JP2014136249A - Soldering device and semiconductor device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a soldering device for induction heating only a solder for connecting a substrate to a terminal, and a semiconductor device manufacturing method.SOLUTION: A soldering device includes: a heating coil 12; a power supply 16 supplying an alternating-current to the heating coil 12; a stage 20 on which a semiconductor device is mounted; a magnetic member 14 covering the heating coil 12 while exposing a surface of the heating coil 12 opposed to the stage 20; and a control device 18 controlling the power supply 16.

Description

  The present invention relates to a soldering apparatus used for assembling a semiconductor device and a method for manufacturing a semiconductor device using the soldering apparatus.

  Patent Document 1 discloses a technique of soldering a plurality of pin terminals to a substrate using a high frequency induction heating device.

JP 2011-187691 A

  In some cases, terminals are soldered to a substrate on which electronic components are soldered. At this time, it is preferable to heat only the solder for connecting the substrate and the terminal and not to heat the solder connecting the substrate and the electronic component. However, when the high frequency induction heating device disclosed in Patent Document 1 is used, there is a problem that all the solder on the substrate is heated.

  It is conceivable to use a soldering iron to heat only a portion of the solder on the substrate. However, soldering using a soldering iron has a problem that takes time. Further, there is a problem that the soldering iron cannot be soldered to the wall surface of the case that accommodates the substrate.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide a soldering apparatus that induction-heats only solder for connecting a substrate and a terminal, and a method for manufacturing a semiconductor device. .

  The soldering apparatus according to the present invention includes a heating coil, a power source for supplying an alternating current to the heating coil, a stage on which a semiconductor device is mounted, and the heating coil while exposing a surface facing the stage. The magnetic body which covers a coil, and the control apparatus which controls this power supply were provided.

  Another soldering apparatus according to the present invention includes a heating coil formed in a shape surrounding a plurality of terminals extending in the same direction in a non-contact manner, a power supply for supplying an alternating current to the heating coil, and the plurality of terminals And a control device that controls the power supply.

  In the method of manufacturing a semiconductor device according to the present invention, a step of supplying solder between a signal terminal fixed to a case and a control board to which an electronic component is soldered, and a surface facing the stage are exposed. A heating coil covered with a magnetic material is disposed immediately above the solder, and an alternating current is passed through the heating coil to melt the solder, thereby connecting the signal terminal and the control board. It is characterized by having.

  Another method of manufacturing a semiconductor device according to the invention of the present application is a step of supplying a plurality of solders between a plurality of signal terminals fixed to a case so as to extend in the same direction and a control board on which electronic components are soldered. And a step of bringing the plurality of signal terminals close to the heating coil formed in a shape surrounding the plurality of signal terminals in a non-contact manner, and enclosing the plurality of signal terminals with the heating coil, and passing an alternating current through the heating coil And a step of connecting the plurality of signal terminals and the control board by melting the plurality of solders.

  According to the present invention, only the solder for connecting the substrate and the terminal can be induction-heated.

It is a front view of the soldering apparatus which concerns on Embodiment 1 of this invention. A is a perspective view of a heating coil and a magnetic body. B is a bottom view of the heating coil and the magnetic body. C is a sectional view of the heating coil and the magnetic body. It is sectional drawing which shows having put the case on the stage. It is sectional drawing which shows having put the control board in the case. It is sectional drawing which shows supplying solder with a dispenser. It is a figure which shows having moved the stage so that a heating coil may be located just above the solder supplied with the dispenser. It is a perspective view which shows the modification of the magnetic body which concerns on Embodiment 1 of this invention. It is sectional drawing which shows having used the ring solder. It is a perspective view which shows the manufacturing method of the semiconductor device using the soldering apparatus which concerns on Embodiment 2 of this invention. It is a perspective view which shows the modification of the heating coil which concerns on Embodiment 2 of this invention.

  A soldering apparatus and a method for manufacturing a semiconductor device according to an embodiment of the present invention will be described with reference to the drawings. The same or corresponding components are denoted by the same reference numerals, and repeated description may be omitted.

Embodiment 1 FIG.
FIG. 1 is a front view of a soldering apparatus according to Embodiment 1 of the present invention. The soldering apparatus 10 according to Embodiment 1 of the present invention includes a heating coil 12. The heating coil 12 is used for induction heating of solder. A part of the heating coil 12 is covered with a magnetic body 14. The magnetic body 14 is fixed to the heating coil 12 with an adhesive, for example. The material of the magnetic body 14 is not particularly limited as long as it functions as a magnetic shield member that absorbs magnetic flux. An example of such a material is ferrite.

  A power source 16 that supplies an alternating current to the heating coil 12 is connected to the heating coil 12. A controller 18 that controls the power supply 16 is connected to the power supply 16. The power supply 16 receives an instruction from the control device 18 and causes an alternating current (high-frequency current) to flow through the heating coil 12.

  The soldering apparatus 10 includes a stage 20 on which a semiconductor device is mounted. The stage 20 is connected to the control device 18. The stage 20 can move in an arbitrary direction in response to a command from the control device 18. As a means for moving the stage 20, for example, an air cylinder or a servo motor is used.

  FIG. 2A is a perspective view of a heating coil and a magnetic body. FIG. 2B is a bottom view of the heating coil and the magnetic body. FIG. 2C is a cross-sectional view of the heating coil and the magnetic body. The magnetic body 14 covers the heating coil 12 while exposing the surface of the heating coil 12 that faces the stage. For this reason, when an alternating current is passed through the heating coil 12, a magnetic flux is generated mainly in a direction not covered with the magnetic body 14.

  Next, a method for manufacturing a semiconductor device using the soldering apparatus according to Embodiment 1 of the present invention will be described. First put the case on the stage. FIG. 3 is a cross-sectional view showing that the case is placed on the stage. The case 50 is fixed to the base plate 52 while surrounding the base plate 52. An insulating substrate 56 is fixed to the base plate 52 with solder 54. A semiconductor element 60 is fixed to the insulating substrate 56 with solder 58. The semiconductor element 60 is, for example, an IGBT (Insulated Gate Bipolar Transistor) or a diode. One end of a wire 62 is connected to the semiconductor element 60. The other end of the wire 62 is connected to the signal terminal 64. The signal terminal 64 is fixed to the case 50. The signal terminal 64 is a terminal that transmits a control signal of the semiconductor element 60.

  Next, the control board is placed in the case. FIG. 4 is a cross-sectional view showing that the control board is placed in the case. An electronic component 104 is fixed to the control board 100 with solder 102. The control board 100 has an opening 100a. When the control board 100 is put into the case 50, the signal terminal 64 passes through the opening 100a.

  Next, solder is supplied. FIG. 5 is a cross-sectional view showing supplying solder with a dispenser. The dispenser 110 supplies solder 112 between the signal terminal 64 fixed to the case 50 and the control board 100 to which the electronic component 104 is soldered. The solder 112 is in a paste form.

  Next, the stage is moved. FIG. 6 is a diagram showing that the stage is moved so that the heating coil is positioned immediately above the solder supplied by the dispenser. In this step, the stage 20 is moved by a command from the control device 18 so that the heating coil 12 is disposed immediately above the solder 112.

  Thereafter, an alternating current (high-frequency current) is passed through the heating coil 12 using the power supply 16. As a result, the changing magnetic flux generated around the heating coil 12 generates an eddy current in the signal terminal 64 and the solder 112. The solder 112 is melted by Joule heat due to the eddy current, and the signal terminal 64 and the control board 100 are connected. At this time, since the magnetic body 14 absorbs the magnetic flux in the direction of the solder 102, the solder 102 does not melt.

  For example, if there are 30 locations where the control board and signal terminals are to be soldered, if soldering with a soldering iron, it takes about 7 seconds to solder at one location, so a total of 210 seconds is required. However, according to the method of manufacturing a semiconductor device using the soldering apparatus according to the first embodiment of the present invention, since induction heating is used, soldering can be performed in a short time of about 10 seconds. When the heating coil 12 is arranged immediately above the plurality of solders and the plurality of solders immediately below the heating coil 12 are melted together, soldering can be performed in a shorter time. Therefore, according to the semiconductor device manufacturing method using the soldering apparatus according to the first embodiment of the present invention, soldering can be performed in a short time.

  In the soldering apparatus according to Embodiment 1 of the present invention, the magnetic body 14 covers the heating coil 12 while exposing the surface of the heating coil 12 that faces the stage 20, so that the magnetic flux is prevented from spreading to the left and right of the heating coil 12. it can. That is, the magnetic flux density directly below the heating coil 12 can be increased and the magnetic flux density in the other direction can be decreased. Therefore, only the solder 112 can be melted without melting the solder 102 fixing the electronic component 104.

  In the case of using a soldering iron, there is a problem that the tip hits the case 50 and the tip cannot be applied to the solder. However, in the manufacturing method of the semiconductor device according to the first embodiment of the present invention, the heating coil 12 is used. Since the solder 112 is melted in a state where the solder is positioned immediately above the solder 112, it can be soldered smoothly. Therefore, soldering around the wall surface of the case 50 is facilitated.

  FIG. 7 is a perspective view showing a modified example of the magnetic body according to Embodiment 1 of the present invention. The magnetic body 200 covers the heating coil 12 so that only the surface of the heating coil 12 facing the stage 20 is exposed. As a result, the magnetic flux can be concentrated in the region immediately below the heating coil 12.

  The solder supply method is not limited to the dispenser. FIG. 8 is a cross-sectional view showing the use of ring solder. By using the ring solder 300, it is possible to easily supply solder between the control board 100 and the signal terminal 64. Note that the solder supplied between the signal terminal 64 and the control board 100 is not limited to ring solder, but may be printed solder, inkjet solder, or thread solder. This modification can also be applied to the soldering apparatus and the semiconductor device manufacturing method according to the second embodiment.

  The number of turns of the heating coil 12 is not particularly limited as long as the conductive wire is formed in a ring shape. Therefore, the number of turns may be increased to make induction heating more efficient. Further, the heating coil 12 may be moved instead of moving the stage 20 by the control device 18. These modifications can also be applied to the soldering apparatus according to the second embodiment and the method for manufacturing the semiconductor device.

Embodiment 2. FIG.
Since the soldering apparatus and the semiconductor device manufacturing method according to the second embodiment of the present invention have much in common with the first embodiment, the differences from the first embodiment will be mainly described. FIG. 9 is a perspective view showing a method for manufacturing a semiconductor device using the soldering apparatus according to Embodiment 2 of the present invention.

  The heating coil 400 is formed in a shape (a shape in which each terminal is wound) that individually surrounds a plurality of signal terminals 64 extending in the same direction in a non-contact manner. That is, the heating coil 400 forms a continuous circle so as to individually surround the three signal terminals 64 in a non-contact manner.

  In the method of manufacturing a semiconductor device using the soldering apparatus according to the second embodiment of the present invention, first, a control in which a plurality of signal terminals 64 fixed to the case so as to extend in the same direction and the electronic component 104 are soldered. A plurality of solders 112 are supplied between the substrates 100. Next, the heating coil 400 and the plurality of signal terminals 64 are brought close to each other, and the plurality of signal terminals 64 are surrounded by the heating coil 400. This state is shown in FIG.

  Next, an alternating current is passed through the heating coil 400 to melt the plural solders 112, thereby connecting the plural signal terminals 64 and the control board 100. Here, since the heating coil 400 and the solder 112 are very close to each other, the solder 112 can be melted even if the alternating current flowing through the heating coil 400 is suppressed. By flowing the suppressed alternating current, melting of the solder 102 that fixes the electronic component 104 on the control board 100 can be avoided.

  FIG. 10 is a perspective view showing a modification of the heating coil according to Embodiment 2 of the present invention. The heating coil 402 is formed in a shape that surrounds a plurality of signal terminals 64 extending in the same direction in a non-contact manner (a shape in which both ends of each terminal are wound). The above effect can also be obtained with the heating coil 402 having such a shape. In addition, the said effect can be acquired if a heating coil is formed not only in the shape of the heating coils 400 and 402 but in the shape which surrounds the several signal terminal 64 extended in the same direction by non-contact.

DESCRIPTION OF SYMBOLS 10 Soldering device, 12 Heating coil, 14 Magnetic body, 16 Power supply, 18 Control device, 20 Stage, 50 Case, 52 Base board, 54 Solder, 56 Insulating substrate, 58 Solder, 60 Semiconductor element, 62 Wire,
64 signal terminals, 100 control board, 100a opening, 102 solder, 104 electronic component, 110 dispenser, 112 solder, 200 magnetic body, 400, 402 heating coil

Claims (6)

A heating coil;
A power supply for supplying an alternating current to the heating coil;
A stage on which a semiconductor device is mounted;
A magnetic body that covers the heating coil while exposing a surface of the heating coil that faces the stage;
And a control device for controlling the power source.   The soldering apparatus according to claim 1, wherein the magnetic body covers the heating coil so that only a surface of the heating coil facing the stage is exposed. A heating coil formed in a shape surrounding a plurality of terminals extending in the same direction without contact;
A power supply for supplying an alternating current to the heating coil;
A stage on which a semiconductor device having the plurality of terminals is mounted;
And a control device for controlling the power source. Supplying solder between the signal terminal fixed to the case and the control board to which the electronic component is soldered;
Disposing a heating coil covered with a magnetic body so as to expose a surface facing the stage, directly above the solder;
And a step of connecting the signal terminal and the control board by flowing an alternating current through the heating coil to melt the solder. Supplying a plurality of solders between a plurality of signal terminals fixed to the case so as to extend in the same direction, and a control board on which electronic components are soldered;
A heating coil formed in a shape surrounding the plurality of signal terminals in a non-contact manner and the plurality of signal terminals, and surrounding the plurality of signal terminals with the heating coil;
Connecting the plurality of signal terminals and the control substrate by causing an alternating current to flow through the heating coil to melt the plurality of solders.   6. The method of manufacturing a semiconductor device according to claim 4, wherein the solder supplied between the signal terminal and the control board is ring solder, printed solder, inkjet solder, or thread solder.

Images