CN105364253A - Tin spraying pond of wave soldering machine with adjustable wave peak positions and heights - Google Patents
Tin spraying pond of wave soldering machine with adjustable wave peak positions and heights Download PDFInfo
- Publication number
- CN105364253A CN105364253A CN201510871046.5A CN201510871046A CN105364253A CN 105364253 A CN105364253 A CN 105364253A CN 201510871046 A CN201510871046 A CN 201510871046A CN 105364253 A CN105364253 A CN 105364253A
- Authority
- CN
- China
- Prior art keywords
- soldering
- scolding tin
- metal electrode
- pond
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Abstract
The invention relates to a tin spraying pond of a wave soldering machine with adjustable wave peak positions and heights. The tin spraying pond consists of a soldering tin heating pond, a coil and metal electrode arrays, wherein the coil is arranged outside the soldering tin heating pond; the metal electrode arrays are uniformly arranged in the soldering tin heating pond; after the coil is electrified, a stationary magnetic field facing upwards or downwards is formed in the soldering tin heating pond; the metal electrode arrays are circularly electrified in a certain order, and the electrically conductive soldering tin moves in a certain direction under the action of ampere force, so that the soldering tin is gathered at an appointed position, a wave peak welding area is formed, and the process of soldering in an appointed area of a circuit board is completed. According to the tin spraying pond disclosed by the invention, the magnitude of an electric current is changed and the sequence of the electric current flowing through the electrode arrays is changed, so that the heights and the positions of the soldering tine wave peaks are controlled, and the soldering operation at appointed positions of the circuit board to be soldered is quickly completed.
Description
Technical field
The present invention relates to a kind of crest location and adjustable for height wave-soldering unit spray Xi Chi.
Background technology
Wave-soldering refers to the solder (terne metal) of fusing, the solder wave of designing requirement is become through electrodynamic pump or electromagnetic pump jet flow, also by being formed to solder pot nitrogen injection, make the printed board that components and parts are housed in advance by solder wave, realize the room machine of components and parts welding end or pin and printed board pad and the solder of electrical connection.
The inner general electrodynamic pump that uses of existing crest welder is as tin jet device, but electrodynamic pump at high temperature General Life is shorter, part bonding machine uses electromagnetic pump, but traditional electrical magnetic pumping can only make the scolding tin of fusing spray toward the direction, scolding tin crest location cannot be changed, need the position changing circuit board to be welded back and forth to complete welding, be difficult to the welding job of appointed area.
Summary of the invention
The object of the invention is to provide a kind of crest location and adjustable for height wave-soldering unit spray Xi Chi, it can flow through height and the position of the sequential control scolding tin crest of electrod-array by change size of current and electric current, thus completes the welding job of circuit board assigned address to be welded fast.
For achieving the above object, the present invention adopts following technical scheme:
A kind of crest location and adjustable for height wave-soldering unit spray Xi Chi, by scolding tin heating bath, coil and metal electrode array composition, described coil is arranged at the outside of scolding tin heating bath, and it is inner that described metal electrode array is evenly arranged in scolding tin heating bath; After described coil electricity, direction is formed upwards or downward stationary magnetic field in scolding tin heating bath inside, in metal electrode array, circulate energising in a certain order, the scolding tin of conduction moves according to a certain direction under the effect of Ampere force, scolding tin is assembled in the position of specifying, forms the welding region of crest shape, the appointed area welding of completing circuit plate.
Changed the position of scolding tin aggregation zone and scolding tin crest by the power-up sequence changing metal electrode array, and the position of scolding tin crest is in the geometric center place of electrical path.By changing the height of the size of current flowing through metal electrode array or the size of current changing flowing through coil change scolding tin crest.
Compared with prior art, the invention has the beneficial effects as follows:
The present invention flows through height and the position of the sequential control scolding tin crest of electrod-array by change size of current and electric current, thus completes the welding job of circuit board assigned address to be welded fast.
Accompanying drawing explanation
Fig. 1 is the structural representation of wave-soldering unit of the present invention spray Xi Chi.
When Fig. 2 is work of the present invention, scolding tin crest forms schematic diagram.
Fig. 3 is the present invention's structural representation when working.
Detailed description of the invention
Below in conjunction with the present invention of the drawings and specific embodiments further instruction.
As shown in Figure 1, a kind of crest location and adjustable for height wave-soldering unit spray Xi Chi, by scolding tin heating bath 1, coil 2 and metal electrode array 3 form, described coil 2 is arranged at the outside of scolding tin heating bath 1, and it is inner that described metal electrode array 3 is evenly arranged in scolding tin heating bath 1; After described coil 2 is energized, direction is formed upwards or downward stationary magnetic field in scolding tin heating bath 1 inside, in metal electrode array 3, circulate energising in a certain order, the scolding tin of conduction moves according to a certain direction under the effect of Ampere force, scolding tin is assembled in the position of specifying, forms the welding region of crest shape, the appointed area welding of completing circuit plate.
In the present embodiment, as shown in Figures 2 and 3, the layout of metal electrode array 3 is as shown in numbering in figure.Scolding tin heating bath 1 heats, scolding tin 4 melts, after coil 2 is energized, downward stationary magnetic field, direction is formed in scolding tin heating bath 1 inside, in metal electrode array 3, be energized according to the sequential loop of A2-A3-A4-B5-C5-D5-E4-E3-E2-D1-C1-B1-A2, the scolding tin 4 of conduction moves under the effect of Ampere force near C3 metal electrode, and form scolding tin crest 5 at this place, the welding job of the circuit board to be welded of this crest location can be completed.
If the now excessive height of scolding tin crest 5 or too low, can reduce or strengthen the electric current of flowing through coil 2, also can by reducing or strengthen the electric current flowing through metal electrode array 3 to make scolding tin crest 5 decline or raise.
Claims (1)
1. a crest location and adjustable for height wave-soldering unit spray Xi Chi, it is characterized in that, by scolding tin heating bath (1), coil (2) and metal electrode array (3) composition, described coil (2) is arranged at the outside of scolding tin heating bath (1), and it is inner that described metal electrode array (3) is evenly arranged in scolding tin heating bath (1); After described coil (2) energising, direction is formed upwards or downward stationary magnetic field in scolding tin heating bath (1) inside, in metal electrode array (3), circulate energising in a certain order, the scolding tin of conduction moves according to a certain direction under the effect of Ampere force, scolding tin is assembled in the position of specifying, forms the welding region of crest shape, the appointed area welding of completing circuit plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510871046.5A CN105364253A (en) | 2015-12-02 | 2015-12-02 | Tin spraying pond of wave soldering machine with adjustable wave peak positions and heights |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510871046.5A CN105364253A (en) | 2015-12-02 | 2015-12-02 | Tin spraying pond of wave soldering machine with adjustable wave peak positions and heights |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105364253A true CN105364253A (en) | 2016-03-02 |
Family
ID=55367149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510871046.5A Pending CN105364253A (en) | 2015-12-02 | 2015-12-02 | Tin spraying pond of wave soldering machine with adjustable wave peak positions and heights |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105364253A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86209242U (en) * | 1986-11-12 | 1987-10-28 | 航天部零六六基地险峰机器厂 | Liquid metal soft soldering electromagnetic pump |
| CN1153449A (en) * | 1995-09-26 | 1997-07-02 | 菲利浦电子有限公司 | Wave soldering machine and method of adjusting and automatically controlling height of solder wave |
| CN1946269A (en) * | 2005-09-28 | 2007-04-11 | 日本电热计器株式会社 | Soldering apparatus |
| US20110210283A1 (en) * | 2010-02-24 | 2011-09-01 | Ainissa G. Ramirez | Low melting temperature alloys with magnetic dispersions |
| CN103846515A (en) * | 2012-11-28 | 2014-06-11 | 西安中科麦特电子技术设备有限公司 | Electromagnetic pump wave crest generator for plating element with tin |
| DE102013110731B3 (en) * | 2013-09-27 | 2014-11-06 | Ersa Gmbh | Separator strip arrangement for soldering nozzle, and soldering nozzle device for selective wave soldering |
-
2015
- 2015-12-02 CN CN201510871046.5A patent/CN105364253A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86209242U (en) * | 1986-11-12 | 1987-10-28 | 航天部零六六基地险峰机器厂 | Liquid metal soft soldering electromagnetic pump |
| CN1153449A (en) * | 1995-09-26 | 1997-07-02 | 菲利浦电子有限公司 | Wave soldering machine and method of adjusting and automatically controlling height of solder wave |
| CN1946269A (en) * | 2005-09-28 | 2007-04-11 | 日本电热计器株式会社 | Soldering apparatus |
| US20110210283A1 (en) * | 2010-02-24 | 2011-09-01 | Ainissa G. Ramirez | Low melting temperature alloys with magnetic dispersions |
| CN103846515A (en) * | 2012-11-28 | 2014-06-11 | 西安中科麦特电子技术设备有限公司 | Electromagnetic pump wave crest generator for plating element with tin |
| DE102013110731B3 (en) * | 2013-09-27 | 2014-11-06 | Ersa Gmbh | Separator strip arrangement for soldering nozzle, and soldering nozzle device for selective wave soldering |
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Legal Events
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160302 |