solder groove, the openend that each straight tube has the end of sealing and is positioned at its opposition side and links with the described hole of corresponding soft solder groove, the flow of molten solder of each soft solder groove can flow in the corresponding straight tube;
A plurality of inner core bodys, be the inner core bodys of the quantity a plurality of tubulars corresponding with the quantity of straight tube, each inner core body forms the soft solder return path in inside, and, be configured in the corresponding straight tube, and form the soft solder stream of ring-type between the two, and, each inner core body have the upper opening that links with second opening of corresponding nozzle and with the opposed lower openings of the closed end of corresponding straight tube;
And one or more driving mechanism, it is the one or more driving mechanism that constitutes by coil and outside core body, the straight tube that each driving mechanism is wished in can corresponding described a plurality of straight tubes is optionally located, when this coil is energized, in the soft solder stream of correspondence, form moving field, its result, flow of molten solder flows downwards along the soft solder stream, then the return path along correspondence flows upward, forms the soft solder ripple from the first opening jet flow of corresponding nozzle above first opening.
The 5th execution mode of the present invention provides a kind of soft soldering apparatus of printed circuit board, and this device comprises:
The soft solder groove is taken in flow of molten solder and is possessed the diapire that is provided with the hole;
A plurality of nozzles, be the quantity a plurality of nozzles corresponding with the quantity in described hole, each nozzle is installed in the soft solder groove, at one end has first opening and has second opening at the other end, and this first opening is arranged in the top of the flow of molten solder liquid level that is accommodated in the soft solder groove;
A plurality of straight tubes are quantity a plurality of straight tubes corresponding with the quantity in described hole, the openend that each straight tube has the end of sealing and is positioned at its opposition side and links with described hole, and the flow of molten solder of soft solder groove can flow in the described straight tube;
A plurality of inner core bodys, be the inner core bodys of the quantity a plurality of tubulars corresponding with the quantity of described straight tube, each inner core body forms the soft solder return path in inside, and, be configured in the corresponding straight tube, and form the soft solder stream of ring-type between the two, and, have the upper opening that links with second opening of corresponding nozzle and with the opposed lower openings of the closed end of corresponding straight tube;
And one or more driving mechanism, it is the one or more driving mechanism that constitutes by coil and outside core body, the straight tube that each driving mechanism is wished in can corresponding described a plurality of straight tubes is optionally located, when this coil is energized, in the soft solder stream of correspondence, form moving field, its result, flow of molten solder flows downwards along the soft solder stream of correspondence, then the return path along correspondence flows upward, forms the soft solder ripple from the first opening jet flow of corresponding nozzle above first opening.
Description of drawings
Fig. 1 is a figure that example describes to the structure of the soft soldering apparatus of expression first embodiment of the invention.
Fig. 2 is the stereogram of explanation soft soldering apparatus overall picture of the present invention.
Fig. 3 is the exploded perspective view of plug relation of straight tube, inner core body and driving body of the electromagnetic pump of explanation soft soldering apparatus of the present invention.
Fig. 4 (a) is the cutaway view that the corrosion resistance insulating barrier of explanation soft solder groove shown in Figure 1 forms.
Fig. 4 (b) is the cutaway view that the corrosion resistance insulating barrier of explanation inner core body shown in Figure 1 forms.
Fig. 5 is a figure that example describes to the structure of the soft soldering apparatus of expression second embodiment of the invention.
Fig. 6 is a figure that example describes to the structure of the soft soldering apparatus of expression third embodiment of the invention.
Fig. 7 is the flow chart of an example moving of the control and treatment in (at first) when starting of expression soft soldering apparatus of the present invention.
Fig. 8 is a figure that example describes to the structure of the soft soldering apparatus of expression four embodiment of the invention.
Fig. 9 is a figure that example describes to the structure of the bull jet flow waveform apparatus for converting of expression fifth embodiment of the invention.
Figure 10 is the stereogram of explanation bull jet flow waveform apparatus for converting overall picture of the present invention.
Embodiment
[first execution mode]
Below, use Fig. 1 to Fig. 3 that the structure example of soft soldering apparatus of the present invention is described.
Fig. 1 shows the soft solder slot part with the longitudinal section, shows the formation of control system with block diagram.The 101st, the soft solder groove.In this soft solder groove 101, be provided with heater 109, heat and make its fusion being accommodated in soft solders 100 in this soft solder groove 101, and remain on target temperature along bottom land 101a or cell wall.
The 201st, temperature control equipment is controlled the temperature of soft solder 100.This temperature control equipment 201 is such structures, that is, the temperature detection result of reference temperature(TR) transducer 106 is controlled the electric power that supplies to heater 109, so that make the temperature of soft solder 100 reach temperature indicative in advance.
In addition, in the hole 108 of the bottom land 101a of soft solder groove 101, be provided with as the thrust tube of ALIP type electromagnetic pump 300 and the straight tube 302 that works.This straight tube 302 have the end 302a of sealing and be positioned at its opposition side and with the openend 302b that above-mentioned hole 108 links, be installed in by methods such as welding or threads engage in the hole 108 of bottom land 101a.
In addition, in this straight tube 302, the inside core body 303 of tubulose is inserted in plug freely, and this inside core body 303 is provided with along the soft solder return path of straight tube 302 central shafts (oppositely stream) 304.Inner core body 303 have upper opening 303a that second opening 107 with nozzle 102 links and with the opposed lower openings 303b of closed end 302a of this straight tube 302.That is, the inflow entrance 107 of the reverse stream 304 of this inside core body 303 and nozzle 102 is communicated with.
Inner core body 303 and nozzle 102 are fixed in the soft solder groove 101 in mode that can attaching/detaching by not shown supporting device.
In addition,, be provided with driving body 301 in the mode that can rotate and can plug in the outside of straight tube 302, this driving body 301 be formed with and inner core body 303 between produce the outside core body 301a of shifting magnetic field and shifting magnetic field and produce and use coil 301b.By encourage this driving body 301 (outside core body 301a and shifting magnetic field produce coil 301b) with electric means, produce thrust in the stream 305 that is formed between straight tube 302 and the inner core body 303, the flow of molten solder of sending from this stream 305 100 is fed into nozzle 102 through the reverse stream 304 of inner core body 303.
By driving body 301 can be rotated, can improve close property to straight tube 302, and, can select best Distribution of Magnetic Field and make thrust stable.Annular linear response type (the R-ALIP type: electromagnetic pump return throughtype annular linear induction pump) that the ALIP type electromagnetic pump 300 of this structure is called the stream reversal.
ALIP type electromagnetic pump 300, cylindric owing to the shape of outside core body 301a being formed, so its outward appearance is generally cylindric.In addition, its inner core body 303 also is cylindric, and the annulus between this outside core body 301a and inner core body 303 just produces the shifting magnetic field in the stream, and the soft solder applied thrust in this stream is moved it, and produces expulsion force and inhalation power.
This R-ALIP type electromagnetic pump (below be referred to as ALIP type electromagnetic pump) is connected with many phase alternating current source apparatus 202 (for example VVVF type three-phase inverter supply unit), the magnetic field of electromagnetic pump is produced with coil 301b supply with many phase alternating current.
Like this, in the present invention, as shown in Figure 1, ALIP type electromagnetic pump 300 is arranged on the cell wall outside of soft solder groove 101, flow of molten solder is drawn into the stream 305 that is arranged in the soft solder groove 101 cell walls outside, then, the flow of molten solder of discharging is supplied to nozzle 102.Thus, maintenance and the replacing that is positioned at the ALIP type electromagnetic pump 300 in soft solder groove 101 outsides becomes easy.
By with the communicating by letter of control device 203, the output voltage of this many phase alternating current source apparatus 202, frequency, power etc. are regulated control arbitrarily.
The fusing point of soft solder is according to the kind of soft solder and different.For instance, the tin of Shi Yonging-plumbous soft solder (for example lead is 37%, and all the other are tin) is approximately 183 ℃ in the past.In addition, the tin-zinc soft solder (for example zinc is 9%, and all the other are tin) as lead-free solder is approximately 199 ℃.In addition, tin-silver-copper soft solder (for example silver-colored about 3.5%, copper is about 0.7%, and all the other are tin) is approximately 220 ℃.
Thereby, kind according to employed soft solder, the temperature of employed soft solder is different when carrying out installing as the solder of the printed circuit board of welded piece, but consider the heat resisting temperature of the electronic component that is equipped on printed circuit board, the example that uses in about 220 ℃ to 260 ℃ scope is more.
In addition, the bottom land 101a of soft solder groove 101 and inner core body 303 uses FCD-400 or FCD-500 cast irons such as (JIS) (aftermentioned Fig. 4 402,404) at least.Here, the bottom land 101a thickness of soft solder groove 101 is set as more than the thickness of inner core body 303.This is because magnetic resistance and sectional area are inversely proportional to.Promptly, be configured to more than the thickness of inner core body 303 by bottom land 101a thickness soft solder groove 101, the major part of the leakage field of electromagnetic pump 300 is collected by soft solder groove 101 at 108 places in the hole, thereby stop soft solder 100 internal leakages just in groove 101.In Fig. 1 or Fig. 5 described later, the path shown in the dotted arrow 199 is the appearance of collecting leakage field.
Like this, arrive the major part of the shifting magnetic field of inner core body 303 through stream 305 from the outside core body 301a of electromagnetic pump 300, turn back among the outside core body 301a by opposite path, in any case although all be easy to generate leakage field at the place, electromagnetic pump 300 ends that constitutes suction inlet or outlet, but this can stop to the soft solder internal leakage.
In addition, the stainless steel that in the past was used as the parts of soft solder groove 101 belongs to non-magnetic part, and soft solder is non-magnetic part (permeability is to the maximum below tens) too.In contrast, the permeability of iron parts such as cast iron is several thousand to several ten thousand, because this difference more than 100 times is revealed magnetic field and collected by the little soft solder groove 101 of magnetic resistance.And, owing to be to be the equal above iron parts of permeability of the inside core body 303 of electromagnetic pump 300 with permeability, the bottom land 101a of formation soft solder groove 101, so, leakage field can be collected reliably.In order to collect leakage field more reliably, also can be designed to soft solder groove integral body all is cast iron.
In addition, when alternating magnetic field is inner by conductor, produce vortex flow.Thereby, on the surface of the bottom land 101a of soft solder groove 101 or inner core body 303, formation has the durability electric insulation layer of corrosion resistance (401 shown in aftermentioned Fig. 4,403) just to soft solder, stops this vortex flow to flow in the soft solder and forms stray electrical current.
As this layer, can use the layer of pottery etc. or nitride layer, intermetallic compounds layer (for example iron-Al intermetallic) or the like, but not wish for the layer of porous or have pore or crack.In addition, cross when thin, insulation breakdown takes place thereby be easy to generate leakage current when its thickness.In addition, also destroyed owing to the corrosion of soft solder easily.
The inventor finds, if the thickness of above-mentioned layer is more than the 30 μ m, then can obtain the durability more than at least five years, obtained such conclusion thus, that is, can guarantee and the equal durability of turn(a)round that is used for installing the jet flow waveform apparatus for converting of electronic component in the production scene.
Fig. 4 is the cutaway view of formation of corrosion resistance insulating barrier of bottom land 101a, the inner core body 303 of explanation soft solder groove 101 shown in Figure 1, and (a) partial sectional view with the soft solder groove is corresponding, and (b) partial sectional view with inner core body is corresponding.
Like that, the bottom land 101a of soft solder groove 101 makes cylinder iron 402 as its parts shown in Fig. 4 (a).In addition, on the surface of the bottom land 101a of soft solder groove 101, being formed with thickness is the above corrosion resistance insulating barriers 401 of 30 μ m.
Like that, inner core body 303 makes cylinder iron 404 as its parts shown in Fig. 4 (b).In addition, on the surface of inner core body 303, also being formed with thickness is the above corrosion resistance insulating barriers 403 of 30 μ m.
On the other hand, owing to need constitute straight tube 302 with non-magnetic part, so, use parts of stainless steel usually.Though parts of stainless steel has corrosion resistance, with respect to rich tin lead-free solder, its corrosion resistance may not be enough.Therefore, use the more excellent titanium of corrosion resistance better.
The magnetic susceptibility of titanium is the same with the magnetic susceptibility of aluminium, belongs to non-magnetic part.And the pyroconductivity of titanium is 17[W/mK], the pyroconductivity of stainless steel (SUS304) equals 16[W/mK].As a reference, the resistivity of titanium is 0.55[μ Ω m], the resistivity of stainless steel (SUS304) equals 0.72[μ Ω m].And the resistivity of the employed tin of the unleaded slicken solder of rich tin is 0.12[μ Ω m], the resistivity of copper is 0.017[μ Ω m], the resistivity of stainless steel or titanium is the value more than 5 to 30 times of rich tin lead-free solder or copper.Therefore, thereby pass to soft solder and this driving body 301 is cooled off the viewpoint of effectively utilizing thermal loss, we can say that constituting straight tube 302 with the titanium material is comparatively to be fit to from the thermal loss that driving body 301 is produced.
Although straight tube 302 is directly run through in the shifting magnetic field, but straight tube 302 also is positioned at the inboard of soft solder groove unlike soft solder groove 101 itself or inner core body 303, so, be created in that vortex flow in this straight tube 302 is loose electric current as the fan and situation about being diffused in the soft solder 100 in the soft solder groove 101 is few.But, become that the fan looses electric current and aspect the problem that spreads, following way is also effective: also form the electric insulation layer that soft solder is had corrosion resistance in advance on this straight tube 302 in the burn into that prevents from fully to cause and vortex flow by soft solder 100.
As explained above such, soft soldering apparatus according to present embodiment, ALIP type electromagnetic pump 300 is located at the outside of soft solder groove 101, especially comprise that the driving body 301 that the shifting magnetic field produces with coil 301b is designed to plug freely, so, can easily carry out operations such as the maintenance of electromagnetic pump or replacing.
In addition, the bottom land 101a of soft solder groove 101 is made of the iron parts, described iron parts have the permeability more than at least 100 times of soft solder permeability, and permeability is more than the permeability of inner core body 303, and thickness is more than the thickness of inner core body 303, so, magnetic field or the fan electric current that looses of can stopping a leak carries out solder and installs under the situation of bringing infringement or stress for the electronic component of installing, can carry out the installation of electronic component with higher reliability.
[second execution mode]
Below, with reference to Fig. 5 the structure of the soft soldering apparatus of expression second embodiment of the invention is described.
Fig. 5 is the figure of an example of structure of the soft soldering apparatus of explanation expression second embodiment of the invention, shows the soft solder slot part with the longitudinal section, shows the formation of control system with block diagram.Here, to the member mark identical Reference numeral identical with Fig. 1.In addition, the scheme difference of the scheme of present embodiment and first execution mode shown in Figure 1 is: in order not change the volume that increases the soft solder groove under the maximum sized situation of soft soldering apparatus, on the bottom land 101a of soft solder groove 101, be provided with recess 111 in the mode that can embed driving body 301 (outside core body 301a and shifting magnetic field produce and use coil 301b).
In addition, by such formation, not only from straight tube 302, but also the thermal loss that electromagnetic pump 300 is produced from driving body 301 (outside core body 301a and shifting magnetic field produce and use coil 301b) is directly passed to soft solder groove 101 and its inner soft solder 100, can improve the total energy efficiency of soft soldering apparatus integral body.
In addition, because electromagnetic pump 300 integral body are covered with the bottom land 101a as the soft solder groove 101 of iron parts, so, the generation of leakage field can further be stoped reliably.
Volume by increasing soft solder groove 101, increase the soft solder amount of taking in, have following advantage: the reduction amount of soft solder temperature in the time of can reducing welded piece and contact with the jet flow ripple, when producing in a large number, can stably keep the soft solder temperature.
[the 3rd execution mode]
Above, in order to make the soft solder fusion in the soft solder groove and it to be maintained predefined set point of temperature, used heater, the temperature sensor of soft solder heating usefulness to also have temperature control equipment, but, because the fusing heat of soft solder is bigger, so, be arranged in the structure in the cell wall outside of soft solder groove at ALIP type electromagnetic pump JP-A-2005-205479, even the soft solder fusion in the soft solder groove, the fusion of the soft solder in the thrust generation stream of above-mentioned electromagnetic pump also will spend the long time before finishing.
Thereby, there is such problem, that is, moving from the outset soft soldering apparatus is longer to forming the starting time of jet flow ripple during this.
Therefore, following technology being disclosed in JP-A-2005-205479: cap is set on blow-off outlet, carries out the induction heating of the soft solder in the thrust tube under the state with this blow-off outlet sealing.Following technology is also disclosed in addition: from the above-mentioned cap temperature sensor that hangs down, carry out above-mentioned induction heating while the temperature of measuring the soft solder in the thrust tube, when the soft solder fusion that detects by temperature sensor in the thrust tube, disconnect the electric power that electromagnetic pump is supplied with.
But, in the technology of JP-A-2005-205479, in the soft soldering apparatus entry into service or when shutting down, the operation that need carry out cap is arranged on the blow-off outlet or cap is pulled down from blow-off outlet, and, the disassembling section of cap need and reach a high temperature in the soft solder fusion and carry out after (220 ℃ to 260 ℃), so this operation is abnormally dangerous.In addition, the sagging cap that is provided with temperature sensor hung down in thrust tube and with the operation of blow-off outlet sealing, need be during the soft solder fusion temperature sensor be hung down in the soft solder in the thrust tube, so, need when the soft solder fusion after the solder operation just finishes, carry out, and, the operation of the sagging cap that is provided with this temperature sensor being taken out from thrust tube and pulling down cap from blow-off outlet, also need under the condition of high temperature of soft solder fusion, carry out, need carry out twice breakneck operation.
In addition, in the technology of JP-A-2005-205479, do not consider following situation, promptly, in the soft solder fusion below only being positioned in this soft solder groove under the state that soft solder in the soft solder groove solidifies, because the volumetric expansion that this fusion causes can make flow of molten solder produce the powerful bulbs of pressure.That is to say and do not consider following problems, promptly, high temperature soft solder with this burst pressure solidifies soft solder that the back forms can produce shrinkage cavity gaps such as (holes that produces owing to solidification shrinkage), and, can produce gap (because gap that solidification shrinkage produces) between thrust tube or inner core body and the soft solder that solidified, can form the jet that reaches several m from these gaps and spray, thus the dangerous phenomenon on operator around may blowing to or the device.This is well known to a person skilled in the art.In JP-A-2005-205479, though open cap thread is bonded on mechanism on the blow-off outlet etc., even but so also can cap be blown off owing to above-mentioned jet, there is not any meaning.
Even mechanism such as suppose to be threadably engaged cap being set, with the operation of the soft solder fusion below the soft solder groove, also is the behavior that the operator can not carry out under the situation that the cap that seals blow-off outlet is being set by such mechanism.This is because when the operation of dismantling cap, exist flow of molten solder to become jet as described above and injure operator's danger.
The 3rd execution mode of the present invention provides the scheme that can shorten the starting time of soft soldering apparatus safely.
Below, the soft soldering apparatus of third embodiment of the invention is described.Fig. 6 is to a figure that example describes of the structure of the soft soldering apparatus of expression third embodiment of the invention, shows the soft solder slot part with the longitudinal section, shows the formation of control system with block diagram.To the parts mark identical Reference numeral identical with Fig. 1.
According to the specific heat of soft solder volume in the soft solder groove 101 and soft solder with and the melting heat amount, try to achieve the required heat of soft solder fusion in the soft solder groove 101.On the other hand, try to achieve the heat supplied of heater 109 by supply capability.Thus, can obtain, arrive the time of the soft solder fusion in the soft solder groove 101 from beginning to heater 109 supply capabilities.To be made as several % to the ratio of atmosphere dispersed heat as required.
In addition, according to the specific heat of the volume of the soft solder in the straight tube 302 and soft solder with and melting heat amount, the volume that also has inner core body 303 and specific heat, try to achieve the required heat of soft solder fusion in this straight tube 302.On the other hand, electromagnetic pump 300 is the induction heating heat that outside core body 301a and shifting magnetic field produce the shifting magnetic field formation that is produced with coil 301b furtherly, can try to achieve according to the electric weight that supplies to ALIP type electromagnetic pump 300 and induction heating efficient (fixed value of trying to achieve according to mensuration is for for example about tens of %).According to above-mentioned parameter, can obtain the time of ALIP type electromagnetic pump 300 supply capabilities being played soft solder 100 fusions from beginning.To be made as to the ratio of atmosphere dispersed heat about several % as required.
Thereby, be total electric weight furtherly with the required total amount of heats of soft solder fusion in the soft solder groove 101, supply to the amount of power supply of heater 109 divided by time per unit, just can obtain the required time of soft solder fusion in the soft solder groove 101.On the contrary, by being total electric weight furtherly,, just can obtain the electric weight that time per unit should supply to heater 109 divided by the target melting time with the required total amount of heat of soft solder 100 fusions in the soft solder groove 101.
Similarly, by making the required total amount of heat of soft solder fusion in the straight tube 302 is total electric weight furtherly, divided by the multiply each other value of gained of the amount of power supply that time per unit is supplied to electromagnetic pump and induction heating efficient, just can obtain the required time of soft solder fusion in the straight tube.On the contrary, by with the required total amount of heats of soft solder fusion in the straight tube 302 be furtherly total electric weight divided by the target melting time, and then, just can obtain the electric weight that time per unit should supply to electromagnetic pump 300 again divided by induction heating efficient.
Therefore, utilize these computational methods, control device 203, set information relevant (electric weight of time per unit or accumulative total electric weight) and the information (electric weight of time per unit or accumulative total electric weight) relevant from indication operating portion 204 in advance, be stored in advance with the form of tables of data in the hard disk (storing mechanism) 206 of control device 203 with the electric power that supplies to electromagnetic pump 300 with the electric power that supplies to heater 109.
And, when having started soft soldering apparatus, the electric power that CPU in the control device 203 supplies with heater 109 and electromagnetic pump 300 with reference to these tables of data controls, so that after the soft solder fusion during making soft solder groove 101 (or simultaneously), the soft solder fusion that straight tube 302 is interior.That is to say, CPU in the control device 203 is with reference to these tables of data, the electric power that subtend heater 109 and electromagnetic pump 300 are supplied with is controlled, before making that the fusion of the soft solder 100 in straight tube 302 begins, begin the fusion of the soft solder 100 in the described soft solder groove 101, and when the fusion of the soft solder in straight tube 302 100 is finished or before finishing, the fusion of the soft solder 100 in the described soft solder groove 101 is finished.
Also can in soft solder liquid level near zone in the soft solder groove 101 and straight tube 302, set in advance temperature sensor, revise the above-mentioned theoretical supply capability of calculating like that, this value is set in the control device 203 according to actual measurement.This mensuration is carried out as following.That is, when the starting soft soldering apparatus, the temperature of soft solder rises towards its fusing point, but owing to need supply with melting heat at the fusing point place, so up to whole soft solder fusions, the temperature of soft solder all remains on fusing point consistently.And when whole soft solder fusion, the temperature of flow of molten solder rises once again.
Therefore, in this was measured, the temperature that detects soft solder by the temperature sensor 106 of soft solder liquid level near zones in the above-mentioned soft solder groove 101 was from the moment that fusing point begins to rise, be exactly in the soft solder groove 101 the whole fusions of soft solder the moment.In addition, the temperature that detects soft solder by the temperature sensors in the above-mentioned straight tube 302 is from the moment that fusing point begins to rise, be exactly in the straight tube 302 the whole fusions of soft solder the moment.
Promptly, as long as following design, promptly, information that will be relevant with the electric power that supplies to heater 109 (for example electric weight of time per unit or accumulative total electric weight) and the information (for example electric weight of time per unit or accumulative total electric weight) relevant with the electric power that supplies to electromagnetic pump 300 are set in the control device 203, make the temperature of the soft solder in soft solder groove 101 after fusing point begins to rise, the temperature of the soft solder in the straight tube 302 begins to rise from fusing point.As long as both time differences are promptly to be safe about 10 minutes, but also simultaneously.In addition, by 203 that carry out with control device, make both control programizations simultaneously, can be made as the starting time the shortest.The temperature sensor that is arranged in the straight tube 302 only is configured in the straight tube 302 when being used to the said determination that carries out above-mentioned correction, rather than when carrying out the solder of welded piece (configuration) is set.
Like this, be set in the control device 203 by information (for example electric weight of time per unit or accumulative total electric weight) that will be relevant and the information (for example electric weight of time per unit or accumulative total electric weight) of being correlated with etc. with the electric power that supplies to electromagnetic pump 300 with the electric power that supplies to heater 109, and control, can prevent that following precarious position from producing: in the lower layer part of the soft solder of solid state, soft solder is gone ahead of the rest fusion and is expanded, because these bulbs of pressure cause flow of molten solder to spray from small gap.
Like this, after the soft soldering apparatus starting, flow of molten solder arrives predefined set point of temperature, and keeps this temperature.So, can under this state, begin the solder of welded pieces such as printed circuit board.
And, if ALIP type electromagnetic pump 300 supply capabilities are produced thrust, then such shown in the arrow A of Fig. 6, flow of molten solder is drawn into the stream 305 from soft solder groove 101, in the terminal flow direction upset of straight tube 302, and be sent in the reverse stream 304 in the inner core body 303, afterwards, be fed into nozzle 102, flow by 105 pairs of cowling panels and carry out after the rectification, from blow-off outlet 103 ejections, form jet flow ripple 110.
Such shown in dotted arrow B among Fig. 6, during with above-mentioned starting (, when the soft solder 100 in the straight tube 302 and inner core body 303 are carried out induction heating) thrust direction be made as direction opposite when forming jet flow ripple 110, thus, can get rid of the precarious position that previously described flow of molten solder is sprayed more reliably.That is, as shown in Figure 6, be in nozzle 102 and cover state on the electromagnetic pump 300, so, the injection of flow of molten solder stoped by the existence of nozzle 102.
Below, with reference to the flow chart of Fig. 7 the control and treatment action soft soldering apparatus of present embodiment, during starting is described.
The flow chart of an example of the control and treatment action when Fig. 7 is the initial start of soft soldering apparatus of expression present embodiment.The following realization of the processing of this flow chart, that is, the program in the hard disk 206 of will being stored in of the CPU in the control device 203 is read into RAM and goes up and carried out.In addition, the S101～S103 among Fig. 7 represents each step.
At first, after the beginning start up process, the CPU of control device 203 in step S101, will be read on the RAM the tables of data of setting data in hard disk 206.This setting data is to be set by indication operating portion 204 by the user in advance.Specifically, this setting data comprises: the information relevant with the electric power that supplies to heater 109 (for example the electric weight of time per unit or accumulative total electric weight) and produce with the relevant information of the electric power of coil 301b (for example electric weight of time per unit or accumulative total electric weight) etc. with the shifting magnetic field that supplies to electromagnetic pump 300.Below, the situation that the shifting magnetic field of having set the accumulative total electric weight that supplies to heater 109 (the first accumulative total electric weight) here as setting data and having supplied to electromagnetic pump 300 is produced accumulative total electric weight with coil 301b (second totally electric weight) describes.This setting data for example is the data of trying to achieve in advance by actual measurement as described above.
Then, in step S102, the CPU of control device 203 is based on accumulative total electric weight in the setting data that reads in step S101, that supply to heater 109 (the first accumulative total electric weight), control temperature control equipment 201, supply to the electric power of heater 109 with control.In addition, the CPU of control device 203, produce the accumulative total electric weight (the second accumulative total electric weight) of using coil 301b based on shifting magnetic field in the setting data that in step S101, reads in, that supply to electromagnetic pump 300, control many phase alternating current source apparatus 202, the shifting magnetic field that supplies to electromagnetic pump 300 with control produces the electric power of using coil 301b.
At this moment, the CPU of control device 203, electric power that supplies to heater 109 and the shifting magnetic field generation that supplies to electromagnetic pump 300 are controlled respectively with the electric power of coil 301b, so that become following order, promptly, after the soft solder fusion in soft solder groove 101 (or simultaneously), the soft solder fusion in the straight tube 302.Promptly, the CPU of control device 203 controls, make the cumulative amount at the electric power that supplies to heater 109 arrive after the above-mentioned first accumulative total electric weight, the cumulative amount that the shifting magnetic field that supplies to electromagnetic pump 300 produces with the electric power of coil 301b reaches the above-mentioned second accumulative total electric weight (also can be simultaneously).
The CPU of control device 203 both can followingly control, promptly, make electric power that supplies to heater 109 and the electric power that the shifting magnetic field that supplies to electromagnetic pump 300 produces with coil 301b be respectively constant electric power, also can followingly control, that is, make in electric power variation described in the time series and non-constant.For example, can control, make at initial bigger electric power, the less electric power of supply when near the accumulative total electric weight supplied with.In addition, both controlled making begins the electric power of heater 109 is supplied with and the shifting magnetic field generation of electromagnetic pump 300 is supplied with the electric power of coil 301b simultaneously, also can control in the mode that the time difference is set.
Promptly, when the soft solder 100 in making soft solder groove 101 starts to the molten condition transformation from solid state, the CPU of control device 203 supplies with the electric power of heater 109 and the shifting magnetic field generation of above-mentioned electromagnetic pump 300 is controlled with the electric power supply of coil 301b, so that heater 109 supply capabilities are heated soft solder, and the shifting magnetic field of electromagnetic pump 300 produced the supply capability with coil 301b, and carry out the induction heating of the soft solder in the straight tube 302 in the lump, and, become following order, promptly, after the soft solder fusion in the soft solder groove 101 or side by side, the soft solder fusion in the straight tube.So long as constitute as described above, then with any method control can, such control all belongs to the present invention.
Then, in step S103, the CPU of control device 203, to the shifting magnetic field that supplies to electromagnetic pump 300 produce cumulative amount with the electric power of coil 301b whether arrive above-mentioned second totally electric weight judge.And, the CPU of control device 203, till the shifting magnetic field that supplies to electromagnetic pump 300 produced cumulative amount with the electric power of coil 301b and reaches the above-mentioned second accumulative total electric weight, the shifting magnetic field generation that all continues subtend heater 109 and electromagnetic pump 300 was controlled with the electric power supply of coil 301b.
And, in step S103, the CPU of control device 203 judges the shifting magnetic field that supplies to electromagnetic pump 300 and produces cumulative amount with the electric power of coil 301b and reach above-mentioned second totally during electric weight, the start up process of the CPU process ends figure of control device 203 makes the state of soft soldering apparatus be transformed into operation mode from originate mode.
There is shown such scheme in this flow process, promptly, as setting data, in advance above-mentioned first, second accumulative total electric weight etc. is set in the control device 203, based on this first, second accumulative total electric weight the electric power that supplies to heater 109, electromagnetic pump 300 is controlled, at this moment, following control, that is, make after the electric weight that supplies to heater 109 has been supplied with the first accumulative total electric weight (also can) that the electric weight that supplies to electromagnetic pump 300 reaches the second accumulative total electric weight simultaneously.Yet, it also can be following proposal, promptly, in control device 203, as setting data, preestablish the electric weight (first electric weight) that time per unit supplies to heater 109, supply to the electric weight (second electric weight) of electromagnetic pump 300 with time per unit, control device 203 is only by will be based on above-mentioned first, the electric power of second electric weight supplies to heater 109 respectively, electromagnetic pump 300, and as described above, make the electric weight supply to heater 109 supply with after the first accumulative total electric weight (simultaneously also can), the electric weight that supplies to electromagnetic pump 300 reaches the second accumulative total electric weight.
As explained above, when the soft solder 100 in making soft solder groove 101 starts to the molten condition transformation from solid state, following electric power to heater 109 is supplied with and the shifting magnetic field generation of above-mentioned electromagnetic pump 300 is controlled with the electric power supply of coil 301b, promptly, heater 109 supply capabilities are heated soft solder, and the shifting magnetic field to electromagnetic pump 300 produces the induction heating that carries out the soft solder in the straight tube 302 with coil 301b supply capability in the lump, and, become following order: after the soft solder fusion in the soft solder groove 101 or side by side, the soft solder fusion in the straight tube 302.So, can be significantly and shorten safely from the soft solder that makes solid state and be molten to the time that reaches operating condition.
Therefore, played following effect: preventive maintenance time or starting time are shortened, and significantly improve solder production rate for mounting etc.
Though do not illustrate, but also can auxiliary heater be set, when the starting soft soldering apparatus in flow of molten solder flow direction terminal position upset, straight tube the outside, with the induction heating of soft solder in the straight tube in the lump, carry out the heating that realizes by this auxiliary heater.
In addition, when the solder of the printed circuit board that carries out being implemented by soft soldering apparatus is installed, following situation is arranged, promptly, when the kind that changes printed circuit board just changes the machine of implementing solder, or in time of having a rest of production operation etc., temporarily stop the jet flow of soft solder.Under the situation that this soft soldering apparatus temporarily rests, for the temperature that prevents soft solder in the straight tube reduces, can control, electromagnetic pump is supplied with the electric power of the degree that can not cause the soft solder injection, and carry out the induction heating of soft solder.Perhaps, can be to above-mentioned auxiliary heater supply capability.
In the 3rd execution mode, with first execution mode in the same manner, also preferred iron with the permeability more than 100 times with flow of molten solder 100, constitute the diapire of soft solder groove 101, and, make its permeability for more than the permeability of this inside core body 303, and make its thickness be this inside core body more than 303, but under the situation that the printed circuit board of the corresponding solder of the leakage field of electromagnetic pump 300 can not impact, the diapire of soft solder groove 101 also can be such in the past structure.
[the 4th execution mode]
Below, with reference to Fig. 8 the structure of the soft soldering apparatus of expression four embodiment of the invention is described.
Fig. 8 is to a figure that example describes of the structure of the soft soldering apparatus of expression four embodiment of the invention, shows the soft solder slot part with the longitudinal section, shows the formation of control system with block diagram.The part identical with Fig. 6 marked with identical Reference numeral.In addition, the structure difference of the structure of present embodiment and the 3rd execution mode shown in Figure 6 is, in order not change the capacity that increases the soft solder groove under the maximum sized situation of soft soldering apparatus, be provided with the recess 111 that can supply driving body 301 (outside core body 301a and shifting magnetic field produce and use coil 301b) to embed at the bottom land 101a of soft solder groove 101.
According to such structure, not only from stream 305 but also from driving body 301 (outside core body 301a and shifting magnetic field produce and use coil 301b), the thermal loss that electromagnetic pump 300 is produced is directly delivered in soft solder groove 101 and its inner soft solder 100, can improve total energy efficiency of soft soldering apparatus integral body.
Increase the soft solder amount of taking in by the volume that increases soft solder groove 101, have such advantage, that is, the reduction amount of soft solder temperature can stably be kept the soft solder temperature in the time of can reducing welded piece and contact with the jet flow ripple when producing in a large number.
In addition, in the present embodiment, be provided with discharge portion 306 (bleeding opening 307, open and close valve 308) in the bottom of straight tube 302.It is used to pass the soft solder that straight tube 302 is discharged in the soft solder groove.When releasing (open open and close valve 308 and with soft solder when bleeding opening is discharged),, can quicken to discharge soft solder by its thrust by making electromagnetic pump 300 actions.
[the 5th execution mode]
In the soldering system of the crest solder of the printed circuit board that is equipped with electronic component, usually constitute in the mode that in system, forms at least two kinds of jet flow ripples, in plural soft solder groove, different types of nozzle is set respectively, or in a soft solder groove, be provided with diverse two with top nozzle, electromagnetic pump is set respectively on each nozzle.
Yet, in such structure,, can there be obsolete nozzle and electromagnetic pump if do not use whole jet flow ripples simultaneously, so, the vacant and waste problem of resource of the electromagnetic pump that has a high price.
The 5th execution mode of the present invention provides a kind of scheme, resources effective is utilized generator at an easy rate thereby it can realize the high price electromagnetic pump, and by realizing that the utilization of electromagnetic pump resources effective provides high-quality solder to install, and can also boost productivity simultaneously.
Below, use Fig. 9 and Figure 10 that the soft soldering apparatus of fifth embodiment of the invention is described.The member identical with Fig. 1 marked with identical Reference numeral.
On the bottom land 101a of the soft solder groove 101 of present embodiment, be provided with a plurality of holes 108, in each hole 108, be respectively equipped with the straight tube 302 of ALIP type electromagnetic pump.These straight tubes 302 are installed in by welding or method such as threads engage in each hole 108 of bottom land 101a of soft solder groove 101.
This soft soldering apparatus has a plurality of nozzles 102 in the soft solder groove.In addition, in each straight tube 302, plug is inserted with the inside core body 303 of tubulose freely respectively, and described inner core body 303 is provided with reverse stream 304 along its central shaft.And the reverse stream 304 of these inner core bodys 303 is communicated with the inflow entrance 107 of each nozzle 102 respectively.
In addition, each nozzle 102 respectively within it portion have the mobile cowling panel 105 that carries out rectification to flow of molten solder, each blow-off outlet 103 is positioned at the top of soft solder liquid level.That is to say to form following structure, that is, when making flow of molten solder, on this blow-off outlet, form jet flow ripple 110, along flowing down in abutting connection with the guided plate 104 (or nozzle 102) that ground is provided with this blow-off outlet 103 from blow-off outlet 103 jet flows.
Each inner core body 303 and nozzle 102 are fixed in the soft solder groove 101 in mode that can attaching/detaching by not shown supporting device.
In addition, straight tube 302 and inner core body 303 and nozzle 102 with the quantity of required jet flow ripple or the quantity of jet flow ripple kind, are arranged in the soft solder groove 101.
In Fig. 9 and example shown in Figure 10, in order in a soft solder groove 101, to form three kinds of jet flow ripples, and be provided with three kinds of nozzles 102.In addition, with its position configuration on the desired position.But, straight tube 302, inner core body 303 and the nozzle 102 of one or requirement also can respectively be set in a plurality of soft solder grooves 101.
In addition, the outside at each straight tube 302, be inserted with driving body 301 with the mode ring that can rotate and can plug, described driving body 301 be formed with and each inner core body 303 between produce the outside core body 301a of shifting magnetic field and shifting magnetic field and produce and use coil 301b.
In Fig. 9 and example shown in Figure 10, be the structure that on the bottom land 101a of soft solder groove 101, is provided with ALIP type electromagnetic pump 300, but also can be the structure that ALIP type electromagnetic pump 300 is set on the sidewall of soft solder groove 101.That is to say, hole 108 is set on the sidewall of soft solder groove 101, in this installing hole 108, straight tube 302 is set.And, also can followingly constitute, promptly, in this straight tube 302, insert inside core body 303 with reverse stream 304, pipe by " L " font or pipeline should inside core body 303 reverse stream 304 be communicated with the inflow entrance 107 of nozzle 102, will supply to nozzle 102 from the soft solder that above-mentioned reverse stream 304 is sent.
In this case, because the straight tube 302 of ALIP type electromagnetic pump 300 is to be provided with along side laterally outwardly from the sidewall of soft solder groove 101, so, as long as driving body 301 rings are inserted on this horizontal straight tube 302.
By this driving body 301 (outside core body 301a and shifting magnetic field produce coil 301b) ring is inserted in the outside of straight tube 302, between straight tube 302 and inner core body 303, form stream 305, pass the reverse stream 304 of inner core body 303 and be fed into nozzle 102 from the flow of molten solder 100 that this stream 305 is sent.
In the present invention, need not to make the quantity " Ns " of straight tube 302 consistent, in the scope of " Ns 〉=Md ", use with the quantity " Md " of driving body 301.That is, only encircling slotting driving body 301 on the straight tube 302 of needs formation jet flow ripple uses.Thereby it also can be a plurality of that the quantity of driving body 301 can be one, usually, because it is less to form the chance of whole jet flow ripples simultaneously, so, also be the driving body 301 that the quantity of nozzle 102 is lacked as long as prepare quantity than the quantity of straight tube 302.
In the example of Fig. 9, be following structure, that is,, be provided with nozzle 102 just being welded on the corresponding position of installation portion with the lead 502 of the lead-type electronic component 501 that is equipped on printed circuit board 500.And, a driving body 301 is changed ring insert (changing slotting) to each corresponding straight tube 302, form the jet flow ripple successively, carry out each by the crest solder of weldering portion.Reference numeral 503 is chip-type electronic components, in illustrated embodiment, has finished solder by other refluxing soft soldering apparatus.
The ring of this plug driving body 301 is freely inserted and is changed slotting, the conveying mechanism (three not shown automatons) that can constitute by the actuator of going up the combination Z-direction at X-Y actuator (horizontal X-Y flatbed actuator) carries out (if only be to switch, then can manually be carried out by the operator) automatically.
By these three conveying mechanisms (three not shown automatons) are set, and in its controller (computer system), its ring is inserted sequential programming in advance, can carry out from moving slotting.If adopting and making driving body is an actuator of core rotation with the Z axle, and uses the conveying mechanism of four axle construction, then can when changing of above-mentioned driving body inserted, make the driving body rotation, thereby can when improving close property, obtain desirable Distribution of Magnetic Field, make thrust stable.
Therefore, connect with the mode that can communicate controller and control device 203 above-mentioned conveying mechanism (three not shown automatons) more than three, and control, make that only at the controller of above-mentioned conveying mechanism more than three changing of driving body 301 being inserted this message of end sends under the situation of control device 203,301 power supplies of 203 pairs of driving bodies of control device, thus, can insert with changing of driving body 301 and form the jet flow ripple accordingly successively.
Such as mentioned above, the fusing point that employed soft solder is installed in solder is according to the kind of soft solder and different.
Thereby, because the kind difference of employed soft solder, so carrying out welded piece, be the solder of printed circuit board when installing, the temperature difference of the soft solder of use.
Based on such reason,, also exist difference to change the situation that the soft solder kind is carried out the solder installation according to quilt weldering portion even in a printed circuit board.In such soldering system, in a plurality of soft solder grooves, take in different soft solders respectively, form the jet flow ripple with different types of soft solder.
Like this, be used for using the soldering system of multiple soft solder,, can have realized effective utilization of high price electromagnetic pump even the kind difference of soft solder also can use identical driving body to form the jet flow ripple by technology with present embodiment.Therefore, generator at an easy rate, and carrying out improving its productivity ratio when high-quality solder is installed.
In above-mentioned the 3rd to the 5th execution mode, also preferred and first, second execution mode in the same manner, with permeability is the diapire of the iron formation soft solder groove 101 more than 100 times of flow of molten solder 100, and, make its permeability for more than the permeability of this inside core body 303, making its thickness is that this inside core body is more than 303, but, the leakage field of electromagnetic pump 300 can corresponding solder printed circuit board situation about impacting under, the diapire of soft solder groove 101 also can be such in the past structure.
More than show a kind of execution mode, still, the present invention also can obtain as for example execution mode of system, device, method, program or storage medium etc.Specifically, both can be used for the system that constitutes by a plurality of machines, also can be used for the device that constitutes by a machine.
Such as mentioned above, be that the storage medium that stores the software program code of realizing above-mentioned execution mode function is supplied with to system or device.Certainly, read and carried out, also can reach purpose of the present invention by the program code that the computer (or CPU or MPU) by this system or device will be stored in the storage medium.
In this case, realize new function of the present invention, thereby the storage medium that stores this program code constitutes the present invention by the program code of reading from storage medium itself.
Industrial applicibility
Soft soldering apparatus of the present invention is the device that uses when being installed in the electronic component solder on the printed circuit board.According to the present invention, can shorten safeguarding idle hours of soft soldering apparatus, realize can not applying solder installation influence, high reliability of leakage field or the diffusing electric current of fan to electronic component with higher productivity ratio.
In addition,, can shorten safeguarding idle hours and starting time of soft soldering apparatus, can realize the peculiar high-quality solder installation of electromagnetic pump safely with higher productivity ratio according to the present invention.
In addition, switching under the situation of using multiple jet flow ripple, or forming on the diverse location under the situation of a plurality of jet flow ripples, can be with low-cost constituent apparatus.
In addition, can utilize a driving body freely to change the position that forms the jet flow ripple, be used thereby also can be used as local soft soldering apparatus (spot welding device).
Claims (7)
1. the soft soldering apparatus of a printed circuit board comprises:
Soft solder groove (101) is taken in flow of molten solder (100), possesses the diapire (101a) that is provided with opening (108);
Nozzle (102), be mounted in the soft solder groove (101) and an end has first opening (103) and the other end has the nozzle (102) of second opening (107), this first opening (103) is arranged in the liquid level top of the flow of molten solder (100) that is accommodated in soft solder groove (101); And
Electromagnetic pump (300);
This electromagnetic pump (300) is the combination of straight tube (302), inner core body (303), coil (301b) and outside core body (301a),
Described straight tube (302), the openend (302b) that has the end (302a) of sealing and be positioned at its opposition side and link with described opening (108), the flow of molten solder (100) of soft solder groove (101) can flow in this straight tube (302),
Described inner core body (303), it is the inner core body (303) of tubular that forms soft solder return path (304) in inside, be configured in this straight tube (302), between forms the soft solder stream (305) of ring-type, and, have the upper opening (303a) that links with second opening (107) of this nozzle (102) and with the opposed lower openings of closed end (302a) (303b) of this straight tube (302)
Described coil (301b) and described outside core body (301a) dispose in the mode of surrounding this straight tube (302), can be encouraged with electric means,
At this coil (301b) when being energized, in this soft solder stream (305), form moving field, its result, flow of molten solder (100) flows downwards along this soft solder stream (305), flow upward along return path (304) then, from first opening (103) jet flow of this nozzle (102), form the soft solder ripple in the top of first opening (103);
This diapire (101a) be the iron formation more than 100 times of flow of molten solder (100) by permeability, and its permeability is more than the permeability of this inside core body (303), and its thickness is more than the thickness of this inside core body (303).
2. soft soldering apparatus as claimed in claim 1 is characterized in that, diapire (101a) and inner core body (303) all are cast iron.
3. soft soldering apparatus as claimed in claim 1 is characterized in that, the inwall of soft solder groove (101) is coated by the corrosion resistance insulating barrier that thickness is at least 30 μ m, and the whole surface of inner core body 303 is coated by the corrosion resistance insulating barrier that thickness is at least 30 μ m.
4. soft soldering apparatus as claimed in claim 1, it is characterized in that, also have heater (109) and controlling organization (203), described heater (109) heats the soft solder in the described soft solder groove (101), and described controlling organization (203) control is supplied with the electric power of the coil (301b) of described heater (109) and described electromagnetic pump (300);
Described controlling organization (203), soft solder (100) in making described soft solder groove (101) from the state that solidifies when the state-transition of fusion, the electric power that the described heater of subtend (109) is supplied with and control to the electric power that the coil (301b) of described electromagnetic pump (300) is supplied with, before making that the fusion of the soft solder (100) in straight tube (302) begins, the fusion of the soft solder (100) in the described soft solder groove (101) begins, and, when the fusion of the soft solder (100) in straight tube (302) is finished, perhaps before it was finished, the fusion of the soft solder (100) in the described soft solder groove (101) was finished.
5. soft soldering apparatus as claimed in claim 4, it is characterized in that, described controlling organization (203) has storing mechanism (206), described storing mechanism (206) the storage first power supply information and the second power supply information, the described first power supply information representation and the relevant information of supplying with to described heater (109) of electric weight, described electric weight is to make the soft solder in the described soft solder groove (101) be converted to the required electric weight of molten condition from solid state, the described second power supply information representation and the relevant information of supplying with to coil (301b) of electric weight, described electric weight is that the soft solder (100) in the described straight tube (302) is carried out induction heating and makes the soft solder in the described straight tube (302) be converted to the required electric weight of molten condition
Described control device (203), during the state of the soft solder (100) in making described soft solder groove (101) from the state-transition of solidifying to fusion, the electric power that the described heater of subtend (109) is supplied with and control to the electric power that the coil (301b) of described electromagnetic pump (300) is supplied with, so that finish the electric power of amount by the described second power supply information specifies in the supply of the coil (301b) of described electromagnetic pump (300), or before it is finished, finish electric power by the amount of the described first power supply information specifies to the supply of described heater (109).
6. soft soldering apparatus as claimed in claim 5, it is characterized in that, the described first power supply information is the information of accumulative total electric weight that expression supplies to the electric power of described heater (109), described accumulative total electric weight be make soft solder in the described soft solder groove from the state-transition of solidifying to the required electric weight of the state of fusion
The described second power supply information is the information of accumulative total electric weight that expression supplies to the electric power of coil (301b), and described accumulative total electric weight is that the soft solder (100) in the described straight tube (302) is carried out induction heating and makes soft solder (100) in the described straight tube (302) be transformed into the required electric weight of state of fusion.
7. soft soldering apparatus as claimed in claim 4, it is characterized in that, described controlling organization constitutes, during the state of the soft solder (100) in making described soft solder groove (101), form the moving field that flow of molten solder (100) is flowed upward along soft solder stream (305) from the state-transition of solidifying to fusion.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005282015 | 2005-09-28 | ||
| JP2005282013 | 2005-09-28 | ||
| JP2005282012 | 2005-09-28 | ||
| JP2005282012A JP2007090379A (en) | 2005-09-28 | 2005-09-28 | Soldering apparatus, and method for starting soldering apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1946269A true CN1946269A (en) | 2007-04-11 |
Family
ID=37976656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610159583 Pending CN1946269A (en) | 2005-09-28 | 2006-09-28 | Soldering apparatus |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2007090379A (en) |
| CN (1) | CN1946269A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101767239A (en) * | 2008-12-27 | 2010-07-07 | 千住金属工业株式会社 | Solder bath and method of heating solder contained in a solder bath |
| CN102133669A (en) * | 2011-01-26 | 2011-07-27 | 宁波江丰电子材料有限公司 | Welding method for target and back plate |
| CN105364253A (en) * | 2015-12-02 | 2016-03-02 | 上海大学 | Tin spraying pond of wave soldering machine with adjustable wave peak positions and heights |
| CN114174678A (en) * | 2019-05-09 | 2022-03-11 | 伊克斯拉姆公司 | X-ray source with electromagnetic pump |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003275867A (en) * | 2002-03-19 | 2003-09-30 | Nihon Dennetsu Keiki Co Ltd | Soldering wave forming device |
| JP3936677B2 (en) * | 2003-06-19 | 2007-06-27 | 株式会社タムラ製作所 | Jet soldering equipment |
| JP2005205479A (en) * | 2004-01-26 | 2005-08-04 | Toshiba Corp | Soldering machine |
-
2005
- 2005-09-28 JP JP2005282012A patent/JP2007090379A/en active Pending
-
2006
- 2006-09-28 CN CN 200610159583 patent/CN1946269A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101767239A (en) * | 2008-12-27 | 2010-07-07 | 千住金属工业株式会社 | Solder bath and method of heating solder contained in a solder bath |
| CN102133669A (en) * | 2011-01-26 | 2011-07-27 | 宁波江丰电子材料有限公司 | Welding method for target and back plate |
| CN105364253A (en) * | 2015-12-02 | 2016-03-02 | 上海大学 | Tin spraying pond of wave soldering machine with adjustable wave peak positions and heights |
| CN114174678A (en) * | 2019-05-09 | 2022-03-11 | 伊克斯拉姆公司 | X-ray source with electromagnetic pump |
| CN114174678B (en) * | 2019-05-09 | 2023-04-28 | 伊克斯拉姆公司 | X-ray source with electromagnetic pump |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007090379A (en) | 2007-04-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100351514C (en) | Starter with overheat protection device | |
| CN1220570C (en) | Jointed metallic parts and parts jointing method | |
| CN1145082C (en) | Image heating device | |
| CN1234311A (en) | Joined metal member and method of joining said member | |
| CN1946269A (en) | Soldering apparatus | |
| EP2618086B1 (en) | Cold crucible induction melter integrating induction coil and melting furnace | |
| CN1643986A (en) | Induction heating apparatus | |
| CN1786228A (en) | Vacuum smelting technology of hafnium containing nickel base casting high temperature alloy K488 reverse material alloy | |
| CN1367410A (en) | Induction heating roller device, heating roller, photographic fixing equipment and imaging device | |
| CN1790880A (en) | Method and system for applying an isolation layer to a brazed end of a generator armature winding bar | |
| CN1795279A (en) | Apparatus for manufacturing compacted irons of reduced materials comprising fine direct reduced irons and apparatus for manufacturing molten irons using the same | |
| CN106513941A (en) | Molten bath stirring and soldering wire preheating integrated method used for fuse surfacing | |
| CN1083889C (en) | Method for reducing iron oxides and smelting iron and installations thereof | |
| CN1494149A (en) | Electronic apparatus | |
| CN1621961A (en) | Fixing device | |
| CN1535191A (en) | Metal ring assembly which is assembled and soldered to support collar in order to form annular cooling conduit of IC engine piston, method of producing said finned metal ring and metal ring thus | |
| CN1256005C (en) | Induction heater | |
| CN1726114A (en) | Aluminum alloy brazing material, brazing member, brazed article and brazinh method therefor using said material, brazing heat exchanging tube, heat exchanger and manufacturing method thereof using sai | |
| CN100340141C (en) | Manufacturing method of pin structural | |
| CN101050054A (en) | Vacuum deshydroxy method for quartz glass cell | |
| CN1711659A (en) | Fuel cell system | |
| CN1287518A (en) | Powder material for powder plasma overlaying and powder plasma overlaying metal | |
| CN1268457C (en) | Casting device and molten-metal supplying device | |
| CN1195599C (en) | Dual drum type continuous casting device and method for continuous casting | |
| CN1244253C (en) | Induction furnace |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |