JP2007090379A - Soldering apparatus, and method for starting soldering apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a soldering apparatus which can easily carry out the maintenance and change of an ALIP type electromagnetic pump, and further to provide a method for safely shortening the starting time of the soldering apparatus to be brought into an operating state after melting a solidified solder. <P>SOLUTION: An R-ALIP type electromagnetic pump 300 is provided outside a solder bath 101. A driving member 301 integratedly composed of an external core 301a and a moving magnetic field generating coil 301b is provided so as to be mounted and dismounted. In addition, when the soldering apparatus is started to transfer the solder in the solder bath 101 from the solidified state to the melted state, a control unit 203 supplies electric power to a heater 109 to heat a solder 100, and also carries out the induction heating of the solder in a thrust pipe 302 by supplying electric power to the moving magnetic field generating coil 301b, and further controls the electric power to be supplied to the heater 109 and the electric power to be supplied to the moving magnetic field generating coil 301b such that the solder in the thrust pipe 302 melts after the solder in the solder bath 101 has melted or simultaneously. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a soldering apparatus for performing soldering by bringing a solder wave, such as a printed wiring board, on which an electronic component is mounted, into contact with a solder wave, and soldering and mounting the electronic component on the printed wiring board. And a method for starting a soldering apparatus.

  The electromagnetic pump (LEP: linear electromagnetic pump) that generates thrust by directly applying electromagnetic force to the medium to be fed and generates pump thrust and suction force is roughly divided into an induction type. And conduction type. In general, there are many examples in which an induction type that does not require energization of a medium to be fed is used.

  The induction type electromagnetic pump is roughly classified into a flat linear type (FLIP type: flat linear induction pump), an annular linear type (ALIP type: annular linear induction pump), and a helical type (HIP type: helical induction pump). Each has its own configuration.

  As a technique of a jet wave forming apparatus for mounting electronic parts using an ALIP type electromagnetic pump, there is a technique of Patent Document 1. This technology is characterized in that the ALIP type electromagnetic pump itself can be operated and operated in the molten solder, energy loss is eliminated, and damage to electronic components is eliminated.

  As an example of the ALIP type electromagnetic pump, Patent Document 2 is a reference.

  Soldering equipment that uses an induction type electromagnetic pump has extremely good reproducibility and stability of parameters for feeding molten solder while maintaining stable jet flow of molten solder. This makes it possible to obtain a stable soldering quality.

  However, in the technique of Patent Document 1, since the ALIP type electromagnetic pump is provided in the solder, the electromagnetic pump must be pulled up in a state where the solder is melted when the electromagnetic pump is maintained or replaced. There was a problem.

  Therefore, as disclosed in Patent Document 3, it has been considered to provide this ALIP type electromagnetic pump outside the tank wall of the solder tank. As a result, the molten solder is sucked into the thrust generation flow channel that is located outside the tank wall of the solder tank, and then the molten solder to be discharged is fed into the solder tank. Maintenance and replacement of the located ALIP type electromagnetic pump became easy.

  On the other hand, in order to melt the solder in the solder bath and maintain it at a predetermined temperature, a heater for heating the solder, a temperature sensor, and a temperature control device are used, but the heat of melting of the solder is large. In addition, in the configuration in which the ALIP type electromagnetic pump of Patent Document 3 is provided outside the tank wall of the solder tank, the melting of the solder in the thrust generation flow path of the electromagnetic pump is completed even if the solder in the solder tank is melted. It takes a long time.

  For this reason, there arises a problem that the start preparation time from the start of the soldering apparatus to the formation of the jet wave becomes long.

Therefore, Patent Document 3 discloses that induction heating of the solder in the thrust pipe is performed in a state where a cap is provided at the blowing port and the blowing port is closed. In addition, if the temperature sensor detects that the solder in the thrust pipe has melted by performing the induction heating while hanging the temperature sensor from the cap and measuring the temperature of the solder in the thrust pipe, the power supply to the electromagnetic pump Is disclosed.
JP 2003-142819 A JP-A-5-260719 2005-205479

  However, in the technique of Patent Document 3, when the soldering apparatus is started or stopped, it is necessary to install or remove the cap on the air outlet, and the cap is removed when the solder melts. Since it is necessary to carry out after (220 ° C. to 260 ° C.), the operation is very dangerous. In addition, the work that hangs the cap with the temperature sensor hanging down in the thrust pipe and closes the blowing port requires the temperature sensor to hang down into the solder in the thrust pipe while the solder is melting. This must be done when the solder is melted immediately after the soldering operation is completed, and the operation of removing the cap with the temperature sensor hanging from the thrust pipe and removing the cap from the air outlet also melts the solder. It is necessary to carry out a very dangerous work twice.

  Further, in the technique of Patent Document 3, when only the solder located below in the solder bath is melted in a state where the solder in the solder bath is solidified, a strong expansion pressure is melted by the volume expansion due to the melting. It does not consider what happens to solder. That is, a gap such as a solder shrinkage nest (a nest generated by solidification shrinkage) of a solidified high-temperature solder having an explosive pressure or a gap formed between the thrust pipe or the inner core and the solidified solder (due to the solidification shrinkage) It does not take into consideration that a terrible phenomenon occurs in which a jet jet extending several meters from the generated gap) is ejected and sprayed to surrounding workers and devices. This is well known to those skilled in the art. In Patent Document 3, there is no means for screwing the cap into the air outlet, but this is meaningless because the cap is blown off by the jet jet.

  Even if the cap is provided by means such as screwing, a person skilled in the art must perform the work of providing a cap that closes the blowing port by such means and melting the solder below the solder bath. It is a bad act. This is because there is a danger that the molten solder becomes a jet jet as described above and attacks the worker during the work of removing the cap.

  The present invention has been made to solve the above-described problems. The object of the present invention is to allow the maintenance and replacement of the ALIP type electromagnetic pump to be easily performed and to melt the solidified solder. To provide a mechanism for safely shortening the start-up time of a soldering apparatus that must be brought into an operating state after that.

  The present invention is characterized by a configuration in which an ALIP type electromagnetic pump is provided in a solder bath and its power supply distribution.

  (1) Annular linear induction pump (ALIP type) An end of the thrust pipe of an electromagnetic pump is sealed and formed into a cap shape, and along the axis of the inner core inserted inside the thrust pipe By providing a reversal flow path, a thrust generation flow path is formed between the thrust pipe and the inner core, and a flow reversal type annular is formed by the thrust generation flow path and the reversal flow path. Linear type (R-ALIP type: return through type annular linear induction pump) The thrust pipe of the electromagnetic pump is provided on the tank wall of the solder tank, and the reversing flow path and the air outlet of the inner core in which the reversing flow path is formed A soldering device that is connected to a body inlet and forms a jet wave of molten solder on the outlet of the blowing body, and further detects the temperature of the solder and the heater that heats and melts the solder in the solder bath Temperature A temperature control device connected to the heater and the temperature sensor, a multiphase AC power supply device that supplies power to the moving magnetic field generating coil of the electromagnetic pump, the temperature control device, and the multiphase AC In a soldering device having a control device for controlling a power supply device, power distribution is controlled as follows.

  That is, when the solder in the solder bath is shifted from the solidified state to the molten state and started, power is supplied to the heater to heat the molten solder, and the moving magnetic field generating coil of the electromagnetic pump is used. In addition, the electric power is supplied and the solder in the thrust pipe is induction-heated together, and the ratio of the electric power supplied to the heater and the electric power supplied to the moving magnetic field generating coil of the electromagnetic pump is determined by the solder in the solder bath. This is a starting method of a soldering apparatus that controls the ratio so that the solder in the thrust pipe is melted after (or at the same time).

  Thereby, it becomes possible to supply heat energy to the solder in the thrust pipe with less heat energy conduction from the heater, and the start-up time of the soldering apparatus can be shortened. And since the melting of the solder is controlled so that the solder in the thrust pipe is melted in the order after the solder in the solder bath is melted (or simultaneously), the volume expansion due to the melting of the solder in the thrust pipe This molten solder does not cause a jet jet (which may reach a height of several meters) from a solidified solder gap (a gap due to a shrinkage nest or the like) in the solder bath, and can be started safely.

  (2) In the starting method of the soldering apparatus of (1), the thrust direction when power is supplied to the moving magnetic field generating coil of the electromagnetic pump is opposite to the direction in which the molten solder is jetted from the blowing port. It is the starting method of the soldering apparatus which is direction.

  As a result, the molten solder fed by the thrust during induction heating is not directed in the direction of the blowing port, so that it is possible to completely prevent the jet flow of the molten solder as described above. become.

  According to the present invention, since the ALIP type electromagnetic pump is provided outside the solder bath, the moving magnetic field generating coil is provided in a particularly detachable manner, so that the operation and maintenance of the electromagnetic pump can be easily performed. Will be able to.

  In addition, the time from melting the solidified solder to the operation state can be significantly and safely shortened.

  Accordingly, the maintenance time and the start-up time are shortened, and the productivity of soldering mounting can be greatly increased.

[First Embodiment]
Hereinafter, a configuration example of the soldering apparatus and an example of a starting method in the present invention will be described.

  FIG. 1 is a diagram for explaining an example of the configuration of the soldering apparatus according to the first embodiment of the present invention, in which a solder bath portion is shown in a longitudinal section, and the configuration of a control system is shown in a block diagram.

  FIG. 2 is a perspective view for explaining the entire soldering apparatus of the present invention.

  FIG. 3 shows a thrust pipe provided in a solder tub of the soldering apparatus of the present invention, an inner core inserted into the thrust pipe, an external core detachably provided in the thrust pipe, and insertion / extraction of a moving magnetic field generating coil. It is a disassembled perspective view explaining a relationship. 1 to 3, the same components are denoted by the same reference numerals.

[Hardware configuration]
First, the hardware configuration of the soldering apparatus according to the first embodiment of the present invention will be described with reference to FIGS.

  101 is a solder bath. A heater 109 is provided in the solder bath 101 along the bath bottom and bath wall, and the solder 100 accommodated in the solder bath 101 is heated and melted to be maintained at a target temperature. Has been.

  Reference numeral 201 denotes a temperature control device that controls the temperature of the solder 100. This temperature control device 201 is a mechanism for referring to the temperature detection result of the temperature sensor 106 and controlling the power supplied to the heater 109 so that the temperature of the solder 100 becomes a temperature instructed in advance.

  A thrust pipe 302 of the ALIP type electromagnetic pump 300 is provided in the thrust pipe mounting hole 108 at the bottom of the solder tank 101. The thrust pipe 302 is attached to the thrust pipe mounting hole 108 at the bottom of the tank by a method such as welding or screwing.

  In addition, a pipe-like inner core 303 having a reversing flow path 304 at its central axis is inserted into the thrust pipe 302 so as to be freely inserted and removed. And it is comprised so that the inversion flow path 304 of this inner core 303 and the inflow port 107 of the blowing body 102 may connect.

  The blower body 102 has a current plate 105 that regulates the flow of molten solder inside, and the blower opening 103 is located on the solder liquid surface. That is, when molten solder is jetted from the blowing port 103, a jet wave 110 is formed on the blowing port and flows down the guide plate 104 provided adjacent to the blowing port 103.

  The inner core 303 and the blower body 102 are fixed to the solder bath 101 so as to be attachable / detachable by support means (not shown).

  In addition, on the outside of the thrust pipe 302, a driving body 301 in which an outer core 301a for generating a moving magnetic field between the inner core 303 and a moving magnetic field generating coil 301b is integrally formed can be rotated and inserted / removed. Is provided. The driving body 301 (the outer core 301a and the moving magnetic field generating coil 301b) forms a thrust generating flow path 305 between the thrust pipe 302 and the inner core 303, and the molten solder 100 delivered from the thrust generating flow path 305. Is fed to the blower body 102 through the reverse flow channel 304 of the inner core 303.

  In addition, by making the drive body 301 rotatable, the adhesion to the thrust pipe 302 can be improved, and the optimum magnetic field distribution can be selected to stabilize the thrust. The ALIP type electromagnetic pump 300 having this configuration is referred to as a flow-reversing type annular linear induction pump (R-ALIP type) electromagnetic pump.

  In addition, since the shape of the outer core 301a can form the column shape of the ALIP type | mold electromagnetic pump 300, the external appearance is also a column shape normally. Further, the inner core 303 is also cylindrical, and a moving magnetic field is generated in an annular space between the outer core 301a and the inner core 303, that is, a flow path. And generate suction force. Note that the ALIP type electromagnetic pump disclosed in Patent Document 1 shown in the [Background Art] column is called a straight-through type because the flow path in the pump is linear.

  This R-ALIP type electromagnetic pump (hereinafter collectively referred to as an ALIP type electromagnetic pump) is connected to a multiphase AC power supply device 202 (for example, a VVVF type three phase inverter power supply device), and generates multiphase AC power to generate a magnetic field of the electromagnetic pump. Is supplied to the coil 301b.

  Thus, in the present invention, as shown in FIG. 1, the ALIP type electromagnetic pump 300 is provided outside the bath wall of the solder bath 101, and the thrust generating flow that is located outside the bath wall of the solder bath 101 is provided. The molten solder was sucked into the passage 305, and then the molten solder to be discharged was fed into the solder bath. Therefore, the maintenance and replacement of the ALIP type electromagnetic pump 300 located outside the solder bath 101 are facilitated.

  The multiphase AC power supply device 202 has a configuration in which its output voltage, frequency, power, etc. are arbitrarily adjusted and controlled by communication with the control device 203.

  The control device 203 includes a computer system, and includes an instruction operation unit 204 such as a keyboard, a display unit 205 such as an LCD, and a CPU, ROM, RAM, hard disk, and the like (not shown). The CPU in the control device 203 can perform various controls by reading the program stored in the hard disk onto the RAM and executing it.

  The control device 203 is configured to control the operation of the above-described multiphase AC power supply device 202 according to an instruction from the instruction operation unit 204. In addition, the above-described temperature control device 201 is configured to be controlled by arbitrarily adjusting control characteristics such as power supplied to the heater 109, temperature, and PID through communication with the control device 203.

  Note that the melting point of solder varies depending on the type of solder. For example, in a conventionally used tin-lead solder (for example, 37% lead and the balance being tin), the temperature is about 183 ° C. Moreover, it is about 199 degreeC in the lead-free solder tin-zinc solder (for example, zinc 9% and remainder is tin). Furthermore, it is about 220 ° C. for tin-silver-copper solder (for example, about 3.5% silver, about 0.7% copper, and the balance being tin).

  Therefore, depending on the type of solder used, the temperature of the solder used when soldering and mounting the printed wiring board, which is the work to be soldered, varies, but the heat resistance temperature of the electronic components mounted on the printed wiring board is taken into consideration For this reason, there are most examples of being used in the range of about 220 ° C to 260 ° C.

[Starting control configuration]
Hereinafter, the starting operation control of the soldering apparatus according to the first embodiment of the present invention will be described.

  From the volume of solder in the solder bath 101, the specific heat of the solder, and the amount of heat of fusion, the amount of heat necessary for melting the solder in the solder bath 101 can be obtained. On the other hand, the amount of heat supplied from the heater 109 is obtained from the supplied power. From these, the time from the start of power supply to the heater 109 to the melting of the solder in the solder bath 101 can be obtained. If necessary, the ratio of the amount of heat released into the atmosphere is set to about several percent.

  Further, the amount of heat necessary for melting the solder in the thrust pipe 302 is obtained from the volume of the solder in the thrust pipe 302, the specific heat of the solder, and its heat of fusion, and the volume and specific heat of the inner core 303. On the other hand, the amount of induction heating due to the moving magnetic field generated by the electromagnetic pump 300 and thus the outer core 301a and the moving magnetic field generating coil 301b is the amount of power supplied to the ALIP type electromagnetic pump 300 and the induction heating efficiency (predetermined values determined by measurement). For example, about several tens of percent). Then, it is possible to obtain the time from the start of supplying power to the ALIP electromagnetic pump 300 until the solder 100 is melted. If necessary, the ratio of the amount of heat released into the atmosphere is set to about several percent.

  Therefore, the solder in the solder bath 101 is melted by dividing the total amount of heat necessary for melting the solder in the solder bath 101 and thus the total power by the amount of power supplied per unit time supplied to the heater 109. Can be obtained. On the contrary, the amount of power per unit time to be supplied to the heater 109 is obtained by dividing the total amount of heat necessary for melting the solder 100 in the solder bath 101 and thus the total amount of power by the target melting time. be able to.

  Similarly, by dividing the total amount of heat necessary for melting the solder in the thrust pipe 302 and thus the total amount of power by the value obtained by multiplying the amount of power supplied per unit time supplied to the electromagnetic pump by the induction heating efficiency, The time until the solder in the thrust pipe is melted can be obtained. Conversely, by dividing the total amount of heat necessary for melting the solder in the thrust pipe 302 and thus the total amount of electric power by the target melting time, and further dividing it by induction heating efficiency, The amount of power per unit time to be supplied can be obtained.

  Therefore, by using these calculation methods, after the solder in the solder bath 101 is melted (or at the same time), information (units) about the electric power supplied to the heater 109 so that the solder in the thrust pipe 302 is melted. (The amount of power per hour or the amount of accumulated power) and information on the power supplied to the electromagnetic pump 300 (the amount of power per unit time or the amount of accumulated power) are set in advance in the control device 203 from the instruction operation unit 204, It is stored as a data table in a hard disk (not shown).

  And when starting a soldering apparatus, CPU in the control apparatus 203 is comprised so that electric power supply control may be performed to the heater 109 and the electromagnetic pump 300 with reference to these data tables.

  A temperature sensor is provided in the solder pipe 101 in a region near the solder liquid level and in the thrust pipe 302, and the theoretical supply power calculated as described above is corrected by actual measurement. You may make it set to the control apparatus 203. FIG. This measurement is performed as follows. In other words, when the soldering device is started, the temperature of the solder rises toward its melting point, but since it is necessary to supply heat of melting at the melting point, the solder temperature remains constant at the melting point until all the solder is melted. Become. When all the solder is melted, the temperature of the molten solder rises again.

  Therefore, in this measurement, when the temperature of the solder starts to rise from the melting point, the time when the temperature sensor 106 in the region near the solder liquid level in the solder bath 101 detects that all the solder in the solder bath 101 is melted. It is the time. Further, when the temperature of the solder starts to rise from the melting point, the time when the temperature sensor in the thrust pipe 302 detects is the time when all the solder in the thrust pipe 302 is melted.

  That is, after the temperature of the solder in the solder bath 101 starts to rise from the melting point, information about the power supplied to the heater 109 (for example, unit time) so that the temperature of the solder in the thrust pipe 302 starts to rise from the melting point. And the information related to the power supplied to the electromagnetic pump 300 (for example, the power amount per unit time or the integrated power amount) may be set in the control device 203. The time difference between the two is safe if it is around 10 minutes, but may be simultaneous. Further, the start time can be minimized by programming the control of the control device 203 so that both are simultaneously performed. Note that the temperature sensor provided in the thrust pipe 302 is disposed in the thrust pipe 302 only for the above-described measurement for performing the above-described correction, and is provided when soldering the workpiece to be soldered (arrangement). Is not).

  As described above, information related to the power supplied to the heater 109 (for example, power amount per unit time or integrated power amount) and information related to the power supplied to the electromagnetic pump 300 (for example, power amount per unit time or integrated power amount). And the like are set in the control device 203 and controlled to cause the solder to be pre-melted and expanded in the lower layer portion of the solidified solder, and this expansion pressure causes the molten solder to jet from a slight gap. It is possible to eliminate the occurrence of a dangerous state.

  In this way, after the soldering apparatus is started, the molten solder reaches a predetermined temperature and is maintained at that temperature. In this state, soldering of a work to be soldered such as a printed wiring board can be started.

  Then, if electric power is supplied to the ALIP electromagnetic pump 300 to generate thrust, molten solder is sucked into the thrust generation flow path 305 from the solder layer 101 as shown by an arrow A in FIG. After the flow direction is reversed at the tip and sent to the reverse flow path 304 in the inner core 303, the flow is fed to the blower body 102, and the flow is adjusted by the rectifying plate 105, and then jetted from the blower 103. Thus, the jet wave 110 is formed.

  It should be noted that the thrust direction at the time of starting (that is, when the reversal flow path 304 in the thrust pipe 302 is induction-heated) is formed as shown by the broken line arrow B in FIG. In the opposite direction, it becomes possible to more reliably eliminate the dangerous state in which the molten solder described above generates a jet jet. That is, as shown in FIG. 1, since the blower body 102 is covered with the electromagnetic pump 300, the jet of molten solder is blocked by the presence of the blower body 102.

  Hereinafter, with reference to the flowchart of FIG. 4, the control processing operation at the time of starting in the soldering apparatus of this invention is demonstrated.

  FIG. 4 is a flowchart showing an example of the control processing operation at the first start in the soldering apparatus of the present invention. Note that the processing in this flowchart is realized by the CPU in the control device 203 reading a program stored in the hard disk on the RAM and executing it. In FIG. 4, S101 to S103 indicate each step.

  First, when the starting process is started, the CPU of the control device 203 reads setting data from the data table in the hard disk into the RAM in step S101. The setting data is set in advance from the instruction operation unit 204 by the user. Specifically, the setting data includes information on power supplied to the heater 109 (for example, power amount per unit time or integrated power amount) and information on power supplied to the moving magnetic field generating coil 301b of the electromagnetic pump 300. (For example, electric energy per unit time or integrated electric energy). Here, the integrated power amount (first integrated power amount) supplied to the heater 109 as setting data and the integrated power amount (second integrated power amount) supplied to the moving magnetic field generating coil 301b of the electromagnetic pump 300 are set. ) Will be described below. This setting data is obtained in advance by actual measurement as described above, for example.

  Next, in step S102, the CPU of the control device 203 supplies power to the heater 109 based on the integrated power amount (first integrated power amount) supplied to the heater 109 in the setting data read in step S101. The temperature control device 201 is controlled so as to be controlled. Further, the CPU of the control device 203 determines the electromagnetic pump 300 based on the integrated electric energy (second integrated electric energy) supplied to the moving magnetic field generating coil 301b of the electromagnetic pump 300 in the setting data read in step S101. The multiphase AC power supply device 202 is controlled so as to control the power supply to the moving magnetic field generating coil 301b.

  At this time, the CPU of the control device 203 uses the electric power supplied to the heater 109 and the electromagnetic wave so that the solder in the thrust pipe 302 is melted after the solder in the solder bath 101 is melted (or simultaneously). The power supplied to the moving magnetic field generating coil 301b of the pump 300 is controlled. That is, the CPU of the control device 203 determines that the integrated amount of power supplied to the moving magnetic field generating coil 301b of the electromagnetic pump 300 after the integrated amount of power supplied to the heater 109 reaches the first integrated power amount. It is assumed that control is performed so as to reach the second integrated power amount (or at the same time).

  The CPU of the control device 203 may control the electric power supplied to the heater 109 and the electric power supplied to the moving magnetic field generating coil 301b of the electromagnetic pump 300 to be constant power, You may control so that it may change in time series and may not become constant. For example, control may be performed so that a large amount of power is supplied at the beginning, and a small amount of power is supplied to the beginning as the accumulated power amount is approached. Further, the start of power supply to the heater 109 and the start of power supply to the moving magnetic field generating coil 301b of the electromagnetic pump 300 may be performed simultaneously, or control may be performed with a time difference.

  That is, when the CPU of the control device 203 shifts from the solidified state of the solder 100 in the solder bath 101 to a molten state and starts the operation, the power is supplied to the heater 109 to heat the solder and electromagnetic Electric power is also supplied to the moving magnetic field generating coil 301b of the pump 300 to perform induction heating of the solder in the thrust pipe 302, so that electric power is supplied to the heater 109 and to the moving magnetic field generating coil 301b of the electromagnetic pump 300. The power supply may be controlled by any method as long as the power supply is controlled so that the solder in the thrust pipe is melted or at the same time the solder in the thrust pipe is melted. All controls are included in the present invention.

  Next, in step S103, the CPU of the control device 203 determines whether or not the integrated amount of power supplied to the moving magnetic field generating coil 301b of the electromagnetic pump 300 has reached the second integrated power amount. Then, the CPU of the control device 203 continues the moving magnetic field of the heater 109 and the electromagnetic pump 300 until the integrated amount of the electric power supplied to the moving magnetic field generating coil 301b of the electromagnetic pump 300 reaches the second integrated electric energy. The power supply to the generating coil 301b is controlled (S102).

  When the CPU of the control device 203 determines in step S103 that the integrated amount of power supplied to the moving magnetic field generating coil 301b of the electromagnetic pump 300 has reached the second integrated power amount, the control is performed. The CPU of the apparatus 203 ends the start process of this flowchart, and shifts the state of the soldering apparatus from the start mode to the operation mode.

  In this flowchart, the first and second integrated power amounts and the like are set in the control device 203 as setting data, and the heater 109 and the electromagnetic pump 300 are supplied based on the first and second integrated power amounts. The power supply is controlled so that the power supplied to the electromagnetic pump 300 reaches the second integrated power after the power supplied to the heater 109 supplies the first integrated power (or at the same time). The configuration to be controlled is shown in However, the controller 203 is supplied with the power amount per unit time (first power amount) supplied to the heater 109 as setting data and the power amount per unit time (second power amount) supplied to the electromagnetic pump 300. The control device 203 simply supplies the electric power based on the first and second electric energy to the heater 109 and the electromagnetic pump 300, respectively. The configuration may be such that the power amount supplied to the electromagnetic pump 300 reaches the second cumulative power amount after supplying the one cumulative power amount (or at the same time).

  As described above, according to the soldering apparatus of this embodiment, the ALIP type electromagnetic pump 300 is provided outside the solder tank 101, and in particular, the moving magnetic field generating coil 301b is provided so as to be freely inserted and removed. Operations such as maintenance and replacement of the pump can be easily performed.

  Furthermore, when the solder 100 in the solder bath 101 is shifted from a solidified state to a molten state and started, power is supplied to the heater 109 to heat the solder and the electromagnetic pump 300 generates a moving magnetic field. Electric power is also supplied to the coil 301b to perform induction heating of the solder in the thrust pipe 302, and power supply to the heater 109 and power supply to the moving magnetic field generating coil 301b of the electromagnetic pump 300 are performed in the solder bath 100. Since the solder is controlled so that the solder in the thrust pipe is melted in the order after the solder in the fuse melts or at the same time, the time from melting the solidified solder to the operation state can be significantly and safely reduced. Can do.

  Accordingly, the maintenance time and start-up time are shortened, and the productivity of soldering mounting can be greatly increased.

  Although not shown, an auxiliary heater is provided outside the tip of the thrust pipe where the flow direction of the molten solder is reversed, and this is combined with induction heating of the solder in the thrust pipe when starting the soldering device. Heating with an auxiliary heater may be performed.

  In addition, when soldering and mounting a printed wiring board using a soldering device, when the type of the printed wiring board is changed, that is, when the type of soldering is changed, or during a production break, etc. In some cases, the solder jet stops. In the case of such a temporary suspension of the soldering apparatus, in order to prevent the temperature of the solder in the thrust pipe from lowering, power is supplied to the electromagnetic pump so that the solder does not flow and induction heating of the solder is performed. It is good to control as follows. Alternatively, power may be supplied to the auxiliary heater.

[Second Embodiment]
Hereinafter, with reference to FIG. 5, the structure of the soldering apparatus which shows 2nd Embodiment of this invention is demonstrated.

  FIG. 5 is a diagram for explaining an example of the configuration of the soldering apparatus according to the second embodiment of the present invention, in which the solder tank portion is shown in a longitudinal section, and the configuration of the control system is shown in a block diagram. In addition, the same code | symbol is attached | subjected to the same thing as FIG. Further, the difference between the configuration of this embodiment and the configuration of the first embodiment shown in FIG. 1 is that the bath of the solder bath 101 is used in order to increase the volume of the solder bath without changing the maximum size of the soldering apparatus. The recess 111 is provided so that the driver 301 (the outer core 301a and the moving magnetic field generating coil 301b) can be fitted into the bottom.

  Further, with such a configuration, heat loss generated in the electromagnetic pump 300 is not only from the thrust generation flow path 305 but also from the driving body 301 (the external core 301a and the moving magnetic field generating coil 301b) and the solder tank 101 and the inside thereof. It is possible to directly conduct to the solder 100 and to increase the overall energy efficiency as seen in the entire soldering apparatus.

  By increasing the volume of the solder bath 101 and increasing the amount of solder accommodated, it becomes possible to reduce the amount of decrease in the solder temperature when the work to be soldered comes into contact with the jet wave. There is an advantage that the solder temperature can be stably maintained during production.

  In this embodiment, a drain 306 (drain opening 307, on-off valve 308) is provided at the lower end of the thrust pipe 302. This is for discharging the solder in the solder bath through the thrust pipe 302. When the drain is executed (when the on-off valve 308 is opened and the solder is discharged from the drain opening), the electromagnetic pump 300 is operated, so that the discharge of the solder can be accelerated by the thrust.

  Although one embodiment has been described above, the present invention can take an embodiment as a system, apparatus, method, program, storage medium, or the like. Specifically, the present invention may be applied to a system composed of a plurality of devices, or may be applied to an apparatus composed of a single device.

  As described above, a recording medium that records a program code of software that implements the functions of the above-described embodiments is supplied to a system or apparatus. It goes without saying that the object of the present invention can also be achieved by the computer (or CPU or MPU) of the system or apparatus reading and executing the program code stored in the storage medium.

  In this case, the program code itself read from the storage medium realizes the novel function of the present invention, and the storage medium storing the program code constitutes the present invention.

  The present invention is not limited to the above embodiments, and various modifications (including organic combinations of the embodiments) are possible based on the spirit of the present invention, and these are excluded from the scope of the present invention. is not. Moreover, all the structures which combined each embodiment mentioned above and its modification are also included in this invention.

  As described above, the soldering apparatus of the present invention is characterized by the configuration in which the ALIP type electromagnetic pump 300 is provided outside the tank wall of the solder tank 101 and its power supply distribution.

  First, one end of an annular linear induction pump (ALIP type) electromagnetic pump thrust pipe 302 is sealed to form a cap shape, and the shaft core of the inner core 303 inserted inside the thrust pipe 302 is used. Is provided between the thrust pipe 302 and the inner core 303, and the thrust generation flow path 305 and the reversal flow path 304 feed the thrust flow path 305. A thrust pipe 302 of a flow reversal type annular linear induction pump (R-ALIP type) electromagnetic pump 300 having a flow path is provided on the tank wall of the solder tank 101, and the reverse flow path The reversing flow path 304 of the inner core 303 formed with 304 and the inflow port 107 of the blower body 102 are connected to each other, and molten solder is sprayed onto the blower port 103 of the blower body 102. In the soldering apparatus for forming the wave 110, the solder bath 101 is further provided with a heater 109 for heating and melting the solder and a temperature sensor 106 for detecting the temperature of the solder. The temperature control device 201 connected to the sensor 106, the multiphase AC power supply device 202 that supplies power to the moving magnetic field generating coil 301b of the electromagnetic pump 300, the temperature control device 201, and the multiphase AC power supply device 202 are controlled. In the soldering apparatus having the control device 203, power distribution is controlled as follows.

  That is, when starting the solder in the solder bath 101 from the solidified state to the molten state, the moving magnetic field of the electromagnetic pump 300 is supplied together with the electric power supplied to the heater 109 to heat the molten solder. Electric power is also supplied to the generating coil 301 b to perform induction heating of the solder in the thrust pipe 302, and the amount of electric power supplied to the heater 109 and the electric power supplied to the moving magnetic field generating coil 301 b of the electromagnetic pump 300. The ratio of the quantity is controlled to be the ratio in the order in which the solder in the thrust pipe 302 is melted after the solder in the solder bath 101 is melted or simultaneously.

  With this soldering device start control (starting method), it becomes possible to supply heat energy to the solder in the thrust pipe with less heat energy conduction from the heater, thereby shortening the start time of the soldering device. Will be able to. In addition, since the melting of the solder is controlled so that the solder in the thrust pipe is melted in the order after the solder in the solder bath is melted or at the same time, the molten solder is melted by the volume expansion due to the melting of the solder in the thrust pipe. However, it is possible to start safely without causing a jet jet (which may reach a height of several meters) from a solidified solder gap (a gap due to a shrinkage nest or the like) in the solder bath.

  Furthermore, in the starting control (starting method) of the soldering apparatus having the above-described configuration, the thrust direction when power is supplied to the moving magnetic field generating coil 301b of the electromagnetic pump 300 is such that the molten solder is discharged from the blowing port 103 of the blowing body 102. The direction is opposite to the direction of jetting. As a result, the molten solder fed by the thrust during induction heating is not directed toward the blowing port 103 of the blowing body 102, and thus the molten solder jet can be completely prevented. become able to.

  Therefore, the maintenance time and the start-up time are shortened, and the start-up can be performed safely, and the productivity and safety of soldering mounting can be greatly improved.

  The soldering apparatus according to the present invention is used when an electronic component is soldered and mounted on a printed wiring board. According to the present invention, it is possible to shorten the maintenance downtime and the start-up time of the soldering apparatus, and it is possible to safely realize high-quality soldering mounting unique to the electromagnetic pump with high productivity.

It is a figure explaining an example of the composition of the soldering device which shows a 1st embodiment of the present invention. It is a perspective view explaining the whole picture of the soldering device of the present invention. The insertion / extraction relationship between the thrust pipe provided in the solder bath of the soldering apparatus of the present invention, the inner core inserted into the thrust pipe, the outer core provided detachably in the thrust pipe, and the moving magnetic field generating coil will be described. It is a disassembled perspective view. It is a flowchart which shows an example of the control processing operation at the time of the 1st starting in the soldering apparatus of this invention. It is a figure explaining an example of composition of a soldering device showing a 2nd embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Solder 101 Solder tank 106 Temperature sensor 109 Heater 201 Temperature control apparatus 202 Multiphase alternating current power supply device 203 Control apparatus 204 Instruction operation part 300 Inversion type ALIP type electromagnetic pump 301 Driver 301a Outer core 301b Moving magnetic field generating coil 302 Thrust pipe 303 Inner core 304 Reverse flow path 305 Thrust generation flow path

Claims (5)

The solder contained in the solder bath is heated and melted by a heater, and a discharge force is applied to the molten solder by an annular linear electromagnetic pump so that the molten solder is jetted from the nozzle of the nozzle body. A soldering device for performing soldering by bringing a wave into contact with a workpiece to be soldered,
The annular annular electromagnetic pump is configured so that one end of a thrust pipe of the annular linear electromagnetic pump is sealed into a cap shape, and the reverse flow is performed along the axis of the inner core inserted inside the thrust pipe. By providing a path, a thrust generating flow path is formed between the thrust pipe and the inner core, and a flow path reversal type annular is formed by the thrust generating flow path and the reversing flow path. A linear electromagnetic pump, and the thrust pipe is connected to a hole provided in a tank wall of the solder tank, and is provided in a reversing flow path provided in the inner core and the blower body. It is connected to the inflow port,
And a control means for controlling power supply to the moving magnetic field generating coil of the heater and the annular linear electromagnetic pump,
The control means moves the electromagnetic pump in addition to supplying power to the heater to heat the molten solder when starting the solder in the solder bath from the solidified state to the molten state. Power is also supplied to the magnetic field generating coil to cause induction heating of the solder in the thrust pipe, and power supplied to the heater and supply to the moving magnetic field generating coil of the electromagnetic pump A soldering apparatus characterized by controlling the electric power so that the solder in the thrust pipe is melted or simultaneously in the order in which the solder in the thrust pipe is melted. First supply power information indicating information related to power to be supplied to the heater, which is necessary for shifting the solder in the solder bath from a solidified state to a melted state, which is set in advance, and the thrust pipe Storage means for storing second supply power information indicating information related to the power supplied to the moving magnetic field generating coil necessary for inductively heating the solder to shift the solder in the thrust pipe to a molten state Have
Based on the first supply power information and the second supply power information stored in the storage means, the control means supplies power to the heater and a moving magnetic field generating coil of the electromagnetic pump. 2. The soldering apparatus according to claim 1, wherein the supply power is controlled so that the solder in the thrust pipe is melted in the order in which the solder in the solder bath is melted or simultaneously. 3. The first supply power information indicates an integrated power amount of power supplied to the heater necessary for shifting from a solidified state of the solder in the solder bath to a molten state,
The second power supply information is an integrated power amount of power supplied to the moving magnetic field generating coil necessary for inductively heating the solder in the thrust pipe to melt the solder in the thrust pipe. The soldering apparatus according to claim 2, wherein:   The control means is configured to control a thrust direction when supplying electric power to the moving magnetic field generating coil in the direction opposite to a direction in which the molten solder is jetted from the blowing port of the blowing body at the time of starting. The soldering apparatus according to claim 1, wherein the soldering apparatus is a soldering apparatus. The solder contained in the solder bath is heated and melted by a heater, and a discharge force is applied to the molten solder by an annular linear electromagnetic pump so that the molten solder is jetted from the blower port, and a jet formed on the blower port. A method for starting a soldering apparatus for performing soldering by bringing a wave into contact with a workpiece to be soldered,
The annular linear electromagnetic pump is configured so that one end of a thrust pipe of the annular linear electromagnetic pump is sealed to form a cap shape, and the flow is reversed along the axis of the inner core inserted inside the thrust pipe. By providing a path, a thrust generating flow path is formed between the thrust pipe and the inner core, and a flow path reversal type annular is formed by the thrust generating flow path and the reversing flow path. A linear electromagnetic pump, and the thrust pipe is connected to a hole provided in a tank wall of the solder tank, and is provided in a reversing flow path provided in the inner core and the blower body. It is connected to the inflow port,
When the solder in the solder bath is shifted from the solidified state to the molten state and started, power is supplied to the heater to heat the molten solder, and the coil for moving magnetic field generation of the electromagnetic pump is used. The electric power is also supplied to cause induction heating of the solder in the thrust pipe and the solder in the thrust pipe is melted or at the same time the solder in the thrust pipe is melted in the order. A method for starting a soldering apparatus, comprising: controlling power supplied to a heater and power supplied to a moving magnetic field generating coil of the electromagnetic pump.

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